TWI584705B - Adhesive tape for connecting carrier tape, film for connecting carrier tape and carrier tape connecting method - Google Patents

Description

Adhesive tape for carrier tape connection, film for carrier tape connection, and carrier tape connection method

The present invention relates to an adhesive tape for carrying tape connection used for connecting end portions of a carrier tape to each other in a joined state, a film for carrying tape for use in supplying the adhesive tape, and a use of the same A carrier tape connection method for an adhesive tape, wherein the carrier tape can supply an electronic component such as a wafer component to an electronic component mounting device.

As a method of connecting a carrier tape using an adhesive tape, for example, it is implemented by adhering two strips of a strip and a strip of one sheet of a feed hole as a surface of a carrier tape in which the ends are joined to each other. The belt on the back. That is, it is adhered along the length direction: a mesa strip that covers only a portion of the feed hole formed along one side of the carrier tape, and a top tape that covers only the part storage portion that houses the wafer part of the coated carrier tape (top tape) The strip tape of the part and the strip tape on the back side of the cover part accommodating part are three (refer to Japanese Laid-Open Patent Publication No. 2000-124665).

According to the above connection method, since the band tape on the front side is adhered to a top tape for peeling which has been attached to the surface of the carrier tape, when the top tape is peeled off from the surface of the carrier tape in order to take out the component, The strip on the surface side is peeled off integrally with the top tape. Therefore, the two belts are connected in a state in which the belt strip on one side of the backrest surface and the feed hole portion on the other side of the surface are fed. As described above, since the connection strength is weak in a state in which only the front surface and the back surface are connected, the joint portion of the two carrier tapes is easily bent. Therefore, there is a problem with the conveyance or winding of the carrier tape.

Furthermore, it is necessary to adhere the three thin strips in parallel and with high precision in parallel along the sides of the carrier tape. In particular, on the surface side of the carrier tape, it must be adhered to the top tape and the pitch of the feed holes, respectively. If it is not adhered to the top tape with high precision, there is a fear that unnecessary stretching force acts on the top tape to cause the parts in the carrier tape to scatter.

Further, when the tape strips are not pasted in parallel on the side edges of the carrier tape, the tape strips of the top tape portion and the feed hole tape are stuck. At this time, if the top tape is directly peeled off, there is a peeling error or the two tapes may be peeled off at the same time.

The present invention has been made in view of such circumstances, and an object thereof is to provide an adhesive tape for connecting a carrier tape, which is intended to reliably and strongly connect a carrier tape in which the end portions are joined to each other using an adhesive tape.

Further, another object of the present invention is to provide a film for carrier tape connection using the adhesive tape for carrier tape connection.

Further, another object of the present invention is to provide a carrier tape joining method for the purpose of sufficiently ensuring the joint strength even in the state where the lower top tape is torn, and suppressing the bending at the joint portion of the carrier tape.

In order to achieve such a purpose, the present invention adopts the following constitution.

That is, an adhesive tape for connecting a carrier tape is adhered in such a manner as to span the ends of the carrier tape in an engaged state, and is characterized in that the width is larger than the width of the carrier tape and is on the surface of the carrier tape when pasted. At least one of the side surface and the back surface has an adhesive layer on the contact portion between the surface and the back surface.

According to this configuration, the adhesive tape can be adhered from the surface of the joint of the carrier tape disposed in the joined state, and the adhesive tape exposed from the other side of the carrier tape can be folded in and adhered to the back side of the two carrier tapes. Therefore, high adhesion strength can be obtained by affixing the adhesive tape over at least the front and back surfaces of the carrier tape and over a large area. Further, when the adhesive layer is provided on the contact portion on the side of the carrier tape, since it can be adhered to a larger area, a higher connection strength can be obtained.

Further, at this time, the adhesive tape is adhered to the surface side of the carrier tape so as to span the full width thereof. In other words, the adhesive tape is adhered to the carrier tape on both sides in the width direction of the top tape which is bonded to the surface of the carrier tape along the recessed portion for storing the components. Therefore, when the top tape is peeled off from the surface of the carrier tape for taking out the part, the adhesive tape portion integral with the top tape is torn into a thin strip shape with the width of the top tape. Even if the adhesive tape is partially torn integrally with the top tape, sufficient bonding strength can be ensured because the adhesive tape region on the surface of the carrier tape, the side of the carrier tape, and the back of the carrier tape remain.

Moreover, even in the state where the top tape is torn off, the adhesive tape adhered to at least the surface and the back surface of the carrier tape can ensure the continuity at the joint portion of the carrier tape, and the carrier tape can be smoothly conveyed. Or winding.

Further, in order to achieve such an object, the present invention adopts the following constitution.

An adhesive tape for connecting a carrier tape is attached in such a manner as to span the ends of the carrier tape in an engaged state, and is characterized in that a width is larger than a width of the carrier tape, and a feed with the carrier tape is formed along one side The through hole corresponding to the hole has an adhesive layer on the surface of the carrier tape, at least the surface of the carrier tape and the back surface at the contact portion of the back surface.

According to this configuration, the surface of the joint of the carrier tapes disposed in the joined state can be adhered to the adhesive tape in a manner that the through holes are aligned with the feed holes formed along one side of the carrier tape, and the carrier tape is The adhesive tape exposed on the other side is folded in and adhered to the back side of the two carrier tapes. Therefore, high adhesion strength can be obtained by adhering the adhesive tape over a large area across at least the front and back surfaces of the two carrier tapes. Further, when the contact portion on the side surface of the carrier tape has an adhesive layer, since it can be adhered to a larger area, a higher connection strength can be obtained.

At this time, an adhesive tape is adhered to the surface side of the carrier tape so as to span the entire width thereof. In other words, the adhesive tape is adhered to the carrier tape on both sides in the width direction of the top tape which is bonded to the surface of the carrier tape along the recessed portion for storing the components. Therefore, when the top tape is peeled off from the surface of the carrier tape for taking out the part, the adhesive tape portion integral with the top tape is torn into a thin strip shape with the width of the top tape. Even if the adhesive tape is partially torn apart from the top tape, the adhesive tape remains on the surface of the carrier tape, the side of the carrier tape, and the back of the carrier tape. It still ensures adequate connection strength.

Moreover, even in the state where the top tape is torn off, the adhesive tape adhered to the surface, the side, and the back of the carrier tape can ensure the continuity at the joint portion of the carrier tape, and the carrier tape can be smoothly carried out. Conveying or winding.

Further, in the embodiment of the belt for connecting a carrier tape of the present invention, it is preferable that a slit is formed at an end side in the longitudinal direction of the adhesive tape.

According to this configuration, when the top tape is peeled off from the surface of the carrier tape, the adhesive tape can be torn at the width of the top tape. At this time, since the shearing force is concentrated on the slit at the end of the adhesive tape to make it the starting point of the tearing of the adhesive tape, the tearing can be smoothly started.

In order to achieve such a purpose, the present invention adopts the following constitution.

A film for supporting a belt for attaching an adhesive tape for connecting a carrier tape, characterized in that a base film, an adhesive tape formed to have a width larger than a width of the carrier tape, and an application tape are used Laminating and laminating, and at least crossing the lamination to form a through hole corresponding to the feed hole of the carrier tape.

According to this configuration, the adhesive tape can be attached to the carrier tape while the base film is peeled off and kept adhered to the bonding tape, and the bonding tape can be peeled off from the adhesive tape after the connection. At this time, even if the adhesive tape is thin and it is not easy to handle, it is not unwoundly bent or wrinkled while being kept adhered to the bonding tape, and can be reliably and easily adhered to the carrier tape. Further, by inserting at least the through hole formed in the bonding tape to the guide pin of the bonding jig or the like, the pair of the adhesive tape and the carrier tape can be more easily performed. Quasi-position work.

Further, in the embodiment of the film for carrier tape connection of the present invention, it is preferable that the bonding tape protrudes from both end sides of the adhesive tape.

According to this configuration, the end portion of the bonding tape can be handled without touching the adhesive surface of the adhesive tape. Moreover, the adhesion of the adhesive tape to the adhesive tape and the tearing of the adhesive tape after the adhesive treatment can be easily performed.

Furthermore, in order to achieve such an object, the present invention adopts the following constitution.

A carrier tape joining method for connecting ends of a carrier tape in an engaged state to each other through an adhesive tape, wherein the adhesive tape is formed to have a width larger than a width of the carrier tape, and the ends are to be joined to each other When the joint portion of the carrier tape of the state is adhered to the adhesive tape, an adhesive layer is provided on at least a surface of the surface of the carrier tape, a side surface and a back surface, and the contact portion is exposed from the side of the carrier tape. The adhesive tape is folded in and adhered to the back side of the carrier tape.

Further, a carrier tape connecting method is characterized in that the ends of the carrier tapes in the joined state are connected to each other through an adhesive tape, wherein the adhesive tape is formed to have a width larger than a width of the carrier tape, and is formed along one side a through hole corresponding to the feed hole of the carrier tape, at least a surface and a back surface of the surface of the carrier tape, one side surface and the back surface when the joint portion of the carrier tape in which the end portions are joined to each other is adhered to the adhesive tape Adhesive layer on the contact area, And the through hole of the adhesive tape is adhered to the feeding hole of the carrier tape, and the adhesive tape exposed from the other side of the carrier tape is folded into and adhered to the back side of the carrier tape.

According to this method, at least the entire surface and the back surface of the series of connected carrier tapes can be joined by an adhesive tape. Therefore, since the adhesion area of the adhesive tape is increased, there is no possibility that the joint end of the carrier tape is pulled apart due to the belt conveying force, and a reliable and smooth belt conveyance can be performed. Further, when the adhesive layer is provided on the contact portion on the side of the carrier tape, since it can be adhered to a larger area, a higher joint strength can be obtained.

Further, in the electronic component mounting device, if the action of taking out the component from the carrier tape touches the tape body joint, the adhesive tape portion attached to the top tape is torn to a thin band side as the top tape is peeled off. Stripped with the top tape. At this time, on both sides of the top tape, the adhesive tape is firmly adhered to the both end portions, the side edges, and the back surface of the surface side of the carrier tape. Therefore, when the top tape is peeled off, on both sides of the top tape, the shearing force for tearing the adhesive tape effectively acts on the adhesive tape to smoothly tear the adhesive tape portion. Furthermore, even if the adhesive tape portion and the top tape are simultaneously torn off, the tape connection function can be sufficiently retained by adhering to the periphery of the feed hole, the side edges of the carrier tape, and the adhesive tape on the back side. Therefore, the conveyance of the carrier tape can be smoothly performed.

Further, an embodiment of the method of the present invention is characterized in that the adhesive tape is adhered to the carrier tape in a state of being adhered to a more rigid adhesive tape of the adhesive tape, and then the adhesive tape is peeled off from the adhesive tape.

According to this method, even if the adhesive tape is thin and not easy to handle, the adhesive tape which is adhered to the bonding tape will not be unwoundly bent or produced. Wrinkles. Therefore, the adhesive tape can be easily adhered to the carrier tape.

Furthermore, in the embodiment of the method of the present invention, it is preferred to apply a release treatment to the surface of the adhesive tape, and set the adhesive force of the adhesive tape to be weaker than the adhesive layer of the adhesive tape, and to adhere the adhesive tape. After the tape is folded in and integrated with the bonding tape, the adhesive tape is adhered to the carrier tape, and the elastic restoring force of the bonding tape is naturally peeled off from the surface of the adhesive tape to form a peeling starting point.

According to this method, after the adhesive tape is adhered, since the adhesive tape can be peeled off from the adhesive tape by the elastic restoring force, the adhesive tape can be easily peeled off.

1‧‧‧ Carrying belt

1a‧‧‧Base belt

2‧‧‧ recess

3‧‧‧Electronic parts

4‧‧‧ top layer

5‧‧‧ Feeding holes

6‧‧‧Adhesive tape

6a‧‧‧Adhesive tape part

7‧‧‧through holes

10‧‧‧Sheet tape for connecting tape

11‧‧‧Base film

12‧‧‧Fitting tape

15‧‧‧ fold line

16‧‧‧Contacting the side of the carrier belt 1

S‧‧‧ incision

T‧‧‧ side

In order to clarify the invention, it is to be understood that several embodiments are considered to be preferred, and it is understood that the invention is not limited to the configuration and the strategy as illustrated in the invention.

Fig. 1 is a perspective view of the carrier tape viewed from the surface side.

Fig. 2 is a perspective view showing a carrier tape connecting program.

Figure 3 is a perspective view showing the carrier tape connection program.

Figure 4 is a perspective view showing the carrier tape connection program.

Fig. 5 is a perspective view of the carrier tape in a connected state as viewed from the back side.

Fig. 6 is a perspective view showing a state in which a component is taken out at a joint portion.

Fig. 7 is a longitudinal sectional front view showing a main portion of a carrier tape in a connected state.

Fig. 8 is a front elevational view showing a state in which a component is taken out at a joint portion.

Fig. 9 is a perspective view showing a film for connecting a carrier tape.

Fig. 10 is a perspective view showing a state in which a base film is peeled off from a film for connecting a carrier tape.

Fig. 11 is a modification of the adhesive tape having the through holes.

Fig. 12 is a modification of the adhesive tape having no through holes.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

As shown in Fig. 1, the carrier tape 1 is composed of a base tape 1a, a recess 2, a top tape 4, and a feed hole 5.

The recesses 2 are formed on the surface of the base tape 1a at a certain pitch in the longitudinal direction of the tape. A small electronic component 3 such as a wafer component is housed in each of the recesses 2.

The top tape 4 is bonded to the surface of the base tape 1a in a state in which the electronic component 3 is housed in each of the recesses 2.

The feed holes 5 are formed at a predetermined interval along one side of the base tape 1a. Therefore, it is configured such that the top layer tape 4 is peeled off from the surface of the base tape 1a and the concave portion 2 is opened to take out the electronic component 3 to be accommodated. Further, the carrier tape 1 is generally loaded in an electronic component mounting device in a state of a roll.

When the electronic component mounting apparatus performs the mounting process, the terminal end of the loaded carrier tape 1 is connected to the front end of the new tape reel which is wound out of the tape reel. The basic connection procedure will be described below.

(1) First, as shown in Fig. 2, the terminal end of the preceding carrier tape 1 and the start end of the subsequent carrier tape 1 are joined in such a manner that the pitch of the feed holes 5 before and after the joint portion is constant. At this time, by using the connection jig in which the guide pins fitted to the feed holes 5 are erected at a predetermined interval and assembled, it is possible to more easily perform the alignment work of the tape bodies. Further, the end portion of the belt body is first cut into a predetermined zigzag shape by using a dedicated cutting scissors or the like. At this time, since the alignment accuracy at the joint portion is improved and the contact area is enlarged, it is possible to smoothly wind and bend without causing a bend or the like at the joint portion.

(2) Next, as shown in Fig. 3, the adhesive tape 6 is adhered to the surface of the joint of the carrier tape 1 joined as described above so as to span a predetermined length.

The adhesive tape 6 has a width larger than the width of the carrier tape, and an adhesive layer is integrally formed on the back surface. Further, a through hole 7 having the same diameter as the feed hole 5 is formed along one side of the adhesive tape at the same pitch as the pitch of the feed holes. The adhesive tape 6 is adhered in such a manner as to straddle the two carrier tapes 1 and align the through holes 7 with the positions of the feed holes 5. Moreover, the other side of the adhesive tape 6 adhered in this manner is largely exposed from the other side t of the carrier tape 1.

(3) Next, as shown in FIGS. 4, 5, and 7, the adhesive tape 6 exposed from the other side t of the carrier tape 1 is bent along the side t of the carrier tape 1 and adhered thereto. The side t and the back side of the carrying belt 1. Thereby, the connection of the two carrier tapes 1 in the joined state is completed.

In this way, the series of connected carrier tapes 1 are connected by the adhesive tape 6 across the entire surface thereof, while the side edges t of the carrier tape 1 and the back side of the carrier tape are also connected by the adhesive tape 6. Therefore, the adhesive tape The area of adhesion increases. Thereby, there is no possibility that the joint end of the carrier tape 1 is pulled apart due to the belt conveying force, and the belt body can be reliably and smoothly conveyed and the belt is taken up and taken out after the parts are taken out.

Further, in the electronic component mounting device, if the action of taking out the component from the carrier tape 1 touches the tape body joint, as shown in Fig. 6, as the top tape 4 is torn, it will be attached as shown in Fig. 8. The adhesive tape portion 6a of the top tape 4 is torn open to the side of the top tape 4 by tearing one side into a thin strip shape. Here, a fine zigzag slit s is formed in advance on the end side across the entire longitudinal direction of the adhesive tape 6, and the shear force is concentrated on the slit s to form a starting point of tearing. Therefore, the tearing start operation of the adhesive tape portion 6a can be smoothly performed. In addition, the number of the slits s is not particularly limited, and can be appropriately set and changed.

At this time, on both sides of the top layer tape 4, the adhesive tape 6 is firmly adhered to the surface of the carrier tape, the side edges t and the back surface. Therefore, when the top tape 4 is torn, on both sides of the top tape 4, the shearing force for tearing the adhesive tape 6 effectively acts on the adhesive tape 6 to smoothly tear the adhesive tape portion 6a.

Moreover, even if the adhesive tape portion 6a and the top tape 4 are simultaneously torn, the tape connection function can be obtained by adhering to the periphery of the feed hole 5, the side t of the carrier tape 1, and the adhesive tape 6 on the back side. Fully reserved.

Further, the adhesive tape 6 used for the above-described connection of the carrier tape 1 is supplied as a label-like laminated film, and the appearance of the carrier tape connecting film 10 is shown in Fig. 9.

The carrier tape connecting film 10 is formed by adhering an adhesive tape 6 to the surface of the base film 11 having a peeling surface formed thereon, and a transparent adhesive tape 12 is attached thereto. Laminated structure. The base film 11 is formed to be longer than the adhesive tape 6, and the bonding tape 12 is bonded to the entire length of the base film 11.

Further, after the base film 11, the adhesive tape 6, and the bonding tape 12 are bonded and laminated, the punching process is performed across the three layers to form the through hole 7 of the adhesive tape 6.

In the actual joining process, as shown in Fig. 10, the base film 11 is peeled off from the film for connecting tape connection 10, and the adhesive tape 6 is attached to the carrier tape 12 while being adhered to the bonding tape 12 ( Refer to the imaginary line of Fig. 2 and Fig. 3). Next, the carrier tape 1 is pasted and the bonding tape 12 is torn.

At this time, even if the adhesive tape 6 is thin and is not easy to handle, by adhering the both end portions of the adhesive tape 12, the adhesive tape 6 which remains in the adhesive state can be prevented from being unwoundly bent or wrinkled. deal with. Therefore, the adhesion work of the adhesive tape 6 to the carrier tape 1 can be performed reliably and easily. Further, the perforation (through hole) 7 formed by traversing the adhesive tape 6 and the bonding tape 12 is inserted into a guide pin that is erected on the bonding jig or the like, whereby the adhesive tape 6 can be easily attached to the carrier tape 1. Align the position to work.

Hereinafter, a specific example of a member used when each carrier tape is connected will be described.

[adhesive tape]

The adhesive tape 6 of the present invention has an adhesive layer on one side of the substrate.

The width of the adhesive tape 6 is preferably widened as much as possible in the range where the front end of the adhesive tape folded into the back side of the carrier tape does not overlap with the feed hole 5. According to this configuration, the adhesion area on the back side of the carrier tape can be sufficiently ensured, and the belt connection strength can be improved.

The adhesive tape 6 is colored to be black, blue, or the like so that the connection of the carrier tape can be easily recognized. According to this configuration, in the mounting device, it is effective in performing lot management of the electronic component 3 transported via the carrier tape 1 based on the detection of the joint.

The base material of the adhesive tape 6 is set to have a tear strength in the longitudinal direction of about 0.75 to 0.10 times (preferably 0.75 to 0.50 times) of the tear strength in the width direction, and is set as the top tape 4 When the tear is made, the adhesive tape portion 6a can be smoothly torn.

The ratio of the tear strength in the longitudinal direction to the tear strength in the width direction can be adjusted by controlling the stretching ratio in each direction.

Further, as the substrate of the adhesive tape 6, for example, polyester (polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, polybutylene naphthalate) can be used. ), polyolefin (polyethylene, polypropylene, ethylene-propylene copolymer, etc.), polyvinyl alcohol, polyvinylidene chloride, polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polyvinyl acetate, polyamine , plastic bases such as polyimine, cellulose, fluorine resin, polyether, polyether amide, polyphenylene sulfide, polystyrene resin (polystyrene, etc.), polycarbonate, polyether oxime material.

In the present invention, a substrate such as a polyester film or a polyolefin film is preferably used because it is easy to obtain, has sufficient strength, and is excellent in linear cutting property.

Furthermore, in order to improve the adhesion to the adhesive, at least the back surface of the substrate of the adhesive tape 6 may be subjected to a conventional surface treatment such as chromic acid treatment, ozone exposure, flame exposure, high voltage electric discharge, free radiation treatment, etc. Oxidation treatment using chemical or physical methods, and the like.

The thickness of the substrate of the adhesive tape 6 is preferably about 10 to 100 μm, more preferably 10 to 50 μm, and most preferably 10 to 30 μm. When the thickness of the base material is less than the above range, the strength of the adhesive tape is insufficient to impair the practicality. On the other hand, when the thickness of the base material is more than the above range, the cracking property in the longitudinal direction tends to be lowered, and it tends to be difficult to be wound around the carrier tape. There is also a deterioration in the progress of the actual machine (mounter: part cassette).

The back surface of the base material of the adhesive tape 6 is formed as an adhesive (base polymer) of the adhesive surface. For example, a single agent or a mixture of an acrylic adhesive, a rubber-based adhesive, and a silicone-based adhesive can be used. Further, the thickness of the adhesive layer is about 10 to 50 μm, preferably 10 to 35 μm, and particularly preferably 15 to 30 μm.

Examples of the acrylic pressure-sensitive adhesive include n-butyl (meth)acrylate, isobutyl (meth)acrylate, secondary butyl (meth)acrylate, and tertiary butyl (meth)acrylate. Ethyl pentyl acrylate, isoamyl (meth) acrylate, hexyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, (methyl) ) 2-ethylhexyl acrylate, isooctyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, decyl (meth) acrylate, isophthalic acid (meth) acrylate Ester, undecyl (meth)acrylate, dodecyl (meth)acrylate, tridecyl (meth)acrylate, tetradecyl (meth)acrylate, pentadecyl (meth)acrylate, (methyl) Hexadecyl acrylate, heptadecyl (meth) acrylate, octadecyl (meth) acrylate, decyl (meth) acrylate, hexadecyl (meth) acrylate, etc. ~20 linear or branched alkyl (meth) acrylate or the like. In addition, in this manual, "(methyl) "meth" acryl" means "acryl" and/or "methacryl".

Among the above, an alkyl (meth)acrylate having an alkyl group having 4 to 20 carbon atoms is preferred, and 2-ethylhexyl acrylate (2EHA) or n-butyl acrylate (BA) is more preferred.

The content of the main monomer is preferably 50 to 100% by weight, and more preferably 70 to 100% by weight based on the total amount of the monomer component (100% by weight) constituting the acrylic pressure-sensitive adhesive.

Examples of the functional group-containing monomer include carboxyl group-containing monomers (maleic anhydride, itaconic acid anhydride, etc.) such as (meth)acrylic acid, itaconic acid, maleic acid, fumaric acid, crotonic acid, and isocrotonic acid. The acid anhydride group-containing monomer is also included; 2-hydroxypropenyl (meth)acrylate, 3-hydroxypropenyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, (meth)acrylic acid 6 a hydroxyalkyl (meth) acrylate such as hydroxyhexyl ester, a hydroxyl group-containing (hydroxyl) monomer such as vinyl alcohol or allyl alcohol; a guanamine-containing monomer such as (meth) acrylamide; N-A Base (meth) acrylamide, N-ethyl (meth) acrylamide, N, N-dimethyl (meth) acrylamide, N-tert-butyl (meth) acrylamide, N-hydroxymethyl (meth) acrylamide, N-methoxymethyl (meth) acrylamide, N-ethoxymethyl (meth) acrylamide, N-butoxymethyl An N-substituted guanamine-based monomer such as (meth)acrylamide, N-octyl acrylamide, N-hydroxyethyl acrylamide or the like; (amino) (meth) acrylate, (meth) Dimethylaminoethyl acrylate, diethylaminoethyl (meth)acrylate, dimethyl (meth)acrylate Amine, propylene carbonate, (meth) acrylate, amino ethyl-tert.butyl amine-containing monomers; (meth) acrylate, (meth) acrylate, methyl glycidyl methacrylate-containing monomers. The above-mentioned functional group-containing monomer Of these, a carboxyl group-containing monomer is preferred, and acrylic acid (AA) is more preferred.

The content of the functional group-containing monomer is preferably less than 20% by weight, more preferably 5% by weight or less, based on the total amount of the monomer components (100% by weight) constituting the acrylic pressure-sensitive adhesive.

The acrylic pressure-sensitive adhesive can be adjusted by polymerizing the monomer component by a known or conventional polymerization method, and examples thereof include a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, or a polymerization method for irradiating activation energy (activated energy ray polymerization method). )Wait. Among the above, from the viewpoints of transparency, water resistance, cost, and the like, a solution polymerization method and an activation energy ray polymerization method are preferred, and a solution polymerization method is more preferred.

When the above solution polymerization method is carried out, various general solutions can be employed. Examples of such a solvent include esters such as ethyl acetate and n-butyl acetate; aromatic hydrocarbons such as toluene and benzene; aliphatic hydrocarbons such as n-hexane and n-heptane; and lipids such as cyclohexane and methylcyclohexane. An organic solvent such as a cyclic hydrocarbon; a ketone such as methyl ethyl ketone or methyl isobutyl ketone. The solvent may be used singly or in combination of two or more.

A polymerization initiator can also be used for the polymerization of the above acrylic adhesive. The polymerization initiator is not particularly limited, and may be appropriately selected from known or customary ones, and examples thereof include 2,2'-azobisisobutyronitrile and 2,2'-azobis (4-methyl). Oxy-2,4-dimethylvaleronitrile), 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2'-azobis(2-methylbutyronitrile) 1,1'-azobis(cyclohexane-1-carbonitrile), 2,2'-azobis(2,4,4-trimethylpentane), dimethyl-2,2' -Azo-based polymerization initiators such as azobis(2-methylpropionate); benzamidine peroxide, tertiary butyl hydroperoxide, di(tertiary butyl peroxide), peroxybenzoic acid Tertiary butyl ester, dicumyl peroxide Peroxidation of 1,1'-bis (tertiary butyl peroxo)-3,3,5-trimethylcyclohexane, 1,1'-bis(tri-butylperoxy)cyclododecane An oil-soluble polymerization initiator such as an organic polymerization initiator or the like. These may be used alone or in combination of two or more. The amount of the polymerization initiator to be used is not particularly limited as long as it is conventionally used as a polymerization initiator.

Further, the acrylic pressure-sensitive adhesive may be crosslinked by adding a crosslinking agent. Examples of the crosslinking agent include various crosslinking agents such as an epoxy compound, an isocyanate compound, a metal chelate compound, a metal alkoxide, a metal salt, an amine compound, a hydrazine compound, and an aldehyde compound. The functional groups contained in these acrylic adhesives are appropriately selected and used. The amount of the crosslinking agent to be used is, for example, about 0.01 to 10 parts by weight, preferably about 0.05 to 5 parts by weight, per 100 parts by weight of the acrylic pressure-sensitive adhesive.

Examples of the rubber adhesive include natural rubber or various synthetic rubbers. Examples of the synthetic rubber include polyisoprene rubber and styrene. Butadiene (SB) rubber, styrene. Isoprene (SI) rubber, styrene. Isoprene. Styrene block copolymer (SIS) rubber, styrene. Butadiene. Styrene block copolymer (SBS) rubber, styrene. Ethylene. Butene. Styrene block copolymer (SEBS) rubber, styrene. Ethylene. Propylene. Styrene block copolymer (SEPS) rubber, styrene. Ethylene. A propylene block copolymer (SEP) rubber, a reclaimed rubber, a butyl rubber, a polyisobutylene, or a modified body thereof.

Examples of the above-mentioned oxygen-adhesive adhesive include a ruthenium oxide rubber or a ruthenium oxide resin containing an organopolyoxane as a main component, or a cross-linking by a peroxide-based cross-linking agent or a peroxide-based cross-linking agent. Crosslinker Cross-linking. Aggregate and so on.

The adhesive layer of the adhesive tape 6 of the present invention may contain other components in addition to the above-mentioned adhesive (base polymer) (for example, a suitable crosslinking agent, an adhesive, a plasticizer, a filler, an antioxidant, etc.) ).

As a method of forming the adhesive layer of the adhesive tape 6 of the present invention, a conventionally known method can be employed, and for example, a solvent (for example, toluene, xylene, ethyl acetate, methyl ethyl ketone, etc.) can be used as needed. The adhesive is diluted to a non-volatile content of about 10 to 50% by weight to adjust the coating liquid, and is applied (coated) to a substrate or a suitable separator (peeling paper or the like), and then added. Drying method, etc.

Further, as for the coating (coating) in the method for forming the above-mentioned adhesive, a well-known coating method can be employed, and a conventional coating machine such as a gravure coater, a reverse coater, or a roll coater (kiss-) can be used. Roll coater), a dip roll coater, a bar coater, a knife coater, a spray coater, a comma coater, a direct coater, a die coater, and the like.

Further, it may be formed by subjecting a substrate and an adhesive constituting the above-mentioned pressure-sensitive adhesive layer to melt extrusion molding, followed by longitudinal or lateral stretching (uniaxial stretching) treatment. As the melt extrusion method, any well-known technique such as an inflation method or a T-die method can be employed.

[Base film for carrying film for connection]

As the base film 11, a known release paper (separator) can be used as the base material, and it is preferably, for example, a release agent such as a ruthenium oxide type, a long chain alkyl type, a fluorine type or a molybdenum sulfide type. A low-adhesive substrate such as a surface-treated plastic film or paper.

Further, the thickness of the base film 11 is preferably about 16 to 300 μm, more preferably 90 to 150 μm, and particularly preferably 95 to 130 μm.

[Adhesive tape for film for connecting tape]

The bonding tape 12 is provided with an adhesive layer of the same material as the adhesive layer of the adhesive tape 6 on the back surface of the substrate of the same material as the substrate of the adhesive tape 6, and the thickness of the substrate is, for example, about 16 to 125 μm. Preferably, it is 38 to 75 μm, and particularly preferably 45 to 70 μm.

Further, the thickness of the adhesive layer of the bonding tape 12 is preferably about 6 to 12 μm, more preferably 7 to 11 μm, and particularly preferably 8 to 10 μm.

The invention can also be implemented in the following form:

(1) The through-hole 7 is not required to be formed on the base film 11 of the film 10 for carrying the tape, and the through-hole 7 may be formed by punching a two-layer tape in which the adhesive tape 6 and the bonding tape 12 are bonded together. And then attached to the base film 11.

(2) The adhesive tape 6 is not limited to the form of the above embodiment, and may be in the form of, for example, as shown in Fig. 11(a), the adhesive tape 6 is formed from a feed hole formed on the carrier tape 1. The side of the 5 side is exposed and can be folded back to the shape of the back side. Further, when the adhesive tape 6 is adhered to the carrier tape 1, a through hole 7 aligned with the feed hole 5 is formed on the back side, and a fold line 15 or a perforation is formed along a portion contacting the side of the carrier tape 1.

As shown in Fig. 11(b), the adhesive tape 6 is exposed from the side formed on the side of the feed hole 5 of the carrier tape 1 and can be folded back and adhered to the back side. Moreover, when the adhesive tape 6 is adhered to the carrier tape 1, a through hole 7 is formed which is aligned with the feed hole 5 on the surface side, and is in contact with the carrier tape 1 A fold line 15 or a perforation is formed in a portion of the side. Furthermore, there is no adhesive layer on the portion 16 that is in contact with the side of the carrier tape 1.

Further, as shown in Fig. 11(c), the adhesive tape 6 is exposed from the side formed on the side of the feed hole 5 of the carrier tape 1 and can be folded back and adhered to the back side. Further, when the adhesive tape 6 is adhered to the carrier tape 1, a through hole 7 is formed which is aligned with the feed holes 5 on the front side and the back side, and a fold line 15 is formed along a portion contacting the side of the carrier tape 1. Or perforation. Furthermore, there is no adhesive layer on the portion 16 that is in contact with the side of the carrier tape 1.

Further, as shown in Fig. 12(a), the adhesive tape 6 may have a shape wider than the carrier tape 1 in which the through holes are not formed. If the tape 6 is adhered to this, the through hole may not be formed in the bonding tape 12. For example, the through hole 7 is formed in a portion exposed from both ends of the adhesive tape 6. The through hole 7 is formed on the surface side in contact with the carrier tape 1, but may be formed on the back side first.

In the adhesive tape 6 of this embodiment, as shown in Fig. 12(b), the fold line 15 or the perforation may be formed along the portion contacting the side of the carrier tape 1 which is folded back to one side of the back surface. Furthermore, there is no adhesive layer on the portion 16 that is in contact with the side of the carrier tape 1.

Further, in the adhesive tape 6 of this embodiment, as shown in Fig. 12(c), a fold line 15 or a perforation is formed along a portion contacting the side of the carrier tape 1 which is folded back to one side of the back surface. At the same time, there is no adhesive layer at the portion in contact with the side. Further, in this embodiment, the through hole 7 aligned with the feed hole 5 is formed on the front surface and the back surface of the carrier tape 1.

(3) The adhesive tape 6 in which the slit s is formed in advance at the end may be attached to the base film 11. Moreover, the adhesive tape 6 can also be attached to the substrate. In the state of the film, the adhesive tape 6 is subjected to a press cutting process to form a slit s at the end of the tape, and the bonding tape 12 is bonded from above.

(4) The film-like carrier tape connecting film 10 in which the adhesive tape 6 and the bonding tape 12 are laminated may be formed to be adhered to the elongated base film 11 at a predetermined pitch.

For this purpose, the adhesive tape 6 and the bonding tape 12 which are adhered to the bonding tape 12 are peeled off from the base film 11 in groups, and are used for the connection of the carrier tape.

(5) The base film 11 and the bonding tape 12 of the film 10 for carrying the tape are not necessarily the same width as the adhesive tape 6, and may be wider than the adhesive tape 6.

(6) A tear line such as a perforation along the both sides of the top tape 4 may be formed in advance over the entire length of the adhesive tape 6 in the longitudinal direction. According to this configuration, as the base material of the adhesive tape 6, those having a thick thickness, a high strength, or a low tearing property can be used.

(7) The above embodiment exemplifies a case where the adhesive tape 6 which is thin and difficult to handle is adhered to the bonding tape 12 to be applied to the bonding process, but may be configured as follows: when the rigidity of the adhesive tape 6 is large to some kind When it is easy to handle, it is not necessary to keep it adhered to the bonding tape 12, and the adhesive tape 6 can be adhered to the carrier tape 1 in a single dose state. At this time, the bonding tape 12 may be omitted, and a film 10 for supporting the tape which is only adhered to the base film 11 by the adhesive tape 6 may be supplied.

(8) In the above embodiment, the slits s are formed at both end portions of the adhesive tape 6, but only on the peeling start side of the top layer tape 4. Moreover, as long as it is a belt body having a tearable property in a uniaxial direction, it may be Adhesive tape of the mouth s.

The present invention can be embodied in other specific forms without departing from the spirit and scope of the invention.

1‧‧‧ Carrying belt

2‧‧‧ recess

4‧‧‧ top layer

5‧‧‧ Feeding holes

6‧‧‧Adhesive tape

7‧‧‧through holes

12‧‧‧Fitting tape

S‧‧‧ incision

T‧‧‧ side

Claims (9)

An adhesive tape for a carrier tape is attached in such a manner as to span the ends of the carrier tape in an engaged state; it is formed to have a width larger than the width of the carrier tape, and has an integrally formed adhesive layer, the adhesive layer The adhesive is attached to the surface of the carrier tape, the back surface, and the side of the side on which the top tape is disposed, respectively. An adhesive tape for connecting tapes is attached in such a manner as to span the ends of the carrier tapes in an engaged state; the width is greater than the width of the carrier tape, and the feed holes are formed along one side of the carrier tape Corresponding through-holes, and having an integrally formed adhesive layer, which is in contact with the surface of the carrier tape, the back surface, and the side opposite to the side, respectively, when pasted. An adhesive tape for a carrier tape connection according to the first aspect of the invention or the second aspect of the patent application, wherein a slit for starting the tearing is formed on an end side of the longitudinal direction of the adhesive tape for connecting the carrier tape. A film for supporting a belt for attaching an adhesive tape for connecting a carrier tape; the base film, an adhesive tape having an adhesive layer integrally formed to have a width larger than a width of the carrier tape, and a bonding tape Laminating and laminating, and forming a through hole corresponding to the feeding hole of the carrier tape at least across the bonding, and the side edge formed without the through hole is folded into the back side of the carrier tape, the adhesive Layer and bearing surface, back, and not The side edges formed by the through holes are each in contact. The film for carrier tape connection according to claim 4, wherein the base film and the bonding tape are formed to protrude from both end portions of the adhesive tape. A carrier tape joining method for joining ends of a carrier tape in an engaged state to each other through an adhesive tape; wherein the adhesive tape is formed to have a width larger than a width of the carrier tape, and has an integrally formed adhesive layer, When the adhesive layer is adhered to the joint portion of the carrier tape in which the end portions are disposed in an engaged state, the adhesive layer is in contact with the surface of the carrier tape, the back surface, and the side on which the side of the top tape is disposed, respectively. And on the carrier tape, the adhesive tape exposed from the side of the side on which the top tape is provided is folded in and adhered to the back side of the carrier tape. A carrier tape joining method for joining end portions of a carrier tape in an engaged state to each other through an adhesive tape; wherein the adhesive tape is formed to have a width larger than a width of the carrier tape, and formed and carried along one side The through hole corresponding to the feed hole of the belt has an integrally formed adhesive layer which adheres the adhesive tape to the joint portion of the carrier tape where the ends are joined to each other, and the surface of the carrier tape The back side and the side opposite to the side are respectively in contact with each other, and are adhered in such a manner that the through hole of the adhesive tape is aligned with the feed hole of the carrier tape, and the opposite side of the carrier tape from the side is The adhesive tape exposed on the side of the side is folded in and adhered to the back side of the carrier tape. Such as the carrier belt of the sixth or the patent application scope The joining method is to adhere the adhesive tape to the carrier tape in a state of being adhered to the adhesive tape which is more rigid than the adhesive tape, and then the adhesive tape is peeled off from the adhesive tape. The method for attaching a carrier tape according to claim 8 is to apply a release treatment to the surface of the adhesive tape, and to set the adhesive force of the adhesive tape to be weaker than the adhesive layer of the adhesive tape. After the adhesive tape is integrally folded into the adhesive tape and the adhesive tape is adhered to the carrier tape, the adhesive tape is naturally peeled off from the surface of the adhesive tape to form a peeling starting point.