JP2013237502A - Method for connecting carrier tape, and method for peeling top tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accurately connect carrier tapes made to abut each other, and to surely peel a top tape of a tape connection part together with an adhesive tape.SOLUTION: When a top tape 4 covering recesses 2 storing chip parts 3 is peeled from a base tape of a carrier tape 1, a terminal face of the carrier tape disposed on the front side in a peeling direction is cut in tapered shape, and an adhesive tape 6 formed in a width larger than the width of the carrier tape is stuck to butting parts of the carrier tapes disposed with the ends butting each other. At this time, the adhesive tape that has an adhesive layer in at least contact parts of front faces and rear faces out of the front faces, one side faces and the rear faces of the carrier tapes and projects from the sides of the carrier tapes, is folded onto the rear face side of the carrier tapes and stuck thereto.

Description

  The present invention is a carrier tape connection method for abutting end portions of carrier tapes that supply electronic components such as chip components to an electronic component mounting apparatus, and affixing and connecting a carrier tape connection adhesive tape to the abutted portion, and The present invention relates to a top tape peeling method for peeling a top tape from a connected carrier tape.

As a carrier tape connection method using an adhesive tape, for example, a method of attaching three strip tapes and one feeding tape as a connecting tape between the front and back surfaces of a carrier tape whose ends are butted together. Has been proposed. That is, a feeding tape that covers only a portion of the feeding hole formed along one side of the carrier tape, a belt-like tape that covers only a top tape portion that covers a component storage portion that stores chip components of the carrier tape, and a component storage portion Three strips of tape that cover the back side of the tape are attached along the longitudinal direction (see Patent Document 1).
JP 2000-124665 A

  However, according to the conventional connection method, when the top tape part is peeled off, there is a problem that the top tape is not peeled off from the front side connecting part in the transport direction of the carrier tape or is broken in the peeling direction. Yes.

  The present invention has been made in view of such circumstances, and secures connection strength even in a state in which the top tape is turned off, suppresses bending at the carrier tape butting portion, and at the connection portion. An object of the present invention is to provide a carrier tape connecting method and a top tape peeling method that can be reliably peeled off from a carrier tape by integrating the top tape on the front side in the peeling direction with the adhesive tape for connection.

  Accordingly, the present inventors have repeatedly conducted experiments and the like to find out the cause of the peeling failure, and as a result, have obtained the following knowledge.

  The abutting portion of the carrier tape was observed while going back in order from the respective steps of peeling the top tape to the cutting process of the abutting portion of the carrier tape. As a result, it has been found that the cause of the problem occurs in the step of cutting the carrier tape using, for example, a nipper or scissors, in order to abut and position the ends of the carrier tape. That is, when a side cross section of the abutting portion is observed, as shown in FIG. 27, the end portion of the base tape 1a constituting the carrier tape is inclined by being compressed and deformed, and is attached to the surface. 4 is also inclined along the end face. In other words, the top tape 4 was tilted between the butted end surfaces.

  Therefore, it was found that the connecting adhesive tape affixed to the abutting site was not affixed to the end side of the top tape attached to the front carrier tape in the peeling direction. That is, on the front side, the adhesive tape is attached to the surface of the top tape slightly removed from the end portion. It was found that when the top tape was peeled in this state, the tensile force of the adhesive tape was not concentrated on the end side of the top tape, and therefore the peeling starting point could not be formed.

  In order to achieve such an object, the present invention has the following configuration.

That is, a carrier tape connection method for connecting the ends of the abutted carrier tapes via an adhesive tape,
When peeling the top tape covering the recess containing the chip parts from the carrier tape, the end surface of the carrier tape disposed on the front side in the peeling direction is cut into a taper shape,
When affixing the adhesive tape formed to a width larger than the width of the carrier tape to the abutting portion of the carrier tape in which the end portions are abutted to each other, the surface of the carrier tape, at least one of the side surface and the back surface, The adhesive tape has a pressure-sensitive adhesive layer at the contact site, and the adhesive tape protruding from the side of the carrier tape is folded and attached to the back side of the carrier tape.

  (Operation / Effect) According to this method, the adhesive tape can be attached to the end side of the top tape attached to the carrier tape cut into a tapered shape. For example, when the carrier tape is cut obliquely downward from the rear side to the front side in the transport direction, the end sides of the carrier tape and the top tape are at the same height as the surface of the carrier tape. Therefore, the adhesive tape to be attached to the abutting portion is reliably attached to the surface from the end side of the top tape. When the top tape peeling process is performed in this state, when the top tape peeling position reaches the carrier tape end side on the front side of the abutting portion, the tensile force concentrates on the top tape end side to which the adhesive tape is attached. As a result, a peeling start point is reliably formed from the terminal side, and the top tape can be peeled off from the carrier tape in a state where the top tape is connected via the adhesive tape.

  On the contrary, when the carrier tape is cut obliquely upward from the rear side to the front side in the peeling direction, the top tape is slightly inclined along the tapered surface of the end face. However, the top tape is exposed at the tapered surface without being sandwiched between the butted portions of the carrier tape by the space cut out in a tapered shape. Therefore, the adhesive tape to be attached to the abutting portion is reliably attached to the end side of the top tape. When the top tape peeling process is performed in this state, when the top tape peeling position reaches the end side of the top tape on the front side in the peeling direction, the tensile force concentrates on the end side, and the peeling starting point is surely formed. . As a result, it can be peeled off from the carrier tape in a state where the top tape is connected via the adhesive tape.

  In this case, the adhesive tape is applied over the entire width of the surface of the carrier tape. That is, the adhesive tape is also affixed to the carrier tape on both sides in the width direction of the top tape that is affixed to the surface of the carrier tape along the concave part row for storing components. Therefore, when the top tape is peeled off from the surface of the carrier tape for taking out the parts, the adhesive tape portion integrated with the top tape is torn into a thin band shape with the width of the top tape. Even if the adhesive tape is partially peeled off integrally with the top tape, the adhesive tape remains on the carrier tape surface, the side of the carrier tape, and the back side of the carrier tape. Sufficient connection strength can be ensured.

  Furthermore, even when the top tape is turned off, the adhesive tape left on the carrier tape at least on the front and back surfaces ensures continuity at the carrier tape abutting site, and the carrier tape is smoothly fed and wound. be able to.

  In the above method, when the ends of the carrier tape are abutted with each other, it is preferable to cut the leading end surface of the carrier tape disposed on the rear side in the peeling direction of the top tape into a taper that is inclined downward.

  According to this method, a “V” -shaped space is formed at the butt portion of the carrier tape. When the adhesive tape is applied to the abutting portion, the adhesive tape adheres to the abutting portion while being concavely curved in the space. That is, it becomes easier to elastically deform the pressure-sensitive adhesive tape into the concave curved shape than when only the end face of the carrier tape on the front side in the peeling direction is cut into a taper shape. Therefore, the adhesive tape can be brought into close contact with the end side of the front top tape, and as a result, the top tape can be more reliably peeled off from the carrier tape.

  In addition, the embodiment of the method of the present invention is characterized in that the adhesive tape is attached to and held on the carrier tape in a state where the adhesive tape is attached and held on the application tape having rigidity higher than that of the adhesive tape, and then the application tape is removed from the adhesive tape.

  According to this method, even if the pressure-sensitive adhesive tape is thin and difficult to handle, the pressure-sensitive adhesive tape attached and held on the application tape is not unduly bent or wrinkled. Therefore, the adhesive tape can be easily attached to the carrier tape.

Furthermore, in the embodiment of the method of the present invention, the surface of the pressure-sensitive adhesive tape is subjected to a release treatment, and the adhesive force of the application tape is set to be weaker than the pressure-sensitive adhesive force of the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape,
The adhesive tape is preferably folded integrally with the application tape, and the adhesive tape is attached to the carrier tape. Then, the adhesive tape is naturally peeled from the surface of the adhesive tape by the elastic restoring force of the application tape to form a peeling start point.

  According to this method, since the application tape is partially peeled from the adhesive tape by the elastic restoring force after the adhesive tape is attached, the application tape can be easily removed.

  The present invention has the following configuration in order to achieve such an object.

That is, a top tape peeling method for peeling the top tape from the surface of the carrier tape connected by attaching an adhesive tape to the abutted ends,
Cutting the end face of the carrier tape arranged on the front side in the peeling direction into a taper shape,
When affixing the adhesive tape formed to a width larger than the width of the carrier tape to the abutting portion of the carrier tape in which the end portions are abutted to each other, the surface of the carrier tape, at least one of the side surface and the back surface, Have a pressure-sensitive adhesive layer at the contact site, fold the adhesive tape protruding from the side of the carrier tape into the back side of the carrier tape, and attach it.
A top tape is continuously peeled off from the connected carrier tape.

  (Operation / Effect) According to this method, the end side of the top tape can be exposed on the tapered end surface of the carrier tape on the front side in the peeling direction. Therefore, the adhesive tape can be brought into close contact with the rear end side of the top tape on the front side, and the top tape can be reliably peeled off from the carrier tape with the terminal end as a peeling starting point.

  According to the carrier tape connecting method and the top tape peeling method of the present invention, the abutted carrier tape is securely and firmly connected using an adhesive tape, and sufficient connection strength is ensured even when the top tape is turned off. And the folding at the carrier tape butting portion can be suppressed.

  Further, since the adhesive tape is securely attached to the rear end side of the top tape on the front side in the peeling direction of the butted portion, the tensile force is concentrated on the rear end side, and the peeling start point is reliably formed. Therefore, it is possible to continuously peel the top tape from the carrier tape without the top tape being peeled off or torn at the butted portion.

It is the perspective view which looked at the carrier tape from the surface side. It is a front view of a cutting jig. It is a vertical side view of a cutting jig. It is a top view of a cutting jig. It is an enlarged side view which shows the cutting process of the terminal part of a carrier tape. It is a side view of the butting part of a carrier tape. It is a top view of the butting | matching part of a carrier tape. It is a perspective view which shows a carrier tape connection procedure. It is a perspective view which shows a carrier tape connection procedure. It is a side view which shows the procedure which affixes an adhesive tape on the carrier tape surface. It is a side view which shows the procedure which affixes an adhesive tape on the carrier tape surface. It is a perspective view which shows a carrier tape connection procedure. It is the perspective view which looked at the connected carrier tape from the back side. It is a perspective view which shows the components taking-out state by peeling process of a top tape. It is a perspective view which shows the peeling procedure of a top tape. It is a perspective view which shows the peeling procedure of a top tape. It is a vertical front view which shows the principal part of the connected carrier tape. It is a vertical front view which shows the components extraction state in a connection site | part. It is a perspective view of the film for carrier tape connection. It is a perspective view of the state which peels off the base film from the film for carrier tape connection. It is a perspective view which shows the peeling procedure of the top tape of a modification. It is a perspective view which shows the peeling procedure of the top tape of a modification. It is a perspective view which shows the peeling procedure of the top tape of a modification. It is a perspective view which shows the peeling procedure of the top tape of a modification. It is a perspective view which shows the peeling procedure of the top tape of a modification. It is a perspective view which shows the peeling procedure of the top tape of a modification. It is a side view of the butting | matching part of the carrier tape connected by the conventional method.

  An embodiment of the present invention will be described below with reference to the drawings.

<Carrier tape>
As shown in FIG. 1, the carrier tape 1 is composed of a base tape 1 a, a recess 2, a top tape 4, and a feed hole 5.

  The recesses 2 are formed on the surface of the base tape 1a at a constant pitch in the tape longitudinal direction. Each recess 2 houses a small electronic component 3 that is a chip component.

  The top tape 4 is bonded to the surface of the base tape 1a in a state where the electronic component 3 is housed in each recess 2.

  The feed holes 5 are formed at a predetermined pitch along one side of the base tape 1a. Therefore, the stored electronic component 3 is taken out by peeling the top tape 4 from the surface of the base tape 1a and opening the recess 2. The carrier tape 1 is generally loaded in an electronic component mounting apparatus in a reel winding state.

<Connection method of carrier tape>
When the mounting process proceeds in the electronic component mounting apparatus, the tip of the carrier tape 1 fed out from a new tape reel is connected to the end of the loaded carrier tape 1. The basic connection procedure will be described below.

  (1) First, the rear end of the carrier tape 1 disposed on the front side in the peeling direction, which becomes a butt portion, is cut into a taper shape with a cutting jig.

  Here, as shown in FIGS. 2 to 4, the cutting jig 20 includes a holding base 21, a support frame 22, a swing arm 23, and a round blade 24. That is, the holding table 21 is formed with a recessed portion 25 for storing the carrier tape 1 and a cutter running groove 26 orthogonal to the recessed portion 25.

  The support frame 22 is erected on the holding base 21 in an inclined posture from the terminal side of the carrier tape 1 stored in the recessed portion 25 toward the carrier tape side.

  The swing arm 23 is pivotally supported by the support frame 22 in the vicinity of the center in the longitudinal direction. In addition, the swing arm 23 has an operation portion that extends on the upper side while rotatably supporting the round blade 24 at the lower portion.

  Therefore, the carrier tape 1 is accommodated while the round blade 24 passes through the cutter running groove 26 by accommodating the end portion side of the carrier tape 1 in the recessed portion 25 and swinging the swing arm 23 as shown in FIG. As shown in FIG. 5, the end portion side of is cut into a taper shape.

  (2) As shown in FIG. 6 and FIG. 7, a state in which the pitch of the feed holes 5 positioned before and after the abutting portion between the end of the preceding carrier tape 1 and the leading end of the following carrier tape 1 is constant. To match. In this case, the tapes can be easily aligned by using a connecting jig in which guide pins P that are fitted in the feed holes 5 are erected and arranged at predetermined intervals.

  (3) Next, as shown in FIG. 8 and FIG. 9, the adhesive tape 6 is attached to the surface of the abutted portion of the abutted carrier tape 1 over a predetermined length.

  The pressure-sensitive adhesive tape 6 has a width larger than that of the carrier tape, and a pressure-sensitive adhesive layer is formed on the entire back surface. Further, through holes 7 having the same diameter as the feed holes 5 are formed at the same pitch as the feed hole pitch along one side of the adhesive tape. Adhesive tape 6 is affixed across both carrier tapes 1 so that these through holes 7 coincide with the positions of feed holes 5. Further, the other side of the adhesive tape 6 attached in this way greatly protrudes from the other side t of the carrier tape 1.

  At this time, since the end surface of the carrier tape 1 is cut into a taper shape, a space is formed at the butt end as shown in FIG. Therefore, as shown in FIG. 11, the pressure-sensitive adhesive tape 6 is concavely curved and stuck along the end surface on the terminal side of the carrier tape 1 by pressing when the tape is applied. That is, the adhesive tape 6 is attached to the end side of the top tape 4.

  (4) Next, as shown in FIGS. 12, 13, and 17, the adhesive tape 6 protruding from the other side t of the carrier tape 1 is bent along the side t of the carrier tape 1 and then the carrier tape 1 is attached to the side t and the back surface. As a result, the connection of the two carrier tapes 1 that are abutted is completed.

  The carrier tapes 1 connected in series in this way are connected with the adhesive tape 6 over the entire width of the surface, and are also connected with the adhesive tape 6 on the side t of the carrier tape 1 and the back surface of the carrier tape. . Therefore, the sticking area of the adhesive tape is increased. Therefore, there is no possibility that the abutting end of the carrier tape 1 is pulled away by the tape feeding force, and reliable and smooth tape feeding and tape winding / recovery after taking out the components can be performed.

<Top tape peeling method>
When the connection process of the carrier tape 6 is completed, the top tape 4 is peeled off from the carrier tape 1 by the electronic component mounting apparatus. In this peeling process, when the part removal from the carrier tape 1 reaches the tape connection location, as shown in FIG. 14, as the top tape 4 is turned up, it is bonded to the top tape 4 as shown in FIG. The adhesive tape portion 6a being cut off is cut off into a thin strip shape and is turned off integrally with the top tape 4. Here, a fine zigzag cut s is formed in advance over the entire width of the longitudinal edge of the adhesive tape 6. A shearing force concentrates on the notch s to form a starting point of tearing. Accordingly, the tearing of the adhesive tape portion 6a is smoothly performed. Note that the number of the cuts s is not particularly limited, and the setting can be changed as appropriate.

  In this case, on both sides of the top tape 4, the adhesive tape 6 is firmly attached and fixed to the carrier tape surface, the side t, and the back surface. Therefore, when the top tape 4 is turned up, the shearing force that tears the adhesive tape 6 on both sides of the top tape 4 efficiently acts on the adhesive tape 6 and the adhesive tape portion 6a is smoothly torn.

  Further, in this peeling process, as shown in FIGS. 15 and 16, when the peeling position reaches the terminal position of the preceding carrier tape 1, the adhesive tape 6 is in close contact with the terminal edge of the top tape 4. The tensile force accompanying the peeling of the adhesive tape 6 is concentrated on the end side, and a peeling starting point is formed on the top tape 4. Therefore, when the peeling start point is formed, the top tape 4 is smoothly peeled from the peeling start point.

  According to the top tape peeling method, the adhesive tape 6 that is recessed and curved in the space formed by the tapered surface at the end of the preceding carrier tape 1 is in close contact with the top tape 4. Therefore, the tensile force accompanying peeling of the top tape 4 can be made to act on the terminal side of the top tape 4 reliably, and the peeling start point can be formed reliably. As a result, the top tape 4 and the adhesive tape 6 can be separated smoothly from the carrier tape 1 without causing the top tape 4 and the adhesive tape 6 to be separated or tearing the top tape 4.

  Further, even if the adhesive tape portion 6a is turned off together with the top tape 4, the tape connecting function is sufficiently left by the adhesive tape 6 attached to the periphery of the feed hole 5, the side t of the carrier tape 1, and the back surface. To do.

<Carrier tape connection film>
In addition, the adhesive tape 6 used for the said connection of the carrier tape 1 is supplied as a label-like laminated film, and the external appearance of the carrier tape connection film 10 is shown in FIG.

  This carrier tape connecting film 10 has a three-layer laminated structure in which an adhesive tape 6 is bonded and held on the surface of a base film 11 whose surface is formed on a release surface, and a transparent application tape 12 is bonded thereon. It has become. The base film 11 is formed longer than the adhesive tape 6, and the application tape 12 is bonded over the entire length of the base film 11.

  Moreover, after the base film 11, the adhesive tape 6, and the application tape 12 are bonded and laminated, the through hole 7 of the adhesive tape 6 is formed by punching over these three layers.

  In the actual connection process, as shown in FIG. 20, the base film 11 is peeled off from the carrier tape connecting film 10 and the adhesive tape 6 is attached to the application tape 12 and held for carrier tape connection. (See the phantom lines in FIGS. 8 and 9). Then, the application tape 12 is turned off after being attached to the carrier tape 1.

  In this case, even if the adhesive tape 6 is thin and difficult to handle, by holding both ends of the application tape 12, the adhesive tape 6 that is stuck and held does not bend unduly or cause wrinkles. It can be handled. Therefore, the adhesive tape 6 can be reliably and easily attached to the carrier tape 1. Further, by inserting the through hole 7 formed between the adhesive tape 6 and the application tape 12 into a guide pin standing on a sticking jig or the like, it is easy to align the adhesive tape 6 with the carrier tape 1. Yes.

  Specific examples of members used for connecting each carrier tape will be described below.

〔Adhesive tape〕
The pressure-sensitive adhesive tape 6 of the present invention has a pressure-sensitive adhesive layer on one surface of the substrate.

  It is preferable that the width of the adhesive tape 6 is as wide as possible as long as the tip of the adhesive tape that wraps around the back side of the carrier tape does not overlap the feed hole 5. With this configuration, a sufficient bonding area on the back side of the carrier tape can be secured, and the tape connection strength can be increased.

  The pressure-sensitive adhesive tape 6 is preferably colored black, blue, or the like so that the carrier tape connection portion can be easily identified. This configuration is effective in performing lot management of the electronic component 3 conveyed via the carrier tape 1 based on detection of the tape connection location in the mounting apparatus.

  The base material of the pressure-sensitive adhesive tape 6 is set so that the tear strength in the longitudinal direction is set to about 0.75 to 0.10 times (preferably 0.75 to 0.50 times) smaller than the tear strength in the width direction. As the tape 4 is turned up, the adhesive tape portion 6a is torn smoothly.

  The ratio between the tear strength in the longitudinal direction and the tear strength in the width direction can be adjusted, for example, by controlling the draw ratio in each direction.

  Examples of the base material of the adhesive tape 6 include polyester (polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, polybutylene naphthalate), polyolefin (polyethylene, polypropylene, ethylene-propylene copolymer, etc.), polyvinyl alcohol, Polyvinylidene chloride, polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polyvinyl acetate, polyamide, polyimide, celluloses, fluororesins, polyethers, polyetheramides, polyphenylene sulfide, polystyrene resins (polystyrene, etc.), Plastic base materials such as polycarbonate and polyethersulfone can be used.

  In this invention, it is preferable to use base materials, such as a polyester film and a polyester film, at the point which is easy to acquire, has sufficient intensity | strength, and is excellent in a linear cut property.

  Moreover, in order to improve the adhesiveness with the adhesive on at least the back surface of the base material in the adhesive tape 6, conventional surface treatments such as chromic acid treatment, ozone exposure, flame exposure, high piezoelectric impact exposure, ionizing radiation treatment, etc. An oxidation treatment by a chemical or physical method may be performed.

  As for the thickness of the base material in the adhesive tape 6, about 10-100 micrometers is preferable, More preferably, it is 10-50 micrometers, Most preferably, it is 10-30 micrometers. When the thickness of the substrate is less than the above range, the strength of the pressure-sensitive adhesive tape may be insufficient, impairing practicality. On the other hand, when the thickness of the substrate exceeds the above range, the tearability in the longitudinal direction tends to be lowered, and it tends to be difficult to wind the carrier tape. In addition, there is a risk that the running performance in the actual machine (mounter: parts cassette) will deteriorate.

  As the pressure-sensitive adhesive (base polymer) for forming the back surface of the substrate in the pressure-sensitive adhesive tape 6 on the pressure-sensitive adhesive surface, for example, an acrylic pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, and a silicon-based pressure-sensitive adhesive can be used. Moreover, the thickness of an adhesive layer is about 10-50 micrometers, Preferably it is 10-35 micrometers, Most preferably, it is 15-30 micrometers.

  Examples of the acrylic pressure-sensitive adhesive include n-butyl (meth) acrylate, isobutyl (meth) acrylate, s-butyl (meth) acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, ( Isopentyl (meth) acrylate, hexyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, (Meth) acrylic acid nonyl, (meth) acrylic acid isononyl, (meth) acrylic acid decyl, (meth) acrylic acid isodecyl, (meth) acrylic acid undecyl, (meth) acrylic acid dodecyl, (meth) acrylic acid tridecyl, ( Tetradecyl (meth) acrylate, pentadecyl (meth) acrylate, (meth) a Linear or branched chain having 4 to 20 carbon atoms in the alkyl group, such as hexadecyl rillate, heptadecyl (meth) acrylate, octadecyl (meth) acrylate, nanodecyl (meth) acrylate, eicosyl (meth) acrylate Examples thereof include (meth) acrylic acid alkyl esters having an alkyl group. In the present specification, “(meth) acryl” means “acryl” and / or “methacryl”.

  Among these, (meth) acrylic acid alkyl esters having 4 to 20 carbon atoms in the alkyl group are preferable, and 2-ethylhexyl acrylate (2EHA) and n-butyl acrylate (BA) are more preferable.

  The content of the main monomer is preferably 50 to 100% by weight, more preferably 70 to 100% by weight, based on the total amount of monomer components (100% by weight) constituting the acrylic pressure-sensitive adhesive.

  Examples of the functional group-containing monomer include carboxyl group-containing monomers such as (meth) acrylic acid, itaconic acid, maleic acid, fumaric acid, crotonic acid, and isocrotonic acid (an acid anhydride group such as maleic anhydride and itaconic anhydride). (Meth) acrylic acid 2-hydroxypropylene, (meth) acrylic acid 3-hydroxypropylene, (meth) acrylic acid 4-hydroxybutyl, (meth) acrylic acid 6-hydroxyhexyl, etc. Hydroxyl group (hydroxyl group) content monomers such as hydroxyalkyl acrylate, vinyl alcohol and allyl alcohol; Amide group containing monomers such as (meth) acrylamide; N-methyl (meth) acrylamide, N-ethyl (meth) acrylamide, N, N-dimethyl (meth) acrylic N-t-butyl (meth) acrylamide, N-methylol (meth) acrylamide, N-methoxymethyl (meth) acrylamide, N-ethoxymethyl (meth) acrylamide, N-butoxymethyl (meth) acrylamide, N-octyl N-substituted amide group-containing monomers such as acrylamide and N-hydroxyethylacrylamide; aminoethyl (meth) acrylate, dimethylaminoethyl (meth) acrylate, diethylaminoethyl (meth) acrylate, dimethylaminopropyl (meth) acrylate And amino group-containing monomers such as t-butylaminoethyl (meth) acrylate; glycidyl group-containing monomers such as glycidyl (meth) acrylate and methyl glycidyl (meth) acrylate. Among the functional group-containing monomers, a carboxyl group-containing monomer is preferable, and acrylic acid (AA) is more preferable.

  The content of the functional group-containing monomer is preferably less than 20% by weight and more preferably 5% by weight or less with respect to the total amount of monomer components (100% by weight) constituting the acrylic pressure-sensitive adhesive.

  The acrylic pressure-sensitive adhesive can be prepared by polymerizing the above monomer components by a known or conventional polymerization method. For example, a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, or a polymerization method (active activity irradiation) Energy beam polymerization method). Among them, the solution polymerization method and the active energy ray polymerization method are preferable in terms of transparency, water resistance, cost, and the like, and the solution polymerization method is more preferable.

  In the above solution polymerization method, various general solutions can be used. Examples of such solvents include esters such as ethyl acetate and n-butyl acetate; aromatic hydrocarbons such as toluene and benzene; aliphatic hydrocarbons such as n-hexane and n-heptane; cyclohexane and methylcyclohexane And organic solvents such as ketones such as methyl ethyl ketone and methyl isobutyl ketone. Solvents can be used alone or in combination of two or more.

  In the polymerization of the acrylic pressure-sensitive adhesive, a polymerization initiator can also be used. The polymerization initiator is not particularly limited and can be appropriately selected from known or commonly used ones. For example, 2,2′-azobisisobutyronitrile, 2,2′-azobis ( 4-methoxy-2,4-dimethylvaleronitrile), 2,2′-azobis (2,4-dimethylvaleronitrile), 2,2′-azobis (2-methylbutyronitrile), 1,1′-azobis Azo polymerization initiators such as (cyclohexane-1-carbonitrile), 2,2′-azobis (2,4,4-trimethylpetane), dimethyl-2,2′-azobis (2-mailpropionate); Benzoyl peroxide, t-butyl hydroperoxide, di-t-butyl peroxide, t-butyl peroxybenzoate, dicumyl peroxide, 1,1'-bi Oil-soluble polymerization initiators such as peroxide-based polymerization initiators such as (t-butylperoxin) -3,3,5-trimethylcyclohexane and 1,1′-bis (t-butylperoxine) cyclododecane Can be mentioned. These can be used alone or in combination of two or more. The amount of the polymerization initiator used is not particularly limited as long as it can be conventionally used as a polymerization initiator.

  The acrylic pressure-sensitive adhesive may be crosslinked by adding a crosslinking agent. Examples of the crosslinking agent include various crosslinking agents such as epoxy compounds, isocyanate compounds, metal chelate compounds, metal alkoxides, metal salts, amine compounds, hydrazine compounds, and aldehyde compounds, and these acrylic pressure-sensitive adhesives. The functional group contained in can be appropriately selected and used. The amount of the crosslinking agent used is, for example, about 0.01 to 10 parts by weight, preferably about 0.05 to 5 parts by weight with respect to 100 parts by weight of the acrylic pressure-sensitive adhesive.

  Examples of the rubber adhesive include natural rubber and various synthetic rubbers. Examples of the synthetic rubber include polyisoprene rubber, styrene / butadiene (SB) rubber, styrene / isoprene (SI) rubber, styrene / isoprene / styrene block copolymer (SIS) rubber, and styrene / butadiene / styrene block copolymer. Combined (SBS) rubber, Styrene / ethylene / butylene / styrene block copolymer (SEBS) rubber, Styrene / ethylene / propylene / styrene block copolymer (SEPS) rubber, Styrene / ethylene / propylene block copolymer (SEP) Examples thereof include rubber, recycled rubber, butyl rubber, polyisobutylene, and modified products thereof.

  As the silicone adhesive, for example, silicone rubber or silicone resin mainly composed of organopolysiloxane, or a crosslinking agent such as a siloxane crosslinking agent or a peroxide crosslinking agent is added and crosslinked / polymerized. The thing etc. can be mentioned.

  The pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape 6 of the present invention contains other components (for example, a suitable crosslinking agent, pressure-sensitive adhesive, plasticizer, filler, antioxidant, etc.) in addition to the pressure-sensitive adhesive (base polymer). May be included.

  As a method for forming the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape 6 of the present invention, a known and usual method can be adopted. For example, a solvent (for example, toluene, xylene, ethyl acetate, methyl ethyl ketone, etc.) is used as necessary. The adhesive is diluted so that the non-volatile concentration is about 10 to 50% by weight to prepare a coating solution, which is applied onto a substrate or an appropriate separator (such as release paper) (coating) And a method of drying after that.

  In addition, a known coating method can be used for application (coating) in the above-described pressure-sensitive adhesive forming method, and a conventional coater such as a gravure coater, a reverse coater, a kiss roll coater, a dip roll coater, or a bar coater. A knife coater, a spray coater, a comma coater, a direct coater, a die coater, or the like can be used.

  Moreover, it can form also by melt-extrusion molding the adhesive which comprises a base material and the said adhesive layer, and performing the extending | stretching (uniaxial stretching) process to a vertical or horizontal direction after that. As the melt extrusion method, any known technique such as an inflation method or a T-die method can be used.

  [Base film for carrier tape connection film]

  The base film 11 can use a well-known release paper (separator), and the substrate is surface-treated with a release agent such as silicone, long chain alkyl, fluorine, or molybdenum sulfide. A low adhesive substrate such as a plastic film or paper material is preferred.

  The thickness of the base film 11 is preferably about 16 to 300 μm, more preferably 90 to 150 μm, and particularly preferably 95 to 130 μm.

  [Application tape with label for carrier tape connection]

  This application tape 12 includes an adhesive layer made of the same material as the adhesive layer of the adhesive tape 6 on the back surface of the substrate made of the same material as that of the adhesive tape 6, and the thickness of the substrate is For example, it is about 16-125 micrometers, Preferably it is 38-75 micrometers, Most preferably, it is 45-70 micrometers.

  Further, the thickness of the pressure-sensitive adhesive layer in the application tape 12 is preferably about 6 to 12 μm, more preferably 7 to 11 μm, and particularly preferably 8 to 10 μm.

  The present invention can also be implemented in the following forms.

  (1) In the embodiment described above, the end of the preceding carrier tape 1 may be cut into a taper with a downward slope as shown in FIG. According to this configuration, a V-shaped space is formed at the abutting portion between the carrier tapes. That is, since a wide opening is formed along the longitudinal direction of the carrier tape 1, it becomes easy to elastically deform the adhesive tape 6 as shown in FIG. 22, and as a result, the adhesive tape 6 precedes as shown in FIG. The carrier tape 1 can be securely adhered to the terminal side of the top tape 4 at the terminal end.

  (2) In the above embodiment, as shown in FIGS. 24 to 26, both end surfaces are cut so that the taper surface at the end of the preceding carrier tape 1 and the taper surface at the tip of the rear carrier tape 1 overlap. Also good. At this time, the thickness of the overlapping portion is the same as the thickness of the carrier tape itself.

  Moreover, it is preferable that the front end of the preceding carrier tape 1 has a taper shape inclined upward toward the end. In this case, since the end side of the top tape 4 protrudes from the end of the carrier tape 1, the adhesive tape 6 can be reliably attached.

  In this case, the end face of the carrier tape 1 may be cut individually, or the end side and the front end side of the carrier tape 1 may be overlapped and obliquely cut simultaneously.

  (3) The through-hole 7 is not necessarily required in the base film 11 of the carrier tape connecting film 10. After the through-hole 7 is punched and formed in a two-layer tape in which the adhesive tape 6 is bonded to the application tape 12, You may make it affix on the film 11. FIG.

  (4) The adhesive tape 6 in which the notches s are formed in advance on the end sides may be bonded to the base film 11. Alternatively, press cutting may be applied to the adhesive tape 6 in a state where the adhesive tape 6 is bonded to the base film to form a cut s at the end of the tape, and the application tape 12 may be bonded thereon.

  (5) The label-like carrier tape connecting film 10 in which the adhesive tape 6 and the application tape 12 are laminated may be formed on the long base film 11 that is stuck and held at a predetermined pitch.

  In the case of this configuration, the adhesive tape 6 and the application tape 12 that are stuck and held on the application tape 12 are turned off from the base film 11 one set at a time and used for carrier tape connection.

  (6) The base film 11 and the application tape 12 in the carrier tape connecting film 10 do not necessarily have the same width as the adhesive tape 6, and may be wider than the adhesive tape 6.

  (7) It is also possible to previously form a tear line such as a perforation along the both sides of the top tape 4 over the entire length of the adhesive tape 6 in the longitudinal direction. According to this configuration, it is possible to use a thick base material having high strength or a low tear property as the base material of the adhesive tape 6.

  (8) In the above embodiment, the case where the adhesive tape 6 which is thin and difficult to handle is pasted and held on the application tape 12 is illustrated as an example, but it may be configured as follows.

  If the adhesive tape 6 has a certain degree of rigidity and is easy to handle, the adhesive tape 6 can be attached to the carrier tape 1 in a single state without being attached and held on the application tape 12. In this case, the application tape 12 can be omitted, and the carrier tape connecting film 10 in which only the adhesive tape 6 is pasted and held on the base film 11 can be configured and supplied.

  (9) In the above embodiment, the cuts s are formed at both ends of the adhesive tape 6, but only the peeling start side of the top tape 4 may be used. Moreover, if it is a tape which has the characteristic to tear along one axial direction, the adhesive tape which does not have the cut s may be sufficient.

DESCRIPTION OF SYMBOLS 1 ... Carrier tape 2 ... Recessed part 3 ... Electronic component 4 ... Top tape 5 ... Feeding hole 6 ... Adhesive tape 7 ... Through-hole 10 ... Carrier tape connection label 11 ... Base film 12 ... Application tape s ... Notch t ... Carrier tape Side

Claims (10)

A carrier tape connection method for connecting the ends of the abutted carrier tapes via an adhesive tape,
When peeling the top tape covering the recess containing the chip parts from the carrier tape, the end surface of the carrier tape arranged on the front side in the peeling direction is cut into a taper shape,
When affixing the adhesive tape formed to a width larger than the width of the carrier tape to the abutting portion of the carrier tape in which the end portions are abutted to each other, the surface of the carrier tape, at least one of the side surface and the back surface, A method of connecting a carrier tape, comprising: an adhesive tape having a pressure-sensitive adhesive layer at a contact portion, and folding and sticking an adhesive tape protruding from a side of the carrier tape to the back side of the carrier tape. The carrier tape connecting method according to claim 1,
A carrier tape connection method, characterized in that, when the ends of the carrier tape are butted together, the front end surface of the carrier tape disposed on the rear side in the peeling direction of the top tape is cut into a taper with an obliquely descending shape. In the carrier tape connecting method according to claim 1 or 2,
The adhesive tape is formed with a width larger than the width of the carrier tape, and a through hole corresponding to the feed hole of the carrier tape is formed along one side.
When affixing the adhesive tape to the butt portion of the carrier tape that has been butt-arranged between the end portions, the carrier tape has a pressure-sensitive adhesive layer at the contact portion between the front surface and the back surface of at least one of the front surface, one side surface, and the back surface;
Attached to the carrier tape feed hole so that the through hole of the adhesive tape matches, and the adhesive tape protruding from the other side of the carrier tape is folded and attached to the back side of the carrier tape. Method. In the carrier tape connection method according to any one of claims 1 to 3,
A carrier tape connection method comprising: adhering an adhesive tape to an application tape that is more rigid than the adhesive tape, attaching the adhesive tape to a carrier tape, and then removing the application tape from the adhesive tape. In the carrier tape connecting method according to any one of claims 1 to 4,
The surface of the adhesive tape has been subjected to a release treatment, and the adhesive strength of the application tape is set to be weaker than the adhesive strength of the adhesive layer of the adhesive tape,
After the adhesive tape is folded together with the application tape and the adhesive tape is attached to the carrier tape, the adhesive tape is naturally peeled from the surface of the adhesive tape by the elastic restoring force of the application tape to form a peeling start point. Carrier tape connection method. It is a top tape peeling method for peeling the top tape from the surface of the carrier tape connected by attaching an adhesive tape to the butted ends,
Cutting the end face of the carrier tape arranged on the front side in the peeling direction into a taper shape,
When affixing the adhesive tape formed to a width larger than the width of the carrier tape to the abutting portion of the carrier tape in which the end portions are abutted to each other, the surface of the carrier tape, at least one of the side surface and the back surface, Have a pressure-sensitive adhesive layer at the contact site, fold the adhesive tape protruding from the side of the carrier tape into the back side of the carrier tape, and attach it.
A top tape peeling method, wherein the top tape is peeled from the connected carrier tape. In the top tape peeling method according to claim 6,
When the ends of the carrier tape are butted together, the top surface of the carrier tape disposed on the rear side in the peeling direction of the top tape is cut into a taper with a downward slope. In the top tape peeling method according to claim 6 or 7,
The adhesive tape is formed with a width larger than the width of the carrier tape, and a through hole corresponding to the feed hole of the carrier tape is formed along one side.
When affixing the adhesive tape to the butt portion of the carrier tape that has been butt-arranged between the end portions, the carrier tape has a pressure-sensitive adhesive layer at the contact portion between the front surface and the back surface of at least one of the front surface, one side surface, and the back surface;
Attaching the adhesive tape so that the through hole of the adhesive tape matches the feed hole of the carrier tape, and attaching the adhesive tape protruding from the other side of the carrier tape to the back side of the carrier tape. Method. In the top tape peeling method in any one of Claims 6 thru | or 8,
A top tape peeling method, comprising: adhering an adhesive tape to an application tape having rigidity higher than that of the adhesive tape, attaching the tape to a carrier tape, and then removing the application tape from the adhesive tape. In the top tape peeling method in any one of Claims 6 thru | or 9,
The surface of the adhesive tape has been subjected to a release treatment, and the adhesive strength of the application tape is set to be weaker than the adhesive strength of the adhesive layer of the adhesive tape,
After the adhesive tape is folded together with the application tape and the adhesive tape is attached to the carrier tape, the adhesive tape is naturally peeled from the surface of the adhesive tape by the elastic restoring force of the application tape to form a peeling start point. Top tape peeling method.

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