TWI583739B - A composition for a transparent film, a method for forming a transparent film, and a transparent film - Google Patents
A composition for a transparent film, a method for forming a transparent film, and a transparent film Download PDFInfo
- Publication number
- TWI583739B TWI583739B TW101130846A TW101130846A TWI583739B TW I583739 B TWI583739 B TW I583739B TW 101130846 A TW101130846 A TW 101130846A TW 101130846 A TW101130846 A TW 101130846A TW I583739 B TWI583739 B TW I583739B
- Authority
- TW
- Taiwan
- Prior art keywords
- transparent film
- composition
- group
- condensation product
- formula
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims description 55
- 238000000034 method Methods 0.000 title claims description 13
- 239000007859 condensation product Substances 0.000 claims description 49
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 39
- 125000000217 alkyl group Chemical group 0.000 claims description 18
- 125000004432 carbon atom Chemical group C* 0.000 claims description 16
- 238000010304 firing Methods 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 11
- 239000004094 surface-active agent Substances 0.000 claims description 10
- 239000003960 organic solvent Substances 0.000 claims description 8
- 125000005843 halogen group Chemical group 0.000 claims description 7
- 238000002834 transmittance Methods 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 239000007858 starting material Substances 0.000 claims description 4
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical group [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 28
- 229910052707 ruthenium Inorganic materials 0.000 description 28
- 230000003287 optical effect Effects 0.000 description 12
- -1 alkoxy decane Chemical compound 0.000 description 10
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- 125000000962 organic group Chemical group 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 8
- 125000001183 hydrocarbyl group Chemical group 0.000 description 8
- 238000006460 hydrolysis reaction Methods 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- 239000010410 layer Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- 230000007062 hydrolysis Effects 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- 125000001424 substituent group Chemical group 0.000 description 5
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 4
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- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000003377 acid catalyst Substances 0.000 description 4
- 125000004122 cyclic group Chemical group 0.000 description 4
- 150000007524 organic acids Chemical class 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- SXZBOQZQPFHOMJ-UHFFFAOYSA-N CC(C(OCCCC)(OCCCC)C)CCCCCCCC Chemical compound CC(C(OCCCC)(OCCCC)C)CCCCCCCC SXZBOQZQPFHOMJ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- ANBBCZAIOXDZPV-UHFFFAOYSA-N 1,1,1-trimethoxy-2-methyldecane Chemical compound CC(C(OC)(OC)OC)CCCCCCCC ANBBCZAIOXDZPV-UHFFFAOYSA-N 0.000 description 2
- VPBZZPOGZPKYKX-UHFFFAOYSA-N 1,2-diethoxypropane Chemical compound CCOCC(C)OCC VPBZZPOGZPKYKX-UHFFFAOYSA-N 0.000 description 2
- LEEANUDEDHYDTG-UHFFFAOYSA-N 1,2-dimethoxypropane Chemical compound COCC(C)OC LEEANUDEDHYDTG-UHFFFAOYSA-N 0.000 description 2
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 2
- GCZWJRLXIPVNLU-UHFFFAOYSA-N 2,2-dimethoxy-3-methylundecane Chemical compound CC(C(OC)(OC)C)CCCCCCCC GCZWJRLXIPVNLU-UHFFFAOYSA-N 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- FFWSICBKRCICMR-UHFFFAOYSA-N 5-methyl-2-hexanone Chemical compound CC(C)CCC(C)=O FFWSICBKRCICMR-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 2
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- JEMYJRYNXYHGFO-UHFFFAOYSA-N CC(C(OC(C)(C)C)(OC(C)(C)C)OC(C)(C)C)CCCCCCCC Chemical compound CC(C(OC(C)(C)C)(OC(C)(C)C)OC(C)(C)C)CCCCCCCC JEMYJRYNXYHGFO-UHFFFAOYSA-N 0.000 description 2
- LNEJJQMNHUGXDW-UHFFFAOYSA-N CC(C(OCC)(OCC)C)CCCCCCCC Chemical compound CC(C(OCC)(OCC)C)CCCCCCCC LNEJJQMNHUGXDW-UHFFFAOYSA-N 0.000 description 2
- PZKBIVOXIFYDRI-UHFFFAOYSA-N CC(C(OCC)(OCC)OCC)CCCCCCCC Chemical compound CC(C(OCC)(OCC)OCC)CCCCCCCC PZKBIVOXIFYDRI-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical class CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 2
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000003301 hydrolyzing effect Effects 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 150000007522 mineralic acids Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 125000000542 sulfonic acid group Chemical group 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 1
- WJMXTYZCTXTFJM-UHFFFAOYSA-N 1,1,1,2-tetraethoxydecane Chemical compound C(C)OC(C(OCC)(OCC)OCC)CCCCCCCC WJMXTYZCTXTFJM-UHFFFAOYSA-N 0.000 description 1
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- GDXHBFHOEYVPED-UHFFFAOYSA-N 1-(2-butoxyethoxy)butane Chemical compound CCCCOCCOCCCC GDXHBFHOEYVPED-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- CGTNCTXIQDWSOL-UHFFFAOYSA-N 1-butoxydecane Chemical compound CCCCCCCCCCOCCCC CGTNCTXIQDWSOL-UHFFFAOYSA-N 0.000 description 1
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
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- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
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- 125000004493 2-methylbut-1-yl group Chemical group CC(C*)CC 0.000 description 1
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- KXEOJQGXZGUSRW-UHFFFAOYSA-N CC(C(OCCC)(OCCC)OCCC)CCCCCCCC Chemical compound CC(C(OCCC)(OCCC)OCCC)CCCCCCCC KXEOJQGXZGUSRW-UHFFFAOYSA-N 0.000 description 1
- FFOAVVUULCTOQJ-UHFFFAOYSA-N COC(C(OCC)(OCC)OC)CCCCCCCC Chemical compound COC(C(OCC)(OCC)OC)CCCCCCCC FFOAVVUULCTOQJ-UHFFFAOYSA-N 0.000 description 1
- FKYNWNIUAYDREP-UHFFFAOYSA-N COC(C(OCC)(OCC)OCC)CCCCCCCC Chemical compound COC(C(OCC)(OCC)OCC)CCCCCCCC FKYNWNIUAYDREP-UHFFFAOYSA-N 0.000 description 1
- CZSYDRJCHANXGS-UHFFFAOYSA-N COC(CCCCCCCCCOCC)(OC)OC Chemical compound COC(CCCCCCCCCOCC)(OC)OC CZSYDRJCHANXGS-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
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- 125000003277 amino group Chemical group 0.000 description 1
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- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
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- 230000001681 protective effect Effects 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 125000003548 sec-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-L sulfite Chemical class [O-]S([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-L 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
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Description
本發明係關於透明膜用之組成物、透明膜之形成方法及透明膜。 The present invention relates to a composition for a transparent film, a method for forming a transparent film, and a transparent film.
過去,發光二極體(LED)等光半導體元件之製造中,光半導體元件等之封裝所使用之透明封裝劑組成物為已知(參照專利文獻1)。專利文獻1中揭示之組成物含有由兩末端具有矽烷醇基之聚矽氧烷與四烷氧基矽烷部分縮合物經脫醇反應獲得之特定烷氧基矽烷改質之聚矽氧烷與硬化觸媒。 In the past, in the manufacture of an optical semiconductor element such as a light-emitting diode (LED), a transparent encapsulant composition used for encapsulation of an optical semiconductor element or the like is known (refer to Patent Document 1). The composition disclosed in Patent Document 1 contains a polyoxyalkylene modified by a specific alkoxydecane obtained by a dealcoholization reaction of a partial condensate of a polyoxyalkylene having a decyl alcohol group and a tetraalkoxy decane at both ends thereof, and hardening. catalyst.
[專利文獻1]國際公開第2010/090280號說明書 [Patent Document 1] International Publication No. 2010/090280
一般,光半導體元件等光學裝置或太陽能電池係以上述專利文獻1之組成物等形成之透明膜保護。該透明膜由於可較好地使用作為保護膜,故要求高的耐久性。且,當然也要求高的透明性。 In general, an optical device such as an optical semiconductor element or a solar cell is protected by a transparent film formed of the composition of the above Patent Document 1. Since the transparent film can be preferably used as a protective film, high durability is required. And, of course, high transparency is also required.
提高透明膜之耐久性之方法考慮有在高溫燒成透明膜用之組成物而形成透明膜。由於藉由在高溫燒成組成物, 可燃燒去除成為透明膜劣化原因之組成物中之雜質,故可提高透明膜之耐久性。然而,在高溫燒成透明膜用之組成物時,會有透明膜上容易產生龜裂之問題。尤其,透明膜之厚度愈厚則愈容易發生龜裂。因此,透明膜用之組成物被要求提高耐龜裂性。 A method of improving the durability of a transparent film is to form a transparent film by firing a composition for a transparent film at a high temperature. Since the composition is fired at a high temperature, The impurities in the composition which is a cause of deterioration of the transparent film can be burned and removed, so that the durability of the transparent film can be improved. However, when the composition for a transparent film is fired at a high temperature, there is a problem that cracks easily occur on the transparent film. In particular, the thicker the thickness of the transparent film, the more likely it is to crack. Therefore, the composition for a transparent film is required to improve crack resistance.
該種狀況下,本申請案之發明人等重複積極研究之結果,發現可藉由透明膜用組成物中所含烷氧基矽烷之縮合產物中之與矽原子直接鍵結之有機基之種類與含量,而獲得較佳之耐龜裂性與透明性。 In this case, the inventors of the present application repeated the results of active research and found that the type of the organic group directly bonded to the ruthenium atom in the condensation product of the alkoxydecane contained in the composition for the transparent film was found. With the content, better crack resistance and transparency are obtained.
本發明係基於發明人等之認知而完成者,其目的係提供一種可對在高溫燒成所形成之透明膜賦予良好的耐龜裂性與透明性之之技術。 The present invention has been completed based on the knowledge of the inventors and the like, and an object thereof is to provide a technique capable of imparting good crack resistance and transparency to a transparent film formed by firing at a high temperature.
為解決上述課題,本發明之樣態為一種透明膜用之組成物,該透明膜用組成物為藉500℃以上之高溫燒成形成之透明膜用之組成物,其特徵為含有以下述通式(1)表示之第一烷氧基矽烷及以下述通式(2)表示之第二烷氧基矽烷作為起始原料之縮合產物(A),及有機溶劑(B),且直接鍵結於縮合產物(A)中之矽原子之甲基相對於前述縮合產物(A)之含量為15~25%,(CH3)nSi(OR1)4-n (1)[通式(1)中,R1為碳數1~5之烷基,n為1或2之整數,複數個(OR1)可相同亦可不同], Si(OR2)4 (2)[通式(2)中,R2為碳數1~5之烷基,複數個(OR2)可相同亦可不同]。 In order to solve the above problems, the present invention is a composition for a transparent film, and the composition for a transparent film is a composition for a transparent film formed by firing at a high temperature of 500 ° C or higher, and is characterized by containing the following The condensation product (A) of the first alkoxydecane represented by the formula (1) and the second alkoxydecane represented by the following formula (2) as a starting material, and the organic solvent (B), and direct bonding The content of the methyl group of the ruthenium atom in the condensation product (A) is 15 to 25% based on the condensation product (A), (CH 3 ) n Si(OR 1 ) 4-n (1) [Formula (1) In the formula, R 1 is an alkyl group having 1 to 5 carbon atoms, n is an integer of 1 or 2, and plural (OR 1 ) may be the same or different], Si(OR 2 ) 4 (2) [Formula (2) In the formula, R 2 is an alkyl group having 1 to 5 carbon atoms, and a plurality of (OR 2 ) may be the same or different.
依據該樣態,可對藉高溫燒成形成之透明膜賦予良好的耐龜裂性與透明性。 According to this aspect, it is possible to impart good crack resistance and transparency to the transparent film formed by firing at a high temperature.
本發明之另一樣態為一種透明膜之形成方法,其特徵為包含於基材上塗佈上述樣態之組成物之步驟,及在500℃以上燒成組成物,形成透明膜之步驟。 Another aspect of the present invention provides a method for forming a transparent film, comprising the steps of applying a composition of the above-described state on a substrate, and firing the composition at 500 ° C or higher to form a transparent film.
本發明之另一樣態為一種透明膜,其特徵為以上述之透明膜形成方法而形成者。 Another aspect of the present invention is a transparent film characterized by being formed by the above-described method of forming a transparent film.
依據本發明可提供一種可對藉高溫燒成形成之透明膜賦予良好之耐龜裂性與透明性之技術。 According to the present invention, it is possible to provide a technique capable of imparting good crack resistance and transparency to a transparent film formed by firing at a high temperature.
以下以較佳實施形態說明本發明。實施形態為例示並非限制本發明者,實施形態中所敘述之所有特徵或其組合未必為發明之本質者。 Hereinafter, the present invention will be described in terms of preferred embodiments. The embodiments are not intended to limit the invention, and all of the features described in the embodiments or combinations thereof are not necessarily essential to the invention.
本實施形態之組成物為藉500℃以上之高溫燒成形成透明膜用之組成物(以下適當稱該組成物為透明膜用組成物)。本實施形態之透明膜用組成物含有縮合產物(A)與有機溶劑(B)。且,透明膜用組成物含有作為任意成分之界面活性劑(C)。以下針對本實施形態之透明膜用 組成物之各成分加以詳細說明。 The composition of the present embodiment is a composition for forming a transparent film by firing at a high temperature of 500 ° C or higher (hereinafter, the composition is appropriately referred to as a composition for a transparent film). The composition for a transparent film of the present embodiment contains a condensation product (A) and an organic solvent (B). Further, the composition for a transparent film contains a surfactant (C) as an optional component. The following is for the transparent film of this embodiment. The components of the composition are described in detail.
縮合產物(A)為以下述通式(1)表示之第一烷氧基矽烷及以下述通式(2)表示之第二烷氧基矽烷作為起始原料之縮合產物。 The condensation product (A) is a condensation product of a first alkoxydecane represented by the following formula (1) and a second alkoxydecane represented by the following formula (2) as a starting material.
(CH3)nSi(OR1)4-n (1)[通式(1)中,R1為碳數1~5之烷基,n為1或2之整數,複數個(OR1)可相同亦可不同], Si(OR2)4 (2)[通式(2)中,R2為碳數1~5之烷基,複數個(OR2)可相同亦可不同]。 (CH 3 ) n Si(OR 1 ) 4-n (1) [In the formula (1), R 1 is an alkyl group having 1 to 5 carbon atoms, n is an integer of 1 or 2, and plural (OR 1 ) Si(OR 2 ) 4 (2) [In the formula (2), R 2 is an alkyl group having 1 to 5 carbon atoms, and plural (OR 2 ) may be the same or different).
以下針對第一烷氧基矽烷及第二烷氧基矽烷加以詳細說明。 The first alkoxydecane and the second alkoxydecane are described in detail below.
第一烷氧基矽烷中,上述通式(1)中之n為1時之烷氧基矽烷(i)係以下述通式(3)表示。 In the first alkoxy decane, the alkoxy decane (i) in the case where n in the above formula (1) is 1, is represented by the following formula (3).
(CH3)Si(OR21)a(OR22)b(OR23)c (3)[通式(3)中,R21、R22及R23各獨立為與上述通式(1)之R1相同之碳數1~5之烷基,a、b及c為滿足0≦a≦3,0≦b≦3,0≦c≦3,且a+b+c=3之條件之整數]。 (CH 3 )Si(OR 21 ) a (OR 22 ) b (OR 23 ) c (3) [In the formula (3), R 21 , R 22 and R 23 are each independently of the above formula (1) R 1 is the same alkyl group having 1 to 5 carbon atoms, and a, b and c are integers satisfying the conditions of 0≦a≦3, 0≦b≦3, 0≦c≦3, and a+b+c=3 ].
上述通式(1)及(3)中之碳數1~5之烷基列舉為例如甲基、乙基、丙基、丁基、戊基等直鏈狀烷基;1-甲基 乙基、1-甲基丙基、2-甲基丙基、1-甲基丁基、2-甲基丁基、3-甲基丁基等分支鏈狀烷基;環戊基等環狀烷基。較好為碳數1~3之烷基,更好為甲基及乙基。 The alkyl group having 1 to 5 carbon atoms in the above formulas (1) and (3) is exemplified by a linear alkyl group such as a methyl group, an ethyl group, a propyl group, a butyl group or a pentyl group; a branched chain alkyl group such as an ethyl group, a 1-methylpropyl group, a 2-methylpropyl group, a 1-methylbutyl group, a 2-methylbutyl group or a 3-methylbutyl group; a cyclic group such as a cyclopentyl group; alkyl. It is preferably an alkyl group having 1 to 3 carbon atoms, more preferably a methyl group and an ethyl group.
烷氧基矽烷(i)之具體例列舉為例如甲基三甲氧基矽烷、甲基三乙氧基矽烷、甲基三正丙氧基矽烷、甲基三異丙氧基矽烷、甲基三正丁氧基矽烷、甲基三第二丁氧基矽烷、甲基三第三丁氧基矽烷、甲基單甲氧基二乙氧基矽烷、甲基二甲氧基單乙氧基矽烷等,其中,就反應性之觀點而言以甲基三甲氧基矽烷、甲基三乙氧基矽烷較佳。 Specific examples of the alkoxydecane (i) are, for example, methyltrimethoxydecane, methyltriethoxydecane, methyltri-n-propoxydecane, methyltriisopropoxydecane, and methyltri-n-methyl Butoxy decane, methyl tri-tert-butoxy decane, methyl tri-tert-butoxy decane, methyl monomethoxy diethoxy decane, methyl dimethoxy monoethoxy decane, etc. Among them, methyltrimethoxydecane and methyltriethoxydecane are preferred from the viewpoint of reactivity.
上述通式(1)中之n為2時之烷氧基矽烷(ii)係以下述通式(4)表示。 The alkoxydecane (ii) in the case where n in the above formula (1) is 2 is represented by the following formula (4).
(CH3)(CH3)Si(OR31)d(OR32)e (4)[通式(4)中,R31及R32各獨立表示與上述通式(1)之R1相同之碳數1~5之烷基,d及e為0≦d≦2,0≦e≦2,且滿足d+e=2條件之整數]。 (CH 3 )(CH 3 )Si(OR 31 ) d (OR 32 ) e (4) [In the formula (4), R 31 and R 32 each independently represent the same as R 1 of the above formula (1). An alkyl group having 1 to 5 carbon atoms, d and e are 0≦d≦2, 0≦e≦2, and an integer satisfying the condition of d+e=2].
烷氧基矽烷(ii)之具體例列舉為例如二甲基二甲氧基矽烷、二甲基二乙氧基矽烷、二甲基二丙氧基矽烷、二甲基二異丙氧基矽烷、二甲基二正丁氧基矽烷、二甲基二第二丁氧基矽烷、二甲基二第三丁氧基矽烷、二甲基單甲氧基單乙氧基矽烷等,其中就反應性方面而言以二甲基二甲氧基矽烷、二甲基二乙氧基矽烷較佳。 Specific examples of the alkoxydecane (ii) are, for example, dimethyldimethoxydecane, dimethyldiethoxydecane, dimethyldipropoxydecane, dimethyldiisopropoxydecane, Dimethyldi-n-butoxy decane, dimethyldi-butoxy decane, dimethyldi-butoxy decane, dimethyl-monomethoxy-monoethoxy decane, etc., among which reactivity In terms of dimethyl dimethoxy decane and dimethyl diethoxy decane, it is preferred.
第一烷氧基矽烷較好為通式(1)中n為2之烷氧基矽烷,亦即,以下述通式(5)表示之烷氧基矽烷,換言之包含以上述通式(4)表示之烷氧基矽烷(ii)。 The first alkoxydecane is preferably an alkoxydecane wherein n is 2 in the formula (1), that is, an alkoxydecane represented by the following formula (5), in other words, the above formula (4) Alkoxydecane (ii) represented.
(CH3)2Si(OR1)2 (5)[通式(5)中,R1為碳數1~5之烷基,複數個(OR1)可相同亦可不同]。 (CH 3 ) 2 Si(OR 1 ) 2 (5) [In the formula (5), R 1 is an alkyl group having 1 to 5 carbon atoms, and plural (OR 1 ) may be the same or different).
第一烷氧基矽烷可藉由含有以上述通式(4)或通式(5)表示之具有與矽原子直接鍵結之兩個甲基之烷氧基矽烷,可容易地將直接鍵結於矽原子之甲基相對於縮合產物(A)之含量調整至後述範圍。 The first alkoxy decane can be easily bonded directly by containing an alkoxy decane having two methyl groups directly bonded to a ruthenium atom represented by the above formula (4) or (5). The content of the methyl group of the ruthenium atom relative to the condensation product (A) is adjusted to the range described later.
以上述通式(2)表示之第二烷氧基矽烷為例如以下述通式(6)表示。 The second alkoxysilane represented by the above formula (2) is, for example, represented by the following formula (6).
Si(OR41)f(OR42)g(OR43)h(OR44)i (6)[通式(6)中,R41、R42、R43及R44各獨立表示與上述通式(2)之R2相同之碳數1~5之烷基。f、g、h及i為0≦f≦4、0≦g≦4、0≦h≦4、0≦i≦4,且滿足f+g+h+i=4之條件之整數]。 Si(OR 41 ) f (OR 42 ) g (OR 43 ) h (OR 44 ) i (6) [In the formula (6), R 41 , R 42 , R 43 and R 44 are each independently represented by the above formula (2) The alkyl group having the same carbon number of 1 to 5 as R 2 . f, g, h, and i are 0≦f≦4, 0≦g≦4, 0≦h≦4, 0≦i≦4, and an integer satisfying the condition of f+g+h+i=4].
上述通式(2)或(6)中之碳數1~5之烷基係與上述通式(1)或(3)中之碳數1~5之烷基相同。 The alkyl group having 1 to 5 carbon atoms in the above formula (2) or (6) is the same as the alkyl group having 1 to 5 carbon atoms in the above formula (1) or (3).
以上述通式(6)表示之烷氧基矽烷之具體例列舉為例如四甲氧基矽烷、四乙氧基矽烷、四正丙氧基矽烷、四異丙氧基矽烷、四正丁氧基矽烷、四第二丁氧基矽烷、四第三丁氧基矽烷、三甲氧基單乙氧基矽烷、二甲氧基二乙氧基矽烷、單甲氧基三乙氧基矽烷等,其中就反應性之觀點而言以四甲氧基矽烷、四乙氧基矽烷較佳。 Specific examples of the alkoxydecane represented by the above formula (6) are, for example, tetramethoxydecane, tetraethoxydecane, tetra-n-propoxydecane, tetraisopropoxydecane, tetra-n-butoxy Decane, tetra-second butoxy decane, tetra-butoxy decane, trimethoxy monoethoxy decane, dimethoxydiethoxy decane, monomethoxy triethoxy decane, etc. From the viewpoint of reactivity, tetramethoxynonane or tetraethoxysilane is preferred.
縮合產物(A)可藉由例如在酸觸媒、水、溶劑之存在下,使第一烷氧基矽烷與第二烷氧基矽烷水解之方法調製。 The condensation product (A) can be prepared by hydrolyzing the first alkoxydecane and the second alkoxydecane in the presence of, for example, an acid catalyst, water, or a solvent.
酸觸媒可使用有機酸、無機酸之任一種。無機酸可使用硫酸、磷酸、硝酸、鹽酸等,其中以硝酸較佳。有機酸可使用甲酸、草酸、富馬酸、馬來酸、冰醋酸、乙酸酐、丙酸、正丁酸等羧酸,及具有含硫酸殘基之有機酸。具有含硫酸殘基之有機酸列舉為有機磺酸等。該等之酯化物列舉為有機硫酸酯、有機亞硫酸酯等。該等中,尤其以有機磺酸,例如以下述式(7)表示之化合物較佳。 As the acid catalyst, any of an organic acid and an inorganic acid can be used. As the inorganic acid, sulfuric acid, phosphoric acid, nitric acid, hydrochloric acid or the like can be used, and among them, nitric acid is preferred. As the organic acid, a carboxylic acid such as formic acid, oxalic acid, fumaric acid, maleic acid, glacial acetic acid, acetic anhydride, propionic acid or n-butyric acid, or an organic acid having a sulfuric acid residue can be used. The organic acid having a sulfuric acid residue is exemplified by an organic sulfonic acid or the like. These ester compounds are exemplified by organic sulfates, organic sulfites, and the like. Among these, in particular, an organic sulfonic acid, for example, a compound represented by the following formula (7) is preferred.
R13-X (7)[通式(7)中,R13為可具有取代基之烴基,X為磺酸基]。 R 13 -X (7) [In the formula (7), R 13 is a hydrocarbon group which may have a substituent, and X is a sulfonic acid group].
上述通式(7)中,作為R13之烴基較好為碳數1~20之烴基。該烴基可為飽和者亦可為不飽和者,且可為直鏈狀、分支狀、環狀之任一種。R13之烴基為環狀時,以例如苯基、萘基、蒽基等芳香族烴基較佳,其中以苯基較佳。該芳香族烴基中之芳香環可鍵結一個或複數個碳數1~20之烴基作為取代基。該芳香環上之取代基之烴基可為飽和者亦可為不飽和者,且可為直鏈狀、分支狀、環狀之任一種。且,作為R13之烴基可具有一個或複數個取代基,至於該取代基列舉為例如氟原子等鹵素原子、磺酸基、羧基、羥基、胺基、氰基等。 In the above formula (7), the hydrocarbon group as R 13 is preferably a hydrocarbon group having 1 to 20 carbon atoms. The hydrocarbon group may be either saturated or unsaturated, and may be any of a linear chain, a branched chain, and a cyclic chain. When the hydrocarbon group of R 13 is cyclic, an aromatic hydrocarbon group such as a phenyl group, a naphthyl group or a fluorenyl group is preferred, and a phenyl group is preferred. The aromatic ring in the aromatic hydrocarbon group may be bonded to one or a plurality of hydrocarbon groups having 1 to 20 carbon atoms as a substituent. The hydrocarbon group of the substituent on the aromatic ring may be either saturated or unsaturated, and may be any of a linear chain, a branched chain, and a cyclic chain. Further, the hydrocarbon group as R 13 may have one or a plurality of substituents, and examples of the substituent include a halogen atom such as a fluorine atom, a sulfonic acid group, a carboxyl group, a hydroxyl group, an amine group, a cyano group and the like.
上述酸觸媒係作為在水存在下使烷氧基矽烷水解時之 觸媒之作用,但使用之酸觸媒量較好為以使水解反應之反應系統中之濃度成為1~1000ppm,尤其成為5~800ppm之範圍之方式調製。水之添加量由於可藉此改變矽氧烷聚合物之水解率,故可依據所欲得到之水解率決定。 The above acid catalyst is used as a hydrolysis of alkoxydecane in the presence of water. The amount of the acid catalyst to be used is preferably such that the concentration in the reaction system for the hydrolysis reaction is from 1 to 1,000 ppm, particularly from 5 to 800 ppm. Since the amount of water added can change the hydrolysis rate of the siloxane polymer, it can be determined according to the desired hydrolysis rate.
水解反應之反應系統中之溶劑列舉為例如如甲醇、乙醇、丙醇、異丙醇(IPA)、正丁醇之一元醇類,如3-甲氧基丙酸甲酯、3-乙氧基丙酸乙酯之烷氧基羧酸酯,乙二醇、二乙二醇、丙二醇、丙三醇、三羥甲基丙烷、己三醇等多元醇類,乙二醇單甲基醚、乙二醇單乙基醚、乙二醇單丙基醚、乙二醇單丁基醚、二乙二醇單甲基醚、二乙醇單乙基醚、二乙二醇單丙基醚、二乙二醇單丁基醚、丙二醇單甲基醚、丙二醇單乙基醚、丙二醇單丙基醚、丙二醇單丁基醚等多元醇之單醚類或該等之單乙酸酯類,如乙酸甲酯、乙酸乙酯、乙酸丁酯之酯類,如丙酮、甲基乙基酮、甲基異戊基酮等酮類,如乙二醇二甲基醚、乙二醇二乙基醚、乙二醇二丙基醚、乙二醇二丁基醚、丙二醇二甲基醚、丙二醇二乙基醚、二乙二醇二甲基醚、二乙二醇二乙基醚、二乙二醇甲基乙基醚之多元醇之羥基均經烷基醚化之多元醇醚類等。該等溶劑可單獨使用,亦可組合兩種以上使用。 The solvent in the reaction system of the hydrolysis reaction is exemplified by, for example, methanol, ethanol, propanol, isopropanol (IPA), one of n-butanol, such as methyl 3-methoxypropionate, 3-ethoxyl. Alkoxycarboxylate of ethyl propionate, polyhydric alcohols such as ethylene glycol, diethylene glycol, propylene glycol, glycerol, trimethylolpropane, hexanetriol, ethylene glycol monomethyl ether, B Glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethanol monoethyl ether, diethylene glycol monopropyl ether, diethyl a monoether of a polyhydric alcohol such as diol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether or propylene glycol monobutyl ether or a monoacetate such as methyl acetate Ethyl acetate, butyl acetate esters, such as acetone, methyl ethyl ketone, methyl isoamyl ketone and other ketones, such as ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene Alcohol dipropyl ether, ethylene glycol dibutyl ether, propylene glycol dimethyl ether, propylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl Ethyl ether Monoalcohols of hydroxy group etherified by both the polyol ethers and the like. These solvents may be used singly or in combination of two or more.
藉由於該反應系統使第一烷氧基矽烷及第二烷氧基矽烷進行水解反應,生成第一烷氧基矽烷之水解產物及第二烷氧基矽烷之水解產物,使該等水解產物脫水縮合而獲得脫水產物(A)。該水解反應通常進行1~100小時左右, 但縮短反應時間時較好在不超過80℃之溫度範圍內加熱。 By hydrolyzing the first alkoxydecane and the second alkoxydecane by the reaction system, a hydrolysis product of the first alkoxydecane and a hydrolysis product of the second alkoxydecane are formed to dehydrate the hydrolyzed product. Condensation to obtain a dehydrated product (A). The hydrolysis reaction is usually carried out for about 1 to 100 hours. However, it is preferred to heat the reaction in a temperature range not exceeding 80 ° C when the reaction time is shortened.
反應結束後,獲得含有合成之縮合產物(A)與反應中使用之溶劑之反應溶液。例如縮合產物(A)可利用過去習知之方法與溶劑分離,且以後述之有機溶劑(B)取代溶劑,以溶液狀態獲得。又,合成之縮合產物(A)亦可利用過去習知方法與溶劑分離,並經乾燥以固體狀態獲得。 After completion of the reaction, a reaction solution containing the synthesized condensation product (A) and a solvent used in the reaction is obtained. For example, the condensation product (A) can be separated from the solvent by a conventional method, and the organic solvent (B) described later is substituted for the solvent to obtain a solution state. Further, the synthesized condensation product (A) can also be separated from the solvent by a conventional method and dried to obtain a solid state.
此處,本實施形態之透明膜用組成物中,直接鍵結於縮合產物(A)中之矽原子之甲基相對於縮合產物(A)之含量為15~25%。該含量(含有率)為直接鍵結於縮合產物(A)中之矽原子之甲基之分子量相對於縮合產物(A)之分子量之比例。 Here, in the composition for a transparent film of the present embodiment, the content of the methyl group of the halogen atom directly bonded to the condensation product (A) to the condensation product (A) is 15 to 25%. The content (content ratio) is a ratio of the molecular weight of the methyl group of the halogen atom directly bonded to the condensation product (A) to the molecular weight of the condensation product (A).
透明膜中,直接鍵結於構成透明膜之縮合產物中之矽原子之有機基具有緩和因縮合產物燒成時之收縮所致之應力之功能。因此,該有機基之鏈長愈長或體積愈大則愈呈現應力緩和功能。另一方面,透明膜之縮合產物中之碳-碳鍵結部分會因高溫而反應而使透明性下降。因此,本實施形態之透明膜用組成物中鍵結於矽原子之有機基設為甲基,且其含量設為15%以上25%以下。藉由將直接鍵結於矽原子之有機基設為甲基,使其含量成為25%以下,可減少縮合產物中之碳-碳鍵結部分,故可抑制透明膜之透明性降低。又,藉由使甲基之含量成為15%以上,可抑制於透明膜上之龜裂發生。 In the transparent film, the organic group directly bonded to the ruthenium atom in the condensation product constituting the transparent film has a function of alleviating the stress due to shrinkage at the time of firing of the condensation product. Therefore, the longer the chain length of the organic group or the larger the volume, the more the stress relieving function is exhibited. On the other hand, the carbon-carbon bond portion in the condensation product of the transparent film reacts due to high temperature to lower the transparency. Therefore, the organic group bonded to the ruthenium atom in the composition for a transparent film of the present embodiment is a methyl group, and the content thereof is 15% or more and 25% or less. By setting the organic group directly bonded to the ruthenium atom to a methyl group to a content of 25% or less, the carbon-carbon bond portion in the condensation product can be reduced, so that the transparency of the transparent film can be suppressed from being lowered. Further, by setting the content of the methyl group to 15% or more, it is possible to suppress the occurrence of cracks on the transparent film.
第一烷氧基矽烷及第二烷氧基矽烷之各比率係基於源 自各成分之單位之分子量,使直接鍵結於矽原子之甲基之分子量之合計相對於縮合產物(A)之分子量包含在上述範圍內而決定。此處,前述「單位」定義為由縮合產物(A)中之矽原子與直接鍵結於該矽原子之原子或分子所成之構造。例如,源自第二烷氧基矽烷之單位具有下述式(8)所示之構造。 The ratios of the first alkoxydecane and the second alkoxydecane are based on the source The molecular weight of the unit of each component is determined by including the total molecular weight of the methyl group directly bonded to the ruthenium atom within the above range with respect to the molecular weight of the condensation product (A). Here, the above "unit" is defined as a structure in which a ruthenium atom in the condensation product (A) and an atom or molecule directly bonded to the ruthenium atom are bonded. For example, the unit derived from the second alkoxydecane has a structure represented by the following formula (8).
縮合產物(A)之具體例列舉為以下述通式(9)~(11)表示之構造。 Specific examples of the condensation product (A) are as shown in the following formulas (9) to (11).
又,縮合產物(A)中之甲基之含量可由利用NMR之縮合產物(A)之構造解析而導出。又,上述通式(9)~(11)中之各單元之比率(j:k、l:m、(o+p):q及o:p)亦可由利用NMR之縮合產物(A)之構造解析而導出。具體而言係利用NMR測定各單元之構造及比率,基於各單元之分子量,可導出直接鍵結於矽原子之甲基相對於縮合產物(A)之分子量之含量Z(%)。例如,上述通式(9)中,j:k為2:1時,甲基之含量Z可由下述數式計算。 Further, the content of the methyl group in the condensation product (A) can be derived from the analysis of the structure of the condensation product (A) by NMR. Further, the ratio (j: k, l: m, (o + p): q, and o: p) of each of the above formulas (9) to (11) may also be obtained by using NMR condensation product (A). The structure is parsed and exported. Specifically, the structure and ratio of each unit are measured by NMR, and based on the molecular weight of each unit, the content Z (%) of the molecular weight of the methyl group directly bonded to the ruthenium atom relative to the condensation product (A) can be derived. For example, in the above formula (9), when j:k is 2:1, the content Z of the methyl group can be calculated by the following formula.
有機溶劑(B)並無特別限制,列舉為例如甲醇、乙醇、異丙醇、丁醇等醇類,丙酮、二乙基酮、甲基乙基酮 等酮類,乙酸甲酯、乙酸乙酯、乙酸丁酯等酯類,丙二醇、丙三醇、二丙二醇等多元醇類,二丙二醇二甲基醚、乙二醇二甲基醚、乙二醇二乙基醚、丙二醇二甲基醚、丙二醇二乙基醚等醚類,乙二醇單甲基醚、乙二醇單乙基醚、丙二醇單甲基醚、丙二醇單乙基醚、二丙二醇單甲基醚等單醚系二醇類,四氫呋喃、二噁烷等環狀醚類,丙二醇單甲基醚乙酸酯、丙二醇單乙基醚乙酸酯等醚系酯類。 The organic solvent (B) is not particularly limited, and examples thereof include alcohols such as methanol, ethanol, isopropanol, and butanol, acetone, diethyl ketone, and methyl ethyl ketone. Ketones, esters such as methyl acetate, ethyl acetate, butyl acetate, polyhydric alcohols such as propylene glycol, glycerol, dipropylene glycol, dipropylene glycol dimethyl ether, ethylene glycol dimethyl ether, ethylene glycol Ethers such as diethyl ether, propylene glycol dimethyl ether, propylene glycol diethyl ether, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, dipropylene glycol Monoether glycols such as monomethyl ether, cyclic ethers such as tetrahydrofuran and dioxane, and ether esters such as propylene glycol monomethyl ether acetate and propylene glycol monoethyl ether acetate.
本實施形態之透明膜用組成物含有作為任意成分之界面活性劑(C)。藉由含有界面活性劑可提高透明膜用組成物之塗佈性、平坦化性、展開性,且可減少塗佈後形成之透明膜用組成物層之塗佈不均之產生。該種界面活性劑可使用過去習知者,但較好為聚矽氧系界面活性劑。又,界面活性劑相對於透明膜用組成物整體係以10~10000質量ppm,較好以100~5000質量ppm,更好以500~1500質量ppm之範圍含有。界面活性劑可單獨使用,亦可組合使用。 The composition for a transparent film of the present embodiment contains a surfactant (C) as an optional component. By containing a surfactant, the coating property, flatness, and spreadability of the composition for a transparent film can be improved, and the uneven coating of the composition layer for transparent films formed after coating can be reduced. Such a surfactant can be used in the past, but is preferably a polyoxyn surfactant. Further, the surfactant is contained in an amount of 10 to 10,000 ppm by mass, preferably 100 to 5,000 ppm by mass, more preferably 500 to 1,500 ppm by mass based on the entire composition for a transparent film. The surfactants may be used singly or in combination.
添加劑亦用以調整透明膜用組成物之黏度等之特性依據需要而添加。 The additive is also added to adjust the characteristics of the viscosity of the composition for a transparent film as needed.
參照圖1(A)~圖1(D),針對形成透明膜之方法加以說明。圖1(A)~圖1(D)為用以說明實施形態之 透明膜之形成方法之步驟剖面模式圖。 A method of forming a transparent film will be described with reference to Figs. 1(A) to 1(D). 1(A) to 1(D) are for explaining the embodiment A schematic cross-sectional view of the steps of forming a transparent film.
本實施形態之透明膜形成方法包含將上述透明膜用組成物塗佈於基材上之步驟,在500℃以上燒成所塗佈之透明膜用組成物,形成透明膜之步驟。 The method for forming a transparent film according to the present embodiment includes the step of applying the composition for a transparent film to a substrate, and baking the composition for the transparent film to be applied at 500 ° C or higher to form a transparent film.
首先,如圖1(A)所示,準備搭載有光學裝置1之基材2。光學裝置1為例如LED(發光二極體)或有機EL等。基材2為例如背面側保護層等。又,基材2亦可為層合於光學裝置1之受光面或發光面側之表面側保護層等。且,基材2上亦可搭載太陽能電池等。 First, as shown in FIG. 1(A), the substrate 2 on which the optical device 1 is mounted is prepared. The optical device 1 is, for example, an LED (Light Emitting Diode), an organic EL, or the like. The base material 2 is, for example, a back side protective layer or the like. Moreover, the base material 2 may be a surface side protective layer laminated on the light-receiving surface or the light-emitting surface side of the optical device 1, or the like. Further, a solar cell or the like may be mounted on the substrate 2.
接著,如圖1(B)所示,於搭載光學裝置1之側的基材2表面上塗佈本實施形態之透明膜用組成物,形成透明膜用組成物層3。透明膜用組成物之塗佈方法並無特別限制,可採用習知方法。藉此,光學裝置1以透明膜用組成物層3被覆。 Then, as shown in FIG. 1(B), the composition for a transparent film of the present embodiment is applied onto the surface of the substrate 2 on the side on which the optical device 1 is mounted, and the composition layer 3 for a transparent film is formed. The coating method of the composition for a transparent film is not particularly limited, and a conventional method can be employed. Thereby, the optical device 1 is covered with the composition layer 3 for a transparent film.
接著,如圖1(C)所示,將層合有透明膜用組成物層3之基材2載置於電爐等加熱爐4內,在500℃以上之溫度燒成透明膜用組成物層3。結果,如圖1(D)所示,使透明膜用組成物熱硬化,於基材2表面形成透明膜5。光學裝置1以透明膜5封裝。藉由使透明膜用組成物之燒成溫度成為500℃以上,可燃燒除去成為透明膜5劣化原因之雜質,故可提高透明膜5之耐久性,而可較好地使用透明膜5作為保護膜。 Then, as shown in Fig. 1(C), the substrate 2 on which the composition layer 3 for a transparent film is laminated is placed in a heating furnace 4 such as an electric furnace, and the composition layer for a transparent film is fired at a temperature of 500 ° C or higher. 3. As a result, as shown in FIG. 1(D), the transparent film composition is thermally cured to form a transparent film 5 on the surface of the substrate 2. The optical device 1 is encapsulated in a transparent film 5. When the baking temperature of the composition for a transparent film is 500° C. or higher, impurities which cause deterioration of the transparent film 5 can be burned and removed, so that the durability of the transparent film 5 can be improved, and the transparent film 5 can be preferably used as a protection. membrane.
由以上之步驟,可形成本實施形態之透明膜。以具備上述組成之透明膜用組成物形成之透明膜於厚度2.0μm時 於400~800nm波長之光透射率為95%以上。 The transparent film of this embodiment can be formed by the above steps. A transparent film formed of the composition for a transparent film having the above composition at a thickness of 2.0 μm The light transmittance at a wavelength of 400 to 800 nm is 95% or more.
如以上之說明,本實施形態之透明膜用組成物為在500℃以上之高溫燒成所形成之透明膜用之組成物,含有以上述通式(1)表示之第一烷氧基矽烷及以上述通式(2)表示之第二烷氧基矽烷作為起始原料之縮合產物(A)及有機溶劑(B)。而且,直接鍵結於縮合產物(A)中之矽原子之甲基相對於縮合產物(A)之含量為15~25%。據此,可對於高溫燒成所形成之透明膜賦予良好之耐龜裂性與透明性。 As described above, the composition for a transparent film of the present embodiment is a composition for a transparent film formed by firing at a high temperature of 500 ° C or higher, and contains the first alkoxydecane represented by the above formula (1) and The condensation product (A) and the organic solvent (B) of the second alkoxydecane represented by the above formula (2) as a starting material. Further, the methyl group of the halogen atom directly bonded to the condensation product (A) is 15 to 25% based on the condensation product (A). According to this, it is possible to impart good crack resistance and transparency to the transparent film formed by firing at a high temperature.
本發明並不限於上述實施形態,亦可基於本技藝者之知識加上各種設計變更等之變形,所加上該變形之實施形態亦包含於本發明範圍中。 The present invention is not limited to the above-described embodiments, and various modifications such as design changes may be added based on the knowledge of those skilled in the art, and embodiments including the modifications are also included in the scope of the present invention.
以下說明本發明之實施例,但該等實施例僅為用以較佳說明本發明之例示,並非限制本發明者。 The embodiments of the present invention are described below, but the examples are merely illustrative of the invention and are not intended to limit the invention.
實驗中使用之透明膜用組成物之各成分及含量示於表1。又,以下之實施例及比較例中係使用聚矽氧系界面活性劑(SF8421EG:Toray.Dow conning股份有限公司製造)作為界面活性劑。且,使用丙二醇單甲基醚(PM)作為有機溶劑,其含量以透明膜用組成物之總質量作為100wt%時,自100wt%減掉各成分之含量餘下之量為全部溶劑之含量。 The components and contents of the composition for a transparent film used in the experiment are shown in Table 1. Further, in the following examples and comparative examples, a polyfluorene-based surfactant (SF8421EG: manufactured by Toray. Dow Conning Co., Ltd.) was used as a surfactant. Further, when propylene glycol monomethyl ether (PM) was used as the organic solvent, and the content thereof was 100% by weight based on the total mass of the composition for a transparent film, the amount of each component was reduced from 100% by weight to the total amount of the solvent.
表1中,構造A1~A5及A’6~A’9為以下述化學式表示之縮合產物。各縮合產物中之直接鍵結於矽原子之有機基(與Si直接鍵結之有機基)之含量(%)係以NMR算出。 In Table 1, structures A1 to A5 and A'6 to A'9 are condensation products represented by the following chemical formulas. The content (%) of the organic group (organic group directly bonded to Si) directly bonded to the ruthenium atom in each condensation product was calculated by NMR.
構造A1:下述通式(12)中,X(表1中之「與Si直接鍵結之有機基」)為甲基,直接鍵結於矽原子之甲基之含量為18%。 Structure A1: In the following general formula (12), X ("organic group directly bonded to Si" in Table 1) is a methyl group, and the methyl group directly bonded to the ruthenium atom is 18%.
構造A2:下述通式(12)中,X為甲基,直接鍵結於矽原子之甲基之含量為20%。 Structure A2: In the following general formula (12), X is a methyl group, and the methyl group directly bonded to the ruthenium atom is 20%.
構造A3:下述通式(12)中,X為甲基,直接鍵結於矽原子之甲基之含量為23%。 Structure A3: In the following general formula (12), X is a methyl group, and the methyl group directly bonded to the ruthenium atom is 23%.
構造A4:下述通式(13)中,直接鍵結於矽原子之甲基之含量為21%。 Structure A4: In the following general formula (13), the methyl group directly bonded to the ruthenium atom is 21%.
構造A5:下述通式(14)中,直接鍵結於矽原子之 甲基之含量為20%。 Structure A5: In the following formula (14), it is directly bonded to a ruthenium atom. The methyl content is 20%.
構造A’6:下述通式(12)中,X為甲基,直接鍵結於矽原子之甲基之含量為10%。 Structure A'6: In the following formula (12), X is a methyl group, and the methyl group directly bonded to the ruthenium atom is 10%.
構造A’7:下述通式(12)中,X為甲基,直接鍵結於矽原子之甲基之含量為30%。 Structure A'7: In the following formula (12), X is a methyl group, and the methyl group directly bonded to the ruthenium atom is 30%.
構造A’8:下述通式(12)中,X為乙基,直接鍵結於矽原子之甲基之含量為20%。 Structure A'8: In the following formula (12), X is an ethyl group, and the methyl group directly bonded to the ruthenium atom is 20%.
構造A’9:下述通式(12)中,X為苯基,直接鍵結於矽原子之苯基之含量為20%。 Structure A'9: In the following formula (12), X is a phenyl group, and the content of the phenyl group directly bonded to the ruthenium atom is 20%.
又,上述通式(12)~(14)中之各單元之比率(r:s、(t+u):v、t:u及w:y)為滿足各實施例及比較例 中之與Si直接鍵結之有機基之含量之比率]。 Further, the ratios (r: s, (t+u): v, t: u, and w: y) of the respective units in the above formulas (12) to (14) satisfy the respective examples and comparative examples. The ratio of the content of the organic group directly bonded to Si].
使用塗佈器(SS8261NUU:東京應化工業股份有限公司製造),以使最終厚度成為2.0μm之方式將各實施例及比較例之透明膜用組成物塗佈於樣品基板上。接著,將樣品載置於加熱板上,在150℃進行預烘烤處理3分鐘。隨後,以立式烤爐(TS8000MB:東京應化工業股份有限公司製造),在N2中,以500℃燒成30分鐘進行熱硬化,獲得膜厚2.0μm之透明膜。 The composition for a transparent film of each of Examples and Comparative Examples was applied onto a sample substrate so that the final thickness became 2.0 μm using an applicator (SS8261NUU: manufactured by Tokyo Ohka Kogyo Co., Ltd.). Next, the sample was placed on a hot plate, and prebaked at 150 ° C for 3 minutes. Subsequently, it was thermally cured by firing in a vertical oven (TS8000MB: manufactured by Tokyo Ohka Kogyo Co., Ltd.) in N 2 at 500 ° C for 30 minutes to obtain a transparent film having a film thickness of 2.0 μm.
對於各實施例及比較例之透明膜測定光透射率。光透射率之測定係使用分光光度計(MCPD-3000:大塚電子股份有限公司製造)進行。於波長400~800nm之透射率為95%以上時評價為良好(○),於波長400~800nm之透射率未達95%時評價為不良(×)。結果示於表1。 The light transmittance of each of the transparent films of the respective examples and comparative examples was measured. The measurement of the light transmittance was carried out using a spectrophotometer (MCPD-3000: manufactured by Otsuka Electronics Co., Ltd.). When the transmittance at a wavelength of 400 to 800 nm was 95% or more, it was evaluated as good (○), and when the transmittance at a wavelength of 400 to 800 nm was less than 95%, it was evaluated as poor (×). The results are shown in Table 1.
對於各實施例及比較例之透明膜,以顯微鏡確認有無龜裂。未確認到龜裂時評價為良好(○),確認到龜裂時評價為不良(×)。結果示於表1。 With respect to the transparent films of the respective Examples and Comparative Examples, the presence or absence of cracks was confirmed by a microscope. When the crack was not confirmed, it was evaluated as good (○), and when the crack was confirmed, it was evaluated as poor (×). The results are shown in Table 1.
如表1所示,縮合產物中於矽原子上直接鍵結甲基,且該甲基相對於縮合產物之含量包含於15~25%之範圍之 實施例1~4獲得良好之透明性與耐龜裂性。另一方面,縮合產物中於矽原子上直接鍵結甲基,但該甲基之含量未達15%之比較例1之耐龜裂性不良。且,縮合產物中於矽原子上直接鍵結甲基,但該甲基之含量超過25%之比較例2,其透明性不良。又,縮合產物中於矽原子上直接鍵結乙基之比較例3,與縮合產物中於矽原子上直接鍵結苯基之比較例4各基之含量雖均包含在15~25%之範圍,但透明性不良。由該等結果確認縮合產物中於矽原子上直接鍵結甲基,且該甲基之含量在15~25%之範圍時,可兼具透明性與耐龜裂性。 As shown in Table 1, the methyl ester is directly bonded to the ruthenium atom in the condensation product, and the content of the methyl group relative to the condensation product is included in the range of 15 to 25%. Examples 1 to 4 obtained good transparency and crack resistance. On the other hand, in the condensation product, a methyl group was directly bonded to a ruthenium atom, but Comparative Example 1 in which the content of the methyl group was less than 15% was poor in crack resistance. Further, in the condensation product, the methyl group was directly bonded to the ruthenium atom, but Comparative Example 2 in which the content of the methyl group exceeded 25% was inferior in transparency. Further, in Comparative Example 3 in which the ethyl group was directly bonded to the ruthenium atom in the condensation product, and the content of each group in Comparative Example 4 in which the phenyl group was directly bonded to the ruthenium atom in the condensation product was contained in the range of 15 to 25%. , but the transparency is poor. From these results, it was confirmed that the methyl group was directly bonded to the ruthenium atom in the condensation product, and when the content of the methyl group was in the range of 15 to 25%, both transparency and crack resistance were obtained.
1‧‧‧光學裝置 1‧‧‧Optical device
2‧‧‧基材 2‧‧‧Substrate
3‧‧‧透明膜用組成物層 3‧‧‧Composition layer for transparent film
4‧‧‧加熱爐 4‧‧‧heating furnace
5‧‧‧透明膜 5‧‧‧Transparent film
圖1(A)~圖1(D)為用以說明實施形態之透明膜之形成方法之步驟剖面模式圖。 1(A) to 1(D) are schematic cross-sectional schematic views for explaining a method of forming a transparent film according to an embodiment.
1‧‧‧光學裝置 1‧‧‧Optical device
2‧‧‧基材 2‧‧‧Substrate
3‧‧‧透明膜用組成物層 3‧‧‧Composition layer for transparent film
4‧‧‧加熱爐 4‧‧‧heating furnace
5‧‧‧透明膜 5‧‧‧Transparent film
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