JPS649231A - Production of siloxane polymer for forming insulation film - Google Patents
Production of siloxane polymer for forming insulation filmInfo
- Publication number
- JPS649231A JPS649231A JP16480687A JP16480687A JPS649231A JP S649231 A JPS649231 A JP S649231A JP 16480687 A JP16480687 A JP 16480687A JP 16480687 A JP16480687 A JP 16480687A JP S649231 A JPS649231 A JP S649231A
- Authority
- JP
- Japan
- Prior art keywords
- polymer
- insulation film
- formula
- siloxane polymer
- adhesion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Silicon Polymers (AREA)
Abstract
PURPOSE:To produce a polymer which can give an insulation film improved in heat resistance, adhesion and cracking resistance, by hydrolyzing and polycondensing an alkoxysilane and making the polymer three-dimensional by distilling off a by-product alcohol below a specified temperature. CONSTITUTION:An alkoxysilane mixture comprising a tetraalkoxysilane of formula I, a trialkoxysilane of formula II and a dialkoxysilane of formula III (wherein R<1>-R<6> are each a 1-6C alkyl or a 6-10C alkyl) are polycondensed at preferably about 0-100 deg.C in the presence of water and a catalyst and, optionally, a solvent. A by-product alcohol and the solvent optionally added are distilled off at 60 deg.C or below at normal or diminished pressure to form a highly concentrated solution of a siloxane polymer, whereby a three-dimensional polymer can be formed within a short time. In this way, the weight loss upon baking of a film can be decreased so that the formation of a crack-free thick film and the level-off of a wafer can be made, and the formation of an insulation film improved in heat resistance, adhesion and cracking resistance is also possible.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16480687A JPS649231A (en) | 1987-06-30 | 1987-06-30 | Production of siloxane polymer for forming insulation film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16480687A JPS649231A (en) | 1987-06-30 | 1987-06-30 | Production of siloxane polymer for forming insulation film |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS649231A true JPS649231A (en) | 1989-01-12 |
Family
ID=15800273
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16480687A Pending JPS649231A (en) | 1987-06-30 | 1987-06-30 | Production of siloxane polymer for forming insulation film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS649231A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1992007042A1 (en) * | 1990-10-16 | 1992-04-30 | Nitto Denko Corporation | Structure of release part |
US5378788A (en) * | 1992-07-16 | 1995-01-03 | Shin-Etsu Chemical Co., Ltd. | Process for preparation of linear organo-polysiloxane having hydroxyl group at its molecular ends |
USRE37880E1 (en) | 1995-03-01 | 2002-10-15 | Seiko Epson Corporation | Projector |
US6589644B1 (en) | 1997-05-28 | 2003-07-08 | Nippon Steel Corporation | Low dielectric constant materials and their production and use |
KR20040018710A (en) * | 2002-08-26 | 2004-03-04 | 주식회사 엘지화학 | Method for preparing organic silicate polymer |
US6737118B2 (en) | 1997-05-28 | 2004-05-18 | Nippon Steel Corporation | Low dielectric constant materials and their production and use |
JP2011181563A (en) * | 2010-02-26 | 2011-09-15 | Fujifilm Corp | Trench embedding composition |
JP2013047293A (en) * | 2011-08-29 | 2013-03-07 | Tokyo Ohka Kogyo Co Ltd | Composition for transparent film, method for forming transparent film, and transparent film |
JP2013119626A (en) * | 2011-12-07 | 2013-06-17 | Wacker Chemie Ag | Production of high molecular weight silicone resin |
-
1987
- 1987-06-30 JP JP16480687A patent/JPS649231A/en active Pending
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1992007042A1 (en) * | 1990-10-16 | 1992-04-30 | Nitto Denko Corporation | Structure of release part |
US5378788A (en) * | 1992-07-16 | 1995-01-03 | Shin-Etsu Chemical Co., Ltd. | Process for preparation of linear organo-polysiloxane having hydroxyl group at its molecular ends |
USRE37880E1 (en) | 1995-03-01 | 2002-10-15 | Seiko Epson Corporation | Projector |
US6589644B1 (en) | 1997-05-28 | 2003-07-08 | Nippon Steel Corporation | Low dielectric constant materials and their production and use |
US6737118B2 (en) | 1997-05-28 | 2004-05-18 | Nippon Steel Corporation | Low dielectric constant materials and their production and use |
WO2004074355A1 (en) * | 1997-05-28 | 2004-09-02 | Noriko Yamada | Low-permittivity material, and production and use thereof |
KR20040018710A (en) * | 2002-08-26 | 2004-03-04 | 주식회사 엘지화학 | Method for preparing organic silicate polymer |
JP2011181563A (en) * | 2010-02-26 | 2011-09-15 | Fujifilm Corp | Trench embedding composition |
JP2013047293A (en) * | 2011-08-29 | 2013-03-07 | Tokyo Ohka Kogyo Co Ltd | Composition for transparent film, method for forming transparent film, and transparent film |
JP2013119626A (en) * | 2011-12-07 | 2013-06-17 | Wacker Chemie Ag | Production of high molecular weight silicone resin |
KR101469330B1 (en) * | 2011-12-07 | 2014-12-04 | 와커 헤미 아게 | Production of high-molecular-weight silicone resins |
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