TWI583499B - A disc with internal supply of fluid structure - Google Patents

A disc with internal supply of fluid structure Download PDF

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Publication number
TWI583499B
TWI583499B TW104134636A TW104134636A TWI583499B TW I583499 B TWI583499 B TW I583499B TW 104134636 A TW104134636 A TW 104134636A TW 104134636 A TW104134636 A TW 104134636A TW I583499 B TWI583499 B TW I583499B
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Taiwan
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channels
grinding disc
grinding
pedestal
disc
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TW104134636A
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Chinese (zh)
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TW201714709A (en
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rong-zhe Xie
Tai-Jia Chen
Shao-Zhong Hu
Jian-Zhong Deng
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China Grinding Wheel Corp
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Priority to TW104134636A priority Critical patent/TWI583499B/en
Priority to CN201610622789.3A priority patent/CN106607775B/en
Publication of TW201714709A publication Critical patent/TW201714709A/en
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Publication of TWI583499B publication Critical patent/TWI583499B/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/10Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with cooling provisions

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Description

具內部供給流體結構之磨盤 Grinding disc with internal fluid supply structure

本發明係關於一種具內部供給流體結構之磨盤。 The present invention relates to a grinding disc having an internal supply fluid structure.

研磨加工係為一種利用磨盤接觸摩擦工件表面,以移除工件材料而能使工件表面平整的加工技術,舉例而言,於半導體製程中,半導體基板以線鋸切割後,係藉由磨盤研磨基板表面,以去除切痕並建立基準面。而在磨盤接觸摩擦工件表面的過程中,係會產生切屑及高溫,因此,研磨加工過程中係對磨盤與工件表面的接觸位置提供切削液,以期切削液帶走切屑並達冷卻之效果。 The grinding process is a processing technique that uses a grinding disc to contact the surface of the workpiece to remove the workpiece material to make the surface of the workpiece flat. For example, in the semiconductor manufacturing process, after the semiconductor substrate is cut by the wire saw, the substrate is polished by the grinding disc. Surface to remove cuts and establish a datum. In the process of the grinding disc contacting the surface of the friction workpiece, the chip and the high temperature are generated. Therefore, during the grinding process, the cutting liquid is provided at the contact position between the grinding disc and the surface of the workpiece, so that the cutting fluid takes away the chips and achieves the cooling effect.

現有技術中係公開了一些磨盤結構,舉例來說:中華民國專利公告第M492522號新型專利案係揭露一種拋光研磨裝置,包含具有通孔之一基座及具有孔隙之一砂輪,該砂輪係連接於該基座,於執行拋光研磨作業時,基座之通孔係提供液體或氣體進入,並由砂輪之孔隙流通至工件表面。其中,該基座上的通孔係均勻地分布且每一通孔係連結提供液體或氣體之一管件,以對於砂輪與工件接觸的表面均勻地提供切削液,然而,由於工件之尺寸不一定與砂輪面積相同、或工件之表面品質不一定均一,而致使砂輪表面各部分因研磨產生之消耗量不相同,砂輪表面將產生變形而不平整,因而需要經常修整維護。 In the prior art, some grinding disc structures are disclosed. For example, the new patent application of the Republic of China Patent Publication No. M492522 discloses a polishing and polishing apparatus comprising a base having a through hole and a grinding wheel having a hole, the grinding wheel system is connected. At the pedestal, the through hole of the pedestal provides liquid or gas entry during the polishing operation and flows from the pores of the grinding wheel to the surface of the workpiece. Wherein, the through holes on the base are evenly distributed and each through hole is connected to provide a pipe of liquid or gas to uniformly supply the cutting fluid to the surface of the grinding wheel in contact with the workpiece, however, since the size of the workpiece is not necessarily The surface area of the grinding wheel is the same, or the surface quality of the workpiece is not necessarily uniform, and the consumption of each part of the surface of the grinding wheel is different due to grinding. The surface of the grinding wheel will be deformed and not flattened, so it needs frequent maintenance and repair.

另有中華民國專利公告第I391208號發明專利案,其係揭露一種可調動態平衡及排屑之研磨砂輪,其中研磨砂輪係套設於一旋轉軸承上,該旋轉軸承係具有一切削液出水口,用以供給切削液至該研磨砂輪,然而,由於此案中旋轉軸承係安裝於該研磨砂輪中央之軸孔,即該研磨砂輪係為位於該旋轉軸的周圍,而切削液係由該旋轉軸承底部之切削液出水口流出,因此當該研磨砂輪旋轉研磨工件時,切削液係容易被排開,致使切削液難以適切地提供至所有砂輪與工件接觸之表面,且更無法調整砂輪表面不同位置上切削液的量,因而導致散熱效果較不佳,且砂輪表面易因消耗量不同而不平整。 In addition, the invention patent case of the Republic of China Patent Publication No. I391208 discloses a grinding wheel with adjustable dynamic balance and chip removal, wherein the grinding wheel is sleeved on a rotary bearing, and the rotary bearing has a cutting fluid outlet. For supplying the cutting fluid to the grinding wheel, however, since the rotary bearing is installed in the shaft hole of the center of the grinding wheel in this case, that is, the grinding wheel is located around the rotating shaft, and the cutting fluid is rotated by the rotation The cutting fluid outlet at the bottom of the bearing flows out, so when the grinding wheel rotates and grinds the workpiece, the cutting fluid is easily discharged, making it difficult for the cutting fluid to be properly supplied to the surface where all the grinding wheels are in contact with the workpiece, and it is impossible to adjust the surface of the grinding wheel differently. The amount of cutting fluid in the position, resulting in poor heat dissipation, and the surface of the grinding wheel is easily flattened due to different consumption.

此外,日本專利特許出願公開第1996-118239號專利係揭露一種砂輪,其包含一基座及複數個研磨片段,該等研磨片段係排列於該基座表面,並該等研磨片段係間隔地配置而形成了排水溝槽,該基座中央係具有與該等排水溝槽連通之軸孔,切削液流通於該等排水溝槽中以帶走研磨時產生之熱能及切屑,然而,該案中並未提及切削液如何供應至該等排水溝槽之間,惟無論切削液係由軸孔中的旋轉軸提供或由設置於砂輪與工件附近的管線提供皆有其缺點,就切削液由軸孔中的旋轉軸提供之手段而言,由於軸孔係位於砂輪之中央,因此切削液難以適切地提供至所有砂輪與工件接觸之表面,並且無法調整砂輪表面不同位置上切削液的量,不僅導致散熱效果較不佳,且砂輪表面易因消耗量不同而不平整;而就切削液由設置於砂輪與工件附近的管線提供之手段而言,外加之管線太靠近砂輪與工件表面的接觸位置將可能阻礙砂輪之作動,並且,砂輪運轉時會產生氣流,而使切削液被排開,導致能進入砂輪與工件表面的接觸位置之切削液十分有限,因而造成研磨產生之熱能無法即時被帶走; 再者,於以研磨片段之間形成排水溝槽的方式,使得需騰出空間來形成排水溝槽,故導致可用於研磨的面積減少。 In addition, Japanese Patent Laid-Open Publication No. 1996-118239 discloses a grinding wheel comprising a base and a plurality of abrasive segments, the abrasive segments being arranged on the surface of the base, and the abrasive segments are spaced apart Forming a drainage groove, the center of the base has a shaft hole communicating with the drainage grooves, and the cutting fluid flows in the drainage grooves to take away heat energy and chips generated during grinding, however, in the case There is no mention of how the cutting fluid is supplied between the drainage channels, but whether the cutting fluid is provided by the rotating shaft in the shaft hole or provided by the pipeline provided near the grinding wheel and the workpiece, the cutting fluid is In the means provided by the rotating shaft in the shaft hole, since the shaft hole is located at the center of the grinding wheel, it is difficult for the cutting fluid to be properly supplied to the surface where all the grinding wheels are in contact with the workpiece, and the amount of cutting fluid at different positions on the surface of the grinding wheel cannot be adjusted. Not only does the heat dissipation effect be poor, but the surface of the grinding wheel is easily uneven due to different consumption; and the cutting fluid is provided by the pipeline provided near the grinding wheel and the workpiece. The additional pipeline is too close to the contact position of the grinding wheel with the surface of the workpiece, which may hinder the operation of the grinding wheel. When the grinding wheel is running, airflow is generated, and the cutting fluid is discharged, resulting in a cutting fluid that can enter the contact position between the grinding wheel and the surface of the workpiece. Limited, thus causing the heat generated by the grinding to be removed immediately; Further, in the manner of forming the drainage grooves between the abrasive segments, it is necessary to make room for forming the drainage grooves, resulting in a reduction in the area available for polishing.

據此,上述現有之磨盤結構的切削液供給方式係各自具有缺點,並其共通的缺點是,現有之磨盤結構於研磨過程中,磨盤之研磨面各部位消耗量無法被控制,因而需要經常地修整研磨面以確保其平整度,才能維持良好的加工品質。 Accordingly, the cutting fluid supply modes of the above-mentioned conventional disc structure each have disadvantages, and the common disadvantage is that the existing disc structure is in the grinding process, the consumption of each part of the grinding surface of the disc cannot be controlled, and thus it is necessary to frequently The polished surface is trimmed to ensure its flatness to maintain good processing quality.

本發明之目的在於揭露一種具內部供給流體結構之磨盤,流體係可通過多孔隙研磨層而直接供給至研磨面與工件之間,且可調整研磨面不同位置的流體出口量,藉此解決習知技術中,由於磨盤之研磨面各部位消耗量無法被控制,因而需要經常地修整研磨面以確保其平整度之問題。 The object of the present invention is to disclose a grinding disc having an internal fluid supply structure. The flow system can be directly supplied between the grinding surface and the workpiece through the porous polishing layer, and the fluid outlet amount at different positions of the polishing surface can be adjusted, thereby solving the problem. In the known technology, since the consumption of each part of the grinding surface of the grinding disc cannot be controlled, it is necessary to frequently trim the grinding surface to ensure the flatness.

為達上述目的及其他目的,本發明揭露一種具內部供給流體結構之磨盤,用於安裝在具有複數條供液管線之驅動軸上,包含一多孔隙研磨層及一基座,該多孔隙研磨層係包括相背之一結合面與一研磨面;該基座係結合於該結合面上,該基座包括貫穿之複數條通道,該等通道以同心圓狀或放射狀的形式排列,且該等通道中至少一部分延伸至該結合面之邊緣,每一通道係用於配置該等供液管線。 To achieve the above and other objects, the present invention discloses a grinding disc having an internal fluid supply structure for mounting on a drive shaft having a plurality of liquid supply lines, comprising a porous polishing layer and a susceptor. The layer includes a bonding surface and a polishing surface; the pedestal is coupled to the bonding surface, the pedestal includes a plurality of channels extending through the channels, and the channels are arranged in a concentric or radial manner, and At least a portion of the channels extend to the edge of the bonding surface, each channel being configured to configure the liquid supply lines.

上述之磨盤,其中當該等通道以同心圓狀的形式排列時,該基座係具有28~75%的海陸比,其中海陸比係為通道之總體積占該基座之總體積的百分比。 The above-mentioned grinding disc, wherein when the channels are arranged in a concentric form, the pedestal has a sea-land ratio of 28 to 75%, wherein the sea-land ratio is a percentage of the total volume of the channel to the total volume of the susceptor.

上述之磨盤,其中當該等通道以放射狀的形式排列時,該基座係具有4~40%的海陸比,其中海陸比係為通道之總體積與該基座之總體積的百分比。 The above-mentioned grinding disc, wherein when the channels are arranged in a radial form, the pedestal has a sea-land ratio of 4 to 40%, wherein the sea-land ratio is a percentage of the total volume of the channel to the total volume of the susceptor.

上述之磨盤,其中每一通道係呈弧形。 The above-mentioned grinding disc, wherein each channel is curved.

上述之磨盤,其中該等通道係排列成環繞於該基座中心的複數圈,位於外圈之通道數量係大於內圈之通道數量。 In the above disc, wherein the channels are arranged in a plurality of turns around the center of the base, and the number of channels in the outer ring is greater than the number of channels in the inner ring.

上述之磨盤,其中該基座係藉由不透水膠層黏合至該結合面上。 In the above grinding disc, the base is adhered to the bonding surface by a water-impermeable adhesive layer.

上述之磨盤,其中該等通道中每一者之寬度係為不同。 The above-mentioned grinding disc, wherein the width of each of the channels is different.

上述之磨盤,其中該多孔隙研磨層之材質係選自由樹脂、金屬、陶瓷及其組合所組成之群組。 In the above grinding disc, the material of the porous abrasive layer is selected from the group consisting of resin, metal, ceramic and combinations thereof.

上述之磨盤,其中該多孔隙研磨層之材質係為陶瓷。 In the above grinding disc, the material of the porous abrasive layer is ceramic.

上述之磨盤,其中該多孔隙研磨層之孔隙率係30~60%。 In the above grinding disc, the porosity of the porous abrasive layer is 30 to 60%.

上述之磨盤,其中該多孔隙研磨層之孔隙率係45~55%。 In the above grinding disc, the porosity of the porous abrasive layer is 45 to 55%.

因此,上述之磨盤,係可藉由控制各通道中流體之供應與否或流量多寡,而調整該多孔隙研磨層之研磨面不同位置的流體出口量,進而影響研磨面不同位置的消耗量,藉以有效地減緩研磨面之變形以減少修整次數。 Therefore, the above-mentioned grinding disc can adjust the fluid outlet amount at different positions of the grinding surface of the porous polishing layer by controlling the supply or the flow of the fluid in each channel or the flow rate, thereby affecting the consumption of different positions on the polishing surface. In order to effectively slow the deformation of the grinding surface to reduce the number of trimming.

1‧‧‧磨盤 1‧‧‧ grinding disc

2‧‧‧供液管線 2‧‧‧liquid supply pipeline

3‧‧‧工件 3‧‧‧Workpiece

10‧‧‧多孔隙研磨層 10‧‧‧Porous abrasive layer

11‧‧‧結合面 11‧‧‧ joint surface

12‧‧‧研磨面 12‧‧‧Grinding surface

20,20’,20”,20'''‧‧‧基座 20,20’,20”,20'''‧‧‧ pedestal

21,21’,21”,21'''‧‧‧通道 21, 21’, 21”, 21'''‧‧‧ channels

22‧‧‧不透水膠層 22‧‧‧impermeable layer

〔圖1〕係為本創作實施例之具內部供給流體結構之磨盤的分解示意圖。 FIG. 1 is an exploded perspective view of a grinding disc having an internal fluid supply structure according to the present embodiment.

〔圖2〕係為本發明實施例之具內部供給流體結構之磨盤的結合示意圖。 2 is a schematic view showing the combination of a grinding disc having an internal fluid supply structure according to an embodiment of the present invention.

〔圖3〕係為圖2中A-A端面之剖面示意圖。 Fig. 3 is a schematic cross-sectional view showing the end face A-A of Fig. 2.

〔圖4〕係為本發明實施例中磨盤使用時的狀態示意圖。 FIG. 4 is a schematic view showing a state in which the grinding disc is used in the embodiment of the present invention.

〔圖5〕係為本發明實施例中磨盤之基座的第一態樣示意圖。 FIG. 5 is a schematic view showing the first aspect of the base of the grinding disc in the embodiment of the present invention.

〔圖6〕係為本發明實施例中磨盤之基座的第二態樣示意圖。 FIG. 6 is a schematic view showing a second aspect of the base of the grinding disc in the embodiment of the present invention.

〔圖7〕係為本發明實施例中磨盤之基座的第三態樣示意圖。 FIG. 7 is a schematic view showing a third aspect of the base of the grinding disc in the embodiment of the present invention.

〔圖8〕係為本發明實施例中磨盤之基座的第四態樣示意圖。 FIG. 8 is a schematic view showing a fourth aspect of the base of the grinding disc in the embodiment of the present invention.

為充分瞭解本發明之目的、特徵及功效,茲藉由下述具體之實施例,並配合所附之圖式,對本發明做一詳細說明,說明如後:請參照圖1至3,本創作實施例之具內部供給流體結構之磨盤1包含一多孔隙研磨層10及一基座20,該多孔隙研磨層10係包括相背之一結合面11與一研磨面12(圖3);該基座20係結合於該結合面11上,該基座20包括貫穿之複數條通道21,該等通道21以同心圓狀的形式排列,且該等通道21中至少一部分延伸至該結合面11之邊緣。上述之「流體」係可為切削液、冷卻液體(如:冷卻水)、冷卻氣體(如:惰性氣體)、或其組合;其中,該流體較佳為切削液。 In order to fully understand the object, features and advantages of the present invention, the present invention will be described in detail by the following specific embodiments and the accompanying drawings, which are illustrated as follows: Referring to Figures 1 to 3, this creation The abrasive disc 1 having an internal supply fluid structure of the embodiment comprises a porous abrasive layer 10 and a susceptor 20, the porous abrasive layer 10 comprising a back bonding surface 11 and a polishing surface 12 (Fig. 3); The base 20 is coupled to the joint surface 11 , and the base 20 includes a plurality of passages 21 extending through the channels 21 , and the passages 21 are arranged in a concentric manner, and at least a portion of the passages 21 extend to the joint surface 11 . The edge. The above "fluid" may be a cutting fluid, a cooling liquid (such as cooling water), a cooling gas (such as an inert gas), or a combination thereof; wherein the fluid is preferably a cutting fluid.

本實施例中,該多孔隙研磨層10係為多孔隙結構,其材質係選自由樹脂、金屬、陶瓷及其組合所組成之群組,舉例來說,該多孔隙研磨層10之材質係可為樹脂、金屬或陶瓷之單一材料,或者,該多孔隙研磨層10之材質係可為樹脂與陶瓷之複合材料、樹脂與金屬之複合材料或金屬與陶瓷之複合材料,其中,該多孔隙研磨層10中係可具有磨料。並且,較佳地是,該多孔隙研磨層10之孔隙率係30~60%,若孔隙率低於30%,係會降低流體之出口流量;若 孔隙率高於60%,將使該多孔隙研磨層10強度降低而容易破裂,更佳的是,該多孔隙研磨層10之孔隙率係45~55%。 In this embodiment, the porous abrasive layer 10 is a porous structure, and the material thereof is selected from the group consisting of a resin, a metal, a ceramic, and a combination thereof. For example, the material of the porous abrasive layer 10 can be The material of the porous abrasive layer 10 may be a composite material of a resin and a ceramic, a composite of a resin and a metal, or a composite of a metal and a ceramic, wherein the porous grinding is performed. The layer 10 can have an abrasive. Moreover, it is preferable that the porosity of the porous polishing layer 10 is 30 to 60%, and if the porosity is less than 30%, the flow rate of the fluid is lowered; If the porosity is higher than 60%, the strength of the porous abrasive layer 10 is lowered to be easily broken. More preferably, the porosity of the porous abrasive layer 10 is 45 to 55%.

如圖4所示,本實施例中,該磨盤1係用於安裝在具有複數條供液管線2之驅動軸(圖未示)上,每一通道21係用於配置該等供液管線2,而使得該等供液管線2依該等通道21的形狀排列,並該等供液管線2之出口係與該多孔隙研磨層10之結合面11相隔一段問距,使得流體先流至各該通道21中並藉由磨盤1旋轉時的離心力作用而分布後,再滲透至該多孔隙研磨層10中。由於該等通道21係環形且以同心圓的方式延伸至該結合面11之邊緣,且每一圈之通道21係為封閉而彼此不相通,故每一圈之通道21中的流體係藉由磨盤1旋轉時的離心力作用而分布,因此可均勻地提供至該多孔隙研磨層10之研磨面12。 As shown in FIG. 4, in the embodiment, the grinding disc 1 is used for mounting on a driving shaft (not shown) having a plurality of liquid supply lines 2, and each channel 21 is used for arranging the liquid supply lines 2 The liquid supply lines 2 are arranged in the shape of the channels 21, and the outlets of the liquid supply lines 2 are separated from the bonding surface 11 of the porous polishing layer 10 by a distance, so that the fluid flows first to each The passage 21 is distributed by the centrifugal force when the grinding disc 1 rotates, and then penetrates into the porous polishing layer 10. Since the passages 21 are annular and extend concentrically to the edge of the joint surface 11, and the passages 21 of each turn are closed and not in communication with each other, the flow system in the passage 21 of each turn is used The centrifugal force of the grinding disc 1 is distributed and distributed, so that it can be uniformly supplied to the grinding surface 12 of the porous polishing layer 10.

該磨盤1係以該多孔隙研磨層10之研磨面12研磨工件3,而流體係由該多孔隙研磨層10中滲透出來而存在於該研磨面12與該工件3表面,進而可帶走研磨過程產生之熱能以及排除切屑。 The grinding disc 1 grinds the workpiece 3 with the grinding surface 12 of the porous polishing layer 10, and the flow system is permeated from the porous polishing layer 10 to exist on the surface of the polishing surface 12 and the workpiece 3, thereby taking away the grinding The heat generated by the process and the elimination of chips.

此外,每一供液管線2係可依需求開啟、關閉或調整供液流量,而可使該等通道21出口之流體流量不同,進而影響該多孔隙研磨層10之研磨面12上對應位置附近的流體流量,而形成研磨面上局部供水的效果,藉此,該多孔隙研磨層10之消耗量係可得到控制。舉例來說,於一研磨過程中,若發現研磨面12中間形成中凹狀,以致影響工件3之外型時,係可關閉外圈及內圈之通道21中之供液管線2對應之開關,使得該研磨面12於對應位置附近的部分對工件切入深度增加,因而增加消耗量;或者,當發現磨盤外側磨耗明顯大於內側時,可暫時增加研磨面外側對應之流體流量、或減少甚至關閉研磨面內側對應之流體供給,藉此調節特定區域之磨盤消耗。 In addition, each liquid supply line 2 can open, close or adjust the liquid supply flow rate according to requirements, and the fluid flow rate at the outlet of the passage 21 can be different, thereby affecting the vicinity of the corresponding position on the grinding surface 12 of the porous abrasive layer 10. The fluid flow rate creates an effect of localized water supply on the abrasive surface whereby the consumption of the porous abrasive layer 10 can be controlled. For example, in a grinding process, if it is found that the middle of the grinding surface 12 is concave, so as to affect the appearance of the workpiece 3, the switch corresponding to the liquid supply line 2 in the passage 21 of the outer ring and the inner ring can be closed. So that the portion of the grinding surface 12 near the corresponding position increases the depth of cut into the workpiece, thereby increasing the consumption; or, when the outer wear of the grinding disc is found to be significantly larger than the inner side, the fluid flow corresponding to the outer side of the grinding surface can be temporarily increased, or reduced or even closed. The corresponding fluid supply on the inside of the grinding surface, thereby adjusting the disc consumption in a particular area.

待磨盤研磨面12之內外側的消耗量一致或該研磨面12及工件外型回復平整後,再開啟外圈及內圈之通道21中之供液管線2對應之開關,使所有供液管線2出口的流量相同,以使該研磨面12整個表面能均勻地分布流體。 After the inner and outer consumption of the grinding surface 12 of the grinding disc is the same or the polishing surface 12 and the workpiece shape are flattened, the corresponding switch of the liquid supply line 2 in the outer ring and the inner ring passage 21 is opened, so that all the liquid supply lines are made. The flow rate at the outlet 2 is the same so that the entire surface of the abrasive surface 12 can uniformly distribute the fluid.

是以,本實施例之磨盤藉由以同心圓形式排列之通道21的配置,並搭配供液管線2之流體供應流量的調整與開關,而可具有研磨面上具局部供水之效果,藉此改善磨盤之研磨面12上特定位置如內側與外側磨耗不均等問題。據此,本實施例之磨盤1係可有效減緩研磨面12變形,而減少研磨面須修整的次數。 Therefore, the grinding disc of the present embodiment can have the effect of local water supply on the grinding surface by the arrangement of the channels 21 arranged in a concentric circular shape and the adjustment and switching of the fluid supply flow rate of the liquid supply line 2. The problem of uneven wear such as unevenness of the inner side and the outer side on the polished surface 12 of the grinding disc is improved. Accordingly, the grinding disc 1 of the present embodiment can effectively reduce the deformation of the abrasive surface 12 and reduce the number of times the polishing surface has to be trimmed.

於本實施例中,該基座20係藉由不透水膠層22黏合至該結合面11上,該不透水膠層22係塗佈於該基座20面向該結合面11之表面上,且為不透水材質,以避免流體穿透流通於該等通道21之間。 In this embodiment, the susceptor 20 is adhered to the bonding surface 11 by the water-impermeable adhesive layer 22, and the water-impermeable adhesive layer 22 is coated on the surface of the susceptor 20 facing the bonding surface 11, and It is impervious to avoid fluid penetration between the channels 21.

上述本實施例中,係以具有同心圓狀排列之通道21作為示例說明,如圖5中所示之基座20的俯視圖,該等通道21係為圓環形並以同心圓狀排列,且該等通道中每一者之寬度係為相同,即該等通道之寬度係為相同;其中,當採用通道21以同心圓狀排列且該基座20之海陸比為28~75%的磨盤1,並於磨盤1與工件3均設定較低轉速的加工參數之下,以同心圓狀排列之通道21且高海陸比之磨盤1係可具有出水量大的效果,因此磨盤1之研磨層或其中的磨料切入工件3的深度較為淺,而可達成高表面品質(即低表面粗糙度)與高表面平坦度之加工目的。上述之海陸比係為通道之總體積占該基座之總體積(即通道之總體積與基座上非通道部分之總體積的總合)的百分比。 In the above embodiment, the channel 21 having a concentric arrangement is exemplified as a top view of the susceptor 20 as shown in FIG. 5, and the channels 21 are annular and arranged in a concentric manner, and The width of each of the channels is the same, that is, the widths of the channels are the same; wherein, when the channel 21 is arranged in a concentric manner and the susceptor 20 has a sea-to-land ratio of 28 to 75%, the disk 1 And under the processing parameters of the grinding disc 1 and the workpiece 3 which are set at a lower rotation speed, the channel 21 arranged in a concentric manner and the high sea-land ratio grinding disc 1 system can have a large water discharge effect, so the abrasive layer of the grinding disc 1 or The abrasive cut into the workpiece 3 has a shallow depth, and can achieve high surface quality (ie, low surface roughness) and high surface flatness. The above-described sea-land ratio is the percentage of the total volume of the channel to the total volume of the pedestal (i.e., the sum of the total volume of the channel and the total volume of the non-channel portion of the susceptor).

此外,本發明中的通道排列之形狀並不限於此態樣,如圖6所示之基座20’,該等通道21’係排列成同心圓狀並該等通道21’中每一者之寬度係為 不同,亦即,該等通道21’之寬度或深度係為不同,則其可對應容置的供液管線2的數量係為不同,因此,對應於該等通道21’之寬度或深度,該研磨面不同位置的出水量係不相同,而可影響磨盤1之研磨層或其中的磨料切入工件3的深度,而使該研磨面不同位置係有不同之消耗量。 In addition, the shape of the channel arrangement in the present invention is not limited to this aspect, as shown in FIG. 6, the pedestal 20', the channels 21' are arranged in a concentric shape and each of the channels 21' Width is Differently, that is, the widths or depths of the channels 21' are different, and the number of the liquid supply lines 2 that can be accommodated is different, and therefore, corresponding to the width or depth of the channels 21', The amount of water discharged at different positions of the grinding surface is different, and the grinding layer of the grinding disc 1 or the depth of the abrasive into the workpiece 3 can be affected, so that the different positions of the grinding surface are differently consumed.

此外,如圖7所示為本實施中基座的另一實施態樣,該基座20”中該等通道21”係以放射狀的形式排列,且每一通道21”係呈弧形,由鄰近該結合面的中心處連續延伸至鄰近邊緣處,且於鄰近該結合面的中心處的通道21之間距離較近,鄰近邊緣處的通道21之間距離較遠。於此態樣下,該基座20之海陸比較佳為4~40%的磨盤1,該磨盤1之研磨面的內外側磨損速度可以趨近一致。上述之海陸比係為通道之總體積占該基座之總體積(即通道之總體積與基座上非通道部分之總體積的總合)的百分比。 In addition, as shown in FIG. 7 , in another embodiment of the susceptor of the present embodiment, the channels 21 ′′ in the pedestal 20 ′′ are arranged in a radial form, and each channel 21′′ is curved. Continuously extending from the center adjacent to the joint surface to the adjacent edge, and the distance between the passages 21 adjacent to the center of the joint surface is relatively close, and the distance between the passages 21 at the adjacent edges is relatively long. The landscaping of the susceptor 20 is preferably 4 to 40% of the grinding disc 1, and the inner and outer wear speeds of the grinding surface of the grinding disc 1 can be nearly uniform. The above-mentioned sea-land ratio is the total volume of the channel occupies the total of the pedestal. The percentage of the volume (i.e., the sum of the total volume of the channel and the total volume of the non-channel portion of the susceptor).

請參照圖8,其係揭示基座的又一實施態樣,該基座20'''中該等通道21'''係以放射狀的形式排列,且每一通道21'''係呈弧形,該等通道21'''係排列成環繞於該基座20'''中心的複數圈(圖8中以2圈做為示例),位於外圈之通道21'''數量係大於內圈之通道21'''數量,較佳為外圈之通道21'''分布的密度較內圈之通道21'''分布的密度高,且內圈與外圈的通道21'''係不連通。其中,該通道21係以放射狀排列的配置下,且該基座20之海陸比較佳為4~40%的磨盤1,以應用於高材料移除率需求下的加工,由於海陸比低,因此該磨盤係可承受較高的加工負荷,並同時維持一定之表面品質。 Please refer to FIG. 8 , which illustrates another embodiment of the susceptor. The pedestals 20 ′′′ are arranged in a radial manner, and each channel 21′′′ is Curved, the channels 21"' are arranged in a plurality of turns around the center of the base 20"" (exemplified by 2 circles in Fig. 8), and the number of channels 21"' in the outer ring is greater than The number of channels 21''' of the inner ring, preferably the channel 21''' of the outer ring is distributed at a higher density than the channel 21''' of the inner ring, and the inner and outer ring channels 21''' It is not connected. Wherein, the channel 21 is arranged in a radial arrangement, and the land 20 of the susceptor 20 is preferably 4 to 40% of the grinding disc 1 for processing under high material removal rate demand, because the sea-land ratio is low, Therefore, the disc can withstand high processing loads while maintaining a certain surface quality.

因此,本創作實施例所揭示之磨盤1應用於研磨加工時,係可依據不同的加工需求或不同工件3的尺寸來選用具有適合之基座20,20’,20”,20'''的磨盤1,以達最佳之研磨效果。 Therefore, when the grinding disc 1 disclosed in the embodiment of the present invention is applied to the grinding process, the bases 20, 20', 20", 20''' can be selected according to different processing requirements or different sizes of the workpiece 3. Grinding disc 1 for the best grinding results.

據此,本發明實施例之磨盤1係可藉由控制各通道21中流體之供應與否或流量多寡,而調整該多孔隙研磨層10之研磨面12不同位置的流體出口量,進而影響研磨面12不同位置的消耗量,藉以有效地減緩研磨面12之變形以減少磨盤1的修整次數。 Accordingly, the grinding disc 1 of the embodiment of the present invention can adjust the fluid outlet amount at different positions of the grinding surface 12 of the porous polishing layer 10 by controlling the supply or the flow of the fluid in each channel 21, thereby affecting the grinding. The consumption of the surface 12 at different positions is effective to slow the deformation of the abrasive surface 12 to reduce the number of times the grinding disc 1 is trimmed.

本發明在上文中已以較佳實施例揭露,然熟習本項技術者應理解的是,該實施例僅用於描繪本發明,而不應解讀為限制本發明之範圍。應注意的是,舉凡與該實施例等效之變化與置換,均應設為涵蓋於本發明之範疇內。因此,本發明之保護範圍當以申請專利範圍所界定者為準。 The invention has been described above in terms of the preferred embodiments, and it should be understood by those skilled in the art that the present invention is not intended to limit the scope of the invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention. Therefore, the scope of protection of the present invention is defined by the scope of the patent application.

1‧‧‧磨盤 1‧‧‧ grinding disc

10‧‧‧多孔隙研磨層 10‧‧‧Porous abrasive layer

11‧‧‧結合面 11‧‧‧ joint surface

20‧‧‧基座 20‧‧‧ Pedestal

21‧‧‧通道 21‧‧‧ channel

22‧‧‧不透水膠層 22‧‧‧impermeable layer

Claims (9)

一種具內部供給流體結構之磨盤,用於安裝在具有複數條供液管線之驅動軸上,包含:一多孔隙研磨層,係包括相背之一結合面與一研磨面;及一基座,係結合於該結合面上,該基座包括貫穿之複數條通道,該等通道以同心圓狀或放射狀的形式排列,且該等通道中至少一部分延伸至該結合面之邊緣,每一通道係用於配置該等供液管線,當該等通道以同心圓狀的形式排列時,該基座係具有28~75%的海陸比,其中海陸比係為通道之總體積占該基座之總體積的百分比,另當該等通道以放射狀的形式排列時,該基座係具有4~40%的海陸比,其中海陸比係為通道之總體積與該基座之總體積的百分比。 A grinding disc having an internal supply fluid structure for mounting on a drive shaft having a plurality of liquid supply lines, comprising: a porous abrasive layer comprising a combined surface and a polishing surface; and a pedestal Attached to the bonding surface, the pedestal includes a plurality of channels extending through the channels, and the channels are arranged in a concentric or radial manner, and at least a portion of the channels extend to the edge of the bonding surface, each channel For arranging the liquid supply pipelines, when the channels are arranged in a concentric manner, the pedestal has a sea-land ratio of 28 to 75%, wherein the sea-land ratio is the total volume of the channels occupying the pedestal The percentage of the total volume, and when the channels are arranged in a radial form, the pedestal has a sea to land ratio of 4 to 40%, wherein the sea to land ratio is the percentage of the total volume of the channel to the total volume of the susceptor. 如請求項1所述之磨盤,其中該基座係藉由不透水膠層黏合至該結合面上。 The grinding disc of claim 1, wherein the base is bonded to the bonding surface by a water-impermeable adhesive layer. 如請求項1所述之磨盤,其中該等通道中每一者之寬度係為不同。 A grinding disc according to claim 1, wherein the width of each of the channels is different. 如請求項1所述之磨盤,其中該多孔隙研磨層之材質係選自由樹脂、金屬、陶瓷及其組合所組成之群組。 The grinding disc of claim 1, wherein the porous abrasive layer is made of a material selected from the group consisting of a resin, a metal, a ceramic, and combinations thereof. 如請求項4所述之磨盤,其中該多孔隙研磨層之材質係為陶瓷。 The grinding disc of claim 4, wherein the porous abrasive layer is made of ceramic. 如請求項1所述之磨盤,其中該多孔隙研磨層之孔隙率係30~60%。 The grinding disc of claim 1, wherein the porous abrasive layer has a porosity of 30 to 60%. 如請求項1所述之磨盤,其中該多孔隙研磨層之孔隙率係45~55%。 The grinding disc of claim 1, wherein the porous abrasive layer has a porosity of 45 to 55%. 如請求項1所述之磨盤,其中每一通道係呈弧形。 A grinding disc according to claim 1, wherein each passage is curved. 如請求項8所述之磨盤,其中該等通道係排列成環繞於該基座中心的複數圈,位於外圈之通道數量係大於內圈之通道數量。 The grinding disc of claim 8, wherein the channels are arranged in a plurality of turns around the center of the base, and the number of channels in the outer ring is greater than the number of channels in the inner ring.
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