TWI582432B - Ic test socket with capacitor - Google Patents

Description

IC test stand for integrated capacitor module

The invention relates to an electrical function testing device, in particular to an IC test socket for integrating a capacitor module.

With the advancement of related technologies such as electronic technology and the Internet, and the gradual increase in the consumption level of the global electronic market, the demand for consumer electronic products has soared, which has led to the vigorous development of the semiconductor industry.

Semiconductor manufacturing (or wafer processing) involves the following steps: IC design, wafer fabrication, wafer probe, wafer packaging, and post-package testing. IC test), etc., where the so-called wafer test and post-package test refers to one or more dies on the uncut wafer or one or more dies cut from the wafer (package) Or not packaged) Conduct electrical testing to identify unqualified dies and eliminate them. Generally, when the semiconductor die is being tested, the tester must touch the device under test (DUT) through the probe card, that is, the probe card is used as the test signal and power signal between the tester and the object to be tested. The transmission interface, together with the control and analysis procedures of the probe card and the test machine, achieves the purpose of measuring the electrical characteristics of the object to be tested.

Furthermore, electronic components are becoming more expensive and high-frequency development, and electronic components are required to have high-standard electrical specifications (such as component operation conditions, operating frequency, signal transmission characteristics, etc.), so the probe card is designed. At least the test conditions, test bandwidth and signal transmission integrity must be considered. However, in order to meet the requirements of the final test, capacitors are required for the transmission path of high-speed (frequency) signals or power signals. But the function is different.

Please refer to FIG. 1 , which is a structural diagram of a conventional IC test probe card. The conventional IC test probe card 100 is usually placed on the IC test panel 104 (meaning Loadboard PCB) during the post-package test because it is limited by the product structure and the test mechanism, and is closer to the test. The test side, as a result, the electronic components to be tested will be distorted due to insufficient power supply, making it easy to misjudge the test process.

One of the main purposes of the present invention from the viewpoint of improving the quality of high-frequency signal transmission is to provide an IC test socket integrated with a capacitor module, which can greatly increase the importance of capacitance in wafer testing or post-packaging testing applications.

To achieve the above objective, the present invention adopts the following technical solution: an IC test socket for integrating a capacitor module, comprising: a first hub; a second hub, the second hub being opposite the first hub a relative arrangement; an interposer having a capacitance, the interposer having a capacitance disposed between the first hub and the second hub, and having a plurality of contact metal pads on the surface to form a capacitor module; And a probe module comprising a plurality of long probes and a plurality of short probes, the long probes extending through the first needle seat, the interposer having a capacitance, and the second socket The short probe includes at least one pair of probes distributed up and down, and penetrates the first hub and the second hub respectively, and is connected in series with the capacitor module.

In an embodiment of the invention, the first needle hub includes a first dial and a first positioning plate disposed on the inner side of the first dial. The first hub has a plurality of first needles extending through the first needle. a first pinhole of the first positioning plate, the second pinhole includes a second dial and a second positioning plate disposed on the inner side of the second dial, wherein the second hub has a plurality of through holes The second dial and the second pinhole of the second positioning plate.

In an embodiment of the invention, the first pinholes are disposed opposite to the second pinholes.

In an embodiment of the invention, the interposer structure having a capacitance includes a middle And a plurality of first contact metal pads and a plurality of second contact metal pads, wherein the first contact metal pads are disposed on one side of the intermediate layer body, and the plurality of first contact metal pads The two contact metal pads are disposed on opposite sides of the interposer body, and the capacitor is electrically connected to the first contact metal pads and the second contact metal pads.

In an embodiment of the present invention, the interposer body includes a first surface layer and a second surface layer disposed opposite to each other, and the first surface layer is located between the interposer body and the first hub. The first contact metal pad is spaced apart from the first surface layer, the second surface layer is located between the interposer body and the second needle seat, and the second contact metal pads are spaced apart from the second surface. On the floor.

In an embodiment of the invention, the interposer having a capacitance further includes a plurality of conductive pillars, the conductive pillars are buried in the interposer body at intervals, and each of the conductive pillars respectively contacts the corresponding one. A first contact metal pad and a second contact metal pad.

In an embodiment of the invention, the capacitor is made of a high dielectric constant material and formed in a thin film process and placed in a built-in manner in the body of the interposer.

In an embodiment of the invention, the capacitor is disposed on the first surface layer, and the capacitor is connected to the adjacent two of the first contact metal pads by soldering.

In an embodiment of the invention, the long probes are not connected to the interposer having a capacitance, and the short probes of the probe module are used to form a loop with the interposer having a capacitance. At the same time, save electricity to provide the current required for the test.

In an embodiment of the invention, the short probes are connected by their probe tips to the contact metal pads having the interposer structure of the capacitor to form a loop.

The present invention has at least the following beneficial effects: the IC test socket of the integrated capacitor module of the present invention transmits "a dielectric layer structure having a capacitance between the first needle seat and the second needle seat, and a plurality of contact metal pads are disposed on the surface thereof. In order to form a capacitor module, when used for wafer testing or post-package testing, the capacitor can be controlled to the position closest to the IC to be tested to improve the efficiency of the capacitor, thereby improving the test yield and performance of the wafer. .

The detailed description of the present invention and the accompanying drawings are to be understood by the claims The scope is subject to any restrictions.

(previous technology)

100‧‧‧IC test probe card

102‧‧‧ capacitor

104‧‧‧Testing panel

(this invention)

100a, 100b, 100c, 100d‧‧‧ IC test socket

10‧‧‧first needle seat

11‧‧‧First dial

12‧‧‧First Positioning Plate

13‧‧‧first pinhole

20‧‧‧Second hub

21‧‧‧Second positioning plate

22‧‧‧Second dial

23‧‧‧second pinhole

30, 30'‧‧‧Intermediate layer structure with capacitance

31‧‧‧Intermediary body

32‧‧‧First surface layer

33‧‧‧Second surface layer

34‧‧‧First contact metal pad

35‧‧‧Second contact metal pad

36‧‧‧conductive column

C‧‧‧Capacitor Module

C’‧‧‧ capacitor

37‧‧‧through hole

40‧‧‧ Probe Module

41‧‧‧Long probe

42‧‧‧Short probe

FIG. 1 is a partial structural diagram of a conventional IC test probe card.

2 is a schematic structural view of an IC test socket of an integrated capacitor module according to a first embodiment of the present invention.

3 is a schematic structural view of an IC test socket of an integrated capacitor module according to a second embodiment of the present invention.

4 is a schematic structural view of an IC test socket of an integrated capacitor module according to a third embodiment of the present invention.

FIG. 5 is a schematic structural diagram of an IC test socket of an integrated capacitor module according to a fourth embodiment of the present invention.

The disclosure of the present invention mainly relates to a structural improvement of an IC test stand, which is characterized in that a film capacitor or a solid capacitor is integrated in a test socket to form a structure with a capacitor in a signal transmission path; thus, the IC test When used for post-package test or Wafer Level package test, since the film capacitor or solid capacitor is placed closest to the IC end to be tested, the power supply time can be shortened to meet the various requirements during the test. The test signal is simultaneously driven by the current draw requirement.

The embodiments of the present invention are described in the following with reference to the accompanying drawings, and those of ordinary skill in the art can understand the advantages and advantages of the present invention. The present invention can be implemented or applied in various other specific embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention. In addition, the drawings of the present invention are merely illustrative and are not described in terms of actual dimensions. The following embodiments will further explain the related technical content of the present invention, but the disclosure is not intended to limit the technical scope of the present invention.

The use principle and basic functions of the probe card are well known to those skilled in the relevant art, and therefore, the description below will not be completely described. At the same time, the drawings referred to in the following texts express the structural schematics related to the features of the present invention, and do not need to be completely drawn according to the actual size, which will be described first.

[First Embodiment]

Please refer to FIG. 2 , which is a structural diagram of an IC test socket of an integrated capacitor module according to a first embodiment of the present invention. The IC test socket 100a of this embodiment is mainly used for IC testing after packaging; as shown in FIG. 2, the IC test socket 100a includes a first hub 10, a second hub 20, and a capacitor layer structure 30. And a probe module 40, firstly, the relative relationship of the constituent elements is described. The first hub 10 and the second hub 20 are oppositely disposed, and the interposer 30 having a capacitance is disposed on the first hub 10 and the first Between the two needle holders 20, the long probe 41 of the probe module 40 extends through the first needle holder 10, the interposer structure 30 having a capacitance, and the second needle holder 20.

Next, the structural features and the detailed connection relationship of the constituent elements will be described. The first hub 10 is substantially identical in structure to the second hub 20, and the first hub 10 and the second hub 20 are The individual components (such as fixing screws, screw holes, nuts, etc.) are combined. In this embodiment, the first and second hubs 10, 20 may have a regular shape (eg, a rectangle), and the shapes of the two are symmetrical; in addition, the first and second hubs 10, 20 may be high in hardness and Easy-to-machine materials (eg, engineering plastics, ceramics, glass, sapphire, etc.), however, the invention does not limit the shape and material of the first and second hubs 10, 20.

Further, the first hub 10 includes a first dial 11 and a first positioning plate 12 disposed on the inner side of the first dial 11, and the first hub 10 further has a plurality of first dials. 11 and the first pinhole 13 of the first positioning plate 12; the second needle holder 20 includes a second dial 22 and a second positioning plate 21 disposed on the inner side of the second dial 22, and the second needle holder 20 There are also a plurality of second pinholes 23 extending through the second dial 22 and the second positioning plate 21. Functionally, the first and second dials 11, 22 are square The implant needle of the probe, while the first and second positioning plates 12, 21 can assist in the mounting and positioning of the probe.

The interposer structure 30 having a capacitance may also be mounted between the first and second hubs 10, 20 by a plurality of mechanical components (eg, fixing screws, screw holes, nuts, etc.), notably, having a capacitance The interposer structure 30 includes an interposer body 31 and a capacitor module C disposed on the interposer body 31. In this embodiment, the interposer body 31 includes a first surface layer 32 and a second surface layer. The capacitor module C includes a plurality of first contact metal pads 34, a plurality of second contact metal pads 35, a plurality of conductive pillars 36, and at least one capacitor C', wherein the first contact metal pads 34 are spaced apart from each other. On a surface layer 32, the second contact metal pads 35 are spaced apart from each other on the second surface layer 33. The distribution of the first and second contact metal pads 34, 35 is in an upper and lower correspondence relationship, and the conductive pillars 36 are buried in the space at intervals. Each of the conductive pillars 36 is in contact with a corresponding first contact metal pad 34 and a second contact metal pad 35. The capacitor C' is also buried in the interposer main body 31, and the capacitor C'. The positive and negative poles are respectively electrically connected to the adjacent two Columns 36 are connected.

Furthermore, the first and second contact metal pads 34, 35 can serve as electrical contacts for the buried capacitor C', and through the configuration and internal interconnection of the first and second contact metal pads 34, 35. The layout of the wires (not shown) allows the capacitor C' to form a loop with the power and ground signals. It should be understood that the number of first and second contact metal pads 34, 35 and conductive posts 36 can be adjusted based on the number of capacitors C'.

Although the number of capacitors C' is only one in the IC test socket 100a shown in FIG. 2, for other embodiments of the embodiment, the number of capacitors C' included in the IC test socket 100a may be two or three. The above is only required to meet the capacitance resonance frequency; therefore, the number of capacitors C' shown in FIG. 2 is for reference only and is not intended to limit the present invention.

The probe module 40 includes a plurality of probes. Functionally, the probes include a signal pin, a ground pin, and a power pin. The principle of use and basic functions are those of ordinary skill in the related art. It can be understood, so I won't go into details here. Real In the embodiment, the probe module 40 is composed of a plurality of long probes 41 and at least one pair of short probes 42. The long probes 41 are not connected to the interposer 30 having a capacitance, and the short probes 42 are used. Forming a loop with the interposer structure 30 having a capacitance while conserving electricity to provide a current required for testing; specifically, a pair of short probes 42, that is, short probes 42, are disposed relative to a capacitor module C. The number depends on the number of capacitors C'.

Furthermore, as shown in FIG. 2, after the probe module 40 is mounted and positioned, the long probe 41 penetrates through the first pinhole 13 of the first hub 10 and the through hole 37 of the interposer 30 having a capacitance. With the second pinhole 23 of the second hub 20, at least one pair of short probes 42 are respectively disposed on the first pinhole 13 of the first hub 10 and the second pinhole 23 of the second hub 20, and Contacting the first and second contact metal pads 34, 35 respectively; thereby preventing the probe module 40 from interfering with the capacitor module C, and the probe module 40 can be electrically connected to the capacitor module C and formed Loop.

[Second embodiment]

Please refer to FIG. 3 , which is a structural diagram of an IC test socket of an integrated capacitor module according to a third embodiment of the present invention. The IC test socket 100b of the embodiment is also used for IC testing after packaging; as shown in FIG. 3, the IC test socket 100b includes a first needle holder 10, a second needle holder 20, and an interposer structure having a capacitance. 30. A probe module 40. The difference between this embodiment and the first embodiment is that in the capacitor module C having the interposer 30' of the capacitor, the capacitor C' is not buried in the interposer main body 31, but is disposed in the first On the surface layer 32 or the second surface layer 33; specifically, the positive and negative electrodes of the capacitor C' are connected to the adjacent two first contact metal pads 34 by soldering and form a conduction.

Although the number of capacitors C' is only one in the IC test socket 100b shown in FIG. 3, and is electrically connected to the first contact metal pad 34, for other embodiments of the embodiment, the IC test socket 100b is The number of capacitors C' may be two or more, wherein the capacitor C' may also be electrically connected to the second contact metal pad. 35, as long as the internal space of the IC test stand 100b is sufficient; therefore, the number of capacitors C' shown in Fig. 3 and its positional arrangement are for reference only, and do not limit the present invention.

[Third embodiment]

Please refer to FIG. 4 , which is a structural diagram of an IC test socket of an integrated capacitor module according to a third embodiment of the present invention. It should be noted that, unlike the previous two embodiments for IC testing after packaging, the IC test socket 100c of the present embodiment is mainly used for IC testing after wafer packaging; as shown in FIG. 4, the IC test socket is shown. The 100c includes a first hub 10, a second hub 20, an interposer 30 having a capacitor, and a probe module 40. This embodiment is substantially the same as the first embodiment, that is, the structure of the capacitor module C is the same, except that there is no limitation of the outer frame of the IC test socket, so that multiple ICs can be simultaneously tested in one probe card. Testing, which in turn increases test efficiency.

[Fourth embodiment]

Please refer to FIG. 5 , which is a structural diagram of an IC test socket of an integrated capacitor module according to a fourth embodiment of the present invention. The IC test socket 100d of the present embodiment is the same as the third embodiment for the IC test after the wafer package. As shown in FIG. 5, the IC test socket 100d includes a first needle holder 10 and a second needle holder 20. An interposer structure 30' having a capacitance and a probe module 40. This embodiment is substantially the same as the second embodiment, that is, the structure of the capacitor module C is the same, except that there is no IC test box frame limitation, so multiple ICs can be tested simultaneously in one probe card pressure measurement. , in turn, can improve test efficiency.

As described above, in all the embodiments of the present invention, the power storage body (ie, the capacitor C') of the capacitor module C is a solid capacitor, but the invention is not limited by this example, for example, the power storage of the capacitor module C The body may also be a film capacitor, which may be made of a high dielectric constant material and formed in a film processing manner and placed in the interposer body 31 in a built-in manner. Specifically, the thin film capacitor may be composed of a first metal layer and a second metal layer disposed opposite to each other and a dielectric layer disposed between the first and second metal layers, wherein the first metal layer is equivalent to the first Electrode, the second metal layer is equivalent to the second electricity pole. The integration of the capacitor module into the interior of the IC test socket falls within the scope of protection of the present invention.

Furthermore, the film capacitor can be processed by pressing, coating, printing, vapor deposition, or sputtering, and can be produced by using a lithography, etching, and electroplating process, and the thickness can be controlled at about 1 μm or even more. thin. A high dielectric constant material such as BST or the like which can be used for a film capacitor, the similar compound may comprise the following elements: lanthanum, cerium, lead, tin, zirconium, hafnium, tantalum, titanium, magnesium, lanthanum, or Specific examples of the combination thereof include Pb(Zr,Ti)O ₃ , Pb(Mg,Nb)O ₃ , SrBi ₂ Ta ₂ O ₉ , ZrO ₂ , Ta ₂ O ₅ and the like. A material that can be used for the metal layer of the film capacitor is, for example, platinum, gold, copper, lead, antimony, bismuth, chromium, or the like.

[Possible effects of the examples]

The IC test socket of the integrated capacitor module of the present invention transmits a "capacitor layer structure having a capacitance between the first needle seat and the second needle seat, and a plurality of contact metal pads are formed on the surface thereof to form a capacitor module" Designed, when applied to post-package test or post-wafer package test, the function of the capacitor can be placed closest to the IC end to be tested, thereby shortening the power supply time to improve the test signals during the test. The ability to draw current and current increases the test yield and performance of the wafer.

The above is only an embodiment of the present invention, and is not intended to limit the scope of the invention. It is still within the scope of patent protection of the present invention to make any substitutions and modifications of the modifications made by those skilled in the art without departing from the spirit and scope of the invention.

100a‧‧‧IC test stand

10‧‧‧first needle seat

11‧‧‧First dial

12‧‧‧First Positioning Plate

13‧‧‧first pinhole

20‧‧‧Second hub

21‧‧‧Second positioning plate

22‧‧‧Second dial

23‧‧‧second pinhole

30‧‧‧Intermediate layer structure with capacitance

31‧‧‧Intermediary body

32‧‧‧First surface layer

33‧‧‧Second surface layer

34‧‧‧First contact metal pad

35‧‧‧Second contact metal pad

36‧‧‧conductive column

37‧‧‧through hole

C‧‧‧Capacitor Module

C’‧‧‧ capacitor

40‧‧‧ Probe Module

41‧‧‧Long probe

42‧‧‧Short probe

Claims (10)

An IC test socket for integrating a capacitor module includes: a first hub; a second hub, the second hub is opposite to the first hub; and an interposer having a capacitance, the capacitor The interposer structure is disposed between the first hub and the second hub, and the surface is provided with a plurality of contact metal pads to form a capacitor module; and a probe module includes a plurality of long probes and a plurality of short probes extending through the first hub, the interposer having a capacitance, and the second hub, and the short probes include at least one pair of probes distributed vertically And passing through the first hub and the second hub respectively, and being connected in series with the capacitor module. The IC test socket of the integrated capacitor module of claim 1, wherein the first hub includes a first dial and a first positioning plate disposed inside the first dial, the first hub a plurality of first pinholes extending through the first dial and the first positioning plate, the second hub includes a second dial and a second positioning plate disposed on the inner side of the second dial The second needle seat has a plurality of second pinholes extending through the second dial and the second positioning plate. The IC test socket of the integrated capacitor module of claim 2, wherein the first pinholes are disposed opposite to the second pinholes. The IC test socket of the integrated capacitor module of claim 1, wherein the interposer structure having a capacitor comprises an interposer body and a capacitor, and the contact metal pads comprise a plurality of first contact metal pads and a plurality of a second contact metal pad, the first contact metal pads are disposed on one side of the interposer body, the second contact metal pads are disposed on the opposite side of the interposer body, and the capacitor and the first The contact metal pad and the second contact metal pads are electrically connected. The IC test socket of the integrated capacitor module of claim 4, wherein the interposer body comprises a first surface layer and a second surface layer disposed opposite to each other, the first surface layer is located at the interposer body and the first The first contact metal between the needle holders The second surface layer is disposed between the interposer body and the second needle seat, and the second contact metal pads are spaced apart from the second surface layer. The IC test socket of the integrated capacitor module of claim 4, wherein the interposer structure having a capacitance further comprises a plurality of conductive pillars, the conductive pillars being buried in the interposer body at intervals, and each The conductive posts respectively contact a corresponding one of the first contact metal pads and one of the second contact metal pads. The IC test socket of the integrated capacitor module according to claim 4, wherein the capacitor is made of a high dielectric material and formed by film processing, and is placed in the main body of the interposer in a built-in manner. The IC test socket of the integrated capacitor module of claim 5, wherein the capacitor is disposed on the first surface layer, and the capacitor is connected to the adjacent two of the first contact metal pads by soldering. The IC test socket of the integrated capacitor module according to claim 1, wherein the long probes do not generate a signal connection with the interposer structure having a capacitance, and the short probes of the probe module are used for The interposer structure with capacitance forms a loop while conserving electricity to provide the current required for testing. The IC test socket of the integrated capacitor module according to claim 9, wherein the short probes are connected with the contact metal pads of the capacitor having an interposer structure to form a loop.