TWI623996B - Integrated circuit test socket with signal and power integration module - Google Patents

Abstract

An integrated circuit test stand for integrating signal and power integrity modules includes a first conductive adhesive layer, a second conductive adhesive layer, a conductor module, and a signal and power integrity module. The second conductive adhesive layer is disposed opposite to the first conductive adhesive layer. The conductor module includes at least one pair of conductors. The signal and power integrity module is disposed between the first conductive adhesive layer and the second conductive adhesive layer. At least one pair of conductors penetrate the first conductive adhesive layer and the second conductive adhesive layer, respectively, and are in electrical contact with the signal and power integrity module.

Description

Integrated circuit test stand for integrated signal and power integrity modules

The invention relates to a test device, and in particular to an integrated circuit test stand for integrating signal and power integrity modules.

With the advancement of related technologies such as electronic technology and the Internet, and the gradual increase in the consumption level of the global electronics market, the demand for consumer electronics products has soared, which has led to the vigorous development of the semiconductor industry.

Semiconductor manufacturing (or wafer processing) includes the following steps: integrated circuit (IC) design, wafer fabrication, wafer probe, wafer packaging, and packaging Final test (meaning IC test), etc. Among them, the so-called wafer test and post-package test refer to one or more dies on or not cut from wafers. One or more dies (packaged or unpackaged) are tested for electrical functions to identify substandard dies and eliminate them. Generally, when testing semiconductor chips, the tester must contact the device under test (DUT) through the probe card, that is, the probe card is used as the test signal and power signal between the test machine and the test object. The transmission interface, together with the control and analysis program of the probe card and the testing machine, achieve the purpose of measuring the electrical characteristics of the object under test.

Furthermore, the more high-speed and high-frequency development of electronic components, the more the electronic components need to have high-level electrical specifications (such as: component operating conditions, operating frequency, signal transmission). Characteristics, etc.), so the probe card must be designed with at least test conditions, test bandwidth, and signal transmission integrity in mind. However, in order to meet the requirements of final test, capacitors are required for transmission paths of high-speed (frequency) signals or power signals, but the functions are different.

Please refer to FIG. 1, which is a schematic structural diagram of a conventional integrated circuit test probe card. In the conventional integrated circuit test probe card 10, during the post-packaging test, electronic components 11 such as capacitors or memories are usually arranged on the integrated circuit test interface panel 12 due to limited product structures and test institutions. (Meaning carrier load circuit board, loadboard print circuit board), because the test paths (such as the ground signal test path T1 and the power signal test path T2 shown in Figure 1) are too long, the high frequency test inductance effect becomes more significant, And affect the entire test result. The test information stored in the memory is also prone to signal distortion because the test path is too long. In addition, if the test path is too long, a large resistance will be generated, and in the path through which the current flows, the energy loss is large. When the DUT 13, such as multiple integrated circuits, is tested at the same time, it is often impossible to supply current in time, and Generate test failure.

Therefore, there is a need to provide an integrated circuit test stand that integrates signal and power integrity modules to solve the problems existing in the conventional technology.

The main object of the present invention is to provide an integrated circuit test socket for integrating signals and power integrity modules, which can supply current in time and provide stable test results.

In order to achieve the above object, the present invention provides an integrated circuit test stand for integrating signal and power integrity modules, which includes a first conductive adhesive layer, a second conductive adhesive layer, a conductor module, and a signal and power integrity Module. The second conductive adhesive layer is disposed opposite to the first conductive adhesive layer. The conductor module includes at least one pair of conductors. The signal and power integrity module is disposed between the first conductive adhesive layer and the second conductive adhesive layer. At least one pair of conductors penetrate the first conductive adhesive layer and the second conductive adhesive layer, respectively, and are in electrical contact with the signal and power integrity module.

In one embodiment of the present invention, the signal and power integrity module includes a capacitor module. The capacitor module includes a capacitor plate and two first conductive contacts respectively disposed on the upper surface and the lower surface of the capacitor plate.

In one embodiment of the present invention, at least one pair of conductors are in contact with two first conductive contacts, respectively.

In one embodiment of the present invention, the signal and power integrity module includes a board and a conductor module, and the conductor module includes at least one grounded conductor unit and a signal conductor unit.

In one embodiment of the present invention, at least one grounded conductor unit includes two grounded conductor units, and the signal conductor unit is disposed between the two grounded conductor units.

In one embodiment of the present invention, the signal conductor unit and the at least one grounded conductor unit form a coaxial structure.

In one embodiment of the present invention, the grounding conductor unit includes a grounding conductor and two grounding conductive contacts. The two grounding conductive contacts are respectively disposed on opposite upper and lower surfaces of the board. The grounding conductor runs through the board and Make electrical contact with two grounded conductive contacts.

In one embodiment of the present invention, the signal conductor unit includes a signal conductor and two signal conductive contacts. The two signal conductive contacts are respectively disposed on the upper surface and the lower surface of the board. The signal conductor runs through the board and Make electrical contact with the two signal conductive contacts.

In one embodiment of the present invention, the signal and power integrity module includes a board and a conductor module, and the conductor module includes a power conductor unit.

In one embodiment of the present invention, the power conductor unit includes a power conductor and an electronic component integrated in the board.

In one embodiment of the present invention, the electronic component is a capacitor structure, a memory or an integrated circuit.

In an embodiment of the present invention, the power supply conductor unit further includes a first power supply conductive contact and a second power supply conductive contact, which are respectively disposed on opposite upper and lower surfaces of the board, and the power supply conductor penetrates the board. And is in electrical contact with the first power supply conductive contact and the second power supply conductive contact, and the electronic component is in electrical contact with the first power supply conductive contact.

In one embodiment of the present invention, the width of the first power contact is greater than the width of the second power contact.

In one embodiment of the present invention, the conductor module further includes a plurality of conductive contacts disposed on opposite upper and lower surfaces of the first conductive adhesive layer and opposite upper and lower surfaces of the second conductive adhesive layer.

In one embodiment of the present invention, each of the conductive contacts includes a conductive layer and at least one conductive structure disposed on the conductive layer.

In one embodiment of the present invention, the conductive structure is selected from the group consisting of a triangular pillar conductive structure or a trapezoidal pillar conductive structure.

In one embodiment of the present invention, the integrated circuit test base further includes a needle base disposed on the first conductive adhesive layer and the second conductive adhesive layer.

In one embodiment of the present invention, the integrated circuit test socket further includes a first locking element and a second locking element, wherein the first locking element passes through the second conductive adhesive layer and the needle base, and the second locking element passes through The second conductive adhesive layer, the signal and power integrity module, the first conductive adhesive layer, and the pin base.

Since the signal and power integrity module of the embodiment of the present invention is integrated in the integrated circuit test stand, and at least one pair of conductors penetrates the first conductive adhesive layer and the second conductive adhesive layer, respectively, and communicates with the signal and power integrity module Sexual contact, thus shortening the current path provided by the signal and power integrity module to the object under test, so that when the object under test is tested, the current can be obtained at a short distance, which helps the function Complex objects under test, such as the amount of current required for simultaneous switching of all signals in an integrated circuit (IC), allow the test product to have stable test results.

10‧‧‧Integrated Circuit Test Probe Card

11‧‧‧Capacitor

12‧‧‧Integrated Circuit Test Interface Panel

13‧‧‧DUT

20‧‧‧Integrated Circuit Test Block

21‧‧‧The first conductive adhesive layer

22‧‧‧Second conductive adhesive layer

23‧‧‧Signal and Power Integrity Module

23a‧‧‧Signal and Power Integrity Module

23b‧‧‧Signal and Power Integrity Module

24‧‧‧Conductor Module

25‧‧‧ Needle Block

26‧‧‧First Lock Firmware

27‧‧‧Second Lock Firmware

231‧‧‧Capacitor Module

232‧‧‧Capacitor board

233‧‧‧First conductive contact

234‧‧‧board

234a‧‧‧board

234b‧‧‧board

235‧‧‧Conductor Module

235a‧‧‧Conductor Module

235b‧‧‧Conductor Module

236a‧‧‧ Ground Conductor Unit

236b‧‧‧ ground conductor

236c‧‧‧ ground conductive contact

237‧‧‧Signal Conductor Unit

237a‧‧‧Signal conductor

237b‧‧‧Signal contact

238‧‧‧Power conductor unit

238a‧‧‧Power Conductor

238b‧‧‧First power contact

238c‧‧‧Second power contact

238d‧‧‧Electronic components

241‧‧‧Conductor

242‧‧‧Conductive contact

243‧‧‧ conductive layer

244‧‧‧ conductive structure

C‧‧‧ coaxial structure

G‧‧‧ Grounding area

P‧‧‧ Power Transmission Area

S‧‧‧Signal transmission area

S1‧‧‧ Upper surface of the first conductive adhesive layer

S2‧‧‧ the lower surface of the first conductive adhesive layer

S3‧‧‧ Upper surface of the second conductive adhesive layer

S4‧‧‧The lower surface of the second conductive adhesive layer

S5‧‧‧Capacitor board top surface

S6‧‧‧Capacitor board under surface

S7‧‧‧ Upper surface of the board

S8‧‧‧ the lower surface of the board

T1‧‧‧ ground signal test path

T2‧‧‧Power signal test path

T3‧‧‧ current path

FIG. 1 is a schematic structural diagram of a conventional integrated circuit test probe card.

FIG. 2 is a schematic structural diagram of an integrated circuit test stand for integrated signal and power integrity modules according to an embodiment of the present invention.

Figure 3A is a schematic diagram showing the structure of the conductor contacts of Figure 2.

Figure 3B is a schematic diagram showing the structure of the conductor contacts of Figure 2.

Figure 3C is a schematic diagram showing the structure of the conductor contacts of Figure 2.

Figure 3D is a schematic diagram showing the structure of the conductor contacts of Figure 2.

FIG. 4 is a schematic structural diagram of an integrated signal and power integrity module according to another embodiment of the present invention.

FIG. 5 is a schematic structural diagram of an integrated signal and power integrity module according to another embodiment of the present invention.

In order to make the above and other objects, features, and advantages of the present invention more comprehensible, the following describes the preferred embodiments of the present invention and the accompanying drawings in detail, as follows. Furthermore, the directional terms mentioned in the present invention include, for example, top, bottom, top, bottom, front, back, left, right, inside, outside, side, periphery, center, horizontal, horizontal, vertical, vertical, axial, The radial direction, the uppermost layer, or the lowermost layer, etc., are only directions referring to the attached drawings. Therefore, the directional terms used are for explaining and understanding the present invention, but not for limiting the present invention.

Please refer to FIG. 2. The integrated circuit test socket 20 of the integrated signal and power integrity module according to the embodiment of the present invention includes a first conductive adhesive layer 21, a second conductive adhesive layer 22, a signal and power integrity module. Group 23 and a conductor module 24. The second conductive adhesive layer 22 is disposed opposite to the first conductive adhesive layer 21. The conductor module 24 includes at least a pair of conductors 241. Signal and Power Integrity Module 23 It is disposed between the first conductive adhesive layer 21 and the second conductive adhesive layer 22. At least one pair of conductors 241 penetrate the first conductive adhesive layer 21 and the second conductive adhesive layer 22 respectively, and are in electrical contact with the signal and power integrity module 23.

The integrated circuit test base 20 further includes a pin base 25, a first locking member 26 and a second locking member 27. The needle base 25 is disposed on the first conductive adhesive layer 21 and the second conductive adhesive layer 22. The first locking member 26 passes through the second conductive adhesive layer 22 and the needle base 25 to lock the second conductive adhesive layer 22 and the needle base 25. The second locking member 27 passes through the second conductive adhesive layer 22, the signal and power integrity module 23, the first conductive adhesive layer 21, and the pin holder 25 to lock the second conductive adhesive layer 22, the signal and power integrity module. Group 23, the first conductive adhesive layer 21 and the needle seat 25. In one embodiment of the present invention, the first conductive adhesive layer 21 and the second conductive adhesive layer 22 are vertical conductive adhesive layers, respectively. In one embodiment of the present invention, the first conductive adhesive layer 21 and the second conductive adhesive layer 22 are processable boards. The board is processed to have a plurality of holes for at least one pair of conductors 241 to pass through.

Because the signal and power integrity module 23 of the embodiment of the present invention is integrated in the integrated circuit test base 20, and at least a pair of conductors 241 penetrate the first conductive adhesive layer 21 and the second conductive adhesive layer 22, respectively, and communicate with the signal and power supply. The integrity module 23 is in electrical contact, so the signal and power integrity module 23 shortens the current path T3 provided by the device under test 13 (device under test, DUT), so that the current can be obtained at a short distance during the test of the device under test. It helps the DUT, such as the amount of current required for the simultaneous switching of all signals in an integrated circuit (IC), allows the test product to have stable test results, and also helps signal integrity (signal integration (SI) and power integration (PI) improvements.

In addition, in the integrated circuit test base 20 of the embodiment of the present invention, at least one pair of conductors 241 are used as the connected conductors. The conductor 241 includes a vertical conductive material, which has a short transmission length and a small inductance effect, and is suitable for high frequency (speed ).

Please refer to FIG. 2, a signal and power integrity module 23 according to an embodiment of the present invention. The capacitor module 231 includes a capacitor plate 232 and two first conductive contacts 233 disposed on the upper surface S5 and the lower surface S6 of the capacitor plate 232, respectively. At least one pair of conductors 241 are in electrical contact with two first conductive contacts 233, respectively. In the embodiment, since the capacitor module 231 is integrated in the integrated circuit test base 20, the capacitor module 231 is disposed near the DUT 13 and the current path T3 is short, which means that the capacitor supplies power to the DUT 13 after being stored. The short path allows the current to be obtained at a short distance when the DUT 13 is tested, which helps the DUT 13 such as the amount of current required for the simultaneous switching of various signals in an integrated circuit (IC) to allow testing. The product has stable test results and helps to check the performance of the IC.

In addition, the capacitor module 231 is integrated in the integrated circuit test base 20, which does not cause the structural change of the capacitor module 231, and can maintain the original structure and wiring density of the capacitor module 231. In addition, the capacitor module 231 is integrated in the integrated circuit test base 20, and the capacitor module 231 can be directly replaced during inspection and maintenance, and replaced with a spare of the capacitor module 231, which saves labor and time for inspection and maintenance, and is easy Inspection and repair.

Referring to FIGS. 2, 3A to 3D, in the embodiment of the present invention, the conductor module 24 includes at least a pair of conductors 241 and a plurality of conductive contacts 242. These conductive contacts 242 are disposed on the opposite upper surfaces S1 and S2 of the first conductive adhesive layer 21 and the opposite upper surfaces S3 and S4 of the second conductive adhesive layer 22. Each conductive contact 242 includes a conductive layer 243 and at least one conductive structure 244 disposed on the conductive layer 243. The conductive structure 244 includes a triangular pillar conductive structure or a trapezoidal pillar conductive structure. The number of triangular pillar conductive structures may be one or more. The number of the conductive structures of the trapezoidal pillars can be one or more, and the protruding conductive structures 244 can help to make contact with the contact points on the IC.

Please refer to FIG. 4. In another embodiment of the present invention, the signal and power integrity module 23a includes a board 234a and a conductor module 235a. The conductor module 235a includes at least one grounded conductor unit and One signal conductor unit 237. At least one ground conductor unit and a signal conductor unit 237 form at least one ground in the signal and power integrity module 23a, respectively. Area G and a signal transmission area S. In the embodiment, since the signal and power integrity module 23a is integrated in the integrated circuit test base 20, at least one ground conductor unit and a signal conductor unit 237 are disposed near the object to be measured, and the current path T3 is short. When the DUT is tested, the current can be obtained at a short distance, which is helpful for the DUT, such as the amount of current required for the simultaneous switching of various signals in an integrated circuit (IC), so that the test product can be stable. Test results and help to check the performance of the IC.

Referring to FIG. 4, at least one grounded conductor unit includes two grounded conductor units 236a. The signal conductor unit 237 is disposed between the two grounded conductor units 236a. In one embodiment of the present invention, the signal conductor unit 237 and the at least one grounded conductor unit form a coaxial structure C, which can implement impedance control and help improve signal integrity (SI). In the embodiment of the present invention, the coaxial structure C refers to a coaxial structure or a coaxial structure similar to the coaxial structure. In one embodiment of the present invention, the signal conductor unit 237 and the two grounded conductor units 236a form a coaxial structure C, which can implement impedance control and contribute to the improvement of signal integrity (SI).

Please refer to FIG. 4. The grounded conductor unit 236a includes a grounded conductor 236b and two grounded conductive contacts 236c. The two grounded conductive contacts 236c are respectively disposed on the upper surface S7 and the lower surface S8 of the board 234a. 236b penetrates the board 234a and is in electrical contact with the two ground conductive contacts 236c. The signal conductor unit 237 includes a signal conductor 237a and two signal conductive contacts 237b. The two signal conductive contacts 237b are respectively disposed on the upper surface S7 and the lower surface S8 of the board 234a. The signal conductor 237a penetrates the board 234a and is in electrical contact with the two signal conductive contacts 237b. In one embodiment of the present invention, the signal conductor 237a and the ground conductor 236b form a coaxial structure C, which can implement impedance control and help to improve signal integrity (SI).

Please refer to FIG. 5. In another embodiment of the present invention, the signal and power integrity module 23b includes a board 234b and a conductor module 235b. The conductor module 235b includes a power source. Electric body unit 238. In the embodiment of the present invention, the power supply conductor unit 238 includes a power supply conductor 238a, a first power supply conductive contact 238b, a second power supply conductive contact 238c, and an electronic component 238d integrated in the board 234b. The first power source conductive contact 238b is disposed on the upper surface S7 of the board 234b, and the second power source conductive contact 238c is disposed on the lower surface S8 of the board 234b. The power supply conductor 238a penetrates the board 234b and is in electrical contact with the first power supply conductive contact 238b and the second power supply conductive contact 238c. The electronic component 238c is electrically connected to the first power supply conductive contact 238b provided on the upper surface S7. contact. The width of the first power conductive contact 238b is greater than the width of the second power conductive contact 238c. Therefore, the first power conductive contact 238b can stably and electrically contact the power conductive body 238a and the electronic component 238d, making the electrical contact good. Since the electronic component 238d of the embodiment of the present invention is integrated in the board 234b, the signal and power integrity module 23 shortens the current path T3 provided by the device under test (DUT). The current can be obtained at a short distance, which is helpful for the object under test, such as the amount of current required for the simultaneous switching of various signals in an integrated circuit (IC), so that the test product can have stable test results, and also help Improvement of power integration (PI). In another embodiment of the present invention, the signal and power integrity module may include a signal and power integrity module 23a and a signal and power integrity module 23b, but the present invention is not limited thereto. In the embodiment of the present invention, the electronic component 238d is, for example, a capacitor structure. In an embodiment of the present invention, the electronic component 238d is, for example, a memory or an integrated circuit (IC). Since the current path T3 is shortened, the memory or the integrated circuit can transmit a current or a signal at a short distance, which can improve the test. effectiveness. The test information stored in the memory can effectively improve the signal distortion problem because the test path is shortened.

In summary, since the signal and power integrity module 23 of the embodiment of the present invention is integrated in the integrated circuit test socket 20, and at least one pair of conductors 241 penetrate the first conductive adhesive layer 21 and the second conductive adhesive layer 22, respectively. The electrical contact with the signal and power integrity module 23 makes the current path T3 provided by the signal and power integrity module 23 to be shortened, which enables the test of the object 13 to be tested. At this time, the current can be obtained at a short distance, which is helpful for the DUT 13 with complex functions, such as the amount of current required for the simultaneous switching of various signals in an integrated circuit (IC), so that the test product can have stable test results. .

Although the present invention has been disclosed in a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. The scope of protection shall be determined by the scope of the attached patent application.

Claims (16)

An integrated circuit test stand for integrating signal and power integrity modules, comprising: a first conductive adhesive layer; a second conductive adhesive layer opposite to the first conductive adhesive layer; a conductor module including at least one A pair of conductors; and a signal and power integrity module disposed between the first conductive adhesive layer and the second conductive adhesive layer, the at least one pair of conductors penetrating the first conductive adhesive layer and the second conductive adhesive, respectively Layer and electrically contact the signal and power integrity module, the signal and power integrity module includes a board and a conductor module, wherein the conductor module includes at least one grounded conductor unit and a signal The conductor unit, or the conductor module includes a power conductor unit. According to the integrated circuit test stand described in item 1 of the scope of patent application, wherein the signal and power integrity module includes a capacitor module, the capacitor module includes a capacitor plate and are disposed on opposite upper surfaces of the capacitor plate, respectively. And two first conductive contacts on the lower surface. According to the integrated circuit test stand described in item 2 of the scope of patent application, wherein the at least one pair of conductors are in electrical contact with the two first conductive contacts, respectively. According to the integrated circuit test stand described in item 1 of the scope of patent application, the at least one grounded conductor unit includes two grounded conductor units, and the signal conductor unit is disposed between the two grounded conductor units. According to the integrated circuit test stand described in item 1 of the scope of patent application, wherein the signal conductor unit and the at least one grounded conductor unit form a coaxial structure. According to the integrated circuit test stand described in item 1 of the scope of patent application, the grounded conductor unit includes a grounded conductor and two grounded conductive contacts, and the two grounded conductive contacts are respectively disposed on opposite upper surfaces of the board. And the lower surface, the grounded conductor penetrates the board and is in electrical contact with the two grounded conductive contacts. According to the integrated circuit test stand described in item 1 of the scope of patent application, the signal conductor unit includes a signal conductor and two signal conductive contacts, and the two signal conductive contacts are respectively disposed on opposite upper surfaces of the board And the lower surface, the signal conductor penetrates the board and is in electrical contact with the two signal conductive contacts. According to the integrated circuit test stand described in item 1 of the patent application scope, the power conductor unit includes a power conductor and an electronic component integrated in the board. According to the integrated circuit test stand described in item 8 of the scope of patent application, wherein the electronic component is a capacitor structure, a memory or an integrated circuit. According to the integrated circuit test stand described in item 8 of the scope of the patent application, the power supply conductor unit further includes a first power supply conductive contact and a second power supply conductive contact, which are respectively disposed on opposite upper surfaces of the board. And the lower surface, the power source conductor penetrates the board and is in electrical contact with the first power source conductive contact and the second power source conductive contact, and the electronic component is in electrical contact with the first power source conductive contact. According to the integrated circuit test stand described in item 10 of the scope of patent application, the width of the conductive contact of the first power source is greater than the width of the conductive contact of the second power source. According to the integrated circuit test stand described in item 1 of the scope of patent application, the conductor module further includes a plurality of conductive contacts disposed on opposite upper and lower surfaces of the first conductive adhesive layer and the second conductive adhesive. The opposite upper and lower surfaces of the layer. According to the integrated circuit test stand described in item 12 of the scope of the patent application, each of the conductive contacts includes a conductive layer and at least one conductive structure disposed on the conductive layer. According to the integrated circuit test stand described in item 13 of the scope of the patent application, the conductive structure is selected from the group consisting of a triangular column conductive structure or a trapezoidal column conductive structure. The integrated circuit test base described in item 1 of the scope of patent application, further includes a needle base disposed on the first conductive adhesive layer and the second conductive adhesive layer. According to the integrated circuit test socket described in item 1 of the scope of the patent application, it further includes a first locking element and a second locking element, wherein the first locking element passes through the second conductive adhesive layer and the pin base. A second fastener passes through the second conductive adhesive layer, the signal and power integrity module, the first conductive adhesive layer, and the pin base.