TWI580570B - Laminated film - Google Patents

Laminated film Download PDF

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TWI580570B
TWI580570B TW102134436A TW102134436A TWI580570B TW I580570 B TWI580570 B TW I580570B TW 102134436 A TW102134436 A TW 102134436A TW 102134436 A TW102134436 A TW 102134436A TW I580570 B TWI580570 B TW I580570B
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layer
resin
film
laminated film
less
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TW102134436A
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TW201422428A (en
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Mitsutaka Sakamoto
Isao Manabe
Kozo Takahashi
Yasushi Takada
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Toray Industries
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/32Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/325Layered products comprising a layer of synthetic resin comprising polyolefins comprising polycycloolefins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/32Layered products comprising a layer of synthetic resin comprising polyolefins

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  • Laminated Bodies (AREA)
  • Wrappers (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Decoration By Transfer Pictures (AREA)

Description

積層薄膜 Laminate film

本發明係有關於一種積層薄膜,係有關於一種構成為在以環狀烯烴系樹脂為主成分之A層的至少單面具有以聚丙烯系樹脂及/或聚乙烯系樹脂為主成分之B層,從而成型性、脫模性、加工適性及水蒸氣阻隔性、熱封性優良之積層薄膜。 The present invention relates to a laminated film comprising a polypropylene resin and/or a polyethylene resin as a main component on at least one side of an A layer containing a cyclic olefin resin as a main component. The layer is a laminated film excellent in moldability, mold release property, processability, water vapor barrier property, and heat sealability.

近來,為了對成型構件賦予刮痕抗性或耐候性、色澤、圖樣,或者對電路構件賦予感光性樹脂或電磁波遮蔽性,將功能性樹脂轉印至各種構件之手法擴大,供滿足此等要求特性之功能性樹脂轉印薄膜的開發亦持續進展。 Recently, in order to impart scratch resistance, weather resistance, color, pattern, or imparting photosensitive resin or electromagnetic shielding to a circuit member, the method of transferring a functional resin to various members has been expanded to meet such requirements. The development of functional functional resin transfer films has continued to progress.

舉例而言,在建材、汽車零件或行動電話、電機製品等的用途中,由於環保意識的高漲,無溶劑塗裝、鍍敷替代方案等的要求提高,就使用薄膜之裝飾方法而言,已有人提出使用環狀烯烴系樹脂之薄膜相關的提案(例如專利文獻1、2)。 For example, in the use of building materials, automobile parts, mobile phones, and motor products, the demand for solvent-free coating and plating alternatives has increased due to the increase in environmental awareness, and the use of film decoration methods has been Proposals related to the use of a film of a cyclic olefin resin have been proposed (for example, Patent Documents 1 and 2).

此外,就可撓性印刷配線板(以下稱為「FPC」)等的電路構件而言,在小型化、高機能化急速進展的行動電話、攝影機、筆記型電腦等的電子機器中,係大量用於在複雜的機構中裝入電路。於此等電子機器中,當 FPC接受產生自其他的零件或機器的電磁波時,便發生電路的破壞或誤動作等,而有產生影像的紊亂或雜訊之情況,因此,FPC便需有可阻斷源自外部之電磁波,即所謂的「電磁波遮蔽性」;具電磁波遮蔽性之遮蔽性可撓性印刷配線板(以下稱為遮蔽性FPC)經廣泛地被使用。 In addition, a large number of electronic components such as mobile phones, video cameras, and notebook computers that are rapidly becoming smaller and higher in performance are widely used in circuit boards such as flexible printed wiring boards (hereinafter referred to as "FPC"). Used to load circuits in complex mechanisms. In such electronic machines, when When the FPC receives electromagnetic waves generated from other parts or machines, the circuit may be damaged or malfunctioned, and there may be a disorder or noise of the image. Therefore, the FPC needs to block electromagnetic waves originating from the outside, that is, The "electromagnetic wave shielding property" and the shielding flexible printed wiring board (hereinafter referred to as shielding FPC) having electromagnetic shielding properties are widely used.

作為此種用以在電路構件轉印功能性樹脂之 薄膜,已有使用雙軸拉伸聚酯薄膜之提案(例如參照專利文獻3)、或使用環狀烯烴系薄膜之提案(例如參照專利文獻4、5)。 As such a function for transferring a functional resin to a circuit member The film has been proposed to use a biaxially stretched polyester film (for example, refer to Patent Document 3) or a proposal to use a cyclic olefin-based film (see, for example, Patent Documents 4 and 5).

另一方面,在鋰離子電池之外裝用薄膜或食 品包裝用薄膜、醫療用包裝薄膜的各種包裝用薄膜中,為了兼備水蒸氣阻隔性、氧氣阻隔性、彎撓性、熱封性、耐溶劑性、耐電解液性等,乃貼合聚乙烯系薄膜、聚丙烯系薄膜、金屬箔或者金屬蒸鍍層、尼龍薄膜、聚酯薄膜等,俾兼備各要求特性。水蒸氣阻隔性等主要可利用金屬箔或者金屬蒸鍍層來賦予,但在將薄膜作成袋狀並熱封的情況下,就薄膜表面而言雖可藉由金屬箔或者金屬蒸鍍層而獲得水蒸氣阻隔性,惟袋體端部之熱封層未能由金屬箔或者金屬蒸鍍層保護,從而有水蒸氣從端部滲入等問題。因此,熱封層自身亦要求水蒸氣阻隔性。 On the other hand, a film or food is placed outside the lithium ion battery. A film for packaging, such as a film for packaging and a packaging film for medical use, which is compatible with water vapor barrier properties, oxygen barrier properties, bending flexibility, heat sealability, solvent resistance, and electrolyte resistance. It is a film, a polypropylene film, a metal foil or a metal vapor-deposited layer, a nylon film, a polyester film, etc., and has various required characteristics. The water vapor barrier property and the like can be mainly imparted by a metal foil or a metal deposition layer. However, when the film is formed into a bag shape and heat-sealed, water vapor can be obtained by a metal foil or a metal deposition layer on the surface of the film. Barrier property, but the heat seal layer at the end of the bag body is not protected by the metal foil or the metal vapor deposition layer, so that there is a problem that water vapor permeates from the end portion. Therefore, the heat seal layer itself also requires water vapor barrier properties.

先前技術文獻 Prior technical literature 專利文獻 Patent literature

專利文獻1 日本特開2012-206299號公報 Patent Document 1 Japanese Patent Laid-Open Publication No. 2012-206299

專利文獻2 日本特開2013-043396號公報 Patent Document 2 Japanese Patent Laid-Open Publication No. 2013-043396

專利文獻3 日本特開2002-252458號公報 Patent Document 3 Japanese Patent Laid-Open Publication No. 2002-252458

專利文獻4 日本特開2006-257399號公報 Patent Document 4 Japanese Patent Laid-Open Publication No. 2006-257399

專利文獻5 日本特開2009-040982號公報 Patent Document 5 Japanese Patent Laid-Open Publication No. 2009-040982

專利文獻1、2記載之薄膜其在表層不具有以聚丙烯系樹脂及/或聚乙烯系樹脂為主成分的層,依據功能性樹脂層之組成,有時脫模性不充分。 The film described in Patent Documents 1 and 2 does not have a layer containing a polypropylene resin and/or a polyethylene resin as a main component in the surface layer, and the mold release property may be insufficient depending on the composition of the functional resin layer.

專利文獻3記載之薄膜其加工適性雖良好,但對於深拉成型構件(即成型倍率加大之類的成型構件)、或者高段差之電路構件,成型性不充分。專利文獻4記載之薄膜,其構成薄膜表面的層係以環狀烯烴系樹脂為主成分,依據功能性樹脂層之種類,脫模性不充分。又,對於向使用玻璃轉移溫度較高之樹脂、耐熱溫度低且成型溫度未充分提升的樹脂構件之轉印、或高段差之電路構件,有時成型性不充分。就專利文獻5記載之薄膜而言,構成薄膜表面的層亦以環狀烯烴系樹脂為主成分,且依據功能性樹脂層之種類,脫模性亦不充分。 Although the film described in Patent Document 3 has good processing suitability, the moldability is insufficient for a deep-drawn molded member (that is, a molded member having a large molding magnification) or a circuit member having a high step. In the film described in Patent Document 4, the layer constituting the surface of the film contains a cyclic olefin resin as a main component, and the mold release property is insufficient depending on the type of the functional resin layer. Further, in the case of using a resin having a high glass transition temperature, a transfer of a resin member having a low heat-resistant temperature and a sufficiently insufficient molding temperature, or a circuit member having a high step, the moldability may be insufficient. In the film described in Patent Document 5, the layer constituting the surface of the film also contains a cyclic olefin resin as a main component, and the mold release property is also insufficient depending on the type of the functional resin layer.

因此,本發明之課題在於解決上述之問題點。亦即,課題在於提供一種作為供轉印功能性樹脂層之薄膜使用時,成型性、脫模性、加工適性良好的積層薄膜及作為各種包裝用薄膜使用時,水蒸氣阻隔性、熱封性良好的積層薄膜。 Therefore, an object of the present invention is to solve the above problems. In other words, when the film is used as a film for transferring a functional resin layer, it is a laminate film having good moldability, mold release property, and processability, and water vapor barrier properties and heat sealability when used as a film for various packagings. Good laminated film.

供解決上述課題之本發明係具有以下構成: The present invention for solving the above problems has the following constitution:

(1)一種積層薄膜,其係在以環狀烯烴系樹脂為主成分之A層的至少單面具有以聚丙烯系樹脂及/或聚乙烯系樹脂為主成分之B層。 (1) A laminated film having a B layer mainly composed of a polypropylene resin and/or a polyethylene resin as a main component of the A layer containing a cyclic olefin resin as a main component.

(2)如(1)之積層薄膜,其在前述A層的兩面具有B層。 (2) The laminated film according to (1), which has a B layer on both sides of the layer A.

(3)如(1)或(2)之積層薄膜,其中前述A層之玻璃轉移溫度為130℃以上150℃以下。 (3) The laminated film according to (1) or (2), wherein the glass transition temperature of the layer A is 130 ° C or more and 150 ° C or less.

(4)如(1)至(3)中任一項之積層薄膜,其中前述A層在設A層之總成分的合計為100質量%時,含有15質量%以上40質量%以下之乙烯系共聚合樹脂。 (4) The laminated film according to any one of (1) to (3), wherein the A layer contains 15% by mass or more and 40% by mass or less of ethylene based on 100% by mass of the total of the total components of the A layer. Copolymerized resin.

(5)如(1)至(4)中任一項之積層薄膜,其120℃之儲存彈性模數為101MPa以上3,000MPa以下、170℃之儲存彈性模數為100MPa以下。 (5) The laminated film according to any one of (1) to (4), wherein the storage elastic modulus at 120 ° C is 101 MPa or more and 3,000 MPa or less, and the storage elastic modulus at 170 ° C is 100 MPa or less.

(6)如(1)至(5)中任一項之積層薄膜,其中前述B層之表面自由能為25mN/m以上35mN/m以下。 (6) The laminated film according to any one of (1) to (5) wherein the surface layer free energy of the layer B is 25 mN/m or more and 35 mN/m or less.

(7)如(1)至(6)中任一項之積層薄膜,其中前述B層係以聚丙烯系樹脂為主成分,並進一步含有石油樹脂。 (7) The laminated film according to any one of (1) to (6) wherein the B layer is mainly composed of a polypropylene resin and further contains a petroleum resin.

(8)如(1)至(6)中任一項之積層薄膜,其中前述B層係以聚乙烯系樹脂為主成分,該聚乙烯系樹脂係直鏈狀低密度聚乙烯或高密度聚乙烯。 (8) The laminated film according to any one of (1) to (6) wherein the B layer is mainly composed of a polyethylene resin which is a linear low density polyethylene or a high density poly Ethylene.

(9)如(1)至(8)中任一項之積層薄膜,其兩面之表面粗糙度SRa為50nm以上3,000nm以下。 (9) The laminated film according to any one of (1) to (8), wherein the surface roughness SRa of both surfaces is 50 nm or more and 3,000 nm or less.

(10)如(1)至(9)中任一項之積層薄膜,其霧度為65%以上90%以下。 (10) The laminated film according to any one of (1) to (9), which has a haze of 65% or more and 90% or less.

(11)如(1)至(10)中任一項之積層薄膜,其色調L值為75以上100以下。 (11) The laminated film according to any one of (1) to (10), wherein the color tone L value is 75 or more and 100 or less.

(12)如(1)至(11)中任一項之積層薄膜,其積層比(B層之合計厚度(μm)/A層之厚度(μm))為0.1以上0.15以下、薄膜之總厚度為40μm以上300μm以下。 (12) The laminated film according to any one of (1) to (11), wherein a laminate ratio (total thickness (μm) of layer B/thickness (μm) of layer A) is 0.1 or more and 0.15 or less, and total thickness of film It is 40 μm or more and 300 μm or less.

(13)如(1)至(11)中任一項之積層薄膜,其積層比(B層之合計厚度(μm)/A層之厚度(μm))為0.25以上2以下、薄膜之總厚度為40μm以上300μm以下。 (13) The laminated film according to any one of (1) to (11), wherein a laminate ratio (total thickness (μm) of layer B/thickness (μm) of layer A) is 0.25 or more and 2 or less, total thickness of film It is 40 μm or more and 300 μm or less.

(14)一種功能性樹脂層轉印薄膜,其具有如(1)至(13)中任一項之積層薄膜及功能性樹脂層。 (14) A functional resin layer transfer film having the laminated film according to any one of (1) to (13) and a functional resin layer.

(15)一種包裝用薄膜,其具有如(1)至(13)中任一項之積層薄膜。 (15) A film for packaging having the laminated film according to any one of (1) to (13).

本發明由於其(特別是藉由構成為在以環狀烯烴系樹脂為主成分之A層的至少單面具有以聚丙烯系樹脂及/或聚乙烯系樹脂為主成分之B層)成型性、脫模性、加工適性及水蒸氣阻隔性、熱封性優良,可適用於建材、汽車零件或行動電話、電機製品、遊戲機零件等的成型構件之裝飾用薄膜、或者像電路構件之電磁波遮蔽層轉印薄膜或各種包裝薄膜。 In the present invention, (particularly, a layer B having a polypropylene resin and/or a polyethylene resin as a main component in at least one side of the layer A having a cyclic olefin resin as a main component) is formed. It is excellent in mold release property, processing suitability, water vapor barrier property, and heat sealability, and can be applied to decorative films for building materials, automobile parts, or molded parts of mobile phones, motor products, game machine parts, etc., or electromagnetic waves like circuit components. Masking layer transfer film or various packaging films.

[實施發明之形態] [Formation of the Invention]

本發明其構成為在以環狀烯烴系樹脂為主成分之A層的至少單面具有以聚丙烯系樹脂及/或聚乙烯系樹脂為主成分之B層。以下,就本發明之積層薄膜具體加以說明。 In the present invention, the B layer having a polypropylene resin and/or a polyethylene resin as a main component is provided on at least one side of the A layer containing the cyclic olefin resin as a main component. Hereinafter, the laminated film of the present invention will be specifically described.

(A層) (A layer)

就本發明之積層薄膜,基於加工適性、成型性觀點,重要的是具有A層。此處A層係指以環狀烯烴系樹脂為主成分的層。而且此處所稱「主成分」,係指設A層之總成分的合計為100質量%時,含有超過50質量%且為100質量%以下之環狀烯烴系樹脂。就A層所含之環狀烯烴系樹脂,較佳為設A層之總成分的合計為100質量%時,含有70質量%以上100質量%以下之形態,若為含有80質量%以上100質量%以下之形態則更佳,若為含有90質量%以上100質量%以下之形態則特佳。且,A層係以環狀烯烴系樹脂為主成分,惟A層縱使僅由環狀烯烴系樹脂所構成,亦可含有其他的烯烴系樹脂,又可含有烯烴系樹脂以外之樹脂。此外,基於維持加工步驟中的尺寸穩定性同時抑制成型時的微細裂隙之觀點等,若為設A層之總成分的合計為100質量%時,含有15質量%以上40質量%以下之後述乙烯系共聚合樹脂之形態,則較佳為以A層之總成分的合計計,含有超過60質量%且為85質量%以下之A層所含之環狀烯烴系樹脂之形態。 In the laminated film of the present invention, it is important to have the A layer from the viewpoint of workability and moldability. Here, the layer A refers to a layer mainly composed of a cyclic olefin resin. In addition, the term "main component" as used herein means a cyclic olefin-based resin containing more than 50% by mass and not more than 100% by mass when the total amount of the total components of the layer A is 100% by mass. When the total amount of the total components of the layer A is 100% by mass, the content of the cyclic olefin resin contained in the layer A is preferably 70% by mass or more and 100% by mass or less, and 80% by mass or more and 100% by mass. The form of % or less is more preferable, and it is especially preferable if it is 90% by mass or more and 100% by mass or less. Further, the layer A is mainly composed of a cyclic olefin resin, but the layer A may be composed of only a cyclic olefin resin, and may contain other olefin resins or a resin other than the olefin resin. In addition, when the total amount of the total components of the layer A is 100% by mass, the ethylene content is 15% by mass or more and 40% by mass or less, based on the viewpoint of maintaining the dimensional stability during the processing step and suppressing the fine cracks during the molding. The form of the copolymerized resin is preferably a form of a cyclic olefin-based resin contained in the A layer of more than 60% by mass and not more than 85% by mass based on the total of the total components of the layer A.

藉由使A層之主成分為環狀烯烴系樹脂,可改良積層薄膜之加工適性、成型性。 By making the main component of the layer A a cyclic olefin resin, the processability and moldability of the laminated film can be improved.

於此,「環狀烯烴系樹脂」係指在由作為單體之環狀烯烴聚合所得之聚合物的主鏈上具有脂環結構之樹脂。 Here, the "cyclic olefin resin" means a resin having an alicyclic structure in a main chain of a polymer obtained by polymerizing a cyclic olefin as a monomer.

又,本發明之環狀烯烴系樹脂係指藉由聚合環狀烯烴單體等所得之樹脂,意指在100質量%之該環狀烯烴系樹脂的聚合物中,源自環狀烯烴單體之成分的合計量超過50質量%且為100質量%以下之形態的聚合物。 In addition, the cyclic olefin resin of the present invention is a resin obtained by polymerizing a cyclic olefin monomer or the like, and means that it is derived from a cyclic olefin monomer in 100% by mass of the polymer of the cyclic olefin resin. The polymer in a form in which the total amount of the components exceeds 50% by mass and is 100% by mass or less.

作為環狀烯烴單體,可列舉環丁烯、環戊烯、環庚烯、環辛烯、環戊二烯、1,3-環己二烯等單環式烯烴;雙環[2,2,1]庚-2-烯、5-甲基-雙環[2,2,1]庚-2-烯、5,5-二甲基-雙環[2,2,1]庚-2-烯、5-乙基-雙環[2,2,1]庚-2-烯、5-丁基-雙環[2,2,1]庚-2-烯、5-亞乙基-雙環[2,2,1]庚-2-烯、5-己基-雙環[2,2,1]庚-2-烯、5-辛基-雙環[2,2,1]庚-2-烯、5-十八基-雙環[2,2,1]庚-2-烯、5-亞甲基-雙環[2,2,1]庚-2-烯、5-乙烯基-雙環[2,2,1]庚-2-烯、5-丙烯基-雙環[2,2,1]庚-2-烯等二環式烯烴;三環[4,3,0,12.5]癸-3,7-二烯、三環[4,3,0,12.5]癸-3-烯、三環[4,3,0,12.5]十一碳-3,7-二烯、三環[4,3,0,12.5]十一碳-3,8-二烯、三環[4,3,0,12.5]十一碳-3-烯、5-環戊基-雙環[2,2,1]庚-2-烯、5-環己基-雙環[2,2,1]庚-2-烯、5-環己烯基雙環[2,2,1]庚-2-烯、5-苯基-雙環[2,2,1]庚-2-烯等三環式烯烴; 四環[4,4,0,12.5,17.10]十二碳-3-烯、8-甲基四環[4,4,0,12.5,17.10]十二碳-3-烯、8-乙基四環[4,4,0,12.5,17.10]十二碳-3-烯、8-亞甲基四環[4,4,0,12.5,17.10]十二碳-3-烯、8-亞乙基四環[4,4,0,12.5,17.10]十二碳-3-烯、8-乙烯基四環[4,4,0,12.5,17.10]十二碳-3-烯、8-丙烯基-四環[4,4,0,12.5,17.10]十二碳-3-烯等四環式烯烴;及8-環戊基-四環[4,4,0,12.5,17.10]十二碳-3-烯、8-環己基-四環[4,4,0,12.5,17.10]十二碳-3-烯、8-環己烯基-四環[4,4,0,12.5,17.10]十二碳-3-烯、8-苯基-環戊基-四環[4,4,0,12.5,17.10]十二碳-3-烯、四環[7,4,13.6,01.9,02.7]十四碳-4,9,11,13-四烯、四環[8,4,14.7,01.10,03.8]十五碳-5,10,12,14-四烯、五環[6,6,13.6,02.7,09.14]-4-十六烯、五環[6,5,1,13.6,02.7,09.13]-4-十五烯、五環[7,4,0,02.7,13.6,110.13]-4-十五烯、七環[8,7,0,12.9,14.7,111.17,03.8,012.16]-5-二十烯、七環[8,7,0,12.9,03.8,14.7,012.17,113.16]-14-二十烯、環戊二烯等四聚體等的多環式烯烴等。此等環狀烯烴單體可分別單獨使用或者組合2種以上使用。 Examples of the cyclic olefin monomer include monocyclic olefins such as cyclobutene, cyclopentene, cycloheptene, cyclooctene, cyclopentadiene, and 1,3-cyclohexadiene; bicyclo [2, 2, 1]hept-2-ene, 5-methyl-bicyclo[2,2,1]hept-2-ene, 5,5-dimethyl-bicyclo[2,2,1]hept-2-ene, 5 -ethyl-bicyclo[2,2,1]hept-2-ene, 5-butyl-bicyclo[2,2,1]hept-2-ene, 5-ethylene-bicyclo[2,2,1 Hept-2-ene, 5-hexyl-bicyclo[2,2,1]hept-2-ene, 5-octyl-bicyclo[2,2,1]hept-2-ene, 5-octadecyl- Bicyclo[2,2,1]hept-2-ene, 5-methylene-bicyclo[2,2,1]hept-2-ene, 5-vinyl-bicyclo[2,2,1]hept-2 a dicyclic olefin such as a olefin, 5-propenyl-bicyclo[2,2,1]hept-2-ene; a tricyclo[4,3,0,1 2.5 ]indole-3,7-diene, tricyclic ring [4,3,0,1 2.5 ]癸-3-ene, tricyclo[4,3,0,1 2.5 ]undec-3,7-diene, tricyclo[4,3,0,1 2.5 11-carbon-3,8-diene, tricyclo[4,3,0,1 2.5 ]undec-3-ene, 5-cyclopentyl-bicyclo[2,2,1]heptan-2- Alkene, 5-cyclohexyl-bicyclo[2,2,1]hept-2-ene, 5-cyclohexenylbicyclo[2,2,1]hept-2-ene, 5-phenyl-bicyclo[2, 2,1] a tricyclic olefin such as hept-2-ene; tetracyclo[4,4,0,1 2.5 ,1 7.10 ]dodeca-3-ene, 8-methyltetracyclo[4,4,0 ,1 2.5, 1 7.10] dodeca-3-ene, 8-ethyl tetracyclo [4,4,0,1 2.5, 1 7.10] dodeca-3-ene, 8-Methylene-tetracyclo [4, 4,0,1 2.5 ,1 7.10 ]dodec-3-ene, 8-ethylenetetracyclo[4,4,0,1 2.5 ,1 7.10 ]dodec-3-ene, 8-vinyl Tetracyclo[4,4,0,1 2.5 ,1 7.10 ]dodec-3-ene, 8-propenyl-tetracyclo[4,4,0,1 2.5 ,1 7.10 ]dodeca-3-ene a tetracyclic olefin; and 8-cyclopentyl-tetracyclo[4,4,0,1 2.5 ,1 7.10 ]dodec-3-ene, 8-cyclohexyl-tetracyclo[4,4,0, 1 2.5 ,1 7.10 ]dodec-3-ene, 8-cyclohexenyl-tetracyclo[4,4,0,1 2.5 ,1 7.10 ]dodec-3-ene, 8-phenyl-ring Amyl-tetracyclo[4,4,0,1 2.5 ,1 7.10 ]dodec-3-ene, tetracyclo[7,4,1 3.6 ,0 1.9 ,0 2.7 ]tetradec-4,9, 11,13-tetraene, tetracyclo[8,4,1 4.7 ,0 1.10 ,0 3.8 ] fifteen carbon-5,10,12,14-tetraene, pentacyclo[6,6,1 3.6 ,0 2.7 , 0 9.14 ]-4-hexadecene, pentacyclo[6,5,1,1 3.6 ,0 2.7 ,0 9.13 ]-4-pentadecene, pentacyclo[7,4,0,0 2.7 ,1 3.6 ,1 10.13 ]-4-pentadecenyl, hepta[8,7,0,1 2.9 ,1 4.7 ,1 11.17 ,0 3.8 ,0 12.16 ]-5-hexadecene, hepta[8,7,0 1 2.9 0 3.8 1 4.7 0 12.17, 1 13.16] -14- eicosene, cyclopentadiene Tetramer like polycyclic olefins. These cyclic olefin monomers may be used alone or in combination of two or more.

作為環狀烯烴單體,在上述當中,基於生產性、表面性觀點,較佳使用雙環[2,2,1]庚-2-烯(以下稱為降莰烯)、三環[4,3,0,12.5]癸-3-烯等碳數10之三環式烯烴(以下稱為三環癸烯)、四環[4,4,0,12.5,17.10]十二碳-3-烯等碳數12之四環式烯烴(以下稱為四環十二烯)、環戊二烯或1,3-環己二烯。 Among the above, among the above, from the viewpoint of productivity and surface properties, bicyclo[2,2,1]hept-2-ene (hereinafter referred to as norbornene) and tricyclo[4,3 are preferably used. , 0,12.5] anthracene-3-ene and other carbon tricyclic olefins (hereinafter referred to as tricyclodecene), tetracyclo[4,4,0,12.5,17.10]dodec-3-ene, etc. A tetracyclic olefin having a carbon number of 12 (hereinafter referred to as tetracyclododecene), cyclopentadiene or 1,3-cyclohexadiene.

在100質量%之環狀烯烴系樹脂的聚合物中,環狀烯烴系樹脂其源自環狀烯烴單體之成分的合計 只要超過50質量%且為100質量%以下,亦可為僅聚合上述環狀烯烴單體而成之樹脂(以下有稱為COP)、或共聚合上述環狀烯烴單體與鏈狀烯烴單體而成之樹脂(以下有稱為COC)的任一種樹脂。 In the polymer of the cyclic olefin resin of 100% by mass, the cyclic olefin resin is derived from the total of the components of the cyclic olefin monomer. When it exceeds 50% by mass and is 100% by mass or less, it may be a resin obtained by polymerizing only the above cyclic olefin monomer (hereinafter referred to as COP), or copolymerizing the above cyclic olefin monomer and a chain olefin monomer. Any of the resins (hereinafter referred to as COC).

作為COP之製造方法,可舉出環狀烯烴單 體之加成聚合、或者開環聚合等的周知方法,可列舉例如使降莰烯、三環癸烯、四環癸烯及其衍生物進行開環複分解聚合後予以氫化之方法、使降莰烯及其衍生物進行加成聚合之方法、使環戊二烯、環己二烯進行1,2-、1,4-加成聚合後予以氫化之方法等。此等當中,基於生產性、成型性觀點,最佳為使降莰烯、三環癸烯、四環癸烯及其衍生物進行開環複分解聚合後予以氫化所得之樹脂。 As a manufacturing method of COP, a cyclic olefin single A known method such as addition polymerization or ring-opening polymerization of a body, for example, a method in which a norbornene, a tricyclodecene, a tetracyclic terpene, and a derivative thereof are subjected to ring-opening metathesis polymerization and hydrogenation, and a method of hydrogenating A method in which an alkene or a derivative thereof is subjected to addition polymerization, a method in which cyclopentadiene or cyclohexadiene is subjected to 1,2-, 1,4-addition polymerization, followed by hydrogenation. Among these, from the viewpoint of productivity and moldability, a resin obtained by subjecting norbornene, tricyclodecene, tetracyclononene, and a derivative thereof to ring-opening metathesis polymerization and hydrogenating is preferably used.

若為COC時,作為較佳之鏈狀烯烴單體, 可列舉乙烯、丙烯、1-丁烯、1-戊烯、1-己烯、3-甲基-1-丁烯、3-甲基-1-戊烯、3-乙基-1-戊烯、4-甲基-1-戊烯、4-甲基-1-己烯、4,4-二甲基-1-己烯、4,4-二甲基-1-戊烯、4-乙基-1-己烯、3-乙基-1-己烯、1-辛烯、1-癸烯、1-十二烯、1-十四烯、1-十六烯、1-十八烯、1-二十烯等。此等當中,基於生產性、成本觀點,可特佳使用乙烯。又作為共聚合環狀烯烴單體與鏈狀烯烴單體而成之樹脂之製造方法,可舉出環狀烯烴單體與鏈狀烯烴單體之加成聚合等的周知方法,可列舉例如使降莰烯及其衍生物與乙烯進行加成聚合之方法等。其中,基於生產性、成型性觀點,最佳為降莰烯與乙烯之共聚物。 In the case of COC, as a preferred chain olefin monomer, Ethylene, propylene, 1-butene, 1-pentene, 1-hexene, 3-methyl-1-butene, 3-methyl-1-pentene, 3-ethyl-1-pentene , 4-methyl-1-pentene, 4-methyl-1-hexene, 4,4-dimethyl-1-hexene, 4,4-dimethyl-1-pentene, 4-B 1-hexene, 3-ethyl-1-hexene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene , 1-hexene and the like. Among these, ethylene is particularly preferred from the viewpoint of productivity and cost. Further, as a method for producing a resin obtained by copolymerizing a cyclic olefin monomer and a chain olefin monomer, a known method such as addition polymerization of a cyclic olefin monomer and a chain olefin monomer may be mentioned, and for example, A method of addition polymerization of norbornene and its derivatives with ethylene. Among them, from the viewpoint of productivity and moldability, a copolymer of norbornene and ethylene is preferred.

可使本發明之積層薄膜之A層含有COC、 COP的任一種,若設A層之總成分的合計為100質量%時,COC及COP的合計量只要超過50質量%且為100質量%以下,亦可含有COC與COP兩者。惟,基於原料片之生產性觀點,A層較佳以COC為主成分;基於薄膜品質觀點,則A層較佳以COP為主成分。又基於A層與B層間之層間密接性觀點,若後述之B層以聚乙烯系樹脂為主成分時,A層較佳以COC為主成分;若B層以聚丙烯系樹脂為主成分時,則A層較佳以COP為主成分。 The layer A of the laminated film of the present invention can contain COC, When the total amount of the total components of the layer A is 100% by mass, the total amount of COC and COP may be more than 50% by mass and 100% by mass or less, and both COC and COP may be contained. However, based on the productivity of the raw material sheet, the A layer is preferably composed mainly of COC; and based on the film quality, the A layer is preferably composed mainly of COP. Further, based on the adhesion between the layers of the layer A and the layer B, when the layer B to be described later is mainly composed of a polyethylene resin, the layer A is preferably composed mainly of COC; and the layer of layer B is mainly composed of a polypropylene resin. The layer A is preferably composed mainly of COP.

如前述,A層亦可含有其他的烯烴系樹脂, 作為環狀烯烴系樹脂以外之烯烴系樹脂,可使用例如高密度聚乙烯、中密度聚乙烯、低密度聚乙烯、直鏈狀中密度聚乙烯、直鏈狀低密度聚乙烯、金屬芳香類低密度聚乙烯、金屬芳香類直鏈狀低密度聚乙烯、金屬芳香類中.高密度聚乙烯等各種聚乙烯系樹脂、聚丙烯、乙烯-丙烯共聚物、乙烯-丙烯-丁烯共聚物、丙烯-丁烯共聚物等各種聚丙烯系樹脂(就乙烯-丙烯共聚物、乙烯-丙烯-丁烯共聚物、丙烯-丁烯共聚物而言,可為隨機共聚物、嵌段共聚物的任一種)、甲基戊烯聚合物等的聚烯烴系樹脂。 As mentioned above, the layer A may also contain other olefin-based resins. As the olefin-based resin other than the cyclic olefin-based resin, for example, high-density polyethylene, medium-density polyethylene, low-density polyethylene, linear medium-density polyethylene, linear low-density polyethylene, and metal aromatics can be used. Density polyethylene, metal aromatic linear low density polyethylene, metal aromatics. Various polypropylene resins such as high-density polyethylene, polypropylene, ethylene-propylene copolymer, ethylene-propylene-butene copolymer, propylene-butene copolymer, etc. (for ethylene-propylene copolymer, ethylene) A propylene-butene copolymer or a propylene-butene copolymer may be a polyolefin resin such as a random copolymer or a block copolymer, or a methylpentene polymer.

此外,亦可使用包含乙烯、丙烯、1-丁烯、 1-戊烯、4-甲基-1-戊烯、1-己烯、1-辛烯等鏈狀烯烴單體之聚合物、包含該鏈狀烯烴單體之隨機共聚物、包含該鏈狀烯烴單體之嵌段共聚物等。 In addition, it can also be used to contain ethylene, propylene, 1-butene, a polymer of a chain olefin monomer such as 1-pentene, 4-methyl-1-pentene, 1-hexene or 1-octene; a random copolymer comprising the chain olefin monomer, comprising the chain A block copolymer of an olefin monomer or the like.

其中,基於與環狀烯烴系樹脂的相溶性之觀 點、與B層的層間密接性之觀點,作為適於A層之環狀烯烴系樹脂以外之烯烴系樹脂,較佳使用各種聚乙烯系樹脂、各種聚丙烯系樹脂。 Among them, based on the compatibility with the cyclic olefin resin From the viewpoint of the adhesion between the layers and the layer B, it is preferable to use various polyethylene resins and various polypropylene resins as the olefin resin other than the cyclic olefin resin suitable for the A layer.

於此,關於本發明中使用之各種聚乙烯系樹 脂,「直鏈狀」係指主要採低壓法所製造之聚合物的主鏈呈直鏈之狀態,只要為在高壓下藉自由基聚合所製造之高壓法低密度聚乙烯之類的長短的多數分支結構,亦可為包含分支之形態。且,「低密度」係指依JIS K6922-2-2010所求得之密度為0.91g/cm3以上小於0.93g/cm3之樹脂;「中密度」係指依JIS K6922-2-2010所求得之密度為0.93g/cm3以上小於0.942g/cm3之樹脂;「高密度」則指依JIS K6922-2-2010所求得之密度為0.942g/cm3以上之樹脂。再者「金屬芳香類低密度聚乙烯、金屬芳香類直鏈狀低密度聚乙烯、金屬芳香類中.高密度聚乙烯」各指採用金屬芳香類觸媒所製造之低密度聚乙烯、直鏈狀低密度聚乙烯、中.高密度聚乙烯。 Here, the "linear" of the various polyethylene-based resins used in the present invention means that the main chain of the polymer produced by the main low-pressure method is linear, as long as it is a radical polymerization under high pressure. The long and short branching structure such as the high-pressure method low-density polyethylene produced may also be in the form of a branch. Further, "low density" means a resin having a density of 0.91 g/cm 3 or more and less than 0.93 g/cm 3 as determined according to JIS K6922-2-2010; "medium density" means according to JIS K6922-2-2010 the obtained density 0.93g / cm 3 or more is less than 0.942g / cm 3 of resin; "high density" refers to the sum determined in accordance with JIS K6922-2-2010 a density of 0.942g / cm 3 or more of the resin. In addition, "metal aromatic low-density polyethylene, metal aromatic linear low-density polyethylene, metal aromatic medium, high-density polyethylene" each refers to low-density polyethylene made of metal aromatic catalyst, linear Low density polyethylene, medium. High-density polyethylene.

此外,本發明中「聚乙烯系樹脂」係指僅包 含乙烯之均聚物、或丙烯、1-丁烯、1-戊烯、1-己烯、3-甲基-1-丁烯、3-甲基-1-戊烯、3-乙基-1-戊烯、4-甲基-1-戊烯、4-甲基-1-己烯、4,4-二甲基-1-己烯、4,4-二甲基-1-戊烯、4-乙基-1-己烯、3-乙基-1-己烯、1-辛烯、1-癸烯、1-十二烯、1-十四烯、1-十六烯、1-十八烯、1-二十烯等鏈狀烯烴共聚合而成之共聚物。 Further, in the present invention, "polyethylene resin" means only a package. A homopolymer containing ethylene, or propylene, 1-butene, 1-pentene, 1-hexene, 3-methyl-1-butene, 3-methyl-1-pentene, 3-ethyl- 1-pentene, 4-methyl-1-pentene, 4-methyl-1-hexene, 4,4-dimethyl-1-hexene, 4,4-dimethyl-1-pentene , 4-ethyl-1-hexene, 3-ethyl-1-hexene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1 a copolymer obtained by copolymerizing a chain olefin such as octadecene or 1-eicosene.

本發明中,藉由使以環狀烯烴系樹脂為主成 分之A層含有聚乙烯系樹脂、聚丙烯系樹脂,可降低擠製步驟中的剪切應力,可抑制交聯所致之雜質的產生,並可進一步提升韌性且提升與B層的層間密接性而較佳。另一方面,聚乙烯系樹脂、聚丙烯系樹脂的含量變多時,有自身保持性、加工適性降低之傾向。 In the present invention, the main component is a cyclic olefin resin. The A layer contains a polyethylene resin or a polypropylene resin, which can reduce the shear stress in the extrusion step, can suppress the generation of impurities due to crosslinking, and can further improve the toughness and enhance the interlayer adhesion with the B layer. Sexually better. On the other hand, when the content of the polyethylene resin or the polypropylene resin is increased, the self-retaining property and the workability tend to be lowered.

基於品質、韌性、自身保持性觀點,就聚乙 烯系樹脂及/或聚丙烯系樹脂的含量,相對於100質量%之A層之總成分的合計,較佳設為1~40質量%,若為1~25質量%則更佳,若為1~10質量%則特佳。 Based on the viewpoint of quality, resilience and self-retention, The content of the olefin resin and/or the polypropylene resin is preferably from 1 to 40% by mass based on 100% by mass of the total of the total components of the A layer, and more preferably from 1 to 25% by mass. 1 to 10% by mass is particularly good.

此外,聚乙烯系樹脂、聚丙烯系樹脂當中, 基於與環狀烯烴系樹脂的相溶性觀點,A層所含有之其他的烯烴系樹脂較佳使用聚乙烯系樹脂;基於相溶性及耐熱性觀點,於聚乙烯系樹脂當中更佳使用高密度聚乙烯、直鏈狀低密度聚乙烯、金屬芳香類直鏈狀低密度聚乙烯、金屬芳香類中.高密度聚乙烯,特別是在重視耐熱性的情況下,最佳使用高密度聚乙烯、金屬芳香類中.高密度聚乙烯;特別是在重視相溶性的情況下,則最佳使用直鏈狀低密度聚乙烯、金屬芳香類直鏈狀聚乙烯。 Further, among polyethylene resins and polypropylene resins, From the viewpoint of compatibility with the cyclic olefin resin, a polyethylene resin is preferably used for the other olefin resin contained in the layer A, and a high density polymer is preferably used among the polyethylene resin from the viewpoint of compatibility and heat resistance. Ethylene, linear low-density polyethylene, metal aromatic linear low-density polyethylene, metal aromatics. High-density polyethylene, especially in the case of heat resistance, the best use of high-density polyethylene, metal aromatics. High-density polyethylene; especially in the case of emphasizing compatibility, linear low-density polyethylene and metal-aromatic linear polyethylene are preferably used.

又,若使A層含有聚丙烯系樹脂時,基於與 環狀烯烴系樹脂的相溶性觀點,較佳使用乙烯-丙烯共聚物、乙烯-丙烯-丁烯共聚物。 Moreover, when the layer A contains a polypropylene resin, From the viewpoint of compatibility of the cyclic olefin resin, an ethylene-propylene copolymer or an ethylene-propylene-butene copolymer is preferably used.

此外,當A層同時含有聚乙烯系樹脂及聚丙 烯系樹脂時,聚乙烯系樹脂及聚丙烯系樹脂的合計量較佳為前述之範圍,即相對於100質量%之A層之總成分 的合計,設為1~40質量%,若為1~25質量%則更佳,若為1~10質量%則特佳。 In addition, when layer A contains both polyethylene resin and polypropylene In the case of the olefin resin, the total amount of the polyethylene resin and the polypropylene resin is preferably in the above range, that is, the total composition of the A layer with respect to 100% by mass. The total amount is preferably 1 to 40% by mass, more preferably 1 to 25% by mass, and particularly preferably 1 to 10% by mass.

再者,「本發明之聚乙烯系樹脂」係指在 100質量%之聚乙烯系樹脂的聚合物中,源自乙烯之成分的合計超過50質量%且為100質量%以下之形態的聚合物。 Furthermore, the "polyethylene resin of the present invention" means In the polymer of the polyethylene resin of 100% by mass, the total amount of the components derived from ethylene is more than 50% by mass and is 100% by mass or less.

又,「本發明之聚丙烯系樹脂」係指在100 質量%之聚丙烯系樹脂的聚合物中,源自丙烯之成分的合計超過50質量%且為100質量%以下之形態的聚合物。 Moreover, "the polypropylene resin of the present invention" means 100 In the polymer of the polypropylene resin having a mass%, the total amount of the components derived from propylene is more than 50% by mass and is 100% by mass or less.

此外,本發明中,屬使用乙烯與丙烯而成的 共聚物,且100質量%之聚合物中的源自乙烯之成分的共聚合率(含有率)為50質量%,並且源自丙烯之成分的共聚合率(含有率)為50質量%的共聚物係歸屬於聚乙烯系樹脂。 Further, in the present invention, it is a mixture of ethylene and propylene. In the copolymer, the copolymerization ratio (content ratio) of the component derived from ethylene in the polymer of 100% by mass is 50% by mass, and the copolymerization ratio (content ratio) of the component derived from propylene is 50% by mass. The system is attributed to a polyethylene resin.

就本發明之積層薄膜的A層而言,基於改良 加工步驟中的尺寸穩定性觀點及抑制應用於電路構件等時之衝壓步驟中的過度變形觀點,其玻璃轉移溫度較佳為130℃以上,更佳為130℃以上180℃以下,再佳為130℃以上150℃以下。A層之玻璃轉移溫度小於130℃時,在塗布、積層、印刷、蒸鍍等加工步驟中,有本發明之積層薄膜的尺寸變化抑制不充分、經加工之薄膜的平面性等不充分之情事。此外,若A層之玻璃轉移溫度超過150℃時,則有本發明之積層薄膜的成型性不充分、構成環狀烯烴系樹脂的源自鏈狀烯烴之成分變少,以致與作為B層之主成分的聚丙烯系樹脂及/或聚乙烯系樹脂的密接點減少,使得A層/B層的相間密接性不充分之情事。 For the layer A of the laminated film of the present invention, based on the improvement The glass transition temperature is preferably 130 ° C or higher, more preferably 130 ° C or more and 180 ° C or less, and more preferably 130, from the viewpoint of dimensional stability in the processing step and the viewpoint of excessive deformation in the press step in suppressing application to a circuit member or the like. Above °C below 150 °C. When the glass transition temperature of the layer A is less than 130° C., in the processing steps such as coating, lamination, printing, and vapor deposition, the dimensional change of the laminated film of the present invention is not sufficiently suppressed, and the planarity of the processed film is insufficient. . In addition, when the glass transition temperature of the layer A exceeds 150 ° C, the moldability of the laminated film of the present invention is insufficient, and the component derived from the chain olefin which constitutes the cyclic olefin resin is reduced, so that it is used as the layer B. The adhesion point between the polypropylene resin and/or the polyethylene resin of the main component is reduced, so that the phase-to-phase adhesion between the A layer and the B layer is insufficient.

為了兼備更高的尺寸穩定性、成型性,A層 之玻璃轉移溫度只要為130℃以上140℃以下則特佳。此外,當存在有多數個A層之玻璃轉移溫度時,則採用高溫側的玻璃轉移溫度作為A層之玻璃轉移溫度。 In order to have higher dimensional stability and formability, layer A The glass transition temperature is particularly preferably from 130 ° C to 140 ° C. Further, when there is a glass transition temperature of a plurality of A layers, the glass transition temperature on the high temperature side is employed as the glass transition temperature of the A layer.

為使A層之玻璃轉移溫度達130℃以上150℃ 以下,例如使用降莰烯與乙烯之共聚物作為COC時,藉由持續增加A層中之降莰烯的含量,可使玻璃轉移溫度向高溫轉移。更且,藉由摻混降莰烯含量相異的2種COC,亦可調整A層的玻璃轉移溫度。再者,例如使用使降莰烯、三環癸烯、四環十二烯及此等之衍生物進行開環複分解聚合後予以氫化而成的樹脂作為COP時,藉由增大待聚合之環狀烯烴(降莰烯、三環癸烯、四環十二烯及此等之衍生物)的分子量、或者增加環數俾形成剛性結構,可使玻璃轉移溫度向高溫轉移。更且,藉由摻混玻璃轉移溫度相異的2種COP,也可調整A層的玻璃轉移溫度。 In order to make the glass transition temperature of layer A reach 130 ° C and above 150 ° C Hereinafter, for example, when a copolymer of norbornene and ethylene is used as the COC, the glass transition temperature can be shifted to a high temperature by continuously increasing the content of the norbornene in the layer A. Furthermore, the glass transition temperature of the layer A can also be adjusted by blending two kinds of COCs having different levels of decane. Further, for example, when a resin obtained by subjecting norbornene, tricyclodecene, tetracyclododecene, and the like to hydrogenation by ring-opening metathesis polymerization is used as the COP, the ring to be polymerized is increased. The molecular weight of the olefin (norbornene, tricyclodecene, tetracyclododecene, and the like) or the increase in the number of rings 俾 form a rigid structure, which allows the glass transition temperature to be transferred to a high temperature. Further, the glass transition temperature of the layer A can also be adjusted by blending two kinds of COPs having different glass transition temperatures.

就本發明之積層薄膜的A層,基於與環狀烯 烴系樹脂的相溶性觀點、維持積層薄膜之加工步驟中的尺寸穩定性同時抑制成型時的微細裂隙觀點,較佳為設A層之總成分的合計為100質量%時,含有15質量%以上40質量%以下之乙烯系共聚合樹脂。A層中所含之乙烯系共聚合樹脂小於15質量%時,於深拉成型(即成型倍率加大的成型)中無法對應積層薄膜,而有微小裂隙產生的情形。若微小裂隙產生時,當使用本發明之積層薄膜作為功能性樹脂層轉印薄膜之際,於功能性樹脂層亦產 生裂隙或平面性的惡化,而有外觀不良或表面硬度、導電性之特性不良的情況。另外,A層中所含之乙烯系共聚合樹脂超過40質量%時,A層的玻璃轉移溫度下降,而有積層薄膜之加工步驟中的尺寸穩定性不充分、或積層薄膜之加工後的平面性不充分的情況。 The layer A of the laminated film of the present invention is based on a cyclic olefin From the viewpoint of the compatibility of the hydrocarbon-based resin, and the dimensional stability in the processing step of the laminated film, and the suppression of the fine crack at the time of molding, it is preferable to contain 15% by mass or more when the total content of the total components of the layer A is 100% by mass. 40% by mass or less of the ethylene-based copolymer resin. When the ethylene-based copolymer resin contained in the layer A is less than 15% by mass, in the deep drawing (that is, molding in which the molding magnification is increased), the laminated film cannot be formed, and micro cracks may occur. When a micro-crack is generated, when the laminated film of the present invention is used as a functional resin layer transfer film, the functional resin layer is also produced. The crack or flatness is deteriorated, and the appearance is poor, or the surface hardness and conductivity are poor. In addition, when the ethylene-based copolymer resin contained in the layer A exceeds 40% by mass, the glass transition temperature of the layer A is lowered, and the dimensional stability in the processing step of the laminated film is insufficient, or the plane after processing of the laminated film Insufficient circumstances.

於此,「乙烯系共聚合樹脂」係指前述之聚 乙烯系樹脂當中,除了僅包含源自乙烯之成分的各種聚乙烯樹脂以外者。具體而言,意指在100質量%之聚合物中,源自乙烯之成分的合計超過50質量%小於100質量%,而且包含源自乙烯單體以外之單體之成分的構成的樹脂。 Here, the "ethylene-based copolymer resin" means the aforementioned aggregation. Among the vinyl resins, various polyethylene resins containing only components derived from ethylene are included. Specifically, it means a resin containing a composition of a component derived from a monomer other than an ethylene monomer in a total amount of components derived from ethylene of 100% by mass or less based on 100% by mass of the polymer.

就乙烯系共聚合樹脂,基於加工時、成型時 之加熱下的結晶化抑制及高溫下的柔軟性觀點、與環狀烯烴系樹脂的相溶性觀點,在100質量%之聚合物中,較佳含有10質量%以上小於50質量%之源自乙烯單體以外之單體之成分,更佳含有20質量%以上小於50質量%。若源自乙烯單體以外之單體之成分小於10質量%時,在加工時、成型時之加熱下結晶化進行,有成型性不充分的情況。又源自乙烯單體以外之單體之成分為50質量%以上時,則有乙烯系共聚合樹脂的生產成本提高、或與環狀烯烴系樹脂的相溶性不充分的情況。且由同樣觀點言之,乙烯系共聚合樹脂較佳在100莫耳%之聚合物中,含有5莫耳%以上小於40莫耳%之源自乙烯單體以外之單體之成分。乙烯系共聚合樹脂中,藉由大量共聚合乙烯單體以外之單體,縱使在加工時、成型時 加熱,結晶化亦不易進行,且於高溫下仍具有柔軟性,因此對環狀烯烴系樹脂實施深拉成型(即成型倍率加大的成型)時所生成的扭曲被乙烯系共聚合樹脂部分緩衝,得以抑制成型時的微小裂隙。 For the vinyl copolymer resin, based on processing and molding From the viewpoint of the crystallization inhibition under heating and the flexibility at high temperature, and the compatibility with the cyclic olefin resin, it is preferable to contain 10% by mass or more and less than 50% by mass of the polymer derived from 100% by mass of the polymer. The component of the monomer other than the monomer is more preferably contained in an amount of 20% by mass or more and less than 50% by mass. When the component derived from the monomer other than the ethylene monomer is less than 10% by mass, crystallization proceeds during heating at the time of processing or molding, and the moldability may be insufficient. When the content of the monomer other than the monomer of the ethylene monomer is 50% by mass or more, the production cost of the ethylene-based copolymer resin may be increased or the compatibility with the cyclic olefin resin may be insufficient. Further, from the same viewpoint, the ethylene-based copolymer resin preferably contains, in 100 mol% of the polymer, 5 mol% or more and less than 40 mol% of a component derived from a monomer other than the ethylene monomer. In the ethylene-based copolymer resin, a large amount of monomers other than the ethylene monomer are copolymerized, even during processing and molding. Heating and crystallization are not easy to carry out, and the flexibility is high even at a high temperature. Therefore, the twist generated when the cyclic olefin resin is subjected to deep drawing (that is, molding with an increased molding magnification) is partially buffered by the vinyl copolymer resin. It is possible to suppress minute cracks during molding.

作為構成乙烯系共聚合樹脂之乙烯單體以外 之單體,基於與作為A層之主成分的環狀烯烴系樹脂的相溶性觀點,較佳使用丙烯、1-丁烯、1-戊烯、1-己烯、1-辛烯等鏈狀烯烴。 Other than the ethylene monomer constituting the vinyl copolymer resin The monomer is preferably chain-like, such as propylene, 1-butene, 1-pentene, 1-hexene or 1-octene, from the viewpoint of compatibility with the cyclic olefin resin which is a main component of the A layer. Olefins.

具體而言,作為乙烯系共聚合樹脂,可列舉 乙烯-丙烯共聚物、乙烯-丙烯-丁烯共聚物、乙烯-丁烯共聚物、乙烯-己烯共聚物、乙烯-辛烯共聚物等。 Specifically, examples of the ethylene-based copolymer resin include An ethylene-propylene copolymer, an ethylene-propylene-butene copolymer, an ethylene-butene copolymer, an ethylene-hexene copolymer, an ethylene-octene copolymer, or the like.

此等當中,基於無需降低A層之玻璃轉移溫 度(將A層之玻璃轉移溫度保持於130℃以上150℃以下),與作為A層之主成分的環狀烯烴系樹脂的相溶性即良好,並可維持積層薄膜的加工適性之觀點,就乙烯系共聚合樹脂而言較佳為將乙烯與鏈狀烯烴共聚合而成的樹脂,而由成型時的微小裂隙抑制觀點,特佳為乙烯-己烯共聚物、乙烯-辛烯共聚物。 Among these, based on the need to reduce the glass transition temperature of layer A Degree (the glass transition temperature of the layer A is maintained at 130 ° C or more and 150 ° C or less), and the compatibility with the cyclic olefin resin which is a main component of the layer A is good, and the processing suitability of the laminated film can be maintained. The ethylene-based copolymer resin is preferably a resin obtained by copolymerizing ethylene and a chain olefin, and is particularly preferably an ethylene-hexene copolymer or an ethylene-octene copolymer from the viewpoint of suppressing minute cracks during molding.

若乙烯系共聚合樹脂為共聚合乙烯與鏈狀烯 烴而成的樹脂時,基於兼備與作為A層之主成分的環狀烯烴系樹脂的相溶性以及微小裂隙的抑制之觀點,100質量%之乙烯系共聚合樹脂中的源自乙烯之成分的含量較佳為60質量%以上90質量%以下,特佳為70質量%以上80質量%以下。乙烯系共聚合樹脂的源自乙烯之成分小於60質量%時,有與作為A層之主成分的環狀烯烴 系樹脂的相溶性不充分的情況;源自乙烯之成分超過90質量%時,則有成型時的微小裂隙的抑制不充分的情況。 If the ethylene-based copolymerized resin is a copolymerized ethylene and a chain olefin In the case of the resin which is a hydrocarbon, the ethylene-based component of the 100% by mass of the ethylene-based copolymer resin is used in view of compatibility with the cyclic olefin resin which is a main component of the A layer and suppression of minute cracks. The content is preferably 60% by mass or more and 90% by mass or less, and particularly preferably 70% by mass or more and 80% by mass or less. When the ethylene-derived resin has an ethylene-derived component of less than 60% by mass, it has a cyclic olefin as a main component of the layer A. When the compatibility of the resin is insufficient, when the component derived from ethylene exceeds 90% by mass, the suppression of minute cracks during molding may be insufficient.

若乙烯系共聚合樹脂為共聚合乙烯與鏈狀烯 烴而成的樹脂時,乙烯系共聚合樹脂的、加工成薄膜前之原料片狀態下的密度較佳為0.84g/cm3以上0.89g/cm3以下。於此,密度係指依循JIS-K7112(1999)所測得之值。若乙烯系共聚合樹脂的、加工成薄膜前之原料片為乙烯與α-烯烴之共聚物時,藉由使密度成為0.89g/cm3以下,由柔軟性特為良好、積層薄膜成型時的微小裂隙抑制效果增大及衝壓耐熱性良好言之係屬較佳者。乙烯系共聚合樹脂的、加工成薄膜前之原料片的密度更佳為0.88g/cm3以下,特佳為0.86g/cm3以下。且,若乙烯系共聚合樹脂為乙烯與α-烯烴之共聚物時,基於生產性觀點,較佳為0.84g/cm3以上。 When the ethylene-based copolymer resin is a resin obtained by copolymerizing ethylene and a chain olefin, the density of the ethylene-based copolymer resin in the state of the raw material sheet before processing into a film is preferably 0.84 g/cm 3 or more and 0.89 g/ Below cm 3 . Here, the density refers to a value measured in accordance with JIS-K7112 (1999). When the raw material sheet of the ethylene-based copolymerized resin before being processed into a film is a copolymer of ethylene and an α-olefin, when the density is 0.89 g/cm 3 or less, the flexibility is particularly good, and when the laminated film is molded, It is preferred that the micro-crack suppression effect is improved and the stamping heat resistance is good. The density of the raw material sheet before processing into a film of the ethylene-based copolymer resin is more preferably 0.88 g/cm 3 or less, particularly preferably 0.86 g/cm 3 or less. In addition, when the ethylene-based copolymer resin is a copolymer of ethylene and an α-olefin, it is preferably 0.84 g/cm 3 or more from the viewpoint of productivity.

此外,就本發明之積層薄膜的A層,在無損 本發明之積層薄膜的尺寸穩定性等加工適性的範圍內,尚可含有不屬於乙烯系共聚合樹脂的苯乙烯-乙烯-丁烯-苯乙烯共聚物、苯乙烯-乙烯-丙烯-苯乙烯共聚物、或者苯乙烯系共聚合樹脂(苯乙烯-丁二烯-苯乙烯共聚物、苯乙烯-異戊二烯-苯乙烯共聚物)。 Further, in the layer A of the laminated film of the present invention, it is not damaged The styrene-ethylene-butylene-styrene copolymer and the styrene-ethylene-propylene-styrene copolymer which are not the ethylene-based copolymer resin may be contained within the range of processing suitability such as dimensional stability of the laminated film of the present invention. Or a styrene-based copolymer resin (styrene-butadiene-styrene copolymer, styrene-isoprene-styrene copolymer).

A層可由1層構成,或進一步由a1層、a2 層及複數層所構成,任一種均可,惟基於生產性、功能性樹脂層的品質觀點,較佳為由1層構成之形態。若使A層由a1層、a2層及複數層構成時,因層的界面數增加而導致成型時容易發生界面的扭曲,有扭曲傳遞至功能性樹脂層引起外觀不良、或使各種功能性下降的情況。 The A layer may be composed of 1 layer, or further by the a1 layer, a2 Any one of the layer and the plurality of layers may be used, but it is preferably one layer in terms of the quality of the productive or functional resin layer. When the layer A is composed of the a1 layer, the a2 layer, and the plurality of layers, the interface number is likely to be distorted during molding due to an increase in the number of interfaces of the layer, and distortion is transmitted to the functional resin layer to cause poor appearance or various functionalities. Case.

(B層) (B layer)

就本發明之積層薄膜,基於作為功能性樹脂層轉印薄膜使用時之與功能性樹脂的脫模性(例如作為電磁波遮蔽層轉印薄膜使用時之與導電層的脫模性)觀點,重要的是在A層的至少單面具有B層。作為構成B層之樹脂,基於脫模性、成型性觀點,重要的是以聚丙烯系樹脂及/或聚乙烯系樹脂為主成分。此處「在A層的至少單面具有B層」,係指在A層的任一面未隔著其他的層地具有B層。此外,就本發明之積層薄膜,基於加工時的操作處理性、耐翹曲性觀點,在A層的兩面具有B層之構造係較佳者。亦即,較佳為B層/A層/B層未隔著其他的層而直接積層之構造。 The laminated film of the present invention is important in view of the release property of the functional resin when used as a functional resin layer transfer film (for example, the release property of the conductive layer when used as an electromagnetic wave shielding layer transfer film). It is to have a B layer on at least one side of the A layer. As the resin constituting the layer B, it is important to use a polypropylene resin and/or a polyethylene resin as a main component from the viewpoint of mold release property and moldability. Here, "having a B layer on at least one side of the A layer" means that the layer B is provided on any one of the A layers without interposing another layer. Further, the laminated film of the present invention is preferably a structure having a B layer on both sides of the layer A from the viewpoint of handling property during processing and warpage resistance. That is, it is preferable that the B layer/A layer/B layer is directly laminated without interposing another layer.

再者,B層係指以聚丙烯系樹脂及/或聚乙烯系樹脂為主成分的層。而且此處所稱「主成分」,係指設B層之總成分的合計為100質量%時,含有超過50質量%且為100質量%以下之聚丙烯系樹脂及/或聚乙烯系樹脂。 In addition, the B layer means a layer mainly composed of a polypropylene resin and/or a polyethylene resin. In addition, the term "main component" as used herein means a polypropylene resin and/or a polyethylene resin containing more than 50% by mass and not more than 100% by mass when the total content of the total components of the layer B is 100% by mass.

換言之,「聚丙烯系樹脂及聚乙烯系樹脂為B層之主成分」係指設B層之總成分的合計為100質量%時,聚丙烯系樹脂與聚乙烯系樹脂的合計量超過50質量%且為100質量%以下之狀態,聚丙烯系樹脂、聚乙烯系樹脂之任一者較多亦無防。此外,就聚丙烯系樹脂、聚乙烯系樹脂之比例,可鑒於A層之組成或與功能性樹脂層的密接性同時加以適當調整。 In other words, when the total content of the total components of the B layer is 100% by mass, the total amount of the polypropylene resin and the polyethylene resin exceeds 50 mass. In the state of 100% by mass or less, the polypropylene resin or the polyethylene resin is often not prevented. Further, the ratio of the polypropylene resin to the polyethylene resin can be appropriately adjusted in view of the composition of the layer A or the adhesion to the functional resin layer.

就B層所含之聚丙烯系樹脂及/或聚乙烯系 樹脂,較佳為設B層之總成分的合計為100質量%時含有70質量%以上100質量%以下之形態,若為含有80質量%以上100質量%以下之形態則更佳,再佳為含有90質量%以上100質量%以下之形態。對B層應用前述之乙烯系共聚合樹脂或者丙烯系共聚合樹脂(此處「丙烯系共聚合樹脂」係指在100質量%之聚合物中,源自丙烯之成分的合計超過50質量%小於100質量%,而且含有源自丙烯單體以外之單體之成分之構成的樹脂)時,由於有在B層產生黏著性,根據製造條件於捲繞時發生黏滯(blocking)的情況,因此B層所含之聚丙烯系樹脂及/或聚乙烯系樹脂最佳為包含源自丙烯之成分為100質量%、或者源自乙烯之成分為100質量%的各種均聚丙烯樹脂/各種均聚乙烯樹脂。 Polypropylene resin and/or polyethylene contained in layer B When the total amount of the total components of the B layer is 100% by mass, the resin is preferably contained in an amount of 70% by mass or more and 100% by mass or less, and more preferably 80% by mass or more and 100% by mass or less. It is contained in the form of 90% by mass or more and 100% by mass or less. The above-mentioned ethylene-based copolymer resin or propylene-based copolymer resin is used for the layer B (the "propylene-based copolymer resin" means that the total amount of the component derived from propylene is less than 50% by mass in 100% by mass of the polymer. When 100% by mass and a resin containing a component derived from a monomer other than a propylene monomer), adhesiveness occurs in the layer B, and blocking occurs at the time of winding depending on production conditions. The polypropylene resin and/or the polyethylene resin contained in the layer B are preferably various homopolypropylene resins/various homopolymers containing 100% by mass of the component derived from propylene or 100% by mass of the component derived from ethylene. Vinyl resin.

此外,在以FPC為對象之電磁波遮蔽層轉 印薄膜的加工中,一般係利用衝壓機,與FPC夾著電磁波遮蔽層轉印薄膜施予數十分鐘左右的熱與壓力來進行,對於電磁波遮蔽層轉印薄膜中之功能性樹脂層(導電層)以外的部分,藉由作成硬質層與柔軟層積層而成之構造,相對於FPC之凸部的柔軟層被壓縮,由於凹部僅在起初自接觸的單側受力,而容易向凹部壓入。而且,使薄膜中包含僅比柔軟層更硬的層,較容易使力傳達至凹部的底側,從而成型性良好。基於此種緩衝等因柔軟性所產生之成型性及脫模性良好,以及與加工適性優良之硬質層(A層)的密接性觀點,重要的是B層之主成分為聚丙烯系樹脂及/或聚乙烯系樹脂。 In addition, the electromagnetic wave shielding layer is applied to the FPC In the processing of the printing film, it is generally carried out by applying a heat and pressure to the FPC with the electromagnetic wave shielding layer transfer film for about several minutes, and the functional resin layer in the electromagnetic wave shielding layer transfer film (conducting) The portion other than the layer is formed by laminating a hard layer and a soft layer, and the soft layer is compressed with respect to the convex portion of the FPC, and the concave portion is easily pressed toward the concave portion only by the one side of the initial self-contact. In. Further, by including a layer which is harder than the soft layer in the film, it is easier to transmit the force to the bottom side of the concave portion, and the moldability is good. It is important that the main component of the B layer is a polypropylene resin and that the moldability and the mold release property due to the flexibility are excellent, and the adhesion to the hard layer (layer A) having excellent workability is important. / or polyethylene resin.

B層之主成分可為聚丙烯系樹脂及/或聚乙 烯系樹脂之任一種,於裝飾用薄膜當中,若構成為具有高軟化溫度之接著層、或應用於作為施加長時間的熱與壓力之類的用於電路構件之電磁波遮蔽層轉印薄膜時,基於改良加工步驟中的尺寸穩定性觀點及抑制應用於電路構件等時之衝壓步驟中的過度變形觀點,B層之主成分較佳為聚丙烯系樹脂。 The main component of layer B can be polypropylene resin and/or polyethylene Any one of the olefinic resins, which is used as an adhesive layer having a high softening temperature in the decorative film, or when applied as an electromagnetic wave shielding layer transfer film for a circuit member such as heat and pressure for a long period of time. The main component of the layer B is preferably a polypropylene resin based on the viewpoint of dimensional stability in the improved processing step and the viewpoint of excessive deformation in the press step at the time of application to a circuit member or the like.

(B層之聚丙烯系樹脂) (B layer polypropylene resin)

本發明之聚丙烯系樹脂係指在100質量%之聚丙烯系樹脂的聚合物中,源自丙烯之成分的合計超過50質量%且為100質量%以下之形態的聚合物。作為本發明之B層所使用的聚丙烯系樹脂,可列舉聚丙烯、乙烯-丙烯共聚物、乙烯-丙烯-丁烯共聚物、丙烯-丁烯共聚物等各種聚丙烯系樹脂等。此等當中,尤其在用於電路構件之電磁波遮蔽層轉印薄膜等要求耐熱性的用途中,基於加工步驟中的尺寸穩定性觀點,聚丙烯系樹脂的聚合物中所含之源自丙烯之成分係愈多愈佳,最佳為僅包含源自丙烯之成分的聚丙烯。此外,就共聚物而言,可為隨機共聚物、嵌段共聚物之任一種。此等當中,特別是在重視與A層的層間密接性的用途中,較佳為乙烯-丙烯共聚物、乙烯-丙烯-丁烯共聚物。再者,對於乙烯-丙烯共聚物、乙烯-丙烯-丁烯共聚物中的乙烯、1-丁烯之共聚合比例,基於生產性、機械特性觀點,就乙烯而言較佳為2~6質量%,就1-丁烯而言較佳為3~15質量%。 The polypropylene-based resin of the present invention is a polymer in which the total amount of the components derived from propylene exceeds 50% by mass and is 100% by mass or less based on 100% by mass of the polymer of the polypropylene resin. Examples of the polypropylene resin used in the layer B of the present invention include various polypropylene resins such as polypropylene, an ethylene-propylene copolymer, an ethylene-propylene-butene copolymer, and a propylene-butene copolymer. Among these, in particular, in applications requiring heat resistance such as an electromagnetic wave shielding layer transfer film for a circuit member, the polymer derived from the polypropylene resin is derived from propylene based on the dimensional stability in the processing step. The more the component system, the better, and it is preferably a polypropylene containing only a component derived from propylene. Further, the copolymer may be either a random copolymer or a block copolymer. Among these, in particular, in the use of adhesion to the interlayer of the layer A, an ethylene-propylene copolymer or an ethylene-propylene-butene copolymer is preferred. Further, the copolymerization ratio of ethylene and 1-butene in the ethylene-propylene copolymer and the ethylene-propylene-butene copolymer is preferably 2 to 6 by mass in terms of productivity and mechanical properties. % is preferably from 3 to 15% by mass in terms of 1-butene.

(B層之聚乙烯樹脂) (B layer of polyethylene resin)

本發明之聚乙烯系樹脂係指在100質量%之聚乙烯系樹脂的聚合物中,源自乙烯之成分的合計超過50質量%且為100質量%以下之形態的聚合物。 The polyethylene-based resin of the present invention is a polymer having a total content of components derived from ethylene of more than 50% by mass and 100% by mass or less in a polymer of a polyethylene resin of 100% by mass.

本發明之B層所使用的聚乙烯系樹脂可列舉例如高密度聚乙烯、中密度聚乙烯、低密度聚乙烯、直鏈狀中密度聚乙烯、直鏈狀低密度聚乙烯、金屬芳香類低密度聚乙烯、金屬芳香類直鏈狀低密度聚乙烯、金屬芳香類中.高密度聚乙烯等各種聚乙烯系樹脂等。又,就聚乙烯系樹脂而言,為了進行強度等的改質,亦較佳使用鏈狀烯烴單體共聚合而成者,作為鏈狀烯烴單體,可列舉例如1-丁烯、1-戊烯、1-己烯、3-甲基-1-丁烯、3-甲基-1-戊烯、3-乙基-1-戊烯、4-甲基-1-戊烯、4-甲基-1-己烯、4,4-二甲基-1-己烯、4,4-二甲基-1-戊烯、4-乙基-1-己烯、3-乙基-1-己烯、1-辛烯、1-癸烯、1-十二烯、1-十四烯、1-十六烯、1-十八烯、1-二十烯等。此等當中,基於強度、生產性、成本觀點,更佳使用1-丁烯、1-戊烯、4-甲基-1-戊烯、1-己烯、1-辛烯等。基於A層之與環狀烯烴系樹脂的相溶性、機械特性觀點,最佳為1-己烯。 The polyethylene-based resin used in the layer B of the present invention may, for example, be high-density polyethylene, medium-density polyethylene, low-density polyethylene, linear medium-density polyethylene, linear low-density polyethylene, or low in metal aromatics. Density polyethylene, metal aromatic linear low density polyethylene, metal aromatics. Various polyethylene resins such as high density polyethylene. In addition, in order to carry out the modification of strength, etc., it is preferable to use a chain-like olefin monomer to copolymerize a polyethylene-based resin. Examples of the chain-like olefin monomer include 1-butene and 1- Pentene, 1-hexene, 3-methyl-1-butene, 3-methyl-1-pentene, 3-ethyl-1-pentene, 4-methyl-1-pentene, 4- Methyl-1-hexene, 4,4-dimethyl-1-hexene, 4,4-dimethyl-1-pentene, 4-ethyl-1-hexene, 3-ethyl-1 Hexene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1-eicosene, and the like. Among these, 1-butene, 1-pentene, 4-methyl-1-pentene, 1-hexene, 1-octene and the like are more preferably used from the viewpoint of strength, productivity, and cost. From the viewpoint of compatibility and mechanical properties of the A layer with the cyclic olefin resin, 1-hexene is most preferable.

若本發明之B層之主成分為聚乙烯系樹脂時,基於與A層的層間密接性及耐熱性觀點,該聚乙烯系樹脂較佳使用高密度聚乙烯、直鏈狀低密度聚乙烯、金屬芳香類直鏈狀低密度聚乙烯、或金屬芳香類中.高密度聚乙烯,特別是在重視耐熱性的情況下,更佳使用高密 度聚乙烯、或金屬芳香類中.高密度聚乙烯;特別是在重視相溶性的情況下,則更佳使用直鏈狀低密度聚乙烯、或金屬芳香類直鏈狀低密度聚乙烯。此外,在重視耐熱性的情況下,聚乙烯系樹脂最佳為僅來自源自乙烯之成分的構成;在重視相溶性的情況下,B層之主成分之聚乙烯系樹脂最佳為直鏈狀低密度聚乙烯、或1-己烯、1-辛烯共聚合而成的金屬芳香類直鏈狀聚乙烯。 When the main component of the layer B of the present invention is a polyethylene-based resin, high-density polyethylene and linear low-density polyethylene are preferably used as the polyethylene-based resin from the viewpoint of interlayer adhesion to the layer A and heat resistance. Metal aromatic linear low density polyethylene, or metal aromatics. High-density polyethylene, especially in the case of heat resistance, better use of high density Polyethylene, or metal aromatics. High-density polyethylene; especially in the case of emphasizing compatibility, linear low-density polyethylene or metal-aromatic linear low-density polyethylene is more preferably used. Further, when heat resistance is emphasized, the polyethylene resin is preferably a composition derived only from a component derived from ethylene; and when compatibility is important, the polyethylene resin having a main component of the B layer is preferably a linear chain. A metal-aromatic linear polyethylene obtained by copolymerizing low-density polyethylene or 1-hexene or 1-octene.

此外,B層所含之聚乙烯系樹脂只要滿足源 自乙烯之成分的合計超過50質量%且為100質量%以下之要件,亦可使用適合作為前述之乙烯系共聚合樹脂的樹脂。 In addition, the polyethylene resin contained in the B layer only needs to satisfy the source. A resin suitable as the above-mentioned ethylene-based copolymer resin can also be used as a component of the total of the components of the ethylene of more than 50% by mass and not more than 100% by mass.

(B層之石油樹脂) (B layer of petroleum resin)

當使用聚丙烯系樹脂作為本發明之B層之主成分時,比起聚乙烯系樹脂其耐熱性雖較為良好,但根據作為A層之主成分的環狀烯烴系樹脂之組成,偶有層間密接性較聚乙烯系樹脂更不充分的情況。因此,當使用聚丙烯系樹脂作為B層之主成分時,係以使B層含有石油樹脂來提高A層與B層的層間密著力為較佳。 When a polypropylene-based resin is used as the main component of the layer B of the present invention, the heat resistance is better than that of the polyethylene-based resin, but the composition of the cyclic olefin-based resin which is a main component of the layer A is occasionally inter-layered. The adhesion is less than that of the polyethylene resin. Therefore, when a polypropylene resin is used as the main component of the B layer, it is preferable to make the layer B contain a petroleum resin to improve the interlayer adhesion between the layer A and the layer B.

於此,「石油樹脂」係指透過石油化學工業中所使用之輕油裂解的副生成油之一部分(C5(碳數5者)餾分或C9(碳數9者)餾分等)的聚合所生成的樹脂,可列舉C5之鏈狀烯烴混合物經陽離子聚合而成的C5系石油樹脂、二環戊二烯餾分經熱聚合而成的二環戊二烯系石油樹脂、C9芳香族烯烴類混合物經陽離子聚合而成的C9系石油樹脂、C5C9共聚合石油樹脂、萃取C9餾分所 含有之α-甲基苯乙烯,用純α-甲基苯乙烯所製造之稱為「純單質樹脂」的石油樹脂及此等經氫化所得之樹脂等。由於石油樹脂具有近似於作為A層之主成分的環狀烯烴系樹脂的結構,與環狀烯烴系樹脂的相溶性高,使之含於B層可提升A層與B層的密接性。基於密接性提升效果觀點,較佳為C9系石油樹脂、C5C9共聚合石油樹脂。 Here, "petroleum resin" refers to a polymerization of a part of a by-product oil (c5 (carbon number 5) fraction or C9 (carbon number 9) fraction) which is passed through the light oil cracking used in the petrochemical industry. Examples of the resin include a C5-based petroleum resin obtained by cationically polymerizing a chain olefin mixture of C5, a dicyclopentadiene petroleum resin obtained by thermal polymerization of a dicyclopentadiene fraction, and a C9 aromatic olefin mixture. Cationic polymerization of C9 petroleum resin, C5C9 copolymerized petroleum resin, extraction of C9 fraction A petroleum resin called "pure elemental resin" produced by pure α-methylstyrene, and a resin obtained by hydrogenation, etc., which are contained in α-methylstyrene. Since the petroleum resin has a structure similar to the cyclic olefin resin which is a main component of the A layer, it has high compatibility with the cyclic olefin resin, and the inclusion of the petroleum layer in the B layer improves the adhesion between the A layer and the B layer. From the viewpoint of the adhesion improving effect, a C9-based petroleum resin and a C5C9 copolymerized petroleum resin are preferable.

石油樹脂具體而言可列舉出光興產製“I-MARV(註冊商標)”、Tonen製“ESCOREZ(註冊商標)”、荒川化學製“ALCON(註冊商標)”、TOSOH製“Petcoal(註冊商標)”、“Petrotack(註冊商標)”等。 Specific examples of the petroleum resin include "I-MARV (registered trademark)", "ESCOREZ (registered trademark)" by Tonen, "ALCON (registered trademark)" by Arakawa Chemical Co., Ltd., and "Petcoal (registered trademark) by TOSOH). ", "Petrotack (registered trademark)" and so on.

就B層所含之石油樹脂,基於改良積層薄膜的成型性、加工適性觀點,其軟化點較佳為80~150℃,更佳為90~125℃。若石油樹脂之軟化點小於80℃時,有於乾燥步驟等的加熱時石油樹脂部分發生變形,使平面性不充分的情況。又石油樹脂之軟化點超過150℃時,則有實施熱壓後石油樹脂部分未依從而造成積層薄膜破裂之原因的情況。 The petroleum resin contained in the layer B has a softening point of preferably from 80 to 150 ° C, more preferably from 90 to 125 ° C, from the viewpoint of moldability and processability of the improved laminated film. When the softening point of the petroleum resin is less than 80 ° C, the petroleum resin portion is deformed during heating such as a drying step, and the planarity is insufficient. When the softening point of the petroleum resin exceeds 150 ° C, there is a case where the portion of the petroleum resin is not subjected to the hot pressing and the laminated film is broken.

就本發明之B層,在設B層之總成分的合計為100質量%時,較佳含有0.1質量%以上15質量%以下之石油樹脂,更佳為1質量%以上12質量%以下,特佳為5質量%以上10質量%以下。B層所含有之石油樹脂小於0.1質量%時,有與A層的相間密接性不充分的情況。又B層所含有之石油樹脂超過15質量%時,則有積層薄膜脆化、或者脫模性不充分的情況。 When the total amount of the total components of the layer B is 100% by mass, the layer B of the present invention preferably contains 0.1% by mass or more and 15% by mass or less of the petroleum resin, more preferably 1% by mass or more and 12% by mass or less. It is preferably 5 mass% or more and 10 mass% or less. When the petroleum resin contained in the layer B is less than 0.1% by mass, the phase-to-phase adhesion to the layer A may be insufficient. When the amount of the petroleum resin contained in the layer B exceeds 15% by mass, the laminated film may be embrittled or the mold release property may be insufficient.

當本發明之B層使用聚丙烯系樹脂時,藉由使B層含有石油樹脂可提升與A層的層間密接性,惟在不損及B層之脫模性的範圍內,亦可使B層含有石油樹脂以外之密接性樹脂來提升A層與B層的密接性。作為石油樹脂以外之密接性樹脂,可列舉松脂、松脂酯、氫化松脂、聚合松脂等松脂系樹脂、或者α-蒎烯聚合物、β-蒎烯聚合物、萜烯-酚聚合物等萜烯系樹脂、含有極性基之環狀烯烴系樹脂、含有極性基之環狀烯烴系樹脂以外之聚烯烴系樹脂等。屬所述極性基者,可列舉如羧基、酸酐基、環氧基、醯胺基、酯基、羥基等。 When the polypropylene resin is used for the layer B of the present invention, the interlayer adhesion between the layer A and the layer A can be improved by including the petroleum resin in the layer B, but it is also possible to prevent the layer B from being damaged. The layer contains an adhesive resin other than petroleum resin to improve the adhesion between the A layer and the B layer. Examples of the adhesive resin other than the petroleum resin include rosin-based resins such as rosin, rosin ester, hydrogenated turpentine, and polymeric turpentine, or terpene such as α-pinene polymer, β-pinene polymer, and terpene-phenol polymer. A resin, a cyclic olefin resin containing a polar group, a polyolefin resin other than a cyclic olefin resin containing a polar group, or the like. Examples of the polar group include a carboxyl group, an acid anhydride group, an epoxy group, a decylamino group, an ester group, and a hydroxyl group.

惟,含有極性基之環狀烯烴系樹脂、含有極性基之環狀烯烴系樹脂以外之聚烯烴樹脂由於與金屬的密接性高,會密接於生產設備的配管或噴嘴,而有成為薄膜外觀不良之原因、或為了清洗配管或噴嘴致使生產性下降的情況,因此含有極性基之樹脂,在設B層之總成分的合計為100質量%時較佳為5質量%以下,更佳為2質量%以下,再佳為1質量%以下,特佳為僅使用石油樹脂、松脂系樹脂、萜烯系樹脂來展現A層與B層之層間密接性。 However, the polyolefin resin other than the cyclic olefin resin containing a polar group or the cyclic olefin resin containing a polar group is in close contact with a pipe or a nozzle of a production facility because of high adhesion to a metal, and the film appearance is poor. In the case where the resin or the nozzle is cleaned, the productivity is lowered. Therefore, when the total amount of the total components of the layer B is 100% by mass, the resin is preferably 5% by mass or less, more preferably 2% by mass. It is more preferably 1% by mass or less, and it is particularly preferable to use only a petroleum resin, a rosin-based resin, or a terpene-based resin to exhibit interlayer adhesion between the A layer and the B layer.

(B層之樹脂的特性) (Characteristics of resin of layer B)

本發明之B層所使用的聚丙烯系樹脂、聚乙烯系樹脂其依據JIS-K7210(1999)在230℃、負載2.16kg之條件下所測得的熔融流動率(MFR)較佳為1~80g/10分鐘,更佳為2~50g/10分鐘,再佳為3~30g/10分鐘;特 佳為4~10g/10分鐘。聚乙烯系樹脂、聚丙烯系樹脂之MFR小於1g/10分鐘時,熔融黏度高使得擠出性下降、厚度不均變大。又聚乙烯系樹脂、聚丙烯系樹脂之MFR超過80g/10分鐘時,有結晶性變高使得製膜性大幅下降、或積層薄膜之機械特性下降的情況。尚有B層的結晶化過度進行,發生粗面化而使印刷精度下降的情況。 The polypropylene resin and the polyethylene resin used in the layer B of the present invention preferably have a melt flow rate (MFR) of 1 to 1 according to JIS-K7210 (1999) at 230 ° C and a load of 2.16 kg. 80g/10 minutes, more preferably 2~50g/10 minutes, and then better 3~30g/10 minutes; Good for 4~10g/10 minutes. When the MFR of the polyethylene resin or the polypropylene resin is less than 1 g/10 minutes, the melt viscosity is high, so that the extrusion property is lowered and the thickness unevenness is increased. When the MFR of the polyethylene resin or the polypropylene resin exceeds 80 g/10 minutes, the crystallinity is increased to cause a large decrease in film formability or a decrease in mechanical properties of the laminated film. In the case where the crystallization of the layer B is excessively performed, the surface is roughened and the printing accuracy is lowered.

就本發明之B層所使用的聚乙烯系樹脂、聚 丙烯系樹脂之極限黏度[η],基於具有適當的結晶性觀點較佳為1.4~3.2dl/g,更佳為1.6~2.4dl/g。[η]小於1.4dl/g時,有因結晶性過高而導致積層薄膜的脆化之虞;若超過3.2dl/g時則有結晶性明顯下降,使得積層薄膜的耐熱性下降的情況。 Polyethylene resin used in the layer B of the present invention, poly The ultimate viscosity [η] of the propylene resin is preferably from 1.4 to 3.2 dl/g, more preferably from 1.6 to 2.4 dl/g, from the viewpoint of having appropriate crystallinity. When [η] is less than 1.4 dl/g, there is a possibility that the laminated film is embrittled due to excessive crystallinity; when it exceeds 3.2 dl/g, the crystallinity is remarkably lowered, and the heat resistance of the laminated film is lowered.

就本發明之B層,基於功能性樹脂層之乾燥 溫度下的加工適性或成型性觀點,其熔點較佳為100~170℃之範圍,更佳為130~165℃,再佳為145℃~160℃。熔點低於100℃時,有薄膜的熱變形增大導致加工適性不充分的情況;超過170℃時則有成型性不充分的情況。 For the layer B of the present invention, drying based on the functional resin layer The melting point is preferably in the range of 100 to 170 ° C, more preferably 130 to 165 ° C, and more preferably 145 ° C to 160 ° C from the viewpoint of processing suitability or moldability at a temperature. When the melting point is lower than 100 ° C, the thermal deformation of the film may increase, resulting in insufficient processing suitability; when it exceeds 170 ° C, the moldability may be insufficient.

當使用聚丙烯系樹脂作為B層之主成分時, 本發明之B層其採用差示掃描熱量分析儀之依據JIS K7121-1987、JIS K7122-1987所求得的結晶熔解熱量較佳為20mJ/mg以上25mJ/mg以下。結晶熔解熱量乃表示結晶化的進行度之標準,若B層之結晶熔解熱量小於20mJ/mg時,結晶化的進行不充分,而有作為具有高軟化溫度之接著層的裝飾薄膜或構造、或在應用於作為施 加長時間的熱與壓力之類的用於電路構件的電磁波遮蔽層轉印薄膜時,發生加工步驟中的尺寸穩定性、應用於電路構件等時之衝壓步驟中的過度變形的情況。又B層之結晶熔解熱量超過25mJ/mg時,則有結晶化過度進行而導致成型性不充分的情況。基於兼備加工步驟中的尺寸穩定性、或者衝壓步驟中的過度變形之抑制與成型性觀點,B層之結晶熔解熱量更佳為21mJ/mg以上23mJ/mg以下,特佳為21.5mJ/mg以上22.5mJ/mg以下。 When a polypropylene resin is used as a main component of the layer B, In the layer B of the present invention, the heat of crystal melting determined by the differential scanning calorimeter according to JIS K7121-1987 and JIS K7122-1987 is preferably 20 mJ/mg or more and 25 mJ/mg or less. The heat of crystal melting indicates the degree of progress of crystallization. If the heat of crystal melting of the layer B is less than 20 mJ/mg, the progress of crystallization is insufficient, and there is a decorative film or structure which is an adhesive layer having a high softening temperature, or Applied as a When the electromagnetic wave shielding layer transfer film for a circuit member such as heat and pressure is added for a long period of time, dimensional stability during the processing step and excessive deformation in the press step when applied to a circuit member or the like occur. When the heat of crystal melting of the layer B exceeds 25 mJ/mg, the crystallization may be excessively performed, and the moldability may be insufficient. The heat of crystal melting of the layer B is preferably 21 mJ/mg or more and 23 mJ/mg or less, and particularly preferably 21.5 mJ/mg or more, based on the dimensional stability in the processing step or the suppression of excessive deformation in the press step and the moldability. 22.5mJ/mg or less.

作為使B層之結晶熔解熱量達20mJ/mg以 上25mJ/mg以下之方法,可列舉例如在本發明之積層薄膜製造時,將適當量的熱傳遞至薄膜的方法等。作為用以獲得本發明之積層薄膜的方法,茲採用例如將從噴嘴擠出的薄膜狀熔融聚合物夾入於橡膠輥與金屬輥的間隙並予以冷卻固化的方法等,具體而言,可舉出在前述之製造方法中,將流延溫度(金屬輥溫度)設定為40℃~110℃之高溫,進而利用橡膠輥等,設夾持壓為0.1~1MPa予以夾入的方法等。 As the crystal of the B layer is melted to a heat of 20 mJ/mg For the method of 25 mJ/mg or less, for example, a method of transferring an appropriate amount of heat to the film during the production of the laminated film of the present invention may be mentioned. As a method for obtaining the laminated film of the present invention, for example, a method in which a film-like molten polymer extruded from a nozzle is sandwiched between a rubber roll and a metal roll and cooled and solidified is used, and specifically, In the above-described manufacturing method, the casting temperature (metal roll temperature) is set to a high temperature of 40 ° C to 110 ° C, and a rubber roller or the like is used, and a nip pressure of 0.1 to 1 MPa is used for sandwiching.

(B層之表面自由能) (surface free energy of layer B)

就本發明之積層薄膜之B層,基於兼備與功能性樹脂層的脫模性及步驟(加工步驟或成型步驟)中之與功能性樹脂層的密接性觀點,其表面自由能較佳為25~35mN/m,更佳為27~33mN/m,特佳為28~32mN/m。此外,前述之「加工步驟」,係指在製作後述之功能性樹脂層轉印薄膜時,對本發明之積層薄膜所實施的塗布加工、印刷加工或金屬蒸鍍加工等中的加工步驟。又前述 之成型步驟係包含將功能性樹脂層轉印薄膜設置於成型機或衝壓機之步驟、或於成型前將樹脂層轉印薄膜以加熱器加熱之步驟。 In the layer B of the laminated film of the present invention, the surface free energy is preferably 25 based on the mold release property of the functional resin layer and the adhesion to the functional resin layer in the step (processing step or molding step). ~35mN/m, more preferably 27~33mN/m, especially preferably 28~32mN/m. In addition, the "processing step" as described above refers to a processing step in coating processing, printing processing, metal deposition processing, and the like performed on the laminated film of the present invention in the case of producing a functional resin layer transfer film to be described later. Again The molding step includes a step of disposing the functional resin layer transfer film on a molding machine or a press, or a step of heating the resin layer transfer film by a heater before molding.

本發明之積層薄膜之B層之表面自由能小於25mN/m時,積層薄膜與功能性樹脂層的密接性較弱,因此在將具有本發明之積層薄膜與導電層(功能性樹脂層)的電磁波遮蔽層轉印薄膜設置於FPC上並實施熱壓前,有積層薄膜與導電層剝離的情況。另一方面,本發明之積層薄膜之B層之表面自由能超過35mN/m時,則積層薄膜與功能性樹脂層的密接性變強,而有熱壓後之與功能性樹脂層的脫模性不充分的情況。 When the surface free energy of the layer B of the laminated film of the present invention is less than 25 mN/m, the adhesion between the laminated film and the functional resin layer is weak, and therefore, the laminated film and the conductive layer (functional resin layer) of the present invention are provided. The electromagnetic wave shielding layer transfer film is disposed on the FPC and is subjected to hot pressing, and the laminated film and the conductive layer are peeled off. On the other hand, when the surface free energy of the layer B of the laminated film of the present invention exceeds 35 mN/m, the adhesion between the laminated film and the functional resin layer becomes strong, and the release of the functional resin layer after hot pressing is performed. Insufficient circumstances.

於此,「表面自由能」係指依據實施例中的量測方法所求得之值。 Here, "surface free energy" means a value obtained by the measurement method in the embodiment.

作為用以使B層之表面自由能處於25~35mN/m之範圍的方法,可舉出使B層之主成分採用聚乙烯系樹脂及/或聚丙烯系樹脂的方法、使B層含有滑劑俾降低表面自由能的方法、藉由電暈放電處理、紫外線照射處理、電漿處理、雷射處理、火焰處理、高頻處理、輝光放電處理、臭氧氧化處理等的各種表面處理使表面自由能增加的方法、使B層含有聚甲基戊烯系樹脂等表面自由能較低之樹脂的方法等。可依據功能性樹脂層的特性,將此等方法加以組合。 The method for making the surface free energy of the layer B in the range of 25 to 35 mN/m includes a method of using a polyethylene resin and/or a polypropylene resin as a main component of the layer B, and the layer B is slippery. The method for reducing the surface free energy of the agent, and the surface treatment by corona discharge treatment, ultraviolet irradiation treatment, plasma treatment, laser treatment, flame treatment, high frequency treatment, glow discharge treatment, ozone oxidation treatment, etc. A method which can be added, and a method in which the layer B contains a resin having a low surface free energy such as a polymethylpentene-based resin or the like. These methods can be combined depending on the characteristics of the functional resin layer.

此外,作為可理想使用之滑劑,可列舉高級脂肪酸醯胺類、高級脂肪酸酯類、蠟及矽油等,較佳為高級脂肪酸醯胺類、高級脂肪酸酯類。又,此等可單獨 使用,亦可併用至少2種。作為高級脂肪酸醯胺類,可列舉飽和脂肪酸醯胺、不飽和脂肪酸醯胺及雙脂肪酸醯胺等。作為飽和脂肪酸醯胺,可列舉例如十二醯胺、十四醯胺、十八醯胺、二十二醯胺等;作為不飽和脂肪酸醯胺,可列舉例如芥酸醯胺、油酸醯胺、反油酸醯胺等;作為雙脂肪酸醯胺,可列舉例如亞甲雙十八醯胺、亞甲雙油酸醯胺、乙烯雙十八醯胺、乙烯雙油酸醯胺等。作為高級脂肪酸酯類,則可列舉例如乙醯化甘油酯、具有碳數8~12之醯基的中鏈脂肪酸三甘油酯及至少具有一個醇性羥基的聚甘油脂肪酸酯等。 Further, examples of the lubricant which can be preferably used include higher fatty acid guanamines, higher fatty acid esters, waxes, and eucalyptus oils, and preferred higher fatty acid guanamines and higher fatty acid esters. Again, this can be separate Use, you can also use at least 2 kinds together. Examples of the higher fatty acid amides include saturated fatty acid decylamine, unsaturated fatty acid decylamine, and di-fatty acid decylamine. Examples of the saturated fatty acid guanamine include, for example, dodecylamine, tetradecylamine, octadecylamine, and behenylamine; and examples of the unsaturated fatty acid guanamine include guanyl erucamide and decyl oleate. Examples of the di-fatty acid decylamines include, for example, methylenebisoctadecylamine, methylene bismuth oleate, ethylene octadecylamine, and ethylene bismuth oleate. Examples of the higher fatty acid esters include acetylated glycerides, medium chain fatty acid triglycerides having a fluorenyl group having 8 to 12 carbon atoms, and polyglycerin fatty acid esters having at least one alcoholic hydroxyl group.

此外,本發明之積層薄膜係例如依以下所示形態使用。 Further, the laminated film of the present invention is used, for example, in the following form.

(功能性樹脂層轉印薄膜) (functional resin layer transfer film)

本發明之積層薄膜由於成型性、脫模性、加工適性良好,藉由進一步積層功能性樹脂層,可適用於作為具有本發明之積層薄膜與功能性樹脂層的功能性樹脂層轉印薄膜。 The laminated film of the present invention can be suitably used as a functional resin layer transfer film having the laminated film of the present invention and the functional resin layer by further laminating the functional resin layer because of its good moldability, mold release property, and processability.

此處「功能性樹脂層」係指用以對成型構件賦予刮痕抗性或耐候性、色澤、圖樣等,或者對電路構件賦予供形成電路圖案形成之感光性或電磁波遮蔽性的層,係包含例如後述之裝飾薄膜之透明層、著色層、接著層或電磁波遮蔽層轉印薄膜之導電層等。 Here, the "functional resin layer" means a layer for imparting scratch resistance, weather resistance, color, pattern, or the like to a molded member, or providing a circuit member with a photosensitive or electromagnetic wave shielding property for forming a circuit pattern. A transparent layer, a colored layer, a conductive layer of an adhesive layer or an electromagnetic wave shielding layer transfer film, for example, a decorative film to be described later.

又,本發明之功能性樹脂層轉印薄膜乃最表面具有功能性樹脂層的薄膜,意指構成為將最表面之功能性樹脂層以熱或壓力貼合於成型構件或電路構件後剝 離、移除功能性樹脂層以外的部分而成之薄膜,例如包含後述之成型轉印箔或電磁波遮蔽層轉印薄膜。藉由將功能性樹脂層貼合於成型構件或電路構件後移除功能性樹脂層以外的部分,即所謂作成轉印構成,作為裝飾薄膜使用時即不需功能性樹脂層轉印後的修整步驟、或透過功能性樹脂層的薄膜化而可達高性能化、低成本化,就此而言係為較佳者。 Further, the functional resin layer transfer film of the present invention is a film having a functional resin layer on the outermost surface, which means that the functional resin layer of the outermost surface is bonded to the molded member or the circuit member by heat or pressure. The film obtained by removing and removing a portion other than the functional resin layer includes, for example, a molding transfer foil or an electromagnetic wave shielding layer transfer film which will be described later. By bonding the functional resin layer to the molded member or the circuit member and removing the portion other than the functional resin layer, that is, the so-called transfer structure, when the decorative film is used, the trimming after the transfer of the functional resin layer is not required. The step or the thinning of the functional resin layer can achieve high performance and low cost, which is preferable.

(裝飾用薄膜) (decorative film)

本發明之積層薄膜由於成型性、脫模性、加工適性良好,較佳使用於成型用途,其中特別是較佳使用於成型轉印箔用途。於本發明之積層薄膜上積層裝飾層,與成型同時予以轉印至成型體(被轉印體),由此可容易地剝離本發明之積層薄膜與裝飾層,而能夠獲得表面外觀優良之成型構件。以成型轉印箔之構造而言,未予特別限定,較佳為於本發明之積層薄膜上積層裝飾層之構造。於此,裝飾層係為用以附加著色、圖樣、木紋、金屬色調、珍珠色調等的裝飾的層。基於轉印後之成型構件的刮痕抗性、耐候性、設計性觀點,係以進一步積層透明層為較佳。此時,透明層較佳積層於成型用薄膜側。又基於轉印後之成型體(被轉印體)與裝飾層的密接性觀點,係以積層接著層為較佳。此時,接著層較佳積層於成型體(被轉印體)側。 The laminated film of the present invention is preferably used for molding purposes because of its moldability, mold release property, and processability, and particularly preferably used for molding transfer foil. The decorative layer is laminated on the laminated film of the present invention and transferred to the molded body (transferred body) at the same time as molding, whereby the laminated film and the decorative layer of the present invention can be easily peeled off, and the surface having excellent surface appearance can be obtained. member. The structure of the molded transfer foil is not particularly limited, and a structure in which a decorative layer is laminated on the laminated film of the present invention is preferred. Here, the decorative layer is a layer for adding a decoration such as coloring, pattern, wood grain, metallic color, pearl color, or the like. It is preferable to further laminate a transparent layer from the viewpoint of scratch resistance, weather resistance, and designability of the molded member after transfer. At this time, the transparent layer is preferably laminated on the side of the film for molding. Further, it is preferable to use a laminated adhesive layer from the viewpoint of the adhesion between the molded body (transferred body) after transfer and the decorative layer. At this time, the adhesive layer is preferably laminated on the side of the molded body (transferred body).

亦即,作為成型轉印箔之較佳形態,可舉出「本發明之積層薄膜/透明層/裝飾層/接著層」之構造。此處所稱「透明層」,係指位於成型構件之最表層的層, 乃用以提升成型構件的外觀之呈高光澤、高透明的層。又,此處所稱「裝飾層」,係指用以附加著色、凹凸、圖樣、木紋、金屬色調、珍珠色調等的裝飾的層。 In other words, as a preferred embodiment of the molded transfer foil, a structure of the "multilayer film/transparent layer/decorative layer/adjacent layer of the present invention" can be mentioned. The term "transparent layer" as used herein refers to the layer located at the outermost layer of the molded member. It is a layer of high gloss and high transparency for enhancing the appearance of the molded member. Here, the term "decorative layer" as used herein refers to a layer for adding a decoration such as coloring, unevenness, pattern, wood grain, metallic color, pearl color, or the like.

於此,作為透明層使用之樹脂只要為高透明樹脂,則未予特別限定,基於刮痕抗性觀點,係較佳使用熱硬化性樹脂、光或紫外線硬化性樹脂。作為熱硬化性樹脂,較佳使用例如熱硬化性丙烯酸樹脂、苯氧基樹脂、環氧樹脂等;作為光或紫外線硬化性樹脂,則較佳使用胺基甲酸酯丙烯酸酯樹脂、聚酯丙烯酸酯樹脂、不飽和聚酯樹脂、聚矽氧丙烯酸酯樹脂、環氧丙烯酸酯樹脂等。此等樹脂中,可視需求混合光聚合起始劑、硬化劑、硬化促進劑、黏結劑、表面調整劑、顏料、塑化劑、紫外線吸收劑、紫外線反射劑、光安定劑等。此外,透明層所使用的樹脂可為共聚物,亦可為2種以上之樹脂的混合物。再者,當使用光或紫外線硬化樹脂時,基於改良轉印箔的成型性觀點,較佳於成型後實施硬化處理。 Here, the resin used as the transparent layer is not particularly limited as long as it is a highly transparent resin, and a thermosetting resin, a light or an ultraviolet curable resin is preferably used from the viewpoint of scratch resistance. As the thermosetting resin, for example, a thermosetting acrylic resin, a phenoxy resin, an epoxy resin or the like is preferably used. As the light or ultraviolet curable resin, a urethane acrylate resin or a polyester acrylic acid is preferably used. An ester resin, an unsaturated polyester resin, a polyoxy acrylate resin, an epoxy acrylate resin, or the like. Among these resins, a photopolymerization initiator, a hardener, a hardening accelerator, a binder, a surface conditioner, a pigment, a plasticizer, an ultraviolet absorber, an ultraviolet reflector, a light stabilizer, and the like may be mixed as needed. Further, the resin used for the transparent layer may be a copolymer or a mixture of two or more kinds of resins. Further, when a light or ultraviolet curable resin is used, it is preferable to carry out a hardening treatment after molding, from the viewpoint of moldability of the modified transfer foil.

作為透明層的形成方法,可舉出直接形成方法、暫時形成於載體膜並予以轉印的方法等。如需使形成透明層後的乾燥溫度達高溫時,較佳使用暫時形成於載體膜,隨後予以轉印的方法。作為透明層的形成方法,除輥塗裝法、刷毛塗裝法、噴射塗裝法、浸漬塗裝法以外,尚可舉出使用凹版塗布機、模塗布機、缺角輪塗布機(comma coater)、棒塗布機、刮刀塗布機的方法。 Examples of the method for forming the transparent layer include a direct formation method, a method of temporarily forming the carrier film, and transferring the film. If it is desired to bring the drying temperature after the formation of the transparent layer to a high temperature, it is preferred to use a method which is temporarily formed on the carrier film and then transferred. As a method of forming the transparent layer, in addition to the roll coating method, the brush coating method, the spray coating method, and the dip coating method, a gravure coater, a die coater, and a horn coater (comma coater) may be used. ), a bar coater, and a knife coater.

就裝飾層的形成方法而言未予特別限定,可藉由例如塗布、印刷、金屬蒸鍍等來形成。實施塗布時, 可採用凹版塗布法、輥塗布法、缺角輪塗布法等的塗布法。又,實施印刷時,可採用平版印刷法、凹版印刷法、網版印刷法等的印刷法。作為此時所使用的樹脂,較佳使用聚酯系樹脂、聚烯烴系樹脂、丙烯酸系樹脂、胺基甲酸酯系樹脂、氟系樹脂、聚乙酸乙烯酯系樹脂、氯乙烯-乙酸乙烯酯共聚物系樹脂、乙烯-乙酸乙烯酯共聚物系樹脂共聚物等。就使用的著色劑而言未予特別限定,惟考量到分散性等,係由染料、無機顏料、有機顏料等中適當選擇。 The method for forming the decorative layer is not particularly limited, and can be formed, for example, by coating, printing, metal deposition, or the like. When applying the coating, A coating method such as a gravure coating method, a roll coating method, a notch wheel coating method, or the like can be employed. Further, when printing is performed, a printing method such as a lithography method, a gravure printing method, or a screen printing method can be employed. As the resin used at this time, a polyester resin, a polyolefin resin, an acrylic resin, a urethane resin, a fluorine resin, a polyvinyl acetate resin, a vinyl chloride-vinyl acetate is preferably used. A copolymer resin, an ethylene-vinyl acetate copolymer resin copolymer, or the like. The coloring agent to be used is not particularly limited, and is preferably selected from dyes, inorganic pigments, organic pigments, and the like in consideration of dispersibility and the like.

作為對成型體(被黏體、被轉印體)賦予接著 性為目的所設置的接著層之材質,可採用感熱型或者感壓型。當使用藉射出成型等所形成的樹脂成型體作為成型體(被黏體、被轉印體)時,在向此等轉印本發明之積層薄膜的情況下,可根據樹脂來設計接著層。若為丙烯酸系樹脂時,較佳使用丙烯酸系樹脂;若為聚苯醚.聚苯乙烯系樹脂、聚碳酸酯系樹脂、苯乙烯共聚物系樹脂、聚苯乙烯系樹脂時,較佳使用與此等樹脂具親和性的丙烯酸系樹脂、聚苯乙烯系樹脂、聚醯胺系樹脂等。若樹脂成型體包含聚丙烯系樹脂時,則較佳使用氯化聚烯烴系樹脂、氯乙烯-乙酸乙烯酯共聚物系樹脂、環化橡膠、苯并呋喃-茚系樹脂。 As a result of giving a molded body (adhered body, transfer target) The material of the adhesive layer provided for the purpose of the purpose may be a heat sensitive type or a pressure sensitive type. When a resin molded body formed by injection molding or the like is used as a molded body (adhered body or transfer target), when the laminated film of the present invention is transferred thereto, an adhesive layer can be designed according to the resin. In the case of an acrylic resin, an acrylic resin is preferably used; if it is a polyphenylene ether. When a polystyrene resin, a polycarbonate resin, a styrene copolymer resin, or a polystyrene resin is used, an acrylic resin, a polystyrene resin, and a polyamine which have affinity with these resins are preferably used. Resin or the like. When the resin molded body contains a polypropylene resin, a chlorinated polyolefin resin, a vinyl chloride-vinyl acetate copolymer resin, a cyclized rubber, or a benzofuran-ruthenium resin is preferably used.

接著層的形成方法可採用各種方法,可使用 例如輥塗布法、凹版塗布法、缺角輪塗布法等的塗布法,亦可採用例如凹版印刷法、網版印刷等的印刷法。 The method of forming the layer can be carried out by various methods and can be used. For example, a coating method such as a roll coating method, a gravure coating method, or a notch wheel coating method may be employed, for example, a printing method such as a gravure printing method or a screen printing method.

作為使用採用本發明之積層薄膜的成型轉印 箔並經裝飾而成的成型體(被轉印體),未予特別限定,可使用例如聚丙烯、丙烯酸、聚苯乙烯、聚丙烯腈.苯乙烯、聚丙烯腈.丁二烯.苯乙烯等樹脂或金屬構件等。 Form transfer using a laminate film using the present invention The molded body (transferred body) which is decorated with a foil is not particularly limited, and for example, polypropylene, acrylic, polystyrene, or polyacrylonitrile can be used. Styrene, polyacrylonitrile. Butadiene. A resin such as styrene or a metal member.

當使用採用本發明之積層薄膜的成型轉印箔 並對成型體(被轉印體)轉印裝飾層時,可採用真空成型、真空壓空成型、模塞助壓成型、熱壓成型等的各種成型方法。 When using a transfer foil using the laminated film of the present invention When the decorative layer is transferred to the molded body (transferred body), various molding methods such as vacuum forming, vacuum pressure forming, plug assist molding, and hot press forming may be employed.

作為成型的具體方法,若採用例如真空成 型、真空壓空成型時,係將成型轉印箔的四角用成型機所附之框架加以固定,並將成型轉印箔以加熱器等加熱至軟化溫度後,對薄膜施以真空與大氣壓、或者真空與壓空等的壓力差使其對應成型體。成型完畢後,從貼合有成型轉印箔的成型體僅剝離積層薄膜部分,即可獲得轉印有裝飾層的成型體。 As a specific method of molding, if, for example, vacuum is used In the vacuum forming process, the four corners of the forming transfer foil are fixed by the frame attached to the molding machine, and the forming transfer foil is heated to a softening temperature by a heater or the like, and then vacuum and atmospheric pressure are applied to the film. Or the pressure difference between vacuum and pressure is made to correspond to the molded body. After the molding is completed, only the laminated film portion is peeled off from the molded body to which the molded transfer foil is bonded, whereby a molded body to which the decorative layer is transferred can be obtained.

(電磁波遮蔽層轉印薄膜) (electromagnetic wave shielding layer transfer film)

本發明之積層薄膜由於成型性、脫模性、加工適性良好,藉由進一步積層導電層,可適用於作為具有本發明之積層薄膜與導電層的電磁波遮蔽層轉印薄膜。 The laminated film of the present invention is excellent in moldability, mold release property, and processability, and can be suitably used as an electromagnetic wave shielding layer transfer film having the laminated film and the conductive layer of the present invention by further laminating a conductive layer.

於此,導電層較佳為接著劑中含有導電性填料之構成。作為接著劑,可使用聚苯乙烯系、乙酸乙烯酯系、聚酯系、聚乙烯系、聚丙烯系、聚醯胺系、橡膠系、丙烯酸系等之熱塑性樹脂、或酚系、環氧系、胺基甲酸酯系、三聚氰胺系、醇酸系等之熱硬化性樹脂。如 未特別要求耐熱性時,較佳為不受限於保存條件等的聚酯系熱塑性樹脂;如要求耐熱性或更優良之可撓性時,則較佳為形成電磁波遮蔽層後的可靠度高的環氧系熱硬化性樹脂。此外,在任一種樹脂中,均以熱壓時的滲出(樹脂流出)小為較佳。 Here, the conductive layer is preferably configured to contain a conductive filler in the adhesive. As the adhesive, a thermoplastic resin such as a polystyrene type, a vinyl acetate type, a polyester type, a polyethylene type, a polypropylene type, a polyamide type, a rubber type, or an acrylic type, or a phenol type or an epoxy type can be used. A thermosetting resin such as a urethane type, a melamine type or an alkyd type. Such as When heat resistance is not particularly required, it is preferably a polyester-based thermoplastic resin which is not limited to storage conditions and the like; and when heat resistance or more excellent flexibility is required, it is preferable to have high reliability after forming an electromagnetic wave shielding layer. An epoxy-based thermosetting resin. Further, in any of the resins, it is preferred that the bleeding (resin outflow) at the time of hot pressing is small.

作為導電性填料,可使用對碳、銀、銅、鎳、 焊錫、鋁及銅粉實施鍍銀的覆銀銅填料,進而可使用對樹脂珠或玻璃珠等實施金屬鍍敷的填料或此等填料的混合體。由於銀價格高昂、銅缺乏耐熱可靠度、鋁缺乏耐濕可靠度,甚而焊錫不易獲得充分的導電性,故以使用較廉價且具有優良導電性,甚而可靠度高的覆銀銅填料或鎳為較佳。 As a conductive filler, carbon, silver, copper, nickel, Solder, aluminum, and copper powder are silver-plated silver-clad copper fillers, and a metal-plated filler such as resin beads or glass beads or a mixture of such fillers can be used. Due to the high price of silver, the lack of heat resistance reliability of copper, the lack of moisture resistance reliability of aluminum, and the fact that solder is not easy to obtain sufficient conductivity, silver-coated copper filler or nickel which is relatively inexpensive and has excellent electrical conductivity and even high reliability is used. Preferably.

導電性填料在接著性樹脂中的摻混比例係取決於填料之形狀等,若為覆銀銅填料時,係以相對於100質量份之接著性樹脂,較佳採用10~400質量份,更佳為20~150質量份為佳。若超過400質量份時,與接地電路(銅箔)的接著性降低,致印刷配線板等的可撓性劣化。又低於10質量份時則導電性明顯下降。另,若為鎳填料時,係以相對於100質量份之接著性樹脂,較佳採用40~400質量份,更佳為100~350質量份為佳。若超過400質量份時,與接地電路(銅箔)的接著性降低,致遮蔽性FPC等的可撓性劣化。又低於40質量份時則導電性明顯下降。金屬填料之形狀可為球狀、針狀、纖維狀、片狀、樹脂狀之任一種。且,上述導電性填料較佳為低熔點金屬。 The blending ratio of the conductive filler in the adhesive resin depends on the shape of the filler, etc., and in the case of the silver-coated copper filler, it is preferably 10 to 400 parts by mass based on 100 parts by mass of the adhesive resin. It is better to use 20 to 150 parts by mass. When the amount is more than 400 parts by mass, the adhesion to the ground circuit (copper foil) is lowered, and the flexibility of the printed wiring board or the like is deteriorated. When the amount is less than 10 parts by mass, the electrical conductivity is remarkably lowered. Further, in the case of the nickel filler, it is preferably 40 to 400 parts by mass, more preferably 100 to 350 parts by mass, per 100 parts by mass of the adhesive resin. When the amount is more than 400 parts by mass, the adhesion to the ground circuit (copper foil) is lowered, and the flexibility such as the shielding FPC is deteriorated. When the amount is less than 40 parts by mass, the electrical conductivity is remarkably lowered. The shape of the metal filler may be any of a spherical shape, a needle shape, a fiber shape, a sheet shape, and a resin shape. Further, the conductive filler is preferably a low melting point metal.

採用本發明之積層薄膜的電磁波遮蔽層轉印 薄膜係於積層薄膜與導電層之間設置藉由蒸鍍等所製作的薄金屬層,可減少導電層之厚鍍同時提升電磁波遮蔽性。金屬層可列舉例如鎳、銅、銀、錫、金、鈀、鋁、鉻、鈦、鋅及包含此等材料的任一種以上之合金當中的任一種材料,金屬材料及厚度只要依據所要求的電磁波遮蔽特性及重複彎曲-滑動耐性來適當選擇即可。此外,就厚度而言,較佳為0.1μm~8μm之厚度。作為金屬層的形成方法,係有電鍍法、無電鍍法、濺鍍法、電子束蒸鍍法、真空蒸鍍法、CVD(Chemical Vapor Deposition)法、使用金屬有機糊料進行印刷、燒成之方法等。 Electromagnetic wave shielding layer transfer using the laminated film of the present invention The thin film is provided with a thin metal layer formed by vapor deposition or the like between the laminated film and the conductive layer, thereby reducing the thickness plating of the conductive layer and improving the electromagnetic wave shielding property. The metal layer may, for example, be any one of nickel, copper, silver, tin, gold, palladium, aluminum, chromium, titanium, zinc, and any one or more of alloys containing such materials, and the metal material and thickness may be as required. The electromagnetic wave shielding characteristics and the repeated bending-sliding resistance can be appropriately selected. Further, in terms of thickness, the thickness is preferably from 0.1 μm to 8 μm. Examples of the method for forming the metal layer include a plating method, an electroless plating method, a sputtering method, an electron beam evaporation method, a vacuum vapor deposition method, a CVD (Chemical Vapor Deposition) method, and printing and firing using a metal organic paste. Method, etc.

作為本發明之積層薄膜其充作電磁波遮蔽層 轉印薄膜而對FPC轉印電磁波遮蔽層的方法,可採用真空成型、真空壓空成型、模塞助壓成型、熱壓成型等的各種成型方法。 As a laminated film of the present invention, it acts as an electromagnetic shielding layer The method of transferring the film and transferring the electromagnetic wave shielding layer to the FPC may employ various molding methods such as vacuum forming, vacuum pressure forming, plug assist molding, and hot press forming.

作為成型的具體方法,在例如採用熱壓成型 時,係將FPC之凹凸基板側與電磁波遮蔽層轉印薄膜之電磁波遮蔽層側重疊後,自電磁波遮蔽層轉印薄膜側以加熱之金屬板進行衝壓,使電磁波遮蔽層轉印薄膜對應FPC之凹凸。成型完畢後,從貼合有電磁波遮蔽層轉印薄膜的FPC僅剝離積層薄膜部分,即可獲得轉印有電磁波遮蔽層的FPC(遮蔽性FPC)。 As a specific method of molding, for example, by hot press forming When the concave-convex substrate side of the FPC is overlapped with the electromagnetic wave shielding layer side of the electromagnetic wave shielding layer transfer film, the electromagnetic wave shielding layer transfer film side is pressed by the heated metal plate, and the electromagnetic wave shielding layer transfer film corresponds to the FPC. Bump. After the molding is completed, the FPC (shielding FPC) to which the electromagnetic wave shielding layer is transferred is obtained by peeling only the laminated film portion from the FPC to which the electromagnetic wave shielding layer transfer film is bonded.

(包裝用薄膜) (film for packaging)

本發明之積層薄膜可作為包裝用薄膜使用。將本發明之積層薄膜作為包裝用薄膜使用時,由於A層 可提升水蒸氣阻隔性、B層可提升熱封性,得以適用於作為鋰離子電池之外裝用薄膜或食品包裝用薄膜、醫療用包裝薄膜之各種包裝用薄膜。作為包裝用薄膜的一般構造,例如係組合雙軸拉伸聚對苯二甲酸乙二酯薄膜(以下稱為BO-PET)、雙軸拉伸尼龍薄膜(以下稱為ONy)、聚丙烯系未延伸薄膜(以下稱為CPP)及鋁箔(以下稱為Al箔)而作成BO-PET/ONy/Al箔/CPP、BO-PET/Al箔/ONy/CPP或BO-PET/Al箔/CPP構造之積層體後,將CPP層側製成袋體而使用;藉由使用本發明之積層薄膜作為該CPP層,可作成使所製袋體端部之水蒸氣阻隔性較習知CPP層更良好的包裝用薄膜。 The laminated film of the present invention can be used as a film for packaging. When the laminated film of the present invention is used as a film for packaging, the layer A is It can improve the water vapor barrier property and the B layer can improve the heat sealability, and can be applied to various packaging films which are used as a film for lithium ion battery, a film for food packaging, and a film for medical use. As a general structure of the film for packaging, for example, a biaxially stretched polyethylene terephthalate film (hereinafter referred to as BO-PET), a biaxially stretched nylon film (hereinafter referred to as ONy), or a polypropylene system is used. Stretch film (hereinafter referred to as CPP) and aluminum foil (hereinafter referred to as Al foil) to form BO-PET/ONy/Al foil/CPP, BO-PET/Al foil/ONy/CPP or BO-PET/Al foil/CPP structure After the laminated body, the CPP layer side is used as a bag body; by using the laminated film of the present invention as the CPP layer, the water vapor barrier property of the end portion of the bag body can be made better than the conventional CPP layer. Packaging film.

又,本發明之積層薄膜係以滿足以下特性(之任一種以上或全部)為佳。 Further, the laminated film of the present invention preferably satisfies the following characteristics (any one or more or all of them).

(表面粗糙度) (Surface roughness)

本發明之積層薄膜其表面粗糙度SRa在兩面均為50nm以上3,000nm以下,基於捲繞性、設計性、生產性觀點係較佳者。若任一面之Sra小於50nm、另一面之SRa為50nm以上時,本發明之積層薄膜在加工步驟、成型步驟中被加熱之際,有在表面粗糙度SRa較大側的層(SRa為50nm以上的層)大量累積的應變被釋放,使得表面粗糙度SRa較大側的層之表面凹凸變小的情況。只要兩面之表面粗糙度SRa均為50nm以上,縱使粗糙度存在差異,凹凸的降低亦較小;本發明之積層薄膜特別在要求消光設計時,係以其兩側表面之表面粗糙度SRa在兩面均為50nm以上為佳。 The laminated film of the present invention has a surface roughness SRa of 50 nm or more and 3,000 nm or less on both sides, and is preferable from the viewpoints of winding properties, design properties, and productivity. When the laminated film of the present invention is heated in the processing step or the molding step, the layer having a larger surface roughness SRa (SRa is 50 nm or more) when the Sra of the surface is less than 50 nm and the surface of the other surface is 50 nm or more. The layer is accumulated in a large amount, and the surface unevenness of the layer on the larger side of the surface roughness SRa becomes smaller. As long as the surface roughness SRa of both sides is 50 nm or more, even if the roughness is different, the reduction of the unevenness is small; the laminated film of the present invention has a surface roughness SRa on both sides of the surface of the laminated film, particularly when the matte design is required. It is preferably 50 nm or more.

此外,入射至薄膜之任一面(方便上稱作「A 面」)的光係於薄膜A面與大氣之間的界面進行折射.反射。其後,進入薄膜內部的光係於薄膜之另一面(方便上稱作「B面」)與大氣之間的界面進行折射.反射,並朝薄膜的外部射出。因此,藉由使積層薄膜之兩表面之表面粗糙度SRa成為50nm以上,可使光分別於2處界面(A面與大氣之間的界面及B面與大氣之間的界面)進行折射.反射。亦即,使光入射至本發明之積層薄膜時可減少直進穿透的光的量,就其結果,可提升薄膜之白色度,因薄膜之視覺辨識性良好(可容易與成型體(被轉印體)目視判別)而較佳。 In addition, it is incident on either side of the film (referred to as "A" The light of the surface is refracted at the interface between the surface of the film A and the atmosphere. reflection. Thereafter, the light entering the inside of the film is refracted at the interface between the other side of the film (referred to as "B side" as convenient) and the atmosphere. Reflect and shoot toward the outside of the film. Therefore, by making the surface roughness SRa of both surfaces of the laminated film 50 nm or more, the light can be refracted at the interface (the interface between the A surface and the atmosphere and the interface between the B surface and the atmosphere) at two interfaces. reflection. That is, when the light is incident on the laminated film of the present invention, the amount of light that is directly penetrated can be reduced, and as a result, the whiteness of the film can be improved, and the visibility of the film is good (it can be easily combined with the molded body). It is preferable to print (visually discriminate).

又SRa超過3,000nm時,由於表面之凹凸變 大,對於積層有功能性樹脂層的面,將功能性樹脂層積層於本發明之積層薄膜時未能使氣泡脫離,而有發生外觀不良或功能性樹脂層之功能性下降(電磁波遮蔽層之電磁波遮蔽性下降)的情況。加之,有無法在積層薄膜之表面凹凸的凹部分均勻積層功能性樹脂層的情況。在此種情況下,由於功能性樹脂層與積層薄膜相接的部分僅形成凸部分,而有積層薄膜與功能性樹脂層之密接性不充分的情況。 When the SRa exceeds 3,000 nm, the surface is uneven. When the functional resin layer is laminated on the laminated film having the functional layer of the present invention, the bubbles are not detached, and the appearance is poor or the functional layer of the functional resin is degraded (electromagnetic wave shielding layer) The case where the electromagnetic wave shielding property is lowered). In addition, there is a case where the functional resin layer cannot be uniformly laminated on the concave portion of the surface of the laminated film. In this case, since the portion where the functional resin layer and the laminated film are in contact with each other forms only a convex portion, the adhesion between the laminated film and the functional resin layer may be insufficient.

再者,將本發明之積層薄膜捲成捲筒狀保存 時,係以積層有功能性樹脂層的面(以下有稱作第1面)與第1面之相反側的面(以下有稱作第2面)直接相接的狀態保存;換言之,乃以第2面壓接於第1面的狀態保存。從而,便有第2面之表面形狀(表面粗糙度)被轉印 至第1面之表面,以致第1面之表面形狀發生變形之情事。如前述,由於第1面之表面粗糙度較佳為3,000nm以下,若考量受到第2面之表面形狀的影響使第1面之表面形狀發生變化的可能性,第2面之表面粗糙度亦較佳為3,000nm以下。 Furthermore, the laminated film of the present invention is rolled into a roll shape for storage In the case where the surface on which the functional resin layer is laminated (hereinafter referred to as the first surface) is directly in contact with the surface on the opposite side of the first surface (hereinafter referred to as the second surface); in other words, The second surface is held in a state of being pressed against the first surface. Therefore, the surface shape (surface roughness) of the second surface is transferred The surface of the first surface is deformed so that the surface shape of the first surface is deformed. As described above, since the surface roughness of the first surface is preferably 3,000 nm or less, the surface roughness of the first surface may be changed by the influence of the surface shape of the second surface, and the surface roughness of the second surface may be It is preferably 3,000 nm or less.

基於上述,本發明之積層薄膜其兩面之表面粗糙度SRa較佳為3,000nm以下。 Based on the above, the laminated film of the present invention preferably has a surface roughness SRa of 3,000 nm or less on both surfaces.

作為使表面粗糙度SRa成為50nm以上3,000nm的方法,可舉出例如將從噴嘴擠出的薄膜狀熔融聚合物,予以夾入於表面經調整為適當粗糙度的2根輥間並冷卻固化而製成薄膜,在將輥之粗糙度轉印至薄膜兩面的方法等。再者,就2根輥而言,基於厚度不均的調整容易度、輥之表面粗糙度的轉印容易度、易將均勻的粗糙度圖案轉印至薄膜觀點,係以1根採用橡膠輥、另1根採用金屬輥為佳。 As a method of setting the surface roughness SRa to 50 nm or more and 3,000 nm, for example, a film-like molten polymer extruded from a nozzle is sandwiched between two rolls whose surface is adjusted to have appropriate roughness and cooled and solidified. A method of forming a film, transferring the roughness of the roll to both sides of the film, or the like. In addition, in the case of the two rolls, the ease of adjustment based on the thickness unevenness, the ease of transfer of the surface roughness of the roll, and the transfer of the uniform roughness pattern to the film viewpoint are as follows. Another one is preferably a metal roller.

(霧度) (haze)

本發明之積層薄膜在作為功能性樹脂之轉印薄膜使用時,為了防止剝離殘餘或忘記剝離,其霧度較佳為65%以上90%以下。積層薄膜之霧度小於65%時,根據成型體(被轉印體)的顏色有不易進行薄膜有無之目視識別的情況。又積層薄膜之霧度超過90%時,會有在塗布功能性樹脂層之際,不易從塗布面之相反側的面目視塗布狀態的情況。舉例來說,本發明之積層薄膜所使用的裝飾薄膜係採用「積層薄膜/透明層/裝飾層/接著層」之構造,「透明層/裝飾層/接著層」係相當於功能性樹脂 層。其後,使用所述裝飾薄膜向成型體轉印功能性樹脂層,則位於成型構件之最表層的層便成為透明層。因此,只要能夠藉由例如在轉印步驟前確認功能性樹脂層之塗布狀態來預先指定透明層的瑕疵處,便可避開該瑕疵處地向成型體轉印(於透明層不含瑕疵的)功能性樹脂層,就其結果,能以高產率獲得外觀優良之成型構件。換言之,若積層薄膜之霧度為90%以下時,由於在塗布功能性樹脂層之際,易於從塗布面之相反側的面目視塗布狀態,就其結果,能以高產率獲得外觀優良之成型構件。 另一方面,亦即積層薄膜之霧度超過90%時,由於在塗布功能性樹脂層之際不易從塗布面之相反側的面目視塗布狀態,故而有未能以高產率獲得外觀優良之成型構件的情況。 When the laminated film of the present invention is used as a transfer film of a functional resin, the haze is preferably 65% or more and 90% or less in order to prevent peeling residue or forgetting to peel off. When the haze of the laminated film is less than 65%, it is difficult to visually recognize the presence or absence of the film depending on the color of the molded body (transferred body). When the haze of the laminated film is more than 90%, it may be difficult to visually coat the surface from the opposite side of the coated surface when the functional resin layer is applied. For example, the decorative film used in the laminated film of the present invention is constructed by "layered film/transparent layer/decorative layer/adhesive layer", and "transparent layer/decorative layer/adhesive layer" is equivalent to functional resin. Floor. Thereafter, when the functional resin layer is transferred to the molded body using the decorative film, the layer located on the outermost layer of the molded member becomes a transparent layer. Therefore, if the position of the transparent layer can be specified in advance by, for example, confirming the application state of the functional resin layer before the transfer step, the transfer to the molded body can be avoided (the transparent layer is free from defects). As a result, the functional resin layer can obtain a molded member excellent in appearance in a high yield. In other words, when the haze of the laminated film is 90% or less, it is easy to visually coat the surface from the opposite side of the coated surface when the functional resin layer is applied, and as a result, it is possible to obtain an excellent appearance in a high yield. member. On the other hand, when the haze of the laminated film is more than 90%, it is difficult to visually coat the surface from the opposite side of the coated surface when the functional resin layer is applied, so that it is not possible to obtain an excellent appearance in a high yield. The condition of the component.

為使積層薄膜之霧度成為65%以上90%以 下,可舉出例如使積層薄膜製造時將熔融聚合物冷卻固化的輥其兩面之表面粗糙度SRa均達50nm以上3,000nm以下的方法等。由於表面粗糙度愈大,光入射至薄膜表面時,光進行折射的界面(薄膜表面與大氣之間的界面)的方向愈多樣化,於薄膜內沿薄膜厚度方向直進的光的量愈少,致霧度愈高。 In order to make the haze of the laminated film 65% or more and 90% For example, a method in which the surface roughness SRa of both surfaces of the roll for cooling and solidifying the molten polymer in the production of the laminated film is 50 nm or more and 3,000 nm or less is used. The larger the surface roughness, the more diversified the direction of the light-refracting interface (the interface between the film surface and the atmosphere) when light is incident on the surface of the film, and the less the amount of light that moves straight in the film thickness direction. The higher the degree of fogging.

惟,若過度增大表面粗糙度至霧度值超過 90%(如表面粗糙度超過3,000nm),則有B層之表面凹凸過大,以致在B層局部產生厚度較薄之處所的情況。若在B層局部存在厚度較薄之處所,便有以該處所為起點發生與A層剝離之情事,就其結果,有A層/B層間之密接性下降的情況。 However, if the surface roughness is excessively increased until the haze value exceeds When 90% (e.g., the surface roughness exceeds 3,000 nm), the surface of the layer B has an excessively large unevenness, so that a portion where the thickness is thin in the layer B is locally generated. If there is a portion where the thickness is thin in the B layer, there is a case where the layer A is peeled off from the point where the layer is removed, and as a result, the adhesion between the layer A and the layer B is lowered.

又作為用以使積層薄膜之霧度成為65%以上 90%以下的其他方法,可舉出增大本發明積層薄膜之厚度並增加在薄膜內部之光的折射處來提高霧度的方法等。具體而言,薄膜之厚度較佳為100~300μm。又,亦較佳採用相對於積層薄膜全體,使其含有1~20質量%之氧化鈦等周知著色顏料的方法。 Also used to make the haze of the laminated film 65% or more The other method of 90% or less may be a method of increasing the thickness of the laminated film of the present invention and increasing the refraction of light inside the film to increase the haze. Specifically, the thickness of the film is preferably from 100 to 300 μm. Moreover, it is also preferable to use a method of containing a known coloring pigment such as titanium oxide in an amount of 1 to 20% by mass based on the entire laminated film.

惟,又當積層薄膜之霧度超過90%時,在使 積層薄膜大量含有氧化鈦等周知著色顏料來增大霧度的情況下,若過度提高著色顏料之含有率至霧度值超過90%(如使著色顏料之含有率超過20質量%),則有在A層/B層的界面處亦存在大量著色顏料的情況。從而,在A層/B層的界面,構成A層之樹脂與構成B層之樹脂可密接的部分變少,就其結果,有A層/B層間之密接性降低的情況。 However, when the haze of the laminated film exceeds 90%, When the laminated film contains a large amount of a known colored pigment such as titanium oxide to increase the haze, if the content of the colored pigment is excessively increased to a haze value of more than 90% (for example, the content of the colored pigment exceeds 20% by mass), A large amount of coloring pigment is also present at the interface of the A layer/B layer. Therefore, at the interface between the layer A and the layer B, the portion of the resin constituting the layer A and the resin constituting the layer B are less likely to adhere, and as a result, the adhesion between the layer A and the layer B may be lowered.

(色調) (tone)

本發明之積層薄膜在作為功能性樹脂之轉印薄膜使用時,為了防止剝離殘餘或忘記剝離,其基於JIS P8123-1961在穿透模式下所量測的色調L值較佳為75以上100以下。色調L值小於75時,根據成型體(被轉印體)的顏色有不易進行薄膜有無之目視識別的情況。色調L值可作為白色性之標準值使用,特別是在成型體(被轉印體)之色調為暗色調時,若本發明之積層薄膜之色調L值為75以上,則可有效防止剝離殘餘或忘記剝離。 When the laminated film of the present invention is used as a transfer film of a functional resin, the color tone L value measured in the penetration mode based on JIS P8123-1961 is preferably 75 or more and 100 or less in order to prevent peeling residue or forgetting to peel off. . When the color tone L value is less than 75, it may be difficult to visually recognize the presence or absence of the film depending on the color of the molded body (transferred body). The color tone L value can be used as a standard value of whiteness, and particularly when the color tone of the molded film of the present invention is a dark color tone, if the color tone L value of the laminated film of the present invention is 75 or more, peeling residue can be effectively prevented. Or forget to strip.

又積層薄膜之色調L值超過100%時,會有在塗布功能性樹脂層之際,不易從塗布面之相反側的面 目視塗布狀態的情況。舉例來說,本發明之積層薄膜所使用的裝飾薄膜係採用「積層薄膜/透明層/裝飾層/接著層」之構造,「透明層/裝飾層/接著層」係相當於功能性樹脂層。其後,使用所述裝飾薄膜向成型體轉印功能性樹脂層,則位於成型構件之最表層的層便成為透明層。 因此,只要能夠藉由例如在轉印步驟前確認功能性樹脂層之塗布狀態來預先指定透明層的瑕疵處,便可避開該瑕疵處地向成型體轉印(於透明層不含瑕疵的)功能性樹脂層,就其結果,能以高產率獲得外觀優良之成型構件。 換言之,若積層薄膜之色調L值為100時,由於在塗布功能性樹脂層之際,呈現可從塗布面之相反側的面目視塗布狀態之程度的白色狀態,就其結果,能以高產率獲得外觀優良之成型構件。另一方面,亦即積層薄膜之色調L值為100時,由於在塗布功能性樹脂層之際有時呈現不易從塗布面之相反側的面目視塗布狀態的白色狀態,故而有未能以高產率獲得外觀優良之成型構件的情況。 When the color tone L value of the laminated film exceeds 100%, the surface of the opposite side of the coated surface is hard to be applied when the functional resin layer is applied. The condition of the coating state was visually observed. For example, the decorative film used in the laminated film of the present invention has a structure of "layered film/transparent layer/decorative layer/adhesive layer", and "transparent layer/decorative layer/adhesive layer" corresponds to a functional resin layer. Thereafter, when the functional resin layer is transferred to the molded body using the decorative film, the layer located on the outermost layer of the molded member becomes a transparent layer. Therefore, if the position of the transparent layer can be specified in advance by, for example, confirming the application state of the functional resin layer before the transfer step, the transfer to the molded body can be avoided (the transparent layer is free from defects). As a result, the functional resin layer can obtain a molded member excellent in appearance in a high yield. In other words, when the color tone L value of the laminated film is 100, when the functional resin layer is applied, it exhibits a white state which can be visually coated from the opposite side of the coated surface, and as a result, high yield can be obtained. A molded member having an excellent appearance is obtained. On the other hand, when the color tone L value of the laminated film is 100, the functional state of the functional resin layer may be difficult to produce in a white state due to the fact that it is not easily visually applied from the opposite side of the coated surface. The rate is obtained in the case of a molded member having an excellent appearance.

惟,若過度增大表面粗糙度至積層薄膜之色 調L值超過100(例如表面粗糙度超過3,000nm),則有B層之表面凹凸過大,以致在B層局部產生厚度較薄之處所的情況。若在B層局部存在厚度較薄之處所,便有以該處所為起點發生與A層剝離之情事,就其結果,有A層/B層間之密接性下降的情況。 However, if the surface roughness is excessively increased to the color of the laminated film When the L value exceeds 100 (for example, the surface roughness exceeds 3,000 nm), the surface unevenness of the B layer is too large, so that a portion where the thickness is thin in the B layer is locally generated. If there is a portion where the thickness is thin in the B layer, there is a case where the layer A is peeled off from the point where the layer is removed, and as a result, the adhesion between the layer A and the layer B is lowered.

惟,又當積層薄膜之色調L值超過100時,在使積層薄膜大量含有氧化鈦等周知著色顏料來增大色 調L值的情況下,若過度提高著色顏料之含有率至色調L值超過100(例如使著色顏料之含有率超過20質量%),則有在A層/B層的界面處亦存在大量著色顏料的情況。 從而,在A層/B層的界面,構成A層之樹脂與構成B層之樹脂可密接的部分變少,就其結果,有A層/B層間之密接性降低的情況。 However, when the L-value of the laminated film exceeds 100, the laminated film is made to contain a large amount of a known coloring pigment such as titanium oxide to increase the color. When the L value is adjusted, if the content of the coloring pigment is excessively increased until the color tone L value exceeds 100 (for example, the content of the coloring pigment exceeds 20% by mass), there is also a large amount of coloring at the interface of the A layer/B layer. The case of pigments. Therefore, at the interface between the layer A and the layer B, the portion of the resin constituting the layer A and the resin constituting the layer B are less likely to adhere, and as a result, the adhesion between the layer A and the layer B may be lowered.

作為用以使色調L值成為75以上100以下 的其他方法,可舉出增大本發明積層薄膜之厚度並增加在薄膜內部之光的折射處來提高霧度的方法等。 The color L value is set to be 75 or more and 100 or less. As another method, a method of increasing the thickness of the laminated film of the present invention and increasing the refraction of light inside the film to increase the haze may be mentioned.

為使積層薄膜之色調L值成為75以上100 以下,可舉出相對於積層薄膜全體,使其含有1~20質量%之氧化鈦等周知著色顏料的方法方法、使積層薄膜製造時將熔融聚合物冷卻固化的輥之表面粗糙度SRa達50nm以上3,000nm以下的方法等。此外,表面粗糙度SRa愈大,積層薄膜的外觀愈白,色調L值愈大。 In order to make the laminated film have a hue L value of 75 or more and 100 In the following, a method for preparing a known coloring pigment such as titanium oxide in an amount of 1 to 20% by mass based on the entire laminated film, and a surface roughness SRa of a roller for cooling and solidifying the molten polymer in the production of the laminated film is 50 nm. The above method of 3,000 nm or less. Further, the larger the surface roughness SRa, the whiter the appearance of the laminated film, and the larger the tone L value.

另外作為其他方法,可舉出針對本發明積層 薄膜之厚度,將薄膜調整至厚達100~300μm,藉以提高本發明積層薄膜之白色度並增大色調L值的方法等。 In addition, as another method, a laminate for the present invention can be cited. The thickness of the film is adjusted to a thickness of 100 to 300 μm to improve the whiteness of the laminated film of the present invention and to increase the color tone L value.

(積層比、厚度) (layering ratio, thickness)

本發明之積層薄膜在例如需有對微細形狀之對應性的電磁波遮蔽層轉印薄膜用途中,其積層比(B層之合計厚度(μm)/A層之厚度(μm))為0.1以上0.15以下,基於對微細形狀之成型性觀點係較佳者。此外,當積層薄膜具有2層B層,即在A層的兩面具有B層時,其積層比(B層之合計厚度(μm)/A層之厚度(μm))為[存在2層 之B層之厚度的合計]/[A層之厚度]。另一方面,當積層薄膜具有1層B層,即僅在A層的單面具有B層時,積層比(B層之合計厚度(μm)/A層之厚度(μm))為[B層之厚度]/[A層之厚度]。 In the use of the laminated film of the present invention, for example, in the electromagnetic wave shielding layer transfer film which is required to have a fine shape, the laminate ratio (the total thickness (μm) of the layer B/the thickness (μm) of the layer A) is 0.1 or more and 0.15. Hereinafter, it is preferable based on the viewpoint of the moldability of a fine shape. Further, when the laminated film has two B layers, that is, when the B layer is formed on both sides of the A layer, the laminated ratio (the total thickness (μm) of the B layer / the thickness (μm) of the A layer) is [there are two layers The total thickness of the B layer] / [the thickness of the A layer]. On the other hand, when the build-up film has one B layer, that is, the B layer is formed only on one side of the A layer, the buildup ratio (the total thickness of the B layer (μm) / the thickness of the A layer (μm)) is [B layer Thickness] / [thickness of layer A].

若積層比小於0.1時,有B層之厚度不均變 大而產生B層之厚度極薄之部分的情況。在此種情況下,有生成脫模性良好之B層未能充分積層之部分,而有在積層薄膜之B層側的表面,A層露出的情況。且,就其結果,有脫模性不充分、A層與B層之層間密接性不充分的情況。 If the laminate ratio is less than 0.1, the thickness of the B layer is uneven. Larger case where the thickness of the B layer is extremely thin. In this case, there is a case where the layer B having a good mold release property is not sufficiently laminated, and the layer A is exposed on the surface on the side of the layer B of the laminated film. Further, as a result, the mold release property is insufficient, and the adhesion between the layers of the layer A and the layer B is insufficient.

若積層比超過0.15時,則因B層增厚的影 響而有對微細形狀之成型性不充分的情況。積層比可藉由利用掃描式電子顯微鏡、穿透式電子顯微鏡、光學顯微鏡等,以500倍以上10,000倍以下之倍率觀察薄膜的剖面來量測。 If the laminate ratio exceeds 0.15, the thickness of the B layer is thickened. There is a case where the moldability of the fine shape is insufficient. The laminate ratio can be measured by observing the cross section of the film at a magnification of 500 times or more and 10,000 times or less by using a scanning electron microscope, a transmission electron microscope, an optical microscope, or the like.

另一方面,例如將本發明之積層薄膜作為裝 飾用薄膜使用時,就本發明之積層薄膜,基於A層與B層之層間密接性、脫模性、加工適性觀點,其積層比(B層之合計厚度(μm)/A層之厚度(μm))較佳為0.25以上2以下。 On the other hand, for example, the laminated film of the present invention is packaged When the decorative film is used, the laminated film of the present invention has a laminate ratio (the total thickness of the layer B (μm) / the thickness of the layer A based on the adhesion between the layers of the layer A and the layer B, the mold release property, and the processing suitability ( Μm)) is preferably 0.25 or more and 2 or less.

特別是在對使用本發明之裝飾用薄膜並增大積層薄膜之成型倍率之類的成型體成型轉印裝飾層時,裝飾用薄膜係沿著成型體之形狀朝深度方向壓入極深。其後,從裝飾用薄膜僅剝離積層薄膜時,有時需要大的力(剝離力)。因此,在此種情況下,A層與B層之層間密接性有時係愈高愈佳。 In particular, when the decorative decorative layer is molded by using the decorative film of the present invention and the molding magnification of the laminated film is increased, the decorative film is pushed deep into the depth direction along the shape of the molded body. Thereafter, when only the laminated film is peeled off from the decorative film, a large force (peeling force) is sometimes required. Therefore, in this case, the adhesion between the layers of the A layer and the B layer is sometimes higher.

若積層比(B層之合計厚度(μm)/A層之厚度 (μm))小於0.25時,有A層與B層之層間密接性、脫模性不充分的情況,而超過2時,則有加工適性不充分的情況。此外,就積層比(B層之合計厚度(μm)/A層之厚度(μm))而言,當存在2層B層,即在A層的兩面具有B層時,係為存在2層之B層之厚度的合計/A層之厚度;當存在1層B層,即僅在A層的單面具有B層時,則為B層之厚度/A層之厚度。積層比(B層之合計厚度(μm)/A層之厚度(μm))若為0.25以上1.2以下則更佳,若為0.25以上0.5以下則特佳。積層比可藉由利用掃描式電子顯微鏡、穿透式電子顯微鏡、光學顯微鏡等,以500倍以上10,000倍以下之倍率觀察薄膜的剖面來量測。 If the laminate ratio (the total thickness of layer B (μm) / thickness of layer A When (μm) is less than 0.25, the adhesion between the layers of the A layer and the B layer may be insufficient, and the mold release property may be insufficient. When the thickness exceeds 2, the workability may be insufficient. Further, in terms of the buildup ratio (the total thickness of the B layer (μm) / the thickness (μm) of the A layer), when there are two B layers, that is, when there are B layers on both sides of the A layer, there are two layers. The total thickness of the B layer / the thickness of the A layer; when there is one B layer, that is, only the B layer on one side of the A layer, the thickness of the B layer / the thickness of the A layer. The laminate ratio (the total thickness (μm) of the layer B/the thickness (μm) of the layer A) is more preferably 0.25 or more and 1.2 or less, and particularly preferably 0.25 or more and 0.5 or less. The laminate ratio can be measured by observing the cross section of the film at a magnification of 500 times or more and 10,000 times or less by using a scanning electron microscope, a transmission electron microscope, an optical microscope, or the like.

就本發明之積層薄膜,基於A層與B層之 層間密接性、成型性、脫模性、加工適性觀點,薄膜之總厚度較佳為40μm以上300μm以下。更佳為60μm以上200μm以下,再佳為80μm以上150μm以下。薄膜之總厚度小於40μm時,有A層與B層之層間密接性、加工適性不充分的情況。又薄膜總厚度超過300μm時,則有成型性不充分的情況。 For the laminated film of the present invention, based on the A layer and the B layer The total thickness of the film is preferably 40 μm or more and 300 μm or less from the viewpoint of interlayer adhesion, moldability, mold release property, and process suitability. More preferably, it is 60 μm or more and 200 μm or less, and more preferably 80 μm or more and 150 μm or less. When the total thickness of the film is less than 40 μm, the adhesion between the layers of the A layer and the B layer may be insufficient, and the processing suitability may be insufficient. When the total thickness of the film exceeds 300 μm, moldability may be insufficient.

本發明之B層可採用從T字模將B層之熔 融樹脂擠出成薄膜狀,並在具有A層構造的單層薄膜上予以冷卻固化並貼合的擠製積層法、以個別的擠製機擠出A層與B層之樹脂後,用分層器(feedblock)予以積層,再將排出自T字模的樹脂以冷卻輥固化的共擠製法等周知方法來得到。 The B layer of the present invention can be used to melt the B layer from the T-shaped mold. The molten resin is extruded into a film, and is extruded and laminated on a single layer film having an A-layer structure, and the resin of the A layer and the B layer is extruded by an individual extruder. The feedblock is laminated, and the resin discharged from the T-die is obtained by a known method such as a co-extrusion method in which a cooling roll is solidified.

(A層與B層之剝離強度) (peel strength of layer A and layer B)

就本發明之積層薄膜,基於層間密接性觀點,A層與B層之180℃剝離試驗下的剝離強度較佳為0.5N/10mm以上5N/10mm以下。若剝離強度小於0.5N/10mm時,於各種加工之際或轉印功能性樹脂之際有在A層與B層之間發生剝離,導致加工性下降、或功能性樹脂的轉印不充分的情況。此外,剝離強度係愈高愈佳,惟視提升剝離強度的方法而定,有積層薄膜的外觀變差的情況,從而較佳為5N/10mm以下。 In the laminated film of the present invention, the peel strength under the 180° C peel test of the A layer and the B layer is preferably 0.5 N/10 mm or more and 5 N/10 mm or less from the viewpoint of interlayer adhesion. When the peeling strength is less than 0.5 N/10 mm, peeling occurs between the layer A and the layer B at the time of various processing or transfer of the functional resin, resulting in deterioration of workability or insufficient transfer of the functional resin. Happening. Further, the higher the peel strength, the better, but depending on the method of improving the peel strength, the appearance of the laminated film may be deteriorated, and it is preferably 5 N/10 mm or less.

作為使本發明之積層薄膜的A層與B層之剝離強度成為0.5N/10mm以上5N/10mm以下的方法,較佳採用「若B層以聚乙烯系樹脂為主成分時,A層以COC為主成分,若B層以聚丙烯系樹脂為主成分時,使A層以COP為主成分」的方法;使A層含有乙烯系共聚合樹脂的方法;設流延鼓輪(casting drum,即金屬輥)之溫度為40℃以上來活化各層聚合物鏈的運動並同時進行流延,藉此增加A層與B層的界面之交絡的方法;以夾持輥方式製造,並設夾持壓為0.2~1.0MPa的方法及彼等之組合等。 When the peeling strength of the layer A and the layer B of the laminated film of the present invention is 0.5 N/10 mm or more and 5 N/10 mm or less, it is preferable to use "when the layer B is mainly composed of a polyethylene resin, the layer A is COC. When the B layer is composed of a polypropylene resin as a main component, the A layer is mainly composed of COP, and the A layer contains a vinyl copolymer resin; a casting drum is provided. That is, the temperature of the metal roll) is 40 ° C or more to activate the movement of the polymer chains of the respective layers and simultaneously cast, thereby increasing the entanglement of the interface between the A layer and the B layer; manufacturing by a nip roll method, and clamping The method of pressing 0.2 to 1.0 MPa and the combination thereof.

(儲存彈性模數) (storage elastic modulus)

就本發明之積層薄膜,基於加工適性、成型性觀點,其120℃之儲存彈性模數較佳為101MPa以上3,000MPa以下。使120℃之儲存彈性模數為101MPa以上,在例如塗布功能性樹脂層後施以乾燥、或於進行金屬蒸鍍加工的步驟中,不會發生薄膜的變形等,可獲得 良好的加工適性。尤其是藉由將塗布後的乾燥溫度設成高溫,得以加快乾燥時的線速度,而有可降低加工成本的優點。由於120℃之儲存彈性模數愈高尺寸穩定性愈優良而較佳,惟欲使之高於3,000MPa時,有成型性下降的情況。為兼備更高的尺寸穩定性、成型性,120℃之儲存彈性模數若為500MPa以上3,000MPa以下則更佳,若為1,000MPa以上3,000MPa以下則最佳。 The laminated film of the present invention preferably has a storage elastic modulus at 120 ° C of from 101 MPa to 3,000 MPa, from the viewpoints of workability and moldability. The storage elastic modulus at 120 ° C is 101 MPa or more, and after drying, for example, after applying the functional resin layer, or in the step of performing metal vapor deposition, deformation or the like of the film does not occur. Good processing suitability. In particular, by setting the drying temperature after coating to a high temperature, the linear velocity at the time of drying can be accelerated, and the processing cost can be reduced. The higher the storage elastic modulus at 120 ° C, the better the dimensional stability is better, and if it is desired to be higher than 3,000 MPa, the moldability is lowered. In order to achieve higher dimensional stability and moldability, the storage elastic modulus at 120 ° C is preferably 500 MPa or more and 3,000 MPa or less, and more preferably 1,000 MPa or more and 3,000 MPa or less.

本發明之積層薄膜中,作為使120℃之儲存彈性模數處於上述101MPa以上3,000MPa以下之範圍的方法,可舉出調整A層之玻璃轉移溫度的方法等。 In the laminated film of the present invention, as a method of setting the storage elastic modulus at 120 ° C to the range of 101 MPa or more and 3,000 MPa or less, a method of adjusting the glass transition temperature of the A layer or the like can be mentioned.

本發明中,A層之玻璃轉移溫度的控制方法未予特別限定,例如使用降莰烯與乙烯之共聚物作為環狀烯烴系樹脂時,藉由持續增加降莰烯的含量,可使玻璃轉移溫度向高溫轉移;又例如使用使降莰烯、三環癸烯、四環癸烯及其衍生物進行開環複分解聚合後予以氫化而成的樹脂作為環狀烯烴系樹脂時,藉由增大待聚合之環狀烯烴(降莰烯、三環癸烯、四環癸烯及此等之衍生物)的分子量、或者增加環數俾形成剛性結構,可使玻璃轉移溫度向高溫轉移。甚而,藉由摻合玻璃轉移溫度相異的2種環狀烯烴系樹脂,亦可調整A層之玻璃轉移溫度。此外,如在A層中混有環狀烯烴系樹脂以外之樹脂的情況下等,若存在複數個玻璃轉移溫度時,則以高溫側的玻璃轉移溫度作為A層之玻璃轉移溫度。 In the present invention, the method for controlling the glass transition temperature of the layer A is not particularly limited. For example, when a copolymer of norbornene and ethylene is used as the cyclic olefin resin, the glass can be transferred by continuously increasing the content of the decene. The temperature is transferred to a high temperature; for example, when a resin obtained by subjecting norbornene, tricyclodecene, tetracyclononene or a derivative thereof to ring-opening metathesis polymerization and hydrogenating is used as a cyclic olefin resin, The molecular weight of the cyclic olefin to be polymerized (norbornene, tricyclodecene, tetracyclononene, and derivatives thereof) or a ring number increase to form a rigid structure allows the glass transition temperature to be shifted to a high temperature. Further, the glass transition temperature of the layer A can be adjusted by blending two kinds of cyclic olefin-based resins having different glass transition temperatures. In the case where a resin other than the cyclic olefin resin is mixed in the layer A, if a plurality of glass transition temperatures are present, the glass transition temperature on the high temperature side is used as the glass transition temperature of the layer A.

本發明之積層薄膜,基於成型性觀點,其170℃之儲存彈性模數較佳為100MPa以下。170℃之儲存 彈性模數為100MPa以下時,藉由至少將成型溫度設成170℃以上,可達優良之成型性而較佳。如需有更高之成型性時,170℃之儲存彈性模數若為50MPa以下則較佳,若為20MPa以下則最佳。又作為儲存彈性模數之下限,較佳為0.5MPa以上。藉由使儲存彈性模數達0.5MPa以上,在將積層薄膜設置於真空成型機或者真空壓空成型機時可抑制積層薄膜的下垂(drawdown)。 The laminated film of the present invention preferably has a storage elastic modulus at 170 ° C of 100 MPa or less based on moldability. Storage at 170 ° C When the modulus of elasticity is 100 MPa or less, it is preferable to set the molding temperature to at least 170 ° C to obtain excellent moldability. If it is required to have higher moldability, the storage elastic modulus at 170 ° C is preferably 50 MPa or less, and preferably 20 MPa or less. Further, as the lower limit of the storage elastic modulus, it is preferably 0.5 MPa or more. By setting the storage elastic modulus to 0.5 MPa or more, the drawdown of the laminated film can be suppressed when the laminated film is placed in a vacuum forming machine or a vacuum pressure forming machine.

此外,若積層薄膜之儲存彈性模數小於 0.5MPa時,在將電磁波遮蔽層轉印薄膜對FPC熱壓成型的情況下,有存在於FPC的凸部分與加熱之金屬版之間所夾之部分的電磁波遮蔽層轉印薄膜之厚度明顯變薄的情況。其結果,有在熱壓成型後剝離積層薄膜的步驟中,剝離應力集中於電磁波遮蔽層轉印薄膜的厚度中較薄的部分,以致積層薄膜斷裂的情況。另一方面,若積層薄膜之儲存彈性模數為0.5MPa以上時,則可抑制此種積層薄膜的斷裂。 In addition, if the storage modulus of the laminated film is less than In the case of 0.5 MPa, in the case where the electromagnetic wave shielding layer transfer film is thermoformed by FPC, the thickness of the electromagnetic wave shielding layer transfer film existing in the portion sandwiched between the convex portion of the FPC and the heated metal plate is significantly changed. Thin case. As a result, in the step of peeling off the laminated film after hot press forming, the peeling stress concentrates on the thin portion of the thickness of the electromagnetic wave shielding layer transfer film, so that the laminated film is broken. On the other hand, when the storage elastic modulus of the laminated film is 0.5 MPa or more, the fracture of the laminated film can be suppressed.

本發明之積層薄膜中,作為使170℃之儲存 彈性模數成為上述100MPa以下的方法,可舉出調整A層之玻璃轉移溫度的方法等。 In the laminated film of the present invention, as a storage at 170 ° C The method in which the elastic modulus is 100 MPa or less is a method of adjusting the glass transition temperature of the layer A, and the like.

於此,「120℃之儲存彈性模數為101MPa以 上3,000MPa以下及170℃之儲存彈性模數為100MPa以下」,係指在積層薄膜之任意一方向及與該方向正交之方向滿足上述數值。 Here, "the storage elastic modulus at 120 ° C is 101 MPa. The storage elastic modulus of 3,000 MPa or less and 170 ° C is 100 MPa or less, which means that the above numerical value is satisfied in any direction of the laminated film and in a direction orthogonal to the direction.

就本發明之積層薄膜,在進一步重視加工適 性的情況下,其130℃之儲存彈性模數較佳為101MPa以 上3,000MPa以下。130℃之儲存彈性模數若為500MPa以上3,000MPa以下則更佳,再佳為1,000MPa以上3,000MPa以下。 In the laminated film of the present invention, further attention is paid to processing In the case of sex, the storage elastic modulus at 130 ° C is preferably 101 MPa. Above 3,000 MPa. The storage elastic modulus at 130 ° C is more preferably 500 MPa or more and 3,000 MPa or less, and more preferably 1,000 MPa or more and 3,000 MPa or less.

就本發明之積層薄膜,為了在成型時予以埋入得更深,其160℃之儲存彈性模數較佳為100MPa以下,150℃之儲存彈性模數更佳為100MPa以下。 In the laminated film of the present invention, in order to be buried deeper during molding, the storage elastic modulus at 160 ° C is preferably 100 MPa or less, and the storage elastic modulus at 150 ° C is more preferably 100 MPa or less.

(添加劑) (additive)

本發明之積層薄膜可以視需求適量含有難燃劑、熱安定劑、抗氧化劑、紫外線吸收劑、抗靜電劑、塑化劑、黏著性賦予劑、聚矽氧烷等的消泡劑、顏料或染料等的著色劑。又能以不妨礙本發明效果之程度含有滑石、雲母、二氧化矽、氧化鋁、氧化鈦、沸石、玻璃、蒙脫土、水輝石、AEROSIL、氧化鋅、氧化鐵、碳黑、石墨、有機金屬鹽、氧化金屬等的粉末狀或纖維狀填料。可予以摻混使用。 The laminated film of the present invention may contain a flame retardant, a heat stabilizer, an antioxidant, an ultraviolet absorber, an antistatic agent, a plasticizer, an adhesion imparting agent, a defoaming agent such as polysiloxane, a pigment or the like according to an appropriate amount. A coloring agent such as a dye. Further, it can contain talc, mica, cerium oxide, aluminum oxide, titanium oxide, zeolite, glass, montmorillonite, hectorite, AEROSIL, zinc oxide, iron oxide, carbon black, graphite, organic to the extent that the effects of the present invention are not impaired. A powdery or fibrous filler such as a metal salt or an oxidized metal. Can be blended for use.

作為抗氧化劑,未予特別限制,可使用周知之亞磷酸鹽系抗氧化劑、有機硫系抗氧化劑、受阻酚系抗氧化劑等的任一種。 The antioxidant is not particularly limited, and any of a well-known phosphite-based antioxidant, an organic sulfur-based antioxidant, and a hindered phenol-based antioxidant can be used.

[實施例] [Examples]

依以下方法來進行積層薄膜的製造、評定。 The production and evaluation of the laminated film were carried out in the following manner.

(1)積層薄膜總厚度及各層之厚度 (1) The total thickness of the laminated film and the thickness of each layer

欲量測積層薄膜之整體厚度時,係利用度盤規量測切取自積層薄膜之長50mm×寬10mm之試料的任意處5處之厚度,並求出平均值。此外,當量測積層薄膜之各層的層厚度之際,係利用金屬顯微鏡 LeicaDMLM(Leica MICROSYSTEMS製),對薄膜的剖面以倍率100倍之條件拍攝透光照片。其後,由所拍攝的照片,按積層薄膜各層量測任意5處之厚度,並以其平均值作為各層之層厚度。 When the overall thickness of the laminated film is to be measured, the thickness of any of the 5 mm long and 10 mm wide samples of the laminated film is measured by a gauge, and the average value is determined. In addition, when the layer thickness of each layer of the equivalent laminated film is used, a metal microscope is used. Leica DMLM (manufactured by Leica MICROSYSTEMS), a light-transmissive photograph was taken on a section of the film at a magnification of 100 times. Thereafter, from the photographs taken, the thickness of any five layers was measured for each layer of the laminated film, and the average value thereof was used as the layer thickness of each layer.

(2)玻璃轉移溫度、熔點、結晶熔解熱量 (2) Glass transfer temperature, melting point, and crystal melting heat

利用差示掃描熱量分析儀(SEIKO電子工業製RDC220),依據JIS K7121-1987、JIS K7122-1987進行量測及解析。取5mg作為試樣,並讀取將試樣由25℃以20℃/分鐘升溫至300℃時之自玻璃狀態向橡膠狀態轉移所產生的比熱變化。求取作為將各基線延長之直線起在縱軸(表示熱流之軸)方向位於等距離(中間點)之與上述直線平行的直線、與玻璃轉移之階段狀變化部分的曲線之交點的中間點玻璃轉移溫度,設為玻璃轉移溫度。此外,若玻璃轉移溫度存在複數個時,係採用高溫側的玻璃轉移溫度作為玻璃轉移溫度。 The measurement and analysis were carried out in accordance with JIS K7121-1987 and JIS K7122-1987 using a differential scanning calorimeter (RDC220 manufactured by SEIKO Electronics Co., Ltd.). Take 5 mg as a sample, and read the specific heat change caused by the transfer of the sample from the glass state to the rubber state when the sample was heated from 25 ° C to 20 ° C / min to 300 ° C. The intermediate point of the intersection of the straight line parallel to the straight line and the curve of the phase change portion of the glass transition at the equidistance (intermediate point) in the direction in which the straight line extending each line is extended is obtained. The glass transition temperature is set to the glass transition temperature. Further, when there are a plurality of glass transition temperatures, the glass transition temperature on the high temperature side is used as the glass transition temperature.

又,以將試樣由25℃以20℃/分鐘升溫至300℃時之吸熱熔解曲線的峰值溫度作為熔點。 Further, the peak temperature of the endothermic melting curve when the sample was heated from 25 ° C to 20 ° C / min to 300 ° C was taken as the melting point.

又,以基線與吸熱熔解曲線所包圍之部分的面積作為熔解結晶熱量。 Further, the area of the portion surrounded by the baseline and the endothermic melting curve was taken as the heat of melting crystallization.

此外,針對以(1)之方法確認積層構造之薄膜,削取其表層、內層對各層之玻璃轉移溫度、熔點進行量測。 Further, the film having the laminated structure was confirmed by the method of (1), and the surface layer and the inner layer were cut to measure the glass transition temperature and melting point of each layer.

再者,在例如環狀烯烴系樹脂之玻璃轉移溫度與聚丙烯系樹脂或聚乙烯系樹脂之熔點溫度相近,使得玻璃轉移溫度之臺階狀變化部分的曲線與熔點峰重疊 之情形下,則採用由重疊峰讀取的中間點玻璃轉移溫度及熔點值。 Further, for example, the glass transition temperature of the cyclic olefin resin is close to the melting temperature of the polypropylene resin or the polyethylene resin, so that the curve of the stepwise change portion of the glass transition temperature overlaps with the melting point peak. In the case of the intermediate point glass transition temperature and melting point value read by the overlapping peaks.

(3)B層之表面自由能 (3) Surface free energy of layer B

在23℃、65%RH之條件下,對經加濕24小時的積層薄膜,使用接觸角計(協和界面化學製CA-D型),並使用水、乙二醇、甲醯胺及二碘甲烷此4種測定液,利用協和界面化學(股)製接觸角計CA-D型求取與薄膜表面所夾之靜態接觸角。將針對各液體所得之接觸角與測定液之表面張力的各成分分別代入下式,對γL、γ+、γ-解出包含4算式的聯立方程式。 Under the conditions of 23 ° C and 65% RH, the contact film was used for 24 hours of humidification using a contact angle meter (CA-D type of Kyowa Interface Chemical Co., Ltd.), and water, ethylene glycol, formamide and diiodine were used. For the four kinds of measuring liquids of methane, the contact angle meter CA-D type made by the Kyowa Interface Chemical Co., Ltd. was used to determine the static contact angle with the surface of the film. Each component of the contact angle with respect to each liquid and the surface tension of the measuring liquid was substituted into the following formula, and the quaternary equation including the formula of 4 was solved for γ L , γ + , and γ .

Lγj L)1/2+2(γ+γj -)1/2+2(γj +γ-)1/2=(1+cosθ)[γj L+2(γj +γj -)1/2]/2 L γ j L ) 1/2 +2(γ + γ j - ) 1/2 +2(γ j + γ - ) 1/2 =(1+cosθ)[γ j L +2(γ j + γ j - ) 1/2 ]/2

惟,γ=γL+2(γ+γ-)1/2γjj L+2(γj +γj -)1/2。於此,γ、γL、γ+、γ-分別表示薄膜表面之表面自由能、長距離間力項、路易士酸參數、路易士鹼參數;又γj、γj L、γj +、γj -分別表示所使用之測定液之表面自由能、長距離間力項、路易士酸參數、路易士鹼參數。 However, γ = γ L + 2 (γ + γ - ) 1/2 γ j = γ j L + 2 (γ j + γ j - ) 1/2 . Here, γ, γ L , γ + , γ respectively represent the surface free energy of the surface of the film, the long-distance force term, the Lewis acid parameter, and the Lewis base parameter; and γ j , γ j L , γ j + , γ j - respectively indicates the surface free energy, the long distance force term, the Lewis acid parameter, and the Lewis base parameter of the measuring liquid used.

此處使用之各液體之表面張力係採用由Oss("Fundamentals of Adhesion",L.H.Lee(Ed.),p153,Plenum ess,New York(1991))所提出的表1之值。 The surface tension of each of the liquids used herein is the value of Table 1 proposed by Oss ("Fundamentals of Adhesion", L.H. Lee (Ed.), p153, Plenum ess, New York (1991).

(4)儲存彈性模數 (4) Storage elastic modulus

將薄膜沿任意一方向及與該方向正交之方向切割成長60mm×寬5mm的矩形而作成試樣。利用動態黏彈性量測裝置(Rheology製DVE-V4 FT Rheospectra),於下述條件下進行量測,求取120℃及170℃之儲存彈性模數(E’)。 A film was cut into a rectangular shape of 60 mm × 5 mm in width in any direction and in a direction orthogonal to the direction to prepare a sample. The storage elastic modulus (E') at 120 ° C and 170 ° C was measured by a dynamic viscoelasticity measuring device (DVE-V4 FT Rheospectra, manufactured by Rheology) under the following conditions.

頻率:10Hz、試樣長(夾頭間距離):20mm、位移振幅:10μm;量測溫度範圍:25℃~200℃、升溫速度:5℃/分鐘。 Frequency: 10 Hz, sample length (distance between chucks): 20 mm, displacement amplitude: 10 μm; measurement temperature range: 25 ° C to 200 ° C, temperature increase rate: 5 ° C / min.

(5)A層/B層間之剝離強度 (5) Peel strength between layer A and layer B

於積層薄膜中的單面黏貼日東電工製OPP膠帶(Dunplon Ace No.375),並予以切割成寬10mm、長150mm的矩形而作成試樣。於積層界面強制剝離該試樣,利用拉伸試驗機(Orientec製TENSILON UCT-100),設初始拉伸夾頭間距離100mm、拉伸速度20mm/分鐘進行180°剝離試驗。進行量測至剝離長度達130mm(夾頭間距離230mm),以剝離長度25mm~125mm之負載的平均值作為剝離強度。此外,量測係進行5次,採用其平均值。又,若構成為如B層/A層/B層之3層構造時,則於兩面進行剝離試驗,並採用各面5次、兩面合計10次的平均值。 Nippon Electric Co., Ltd. OPP tape (Dunplon Ace No. 375) was adhered to one side of the laminated film, and cut into a rectangle having a width of 10 mm and a length of 150 mm to prepare a sample. The sample was forcibly peeled off at the laminate interface, and a 180° peel test was performed by using a tensile tester (TENSILON UCT-100 manufactured by Orientec) and setting a distance between the initial stretching chucks of 100 mm and a stretching speed of 20 mm/min. The measurement was carried out until the peeling length was 130 mm (the distance between the chucks was 230 mm), and the average value of the load of the peeling length of 25 mm to 125 mm was taken as the peeling strength. In addition, the measurement system was carried out 5 times, and the average value was used. In the case of a three-layer structure such as a B layer/A layer/B layer, a peeling test was performed on both surfaces, and an average value of five times on each side and a total of ten times on both sides was used.

另,剝離強度係於調溫成25℃的室內進行量測。 In addition, the peel strength was measured in a room where the temperature was adjusted to 25 °C.

(6)表面粗糙度 (6) Surface roughness

利用表面粗糙度計(小坂研究所製SE4000)對兩面進行量測。在觸針前端半徑0.5μm、量測力 100μN、量測長度1mm、低域截取值0.200mm、高域截取值0.000mm之條件下進行量測,依據JIS B0601-2001求出算術平均粗糙度SRa。 Both sides were measured using a surface roughness meter (SE4000 manufactured by Otaru Research Institute). Radius at the front end of the stylus is 0.5μm, measuring force The measurement was performed under conditions of 100 μN, a measurement length of 1 mm, a low-range intercept value of 0.200 mm, and a high-range interception value of 0.000 mm, and an arithmetic mean roughness SRa was obtained in accordance with JIS B0601-2001.

(7)霧度 (7) Haze

利用霧度計(日本電飾工業製NDH7000),依據JIS K7136-2000加以量測。若設積層薄膜之任一表面為A面、另一表面為B面時,以光的入射面為A面量測霧度值5次。其後,將光的入射面變更為B面,量測霧度值5次。求取合計10次之量測值的平均,以其為該積層薄膜之霧度值。 It was measured by a haze meter (NDH7000 manufactured by Nippon Electric Industrial Co., Ltd.) in accordance with JIS K7136-2000. When any surface of the laminated film is the A surface and the other surface is the B surface, the haze value is measured 5 times with the incident surface of the light as the A surface. Thereafter, the incident surface of the light was changed to the B surface, and the haze value was measured 5 times. The average of the measured values of 10 times in total was obtained as the haze value of the laminated film.

(8)色調L值 (8) tone L value

利用色度計(Suga試驗機製SM-T),依據JIS P8123-1961量測依Hunter方式之穿透模式下的測定值。若設積層薄膜之任一表面為A面、另一表面為B面時,以光的入射面為A面量測色調L值5次。其後,將光的入射面變更為B面,量測色調L值5次。求取合計10次之量測值的平均,以其為該積層薄膜之色調L值。 The measured value in the breakthrough mode according to the Hunter method was measured by a colorimeter (Suga test mechanism SM-T) in accordance with JIS P8123-1961. When any one surface of the laminated film is the A surface and the other surface is the B surface, the color tone L value is measured five times with the light incident surface as the A surface. Thereafter, the incident surface of the light was changed to the B surface, and the tone L value was measured 5 times. The average of the measured values for the total of 10 times was obtained as the hue L value of the laminated film.

(9)成型性 (9) Formability

於仿FPC表面之形成有L/S=100μm/100μm、深度300μm梳形圖案的10cm見方的黃銅板上載置積層薄膜,並從黃銅板與積層薄膜的兩側隔著鐵板於150℃、4MPa以衝壓機進行熱壓30分鐘,而製成評定用試樣。於此,L係指梳形圖案當中山部分之寬度(即FPC中之線寬(L寬度))的長度;S則指谷部分之寬度(即FPC之空間寬度(S寬度))的長度。換言之,梳形圖案之等間隔排列 的凸部分之一寬度為L寬度,凸部分之間隔為S寬度。利用KEYENCE製Microscope VHX-2000觀察衝壓後之評定用試樣的剖面,以10處之梳形圖案當中有9處以上不含氣泡地密接者評定為合格。 A 10 cm square brass plate having a comb pattern of L/S=100 μm/100 μm and a depth of 300 μm was formed on the surface of the FPC, and the laminated film was placed on both sides of the brass plate and the laminated film at 150 ° C. 4 MPa was hot pressed by a press for 30 minutes to prepare a sample for evaluation. Here, L means the length of the width of the mountain portion in the comb pattern (i.e., the line width (L width) in the FPC); and S refers to the length of the width of the valley portion (i.e., the space width (S width) of the FPC). In other words, the comb patterns are equally spaced One of the convex portions has a width L and the convex portion has an S width. The cross section of the sample for evaluation after punching was observed using a Microscope VHX-2000 manufactured by KEYENCE, and it was judged that it was judged by a close contact with no more than 9 of the comb patterns at 10 places.

接著,除設深度為500μm、800μm及1,000μm以外,係針對與上述同樣之黃銅板製作評定用試樣,依以下基準進行評定。 Then, in addition to the depths of 500 μm, 800 μm, and 1,000 μm, samples for evaluation of the same brass plate as described above were prepared and evaluated according to the following criteria.

S:乃深度1,000μm之圖案,屬合格。 S: It is a pattern of depth of 1,000 μm and is qualified.

A:乃深度1,000μm之圖案,屬不合格,但為深度800μm之圖案,屬合格。 A: It is a pattern with a depth of 1,000 μm, which is unqualified, but is a pattern with a depth of 800 μm.

B:乃深度800μm之圖案,屬不合格,但為深度500μm之圖案,屬合格。 B: It is a pattern with a depth of 800 μm, which is unqualified, but is a pattern having a depth of 500 μm, which is acceptable.

C:乃深度500μm之圖案,屬不合格,但為深度300μm之圖案,屬合格。 C: It is a pattern of 500 μm in depth, which is unqualified, but is a pattern with a depth of 300 μm.

D:乃深度300μm之圖案,屬不合格。 D: It is a pattern with a depth of 300 μm, which is unqualified.

(10)脫模性 (10) Demoulding

藉由將100質量份之環氧系接著劑(東亞合成製“AS-60”)中混有150質量份之50%粒徑(中位徑)為5.9μm之覆銀銅粉(福田金屬箔粉工業製“Cu-HWQ5μm”)的導電性糊料塗布於積層薄膜的B層側來形成功能性樹脂層(導電層),而製成電磁波遮蔽層轉印薄膜。且,對於塗布係使用塗抹器,設乾燥前之塗布厚度為100μm、設乾燥條件為100℃、10分鐘。於乾燥後切割成寬10mm、長150mm的矩形而作成試樣。於積層界面強制剝離該試樣,依以下基準進行評定。 100 parts by mass of an epoxy-based adhesive ("AS-60" manufactured by Toagosei Co., Ltd.) was mixed with 150 parts by mass of silver-coated copper powder having a 50% particle diameter (median diameter) of 5.9 μm (Futian metal foil) A conductive paste of "Cu-HWQ5 μm" manufactured by Powder Industries was applied to the side of the B layer of the laminated film to form a functional resin layer (conductive layer), thereby forming an electromagnetic wave shielding layer transfer film. Further, the applicator was used for the coating system, and the coating thickness before drying was 100 μm, and the drying conditions were 100 ° C for 10 minutes. After drying, it was cut into a rectangle having a width of 10 mm and a length of 150 mm to prepare a sample. The sample was forcibly peeled off at the laminate interface and evaluated according to the following criteria.

A:可無阻力地剝離。 A: It can be peeled off without resistance.

B:於剝離時雖感受到阻力,但功能性樹脂層(導電層)未轉移至積層薄膜側。 B: Although resistance was felt at the time of peeling, the functional resin layer (conductive layer) was not transferred to the side of the laminated film.

C:功能性樹脂層(導電層)的一部分剝離並轉移至積層薄膜側。 C: A part of the functional resin layer (conductive layer) was peeled off and transferred to the side of the laminated film.

D:積層薄膜與功能性樹脂層(導電層)之密接性強,無法強制剝離。 D: The laminated film and the functional resin layer (conductive layer) have strong adhesion and cannot be forcibly peeled off.

(11)加工適性 (11) Processing suitability

將薄膜沿任意一方向及與該方向正交之方向切割成長50mm×寬4mm的矩形而作成試樣。對試樣使用熱機械分析裝置(Seiko Instruments製TMA EXSTAR6000),在下述條件下予以升溫。在升溫過程中,根據尺寸變化率達到1.0%的溫度,依以下基準進行評定。且,對於尺寸變化率係進行量測至小數點以下一位。 A film was cut into a rectangular shape of 50 mm × 4 mm in width in any direction and in a direction orthogonal to the direction to prepare a sample. A thermomechanical analyzer (TMA EXSTAR6000 manufactured by Seiko Instruments) was used for the sample, and the temperature was raised under the following conditions. During the heating process, the temperature was changed to 1.0% according to the dimensional change rate, and the evaluation was performed based on the following criteria. Moreover, the dimensional change rate is measured to one decimal place.

試樣長:15mm、負載:19.6mN、升溫速度:5℃/分鐘、量測溫度範圍:25~220℃ Sample length: 15mm, load: 19.6mN, heating rate: 5°C/min, measuring temperature range: 25~220°C

尺寸變化率(%)={|試樣長(mm)-保持後之薄膜長(mm)|/試樣長(mm)}×100 Dimensional change rate (%) = {|sample length (mm) - film length after holding (mm) | / sample length (mm)} × 100

S:130℃以上 S: 130 ° C or more

A:125℃以上小於130℃ A: 125 ° C or more and less than 130 ° C

B:120℃以上小於125℃ B: 120 ° C or more and less than 125 ° C

C:100℃以上小於120℃ C: 100 ° C or more and less than 120 ° C

D:小於100℃。 D: less than 100 ° C.

(12)與功能性樹脂層之密接性 (12) Adhesion to functional resin layer

利用模塗布機,將(10)所記載之功能性樹脂層(導電層)塗布於薄膜上,製成電磁波遮蔽層轉印薄膜。而且,設乾燥條件為100℃、10分鐘,並將乾燥後之功能性樹脂層(導電層)厚度調整成為50μm。製備捲繞於直徑6吋、寬550mm之捲芯的寬500mm、長200m電磁波遮蔽層轉印薄膜,並依下述條件,對直徑3吋、寬550mm之捲芯進行綑繞,依下述基準進行評定。 The functional resin layer (conductive layer) described in (10) was applied onto the film by a die coater to prepare an electromagnetic wave shielding layer transfer film. Further, the drying conditions were 100 ° C for 10 minutes, and the thickness of the functional resin layer (conductive layer) after drying was adjusted to 50 μm. A transfer film of 500 mm wide and 200 m long electromagnetic wave shielding layer wound around a core having a diameter of 6 吋 and a width of 550 mm was prepared, and a winding core having a diameter of 3 inches and a width of 550 mm was bundled according to the following conditions, according to the following criteria. Conduct an assessment.

捲繞張力:100N/m Winding tension: 100N/m

速度:5m/min Speed: 5m/min

A:於薄膜層/功能性樹脂層(導電層)間,完全未發生剝離。 A: No peeling occurred between the film layer/functional resin layer (conductive layer).

B:於薄膜層/功能性樹脂層(導電層)間可見剝離,惟於剝離處未發生空氣卡入。 B: Peeling was observed between the film layer/functional resin layer (conductive layer), but no air entrapment occurred at the peeling point.

C:於薄膜層/功能性樹脂層(導電層)間可見剝離,且於剝離處發生了空氣卡入。 C: Peeling was observed between the film layer/functional resin layer (conductive layer), and air entrapment occurred at the peeling place.

(13)耐翹曲性 (13) Warpage resistance

對以與(12)同樣方式得到的電磁波遮蔽層轉印薄膜,針對設置於A4大小之衝壓機時的操作處理容易度,依以下基準進行評定。 The electromagnetic wave shielding layer transfer film obtained in the same manner as in (12) was evaluated for the ease of handling of the press machine installed in the A4 size according to the following criteria.

A:幾無翹曲,可毫無問題地設置薄膜。 A: There is no warpage, and the film can be set without any problem.

B:可見翹曲,設置於衝壓機時需事先用膠帶固定電磁波遮蔽層轉印薄膜後進行。 B: Warpage can be seen, and it is necessary to fix the electromagnetic wave shielding layer transfer film with a tape beforehand in the press machine.

(14)A層/B層間之密接性 (14) Adhesion between layer A and layer B

製作10根將薄膜切割成15mm×110mm之大小,並利用MIT耐折試驗機(東洋精機製作所(股)製MID-D)在旋轉速度:175cpm、量測負載:25N(250gf)、彎曲角度:135°之條件下進行過薄膜的彎撓共10次之評定用試樣,依下述基準以目視進行評定。 10 pieces of the film were cut into a size of 15 mm × 110 mm, and the MIT folding test machine (MID-D manufactured by Toyo Seiki Seisakusho Co., Ltd.) was used at a rotation speed of 175 cpm, and the load was measured: 25 N (250 gf), and the bending angle was: A sample for evaluation of bending of the film for 10 times under conditions of 135 ° was visually evaluated according to the following criteria.

A:於彎撓處未見到任何1根發生層間剝離。 A: No peeling occurred between the layers at the bend.

B:發現1根以上之於彎撓處端部可見剝離的試樣,但未見到任何1根彎撓處兩端的剝離處彼此間相連的試樣。 B: It was found that more than one sample which was peeled off at the end portion of the bending portion was observed, but no sample in which the peeling portions at both ends of the one bent portion were connected to each other was observed.

C:可見到1根以上小於5根之彎撓處兩端的剝離處彼此間相連的試樣。 C: A sample in which the peeling portions at both ends of one or more of the bending portions of less than five were connected to each other was observed.

D:可見到5根以上之彎撓處兩端的剝離處彼此間相連的試樣。 D: A sample in which the peeling portions at both ends of the five or more bending portions are connected to each other can be seen.

(15)衝壓耐熱性 (15) Stamping heat resistance

將薄膜切成寬10mm×長100mm的長條形(矩形)而得到試樣。爾後,每隔長度10mm朝寬度方向以黑色油性印墨劃出記號(直線)。換言之,在距試樣之長度方向一端起10mm的位置,沿與試樣之寬度方向平行的方向描繪出直線(記號)。另外,在由該位置起算,於薄膜長度方向再間隔10mm的位置,沿與試樣之寬度方向平行的方向描繪出直線(記號)。重複相同作業,對試樣描繪出合計9處之直線(記號)。 The film was cut into strips (rectangular) having a width of 10 mm and a length of 100 mm to obtain a sample. Thereafter, marks (straight lines) are drawn with black oily ink in the width direction every 10 mm in length. In other words, a straight line (mark) is drawn in a direction parallel to the width direction of the sample at a position 10 mm from one end in the longitudinal direction of the sample. Further, at this position from the position, a straight line (mark) is drawn in a direction parallel to the width direction of the sample at a position spaced apart by 10 mm in the longitudinal direction of the film. The same operation was repeated, and a total of nine straight lines (marks) were drawn on the sample.

以120mm之各聚醯亞胺片(Du Pont-Toray(股)公司製“Kapton(註冊商標)”)100H夾持矩形薄膜(試樣)的 兩面,並從兩側隔著鐵板於150℃、4MPa以衝壓機進行熱壓30分鐘。熱壓完畢後,從聚醯亞胺片剝除長方形狀薄膜,求取8處黑色油性印墨的長度的平均值,依下述基準進行評定。亦即,求取所有相鄰之直線(記號)間的距離(薄膜長度方向的距離)。將所得8個值加以平均求出平均值,並基於下述基準進行評定。 A rectangular film (sample) was sandwiched between 120 mm of each polyimide film ("Kapton (registered trademark)" manufactured by Du Pont-Toray Co., Ltd.) 100H. Both sides were hot pressed by a press at 150 ° C and 4 MPa from both sides through an iron plate for 30 minutes. After the hot pressing was completed, the rectangular film was peeled off from the polyimide film, and the average value of the lengths of the eight black oily inks was determined and evaluated according to the following criteria. That is, the distance between all adjacent straight lines (marks) (the distance in the longitudinal direction of the film) is obtained. The obtained eight values were averaged to obtain an average value, and the evaluation was performed based on the following criteria.

A:長方形的寬度(直線(記號)間的距離)的平均值為10mm以上小於10.5mm A: The average width of the rectangle (the distance between the straight lines (marks)) is 10 mm or more and less than 10.5 mm.

B:長方形的寬度(直線(記號)間的距離)的平均值為10.5mm以上小於11mm B: The average width of the rectangle (the distance between the straight lines (marks)) is 10.5 mm or more and less than 11 mm.

C:長方形的寬度(直線(記號)間的距離)的平均值為11mm以上小於12mm C: The average width of the rectangle (the distance between the straight lines (marks)) is 11 mm or more and less than 12 mm.

D:長方形的寬度(直線(記號)間的距離)的平均值為12mm以上。 D: The average value of the width of the rectangle (the distance between the straight lines (marks)) is 12 mm or more.

(16)視覺辨識性 (16) Visual identity

將薄膜切成1mm×5mm之形狀後,予以載置於B4大小之黑色紙板的任意位置處,令位於遠離2m位置的觀測者探尋薄膜的位置。將觀測者彼此交換,依下述基準進行評定。 After the film was cut into a shape of 1 mm × 5 mm, it was placed at any position of the B4 size black cardboard, so that the observer located at a position away from 2 m sought the position of the film. The observers are exchanged and evaluated according to the following criteria.

A:5名觀測者中,5名皆於10秒以內發現薄膜。 A: Of the 5 observers, 5 found the film within 10 seconds.

B:5名觀測者中,有1名以上4名以下於10秒以內發現薄膜。 B: Among the five observers, one or more of the four or less were found to have a film within 10 seconds.

C:5名觀測者中,無任何1名於10秒以內發現薄膜。 C: None of the five observers found the film within 10 seconds.

(17)本發明積層薄膜的製造所使用之樹脂 (17) Resin used in the production of the laminated film of the present invention (環狀烯烴共聚合樹脂A(COC-A)) (Cyclic olefin copolymer resin A (COC-A))

使用Polyplastics製“TOPAS(註冊商標)”6013F-04(乙烯與降莰烯共聚合而成的樹脂,玻璃轉移溫度為138℃。且以樹脂的總成分為100質量%計,源自降莰烯(環狀烯烴)之部分的質量比例推定為76質量%、源自乙烯(鏈狀烯烴)之部分的質量比例推定為24質量%的樹脂。 "TOPAS (registered trademark)" 6013F-04 (a resin obtained by copolymerizing ethylene and norbornene) having a glass transition temperature of 138 ° C and having a total composition of the resin of 100% by mass, derived from norbornene The mass ratio of the portion of the (cyclic olefin) was estimated to be 76% by mass, and the mass ratio of the portion derived from ethylene (chain olefin) was estimated to be 24% by mass.

(環狀烯烴共聚合樹脂B(COC-B)) (Cyclic olefin copolymer resin B (COC-B))

使用Polyplastics製“TOPAS(註冊商標)”8007F-04(乙烯與降莰烯共聚合而成的樹脂,玻璃轉移溫度為78℃。且以樹脂的總成分為100質量%計,源自降莰烯(環狀烯烴)之部分的質量比例推定為64質量%、源自乙烯(鏈狀烯烴)之部分的質量比例推定為36質量%的樹脂)。 "TOPAS (registered trademark)" 8007F-04 (a resin obtained by copolymerizing ethylene and norbornene) having a glass transition temperature of 78 ° C and having a total composition of the resin of 100% by mass, derived from norbornene The mass ratio of the portion of the (cyclic olefin) is estimated to be 64% by mass, and the mass ratio of the portion derived from ethylene (chain olefin) is estimated to be 36% by mass.

(環狀烯烴樹脂C(COP-C)) (Cyclic olefin resin C (COP-C))

使用日本ZEON製“ZEONOR(註冊商標)”1420R(玻璃轉移溫度135℃之環狀烯烴樹脂)。 "ZEONOR (registered trademark)" 1420R (a cyclic olefin resin having a glass transition temperature of 135 ° C) manufactured by ZEON, Japan was used.

(環狀烯烴樹脂D(COC-D)) (cyclic olefin resin D (COC-D))

使用Polyplastics公司製“TOPAS(註冊商標)”6017S-04(乙烯與降莰烯共聚合而成的樹脂,玻璃轉移溫度為178℃。且以樹脂的總成分為100質量%計,源自降莰烯(環狀烯烴)之部分的質量比例推定為82質量%、源自乙烯(鏈狀烯烴)之部分的質量比例推定為18質量%的樹脂)。 "TOPAS (registered trademark)" 6017S-04 (a resin obtained by copolymerization of ethylene and norbornene), a glass transition temperature of 178 ° C, and a total component of the resin of 100% by mass, derived from hail The mass ratio of the portion of the olefin (cyclic olefin) is estimated to be 82% by mass, and the mass ratio of the portion derived from ethylene (chain olefin) is estimated to be 18% by mass.

(環狀烯烴系共聚合樹脂A(COC-A)之氧化鈦混合物)(COC-T) (Calcium Olefin Copolymerized Resin A (COC-A) Titanium Oxide Mixture) (COC-T)

取100質量份之Polyplastics製“TOPAS(註冊商標)”6013F-04(乙烯與降莰烯共聚合而成的樹脂,玻璃轉移溫度為138℃。且以樹脂的總成分為100質量%計,源自降莰烯(環狀烯烴)之部分的質量比例推定為76質量%、源自乙烯(鏈狀烯烴)之部分的質量比例推定為24質量%的樹脂)與100質量份之氧化鈦粒子(Titan工業製“KA-10”)利用雙軸擠製機於280℃進行混煉、擠製而得到細線條(gut)。使用所得細線條經水冷卻並切成片狀者。 100 parts by mass of "TOPAS (registered trademark)" 6013F-04 (a resin obtained by copolymerization of ethylene and norbornene) having a glass transition temperature of 138 ° C and a total composition of the resin of 100% by mass. The mass ratio of the portion of the self-decreasing terpene (cyclic olefin) is estimated to be 76% by mass, the mass ratio of the portion derived from ethylene (chain olefin) is estimated to be 24% by mass), and 100 parts by mass of the titanium oxide particles ( Titan industrial "KA-10") was kneaded and extruded at 280 ° C using a twin-screw extruder to obtain a fine gut. The obtained fine lines are cooled by water and cut into pieces.

(金屬芳香類直鏈狀低密度聚乙烯系樹脂(m-LLDPE)) (Metal aromatic linear low density polyethylene resin (m-LLDPE))

使用Prime Polymer製“Evolue(註冊商標)”SP2540(依據JIS K7210-1999之MFR為3.8g/10min、熔點為123℃、依JIS K6922-2-2010所求得之密度為0.924g/cm3、屬乙烯與1-己烯共聚合而成的樹脂(1-己烯的含有比例為5莫耳%以下)、金屬芳香類直鏈狀低密度聚乙烯系樹脂)。 "Evolue (registered trademark)" SP2540 manufactured by Prime Polymer (MFR of 3.8 g/10 min according to JIS K7210-1999, melting point of 123 ° C, density determined according to JIS K6922-2-2010, 0.924 g/cm 3 , It is a resin obtained by copolymerizing ethylene and 1-hexene (the content ratio of 1-hexene is 5 mol% or less), and a metal aromatic linear low-density polyethylene resin).

(直鏈狀中密度聚乙烯系樹脂(LMDPE)) (Linear Medium Density Polyethylene Resin (LMDPE))

使用Prime Polymer製“ULTZEX(註冊商標)”4050(依據JIS K7210-1999之MFR為6g/10min、熔點為125℃、依JIS K6922-2-2010所求得之密度為0.937g/cm3、屬乙烯與1-己烯共聚合而成的樹脂(1-己烯的含有比例為5莫耳%以下)、利用與金屬芳香類觸媒相異之觸媒聚合而成的直鏈狀低密度聚乙烯系樹脂)。 "ULTZEX (registered trademark)" 4050 manufactured by Prime Polymer (MFR of 6 g/10 min according to JIS K7210-1999, melting point of 125 ° C, density determined according to JIS K6922-2-2010, 0.937 g/cm 3 , genus A resin obtained by copolymerizing ethylene and 1-hexene (content ratio of 1-hexene is 5 mol% or less), and linear low-density polymerization by polymerization of a catalyst different from a metal aromatic catalyst Vinyl resin).

(低密度聚乙烯系樹脂(LDPE)) (Low Density Polyethylene Resin (LDPE))

使用住友化學製“Sumikathene(註冊商標)”F412-1(依據JIS K7210-1999之MFR為5g/10min、熔點為110℃、依JIS K6922-2-2010所求得之密度為0.921g/cm3的低密度聚乙烯系樹脂)。 "Sumikathene (registered trademark)" F412-1 manufactured by Sumitomo Chemical Co., Ltd. (MFR according to JIS K7210-1999 is 5 g/10 min, melting point is 110 ° C, and density determined according to JIS K6922-2-2010 is 0.921 g/cm 3 Low density polyethylene resin).

(高密度聚乙烯系樹脂(HDPE)) (High Density Polyethylene Resin (HDPE))

使用Prime Polymer製“HI-ZEX(註冊商標)”2200J(依據JIS K7210-1999之MFR為5.2g/10min、熔點為135℃、依JIS K6922-2-2010所求得之密度為0.921g/cm3的高密度聚乙烯系樹脂)。 "HI-ZEX (registered trademark)" 2200J manufactured by Prime Polymer (MFR according to JIS K7210-1999 is 5.2 g/10 min, melting point is 135 ° C, and density determined according to JIS K6922-2-2010 is 0.921 g/cm. 3 high density polyethylene resin).

(聚丙烯系樹脂E(PP-E)) (polypropylene resin E (PP-E))

使用住友化學製“Nobrene(註冊商標)”R101(依據JIS K7210-1999之MFR為19g/10min、熔點為160℃、僅包含源自丙烯之成分的均聚丙烯系樹脂)。 "Nobrene (registered trademark)" R101 (manufactured by Sumitomo Chemical Co., Ltd.) R101 (having a MFR of 19 g/10 min according to JIS K7210-1999, a melting point of 160 ° C, and a homopolypropylene resin containing only a component derived from propylene).

(聚丙烯系樹脂F(PP-F)) (Polypropylene resin F (PP-F))

使用Prime Polymer製“Prime Polypro(註冊商標)”E111G(依據JIS K7210-1999之MFR為0.5g/10min、熔點為164℃、僅包含源自丙烯之成分的均聚丙烯系樹脂)。 "Prime Polypro (registered trademark)" E111G (a MFR of 0.5 g/10 min according to JIS K7210-1999, a melting point of 164 ° C, and a homopolypropylene resin containing only a component derived from propylene) was used.

(聚丙烯系樹脂(乙烯-丙烯隨機共聚物樹脂)(EPC)) (Polypropylene resin (ethylene-propylene random copolymer resin) (EPC))

使用Prime Polymer(股)公司製“Prime Polypro(註冊商標)”Y-2045GP(依據JIS K6922-2-2010之密度為0.91g/cm3、依據JIS K7210-1999之MFR為24g/10min、熔點為145℃的樹脂、以4質量%乙烯與96質量%丙烯之比例聚合而成的乙烯-丙烯隨機共聚物樹脂(聚丙烯系樹脂))。 "Prime Polypro (registered trademark)" Y-2045GP manufactured by Prime Polymer Co., Ltd. (density according to JIS K6922-2-2010 is 0.91 g/cm 3 , MFR according to JIS K7210-1999 is 24 g/10 min, melting point is A resin of 145 ° C, an ethylene-propylene random copolymer resin (polypropylene resin) obtained by polymerizing a ratio of 4% by mass of ethylene to 96% by mass of propylene.

(乙烯系共聚合樹脂G(E-co-G)) (ethylene-based copolymer resin G (E-co-G))

使用Dow Chemical(股)公司製“Affinity(註冊商標)”依據EG8200(JIS-K7112(1999)之密度為0.86g/cm3、源自乙烯之成分為76質量%(乙烯含有率為92.7莫耳%)、源自辛烯之成分為24質量%(辛烯含有率為7.3莫耳%)的乙烯-辛烯共聚物樹脂)。 "Affinity (registered trademark)" manufactured by Dow Chemical Co., Ltd. is used according to EG8200 (JIS-K7112 (1999) has a density of 0.86 g/cm 3 and an ethylene-derived component of 76% by mass (ethylene content is 92.7 mol). %), an ethylene-octene copolymer resin derived from an octene component of 24% by mass (octene content: 7.3 mol%).

(苯乙烯-乙烯-丁烯-苯乙烯共聚合樹脂H(SEBS-H)) (styrene-ethylene-butylene-styrene copolymer resin H (SEBS-H))

使用旭化成(股)公司製“Tuftec(註冊商標)”H1051(依據JIS-K7112(1999)之密度為0.93g/cm3、源自苯乙烯之成分為42質量%的苯乙烯-乙烯-丁烯-苯乙烯共聚合樹脂)。 "Tuftec (registered trademark)" H1051 (a density of 0.93 g/cm 3 according to JIS-K7112 (1999) and 42% by mass of styrene-ethylene-butene derived from styrene) - styrene copolymer resin).

(石油樹脂) (petroleum resin)

使用荒川化學製“ALKON(註冊商標)”P100(依據JIS K2207-1996之軟化點為100℃之以C9餾分為主成分的完全氫化石油樹脂)。 "ALKON (registered trademark)" P100 (a completely hydrogenated petroleum resin containing a C9 fraction as a main component at a softening point of 100 ° C according to JIS K2207-1996) was used.

(聚甲基戊烯系樹脂(PMP)) (polymethylpentene resin (PMP))

使用三井化學製“TPX(註冊商標)”MX002(熔點為224℃之聚甲基戊烯系樹脂)。 "TPX (registered trademark)" MX002 (polymethylpentene resin having a melting point of 224 ° C) manufactured by Mitsui Chemicals Co., Ltd. was used.

(滑劑) (slip agent)

使用日本精化製“NEUTRON-S(註冊商標)”(芥酸醯胺)、日本精化製“NEUTRON(註冊商標)”(油酸醯胺)、日油製“ALFLOW AD281F(註冊商標)”(乙烯雙油酸醯胺)此3種以各100質量份經混合者。 "NEUTRON-S (registered trademark)" (erucic acid decylamine) manufactured by Nippon Seika Co., Ltd., "NEUTRON (registered trademark)" (oleic acid amide) manufactured by Nippon Seika Co., Ltd., and "ALFLOW AD281F (registered trademark)" manufactured by Nippon Oil Co., Ltd. (Ethylene bismuth oleate) These three kinds are mixed in 100 parts by mass each.

(實施例1) (Example 1)

茲作成3層構造。使各層之組成如表所示,分別予以供給至單軸擠製機(L/D=28),於供給部溫度240℃、後續溫度為260℃下予以熔融,並使其通過過濾精密度20μm之過濾碟片(leaf disk filter)後,在設置於模具上部的分層器內以B層/A層/B層(各層之厚度比茲參考附表)方式積層後,從T字模,於控溫成85℃的金屬輥(SRa=0.03μm)上排出成薄膜狀。此時,用橡膠輥(SRa=0.6μm)予以夾持(夾持壓:0.2MPa),得到厚度100μm之積層薄膜。對所得薄膜,依(1)~(16)記載之方法進行評定。此外,就金屬輥、橡膠輥之表面粗糙度SRa,係使用厚度80μm之三乙酸纖維素薄膜(BIODEN RFA公司製,以三乙酸纖維素溶劑(乙酸甲酯)溶解者),使三乙酸纖維素薄膜在輥面上以壓接輥施加線壓9.8N/cm而轉印輥的表面形狀後在室溫將溶劑乾燥,並以該複製試樣作為量測試樣進行量測。成形性、與功能性樹脂的密接性、耐翹曲性、與A層/B層的密接性均獲得良好之結果。再者,就各層之厚度比,表中所記載之1/2/1係表示相對於薄膜總厚度100μm,表中所記載之層構造(就實施例1而言為B/A/B)的各層以1/2/1之厚度比所構成,即B層/A層/B層=1/2/1(=25μm/50μm/25μm)之形態。尚且,對於其他實施例或比較例亦同。 It is made into a three-layer structure. The composition of each layer was supplied to a uniaxial extruder (L/D=28) as shown in the table, and melted at a supply unit temperature of 240 ° C and a subsequent temperature of 260 ° C, and passed through a filtration precision of 20 μm. After the leaf disk filter, it is layered in the layerer of the upper part of the mold by layer B/A layer/B layer (the thickness of each layer is referred to the attached table), and then controlled from the T-shaped mold. The metal roll (SRa = 0.03 μm) at a temperature of 85 ° C was discharged into a film form. At this time, it was clamped with a rubber roller (SRa = 0.6 μm) (nip pressure: 0.2 MPa) to obtain a laminated film having a thickness of 100 μm. The obtained film was evaluated according to the methods described in (1) to (16). In addition, as for the surface roughness SRa of the metal roll and the rubber roll, a cellulose triacetate film (manufactured by BIODEN RFA Co., Ltd., which is dissolved in a cellulose triacetate solvent (methyl acetate)) is used to make cellulose triacetate. The film was applied with a line pressure of 9.8 N/cm on the roll surface by a pressure roller and the surface shape of the transfer roll was dried, and the solvent was dried at room temperature, and the replicated sample was used as a quantity test sample for measurement. The moldability, the adhesion to the functional resin, the warpage resistance, and the adhesion to the A layer/B layer were all good. In addition, in the thickness ratio of each layer, the 1/2/1 system shown in the table indicates the layer structure (B/A/B in the case of Example 1) described in the table with respect to the total thickness of the film of 100 μm. Each layer is composed of a thickness ratio of 1/2/1, that is, a form of B layer/A layer/B layer=1/2/1 (=25 μm/50 μm/25 μm). Still, the same applies to other embodiments or comparative examples.

(實施例2) (Example 2)

除將B層之組成變更為LMDPE以外,係以與實施例1同樣的方式得到積層薄膜。對所得薄膜依 (1)~(16)記載之方法進行評定的結果,獲得與實施例1約略相同的結果。 A laminate film was obtained in the same manner as in Example 1 except that the composition of the layer B was changed to LMDPE. According to the obtained film The results of the methods described in (1) to (16) were evaluated, and approximately the same results as in Example 1 were obtained.

(實施例3) (Example 3)

除將B層之組成變更為LDPE以外,係以與實施例1同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,衝壓耐熱性較實施例1為差。 A laminate film was obtained in the same manner as in Example 1 except that the composition of the layer B was changed to LDPE. As a result of evaluating the obtained film according to the methods described in (1) to (16), the heat resistance of the press was inferior to that of Example 1.

(實施例4) (Example 4)

除將B層之組成變更為HDPE以外,係以與實施例1同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,A層/B層間之密接性較實施例1為差。 A laminate film was obtained in the same manner as in Example 1 except that the composition of the layer B was changed to HDPE. As a result of evaluating the obtained film according to the methods described in (1) to (16), the adhesion between the A layer and the B layer was inferior to that of Example 1.

(實施例5) (Example 5)

除將積層構造變更為A層/B層之2層構造以外,係以與實施例1同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,耐翹曲性較實施例1為差。 A laminated film was obtained in the same manner as in Example 1 except that the laminated structure was changed to the two-layer structure of the A layer/B layer. As a result of evaluating the obtained film according to the methods described in (1) to (16), the warp resistance was inferior to that of Example 1.

(實施例6) (Example 6)

除將B層之組成變更為PP-E以外,係以與實施例1同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例1,A層/B層間之密接性雖較差,惟脫模性、衝壓耐熱性良好。 A laminate film was obtained in the same manner as in Example 1 except that the composition of the layer B was changed to PP-E. As a result of evaluating the obtained film according to the methods described in (1) to (16), the adhesion between the A layer and the B layer was inferior to that in Example 1, but the mold release property and the press heat resistance were good.

(實施例7) (Example 7)

除將B層之組成變更為PP-F以外,係以與實施例6同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,獲得與實施例6約略相同的結果。 A laminate film was obtained in the same manner as in Example 6 except that the composition of the layer B was changed to PP-F. The results obtained by evaluating the obtained film according to the methods described in (1) to (16) gave approximately the same results as in Example 6.

(實施例8) (Example 8)

除使B層含有石油樹脂以外,係以與實施例7同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例7脫模性雖較差,惟A層/B層間之密接性良好。 A laminate film was obtained in the same manner as in Example 7 except that the layer B was a petroleum resin. As a result of evaluating the obtained film according to the methods described in (1) to (16), the release property was inferior to that of Example 7, but the adhesion between the A layer and the B layer was good.

(實施例9) (Example 9)

除變更A層之組成並設A層之Tg為97℃以外,係以與實施例1同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例1,加工適性、衝壓耐熱性較差。 A laminate film was obtained in the same manner as in Example 1 except that the composition of the layer A was changed and the Tg of the layer A was changed to 97 °C. As a result of evaluating the obtained film according to the methods described in (1) to (16), the workability and the heat resistance of the press were inferior compared to Example 1.

(實施例10) (Embodiment 10)

除變更A層之組成、設A層之Tg為172℃,並設擠製機之供給部溫度為265℃、後續溫度為275℃以外,係以與實施例1同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,加工適性雖良好,惟成型性、A層/B層間之密接性較差。 A laminate film was obtained in the same manner as in Example 1 except that the composition of the layer A was changed, the Tg of the layer A was 172 ° C, and the temperature of the supply portion of the extruder was 265 ° C and the subsequent temperature was 275 ° C. As a result of evaluating the obtained film according to the methods described in (1) to (16), the processing suitability was good, but the moldability and the adhesion between the A layer and the B layer were inferior.

(實施例11) (Example 11)

除變更積層比並減少B層之厚度以外,係以與實施例1同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例1,A/B層間之密接性雖較差,惟加工適性良好。 A laminate film was obtained in the same manner as in Example 1 except that the laminate ratio was changed and the thickness of the layer B was decreased. As a result of evaluating the obtained film according to the methods described in (1) to (16), the adhesion between the A/B layers was inferior to that in Example 1, but the processing suitability was good.

(實施例12) (Embodiment 12)

除變更積層比並減少B層之厚度以外,係以與實施例1同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,獲得與實施例1約略相同的結果。 A laminate film was obtained in the same manner as in Example 1 except that the laminate ratio was changed and the thickness of the layer B was decreased. The results obtained by evaluating the obtained film according to the methods described in (1) to (16) gave approximately the same results as in Example 1.

(實施例13) (Example 13)

除變更積層比並減少B層之厚度以外,係以與實施例1同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例1加工性較良好。 A laminate film was obtained in the same manner as in Example 1 except that the laminate ratio was changed and the thickness of the layer B was decreased. As a result of evaluating the obtained film according to the methods described in (1) to (16), the workability was better than that of Example 1.

(實施例14) (Example 14)

除變更積層比並減少B層之厚度以外,係以與實施例1同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例1,加工適性較差。 A laminate film was obtained in the same manner as in Example 1 except that the laminate ratio was changed and the thickness of the layer B was decreased. As a result of evaluating the obtained film according to the methods described in (1) to (16), the processing suitability was inferior compared to Example 1.

(實施例15) (Example 15)

除減少總厚度以外,係以與實施例1同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例1,成型性、A層/B層間之密接性較差。 A laminate film was obtained in the same manner as in Example 1 except that the total thickness was reduced. As a result of evaluating the obtained film according to the methods described in (1) to (16), the moldability and the adhesion between the A layer and the B layer were inferior to those in Example 1.

(實施例16) (Embodiment 16)

除減少總厚度以外,係以與實施例1同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例1,成型性較差。 A laminate film was obtained in the same manner as in Example 1 except that the total thickness was reduced. As a result of evaluating the obtained film according to the methods described in (1) to (16), the moldability was inferior to that of Example 1.

(實施例17) (Example 17)

除減少總厚度以外,係以與實施例15同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例15,成型性、加工適性、A層/B層間之密接性較差。 A laminate film was obtained in the same manner as in Example 15 except that the total thickness was reduced. As a result of evaluating the obtained film according to the methods described in (1) to (16), the moldability, the workability, and the adhesion between the A layer and the B layer were inferior to those of Example 15.

(實施例18) (Embodiment 18)

除增加層厚度以外,係以與實施例16同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例16,衝壓耐熱性較差。 A laminate film was obtained in the same manner as in Example 16 except that the layer thickness was increased. As a result of evaluating the obtained film according to the methods described in (1) to (16), the heat resistance of the press was inferior to that of Example 16.

(實施例19) (Embodiment 19)

除使B層含有滑劑以外,係以與實施例1同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例1,脫模性雖良好,惟A層/B層間之密接性較差。 A laminate film was obtained in the same manner as in Example 1 except that the layer B was a lubricant. As a result of evaluating the obtained film according to the methods described in (1) to (16), the mold release property was good as compared with Example 1, but the adhesion between the A layer and the B layer was poor.

(實施例20) (Embodiment 20)

除使B層含有COC-B以外,係以與實施例1同樣的方式得到積層薄膜。對所得積層薄膜,利用電暈處理機以E值=3於兩面進行表面處理。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例1,脫模性、A層/B層間之密接性較差。 A laminate film was obtained in the same manner as in Example 1 except that the layer B contained COC-B. The obtained laminated film was subjected to surface treatment by a corona treatment machine at an E value of 3 on both sides. As a result of evaluating the obtained film according to the methods described in (1) to (16), the mold release property and the adhesion between the A layer and the B layer were inferior to those of Example 1.

(實施例21) (Example 21)

除使B層含有滑劑與PMP以外,係以與實施例1同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例1,脫模性雖良好,惟與功能性樹脂層的密接性、A層/B層間之密 接性較差。此外,就熔點而言係檢測2處,從而分別對其等求出結晶熔解熱量,並於表中記載各值。 A laminate film was obtained in the same manner as in Example 1 except that the layer B contained a lubricant and a PMP. As a result of evaluating the obtained film according to the methods described in (1) to (16), the mold release property was good as compared with Example 1, but the adhesion to the functional resin layer and the adhesion between the A layer and the B layer were good. Poor connection. Further, two points were detected in terms of the melting point, and the heat of crystal melting was determined separately, and the respective values are shown in the table.

(實施例22) (Example 22)

除提高B層中的COC-B濃度並設電暈處理機之E值=10以外,係以與實施例20同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例20,脫模性較差。 A laminate film was obtained in the same manner as in Example 20 except that the COC-B concentration in the layer B was increased and the E value of the corona treatment machine was set to 10. As a result of evaluating the obtained film according to the methods described in (1) to (16), the mold release property was inferior to that of Example 20.

(實施例23) (Example 23)

除變更A層之組成並設A層之Tg為126℃以外,係以與實施例6同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,獲得與實施例6約略相同的結果。 A laminate film was obtained in the same manner as in Example 6 except that the composition of the layer A was changed and the Tg of the layer A was 126 °C. The results obtained by evaluating the obtained film according to the methods described in (1) to (16) gave approximately the same results as in Example 6.

(實施例24) (Example 24)

除變更A層之組成並設A層之Tg為130℃以外,係以與實施例23同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例23,加工適性較良好。 A laminate film was obtained in the same manner as in Example 23 except that the composition of the layer A was changed and the Tg of the layer A was changed to 130 °C. As a result of evaluating the obtained film according to the methods described in (1) to (16), the processing suitability was better than that of Example 23.

(實施例25) (Embodiment 25)

除變更A層之組成並設A層之Tg為138℃以外,係以與實施例24同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例24,加工適性較良好。 A laminate film was obtained in the same manner as in Example 24 except that the composition of the layer A was changed and the Tg of the layer A was 138 °C. As a result of evaluating the obtained film according to the methods described in (1) to (16), the processing suitability was better than that in Example 24.

(實施例26) (Example 26)

除變更A層之組成並設A層之Tg為145℃以外,係以與實施例6同樣的方式得到積層薄膜。對所 得薄膜依(1)~(16)記載之方法進行評定的結果,獲得與實施例25約略相同的結果。 A laminate film was obtained in the same manner as in Example 6 except that the composition of the layer A was changed and the Tg of the layer A was changed to 145 °C. Right place The film was evaluated according to the methods described in (1) to (16), and about the same results as in Example 25 were obtained.

(實施例27) (Example 27)

除變更A層之組成並設A層之Tg為155℃以外,係以與實施例6同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例26,成型性、A層/B層間之密接性較差。 A laminate film was obtained in the same manner as in Example 6 except that the composition of the layer A was changed and the Tg of the layer A was 155 °C. As a result of evaluating the obtained film according to the methods described in (1) to (16), the moldability and the adhesion between the layer A and the layer B were inferior to those in the example 26.

(實施例28) (Embodiment 28)

除將A層之m-LLDE變更為乙烯系共聚合樹脂(E-co-G)並調成表中之濃度以外,係以與實施例25同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例25,A層/B層間之密接性較良好。 A laminate film was obtained in the same manner as in Example 25 except that the m-LLDE of the layer A was changed to the ethylene-based copolymer resin (E-co-G) and the concentration in the table was adjusted. As a result of evaluating the obtained film according to the methods described in (1) to (16), the adhesion between the A layer and the B layer was better than that in Example 25.

(實施例29) (Example 29)

除增加乙烯系共聚合樹脂之濃度以外,係以與實施例28同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例28,A層/B層間之密接性較良好。 A laminate film was obtained in the same manner as in Example 28 except that the concentration of the ethylene-based copolymer resin was increased. As a result of evaluating the obtained film according to the methods described in (1) to (16), the adhesion between the A layer and the B layer was better than that in Example 28.

(實施例30) (Embodiment 30)

除增加乙烯系共聚合樹脂之濃度以外,係以與實施例29同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例29,加工適性較差。 A laminate film was obtained in the same manner as in Example 29 except that the concentration of the ethylene-based copolymer resin was increased. As a result of evaluating the obtained film according to the methods described in (1) to (16), the processing suitability was inferior to that of Example 29.

(實施例31) (Example 31)

除增加乙烯系共聚合樹脂之濃度以外,係以與實施例30同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例30,加工適性、衝壓耐熱性較差。 A laminate film was obtained in the same manner as in Example 30 except that the concentration of the ethylene-based copolymer resin was increased. As a result of evaluating the obtained film according to the methods described in (1) to (16), the processing suitability and the stamping heat resistance were inferior to those in Example 30.

(實施例32) (Example 32)

除將乙烯共聚合樹脂變更為苯乙烯-乙烯-丁烯-苯乙烯共聚合樹脂以外,係以與實施例29同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例29,加工適性、A層/B層間之相間密接性較差。 A laminate film was obtained in the same manner as in Example 29 except that the ethylene copolymer resin was changed to a styrene-ethylene-butylene-styrene copolymer resin. As a result of evaluation of the obtained film according to the methods described in (1) to (16), the processing suitability and the phase-to-phase adhesion between the A layer and the B layer were inferior compared to Example 29.

(實施例33) (Example 33)

除設金屬輥之溫度為40℃以外,係以與實施例29同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例29,A層/B層間之相間密接性較差。 A laminated film was obtained in the same manner as in Example 29 except that the temperature of the metal roll was 40 °C. As a result of evaluating the obtained film according to the methods described in (1) to (16), the phase-to-phase adhesion between the A layer and the B layer was inferior to that in Example 29.

(實施例34) (Example 34)

除設金屬輥之溫度為25℃以外,係以與實施例33同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例33,A層/B層間之相間密接性較差。 A laminated film was obtained in the same manner as in Example 33 except that the temperature of the metal roll was 25 °C. As a result of evaluating the obtained film according to the methods described in (1) to (16), the phase-to-phase adhesion between the A layer and the B layer was inferior compared to Example 33.

(實施例35) (Example 35)

除設金屬輥之溫度為120℃以外,係以與實施例29同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例29,成形性較差。 A laminated film was obtained in the same manner as in Example 29 except that the temperature of the metal roll was 120 °C. As a result of evaluating the obtained film according to the methods described in (1) to (16), the formability was inferior to that of Example 29.

(實施例36) (Example 36)

除將B層之組成變更為EPC以外,係以與實施例1同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例1,衝壓耐熱性較良好。 A laminate film was obtained in the same manner as in Example 1 except that the composition of the layer B was changed to EPC. As a result of evaluating the obtained film according to the methods described in (1) to (16), the heat resistance of the press was better than that of Example 1.

(實施例37) (Example 37)

除變更積層比並增加B層之厚度以外,係以與實施例29同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例29,加工適性、衝壓耐熱性較差。 A laminate film was obtained in the same manner as in Example 29 except that the laminate ratio was changed and the thickness of the layer B was increased. As a result of evaluating the obtained film according to the methods described in (1) to (16), the workability and the heat resistance of the press were inferior to those of Example 29.

(實施例38) (Example 38)

除變更積層比並減少B層之厚度以外,係以與實施例29同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例29,A層/B層間之密接性較差。 A laminate film was obtained in the same manner as in Example 29 except that the laminate ratio was changed and the thickness of the layer B was decreased. As a result of evaluating the obtained film according to the methods described in (1) to (16), the adhesion between the A layer and the B layer was inferior to that in Example 29.

(實施例39) (Example 39)

除變更乙烯共聚合樹脂之種類以外,係以與實施例29同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例29,成型性、衝壓耐熱性較差。 A laminate film was obtained in the same manner as in Example 29 except that the type of the ethylene copolymer resin was changed. As a result of evaluating the obtained film according to the methods described in (1) to (16), moldability and press heat resistance were inferior compared to Example 29.

(實施例40) (Embodiment 40)

除使A層含有COC-T以外,係以與實施例29同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例29、實施例31,視覺辨識性較良好。 A laminate film was obtained in the same manner as in Example 29 except that the layer A contained COC-T. As a result of evaluating the obtained film according to the methods described in (1) to (16), the visual recognition property was better than that of Example 29 and Example 31.

此外,COC-T雖含有氧化鈦,但於表中之「A層之環狀烯烴系樹脂之比例(質量%)」一欄係記載不含氧化鈦之含量,即僅有環狀烯烴系樹脂之含量。換言之,於表中之實施例40之「A層之環狀烯烴系樹脂之比例(質量%)」一欄係記載由構成A層之COC-A與COC-T之含量的合計減去氧化鈦等環狀烯烴系以外的物質之含量之值。尚且,對於其他實施例或比較例亦同。 In addition, although the COC-T contains titanium oxide, the column "the ratio (% by mass) of the cyclic olefin resin of the A layer" in the table describes the content of the titanium oxide-free resin, that is, only the cyclic olefin resin. The content. In other words, in the column of "the ratio (% by mass) of the cyclic olefin resin of the A layer" in the example 40 in the table, the total amount of COC-A and COC-T constituting the layer A is subtracted from the titanium oxide. The value of the content of a substance other than the cyclic olefin system. Still, the same applies to other embodiments or comparative examples.

(實施例41) (Example 41)

除提高A層中的COC-T之含量以外,係以與實施例40同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相對於實施例40,視覺辨識性較良好。 A laminate film was obtained in the same manner as in Example 40 except that the content of COC-T in the layer A was increased. As a result of evaluating the obtained film according to the methods described in (1) to (16), the visibility was better than that of Example 40.

(實施例42) (Example 42)

除提高A層中的COC-T之含量以外,係以與實施例40同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,獲得與實施例40相同的結果。 A laminate film was obtained in the same manner as in Example 40 except that the content of COC-T in the layer A was increased. The results of the evaluation of the obtained film according to the methods described in (1) to (16) gave the same results as in Example 40.

(實施例43) (Example 43)

除提高A層中的COC-T之含量以外,係以與實施例42同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例42,A層/B層間之密接性較差。 A laminate film was obtained in the same manner as in Example 42 except that the content of COC-T in the layer A was increased. As a result of evaluating the obtained film according to the methods described in (1) to (16), the adhesion between the A layer and the B layer was inferior to that in Example 42.

(實施例44) (Example 44)

除提高A層中的COC-T之含量以外,係以與實施例43同樣的方式得到積層薄膜。對所得薄膜依 (1)~(16)記載之方法進行評定的結果,相較於實施例43,與功能性樹脂層的密接性較差。 A laminate film was obtained in the same manner as in Example 43 except that the content of COC-T in the layer A was increased. According to the obtained film As a result of the evaluation by the methods described in (1) to (16), the adhesion to the functional resin layer was inferior to that of Example 43.

(實施例45) (Example 45)

除設金屬輥之表面粗糙度SRa為0.05μm並設金屬輥之溫度為30℃以外,係以與實施例29同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,獲得與實施例29約略相同的結果。 A laminated film was obtained in the same manner as in Example 29 except that the surface roughness SRa of the metal roll was 0.05 μm and the temperature of the metal roll was 30 °C. The results obtained by evaluating the obtained film according to the methods described in (1) to (16) gave approximately the same results as in Example 29.

(實施例46) (Example 46)

除設金屬輥之表面粗糙度SRa為0.05μm以外,係以與實施例29同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例29、45,視覺辨識性較良好。 A laminated film was obtained in the same manner as in Example 29 except that the surface roughness SRa of the metal roll was 0.05 μm. As a result of evaluating the obtained film according to the methods described in (1) to (16), the visual recognition property was better than that of Examples 29 and 45.

(實施例47) (Example 47)

除設金屬輥之表面粗糙度SRa為0.63μm以外,係以與實施例46同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例46,視覺辨識性較良好。 A laminated film was obtained in the same manner as in Example 46 except that the surface roughness SRa of the metal roll was 0.63 μm. As a result of evaluating the obtained film according to the methods described in (1) to (16), the visual recognition property was better than that of Example 46.

(實施例48) (Example 48)

除設金屬輥之表面粗糙度SRa為3.0μm並設金屬輥之溫度為30℃以外,係以與實施例47同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例47,與功能性樹脂層的密接性較差。 A laminated film was obtained in the same manner as in Example 47 except that the surface roughness SRa of the metal roll was 3.0 μm and the temperature of the metal roll was 30 °C. As a result of evaluating the obtained film according to the methods described in (1) to (16), the adhesion to the functional resin layer was inferior to that of Example 47.

(實施例49) (Example 49)

除設金屬輥之表面粗糙度SRa為3.0μm以外,係以與實施例29同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例48,與功能性樹脂層的密接性較差。 A laminated film was obtained in the same manner as in Example 29 except that the surface roughness SRa of the metal roll was 3.0 μm. As a result of evaluating the obtained film according to the methods described in (1) to (16), the adhesion to the functional resin layer was inferior to that of Example 48.

(實施例50) (Example 50)

除變更積層比並減少B層之厚度以外,係以與實施例29同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例29,A層/B層間之密接性較差。 A laminate film was obtained in the same manner as in Example 29 except that the laminate ratio was changed and the thickness of the layer B was decreased. As a result of evaluating the obtained film according to the methods described in (1) to (16), the adhesion between the A layer and the B layer was inferior to that in Example 29.

(實施例51) (Example 51)

除變更積層比並減少B層之厚度以外,係以與實施例50同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例50,成型性較良好。 A laminate film was obtained in the same manner as in Example 50 except that the laminate ratio was changed and the thickness of the layer B was decreased. As a result of evaluating the obtained film according to the methods described in (1) to (16), the moldability was better than that of Example 50.

(實施例52) (Example 52)

除變更積層比並減少B層之厚度以外,係以與實施例51同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,獲得與實施例51相同的結果。 A laminate film was obtained in the same manner as in Example 51 except that the laminate ratio was changed and the thickness of the layer B was decreased. The obtained film was evaluated according to the method described in (1) to (16), and the same results as in Example 51 were obtained.

(實施例53) (Example 53)

除變更積層比並減少B層之厚度以外,係以與實施例52同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例51,脫模性較差。 A laminate film was obtained in the same manner as in Example 52 except that the laminate ratio was changed and the thickness of the layer B was decreased. As a result of evaluating the obtained film according to the methods described in (1) to (16), the mold release property was inferior to that of Example 51.

(實施例54) (Example 54)

除降低A層之環狀烯烴系樹脂之比例以外,係以與實施例29同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,獲得與實施例29約略相同的結果。 A laminate film was obtained in the same manner as in Example 29 except that the ratio of the cyclic olefin resin of the A layer was lowered. The results obtained by evaluating the obtained film according to the methods described in (1) to (16) gave approximately the same results as in Example 29.

(實施例55) (Example 55)

除降低A層之環狀烯烴系樹脂之比例以外,係以與實施例54同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,相較於實施例54,加工適性較差。 A laminate film was obtained in the same manner as in Example 54 except that the ratio of the cyclic olefin resin of the A layer was lowered. As a result of evaluating the obtained film according to the methods described in (1) to (16), the processing suitability was inferior to that of Example 54.

(實施例56) (Example 56)

除將積層構造變更為A層/B層之2層構造以外,係以與實施例29同樣的方式得到積層薄膜。對所得薄膜依(1)~(16)記載之方法進行評定的結果,耐翹曲性比起實施例29較差。 A laminated film was obtained in the same manner as in Example 29 except that the laminated structure was changed to the two-layer structure of the A layer/B layer. As a result of evaluating the obtained film according to the methods described in (1) to (16), the warpage resistance was inferior to that of Example 29.

(比較例1) (Comparative Example 1)

茲作成單層構造。以表所示組成混合樹脂,予以供給至單軸擠製機(L/D=28),於供給部溫度240℃、後續溫度為260℃下予以熔融,並使其通過過濾精密度20μm之過濾碟片。其後,從T字模(唇端間隙(lip gap):0.4mm),於控溫成85℃的金屬輥上排出成片狀。此時,用橡膠輥予以夾持(夾持壓:0.2MPa),得到厚度100μm之單層薄膜。對所得薄膜,依(1)~(16)記載之方法進行評定。 It is made into a single layer structure. The mixed resin was composed as shown in the table, and supplied to a uniaxial extruder (L/D = 28). The mixture was melted at a supply temperature of 240 ° C and a subsequent temperature of 260 ° C, and filtered through a filtration precision of 20 μm. Disc. Thereafter, it was discharged into a sheet shape from a T-die (lip gap: 0.4 mm) on a metal roll controlled to 85 °C. At this time, it was clamped with a rubber roller (clamping pressure: 0.2 MPa) to obtain a single-layer film having a thickness of 100 μm. The obtained film was evaluated according to the methods described in (1) to (16).

(比較例2) (Comparative Example 2)

除使組成為如表所示、設擠製機之供給部溫度為190℃、設後續溫度為220℃以外,係以與比較例1同樣的方式得到單層薄膜。對所得薄膜,依(1)~(16)記載之方法進行評定。 A single-layer film was obtained in the same manner as in Comparative Example 1, except that the composition was as shown in the table, and the temperature of the supply portion of the extruder was 190 ° C and the subsequent temperature was 220 ° C. The obtained film was evaluated according to the methods described in (1) to (16).

(比較例3、4) (Comparative Examples 3 and 4)

除使組成如表所示以外,係以與實施例1同樣的方式得到積層試樣。對所得薄膜,依(1)~(16)記載之方法進行評定。 A laminate sample was obtained in the same manner as in Example 1 except that the composition was as shown in the table. The obtained film was evaluated according to the methods described in (1) to (16).

將各實施例及各比較例之細節示於表中。 The details of the respective examples and comparative examples are shown in the table.

此外,就評定而言,在需有對微細形狀之對應性的電磁波遮蔽層轉印薄膜用途中,係以成型性為S評定、A層/B層間之密接性為C評定以上為較佳,在作為裝飾用途從深拉成型體(即成型倍率加大的成型體)進行剝離轉印時,由於需剝除對應至進深處的薄膜,因此成型性為A評定以上、A層/B層間之密接性為B評定以上特佳。 In addition, in the application of the electromagnetic wave shielding layer transfer film which is required to have a correspondence with a fine shape, it is preferable that the moldability is S, and the adhesion between the A layer and the B layer is C. When peeling and transferring from a deep-drawn molded body (that is, a molded body having an increased molding magnification) as a decorative use, since the film corresponding to the depth is to be peeled off, the moldability is evaluated by A or more, and between A and B layers. The adhesion is particularly good for B.

又,表中「PE系樹脂」係表示「聚乙烯系樹脂」,「PP系樹脂」表示「聚丙烯系樹脂」。 In the table, "PE resin" means "polyethylene resin", and "PP resin" means "polypropylene resin".

Claims (14)

一種積層薄膜,其係在以環狀烯烴系樹脂為主成分之A層的兩面具有以聚丙烯系樹脂及/或聚乙烯系樹脂為主成分之B層,而僅由B層、A層、B層的3層所構成,且120℃之儲存彈性模數為101MPa以上3,000MPa以下、170℃之儲存彈性模數為100MPa以下。 A laminated film having a B layer mainly composed of a polypropylene resin and/or a polyethylene resin as a main component of the A layer containing a cyclic olefin resin as a main component, and only the B layer and the A layer. The three layers of the B layer are composed, and the storage elastic modulus at 120 ° C is 101 MPa or more and 3,000 MPa or less, and the storage elastic modulus at 170 ° C is 100 MPa or less. 如請求項1之積層薄膜,其中該A層之玻璃轉移溫度為130℃以上150℃以下。 The laminated film according to claim 1, wherein the glass transition temperature of the layer A is 130 ° C or more and 150 ° C or less. 如請求項1或2之積層薄膜,其中該A層在設A層之總成分的合計為100質量%時,含有15質量%以上40質量%以下之乙烯系共聚合樹脂。 The laminated film according to claim 1 or 2, wherein the A layer contains 15% by mass or more and 40% by mass or less of the ethylene-based copolymer resin when the total of the total components of the layer A is 100% by mass. 如請求項1或2之積層薄膜,其中該B層之表面自由能為25mN/m以上35mN/m以下。 The laminate film of claim 1 or 2, wherein the surface layer free energy of the layer B is 25 mN/m or more and 35 mN/m or less. 如請求項1或2之積層薄膜,其中該B層係以聚丙烯系樹脂為主成分,並進一步含有石油樹脂。 The laminated film according to claim 1 or 2, wherein the B layer is mainly composed of a polypropylene resin and further contains a petroleum resin. 如請求項1或2之積層薄膜,其中該B層係以聚乙烯系樹脂為主成分,該聚乙烯系樹脂係直鏈狀低密度聚乙烯或高密度聚乙烯。 The laminated film according to claim 1 or 2, wherein the B layer is mainly composed of a polyethylene resin which is a linear low density polyethylene or a high density polyethylene. 如請求項1或2之積層薄膜,其兩面之表面粗糙度SRa為50nm以上3,000nm以下。 The laminated film of claim 1 or 2 has a surface roughness SRa of 50 nm or more and 3,000 nm or less on both surfaces. 如請求項1或2之積層薄膜,其霧度為65%以上90%以下。 The laminate film of claim 1 or 2 has a haze of 65% or more and 90% or less. 如請求項1或2之積層薄膜,其色調L值為75以上100以下。 The laminated film of claim 1 or 2 has a hue L value of 75 or more and 100 or less. 如請求項1或2之積層薄膜,其積層比(B層之合計厚度(μm)/A層之厚度(μm))為0.1以上0.15以下、薄膜之總厚度為40μm以上300μm以下。 The laminated film of the claim 1 or 2 has a laminate ratio (the total thickness (μm) of the layer B/the thickness (μm) of the layer A) of 0.1 or more and 0.15 or less, and the total thickness of the film is 40 μm or more and 300 μm or less. 如請求項1或2之積層薄膜,其積層比(B層之合計厚度(μm)/A層之厚度(μm))為0.25以上2以下、薄膜之總厚度為40μm以上300μm以下。 In the laminated film of the claim 1 or 2, the laminate ratio (the total thickness (μm) of the layer B/the thickness (μm) of the layer A) is 0.25 or more and 2 or less, and the total thickness of the film is 40 μm or more and 300 μm or less. 如請求項3之積層薄膜,其中乙烯系共聚合樹脂的密度為0.84g/cm3以上0.86g/cm3以下。 The laminated film according to claim 3, wherein the ethylene-based copolymer resin has a density of 0.84 g/cm 3 or more and 0.86 g/cm 3 or less. 一種功能性樹脂層轉印薄膜,其具有如請求項1至12中任一項之積層薄膜及功能性樹脂層。 A functional resin layer transfer film having the laminated film and the functional resin layer according to any one of claims 1 to 12. 一種包裝用薄膜,其具有如請求項1至12中任一項之積層薄膜。 A film for packaging having the laminated film according to any one of claims 1 to 12.
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