TWI577311B - 高勁度、防滑洗滌刷組件，高勁度心軸，子組件及組合方法 - Google Patents

高勁度、防滑洗滌刷組件，高勁度心軸，子組件及組合方法 Download PDF

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Publication number
TWI577311B
TWI577311B TW102114625A TW102114625A TWI577311B TW I577311 B TWI577311 B TW I577311B TW 102114625 A TW102114625 A TW 102114625A TW 102114625 A TW102114625 A TW 102114625A TW I577311 B TWI577311 B TW I577311B
Authority
TW
Taiwan
Prior art keywords
mandrel
sleeve
washing brush
brush assembly
length
Prior art date
Application number
TW102114625A
Other languages
English (en)
Chinese (zh)
Other versions
TW201406325A (zh
Inventor
陳輝
陳宏
艾特金森吉姆
霍大衛Ｄ
Original Assignee
應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 應用材料股份有限公司 filed Critical 應用材料股份有限公司
Publication of TW201406325A publication Critical patent/TW201406325A/zh
Application granted granted Critical
Publication of TWI577311B publication Critical patent/TWI577311B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B3/00—Brushes characterised by the way in which the bristles are fixed or joined in or on the brush body or carrier
    • A46B3/005—Bristle carriers and bristles moulded as a unit
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B13/00—Brushes with driven brush bodies or carriers
    • A46B13/001—Cylindrical or annular brush bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/60—Cleaning only by mechanical processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Brushes (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
TW102114625A 2012-04-26 2013-04-24 高勁度、防滑洗滌刷組件，高勁度心軸，子組件及組合方法 TWI577311B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/456,796 US9119461B2 (en) 2012-04-26 2012-04-26 High stiffness, anti-slip scrubber brush assembly, high-stiffness mandrel, subassemblies, and assembly methods

Publications (2)

Publication Number Publication Date
TW201406325A TW201406325A (zh) 2014-02-16
TWI577311B true TWI577311B (zh) 2017-04-11

Family

ID=49476037

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102114625A TWI577311B (zh) 2012-04-26 2013-04-24 高勁度、防滑洗滌刷組件，高勁度心軸，子組件及組合方法

Country Status (5)

Country Link
US (1) US9119461B2 (https=)
JP (1) JP2015516862A (https=)
KR (1) KR102194652B1 (https=)
TW (1) TWI577311B (https=)
WO (1) WO2013162864A1 (https=)

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US9202723B2 (en) 2011-11-29 2015-12-01 Illinois Tool Works, Inc. Brush with cantilevered nodules
US20140059913A1 (en) * 2012-03-14 2014-03-06 Advanced Innovation and Manufacturing, Inc. Suppressor sleeves and heat resistant weapon accessories
US9140511B2 (en) * 2012-03-14 2015-09-22 Frank J. Michal Barrel and suppressor sleeves and heat resistant weapon accessories
US8778087B2 (en) 2012-04-03 2014-07-15 Illinois Tool Works Inc. Conical sponge brush for cleaning semiconductor wafers
CN110216088A (zh) * 2019-04-30 2019-09-10 广东隽诺环保科技股份有限公司 一种清洗刀辊以及具有清洗刀辊的清洗机
CN110335837A (zh) * 2019-07-05 2019-10-15 北京理工大学 一种半导体晶圆清洗用多孔亲水材料和组件的制备方法
KR102366741B1 (ko) * 2019-10-15 2022-02-22 윤정혜 기판세정장치
CN114438552B (zh) * 2022-02-08 2022-09-16 广东嘉元科技股份有限公司 一种电解铜箔生产表面处理装置
EP4533528A4 (en) * 2022-05-31 2025-08-20 Entegris Inc Cleaning brush for semiconductor fabrication process
KR102664024B1 (ko) * 2022-06-17 2024-05-13 주식회사 브러쉬텍 내경이 확장된 웨이퍼 세정용 브러쉬
KR102916898B1 (ko) * 2023-06-15 2026-01-23 윤스랩 주식회사 웨이퍼 세정용 브러쉬
US20250160507A1 (en) * 2023-11-22 2025-05-22 Tech Core Pva, Llc Cylindrical Brush with Varying Brush Nodule Length
KR102861722B1 (ko) * 2025-04-21 2025-09-19 주식회사 퓨리언스 Pva 브러쉬의 균일한 함수율을 확보하고, 공회전, 뒤틀림 및 이탈 방지 기능을 포함하는 브러쉬 코어

Citations (2)

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Publication number Priority date Publication date Assignee Title
KR20110034802A (ko) * 2009-09-29 2011-04-06 방선정 반도체 웨이퍼용 브러쉬 롤
TWI351991B (en) * 2006-03-07 2011-11-11 Applied Materials Inc Scrubber brush with sleeve and brush mandrel for u

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6299698B1 (en) 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
SG99307A1 (en) * 1999-06-01 2003-10-27 Applied Materials Inc Brush core for disk scrubbing apparatus and method for use thereof
US6728989B2 (en) 2001-01-27 2004-05-04 Applied Materials Inc. Labyrinth seal for bearing in brush mounting assembly for semiconductor wafer scrubber
US7955693B2 (en) 2001-04-20 2011-06-07 Tolland Development Company, Llc Foam composition roller brush with embedded mandrel
US6904637B2 (en) 2001-10-03 2005-06-14 Applied Materials, Inc. Scrubber with sonic nozzle
TWI286096B (en) * 2003-08-08 2007-09-01 Entegris Inc Methods and materials for making a monolithic porous pad onto a rotatable base
US20050109371A1 (en) 2003-10-27 2005-05-26 Applied Materials, Inc. Post CMP scrubbing of substrates
CN100502722C (zh) 2004-01-29 2009-06-24 应用材料公司 在心轴上安装洗涤器刷子的方法和设备
JP2007289878A (ja) 2006-04-26 2007-11-08 Hitachi High-Technologies Corp ディスク洗浄ブラシ、ディスク洗浄機構およびディスク洗浄装置
WO2007145904A2 (en) 2006-06-05 2007-12-21 Applied Materials, Inc. Methods and apparatus for supporting a substrate in a horizontal orientation during cleaning
JP2008004618A (ja) * 2006-06-20 2008-01-10 Renesas Technology Corp 半導体装置の製造方法
TWI594811B (zh) 2010-05-19 2017-08-11 湯瑪士衛斯特公司 用於擦洗基材的裝置與方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI351991B (en) * 2006-03-07 2011-11-11 Applied Materials Inc Scrubber brush with sleeve and brush mandrel for u
KR20110034802A (ko) * 2009-09-29 2011-04-06 방선정 반도체 웨이퍼용 브러쉬 롤

Also Published As

Publication number Publication date
KR20150016274A (ko) 2015-02-11
TW201406325A (zh) 2014-02-16
WO2013162864A1 (en) 2013-10-31
KR102194652B1 (ko) 2020-12-24
JP2015516862A (ja) 2015-06-18
US9119461B2 (en) 2015-09-01
US20130283556A1 (en) 2013-10-31

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