TWI577255B - Automatic alignment method for circuit board cutting - Google Patents

Description

Automatic alignment method for circuit board cutting

The "automatic alignment method for circuit board cutting" of the present invention relates to a technique for automatically aligning the cutting position of a circuit board.

After the circuit board industry has completed the pressing of the circuit board in the process, the relatively large area often needs to be split in half and divided into two. In order to solve the problem of half-cutting of circuit boards, the conventional industry often needs to make special, complicated and high-cost mechanisms, such as many detectors, steering mechanisms, displacement mechanisms and clamping mechanisms, etc., and the gross profit is getting lower and lower. In an era of increasingly fierce competition, there is a need for more ideal, simple, and low-cost methods and institutions to replace the learners in order to create profits.

In view of this, the inventor has been able to use the present case to improve the existing defects in order to make the half-cutting technology of the sheet more perfect, ideal and progressive. The inventor has worked hard to find a solution based on the accumulated experience of the industry for decades, and finally completed the invention. The inventor hopes that with the proposal of this case, he will be able to contribute his own talents to the industry.

In order to improve the conventional circuit board, the method and mechanism are too The problem of cumbersome and high cost, the automatic alignment method of circuit board cutting in the present invention, the main purpose of which is to provide a simple automatic alignment method, after the circuit board is fed into a lifting device, the lifting device is After the jacking, a central high and a low end can be formed, and the lifting device is provided with an air suction function, so that the groove reserved in the center of the circuit board can be positioned at the top of the center; , in a relatively simple way and mechanism, to ensure that the cutting position is accurate, in order to successfully complete the cutting.

In order to achieve the above object, the method specifically includes the steps of: pre-positioning a groove at a position where a circuit board is to be cut, and then feeding the circuit board to a lifting device, and then lifting the center of the bottom of the lifting device; The lifting device can form a central high and a low end state after being lifted, and then suctioning the vacuum through the lifting device, so that the bottom of the circuit board is closely adsorbed on the surface of the lifting device to avoid displacement. Then, the lifting device is lowered, so that a cutter cuts the predetermined path, and then the vacuum suctioning action is released, and finally the circuit board is conveyed and discharged.

The cutting operation may also be performed before the lifting device has been lowered, and the lifting device is lowered after being cut.

11‧‧‧Reserving trenches in circuit boards

12‧‧‧Feed to lifting device

13‧‧‧Uplift lifting device

14‧‧‧Suction

15‧‧‧ Lowering the lifting device

16‧‧‧cut

17‧‧‧ Stop sucking

18‧‧‧Export

19‧‧‧Completed

2‧‧‧ lifting device

21‧‧‧ body

22‧‧‧ stomata

23‧‧‧ gap

3‧‧‧ circuit board

31‧‧‧ trench

4‧‧‧Tools

The first figure is a flow chart of the method of the present invention.

Second figure: is a schematic perspective view of the feed when the invention is implemented.

The third figure is a three-dimensional schematic diagram of the completion of the feed when the invention is implemented.

The fourth figure is a three-dimensional schematic diagram of the lifting device rising upward to perform alignment when the invention is implemented.

Fig. 5 is a perspective view showing the lowering of the lifting device when the invention is implemented.

Fig. 6 is a schematic view showing cutting at the time of implementation of the present invention.

Figure 7 is a three-dimensional schematic view of the cutting and discharging when the invention is implemented.

The detailed procedure and the effect of the automatic alignment method for cutting the circuit board of the present invention are described in detail below with reference to the preferred embodiment of the present invention.

First, please refer to the first figure, the automatic alignment method of the circuit board cutting in this case includes the following steps: Step 1: Reserve a groove 11 in the circuit board, the groove is located at a position to be cut; Step 2: feeding to the lifting device 12, the circuit board is transported to a lifting device, the lifting device will generate a blowing action when feeding, to assist the feeding; Step 3: jacking the lifting device 13, especially Lifting the center of the bottom of the lifting device, so that the lifting device can form a central high and a low end at the same time; at this time, the groove of the circuit board will be located at the highest point in the center of the lifting device; Step 4: The suction material 14 is subjected to vacuum suction through the lifting device, so that the bottom of the circuit board is closely adsorbed on the surface of the lifting device to avoid displacement; Step 5: lowering the lifting device 15 to lower the lifting device Return to a near horizontal or horizontal state; Step 6: Cut 16, let a cutter pass through the middle of the lifting device Passing through the gap and cutting the groove of the circuit board; Step 7: stopping the suction material 17, after the cutting is completed, the circuit board is divided into two, and the lifting device is released relative to the circuit board Vacuuming and sucking action; Step 8: discharging 18, finally, the two circuit boards are combined with the lifting device to generate a blowing action, and the discharging is carried out; Step 9: Finish 19. The foregoing step 5 and step 6 are performed according to actual needs, that is, the cutting 16 is performed first, and then the lifting device 15 is lowered.

Referring to the second figure, in the specific implementation of the present invention, the lifting device 2 includes two adjacent bodies 21, and each of the bodies 21 is provided with a plurality of air holes 22, and a pneumatic device is connected below the air holes 22 (not shown) The pneumatic device has the function of blowing or vacuuming; and a gap 23 is preset between the two bodies 21, and a cutter 4 is disposed below the gap 23, and the cutter 4 has a lifting and moving function. In the implementation of the present invention, a circuit board 3 is preset with a groove 31 at a position to be cut, so that the circuit board 3 is sent to the lifting device 2, and at the same time, the lifting device 2 generates an air blowing function to assist the feeding. After the circuit board 3 is sent to a suitable position above the lifting device 2 (as shown in the third figure), the lifting device 2 is lifted up, as in the fourth figure, in particular, the center bottom of the lifting device 2 is lifted, so that the lifting device 2 After the jacking, a central high and a low end can be formed; at this time, the groove 31 of the circuit board 3 will be located at the highest point in the center of the lifting device 2; then the air hole 22 of the lifting device 2 is passed through Carrying out the vacuum suctioning action, so that the bottom of the circuit board 3 is closely adsorbed on the surface of the lifting device 2 to avoid displacement, and then the lifting device 2 is lowered (as shown in the fifth figure), so that a cutter 4 passes the lifting A gap 23 is formed in the middle of the device 2, so that the groove 31 of the circuit board 3 can be cut (as shown in the sixth figure); then the suction is stopped, and after the cutting process is completed, the circuit board 3 is divided into one point. For example, at this time, the vacuum suction action of the lifting device 2 relative to the circuit board 3 is released, and the air blowing action is changed, and finally the circuit board 3 which has been cut in half is transported and discharged (as shown in the seventh figure).

In summary, the automatic alignment method for cutting the circuit board of the present invention is indeed utilized in the industry, has not been seen in the publication or publicly used before the application, and is not a technology known to the public. Furthermore, the present invention effectively solves the long-standing problems in the prior art and achieves long-term needs of related users and consumers, and it is corroborated that the present invention is not easily accomplished. The case is in full compliance with the requirements of "industry useability", "novelty" and "progressiveness" as stipulated in the Patent Law. The patents are submitted in accordance with the law, and the Bureau is invited to conduct a detailed investigation and to approve the patent as soon as possible to protect the wisdom of the applicant. Property rights, encourage innovation.

The present invention has been described by way of example only, and it is to be understood by those skilled in the art. The preferred embodiment of the present invention is only one of the ways in which the present invention can be implemented in a specific manner, but is not limited thereto, and should be defined in the scope of the appended patent application.

11‧‧‧Reserving trenches in circuit boards

12‧‧‧Feed to lifting device

13‧‧‧Uplift lifting device

14‧‧‧Suction

15‧‧‧ Lowering the lifting device

16‧‧‧cut

17‧‧‧ Stop sucking

18‧‧‧Export

19‧‧‧Completed

Claims (10)

An automatic alignment method for circuit board cutting comprises the following steps: Step 1: reserve a groove in a circuit board; Step 2: feed the circuit board to a lifting device; Step 3: jack up the lifting The device, in particular lifting the center of the bottom of the lifting device, enables the lifting device to form a central high and a low end when the lifting device is raised; step 4: sucking the material through the lifting device to perform vacuum suctioning action The bottom of the circuit board is closely adhered to the surface of the lifting device; step 5: lowering the lifting device; step 6: cutting, causing a cutter to cut the groove of the circuit board; step 7: stopping the suction, after completion After cutting, the vacuuming action of the lifting device relative to the circuit board is released; Step 8: discharging; Step 9: Finishing. The automatic alignment method for cutting a circuit board according to Item 1 of the patent application, wherein in the second step, the lifting device generates an air blowing action during feeding to assist the feeding. The automatic alignment method for cutting a circuit board according to claim 1, wherein in the third step, the groove of the circuit board is located at the highest point in the center of the lifting device. The automatic alignment method for cutting a circuit board according to claim 1, wherein in the step 5, the lifting device is lowered to a level close to a horizontal or horizontal state. The automatic alignment method for cutting a circuit board according to claim 1, wherein in the step (8), the two circuit boards are combined with the lifting device to generate an air blowing function to assist in conveying the discharging. An automatic alignment method for circuit board cutting comprises the following steps: Step 1: reserve a groove in a circuit board; Step 2: feed the circuit board to a lifting device; Step 3: jack up the lifting The device, in particular lifting the center of the bottom of the lifting device, enables the lifting device to form a central high and a low end when the lifting device is raised; step 4: sucking the material through the lifting device to perform vacuum suctioning action The bottom of the circuit board is closely adhered to the surface of the lifting device; step 5: cutting, causing a cutter to cut the groove of the circuit board; step 6: lowering the lifting device; step 7: stopping the suction, after completion After cutting, the vacuuming action of the lifting device relative to the circuit board is released; Step 8: discharging; Step 9: Finishing. The automatic alignment method for cutting a circuit board according to Item 6 of the patent application, wherein in the second step, the lifting device generates a blowing action during feeding to assist the feeding. The automatic alignment method for cutting a circuit board according to Item 6 of the patent application, wherein in the third step, the groove of the circuit board will be located at the highest point in the center of the lifting device. The automatic alignment method for cutting a circuit board according to Item 6 of the patent application, wherein in the step 6, the lifting device is lowered to a near horizontal or horizontal state. The method for automatically aligning a circuit board according to claim 6, wherein in the step (8), the two circuit boards are combined with the lifting device to generate an air blowing function to assist in conveying the discharging.