TWI569437B - Environmental sensitive electronic device package - Google Patents

Description

Environmentally sensitive electronic component package

The present disclosure relates to a package, and more particularly to an environmentally sensitive electronic component package.

With the advancement of technology, information products that are light, power-saving and high-definition display have become indispensable for modern people, whether it is a smart phone, a tablet PC or a TV ( Information products such as Television) require a display as a user interface, and the organic light-emitting display is widely used in consideration of lightness, thinness, high image quality, and low power consumption.

However, the organic light-emitting display has extremely high sensitivity to moisture. Once the water vapor contacts the internal organic light-emitting element, the interface between the oxidation and the organic compound at the cathode will be peeled off, which may cause a decline in display quality. The illuminating element is accelerated to age and the life of the display is reduced. On the other hand, organic light-emitting displays with large display sizes have gradually become the main trend in the development of current information products. When the number of organic light-emitting elements is larger or the area is larger, the problem of heat generation tends to be serious. In short, the ability of organic light-emitting displays to block water and oxygen And its heat dissipation has always been an urgent problem to be solved.

Embodiments of the present disclosure provide an environmentally sensitive electronic component package that can be used to improve the life expectancy of environmentally sensitive electronic components due to moisture or overheating.

The present disclosure provides an environmentally sensitive electronic component package including a first substrate, a second substrate, environmentally sensitive electronic components, at least one first sidewall barrier structure, at least one heat dissipation protrusion, and a first filling layer. The second substrate is disposed above the first substrate. The environmentally sensitive electronic component is disposed on the first substrate and located between the first substrate and the second substrate. The first sidewall barrier structure is disposed on the second substrate and located between the first substrate and the second substrate, wherein the first sidewall barrier structure is located on at least one side surrounding the environmentally sensitive electronic component. The heat dissipation protrusion is located on the second substrate. The first filling layer is located between the first substrate and the second substrate, and covers the environmentally sensitive electronic component, the first sidewall barrier structure, and the heat dissipation protrusion.

The present disclosure provides another environmentally sensitive electronic component package including a first substrate, a second substrate, environmentally sensitive electronic components, a first filling layer, a third substrate, at least one sidewall barrier structure, at least one heat dissipation protrusion, and The second filling layer. The second substrate is disposed above the first substrate. The environmentally sensitive electronic component is disposed on the first substrate and located between the first substrate and the second substrate. The first filling layer is located between the first substrate and the second substrate and encapsulates the environmentally sensitive electronic component. The third substrate is disposed under the first substrate, wherein the first substrate is located between the second substrate and the third substrate. The sidewall barrier structure is disposed on the third substrate and located on the first substrate and the third substrate The sidewall barrier structure is located on at least one side of the environmentally sensitive electronic component. The heat dissipation protrusion is located on the third substrate. The second filling layer is located between the first substrate and the third substrate, and covers the sidewall barrier structure and the heat dissipation protrusion.

The present disclosure further provides an environmentally sensitive electronic component package including a first substrate, a second substrate, environmentally sensitive electronic components, at least one first sidewall barrier structure, a first heat dissipation layer, a first heat dissipation structure, and a first Fill the layer. The second substrate is disposed above the first substrate. The environmentally sensitive electronic component is disposed on the first substrate and located between the first substrate and the second substrate. The first sidewall barrier structure is disposed on the second substrate and located between the first substrate and the second substrate, wherein the first sidewall barrier structure is located on at least one side of the environmentally sensitive electronic component. The first heat dissipation layer is disposed on the second substrate and located between the first substrate and the second substrate, wherein the first heat dissipation layer covers the second substrate and the first sidewall barrier structure. The first heat dissipation structure is disposed on the first substrate and located between the first substrate and the second substrate, wherein the first heat dissipation structure surrounds the first sidewall barrier structure. The first filling layer is located between the first substrate and the second substrate, and covers the first sidewall barrier structure and the environmentally sensitive electronic component, wherein the first heat dissipation structure is bonded to the first heat dissipation layer on the second substrate.

Based on the above, since the environmentally sensitive electronic component package of the present disclosure has a sidewall barrier structure surrounding the environmentally sensitive electronic component and is disposed between any two substrates, the environmentally sensitive electronic component package of the present disclosure has a good barrier against moisture and The ability of oxygen. In addition, the environmentally sensitive electronic component package of the present disclosure further has a heat dissipating protruding structure or a heat conductive material, wherein the heat dissipating protrusion is disposed on the substrate and faces The environment-sensitive electronic component extends, and the heat conductive material is distributed in the filling layer or constitutes a heat dissipation layer. Therefore, the environmentally sensitive electronic component package disclosed in the present invention has good heat dissipation capability at the same time, so as to effectively extend the life of the environmentally sensitive electronic component.

In order to make the disclosure more apparent, the following embodiments are described in detail with reference to the accompanying drawings.

10‧‧‧thermal materials

100A, 100B, 200A‧‧‧Environmentally sensitive electronic component package

300A, 300B, 300C, 400A‧‧‧ Environmentally sensitive electronic component packages

110, 210, 310, 410‧‧‧ first substrate

120, 220, 320, 420‧‧‧ second substrate

130, 230, 330, 430‧‧‧ Environmentally sensitive electronic components

140, 140a, 260, 440‧‧ ‧ heat dissipation

150‧‧‧First filling layer

240, 360, 450‧‧‧ first filling layer

250, 370, 460‧‧‧ third substrate

270, 380, 490‧‧‧ second filling layer

340‧‧‧First heat sink

342‧‧‧Second heat dissipation layer

350‧‧‧First heat dissipation structure

352‧‧‧Second heat dissipation structure

350a‧‧‧First heat conductive material

350b‧‧‧First thermal point

352a‧‧‧Second thermal material

352b‧‧‧second thermal point

470‧‧‧heat layer

480‧‧‧heat dissipation structure

480a‧‧‧heat material

480b‧‧‧thermal point

A~D‧‧‧Area

CASE, CASE1, CASE2‧‧‧ shell

DC‧‧‧ circuit wire

SWB, SWB4‧‧‧ first sidewall barrier structure

SWB1‧‧‧ sidewall barrier structure

SWB2‧‧‧First sidewall barrier structure

SWB3, SWB5‧‧‧ second sidewall barrier structure

1A is a cross-sectional view of an environmentally sensitive electronic component package in accordance with an embodiment of the present disclosure.

FIG. 1B is a bottom view of the environmentally sensitive electronic component package of FIG. 1A.

2A is an environmentally sensitive electronic component package of another embodiment of the present disclosure.

2B is a bottom view of the environmentally sensitive electronic component package of FIG. 2A.

3A is a schematic cross-sectional view of an environmentally sensitive electronic component package according to another embodiment of the present disclosure.

3B is a top view of the third substrate of the environmentally sensitive electronic component package of FIG. 3A.

4A is a schematic cross-sectional view of an environmentally sensitive electronic component package according to still another embodiment of the present disclosure.

4B is a bottom view of the environmentally sensitive electronic component package of FIG. 4A.

4C is a top view of the third substrate of the environmentally sensitive electronic component package of FIG. 4A.

4D is a top plan view of the third substrate of FIG. 4C joined to the housing.

4E is another top view of the third substrate of the environmentally sensitive electronic component package of FIG. 4A.

4F is a top plan view of the third substrate of FIG. 4E joined to the housing.

FIG. 5A is an environmentally sensitive electronic component package according to still another embodiment of the present disclosure.

5B is a top view of the third substrate of the environmentally sensitive electronic component package of FIG. 5A.

FIG. 6 is an environmentally sensitive electronic component package according to still another embodiment of the present disclosure.

7A is an environmentally sensitive electronic component package of a further embodiment of the present disclosure.

Figure 7B is a top view of the environmentally sensitive electronic component package of Figure 7A.

1A is a cross-sectional view of an environmentally sensitive electronic component package in accordance with an embodiment of the present disclosure. FIG. 1B is a bottom view of the environmentally sensitive electronic component package of FIG. 1A. Referring to FIG. 1A , in the embodiment, the environment-sensitive electronic component package 100A includes a first substrate 110 , a second substrate 120 , environmentally sensitive electronic components 130 , at least one first sidewall barrier structure SWB , and at least one heat dissipation protrusion 140 . And a first filling layer 150. The second substrate 120 is disposed above the first substrate 110. The environmentally sensitive electronic component 130 is disposed on the first substrate 110 and located between the first substrate 110 and the second substrate 120. The first sidewall barrier structure SWB is disposed on the second substrate 120 and located between the first substrate 110 and the second substrate 120 , wherein the first sidewall barrier structure SWB is located on at least one side of the environmentally sensitive electronic component 130 . The heat dissipation protrusion 140 is located at the second base On the board 120, and extending toward the first substrate 110. The first filling layer 150 is located between the first substrate 110 and the second substrate 120 and encapsulates the environmentally sensitive electronic component 130 , the sidewall barrier structure 140 , and the heat dissipation protrusion 140 .

In this embodiment, the first substrate 110 is, for example, a flexible substrate, wherein the material of the flexible substrate is polyethylene terephthalate (PET) or polyethylene isophthalate ( Polyethylene naphthalate (PEN), polyethersulfone (PES), polymethyl methacrylate (PMMA), polycarbonate (Polycarbonate, PC), poly-liminamide (PI) or metal foil (metal Foil). In addition, the environmentally sensitive electronic component package 100A may further include a functional film (not shown), wherein the functional film is disposed on the first substrate 110 and located between the first substrate 110 and the environmentally sensitive electronic component 130. In general, the functional film may be a touch panel, such as a surface capacitive touch panel, a digital matrix touch panel (such as a projected capacitive touch) or an analog matrix touch panel. . Of course, the functional film can also be a color filter or an electrophoretic display (EPD). In short, the environmentally sensitive electronic component package of the present disclosure may have a touch function.

On the other hand, in the present embodiment, the second substrate 120 is, for example, a metal substrate, and the second substrate 120 may be a flexible metal substrate having better heat conduction and heat dissipation characteristics. Of course, the second substrate 120 may also be the same or similar flexible substrate as the first substrate 110, wherein the flexible substrate may be made of polyethylene terephthalate. (polyethylene terephthalate, PET), polyethylene naphthalate (PEN), polyethersulfone (PES), polymethyl methacrylate (PMMA), polycarbonate (Polycarbonate) , PC), polyamine (PI), the disclosure is not limited herein.

In addition, the environmentally sensitive electronic component 130 is, for example, an active environmentally sensitive electronic display component or a passive environmentally sensitive electronic display component, wherein the active environmentally sensitive electronic display component is, for example, an active matrix organic light emitting diode (Active Matrix Organic Light Emitting Diode). , AM-OLED) or Active Matrix Electro Phoretic Display (AM-EPD), commonly known as electronic paper, or Active Matrix Liquid Crystal Display (AM-LCD), or active Active Matrix Blue Phase Liquid Crystal Display. The passive environmentally sensitive electronic display component is, for example, a passively driven organic light emitting device array substrate (Passive Matrix OLED, PM-OLED) or a Super Twisted Nematic Liquid Crystal Display (STN-LCD).

In addition, as shown in FIG. 1A , in the embodiment, the first sidewall barrier structure SWB is located on the second substrate 120 and extends toward the first substrate 110 , wherein the first sidewall barrier structure SWB is perpendicular to the first substrate 110 . The cross section is, for example, a trapezoid, of course, the cross section may also be rectangular, other different types of polygons, circles or ellipses. In general, the material of the first sidewall barrier structure SWB may include a metal material, and gold The genus material is, for example, a metal such as iron, aluminum, copper, magnesium, chromium, gold, silver, molybdenum or titanium or an alloy material thereof, and the first sidewall barrier structure SWB is, for example, etched by a yellow light lithography, an embossing or a precision lathe, etc. The process is formed on the second substrate 120. In this embodiment, the first sidewall barrier structure SWB and the second substrate 120 are made of the same material, for example, in other embodiments not shown, the first sidewall barrier structure SWB and the second substrate 120 are also It may be composed of different materials, and the disclosure is not limited herein.

On the other hand, as shown in FIG. 1B, in the present embodiment, the first sidewall barrier structure SWB is, for example, a continuous and closed annular structure surrounding the environmentally sensitive electronic component 130 for blocking moisture and oxygen from the outside. The first sidewall barrier structure SWB surrounds the heat dissipation protrusion 140. It should be noted that, as shown in FIG. 1A, the heat dissipation protrusion 140 of the present embodiment is formed of the same material as the second substrate 120, for example, the heat dissipation protrusion 140 is etched, embossed, sandblasted or precision lathe by yellow light micro-image. The process is formed on the second substrate 120 in an array, and the material of the second substrate 120 and the heat dissipation protrusion 140 is mainly a metal material, wherein the metal material is, for example, iron, aluminum, copper, magnesium, chromium, gold, silver. A metal such as molybdenum or titanium or an alloy thereof.

Further, in other embodiments not shown, the heat dissipation protrusions 140 and the second substrate 120 may also be made of different materials, wherein the material of the second substrate 120 is, for example, a metal material, and the metal material is, for example, iron. , aluminum, copper, magnesium, chromium, gold, silver, molybdenum, titanium and other metals or alloy materials thereof, the material of the heat dissipation protrusion 140 is mainly an inorganic material, wherein the inorganic material is, for example, a telluride, an aluminide, a diamond, or a class Diamonds, etc. The heat dissipation protrusions 140 may be formed on the second substrate 120 by chemical vapor deposition, sputtering, spraying, or the like and arranged in an array.

In detail, as shown in FIGS. 1A and 1B, in the present embodiment, the number of heat dissipation protrusions 140 is, for example, a plurality and arrays of an area A on the second substrate 120, wherein the area of the area A and the environmentally sensitive electronic components The dimensions of 130 are substantially the same. Of course, the area of the area A can be adjusted according to the design requirements of the product. In other words, the area of the area A can be equal to, larger or smaller than the size of the environmentally sensitive electronic component 130, and the distribution position of the heat dissipation protrusion 140 is at least equal to that of the environmentally sensitive electronic component 130. Partial overlap. Therefore, the thermal energy emitted by the environmentally sensitive electronic component 130 can be transferred to the heat dissipation protrusion 140 via the filling layer 150, and then further radiated to the second substrate 120 by the heat dissipation protrusion 140 to escape to the outside.

In short, the heat dissipation of the present disclosure can effectively improve the efficiency of heat conduction and heat dissipation. In addition, in this embodiment, the bottom area of the heat dissipation protrusion 140 is, for example, a circle. Of course, in other embodiments not shown, the bottom surface area of the heat dissipation protrusion 140 may also be a triangle, other different types of polygons or ovals. The disclosure is not limited herein.

In addition, the first filling layer 150 is formed, for example, by a solidification or thermal curing of a rubber material. The material of the rubber material is, for example, acrylic or epoxy. In the present embodiment, the type of the first filling layer 150 before uncured is, for example, a liquid type rubber material or a sheet type rubber material. Further, the first filling layer 150 may further include a heat conductive material 10, wherein the heat conductive material 10 For example, artificial diamonds, diamond-like diamonds, diamond like carbon, and nano-sized particles are distributed in the first filling layer 150, which can effectively improve the efficiency of heat conduction.

On the other hand, the environmentally sensitive electronic component package 100A of the present embodiment further includes a circuit lead DC, wherein the circuit lead DC is disposed on the first substrate 110 and located between the first substrate 110 and the second substrate 120. The circuit lead DC is electrically connected to the environmentally sensitive electronic component 130. The circuit lead DC can be used to receive an input signal and convert the input signal to generate an output signal, wherein the output signal is, for example, a display control signal. The circuit lead DC output displays a control signal to control the environmentally sensitive electronic component 130.

Another embodiment will be described below to illustrate the design of the environmentally sensitive electronic component package 100B, wherein the same or similar elements have the same or similar reference numerals, and the same or similar elements have the same or similar features, which are not described herein.

2A is an environmentally sensitive electronic component package of another embodiment of the present disclosure. 2B is a bottom view of the environmentally sensitive electronic component package of FIG. 2A. As shown in FIG. 2A and FIG. 2B, the environmentally sensitive electronic component package 100B of FIG. 2A is similar to the environmentally sensitive electronic component package 100A of FIG. 1A, except that the heat dissipation of the environmentally sensitive electronic component package 100B of FIG. 2A is achieved. The bottom area of the protrusion 140a is, for example, a square shape. Of course, in other embodiments not shown, the bottom surface area of the heat dissipation protrusion 140a may also be a triangle, other different types of polygons or ovals, and the disclosure is not limited herein.

In detail, the number of heat dissipation protrusions 140a is, for example, a plurality and arrayed on a region B on the second substrate 120, wherein the area of the region B is substantially the same as the size of the environmentally sensitive electronic component 130. Of course, the area of the area B can be adjusted according to the design requirements of the product. In other words, the area of the area B can be equal to, larger or smaller than the size of the environmentally sensitive electronic component 130, and the distribution position of the heat dissipation protrusion 140a and the environment sensitive electronic component 130 are at least partially. overlapping. Therefore, the thermal energy emitted by the environmentally sensitive electronic component 130 can be transmitted to the heat dissipation protrusion 140a via the first filling layer 150, and then further transmitted to the second substrate 120 by the heat dissipation protrusion 140a to be dissipated to the outside. In short, the heat dissipation protrusion 140a of the present disclosure can effectively improve the efficiency of heat conduction and heat dissipation.

3A is a schematic cross-sectional view of an environmentally sensitive electronic component package according to another embodiment of the present disclosure. 3B is a top view of the third substrate of the environmentally sensitive electronic component package of FIG. 3A. Referring to FIG. 3A , the environmentally sensitive electronic component package 200A includes a first substrate 210 , a second substrate 220 , environmentally sensitive electronic components 230 , a first filling layer 240 , a third substrate 250 , and at least one sidewall barrier structure SWB1 . The heat dissipation protrusion 260 and the second filling layer 270. The second substrate 220 is disposed above the first substrate 210. The environmentally sensitive electronic component 230 is disposed on the first substrate 210 and located between the first substrate 210 and the second substrate 220. The first filling layer 240 is located between the first substrate 210 and the second substrate 220 and encapsulates the environmentally sensitive electronic component 230. The third substrate 250 is disposed under the first substrate 210 , wherein the first substrate 210 is located between the second substrate 220 and the third substrate 250 . The sidewall barrier structure SWB1 is disposed in the third The substrate 250 is located between the first substrate 210 and the third substrate 250, wherein the sidewall barrier structure SWB1 is located on at least one side of the environmentally sensitive electronic component 230. The heat dissipation protrusion 260 is located on the third substrate 250 and extends toward the first substrate 210. The second filling layer 270 is located between the first substrate 210 and the third substrate 250 and covers the sidewall barrier structure SWB1 and the heat dissipation protrusion 260.

In this embodiment, the first substrate 210 and the second substrate 220 are, for example, flexible substrates, and the material of the flexible substrate may be polyethylene terephthalate (PET) or poly(diphenylene). Polyethylene naphthalate (PEN), polyether sulfone (PES), polymethyl methacrylate (PMMA), polycarbonate (PC), polytheneamine (PI) Or metal foil. In addition, the environmentally sensitive electronic component package 200A may further include a functional film (not shown), wherein the functional film is disposed on the second substrate 220 and located between the first substrate 210 and the second substrate 220. In general, the functional film may be a touch panel, such as a surface capacitive touch panel, a digital matrix touch panel (such as a projected capacitive touch) or an analog matrix touch panel. . Of course, the functional film can also be a color filter or an electrophoretic display (EPD). In short, the environmentally sensitive electronic component package of the present disclosure may have a touch function.

In addition, the environmentally sensitive electronic component 230 is, for example, an active environmentally sensitive electronic display component or a passive environmentally sensitive electronic display component, wherein the active environmental sensitive component The electronic display device is, for example, an Active Matrix Organic Light Emitting Diode (AM-OLED) or an Active Matrix Electro Phoretic Display (AM-EPD), commonly known as electronic paper. Either an Active Matrix Liquid Crystal Display (AM-LCD) or an Active Matrix Blue Phase Liquid Crystal Display. The passive environmentally sensitive electronic display component is, for example, a passively driven organic light emitting device array substrate (Passive Matrix OLED, PM-OLED) or a Super Twisted Nematic Liquid Crystal Display (STN-LCD).

On the other hand, the first filling layer 240 is formed, for example, by a solidification or thermal curing of a rubber material. The material of the rubber material is, for example, acrylic or epoxy. In the present embodiment, the type before the first filling layer 240 is uncured is, for example, a liquid type rubber material or a sheet type rubber material. Further, the first filling layer 240 may further include a heat conductive material 10, wherein the heat conductive material 10 is, for example, an artificial diamond, a diamond-like diamond, a diamond like carbon, and distributed in a first filling layer 240 as a nano-sized particle. It can effectively improve the efficiency of heat transfer.

Following the above, the third substrate 250 is, for example, a metal substrate, and the third substrate 250 may be a flexible metal substrate having better heat conduction and heat dissipation characteristics. Of course, the third substrate 250 may also be the same or similar flexible substrate as the first substrate 210, wherein the flexible substrate may be made of polyethylene terephthalate (polyethylene). Terephthalate, PET), polyethylene naphthalate (PEN), polyethersulfone (PES), polymethyl methacrylate (PMMA), polycarbonate (Polycarbonate, PC) Polyimide (PI), the disclosure is not limited herein.

In addition, as shown in FIG. 3A , in the embodiment, the sidewall barrier structure SWB1 is located on the third substrate 250 and extends toward the first substrate 210 , wherein a cross section of the sidewall barrier structure SWB1 perpendicular to the first substrate 210 is, for example, a trapezoid. Of course, the cross section can also be rectangular, other different types of polygonal, circular or elliptical. In general, the material of the sidewall barrier structure SWB1 may include a metal material, and the metal material is, for example, a metal such as iron, aluminum, copper, magnesium, chromium, gold, silver, molybdenum, titanium, or an alloy thereof, and the sidewall barrier structure The SWB1 is formed on the third substrate 250 by, for example, a process such as yellow photolithography etching, imprinting, or a precision lathe. It is to be noted that the sidewall barrier structure SWB1 and the third substrate 250 may be made of the same material or different materials, and the disclosure is not limited herein.

On the other hand, as shown in FIG. 3B, in the present embodiment, the sidewall barrier structure SWB1 is, for example, a continuous and closed annular structure surrounding the environmentally sensitive electronic component 230 for blocking moisture and oxygen from the outside, wherein The sidewall barrier structure SWB1 surrounds the heat dissipation protrusion 260. Generally, the heat dissipating protrusions 260 are formed on the third substrate 250 by a process such as lithography, imprinting, sand blasting, or precision lathe, and are arranged in an array. The material of the heat dissipating protrusions 260 may mainly include metal materials or other materials. High thermal conductivity material, such as iron, aluminum, copper, magnesium, chromium, gold, A metal such as silver, molybdenum or titanium or an alloy thereof may be a combination of a multilayer metal such as molybdenum/aluminum/molybdenum or titanium/aluminum/titanium, or an inorganic material or an organic and inorganic mixed material such as telluride or aluminum. Compounds, diamonds, diamonds, etc. The heat dissipation protrusion 260 and the third substrate 250 may be made of the same material or different materials.

In detail, as shown in FIGS. 3A and 3B, in the present embodiment, the number of heat dissipation protrusions 260 is, for example, a plurality and arrayed on a region C on the third substrate 250, wherein the area of the region C is environmentally sensitive. The dimensions of element 230 are substantially the same. Of course, the area of the area C may be adjusted according to the design requirements of the product. In other words, the area of the area C may be equal to, larger than, or smaller than the size of the environmentally sensitive electronic component 230, and the distribution position of the heat dissipation protrusion 260 and the environmentally sensitive electronic component 230 are at least Partial overlap. Therefore, the thermal energy emitted by the environmentally sensitive electronic component 230 can be transferred to the heat dissipation protrusion 260 via the second filling layer 270, and then further radiated to the third substrate 250 by the heat dissipation protrusion 260 to be dissipated to the outside.

In short, the heat dissipation of the present disclosure can effectively improve the efficiency of heat conduction and heat dissipation. In addition, in the embodiment, the bottom surface area of the heat dissipation protrusion 260 is, for example, a circle. Of course, in other embodiments not shown, the bottom surface area of the heat dissipation protrusion 260 may also be a triangle, a square, a rectangle, or other different types. Polygon or ellipse, the disclosure is not limited herein.

In addition, the second filling layer 270 is formed, for example, by a solidification or thermal curing of the rubber material. The material of the rubber material is, for example, acrylic or epoxy. In this embodiment, the type of the second filling layer 270 before being cured is, for example, It is a liquid type glue or a sheet type glue. Further, the second filling layer 270 may further include a heat conductive material 10, wherein the heat conductive material 10 is, for example, an artificial diamond, a diamond-like diamond, diamond like carbon, and distributed in a second filling layer 270 with nano-sized particles. In the middle, it can effectively improve the efficiency of conduction and heat dissipation.

On the other hand, the environmentally sensitive electronic component package 200A of the present embodiment further includes a circuit lead DC, wherein the circuit lead DC is disposed on the first substrate 210 and located between the first substrate 210 and the second substrate 220. The circuit lead DC is electrically connected to the environmentally sensitive electronic component 230. The circuit lead DC can be used to receive an input signal and convert the input signal to generate an output signal, wherein the output signal is, for example, a display control signal. The circuit lead DC output displays a control signal to control the environmentally sensitive electronic component 230.

4A is a schematic cross-sectional view of an environmentally sensitive electronic component package according to still another embodiment of the present disclosure. 4B is a bottom view of the environmentally sensitive electronic component package of FIG. 4A. 4C is a top view of the third substrate of the environmentally sensitive electronic component package of FIG. 4A. 4D is a top plan view of the third substrate of FIG. 4C joined to the housing. 4E is another top view of the third substrate of the environmentally sensitive electronic component package of FIG. 4A. 4F is a top plan view of the third substrate of FIG. 4E joined to the housing. Referring to FIG. 4A , the environmentally sensitive electronic component package 300A includes a first substrate 310 , a second substrate 320 , environmentally sensitive electronic components 330 , at least one first sidewall barrier structure SWB2 , a first heat dissipation layer 340 , and a first heat dissipation structure 350 . And a first filling layer 360. Second substrate 320 The first substrate 310 is disposed above the first substrate 310. The environmentally sensitive electronic component 330 is disposed on the first substrate 310 and located between the first substrate 310 and the second substrate 320. The first sidewall barrier structure SWB2 is disposed on the second substrate 320 and located between the first substrate 310 and the second substrate 320 , wherein the first sidewall barrier structure SWB2 is located on at least one side of the environmentally sensitive electronic component 330 . The first heat dissipation layer 340 is disposed on the second substrate 320 and located between the first substrate 310 and the second substrate 320 , wherein the first heat dissipation layer 340 covers the second substrate 320 and the first sidewall barrier structure SWB2 . The first heat dissipation structure 350 is disposed on the first substrate 310 and located between the first substrate 310 and the second substrate 320 , wherein the first heat dissipation structure 350 surrounds the first sidewall barrier structure SWB2 . The first filling layer 360 is disposed between the first substrate 310 and the second substrate 320 and covers the first sidewall barrier structure SWB2 and the environmentally sensitive electronic component 330. The first heat dissipation structure 350 is the same as the second substrate 320. A heat dissipation layer 340 is directly joined.

In addition, the first heat dissipation structure 350 is further coupled to the housing CASE of the environmentally sensitive electronic component package 300A. In other words, the thermal energy generated by the environmentally sensitive electronic component 330 can be conducted to the first heat dissipation structure 350 via the first heat dissipation layer 340, and then, Conducted to the housing CASE of the environmentally sensitive electronic component package 300A via the first heat dissipation structure 350, and finally the thermal energy can be outwardly led out by the housing CASE.

In this embodiment, the first substrate 310 and the second substrate 320 are, for example, flexible substrates, and the material of the flexible substrate may be polyethylene terephthalate (PET) or poly(diphenylene). Polyethylene naphthalate (PEN), polyethersulfone (Polyethersulfone, PES), polymethyl methacrylate (PMMA), polycarbonate (Polycarbonate, PC), poly-liminamide (PI) or metal foil. In addition, the environmentally sensitive electronic component package 300A may further include a functional film (not shown), wherein the functional film is disposed on the second substrate 320 and located between the first substrate 310 and the second substrate 320. In general, the functional film may be a touch panel, such as a surface capacitive touch panel, a digital matrix touch panel (such as a projected capacitive touch) or an analog matrix touch panel. . Of course, the functional film can also be a color filter or an electrophoretic display (EPD). In short, the environmentally sensitive electronic component package of the present disclosure may have a touch function.

In addition, the environmentally sensitive electronic component 330 is, for example, an active environmentally sensitive electronic display component or a passive environmentally sensitive electronic display component, wherein the active environmentally sensitive electronic display component is, for example, an active matrix organic light emitting diode (Active Matrix Organic Light Emitting Diode). , AM-OLED) or Active Matrix Electro Phoretic Display (AM-EPD), commonly known as electronic paper, or Active Matrix Liquid Crystal Display (AM-LCD), or active Active Matrix Blue Phase Liquid Crystal Display. The passive environmentally sensitive electronic display component is, for example, a passively driven organic light emitting device array substrate (Passive Matrix OLED, PM-OLED) or a Super Twisted Nematic Liquid Crystal Display (STN-LCD).

As shown in FIG. 4A, in the present embodiment, the first sidewall barrier structure SWB2 is located on the second substrate 320 and extends toward the first substrate 310, wherein the first sidewall barrier structure SWB2 is perpendicular to the cross section of the first substrate 310, for example. It is trapezoidal. Of course, this section can also be rectangular, other different types of polygonal, circular or elliptical. In general, the material of the first sidewall barrier structure SWB2 may include a metal material, and the metal material is, for example, a metal such as iron, aluminum, copper, magnesium, chromium, gold, silver, molybdenum, titanium, or an alloy thereof, and the first The sidewall barrier structure SWB2 is formed on the second substrate 320 by, for example, a yellow photolithography etching, an imprinting, or a precision lathe. It is to be noted that the first sidewall barrier structure SWB2 and the second substrate 320 may be made of the same material or different materials, and the disclosure is not limited herein.

On the other hand, referring to FIG. 4B, in order to clearly show the main features of the first sidewall barrier structure SWB2, the first heat dissipation layer 340 covering the second substrate 320 and the first sidewall barrier structure SWB2 is not illustrated. The first sidewall barrier structure SWB2 of the present embodiment is, for example, a continuous and closed annular structure surrounding the environmentally sensitive electronic component 330 for blocking moisture and oxygen from the outside. In detail, in the embodiment, the first heat dissipation layer 340 covering the first sidewall barrier structure SWB2 is mainly composed of a heat conductive material 10, wherein the heat conductive material 10 is, for example, an artificial diamond, a diamond-like diamond, a diamond-like carbon (diamond). The first heat dissipation layer 340 is formed on the first sidewall barrier structure SWB2 by a process such as chemical vapor deposition or spray coating, for example. The first heat dissipation layer 340 may also include an anti-electromagnetic interference material. Generally, the anti-electromagnetic interference material is, for example, gold, silver, copper, carbon or lead. Attenuate the effects of electromagnetics.

In addition, the first heat dissipation layer 340 covering the first sidewall barrier structure SWB2 may also be composed of a metal material or a highly thermally conductive material, for example, a single layer of metal such as aluminum, molybdenum, titanium, or the like. Or a combination of multilayer metal stacks such as molybdenum/aluminum/molybdenum or titanium/aluminum/titanium. Generally, the first heat dissipation layer 340 is formed on the first sidewall barrier structure SWB2 by a process such as a chemical vapor deposition method, a thin film evaporation method, or a thin film sputtering method, for example, the foregoing metal material or high thermal conductive material.

As shown in FIG. 4C to FIG. 4F , the first heat dissipation structure 350 may be a continuous annular structure or a discontinuous annular structure, and has a design that avoids the circuit wire DC, wherein the first heat dissipation structure 350 is the first heat dissipation layer 340 . Direct bonding. In addition, the first heat dissipation structure 350 is further coupled to the housing CASE of the environmentally sensitive electronic component package 300A. In other words, the thermal energy generated by the environmentally sensitive electronic component 330 can be conducted to the first heat dissipation structure 350 via the first heat dissipation layer 340, and then, Conducted to the housing CASE of the environmentally sensitive electronic component package 300A via the first heat dissipation structure 350, and finally the thermal energy can be outwardly led out by the housing CASE.

In further detail, as shown in FIG. 4A, the first heat dissipation structure 350 may include a first heat conduction material 350a and a first heat conduction point 350b, wherein the material of the first heat conduction material 350a may mainly include a metal material or other high heat conductive material, for example Metal thermal conductive adhesive, thermal tape, etc. In addition, the material of the first thermal conduction point 350b may mainly include a metal material such as a single layer metal such as aluminum, molybdenum, titanium, or the like, or a combination of a plurality of metal stacks such as molybdenum/aluminum/molybdenum or titanium/aluminum/titanium. The first heat dissipation structure 350 is, for example, transparent A process such as a vapor deposition method, a thin film evaporation method, or a thin film sputtering method is formed on the first substrate 310. More specifically, the first thermal conduction point 350b can be fabricated simultaneously using an active component such as a metal wire process in a thin film transistor (TFT) process, and the first thermal conductive material 350a and the first thermal conduction point 350b can be the same material or not. The same material is constructed, and the disclosure is not limited herein.

In the present embodiment, the first filling layer 360 is formed, for example, by a solidification or thermal curing of the glue. The material of the rubber material is, for example, acrylic or epoxy, and the type before the first filling layer 360 is uncured is, for example, a liquid type adhesive or a sheet type. ) glue. Further, the first filling layer 360 may further include a heat conductive material 10, wherein the heat conductive material 10 is, for example, an artificial diamond, a diamond-like diamond, a diamond like carbon, and distributed in a first filling layer 360 as a nano-sized particle. It can effectively improve the efficiency of heat transfer.

In addition, as shown in FIG. 4A, in the embodiment, the first substrate 310 and the second substrate 320 are disposed in the casing CASE, and the second substrate 320 is disposed on the casing CASE. In general, the material of the casing CASE may mainly include a metal material or other high thermal conductive material, wherein the casing CASE is in contact with the heat dissipation structure 350, in other words, the thermal energy emitted by the environmentally sensitive electronic component 330 may be conducted to the first through the first filling layer 360. A heat dissipation layer 340, wherein the first heat dissipation layer 340 is connected to the first heat dissipation structure 350. Thus, thermal energy can be further conducted from the first heat dissipation structure 350 to the housing CASE to direct thermal energy out of the environmentally sensitive electronic component 330 to reduce the effect of thermal energy on the life of the environmentally sensitive electronic component 330.

In the present embodiment, the environmentally sensitive electronic component package 300A is, for example, a top emission or a bottom emission design. Of course, in other embodiments not shown, the housing CASE of the environmentally sensitive electronic component package 300A can be further designed with a double-sided light exit port, whereby light can be simultaneously output from the top surface and the bottom surface to achieve double-sided illumination. (dual emission) effect.

Other embodiments are described below to illustrate the design of environmentally sensitive electronic component packages 300B and 300C, wherein the same or similar elements have the same or similar reference numerals, and the same or similar elements have the same or similar features, and are not described herein.

FIG. 5A is an environmentally sensitive electronic component package according to still another embodiment of the present disclosure. 5B is a top view of the third substrate of the environmentally sensitive electronic component package of FIG. 5A. As shown in FIG. 5A, the environmentally sensitive electronic component package 300B of FIG. 5A is similar to the environmentally sensitive electronic component package 300A of FIG. 4A, except that the environmentally sensitive electronic component package 300B of FIG. 5A does not have a housing CASE. The environmentally sensitive electronic component package 300B further includes a third substrate 370, a second sidewall barrier structure SWB3, and a second filling layer 380. The third substrate 370 is disposed under the first substrate 310 , wherein the first substrate 310 is located on the second substrate 320 and the third substrate 370 . between. The second sidewall barrier structure SWB3 is disposed on the third substrate 370 and located between the first substrate 310 and the third substrate 370. The second filling layer 380 is disposed between the first substrate 310 and the third substrate 320 , wherein the second filling layer 380 covers the second sidewall blocking structure SWB3 , and the third substrate 370 passes through the second filling layer 380 and the first substrate 310 . fit.

In this embodiment, the third substrate 370 is, for example, a metal substrate, and the third substrate 370 can be a flexible metal substrate having better heat conduction and heat dissipation characteristics. The third substrate 370 may also be the same or similar flexible substrate as the first substrate 310. The material of the flexible substrate may be polyethylene terephthalate (PET) or poly-m-benzene. Polyethylene naphthalate (PEN), polyethersulfone (PES), polymethyl methacrylate (PMMA), polycarbonate (PC), polyamidamine (PI) The disclosure is not limited herein.

In addition, the second sidewall barrier structure SWB3 is located on the third substrate 370 and extends toward the first substrate 310. The cross section of the second sidewall barrier structure SWB3 perpendicular to the first substrate 310 is, for example, a trapezoid. Rectangular, other different types of polygonal, circular or elliptical. In general, the material of the second sidewall barrier structure SWB3 may include a metal material, for example, a metal such as iron, aluminum, copper, magnesium, chromium, gold, silver, molybdenum, titanium, or an alloy thereof, and a second material. The sidewall barrier structure SWB3 is formed on the third substrate 370 by, for example, a yellow photolithography etching, an imprinting, or a precision lathe. The second sidewall barrier structure SWB3 and the third substrate 370 may be made of the same material or different materials, and the disclosure is not limited herein.

The second filling layer 380 is formed, for example, by a solidification or thermal curing of the rubber. The material of the rubber material is, for example, acrylic or epoxy. In this embodiment, the type before the second filling layer 380 is uncured is, for example, a liquid type. (liquid type) glue or sheet type glue. Further, the second filling layer 380 may further include a heat conductive material 10, wherein the heat conductive material 10 is, for example, an artificial diamond, a diamond-like diamond, diamond like carbon, and distributed in a second filling layer 380 as nano-sized particles. It can effectively improve the efficiency of heat transfer. In addition, the heat emitted by the environmentally sensitive electronic component 330 can be conducted to the second filling layer via the first substrate 310, and further transferred from the second filling layer to the second sidewall blocking structure SWB3 and the third substrate 370 to escape to the outside. Thermal energy can also be conducted through the first heat dissipation layer 340 to the heat dissipation structure 350.

As shown in FIG. 5B, in the present embodiment, the second sidewall barrier structure SWB3 is, for example, a continuous and closed annular structure for blocking moisture and oxygen from the outside.

FIG. 6 is an environmentally sensitive electronic component package according to still another embodiment of the present disclosure. As shown in FIG. 6, the environmentally sensitive electronic component package 300C of FIG. 6 is similar to the environmentally sensitive electronic component package 300B of FIG. 5A, except that the environmentally sensitive electronic component package 300C of FIG. 6 further includes a second heat dissipation. Layer 342, second heat dissipation structure 352, and housing CASE1. The second heat dissipation layer 342 is disposed on the third substrate 370 and located between the first substrate 310 and the third substrate 370 , wherein the second heat dissipation layer 342 covers the third substrate 370 and the second sidewall barrier structure SWB3 . The second heat dissipation structure 352 is disposed on the first substrate 310 and located between the first substrate 310 and the third substrate 370 , wherein the second heat dissipation structure 352 surrounds the second sidewall barrier structure SWB3 , and the second heat dissipation structure 352 and the first The second heat dissipation layer 342 on the substrate 310 is bonded. The first substrate 310, the second substrate 320, and the third substrate 370 are mounted in the casing CASE1.

In detail, in the embodiment, the second heat dissipation layer 342 covering the second sidewall barrier structure SWB3 is mainly composed of a heat conductive material 10, wherein the heat conductive material 10 is, for example, an artificial diamond, a diamond-like diamond, a diamond-like carbon (diamond). The second heat dissipation layer 342 is formed on the second sidewall barrier structure SWB3 by a process such as a chemical vapor deposition method or a spray coating method. The second heat dissipation layer 342 may also include an anti-electromagnetic interference material. Generally, the anti-electromagnetic interference material such as gold, silver, copper, carbon or lead may be used to attenuate the electromagnetic effect.

In addition, the second heat dissipation layer 342 covering the second sidewall barrier structure SWB3 may also be composed of a metal material or a highly thermally conductive material, such as a single layer of metal such as aluminum, molybdenum, titanium, or the like. Or a combination of multilayer metal stacks such as molybdenum/aluminum/molybdenum or titanium/aluminum/titanium. In general, the second heat dissipation layer 342 is formed on the second sidewall barrier structure SWB3 by a process such as chemical vapor deposition, thin film evaporation, or thin film sputtering, for example, the foregoing metal material or high thermal conductive material.

On the other hand, the second heat dissipation structure 352 is, for example, a continuous ring structure or a discontinuous ring structure, and has a design that avoids the circuit wire DC, wherein the second heat dissipation structure 352 is directly engaged with the second heat dissipation layer 342, in other words, The second heat dissipation structure 352 is substantially the same as or similar to the structure illustrated in FIGS. 4A-4E. In addition, the second heat dissipation structure 352 is further coupled to the housing CASE1 of the environmentally sensitive electronic component package 300C. Therefore, the thermal energy generated by the environmentally sensitive electronic component 330 can be conducted to the first heat dissipation structure 350 via the first heat dissipation layer 340. Conducted to the housing CASE1 of the environmentally sensitive electronic component package 300C via the heat dissipation structure, and finally the thermal energy can be The housing CASE1 is led out.

In further detail, as shown in FIG. 6, the second heat dissipation structure 352 includes a second heat conduction material 352a and a second heat conduction point 352b, wherein the material of the second heat conduction material 352a may mainly include a metal material or other high heat conductive material such as metal. Thermal adhesive, thermal tape, etc. In addition, the material of the second heat conduction point 352b may mainly include a metal material, for example, a single layer metal such as aluminum, molybdenum, titanium, or the like, or a combination of a plurality of metal layers such as molybdenum/aluminum/molybdenum or titanium/aluminum/titanium. The second heat dissipation structure 352 is formed on the first substrate 310 by a process such as chemical vapor deposition, thin film evaporation, or thin film sputtering. In more detail, the second thermal conductive spot 352b can be fabricated simultaneously using a metal wire process in a thin film transistor (TFT) process, and the second thermal conductive material 352a and the second thermal conductive spot 352b can be the same material or not. The same material is constructed, and the disclosure is not limited herein.

In this embodiment, the first substrate 310, the second substrate 320, and the third substrate 370 are surrounded by the casing CASE, for example, wherein the first substrate 310 further abuts the inner surface of the casing CASE1, and the casing CASE1 and the A heat dissipation structure 350 and a second heat dissipation structure 352 are in contact. In other words, the thermal energy emitted by the environmentally sensitive electronic component 330 can be conducted to the first heat dissipation layer 340 via the first filling layer 360 , wherein the first heat dissipation layer 340 is coupled to the first heat dissipation structure 350 . Thus, thermal energy can be further conducted from the first heat dissipation structure 350 to the housing CASE1 to direct thermal energy out of the environmentally sensitive electronic component 330 to reduce the effect of thermal energy on the life of the environmentally sensitive electronic component 330.

In addition, the thermal energy emitted by the environmentally sensitive electronic component 330 can also pass through the first The substrate 310 is conducted to the second filling layer 380 and further conducted from the second filling layer 380 to the second heat dissipation layer 342 , wherein the second heat dissipation layer 342 is connected to the second heat dissipation structure 352 . Therefore, thermal energy can be further conducted from the second heat dissipation structure 352 to the housing CASE1 to derive thermal energy. Of course, the second heat dissipation structure 352 can be directly conducted to the second heat dissipation structure 352 via the first substrate 310, wherein the second heat dissipation structure 352 abuts the housing CASE1, and thus, thermal energy can be conducted from the second heat dissipation structure 352 to the housing. CASE1 derives thermal energy. Of course, the thermal energy emitted by the environmentally sensitive electronic component 330 can be conducted to the first substrate 310 and conducted from the first substrate 310 to the casing CASE1 to conduct thermal energy.

In the present embodiment, the environmentally sensitive electronic component package 300C is, for example, a design of dual emission. That is to say, the casing CASE1 of the environmentally sensitive electronic component package 300C is further designed with upper and lower exit ports, whereby light can be simultaneously output from the top surface and the bottom surface, thereby achieving the effect of dual emission.

7A is an environmentally sensitive electronic component package of a further embodiment of the present disclosure. Figure 7B is a top view of the environmentally sensitive electronic component package of Figure 7A. Referring to FIG. 7A , the environmentally sensitive electronic component package 400A includes a first substrate 410 , a second substrate 420 , environmentally sensitive electronic components 430 , at least one first sidewall barrier structure SWB4 , at least one heat dissipation protrusion 440 , and a first filling layer 450 . The third substrate 460, the at least one second sidewall barrier structure SWB5, the heat dissipation layer 470, the heat dissipation structure 480, and the second filling layer 490. The second substrate 420 is disposed above the first substrate 410. Environmentally sensitive The electronic component 430 is disposed on the first substrate 410 and located between the first substrate 410 and the second substrate 420. The first sidewall barrier structure SWB4 is disposed on the second substrate 420 and located between the first substrate 410 and the second substrate 420 , wherein the first sidewall barrier structure SWB4 is located on at least one side of the environmentally sensitive electronic component 430 . The heat dissipation protrusion 440 is located on the second substrate 420 and extends toward the first substrate 410. The first filling layer 450 is disposed between the first substrate 410 and the second substrate 420. The first substrate 410 is bonded to the second substrate 420 through the first filling layer 450. The first filling layer 450 is coated with the environmentally sensitive electronic component 430. The heat dissipation protrusion 440 and the first sidewall barrier structure SWB4. The third substrate 460 is disposed under the first substrate 410 , wherein the first substrate 410 is located between the second substrate 420 and the third substrate 460 . The second sidewall barrier structure SWB5 is disposed on the third substrate 460 and located between the first substrate 410 and the third substrate 460. The heat dissipation layer 470 is disposed on the third substrate 460 and located between the first substrate 410 and the third substrate 460 , wherein the heat dissipation layer 470 covers the third substrate 460 and the second sidewall barrier structure SWB5 . The heat dissipation structure 480 is disposed on the first substrate 410 and located between the first substrate 410 and the third substrate 460, wherein the heat dissipation structure 480 surrounds the second sidewall barrier structure SWB5, and the heat dissipation structure 480 and the heat dissipation on the third substrate 460 Layer 470 is joined. The second filling layer 490 is disposed between the first substrate 410 and the third substrate 460. The first substrate 410 is bonded to the third substrate 460 through the second filling layer 490, wherein the second filling layer 490 covers the second sidewall blocking structure. SWB5.

In the present embodiment, the first substrate 410 is, for example, a flexible glass film, and has the flexibility of the flexible substrate and the characteristics of the rigid substrate. of course, The first substrate 410 may also be a flexible substrate of other different types, wherein the material of the flexible substrate may be polyethylene terephthalate (PET) or polyethylene isophthalate ( Polyethylene naphthalate (PEN), polyethersulfone (PES), polymethyl methacrylate (PMMA), polycarbonate (Polycarbonate, PC), poly-liminamide (PI) or metal foil (metal Foil). In addition, the environmentally sensitive electronic component package 400A may further include a functional film (not shown), wherein the functional film is disposed on the first substrate 410 and located between the first substrate 410 and the environmentally sensitive electronic component 430. In general, the functional film may be a touch panel, such as a surface capacitive touch panel, a digital matrix touch panel (such as a projected capacitive touch) or an analog matrix touch panel. . Of course, the functional film can also be a color filter or an electrophoretic display (EPD). In short, the environmentally sensitive electronic component package of the present disclosure may have a touch function.

On the other hand, in the embodiment, the second substrate 420 is, for example, a metal substrate, and the second substrate 420 may be a flexible metal substrate having better heat conduction and heat dissipation characteristics. Certainly, the second substrate 420 may also be the same or similar flexible substrate as the first substrate 410. The material of the flexible substrate may be polyethylene terephthalate (PET) or poly-m-benzene. Polyethylene naphthalate (PEN), polyethersulfone (PES), polymethyl methacrylate (PMMA), polycarbonate (PC), polyamidamine (PI) ), this disclosure does not add here To limit.

In addition, the environmentally sensitive electronic component 430 is, for example, an active environmentally sensitive electronic display component or a passive environmentally sensitive electronic display component, wherein the active environmentally sensitive electronic display component is, for example, an active matrix organic light emitting diode (Active Matrix Organic Light Emitting Diode). , AM-OLED) or Active Matrix Electro Phoretic Display (AM-EPD), commonly known as electronic paper, or Active Matrix Liquid Crystal Display (AM-LCD), or active Active Matrix Blue Phase Liquid Crystal Display. The passive environmentally sensitive electronic display component is, for example, a passively driven organic light emitting device array substrate (Passive Matrix OLED, PM-OLED) or a Super Twisted Nematic Liquid Crystal Display (STN-LCD).

In addition, as shown in FIG. 7A , in the embodiment, the first sidewall barrier structure SWB4 is located on the second substrate 420 and extends toward the first substrate 410 , wherein the first sidewall barrier structure SWB4 is perpendicular to the first substrate 410 . The cross section is, for example, a trapezoid, of course, the cross section may also be rectangular, other different types of polygons, circles or ellipses. In general, the material of the first sidewall barrier structure SWB4 may include a metal material, and the metal material is, for example, a metal such as iron, aluminum, copper, magnesium, chromium, gold, silver, molybdenum, titanium, or an alloy thereof, and the first The sidewall barrier structure SWB4 is formed on the second substrate 420 by, for example, a yellow photolithography etching, an imprinting, or a precision lathe. In this embodiment, the first sidewall barrier structure SWB4 and the second substrate 420 are, for example, the same material. In other embodiments, the first sidewall barrier structure SWB4 and the second substrate 420 may be made of different materials, and the present disclosure is not limited thereto.

On the other hand, as shown in FIG. 7B, in the present embodiment, the first sidewall barrier structure SWB4 is, for example, a continuous and closed annular structure surrounding the environmentally sensitive electronic component 430 for blocking moisture and oxygen from the outside. The first sidewall barrier structure SWB4 surrounds the heat dissipation protrusion 440. It should be noted that, as shown in FIG. 7A, the heat dissipation protrusion 440 of the present embodiment and the second substrate 420 are made of the same material, for example, the heat dissipation protrusion 440 is etched, for example, by yellow light lithography, embossing, sand blasting, or a precision lathe. The process is formed on the second substrate 420 in an array, and the material of the second substrate 420 and the heat dissipation protrusion 440 is mainly a metal material, wherein the metal material is, for example, iron, aluminum, copper, magnesium, chromium, gold, silver. A metal such as molybdenum or titanium or an alloy thereof.

Further, in other embodiments, the heat dissipation protrusions 440 and the second substrate 420 may be made of different materials, wherein the material of the second substrate 420 is, for example, a metal material, and the metal material is, for example, iron. , aluminum, copper, magnesium, chromium, gold, silver, molybdenum, titanium and other metals or alloy materials thereof, the material of the heat dissipation protrusion 440 is mainly inorganic materials, wherein the inorganic materials are, for example, telluride, aluminide, diamond, diamond-like, etc. . The heat dissipation protrusions 440 can be formed on the second substrate 420 by chemical vapor deposition, sputtering, spraying, etc., and arranged in an array.

In detail, as shown in FIGS. 7A and 7B, in the present embodiment, heat dissipation The number of protrusions 440 is, for example, a plurality and arrays of a region D on the second substrate 420, wherein the area of the region D is substantially the same as the size of the environmentally sensitive electronic component 430. Of course, the area of the area D can be adjusted according to the design requirements of the product. In other words, the area of the area D can be equal to, larger or smaller than the size of the environmentally sensitive electronic component 430, and the distribution position of the heat dissipation protrusion 440 is at least equal to that of the environmentally sensitive electronic component 430. Partial overlap. Therefore, the thermal energy emitted by the environmentally sensitive electronic component 430 can be transferred to the heat dissipation protrusion 440 via the first filling layer 450, and then further radiated to the second substrate 420 by the heat dissipation protrusion 440 to escape to the outside.

In short, the heat dissipation of the present disclosure can effectively improve the efficiency of heat conduction and heat dissipation. In addition, in this embodiment, the bottom area of the heat dissipation protrusion 440 is, for example, a square shape. Of course, in other embodiments not shown, the bottom surface area of the heat dissipation protrusion 440 may also be a triangle, other different types of polygons, circles, or Oval, the disclosure is not limited herein.

In addition, the first filling layer 450 is formed, for example, by a solidification or thermal curing of a rubber material. The material of the rubber material is, for example, acrylic or epoxy. In the present embodiment, the pre-cured form of the first filling layer 450 is, for example, a liquid type rubber material or a sheet type rubber material. Further, the first filling layer 450 further includes a heat conductive material 10, wherein the heat conductive material 10 is, for example, an artificial diamond, a diamond-like diamond, a diamond like carbon, and is distributed in the first filling layer 450 as a nano-sized particle. Can effectively improve the efficiency of heat transfer.

On the other hand, the environmentally sensitive electronic component package 400A of the present embodiment is more The circuit lead DC is disposed on the first substrate 410 and located between the first substrate 410 and the second substrate 420. The circuit lead DC is electrically connected to the environmentally sensitive electronic component 430. The circuit lead DC is operable to receive an input signal and convert the input signal to generate an output signal, wherein the output signal is, for example, a display control signal. The circuit lead DC output displays a control signal to control the environmentally sensitive electronic component 430.

Following the above, the third substrate 460 is, for example, a metal substrate, and the third substrate 460 can be a flexible metal substrate having better heat conduction and heat dissipation characteristics. Of course, the third substrate 460 may also be the same or similar flexible substrate as the first substrate 410. The material of the flexible substrate may be polyethylene terephthalate (PET) or poly-m-benzene. Polyethylene naphthalate (PEN), polyethersulfone (PES), polymethyl methacrylate (PMMA), polycarbonate (PC), polyamidamine (PI) The disclosure is not limited herein.

In addition, as shown in FIG. 7A , in the embodiment, the second sidewall barrier structure SWB5 is located on the third substrate 460 and extends toward the first substrate 410 , wherein the second sidewall barrier structure SWB5 is perpendicular to the first substrate 410 . The cross section is, for example, a trapezoid. Of course, the cross section may also be rectangular, other different types of polygonal, circular or elliptical. In general, the material of the second sidewall barrier structure SWB5 may include a metal material, and the metal material is, for example, a metal such as iron, aluminum, copper, magnesium, chromium, gold, silver, molybdenum, titanium, or an alloy thereof, and the second The sidewall barrier structure SWB5 is, for example, by yellow light micro-etching A process such as engraving, stamping or precision lathe is formed on the third substrate 460. It is to be noted that the second sidewall barrier structure SWB5 and the third substrate 460 may be made of the same material or different materials, and the disclosure is not limited herein.

In detail, in the embodiment, the heat dissipation layer 470 covering the second sidewall barrier structure SWB5 is mainly composed of a heat conductive material 10, wherein the heat conductive material 10 is, for example, an artificial diamond, a diamond-like diamond, or a diamond-like carbon (diamond like carbon). And the heat dissipation layer 470 is formed on the second sidewall barrier structure SWB5 by a process such as a chemical vapor deposition method or a spray coating method, for example. The heat dissipation layer 470 may also include an anti-electromagnetic interference material. Generally, the anti-electromagnetic interference material such as gold, silver, copper, carbon or lead may be used to attenuate the electromagnetic effect.

In addition, the heat dissipation layer 470 covering the second sidewall barrier structure SWB5 may also be composed of a metal material or a highly thermally conductive material, such as a single layer of metal such as aluminum, molybdenum, titanium, etc., or A multilayer metal stack such as molybdenum/aluminum/molybdenum or titanium/aluminum/titanium. Generally, the heat dissipation layer 470 is formed on the second sidewall barrier structure SWB5 by a process such as a chemical vapor deposition method, a thin film evaporation method, or a thin film sputtering method, for example, the foregoing metal material or high thermal conductive material.

On the other hand, the heat dissipation structure 480 is, for example, a continuous annular structure in which the heat dissipation structure 480 is directly bonded to the heat dissipation layer 470. In addition, the heat dissipation structure 480 is further coupled to the housing CASE2. Therefore, the thermal energy generated by the environmentally sensitive electronic component 430 can be conducted to the heat dissipation structure 480 via the heat dissipation layer 470, and then transmitted to the housing CASE2 via the heat dissipation structure 480, and finally the thermal energy is provided by the housing. The body CASE2 is exported outward.

In further detail, as shown in FIG. 7A, the heat dissipation structure 480 includes a heat conductive material 480a and a heat conduction point 480b. The material of the heat conductive material 480a may mainly include a metal material or other high heat conductive material such as a metal heat conductive adhesive material, a thermal conductive tape, or the like. In addition, the material of the thermal conductive spot 480b may mainly include a metal material such as a single layer metal such as aluminum, molybdenum, titanium, or the like, or a combination of a plurality of metal stacks such as molybdenum/aluminum/molybdenum or titanium/aluminum/titanium. The heat dissipation structure 480 is formed on the first substrate 410 by, for example, a chemical vapor deposition method, a thin film deposition method, or a thin film sputtering method. More specifically, the thermal conductive spot 480b can be fabricated simultaneously using an active component such as a metal wire process in a thin film transistor (TFT) process, and the thermal conductive material 480a and the thermal conductive spot 480b can be made of the same material or different materials. The disclosure is not limited here.

In this embodiment, the first substrate 410, the second substrate 420, and the third substrate 460 are disposed in the casing CASE2. In detail, the first substrate 410, the second substrate 420, and the third substrate 460 are, for example, shells. The body CASE2 is surrounded, wherein the first substrate 410 further abuts the inner surface of the casing CASE2. In other words, the thermal energy emitted by the environmentally sensitive electronic component 430 can be conducted to the housing CASE2 via the first substrate to direct thermal energy to reduce the effect of thermal energy on the life of the environmentally sensitive electronic component 430.

In the present embodiment, the environmentally sensitive electronic component package 400A is, for example, a bottom emission design, and is also a top emission design, which is not limited herein. Of course, in other embodiments not shown, the housing CASE of the environmentally sensitive electronic component package 400A may be further configured with a double-sided light exit port, whereby light can be simultaneously outputted from the top surface and the bottom surface. Thereby achieving the effect of dual emission.

In summary, since the environmentally sensitive electronic component package of the present disclosure has a sidewall barrier structure surrounding the environmentally sensitive electronic component and is disposed between any two substrates, the environmentally sensitive electronic component package of the present disclosure has good barrier water. Gas and oxygen capacity. In addition, the environmentally sensitive electronic component package of the present disclosure further has a heat dissipating protruding structure or a heat conductive material, wherein the heat dissipating protrusion is disposed on the substrate and extends toward the environmentally sensitive electronic component, and the heat conducting material is distributed on the filling layer by nanometer particles or The heat dissipation layer, therefore, the environmentally sensitive electronic component package disclosed herein has good heat dissipation capability to effectively extend the life of environmentally sensitive electronic components.

The present disclosure has been described above by way of example only, and is not intended to limit the scope of the disclosure, and the invention may be modified and modified without departing from the spirit and scope of the disclosure. The scope of protection of this disclosure is subject to the definition of the scope of the appended claims.

10‧‧‧thermal materials

200A‧‧‧Environmentally sensitive electronic component package

210‧‧‧First substrate

220‧‧‧second substrate

230‧‧‧Environmentally sensitive electronic components

240‧‧‧First filling layer

250‧‧‧ third substrate

260‧‧‧heating outstanding

270‧‧‧Second filling layer

SWB1‧‧‧ sidewall barrier structure

DC‧‧‧ circuit wire

Claims (21)

An environmentally sensitive electronic component package includes: a first substrate; a second substrate disposed above the first substrate; an environmentally sensitive electronic component disposed on the first substrate and located on the first substrate and the Between the second substrate; at least one first sidewall barrier structure disposed on the second substrate and located between the first substrate and the second substrate, wherein the first sidewall barrier structure is located in the environmentally sensitive electron At least one side of the component; at least one heat dissipating protrusion on the second substrate, the heat dissipating protrusion is at least partially overlapped with the environmentally sensitive electronic component; a first filling layer is located on the first substrate and the second substrate The first filling layer covers the environmentally sensitive electronic component, the heat dissipation protrusion and the first sidewall barrier structure; a third substrate is disposed under the first substrate, wherein the first substrate is located at the first The second substrate is disposed between the first substrate and the third substrate; On the third substrate, between the first substrate and the third substrate, wherein the heat dissipation layer covers the third substrate and the second sidewall barrier structure; and a heat dissipation structure disposed on the first substrate And located on the first substrate and the Between the third substrates, wherein the heat dissipation structure surrounds the second sidewall barrier structure, and the heat dissipation structure is bonded to the heat dissipation layer on the third substrate; and a second filling layer is located on the first substrate and the first substrate Between the three substrates, wherein the second filling layer covers the second sidewall barrier structure. The environmentally sensitive electronic component package of claim 1, wherein the first sidewall barrier structure comprises a continuous and closed annular structure, and the first sidewall barrier structure protrudes around the heat dissipation. The environmentally sensitive electronic component package of claim 1, wherein the first sidewall barrier structure comprises a trapezoidal, rectangular, polygonal, circular or elliptical cross section, and the cross section is perpendicular to the first substrate. The environmentally sensitive electronic component package of claim 1, wherein the heat dissipating protruding bottom area comprises a square, a rectangle, a polygon, a circle or an ellipse. The environmentally sensitive electronic component package of claim 1, wherein the heat dissipation protruding array is arranged on the second substrate. The environmentally sensitive electronic component package of claim 1, wherein the first filling layer has a thermally conductive material. The environmentally sensitive electronic component package of claim 1, further comprising a circuit wire, wherein the circuit wire is disposed on the first substrate and located between the first substrate and the second substrate to be electrically Sexually connect the environmentally sensitive electronic components. The environmentally sensitive electronic component package of claim 1, wherein the heat dissipation structure comprises a continuous annular structure. The environmentally sensitive electronic component package of claim 1, wherein the heat dissipation structure comprises a discontinuous annular structure. The environmentally sensitive electronic component package of claim 1, wherein the heat dissipation layer is a heat conductive material. The environmentally sensitive electronic component package of claim 1, wherein the second filling layer has a thermally conductive material. The environmentally sensitive electronic component package of claim 1, further comprising a casing, wherein the first substrate, the second substrate and the third substrate are disposed in the casing. The environmentally sensitive electronic component package of claim 1, wherein the second sidewall barrier structure comprises a trapezoidal, rectangular, polygonal, circular or elliptical cross section, and the cross section is perpendicular to the first substrate. An environmentally sensitive electronic component package includes: a first substrate; a second substrate disposed above the first substrate; an environmentally sensitive electronic component disposed on the first substrate and located on the first substrate and the a first filling layer between the first substrate and the second substrate and covering the environmentally sensitive electronic component; a third substrate disposed under the first substrate, wherein the first substrate a substrate is disposed between the second substrate and the third substrate; at least one sidewall barrier structure is disposed on the third substrate and located at the first Between the substrate and the third substrate, wherein the sidewall barrier structure is located on at least one side of the environmentally sensitive electronic component; at least one heat dissipation protruding on the third substrate, the heat dissipation protruding position and the environment sensitive electronic component At least partially overlapping; and a second filling layer between the first substrate and the third substrate, and covering the sidewall barrier structure and the heat dissipation protrusion. The environmentally sensitive electronic component package of claim 14, wherein the sidewall barrier structure comprises a continuous and closed annular structure, and the sidewall barrier structure protrudes around the heat dissipation. The environmentally sensitive electronic component package of claim 14, wherein the cross section of the first sidewall barrier structure comprises a trapezoidal shape, a rectangular shape, a polygonal shape, a circular shape or an elliptical shape, and the cross section is perpendicular to the first substrate. The environmentally sensitive electronic component package of claim 14, wherein the heat dissipating protruding bottom area comprises a square, a rectangle, a polygon, a circle or an ellipse. The environmentally sensitive electronic component package of claim 14, wherein the heat dissipation protruding array is arranged on the third substrate. The environmentally sensitive electronic component package of claim 14, wherein the first filled layer has a thermally conductive material. The environmentally sensitive electronic component package of claim 14, wherein the second filled layer has a heat conductive material. Environmentally sensitive electronic component package as described in claim 14 The circuit further includes a circuit conductor, wherein the circuit conductor is disposed on the first substrate and located between the first substrate and the second substrate to electrically connect the environmentally sensitive electronic component.