TWI568762B - An esterified epoxy resin, a method for producing the same, and a hardening composition containing the same - Google Patents

An esterified epoxy resin, a method for producing the same, and a hardening composition containing the same Download PDF

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TWI568762B
TWI568762B TW102117533A TW102117533A TWI568762B TW I568762 B TWI568762 B TW I568762B TW 102117533 A TW102117533 A TW 102117533A TW 102117533 A TW102117533 A TW 102117533A TW I568762 B TWI568762 B TW I568762B
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group
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carbon atoms
resin
epoxy resin
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TW201406805A (en
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Taikou Usui
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Kyoritsu Chemical & Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14Polycondensates modified by chemical after-treatment
    • C08G59/1433Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10Epoxy resins modified by unsaturated compounds
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1339Gaskets; Spacers; Sealing of cells

Description

酯化環氧樹脂、其製造方法及含有其之硬化性組成物 Esterified epoxy resin, method for producing the same, and curable composition containing the same

本發明係有關液安定性優異之酯化環氧樹脂、其製造方法及含有其之硬化性組成物。 The present invention relates to an esterified epoxy resin excellent in liquid stability, a method for producing the same, and a curable composition containing the same.

液晶顯示元件之製造方法中,滴下工法係在真空下,將液晶直接滴下於密封劑之封閉迴圈(Loop)內,進行貼合、真空開放,可製作面板的工法。此滴下工法有液晶之使用量降低,縮短液晶注入面板之注入時間等許多優點,成為目前使用大型基板之液晶面板之製造方法的主流。含有滴下工法的方法係塗佈密封劑.液晶,經貼合後,進行間隙、對位,然後主要藉由紫外線硬化進行密封劑之硬化。 In the method for producing a liquid crystal display device, the dropping method is a method in which a liquid crystal panel is directly dropped into a loop of a sealant under vacuum to perform lamination and vacuum opening, and a panel can be produced. This dropping method has many advantages such as a decrease in the use amount of the liquid crystal, a shortening of the injection time of the liquid crystal injection panel, and the like, and has become the mainstream of the current manufacturing method of the liquid crystal panel using the large substrate. 4. The method containing the dropping method is to apply a sealant. After the liquid crystal is bonded, the gap and the alignment are performed, and then the sealant is hardened mainly by ultraviolet curing.

密封劑之原料檢討使用(甲基)丙烯酸所構成之酯化環氧樹脂(專利文獻1~3)。此等文獻中記載將環氧基轉變成(甲基)丙烯醯基的方法,例如具有環氧基之化合物與(甲基)丙烯酸之反應。專利文獻3記載之(甲基)丙烯酸酯化環氧樹脂係耐液晶性特別優異。 An esterified epoxy resin composed of (meth)acrylic acid was used as a raw material for the sealant (Patent Documents 1 to 3). These documents describe a method of converting an epoxy group to a (meth)acryloyl group, for example, a reaction of a compound having an epoxy group with (meth)acrylic acid. The (meth)acrylated epoxy resin described in Patent Document 3 is particularly excellent in liquid crystal resistance.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開平05-295087號公報 [Patent Document 1] Japanese Patent Publication No. 05-295087

[專利文獻2]日本特開2008-3260號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2008-3260

[專利文獻3]日本特開2012-77202號公報 [Patent Document 3] Japanese Patent Laid-Open Publication No. 2012-77202

本發明人等發現專利文獻1~3所記載的方法中,含有藉由(甲基)丙烯酸之酯化環氧樹脂的密封劑中,黏度高,變成無法添加潛在性硬化劑(固形),或其添加量受限制及、與潛在性硬化劑混合時之液安定性低等的問題。 The present inventors have found that in the method described in Patent Documents 1 to 3, the sealant containing the (meth)acrylic acid esterified epoxy resin has a high viscosity, and it is impossible to add a latent curing agent (solid type), or The amount of addition is limited, and the stability of the liquid when mixed with a latent hardener is low.

因此,本發明之課題係維持含有以往藉由(甲基)丙烯酸之酯化環氧樹脂之密封劑之長處,即耐液晶性,改善密封劑之液安定性,降低黏度。 Therefore, the problem of the present invention is to maintain the liquid crystallinity of the sealant containing the esterified epoxy resin (meth)acrylic acid, and to improve the liquid stability of the sealant and to lower the viscosity.

本發明人等為了達成上述課題而精心檢討的結果,發現專利文獻1~3所記載之(甲基)丙烯酸所構成之酯化環氧樹脂,因環氧環之開環產生羥基,此會產生上述液安定性之不安定化及高黏度化的問題。 As a result of careful examination of the above-mentioned problems, the inventors of the present invention found that the esterified epoxy resin composed of (meth)acrylic acid described in Patent Documents 1 to 3 generates a hydroxyl group by ring opening of the epoxy ring, which causes generation. The problem of unstable stability and high viscosity of the above liquid stability.

專利文獻3記載含有例如以下述式: 表示之甲基丙烯酸所構成之酯化環氧樹脂的樹脂組成物,此環氧樹脂組成物係耐液晶性優異。但是存在於(甲基)丙烯酸所構成之酯化環氧樹脂中的羥基,使密封劑之液安定性變差,且因分子間氫鍵作用,使密封劑之黏度升高。 Patent Document 3 describes, for example, the following formula: A resin composition of an esterified epoxy resin composed of methacrylic acid, which is excellent in liquid crystal resistance. However, the hydroxyl group present in the esterified epoxy resin composed of (meth)acrylic acid deteriorates the liquid stability of the sealant, and the viscosity of the sealant increases due to intermolecular hydrogen bonding.

本發明係如下述。 The present invention is as follows.

(1)一種酯化環氧樹脂,其特徵係以一般式(1): 表示之樹脂及有時由其多聚物所構成,或以一般式(2): 表示之樹脂及有時由其多聚物所構成,或以一般式(3): 表示之樹脂及有時由其多聚物所構成,〔各式中,X係-O-、碳原子數1~4之伸烷基、或碳原子數2~4之亞烷基,Y係碳原子數1~4之伸烷基-碳原子數6~20之伸芳基-碳原子數1~4之伸烷基、碳原子數1~4之伸烷基-碳原子數6~20之伸芳基、或基:-R7-(O-R7)n-(式中,R7係碳原子數1~4之伸烷基,n為0或1~6之整數),各R21各自彼此獨立為氫或甲基,R11、R12、R13、R14、R15及R16各自彼此獨立為氫、縮水甘油基、甲基縮水甘油基、(甲基)丙烯醯基、烷基、醯基、甲矽烷基(silyl)、縮醛基(acetal)、或基:-CH2-CH(OR’)-CH2-O-R8或基:-CH2-C(CH3)(OR’)-CH2-O-R8(式中,R’為氫、(甲基)丙烯醯基、烷基、醯基、甲矽烷基、或縮醛基,R8為(甲基)丙烯醯基,但是存在於基:-CH2-CH(OR’)-CH2-O-R8中之R’之中,氫平均未達0.8個),存在於一般式(1)及(2)之R11、R12、R14及R15中,縮 水甘油基與甲基縮水甘油基與基:-CH2-CH(OR’)-CH2-O-R8與基:-CH2-C(CH3)(OR’)-CH2-O-R8之合計平均為2個以上,縮水甘油基及甲基縮水甘油基之平均之個數與基:-CH2-CH(OR’)-CH2-O-R8及基:-CH2-C(CH3)(OR’)-CH2-O-R8之平均個數之比例為10:90~90:10,存在於一般式(3)之R11、R12、R13、R14、R15及R16中,縮水甘油基與甲基縮水甘油基與基:-CH2-CH(OR’)-CH2-O-R8與基:-CH2-C(CH3)(OR’)-CH2-O-R8之合計平均為2個以上,縮水甘油基及甲基縮水甘油基之平均個數與基:-CH2-CH(OR’)-CH2-O-R8及基:-CH2-C(CH3)(OR’)-CH2-O-R8之平均個數之比例為10:90~90:10〕。 (1) An esterified epoxy resin characterized by the general formula (1): Represents the resin and sometimes consists of its polymer, or in the general formula (2): Represents the resin and sometimes consists of its polymer, or in the general formula (3): The resin is sometimes composed of a polymer thereof, and in each formula, X-type O-, alkylene group having 1 to 4 carbon atoms, or alkylene group having 2 to 4 carbon atoms, Y-system Alkyl group having 1 to 4 carbon atoms - an extended aryl group having 6 to 20 carbon atoms - an alkyl group having 1 to 4 carbon atoms, an alkyl group having 1 to 4 carbon atoms - 6 to 20 carbon atoms An aryl group or a group: -R 7 -(OR 7 ) n - (wherein R 7 is an alkylene group having 1 to 4 carbon atoms, n is an integer of 0 or 1 to 6), and each R 21 Each of them is independently hydrogen or a methyl group, and each of R 11 , R 12 , R 13 , R 14 , R 15 and R 16 is independently hydrogen, glycidyl, methyl glycidyl, (meth)acryl fluorenyl, Alkyl, fluorenyl, silyl, acetal, or a group: -CH 2 -CH(OR')-CH 2 -OR 8 or a group: -CH 2 -C(CH 3 ) (OR')-CH 2 -OR 8 (wherein R' is hydrogen, (meth)propenyl group, alkyl group, fluorenyl group, formyl group, or acetal group, and R 8 is (meth) propylene Sulfhydryl, but present in the base: -CH 2 -CH(OR')-CH 2 -OR 8 in R', the average hydrogen is less than 0.8), present in the general formula (1) and (2) R 11, R 12, R 14 and R 15, the glycidyl and methyl glycidyl And oleyl group: -CH 2 -CH (OR ') - CH 2 -OR 8 and group: -CH 2 -C (CH 3) (OR') - CH 2 -OR 8 total average of 2 or more, The average number of glycidyl groups and methyl glycidyl groups and the group: -CH 2 -CH(OR')-CH 2 -OR 8 and the group: -CH 2 -C(CH 3 )(OR')-CH The ratio of the average number of 2 -OR 8 is 10:90~90:10, which exists in R 11 , R 12 , R 13 , R 14 , R 15 and R 16 of general formula (3), glycidyl group and The methyl glycidyl group and the group: -CH 2 -CH(OR')-CH 2 -OR 8 and the group: -CH 2 -C(CH 3 )(OR')-CH 2 -OR 8 have an average of 2 More than one, the average number of glycidyl groups and methyl glycidyl groups and groups: -CH 2 -CH(OR')-CH 2 -OR 8 and base: -CH 2 -C(CH 3 )(OR') The ratio of the average number of -CH 2 -OR 8 is 10:90~90:10].

(2)一種酯化環氧樹脂,其特徵係以一般式(1a): 表示之樹脂及有時由其多聚物所構成,或以一般式(2a): 表示之樹脂及有時由其多聚物所構成,或以一般式(3a): 表示之樹脂及有時由其多聚物所構成,〔各式中,X係-O-、碳原子數1~4之伸烷基、或碳原子數2~4之亞烷基,Y係碳原子數1~4之伸烷基-碳原子數6~20之伸芳基-碳原子數1~4之伸烷基、碳原子數1~4之伸烷基-碳原子數6~20之伸芳基、或基:-R7-(O-R7)n-(式中,R7係碳原子數1~4之伸烷基,n為0或1~6之整數),各R21各自彼此獨立為氫或甲基,R11、R12、R13、R14、R15及R16各自彼此獨立為氫、縮水甘油基、甲基縮水甘油基、(甲基)丙烯醯基、或基:-CH2-CH(OR’)-CH2-O-R8或基:-CH2-C(CH3)(OR’)-CH2-O-R8(式中,R’為氫或(甲基)丙烯醯基,R8為(甲基)丙烯醯基,存在於基:-CH2-CH(OR’)-CH2-O-R8中之R’之中,氫平均為未達0.8個),存在於一般式(1a)及(2a)中之R11、R12、R14及R15 中,縮水甘油基與甲基縮水甘油基與基:-CH2-CH(OR’)-CH2-O-R8與基:-CH2-C(CH3)(OR’)-CH2-O-R8之合計平均為2個以上,縮水甘油基及甲基縮水甘油基之平均個數與基:-CH2-CH(OR’)-CH2-O-R8及基:-CH2-C(CH3)(OR’)-CH2-O-R8之平均個數之比例為10:90~90:10,存在於一般式(3a)中之R11、R12、R13、R14、R15及R16中,縮水甘油基與甲基縮水甘油基與基:-CH2-CH(OR’)-CH2-O-R8與基:-CH2-C(CH3)(OR’)-CH2-O-R8之合計平均為2個以上,縮水甘油基及甲基縮水甘油基之平均個數與基:-CH2-CH(OR’)-CH2-O-R8及基:-CH2-C(CH3)(OR’)-CH2-O-R8之平均個數之比例為10:90~90:10〕。 (2) An esterified epoxy resin characterized by the general formula (1a): Represents the resin and sometimes consists of its polymer, or in the general formula (2a): Represents the resin and sometimes consists of its polymer, or in the general formula (3a): The resin is sometimes composed of a polymer thereof, and in each formula, X-type O-, alkylene group having 1 to 4 carbon atoms, or alkylene group having 2 to 4 carbon atoms, Y-system Alkyl group having 1 to 4 carbon atoms - an extended aryl group having 6 to 20 carbon atoms - an alkyl group having 1 to 4 carbon atoms, an alkyl group having 1 to 4 carbon atoms - 6 to 20 carbon atoms An aryl group or a group: -R 7 -(OR 7 ) n - (wherein R 7 is an alkylene group having 1 to 4 carbon atoms, n is an integer of 0 or 1 to 6), and each R 21 Each of them is independently hydrogen or a methyl group, and each of R 11 , R 12 , R 13 , R 14 , R 15 and R 16 is independently hydrogen, glycidyl, methyl glycidyl, (meth)acryl fluorenyl, Or a group: -CH 2 -CH(OR')-CH 2 -OR 8 or a group: -CH 2 -C(CH 3 )(OR')-CH 2 -OR 8 (wherein R' is hydrogen or Methyl) propylene fluorenyl group, R 8 is a (meth) acryl fluorenyl group, which is present in the group R: in the group: -CH 2 -CH(OR')-CH 2 -OR 8 , and the hydrogen is on average less than 0.8 In the general formulae (1a) and (2a), R 11 , R 12 , R 14 and R 15 , glycidyl group and methyl glycidyl group and group: -CH 2 -CH(OR') and -CH 2 -OR 8 group: -CH 2 -C (CH 3) (OR ') - CH 2 -OR 8 of total average 2 And the average number of groups, glycidyl and methyl glycidyl group: -CH 2 -CH (OR ') - CH 2 -OR 8 group, and: -CH 2 -C (CH 3) (OR') - The ratio of the average number of CH 2 -OR 8 is 10:90 to 90:10, which is present in R 11 , R 12 , R 13 , R 14 , R 15 and R 16 in the general formula (3a), glycidol Base and methyl glycidyl group with: -CH 2 -CH(OR')-CH 2 -OR 8 and base: -CH 2 -C(CH 3 )(OR')-CH 2 -OR 8 The average number of glycidyl groups and methyl glycidyl groups of 2 or more and the base: -CH 2 -CH(OR')-CH 2 -OR 8 and the group: -CH 2 -C(CH 3 )(OR The ratio of the average number of ')-CH 2 -OR 8 is 10:90~90:10].

(3)一種酯化環氧樹脂之製造方法,其特徵係含有下述步驟(1A)~(1C):(1A)使分子中具有2以上之環氧基之多官能環氧化合物,在金屬觸媒之存在下,與分子中具有2以上之羥基的聚羥基化合物反應,得到多官能環氧化合物之環氧開環物(ring-opened form)的步驟,(1B)將步驟(1A)所得之多官能環氧化合物之環氧開環物之羥基進行環氧化得到環氧樹脂的步驟,(1C)使步驟(1B)所得之環氧樹脂與(甲基)丙烯酸酐反應的步驟。 (3) A method for producing an esterified epoxy resin, comprising the following steps (1A) to (1C): (1A) a polyfunctional epoxy compound having 2 or more epoxy groups in a molecule, in a metal In the presence of a catalyst, a step of reacting with a polyhydroxy compound having 2 or more hydroxyl groups in the molecule to obtain a ring-opened form of a polyfunctional epoxy compound, (1B) obtaining the step (1A) The step of epoxidizing the hydroxyl group of the epoxy ring-opening compound of the polyfunctional epoxy compound to obtain an epoxy resin, and (1C) the step of reacting the epoxy resin obtained in the step (1B) with (meth)acrylic anhydride.

(4)一種如前述第(2)項之酯化環氧樹脂之製造 方法,其特徵係含有使以一般式(4): 表示之樹脂及有時由其多聚物所構成之環氧樹脂,或以一般式(5): 表示之樹脂及有時由其多聚物所構成之環氧樹脂,或以一般式(6): 表示之樹脂及有時由其多聚物所構成之環氧樹脂〔各式中, X為-O-、碳原子數1~4之伸烷基、或碳原子數2~4之亞烷基,Y為碳原子數1~4之伸烷基-碳原子數6~20之伸芳基-碳原子數1~4之伸烷基、碳原子數1~4之伸烷基-碳原子數6~20之伸芳基、或基:-R7-(O-R7)n-(式中,R7為碳原子數1~4之伸烷基,n為0或1~6之整數),各R21各自彼此獨立為氫或甲基,R1、R2、R3、R4、R5及R6各自彼此獨立為氫、縮水甘油基、或甲基縮水甘油基,但是存在於一般式(4)及(5)中之R1、R2、R4及R5之至少2個為縮水甘油基或甲基縮水甘油基,存在於一般式(6)中之R1、R2、R3、R4、R5及R6之至少2個為縮水甘油基或甲基縮水甘油基〕與(甲基)丙烯酸酐反應。 (4) A method for producing an esterified epoxy resin according to the above item (2), which is characterized by containing the general formula (4): a resin represented by an epoxy resin sometimes composed of a polymer thereof, or a general formula (5): a resin represented by an epoxy resin sometimes composed of a polymer thereof, or a general formula (6): The resin represented by the resin and the epoxy resin sometimes composed of the polymer thereof (wherein X is -O-, an alkylene group having 1 to 4 carbon atoms, or an alkylene group having 2 to 4 carbon atoms) , Y is an alkyl group having 1 to 4 carbon atoms - an exoaryl group having 6 to 20 carbon atoms - an alkyl group having 1 to 4 carbon atoms, and an alkyl group having 1 to 4 carbon atoms 6 to 20 of an extended aryl group, or a group: -R 7 -(OR 7 ) n - (wherein, R 7 is an alkylene group having 1 to 4 carbon atoms, and n is an integer of 0 or 1 to 6), Each of R 21 is independently hydrogen or methyl, and R 1 , R 2 , R 3 , R 4 , R 5 and R 6 are each independently hydrogen, glycidyl, or methyl glycidyl, but are present in general. At least two of R 1 , R 2 , R 4 and R 5 in the formulae (4) and (5) are glycidyl groups or methyl glycidyl groups, and R 1 and R 2 are present in the general formula (6). And at least two of R 3 , R 4 , R 5 and R 6 are glycidyl or methyl glycidyl groups are reacted with (meth)acrylic anhydride.

(5)如前述第(4)項之酯化環氧樹脂之製造方法,其係含有下述步驟(2A)~(2B)的方法製造如前述第(4)項之一般式(4)~一般式(6)之任一表示之樹脂及有時由其多聚物所構成之環氧樹脂,(2A)使以一般式(7a): 或一般式(8a): 或一般式(9a): 〔各式中,X及R21係前述第(4)項所定義〕表示之環氧化合物,在金屬觸媒之存在下,與下述一般式(10):HO-Y-OH (10)(式中,Y係如前述第(4)項所定義) 表示之二羥基化合物進行反應,得到以一般式(7b): 表示之樹脂及有時由其多聚物所構成之環氧開環物、或以一般式(8b): 表示之樹脂及有時由其多聚物所構成之環氧開環物、或以一般式(9b): 表示之樹脂及有時由其多聚物所構成之環氧開環物〔各式中,X、Y及R21係如上述所定義〕的步驟, (2B)將步驟(2A)所得之一般式(7b)~一般式(9b)之任一表示之樹脂及有時由其多聚物所構成之環氧開環物之羥基,進行環氧化的步驟。 (5) The method for producing an esterified epoxy resin according to the above item (4), which comprises the method of the following steps (2A) to (2B), wherein the general formula (4) of the above item (4) is produced. The resin represented by any one of the general formula (6) and the epoxy resin sometimes composed of the polymer thereof, (2A) are given by the general formula (7a): Or general formula (8a): Or general formula (9a): [In each formula, X and R 21 are the epoxy compounds represented by the above-mentioned item (4)], in the presence of a metal catalyst, and the following general formula (10): HO-Y-OH (10) (wherein, Y is as defined in the above item (4)), and the dihydroxy compound is reacted to obtain a general formula (7b): a resin represented by an epoxy ring ring sometimes composed of a polymer thereof, or a general formula (8b): a resin represented by an epoxy ring ring sometimes composed of a polymer thereof, or a general formula (9b): a step of forming a resin and an epoxy ring-opening material which is sometimes composed of a polymer (wherein X, Y and R 21 are as defined above), (2B) a general result obtained in the step (2A) The step of epoxidizing the resin represented by any one of the formula (7b) to the general formula (9b) and the hydroxyl group of the epoxy ring-opening material composed of the polymer.

(6)一種酯化環氧樹脂之製造方法,其特徵係含有下述步驟(1A)、(1B)、(1C’)及(1D),(1A)使分子中具有2以上之環氧基之多官能環氧化合物,在金屬觸媒之存在下,與分子中具有2以上之羥基的聚羥基化合物反應,得到多官能環氧化合物之環氧開環物的步驟,(1B)將步驟(1A)所得之多官能環氧化合物之環氧開環物之羥基進行環氧化得到環氧樹脂的步驟,(1C’)使步驟(1B)所得之環氧樹脂與(甲基)丙烯酸反應,得到部分酯化環氧樹脂的步驟,(1D)使步驟(1C’)所得之部分酯化環氧樹脂與(甲基)丙烯醯基化劑、烷基化劑、醯基化劑、甲矽烷基化劑、或縮醛基化劑反應的步驟。 (6) A method for producing an esterified epoxy resin, which comprises the following steps (1A), (1B), (1C') and (1D), wherein (1A) has an epoxy group having 2 or more in the molecule; a polyfunctional epoxy compound, which is reacted with a polyhydroxy compound having 2 or more hydroxyl groups in the molecule in the presence of a metal catalyst to obtain an epoxy ring-opening of a polyfunctional epoxy compound, and (1B) a step ( 1A) a step of epoxidizing a hydroxyl group of the epoxy ring-opening compound of the obtained polyfunctional epoxy compound to obtain an epoxy resin, and (1C') reacting the epoxy resin obtained in the step (1B) with (meth)acrylic acid to obtain a step of partially esterifying the epoxy resin, (1D) partially esterifying the epoxy resin obtained in the step (1C') with a (meth) propylene sulfhydrylating agent, an alkylating agent, a thiolating agent, a germyl group The step of reacting the agent or the acetalizing agent.

(7)一種如前述第(1)項之酯化環氧樹脂之製造方法,其特徵係含有使以一般式(1’): 表示之樹脂及有時由其多聚物所構成之部分酯化環氧樹 脂、或以一般式(2’): 表示之樹脂及有時由其多聚物所構成之部分酯化環氧樹脂、或以一般式(3’): 表示之樹脂及有時由其多聚物所構成之部分酯化環氧樹脂〔各式中,X係-O-、碳原子數1~4之伸烷基、或碳原子數2~4之亞烷基,Y為碳原子數1~4之伸烷基-碳原子數6~20之伸芳基-碳原子數1~4之伸烷基、碳原子數1~4之伸烷基-碳原子數6~20之伸芳基、或基:-R7-(O-R7)n-(式中,R7為碳原子數1~4之伸烷基,n為0或1~6之整數),各R21各自彼此獨立為氫或甲基, R11、R12、R13、R14、R15及R16各自彼此獨立為氫、縮水甘油基、甲基縮水甘油基、或基:-CH2-CH(OH)-CH2-O-R8(式中,R8為丙烯醯基或甲基丙烯醯基),存在於一般式(1’)及(2’)中之R11、R12、R14及R15之至少2個為縮水甘油基、甲基縮水甘油基、或基:-CH2-CH(OH)-CH2-O-R8或基:-CH2-C(CH3)(OH)-CH2-O-R8,縮水甘油基及甲基縮水甘油基之平均個數與基:-CH2-CH(OH)-CH2-O-R8及基:-CH2-C(CH3)(OH)-CH2-O-R8之平均個數之比例為10:90~90:10,存在於一般式(3’)中之R11、R12、R13、R14、R15及R16之至少2個為縮水甘油基、甲基縮水甘油基、或基:-CH2-CH(OH)-CH2-O-R8或基:-CH2-C(CH3)(OH)-CH2-O-R8,縮水甘油基及甲基縮水甘油基之平均個數與基:-CH2-CH(OH)-CH2-O-R8及基:-CH2-C(CH3)(OH)-CH2-O-R8之平均個數之比例為10:90~90:10〕與(甲基)丙烯醯基化劑、烷基化劑、醯基化劑、甲矽烷基化劑、或縮醛基化劑進行反應者。 (7) A method for producing an esterified epoxy resin according to the above item (1), which is characterized by containing the general formula (1'): a resin and a partially esterified epoxy resin sometimes composed of a polymer thereof, or in the general formula (2'): a resin and a partially esterified epoxy resin sometimes composed of a polymer thereof, or in the general formula (3'): a resin represented by a resin and a partially esterified epoxy resin sometimes composed of a polymer thereof (in the formula, X-O-, an alkyl group having 1 to 4 carbon atoms, or a carbon number of 2 to 4) An alkylene group, Y is an alkylene group having 1 to 4 carbon atoms, an extended aryl group having 6 to 20 carbon atoms, an alkylene group having 1 to 4 carbon atoms, and an alkylene group having 1 to 4 carbon atoms. An extended aryl group having 6 to 20 carbon atoms or a group: -R 7 -(OR 7 ) n - (wherein R 7 is an alkylene group having 1 to 4 carbon atoms, and n is 0 or 1 to 6 Integer), each R 21 is each independently hydrogen or methyl, and R 11 , R 12 , R 13 , R 14 , R 15 and R 16 are each independently hydrogen, glycidyl, methyl glycidyl, or :-CH 2 -CH(OH)-CH 2 -OR 8 (wherein R 8 is a propylene fluorenyl group or a methacryl fluorenyl group), and R 11 is present in the general formulae (1') and (2') And at least two of R 12 , R 14 and R 15 are glycidyl, methyl glycidyl, or a group: -CH 2 -CH(OH)-CH 2 -OR 8 or a group: -CH 2 -C ( CH 3 )(OH)-CH 2 -OR 8 , the average number of glycidyl groups and methyl glycidyl groups and the group: -CH 2 -CH(OH)-CH 2 -OR 8 and the group: -CH 2 - the average ratio of the number of -CH C (CH 3) (OH) 2 -OR 8 of 10: 90 ~ 90: 10, present in the general formula (3 ') R 11, R 12, R 13, R 14, R 15 and R 16 is at least two glycidyl groups, glycidyl methyl, Or an average of -CH 2 -CH(OH)-CH 2 -OR 8 or a group: -CH 2 -C(CH 3 )(OH)-CH 2 -OR 8 , glycidyl and methyl glycidyl The ratio of the number to the base: -CH 2 -CH(OH)-CH 2 -OR 8 and the base: -CH 2 -C(CH 3 )(OH)-CH 2 -OR 8 is 10:90 ~90:10] Reacts with a (meth) propylene sulfhydrylating agent, an alkylating agent, a thiolating agent, a formylating agent, or an acetalizing agent.

(8)如前述第(7)項之酯化環氧樹脂之製造方法,其係藉由含有下述步驟(2A)~(2C),製造如前述第(7)項之一般式(1’)~一般式(3’)之任一表示之樹脂及有時由其多聚物所構成之部分酯化環氧樹脂,(2A)使以一般式(7a): 一般式(8a): 或一般式(9a): 〔各式中,X及R21係如前述第(7)項所定義〕表示之環氧化合物,在金屬觸媒之存在下,與下述一般式(10): HO-Y-OH (10) (式中,Y係如前述第(7)項所定義)表示之二羥基化合物進行反應,得到以一般式(7b): 表示之樹脂及有時由其多聚物所構成之環氧開環物、或一般式(8b): 表示之樹脂及有時由其多聚物所構成之環氧開環物、或一般式(9b): 表示之樹脂及有時由其多聚物所構成之環氧開環物〔式中,X、Y及R21係如上述定義〕的步驟,(2B)使步驟(2A)所得之一般式(7b)~一般式(9b)之任一表示之樹脂及有時由其多聚物所構成之環氧開環物之羥基進行環氧化,得到以一般式(4): 表示之樹脂及有時由其多聚物所構成之環氧樹脂、或一般式(5): 表示之樹脂及有時由其多聚物所構成之環氧樹脂、或一般 式(6): 表示之樹脂及有時由其多聚物所構成之環氧樹脂〔各式中,X為-O-、碳原子數1~4之伸烷基、或碳原子數2~4之亞烷基,Y為碳原子數1~4之伸烷基-碳原子數6~20之伸芳基-碳原子數1~4之伸烷基、碳原子數1~4之伸烷基-碳原子數6~20之伸芳基、或基:-R7-(O-R7)n-(式中,R7為碳原子數1~4之伸烷基,n為0或1~6之整數),各R21各自彼此獨立為氫或甲基,R1、R2、R3、R4、R5及R6各自彼此獨立為氫、縮水甘油基、或甲基縮水甘油基,但是存在於一般式(4)及(5)中之R1、R2、R4及R5之至少2個為縮水甘油基或甲基縮水甘油基,存在於一般式(6)中之R1、R2、R3、R4、R5及R6之至少2個為縮水甘油基或甲基縮水甘油基〕, (2C)使步驟(2B)所得之一般式(4)~(6)之任一表示之樹脂及有時由其多聚物所構成之環氧樹脂與(甲基)丙烯酸反應。 (8) The method for producing an esterified epoxy resin according to the above item (7), which comprises the general formula (1' of the above item (7) by the following steps (2A) to (2C); a resin represented by any of the general formulas (3') and a partially esterified epoxy resin sometimes composed of a polymer thereof, (2A) is given by the general formula (7a): General formula (8a): Or general formula (9a): [In each formula, X and R 21 are an epoxy compound represented by the above-mentioned item (7), in the presence of a metal catalyst, and the following general formula (10): HO-Y-OH (10) (in the formula, Y is as defined in the above item (7)), the dihydroxy compound is reacted to obtain the general formula (7b): An epoxy ring or a general formula (8b) which is represented by a resin and sometimes a polymer thereof: An epoxy ring or a general formula (9b) which is represented by a resin and sometimes a polymer thereof: a resin represented by the epoxy ring-opening compound (wherein, X, Y and R 21 are as defined above), and (2B) a general formula obtained by the step (2A) 7b)~ The resin represented by any one of the general formula (9b) and the hydroxyl group of the epoxy ring-opening material which is sometimes composed of the polymer are epoxidized to obtain the general formula (4): The resin represented by the resin and sometimes the polymer thereof, or the general formula (5): Resin represented by epoxy resin and sometimes composed of its polymer, or general formula (6): The resin represented by the resin and the epoxy resin sometimes composed of the polymer thereof (wherein X is -O-, an alkylene group having 1 to 4 carbon atoms, or an alkylene group having 2 to 4 carbon atoms) , Y is an alkyl group having 1 to 4 carbon atoms - an exoaryl group having 6 to 20 carbon atoms - an alkyl group having 1 to 4 carbon atoms, and an alkyl group having 1 to 4 carbon atoms 6 to 20 of an extended aryl group, or a group: -R 7 -(OR 7 ) n - (wherein, R 7 is an alkylene group having 1 to 4 carbon atoms, and n is an integer of 0 or 1 to 6), Each of R 21 is independently hydrogen or methyl, and R 1 , R 2 , R 3 , R 4 , R 5 and R 6 are each independently hydrogen, glycidyl, or methyl glycidyl, but are present in general. At least two of R 1 , R 2 , R 4 and R 5 in the formulae (4) and (5) are glycidyl groups or methyl glycidyl groups, and R 1 and R 2 are present in the general formula (6). And at least two of R 3 , R 4 , R 5 and R 6 are glycidyl or methyl glycidyl groups, and (2C) any one of general formulas (4) to (6) obtained in the step (2B). The resin represented by the resin and the epoxy resin sometimes composed of the polymer thereof are reacted with (meth)acrylic acid.

(9)一種硬化性組成物,其特徵係含有如前述第(1)或(2)項之酯化環氧樹脂。 (9) A curable composition characterized by containing the esterified epoxy resin according to the above item (1) or (2).

(10)一種硬化性組成物,其特徵係含有藉由如前述第(3)~(8)項中任一項之製造方法而得的酯化環氧樹脂。 (10) A curable composition comprising the esterified epoxy resin obtained by the production method according to any one of the items (3) to (8) above.

依據本發明時,可抑制對液晶之溶解性,防止液晶之污染,同時使密封劑之黏度降低,且提高密封劑之液安定性。 According to the present invention, the solubility to the liquid crystal can be suppressed, the contamination of the liquid crystal can be prevented, the viscosity of the sealant can be lowered, and the liquid stability of the sealant can be improved.

[實施發明之最佳形態] [Best Mode for Carrying Out the Invention]

以下說明本發明之較佳的實施形態。 Preferred embodiments of the present invention are described below.

本發明係一般式(1)~(3)[各式中,X係-O-、碳原子數1~4之伸烷基、或碳原子數2~4之亞烷基,Y為碳原子數1~4之伸烷基-碳原子數6~20之伸芳基-碳原子數1~4之伸烷基、碳原子數1~4之伸烷基-碳原子數6~20之伸芳基、或基:-R7-(O-R7)n-(式中,R7為碳原子數1~4之伸烷基,n為0或1~6之整數),各R21各自彼此獨立為氫或甲基,R11、R12、R13、R14、R15及R16各自彼此獨立為氫、縮水甘油基、甲基縮水甘油基、(甲基)丙烯醯基、烷基、甲矽烷基、縮醛基、或基:-CH2-CH(OR’)-CH2-O-R8或基: -CH2-C(CH3)(OR’)-CH2-O-R8(式中,R’係氫、(甲基)丙烯醯基、烷基、醯基、甲矽烷基、或縮醛基,R8為(甲基)丙烯醯基,但是存在於基:-CH2-CH(OR’)-CH2-O-R8中之R’之中,氫平均未達0.8個),存在於一般式(1)及(2)中之R11、R12、R14及R15中,縮水甘油基與甲基縮水甘油基與基:-CH2-CH(OR’)-CH2-O-R8與基:-CH2-C(CH3)(OR’)-CH2-O-R8之合計平均為2個以上,縮水甘油基及甲基縮水甘油基之平均個數與基:-CH2-CH(OR’)-CH2-O-R8及基:-CH2-C(CH3)(OR’)-CH2-O-R8之平均個數之比例為10:90~90:10,存在於一般式(3)中之R11、R12、R13、R14、R15及R16中,縮水甘油基與甲基縮水甘油基與基:-CH2-CH(OR’)-CH2-O-R8與基:-CH2-C(CH3)(OR’)-CH2-O-R8之合計平均為2個以上,縮水甘油基及甲基縮水甘油基之平均個數與基:-CH2-CH(OR’)-CH2-O-R8及基:-CH2-C(CH3)(OR’)-CH2-O-R8之平均個數之比例為10:90~90:10〕表示之樹脂及有時由其多聚物所構成之酯化環氧樹脂。 The present invention is a general formula (1) to (3) [in each formula, X-form O-, an alkylene group having 1 to 4 carbon atoms, or an alkylene group having 2 to 4 carbon atoms, and Y is a carbon atom. Number of 1-4 alkyl groups - 6 to 20 carbon atoms of the extended aryl group - an alkyl group having 1 to 4 carbon atoms, an alkyl group having 1 to 4 carbon atoms - a carbon number of 6 to 20 An aryl group or a group: -R 7 -(OR 7 ) n - (wherein, R 7 is an alkylene group having 1 to 4 carbon atoms, and n is an integer of 0 or 1 to 6), and each of R 21 is each other Independently hydrogen or methyl, R 11 , R 12 , R 13 , R 14 , R 15 and R 16 are each independently hydrogen, glycidyl, methyl glycidyl, (meth)acrylonitrile, alkyl , a mercaptoalkyl group, an acetal group, or a group: -CH 2 -CH(OR')-CH 2 -OR 8 or a group: -CH 2 -C(CH 3 )(OR')-CH 2 -OR 8 ( Wherein R' is hydrogen, (meth)propenyl, alkyl, fluorenyl, germyl, or acetal, and R 8 is (meth)acryl fluorenyl, but is present at the group: -CH 2 -CH(OR')-CH 2 -OR 8 in R', the average hydrogen is less than 0.8), and R 11 , R 12 , R 14 and R present in the general formulae (1) and (2) 15, with the glycidyl and methyl glycidyl group: -CH 2 -CH (OR ') - CH 2 -OR 8 Group: -CH 2 -C (CH 3) (OR ') - CH 2 -OR 8 total average of 2 or more, glycidyl and methyl glycidyl groups with the average number of glycidyl: -CH 2 -CH (OR')-CH 2 -OR 8 and the base: -CH 2 -C(CH 3 )(OR')-CH 2 -OR 8 The average number of the ratio is 10:90~90:10, which exists in general In R 11 , R 12 , R 13 , R 14 , R 15 and R 16 in the formula (3), a glycidyl group and a methyl glycidyl group are bonded to a group: -CH 2 -CH(OR')-CH 2 - OR 8 and base: -CH 2 -C(CH 3 )(OR')-CH 2 -OR 8 totals 2 or more on average, the average number of glycidyl groups and methyl glycidyl groups and base: -CH 2 -CH(OR')-CH 2 -OR 8 and the ratio of the base: -CH 2 -C(CH 3 )(OR')-CH 2 -OR 8 is 10:90~90:10] A resin represented by an ester and an epoxy resin sometimes composed of a polymer thereof.

本發明中,有時所含有之多聚物可為二聚物、三聚物、四聚物、五聚物或該等以上。一般式(1)之多聚物係以 表示。一般式(2)及(3)之多聚物也可與一般式(1)之多聚物 同樣表示。多聚物之量可變化。 In the present invention, the polymer contained may be a dimer, a trimer, a tetramer, a pentamer or the like. The general formula (1) is a polymer Said. The polymers of the general formulae (2) and (3) can also be represented by the same general formula (1). The amount of the polymer can vary.

碳原子數1~4之伸烷基,例如有亞甲基、伸乙基、三伸甲基、及四亞甲基,較佳為亞甲基及伸乙基。 The alkylene group having 1 to 4 carbon atoms is, for example, a methylene group, an ethyl group, a trimethyl group, and a tetramethylene group, preferably a methylene group and an ethyl group.

碳原子數2~4之亞烷基(Alkylidene group),例如有亞乙基、亞丙基、異亞丙基、甲基亞丙基及亞丁基,較佳為亞乙基及異亞丙基。 The Alkylidene group having 2 to 4 carbon atoms, for example, an ethylene group, a propylene group, an isopropylidene group, a methylpropylene group and a butylene group, preferably an ethylene group and an isopropylidene group. .

碳原子數6~20之伸芳基(arylene group)係單環或多環之芳香族基,例如有伸苯基、伸萘基及伸蒽基,較佳為伸苯基。 The arylene group having 6 to 20 carbon atoms is a monocyclic or polycyclic aromatic group, and examples thereof include a stretching phenyl group, a stretching naphthyl group and a stretching group, and preferably a stretching phenyl group.

碳原子數1~4之伸烷基-碳原子數6~20之伸芳基中之碳原子數1~4之伸烷基及碳原子數6~20之伸芳基之例示係如上述所定義。碳原子數1~4之伸烷基-碳原子數6~20之伸芳基,較佳為例如亞甲基-伸苯基。本發明中,對於碳原子數1~4之伸烷基-碳原子數6~20之伸芳基中各基之鍵結的順序無限制。例如R1~R6所鍵結之氧原子,可鍵結在碳原子數1~4之伸烷基-碳原子數6~20之伸芳基中之碳原子數1~4之伸烷基,也可鍵結碳原子數6~20之伸芳基。 Examples of the alkylene group having 1 to 4 carbon atoms and 6 to 20 carbon atoms in the exoaryl group having 1 to 4 carbon atoms and 6 to 20 carbon atoms in the extended aryl group are as described above. definition. The alkyl group having 1 to 4 carbon atoms and the aryl group having 6 to 20 carbon atoms are preferably, for example, a methylene-phenylene group. In the present invention, the order of bonding of each group in the exoaryl group having from 6 to 20 carbon atoms having 1 to 4 carbon atoms is not limited. For example, an oxygen atom bonded to R 1 to R 6 may be bonded to an alkyl group having 1 to 4 carbon atoms in an alkyl group having 1 to 4 carbon atoms and 6 to 20 carbon atoms. It is also possible to bond an extended aryl group having 6 to 20 carbon atoms.

碳原子數1~4之伸烷基-碳原子數6~20之伸芳基-碳原子數1~4之伸烷基中之碳原子數1~4之伸烷基及碳原子數6~20之伸芳基之例示係如上述所定義。碳原子數1~4之伸烷基-碳原子數6~20之伸芳基-碳原子數1~4之伸烷基,較佳為伸苯基雙(亞甲基)。 The alkyl group having 1 to 4 carbon atoms - the aryl group having 6 to 20 carbon atoms - the number of carbon atoms having 1 to 4 carbon atoms in the alkyl group having 1 to 4 carbon atoms and the number of carbon atoms 6~ An illustration of the exoaryl group of 20 is as defined above. The alkyl group having 1 to 4 carbon atoms - the aryl group having 6 to 20 carbon atoms - the alkyl group having 1 to 4 carbon atoms is preferably a phenylene bis(methylene group).

烷基例如有甲基、乙基、丙基、烯丙基、苄 基、p-甲氧基苄基、三苯甲基(trityl group)等。 Alkyl groups are, for example, methyl, ethyl, propyl, allyl, benzyl Base, p-methoxybenzyl, trityl group, and the like.

醯基例如有乙醯基、三甲基乙醯基、苯甲醯基、t-丁氧基羰基等。 The mercapto group is, for example, an ethenyl group, a trimethylethenyl group, a benzamidine group, a t-butoxycarbonyl group or the like.

甲矽烷基例如有三甲基甲矽烷基、三乙基甲矽烷基、t-丁基二甲基甲矽烷基、三異丙基甲矽烷基、t-丁基二苯基甲矽烷基等。 The mercapto group is, for example, trimethylmethanealkyl, triethylmethane, t-butyldimethylformamidin, triisopropylcarbenyl, t-butyldiphenylcarbenyl or the like.

縮醛基(Acetal)例如有甲氧基甲基、乙氧基乙基、四氫吡喃基、苄氧基甲基、甲氧基乙氧基甲基、甲基硫基甲基等。 The acetal group (Acetal) may, for example, be a methoxymethyl group, an ethoxyethyl group, a tetrahydropyranyl group, a benzyloxymethyl group, a methoxyethoxymethyl group, a methylthiomethyl group or the like.

本發明中,R11~R16之中,氫儘量少為佳。R11~R16之中,氫平均較佳為1個以下,更佳為0.5個以下,更佳為0.1個以下,最佳為0個。 In the present invention, among R 11 to R 16 , hydrogen is preferably as small as possible. Among R 11 to R 16 , the average hydrogen is preferably 1 or less, more preferably 0.5 or less, still more preferably 0.1 or less, and most preferably 0.

本發明中,R11~R16之中,縮水甘油基與甲基縮水甘油基與基:-CH2-CH(OR’)-CH2-O-R8與基:-CH2-C(CH3)(OR’)-CH2-O-R8之合計,較佳為平均3個以上,更佳為式(1)及(2)時,為3.8個以上,式(3)時,為5.8個以上,最佳為式(1)及(2)時,為4個以上,式(3)時為6個以上。 In the present invention, among R 11 to R 16 , a glycidyl group and a methyl glycidyl group are bonded to a group: -CH 2 -CH(OR')-CH 2 -OR 8 and a group: -CH 2 -C (CH 3 The total of (OR')-CH 2 -OR 8 is preferably 3 or more on average, more preferably 3.8 or more in the case of the formulas (1) and (2), and 5.8 or more in the case of the formula (3). When it is the best formula (1) and (2), it is four or more, and when it is formula (3), it is six or more.

縮水甘油基及甲基縮水甘油基之平均個數與基:-CH2-CH(OR’)-CH2-O-R8及基:-CH2-C(CH3)(OR’)-CH2-O-R8之平均個數之比例為10:90~90:10。 The average number of glycidyl groups and methyl glycidyl groups and groups: -CH 2 -CH(OR')-CH 2 -OR 8 and groups: -CH 2 -C(CH 3 )(OR')-CH 2 The ratio of the average number of -OR 8 is 10:90~90:10.

存在於基:-CH2-CH(OR’)-CH2-O-R8中之R’之中,氫較佳為平均0.7個以下,更佳為0.5個以下,更佳為0.3個以下,最佳為0個。 The hydrogen present in the group: -CH 2 -CH(OR')-CH 2 -OR 8 is preferably 0.7 or less, more preferably 0.5 or less, still more preferably 0.3 or less, most preferably Good for 0.

酯化環氧樹脂中,縮水甘油基及甲基縮水甘油基之數,及(甲基)丙烯醯基之數可藉由HPLC計算。具體而言,藉由HPLC可得到與各環氧基之數及各(甲基)丙烯醯基之數對應的波峰,由各自之波峰面積可算出各個數之存在比例。可求得酯化環氧樹脂中,縮水甘油基、甲基縮水甘油基、含有(甲基)丙烯醯基之基:-CH2-CH(OR’)-CH2-O-R8及基:-CH2-C(CH3)(OR’)-CH2-O-R8之個數。又,酯化環氧樹脂為混合物時,縮水甘油基及甲基縮水甘油基之數、及(甲基)丙烯醯基之數係以混合物的平均值計算。例如以一般式(1)及一般式(2)表示時,酯化環氧樹脂之混合物係包含後述一般式(4)及一般式(5)表示之環氧樹脂之混合物及彼等之環氧基之一部份成為(甲基)丙烯醯基的樹脂,而以一般式(3)表示之部分酯化環氧樹脂,有時包含後述一般式(6)表示之環氧樹脂之混合物及彼等之環氧基之一部份成為(甲基)丙烯醯基之樹脂的情形。 In the esterified epoxy resin, the number of glycidyl groups and methyl glycidyl groups, and the number of (meth)acrylonitrile groups can be calculated by HPLC. Specifically, peaks corresponding to the number of each epoxy group and the number of each (meth)acryl fluorenyl group can be obtained by HPLC, and the ratio of the respective numbers can be calculated from the respective peak areas. In the esterified epoxy resin, a glycidyl group, a methyl glycidyl group, a (meth)acryloyl group-containing group: -CH 2 -CH(OR')-CH 2 -OR 8 and a group:- The number of CH 2 -C(CH 3 )(OR')-CH 2 -OR 8 . Further, when the esterified epoxy resin is a mixture, the number of glycidyl groups and methyl glycidyl groups and the number of (meth)acrylonitrile groups are calculated as the average value of the mixture. For example, when expressed by the general formula (1) and the general formula (2), the mixture of the esterified epoxy resins is a mixture of the epoxy resins represented by the general formula (4) and the general formula (5) described later and their epoxy resins. a part of the base is a (meth)acrylonitrile-based resin, and a partially esterified epoxy resin represented by the general formula (3) sometimes contains a mixture of the epoxy resin represented by the general formula (6) described later and The case where a part of the epoxy group is a (meth)acrylonitrile-based resin.

一般式(1)中之X之鍵結位置,較佳為4,4’-位,即具有雙酚型環氧樹脂骨架者。又,一般式(2)表示之化合物中之萘環的鍵結位置,較佳為1,6-鍵結。 The bonding position of X in the general formula (1) is preferably 4, 4'-position, that is, a bisphenol type epoxy resin skeleton. Further, the bonding position of the naphthalene ring in the compound represented by the general formula (2) is preferably 1,6-bonded.

酯化環氧樹脂中,縮水甘油基及甲基縮水甘油基與丙烯醯基及甲基丙烯醯基之比例,可藉由HPLC及環氧當量求得。具體而言,由僅增加原料之環氧樹脂之環氧當量被酯化的量,藉由測定酯化環氧樹脂之環氧當量,可算出某種程度被酯化。又,藉由HPLC之各波峰之質量分析(LC-MS),可求得各成分之分子量及存在比例,每成 分之環氧基及丙烯醯基之比例。 In the esterified epoxy resin, the ratio of the glycidyl group and the methyl glycidyl group to the acrylonitrile group and the methacrylic acid group can be determined by HPLC and epoxy equivalent. Specifically, the amount of esterification of the epoxy equivalent of the epoxy resin which only increases the raw material can be calculated to be esterified to some extent by measuring the epoxy equivalent of the esterified epoxy resin. Moreover, by mass spectrometry (LC-MS) of each peak of HPLC, the molecular weight and the ratio of each component can be obtained. The ratio of epoxy groups to acryl groups.

本發明之酯化環氧樹脂之數平均分子量,較佳為500~10,000,更佳為800~5,000。又,酯化環氧樹脂在25℃下的黏度,較佳為1,000~600,000mPa.s,更佳為1,000~100,000mPa.s,最佳為1,000~50,000mPa.s。此範圍內時,可填充比以往更多的硬化劑或粉體。又,本發明中,黏度係使用E型黏度計測定的值。 The number average molecular weight of the esterified epoxy resin of the present invention is preferably from 500 to 10,000, more preferably from 800 to 5,000. Moreover, the viscosity of the esterified epoxy resin at 25 ° C is preferably from 1,000 to 600,000 mPa. s, more preferably 1,000 to 100,000 mPa. s, the best is 1,000~50,000mPa. s. When it is within this range, it can be filled with more hardener or powder than ever before. Further, in the present invention, the viscosity is a value measured by an E-type viscometer.

一般式(1)表示之本發明之酯化環氧樹脂,較佳為例如 (式中,R為(甲基)丙烯醯基、Me或Et等) 及/或 ,此外也可含有其六甲基丙烯酸酯化物、八甲基丙烯酸酯化物或二聚物或三聚物等多聚物。 The esterified epoxy resin of the present invention represented by the general formula (1) is preferably, for example, (wherein R is (meth)acryloyl group, Me or Et, etc.) And/or Further, a polymer such as a hexamethacrylate, an octa methacrylate or a dimer or a trimer may be contained.

本發明係以一般式(1a)~(3a)〔式中,R11、R12、R13、R14、R15及R16各自彼此獨立為氫、縮水甘油基、甲基縮水甘油基、(甲基)丙烯醯基、或基:-CH2-CH(OR’)-CH2-O-R8或基:-CH2-C(CH3)(OR’)-CH2-O-R8(式中,R’係氫或(甲基)丙烯醯基,R8為(甲基)丙烯醯基)以外,與一般式(1)~(3)中相同〕表示之樹脂及有時由其多聚物所構成之酯化環氧樹脂。 In the present invention, the general formulae (1a) to (3a) are used, wherein R 11 , R 12 , R 13 , R 14 , R 15 and R 16 are each independently hydrogen, glycidyl, methyl glycidyl, (Meth)acryloyl group, or a group: -CH 2 -CH(OR')-CH 2 -OR 8 or a group: -CH 2 -C(CH 3 )(OR')-CH 2 -OR 8 (formula In the case where R' is a hydrogen or a (meth) acrylonitrile group, and R 8 is a (meth) acryl fluorenyl group, the resin represented by the same formula as in the general formulae (1) to (3) and sometimes An esterified epoxy resin composed of a polymer.

本發明之酯化環氧樹脂之製造方法,其係含有下述步驟(1A)~(1C):(1A)使分子中具有2以上之環氧基之多官能環氧化合物,在金屬觸媒之存在下,與分子中具有2以上之羥基的聚羥基化合物反應,得到多官能環氧化合物之環氧開環物的步驟,(1B)將步驟(1A)所得之多官能環氧化合物之環氧開環物之羥基進行環氧化得到環氧樹脂的步驟,(1C)使步驟(1B)所得之環氧樹脂與(甲基)丙烯酸酐反應的步驟。 The method for producing an esterified epoxy resin according to the present invention comprises the following steps (1A) to (1C): (1A) a polyfunctional epoxy compound having 2 or more epoxy groups in a molecule, in a metal catalyst In the presence of a polyhydroxy compound having 2 or more hydroxyl groups in the molecule, a step of obtaining an epoxy ring-opening of the polyfunctional epoxy compound, and (1B) a ring of the polyfunctional epoxy compound obtained in the step (1A) The step of epoxidizing the hydroxyl group of the oxygen ring-opening to obtain an epoxy resin, and (1C) the step of reacting the epoxy resin obtained in the step (1B) with (meth)acrylic anhydride.

<步驟(1A)> <Step (1A)>

步驟(1A)中,原料化合物、即分子中具有2以上之環氧基的多官能環氧化合物係藉由環氧基之開環形成羥基, 同時形成來自聚羥基化合物的羥基。多官能環氧化合物之開環物係指多官能環氧化合物之環氧基全部開環後的化合物。 In the step (1A), the starting compound, that is, the polyfunctional epoxy compound having 2 or more epoxy groups in the molecule, forms a hydroxyl group by ring opening of an epoxy group. At the same time, a hydroxyl group derived from a polyhydroxy compound is formed. The ring-opening of the polyfunctional epoxy compound means a compound in which the epoxy groups of the polyfunctional epoxy compound are all ring-opened.

多官能環氧化合物只要是1分子中具有2以上之環氧基的環氧化合物時,即無特別限定。多官能環氧化合物例如有以下的化合物。 The polyfunctional epoxy compound is not particularly limited as long as it is an epoxy compound having 2 or more epoxy groups in one molecule. The polyfunctional epoxy compound is, for example, the following compound.

多官能環氧化合物例如有乙二醇、二乙二醇、三乙二醇、丙二醇、二丙二醇、三丙二醇等之聚烷二醇類、二羥甲基丙烷、三羥甲基丙烷、螺環乙二醇(spiroglycol)、甘油等之多元醇類與環氧氯丙烷(Epichlorohydrin)反應所得之脂肪族多價縮水甘油基醚化合物。 The polyfunctional epoxy compound is, for example, a polyalkylene glycol such as ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, dipropylene glycol or tripropylene glycol, dimethylolpropane, trimethylolpropane or a spiro ring. An aliphatic polyvalent glycidyl ether compound obtained by reacting a polyhydric alcohol such as spiroglycol or glycerin with epichlorohydrin.

多官能環氧化合物例如有雙酚A、雙酚S、雙酚F、雙酚AD等之芳香族二醇類及彼等進行乙二醇、丙二醇、烷二醇改質後的二醇類與環氧氯丙烷反應所得之芳香族多價縮水甘油基醚化合物。 Examples of the polyfunctional epoxy compound include aromatic diols such as bisphenol A, bisphenol S, bisphenol F, and bisphenol AD, and glycols modified with ethylene glycol, propylene glycol, and alkanediol. An aromatic polyvalent glycidyl ether compound obtained by the reaction of epichlorohydrin.

多官能環氧化合物例如有己二酸、依康酸等之芳香族二羧酸與環氧氯丙烷反應所得之脂肪族多價縮水甘油基酯化合物、間苯二甲酸、對苯二甲酸、苯均四酸等之芳香族二羧酸與環氧氯丙烷反應所得之芳香族多價縮水甘油基酯化合物。 The polyfunctional epoxy compound is, for example, an aliphatic polyvalent glycidyl ester compound obtained by reacting an aromatic dicarboxylic acid such as adipic acid or isaconic acid with epichlorohydrin, isophthalic acid, terephthalic acid or benzene. An aromatic polyvalent glycidyl ester compound obtained by reacting an aromatic dicarboxylic acid such as tetraacid with epichlorohydrin.

多官能環氧化合物例如有二胺基二苯基甲烷、苯胺、間苯二甲胺等之芳香族胺與環氧氯丙烷反應所得之芳香族多價縮水甘油基胺化合物。 The polyfunctional epoxy compound is, for example, an aromatic polyvalent glycidylamine compound obtained by reacting an aromatic amine such as diaminodiphenylmethane, aniline or m-xylylenediamine with epichlorohydrin.

多官能環氧化合物例如有乙內醯(Hydantoin) 及其衍生物與環氧氯丙烷反應所得之乙內醯型多價縮水甘油基化合物。 Polyfunctional epoxy compounds such as Hydantoin And an indole-type polyvalent glycidyl compound obtained by reacting the derivative with epichlorohydrin.

多官能環氧化合物例如有酚或甲酚與甲醛所衍生之酚樹脂、酚醛樹脂與環氧氯丙烷反應所得之酚、酚醛型多價縮水甘油基醚化合物。 The polyfunctional epoxy compound is, for example, a phenol resin derived from phenol or cresol and formaldehyde, a phenol obtained by reacting a phenol resin with epichlorohydrin, and a phenol type polyvalent glycidyl ether compound.

本發明中,多官能環氧化合物例如有以下述 一般式(7a): 一般式(8a): 及一般式(9a): 〔式中,X及R21係如前述〕表示之環氧化合物較佳。 In the present invention, the polyfunctional epoxy compound is, for example, the following general formula (7a): General formula (8a): And general formula (9a): The epoxy compound represented by the formula (wherein X and R 21 are as described above) is preferred.

本發明之較佳的多官能環氧化合物,即一般式(7a)~一般式(9a)表示之環氧化合物,例如有市售品,例如EPICLON 850(大日本油墨公司製)、epikote 828EL、epikote1004(以上均為Japan Epoxy Resin公司製)等之雙酚A型環氧樹脂、epikote806、epikote 4004(以上均為Japan Epoxy Resin公司製)等之雙酚F型環氧樹脂、EPICLON HP4032、EPICLON EXA-4700(以上均為大日本油墨公司製)等之萘型環氧樹脂、VG-3101(三井石油化學公司製)等之3官能環氧樹脂。 The preferred polyfunctional epoxy compound of the present invention, that is, the epoxy compound represented by the general formula (7a) to the general formula (9a), for example, a commercially available product such as EPICLON 850 (manufactured by Dainippon Ink Co., Ltd.), epikote 828EL, Bisphenol A type epoxy resin such as epikote 1004 (all of which is manufactured by Japan Epoxy Resin Co., Ltd.), epicote 806, and epikote 4004 (all of which are manufactured by Japan Epoxy Resin Co., Ltd.), EPICLON HP4032, EPICLON EXA A tetrafunctional epoxy resin such as a naphthalene type epoxy resin such as -4700 (all of which is manufactured by Dainippon Ink Co., Ltd.) or VG-3101 (manufactured by Mitsui Petrochemical Co., Ltd.).

本發明中,分子中具有2以上之羥基的聚羥基化合物,只要是分子中含有2個以上之羥基的化合物時,即無特別限定。聚羥基化合物之具體例,例如有以下的化合物。 In the present invention, the polyhydroxy compound having two or more hydroxyl groups in the molecule is not particularly limited as long as it is a compound having two or more hydroxyl groups in the molecule. Specific examples of the polyhydroxy compound include, for example, the following compounds.

分子中具有2個羥基的化合物,例如有乙二醇、二乙二醇、三乙二醇、丙二醇、二丙二醇、新戊二醇、1,4-丁二醇、及1,6-己二醇等之單烷二醇及聚烷二醇;鄰苯二酚、1,2-二羥基萘、2,3-二羥基萘、1,2-二羥基蒽醌(anthraquinone)及2,3-二羥基喹喔啉等之2價芳香族羥基化合物;苯-1,4-二甲醇、苯-1,3-二甲醇、苯-1,4-二乙醇等之芳香族醇;4-羥基甲基酚、3-羥基甲基酚、4-羥基甲基酚及3-羥基乙基酚等之羥基烷基酚。 a compound having two hydroxyl groups in the molecule, such as ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, dipropylene glycol, neopentyl glycol, 1,4-butanediol, and 1,6-hexane Monoalkanediols such as alcohols and polyalkylene glycols; catechol, 1,2-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 1,2-dihydroxypurine (anthraquinone) and 2,3- a divalent aromatic hydroxy compound such as dihydroxyquinoxaline; an aromatic alcohol such as benzene-1,4-dimethanol, benzene-1,3-dimethanol or benzene-1,4-diethanol; 4-hydroxymethyl A hydroxyalkylphenol such as a phenol, a 3-hydroxymethylphenol, a 4-hydroxymethylphenol or a 3-hydroxyethylphenol.

分子中具有3個羥基的化合物,例如有甘油、三羥甲基丙烷、2-甲基-2-羥基甲基-1,3-丙二醇、2,4-二羥基-3-羥基甲基戊烷、1,2,6-己三醇及1,1,1-三(羥基甲基)丙烷等之3元醇;苯三酚(pyrogallol)、3,4,5-三羥基甲苯、1,2,4-三羥基蒽醌、没食子酸(gallic acid)、及没食子酸甲酯、没食子酸丙酯及没食子酸辛酯等之没食子酸酯化合物等之3價芳香族聚羥基化合物。 a compound having three hydroxyl groups in the molecule, such as glycerin, trimethylolpropane, 2-methyl-2-hydroxymethyl-1,3-propanediol, 2,4-dihydroxy-3-hydroxymethylpentane , 1,2,6-hexanetriol and 1,1,1-tris(hydroxymethyl)propane, etc.; 3-pyrrolol; pyrogallol, 3,4,5-trihydroxytoluene, 1,2 a trivalent aromatic polyhydroxy compound such as a 4-trihydroxyindole, a gallic acid, or a gallic acid ester compound such as methyl gallate, propyl gallate or octyl gallate.

分子中具有4個以上之羥基的化合物,例如有季戊四醇、二甘油、四羥甲基甲烷、烷基糖苷(alkylglycoside)(甲基糖苷、乙基糖苷等)。又,2,3,4,4’-四羥基二苯甲酮、鞣花酸(ellagic acid)、六羥基苯、單寧酸及兒茶酚或苯三酚之環芳烴(calixarene)化合物等之4價以上的芳香族聚羥基化合物。 Examples of the compound having four or more hydroxyl groups in the molecule include pentaerythritol, diglycerin, tetramethylolethane, and alkylglycoside (methyl glycoside, ethyl glycoside, etc.). Further, 2,3,4,4'-tetrahydroxybenzophenone, ellagic acid, hexahydroxybenzene, tannic acid, and calixarene compounds such as catechol or benzenetriol An aromatic polyhydroxy compound having a tetravalent or higher value.

本發明中,聚羥基化合物較佳為分子中具有2~6個羥基者,更佳為分子中具有2~4個羥基者,特佳為以下述一般式(10): HO-Y-OH (10)〔式中,Y係如前述〕表示之二羥基化合物。 In the present invention, the polyhydroxy compound is preferably one having 2 to 6 hydroxyl groups in the molecule, more preferably having 2 to 4 hydroxyl groups in the molecule, and particularly preferably the following general formula (10): HO-Y-OH (10) (wherein Y is as described above) is a dihydroxy compound.

一般式(10)表示之二羥基化合物,較佳為乙二醇、丙二醇、丁烷-1,4-二醇二乙二醇、三乙二醇等之單烷二醇及聚烷二醇;苯-1,4-二甲醇、苯-1,3-二甲醇、苯-1,4-二乙醇等之芳香族醇;(2-羥基苯基)甲醇、(2-羥基苯基)-2-乙醇等之羥基烷基酚。 The dihydroxy compound represented by the general formula (10) is preferably a monoalkylene glycol such as ethylene glycol, propylene glycol, butane-1,4-diol diethylene glycol or triethylene glycol, or a polyalkylene glycol; An aromatic alcohol such as benzene-1,4-dimethanol, benzene-1,3-dimethanol or benzene-1,4-diethanol; (2-hydroxyphenyl)methanol, (2-hydroxyphenyl)-2 - a hydroxyalkylphenol such as ethanol.

金屬觸媒只要是用於環氧基之開環反應的觸媒時,均可使用,例如有由銅、鋅、鐵、鎂、銀、鈣、錫等之金屬與BF4 -、SiF6 2-或PF6 -、CF3SO2 -等之陰離子所構成之金屬觸媒。較佳為硼氟化錫(Sn(BF4)2)。 The metal catalyst can be used as long as it is a catalyst for ring-opening reaction of an epoxy group, and for example, a metal such as copper, zinc, iron, magnesium, silver, calcium, tin, or the like, and BF 4 - , SiF 6 2 - a metal catalyst composed of an anion such as PF 6 - or CF 3 SO 2 - . Preferred is tin borofluoride (Sn(BF 4 ) 2 ).

本發明中,聚羥基化合物之使用量係相對於多官能環氧化合物中之環氧基1當量,為1當量~10當量,較佳為4當量~8當量。本發明中,使用高速液體層析法(HPLC),藉由原料之多官能環氧化合物及單末端反應物之波峰消失,可確認所有的環氧基與聚羥基化合物反應,生成環氧開環物。其中,單末端反應物係指多官能環氧化合物之環氧基之一部份為未開環的反應物,例如一般式(7a)及(8a)表示之化合物係僅1個環氧基進行開環的化合物,又,一般式(9a)表示之化合物係僅1個或2個環氧基進行開環的化合物。 In the present invention, the polyhydroxy compound is used in an amount of from 1 equivalent to 10 equivalents, preferably from 4 equivalents to 8 equivalents, per equivalent of the epoxy group in the polyfunctional epoxy compound. In the present invention, by high-speed liquid chromatography (HPLC), it is confirmed that all of the epoxy groups react with the polyhydroxy compound to form an epoxy ring-opening by the disappearance of the peak of the polyfunctional epoxy compound and the single-end reactant of the starting material. Things. Wherein, the single-end reactant means that one part of the epoxy group of the polyfunctional epoxy compound is an unopened reactant, for example, the compound represented by the general formulas (7a) and (8a) is opened by only one epoxy group. The compound of the ring, in addition, the compound represented by the general formula (9a) is a compound which is opened by only one or two epoxy groups.

本發明中,金屬觸媒之使用量係相對於全反 應混合物之重量,為10~1,000ppm,較佳為20~200ppm。 In the present invention, the amount of metal catalyst used is relative to the total The weight of the mixture should be from 10 to 1,000 ppm, preferably from 20 to 200 ppm.

步驟(1A)中之反應溫度無特別限定,可為50℃~130℃,較佳為70℃~120℃。步驟(1A)中之反應可在有機溶劑之存在下或非存在下進行。可使用的有機溶劑,例如有苯及甲苯等之芳香族烴:例如環己酮等之環脂肪族酮;及出發物質之二羥基化合物。 The reaction temperature in the step (1A) is not particularly limited and may be from 50 ° C to 130 ° C, preferably from 70 ° C to 120 ° C. The reaction in the step (1A) can be carried out in the presence or absence of an organic solvent. The organic solvent which can be used, for example, an aromatic hydrocarbon such as benzene or toluene: a cycloaliphatic ketone such as cyclohexanone; and a dihydroxy compound of a starting material.

<步驟(1B)> <Step (1B)>

藉由步驟(1B),在步驟(1A)所得之多官能環氧化合物之環氧開環物之羥基被環氧化。步驟(1B)中,多官能環氧化合物之環氧開環物中之羥基之一部份或全部被環氧化。本發明中,多官能環氧化合物之環氧開環物之羥基之50%~100%被環氧化較佳,更佳為75%~100%被環氧化。 The hydroxyl group of the epoxy ring-opening of the polyfunctional epoxy compound obtained in the step (1A) is epoxidized by the step (1B). In the step (1B), part or all of the hydroxyl group in the epoxy ring-opening of the polyfunctional epoxy compound is epoxidized. In the present invention, 50% to 100% of the hydroxyl group of the epoxy ring-opening material of the polyfunctional epoxy compound is preferably epoxidized, more preferably 75% to 100% by epoxidation.

多官能環氧化合物之環氧開環物係步驟(1B)中之原料化合物,例如有前述多官能環氧化合物之環氧基全部開環的化合物。較佳為以一般式(7a)~一般式(9a)表示之環氧化合物之環氧開環物,下述一般式(7b): 表示之樹脂及有時由其多聚物所構成之環氧開環物、或一般式(8b): 表示之樹脂及有時由其多聚物所構成之環氧開環物、或以一般式(9b): 表示之樹脂及有時由其多聚物所構成之環氧開環物〔式中,X、Y及R21係如前述所定義〕。 The epoxy ring-opening compound of the polyfunctional epoxy compound is a raw material compound in the step (1B), for example, a compound in which all of the epoxy groups of the above polyfunctional epoxy compound are ring-opened. It is preferably an epoxy ring-opening compound of an epoxy compound represented by the general formula (7a) to the general formula (9a), and the following general formula (7b): An epoxy ring or a general formula (8b) which is represented by a resin and sometimes a polymer thereof: a resin represented by an epoxy ring ring sometimes composed of a polymer thereof, or a general formula (9b): The resin represented by the epoxy ring-opening compound which is sometimes composed of a polymer thereof (wherein, X, Y and R 21 are as defined above).

步驟(1B)中,環氧化可使用將公知之羥基進行環氧化的反應,例如有環氧氯丙烷法及氧化法,較佳為環氧氯丙烷法。 In the step (1B), a reaction in which a known hydroxyl group is epoxidized may be used for the epoxidation, for example, an epichlorohydrin method and an oxidation method, preferably an epichlorohydrin method.

環氧氯丙烷法係將步驟(1A)所得之多官能環氧化合物之環氧開環物,在相間移動觸媒之存在下,藉由與環氧氯丙烷或甲基環氧氯丙烷反應,使多官能環氧化合物之環氧開環物之羥基進行環氧化的方法。 The epichlorohydrin method is an epoxy ring-opening of the polyfunctional epoxy compound obtained in the step (1A), which is reacted with epichlorohydrin or methyl epichlorohydrin in the presence of a phase-shifting catalyst. A method of epoxidizing a hydroxyl group of an epoxy ring-opening of a polyfunctional epoxy compound.

環氧氯丙烷法可使環氧氯丙烷或甲基環氧氯 丙烷,以成為所要之環氧基數的莫耳數進行反應。相對於多官能環氧化合物之環氧開環物之羥基1莫耳,環氧氯丙烷或甲基環氧氯丙烷之量為0.5莫耳~20莫耳,較佳為0.5~10莫耳。 Epichlorohydrin method can be used to produce epichlorohydrin or methyl epoxide Propane is reacted in a molar number which is the desired number of epoxy groups. The amount of epichlorohydrin or methyl epichlorohydrin relative to the hydroxyl group of the epoxy ring-opening of the polyfunctional epoxy compound is from 0.5 moles to 20 moles, preferably from 0.5 to 10 moles.

相間移動觸媒例如氯化甲基三辛基銨、氯化甲基三癸基銨及氯化四甲基銨之氯化四烷基銨及如氯化苄基三甲基銨之氯化芳烷基三烷基銨等之第四級銨鹽,較佳為氯化苄基三甲基銨。相間移動觸媒之使用量係以反應體之全重量為基準,較佳為0.1~5重量%,更佳為0.5~3.0重量%。 Phase-shifting catalysts such as methyltrioctylammonium chloride, methyltriammonium chloride and tetramethylammonium chloride tetramethylammonium chloride and chlorinated aryl chloride such as benzyltrimethylammonium chloride The fourth ammonium salt of an alkyltrialkylammonium or the like is preferably benzyltrimethylammonium chloride. The amount of the phase shifting catalyst used is preferably from 0.1 to 5% by weight, more preferably from 0.5 to 3.0% by weight, based on the total weight of the reactant.

反應可在己烷及戊烷等之烴;二乙醚、t-丁基甲醚及二異丙醚等之醚;或丙酮及甲基乙基酮等之酮的溶劑存在下進行,也可使用過剩的環氧氯丙烷及甲基環氧氯丙烷,作為溶劑。反應溫度為30~90℃,較佳為40~65℃,最佳為約50~約55℃之範圍的溫度下進行反應。 The reaction may be carried out in the presence of a solvent such as a hydrocarbon such as hexane or pentane; an ether such as diethyl ether, t-butyl methyl ether or diisopropyl ether; or a ketone such as acetone or methyl ethyl ketone, or may be used in excess. Epichlorohydrin and methyl epichlorohydrin are used as solvents. The reaction is carried out at a temperature of from 30 to 90 ° C, preferably from 40 to 65 ° C, preferably from about 50 to about 55 ° C.

鹼水溶液例如有氫氧化鈣、氫氧化鉀及氫氧化鈉。使用之鹼金屬的使用量係相對於多官能環氧化合物之環氧開環物之羥基1當量,較佳為0.5~2.0當量。 The aqueous alkali solution is, for example, calcium hydroxide, potassium hydroxide or sodium hydroxide. The amount of the alkali metal to be used is 1 equivalent to the hydroxyl group of the epoxy ring-opening material of the polyfunctional epoxy compound, preferably 0.5 to 2.0 equivalents.

氧化法係含有將步驟(1A)所得之多官能環氧化合物之環氧開環物之羥基進行烯丙基化,得到聚烯丙基醚化合物的步驟;及聚烯丙基醚化合物之烯丙基或2-甲基-2-丙烯基進行氧化的步驟的方法。本發明中,羥基之烯丙基化包含使羥基成為烯丙氧基或2-甲基-2-丙烯氧基 的情形。 The oxidation method comprises a step of allylation of a hydroxyl group of an epoxy ring-opening compound of the polyfunctional epoxy compound obtained in the step (1A) to obtain a polyallyl ether compound; and an allylic group of the polyallyl ether compound A method of the step of oxidizing a base or a 2-methyl-2-propenyl group. In the present invention, allylation of a hydroxyl group includes making a hydroxyl group an allyloxy group or a 2-methyl-2-propenyloxy group. The situation.

本發明中,得到聚烯丙基化合物的步驟係藉由使多官能環氧化合物之環氧開環物與烯丙基鹵化物或2-甲基-2-丙烯基鹵化物進行反應,使多官能環氧化合物之環氧開環物之羥基轉變成烯丙氧基或2-甲基-2-丙烯氧基的步驟。具體而言,將多官能環氧化合物之環氧開環物及烯丙基鹵化物,溶解於二甲基亞碸後,添加第四級銨鹽,使反應溫度保持40℃以下,將鹼水溶液滴下,滴下終了後,在30~40℃下進行約6小時的反應。 In the present invention, the step of obtaining a polyallyl compound is carried out by reacting an epoxy ring-opening compound of a polyfunctional epoxy compound with an allyl halide or a 2-methyl-2-propenyl halide. The step of converting the hydroxyl group of the epoxy ring-opening of the functional epoxy compound to an allyloxy group or a 2-methyl-2-propenyloxy group. Specifically, after the epoxy ring-opening compound and the allyl halide of the polyfunctional epoxy compound are dissolved in dimethyl hydrazine, a fourth-order ammonium salt is added to maintain the reaction temperature at 40 ° C or lower, and the aqueous alkali solution is added. After the dropwise addition, the reaction was carried out at 30 to 40 ° C for about 6 hours.

烯丙基鹵化物及2-甲基-2-丙烯基鹵化物中之鹵化物,例如有氯及溴。烯丙基鹵化物及2-甲基-2-丙烯基鹵化物之添加量係相對於多官能環氧化合物之環氧開環物之羥基1莫耳,較佳為3~30莫耳。 Halides in allyl halides and 2-methyl-2-propenyl halides, for example, chlorine and bromine. The allyl halide and the 2-methyl-2-propenyl halide are added in an amount of 1 to 30 moles per hydroxy group of the epoxy ring-opening of the polyfunctional epoxy compound.

第四級銨鹽例如有四丁基溴化銨等之四烷基鹵化銨或四苯基氯化銨等之四芳基鹵化銨。第四級銨鹽之添加量係相對於多官能環氧化合物之環氧開環物1莫耳,較佳為0.001莫耳~0.1莫耳。 The fourth-order ammonium salt is, for example, a tetraalkylammonium halide such as tetrabutylammonium bromide or a tetraarylammonium halide such as tetraphenylammonium chloride. The fourth-stage ammonium salt is added in an amount of from 1 mol to 0.1 mol per mol of the epoxy ring-opening of the polyfunctional epoxy compound.

鹼水溶液例如有氫氧化鈣、氫氧化鉀及氫氧化鈉。使用之鹼金屬的使用量係相對於多官能環氧化合物之環氧開環物之羥基1當量,較佳為2~8當量。 The aqueous alkali solution is, for example, calcium hydroxide, potassium hydroxide or sodium hydroxide. The amount of the alkali metal to be used is 1 equivalent to the hydroxyl group of the epoxy ring-opening material of the polyfunctional epoxy compound, preferably 2 to 8 equivalents.

聚烯丙基醚化物之烯丙基或2-甲基-2-丙烯基進行氧化的步驟係將聚烯丙基醚化合物在碳酸鉀之存在下,與過氧化氫水反應的步驟。具體而言,多官能環氧化合物之環氧開環物之羥基進行烯丙基化後的聚烯丙基醚化 合物化合物,在添加甲醇、乙醇等之醇、或乙腈、苯甲腈等之腈等溶劑與碳酸鉀,攪拌下,將5~40%,較佳為30~35%之過氧化氫水滴下,滴下終了後,進行0.5~10小時,較佳為1~6小時的氧化反應。 The step of oxidizing the allyl or 2-methyl-2-propenyl group of the polyallyl etherate is a step of reacting the polyallyl ether compound with hydrogen peroxide in the presence of potassium carbonate. Specifically, the allylation of the hydroxyl group of the epoxy ring-opening compound of the polyfunctional epoxy compound is carried out by polyallyl etherification The compound is added with a solvent such as methanol or ethanol or a solvent such as nitrile such as acetonitrile or benzonitrile and potassium carbonate, and 5 to 40%, preferably 30 to 35%, of hydrogen peroxide is dropped under stirring. After the completion of the dropping, the oxidation reaction is carried out for 0.5 to 10 hours, preferably for 1 to 6 hours.

過氧化氫水之添加量係相對於使多官能環氧化合物之環氧開環物之羥基進行烯丙基化後的聚烯丙基醚化合物1莫耳,較佳為5~15莫耳。反應溫度例如45℃以下,較佳為20~40℃。 The amount of hydrogen peroxide added is 1 to 15 moles per mole of the polyallyl ether compound obtained by allylation of the hydroxyl group of the epoxy ring-opening compound of the polyfunctional epoxy compound. The reaction temperature is, for example, 45 ° C or lower, preferably 20 to 40 ° C.

步驟(1B)所得之環氧樹脂,較佳為由一般式(7b)~(9b)之以一般式(4)、一般式(5)及一般式(6)表示之化合物。 The epoxy resin obtained in the step (1B) is preferably a compound represented by the general formula (7), the general formula (5) and the general formula (6) of the general formulae (7b) to (9b).

以一般式(4)表示之環氧樹脂之成分,例如有 ,此外有時也可包含其二聚物、三聚物等之多聚物。 The composition of the epoxy resin represented by the general formula (4), for example Further, a polymer of a dimer, a trimer or the like may be sometimes included.

一般式(4)~(6)中,R1~R6之至少2個為縮水甘油基或甲基縮水甘油基。本發明中,環氧基係指包含縮水甘油基及甲基縮水甘油基兩者。其中,縮水甘油基為2,3-環氧丙基,甲基縮水甘油基為2,3-環氧基-2-甲基丙基。本發明中,R1~R6之中,3個以上為縮水甘油基或甲基縮水甘油基較佳,R1~R6之中,均為縮水甘油基或甲基縮水甘 油基更佳。 In the general formulae (4) to (6), at least two of R 1 to R 6 are a glycidyl group or a methyl glycidyl group. In the present invention, the epoxy group means both a glycidyl group and a methyl glycidyl group. Among them, the glycidyl group is 2,3-epoxypropyl group, and the methyl glycidyl group is 2,3-epoxy-2-methylpropyl group. In the present invention, among R 1 to R 6 , three or more are glycidyl groups or methyl glycidyl groups, and among R 1 to R 6 , all of them are glycidyl groups or methyl glycidyl groups.

本發明中,一般式(4)~一般式(6)中之縮水甘油基及甲基縮水甘油基之數,可藉由高速液體層析法(HPLC)計算。具體而言,藉由HPLC可得到與縮水甘油基及甲基縮水甘油基之個數對應的波峰,由各自之波峰面積可算出縮水甘油基及甲基縮水甘油基之個數之存在比例。藉此可算出包含於化合物之縮水甘油基及甲基縮水甘油基之個數。又,一般式(4)~(6)中,環氧樹脂為混合物時,縮水甘油基及甲基縮水甘油基之數係以混合物的平均值計算得到。換言之,環氧基之數係藉由HPLC之各波峰中之質量分析(LC-MS),可判斷分子量,由混合物中之各成分的存在比,算出混合物中之環氧基之平均數。例如以一般式(4)及一般式(5)表示之環氧樹脂之混合物中,可含有環氧基為3個及4個的化合物、及其多聚物,以一般式(6)表示之環氧樹脂有時也包含環氧基為3個、4個、5個及6個的化合物及其多聚物。 In the present invention, the number of the glycidyl group and the methyl glycidyl group in the general formula (4) to the general formula (6) can be calculated by high-speed liquid chromatography (HPLC). Specifically, a peak corresponding to the number of glycidyl groups and methyl glycidyl groups can be obtained by HPLC, and the ratio of the number of glycidyl groups and methyl glycidyl groups can be calculated from the respective peak areas. Thereby, the number of glycidyl groups and methyl glycidyl groups contained in the compound can be calculated. Further, in the general formulae (4) to (6), when the epoxy resin is a mixture, the number of glycidyl groups and methyl glycidyl groups is calculated as the average value of the mixture. In other words, the number of epoxy groups is determined by mass analysis (LC-MS) in each peak of HPLC, and the average number of epoxy groups in the mixture is calculated from the ratio of the components in the mixture. For example, a mixture of epoxy resins represented by the general formula (4) and the general formula (5) may contain a compound having 3 or 4 epoxy groups and a polymer thereof, and is represented by the general formula (6). The epoxy resin sometimes contains a compound having 3, 4, 5, and 6 epoxy groups and a polymer thereof.

以一般式(4)表示之化合物之X之鍵結位置,較佳為4,4’-位,即具有雙酚型環氧樹脂骨架者。又,一般式(5)表示之化合物中之萘環的鍵結位置,較佳為1,6-鍵結。 The bonding position of X of the compound represented by the general formula (4) is preferably a 4, 4'-position, that is, a bisphenol type epoxy resin skeleton. Further, the bonding position of the naphthalene ring in the compound represented by the general formula (5) is preferably 1,6-bonded.

本發明中,環氧樹脂之數平均分子量,較佳為200~5,000。本發明中,數平均分子量係藉由凝膠滲透層析法(GPC),以聚苯乙烯換算得到的數平均分子量。 In the present invention, the number average molecular weight of the epoxy resin is preferably from 200 to 5,000. In the present invention, the number average molecular weight is a number average molecular weight obtained by gel permeation chromatography (GPC) in terms of polystyrene.

本發明中,環氧樹脂之環氧當量,較佳為 100~3,000g/eq.,更佳為150~1,000g/eq.。本發明中,環氧當量係當環氧樹脂為混合物時,以混合物之平均值求得。本發明中,環氧當量可依據JISK7236:2001(與ISO3001:1999對應)求得。 In the present invention, the epoxy equivalent of the epoxy resin is preferably 100 to 3,000 g/eq., more preferably 150 to 1,000 g/eq. In the present invention, the epoxy equivalent is obtained by averaging the mixture when the epoxy resin is a mixture. In the present invention, the epoxy equivalent can be obtained in accordance with JIS K7236:2001 (corresponding to ISO3001:1999).

<步驟(1C)> <Step (1C)>

步驟(1C)中,以包含前述步驟(1A)~(1B)之製造方法所得之環氧樹脂之縮水甘油基、甲基縮水甘油基及羥基,藉由(甲基)丙烯酸酐被(甲基)丙烯醯基化。以包含步驟(1A)~(1B)之製造方法所得之環氧樹脂,較佳為以一般式(4)~一般式(6)表示之樹脂及有時由其多聚物所構成之環氧樹脂。 In the step (1C), the glycidyl group, the methyl glycidyl group and the hydroxyl group of the epoxy resin obtained by the production method of the above steps (1A) to (1B) are (meth)acrylic anhydride (methyl) ) propylene thiolation. The epoxy resin obtained by the production method comprising the steps (1A) to (1B) is preferably a resin represented by the general formula (4) to the general formula (6) and an epoxy compound sometimes composed of the polymer thereof. Resin.

(甲基)丙烯酸酐無特別限定,例如可使用市售之丙烯酸或甲基丙烯酸之酸酐。 The (meth)acrylic anhydride is not particularly limited, and for example, a commercially available acid anhydride of acrylic acid or methacrylic acid can be used.

本發明中,以包含步驟(1A)~(1B)之製造方法所得之環氧樹脂與(甲基)丙烯酸酐反應時,相對於包含步驟(1A)~(1B)之製造方法所得之環氧樹脂之環氧基1當量時,反應的(甲基)丙烯酸酐較佳為10~90當量%,更佳為20~80當量%,特佳為25~75當量%。 In the present invention, when the epoxy resin obtained by the production method comprising the steps (1A) to (1B) is reacted with (meth)acrylic anhydride, the epoxy obtained by the production method comprising the steps (1A) to (1B) is used. When the epoxy group of the resin is 1 equivalent, the amount of the (meth)acrylic anhydride to be reacted is preferably 10 to 90 equivalent %, more preferably 20 to 80 equivalent %, particularly preferably 25 to 75 equivalent %.

酯化環氧樹脂之製造方法中,縮水甘油基及甲基縮水甘油基與(甲基)丙烯酸酐之反應係以定量進行,因此所得之酯化環氧樹脂之酯化率也可藉由環氧當量推測。 In the method for producing an esterified epoxy resin, the reaction between the glycidyl group and the methyl glycidyl group and the (meth)acrylic anhydride is carried out quantitatively, so that the esterification ratio of the obtained esterified epoxy resin can also be obtained by a ring. Oxygen equivalent is estimated.

相對於包含步驟(1A)~(1B)之製造方法所得之環氧樹脂之環氧基1當量時,使(甲基)丙烯酸酐在上述範 圍內反應時,可得到黏度低,液安定性高的酯化環氧樹脂。 The (meth)acrylic anhydride is in the above-mentioned range with respect to the epoxy group of the epoxy resin obtained by the manufacturing method of the steps (1A) to (1B). In the inner reaction, an esterified epoxy resin having low viscosity and high liquid stability can be obtained.

上述反應可在相間移動觸媒或鹼性觸媒之存在下進行。 The above reaction can be carried out in the presence of a phase shifting catalyst or a basic catalyst.

相間移動觸媒可由前述觸媒中選擇,較佳為氯化苄基三甲基銨。相間移動觸媒之使用量,以反應體之全重量為基準,較佳為0.001~5重量%,更佳為0.001~2.0重量%。 The phase shifting catalyst can be selected from the foregoing catalysts, preferably benzyltrimethylammonium chloride. The amount of the phase-shifting catalyst used is preferably 0.001 to 5% by weight, and more preferably 0.001 to 2.0% by weight based on the total weight of the reactant.

鹼性觸媒較佳為3價之有機磷化合物及/或胺化合物。鹼性觸媒之鹼性原子為磷及/或氮。 The basic catalyst is preferably a trivalent organic phosphorus compound and/or an amine compound. The basic atom of the basic catalyst is phosphorus and/or nitrogen.

又,也可使用將鹼性觸媒載持於聚合物之聚合物載持鹼性觸媒。 Further, it is also possible to use a polymer-supporting alkaline catalyst in which a basic catalyst is supported on a polymer.

3價有機磷化合物,例如有三乙基膦(PHOSPHINE)、三-n-丙基膦、三-n-丁基膦等之烷基膦類及其鹽、三苯基膦、三-m-甲苯基膦、三-(2,6-二甲氧基苯基)膦等之芳基膦類及其鹽、三苯基亞磷酸酯(phosphite)、三乙基亞磷酸酯、三(壬基苯基)亞磷酸酯等之亞磷酸三酯類及其鹽等。3價有機磷化合物的鹽,例如有三苯基膦.乙基溴化物(Bromide)、三苯基膦.丁基溴化物、三苯基膦.辛基溴化物、三苯基膦.癸基溴化物、三苯基膦.異丁基溴化物、三苯基膦.丙基氯化物、三苯基膦.戊基氯化物、三苯基膦.己基溴化物等。其中,較佳為三苯基膦。 a trivalent organic phosphorus compound, for example, an alkylphosphine such as triethylphosphine (PHOSPHINE), tri-n-propylphosphine or tri-n-butylphosphine, or a salt thereof, triphenylphosphine, tri-m-toluene Arylphosphines such as phosphines, tris-(2,6-dimethoxyphenyl)phosphines and salts thereof, phosphite, triethyl phosphite, tris(nonylbenzene) a phosphite triester such as a phosphite or a salt thereof. a salt of a trivalent organic phosphorus compound, for example, triphenylphosphine. Ethyl bromide (Bromide), triphenylphosphine. Butyl bromide, triphenylphosphine. Octyl bromide, triphenylphosphine. Mercapto bromide, triphenylphosphine. Isobutyl bromide, triphenylphosphine. Propyl chloride, triphenylphosphine. Amyl chloride, triphenylphosphine. Hexyl bromide and the like. Among them, triphenylphosphine is preferred.

胺化合物例如有二乙醇胺等之第二級胺、三乙醇胺、二甲基苄胺、三(二甲基胺基)甲基酚、三(二乙基胺基)甲基酚等之第3級胺、1,5,7-三氮雜雙環[4.4.0]癸-5- 烯(TBD)、7-甲基-1,5,7-三氮雜雙環[4.4.0]癸-5-烯(Me-TBD)、1,8-二氮雜雙環[5.4.0]十一碳(undeca)-7-烯(DBU)、6-二丁基胺基-1,8-二氮雜雙環[5.4.0]十一碳-7-烯、1,5-二氮雜雙環[4.3.0]壬-5-烯(DBN)、1,1,3,3-四甲基胍(guanidine)等之強鹼性胺及其鹽。其中,較佳為1,5,7-三氮雜雙環[4.4.0]癸-5-烯(TBD)。胺化合物之鹽,例如有氯化苄基三甲基銨、氯化苄基三乙基銨。 The amine compound is, for example, a second-stage amine such as diethanolamine, a third-grade amine such as triethanolamine, dimethylbenzylamine, tris(dimethylamino)methylphenol or tris(diethylamino)methylphenol. Amine, 1,5,7-triazabicyclo[4.4.0]癸-5- Alkene (TBD), 7-methyl-1,5,7-triazabicyclo[4.4.0]non-5-ene (Me-TBD), 1,8-diazabicyclo[5.4.0] Undeca-7-ene (DBU), 6-dibutylamino-1,8-diazabicyclo[5.4.0]undec-7-ene, 1,5-diazabicyclo [4.3.0] Strongly basic amines such as guan-5-ene (DBN), 1,1,3,3-tetramethylguanidine (guanidine) and salts thereof. Among them, preferred is 1,5,7-triazabicyclo[4.4.0]non-5-ene (TBD). The salt of the amine compound is, for example, benzyltrimethylammonium chloride or benzyltriethylammonium chloride.

載持鹼性觸媒之聚合物,無特別限定,可使用將聚苯乙烯以二乙烯基苯交聯之聚合物或丙烯酸樹脂以二乙烯基苯交聯之聚合物等。此等聚合物係不溶於藉由含有步驟(1A)~(1B)之製造方法所得之環氧樹脂與(甲基)丙烯酸酐之反應用的溶劑(例如甲基乙基酮、甲基異丁基酮、甲苯等)及原料、生成物。 The polymer carrying the basic catalyst is not particularly limited, and a polymer obtained by crosslinking a polystyrene with divinylbenzene or a polymer obtained by crosslinking an acrylic resin with divinylbenzene can be used. These polymers are insoluble in a solvent (for example, methyl ethyl ketone or methyl isobutyl amide) for the reaction of an epoxy resin obtained by the production method containing the steps (1A) to (1B) with (meth)acrylic anhydride. Base ketone, toluene, etc.) and raw materials and products.

聚合物載持之鹼性觸媒可將鹼性觸媒與不溶性聚合物進行化學鍵結,或將鹼性觸媒導入於單體後,使單體聚合後,藉由以二乙烯基苯等之交聯單體進行3次元交聯,可製造不溶於甲基乙基酮、甲基異丁基酮、甲苯等之溶劑的聚合物載持之鹼性觸媒。 The basic catalyst supported by the polymer can chemically bond the basic catalyst with the insoluble polymer, or introduce the basic catalyst into the monomer, and then polymerize the monomer, and then use divinylbenzene or the like. The cross-linking monomer is subjected to 3-dimensional cross-linking to produce a basic catalyst supported by a polymer which is insoluble in a solvent such as methyl ethyl ketone, methyl isobutyl ketone or toluene.

聚合物載持之鹼性觸媒,具體而言,例如有二苯基膦基聚苯乙烯、1,5,7-三氮雜雙環[4.4.0]癸-5-烯聚苯乙烯、N,N-(二異丙基)胺基甲基聚苯乙烯、N-(甲基聚苯乙烯)-4-(甲基胺基)吡啶等。此等聚合物載持之鹼性觸媒可單獨使用1種或併用2種以上使用。 The basic catalyst supported by the polymer, specifically, for example, diphenylphosphinopolystyrene, 1,5,7-triazabicyclo[4.4.0]non-5-ene polystyrene, N , N-(diisopropyl)aminomethylpolystyrene, N-(methylpolystyrene)-4-(methylamino)pyridine, and the like. The basic catalysts to be supported by these polymers may be used singly or in combination of two or more.

聚合物載持之鹼性觸媒可使用市售者。市售 之聚合物載持之鹼性觸媒,例如有PS-PPh3(二苯基膦基聚苯乙烯、biotage公司製)、PS-TBD(1,5,7-三氮雜雙環[4.4.0]癸-5-烯聚苯乙烯、biotage公司製)。 The alkaline catalyst supported by the polymer can be used by a commercially available person. A commercially available polymer-supported alkaline catalyst, for example, PS-PPh 3 (diphenylphosphinopolystyrene, manufactured by Biotage Co., Ltd.), PS-TBD (1,5,7-triazabicyclo[4.4 .0] 癸-5-ene polystyrene, manufactured by Biotage Co., Ltd.).

聚合物載持之鹼性觸媒之使用比例係相對於包含步驟(1A)~(1B)之製造方法所得之環氧樹脂之環氧基1當量時,聚合物載持之鹼性觸媒較佳為0.5~10.0毫當量,更佳為1.0~5.0毫當量。聚合物載持之鹼性觸媒之使用比例在上述範圍內時,從反應率、反應時間及觸媒成本的觀點較佳。 When the ratio of the basic catalyst supported by the polymer is 1 equivalent to the epoxy group of the epoxy resin obtained by the production method of the steps (1A) to (1B), the alkaline catalyst supported by the polymer is more Preferably, it is 0.5 to 10.0 milliequivalent, more preferably 1.0 to 5.0 milliequivalent. When the ratio of use of the basic catalyst supported by the polymer is within the above range, it is preferable from the viewpoints of the reaction rate, the reaction time, and the catalyst cost.

本發明之製造方法中,藉由包含步驟(1A)~(1B)之製造方法所得之環氧樹脂與(甲基)丙烯酸酐之反應步驟中之溫度,較佳為60~130℃,更佳為80~130℃,更佳為90~120℃。 In the production method of the present invention, the temperature in the reaction step of the epoxy resin and (meth)acrylic anhydride obtained by the production method comprising the steps (1A) to (1B) is preferably 60 to 130 ° C, more preferably It is 80 to 130 ° C, more preferably 90 to 120 ° C.

觸媒存在下,藉由包含步驟(1A)~(1B)之製造方法所得之環氧樹脂與(甲基)丙烯酸酐之反應時,為了防止凝膠化時,反應系內及反應系上之氣相之氧濃度必須適當地保持。例如積極的將空氣吹入反應系內時,有時會引起觸媒之氧化,導致活性降低,因此必須注意。 In the presence of a catalyst, when the epoxy resin obtained by the production method of the steps (1A) to (1B) is reacted with (meth)acrylic anhydride, in order to prevent gelation, in the reaction system and on the reaction system The oxygen concentration in the gas phase must be properly maintained. For example, when air is actively blown into the reaction system, oxidation of the catalyst may occur, resulting in a decrease in activity, so care must be taken.

又,可添加聚合抑制劑(polymerization inhibitor),聚合抑制劑例如有對苯二酚、對己氧基酚、BHT(二丁基羥基甲苯)等,可單獨使用或組合2使用。添加量係相對於反應系重量,較佳為50~1000ppm。 Further, a polymerization inhibitor may be added, and examples of the polymerization inhibitor include hydroquinone, p-hexyloxyphenol, and BHT (dibutylhydroxytoluene), and they may be used singly or in combination 2. The amount added is preferably from 50 to 1000 ppm based on the weight of the reaction system.

藉由包含步驟(1A)~(1B)之製造方法所得之環氧樹脂與(甲基)丙烯酸酐之反應係因此反應所得之酯化環 氧樹脂為藉由紫外線等之活性能量線硬化,因此在遮蔽紫外線的容器內進行反應較佳。又,藉由包含步驟(1A)~(1B)之製造方法所得之環氧樹脂與(甲基)丙烯酸酐之反應,為了防止氣相聚合,可在對於環氧樹脂顯示良溶劑性的迴流溶劑存在下進行,此時,必須在反應終了後除去溶劑,因此在無溶劑下進行較佳。迴流溶劑例如有丙酮、甲基乙基酮等。 The esterification ring obtained by reacting the epoxy resin obtained by the production method of the steps (1A) to (1B) with (meth)acrylic anhydride Since the oxygen resin is hardened by an active energy ray such as ultraviolet rays, it is preferred to carry out the reaction in a container that shields ultraviolet rays. Further, by reacting the epoxy resin obtained by the production method of the steps (1A) to (1B) with (meth)acrylic anhydride, in order to prevent gas phase polymerization, a solvent-based reflux solvent can be exhibited for the epoxy resin. In the presence of the solvent, it is necessary to remove the solvent after the end of the reaction, so that it is preferably carried out without a solvent. The reflux solvent is, for example, acetone, methyl ethyl ketone or the like.

本發明之製造方法中,使用聚合物載持之鹼性觸媒時,使藉由包含步驟(1A)~(1B)之製造方法所得之環氧樹脂與(甲基)丙烯酸酐反應後,部分酯化環氧樹脂係藉由除去聚合物載持之鹼性觸媒而得。除去聚合物載持之鹼性觸媒的方法,使用過濾或離心分離較佳。 In the production method of the present invention, when a basic catalyst supported by a polymer is used, the epoxy resin obtained by the production method comprising the steps (1A) to (1B) is reacted with (meth)acrylic anhydride, and then partially The esterified epoxy resin is obtained by removing the basic catalyst supported by the polymer. The method of removing the polymer-supported alkaline catalyst is preferably carried out using filtration or centrifugation.

過濾聚合物載持之鹼性觸媒的方法,例如有使用網眼10μm之尼龍mesh NY-10HC(瑞士Sefar公司製),過濾聚合物載持之鹼性觸媒的方法。 A method of filtering a basic catalyst supported by a polymer, for example, a method of filtering a polymer-supported alkaline catalyst using a mesh mesh NY-10HC (manufactured by Sefar, Switzerland) having a mesh size of 10 μm.

將聚合物載持之鹼性觸媒進行離心分離的方法,例如有使用離心分離機,藉由固液分離,除去聚合物載持之鹼性觸媒的方法。 A method of centrifugally separating a basic catalyst supported by a polymer, for example, a method of removing a polymer-supported alkaline catalyst by solid-liquid separation using a centrifugal separator.

本發明之酯化環氧樹脂之製造方法,較佳為可用於製造一般式(1)~一般式(3)表示之樹脂及有時由其多聚物所構成之酯化環氧樹脂。換言之,使藉由前述記載之酯化環氧樹脂的製造方法,即包含步驟(2C):步驟(2A)~(2B)之步驟的製造方法所得之一般式(4)~(6)之任一表示之樹脂及有時由其多聚物所構成之環氧樹脂與(甲基) 丙烯酸酐反應,可得到一般式(1a)~一般式(3a)表示之樹脂及有時由其多聚物所構成之酯化環氧樹脂的步驟之酯化環氧樹脂的製造方法。 The method for producing the esterified epoxy resin of the present invention is preferably used for producing a resin represented by the general formula (1) to the general formula (3) and an esterified epoxy resin composed of a polymer thereof. In other words, the method of producing the esterified epoxy resin described above, that is, the general formula (4) to (6) obtained by the production method including the step (2C): steps (2A) to (2B) is employed. An epoxy resin and a (meth) resin sometimes composed of a polymer thereof The acrylic acid anhydride reaction can obtain a method for producing an esterified epoxy resin which is a step of a resin represented by the general formula (1a) to the general formula (3a) and an esterified epoxy resin which is sometimes composed of a polymer.

本發明之酯化環氧樹脂之製造方法,其係含有下述步驟(1A)、(1B)、(1C’)及(1D),(1A)使分子中具有2以上之環氧基之多官能環氧化合物,在金屬觸媒之存在下,與分子中具有2以上之羥基的聚羥基化合物反應,得到多官能環氧化合物之環氧開環物的步驟,(1B)將步驟(1A)所得之多官能環氧化合物之環氧開環物之羥基進行環氧化得到環氧樹脂的步驟,(1C’)使步驟(1B)所得之環氧樹脂與(甲基)丙烯酸反應,得到部分酯化環氧樹脂的步驟,(1D)使步驟(1C’)所得之部分酯化環氧樹脂與(甲基)丙烯醯基化劑、烷基化劑、醯基化劑、甲矽烷基化劑、或縮醛基化劑反應的步驟。 The method for producing an esterified epoxy resin of the present invention comprises the following steps (1A), (1B), (1C') and (1D), wherein (1A) has a polyepoxy group having 2 or more in the molecule; a functional epoxy compound, which is reacted with a polyhydroxy compound having 2 or more hydroxyl groups in the molecule in the presence of a metal catalyst to obtain an epoxy ring-opening of a polyfunctional epoxy compound, and (1B) a step (1A) The hydroxy group of the epoxy ring-opening compound of the obtained polyfunctional epoxy compound is subjected to epoxidation to obtain an epoxy resin, and (1C') the epoxy resin obtained in the step (1B) is reacted with (meth)acrylic acid to obtain a partial ester. a step of epoxidizing the epoxy resin, (1D) the partially esterified epoxy resin obtained in the step (1C') with a (meth) propylene sulfhydrylating agent, an alkylating agent, a thiolating agent, a formylating agent Or a step of reacting an acetalizing agent.

<步驟(1A)>及<(1B)> <Step (1A)> and <(1B)>

步驟(1A)及(1B)係如前述。 Steps (1A) and (1B) are as described above.

<步驟(1C’)> <Step (1C')>

步驟(1C’)中,藉由包含前述步驟(1A)~(1B)之製造方法所得之環氧樹脂之縮水甘油基及甲基縮水甘油基被部分(甲基)丙烯醯基化。藉由包含前述步驟(1A)~(1B)之製造方 法所得之環氧樹脂,較佳為一般式(4)~一般式(6)表示之樹脂及有時由其多聚物所構成之環氧樹脂。 In the step (1C'), the glycidyl group and the methyl glycidyl group of the epoxy resin obtained by the production method comprising the above steps (1A) to (1B) are partially (meth)acryl thiolated. By the manufacturer including the aforementioned steps (1A) to (1B) The epoxy resin obtained by the method is preferably a resin represented by the general formula (4) to the general formula (6) and an epoxy resin sometimes composed of a polymer thereof.

(甲基)丙烯酸無特別限定,例如可使用市售之丙烯酸或甲基丙烯酸。 (Meth)acrylic acid is not particularly limited, and for example, commercially available acrylic acid or methacrylic acid can be used.

本發明中,使藉由包含前述步驟(1A)~(1B)之製造方法所得之環氧樹脂與(甲基)丙烯酸反應的步驟中,使相對於藉由包含前述步驟(1A)~(1B)之製造方法所得之環氧樹脂之環氧基1當量,反應的(甲基)丙烯酸,較佳為10~90當量%,更佳為20~80當量%,更佳為30~70當量%,特佳為40~60當量%。部分酯化環氧樹脂之製造方法中,縮水甘油基及甲基縮水甘油基與(甲基)丙烯酸之反應係以定量方式進行,故所得之部分酯化環氧樹脂之酯化率可藉由環氧當量推測。 In the present invention, the step of reacting the epoxy resin obtained by the production method comprising the above steps (1A) to (1B) with (meth)acrylic acid is carried out by including the aforementioned steps (1A) to (1B). The epoxy group obtained by the production method has an epoxy group equivalent of 1 equivalent, and the reacted (meth)acrylic acid is preferably 10 to 90 equivalent %, more preferably 20 to 80 equivalent %, still more preferably 30 to 70 equivalent %. , particularly preferably 40 to 60 equivalent %. In the method for producing a partially esterified epoxy resin, the reaction of the glycidyl group and the methyl glycidyl group with the (meth)acrylic acid is carried out in a quantitative manner, so that the esterification ratio of the obtained partially esterified epoxy resin can be obtained by The epoxy equivalent is estimated.

相對於藉由包含前述步驟(1A)~(1B)之製造方法所得之環氧樹脂之環氧基1當量,使(甲基)丙烯酸在上述範圍內反應時,僅使不飽和基反應的一次聚合時,可得到暫時固定良好的樹脂特性,二次聚合時,可不產生相分離等,可得到可形成均質的聚合物的部分酯化環氧樹脂。 The reaction of only the unsaturated group is carried out when the (meth)acrylic acid is reacted in the above range with respect to 1 equivalent of the epoxy group of the epoxy resin obtained by the production method of the above steps (1A) to (1B). At the time of polymerization, a resin property which is temporarily fixed can be obtained, and in the case of secondary polymerization, phase separation or the like can be prevented, and a partially esterified epoxy resin which can form a homogeneous polymer can be obtained.

本發明中,環氧樹脂與(甲基)丙烯酸之反應,可使用前述將鹼性觸媒或鹼性觸媒載持於聚合物之聚合物載持之鹼性觸媒。 In the present invention, the reaction of the epoxy resin with (meth)acrylic acid may be carried out using the above-mentioned basic catalyst supported by a polymer supported on a basic catalyst or a basic catalyst.

本發明之製造方法中,藉由包含前述步驟(1A)~(1B)之製造方法所得之環氧樹脂與(甲基)丙烯酸之反應步驟中之溫度,較佳為60~120℃,更佳為80~120℃, 更佳為90~110℃。 In the production method of the present invention, the temperature in the reaction step of the epoxy resin and (meth)acrylic acid obtained by the production method comprising the above steps (1A) to (1B) is preferably 60 to 120 ° C, more preferably 80~120°C, More preferably 90~110 °C.

在觸媒存在下,使藉由包含前述步驟(1A)~(1B)之製造方法所得之環氧樹脂與(甲基)丙烯酸進行反應時,為了防止凝膠化時,反應系內及反應系上之氣相之氧濃度必須適當地保持。例如積極的將空氣吹入反應系內時,有時會引起觸媒之氧化,導致活性降低,因此必須注意。 In the presence of a catalyst, when the epoxy resin obtained by the production method including the above steps (1A) to (1B) is reacted with (meth)acrylic acid, in order to prevent gelation, the reaction system and the reaction system The oxygen concentration in the gas phase must be properly maintained. For example, when air is actively blown into the reaction system, oxidation of the catalyst may occur, resulting in a decrease in activity, so care must be taken.

又,可添加聚合抑制劑(polymerization inhibitor),聚合抑制劑例如有對苯二酚、對己氧基酚、BHT(二丁基羥基甲苯)等,可單獨使用或組合2使用。添加量係相對於反應系重量,較佳為50~1000ppm。 Further, a polymerization inhibitor may be added, and examples of the polymerization inhibitor include hydroquinone, p-hexyloxyphenol, and BHT (dibutylhydroxytoluene), and they may be used singly or in combination 2. The amount added is preferably from 50 to 1000 ppm based on the weight of the reaction system.

藉由包含前述步驟(1A)~(1B)之製造方法所得之環氧樹脂與(甲基)丙烯酸之反應係因此反應所得之部分酯化環氧樹脂為藉由紫外線等之活性能量線硬化,因此在遮蔽紫外線的容器內進行反應較佳。又,藉由包含步驟(1A)~(1B)之製造方法所得之環氧樹脂與(甲基)丙烯酸之反應,為了防止氣相聚合,可在對於環氧樹脂顯示良溶劑性的迴流溶劑存在下進行,此時,必須在反應終了後除去溶劑,因此在無溶劑下進行較佳。迴流溶劑例如有丙酮、甲基乙基酮等。 The partially esterified epoxy resin obtained by the reaction of the epoxy resin obtained by the above-mentioned steps (1A) to (1B) with (meth)acrylic acid is reacted by active energy rays such as ultraviolet rays. Therefore, it is preferred to carry out the reaction in a container that shields ultraviolet rays. Further, by reacting the epoxy resin obtained by the production method of the steps (1A) to (1B) with (meth)acrylic acid, in order to prevent gas phase polymerization, a reflux solvent having a good solvent property for the epoxy resin may be present. The reaction is carried out at this time, and it is necessary to remove the solvent after the completion of the reaction, so that it is preferably carried out without a solvent. The reflux solvent is, for example, acetone, methyl ethyl ketone or the like.

本發明之製造方法中,使藉由包含步驟(1A)~(1B)之製造方法所得之環氧樹脂與(甲基)丙烯酸反應後,部分酯化環氧樹脂係藉由除去聚合物載持之鹼性觸媒而得。除去聚合物載持之鹼性觸媒的方法,如前述,使用 過濾或離心分離較佳。 In the production method of the present invention, after the epoxy resin obtained by the production method comprising the steps (1A) to (1B) is reacted with (meth)acrylic acid, the partially esterified epoxy resin is removed by removing the polymer. The basic catalyst comes. a method of removing a polymer-supported alkaline catalyst, as described above, using Filtration or centrifugation is preferred.

步驟(1C’)所得之部分酯化環氧樹脂,較佳為由一般式(4)~(6)所製造之一般式(1’)、一般式(2’)及一般式(3’)表示者。一般式(1’)~一般式(3’)表示之部分酯化環氧樹脂中,R11、R12、R13、R14、R15及R16之至少2個係縮水甘油基、甲基縮水甘油基、或包含(甲基)丙烯醯基之基:-CH2-CH(OH)-CH2-O-R8或基:-CH2-C(CH3)(OH)-CH2-O-R8。換言之,本發明之一般式(1’)~一般式(3’)表示之部分酯化環氧樹脂係一般式(4)~一般式(6)表示之環氧樹脂之縮水甘油基及甲基縮水甘油基之一部份被(甲基)丙烯醯基化的環氧樹脂。 The partially esterified epoxy resin obtained in the step (1C') is preferably a general formula (1'), a general formula (2'), and a general formula (3') produced by the general formulas (4) to (6). Representation. In the partially esterified epoxy resin represented by the general formula (1') to the general formula (3'), at least two glycidyl groups of R 11 , R 12 , R 13 , R 14 , R 15 and R 16 , A glycidyl group or a group containing a (meth)acrylinyl group: -CH 2 -CH(OH)-CH 2 -OR 8 or a group: -CH 2 -C(CH 3 )(OH)-CH 2 - OR 8 . In other words, the partially esterified epoxy resin represented by the general formula (1') to the general formula (3') of the present invention is a glycidyl group and a methyl group of the epoxy resin represented by the general formula (4) to the general formula (6). One part of the glycidyl group is a (meth) propylene-based epoxy resin.

一般式(1’)~一般式(3’)中,R11~R16之中,3個以上為縮水甘油基、甲基縮水甘油基、或包含(甲基)丙烯醯基之基:-CH2-CH(OH)-CH2-O-R8或基:-CH2-C(CH3)(OH)-CH2-O-R8為佳,R11~R16之中,一般式(1’)及(2’)中,3.8個以上,一般式(3’)中,5.8個以上為縮水甘油基、甲基縮水甘油基、或包含(甲基)丙烯醯基之基:-CH2-CH(OH)-CH2-O-R8或基:-CH2-C(CH3)(OH)-CH2-O-R8更佳,R11~R16之中,所有、即一般式(1’)及(2’)中,4個以上,一般式(3’)中,6個以上為縮水甘油基、甲基縮水甘油基、或包含(甲基)丙烯醯基之-基:-CH2-CH(OH)-CH2-O-R8或基:-CH2-C(CH3)(OH)-CH2-O-R8最佳。 In the general formula (1') to the general formula (3'), among the R 11 to R 16 , three or more are a glycidyl group, a methyl glycidyl group, or a group containing a (meth)acryl fluorenyl group:- CH 2 -CH(OH)-CH 2 -OR 8 or a group: -CH 2 -C(CH 3 )(OH)-CH 2 -OR 8 is preferred, among R 11 to R 16 , the general formula (1' And (2'), 3.8 or more, of the general formula (3'), 5.8 or more are glycidyl groups, methyl glycidyl groups, or a group containing a (meth)acryl fluorenyl group: -CH 2 - CH(OH)-CH 2 -OR 8 or a group: -CH 2 -C(CH 3 )(OH)-CH 2 -OR 8 is more preferable, and among R 11 to R 16 , all, that is, the general formula (1' And (2'), 4 or more, in the general formula (3'), 6 or more are glycidyl groups, methyl glycidyl groups, or a group containing (meth)acrylinyl group: -CH 2 -CH(OH)-CH 2 -OR 8 or a group: -CH 2 -C(CH 3 )(OH)-CH 2 -OR 8 is most preferred.

一般式(1’)~一般式(3’)中之縮水甘油基及甲基 縮水甘油基之數及(甲基)丙烯醯基之數可藉由HPLC計算。具體而言,藉由HPLC可得到與各環氧基之數及各(甲基)丙烯醯基之數對應的波峰,由各自之波峰面積可算出各個數之存在比例。可求得一般式(1’)~一般式(3’)中之縮水甘油基、甲基縮水甘油基、包含(甲基)丙烯醯基之基:-CH2-CH(OH)-CH2-O-R8或基:-CH2-C(CH3)(OH)-CH2-O-R8之個數。又,一般式(1’)~(3’)表示之部分酯化環氧樹脂為混合物時,縮水甘油基及甲基縮水甘油基之數、及包含(甲基)丙烯醯基之基:-CH2-CH(OH)-CH2-O-R8或基:-CH2-C(CH3)(OH)-CH2-O-R8之數係以混合物的平均值計算。例如部分酯化環氧樹脂之混合物,有時包含環氧樹脂之混合物及彼等之環氧基之一部份成為(甲基)丙烯醯基之樹脂的情形。 The number of glycidyl groups and methyl glycidyl groups and the number of (meth)acryloyl groups in the general formula (1') to the general formula (3') can be calculated by HPLC. Specifically, peaks corresponding to the number of each epoxy group and the number of each (meth)acryl fluorenyl group can be obtained by HPLC, and the ratio of the respective numbers can be calculated from the respective peak areas. A glycidyl group, a methyl glycidyl group, and a group containing a (meth)acrylinyl group in the general formula (1') to the general formula (3'): -CH 2 -CH(OH)-CH 2 can be obtained. -OR 8 or a group: the number of -CH 2 -C(CH 3 )(OH)-CH 2 -OR 8 . Further, when the partially esterified epoxy resin represented by the general formulae (1') to (3') is a mixture, the number of glycidyl groups and methyl glycidyl groups, and the group containing a (meth)acryl fluorenyl group: - The number of CH 2 -CH(OH)-CH 2 -OR 8 or a group: -CH 2 -C(CH 3 )(OH)-CH 2 -OR 8 is calculated as the average of the mixture. For example, a mixture of partially esterified epoxy resins sometimes contains a mixture of epoxy resins and a portion of the epoxy groups of which are (meth)acrylonitrile-based resins.

部分酯化環氧樹脂中,縮水甘油基及甲基縮水甘油基與包含丙烯醯基及甲基丙烯醯基之基:-CH2-CH(OH)-CH2-O-R8及基:-CH2-C(CH3)(OH)-CH2-O-R8之比例,較佳為20:80~80:20,更佳為25:75~75:25。環氧基與(甲基)丙烯醯基之比例可藉由HPLC及環氧當量求得。具體而言,由僅增加原料之環氧樹脂之環氧當量被酯化的量,藉由測定部分酯化環氧樹脂之環氧當量,可算出某種程度被酯化。又,藉由HPLC之各波峰之質量分析(LC-MS),可求得各成分之分子量及存在比例,每成分之環氧基及丙烯醯基之比例。 In the partially esterified epoxy resin, a glycidyl group and a methyl glycidyl group and a group containing an acryloyl group and a methacryl group: -CH 2 -CH(OH)-CH 2 -OR 8 and a group: -CH The ratio of 2 -C(CH 3 )(OH)-CH 2 -OR 8 is preferably 20:80 to 80:20, more preferably 25:75 to 75:25. The ratio of epoxy groups to (meth) acrylonitrile groups can be determined by HPLC and epoxy equivalents. Specifically, the amount of esterification of the epoxy equivalent of the epoxy resin which only increases the raw material can be calculated to some extent by esterification by measuring the epoxy equivalent of the partially esterified epoxy resin. Further, by mass spectrometry (LC-MS) of each peak of HPLC, the molecular weight and the ratio of each component, and the ratio of the epoxy group and the acrylonitrile group per component can be determined.

本發明中,部分酯化環氧樹脂之數平均分子 量,較佳為500~10,000,更佳為800~5,000。 In the present invention, the number average molecular weight of the partially esterified epoxy resin The amount is preferably from 500 to 10,000, more preferably from 800 to 5,000.

一般式(1’)表示之部分酯化環氧樹脂包含例如二甲基丙烯酸酯化物, ,此外也可包含單甲基丙烯酸酯化物、三甲基丙烯酸酯化物、四甲基丙烯酸酯化物或此等之二聚物、三聚物等之多聚物。 The partially esterified epoxy resin represented by the general formula (1') contains, for example, a dimethacrylate compound, Further, a monomethacrylate, a trimethacrylate, a tetramethacrylate or a polymer of such a dimer, a trimer or the like may be contained.

<步驟(1D)> <Step (1D)>

步驟1D係使步驟(1C’)所得之部分酯化環氧樹脂與(甲基)丙烯醯基化劑、烷基化劑、醯基化劑、甲矽烷基化劑或縮醛基化劑進行反應的步驟。 Step 1D is carried out by partially esterifying the epoxy resin obtained in the step (1C') with a (meth) propylene oximation agent, an alkylating agent, a thiolating agent, a formylating agent or an acetalizing agent. The step of the reaction.

(甲基)丙烯醯基化劑例如可為(甲基)丙烯酸氯化物、(甲基)丙烯酸溴化物等之(甲基)丙烯酸鹵化物、或(甲基)丙烯酸酐、或(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯等之(甲基)丙烯酸酯。 The (meth)acrylonitrile grouping agent may be, for example, a (meth)acrylic acid chloride, a (meth)acrylic acid bromide or the like (meth)acrylic acid halide, or a (meth)acrylic anhydride, or a (meth) group. A (meth) acrylate such as methyl acrylate, ethyl (meth) acrylate or propyl (meth) acrylate.

烷基化劑例如可為烷基氯化物、烷基溴化物、烷基碘化物等之烷基鹵化物等。 The alkylating agent may be, for example, an alkyl halide such as an alkyl chloride, an alkyl bromide or an alkyl iodide.

醯基化劑例如可為醯基氯化物、醯基溴化物等之醯基鹵化物、或酸酐、或酯等。 The thiolating agent may be, for example, a mercapto halide such as mercapto chloride or mercapto bromide, or an acid anhydride or an ester.

甲矽烷基化劑例如可為三烷基甲矽烷基氯化物、三烷基甲矽烷基溴化物等之三烷基甲矽烷基鹵化物等。 The formylating agent may be, for example, a trialkylformamidine alkyl halide such as a trialkylformamidine alkyl chloride or a trialkylformamidine alkyl bromide.

縮醛基化劑例如可為三甲氧基甲基氯化物、乙氧基甲基氯化物等之烷氧基甲基鹵化物、或四氫吡喃、乙基乙烯醚等之烷基乙烯醚等。 The acetal grouping agent may, for example, be an alkoxymethyl halide such as trimethoxymethyl chloride or ethoxymethyl chloride, or an alkyl vinyl ether such as tetrahydropyran or ethyl vinyl ether. .

部分酯化環氧樹脂與(甲基)丙烯醯基化劑、烷基化劑、甲矽烷基化劑或縮醛基化劑之反應可藉由慣用方法進行。 The reaction of the partially esterified epoxy resin with a (meth) propylene sulfhydrylating agent, an alkylating agent, a formylating agent or an acetalizing agent can be carried out by a conventional method.

步驟1D中,較佳為部分酯化環氧樹脂使用一般式(1’)~(3’)表示之樹脂及有時由其多聚物所構成之部分酯化環氧樹脂,將此樹脂與(甲基)丙烯醯基化劑、烷基化劑、醯基化劑、甲矽烷基化劑或縮醛基化劑反應,得到一般式(1)~(3)表示之樹脂及有時由其多聚物所構成之酯化環氧樹脂。 In the step 1D, it is preferred that the partially esterified epoxy resin is a resin represented by the general formula (1') to (3') and a partially esterified epoxy resin sometimes composed of a polymer thereof, and the resin is Reacting a (meth) propylene thiolating agent, an alkylating agent, a thiolating agent, a formylating agent or an acetalizing agent to obtain a resin represented by the general formulas (1) to (3) and sometimes An esterified epoxy resin composed of a polymer thereof.

本發明之硬化性組成物係包含前述酯化環氧樹脂、或以前述任一方法所製造之酯化環氧樹脂之1種以上。硬化性組成物可為液晶密封劑、特別是滴下工法用的液晶密封劑。 The curable composition of the present invention contains one or more of the esterified epoxy resin or the esterified epoxy resin produced by any of the above methods. The curable composition may be a liquid crystal sealing agent, particularly a liquid crystal sealing agent for a dropping method.

本發明之硬化性組成物所含有的成分,除本發明之酯化環氧樹脂外,例如有硬化劑、聚合起始劑、填料、偶合劑。 The component contained in the curable composition of the present invention may be, for example, a curing agent, a polymerization initiator, a filler or a coupling agent in addition to the esterified epoxy resin of the present invention.

硬化劑無特別限定,硬化劑可使用公知的化合物。硬化劑例如有胺系硬化劑、有機酸二醯肼化合物、咪唑及其衍生物、雙氰胺、芳香族胺、環氧改質聚胺、及 聚胺基脲等,特佳為有機酸二醯肼之VDH(1,3-雙(醯肼基羧乙基)-5-異丙基乙內醯)、碳酸鈣(己二酸二醯肼)、UDH(7,11-十八烷二烯-1,18-二碳酸二醯肼(Carbohydrazide))及LDH(十八烷-1,18-二羧酸二醯肼)。此等之硬化劑可單獨使用或複數種使用。硬化劑之調配量係相對於環氧樹脂及部分酯化環氧樹脂100重量份,較佳為1~25重量份,更佳為5~15重量份。 The hardener is not particularly limited, and a known compound can be used as the hardener. The hardener is, for example, an amine hardener, an organic acid diterpene compound, imidazole and a derivative thereof, dicyandiamide, an aromatic amine, an epoxy modified polyamine, and Polyaminourea, etc., particularly preferably VDH (1,3-bis(decylcarboxyethyl)-5-isopropylethyl fluorene) of organic acid diterpene, calcium carbonate (dioxalate adipic acid) ), UDH (Carbohydrazide, 7,11-octadecadiene-1,18-dicarbonate) and LDH (octadecane-1,18-dicarboxylic acid dioxime). These hardeners may be used singly or in combination. The amount of the curing agent is preferably from 1 to 25 parts by weight, more preferably from 5 to 15 parts by weight, per 100 parts by weight of the epoxy resin and the partially esterified epoxy resin.

聚合起始劑係指藉由吸收光的能量而活性化,產生自由基的化合物。聚合起始劑無特別限定,聚合起始劑可使用公知的化合物。聚合起始劑例如有苯偶因類、苯乙酮類、二苯甲酮類、噻噸酮類、α-醯氧基乙酯類、苯基乙醛酸酯類、苯偶醯(benzil)類、偶氮系化合物、二苯基硫系化合物、醯基膦氧化物系化合物、苯偶因類、苯偶因醚類及蒽醌類之聚合起始劑,較佳為對液晶之溶解性低,且本身具有在照射光時,分解物不會氣體化之反應性基者。本發明之較佳的聚合起始劑,例如有EY resin KR-2(k-s-m公司製)等。聚合起始劑之調配量係相對於環氧樹脂及部分酯化環氧樹脂100重量份,較佳為0.1~5重量份,更佳為1~5重量份。 The polymerization initiator refers to a compound which is activated by absorption of energy of light to generate a radical. The polymerization initiator is not particularly limited, and a known compound can be used as the polymerization initiator. The polymerization initiators are, for example, benzoin, acetophenone, benzophenone, thioxanthone, α-methoxyethyl ester, phenylglyoxylate, benzil A polymerization initiator of a azo compound, a diphenylthio compound, a mercaptophosphine oxide compound, a benzoin, a benzoin ether, and an anthracene, preferably having solubility in a liquid crystal It is low and has a reactive base which does not gasify when the light is irradiated. The preferred polymerization initiator of the present invention is, for example, EY resin KR-2 (manufactured by k-s-m). The amount of the polymerization initiator to be added is preferably 0.1 to 5 parts by weight, more preferably 1 to 5 parts by weight, per 100 parts by weight of the epoxy resin and the partially esterified epoxy resin.

填料係為了提高硬化性組成物之黏度控制或使硬化性組成物硬化後之硬化物的強度、或藉由抑制線膨脹性提高硬化性組成物之接著信賴性等的目的而添加。填料可使用對於含有環氧樹脂之組成物所使用之公知的無機填料及有機填料。無機填料例如有碳酸鈣、碳酸鎂、硫酸 鋇、硫酸鎂、矽酸鋁、氧化鈦、氧化鋁、氧化鋅、二氧化矽、高嶺土、滑石、玻璃珠、絹雲母活性白土、膨潤土(bentonite)、氮化鋁、及氮化矽。有機填料例如有聚甲基丙烯酸甲酯、聚苯乙烯、構成此等之單體與其他單體進行共聚合所得之共聚合物、聚酯微粒子、聚胺基甲酸酯微粒子、及橡膠微粒子。本發明中,特佳為無機填料,例如二氧化矽素及滑石。填料之調配量係相對於環氧樹脂及部分酯化環氧樹脂100重量份,較佳為2~40重量份。更佳為5~30重量份。 The filler is added for the purpose of improving the viscosity control of the curable composition, the strength of the cured product after the curable composition is cured, or the subsequent reliability of the curable composition by suppressing the linear expansion property. As the filler, a known inorganic filler and an organic filler which are used for the composition containing an epoxy resin can be used. Inorganic fillers such as calcium carbonate, magnesium carbonate, sulfuric acid Bismuth, magnesium sulfate, aluminum citrate, titanium oxide, aluminum oxide, zinc oxide, cerium oxide, kaolin, talc, glass beads, sericite activated clay, bentonite, aluminum nitride, and tantalum nitride. The organic filler is, for example, polymethyl methacrylate, polystyrene, a copolymer obtained by copolymerizing these monomers with other monomers, polyester fine particles, polyurethane fine particles, and rubber fine particles. In the present invention, inorganic fillers such as cerium oxide and talc are particularly preferred. The amount of the filler is preferably from 2 to 40 parts by weight based on 100 parts by weight of the epoxy resin and the partially esterified epoxy resin. More preferably 5 to 30 parts by weight.

偶合劑係為了使與液晶顯示基板之接著性更佳而添加。偶合劑無特別限定,例如有γ-胺基丙基三甲氧基矽烷、γ-氫硫基丙基三甲氧基矽烷、γ-異氰酸酯丙基三甲氧基矽烷及3-環氧丙氧基(glycidoxy)丙基三甲氧基矽烷等。此等之矽烷偶合劑可單獨使用1種或併用2種以上使用。矽烷偶合劑之調配量係相對於環氧樹脂及部分酯化環氧樹脂100重量份,較佳為0.1~10重量份,更佳為0.5~2重量份。 The coupling agent is added in order to improve the adhesion to the liquid crystal display substrate. The coupling agent is not particularly limited, and examples thereof include γ-aminopropyltrimethoxydecane, γ-hydrothiopropyltrimethoxydecane, γ-isocyanatepropyltrimethoxydecane, and 3-glycidoxy (glycidoxy). ) propyl trimethoxy decane, and the like. These decane coupling agents may be used alone or in combination of two or more. The blending amount of the decane coupling agent is preferably 0.1 to 10 parts by weight, more preferably 0.5 to 2 parts by weight, per 100 parts by weight of the epoxy resin and the partially esterified epoxy resin.

本發明之硬化性組成物係藉由照射紫外線等之能量線、加熱,或藉由照射紫外線等之能量線後加熱而硬化。藉此,可得到本發明之硬化性組成物之硬化物。因此,使含有本發明之環氧樹脂及部分酯化環氧樹脂之硬化性組成物硬化的方法係包含對於含有本發明之環氧樹脂及部分酯化環氧樹脂之硬化性組成物,照射紫外線等之能量線或加熱或照射紫外線等之能量線後加熱的步驟。 The curable composition of the present invention is cured by irradiation with an energy ray such as ultraviolet rays, heating, or by heating an energy ray such as ultraviolet rays. Thereby, the cured product of the curable composition of the present invention can be obtained. Therefore, the method of hardening the curable composition containing the epoxy resin of the present invention and the partially esterified epoxy resin includes irradiating ultraviolet rays to the curable composition containing the epoxy resin of the present invention and the partially esterified epoxy resin. The step of heating the energy line or heating or irradiating the energy line such as ultraviolet rays.

本發明之酯化環氧樹脂係保持對液晶之溶出性極低的特性,同時黏度低,且與潛在性硬化劑混合時之液安定性優異,因此特別適合作為滴下工法中之液晶用密封劑使用。 The esterified epoxy resin of the present invention maintains the property of extremely low elution property to liquid crystals, has low viscosity, and is excellent in liquid stability when mixed with a latent curing agent, and thus is particularly suitable as a sealing agent for liquid crystals in a dropping method. use.

[實施例] [Examples]

其次,以實施例更詳細說明本發明之具體的態樣,但是本發明不限於此等實施例者。 Next, specific aspects of the invention will be described in more detail by way of examples, but the invention is not limited to the embodiments.

<環氧樹脂A之合成> <Synthesis of epoxy resin A>

環氧樹脂A(一般式(4)中,X為異亞丙基,X之鍵結位置為4,4’-位,R21均為氫,Y為伸乙基)之合成 Epoxy resin A (in general formula (4), X is an isopropylidene group, the bonding position of X is 4,4'-position, R 21 is hydrogen, and Y is a stretching ethyl group)

將乙二醇(東京化成公司製)500g、45%硼氟化錫(II)水溶液(森田化學工業公司製)1.0g置入茄形燒瓶中。將雙酚A型環氧樹脂(EXA850CRP、DIC股份公司製)340g在攪拌下,保持80℃以1小時慢慢添加,添加終了後,以80℃攪拌1小時。將反應混合物冷卻至室溫,添加氯仿1L,以水1L洗淨6次。藉由減壓餾去,除去所得之有機相的溶劑,得到無色透明黏稠物之開環物(化合物1a:雙酚A型環氧樹脂之乙二醇開環物、一般式(7b)中,X為異亞丙基,X之鍵結位置為4,4’-位,R21均為氫,Y為伸乙基的化合物)410g。又,藉由高速液體層析(HPLC),以原料之環氧樹脂及僅1個環氧基開環後之化合物之波峰消失,確 認所有環氧基被開環。 500 g of ethylene glycol (manufactured by Tokyo Chemical Industry Co., Ltd.) and 1.0 g of a 45% aqueous solution of tin (II) borohydride (manufactured by Morita Chemical Industry Co., Ltd.) were placed in an eggplant-shaped flask. 340 g of bisphenol A type epoxy resin (EXA850 CRP, manufactured by DIC Co., Ltd.) was gradually added thereto at 80 ° C for 1 hour while stirring, and after the addition was completed, the mixture was stirred at 80 ° C for 1 hour. The reaction mixture was cooled to room temperature, and 1 L of chloroform was added thereto, and the mixture was washed 6 times with 1 L of water. The solvent of the obtained organic phase is removed by distillation under reduced pressure to obtain a ring-opening product of a colorless transparent viscous material (Compound 1a: a glycol open-loop of a bisphenol A type epoxy resin, in the general formula (7b), X is an isopropylidene group, and the bonding position of X is 4,4'-position, R 21 is hydrogen, and Y is a compound of an ethyl group extending) 410 g. Further, by high-speed liquid chromatography (HPLC), the peak of the epoxy resin of the starting material and the compound after ring-opening of only one epoxy group disappeared, and it was confirmed that all the epoxy groups were ring-opened.

將化合物1a(EXA850CRP-乙二醇開環物)232g、環氧氯丙烷(和光純藥公司製)590g、苄基三甲基氯化銨(東京化成公司製)50g置入於具備機械攪拌機、溫度計、溫度調節器、凝縮器、Dean-Stark.trap及滴下漏斗之2L的三口圓底燒瓶中。其次,將混合物在70托(torr)之高真空下攪拌,同時加熱至約50~55℃,使環氧氯丙烷快速迴流。將160g之48%溶液NaOH(關東化學公司製)以2小時,徐徐添加於混合物中。隨著共沸物產生,在水/環氧氯丙烷混合物之中,使環氧氯丙烷返回反應系中,並繼續攪拌。添加終了後,以3小時繼續攪拌。其次,使反應混合物冷卻至室溫,添加氯仿1L,以1L的水洗淨6次。藉由減壓餾去,除去所得之有機相的溶劑,得到淡黃色透明黏稠物之縮水甘油基醚物(環氧樹脂A)245g。環氧當量188g/eq、黏度13,000mPa.s(3°×R14轉子(rotor)、10rpm)、以分子量測定測得[M+NH4]+=706、[M+2NH4]2+/2=619。 232 g of the compound 1a (EXA850 CRP-ethylene glycol ring-opening), 590 g of epichlorohydrin (manufactured by Wako Pure Chemical Industries, Ltd.), and 50 g of benzyltrimethylammonium chloride (manufactured by Tokyo Chemical Industry Co., Ltd.) were placed in a mechanical stirrer. Thermometer, thermostat, condenser, Dean-Stark. Trap and a 2 L three-neck round bottom flask with a funnel. Next, the mixture was stirred under a high vacuum of 70 torr while heating to about 50 to 55 ° C to rapidly reflux the epichlorohydrin. 160 g of 48% solution NaOH (manufactured by Kanto Chemical Co., Ltd.) was slowly added to the mixture for 2 hours. As the azeotrope is produced, the epichlorohydrin is returned to the reaction system in the water/epichlorohydrin mixture and stirring is continued. After the addition was completed, stirring was continued for 3 hours. Next, the reaction mixture was cooled to room temperature, and 1 L of chloroform was added thereto, and the mixture was washed 6 times with 1 L of water. The solvent of the obtained organic phase was removed by distillation under reduced pressure to obtain 245 g of glycidyl ether (epoxy resin A) as a pale yellow transparent viscous material. Epoxy equivalent 188g / eq, viscosity 13,000mPa. s (3°×R14 rotor, 10 rpm), [M+NH 4 ] + = 706, [M+2NH 4 ] 2+ /2=619 was determined by molecular weight measurement.

[實施例1]酯化環氧樹脂A之合成 [Example 1] Synthesis of esterified epoxy resin A

將環氧樹脂A(50g、0.266當量/環氧基)、甲基丙烯酸酐10.25g(0.0665當量)、苄基三甲基氯化銨493mg、BHT(12mg)置入茄形燒瓶中,在90℃下攪拌5小時。將反應混合物冷卻至40℃以下,添加氯仿150ml,以水250ml洗淨5次後,使用飽和食鹽水150ml洗淨1次。所得之有機相中添加硫酸鎂,乾燥後,以過濾等過濾固形分,將所得之有機相之溶劑以減壓餾除,得到黃色黏稠物之酯化環氧樹脂A(54g)。酯化環氧樹脂A係一般式(1a)中,X為異亞丙基,X之結合位置為4,4’-位,R21均為氫,Y為伸乙基,存在於基:-CH2-CH(OR’)-CH2-O-R8中之R’中,氫平均為0.3個以下,R11、R12、R14及R15中,氫平均幾乎為0個,且縮水甘油基之平均個數與基:-CH2-CH(OR’)-CH2-O-R8之平均個數之理論的比例為75:25。環氧當量293g/eq、黏度23,450mPa.s(3°×R14轉子、10rpm)、以分子量測定測得(A-1):[M+NH4]+=706,(A-2):[M+NH4]+=860,(A-3):[M+NH4]+=1015,(A-4): [M+NH4]+=1169,(A-5):[M+2NH4]2+/2=696,(A-6):[M+2NH4]2+/2=773。 Epoxy resin A (50 g, 0.266 equivalent/epoxy group), methacrylic anhydride 10.25 g (0.0665 equivalent), benzyltrimethylammonium chloride 493 mg, BHT (12 mg) were placed in an eggplant-shaped flask at 90 Stir at ° C for 5 hours. The reaction mixture was cooled to 40 ° C or lower, and 150 ml of chloroform was added thereto, and the mixture was washed five times with 250 ml of water, and then washed once with 150 ml of saturated brine. Magnesium sulfate was added to the obtained organic phase, and after drying, the solid fraction was filtered by filtration or the like, and the solvent of the obtained organic phase was distilled off under reduced pressure to give an esterified epoxy resin A (54 g) as a yellow viscous material. Esterified Epoxy Resin A is a general formula (1a), X is an isopropylidene group, X is bonded to the 4,4'-position, R 21 is hydrogen, Y is an exoethyl group, and is present in the group:- In R 2 in CH 2 —CH(OR′)—CH 2 —OR 8 , the hydrogen is on average 0.3 or less, and in R 11 , R 12 , R 14 and R 15 , the hydrogen is almost zero on average, and glycidol is present. The theoretical ratio of the average number of bases to the base: -CH 2 -CH(OR')-CH 2 -OR 8 is 75:25. Epoxy equivalent 293g / eq, viscosity 23,450mPa. s (3°×R14 rotor, 10 rpm), measured by molecular weight (A-1): [M+NH 4 ] + = 706, (A-2): [M+NH 4 ] + =860, (A -3): [M+NH 4 ] + = 1015, (A-4): [M+NH 4 ] + =1169, (A-5): [M+2NH 4 ] 2+ /2=696, ( A-6): [M+2NH 4 ] 2+ /2=773.

[實施例2]酯化環氧樹脂B之合成 [Example 2] Synthesis of esterified epoxy resin B

實施例1中,除了將甲基丙烯酸酐設定為13.6g(0.0886當量)外,其餘同樣操作得到黃色黏稠物之酯化環氧樹脂B(57g)。酯化環氧樹脂B係一般式(1a)中,X為異亞丙基,X之鍵結位置為4,4’-位,R21均為氫,Y為伸乙基,存在於基:-CH2-CH(OR’)-CH2-O-R8中之R’中,氫平均為0.3個以下,R11、R12、R14及R15中,氫平均幾乎為0個,且縮水甘油基之平均個數與基:-CH2-CH(OR’)-CH2-O-R8之平均個數之理論比例為65:35。環氧當量368g/eq、黏度32,100mPa.s(3°×R14轉子、10rpm),以分子量測定測得(A-1):[M+NH4]+=706,(A-2):[M+NH4]+=860,(A-3):[M+NH4]+=1015,(A-4):[M+NH4]+=1169,(A-5):[M+2NH4]2+/2=696,(A-6):[M+2NH4]2+/2=773,(A-7):[M+NH4]+=1323。 In Example 1, except that methacrylic anhydride was set to 13.6 g (0.0886 equivalent), the same procedure was carried out to obtain an esterified epoxy resin B (57 g) of a yellow viscous material. Esterified Epoxy Resin B is a general formula (1a), X is an isopropylidene group, the bonding position of X is 4,4'-position, R 21 is hydrogen, Y is an ex-ethyl group, and is present in the group: In R' of -CH 2 -CH(OR')-CH 2 -OR 8 , the hydrogen is on average 0.3 or less, and in R 11 , R 12 , R 14 and R 15 , the hydrogen is almost zero on average, and shrinks. The theoretical ratio of the average number of glycerol groups to the base: -CH 2 -CH(OR')-CH 2 -OR 8 is 65:35. Epoxy equivalent 368g / eq, viscosity 32,100mPa. s (3°×R14 rotor, 10 rpm), measured by molecular weight (A-1): [M+NH 4 ] + = 706, (A-2): [M+NH 4 ] + =860, (A -3): [M+NH 4 ] + = 1015, (A-4): [M+NH 4 ] + =1169, (A-5): [M+2NH 4 ] 2+ /2=696, ( A-6): [M+2NH 4 ] 2+ /2=773, (A-7): [M+NH 4 ] + =1323.

除了(A-1)~(A-6)外,含有 In addition to (A-1)~(A-6), contains

[實施例3]酯化環氧樹脂C之合成 [Example 3] Synthesis of esterified epoxy resin C

實施例1中,除了將甲基丙烯酸酐設定為20.5g(0.133當量)外,其餘同樣得到黃色黏稠物之酯化環氧樹脂C(63g)。酯化環氧樹脂C係一般式(1a)中,X為異亞丙基,X之鍵結位置為4,4’-位,R21均為氫,Y為伸乙基,存在於基:-CH2-CH(OR’)-CH2-O-R8中之R’中,氫平均為0.3個以下,R11、R12、R14及R15中,氫平均幾乎為0個,且縮水甘油基之平均個數與基:-CH2-CH(OR’)-CH2-O-R8之平均個數之理論比例為50:50。環氧當量528g/eq、黏度40,200mPa.s(3°×R14轉子、10rpm),以分子量測定測得(A-1):[M+NH4]+=706,(A-2):[M+NH4]+=860,(A-3):[M+NH4]+=1015,(A-4):[M+NH4]+=1169,(A-5):[M+2NH4]2+/2=696,(A-6):[M+2NH4]2+/2=773,(A-7):[M+NH4]+=1323。 In Example 1, except that methacrylic anhydride was set to 20.5 g (0.133 equivalent), an esterified epoxy resin C (63 g) of a yellow viscous material was obtained in the same manner. Esterified Epoxy Resin C is a general formula (1a), X is an isopropylidene group, the bonding position of X is 4,4'-position, R 21 is hydrogen, Y is an exoethyl group, and is present in the group: In R' of -CH 2 -CH(OR')-CH 2 -OR 8 , the hydrogen is on average 0.3 or less, and in R 11 , R 12 , R 14 and R 15 , the hydrogen is almost zero on average, and shrinks. The theoretical ratio of the average number of glycerol groups to the base: -CH 2 -CH(OR')-CH 2 -OR 8 is 50:50. Epoxy equivalent weight 528g / eq, viscosity 40,200mPa. s (3°×R14 rotor, 10 rpm), measured by molecular weight (A-1): [M+NH 4 ] + = 706, (A-2): [M+NH 4 ] + =860, (A -3): [M+NH 4 ] + = 1015, (A-4): [M+NH 4 ] + =1169, (A-5): [M+2NH 4 ] 2+ /2=696, ( A-6): [M+2NH 4 ] 2+ /2=773, (A-7): [M+NH 4 ] + =1323.

包含(A-1)~(A-7)。 Contains (A-1)~(A-7).

[比較例1]部分酯化環氧樹脂A之合成 [Comparative Example 1] Synthesis of partially esterified epoxy resin A

將環氧樹脂A(376g、2.0當量/環氧基)、甲基丙烯酸88.7g(1.0當量)、三苯基膦0.52g、BHT(90mg)進行混合,在100℃下攪拌6小時,得到部分酯化環氧樹脂A(460g)。部分酯化環氧樹脂A係一般式(1a)中,X為異亞丙基,X之鍵結位置為4,4’-位,R21均為氫,Y為伸乙基,存在於基:-CH2-CH(OR’)-CH2-O-R8中之R’中,氫理論上平均為1.0個,R11、R12、R14及R15中,氫平均幾乎 為0個,且縮水甘油基之平均個數與基:-CH2-CH(OR’)-CH2-O-R8之平均個數之理論比例為50:50。環氧當量470g/eq、黏度100,000mPa.s(3°×R7.7轉子、10rpm)。 Epoxy resin A (376 g, 2.0 equivalent/epoxy group), 88.7 g (1.0 equivalent) of methacrylic acid, 0.52 g of triphenylphosphine, and BHT (90 mg) were mixed, and stirred at 100 ° C for 6 hours to obtain a portion. Esterified epoxy resin A (460 g). Partially esterified epoxy resin A is a general formula (1a), X is an isopropylidene group, the bonding position of X is 4,4'-position, R 21 is hydrogen, Y is an ethylidene group, and is present in the group. In R-' in -CH 2 -CH(OR')-CH 2 -OR 8 , the hydrogen is theoretically 1.0 on average, and in R 11 , R 12 , R 14 and R 15 , the average hydrogen is almost 0. The theoretical ratio of the average number of glycidyl groups to the average number of bases: -CH 2 -CH(OR')-CH 2 -OR 8 is 50:50. Epoxy equivalent 470g / eq, viscosity 100,000mPa. s (3° × R7.7 rotor, 10 rpm).

[比較例2]部分酯化環氧樹脂B [Comparative Example 2] Partially esterified epoxy resin B

使用50%丙烯醯基化之部分酯化雙酚A型環氧樹脂(Daicel ucp公司製)。雙酚A型縮水甘油基環氧樹脂為2官能的環氧樹脂,但是其中1官能之環氧基以甲基丙烯酸進行甲基丙烯醯基化的樹脂。部分酯化環氧樹脂B係以下式: (式中,R為縮水甘油基或基:-CH2-CHOH-CH2-O-CO-C(CH3)=CH2,縮水甘油基之平均個數與基:基:-CH2-CHOH-CH2-O-CO-C(CH3)=CH2之平均個數之理論比例為50:50)表示。 A partially esterified bisphenol A type epoxy resin (manufactured by Daicel ucp Co., Ltd.) was used in a 50% acrylonitrile group. The bisphenol A type glycidyl epoxy resin is a bifunctional epoxy resin, but a resin in which a monofunctional epoxy group is methylated with methacrylic acid. Partially esterified epoxy resin B is of the following formula: (wherein R is a glycidyl group or a group: -CH 2 -CHOH-CH 2 -O-CO-C(CH 3 )=CH 2 , the average number of glycidyl groups and a group: group: -CH 2 - The theoretical ratio of the average number of CHOH-CH 2 -O-CO-C(CH 3 )=CH 2 is 50:50).

[試驗例1]黏度、環氧當量、分子量之測定 [Test Example 1] Measurement of viscosity, epoxy equivalent, and molecular weight

分別對於以實施例1~3及比較例1~2所得之樹脂、及環氧樹脂A,使用E型黏度計(東機產業公司製 RE105U),在25℃下測定的黏度、及藉由JISK7236:2001測定的環氧當量如表1所示。質量分析使用Waters公司製Quattro micro。 For the resins obtained in Examples 1 to 3 and Comparative Examples 1 and 2, and the epoxy resin A, an E-type viscometer (manufactured by Toki Sangyo Co., Ltd.) was used. RE105U), the viscosity measured at 25 ° C, and the epoxy equivalent measured by JIS K7236:2001 are shown in Table 1. Mass analysis was performed using a Quattro micro manufactured by Waters.

[試驗例2]Ni點之測定 [Test Example 2] Measurement of Ni point

分別對於以實施例1~5及比較例1~2所得之樹脂及環氧樹脂A,利用以下的方法測定Ni點。因液晶之相轉移溫度,即Ni點(Nematic-Isotropic point)之變化評價對液晶之溶出性。液晶之Ni點係以液晶之各成分之混合組成來決定,各調配下成為固有的值。一般而言,此等液晶中混入有雜質(其他成分),Ni點會降低已為人知,可藉由Ni點評價雜質混入的情形。 For the resins obtained in Examples 1 to 5 and Comparative Examples 1 and 2 and the epoxy resin A, the Ni dots were measured by the following methods. The dissolution property to the liquid crystal was evaluated by the phase transition temperature of the liquid crystal, that is, the change in the Nematic-Isotropic point. The Ni dot of the liquid crystal is determined by the mixed composition of the components of the liquid crystal, and is an inherent value in each blending. In general, impurities (other components) are mixed in these liquid crystals, and the Ni dots are known to be reduced, and it is possible to mix impurities by Ni.

[Ni點之測定方法] [Method for measuring Ni point]

在安瓶(ampoule)中置入各環氧樹脂0.1g,添加液晶(MLC-11900-080、Merck公司製)1g。將此瓶置入於120℃烘箱中1小時,然後室溫靜置,返回至室溫(25℃)後取出液晶部分,以0.2μm過濾器過濾,作為評價用之液晶樣品。Ni點之測定係使用示差掃描型熱量計(DSC、Perkin-Elmer公司製、PYRIS6),將評價用之液晶樣品10mg封入於鋁製樣品箱內,以昇溫速度5℃/分鐘的條件測定。測定結果如表1~2所示。 0.1 g of each epoxy resin was placed in an ampoule, and 1 g of liquid crystal (MLC-11900-080, manufactured by Merck) was added. The bottle was placed in an oven at 120 ° C for 1 hour, and then allowed to stand at room temperature. After returning to room temperature (25 ° C), the liquid crystal portion was taken out and filtered through a 0.2 μm filter to obtain a liquid crystal sample for evaluation. The measurement of the Ni point was carried out by using a differential scanning calorimeter (DSC, manufactured by Perkin-Elmer Co., Ltd., PYRIS6), and 10 mg of the liquid crystal sample for evaluation was sealed in an aluminum sample box, and the temperature was measured at a temperature elevation rate of 5 ° C /min. The measurement results are shown in Tables 1 and 2.

[試驗例3]增黏率之測定 [Test Example 3] Determination of viscosity increase rate

以AJICURE VDH(味之素finetechno股份公司製)與環氧當量與活性氫當量成為相同的方式混合各樹脂5重量份,測定在25℃下放置1週時之放置前後之黏度值的變化率。相對於部分酯化環氧樹脂A之5重量份,AJICURE VDH使用0.84重量份,相對於酯化環氧樹脂A之5重量份,AJICURE VDH使用1.25重量份,相對於酯化環氧樹脂B之5重量份,AJICURE VDH使用1.10重量份,相對於酯化環氧樹脂C之5重量份,AJICURE VDH使用0.71重量份,相對於部分酯化環氧樹脂B之5重量份,AJICURE VDH使用0.92重量份。測定結果如表1~2所示。 5 parts by weight of each resin was mixed in the same manner as the epoxy equivalent and the active hydrogen equivalent, and the rate of change of the viscosity value before and after standing at 25 ° C for one week was measured. AJICURE VDH is used in an amount of 0.84 parts by weight relative to 5 parts by weight of the partially esterified epoxy resin A, and 1.25 parts by weight is used for AJICURE VDH with respect to 5 parts by weight of the esterified epoxy resin A, relative to the esterified epoxy resin B. 5 parts by weight, AJICURE VDH is used in an amount of 1.10 parts by weight, based on 5 parts by weight of the esterified epoxy resin C, 0.71 parts by weight of AJICURE VDH, and 0.92 part by weight of AJICURE VDH with respect to 5 parts by weight of the partially esterified epoxy resin B. Share. The measurement results are shown in Tables 1 and 2.

[實施例4]酯化環氧樹脂D [Example 4] Esterified epoxy resin D

將環氧樹脂A(50g、0.266當量/環氧基)、甲基丙烯酸酐10.25g(0.0665當量)、PS-TBD(聚苯乙烯-1,5,7-三氮雜雙環[4.4.0]癸-5-烯)806mg,BHT(12mg)置入茄形燒瓶中,在100℃下攪拌5小時。過濾固形分,得到黃色黏稠物之酯化環氧樹脂D(50g)。酯化環氧樹脂D係一般式(1a)中,X為異亞丙基,X之鍵結位置為4,4’-位,R21均為氫,Y為伸乙基,存在於基:-CH2-CH(OR’)-CH2-O-R8中之R’中,氫平均為0.3個以下,R11、R12、R14及R15中,氫平均幾乎為0個,且縮水甘油基之平均個數與基:-CH2-CH(OR’)-CH2-O-R8之平均個數之理論比例為75:25。環氧當量272g/eq、黏度18,200mPa.s(3°×R14轉子、10rpm),以分子量測定測得(A-1):[M+NH4]+=706,(A-2):[M+NH4]+=860,(A-3):[M+NH4]+=1015,(A-4):[M+NH4]+=1169,(A-5):[M+2NH4]2+/2=696,(A-6):[M+2NH4]2+/2=773。 Epoxy resin A (50 g, 0.266 equivalent/epoxy group), methacrylic anhydride 10.25 g (0.0665 equivalent), PS-TBD (polystyrene-1,5,7-triazabicyclo[4.4.0]癸-5-ene) 806 mg, BHT (12 mg) was placed in an eggplant-shaped flask, and stirred at 100 ° C for 5 hours. The solid fraction was filtered to give an esterified epoxy resin D (50 g) as a yellow viscous material. Esterified epoxy resin D is a general formula (1a), X is an isopropylidene group, the bonding position of X is 4,4'-position, R 21 is hydrogen, Y is an ethylidene group, and is present in the group: In R' of -CH 2 -CH(OR')-CH 2 -OR 8 , the hydrogen is on average 0.3 or less, and in R 11 , R 12 , R 14 and R 15 , the hydrogen is almost zero on average, and shrinks. the average number of glycidyl group: -CH 2 -CH (OR ') - the average number ratio of theory CH 2 -OR 8 of 75:25. Epoxy equivalent 272g / eq, viscosity 18,200mPa. s (3°×R14 rotor, 10 rpm), measured by molecular weight (A-1): [M+NH 4 ] + = 706, (A-2): [M+NH 4 ] + =860, (A -3): [M+NH 4 ] + = 1015, (A-4): [M+NH 4 ] + =1169, (A-5): [M+2NH 4 ] 2+ /2=696, ( A-6): [M+2NH 4 ] 2+ /2=773.

包含(A-1)~(A-6)。 Contains (A-1)~(A-6).

[實施例5]酯化環氧樹脂E [Example 5] Esterified Epoxy Resin E

將環氧樹脂A(50g、0.266當量/環氧基)、甲基丙烯酸酐10.25g(0.0665當量)、PS-TPP(聚苯乙烯-三苯基膦)434mg、BHT(12mg)置入茄形燒瓶中,在100℃下攪拌7小時。過濾固形分,得到黃色黏稠物之酯化環氧樹脂E(50g)。酯化環氧樹脂E係一般式(1a)中,X為異亞丙基,X之鍵結位置為4,4’-位,R21均為氫,Y為伸乙基, 存在於基:-CH2-CH(OR’)-CH2-O-R8中之R’中,氫平均為0.3個以下,R11、R12、R14及R15中,氫平均幾乎為0個,且縮水甘油基之平均個數與基:-CH2-CH(OR’)-CH2-O-R8之平均個數之理論比例為75:25。環氧當量295g/eq、黏度19,150mPa.s(3°×R14轉子、10rpm),以分子量測定測得(A-1):[M+NH4]+=706,(A-2):[M+NH4]+=860,(A-3):[M+NH4]+=1015,(A-4):[M+NH4]+=1169,(A-5):[M+2NH4]2+/2=696,(A-6):[M+2NH4]2+/2=773。 Epoxy resin A (50 g, 0.266 equivalent/epoxy group), methacrylic anhydride 10.25 g (0.0665 equivalent), PS-TPP (polystyrene-triphenylphosphine) 434 mg, BHT (12 mg) were placed in an eggplant shape The flask was stirred at 100 ° C for 7 hours. The solid fraction was filtered to give an esterified epoxy resin E (50 g) as a yellow viscous material. Esterified Epoxy Resin E is a general formula (1a), X is an isopropylidene group, the bonding position of X is 4,4'-position, R 21 is hydrogen, Y is an ex-ethyl group, and is present in the group: In R' of -CH 2 -CH(OR')-CH 2 -OR 8 , the hydrogen is on average 0.3 or less, and in R 11 , R 12 , R 14 and R 15 , the hydrogen is almost zero on average, and shrinks. The theoretical ratio of the average number of glycerol groups to the base: -CH 2 -CH(OR')-CH 2 -OR 8 is 75:25. Epoxy equivalent 295g / eq, viscosity 19,150mPa. s (3°×R14 rotor, 10 rpm), measured by molecular weight (A-1): [M+NH 4 ] + = 706, (A-2): [M+NH 4 ] + =860, (A -3): [M+NH 4 ] + = 1015, (A-4): [M+NH 4 ] + =1169, (A-5): [M+2NH 4 ] 2+ /2=696, ( A-6): [M+2NH 4 ] 2+ /2=773.

包含(A-1)~(A-6)。 Contains (A-1)~(A-6).

實施例4及5所得之酯化環氧樹脂D及E之測定結果如表2所示。 The measurement results of the esterified epoxy resins D and E obtained in Examples 4 and 5 are shown in Table 2.

[產業上之可利用性] [Industrial availability]

本發明之酯化環氧樹脂係對於液晶維持低的溶解性、溶出性,同時使密封劑之黏度降低,且可提高密封劑之液安定性,因此可作為液晶之密封劑之調配原料使用。 The esterified epoxy resin of the present invention can be used as a preparation material for a liquid crystal sealing agent because it maintains low solubility and elution property to the liquid crystal, reduces the viscosity of the sealant, and improves the liquid stability of the sealant.

Claims (8)

一種滴下工法用的液晶密封劑,其特徵係含有以一般式(1): 表示之樹脂及有時由其多聚物所構成之酯化環氧樹脂,或以一般式(2): 表示之樹脂及有時由其多聚物所構成之酯化環氧樹脂,或以一般式(3): 表示之樹脂及有時由其多聚物所構成之酯化環氧樹脂,〔各式中,X係-O-、碳原子數1~4之伸烷基、或碳原子數2~4之亞烷基,Y係碳原子數1~4之伸烷基-碳原子數6~20之伸芳基-碳原子數1~4之伸烷基、碳原子數1~4之伸烷基-碳原子數6~20之伸芳基、或基:-R7-(O-R7)n-(式中,R7係碳原子數1~4之伸烷基,n為0或1~6之整數),各R21各自彼此獨立為氫或甲基,R11、R12、R13、R14、R15及R16各自彼此獨立為氫、縮水甘油基、甲基縮水甘油基、(甲基)丙烯醯基、烷基、醯基、甲矽烷基(silyl)、縮醛基(acetal)、或基:-CH2-CH(OR’)-CH2-O-R8或基:-CH2-C(CH3)(OR’)-CH2-O-R8(式中,R’為氫、(甲基)丙烯醯基、烷基、醯基、甲矽烷基、或縮醛基,R8為(甲基)丙烯醯基,但是存在於基:-CH2-CH(OR’)-CH2-O-R8中之R’之中,氫平均未達0.8個),存在於一般式(1)及(2)之R11、R12、R14及R15中,縮水甘油基與甲基縮水甘油基與基:-CH2-CH(OR’)-CH2-O-R8與基:-CH2-C(CH3)(OR’)-CH2-O-R8之合計平均為2個以上,縮水甘油基及甲基縮水甘油基之平均之個數與基:-CH2-CH(OR’)-CH2-O-R8及基:-CH2-C(CH3)(OR’)-CH2-O-R8之平均個數之比例為10:90~90:10,存在於一般式(3)之R11、R12、R13、R14、R15及R16 中,縮水甘油基與甲基縮水甘油基與基:-CH2-CH(OR’)-CH2-O-R8與基:-CH2-C(CH3)(OR’)-CH2-O-R8之合計平均為2個以上,縮水甘油基及甲基縮水甘油基之平均個數與基:-CH2-CH(OR’)-CH2-O-R8及基:-CH2-C(CH3)(OR’)-CH2-O-R8之平均個數之比例為10:90~90:10〕。 A liquid crystal sealing agent for a dropping method, characterized by containing the general formula (1): a resin represented by an esterified epoxy resin sometimes composed of a polymer thereof, or a general formula (2): a resin represented by an esterified epoxy resin sometimes composed of a polymer thereof, or a general formula (3): An esterified epoxy resin composed of a resin and a polymer thereof, in each formula, X-type -O-, an alkyl group having 1 to 4 carbon atoms, or a carbon number of 2 to 4 Alkylene group, Y-type alkyl group having 1 to 4 carbon atoms - aryl group having 6 to 20 carbon atoms - alkyl group having 1 to 4 carbon atoms, alkyl group having 1 to 4 carbon atoms - An extended aryl group having 6 to 20 carbon atoms or a group: -R 7 -(OR 7 ) n - (wherein R 7 is an alkylene group having 1 to 4 carbon atoms, and n is 0 or 1 to 6 Integer), each R 21 is each independently hydrogen or methyl, and R 11 , R 12 , R 13 , R 14 , R 15 and R 16 are each independently hydrogen, glycidyl, methyl glycidyl, (A Alkyl, alkyl, fluorenyl, silyl, acetal, or a group: -CH 2 -CH(OR')-CH 2 -OR 8 or a group: -CH 2 -C (CH 3) (oR ' ) - CH 2 -OR 8 ( wherein, R' is hydrogen, (meth) Bing Xixi, alkyl, acyl, alkyl methyl silicone, or an acetal group, R 8 Is a (meth) propylene fluorenyl group, but is present in the group: -CH 2 -CH(OR')-CH 2 -OR 8 in R', the hydrogen is less than 0.8 on average), and is present in the general formula (1) And (2) of R 11 , R 12 , R 14 and R 15 Oil-based and methyl glycidyl groups and groups: -CH 2 -CH(OR')-CH 2 -OR 8 and base: -CH 2 -C(CH 3 )(OR')-CH 2 -OR 8 The average number is 2 or more, the average number of glycidyl groups and methyl glycidyl groups and the group: -CH 2 -CH(OR')-CH 2 -OR 8 and the group: -CH 2 -C(CH 3 ) The ratio of the average number of (OR')-CH 2 -OR 8 is 10:90 to 90:10, which is present in R 11 , R 12 , R 13 , R 14 , R 15 and R 16 of the general formula (3). Medium, glycidyl group and methyl glycidyl group with: -CH 2 -CH(OR')-CH 2 -OR 8 and group: -CH 2 -C(CH 3 )(OR')-CH 2 -OR The total number of 8 is more than 2, the average number of glycidyl groups and methyl glycidyl groups and the group: -CH 2 -CH(OR')-CH 2 -OR 8 and the group: -CH 2 -C(CH 3 ) The ratio of the average number of (OR')-CH 2 -OR 8 is 10:90~90:10]. 一種滴下工法用的液晶密封劑,其特徵係以一般式(1a): 表示之樹脂及有時由其多聚物所構成之酯化環氧樹脂,或以一般式(2a): 表示之樹脂及有時由其多聚物所構成之酯化環氧樹脂,或以一般式(3a): 表示之樹脂及有時由其多聚物所構成之酯化環氧樹脂,〔各式中,X係-O-、碳原子數1~4之伸烷基、或碳原子數2~4之亞烷基,Y係碳原子數1~4之伸烷基-碳原子數6~20之伸芳基-碳原子數1~4之伸烷基、碳原子數1~4之伸烷基-碳原子數6~20之伸芳基、或基:-R7-(O-R7)n-(式中,R7為碳原子數1~4之伸烷基,n為0或1~6之整數),各R21各自彼此獨立為氫或甲基,R11、R12、R13、R14、R15及R16各自彼此獨立為氫、縮水甘油基、甲基縮水甘油基、(甲基)丙烯醯基、或基:-CH2-CH(OR’)-CH2-O-R8或基:-CH2-C(CH3)(OR’)-CH2-O-R8(式中,R’為氫或(甲基)丙烯醯基,R8為(甲基)丙烯醯基,存在於基:-CH2-CH(OR’)-CH2-O-R8中之R’之中,氫平均為未達0.8個),存在於一般式(1a)及(2a)中之R11、R12、R14及R15 中,縮水甘油基與甲基縮水甘油基與基:-CH2-CH(OR’)-CH2-O-R8與基:-CH2-C(CH3)(OR’)-CH2-O-R8之合計平均為2個以上,縮水甘油基及甲基縮水甘油基之平均個數與基:-CH2-CH(OR’)-CH2-O-R8及基:-CH2-C(CH3)(OR’)-CH2-O-R8之平均個數之比例為10:90~90:10,存在於一般式(3a)中之R11、R12、R13、R14、R15及R16中,縮水甘油基與甲基縮水甘油基與基:-CH2-CH(OR’)-CH2-O-R8與基:-CH2-C(CH3)(OR’)-CH2-O-R8之合計平均為2個以上,縮水甘油基及甲基縮水甘油基之平均個數與基:-CH2-CH(OR’)-CH2-O-R8及基:-CH2-C(CH3)(OR’)-CH2-O-R8之平均個數之比例為10:90~90:10〕。 A liquid crystal sealing agent for dropping method, which is characterized by the general formula (1a): a resin represented by an esterified epoxy resin sometimes composed of a polymer thereof, or a general formula (2a): a resin represented by an esterified epoxy resin sometimes composed of a polymer thereof, or a general formula (3a): An esterified epoxy resin composed of a resin and a polymer thereof, in each formula, X-type -O-, an alkyl group having 1 to 4 carbon atoms, or a carbon number of 2 to 4 Alkylene group, Y-type alkyl group having 1 to 4 carbon atoms - aryl group having 6 to 20 carbon atoms - alkyl group having 1 to 4 carbon atoms, alkyl group having 1 to 4 carbon atoms - An extended aryl group having 6 to 20 carbon atoms or a group: -R 7 -(OR 7 ) n - (wherein R 7 is an alkylene group having 1 to 4 carbon atoms, and n is 0 or 1 to 6 Integer), each R 21 is each independently hydrogen or methyl, and R 11 , R 12 , R 13 , R 14 , R 15 and R 16 are each independently hydrogen, glycidyl, methyl glycidyl, (A Acryl fluorenyl, or a group: -CH 2 -CH(OR')-CH 2 -OR 8 or a group: -CH 2 -C(CH 3 )(OR')-CH 2 -OR 8 (wherein R' is hydrogen or (meth) propylene fluorenyl group, and R 8 is a (meth) acryl fluorenyl group, which is present in R' of the group: -CH 2 -CH(OR')-CH 2 -OR 8 , Hydrogen has an average of less than 0.8), which is present in R 11 , R 12 , R 14 and R 15 in the general formulae (1a) and (2a), glycidyl and methyl glycidyl groups and groups: -CH 2 -CH (OR ') - CH 2 -OR 8 and group: -CH 2 -C (CH 3) (OR') - CH 2 -OR 8 Total average of two or more, glycidyl and methyl glycidyl groups with the average number of glycidyl: -CH 2 -CH (OR ') - CH 2 -OR 8 group, and: -CH 2 -C (CH 3) The ratio of the average number of (OR')-CH 2 -OR 8 is 10:90 to 90:10, and R 11 , R 12 , R 13 , R 14 , R 15 and R existing in the general formula (3a) In 16 , a glycidyl group and a methyl glycidyl group with a group: -CH 2 -CH(OR')-CH 2 -OR 8 and a group: -CH 2 -C(CH 3 )(OR')-CH 2 - The total number of OR 8 is 2 or more on average, and the average number of glycidyl groups and methyl glycidyl groups is related to: -CH 2 -CH(OR')-CH 2 -OR 8 and base: -CH 2 -C ( The ratio of the average number of CH 3 )(OR')-CH 2 -OR 8 is 10:90~90:10]. 一種滴下工法用的液晶密封劑之製造方法,其特徵係含有將以包含下述步驟(1A)~(1C)之製造方法所得之如申請專利範圍第2項之酯化環氧樹脂、與硬化劑進行混合的步驟,(1A)使分子中具有2以上之環氧基之多官能環氧化合物,在金屬觸媒之存在下,與分子中具有2以上之羥基的聚羥基化合物反應,得到多官能環氧化合物之環氧開環物(ring-opened form)的步驟,(1B)將步驟(1A)所得之多官能環氧化合物之環氧開環物之羥基進行環氧化得到環氧樹脂的步驟,(1C)使步驟(1B)所得之環氧樹脂與(甲基)丙烯酸酐反應的步驟。 A method for producing a liquid crystal sealing agent for a dropping method, which comprises an esterified epoxy resin obtained by the production method comprising the following steps (1A) to (1C), and a hardened epoxy resin according to item 2 of the patent application scope, and hardening a step of mixing the agent, (1A) a polyfunctional epoxy compound having 2 or more epoxy groups in the molecule, and reacting with a polyhydroxy compound having 2 or more hydroxyl groups in the molecule in the presence of a metal catalyst to obtain a plurality of a step of a ring-opened form of a functional epoxy compound, (1B) epoxidizing a hydroxyl group of an epoxy ring-opening compound of the polyfunctional epoxy compound obtained in the step (1A) to obtain an epoxy resin Step, (1C) a step of reacting the epoxy resin obtained in the step (1B) with (meth)acrylic anhydride. 一種滴下工法用的液晶密封劑之製造方法,其特徵係含有將以包含使以一般式(4): 表示之樹脂及有時由其多聚物所構成之環氧樹脂,或以一般式(5): 表示之樹脂及有時由其多聚物所構成之環氧樹脂,或以一般式(6): 表示之樹脂及有時由其多聚物所構成之環氧樹脂〔各式中, X為-O-、碳原子數1~4之伸烷基、或碳原子數2~4之亞烷基,Y為碳原子數1~4之伸烷基-碳原子數6~20之伸芳基-碳原子數1~4之伸烷基、碳原子數1~4之伸烷基-碳原子數6~20之伸芳基、或基:-R7-(O-R7)n-(式中,R7為碳原子數1~4之伸烷基,n為0或1~6之整數),各R21各自彼此獨立為氫或甲基,R1、R2、R3、R4、R5及R6各自彼此獨立為氫、縮水甘油基、或甲基縮水甘油基,但是存在於一般式(4)及(5)中之R1、R2、R4及R5之至少2個為縮水甘油基或甲基縮水甘油基,存在於一般式(6)中之R1、R2、R3、R4、R5及R6之至少2個為縮水甘油基或甲基縮水甘油基〕與(甲基)丙烯酸酐反應之製造方法所得之如申請專利範圍第2項之酯化環氧樹脂、與硬化劑進行混合的步驟。 A method for producing a liquid crystal sealing agent for a dropping method, characterized in that it is contained to contain a general formula (4): a resin represented by an epoxy resin sometimes composed of a polymer thereof, or a general formula (5): a resin represented by an epoxy resin sometimes composed of a polymer thereof, or a general formula (6): The resin represented by the resin and the epoxy resin sometimes composed of the polymer thereof (wherein X is -O-, an alkylene group having 1 to 4 carbon atoms, or an alkylene group having 2 to 4 carbon atoms) , Y is an alkyl group having 1 to 4 carbon atoms - an exoaryl group having 6 to 20 carbon atoms - an alkyl group having 1 to 4 carbon atoms, and an alkyl group having 1 to 4 carbon atoms 6 to 20 of an extended aryl group, or a group: -R 7 -(OR 7 ) n - (wherein, R 7 is an alkylene group having 1 to 4 carbon atoms, and n is an integer of 0 or 1 to 6), Each of R 21 is independently hydrogen or methyl, and R 1 , R 2 , R 3 , R 4 , R 5 and R 6 are each independently hydrogen, glycidyl, or methyl glycidyl, but are present in general. At least two of R 1 , R 2 , R 4 and R 5 in the formulae (4) and (5) are glycidyl groups or methyl glycidyl groups, and R 1 and R 2 are present in the general formula (6). Esterification as in the second aspect of the patent application, which is obtained by a method for producing a reaction of (meth) at least two of R 3 , R 4 , R 5 and R 6 with a glycidyl group or a methyl glycidyl group. An epoxy resin and a step of mixing with a hardener. 如申請專利範圍第4項之滴下工法用的液晶密封劑之製造方法,其係以包含下述步驟(2A)~(2B)的方法製造以一般式(4)~一般式(6)之任一表示之樹脂及有時由其多聚物所構成之環氧樹脂,(2A)使以一般式(7a): 或一般式(8a): 或一般式(9a): 〔式中,X及R21係如申請專利範圍第4項所定義〕表示之環氧化合物,在金屬觸媒之存在下,與下述一般式(10): HO-Y-OH (10)(式中,Y係如申請專利範圍第4項所定義)表示之二羥基化合物進行反應,得到以一般式(7b): 表示之樹脂及有時由其多聚物所構成之環氧開環物、或以一般式(8b): 表示之樹脂及有時由其多聚物所構成之環氧開環物、或以一般式(9b): 表示之樹脂及有時由其多聚物所構成之環氧開環物〔各式中,X、Y及R21係如上述所定義〕的步驟,(2B)將步驟(2A)所得之以一般式(7b)~一般式(9b)之任一表示之樹脂及有時由其多聚物所構成之環氧開環物之羥基,進行環氧化的步驟。 A method for producing a liquid crystal sealing agent for a dropping method according to the fourth aspect of the patent application, which is produced by the method comprising the following steps (2A) to (2B), wherein the general formula (4) to the general formula (6) are used. A resin represented by a resin and sometimes composed of a polymer thereof, (2A) is given by the general formula (7a): Or general formula (8a): Or general formula (9a): [In the formula, X and R 21 are as defined in the fourth paragraph of the patent application], in the presence of a metal catalyst, and the following general formula (10): HO-Y-OH (10) (In the formula, Y is as defined in the fourth paragraph of the patent application scope), the dihydroxy compound is reacted to obtain the general formula (7b): a resin represented by an epoxy ring ring sometimes composed of a polymer thereof, or a general formula (8b): a resin represented by an epoxy ring ring sometimes composed of a polymer thereof, or a general formula (9b): a step of forming a resin and an epoxy ring-opening material (hereinafter, X, Y, and R 21 are as defined above) composed of a polymer thereof, and (2B) obtaining the step (2A) The step of epoxidizing the resin represented by any one of the general formula (7b) to the general formula (9b) and the hydroxyl group of the epoxy ring-opening material composed of the polymer. 一種滴下工法用的液晶密封劑之製造方法,其特徵係含有將以包含下述步驟(1A)、(1B)、(1C’)及(1D)之製造方法所得之如申請專利範圍第1項之酯化環氧樹脂、與硬化劑進行混合的步驟,(1A)使分子中具有2以上之環氧基之多官能環氧化合物,在金屬觸媒之存在下,與分子中具有2以上之羥基的聚羥基化合物反應,得到多官能環氧化合物之環氧開環物的步驟,(1B)將步驟(1A)所得之多官能環氧化合物之環氧開環物之羥基進行環氧化得到環氧樹脂的步驟,(1C’)使步驟(1B)所得之環氧樹脂與(甲基)丙烯酸反應,得到部分酯化環氧樹脂的步驟,(1D)使步驟(1C’)所得之部分酯化環氧樹脂與(甲基)丙烯醯基化劑、烷基化劑、醯基化劑、甲矽烷基化劑、或縮醛基化劑反應的步驟。 A method for producing a liquid crystal sealing agent for a dropping method, characterized in that it comprises a manufacturing method comprising the following steps (1A), (1B), (1C') and (1D) as claimed in claim 1 a step of mixing an esterified epoxy resin with a curing agent, and (1A) a polyfunctional epoxy compound having 2 or more epoxy groups in the molecule, and having 2 or more in the presence of a metal catalyst and in the molecule The polyhydroxy compound of a hydroxyl group is reacted to obtain an epoxy ring-opening compound of a polyfunctional epoxy compound, and (1B) the hydroxyl group of the epoxy ring-opening compound of the polyfunctional epoxy compound obtained in the step (1A) is epoxidized to obtain a ring. a step of oxyresin, (1C') a step of reacting the epoxy resin obtained in the step (1B) with (meth)acrylic acid to obtain a partially esterified epoxy resin, and (1D) a partial ester obtained in the step (1C') The step of reacting the epoxy resin with a (meth) propylene hydrazide, an alkylating agent, a thiolating agent, a formylating agent, or an acetalizing agent. 一種滴下工法用的液晶密封劑之製造方法,其係含有將以包含使以一般式(1’): 表示之樹脂及有時由其多聚物所構成之部分酯化環氧樹脂、或以一般式(2’): 表示之樹脂及有時由其多聚物所構成之部分酯化環氧樹脂、或以一般式(3’): 表示之樹脂及有時由其多聚物所構成之部分酯化環氧樹脂〔各式中,X係-O-、碳原子數1~4之伸烷基、或碳原子數2~4之亞烷基,Y為碳原子數1~4之伸烷基-碳原子數6~20之伸芳基-碳原子數1~4之伸烷基、碳原子數1~4之 伸烷基-碳原子數6~20之伸芳基、或基:-R7-(O-R7)n-(式中,R7為碳原子數1~4之伸烷基,n為0或1~6之整數),各R21各自彼此獨立為氫或甲基,R11、R12、R13、R14、R15及R16各自彼此獨立為氫、縮水甘油基、甲基縮水甘油基、或基:-CH2-CH(OH)-CH2-O-R8(式中,R8為丙烯醯基或甲基丙烯醯基),存在於一般式(1’)及(2’)中之R11、R12、R14及R15之至少2個為縮水甘油基、甲基縮水甘油基、或基:-CH2-CH(OH)-CH2-O-R8或基:-CH2-C(CH3)(OH)-CH2-O-R8,縮水甘油基及甲基縮水甘油基之平均個數與基:-CH2-CH(OH)-CH2-O-R8及基:-CH2-C(CH3)(OH)-CH2-O-R8之平均個數之比例為10:90~90:10,存在於一般式(3’)中之R11、R12、R13、R14、R15及R16之至少2個為縮水甘油基、甲基縮水甘油基、或基:-CH2-CH(OH)-CH2-O-R8或基:-CH2-C(CH3)(OH)-CH2-O-R8,縮水甘油基及甲基縮水甘油基之平均個數與基:-CH2-CH(OH)-CH2-O-R8及基:-CH2-C(CH3)(OH)-CH2-O-R8之平均個數之比例為10:90~90:10〕與(甲基)丙烯醯基化劑、烷基化劑、醯基化劑、甲矽烷基化劑、或縮醛基化劑進行反應之製造方法所得之如申請專利範圍第1項之酯化環氧樹脂、與硬化劑進行混合的步驟。 A method for producing a liquid crystal sealing agent for a dropping method, which is to contain a general formula (1'): a resin and a partially esterified epoxy resin sometimes composed of a polymer thereof, or in the general formula (2'): a resin and a partially esterified epoxy resin sometimes composed of a polymer thereof, or in the general formula (3'): a resin represented by a resin and a partially esterified epoxy resin sometimes composed of a polymer thereof (in the formula, X-O-, an alkyl group having 1 to 4 carbon atoms, or a carbon number of 2 to 4) An alkylene group, Y is an alkylene group having 1 to 4 carbon atoms, an extended aryl group having 6 to 20 carbon atoms, an alkylene group having 1 to 4 carbon atoms, and an alkylene group having 1 to 4 carbon atoms. An extended aryl group having 6 to 20 carbon atoms or a group: -R 7 -(OR 7 ) n - (wherein R 7 is an alkylene group having 1 to 4 carbon atoms, and n is 0 or 1 to 6 Integer), each R 21 is each independently hydrogen or methyl, and R 11 , R 12 , R 13 , R 14 , R 15 and R 16 are each independently hydrogen, glycidyl, methyl glycidyl, or :-CH 2 -CH(OH)-CH 2 -OR 8 (wherein R 8 is a propylene fluorenyl group or a methacryl fluorenyl group), and R 11 is present in the general formulae (1') and (2') And at least two of R 12 , R 14 and R 15 are glycidyl, methyl glycidyl, or a group: -CH 2 -CH(OH)-CH 2 -OR 8 or a group: -CH 2 -C ( CH 3 )(OH)-CH 2 -OR 8 , the average number of glycidyl groups and methyl glycidyl groups and the group: -CH 2 -CH(OH)-CH 2 -OR 8 and the group: -CH 2 - The ratio of the average number of C(CH 3 )(OH)-CH 2 -OR 8 is 10:90 to 90:10, at least two of R 11 , R 12 , R 13 , R 14 , R 15 and R 16 which are present in the general formula (3') are glycidyl groups, methyl glycidyl groups, Or an average of -CH 2 -CH(OH)-CH 2 -OR 8 or a group: -CH 2 -C(CH 3 )(OH)-CH 2 -OR 8 , glycidyl and methyl glycidyl The ratio of the number to the base: -CH 2 -CH(OH)-CH 2 -OR 8 and the base: -CH 2 -C(CH 3 )(OH)-CH 2 -OR 8 is 10:90 ~90:10] A method for producing a reaction with a (meth) propylene hydrazide, an alkylating agent, a thiolating agent, a formylating agent, or an acetalizing agent, as claimed in the patent application A step of mixing an esterified epoxy resin with a hardener. 如申請專利範圍第7項之滴下工法用的液晶密封劑之製造方法,其係藉由以包含下述步驟(2A)~(2C)的方法製造以一般式(1’)~一般式(3’)之任一表示之樹脂及有時由其多聚物所構成之部分酯化環氧樹脂,(2A)使以一般式(7a): 一般式(8a): 或一般式(9a): 〔式中,X及R21係如申請專利範圍第7項所定義〕表示之環氧化合物,在金屬觸媒之存在下,與下述一般式(10):HO-Y-OH (10)(式中,Y係如申請專利範圍第7項所定義)表示之二羥基化合物進行反應,得到以一般式(7b): 表示之樹脂及有時由其多聚物所構成之環氧開環物、或一般式(8b): 表示之樹脂及有時由其多聚物所構成之環氧開環物、或一般式(9b): 表示之樹脂及有時由其多聚物所構成之環氧開環物〔式中,X、Y及R21係如上述定義〕的步驟,(2B)使步驟(2A)所得之一般式(7b)~一般式(9b)之任一表示之樹脂及有時由其多聚物所構成之環氧開環物之羥基進行環氧化,得到以一般式(4): 表示之樹脂及有時由其多聚物所構成之環氧樹脂、或一般式(5): 表示之樹脂及有時由其多聚物所構成之環氧樹脂、或一般式(6): 表示之樹脂及有時由其多聚物所構成之環氧樹脂〔各式中,X為-O-、碳原子數1~4之伸烷基、或碳原子數2~4之亞烷基,Y為碳原子數1~4之伸烷基-碳原子數6~20之伸芳基-碳原子數1~4之伸烷基、碳原子數1~4之伸烷基-碳原子數6~20之伸芳基、或基:-R7-(O-R7)n-(式中,R7為碳原子數1~4之伸烷基,n為0或1~6之整 數),各R21各自彼此獨立為氫或甲基,R1、R2、R3、R4、R5及R6各自彼此獨立為氫、縮水甘油基、或甲基縮水甘油基,但是存在於一般式(4)及(5)中之R1、R2、R4及R5之至少2個為縮水甘油基或甲基縮水甘油基,存在於一般式(6)中之R1、R2、R3、R4、R5及R6之至少2個為縮水甘油基或甲基縮水甘油基〕,(2C)使以步驟(2B)所得之一般式(4)~(6)之任一表示之樹脂及有時由其多聚物所構成之環氧樹脂與(甲基)丙烯酸反應者。 A method for producing a liquid crystal sealing agent for a dripping method according to the seventh aspect of the patent application, which is produced by a method comprising the following steps (2A) to (2C), wherein the general formula (1') to the general formula (3) A resin represented by any of ') and a partially esterified epoxy resin sometimes composed of a polymer thereof, (2A) is given by the general formula (7a): General formula (8a): Or general formula (9a): [In the formula, X and R 21 are as defined in the scope of claim 7], in the presence of a metal catalyst, and the following general formula (10): HO-Y-OH (10) (In the formula, Y is as defined in the seventh paragraph of the patent application scope), the dihydroxy compound is reacted to obtain the general formula (7b): An epoxy ring or a general formula (8b) which is represented by a resin and sometimes a polymer thereof: An epoxy ring or a general formula (9b) which is represented by a resin and sometimes a polymer thereof: a resin represented by the epoxy ring-opening compound (wherein, X, Y and R 21 are as defined above), and (2B) a general formula obtained by the step (2A) 7b)~ The resin represented by any one of the general formula (9b) and the hydroxyl group of the epoxy ring-opening material which is sometimes composed of the polymer are epoxidized to obtain the general formula (4): The resin represented by the resin and sometimes the polymer thereof, or the general formula (5): Resin represented by epoxy resin and sometimes composed of its polymer, or general formula (6): The resin represented by the resin and the epoxy resin sometimes composed of the polymer thereof (wherein X is -O-, an alkylene group having 1 to 4 carbon atoms, or an alkylene group having 2 to 4 carbon atoms) , Y is an alkyl group having 1 to 4 carbon atoms - an exoaryl group having 6 to 20 carbon atoms - an alkyl group having 1 to 4 carbon atoms, and an alkyl group having 1 to 4 carbon atoms 6 to 20 of an extended aryl group, or a group: -R 7 -(OR 7 ) n - (wherein, R 7 is an alkylene group having 1 to 4 carbon atoms, and n is an integer of 0 or 1 to 6), Each of R 21 is independently hydrogen or methyl, and R 1 , R 2 , R 3 , R 4 , R 5 and R 6 are each independently hydrogen, glycidyl, or methyl glycidyl, but are present in general. At least two of R 1 , R 2 , R 4 and R 5 in the formulae (4) and (5) are glycidyl groups or methyl glycidyl groups, and R 1 and R 2 are present in the general formula (6). , at least two of R 3 , R 4 , R 5 and R 6 are glycidyl or methyl glycidyl groups, and (2C) is the general formula (4) to (6) obtained by the step (2B). A resin represented by a resin and a resin composed of a polymer thereof and a (meth)acrylic acid.
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