TWI567358B - A method for producing a homogenizing device without a syringe and a method of making the same - Google Patents

Description

Method for manufacturing uniform temperature device without liquid injection pipe and object made by the same

The invention relates to heat transfer technology, in particular to a method for manufacturing a temperature equalizing device without a liquid injection pipe and a product produced by the method.

According to the traditional heat transfer device, such as flat heat pipe, loop heat pipe or uniform temperature heat transfer plate, the principle of working liquid phase change is adopted to achieve heat transfer effect.

Conventional uniform temperature heat transfer plates must be welded around before they are manufactured, and then follow the steps of drilling, welding, vacuum injection, sealing and spot welding. Another way is to pre-heat the temperature. When the upper and lower plate covers of the heat transfer plate are punched, a liquid injection hole is reserved to omit the above drilling step. However, the uniform temperature heat transfer plates made by the above-mentioned production method generally leave a liquid injection pipe of 0.5 to 3 cm in length, and often because the control on the process is not easy, the benefits of uniform temperature or heat transfer are often not caused. Zhang. Furthermore, the exposed liquid injection tube tends to become a stress concentration place, which is liable to be damaged, has poor reliability, and is easily damaged by collision due to its convexity.

In view of this, the inventor of the present invention has proposed the Japanese Patent No. I324541, which provides a heat transfer device without a liquid injection pipe, which solves the problems of the aforementioned conventional heat transfer device. The inventor of the present invention has additionally developed a technique different from the previous case, and has filed an application for this patent.

The main object of the present invention is to provide a method for manufacturing a temperature equalizing device without a liquid injection tube and a material produced by the method, which is different from the prior art and still has good reliability and heat dissipation performance.

A second object of the present invention is to provide a method for manufacturing a temperature equalizing device without a liquid injection tube and a material produced by the method, wherein the liquid working medium filling portion (ie, the slit) is a flat sealing surface.

In order to achieve the foregoing object, a method for manufacturing a temperature equalizing device without a liquid injection tube according to the present invention comprises the following steps: a) preparing an upper casing and a lower casing, the upper casing and the lower casing Forming an accommodating space; b) placing a capillary material and a support frame in the accommodating space, soldering and sealing the joint between the upper casing and the lower casing, and leaving a gap therein; The capillary material has at least an upper portion and a lower portion, the support frame being located between the upper portion and the lower portion, and separating the upper portion and the lower portion; c) the upper housing and the welded portion of the step b) The composition of the lower casing is sintered; d) a liquid working medium is injected into the accommodating space from the gap, the amount of the injection is a predetermined amount; and e) the liquid having the liquid working substance injected in the step d) The combination of the upper casing and the lower casing is placed in a vacuum environment and the gap is quickly welded to seal.

In addition, the present invention provides a temperature-free device for a liquid-free tube, comprising: an upper casing and a lower casing, and an accommodating space is formed therebetween, wherein a capillary material is disposed in the accommodating space; a support frame and a liquid working medium; the capillary material has at least an upper portion and a lower portion; the support frame is located between the upper portion and the lower portion, and the upper portion and the lower portion are opened; the liquid working medium is a predetermined amount The capillary material and the support frame are sintered to be combined with the upper casing and the lower casing; the peripheral edges of the upper and lower casings are welded and leave a gap, and the gap is caused by High energy welding method for welding seals.

Thereby, the method and the manufactured article of the present invention are different from the prior art, and still have good reliability and heat dissipation performance, and the liquid working fluid filling portion (ie, the slit) is a flat sealing surface.

In order to explain the structure and features of the present invention in detail, the following preferred embodiments,

As shown in the first to sixth embodiments, a method for manufacturing a temperature equalization device without a liquid injection tube according to a first preferred embodiment of the present invention has the following steps:

a) As shown in the first figure, an upper casing 11 and a lower casing 15 are disposed, and an accommodation space 19 is formed between the upper casing 11 and the lower casing 15.

b) as shown in the second to fourth figures, a capillary material 21 and a support frame 25 are placed in the accommodating space 19, and the joint between the upper casing 11 and the lower casing 15 is welded and sealed. And a slit 18 is reserved; wherein the capillary material 21 has at least an upper portion 211 and a lower portion 212, the upper portion 211 is in contact with the bottom surface of the upper casing 11, and the lower portion 212 is in contact with the top of the lower casing 15. The support frame 25 is located between the upper portion 211 and the lower portion 212, and supports and partitions the upper portion 211 and the lower portion 212. In the present embodiment, the capillary material 21 is a metal mesh, and is formed in an endless belt shape. The upper portion 211 and the lower portion 212 are naturally formed when placed in the accommodating space 19, and due to the capillary material. 21 is in the form of a ring, so the upper portion 211 is connected to both sides of the lower portion 212. The support frame 25 can be a grid or a plurality of support columns. In this embodiment, the grid is taken as an example, and the structure of the grid is as shown in the fifth figure. The structure of the support piece.

c) sintering the composition of the upper casing 11 and the lower casing 15 welded together in step b).

d) A liquid working medium (which is not shown by the liquid and which is a conventional element, which is not shown in the drawing) is injected into the accommodating space 19 by the slit 18, and the amount of the injection is a predetermined amount. In the present embodiment, a fine needle tube (which is not shown) is inserted into the slit 18, and the liquid working medium is injected into the accommodating space 19 through the thin needle tube.

e) first clamping the composition of the upper casing 11 and the lower casing 15 into which the liquid working medium has been injected in step d) by a clamp (which is not shown), and then placing a vacuum. The environment, and the gap 18 is quickly welded and sealed, that is, a finished product of the temperature equalizing device 10 is produced, as shown in the sixth figure. In the present embodiment, the welding of the slit 18 is exemplified by a high-energy welding method, which is one of electron beam welding, high-frequency argon arc welding, or laser welding.

Through the above steps, the temperature equalizing device 10 can be manufactured, and the structure thereof comprises:

The upper casing 11 and the lower casing 15 form the accommodating space 19 therebetween, and the capillary material 21, the support frame 25 and the night working medium are placed in the accommodating space 19. The capillary material 21 has an upper portion 211 and a lower portion 212, and the upper portion 211 is in contact with the bottom surface of the upper casing 11, and the lower portion 212 is in contact with the top surface of the lower casing 15. The support frame 25 is located between the upper portion 211 and the lower portion 212, and the upper portion 211 and the lower portion 212 are opened. The liquid working system is a predetermined amount.

The capillary material 21 and the support frame 25 are sintered and joined to the upper casing 11 and the lower casing 15.

The peripheral edges of the upper and lower casings 11, 15 are welded and leave a gap 18 which is welded and sealed by high energy welding.

It can be seen that the contact portions between the upper and lower casings 11 and 15 are sealed, and the upper portion 211 and the lower portion 212 of the capillary material 21 in the inner accommodating space 19 are respectively in contact with the upper and lower casings. The inner surface of 11,15, and the support frame 25 supports the upper portion 211 and the lower portion 212. Thereby, the liquid working medium can have a good gaseous and liquid circulation path during the phase change by the space opened by the support frame 25 and the capillary action of the capillary material 21, thereby achieving rapid temperature uniformity. effect. In addition, the liquid working fluid filling portion (i.e., the position where the slit 18 is located) is a flat close-fitting surface, and the conventional liquid-filled liquid pipe is not provided, and there is no reliability problem of the exposed liquid-filled pipe.

It can be seen that the first embodiment differs from the prior art in the manufacturing method and the completed structure, and has the advantages of good reliability and heat dissipation performance in addition to the absence of the exposed liquid injection tube to reduce the volume occupation.

In the first embodiment, the capillary material is a metal mesh, which is merely an example, and is not intended to limit the material or composition thereof. The capillary material may also be a copper powder sintered material, since the copper powder sintered material belongs to a conventional component. The setting method is also a well-known method, so I will not repeat it.

Referring to FIG. 7 again, a method for manufacturing a temperature equalizing device without a liquid injection tube according to a second preferred embodiment of the present invention is mainly the same as the first embodiment disclosed above, except that:

In the step a), the bottom surface of the upper casing 31 is provided with an upper capillary structure 32, and the top surface of the lower casing 35 is provided with a lower capillary structure 36. In the second embodiment, the upper capillary structure 32 and the lower capillary structure 36 are both complex grooves.

Thereby, the plurality of disposed upper capillary structures 32 and the lower capillary structure 36 can further increase the flow path of the liquid, and the liquid working medium can have a better reflow effect than the first embodiment.

In the second embodiment, the upper capillary structure and the lower capillary structure are plural grooves, which are not intended to limit the material or composition thereof. The upper capillary structure and the lower capillary structure may also be a copper. A powder-wound or a metal-woven net, since the copper powder sinter and the metal-woven net are both conventional elements, the arrangement thereof is also conventional, and therefore will not be described.

The remaining structure, the operation mode and the achievable functions of the second embodiment are the same as those of the first embodiment, and are not described herein.

Referring to the eighth to ninth embodiments, a method for manufacturing a temperature-free device without a liquid injection tube according to a third preferred embodiment of the present invention is mainly related to the first embodiment disclosed above, except that:

In the step b), a capillary material 61 and a support frame 65 are placed in the accommodating space 59, and an upper bristles 681 are disposed between the capillary material 61 and the upper casing 51. And a sub-wool 682 is further disposed between the capillary material 61 and the lower casing 55. The upper auxiliary capillary 681 and the lower secondary capillary 682 are one of a metal mesh or a copper powder sintered material. In the third embodiment, a metal mesh is taken as an example.

Thereby, the third embodiment further adds an upper secondary capillary 681 and a lower secondary capillary 682 to the first embodiment, thereby increasing the return path of the liquid working medium, and further enhancing the effect of rapid average temperature.

Further, as is apparent from the third embodiment, it is possible to increase the return path by adding a layer of the secondary capillary between the capillary and the upper and lower casings. It can be understood that the addition of two or more layers of the secondary capillary material is only a simple change of the third embodiment, and should be covered by the scope of the patent application of the present application.

The remaining structure, the operation mode and the achievable functions of the third embodiment are the same as those of the first embodiment, and are not described herein.

10. . . Temperature equalization device

11. . . Upper housing

15. . . Lower housing

18. . . Gap

19. . . Housing space

twenty one. . . Capillary

211. . . Upper

212. . . Lower part

25. . . Support frame

31. . . Upper housing

32. . . Upper capillary structure

35. . . Lower housing

36. . . Lower capillary structure

51. . . Upper housing

55. . . Lower housing

59. . . Housing space

61. . . Capillary

65. . . Support frame

681. . . Upper secondary capillary

682. . . Lower secondary capillary

The first figure is a schematic view of a first preferred embodiment of the present invention showing an upper casing and a lower casing.

The second drawing is a schematic view of the combination of the first preferred embodiment of the present invention.

The third figure is a cross-sectional view taken along line 3-3 of the second figure.

The fourth figure is an exploded view of the first preferred embodiment of the present invention.

The fifth drawing is a schematic view of a partial member of the first preferred embodiment of the present invention, showing the structure of the support frame.

Figure 6 is a schematic view of the finished product of the first preferred embodiment of the present invention.

Figure 7 is a schematic view showing a second preferred embodiment of the present invention, showing the state in which the upper and lower casings have upper and lower capillary structures.

Figure 8 is an exploded view of a third preferred embodiment of the present invention.

Figure 9 is a cross-sectional view showing a third preferred embodiment of the present invention.

10. . . Temperature equalization device

11. . . Upper housing

15. . . Lower housing

19. . . Housing space

twenty one. . . Capillary

211. . . Upper

212. . . Lower part

25. . . Support frame

Claims (16)

A method for manufacturing a temperature equalizing device without a liquid injection tube, comprising the steps of: a) preparing an upper casing and a lower casing, wherein an upper accommodating space is formed between the upper casing and the lower casing; b) a capillary material and a support frame are disposed in the accommodating space, and a joint between the upper casing and the lower casing is welded and sealed, and a slit is reserved; wherein the capillary material has at least an upper portion and a lower portion. The support frame is located between the upper portion and the lower portion, and separates the upper portion and the lower portion; furthermore, when a capillary material and a support frame are placed in the accommodating space, the capillary material is attached to the capillary material An upper auxiliary capillary material is further disposed between the upper casings, and a sub-wool material is further disposed between the capillary materials and the lower casing; c) the upper casing and the welded body of the step b) The composition of the lower casing is sintered; d) a liquid working medium is injected into the accommodating space from the slit, the amount of the injection is a predetermined amount; and e) the liquid having the liquid working medium injected in the step d) The composition of the housing and the lower housing is placed in a vacuum environment and the high energy is quickly used Seal welding the welding gap, the high energy welding system in which one kind of electron beam welding method, a high-frequency arc welding method or laser welding method. The method for manufacturing a temperature equalizing device without a liquid injection pipe according to the first aspect of the invention, wherein the bottom surface of the upper casing is provided with an upper capillary structure, and the top surface of the lower casing is provided with a lower capillary structure. According to the scope of claim 2, the non-injection tube is evenly installed. The manufacturing method is characterized in that the upper capillary structure and the lower capillary structure are one of a plurality of grooves, a copper powder sintered body or a metal mesh. The method for manufacturing a temperature equalizing device without a liquid injection pipe according to the first aspect of the invention, wherein in the step d), a fine needle is inserted into the slit, and the liquid working medium is injected through the fine needle tube. The accommodation space. The method for manufacturing a temperature equalizing device without a liquid injection pipe according to claim 1, wherein in the step e), the upper casing and the lower casing are first clamped by a clamp, and then the step e is performed. ) action. The method for manufacturing a temperature equalizing device without a liquid injection pipe according to the first aspect of the invention, wherein in the step b), the capillary material is one of a metal mesh or a copper powder sintered product. The method for manufacturing a temperature equalizing device without a liquid injection pipe according to claim 1, wherein in the step b), the support frame is a grid or a plurality of support columns. The method for manufacturing a temperature equalizing device without a liquid injection pipe according to the first aspect of the invention, wherein the upper portion is in contact with a bottom surface of the upper casing, and the lower portion is in contact with a top surface of the lower casing. The method for manufacturing a temperature equalizing device without a liquid injection pipe according to the first aspect of the invention, wherein the upper auxiliary capillary material and the lower secondary capillary material are one of a metal mesh or a copper powder sintered product. A temperature equalizing device made by the manufacturing method of claim 1, comprising: an upper casing and a lower casing, and forming an accommodating space therebetween, wherein the accommodating space is inserted a capillary, a support frame, and a liquid worker The capillary material has at least an upper portion and a lower portion; the support frame is located between the upper portion and the lower portion, and the upper portion and the lower portion are opened; the liquid working medium is a predetermined amount; the capillary material, the support The frame is sintered to be combined with the upper casing and the lower casing; an upper pair of capillary material is further disposed between the capillary material and the upper casing, and a further pair is disposed between the capillary material and the lower casing The capillary material; the peripheral edge of the upper and lower casings is welded and leaves a gap, and the gap is welded and sealed by high-energy welding method, which is electron beam welding method, high frequency One of argon arc welding, or laser welding. The temperature equalizing device according to claim 10, wherein the capillary material is one of a metal mesh or a copper powder sintered product. The temperature equalizing device according to claim 10, wherein the support frame is a grid or a plurality of support columns. The temperature equalizing device according to claim 10, wherein the bottom surface of the upper casing is provided with an upper capillary structure, and the top surface of the lower casing is provided with a lower capillary structure. The temperature equalizing device according to claim 13, wherein the upper capillary structure and the lower capillary structure are one of a plurality of grooves, a copper powder sintered body or a metal mesh. The temperature equalizing device according to claim 10, wherein the upper portion is in contact with a bottom surface of the upper casing, and the lower portion is in contact with a top surface of the lower casing. The temperature equalizing device according to claim 10, wherein the upper auxiliary capillary material and the lower secondary capillary material are one of a metal mesh or a copper powder sintered product.