TWI566072B - Electronic device - Google Patents

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Publication number
TWI566072B
TWI566072B TW102124622A TW102124622A TWI566072B TW I566072 B TWI566072 B TW I566072B TW 102124622 A TW102124622 A TW 102124622A TW 102124622 A TW102124622 A TW 102124622A TW I566072 B TWI566072 B TW I566072B
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Taiwan
Prior art keywords
light
touch
electronic device
shielding layer
pins
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TW102124622A
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Chinese (zh)
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TW201506583A (en
Inventor
羅文凱
吳錫堯
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業成光電(深圳)有限公司
英特盛科技股份有限公司
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Description

電子裝置 Electronic device

本發明涉及一種電子裝置。 The present invention relates to an electronic device.

觸控功能現廣泛應用於手機、平板電腦等電子設備中,以帶給用戶直觀的對話模式。觸控功能主要藉由觸控電極連接觸控驅動件,並藉由觸控驅動件分析觸摸位置來實現。為了實現觸控裝置的輕薄化,可以將觸控驅動件直接設置在電子裝置的蓋板玻璃(Cover Glass)上。但由於蓋板玻璃上的遮光層的遮蔽,生產者無法觀察到觸控驅動件的貼合狀況,即使貼合出現異常也無法及時作出修復,以致於造成資源浪費以及成本增加。 The touch function is now widely used in electronic devices such as mobile phones and tablet computers to bring users an intuitive dialogue mode. The touch function is mainly connected to the touch driving component by the touch electrode, and the touch position is analyzed by the touch driving component. In order to achieve thinning and thinning of the touch device, the touch driving component can be directly disposed on the cover glass of the electronic device. However, due to the shielding of the light shielding layer on the cover glass, the manufacturer cannot observe the fitting condition of the touch driving member, and even if the fitting is abnormal, the repair cannot be performed in time, resulting in waste of resources and an increase in cost.

鑒於此,有必要提供一種電子裝置。所述電子裝置包括觸控模組與殼體。所述觸控模組固定於殼體的內表面。所述觸控模組包括觸控區和非觸控區,所述觸控區包括觸控電極,所述非觸控區包括導線以及觸控驅動件,所述觸控電極與觸控驅動件藉由導線電連接以實現資料傳輸。所述電子裝置還在對應觸控模組的非觸控區的位置設置遮光層,所述遮光層對應觸控驅動件的位置設置有透光結構。 In view of this, it is necessary to provide an electronic device. The electronic device includes a touch module and a housing. The touch module is fixed to an inner surface of the housing. The touch panel includes a touch area and a non-touch area, the touch area includes a touch electrode, the non-touch area includes a wire and a touch driving component, and the touch electrode and the touch driving component Data transmission is achieved by electrical connection of wires. The electronic device further provides a light shielding layer at a position corresponding to the non-touch area of the touch module, and the light shielding layer is provided with a light transmitting structure corresponding to the position of the touch driving device.

相較於習知技術,本發明電子裝置藉由在遮光層上設置的孔的方式,供生產者能夠在觸控驅動件貼合後及時觀察觸控驅動件的貼 合狀況,以在貼合出現異常時及時修復。 Compared with the prior art, the electronic device of the present invention allows the manufacturer to observe the sticker of the touch driving component in time after the touch driving component is attached by means of the hole provided in the light shielding layer. The situation is combined to repair in time when the fitting is abnormal.

1‧‧‧電子裝置 1‧‧‧Electronic device

10‧‧‧殼體 10‧‧‧shell

20‧‧‧觸控模組 20‧‧‧Touch Module

30‧‧‧顯示模組 30‧‧‧Display module

11‧‧‧蓋板玻璃 11‧‧‧ Cover glass

12‧‧‧遮光層 12‧‧‧Lighting layer

21‧‧‧觸控電極 21‧‧‧Touch electrode

22‧‧‧導線 22‧‧‧Wire

221‧‧‧連接墊 221‧‧‧Connecting mat

23‧‧‧觸控驅動件 23‧‧‧Touch driver

231‧‧‧接腳 231‧‧‧ pins

232‧‧‧驅動晶片 232‧‧‧Drive chip

24‧‧‧異方性導電膠 24‧‧‧ anisotropic conductive adhesive

121‧‧‧通光孔 121‧‧‧Lighting hole

121a‧‧‧第一通光孔 121a‧‧‧First light hole

121b‧‧‧第二通光孔 121b‧‧‧second light hole

121c‧‧‧第三通光孔 121c‧‧‧ third pass hole

A‧‧‧觸控區 A‧‧‧ touch area

B‧‧‧非觸控區 B‧‧‧ non-touch area

圖1係本發明具體實施方式電子裝置的結構示意圖。 1 is a schematic structural view of an electronic device according to a specific embodiment of the present invention.

圖2係圖1中觸控模組的結構示意圖。 2 is a schematic structural view of the touch module of FIG. 1.

圖3係圖2中沿V-V切割線的剖面示意圖。 Figure 3 is a schematic cross-sectional view along line V-V of Figure 2.

圖4係本發明具體實施方式電子裝置中的通光孔的分佈示意圖。 4 is a schematic view showing the distribution of light-passing holes in an electronic device according to an embodiment of the present invention.

圖5係接腳貼合位置偏差時的示意圖。 Fig. 5 is a schematic view showing the positional deviation of the pin.

下面結合附圖將對本發明實施方式作進一步的詳細說明。 The embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

如圖1所示,本發明具體實施方式所提供的電子裝置1包括殼體10、觸控模組20以及顯示模組30。所述觸控模組20固定於所述殼體10的內表面,所述顯示模組30收容於所述殼體10內。所述觸控模組20用於實現觸控功能,所述顯示模組30用於實現畫面顯示功能,所述殼體10用於收容各部件以形成一個整體。 As shown in FIG. 1 , an electronic device 1 according to an embodiment of the present invention includes a housing 10 , a touch module 20 , and a display module 30 . The touch module 20 is fixed to the inner surface of the casing 10 , and the display module 30 is received in the casing 10 . The touch module 20 is configured to implement a touch function, the display module 30 is configured to implement a screen display function, and the housing 10 is configured to receive components to form a whole.

如圖2及圖3所示,所述殼體10包括蓋板玻璃11與遮光層12,所述觸控模組20包括觸控電極21、導線22以及觸控驅動件23。所述觸控模組20包括觸控區A和非觸控區B,所述觸控區A包括觸控電極21,所述非觸控區B包括導線22以及觸控驅動件23。所述遮光層12與觸控電極21共同設置在所述殼體10的內表面上,具體而言,設置在所述蓋板玻璃11上。其中,所述遮光層12設置在蓋板玻璃11上與所述非觸控區B對應的位置,所述導線22以及觸控驅動件23設置在所述遮光層12上。所述觸控驅動件23包括驅動晶片232以及設置在所述驅動晶片232上作為信號接點的接腳231。所述導 線22靠近所述觸控驅動件23的一端包括與所述接腳231對應的連接墊221,所述接腳231與連接墊221對應貼合,所述導線22的另一端與觸控電極21相連。所述觸控電極21與觸控驅動件23藉由導線22電連接以實現資料傳輸。所述觸控驅動件23藉由異方性導電膠(Anisotropic Conductive Film,ACF)24黏貼在所述遮光層12上,具體地,所述驅動晶片232藉由異方性導電膠24黏貼在所述遮光層12上,同時所述接腳231藉由異方性導電膠24黏貼在所述導線22的連接墊221上。在本實施方式中,所述連接墊221的寬度與所述接腳231的寬度相同。所述遮光層12對應觸控驅動件23的位置設置有透光結構。在本實施方式中,所述透光結構包括若干圓形的通光孔121,在其他實施方式中,所述透光結構也可以是其他形狀例如方形、三角形等,以上內容均為方便理解本發明,而並非對其限定。從所述蓋板玻璃11一側藉由所述通光孔121即可觀察接腳231的貼合狀況,例如,可以藉由電荷耦合式(Charge-Coupled Device,CCD)攝像機2等裝置藉由所述通光孔121觀察接腳231的貼合狀況。 As shown in FIG. 2 and FIG. 3 , the housing 10 includes a cover glass 11 and a light shielding layer 12 , and the touch module 20 includes a touch electrode 21 , a wire 22 , and a touch driving component 23 . The touch panel 20 includes a touch area A and a non-touch area B. The touch area A includes a touch electrode 21, and the non-touch area B includes a wire 22 and a touch drive member 23. The light shielding layer 12 is disposed on the inner surface of the casing 10 together with the touch electrode 21, and specifically, is disposed on the cover glass 11. The light shielding layer 12 is disposed on the cover glass 11 at a position corresponding to the non-touch area B, and the wire 22 and the touch driving member 23 are disposed on the light shielding layer 12. The touch driving component 23 includes a driving die 232 and a pin 231 disposed on the driving die 232 as a signal contact. The guide One end of the line 22 adjacent to the touch driving member 23 includes a connection pad 221 corresponding to the pin 231 . The pin 231 is correspondingly attached to the connection pad 221 , and the other end of the wire 22 and the touch electrode 21 Connected. The touch electrodes 21 and the touch driving member 23 are electrically connected by wires 22 to realize data transmission. The touch driving device 23 is adhered to the light shielding layer 12 by an anisotropic conductive film (ACF) 24. Specifically, the driving wafer 232 is pasted by the anisotropic conductive adhesive 24. On the light shielding layer 12, the pins 231 are adhered to the connection pads 221 of the wires 22 by the anisotropic conductive adhesive 24. In the present embodiment, the width of the connection pad 221 is the same as the width of the pin 231. The light shielding layer 12 is provided with a light transmitting structure corresponding to the position of the touch driving member 23 . In this embodiment, the light-transmitting structure includes a plurality of circular light-passing holes 121. In other embodiments, the light-transmitting structure may be other shapes such as a square, a triangle, etc. The invention is not limited thereto. The bonding state of the pins 231 can be observed from the side of the cover glass 11 through the light-passing holes 121, for example, by means of a charge-coupled device (CCD) camera 2 or the like. The light passing hole 121 observes the fitting state of the pin 231.

所述遮光層12的材質可以是油墨,也可以是其他遮光材料。所述觸控電極21可以是藉由氧化銦錫(Indium Tin Oxides,ITO)形成,也可以是藉由極細的金屬網格(Metal Mesh)形成,還可以是藉由其它材料形成。所述導線22的材質可以是導電金屬,也可以是氧化銦錫等其它材質。 The material of the light shielding layer 12 may be ink or other light shielding material. The touch electrode 21 may be formed by Indium Tin Oxides (ITO), may be formed by a very fine metal mesh (Metal Mesh), or may be formed by other materials. The material of the wire 22 may be a conductive metal or other material such as indium tin oxide.

可以理解的是,本發明具體實施方式所提供的電子裝置1中的觸控驅動件23包括多個接腳231及連接墊221,在此選擇其中任意一組接腳231及連接墊221所對應的通光孔121來闡述本發明。 It can be understood that the touch driving component 23 of the electronic device 1 provided by the embodiment of the present invention includes a plurality of pins 231 and a connection pad 221, and any one of the pins 231 and the connection pads 221 is selected therein. The apertures 121 are used to illustrate the invention.

如圖4所示,所述通光孔121包括第一通光孔121a、第二通光孔121b以及第三通光孔121c。所述接腳231的拐角正對所述第一通光孔121a,所述接腳231的位置與所述第二通光孔121b重疊,並位於所述第三通光孔121c所圍成的區域內,且不與所述第三通光孔121c重疊。 As shown in FIG. 4, the light passing hole 121 includes a first light passing hole 121a, a second light passing hole 121b, and a third light passing hole 121c. The corner of the pin 231 is opposite to the first light-passing hole 121a, the position of the pin 231 is overlapped with the second light-passing hole 121b, and is located in the third light-passing hole 121c. In the area, it does not overlap with the third light passing hole 121c.

其中,所述第一通光孔121a與第二通光孔121b均可用於觀察異方性導電膠24中導電粒子的壓痕來判斷接腳231的貼合強度及導電狀況,所述第一通光孔121a與第三通光孔121c均可用於觀察接腳231的貼合位置是否偏差。由於在本實施方式中所述連接墊221的寬度與所述接腳231的寬度相同,因此在貼合正常時,所述接腳231會被連接墊221遮擋而不能從通光孔121中被看到。 The first light-passing hole 121a and the second light-passing hole 121b can be used to observe the indentation of the conductive particles in the anisotropic conductive adhesive 24 to determine the bonding strength and the conductive state of the pin 231. Both the light-passing hole 121a and the third light-passing hole 121c can be used to observe whether or not the bonding position of the pin 231 is different. Since the width of the connection pad 221 is the same as the width of the pin 231 in the embodiment, when the bonding is normal, the pin 231 is blocked by the connection pad 221 and cannot be removed from the light-passing hole 121. see.

所述通光孔121的位置、大小及排布方式可以根據接腳231的大小及形狀來設置。在此採用寬度為60微米的矩形接腳231舉例說明。在本實施方式中,所述接腳231及連接墊221的寬度為60微米,每一組接腳231及連接墊221與21個通光孔121對應,所述通光孔121的孔徑可以設置在5微米至10微米之間,相鄰通光孔121之間的間距可以設置在10微米至25微米之間。 The position, size and arrangement of the light-passing holes 121 can be set according to the size and shape of the pins 231. Here, a rectangular pin 231 having a width of 60 μm is exemplified. In the present embodiment, the width of the pin 231 and the connection pad 221 is 60 micrometers, and each set of pins 231 and the connection pad 221 correspond to 21 light-passing holes 121, and the aperture of the light-passing hole 121 can be set. Between 5 micrometers and 10 micrometers, the spacing between adjacent light-passing apertures 121 can be set between 10 micrometers and 25 micrometers.

具體地,所述接腳231的四個拐角各對應一個第一通光孔121a(共4個),所述接腳231的位置與9個第二通光孔121b重疊,其中,有4個第二通光孔121b位於相鄰的兩個第一通光孔121a之間,而另外的5個第二通光孔121b均勻分佈在所述第一通光孔121a及上述4個第二通光孔121b所圍成的區域內。藉由上述4個第一通光孔121a與9個第二通光孔121b即可在接腳231貼合後觀察異方性導電膠24中導電粒子的壓痕來判斷接腳231的貼合強度及導電狀況 。所述接腳231的位置同時位於8個第三通光孔121c所圍成的區域內,且不與所述第三通光孔121c重疊,所述各第三通光孔121c設置在各第一通光孔121a周圍遠離接腳231的位置。藉由上述8個第三通光孔121c可以在接腳231貼合後觀察接腳231的貼合位置是否有偏差。 Specifically, the four corners of the pin 231 correspond to one first light-passing hole 121a (four in total), and the position of the pin 231 overlaps with the nine second light-passing holes 121b, of which four The second light passing holes 121b are located between the adjacent two first light passing holes 121a, and the other five second light passing holes 121b are evenly distributed in the first light passing holes 121a and the above four second through holes. The area enclosed by the light holes 121b. The four first light-passing holes 121a and the nine second light-passing holes 121b can be used to observe the indentation of the conductive particles in the anisotropic conductive paste 24 after bonding the pins 231 to determine the bonding of the pins 231. Strength and conductivity . The position of the pin 231 is located in a region surrounded by the eight third light-passing holes 121c and does not overlap with the third light-passing hole 121c. The third light-passing holes 121c are disposed in each of the first holes. A light-passing hole 121a is located away from the position of the pin 231. The eight third light-passing holes 121c can be attached to the pins 231 to observe whether or not the bonding positions of the pins 231 are different.

由於接腳231貼合後,其各拐角應當在與其對應的第一通光孔121a中,且由於連接墊221的寬度與接腳231的寬度相同,所述接腳231會被連接墊221遮擋,因此當接腳231的貼合位置存在偏差時,所述接腳231不能被所述連接墊221完全遮擋,從而會出現在第一通光孔121a中,甚至偏差厲害時,會出現在第三通光孔121c中。因此,藉由觀察第一通光孔121a以及第三通光孔121c中是否能看到接腳231即可判斷所述接腳231的貼合位置是否偏差。例如圖5所示,當所述接腳231出現在第一通光孔121a及第三通光孔121c中時,即可判定所述接腳231的貼合位置出現偏差,並且其偏差的方向也隨即被獲悉。同時,藉由觀察第一通光孔121a以及第二通光孔121b中異方性導電膠24中導電粒子的壓痕即可判斷接腳231的貼合強度及導電狀況是否異常。 Since the pins 231 are attached, the corners thereof should be in the corresponding first light-passing holes 121a, and since the width of the connection pads 221 is the same as the width of the pins 231, the pins 231 are blocked by the connection pads 221. Therefore, when there is a deviation in the bonding position of the pin 231, the pin 231 cannot be completely blocked by the connecting pad 221, so that it may appear in the first light-passing hole 121a, and even when the deviation is severe, it may appear in the first The three-way light hole 121c. Therefore, whether the bonding position of the pin 231 is deviated can be determined by observing whether the pin 231 can be seen in the first light-passing hole 121a and the third light-passing hole 121c. For example, as shown in FIG. 5, when the pin 231 is present in the first light-passing hole 121a and the third light-passing hole 121c, it can be determined that the bonding position of the pin 231 is deviated, and the direction of the deviation It was also immediately informed. At the same time, it is possible to determine whether the bonding strength and the conductive state of the pin 231 are abnormal by observing the indentation of the conductive particles in the anisotropic conductive paste 24 in the first light-passing hole 121a and the second light-passing hole 121b.

這樣,生產者就可以在貼合完成後藉由所述通光孔121觀察異方性導電膠24的壓痕以及接腳231的位置來判斷所述接腳231的貼合狀況是否異常,並在貼合出現異常時及時修復,避免更大的損失。同時,由於所述通光孔121的孔徑僅為5至10微米,當使用者使用該電子裝置1時,也不會用肉眼看到所述通光孔121的存在,不會給用戶帶來困擾。而且所述通光孔121與所述遮光層12可以藉由同一到掩膜光照形成,並不會造成成本的增加。 In this way, the manufacturer can judge whether the bonding state of the pin 231 is abnormal by observing the indentation of the anisotropic conductive adhesive 24 and the position of the pin 231 through the light-passing hole 121 after the bonding is completed. Repair in time when there is an abnormality in the fit to avoid greater losses. At the same time, since the aperture of the light-passing hole 121 is only 5 to 10 micrometers, when the user uses the electronic device 1, the presence of the light-passing hole 121 is not visible to the naked eye, and the user is not brought to the user. Troubled. Moreover, the light-passing hole 121 and the light-shielding layer 12 can be formed by the same illumination to the mask without causing an increase in cost.

可以理解的是,本發明所提供的電子裝置1中遮光層12上通光孔121的數量及排布方式並不限定於此,上述每一接腳231對應21個通光孔121的說明僅為方便理解,任何在遮光層12上設置有用於觀察電子裝置1貼合狀況的實施方式,均在本發明的保護範圍之內。另外,本發明中各接腳231所對應的通光孔121的數量及排布方式也可不盡相同,而是可以根據具體設計做相應的調整。 It can be understood that the number and arrangement of the light-passing holes 121 in the light-shielding layer 12 of the electronic device 1 provided by the present invention are not limited thereto, and the description of the 21 light-passing holes 121 for each of the pins 231 is only described. For ease of understanding, any embodiment for providing a viewing condition for observing the electronic device 1 on the light shielding layer 12 is within the scope of the present invention. In addition, the number and arrangement of the light-passing holes 121 corresponding to the pins 231 in the present invention may also be different, but may be adjusted according to the specific design.

綜上所述,本創作符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本創作之較佳實施例,本創作之範圍並不以上述實施例為限,舉凡熟習本案技藝之人士爰依本創作之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。 In summary, the creation meets the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments, and those skilled in the art will be equivalently modified or changed according to the spirit of the present invention. It should be covered by the following patent application.

12‧‧‧遮光層 12‧‧‧Lighting layer

221‧‧‧連接墊 221‧‧‧Connecting mat

231‧‧‧接腳 231‧‧‧ pins

121a‧‧‧第一通光孔 121a‧‧‧First light hole

121b‧‧‧第二通光孔 121b‧‧‧second light hole

121c‧‧‧第三通光孔 121c‧‧‧ third pass hole

Claims (10)

一種電子裝置,包括一觸控模組與一殼體,所述觸控模組固定於殼體的內表面,所述觸控模組包括一觸控區和一非觸控區,所述觸控區包括若干觸控電極,所述非觸控區包括若干導線以及一觸控驅動件,所述若干觸控電極與觸控驅動件藉由若干導線電連接以實現資料傳輸,所述電子裝置對應觸控模組的非觸控區的位置設置一遮光層,所述遮光層對應觸控驅動件的位置設置有一透光結構。 An electronic device includes a touch module and a housing. The touch module is fixed on an inner surface of the housing. The touch module includes a touch area and a non-touch area. The control area includes a plurality of touch electrodes, the non-touch area includes a plurality of wires and a touch driving component, and the plurality of touch electrodes and the touch driving component are electrically connected by a plurality of wires to realize data transmission, and the electronic device A light shielding layer is disposed corresponding to the position of the non-touch area of the touch module, and the light shielding layer is disposed with a light transmitting structure corresponding to the position of the touch driving component. 如請求項第1項所述的電子裝置,其中,所述觸控驅動件包括若干接腳,所述若干導線靠近所述觸控驅動件的一端包括與所述若干接腳對應的若干連接墊,所述透光結構正對該若干連接墊設置。 The electronic device of claim 1, wherein the touch driving component comprises a plurality of pins, and the one end of the plurality of wires adjacent to the touch driving component comprises a plurality of connecting pads corresponding to the plurality of pins The light transmissive structure is being disposed on the plurality of connection pads. 如請求項第2項所述的電子裝置,其中,所述透光結構包括若干通光孔。 The electronic device of claim 2, wherein the light transmissive structure comprises a plurality of light passing holes. 如請求項第3項所述的電子裝置,其中,所述透光結構包括若干第一通光孔,每一所述接腳的每一拐角都正對一所述第一通光孔。 The electronic device of claim 3, wherein the light transmissive structure comprises a plurality of first light passing holes, each of the corners of each of the pins facing a first light passing hole. 如請求項第4項所述的電子裝置,其中,所述透光結構還包括若干第二通光孔,每一所述接腳的位置與若干所述第二通光孔重疊。 The electronic device of claim 4, wherein the light transmissive structure further comprises a plurality of second light passing holes, the positions of each of the pins overlapping with the plurality of the second light passing holes. 如請求項第4項所述的電子裝置,其中,所述透光結構還包括若干第三通光孔,每一所述接腳的位置位於若干所述第三通光孔所圍成的區域內,且不與任一所述第三通光孔重疊。 The electronic device of claim 4, wherein the light transmissive structure further comprises a plurality of third light passing holes, each of the pins being located at an area surrounded by the plurality of third light passing holes And does not overlap with any of the third light passing holes. 如請求項第2項所述的電子裝置,其中,所述遮光層直接形成在殼體的內表面上,所述連接墊直接形成在遮光層的表面,所述觸控驅動件還包括驅動晶片,所述驅動晶片藉由異方性導電膠黏貼與所述遮光層連接,所述接腳藉由異方性導電膠黏貼與所述連接墊電性連接。 The electronic device of claim 2, wherein the light shielding layer is directly formed on an inner surface of the casing, the connection pad is directly formed on a surface of the light shielding layer, and the touch driving component further comprises a driving chip The driving chip is connected to the light shielding layer by an anisotropic conductive adhesive, and the pin is electrically connected to the connection pad by an anisotropic conductive adhesive. 如請求項第3項所述的電子裝置,其中,所述通光孔為圓孔,所述通光孔 的孔徑在5微米至10微米之間,相鄰通光孔之間的間距在10微米至25微米之間。 The electronic device of claim 3, wherein the light-passing hole is a circular hole, and the light-passing hole The aperture is between 5 microns and 10 microns and the spacing between adjacent apertures is between 10 microns and 25 microns. 如請求項第3項所述的電子裝置,其中,所述通光孔與所述遮光層藉由同一掩膜光照形成。 The electronic device of claim 3, wherein the light-passing aperture and the light-shielding layer are formed by illumination of the same mask. 如請求項第1項所述的電子裝置,其中,所述殼體包括蓋板玻璃,所述遮光層及觸控電極共同設置在所述蓋板玻璃上。 The electronic device of claim 1, wherein the housing comprises a cover glass, and the light shielding layer and the touch electrode are disposed together on the cover glass.
TW102124622A 2013-06-13 2013-07-09 Electronic device TWI566072B (en)

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