TWI565783B - A tape for conducting inspection, and a conduction inspection method using the tape - Google Patents

Description

Conduction inspection strip and conduction inspection method using the same

The present invention relates to a conduction inspection strip for performing conduction inspection in a state in which a semiconductor wafer or a semiconductor wafer is bonded.

In the past, a semiconductor wafer made of germanium, gallium, or arsenic was subjected to a large-diameter state, and a semiconductor wafer was inspected for inspection by an inspection process. After that, the semiconductor wafer is attached to the cutting plate and subjected to cutting, cleaning, expansion, selection, and engineering. Further, after the dicing process, there is a case where the conduction inspection of the semiconductor wafer is performed.

In the adhesive tape for inspection used in the above inspection, Patent Document 1 discloses a substrate film having a structure in which a conductive vapor layer is provided on a base film or a substrate formed of a metal foil. Adhesive sheets of laminated adhesive layers.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2009-114394

According to the review by the present inventors, it is described in Patent Document 1 When the adhesive sheet is used and the metal foil is used as the base film, the adhesive sheet is not flexible, and if it is bent, there is a problem that the plastic shape cannot be returned to the original shape. In other words, the adhesive sheet for inspection described in Patent Document 1 is inferior in workability. Further, there is a possibility that the guide roller or the like is damaged by the metal foil, which may cause a malfunction of the device. Moreover, when the base material provided with the conductive vapor deposition layer is used as the base film, the adhesive sheet does not have conductivity in the lamination direction (thickness direction).

The present invention has been made in view of the above circumstances. In other words, the present invention has an object of providing a conductive inspection strip which is excellent in operability and can be easily subjected to conduction inspection.

The present invention has been made in order to solve the above problems.

(1) A conduction inspection strip which is formed by laminating a base material having a plurality of through holes and a metal film substrate formed of a metal film, and a conductive adhesive layer, and has conductivity in a lamination direction. . .

(2) The tape for conduction inspection according to (1), wherein the thickness of the base material in the peripheral portion of the through hole is t1, and the difference t1-t2 between the thicknesses t2 of the base material other than the peripheral portion of the through hole is 60μm or less

(3) The conduction inspection strip according to (1) or (2), wherein the through hole is formed by laser light.

(4) The conductive inspection strip according to any one of (1) to (3), wherein the thickness of the metal film is 60 to 1000 nm.

(5) The conductive inspection strip according to any one of (1) to (4), wherein the total area of the through-holes in one of the base materials is 1 to 10% of the area of the substrate.

(6) The conductive inspection tape according to any one of (1) to (5), wherein the conductive adhesive layer has removability.

(7) Use the continuity check method for the conduction check strip of any of (1) to (6).

According to the present invention, by providing a metal film on a substrate provided with a through hole and further providing a conductive adhesive layer, it is possible to obtain a conduction check excellent in conductivity in the thickness direction (layering direction) and in the plane direction or operability. Use strips. The conduction inspection can be easily performed by the conduction inspection tape of the present invention.

10‧‧‧Training inspection tape

1‧‧‧Substrate

2‧‧‧Metal film

3‧‧‧ Conductive adhesive layer

4‧‧‧through holes

5‧‧‧Semiconductor wafer

6‧‧‧Metal coated substrate

Fig. 1 is a cross-sectional view showing a strip for conduction inspection relating to an embodiment of the present invention.

Fig. 2 is a cross-sectional view showing a strip for conduction inspection according to another embodiment of the present invention.

Fig. 3 is a cross-sectional view showing a strip for conduction inspection in accordance with another embodiment of the present invention.

Fig. 4 is an enlarged view showing Fig. 1.

Hereinafter, the present invention will be described more specifically with the best mode. As shown in FIGS. 1 to 3, the conductive inspection strip 10 according to the present invention is formed by laminating a plurality of base materials 1 of the through holes 4 and a metal film substrate 6 formed of the metal film 2, The conductive adhesive layer 3 has conductivity in the lamination direction.

[Metal coated substrate]

In the present invention, the metal film-coated substrate is formed of a base material and a metal film provided with a plurality of through-holes, and specifically, a surface of a metal film-coated base material. Hereinafter, the substrate and the metal film will be described.

(substrate)

A plurality of through holes 4 are formed in the substrate 1.

The shape of the through hole is not particularly limited. The through hole of the present invention can be formed by, for example, a method of piercing a substrate using a fine needle, a method of forming using a punch, or a method of forming using a spindle or laser light. Among them, a method of forming a through hole using laser light is preferable.

The laser light that can be used in the present invention is not particularly limited, and for example, a YAG laser or a carbon dioxide gas (CO ₂ ) laser or the like can be used. The repetition frequency of such a laser light is preferably 5000 to 10000 Hz. Further, the pulse width is preferably 5 to 50 μsec. With the above-described laser light, it is possible to suppress the deformation of the substrate while the heat generated by the irradiation of the laser light, and to form a desired through hole.

In the through hole formed by the above method, the diameter of the through hole in the surface on one side of the substrate (the surface 1a of the first to third figures) is preferably 300 μm or less, and more preferably 250 μm or less. Especially better at 50~200μm.

When the diameter of the through hole in the surface of one of the base materials exceeds 300 μm, the conductive adhesive layer is formed on the substrate as will be described later, and the conductive adhesive layer penetrates the surface on the opposite side, which is difficult. A smooth conductive adhesive layer is formed.

In the present invention, the "surface of one side of the substrate" means a surface of the substrate on which the needle or the blade of the punch or the punch is pushed into the end or the incident end of the laser light when the through hole is formed. The substrate surface (the substrate surface 1a in the first to third figures). Further, the surface of the substrate opposite to the side of one side of the substrate is referred to as "the other surface of the substrate" (the substrate surface 1b in the first to third figures).

Further, the total area of the through holes in the surface of one side of the substrate is preferably 1 to 10%, more preferably 2 to 10%, still more preferably 3 to 10%, particularly 3 ~5% is better. By setting the total area of the through-holes for the substrate area within the above range, it is possible to ensure the conductivity in the thickness direction (the stacking direction) of the conduction inspection strip, and to maintain the smoothness. Maintain the accuracy of the continuity check.

The through hole may be formed in a comprehensive range of the substrate, or may be formed only in a range in which the adherend (wafer for conducting inspection or the like) is attached.

Further, as shown in Fig. 4, the difference (t1 - t2) between the thickness (t1) of the base material in the peripheral portion of the through hole and the thickness (t2) of the substrate other than the peripheral portion of the through hole is 60 μm or less. Preferably, it is preferably less than 30 μm, especially preferably 5 to 15 μm. When the through hole is formed by the above method, irregularities may be formed on the other surface of the substrate in the peripheral portion of the through hole. When a conductive adhesive layer to be described later is formed on the other surface of the substrate, the unevenness of the surface generated on the other surface of the substrate can be filled, and the effect of obtaining a smooth conductive adhesive layer can be obtained. By setting the difference (t1 - t2) within the above range, the unevenness of the other surface of the substrate can be made small, and this effect can be obtained even if a conductive adhesive layer having a small thickness is formed. When the conductive adhesive layer is smooth, the inclination of the adherend adhering to the conductive adhesive layer is suppressed, and the contact area of each of the adherends of the conductive adhesive layer is almost constant, and the accuracy of the conduction inspection is improved. . Moreover, by making the thickness of the conductive adhesive layer thin, the conduction inspection strip can be reduced Manufacturing costs.

By forming the through holes by using the laser light, it is easy to make the difference (t1-t2) within the above range. In the present invention, the thickness (t1) of the base material in the peripheral portion of the through hole is the portion of the peripheral portion of the through hole that is the maximum height from the substrate surface as shown in Fig. 4 . Substrate thickness. Moreover, the "thickness (t2) of the base material other than the peripheral portion of the through hole" means the substantial thickness of the base material.

The material of the substrate on which the through holes are formed is not particularly limited. For example, PET (polyethylene terephthalate), PBT (polybutylene terephthalate), and PEN (polynaphthalene dicarboxylic acid) can be used. An insulating film made of resin such as ethylene glycol), PPS (polyphenylene ether), PI (polyimide), PEEK (polyether ether), aramid or polylactic acid. Among them, PET, PBT, PEN, and PI are preferably used from the viewpoints of heat resistance, followability, cost, and the like.

The thickness of the substantial base material other than the peripheral portion of the through hole is not particularly limited, and is preferably 30 to 200 μm, more preferably 50 to 150 μm, particularly preferably 50 to 100 μm. When the thickness of the substrate is less than 30 μm, the substrate may shrink due to heat generated when the laser light forms the through hole, and wrinkles may occur. Moreover, when the thickness of the base material exceeds 200 μm, the operability may be lowered in the manufacturing process of the tape for conduction inspection.

(metal film)

The metal film is formed by a vapor deposition method, a sputtering method, or the like. The metal film formed by a vapor deposition method, a sputtering method, or the like covers a single side of the substrate, and preferably covers both sides of the substrate while covering the peripheral side surface of the through hole. Further, when a metal film is formed by a vapor deposition method, a sputtering method, or the like, the metal constituting the metal film may be filled with a through hole. As a result, the conduction inspection strip of the present invention is in the lamination direction (thickness Direction) is conductive. Although such a metal film is not particularly limited, for example, aluminum, gold, silver, copper, platinum, nickel, or the like can be used. Further, in the case where the metal film is formed on one surface of the substrate, it is preferable to form a metal film on the substrate surface 1a, that is, the "surface on one side of the substrate" in Fig. 2 . By forming a metal film on one side of the substrate, a smooth conduction inspection strip can be obtained, and thus the accuracy of the conduction inspection is improved.

The thickness of the metal film is preferably 60 to 1000 nm, more preferably 100 to 500 nm, and particularly preferably 150 to 300 nm. When the thickness of the metal film is in the above range, not only the conductivity in the thickness direction in the conduction inspection strip is excellent, but also the crack of the metal film when the inspection inspection strip is operated can be suppressed. Moreover, the manufacturing cost of the strip for conduction inspection can also be reduced.

[conductive adhesive layer]

The conductive adhesive layer is laminated on one side of the metal film substrate. By providing a conductive adhesive layer, it is possible to maintain the adherend well. In addition, the adhesive composition constituting the conductive adhesive layer penetrates into the through hole, and is in contact with the metal film, and the conductivity in the thickness direction is improved. Further, the surface of the conductive adhesive layer is not particularly limited. However, it is preferable to laminate the conductive adhesive layer on the side of the substrate surface 1b in the first drawing, that is, on the side of the other side of the substrate. . The "other surface of the substrate" is a side-layer conductive adhesive layer, and the conductive adhesive is laminated on the side of the substrate surface 1a in the first drawing, that is, on the side of the "surface on one side of the substrate". In the case of the layer, the influence of the unevenness generated on the "other surface of the substrate" when the through hole is formed on the operability of the tape for conduction inspection can be made small. Further, by laminating the conductive adhesive layer on the other surface of the substrate and filling the unevenness, a smooth conduction inspection strip can be obtained, and the accuracy of the conduction inspection can be improved while the conduction is improved. Check the operability of the strip. Also, by making the thickness of the conductive adhesive layer thick The degree is thin, and the manufacturing cost of the strip for conduction inspection can be reduced.

The type of the adhesive constituting the conductive adhesive layer is not particularly limited, and can be obtained by forming various conventionally known adhesives. As such an adhesive layer, for example, an adhesive such as a rubber-based, acryl-based, epoxy-based resin, polyester-based, polyurethane-based, or polyvinyl ether can be used. Further, an energy ray-curing type adhesive, a heat-foaming type, and a water-swellable type of adhesive which are hardened by irradiation with an energy source and are re-peelable can also be used.

Among the above-mentioned adhesives, an acryl-based, polyester-based or polyurethane-based adhesive is preferred from the viewpoint of versatility and workability, and a propylene-based adhesive is particularly preferable.

As the propylene-based adhesive, a copolymer containing, for example, a (meth) acrylate individual polymer, a copolymer containing two or more (meth) acrylate units, and (meth) acrylate and other functional groups can be used. At least one selected from the monolithic copolymer is used as a main component. Examples of the (meth) acrylate include butyl (meth)acrylate, amyl (meth)acrylate, hexyl (meth)acrylate, and heptyl (meth)acrylate, (methyl). Octyl acrylate, decyl (meth) acrylate, decyl (meth) acrylate, and the like. In addition, examples of the functional monovalent body include a hydroxyl group-containing monovalent body such as hydroxyethyl (meth)acrylate or hydroxypropyl (meth)acrylate, and a carboxylic acid group such as (meth)acrylic acid. Monomeric, (meth)acrylamide, dimethyl (meth) acrylamide, N-vinylmorpholine, N-arylmorpholine, N-(meth)acryloylmorpholine, and the like.

When one of the functional monomeric components is used, an ethylenically unsaturated mono-nose of an ethylene-unsaturated monomer having a 6-membered ring of a nitrogen atom and an oxygen atom, N-vinylmorpholine, N-arylmorpholine, N -(meth)acryloylmorpholine, etc. It is preferable to exhibit the performance as a crosslinking accelerator in the reaction with the crosslinking agent described later. Among them, N-(meth)acryloylmorpholine or the like is preferably used from the viewpoint of excellent copolymerizability with other monomer components.

The tape for conduction inspection is applied to an adherend such as a semiconductor wafer, and is particularly attached to a conductive adherend. Therefore, from the viewpoint of suppressing oxidation (corrosion) of the surface of the conductive adherend, it is preferable to use an adhesive which does not contain an acid group, and for example, an adhesive which does not use a monocarboxylic acid-containing monomer is preferable. On the other hand, from the viewpoint of dispersibility of the conductive particles to be described later, it is preferred to use an adhesive containing an acid group.

Further, the above-mentioned adhesive may be crosslinked by a crosslinking agent such as a polyisocyanate crosslinking agent, an epoxy crosslinking agent, an aziridine crosslinking agent or a chelating crosslinking agent. Examples of the polyisocyanate crosslinking agent include toluene diisocyanate (TDI), hexamethylene diisocyanate (HMDI), isophorone diisocyanate (IPDI) diisocyanate xylyl ester (XDI), and hydrogenated toluene diisocyanate. Diphenylmethane diisocyanate, trimethylol propyl ring denatured TDI, and the like. As the epoxy crosslinking agent, ethylene glycol diglycidyl ether, 1,6-hexane glycol diglycidyl ether, trimethylolpropane diglycidyl ether, diglycidyl ether aniline, and the like can be used. Glycidylamine and the like. As the aziridine crosslinking agent, 2,2-bishydroxymethylbutanol-tris[3-(1-aziridine)propionate], 4,4-bis(ethyleneiminecarboxylate) can be used. Alkenyl)di-based methane, tris-2,4,6-(1-aziridine)-1,3,5-triazine, tris[1-(2-methyl)aziridine 】 Phosphine oxide, hex[1-(2-methyl)aziridine]triphosphine oxide, and the like. As the chelating crosslinking agent, an aluminum chelating agent, a titanium chelating agent or the like can be used. By appropriately adjusting the amount of the crosslinking agent, it is possible to exhibit the necessary adhesive properties for various adherends. Crosslinker not It can be used alone or in combination of two or more types as necessary.

The adhesive composition constituting the conductive adhesive layer is preferably a conductive particle in addition to the above-mentioned adhesive. The conductive layer can be imparted with conductivity by blending conductive particles in the conductive adhesive layer.

As the conductive particles used in the present invention, carbon black or graphite such as furnace black or acetylene black, or carbon fiber, conductive whiskers, conductive ceramic powder, or nickel, copper, gold, silver, iron, or the like can be used. One or more kinds of metal particles such as chromium.

Further, the adhesive composition for forming the conductive adhesive layer may contain, as necessary, an additive generally contained in an adhesive for an adhesive sheet, for example, an adhesion-imparting agent, an ultraviolet absorber, an oxidation inhibitor, or the like. Or a coloring agent, etc.

The conduction inspection strip of the present invention configured as described above is attached to the adherend, and the conductive adhesive layer is in contact with the adherend, and the adherend is electrically connected to the conduction test strip. Therefore, since it can be electrically connected in the lamination direction (thickness direction) and the surface direction, the conduction inspection can be easily performed.

The thickness of the conductive adhesive layer is not particularly limited, and the difference between the thickness of the substrate (t1) at the peripheral portion of the through hole and the thickness (t2) of the substrate other than the peripheral portion of the through hole (t1 - t2) ) is set to be good. The thickness of the conductive adhesive layer is preferably from 10 to 80 μm, more preferably from 15 to 50 μm, still more preferably from 20 to 35 μm. By setting the thickness of the conductive adhesive layer to the above range, the conductive adhesive layer can be filled with the unevenness (t1-t2), and it is possible to obtain an adhesive layer which is thin even if a metal coated substrate is formed. A smooth adhesive layer is obtained.

Further, the conductive adhesive layer preferably has an appropriate removability for the adherend, and the adhesion to the adherend is preferably 1000 to 7000 mN/25 mm, more preferably 2000 to 6000 mN/25 mm, particularly 2,500. ~5000mN/25mm is preferred. When the adhesive force of the conductive adhesive layer is in the above range, not only the retention of the attachment body but also the separation of the adherend after the inspection is easy. The adhesion is based on JIS Z 0237; 2009, after adhesion to the adherend (SUS) for 30 minutes, at 23 ° C, relative humidity of 50% by the 180 ° peeling method.

Further, in the conduction inspection tape of the present invention, in order to protect the conductive adhesive layer before use, the sheet may be laminated on the surface of the adhesive layer. In the peeling sheet, the peeling sheet used at the time of manufacture of the strip for the inspection inspection of the present invention described later may be used without being peeled off from the adhesive layer.

The release base material in the release sheet is not particularly limited, and may be appropriately selected from various substrates known as the base material of the release sheet. Examples of such a release substrate include a polyester film such as PET, PBT, or PEN, a polyolefin film such as polypropylene or polymethylpentene, and a plastic film such as a polycarbonate film or a cellulose acetate film. , or a laminate sheet containing the same. The thickness of the release substrate is not particularly limited, and is usually 10 to 150 μm.

When a plastic film is used as the release substrate of the release sheet, the adhesion of the plastic film to the release agent layer is improved, and the surface of the plastic film on the side of the release agent layer may be provided as desired. , subject to physical or chemical surface treatment such as oxidation. Examples of the above oxidation method include corona discharge treatment, chromic acid treatment, flame treatment, hot air treatment, and ozone. Ultraviolet radiation Processing and so on. These surface treatment methods can be appropriately selected depending on the type of the release substrate. In general, the corona discharge treatment method is preferably used in view of effects and operability. Further, a substrate treatment can also be applied.

Examples of the release agent for forming the release agent layer in the release sheet include a silicone resin, a long-chain alkyl resin, an alkyd resin, a fluororesin, a polybutadiene rubber, a butyl rubber, and a styrene-butylene. A rubber-based elastomer such as a diene copolymer, a polyisoprene rubber, or an ethylene-propylene rubber copolymer.

The coating on the release substrate for the release agent can be, for example, by roll bar coating, reverse roll coating, blade coating, roll coating method, gravure coating method, air knife coating method, knife coating method, or the like. The coating method is carried out. The thickness of the release agent layer is not particularly limited, and is usually preferably 0.01 to 5 μm.

Next, a description will be given of a method of manufacturing a conduction inspection strip relating to the present invention.

In the first manufacturing method according to the present invention, first, a substrate provided with a plurality of through holes is prepared. Next, a metal film is formed on the surface of the substrate by a vapor deposition method, a sputtering method, or the like to obtain a metal film substrate. The metal film is preferably formed by a vapor deposition method from the viewpoint of easiness of production and uniformity of the metal film. Thereafter, a conductive adhesive layer is laminated on the surface of the metal film substrate. In the method of laminating the adhesive layer, the adhesive is diluted with an appropriate solvent as necessary to form an adhesive composition, and the sheet may be peeled off to have a predetermined dry film thickness, and dried to form an adhesive layer. The adhesive composition may be directly applied onto the surface of the metal film substrate and dried to form an adhesive layer. Thus, the conduction inspection strip relating to the present invention can be obtained.

Moreover, in the second manufacturing method according to the present invention, first, a conductive adhesive layer is laminated on the surface of a substrate on which a plurality of through holes are provided. The lamination method of the adhesive layer is the same as described above. Thereafter, a metal film is formed on one surface of the substrate (the surface opposite to the surface on which the adhesive layer is laminated) by a vapor deposition method, a sputtering method, or the like. A metal film substrate was obtained. In this way, the conduction inspection strip relating to the present invention can also be obtained.

The conduction inspection strip according to the present invention has conductivity in the lamination direction and the surface direction, and can easily check the conductivity of a semiconductor wafer or the like.

Next, a description will be given of a conduction inspection method using a conduction inspection strip relating to the present invention.

In the conduction inspection method of the present invention, the adherend is attached to the conductive adhesive layer of the conduction inspection strip of the present invention, and then the probe of the electric meter and the adherend and the adhesive for the inspection inspection strip are attached. The layer or the metal film (the surface opposite to the conductive adhesive layer) is brought into contact, and the conductivity of the adherend is inspected. Since the conduction inspection strip of the present invention has conductivity in the lamination direction, the electric meter on one side is in contact with the adherend, and the other electric meter is in contact with the metal film to check the conductivity in the lamination direction, and the other is The electric meter is in contact with the metal film in the range in which the adherend is attached, and the conductivity in the lamination direction (almost vertical direction) is more preferably inspected. By checking the conductivity in the lamination direction, the distance between the meters can be kept almost constant, and not only the accuracy of the conduction inspection is excellent, but also the conduction inspection can be easily performed.

Hereinafter, the present invention will be described by way of examples, but the invention is not limited thereto. In the following examples and comparative examples, "the straight through hole The ratio of the diameter to the total area of the through-holes of the substrate area, and the difference between the thickness of the substrate (t1) in the peripheral portion of the through-hole and the thickness (t2) of the substrate other than the peripheral portion of the through-hole ( T1-t2)", "operability", "conduction check", "wafer tilt", "adhesion" and "fast tack" are as follows.

<diameter of through hole>

The diameter of the through-hole was measured by observing the surface using a scanning electron microscope (Scanning Electron Microscope (SEM) VE-9800, manufactured by KEYENCE Co., Ltd.).

<The ratio of the total area of the through holes of the substrate area>

The number of through holes formed in the substrate was calculated, and the total area of the through holes was calculated from the diameter of the through holes in the surface of the substrate measured by the above, and the area of the substrate was determined. The ratio of the total area of the holes.

<The difference between the thickness of the base material (t1) in the peripheral portion of the through hole and the thickness (t2) of the base material other than the peripheral portion of the through hole> (t1-t2)>

The base material on which the through-holes were formed was subjected to cross-sectional observation using a laser microscope (VHS-1000, manufactured by KEYNENCE Co., Ltd.), and the thickness (t1) of the base material in the peripheral portion of the through-hole was measured, and the base other than the peripheral portion of the through-hole was measured. The thickness of the material (t2). Further, as shown in Fig. 4, the thickness (t1) of the base material in the peripheral portion of the through hole is the thickness of the base material in the portion of the peripheral portion of the through hole which is the maximum height from the substrate surface. Further, the thickness (t2) of the substrate other than the peripheral portion of the through hole means substantially the same as the thickness of the substrate.

<Operability>

A 15 cm square conduction inspection tape was wound around a polyethylene rod having a diameter of 5 cm, and it was confirmed that there was a crease or a bend. Did not occur on the continuity check strip The crease and the bending were evaluated as "good", and the occurrence of creases and bending was evaluated as "poor".

<Conduction check>

The wafer on which the electrode is formed is attached to the conductive adhesive layer of the conduction inspection strip. After that, the probe of the electric meter (KIT-60 manufactured by Sanhe Electric Co., Ltd.) and the electrode on the wafer are in contact with the metal film (surface opposite to the conductive adhesive layer) of the conduction inspection strip to perform conduction inspection. . Conduction inspection was performed on 100 wafers attached to the conductive adhesive layer, and it was confirmed that the number of the turned-on wafers was 100, and it was evaluated as "A" and 70 to 99, and it was evaluated as "B" and 0 to 69. The situation is evaluated as "C".

<Tilt of wafer>

A semiconductor wafer (1 mm × 1 mm, thickness: 200 μm) was attached to a conductive adhesive layer, and the angle between the wafer and the adhesive layer was measured using a laser microscope (VHS-1000, manufactured by KEYENCE Co., Ltd.) (the angle α shown in Fig. 3) ).

<adhesion>

According to JIS Z 0237; 2009, the adhesion inspection tape attached to the adherend (SUS) for 30 minutes was passed, and the adhesion was measured by a 180° peeling method at 23° C. and a relative humidity of 50%.

<fast viscosity>

Touch the adhesive layer with your fingers to check for fast adhesion.

(Example 1)

[Production of substrate]

On a PET film having a thickness of 100 μm, a CO ₂ laser (CO ₂ laser processing machine "YB-HCS03" manufactured by Panasonic Co., Ltd.) was used to process with a double pulse (repeated frequency: 10000 Hz, pulse width: 25 μsec) (first shot) / 50 μsec (second shot)) A through hole was formed to obtain a substrate. Further, the ratio of the total area of the through holes of the substrate area was 3%.

[Formation of metal film]

On both surfaces of the substrate obtained above, a vapor deposition method (vapor deposition rate: 2 Å/sec, film formation thickness: 200 nm, resistance heating conditions: 40 A, 2.0 V) was used, and aluminum was formed into a film at 200 nm to obtain a metal. Film coated substrate.

[Production of Adhesive Composition]

For the propylene-based adhesive [butyl acrylate / acrylic acid = 95/5 (mass ratio), weight average molecular weight = 600,000] 100 parts by mass, conductive particles (man's lion, carbon black) 12 weights were mixed in a solvent. 0.1 parts by weight of an isocyanate-based crosslinking agent (BHS-8515, manufactured by Toyo Ink Co., Ltd.) was obtained to obtain an adhesive composition. In addition, the weight average molecular weight is a commercially available molecular weight measuring machine (body product name "HLC-8220GPC", manufactured by TOSOH Co., Ltd.: analysis column product name "TSKGel Super "HZM-M", manufactured by TOSOH Co., Ltd.: developing solvent The value obtained by tetrahydrofuran) (hereinafter, the same). Moreover, even if the mass fraction is a packaged product after solvent dilution, it is a solid value conversion value (hereinafter, the same.)

[Production of strip for conduction inspection]

The adhesive composition was applied to a release sheet (SP-PET 381031 LK, manufactured by Lintec Co., Ltd.) to a thickness of 35 μm after drying. Drying (drying conditions: 100 ° C, 1 minute), a conductive adhesive layer formed on the release sheet was obtained. Next, the conductive adhesive layer was bonded to the metal film substrate to obtain a conduction inspection tape. The peeled sheets were removed for each evaluation. Result In Table 1. Further, the conductive adhesive layer is laminated on the side opposite to the surface of the substrate on the incident end of the laser light (the other surface side of the substrate).

(Example 2)

In the production of the adhesive composition, a conduction inspection strip was obtained in the same manner as in Example 1 except that the amount of the conductive particles added was 15 parts by weight. The results are shown in Table 1.

(Example 3)

In the production of the adhesive composition, in addition to the use of nickel metal particles (HCA-1 manufactured by Vale. Japan Co., Ltd.) as conductive particles, the addition amount was 75 mass minutes, and the conduction inspection was performed in the same manner as in the first embodiment. Use strips. The results are shown in Table 1.

(Example 4)

In the production of the adhesive composition, in addition to the use of nickel metal particles (Novamet Specialty Products Corporation, #255), the conductive particles were added in an amount of 60 parts by mass, and the conduction test was carried out in the same manner as in the first embodiment. Bands. The results are shown in Table 1.

(Example 5)

In the production of the substrate, in addition to the increase in the number of through holes formed, the ratio of the total area of the through holes to the substrate area was 8%, and the conduction test strip was obtained in the same manner as in Example 1. The results are shown in Table 1.

(Example 6)

In the formation of the metal film, a conduction inspection strip was obtained in the same manner as in Example 1 except that the film thickness of aluminum was 60 nm. The results are shown in Table 1.

(Example 7)

In the formation of the metal film, a conduction inspection strip was obtained in the same manner as in Example 1 except that the film thickness of aluminum was 900 nm. The results are shown in Table 1.

(Example 8)

In the production of the substrate, a strip for conduction inspection was obtained in the same manner as in Example 1 except that a needle (a needle No. 5) was used on a PET film having a thickness of 100 μm to form a through-hole. The results are shown in Table 1.

(Example 9)

In the formation of the metal film, a conduction inspection strip was obtained in the same manner as in Example 1 except that the film thickness of aluminum was 500 nm. The results are shown in Table 1.

(Embodiment 10)

In the production of the substrate, the conduction inspection strip was obtained in the same manner as in Example 1 except that the number of through holes formed was increased and the ratio of the total area of the through holes to the substrate area was 5%. The results are shown in Table 1.

(Example 11)

In the production of the substrate, the conduction inspection strip was obtained in the same manner as in Example 1 except that the number of through holes formed was increased and the ratio of the total area of the through holes to the substrate area was 10%. The results are shown in Table 1.

(Embodiment 12)

In the production of the substrate, a conduction inspection strip was obtained in the same manner as in Example 8 except that the diameter of the formed through-hole was changed. The results are shown in Table 1.

(Comparative Example 1)

A conduction inspection strip was obtained in the same manner as in Example 1 except that a rolled copper foil having a thickness of 35 μm without a through hole was used as the substrate. The results are shown in Table 2.

(Comparative Example 2)

A conduction inspection strip was obtained in the same manner as in Example 1 except that an aluminum foil having a thickness of 50 μm without a through hole was used as the substrate. The results are shown in Table 2.

(Comparative Example 3)

In the formation of the metal film, a conduction inspection strip was obtained in the same manner as in Example 1 except that the film thickness of aluminum was 50 nm. The results are shown in Table 2. In Comparative Example 3, since an extremely thin metal film was formed, a continuous metal film could not be formed on the peripheral side surface of the through hole, and as a result, it was considered that the conductivity in the thickness direction could not be obtained.

The confirmation of whether or not a metal film was formed on the circumferential side surface of the through hole was carried out as follows.

A strip for the conduction inspection was cut, and a scanning electron microscope (SEM-9, VE-9800) was used to observe the cross section, and an energy dispersive X-ray spectroscope (EDX) manufactured by Ametek Co., Ltd. was used. , X-ray analysis of the profile. Elemental measurement was performed, and it was confirmed whether or not the Al element was present on the circumferential side of the through hole, and the other elements in the conduction test strip did not have the Al element.

In the conduction test strip of Comparative Example 3, it was confirmed that the Al element was not present on the circumferential side surface of the through hole, and the Al element was not present in other cross sections.

Further, in the conduction inspection strips of Examples 1 to 12, it was confirmed that Al elements were present on the circumferential side surface of the through holes, and no Al element was present in other cross sections.

10‧‧‧Training inspection tape

1‧‧‧Substrate

2‧‧‧Metal film

3‧‧‧ Conductive adhesive layer

4‧‧‧through holes

5‧‧‧Semiconductor wafer

6‧‧‧Metal coated substrate

Claims (9)

A conduction inspection strip formed by laminating a base material of a plurality of through holes and a metal film substrate formed of a metal film, and a conductive adhesive layer, and having conductivity in a lamination direction, wherein The difference t1 - t2 between the substrate thickness t1 of the peripheral portion of the through hole and the thickness t2 of the substrate other than the peripheral portion of the through hole is 60 μm or less. For example, the strip for conducting inspection according to item 1 of the patent application scope, wherein the thickness of the metal film is 60 to 1000 nm. The strip for continuity inspection according to claim 1, wherein the total area of the through holes on one side of the substrate is 1 to 10% of the area of the substrate. A conduction inspection strip formed by laminating a base material of a plurality of through holes and a metal film base material formed of a metal film, and a conductive adhesive layer, and having conductivity in a lamination direction, wherein the metal The thickness of the film is 60 to 1000 nm. The strip for continuity inspection according to item 4 of the patent application, wherein the total area of the through holes on one side of the substrate is 1 to 10% of the area of the substrate. A conduction inspection strip formed by laminating a base material of a plurality of through holes and a metal film base material formed of a metal film, and a conductive adhesive layer, and having conductivity in a lamination direction, wherein the The total area of the through holes on one side of the substrate is 1 to 10% for the area of the substrate. The conduction inspection strip according to any one of claims 1 to 6, wherein the through hole is formed by laser light. The conductive inspection tape according to any one of claims 1 to 6, wherein the conductive adhesive layer has removability. A conduction inspection method for a conduction inspection strip according to any one of claims 1 to 8.