TWI565596B - Transfer film for in-mold molding and manufacturing method thereof - Google Patents

Description

Transfer film for in-mold forming and method of producing the same

The present invention relates to a transfer film used for in-mold forming and a method of manufacturing the same.

In recent years, most televisions, displays for mobile devices, displays for car navigation systems, and displays for touch panel displays have been used. Anti-Reflection (hereinafter referred to as AR) processing is generally performed on the surface of the display to reduce surface reflected light due to external light and to suppress reflected glare. In the AR treatment method, a method of directly applying an AR material to a surface of a substrate used for a display, a method of performing treatment by vapor deposition, sputtering, or the like, and transferring the AR-treated film to the base are used. The method of the surface of the material, etc. A variety of AR processing methods as described above are used depending on the application.

Among them, in the display of a resin molded article or a cover lens, in one of the methods which are inexpensive and mass-produced in recent years, an insert molding method is applied. In the insert molding method, first, a preformed polyethylene terephthalate (PET) film is preformed using a preform molding die. Thereafter, the preformed AR film with AR is placed for injection molding. Inside the mold. Next, the PET film with AR is integrally molded and transferred onto the surface of the injection molding resin such as polycarbonate (PC) resin.

The AR film for general insertion molding used in the insert molding will be described with reference to Fig. 7 . Fig. 7 is a cross-sectional view showing a conventional AR film 100 for insert molding. The AR film 100 has a base film 101, an AR layer 102, a hard coat layer 103, and an adhesive layer 104.

The base film 101 is formed of a PET or acrylic film. The AR layer 102 has a function of reducing external light reflection on the outermost surface of the molded article. The AR layer 102 can also be formed of a plurality of layers having different refractive indices. The hard coat layer 103 functions as a protective layer for imparting strength and hardness to the AR layer 102. Next, the layer 104 functions to cause the molten resin to adhere to the underlying film 101. As described above, the AR film 100 is composed of a plurality of layers.

Next, a process of transferring the AR film 100 onto the surface of the molded article will be described with reference to FIGS. 7 and 8. Fig. 8 is a view showing a process of insert molding in accordance with each engineering description.

In the case of the work A-1, first, the AR film 100 is disposed between the fixed mold 1A for preforming and the movable mold 2A. The AR film 100 is a single film. At this time, the AR film 100 is disposed such that the AR layer 102 faces the movable mold 2A. Further, the AR film 100 is attracted by the suction holes 4 that form an opening in the movable mold 2A. Next, in the operation A-2, the movable mold 2A is operated to perform mold clamping, and the AR film 100 is preformed. Thereafter, in the work A-3, the movable mold 2A is returned to the original, and the preformed AR film 100 is taken out from the mold.

Next, in the item B-1, the preformed AR film 100 is placed between the movable mold 2B for the main molding and the fixed mold 1B. At this time, the AR film 100 is disposed such that the AR layer 102 faces the movable mold 2B in which the opening of the suction hole 4 is formed. At this time, the preformed AR film 100 is attracted by the suction holes 4. Next, the mold clamping is performed in the project B-2. In the case of the work B-3, the molten resin 6 is poured into the mold by the gate 5 vacated in the fixed mold 1B, and is followed by the adhesive layer 104 provided on the opposite side to the AR layer 102 of the AR film 100. In the case of the work B-4, the mold is opened, and the insert molded article 105 integrally formed with the AR film 100 is taken out from the mold by a protruding pin (not shown).

Next, in the item C-1, the unnecessary film portion inserted into the end portion of the molded article 105 is trimmed by a dedicated cutter 106. In the finishing work C-2, the final AR molded insert 105C is completed.

As the PET film used as the base film 101, a 2-axis stretch film is mainly used. The two-axis stretch film is produced while being stretched in a direction perpendicular to the feed direction. Therefore, residual stress is likely to remain in the inside of the film, and the residual stress distribution tends to be uneven in the surface of the PET film. If there is a portion with a large residual stress and a small portion, a refractive index difference occurs inside the PET film. In the portion where the residual stress is large, since the refractive index difference is large inside the PET film, the reflection of light is large. On the other hand, in a portion where the residual stress is small, the difference in refractive index inside the PET film is small compared to the portion where the residual stress is large, and the amount of reflection of light is also small.

If the AR film 100 including the PET film as described above is used as the base film 101 in the cover lens, the following problems occur. In other words, when the image is projected from the inside of the display, when the light incident on the inside of the cover lens from the inside enters the PET film, the reflection mode of the light changes in a place where the residual stress is large and in a small place. As a result, when the portion where the residual stress is large and the portion where the residual stress is small enters the human eye nitrile, respectively, the difference in the amount of reflection of light at each portion is formed on the display to be recognized as color unevenness.

Therefore, the AR film having a portion where the residual stress is large cannot be used, and is treated as a defective product. In addition, in the case of insert molding, the forming process also includes a number of projects such as pre-forming, formal forming, and finishing.

In order to solve the above problems, there is a case where an in-mold forming method in which only the AR layer is transferred without transferring the film without performing pre-forming and trimming is used.

Next, the configuration of the general transfer type AR film used in the in-mold molding will be described with reference to Fig. 9 . Fig. 9 is a cross-sectional view showing a general transfer type AR film 301. The AR film 301 is a continuous film. The AR film 301 is roughly divided into a carrier layer 302 that has not been transferred to a molded article, and a transfer layer 303 that is transferred to the surface of the molded article. The carrier layer 302 has a base film 201 and a peeling layer 202. The transfer layer 303 has a functional layer of an AR layer 203, a hard coat layer 204, and an adhesive layer 205.

The base film 201 is formed of PET, an acrylic film, or the like, and functions to continuously supply the AR film 301 into the mold. Peeling layer 202 This serves to peel off the base film 201 and the transfer layer 303 transferred to the molded article. The AR layer 203 reduces reflection of external light on the outermost surface of the molded article. The hard coat layer 204 is a protective layer for imparting strength and hardness to the AR layer 203. Next, the layer 205 functions to cause the molten resin to adhere to the transfer layer 303. Wherein, if the hard coat layer 204 also has an adhesive function with the molten resin, the subsequent layer 205 does not need to be specially reformed. As described above, the AR film 301 is composed of a plurality of layers.

Next, a process of transferring the AR film 301 onto the surface of the molded article by an in-mold forming method will be described with reference to Figs. 9 and 10 . Figure 10 is a diagram showing the process of continuous in-mold forming for each project.

In the work A, first, between the fixed mold 1 and the movable mold 2, the AR film 301 is conveyed to a predetermined position by using the feeding device 3. At this time, the AR film 301 is disposed such that the base film 201 faces the movable mold 2. Further, the AR film 301 may be easily heated in a mold, and the AR film 301 may be preheated by a heater (not shown) and then fed into the mold. After the AR film 301 is sent to a predetermined position, in the engineering B, the AR film 301 is attracted by the suction holes 4 vacated in the cavity surface of the movable mold 2, and the cavity surface of the movable mold 2 is AR. The film 301 is molded. At this time, the outer circumference of the AR film 301 is fixedly positioned by a film pressing mechanism (not shown). Thereafter, in the project C, the movable mold 2 is moved to perform mold clamping. Next, in the process D, the molten resin 6 is injected from the gate 5 of the fixed mold 1 toward the adhesive layer 205 of the AR film 301, and the molten resin 6 is filled in the cavity in the mold.

After the filling of the molten resin 6 is completed, in the engineering E, the melt will be melted. The molten resin 6 is cooled to a predetermined temperature. In the work F, the movable mold 2 is operated to open the mold, and the in-mold molded article 7 is taken out. At this time, the carrier layer 302 of the AR film 301 is peeled off from the in-mold molded article 7, and only the transfer layer 303 is transferred. As a result, the AR layer 203 is transferred on the outermost surface of the in-mold molded article 7. Thereafter, in the project G, the protruding pin 8 provided in the fixed mold 1 is pushed out, and the in-mold molded article 7 is taken out from the mold. In the work H, first, the carrier layer 302 of the AR film 301 is prevented from being adsorbed into the cavity of the movable mold 2 by the suction holes 4 for the subsequent molding. Next, by using the feeding device 3, the portion to be formed in the AR film 301 to be conveyed to the next position is transferred to a predetermined position. Repeat the above series of actions to form continuously.

In the case of the in-mold forming method, PET or the like as the base film 201 functions as a carrier for feeding the transfer layer 303 into the mold. That is, the base film 201 is not transferred to the in-mold molded article 7. Therefore, the problem of the residual stress in the PET which is a problem in the above-described insert molding is solved. Further, the AR film 301 is directly fed into the mold from the first place to be injection-molded, and the transfer layer 303 is transferred onto the surface of the in-mold molded article 7 only by taking out the in-mold molded article 7 from the inside of the mold. Therefore, pre-forming of the film and finishing work after forming are not required. Therefore, the in-mold forming method has high productivity and is more efficient than the insert molding method (see, for example, Japanese Laid-Open Patent Publication No. 2012-096412).

The present invention provides a transfer film for in-mold forming which can easily optimize the peel strength between a release layer and a functional layer, and a method for producing the same.

The transfer film for in-mold forming of the present invention has a base film, a release layer, and an antireflection layer. The peeling layer has a first surface that is in contact with the base film and a second surface that is on the back side of the first surface. The antireflection layer is in contact with the second surface of the release layer. The antireflection layer has a first resin having an organic chain, and a plurality of low refractive index fine particles having a lower refractive index than the first resin in the first resin. In the antireflection layer, at least at the interface with the release layer, a plurality of voids in which a part of the organic chain of the first resin is decomposed are provided. Each of the voids is smaller than each of the low refractive index microparticles.

Further, in the method for producing a transfer film of the present invention, first, a base film, a release layer, and a first resin having an organic chain are included in a plurality of low refractive indexes having a lower refractive index than that of the first resin. Rate the antireflection layer of the microparticles and the photocatalyst layer. Next, the photocatalyst layer is irradiated with ultraviolet rays, and at least the voids of the low refractive index microparticles are formed in the antireflection layer at least at the interface with the peeling layer. At this time, electrons are generated in the photocatalyst layer by irradiation of ultraviolet rays, and electrons enter the antireflection layer, and a part of the organic chain is decomposed to form a void. The amount of voids formed by the amount of irradiation of ultraviolet rays at this time is adjusted.

As described above, according to the method for producing a transfer film and a transfer film of the present invention, it is less likely to cause a transfer failure on the surface of the molded article during in-mold molding, and the peeling strength between the release layer and the functional layer such as the AR layer can be obtained. Be the best. Moreover, fine adjustment of the peel strength between the peeling layer and the functional layer can be performed.

1‧‧‧Fixed mode

1A‧‧‧Fixed mode

1B‧‧‧Fixed mode

2‧‧‧ movable mold

2A‧‧‧ movable mold

2B‧‧‧ movable mold

3‧‧‧Feeding device

4‧‧‧Attraction hole

5‧‧‧Gate

6‧‧‧Resin

7‧‧‧In-mold molded products

8‧‧‧Highlight

100‧‧‧AR film

101‧‧‧Base film

102‧‧‧AR layer

103‧‧‧hard coating

104‧‧‧Next layer

105‧‧‧Insert molded products

105C‧‧‧ Inserted molded article with AR

106‧‧‧Cutter

110‧‧‧Transfer type AR film (AR film)

111‧‧‧AR layer

112‧‧‧Photocatalyst layer

113‧‧‧ Pull-up layer

114‧‧‧Low-refractive-index microparticles (first particle)

115A‧‧‧Resin matrix

115B‧‧‧Resin matrix

116‧‧‧Photocatalyst particles (2nd particle)

117‧‧ organic chain

118‧‧‧Electronics

119‧‧‧ gap

120‧‧‧Reeling Department

121‧‧‧Winding Department

122‧‧‧gravure cylinder

123‧‧‧ scraper

124‧‧‧ liquid dish

125‧‧‧Guide roller

126‧‧‧Transfer type AR film (AR film)

127‧‧‧Photocatalyst layer

201‧‧‧Base film

202‧‧‧ peeling layer

203‧‧‧AR layer

204‧‧‧hard coating

205‧‧‧Next layer

210‧‧‧Base film

211‧‧‧heat drying oven

212‧‧‧UV irradiation department

213‧‧‧Metal halogen lamp

214‧‧‧ UV

301‧‧‧AR film

302‧‧‧ Carrier layer

303‧‧‧Transfer layer

Fig. 1A is a cross-sectional view showing a transfer type AR film in the first embodiment of the present invention.

Fig. 1B is a cross-sectional view showing a layer configuration of a transfer type AR film in the first embodiment of the present invention.

Fig. 2 is a view showing the configuration of a coating device for an AR layer in the first embodiment of the present invention.

Fig. 3 is a view showing the configuration of a coating device for a photocatalyst layer in the first embodiment of the present invention.

Fig. 4 is a view for explaining a process of forming a void in the first embodiment of the present invention for each project.

Fig. 5 is a cross-sectional view showing a transfer type AR film of a final form in the first embodiment of the present invention.

Fig. 6 is a view for explaining a coating process of a photocatalyst layer in the second embodiment of the present invention.

Fig. 7 is a cross-sectional view showing a conventional AR film for insert molding.

Fig. 8 is a view showing a process of insert molding in accordance with each engineering description.

Figure 9 is a cross-sectional view showing a general transfer type AR film.

Figure 10 is a diagram showing the process of continuous in-mold forming for each project.

Before explaining the embodiment of the present invention, a problem in the conventional transfer type AR film will be briefly described. In the above-described general transfer type AR film 301, the AR layer 203 is formed of a thermosetting resin such as a silicone resin as an inorganic material from the viewpoint of weather resistance and film strength. shape. In the case as described above, the sol-gel method is applied as a coating liquid for an AR material. When the coating liquid formed by the sol-gel method is used, the AR layer 203 can be formed by wet coating. That is, the thin layer AR layer 203 of about 100 nm can be formed by gravure coating, die coating, or the like.

When the AR material is applied to the release layer 202, the thermosetting epoxy resin contained in the AR material undergoes a thermosetting reaction, and when the reaction proceeds, a three-dimensional crosslinked structure is formed. At this time, the AR material enters the fine concavities and convexities existing on the peeling layer 202, and if the thermosetting reaction proceeds, the fine concavities and convexities existing on the peeling layer 202 or in the peeling layer 202 are between the peeling layer 202 and the AR layer 203. The contacts will increase. As a result, the adhesion between the peeling layer 202 and the AR layer 203 is improved, and the AR layer 203 is less likely to be peeled off by the peeling layer 202. If the peeling strength between the peeling layer 202 and the AR layer 203 becomes excessively large, the AR layer 203 which should be transferred to the surface of the molding resin at the time of molding is not smoothly peeled off by the peeling layer 202, and the AR layer 203 is not completely removed by the peeling layer 202. When the mold is released, a part of the AR layer 203 remains on the peeling layer 202, and transfer failure easily occurs.

As described above, when the peeling strength between the peeling layer 202 and the AR layer 203 is excessively large at the time of molding, and the AR layer 203 is not beautifully transferred to the surface of the molded article, it is necessary to reduce the peeling layer 202 and the AR layer 203. The adjustment of the peel strength between. When the conventional AR film 301 reduces the peel strength between the peeling layer 202 and the AR layer 203, generally, the peeling layer 202 is adjusted by changing the material composition of the peeling layer 202 or changing the thickness of the peeling layer 202. Peel strength. Therefore, it is necessary to optimize each time the material is laminated on the peeling layer 202. At the time of optimization, a specific layer The material on the release layer 202 is repeatedly altered in material composition and thickness by continuous testing and failure. Therefore, it takes time to optimize. In other words, the peel strength cannot be adjusted in an instant and with a degree of freedom according to various conditions. If the composition is determined, the peel strength cannot be adjusted, and the peel strength cannot be easily optimized.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)

1A and 1B are cross-sectional views showing transfer-type AR thin films (hereinafter referred to as AR thin films) 110 and 126 in the first embodiment of the present invention. The AR film 110 has a photocatalyst layer 112 and a hard coat layer 204, respectively, and FIG. 1A also shows an enlarged view of the AR layer 111 and the photocatalyst layer 112. The AR film 126 has a photocatalyst layer 127 that also functions as a hard coat layer, and FIG. 1B also shows an enlarged view of the photocatalyst layer 127 and the AR layer 111. In FIGS. 1A and 1B, the same components as those in FIGS. 7 to 9 are denoted by the same reference numerals, and description thereof will be omitted.

The AR film 110 shown in FIG. 1A basically has a base film 201, a peeling layer 202, an AR layer 111 as an antireflection layer, a photocatalyst layer 112, a post-hardening type hard coat layer 204, a puller layer 113, and an adhesive layer 205. The layers are laminated in this order. Further, on the side opposite to the AR layer 111 of the base film 201, a charging prevention layer may be provided as needed.

In general, as the base film 201, a PET film or an acrylic film having an average thickness of 20 to 100 μm can be used. In the following description Among them, a PET film having an average thickness of 50 μm was used.

The peeling layer 202 is formed of a general melamine resin, an olefin resin, or the like, and has an average thickness of 0.03 to 0.15 μm. In the following description, a melamine resin was used to form an average thickness of 1 μm.

Next, the AR layer 111 will be described. As shown in a partially enlarged view of FIG. 1A, the AR layer 111 has a resin matrix 115A formed of a first resin, and a plurality of low refractive index fine particles (hereinafter, dispersed and formed of an inorganic material in the resin matrix 115A (hereinafter It is the first particle) 114.

The first particles 114 have a lower refractive index than the first resin constituting the resin matrix 115A. Specifically, the refractive index of the first particles 114 is 1.2 or more and 1.4 or less. Examples of the material of the first particles 114 include porous ceria, hollow ceria, magnesium fluoride, and cryolite. In addition to these, if the same low refractive index is exhibited, it is not necessary to be limited to these. Further, these may be used alone or in combination of two or more types.

The first resin is a silicone resin such as a curable resin. The resin matrix 115A may also be formed by using, for example, an alkyloxy resin having an organic chain in the molecule. Alternatively, the resin matrix 115A may be formed by using a plurality of oxime resins having different kinds of organic chains in the molecule. As the oxime resin having an organic chain in the molecule, a series of oxime resins having a hydrolyzable formyl group are mentioned. The above-described oxime resin can be prepared by at least one of an organic hydrolyzed condensate and a partial hydrolyzate thereof. The molecule which hydrolyzes the condensable compound has an organic chain and a hydrolyzable formyl group bonded to each phase of both ends of the organic chain. this In addition, a substituent may be bonded to the organic chain. In terms of the organic chain, an alkyl group, a fluorinated alkyl group, an ether group, a vinyl group, an epoxy group, an amine group, a methacryl group, a fluorenyl group, etc. may be mentioned, and a phthalocyanine resin having the same may be used. The first resin. Further, a decane coupling agent having an organic chain may be used as a main component of the oxirane resin having no organic chain. Two or more types of oxime resins having these organic chains may be used alone or in combination as the first resin. A decane coupling agent having no organic chain and a decane coupling agent having an organic chain may be used alone, or two or more types of decane coupling agents having different types of organic chains may be used in combination. In addition, the AR layer 111 can be simultaneously provided with other functions such as antifouling and fingerprint resistance. In this case, an additive such as a water repellent agent such as a fluorocarbon resin, a charge prevention agent, and a metal oxide fine particle having a charge prevention effect may be added together.

The average thickness of the AR layer 111 is preferably 0.05 μm or more and 0.15 μm or less, and more preferably 0.08 μm or more and 0.12 μm or less. When the average thickness is thinner than 0.05 μm, the strength of the film of the AR layer 111 tends to be weak, and if it is thicker than 0.15 μm, the reflectance of the AR layer 111 in the visible light region becomes high, and the effect of preventing reflection cannot be obtained.

In the AR layer 111, the weight ratio of the first particles 114 to the first resin determines the refractive index of the AR layer 111. When the porous ceria having an average particle diameter of 0.04 μm is used as the first particles 114, the weight ratio is preferably 30% by mass or more and 85% by mass or less based on 100% by mass of the solid content. It is preferably 40% by mass or more and 80% by mass or less. When the first particles 114 are contained in a range of 40% by mass or more and 80% by mass or less, the refractive index of the AR layer 111 itself is 1.31. 1.38 or so.

When the weight ratio is less than 30% by mass, the AR layer 111 is not sufficiently lowered in refractive index, and it is difficult to exhibit desired reflection preventing performance. Further, when the weight ratio of the porous ceria is more than 85% by mass, the mechanical strength of the AR layer 111 becomes weak, and the abrasion resistance is lowered. That is, sufficient film strength cannot be obtained.

For the first particles 114 dispersed in the resin matrix 115A, a sol type, a spherical type, a porous type, or the like can be used. The average particle diameter of the first particles 114 is preferably 0.01 μm or more and 0.1 μm or less. If the average particle diameter is less than 0.01 μm, it is difficult to adjust the refractive index of the AR layer 111 to a predetermined desired value. When the average particle diameter is larger than 0.1 μm, when the AR layer 111 is applied by a gravure coater or the like, aggregates of the first particles 114 are likely to occur, and the coating film surface on the applied film is likely to be agglomerated. The appearance of the object is poor.

Next, the photocatalyst layer 112 will be described. As shown in a partially enlarged view of FIG. 1A, the photocatalyst layer 112 has a resin matrix 115B formed of a second resin, and a plurality of photocatalyst fine particles (hereinafter referred to as second particles) 116 contained (dispersed) in the resin matrix 115B. In the second particle 116, for example, titanium oxide or zinc oxide which can be easily obtained is preferably used. However, in the case of photocatalyst, in addition to tin oxide, iron oxide, zirconium oxide, tungsten oxide, chromium oxide, molybdenum oxide, cerium oxide, cerium oxide, lead oxide, cadmium oxide, copper oxide, vanadium oxide, cerium oxide, cerium oxide, In addition to metal oxides such as manganese oxide, cobalt oxide, cerium oxide, nickel oxide, and cerium oxide, barium titanate or the like may be substituted. However, in addition to these, it is not necessary to be limited to these materials in order to achieve the same effect. In addition, the second particles can be 116 alone or in combination of two or more types.

The second resin constituting the resin matrix 115B is, for example, a silicone resin containing no organic chain. From the viewpoint of the refractive index of the photocatalyst layer 112, if a photocatalyst layer 112 having a higher refractive index is to be formed, other metal alkoxides (for example, titanium, zirconia, etc.) may be used alone or in combination to form a resin matrix. 115B.

The average thickness of the photocatalyst layer 112 is preferably 0.01 μm or more and 0.3 μm or less, and more preferably 0.03 μm or more and 0.15 μm or less. If the average thickness is thinner than 0.01 μm, the photocatalytic action of the photocatalyst layer 112 becomes weak, and when the organic matter in the AR layer 111 is decomposed as described later, it is not sufficient. Further, when an inorganic thermosetting resin is used as the second resin, when the average thickness is more than 0.3 μm, the flexibility of the photocatalyst layer 112 is lowered, and it is broken during molding in the mold, and micro cracks are likely to occur.

In the photocatalyst layer 112, the weight ratio of the second particles 116 to the second resin determines the photocatalytic action and the refractive index. When titanium oxide having a diameter of 0.05 μm is used as the second particles 116, the weight ratio is preferably 20% by mass or more and 90% by mass or less based on 100% by mass of the solid content. It is preferably 50% by mass or more and 80% by mass or less. If the above weight ratio is less than 20% by mass, the photocatalytic action of the photocatalyst layer 112 is not sufficiently exhibited. In addition, when the weight ratio is more than 90% by mass, the resin is less converted, and the mechanical strength such as adhesion to other layers is lowered.

In the second particle 116, the refractive index of the photocatalyst layer 112 can be made high by using titanium oxide or zinc oxide which are relatively easy to obtain, and the high refractive index layer can be disposed in the lower portion of the AR layer 111. Therefore, in optical design, In the AR film 110, a transfer type AR film having a low external light reflectance and less glare on the surface can be produced.

Further, as the second particles 116 dispersed in the resin matrix 115B, a sol type, a spherical type, a porous type or the like can be used. The average particle diameter of the second particles 116 is preferably 0.01 μm or more and 0.1 μm or less. If the average particle diameter is less than 0.01 μm, it is difficult to sufficiently obtain the photocatalytic effect of the photocatalyst layer 112. When the average particle diameter is larger than 0.1 μm, when the photocatalyst layer 112 is applied by a gravure coater or the like, aggregates of the second particles 116 are likely to be formed, and the appearance of defects due to the second particles 116 is caused on the film.

The hard coat layer 204 is an ultraviolet curable post-curing type, and is formed so that the average thickness after drying is 2 μm or more and 10 μm or less. If the average thickness of the hard coat layer 204 is less than 2 μm, sufficient hardness cannot be obtained after the formation. Further, when it is more than 10 μm, it is difficult to cut during molding in the mold, which causes burrs. The ultraviolet curable post-hardening type hard coat layer 204 is cured by being irradiated with ultraviolet rays after molding in the mold. Therefore, in the state of the AR film 110 before the in-mold forming, the ultraviolet curable resin constituting the hard coat layer 204 is not completely photohardened (polymerized), and is present in an unhardened or semi-hardened state. The hard coat layer 204 is photohardened (polymerized) using a metal halide lamp after molding in the mold. The puller layer 113 and the adhesive layer 205 are each formed so that the average thickness after drying becomes 1 μm or more and 10 μm or less. Further, with regard to the layers, it is possible to form the single layer or the plural layer, which is not a problem.

If you want to give design, concealment, etc., you can connect with the pull-up layer 113. Between the layers 205, a decorative printed layer (not shown) is formed with an appropriate thickness as appropriate. The puller layer 113, the print layer, and the adhesive layer 205 can be formed by a gravure coater, a knurling wheel coater, roll coating, gravure printing, screen printing, inkjet printing, or the like. Further, the printed layer can be formed by an appropriate method each time by a desired design by metal deposition, sputtering, painting, or the like other than ink. The function of the primer layer 113 and the adhesion layer 205 may be also applied to the hard coat layer 204, and the configuration of the puller layer 113 and the adhesion layer 205 may be omitted.

On the other hand, as described above, the AR film 126 shown in FIG. 1B has a photocatalyst layer 127 which also uses the photocatalyst layer 112 and the hard coat layer 204 shown in FIG. 1A. That is, the photocatalyst layer 127 contains the second particles 116 and functions as a protective layer or a hard coat layer. As shown in a partially enlarged view, the photocatalyst layer 127 is formed on the AR layer 111 and is formed thicker than the AR layer 111. The average thickness is preferably 2 μm or more and 10 μm or less. If the average thickness is thinner than 2 μm, sufficient hardness for supporting the AR layer 111 is hard to occur, and if it is thicker than 10 μm, it is difficult to cut at the time of transfer, and burrs are likely to occur.

The photocatalyst layer 127 is sufficiently thicker than the AR layer 111, and it is difficult to decompose even by the photocatalytic action obtained by the second particles 116. Therefore, the photocatalyst layer 127 can be formed by using an organic resin having high durability, such as thermoplasticity, thermosetting property, ultraviolet ray, and electron beam curing acrylic resin. In addition, in the same manner as in FIG. 1A, a decorative printed layer (not shown) may be formed between the puller layer 113 and the adhesive layer 205 as appropriate, as appropriate. Forming the puller layer 113, The method of printing the layer and the subsequent layer 205 is as described above.

Next, a coating process of the AR liquid when the AR layer 111 is formed will be described with reference to FIGS. 1A to 2 . FIG. 2 is a view showing the configuration of a coating device for an AR liquid in the AR film 110. In FIG. 2, the same components as those in FIGS. 1A, 1B, and 7 to 9 are denoted by the same reference numerals, and description thereof will be omitted.

First, the base film 210 with the release layer is prepared, and the release layer is placed toward the coated surface. The coating device includes a unwinding portion 120 of the base film 210 and a winding portion 121. The unwinding unit 120 continuously supplies the base film 210 in order to apply the AR liquid. The winding unit 121 winds the base film 210 to which the AR liquid is applied. The base film 210 is continuously conveyed in the directions indicated by X1 and X2 in Fig. 2 . In addition, in order to prevent the occurrence of wrinkles on the base film 210 due to peeling and charging during conveyance, a charging prevention layer (not shown) is formed in advance on the surface of the base film 210 opposite to the peeling layer.

The base film 210 is formed, for example, of a PET film. In addition, a plastic film or a plastic sheet formed of a material such as polyacrylonitrile, polyurethane, polyolefin, polycarbonate, or cellulose triacetate may be used. The average thickness of the PET film constituting the base film 210 is appropriately selected depending on the purpose, and the average thickness when used in roll-to-roll coating is preferably 20 μm or more and 250 μm or less. If the average thickness is less than 20 μm, the tension control during transportation is difficult, and the PET film is plastically deformed to cause extended wrinkles. Alternatively, when various layers are laminated on the base film 210, the PET film is easily warped due to heat hardening shrinkage during drying of the coating agent, and handling in the post-engineering process becomes difficult. In addition, if the average thickness is greater than 250 μm, When the reel is produced, the coating length becomes long, and the winding core diameter of the reel when the reel is wound is excessively large. Therefore, the cost of being difficult to handle or as a PET film in post-engineering is also high. However, it is not limited to the above range, and it is not a problem to use a PET film or another resin film having an average thickness other than the above range depending on the demand and use. In the present embodiment, the AR layer 111 is applied by a roll coating apparatus, and a PET film having an average thickness of 50 μm is used as the base film 210.

The AR liquid is applied to the surface of the base film 210 where the peeling layer 202 is provided. Therefore, coating was performed using a gravure coater. The coating portion is composed of a gravure cylinder 122 for applying the AR liquid to the separation layer 202, and a guide roller 125. The guide roller 125 applies tension to the base film 210 when the AR liquid is transferred to the base film 210 by the gravure cylinder 122. Therefore, the guide roller 125 and the intaglio cylinder 122 are disposed to sandwich the base film 210 therebetween. The guide roller 125 is also disposed at a desired portion or the like in order to guide the base film 210 or to maintain tension. A groove having a depth of several tens of μm (not shown) is spirally formed in the gravure cylinder 122, and the AR liquid is supplied into the groove. Further, the gravure cylinder 122 is rotated clockwise as shown in FIG. When the gravure cylinder 122 is immersed in the AR liquid in the liquid dish 124, the AR liquid is supplied to the spiral groove of the gravure cylinder 122. Next, the doctor blade 123 scrapes the AR liquid from the surface of the gravure cylinder 122 to a predetermined liquid amount, and the AR liquid is in a state of remaining only in the groove of the gravure cylinder 122 before coming into contact with the peeling layer 202. Thereafter, when the gravure cylinder 122 comes into contact with the peeling layer 202, the AR liquid in the groove of the gravure cylinder 122 is transferred onto the peeling layer 202, and an AR is formed on the peeling layer 202. A film of a wet state of liquid. As shown above, the AR layer 111 uniformly spread over the base film 210 is formed.

In addition, in the coating method of the AR liquid, in addition to gravure printing, all other coating methods such as die coating, calendar coating, and roll coating may be used.

In the next process, in order to thermally cure the AR liquid on the peeling layer 202, the base film 210 is transferred to the thermal drying furnace 211. In the heat drying furnace 211, a general apparatus such as a hot air furnace or an infrared heater (IR) furnace or a hot air drying furnace in combination with hot air and IR can be used. In the present embodiment, the AR layer 111 is thermally dried at 150 ° C for 1 minute using a hot air circulating furnace, and is thermally cured. The AR layer 111 having a refractive index of 1.36 and an average thickness after drying of 0.1 μm was formed on the peeling layer 202 as shown above.

The AR liquid used in the present embodiment contains a porous ceria sol as the first particles 114 and contains alkyl decane as a binder. These were dispersed in water, added with nitric acid to be hydrolyzed, and diluted with isopropyl alcohol so that the solid content became 5% to prepare an AR liquid. Therefore, in this example, the AR layer 111 contains a small amount of a decane bond.

Next, the coating process of the photocatalyst coating material will be described with reference to FIGS. 1A, 1B, 3, and 4. FIG. 3 is a view showing the configuration of a coating device of the photocatalyst layer 112. Fig. 4 is a view for explaining the void formation process for each project. In FIGS. 3 and 4, the same components as those in FIGS. 1A to 2 and 7 to 9 are denoted by the same reference numerals, and description thereof will be omitted. In Fig. 3, similar to the coating process of the AR liquid of Fig. 2, photocatalyst coating The coating process is also applied by a gravure coater.

First, in the unwinding unit 120, the base film 210 coated with the AR layer 111 is placed such that the AR layer 111 serves as a coating surface. Next, a photocatalyst coating is applied onto the AR layer 111 of the base film 210. The photocatalyst coating system mainly contains titanium oxide as the second particles 116 and contains a cerium oxide resin as a binder. After coating the photocatalyst coating with a gravure coater so that the average thickness after drying was 0.12 μm, it was thermally dried at 150 ° C for 2 minutes by a heat drying oven 211, and thermally cured. The refractive index of the photocatalyst layer 112 is 1.80. As described above, the photocatalyst layer 112 is uniformly formed on the AR layer 111.

Thereafter, the photocatalyst layer 112 is irradiated with ultraviolet rays by the metal halide lamp 213, which is disposed in the ultraviolet irradiation unit 212 after the thermal drying furnace 211. In the case of ultraviolet lamps, low-pressure mercury, high-pressure mercury, LED-UV lamps, and the like can also be used.

Next, a mechanism for adjusting the peel strength between the peeling layer 202 and the AR layer 111 on the base film 210 will be described with reference to FIG. 4 . In FIG. 3, when the base film 210 is conveyed to the ultraviolet ray irradiation unit 212, as shown in the item (a), the ultraviolet ray 214 is irradiated to the photocatalyst layer 112 by the metal halide lamp 213. At this time, as shown in the item (b), the electrons 118 having high reactivity are largely discharged to the outside by the second particles 116 in the photocatalyst layer 112. Therefore, most of the electrons 118 having high reactivity are formed in the photocatalyst layer 112. status. The resin matrix 115B forming the photocatalyst layer 112 does not have an organic chain, but only a decane bond. The electron 118 is in the photocatalyst layer 112 because it has less energy than the decane bond. The redox reaction does not occur between the matrix 115B and the electrons 118. Therefore, the emitted electrons 118 move around in the photocatalyst layer 112 and move into the adjacent AR layer 111.

The bonding energy of the organic chain in the resin matrix 115A constituting the AR layer 111 is smaller than that of the decane bond, and is also smaller than the energy of the electron 118. Therefore, an oxidation-reduction reaction occurs between the electron 118 having high energy and the organic chain 117 having a bonding energy smaller than the energy of the electron 118, and the + electric charge is taken up by the organic chain 117, and the electron 118 is stabilized. As a result, the bond of the organic chain 117 which is captured + charged is detached in the resin matrix 115A. That is, the organic chain 117 in the resin matrix 115A is decomposed. A large amount of electrons 118 appearing from the second particles 116 overlap the redox reaction with the organic chain 117 in the AR layer 111, and the + electrons are repeatedly taken up by the organic chain 117 existing in the resin matrix 115A in the AR layer 111. As a result, in the AR layer 111, the molecular bonding of the organic chain 117 of the resin matrix 115A is successively cut, and the decomposition of the organic chain 117 in the AR layer 111 progresses.

By the reaction shown above, in the process (c) of finally irradiating the ultraviolet ray 214 of the specific integrated light amount, the void 119 can be formed in the portion where the organic chain 117 in the resin matrix 115A in the AR layer 111 is decomposed. As a result, innumerable voids 119 which are smaller than the size of the first particles 114 are generated in the AR layer 111. As described above, in the microscopic viewpoint, the void 119 is generated in the AR layer 111 at the portion where the organic chain 117 is decomposed and disappears. Therefore, the respective results of the voids 119 exist between the respective ends of the two organic chains 117. The size of the first particles 114 and the voids 119 is the portion where the diameter of the first particles 114 and the voids 119 is the largest. length.

By the voids 119 formed as described above, a portion having no contact between the peeling layer 202 and the AR layer 111 is formed, and the adhesion between the peeling layer 202 and the AR layer 111 is lowered. As described above, in the AR film 110, the peeling strength between the peeling layer 202 and the AR layer 111 is reduced by the effect of the voids 119 formed between the peeling layer 202 and the AR layer 111. The amount of decomposition of the organic chain 117 in the AR layer 111 is related to the peel strength between the peeling layer 202 and the AR layer 111. Therefore, by appropriately adjusting the energy of the ultraviolet ray 214 irradiated on the photocatalyst layer 112, the amount of decomposition of the organic chain 117 in the AR layer 111 can be adjusted, and the amount of formation of the void 119 can be adjusted.

Next, another adjustment method of the amount of decomposition of the organic chain 117 in the AR layer 111 will be described.

In this method, a resin matrix of the AR layer 111 is composed of a mixture of two types of epoxy resins. One of the oxime resins forms a molecular structure containing the organic chain 117 after the AR layer 111 is thermally hardened. The other epoxy resin forms a molecular structure which does not contain the organic chain 117 after the AR layer 111 is thermally hardened. An example of the latter epoxy resin is methyl decanoate or tetraethoxy decane.

If the resin matrix as shown above is formed, since the thermosetting reaction has already ended in the thermal drying furnace 211, there is no organic chain 117 in the portion where the resin matrix in the AR layer 111 is formed with methyl decanoate or tetraethoxysilane. . Therefore, even if the photocatalyst layer 112 is irradiated with the ultraviolet ray 214, the epoxy resin which does not contain the molecular structure of the organic chain 117 after the thermosetting reaction does not Decomposed. On the other hand, by irradiating the photocatalyst layer 112 with the ultraviolet ray 214, the oxime resin which has a molecular structure containing the organic chain 117 after the thermosetting reaction is decomposed.

As described above, the resin matrix of the AR layer 111 is constituted by a mixture of a cerium oxide resin containing the organic chain 117 after the thermosetting reaction and a cerium oxide resin having a molecular structure which does not contain the organic chain 117 after the thermosetting reaction. The amount of voids in the AR layer 111 can be adjusted.

Further, in order to promote the decomposition of the organic chain 117 in the AR layer 111 more efficiently, the second particles 116 may be contained in the release layer 202. As a result, when the photocatalyst layer 112 of FIG. 4 is irradiated with the ultraviolet ray 214, the photocatalytic action acts on the AR layer 111 from the two directions of the peeling layer 202 and the photocatalyst layer 112, and the organic chain in the AR layer 111 can be efficiently in a short time. Good decomposition. In order to keep the peeling layer 202 smooth, it is sufficient to use an inorganic resin such as a silicone resin for the resin constituting the peeling layer 202. At this time, the peeling layer 202 can be prevented from being decomposed by the photocatalytic action by the second particles 116.

In the present embodiment, after the photocatalyst layer 112 is formed, the ultraviolet ray 214 generated by the metal halide lamp 213 is irradiated with the ultraviolet ray irradiation unit 212. At this time, the wavelength of the ultraviolet ray 214 was set to 365 nm, and the irradiation time was adjusted so that the integrated light amount became 1200 mJ/cm ² . The integrated light amount of the ultraviolet ray irradiated to the photocatalyst layer 112 is preferably 700 mJ/cm ² or more and 5000 mJ/cm ² or less. If the integrated light amount is less than 700 mJ/cm ² , a sufficient number of electrons 118 are not generated when the organic chain 117 in the AR layer 111 is decomposed by the photocatalytic action by the photocatalyst layer 112. Further, if the integrated light amount is more than 5000 mJ/cm ² , the base film 201 is deteriorated. However, the amount of integrated light is not limited to the above range, and the type of the base film 201 to be used, the amount of the second particles 116 contained in the photocatalyst layer 112, and the content of the organic chain 117 in the AR layer 111 and The amount of decomposition of the organic chain 117 in the obtained AR layer 111 may be appropriately adjusted. If the effect obtained by forming the voids 119 is available, there is no problem even if the integrated light amount is outside the above range.

After the process (c) shown in FIG. 4, the post-curing type is applied by a gravure coater so that the average thickness after drying is 5 μm, similarly to the coating process of the AR layer 111 described with reference to FIG. Hard coating 204. Thereafter, the adhesive layer 205 which can be bonded to the polycarbonate of the injection molding resin was applied by a gravure coater so as to have an average thickness of 2 μm after drying.

A cross-sectional view of the AR film 110 formed by the above process is shown in FIG. In the AR thin film 110, at the interface between the peeling layer 202 and the AR layer 111, there are innumerable voids 119 in the AR layer 111 which are smaller than the size of the first particles 114. In the region where the voids 119 are formed, there is no contact between the peeling layer 202 and the AR layer 111, and thus the adhesion is low. As a result, in the AR film 110, the peel strength between the peeling layer 202 and the AR layer 111 is smaller than that of the conventional transfer type AR film by the voids 119 which are present innumerable between the peeling layer 202 and the AR layer 111. Further, since the amount of the voids 119 formed can be adjusted by the amount of ultraviolet rays to be irradiated, the peel strength can be easily adjusted, and the peel strength can be optimized.

In addition, by the innumerable voids 119 formed in the AR layer 111, An air layer is formed in the AR layer 111, and the refractive index of the AR layer 111 becomes smaller. Further, at the interface between the AR layer 111 and the photocatalyst layer 112, in the space 119, a part of the photocatalyst layer 112 disposed on the AR layer 111 is formed to be exposed by the AR layer 111. Thereby, after the AR layer 111 is transferred to the molded article, if ultraviolet rays are irradiated onto the surface of the AR layer 111, the photocatalytic effect of the photocatalyst layer 112 can also cause contaminants such as organic substances attached to the surface of the AR layer 111. break down. Further, after the AR layer 111 is transferred to the molded article, if the hard coat layer 204 is to be protected by the photocatalytic action of the photocatalyst layer 112, a layer of inorganic layer is disposed between the photocatalyst layer 112 and the hard coat layer 204 as needed. The protective layer (not shown) formed by the material may be used. The hard coat layer 204 is not affected by the photocatalytic action of the photocatalyst layer 112 by providing a protective layer.

The peeling strength between the peeling layer 202 and the AR layer 111 is small compared to the conventional transfer type AR film having no photocatalyst layer 112. Therefore, when the AR film 110 is used, when in-mold forming is performed by a polycarbonate resin, When the AR layer 111 is released from the peeling layer 202, transfer failure of the AR layer 111 to the molded article is less likely to occur, and the AR layer 111 can be stably transferred.

(Embodiment 2)

In the transfer type AR film, the peeling strength between the peeling layer and the AR layer transferred to the portion of the molded article is set to a relatively small state. However, if the peeling strength between the peeling layer and the AR layer of the portion not to be transferred is small, the transfer layer is easily peeled off by the peeling layer, and when the width of the transfer type AR film is made uniform, the slit is used. Engineering, including the transfer layer of the AR layer by stripping The peeling layer is peeled off and becomes a factor of powder scattering due to the transfer layer. When the powder as described above is scattered to the slit of the film, if a part of the powder is mixed into the transfer type AR film roll during the slit processing, it is formed as a foreign matter, and the mixed powder adheres to the transfer type AR film surface. In the state as described above, the transfer type AR film is directly wound, and the transfer layer at the portion becomes uneven, and printing defects occur. Therefore, the peeling strength between the peeling layer and the AR layer at the portion where the slit processing is performed is preferably kept larger than the portion to be transferred.

However, in the conventional method for adjusting the peel strength between the peeling layer and the AR layer, the peel strength of the entire film on which the peeling layer is formed is substantially the same in the plane. Therefore, in order to change the peeling strength of the transfer type AR film in the film surface, the peel strength between the peeling layer formed on the same film and the AR layer is the same value. Therefore, it is extremely difficult to change the peel strength between the peeling layer and the AR layer of only a specific portion in the plane of the transfer type AR film.

In the second embodiment of the present invention, the peeling strength between the peeling layer and the AR layer is easily optimized, and the transfer film and transfer which solve the above problems are also described with reference to FIGS. 1A and 6 . A method of manufacturing a film.

Fig. 6 is a view for explaining a coating process of the photocatalyst layer in the embodiment. In FIG. 6, the same components as those in FIGS. 1A to 4 and 7 to 9 are denoted by the same reference numerals, and description thereof will be omitted.

The base film 210 with the peeling layer similar to the first embodiment shown in FIG. 3 is used, and the process of applying the AR layer 111 is the same as that of the first embodiment. To the same, the AR layer 111 was applied to the release layer of the base film 210 in a roll to roll gravure coater. In the application of the photocatalyst layer 112, after the thermal drying process of the photocatalyst layer 112, the engineering system in which the photocatalyst layer 112 is irradiated with the ultraviolet ray 214 by the metal halide lamp 213 of the ultraviolet ray irradiation unit 212 is performed in the next process. In FIG. 6, a partial enlarged view showing the manner in which the photocatalyst layer 112 is irradiated with the ultraviolet ray 214 in the ultraviolet ray irradiation unit 212 is shown in two configurations (a) and (b). Partial enlarged views (a) and (b) are plan views showing the inside of the ultraviolet ray irradiation unit 212 when the ultraviolet ray 214 is irradiated in a direction orthogonal to the irradiation direction of the ultraviolet ray 214. Hereinafter, a direction perpendicular to the feeding direction of the base film 210 indicated by an arrow is referred to as a wide direction.

When applied by a gravure coater, the coating amount of the coating agent is larger than the center portion at both end portions in the wide direction. Therefore, the thickness of the coating film differs in the center portion and the end portion in the wide direction. In order to match the height (thickness) at the center portion and the end portion of the transfer type AR film of the finished product, it is necessary to perform slit processing on the transfer type AR film film. That is, after the transfer type AR film is completed, both ends of the base film 210 are subjected to slit processing to eliminate the convex portion on the surface of the transfer type AR film. As described above, the height of the center portion and the end portion of the transfer type AR film roll, that is, the thickness of the center portion and the end portion of the transfer type AR film roll are matched.

At the time of slit processing, the AR layer 111 is peeled off by the peeling layer 202, and a part of the transfer layer including the AR layer 111 is peeled off by the peeling layer 202, and is scattered as a powder and is a problem. As described above, if the scattered powder is mixed into the transfer type AR film roll in the slit processing, at the portion where the powder is mixed, The unevenness is formed by the powder, the transfer layer of the transfer type AR film is deformed, or the decorative printing and the forming process of the post-engineering process become foreign matter, and a defective product occurs. Therefore, in order to prevent generation of powder, it is preferable that the peeling strength between the peeling layer 202 and the AR layer 111 is large.

In the present embodiment, in order to suppress generation of powder during slit processing of the transfer type AR film, as shown in Fig. 6(a), a coating width larger than that of the base film 210 in which the AR layer 111 and the photocatalyst layer 112 are formed is used. The wide-width metal halide lamp 213 is irradiated with ultraviolet rays 214 to the photocatalyst layer 112. Alternatively, the irradiation intensity is higher than the ultraviolet irradiation amount (illuminance) of the center portion, and the ultraviolet irradiation amount (illuminance) at the end portion is a weak metal halide lamp 213. By using the metal halide lamp 213 as described above, the amount of decomposition of the organic chain 117 in the AR layer 111 by the photocatalyst layer 112 is reduced at both end portions as compared with the central portion. Thereby, the peeling strength between the peeling layer 202 and the AR layer 111 can be maintained in a state larger than the center portion in the width direction at both end portions in the wide direction. Therefore, at the time of slit processing, it is difficult to peel off the transfer layer containing the AR layer 111 by the peeling layer 202, and the occurrence of powder is suppressed. Thereby, it is possible to reduce the mixing of the powder into the transfer type AR film roll in the slit processing.

Further, the base film 210 having a large width is used to increase the coating width. For example, after the transfer type AR film is completed, the center portion in the wide direction is also subjected to slit processing, and is divided into two or more in the wide direction. The situation. In the case shown above, as shown in FIG. 6(b), the slit width is matched so that the amount of ultraviolet irradiation of the photocatalyst layer 112 at the end portion and the center portion is reduced, and two metal halide lamps 213 are provided. Or, use 1 metal halide The lamp 213 has only the center portion to adjust the amount of ultraviolet rays. Therefore, in the metal halide lamp 213, an ultraviolet cut filter that can be adjusted to a specific ultraviolet energy is attached to a place corresponding to the slit processing, and the photocatalyst layer 112 is irradiated with the ultraviolet ray 214. Thereby, the amount of decomposition of the organic chain 117 in the AR layer 111 can be reduced at both end portions and the center portion of the transfer type AR film in the width direction. As a result, the peeling strength between the peeling layer 202 of the portion and the AR layer 111 can be maintained at a state larger than the other portions of the transfer. Thereby, similarly to the configuration shown in FIG. 6(a), at the time of slit processing, generation of powder due to the transfer layer containing the AR layer 111 peeled off by the peeling layer 202 at the slit portion can be suppressed. Therefore, it is possible to prevent the powder from scattering during the slit processing, and it is possible to prevent the foreign matter from being mixed due to the scattering of the powder in the transfer type AR film roll during the slit processing.

As described above, the peeling strength between the peeling layer 202 and the AR layer 111 can be easily optimized, and the powder scattering can be prevented during the slit processing of the AR film 110.

In the present embodiment, the irradiation amount of the ultraviolet ray 214 is adjusted in the central portion and the both end portions in the wide direction. However, the irradiation amount of the ultraviolet ray 214 may be constant, and the central portion and the end portion may be changed in the AR layer 111. The amount of the organic chain 117 is thereby adjusted for the peel strength.

As described above, the AR film 110 (126), which is a transfer film for in-mold forming obtained in the present embodiment, has a base film 201, a peeling layer 202, and an AR layer 111 as an antireflection layer. The peeling layer 202 has a first surface that is in contact with the base film 201 and a second surface that is on the back side of the first surface. The AR layer 111 is in contact with the second surface of the peeling layer 202. The AR layer 111 has a first resin (resin matrix 115A) having an organic chain 117, and a plurality of low refractive index fine particles 114 included in the first resin and having a lower refractive index than the first resin. In the AR layer 111, at least at the interface with the peeling layer 202, a plurality of voids 119 in which a part of the organic chain 117 of the first resin is decomposed are provided. Each of the voids 119 is smaller than each of the low refractive index microparticles 114.

The AR film 110 (126) preferably further has a second resin (resin having a bonding energy larger than the bonding energy of the organic chain 117, which is in contact with the back surface of the surface of the opposite AR layer 111 which is in contact with the peeling layer 202. The substrate 115B); and the photocatalyst layer 112 (127) of the photocatalyst fine particles 116 contained in the second resin. It is more preferable that the second resin has a decane bond, and the void 119 is also formed at the interface between the AR layer 111 and the photocatalyst layer 112, and the photocatalyst layer 112 is preferably exposed by the AR layer 111 by the voids 119.

Further, the average thickness of the AR layer 111 is preferably 0.05 μm or more and 0.15 μm or less, and the refractive index thereof is preferably 1.31 or more and 1.38 or less.

Further, the release layer 202 is preferably containing photocatalyst particles 116.

Further, the peeling strength between the peeling layer 202 and the AR layer 111 is preferably larger at both end portions than the center portion in one wide width direction, and the AR layer 111 is also larger than the above-mentioned width direction. It is preferable that the center portion of the middle portion contains a large number of organic chains 117 in the first resin at both end portions.

In the method for producing a transfer film according to the present embodiment, first, a base film 201, a peeling layer 202, and a layer are sequentially laminated; The first resin of the chain 117 includes an AR layer 111 having a lower refractive index than the plurality of low refractive index fine particles 114 of the first resin, and a photocatalyst layer 112. Next, the photocatalyst layer 112 is irradiated with ultraviolet rays, and at least the interface with the peeling layer 202 in the AR layer 111 forms a plurality of voids 119 smaller than each of the low refractive index fine particles 114. At this time, electrons are generated in the photocatalyst layer 112 by irradiation of ultraviolet rays, and electrons enter the AR layer 111 to decompose a part of the organic chain 117 to form a void 119. The amount of the voids 119 formed is adjusted by the amount of ultraviolet rays irradiated at this time.

Among them, the first portion and the second portion in which the amounts of irradiation of ultraviolet rays are different from each other are provided on the surface of the photocatalyst layer 112 to be irradiated with ultraviolet rays. Thereby, the amount of the void 119 formed in the portion corresponding to the first portion and the amount of the void 119 formed in the portion corresponding to the second portion can be made in a direction parallel to the interface between the AR layer 111 and the peeling layer 202. different.

As described above, according to the present invention, the peel strength between the peeling layer and the functional layer can be adjusted to be optimum. Therefore, there are a transfer film used for molding in a mold, a method for producing the same, and the like.

111‧‧‧AR layer

112‧‧‧Photocatalyst layer

114‧‧‧Low-refractive-index microparticles (first particle)

115A‧‧‧Resin matrix

115B‧‧‧Resin matrix

116‧‧‧Photocatalyst particles (2nd particle)

117‧‧ organic chain

118‧‧‧Electronics

119‧‧‧ gap

201‧‧‧Base film

202‧‧‧ peeling layer

210‧‧‧Base film

213‧‧‧Metal halogen lamp

214‧‧‧ UV

Claims (9)

A transfer film for in-mold molding, comprising: a base film; and a release layer comprising: a first surface that is in contact with the base film; and a second surface on the back side of the first surface; and reflection prevention a layer comprising: a first resin having an organic chain that is in contact with the second surface of the release layer; and a first resin that is included in the first resin and having a lower refractive index than the first resin And a photocatalyst layer having a surface opposite to a surface of the anti-reflection layer that is in contact with the release layer, and having a bonding energy greater than a bond energy of the organic chain; In the second catalyst; and the photocatalyst fine particles contained in the second resin, at least at a portion of the antireflection layer, a plurality of voids in which a part of the organic chain is decomposed are provided at an interface with the peeling layer, and each of the plurality of voids Each of the plurality of low refractive index microparticles is smaller than the foregoing. The transfer film for in-mold forming according to the first aspect of the invention, wherein the second resin has a decane bond. The transfer film for in-mold forming according to the first aspect of the invention, wherein the gap is formed at an interface between the antireflection layer and the photocatalyst layer, and the photocatalyst layer is exposed by the antireflection layer by the void. A transfer film for in-mold forming, which is provided with: a base film; the peeling layer comprising: a first surface that is in contact with the base film; and a second surface on the back side of the first surface; and an antireflection layer that has the first layer and the peeling layer a first resin having two sides and having an organic chain; and a plurality of low refractive index fine particles included in the first resin and having a lower refractive index than the first resin, wherein the antireflection layer is at least a plurality of voids formed by decomposing a part of the organic chain are provided at an interface with the peeling layer, and each of the plurality of voids is smaller than each of the plurality of low refractive index microparticles, and an average thickness of the antireflection layer is 0.05 μm. Above 0.15 μm or less, the refractive index of the antireflection layer is 1.31 or more and 1.38 or less. A transfer film for in-mold molding, comprising: a base film; and a release layer comprising: a first surface that is in contact with the base film; and a second surface on the back side of the first surface; and a reflection a preventive layer comprising: a first resin having an organic chain in contact with the second surface of the release layer; and a plurality of particles included in the first resin and having a lower refractive index than the first resin In the low-refractive-index fine particles, at least at the interface with the peeling layer, a plurality of voids in which a part of the organic chain is decomposed are provided in the anti-reflection layer. Each of the plurality of voids is smaller than each of the plurality of low-refractive-index fine particles, and the peeling layer contains photocatalyst fine particles. A transfer film for in-mold molding, comprising: a base film; and a release layer comprising: a first surface that is in contact with the base film; and a second surface on the back side of the first surface; and a reflection a preventive layer comprising: a first resin having an organic chain in contact with the second surface of the release layer; and a plurality of particles included in the first resin and having a lower refractive index than the first resin In the low-refractive-index fine particles, at least at a boundary with the peeling layer, a plurality of voids in which a part of the organic chain is decomposed are provided, and each of the plurality of voids is larger than each of the plurality of low-refractive-index fine particles. In the smaller portion, the peeling strength between the peeling layer and the antireflection layer is larger at the both end portions than the center portion in one wide width direction. A transfer film for in-mold molding, comprising: a base film; and a release layer comprising: a first surface that is in contact with the base film; and a second surface on the back side of the first surface; and a reflection a preventive layer comprising: a first resin having an organic chain in contact with the second surface of the release layer; and a plurality of particles included in the first resin and having a lower refractive index than the first resin Low refractive index particles In the antireflection layer, a plurality of voids in which a part of the organic chain is decomposed are provided at least at an interface with the peeling layer, and each of the plurality of voids is smaller than each of the plurality of low refractive index fine particles. The antireflection layer contains a large amount of the organic chain in the first resin at both end portions than the central portion in one wide direction. A method for producing a transfer film for in-mold molding, comprising: sequentially laminating: a base film, a release layer, and a first resin having an organic chain; and a refractive index lower than that of the first resin; a step of preventing the antireflection layer of the low refractive index fine particles and the photocatalyst layer; and irradiating the photocatalyst layer with ultraviolet rays, and forming at least an interface with the peeling layer in the antireflection layer is smaller than each of the plurality of low refractive index fine particles In the step of a plurality of voids, electrons are generated in the photocatalyst layer by the irradiation of the ultraviolet rays, and the electrons enter the antireflection layer, and a part of the organic chain is decomposed to form the voids, and the amount of ultraviolet rays is adjusted. The amount of the aforementioned voids formed. The method for producing a transfer film for in-mold forming according to the eighth aspect of the invention, wherein the surface of the photocatalyst layer to which the ultraviolet ray is irradiated is provided with the first portion and the second portion which are different in irradiation amount of the ultraviolet ray Thereby, the aforementioned portion formed in the portion corresponding to the first portion is formed in a direction parallel to the interface between the antireflection layer and the peeling layer. The amount of the voids and the amount of the voids formed in the portion corresponding to the second portion are different.