TWI563124B - Manufacturing method of resin material with metallic pattern and resin material with metallic pattern - Google Patents

Manufacturing method of resin material with metallic pattern and resin material with metallic pattern

Info

Publication number
TWI563124B
TWI563124B TW103129855A TW103129855A TWI563124B TW I563124 B TWI563124 B TW I563124B TW 103129855 A TW103129855 A TW 103129855A TW 103129855 A TW103129855 A TW 103129855A TW I563124 B TWI563124 B TW I563124B
Authority
TW
Taiwan
Prior art keywords
resin material
metallic pattern
manufacturing
metallic
pattern
Prior art date
Application number
TW103129855A
Other languages
Chinese (zh)
Other versions
TW201512455A (en
Inventor
Christopher Cordonier
Yoshio Horiuchi
Hideo Honma
Original Assignee
Kanto Gakuin School Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanto Gakuin School Corp filed Critical Kanto Gakuin School Corp
Publication of TW201512455A publication Critical patent/TW201512455A/en
Application granted granted Critical
Publication of TWI563124B publication Critical patent/TWI563124B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1657—Electroless forming, i.e. substrate removed or destroyed at the end of the process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
TW103129855A 2013-09-19 2014-08-29 Manufacturing method of resin material with metallic pattern and resin material with metallic pattern TWI563124B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013193802A JP2015059244A (en) 2013-09-19 2013-09-19 Manufacturing method of resin material with metal pattern and resin material with metal pattern

Publications (2)

Publication Number Publication Date
TW201512455A TW201512455A (en) 2015-04-01
TWI563124B true TWI563124B (en) 2016-12-21

Family

ID=52688594

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103129855A TWI563124B (en) 2013-09-19 2014-08-29 Manufacturing method of resin material with metallic pattern and resin material with metallic pattern

Country Status (3)

Country Link
JP (1) JP2015059244A (en)
TW (1) TWI563124B (en)
WO (1) WO2015040934A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5804011B2 (en) * 2013-09-20 2015-11-04 大日本印刷株式会社 Transmission type display device
KR102465117B1 (en) * 2017-11-29 2022-11-11 주식회사 잉크테크 Method for manufacturing printed circuit board
WO2020100710A1 (en) * 2018-11-16 2020-05-22 株式会社ニコン Pattern forming method, transistor manufacturing method, and film for pattern formation
TWI706704B (en) * 2019-06-19 2020-10-01 特豪科技股份有限公司 Circuit board manufacturing method
WO2021140971A1 (en) * 2020-01-08 2021-07-15 パナソニックＩｐマネジメント株式会社 Method for manufacturing wiring body, pattern plate, and wiring body
WO2021220919A1 (en) * 2020-05-01 2021-11-04 東京応化工業株式会社 Method for producing surface-modified metal oxide microparticles, method for producing surface-modified metal oxide microparticle dispersion, and method for producing solid product
KR102414125B1 (en) * 2020-07-21 2022-06-29 (주)티에스이 Flexible printed circuit board and method for manufacturing the same
KR102358393B1 (en) * 2020-09-22 2022-02-08 (주)티에스이 Flexible printed circuit board and method for manufacturing the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4751146A (en) * 1985-07-09 1988-06-14 Showa Denko Kabushiki Kaisha Printed circuit boards
US5374469A (en) * 1991-09-19 1994-12-20 Nitto Denko Corporation Flexible printed substrate
JPH11170421A (en) * 1997-12-17 1999-06-29 Sumitomo Osaka Cement Co Ltd Transparent conductive film and its production

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63132499A (en) * 1986-11-25 1988-06-04 古河電気工業株式会社 Manufacture of circuit board
JPH05198901A (en) * 1991-09-19 1993-08-06 Nitto Denko Corp Printed circuit board and manufacture thereof
JP2755520B2 (en) * 1992-06-01 1998-05-20 アルプス電気株式会社 Method of forming through hole in printed wiring board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4751146A (en) * 1985-07-09 1988-06-14 Showa Denko Kabushiki Kaisha Printed circuit boards
US5374469A (en) * 1991-09-19 1994-12-20 Nitto Denko Corporation Flexible printed substrate
JPH11170421A (en) * 1997-12-17 1999-06-29 Sumitomo Osaka Cement Co Ltd Transparent conductive film and its production

Also Published As

Publication number Publication date
TW201512455A (en) 2015-04-01
JP2015059244A (en) 2015-03-30
WO2015040934A1 (en) 2015-03-26

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