TWI562885B - - Google Patents

Info

Publication number
TWI562885B
TWI562885B TW103107351A TW103107351A TWI562885B TW I562885 B TWI562885 B TW I562885B TW 103107351 A TW103107351 A TW 103107351A TW 103107351 A TW103107351 A TW 103107351A TW I562885 B TWI562885 B TW I562885B
Authority
TW
Taiwan
Application number
TW103107351A
Other languages
Chinese (zh)
Other versions
TW201446495A (en
Inventor
Kazuhiko Sakaguchi
Shinichi Sasaki
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW201446495A publication Critical patent/TW201446495A/en
Application granted granted Critical
Publication of TWI562885B publication Critical patent/TWI562885B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
TW103107351A 2013-03-04 2014-03-04 Copper foil with attached carrier, copper-clad laminate using same, printed circuit board, electronic device, and method for manufacturing printed circuit board TW201446495A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013042076 2013-03-04

Publications (2)

Publication Number Publication Date
TW201446495A TW201446495A (en) 2014-12-16
TWI562885B true TWI562885B (en) 2016-12-21

Family

ID=51491300

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103107351A TW201446495A (en) 2013-03-04 2014-03-04 Copper foil with attached carrier, copper-clad laminate using same, printed circuit board, electronic device, and method for manufacturing printed circuit board

Country Status (5)

Country Link
JP (1) JP6514635B2 (en)
KR (1) KR20150126008A (en)
CN (2) CN107031143A (en)
TW (1) TW201446495A (en)
WO (1) WO2014136785A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5925981B1 (en) * 2014-09-19 2016-05-25 三井金属鉱業株式会社 Surface-treated copper foil and method for producing the same, copper-clad laminate for printed wiring board, and printed wiring board
JP2016084533A (en) * 2014-10-22 2016-05-19 Ｊｘ金属株式会社 Surface treated metal material, metal foil with carrier, connector, terminal, laminate, shield tape, shield material, printed wiring board, metal processing member, manufacturing method of electronic apparatus and manufacturing method of printed wiring board
KR101852671B1 (en) * 2015-01-21 2018-06-04 제이엑스금속주식회사 Copper foil with carrier, laminate, printed circuit board and method of manufacturing printed circuit board
JP6427454B2 (en) * 2015-03-31 2018-11-21 日鉄ケミカル＆マテリアル株式会社 Copper-clad laminate and printed wiring board
JP6639128B2 (en) * 2015-07-10 2020-02-05 株式会社カネカ Thin metal wire film and method of manufacturing the same
JP6200042B2 (en) * 2015-08-06 2017-09-20 Ｊｘ金属株式会社 Copper foil with carrier, laminate, printed wiring board manufacturing method and electronic device manufacturing method
WO2017141983A1 (en) * 2016-02-18 2017-08-24 三井金属鉱業株式会社 Printed circuit board production method
JP6824436B2 (en) * 2017-10-26 2021-02-03 三井金属鉱業株式会社 Manufacturing method of ultra-thin copper foil, ultra-thin copper foil with carrier, and printed wiring board
JP6836689B2 (en) * 2018-03-29 2021-03-03 三井金属鉱業株式会社 Copper foil with glass carrier and its manufacturing method
EP3930996B1 (en) * 2019-02-28 2023-10-25 Circuit Foil Luxembourg Composite copper foil and method of fabricating the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI338543B (en) * 2002-10-31 2011-03-01 Furukawa Electric Co Ltd
JP2011176051A (en) * 2010-02-23 2011-09-08 Dainippon Printing Co Ltd Base material for wiring circuit substrate, method of manufacturing the base material for wiring circuit substrate, wiring circuit substrate, and method of manufacturing the wiring circuit substrate, suspension substrate for hdd, suspension for hdd, and hard disk drive
TWI379925B (en) * 2003-09-01 2012-12-21

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4006618B2 (en) * 2001-09-26 2007-11-14 日鉱金属株式会社 Manufacturing method of copper foil with carrier and printed board using copper foil with carrier
JP2004169181A (en) * 2002-10-31 2004-06-17 Furukawa Techno Research Kk Ultrathin copper foil with carrier and method for manufacturing the same, and printed wiring board using ultrathin copper foil with carrier
JP4087369B2 (en) * 2003-11-11 2008-05-21 古河サーキットフォイル株式会社 Ultra-thin copper foil with carrier and printed wiring board
JP4570070B2 (en) * 2004-03-16 2010-10-27 三井金属鉱業株式会社 Electrolytic copper foil with carrier foil provided with resin layer for forming insulating layer, copper-clad laminate, printed wiring board, method for producing multilayer copper-clad laminate, and method for producing printed wiring board
CN101851769B (en) * 2005-03-31 2012-07-04 三井金属矿业株式会社 Electrolytic copper foil and method for producing same, surface-treated electrolytic copper foil, copper-clad laminate, and printed wiring board
JP4927503B2 (en) * 2005-12-15 2012-05-09 古河電気工業株式会社 Ultra-thin copper foil with carrier and printed wiring board
JP5379528B2 (en) * 2009-03-24 2013-12-25 三井金属鉱業株式会社 Electrolytic copper foil with carrier foil, method for producing electrolytic copper foil with carrier foil, and copper-clad laminate obtained using the electrolytic copper foil with carrier foil
JP5481577B1 (en) * 2012-09-11 2014-04-23 Ｊｘ日鉱日石金属株式会社 Copper foil with carrier

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI338543B (en) * 2002-10-31 2011-03-01 Furukawa Electric Co Ltd
TWI379925B (en) * 2003-09-01 2012-12-21
JP2011176051A (en) * 2010-02-23 2011-09-08 Dainippon Printing Co Ltd Base material for wiring circuit substrate, method of manufacturing the base material for wiring circuit substrate, wiring circuit substrate, and method of manufacturing the wiring circuit substrate, suspension substrate for hdd, suspension for hdd, and hard disk drive

Also Published As

Publication number Publication date
KR20150126008A (en) 2015-11-10
TW201446495A (en) 2014-12-16
JPWO2014136785A1 (en) 2017-02-16
CN105209252B (en) 2018-01-30
CN107031143A (en) 2017-08-11
WO2014136785A1 (en) 2014-09-12
CN105209252A (en) 2015-12-30
JP6514635B2 (en) 2019-05-15

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