TWI562271B - - Google Patents

Info

Publication number
TWI562271B
TWI562271B TW099144803A TW99144803A TWI562271B TW I562271 B TWI562271 B TW I562271B TW 099144803 A TW099144803 A TW 099144803A TW 99144803 A TW99144803 A TW 99144803A TW I562271 B TWI562271 B TW I562271B
Authority
TW
Taiwan
Application number
TW099144803A
Other versions
TW201133700A (en
Inventor
Daisuke Yuki
Takahiro Miike
Hiroshi Mori
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW201133700A publication Critical patent/TW201133700A/zh
Application granted granted Critical
Publication of TWI562271B publication Critical patent/TWI562271B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW099144803A 2009-12-18 2010-12-20 Pair of substrate holders, method for manufacturing device, separation device, method for separating substrates, substrate holder, and device for positioning substrate TW201133700A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009288121 2009-12-18
JP2009288261 2009-12-18

Publications (2)

Publication Number Publication Date
TW201133700A TW201133700A (en) 2011-10-01
TWI562271B true TWI562271B (zh) 2016-12-11

Family

ID=44167044

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099144803A TW201133700A (en) 2009-12-18 2010-12-20 Pair of substrate holders, method for manufacturing device, separation device, method for separating substrates, substrate holder, and device for positioning substrate

Country Status (6)

Country Link
US (1) US8863808B2 (zh)
EP (1) EP2515322A4 (zh)
JP (1) JP6051523B2 (zh)
KR (1) KR101860956B1 (zh)
TW (1) TW201133700A (zh)
WO (1) WO2011074274A1 (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4676026B1 (ja) 2010-09-17 2011-04-27 日東電工株式会社 液晶表示素子の製造システム及び製造方法
JP4733227B1 (ja) * 2010-09-30 2011-07-27 日東電工株式会社 液晶表示素子の製造システム及び製造方法
TWI616975B (zh) * 2011-12-14 2018-03-01 Nikon Corp Substrate holder and substrate bonding device
US10121760B2 (en) 2013-11-01 2018-11-06 Nikon Corporation Wafer bonding system and method
JP6473908B2 (ja) * 2015-02-17 2019-02-27 ボンドテック株式会社 ウエハ接合装置及びウエハ接合方法
CN107749407B (zh) * 2017-09-22 2020-08-28 沈阳拓荆科技有限公司 晶圆承载盘及其支撑结构
CN118658825A (zh) * 2018-01-23 2024-09-17 东京毅力科创株式会社 接合装置和接合方法
KR102217780B1 (ko) * 2018-06-12 2021-02-19 피에스케이홀딩스 (주) 정렬 장치
IL286750B1 (en) 2019-03-27 2024-11-01 Yaskawa Europe Tech Ltd becomes a semiconductor
JP7267111B2 (ja) * 2019-05-31 2023-05-01 東京エレクトロン株式会社 位置決め機構及び位置決め方法
JP7288832B2 (ja) * 2019-10-01 2023-06-08 キヤノントッキ株式会社 回転駆動装置
KR102507268B1 (ko) * 2021-04-26 2023-03-07 (주)에스티아이 라미네이션 시스템

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI264080B (en) * 2003-03-24 2006-10-11 Sumitomo Electric Industries Wafer holder for semiconductor manufacturing device and semiconductor manufacturing device in which it is installed
US7207763B2 (en) * 2004-01-15 2007-04-24 Terasemicon Co., Ltd Semiconductor manufacturing system and wafer holder for semiconductor manufacturing system
TW200917410A (en) * 2007-08-15 2009-04-16 Nikon Corp Aligning apparatus, bonding apparatus, laminated substrate manufacturing apparatus, exposure apparatus and aligning method
TW200919626A (en) * 2007-10-25 2009-05-01 Topcon Corp Wafer holder
TWI483339B (zh) * 2007-06-12 2015-05-01 尼康股份有限公司 Wafer bonding device, wafer bonding method, wafer detection device and wafer detection method

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11261000A (ja) 1998-03-13 1999-09-24 Japan Science & Technology Corp ３次元半導体集積回路装置の製造方法
JP2005310939A (ja) * 2004-04-20 2005-11-04 Hitachi Cable Ltd ウェハ接合用治具及びウェハ接合方法
JP2006332563A (ja) * 2005-05-30 2006-12-07 Nikon Corp ウェハ搬送装置、ウェハ積層体搬送装置及び積層型半導体装置製造方法
JP2007115978A (ja) 2005-10-21 2007-05-10 Nikon Corp 加圧装置及び半導体装置の製造方法
JP4692238B2 (ja) * 2005-11-15 2011-06-01 株式会社ニコン マスク収納容器開装置、露光装置
JP5098165B2 (ja) * 2005-12-08 2012-12-12 株式会社ニコン ウェハの接合方法、接合装置及び積層型半導体装置の製造方法
WO2008114337A1 (ja) * 2007-02-22 2008-09-25 Shin-Etsu Engineering Co., Ltd. 真空貼り合わせ方法及び真空貼り合わせ装置
JP5561572B2 (ja) * 2007-08-30 2014-07-30 株式会社チユーオー 屋根上設置物の取付け用金物
TWI471971B (zh) 2007-10-30 2015-02-01 尼康股份有限公司 Substrate holding member, substrate bonding apparatus, laminated substrate manufacturing apparatus, substrate bonding method, laminated substrate manufacturing method, and laminated semiconductor device manufacturing method
US8245751B2 (en) * 2007-11-07 2012-08-21 Advanced Display Process Engineering Co., Ltd. Substrate bonding apparatus
JP2009194264A (ja) 2008-02-18 2009-08-27 Nikon Corp 基板貼り合わせ装置
CN101971319B (zh) * 2008-03-13 2013-03-06 株式会社尼康 基板保持架、基板保持单元、基板搬送装置和基板贴合装置
JP4786693B2 (ja) * 2008-09-30 2011-10-05 三菱重工業株式会社 ウェハ接合装置およびウェハ接合方法
US8276262B2 (en) * 2008-12-03 2012-10-02 Intel Corporation Magnetically coupled thin-wafer handling system

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI264080B (en) * 2003-03-24 2006-10-11 Sumitomo Electric Industries Wafer holder for semiconductor manufacturing device and semiconductor manufacturing device in which it is installed
US7207763B2 (en) * 2004-01-15 2007-04-24 Terasemicon Co., Ltd Semiconductor manufacturing system and wafer holder for semiconductor manufacturing system
TWI483339B (zh) * 2007-06-12 2015-05-01 尼康股份有限公司 Wafer bonding device, wafer bonding method, wafer detection device and wafer detection method
TW200917410A (en) * 2007-08-15 2009-04-16 Nikon Corp Aligning apparatus, bonding apparatus, laminated substrate manufacturing apparatus, exposure apparatus and aligning method
TW200919626A (en) * 2007-10-25 2009-05-01 Topcon Corp Wafer holder

Also Published As

Publication number Publication date
US8863808B2 (en) 2014-10-21
JP6051523B2 (ja) 2016-12-27
KR101860956B1 (ko) 2018-05-24
JPWO2011074274A1 (ja) 2013-04-25
EP2515322A4 (en) 2017-03-01
KR20120109561A (ko) 2012-10-08
US20130008581A1 (en) 2013-01-10
EP2515322A1 (en) 2012-10-24
WO2011074274A1 (ja) 2011-06-23
TW201133700A (en) 2011-10-01

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