TWI561674B - Method for modifying surface of resin substrate, method for forming metal coating film and laminate - Google Patents
Method for modifying surface of resin substrate, method for forming metal coating film and laminateInfo
- Publication number
- TWI561674B TWI561674B TW104111413A TW104111413A TWI561674B TW I561674 B TWI561674 B TW I561674B TW 104111413 A TW104111413 A TW 104111413A TW 104111413 A TW104111413 A TW 104111413A TW I561674 B TWI561674 B TW I561674B
- Authority
- TW
- Taiwan
- Prior art keywords
- laminate
- coating film
- resin substrate
- metal coating
- forming metal
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemically Coating (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014106656A JP2015221925A (en) | 2014-05-23 | 2014-05-23 | Method for treating surface modification of resin base material, method for forming metal film, and laminate |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201544626A TW201544626A (en) | 2015-12-01 |
TWI561674B true TWI561674B (en) | 2016-12-11 |
Family
ID=54553778
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104111413A TWI561674B (en) | 2014-05-23 | 2015-04-09 | Method for modifying surface of resin substrate, method for forming metal coating film and laminate |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2015221925A (en) |
TW (1) | TWI561674B (en) |
WO (1) | WO2015178101A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017179530A (en) * | 2016-03-31 | 2017-10-05 | 旭化成株式会社 | Plated product and method for manufacturing the same |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08253869A (en) * | 1995-03-14 | 1996-10-01 | Sharp Corp | Method for electroless-plating resin |
JP2000129449A (en) * | 1998-10-20 | 2000-05-09 | Murata Mfg Co Ltd | Production of chip-like electronic parts |
JP2003027250A (en) * | 2001-07-18 | 2003-01-29 | Toyota Motor Corp | Method for forming electroless plating film of resin |
JP2004186661A (en) * | 2002-10-07 | 2004-07-02 | Tokai Rubber Ind Ltd | Method of producing flexible printed circuit board |
JP2007231362A (en) * | 2006-03-01 | 2007-09-13 | Kanto Gakuin Univ Surface Engineering Research Institute | Electroless plating method of resin product |
JP2009084596A (en) * | 2007-09-27 | 2009-04-23 | Dainippon Printing Co Ltd | Manufacturing method of metal pattern forming body |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19835917A1 (en) * | 1998-08-07 | 2000-02-10 | Basf Ag | With energetic radiation and / or thermally curable binder |
JP4738308B2 (en) * | 2006-10-11 | 2011-08-03 | 株式会社関東学院大学表面工学研究所 | Method for producing cycloolefin polymer material with metal film and cycloolefin polymer material with metal film obtained by using the method |
-
2014
- 2014-05-23 JP JP2014106656A patent/JP2015221925A/en active Pending
-
2015
- 2015-03-30 WO PCT/JP2015/059926 patent/WO2015178101A1/en active Application Filing
- 2015-04-09 TW TW104111413A patent/TWI561674B/en active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08253869A (en) * | 1995-03-14 | 1996-10-01 | Sharp Corp | Method for electroless-plating resin |
JP2000129449A (en) * | 1998-10-20 | 2000-05-09 | Murata Mfg Co Ltd | Production of chip-like electronic parts |
JP2003027250A (en) * | 2001-07-18 | 2003-01-29 | Toyota Motor Corp | Method for forming electroless plating film of resin |
JP2004186661A (en) * | 2002-10-07 | 2004-07-02 | Tokai Rubber Ind Ltd | Method of producing flexible printed circuit board |
JP2007231362A (en) * | 2006-03-01 | 2007-09-13 | Kanto Gakuin Univ Surface Engineering Research Institute | Electroless plating method of resin product |
JP2009084596A (en) * | 2007-09-27 | 2009-04-23 | Dainippon Printing Co Ltd | Manufacturing method of metal pattern forming body |
Also Published As
Publication number | Publication date |
---|---|
TW201544626A (en) | 2015-12-01 |
WO2015178101A1 (en) | 2015-11-26 |
JP2015221925A (en) | 2015-12-10 |
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