TWI561141B - Sealing structure - Google Patents

Sealing structure

Info

Publication number
TWI561141B
TWI561141B TW100132993A TW100132993A TWI561141B TW I561141 B TWI561141 B TW I561141B TW 100132993 A TW100132993 A TW 100132993A TW 100132993 A TW100132993 A TW 100132993A TW I561141 B TWI561141 B TW I561141B
Authority
TW
Taiwan
Prior art keywords
sealing structure
sealing
Prior art date
Application number
TW100132993A
Other languages
English (en)
Other versions
TW201230924A (en
Inventor
Atsushi Kajiya
Hidekazu Yoshihara
Original Assignee
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk
Publication of TW201230924A publication Critical patent/TW201230924A/zh
Application granted granted Critical
Publication of TWI561141B publication Critical patent/TWI561141B/zh

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/06Hermetically-sealed casings
    • H05K5/061Hermetically-sealed casings sealed by a gasket held between a removable cover and a body, e.g. O-ring, packing
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0095Light guides as housings, housing portions, shelves, doors, tiles, windows, or the like

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Telephone Set Structure (AREA)
  • Casings For Electric Apparatus (AREA)
  • Gasket Seals (AREA)
  • Planar Illumination Modules (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
TW100132993A 2010-10-20 2011-09-14 Sealing structure TWI561141B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010235588A JP5667412B2 (ja) 2010-10-20 2010-10-20 シール構造体

Publications (2)

Publication Number Publication Date
TW201230924A TW201230924A (en) 2012-07-16
TWI561141B true TWI561141B (en) 2016-12-01

Family

ID=45974994

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100132993A TWI561141B (en) 2010-10-20 2011-09-14 Sealing structure

Country Status (6)

Country Link
US (1) US9024184B2 (zh)
JP (1) JP5667412B2 (zh)
CN (1) CN103168508B (zh)
HK (1) HK1182577A1 (zh)
TW (1) TWI561141B (zh)
WO (1) WO2012053269A1 (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5521887B2 (ja) * 2010-08-19 2014-06-18 アイコム株式会社 携帯電子機器
WO2013050320A2 (en) * 2011-10-03 2013-04-11 Tyco Electronics Raychem Bvba Aggregation enclosure for elevated, outdoor locations
JP5852481B2 (ja) * 2012-03-19 2016-02-03 シャープ株式会社 携帯端末
DE102012219877A1 (de) * 2012-08-24 2014-02-27 Tesa Se Haftklebemasse insbesondere zur Kapselung einer elektronischen Anordnung
JP5856928B2 (ja) * 2012-08-28 2016-02-10 シャープ株式会社 携帯端末
US20150377476A1 (en) * 2013-03-28 2015-12-31 Nec Corporation Water proof structure providing illumination function
JP2014230228A (ja) * 2013-05-27 2014-12-08 富士通株式会社 電子装置
KR101545404B1 (ko) * 2013-12-04 2015-08-18 엘에스산전 주식회사 전기 자동차의 충전기
EP2899519B1 (en) * 2014-01-24 2016-11-16 Siemens Schweiz AG Temperature sensing apparatus
KR102309831B1 (ko) * 2015-03-23 2021-10-13 현대모비스 주식회사 조명장치
US10664020B2 (en) * 2015-04-23 2020-05-26 Semiconductor Energy Laboratory Co., Ltd. Electronic device
FR3046903B1 (fr) * 2016-01-19 2019-08-16 Valeo Comfort And Driving Assistance Dispositif electronique etanche et son procede d'obtention

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5646649A (en) * 1994-08-23 1997-07-08 Mitsubishi Denki Kabushiki Kaisha Portable information terminal
JP2001036262A (ja) * 1999-07-26 2001-02-09 Optex Co Ltd 無線式防水型押しボタンスイッチ
CN1302501A (zh) * 1997-10-07 2001-07-04 艾利森公司 通信模块的可视报警

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3993938A (en) * 1974-07-17 1976-11-23 Corning Glass Works Electrical component hermetic enclosure
US4577056A (en) * 1984-04-09 1986-03-18 Olin Corporation Hermetically sealed metal package
JPH08204356A (ja) * 1995-01-27 1996-08-09 Mitsubishi Electric Corp 電子機器筺体の防水構造
JP2002042536A (ja) * 2000-07-26 2002-02-08 Fujitsu Ltd 携帯型通信装置
JP2002352657A (ja) * 2001-05-25 2002-12-06 Shin Etsu Polymer Co Ltd 押釦スイッチ用部材とその製造方法
JP2003142836A (ja) 2001-11-05 2003-05-16 Seiko Instruments Inc 電子機器
JP2004214927A (ja) 2002-12-27 2004-07-29 Casio Comput Co Ltd 携帯用電子機器
JP2004228238A (ja) * 2003-01-21 2004-08-12 Mitsubishi Electric Corp 筐体及び筐体の製造方法
JP2006019812A (ja) * 2004-06-30 2006-01-19 Panasonic Mobile Communications Co Ltd 携帯電話機及び携帯電話機の筐体成型方法
JP2006290960A (ja) * 2005-04-07 2006-10-26 Geltec Co Ltd 光透過性粘着シート及びそれを用いた画像表示装置
CN2838214Y (zh) * 2005-09-26 2006-11-15 互亿科技股份有限公司 防水资讯装置
CN100442958C (zh) * 2005-11-08 2008-12-10 乐金电子(天津)电器有限公司 洗衣机的显示器
KR100877049B1 (ko) * 2006-09-28 2009-01-07 가시오 히타치 모바일 커뮤니케이션즈 컴퍼니 리미티드 방수구조

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5646649A (en) * 1994-08-23 1997-07-08 Mitsubishi Denki Kabushiki Kaisha Portable information terminal
CN1302501A (zh) * 1997-10-07 2001-07-04 艾利森公司 通信模块的可视报警
JP2001036262A (ja) * 1999-07-26 2001-02-09 Optex Co Ltd 無線式防水型押しボタンスイッチ

Also Published As

Publication number Publication date
CN103168508B (zh) 2016-03-16
WO2012053269A1 (ja) 2012-04-26
CN103168508A (zh) 2013-06-19
US20130194735A1 (en) 2013-08-01
US9024184B2 (en) 2015-05-05
JP5667412B2 (ja) 2015-02-12
TW201230924A (en) 2012-07-16
JP2012089698A (ja) 2012-05-10
HK1182577A1 (zh) 2013-11-29

Similar Documents

Publication Publication Date Title
DK3342786T3 (en) Anti-dll3-antistof
AP3107A (en) 5-Alkynyl-pyrimidines
EP2650572A4 (en) STATIC JOINT
EP2566479A4 (en) AZA-INDAZOLES
EP2640189A4 (en) 3-deutero-pomalidomide
HK1178226A1 (zh) 密封裝置
TWI561141B (en) Sealing structure
PT2627579E (pt) Vedantes
DK3466977T3 (en) Anti-vla-4-antistoffer
EP2651505A4 (en) ELECTROPORATION-INDUCED ELECTROSENSIBILIZATION
GB2485334B (en) Structure
GB201007601D0 (en) Sealing assembly
EP2551563A4 (en) SEAL FOR A TURN
EP2746626A4 (en) SEALING STRUCTURE
GB201013492D0 (en) Sealing Arrangement
PL2563680T3 (pl) Uszczelnienie
PL2595767T3 (pl) Zespół uszczelniający
EP2625110A4 (en) ARRANGEMENT ENSURING SEALING
EP2591985A4 (en) PANEL ASSEMBLY STRUCTURE
GB201012263D0 (en) Sealing assembly
TWM402991U (en) LED seal structure
EP2607755A4 (en) SEALING OBJECT WITH A CIRCULAR STRIP
GB201120986D0 (en) Seal
PL2469005T3 (pl) Uszczelka
GB201008385D0 (en) Seal