TWI560917B - Magnetic tunnel junction device and method for fabricating the same - Google Patents

Magnetic tunnel junction device and method for fabricating the same

Info

Publication number
TWI560917B
TWI560917B TW103110610A TW103110610A TWI560917B TW I560917 B TWI560917 B TW I560917B TW 103110610 A TW103110610 A TW 103110610A TW 103110610 A TW103110610 A TW 103110610A TW I560917 B TWI560917 B TW I560917B
Authority
TW
Taiwan
Prior art keywords
fabricating
same
tunnel junction
magnetic tunnel
junction device
Prior art date
Application number
TW103110610A
Other languages
English (en)
Other versions
TW201508962A (zh
Inventor
wei hang Huang
Chern Yow Hsu
Shih Chang Liu
Chia Shiung Tsai
Original Assignee
Taiwan Semiconductor Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg Co Ltd filed Critical Taiwan Semiconductor Mfg Co Ltd
Publication of TW201508962A publication Critical patent/TW201508962A/zh
Application granted granted Critical
Publication of TWI560917B publication Critical patent/TWI560917B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/80—Constructional details
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/10—Magnetoresistive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/80—Constructional details
    • H10N50/85—Magnetic active materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Hall/Mr Elements (AREA)
  • Mram Or Spin Memory Techniques (AREA)
TW103110610A 2013-08-29 2014-03-21 Magnetic tunnel junction device and method for fabricating the same TWI560917B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/013,943 US9142761B2 (en) 2013-08-29 2013-08-29 Method for fabricating a magnetic tunnel junction device

Publications (2)

Publication Number Publication Date
TW201508962A TW201508962A (zh) 2015-03-01
TWI560917B true TWI560917B (en) 2016-12-01

Family

ID=52582027

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103110610A TWI560917B (en) 2013-08-29 2014-03-21 Magnetic tunnel junction device and method for fabricating the same

Country Status (2)

Country Link
US (2) US9142761B2 (zh)
TW (1) TWI560917B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9324937B1 (en) * 2015-03-24 2016-04-26 International Business Machines Corporation Thermally assisted MRAM including magnetic tunnel junction and vacuum cavity
KR102444236B1 (ko) 2015-08-25 2022-09-16 삼성전자주식회사 자기 소자 및 그 제조 방법
US9905751B2 (en) 2015-10-20 2018-02-27 Taiwan Semiconductor Manufacturing Company, Ltd. Magnetic tunnel junction with reduced damage
US10069064B1 (en) 2017-07-18 2018-09-04 Headway Technologies, Inc. Memory structure having a magnetic tunnel junction (MTJ) self-aligned to a T-shaped bottom electrode, and method of manufacturing the same
US10475991B2 (en) 2018-02-22 2019-11-12 Taiwan Semiconductor Manufacturing Company, Ltd. Fabrication of large height top metal electrode for sub-60nm magnetoresistive random access memory (MRAM) devices
US10748962B2 (en) 2018-04-24 2020-08-18 International Business Machines Corporation Method and structure for forming MRAM device
US11937512B2 (en) 2021-06-02 2024-03-19 International Business Machines Corporation Magnetic tunnel junction device with air gap
US12112782B2 (en) * 2021-09-08 2024-10-08 International Business Machines Corporation Compact MRAM architecture with magnetic bottom electrode

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110189796A1 (en) * 2010-01-29 2011-08-04 Taiwan Semiconductor Manufacturing Company, Ltd. Uniformity in the Performance of MTJ Cells

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6984530B2 (en) * 2004-03-29 2006-01-10 Hewlett-Packard Development Company, L.P. Method of fabricating a MRAM device
KR100990143B1 (ko) * 2008-07-03 2010-10-29 주식회사 하이닉스반도체 자기터널접합 장치, 이를 구비하는 메모리 셀 및 그제조방법
US8334213B2 (en) * 2009-06-05 2012-12-18 Magic Technologies, Inc. Bottom electrode etching process in MRAM cell
US8803293B2 (en) * 2012-05-11 2014-08-12 Headway Technologies, Inc. Method to reduce magnetic film stress for better yield
US8772888B2 (en) * 2012-08-10 2014-07-08 Avalanche Technology Inc. MTJ MRAM with stud patterning

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110189796A1 (en) * 2010-01-29 2011-08-04 Taiwan Semiconductor Manufacturing Company, Ltd. Uniformity in the Performance of MTJ Cells

Also Published As

Publication number Publication date
US20150061051A1 (en) 2015-03-05
US9142761B2 (en) 2015-09-22
TW201508962A (zh) 2015-03-01
US9608195B2 (en) 2017-03-28
US20150340596A1 (en) 2015-11-26

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