TWI560745B - Detection of weak points of a mask - Google Patents

Detection of weak points of a mask

Info

Publication number
TWI560745B
TWI560745B TW103108416A TW103108416A TWI560745B TW I560745 B TWI560745 B TW I560745B TW 103108416 A TW103108416 A TW 103108416A TW 103108416 A TW103108416 A TW 103108416A TW I560745 B TWI560745 B TW I560745B
Authority
TW
Taiwan
Prior art keywords
mask
detection
weak points
weak
points
Prior art date
Application number
TW103108416A
Other languages
English (en)
Other versions
TW201442065A (zh
Inventor
Aviram Tam
Michael Ben-Yishai
Yaron Cohen
Original Assignee
Applied Materials Israel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Israel Ltd filed Critical Applied Materials Israel Ltd
Publication of TW201442065A publication Critical patent/TW201442065A/zh
Application granted granted Critical
Publication of TWI560745B publication Critical patent/TWI560745B/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30164—Workpiece; Machine component

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Image Analysis (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
TW103108416A 2013-03-12 2014-03-11 Detection of weak points of a mask TWI560745B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/795,584 US9299135B2 (en) 2013-03-12 2013-03-12 Detection of weak points of a mask

Publications (2)

Publication Number Publication Date
TW201442065A TW201442065A (zh) 2014-11-01
TWI560745B true TWI560745B (en) 2016-12-01

Family

ID=51527284

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103108416A TWI560745B (en) 2013-03-12 2014-03-11 Detection of weak points of a mask

Country Status (3)

Country Link
US (1) US9299135B2 (zh)
KR (1) KR101675628B1 (zh)
TW (1) TWI560745B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2982364B1 (fr) * 2011-11-09 2014-08-01 Snecma Procede et dispositif d'estimation d'un taux de porosite d'un echantillon de materiau a partir d'au moins une image codee en niveaux de gris
US10740888B2 (en) 2016-04-22 2020-08-11 Kla-Tencor Corporation Computer assisted weak pattern detection and quantification system
CN105743547A (zh) * 2016-04-28 2016-07-06 李应刚 一种感应式介绍展品的介绍方法、装置及介绍系统
CN106024665B (zh) * 2016-05-30 2019-01-18 上海华力微电子有限公司 一种曝光条件检测方法及系统

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6777147B1 (en) * 2003-05-21 2004-08-17 International Business Machines Corporation Method for evaluating the effects of multiple exposure processes in lithography
US20060136862A1 (en) * 2004-11-29 2006-06-22 Shigeki Nojima Pattern data verification method, pattern data creation method, exposure mask manufacturing method, semiconductor device manufacturing method, and computer program product
US7120285B1 (en) * 2000-02-29 2006-10-10 Advanced Micro Devices, Inc. Method for evaluation of reticle image using aerial image simulator
US20060234139A1 (en) * 2005-04-13 2006-10-19 Kla-Tencor Technologies Corporation Systems and methods for modifying a reticle's optical properties
TW201305531A (zh) * 2011-06-14 2013-02-01 Advantest Corp 圖案量測裝置及圖案量測方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7107571B2 (en) * 1997-09-17 2006-09-12 Synopsys, Inc. Visual analysis and verification system using advanced tools
US6873720B2 (en) * 2001-03-20 2005-03-29 Synopsys, Inc. System and method of providing mask defect printability analysis
US6765651B1 (en) * 2003-03-11 2004-07-20 Peter J. Fiekowsky Fast image simulation for photolithography
DE102005005591B3 (de) * 2005-02-07 2006-07-20 Infineon Technologies Ag Verfahren zur Optimierung der Geometrie von Strukturelementen eines Musters eines Schaltungsentwurfs für eine Verbesserung der optischen Abbildungseigenschaften und Verwendung des Verfahrens zur Herstellung einer Photomaske
US7506285B2 (en) * 2006-02-17 2009-03-17 Mohamed Al-Imam Multi-dimensional analysis for predicting RET model accuracy
US7962863B2 (en) * 2007-05-07 2011-06-14 Kla-Tencor Corp. Computer-implemented methods, systems, and computer-readable media for determining a model for predicting printability of reticle features on a wafer
JP4594994B2 (ja) * 2008-03-24 2010-12-08 株式会社東芝 マスクパターンデータ生成方法、マスクの製造方法、半導体装置の製造方法及びパターンデータ生成プログラム
JP4918598B2 (ja) * 2010-01-18 2012-04-18 株式会社ニューフレアテクノロジー 検査装置および検査方法
KR101095549B1 (ko) * 2010-04-29 2011-12-19 삼성전자주식회사 마스크리스 노광 장치와 이를 이용한 스티칭 노광 방법
JP6189933B2 (ja) * 2012-04-18 2017-08-30 ディー・ツー・エス・インコーポレイテッドＤ２Ｓ， Ｉｎｃ． 荷電粒子ビームリソグラフィを用いる限界寸法均一性のための方法およびシステム

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7120285B1 (en) * 2000-02-29 2006-10-10 Advanced Micro Devices, Inc. Method for evaluation of reticle image using aerial image simulator
US6777147B1 (en) * 2003-05-21 2004-08-17 International Business Machines Corporation Method for evaluating the effects of multiple exposure processes in lithography
US20060136862A1 (en) * 2004-11-29 2006-06-22 Shigeki Nojima Pattern data verification method, pattern data creation method, exposure mask manufacturing method, semiconductor device manufacturing method, and computer program product
US20060234139A1 (en) * 2005-04-13 2006-10-19 Kla-Tencor Technologies Corporation Systems and methods for modifying a reticle's optical properties
TW201305531A (zh) * 2011-06-14 2013-02-01 Advantest Corp 圖案量測裝置及圖案量測方法

Also Published As

Publication number Publication date
KR20140111999A (ko) 2014-09-22
KR101675628B1 (ko) 2016-11-11
US9299135B2 (en) 2016-03-29
US20140270468A1 (en) 2014-09-18
TW201442065A (zh) 2014-11-01

Similar Documents

Publication Publication Date Title
GB2533229B (en) Mineral-encapsulated tracers
GB2516512B (en) Face detection
HK1214896A1 (zh) 接近度檢測
EP2977754A4 (en) DEVICE FOR DETECTING MAGNETIC CHARACTERISTICS
GB201319612D0 (en) Detection of a microphone
GB201801587D0 (en) Marker Development
HK1199852A1 (zh) 口罩
EP2986385A4 (en) METHOD FOR PRODUCING A DROP GENERATION DEVICE
GB201316478D0 (en) Remote Detection
IL240319A0 (en) Quick discovery
EP3023416A4 (en) PREPARATION OF (-) - HUPERZINE A
GB201320692D0 (en) Solenoid-actuator-armature end-of-motion detection
HUP1300468A2 (en) Laryngeal mask
EP2989611A4 (en) MOBILE OBJECT DETECTION
EP2881719C0 (en) Spark detection
TWI560745B (en) Detection of weak points of a mask
GB201317540D0 (en) Sensing
HK1245419B (zh) 圓筒光罩
GB201321056D0 (en) Debug circuitry
GB201315249D0 (en) Sensing
HK1223068A1 (zh) 種構建軟管的方法
IL238230B (en) Receiver-transmitter
GB2511755B (en) Event Detection
GB201301013D0 (en) Clothing with a pouch for temporary display of an object
GB201322848D0 (en) Offset detection