TWI560441B - - Google Patents

Info

Publication number
TWI560441B
TWI560441B TW101108552A TW101108552A TWI560441B TW I560441 B TWI560441 B TW I560441B TW 101108552 A TW101108552 A TW 101108552A TW 101108552 A TW101108552 A TW 101108552A TW I560441 B TWI560441 B TW I560441B
Authority
TW
Taiwan
Application number
TW101108552A
Other languages
Chinese (zh)
Other versions
TW201239348A (en
Inventor
Yasuyuki Kuze
Hisashi Yamamoto
Original Assignee
Toray Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Eng Co Ltd filed Critical Toray Eng Co Ltd
Publication of TW201239348A publication Critical patent/TW201239348A/zh
Application granted granted Critical
Publication of TWI560441B publication Critical patent/TWI560441B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/136—Segmentation; Edge detection involving thresholding
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Quality & Reliability (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Image Processing (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Analysis (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
TW101108552A 2011-03-25 2012-03-14 Exterior inspection method and device for same TW201239348A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011066974 2011-03-25

Publications (2)

Publication Number Publication Date
TW201239348A TW201239348A (en) 2012-10-01
TWI560441B true TWI560441B (ja) 2016-12-01

Family

ID=46930066

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101108552A TW201239348A (en) 2011-03-25 2012-03-14 Exterior inspection method and device for same

Country Status (4)

Country Link
JP (1) JP5917492B2 (ja)
CN (1) CN103460029B (ja)
TW (1) TW201239348A (ja)
WO (1) WO2012132273A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI741541B (zh) * 2020-03-26 2021-10-01 華邦電子股份有限公司 影像分析系統及影像分析方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5978162B2 (ja) * 2013-03-29 2016-08-24 株式会社日立ハイテクノロジーズ 欠陥検査方法および欠陥検査装置
TWI494561B (zh) * 2013-12-19 2015-08-01 Chroma Ate Inc 用於檢測晶圓之比對座標之方法
JP6784540B2 (ja) * 2015-09-30 2020-11-11 日東電工株式会社 偏光板の検査方法および検査装置
JP7193728B2 (ja) 2019-03-15 2022-12-21 富士通株式会社 情報処理装置および蓄積画像選択方法
CN112541949B (zh) * 2020-12-25 2024-03-29 铜陵三佳山田科技股份有限公司 用于半导体芯片封装的芯片定位方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070188859A1 (en) * 2006-02-15 2007-08-16 Olympus Corporation Visual inspection apparatus
CN101339913A (zh) * 2007-07-02 2009-01-07 日东电工株式会社 半导体晶圆的缺陷位置检测方法
TW201036082A (en) * 2009-03-31 2010-10-01 Toray Eng Co Ltd Inspection condition data generation method and inspection system of semiconductor wafer appearance inspection apparatus
JP2011012971A (ja) * 2009-06-30 2011-01-20 Toray Eng Co Ltd 外観検査方法およびその方法を用いて検査する外観検査装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS632344A (ja) * 1986-06-23 1988-01-07 Matsushita Electric Works Ltd ウエハチツプの検出方法
JPH01173173A (ja) * 1987-12-28 1989-07-07 Matsushita Electric Ind Co Ltd 位置補正機能付認識装置
JPH06215992A (ja) * 1993-01-12 1994-08-05 Sony Corp 半導体装置の取り出し方法
JP2007017283A (ja) * 2005-07-07 2007-01-25 Toshiba Corp 外観検査方法及び外観検査装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070188859A1 (en) * 2006-02-15 2007-08-16 Olympus Corporation Visual inspection apparatus
CN101339913A (zh) * 2007-07-02 2009-01-07 日东电工株式会社 半导体晶圆的缺陷位置检测方法
TW201036082A (en) * 2009-03-31 2010-10-01 Toray Eng Co Ltd Inspection condition data generation method and inspection system of semiconductor wafer appearance inspection apparatus
JP2011012971A (ja) * 2009-06-30 2011-01-20 Toray Eng Co Ltd 外観検査方法およびその方法を用いて検査する外観検査装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI741541B (zh) * 2020-03-26 2021-10-01 華邦電子股份有限公司 影像分析系統及影像分析方法

Also Published As

Publication number Publication date
CN103460029A (zh) 2013-12-18
TW201239348A (en) 2012-10-01
JPWO2012132273A1 (ja) 2014-07-24
CN103460029B (zh) 2015-08-19
WO2012132273A1 (ja) 2012-10-04
JP5917492B2 (ja) 2016-05-18

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