TWI553804B - Substrate structure and method of manufacture thereof - Google Patents

Description

Method of manufacturing substrate structure

The present invention relates to a substrate structure and a method of fabricating the same, and more particularly to a substrate structure for forming a line on an end portion of a conductive hole and a method of fabricating the same.

As electronic products tend to be light and thin, and their functions continue to increase, the lines on the substrate structure tend to become denser. Therefore, the distance between the lines is shrinking, the number of configurations is increasing, and the wiring density is getting more and more. high.

1A and 1B are respectively a cross-sectional view and a partial plan view showing a substrate structure 1 of a conventional technique. As shown, the substrate structure 1 includes a substrate body 10, a first build-up structure 11, a second build-up structure 12, two conductive blind vias 13, two first traces 14, and at least one second trace 15.

The substrate body 10 has an opposite first surface 10a and a second surface 10b. The first build-up structure 11 and the second build-up structure 12 are respectively formed on the first surface 10a and the second surface of the substrate body 10. The two conductive blind vias 13 are formed in the first build-up structure 11 to electrically connect the substrate body 10 .

The two first lines 14 are formed on the first build-up structure 11 to pass through the ends of the two conductive blind holes 13, respectively, and the second line 15 is formed on the first build-up structure 11 to pass the two Between the conductive blind holes 13. The two first lines 14 have two pads 141 formed on the ends of the two conductive vias 13 , and the width A1 of the pads 141 is greater than the width A2 of the ends of the conductive vias 13 to avoid The etching liquid flows into the conductive blind via 13 during the etching operation.

The disadvantage of the substrate structure 1 of FIG. 1A and FIG. 1B is that the width A1 of the pad 141 is greater than the width A2 of the end of the conductive via 13 , so when the first line 14 and the second line 15 are When the density is increased, the pads 141 occupy a portion of the surface of the first build-up structure 11, thereby reducing the number of second lines 15 that can pass between the pads 141, resulting in a reduction in the number of pads. The number of arrangements and the wiring density of a line 14 and a second line 15.

In order to solve the aforementioned problems, the substrate structure 1' as shown in Figs. 2A and 2B has been developed.

2A and 2B are respectively a cross-sectional view and a partial top view of another substrate structure 1' of the prior art. The substrate structure 1' of FIGS. 2A and 2B is substantially the same as the substrate structure 1 of the first FIG. 1A and the first BB, and the main difference is that the substrate structure 1' of FIGS. 2A and 2B reduces the pad 141. The width A1 is such that the width A1 of the pad 141 is equal to the width A3 of the first line 14 on the first build-up structure 11 and smaller than the width A2 of the end of the conductive blind hole 13.

However, the disadvantages of the substrate structure 1' of the above 2A and 2B are that The substrate structure 1 ′ can increase the number of the first lines 14 and the second lines 15 and the wiring density, but the substrate structure 1 ′ needs to additionally fabricate the first build-up structure 11 (or add a second build-up layer) The structure 12) can form the conductive vias 13, the first lines 14 and the second lines 15 on the first build-up structure 11, resulting in a complicated process and high cost of the substrate structure 1'.

Therefore, how to overcome the problems of the above-mentioned prior art has become a problem that is currently being solved.

The present invention provides a substrate structure, comprising: a substrate body having opposite first and second surfaces, and at least two conductive holes extending through the first surface and the second surface; at least two first lines, Forming on the substrate body to extend to the ends of the at least two conductive holes, respectively, and the width of the first line on the end of the conductive hole is smaller than the width of the end of the conductive hole; and at least one The second line is formed on the substrate body to pass between the at least two first lines on the end of the at least two conductive holes.

The substrate structure may include a metal layer formed on one or both of the first surface and the second surface of the substrate body. The substrate structure may further include a second pad formed on the other end of the conductive via to electrically connect the first line via the conductive via, and the width of the second pad is greater than the conductive via width.

The present invention provides a method of fabricating a substrate structure, comprising: providing a substrate body having opposite first and second surfaces, and at least two conductive holes extending through the first surface and the second surface; Ontology Forming at least two first lines respectively extending to the ends of the two conductive holes, and the width of the first line on the end of the conductive hole is smaller than the width of the end of the conductive hole; and the substrate body Forming at least one second line between the at least two first lines on the end of the at least two conductive holes.

The above substrate structure can be formed by forming a metal layer on one or both of the first surface and the second surface of the substrate body.

The forming the at least two conductive holes, the at least two first lines and the first line may include: forming at least two through holes to penetrate the metal layer, the first surface and the second surface of the substrate body; forming a first resist layer The first resistive layer has at least two first trenches extending from the metal layer to the at least two through holes and at least one second between the at least two first trenches a trench, wherein the width of the first trench is smaller than a width of the through hole; and filling a conductive material in the at least two through holes to form the at least two conductive holes, and forming the conductive material in the at least two first trenches Forming the at least two first lines in the groove and the end of the at least two conductive holes, and forming the conductive material in the second groove to form the second line.

The method of fabricating the substrate structure may include removing a portion of the metal layer except the first resist layer; forming a second resist layer on the first line and the second line; etching the metal layer according to the second resist layer Working to remove a portion of the metal layer; and removing the portion of the substrate body other than the second resist layer.

The forming the at least two conductive holes, the at least two first lines and the first line may include: forming at least two through holes to penetrate the metal layer, a first surface and a second surface of the substrate body; filling a conductive material in the at least two through holes, and forming the conductive material on the metal layer; forming a first resist layer on the conductive material of the metal layer, the first The barrier layer has at least two first blocking portions respectively corresponding to the at least two through holes and at least one second blocking portion interposed between the two first blocking portions, and the width of the first blocking portion is smaller than the through hole The width of the metal layer and the conductive material are etched according to the first resist layer, and the at least two conductive holes are formed according to the at least two through holes, the at least two first blocking portions and the second blocking portion, respectively. Two first lines and second lines.

The substrate structure may be formed by removing the first resist layer and exposing a portion of the substrate body, a portion of the at least two conductive via ends, the at least two first lines and the second line.

In the above substrate structure and the method of manufacturing the same, the first line may be formed on the end of the metal layer and the conductive hole, or may pass through the end of the conductive hole, and the second line may be formed on the metal On the floor. The first line on the end of the conductive hole can serve as the first pad.

The substrate structure may be formed by forming a second pad on the other end of the conductive via to electrically connect the first line via the conductive via, and the second pad may have a width greater than a width of the conductive via.

In the above substrate structure and the method of manufacturing the same, the material of the substrate body may be FR-4 resin, FR-5 resin, epoxy resin, polyester fiber, polyamidamine resin, BT resin or glass fiber.

As can be seen from the above, in the substrate structure of the present invention and the method of manufacturing the same, the method further comprises forming at least two conductive holes in the substrate body to penetrate the opposite sides of the substrate body. And forming at least two first lines on the surface of the substrate body to extend to the ends of the at least two conductive holes respectively, and the width of the first line may be smaller than the width of the end of the conductive holes, so as to benefit At least one second line passes between the two first lines on the ends of the two conductive holes. Therefore, in addition to improving the number of the first line and the second line and the wiring density, the present invention can also simplify the manufacturing process of the substrate structure and reduce the cost of the substrate structure.

1,1', 2‧‧‧ substrate structure

10, 20‧‧‧ substrate body

10a, 20a‧‧‧ first surface

10b, 20b‧‧‧ second surface

11‧‧‧First buildup structure

12‧‧‧Second layered structure

13‧‧‧ Conductive blind holes

14, 24‧‧‧ first line

141‧‧‧ solder pads

15, 25‧‧‧ second line

21‧‧‧metal layer

22‧‧‧through holes

221‧‧‧Electrical materials

222‧‧‧Electrical hole

223‧‧‧End

23‧‧‧First resistance layer

231‧‧‧First trench

232‧‧‧Second trench

233‧‧‧First barrier

234‧‧‧Second obstruction

241‧‧‧First pad

242‧‧‧Second pad

26‧‧‧second barrier layer

A1, A2, A3, B1, B2, B3‧‧‧ width

1A and 1B are respectively a cross-sectional view and a partial top view of a substrate structure of the prior art; FIGS. 2A and 2B are respectively schematic cross-sectional views showing another substrate structure of the prior art; 3A to 3F" are schematic cross-sectional views showing an embodiment of a substrate structure and a method of fabricating the same according to an embodiment of the present invention, wherein the 3F' is a third aspect of the 3F, 3F" is a partial plan view of the 3F or 3F' figure; and 4A to 4E" are schematic cross-sectional views showing another embodiment of the substrate structure of the present invention and a method of manufacturing the same, wherein 4E' is another aspect of FIG. 4E, and FIG. 4E" is a partial plan view of FIG. 4E or 4E'.

The other embodiments of the present invention will be readily understood by those skilled in the art from this disclosure.

It is to be understood that the structure, the proportions, the size, and the like of the present invention are intended to be used in conjunction with the disclosure of the specification, and are not intended to limit the invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in this book without affecting the effects and the objectives that can be achieved by the present invention. The technical content disclosed in the invention can be covered.

At the same time, terms such as "upper", "one", "first", "second", "surface" or "end" as quoted in this manual are for convenience only, and not for The scope of the invention can be implemented, and the relative changes or adjustments of the invention are considered to be within the scope of the invention.

3A to 3F" are schematic cross-sectional views showing an embodiment of the substrate structure 2 of the present invention and a method of manufacturing the same, wherein the 3F' is a view of another 3F, and the 3F" is A partial top view of the 3F or 3F' diagram.

As shown in FIG. 3A, a substrate body 20 is provided first and has opposite first and second surfaces 20a, 20b. The substrate body 20 can be a core substrate or a core layer or the like, and the material thereof can be, for example, FR-4 resin, FR-5 resin, epoxy, polyester, polytheneamine. (polyimide) resin, BT resin (polybiguanamine azide resin) or insulating material such as glass fiber.

In this embodiment, one or two metal layers 21 may be formed on one or both of the first surface 20a and the second surface 20b of the substrate body 20. Further, at least two through holes 22 having a width B1 are formed to penetrate the metal layer 21 and the first surface 20a and the second surface 20b of the substrate body 20.

In other embodiments, the metal layer 21 is not necessarily formed on the first surface 20a or the second surface 20b of the substrate body 20, so that the at least two through holes 22 are directly formed in the substrate body 20 to penetrate the The first surface 20a and the second surface 20b.

As shown in FIG. 3B, the metal layer 21 may be formed on one or both of the first surface 20a and the second surface 20b of the substrate body 20 to form one or two first resist layers 23 thereon. On the metal layer 21.

The first resist layer 23 may have at least two first trenches 231 and at least one (eg, two) second trenches 232 extending from the metal layer 21 to the through holes 22 . The width of the first trench 231 is smaller than the width B1 of the through hole 22, and the second trench 232 is interposed between the two first trenches 231. between.

As shown in FIG. 3C , a conductive material 221 is filled in the at least two through holes 22 to form at least two conductive holes 222 , and the conductive material 221 is formed in the at least two first trenches 231 and the at least two conductive vias 222 . The end portion 223 is formed to form at least two first lines 24, and the conductive material 221 is formed in the second trench 232 to form a second line 25.

The first line 24 can be formed on the metal layer 21 and the end portion 223 of the conductive hole 222, and can also pass through the end portion 223 of the conductive hole 222. The second line 25 can be formed on the metal layer 21. on. The first line 24 on the end portion 223 of the conductive hole 222 can serve as a first pad 241 to electrically connect an external component (such as a solder ball or a bonding wire), and the width B2 of the first pad 241 It is equal to or approximately equal to the width B2 of the first line 24 on the metal layer 21.

In this embodiment, the at least two conductive holes 222, the at least two first lines 24 and the second line 25 are simultaneously formed, integrally formed or of the same material. However, in other embodiments, the at least two conductive holes 222, the at least two first lines 24 and the second line 25 may be formed at the same time (formed sequentially), non-integrally formed (formed separately) or different materials.

As shown in FIG. 3D, a portion of the metal layer 21 is exposed except for the first resist layer 23.

As shown in FIG. 3E, the first line 24 and the second line 25 may be formed on the one or two metal layers 21 to form one or two second resist layers 26 on the first line 24 and the On the second line 25.

As shown in FIG. 3F and FIG. 3F, the metal layer 21 may be etched according to the second resist layer 26 to remove a portion of the metal layer 21. Then, the exposed portion of the second resist layer 26 may be removed. The first surface 20a and the second surface 20b of the substrate body 20 thereby form the substrate structure 2.

In addition, as shown in the 3F' and 3F" figures, the 3F' is another aspect of the above 3F. The main difference between the 3F' and the 3F is that the 3F' is formed. The second pad 242 is electrically connected to the first line 24 via the conductive hole 222 at the other end (the end) 223 of the two conductive holes 222, and the width B3 of the second pad 242 is A width B1 larger than the conductive hole 222 is used to electrically connect an external component such as a solder ball or a bonding wire.

4A to 4E" are schematic cross-sectional views showing another embodiment of the substrate structure 2 of the present invention and a method of manufacturing the same, wherein the 4E' is a 4E In another aspect, the 4E" figure is a partial top view of the 4E or 4E'.

As shown in FIG. 4A, a substrate body 20 is provided and has an opposite first surface 20a and a second surface 20b. The substrate body 20 can be a core substrate or a core layer or the like.

In this embodiment, one or two metal layers 21 may be formed on one or both of the first surface 20a and the second surface 20b of the substrate body 20 to form at least two through holes 22 having a width B1. The first surface 20a and the second surface 20b of the substrate body 20 are penetrated through the metal layer 21.

In other embodiments, the metal layer 21 is not necessarily formed on the first surface 20a or the second surface 20b of the substrate body 20, so that the at least two through holes are directly formed in the substrate body 20 to penetrate the first surface. A surface 20a and the second surface 20b.

As shown in FIG. 4B, the conductive material 221 is filled in the at least two through holes 22, and the metal layer 21 is formed on one or both of the first surface 20a and the second surface 20b of the substrate body 20. To form the conductive material 221 on the one or two metal layers 21.

As shown in FIG. 4C, the conductive material 221 may be formed on the one or two metal layers 21 to form one or two first resist layers 23 on the metal layer 21.

The first resistive layer 23 may have at least two first blocking portions 233 corresponding to the at least two through holes 22 and at least one (eg, two) second blocking portions 234 interposed between the two first blocking portions 233, The width B2 of the first blocking portion 233 is smaller than the width B1 of the through hole 22.

As shown in FIG. 4D, the metal layer 21 and the conductive material 221 are etched according to the first resist layer 23, according to the at least two through holes 22, the at least two first blocking portions 233 and the second blocking portion 234. The at least two conductive holes 222, the at least two first lines 24, and the second line 25 are formed respectively.

The first line 24 can be formed on the metal layer 21 and the end portion 223 of the conductive hole 222, and can also pass through the end portion 223 of the conductive hole 222. The second line 25 can be formed on the metal layer 21. on. The first line 24 on the end portion 223 of the conductive hole 222 can serve as a first pad 241 to electrically connect an external component (such as a solder ball or a bonding wire), and the width B2 of the first pad 241 is equal to or approximately It is equal to the width B2 of the first line 24 on the metal layer 21.

In this embodiment, the at least two conductive holes 222, the at least two first lines 24 and the second line 25 are simultaneously formed, integrally formed or of the same material. However, in other embodiments, the at least two conductive holes 222, the at least two first lines 24 and the second line 25 may be formed at the same time (formed sequentially), non-integrally formed (formed separately) or different materials.

As shown in FIG. 4E and FIG. 4E′, the first resist layer 23 is removed, and the substrate body 20, a portion of the at least two conductive holes 222, the at least two first lines 24, and the portion are exposed. The second line 25, thereby forming the substrate structure 2.

In addition, as shown in FIGS. 4E' and 4E", FIG. 4E' is another aspect of the above-mentioned 4E. The main difference between the 4E' and 4E is that the 4E' figure forms a first The second pad 242 is electrically connected to the other end of the at least two conductive holes 222 (the end portion 223 ) via the conductive hole 222 . The first line 24, and the width B3 of the second pad 242 may be greater than the width B1 of the conductive via 222 to electrically connect external components (such as solder balls or bonding wires).

The present invention provides a substrate structure 2 as shown in Figures 3F and 3F' (or Figures 4E and 4E'). The substrate structure 2 mainly includes a substrate body 20, at least two first lines 24, and at least one second line 25.

The substrate body 20 has a first surface 20a and a second surface 20b opposite to each other, and at least two conductive holes 222 extending through the first surface 20a and the second surface 20b. The substrate body 20 may be a core substrate or a core layer or the like, and the material thereof may be, for example, FR-4 resin, FR-5 resin, epoxy resin, polyester fiber, polyamido resin, BT resin or glass fiber. material.

The first line 24 may be formed on the first surface 20a or the second surface 20b of the substrate body 20 to extend to the end 223 of the two conductive holes 222 or to the end of the conductive hole 222. The width B2 of the first line 24 on the end portion 223 of the conductive hole 222 is smaller than the width B1 of the end portion 223 of the conductive hole 222. The first line 24 on the end portion 223 of the conductive hole 222 can serve as a first pad 241 to electrically connect an external component (such as a solder ball or a bonding wire), and the width B2 of the first pad 241 is equal to or approximately It is equal to the width B2 of the first line 24 on the metal layer 21.

The second line 26 is formed on the substrate body 20 to pass between the at least two first lines 24 on the end 223 of the at least two conductive holes 222.

The substrate structure 2 may include one or two metal layers 21 formed on one or both of the first surface 20a and the second surface 20b of the substrate body 20. The first line 24 is formed on the end portion 223 of the metal layer 21 and the conductive hole 222 or passes over the end portion 223 of the conductive hole 222, and the second line 25 is formed on the metal. On layer 21.

In addition, as shown in FIGS. 3F' and 3F", the 3F' is another aspect of the above 3F. The difference between the 3F' and the 3F is that the substrate structure 2 of the 3F' is A second pad 242 is formed on the other end of the two conductive vias 222 (the end) 223 to electrically connect the first line 24 via the conductive via 222, and the second solder The width B3 of the pad 242 may be greater than the width B1 of the conductive via 222 to electrically connect external components such as solder balls or bonding wires.

As can be seen from the above, the substrate structure of the present invention and the method for fabricating the same are mainly for forming at least two conductive holes in the substrate body to penetrate opposite surfaces of the substrate body, and forming at least two first lines on the surface of the substrate body. And extending to the end of the at least two conductive holes, and the width of the first line may be smaller than the width of the end of the conductive hole, so that at least one second line passes through the end of the two conductive holes Between one line. Therefore, in addition to improving the number of the first line and the second line and the wiring density, the present invention can also simplify the manufacturing process of the substrate structure and reduce the cost of the substrate structure.

The above embodiments are intended to illustrate the principles of the invention and its effects, and are not intended to limit the invention. Any of the above-described embodiments may be modified by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the scope of the patent application.

2‧‧‧Substrate structure

20‧‧‧Substrate body

20a‧‧‧ first surface

20b‧‧‧second surface

21‧‧‧metal layer

222‧‧‧Electrical hole

223‧‧‧End

24‧‧‧First line

241‧‧‧First pad

25‧‧‧second line

B1, B2‧‧‧ width

Claims (8)

A method of fabricating a substrate structure, comprising: providing a substrate body having opposite first and second surfaces, and forming a metal layer on one or both of the first surface and the second surface of the substrate body, a metal layer, a first surface and a second surface of the substrate body having at least two conductive holes formed therein; and at least two first lines extending to the ends of the two conductive holes respectively formed on the metal layer, and the first line The width of the end of the conductive hole is smaller than the width of the end of the conductive hole; and the at least one of the at least two first lines on the end of the metal layer formed on the end of the at least two conductive holes a second line; wherein the process of forming the at least two conductive holes, the at least two first lines and the second line comprises: forming at least two through holes to penetrate the metal layer, the first surface and the second surface of the substrate body; Forming a first resist layer on the metal layer, the first resistive layer having at least two first trenches extending from the metal layer to the at least two through holes and interposed between the at least two first trenches At least one a trench, wherein the width of the first trench is smaller than a width of the through hole; and filling a conductive material in the at least two through holes to form the at least two conductive holes, and forming the conductive material in the at least two first trenches Forming the at least two first lines in the end of the slot and the at least two conductive holes, and forming the conductive material in the second trench to form the second line. The method for manufacturing a substrate structure according to claim 1, further comprising: removing the portion of the metal layer except the first resist layer; forming a second resist layer on the first line and the second line; The second resist layer etches the metal layer to remove a portion of the metal layer; and removes the second resist layer to expose the first line and the second line. A method of fabricating a substrate structure, comprising: providing a substrate body having opposite first and second surfaces, and forming a metal layer on one or both of the first surface and the second surface of the substrate body, a metal layer, a first surface and a second surface of the substrate body having at least two conductive holes formed therein; and at least two first lines extending to the ends of the two conductive holes respectively formed on the metal layer, and the first line The width of the end of the conductive hole is smaller than the width of the end of the conductive hole; and the at least one of the at least two first lines on the end of the metal layer formed on the end of the at least two conductive holes a second line; wherein the process of forming the at least two conductive holes, the at least two first lines and the second line comprises: forming at least two through holes to penetrate the metal layer, the first surface and the second surface of the substrate body; Filling a conductive material in the at least two through holes and forming the guide And electrically forming a first resist layer on the conductive material of the metal layer, wherein the first resist layer has at least two first blocking portions respectively corresponding to the at least two through holes and the second At least one second blocking portion between the barrier portions, and the width of the first blocking portion is smaller than the width of the through hole; and etching the metal layer and the conductive material according to the first resist layer, according to the The at least two through holes, the at least two first blocking portions and the second blocking portion respectively form the at least two conductive holes, the at least two first lines and the second line. The method for fabricating a substrate structure according to claim 3, further comprising removing the first resist layer and exposing the at least two first lines and the second line. The method of fabricating a substrate structure according to claim 1 or 3, wherein the first circuit is formed on the end of the metal layer and the conductive hole or passes through the end of the conductive hole. And the second circuit is formed on the metal layer. The method of fabricating a substrate structure according to claim 1 or 3, wherein the first line on the end of each of the conductive holes serves as a first pad. The method of fabricating the substrate structure according to the first or third aspect of the invention, further comprising forming a second solder pad on the other end of the conductive via to electrically connect the first line via the conductive via, The width of the second pad is greater than the width of the conductive via. The method for manufacturing a substrate structure according to the first or third aspect of the invention, wherein the substrate body is made of FR-4 resin, FR-5 resin, epoxy resin, polyester fiber, polyamidoamine. Resin, BT resin or fiberglass.