TWI520295B - Substrate having pillar group and via group and semiconductor package having pillar group and via group - Google Patents

Description

Substrate with metal column group and conductive hole group and package structure with metal column group and conductive hole group

The present invention relates to a substrate and a package structure. In particular, the present invention relates to a substrate having a metal pillar group and a conductive hole group, and a package structure having a metal pillar group and a conductive hole group.

Conventional metal posts are placed around the substrate and surround the wafer on the substrate as an input/output (I/O) connection point for interconnection with other substrates. However, according to the structure of the conventional metal column, it is difficult to increase the number of conventional metal pillars on the substrate, so the number of interconnected I/Os cannot be increased. Moreover, even with a conductive via (Via) structure, one conductive via can only be electrically connected to one metal pillar, and it is still difficult to increase the number of conventional metal pillars on the substrate and the number of I/Os that cannot be interconnected.

One aspect of the disclosure relates to a substrate having a set of metal pillars and a set of conductive holes. In one embodiment, the substrate having the metal pillar group and the conductive hole group includes: a substrate body, a plurality of first conductive pads, a plurality of first metal pillars, at least one conductive pad group, at least one metal pillar group, and at least a first set of conductive holes. The substrate body has a first surface, a first intermediate layer, a first circuit layer and a second circuit layer, and the first circuit layer includes a plurality of first lines The wire is disposed on the first surface, and the second circuit layer includes a plurality of second wires disposed on the first intermediate layer of the substrate body. The first conductive pads are disposed on the first surface and electrically connected to the first wires. The first metal pillars are respectively formed on the first conductive pads. The at least one conductive pad set is disposed on the first surface, each of the conductive pad sets includes a plurality of second conductive pads, each of the second conductive pads having at least one inner side and at least one outer side in the conductive pad set The inner side of one of the second conductive pads and the inner side of the adjacent second conductive pad are opposite each other with an elongated spacer therebetween. The at least one metal pillar group is formed on a portion of the at least one conductive pad group, and each of the metal pillar groups includes a plurality of second metal pillars respectively formed on a portion of the second conductive pads. Each of the first conductive hole groups includes a first through hole and a plurality of first conductive segments, the first through hole passes through the first surface and the first intermediate layer, and the first conductive segments are disposed on the first conductive layer The first conductive segments are electrically connected to the second conductive pads and the second conductive wires respectively in a through hole and corresponding to the second conductive pads of the conductive pad group.

Another aspect of the disclosure relates to a package structure having a metal pillar group and a conductive hole group. In one embodiment, the package structure having the metal pillar group and the conductive hole group includes: a first substrate, a second substrate, a wafer, and a sealant. The first substrate includes a first substrate body, a plurality of first conductive pads, a plurality of first metal pillars, at least one conductive pad set, at least one metal pillar set, and at least one first conductive hole set. The first substrate body has a first surface, a first intermediate layer, a first circuit layer and a second circuit layer. The first circuit layer includes a plurality of first wires disposed on the first surface. The two circuit layers include a plurality of second wires disposed on the first intermediate layer of the substrate body. The first conductive pads are disposed on the first surface and electrically connected to the first wires. The first metal pillars are respectively formed on the first conductive pads. The at least one conductive pad set is disposed on the first surface, each of the conductive pad sets includes a plurality of second conductive pads, each of the second conductive pads having at least one inner side and at least one outer side in the conductive pad set The inner side of one of the second conductive pads and the inner side of the adjacent second conductive pad are opposite each other with an elongated spacer therebetween. The to a plurality of metal pillars are formed on a portion of the at least one conductive pad group, each of the metal pillar groups includes a plurality of second metal pillars respectively formed on a portion of the second conductive pads; each of the first conductive via groups includes a a first through hole and a plurality of first conductor segments, the first through hole passing through the first surface and the first intermediate layer, wherein the first conductive segments are disposed in the first through hole and corresponding to the conductive The second conductive pads of the pad group are electrically connected to the second conductive pads and the second wires, respectively. The second substrate includes a second substrate body and a plurality of conductive terminals, and the second substrate body has a second surface facing the first surface of the first substrate. The conductive terminals of the second substrate are electrically connected to the first metal pillars of the first substrate and the at least one metal pillar group. The wafer is disposed on the first substrate and electrically coupled to at least one of the first wires or the second wires of the first substrate. The sealant is disposed between the first substrate and the second substrate.

The conductive pad set has a plurality of second conductive pads, and a plurality of second metal pillars are correspondingly arranged, and the conductive hole group has a plurality of conductor segments electrically connected to the second conductive pads, so that the metal pillars can be greatly improved The number of I/Os is increased, and the area occupied by the conductive pads, the metal posts, and the conductive hole groups can be reduced.

10‧‧‧substrate and first substrate with metal column group and conductive hole group

11‧‧‧Substrate body, first substrate body

12‧‧‧First conductive pad

13‧‧‧First metal column

14‧‧‧Electrical mat group

15‧‧‧Metal column group

16‧‧‧First conductive hole group

17‧‧‧First intermediate layer conductive pad set

111‧‧‧ first surface

112‧‧‧First intermediate layer

113‧‧‧First circuit layer

114‧‧‧Second circuit layer

115‧‧‧First wire

116‧‧‧second wire

141, 142‧‧‧second conductive pad

145, 147‧‧‧ the inner side of the conductive pad

146, 148‧‧‧ outside the conductive pad

149‧‧‧Slong interval

151, 152‧‧‧ second metal column

161‧‧‧ first through hole

162, 163‧‧‧ first conductor section

171, 172‧‧‧ third conductive pad

20‧‧‧Substrate with metal column group and conductive hole group

24‧‧‧Electrical mat set

25‧‧‧Metal column group

27‧‧‧First intermediate layer conductive pad set

241, 242, 243, 244‧‧‧ second conductive pads

251, 252, 253, 254‧‧‧ second metal column

271, 272, 273, 274‧‧‧ third conductive pads

30‧‧‧Substrate with metal column group and conductive hole group

34‧‧‧Electrical mat set

35‧‧‧Metal column group

37‧‧‧First intermediate layer conductive pad set

341, 342, 343, 344, 345, 346‧‧‧ second conductive pads

351, 352, 353, 354, 355, 356‧‧‧ second metal column

371, 372, 373, 374, 375, 376‧‧‧ third conductive pads

40‧‧‧Substrate with metal column group and conductive hole group

41‧‧‧Substrate body

411‧‧‧ first surface

112‧‧‧First intermediate layer

414‧‧‧ third circuit layer

415‧‧‧Second intermediate layer

416‧‧‧ Third wire

47‧‧‧Electrical mat set

471, 472, 473, 474‧‧‧ second conductive pads

49‧‧‧Second conductive hole group

491‧‧‧Second through hole

492, 493‧‧‧second conductor section

52‧‧‧First intermediate layer conductive pad set

521, 522, 523, 524‧‧‧4th conductive pad

53‧‧‧Second intermediate layer conductive pad set

531, 532, 533, 534‧‧‧ fifth conductive pad

611, 612, 613, 614‧‧‧ second conductive pads

62‧‧‧6th conductive pad

63‧‧‧ Third metal column

70‧‧‧Package structure with metal column group and conductive hole group

71‧‧‧ wafer

72‧‧‧Packing

80‧‧‧second substrate

81‧‧‧Second substrate body

82‧‧‧Electrical end points

811‧‧‧ second surface

821‧‧‧Metal bumps

822‧‧‧ solder

1 is a cross-sectional view showing a first embodiment of a substrate having a metal pillar group and a conductive hole group according to the present invention; and FIG. 2 is a view showing a first embodiment of the substrate having a metal pillar group and a conductive hole group according to the present invention. FIG. 3 is a schematic view showing a first embodiment of a substrate having a metal pillar group and a conductive hole group according to the present invention; FIG. 4 is a second embodiment of the substrate having a metal pillar group and a conductive hole group according to the present invention; The embodiment is a schematic view from the top of the first surface; FIG. 5 is a schematic view showing the second embodiment of the substrate with the metal pillar group and the conductive hole group of the present invention; 6 is a top plan view showing a third embodiment of a substrate having a metal pillar group and a conductive hole group according to the present invention; FIG. 7 is a view showing a third embodiment of the substrate having the metal pillar group and the conductive hole group of the present invention. FIG. 8 is a cross-sectional view showing a fourth embodiment of a substrate having a metal pillar group and a conductive hole group according to the present invention; and FIG. 9 is a fourth embodiment of the substrate having a metal pillar group and a conductive hole group according to the present invention; The embodiment is shown in the top view of the first surface; FIG. 10 is a schematic view showing the fourth embodiment of the substrate with the metal pillar group and the conductive hole group of the present invention, and FIG. 11 shows the metal pillar group and the conductive layer of the present invention. The fourth embodiment of the substrate of the hole group is a schematic view of the second intermediate layer; FIG. 12 is a schematic cross-sectional view showing the fifth embodiment of the substrate with the metal column group and the conductive hole group of the present invention; FIG. 13 shows the metal column of the present invention. The fifth embodiment of the substrate of the group and the conductive hole group is viewed from the top of the first surface; FIG. 14 is a schematic cross-sectional view showing the package structure of the metal column group and the conductive hole group of the present invention; and FIG. 15 shows the metal of the present invention. Column group and conductive hole group One embodiment of the substrate is viewed from above the first surface.

1 is a cross-sectional view showing a first embodiment of a substrate having a metal pillar group and a conductive hole group according to the present invention. 2 shows a top view of a first embodiment of a substrate having a metal pillar set and a conductive via set of the present invention. 3 is a schematic view showing a first embodiment of a substrate having a metal pillar group and a conductive hole group according to the present invention. Referring to FIG. 1 to FIG. 3, the substrate 10 having the metal pillar group and the conductive hole group includes: a substrate body 11 and a plurality of first guides The electric pad 12, the plurality of first metal posts 13, the at least one conductive pad set 14, the at least one metal post set 15 and the at least one first conductive hole set 16.

The substrate body 11 has a first surface 111, a first intermediate layer 112, a first circuit layer 113 and a second circuit layer 114. The first circuit layer 113 includes a plurality of first wires 115 disposed on the substrate A surface 111. The second circuit layer 114 includes a plurality of second wires 116 disposed on the first intermediate layer 112 of the substrate body 11.

The first conductive pads 12 are disposed on the first surface 111 and electrically connected to the first conductive lines 115, respectively. The first metal pillars 13 are formed on the first conductive pads 12, respectively. The at least one conductive pad set 14 is disposed on the first surface 111, and each of the conductive pad sets includes a plurality of second conductive pads. In the embodiment, the conductive pad set 14 includes two second conductive pads 141, 142. Each of the second conductive pads 141 has an inner side 145 and an outer side 146, and the second conductive pad 142 has an inner side. 147 and an outer side 148. The inner side 145 of the second conductive pad 141 in the conductive pad set 14 and the inner side 147 of the adjacent second conductive pad 142 are opposite each other with an elongated spacer 149 therebetween. In this embodiment, the inner side 145 of the second conductive pad 141 is parallel to the inner side 147 of the adjacent second conductive pad 142, that is, the elongated spacer 149 is a parallel spacer 149. In another embodiment of the present invention, the second conductive pad has an elliptical structure, and the long side radius defines an inner side and an outer side of the elliptical shape, and the inner side of the second conductive pad and the adjacent second conductive The inner side of the pad is a circular arc structure, and the spacing area is a structure that is gradually widened from the middle to the outside. Referring to FIG. 15, the at least one inner side of the second conductive pad has a shortest distance S and a farthest distance L from the inner side of the adjacent second conductive pad, and the shortest distance S of the second conductive pads The distance between the position of the farthest distance L and the position of the farthest distance L is X1, and the difference between the shortest distance S and the farthest distance L is X2, where 2X1 is greater than X2.

The at least one metal pillar group 15 is formed on a portion of the at least one conductive pad group 14, each of the metal pillar groups includes a plurality of second metal pillars. In the embodiment, the metal pillar group 15 includes two second metal pillars. 151, 152, respectively corresponding to the second conductive pads 141, On 142. The conductive pad group 14 is circular, the two second conductive pads 141, 142 are semi-circular, and the two second metal posts 151, 152 are circular. In another embodiment of the invention, the second metal post may be elliptical.

Each of the first conductive vias 16 includes a first via 161 and a plurality of first conductor segments 162 and 163. In this embodiment, the first conductive via 16 includes the first via 161 and two First conductor segments 162, 163. The first through hole 161 passes through the first surface 111 and the first intermediate layer 112. The first conductor segments 162 and 163 are disposed in the first through hole 161, and corresponding to the conductive pad group 14 Second conductive pads 141, 142. Corresponding to the semi-circular second conductive pads 141, 142, the first conductor segments 162, 163 may be semi-cylindrical. The first conductor segments 162 and 163 are electrically connected to the second conductive pads 141 and 142 and the second wires 116 respectively. A dielectric material may be present between the first conductor segments 162, 163 to avoid shorting within the conductive segments.

The substrate 10 having the metal pillar group and the conductive hole group further includes at least one first intermediate layer conductive pad group 17 disposed on the first intermediate layer 112, and each of the first intermediate layer conductive pad groups includes a plurality of third conductive pads In the embodiment, the first intermediate layer conductive pad set 17 includes two third conductive pads 171, 172. Each of the third conductive pads has at least one inner side and at least one outer side. The third conductive pads 171, 172 correspond to the second conductive pads 141, 142, that is, the two third conductive pads 171, 172 are also semi-circular. The third conductive pads are electrically connected to the first conductor segments and the second wires, wherein the third conductive pads 171 are electrically connected to the first conductor segments 161 and the second wires 116.

The volume and shape of the first metal pillars 13 and the second metal pillars 151 and 152 may be the same or different, and the spacing between the first metal pillars 13 and the second metal pillars 151 and 152 may be the same or different.

In this example, the substrate 10 itself is an inactive component, ie, the substrate 10 does not contain any active components (such as active wafers or active circuitry), such as a printed circuit board. In another example, the substrate 10 can include an active line or an active chip to become an active element. Pieces.

In one embodiment of the present invention, the first through hole 161 is formed by laser drilling, and then a conductive channel is formed by electroplating, and the conductive channel is cut by laser. The first conductive segments 162, 163 are formed, and a dielectric material can be filled between the conductive segments as needed.

In the embodiment of the invention, the first conductive pad 12, the second conductive pads 141, 142 and the conductive traces 115 are formed. In an embodiment of the invention, the pattern is defined by exposure and development of the dry film, and then etching is performed. The first conductive pads 12, the second conductive pads 141, 142 and the conductive traces 115 are formed simultaneously. In another embodiment of the present invention, the second conductive pads 141, 142 first form a large conductive pad, and then cut a conductive pad into a plurality of smaller conductive pads by laser cutting to form a conductive pad group 12. .

A method of forming the first metal pillars 13 and the second metal pillars 151 and 152. In an embodiment of the invention, a seed layer is formed on the conductive pad group, and then plated. The first metal pillars 13 and the second metal pillars 151, 152 are formed in a manner. Another embodiment of the present invention forms a metal pillar by filling a patterned dry film with a conductive paste, and then removing the dry film.

The conductive pad set has a plurality of second conductive pads, and a plurality of second metal pillars are correspondingly arranged, and the conductive hole group has a plurality of conductor segments electrically connected to the second conductive pads, so that the metal pillars can be greatly improved The number of I/Os is increased, and the area occupied by the conductive pads, the metal posts, and the conductive hole groups can be reduced. In addition, the design of the conductive hole group can improve the flexibility of the wire design and the design of the conductive hole group can reduce the number of wires on one plane, and increase the I/O quantity while reducing the area of the substrate.

4 is a top plan view showing a second embodiment of a substrate having a metal pillar group and a conductive hole group according to the present invention. FIG. 5 is a schematic view showing a second embodiment of a substrate having a metal pillar group and a conductive hole group according to the present invention. 4 and FIG. 5, the same components are given the same component numbers in the second embodiment as compared with the first embodiment. In the gold In the substrate 20 of the column group and the conductive hole group, each of the conductive pad sets is circular, and each of the conductive pad sets includes four second conductive pads, wherein the conductive pad set 24 includes four second conductive pads 241, 242, 243, and 244, the second conductive pads 241, 242, 243, and 244 are quarter-circular. Moreover, each of the metal pillar groups includes four second metal pillars, wherein the metal pillar group 25 includes four second metal pillars 251, 252, 253, and 254 respectively formed corresponding to the second conductive pads 241, 242, At 243, 244, the four second metal posts 251, 252, 253, 254 are circular.

Likewise, each of the first intermediate layer conductive pad sets includes four third conductive pads, wherein the first intermediate layer conductive pad set 27 includes four third conductive pads 271, 272, 273, 274. The four third conductive pads 271, 272, 273, 274 are also quarter-circular.

6 is a top plan view showing a third embodiment of a substrate having a metal pillar group and a conductive hole group according to the present invention. FIG. 7 is a schematic view showing a third embodiment of a substrate having a metal pillar group and a conductive hole group according to the present invention. 6 and 7, with reference to the first embodiment, the same elements are given the same component numbers in the third embodiment. In the substrate 30 with the metal pillar group and the conductive hole group, each conductive pad group is circular, and each conductive pad group includes six second conductive pads, wherein the conductive pad group 34 includes six second conductive layers. Pads 341, 342, 343, 344, 345, 346, the second conductive pads 341, 342, 343, 344, 345, 346 are one-sixth round. Moreover, each of the metal pillar groups includes six second metal pillars, wherein the metal pillar group 35 includes six second metal pillars 351, 352, 353, 354, 355, and 356 respectively corresponding to the second conductive pads. On the 341, 342, 343, 344, 345, 346, the six second metal posts 351, 352, 353, 354, 355, 356 are circular.

Likewise, each of the first intermediate layer conductive pad sets includes six third conductive pads, wherein the first intermediate layer conductive pad set 37 includes six third conductive pads 371, 372, 373, 374, 375, 376. The six third conductive pads 371, 372, 373, 374, 375, 376 are also one-sixth round.

8 is a cross-sectional view showing a fourth embodiment of a substrate having a metal pillar group and a conductive hole group according to the present invention. FIG. 9 is a top plan view showing a fourth embodiment of a substrate having a metal pillar group and a conductive hole group according to the present invention. FIG. 10 is a schematic view showing a fourth embodiment of a substrate having a metal pillar group and a conductive hole group according to the present invention. Figure 11 is a schematic view showing a fourth embodiment of the substrate of the present invention having a metal pillar group and a conductive via group. In the fourth embodiment, the same elements are given the same element numbers as compared with the second embodiment. Referring to FIG. 8 to FIG. 11 , the substrate body 41 of the substrate 40 having the metal pillar group and the conductive hole group further includes a third circuit layer 414 and a second intermediate layer 415. The third circuit layer 414 includes a plurality of strips. The three wires 416 are disposed on the second intermediate layer 415 of the substrate body 41.

The substrate 40 further includes at least one second conductive hole group 49. Each of the second conductive hole groups includes a second through hole and a plurality of second conductive segments. In this embodiment, the second conductive hole group 49 includes A second through hole 491 and four second conductor segments 492, 493 and the like. The second through hole 491 passes through the first surface 411, the first intermediate layer 412 and the second intermediate layer 415, and the four second conductor segments 492, 493 are disposed in the second through hole 491, and correspondingly The second conductive pads 471, 472, 473, and 474 of the conductive pad group 47 are electrically connected to the second conductive pads 471, 472, 473, and 474, respectively. Three wires 416.

In the first intermediate layer 412, in addition to the first intermediate layer conductive pad group 27 of the second embodiment, the substrate 40 further includes at least one first intermediate layer conductive pad group 52 disposed on the first intermediate layer 412. Each of the first intermediate layer conductive pad sets includes a plurality of fourth conductive pads, wherein the first intermediate layer conductive pad set 52 includes four fourth conductive pads 521, 522, 523, 524, each of the fourth conductive pads having At least one inner side and at least one outer side correspond to the second conductive pads 471, 472, 473, 474, and the four fourth conductive pads 521, 522, 523, 524 are also quarter-circular. The fourth conductive pads 521, 522, 523, and 524 are electrically connected to the second conductor segments 492, 493 and the like, respectively, but the second wires 116 are not connected.

In the second intermediate layer 415, the substrate 40 further includes at least one second intermediate layer conductive pad The group 53 is disposed on the second intermediate layer 415, and each of the second intermediate layer conductive pad sets includes a plurality of fifth conductive pads, wherein the second intermediate layer conductive pad set 53 includes four fifth conductive pads 531, 532, 533 , 534. Each of the fifth conductive pads has at least one inner side and at least one outer side, corresponding to the second conductive pads 471, 472, 473, 474 and the fourth conductive pads 521, 522, 523, 524, four The fifth conductive pads 531, 532, 533, 534 are also quarter-circular. The fifth conductive pads 531, 532, 533, 534 are electrically connected to the second conductor segments 492, 493 and the third wires 416, respectively.

Figure 12 is a cross-sectional view showing a fifth embodiment of the substrate having the metal pillar group and the conductive hole group of the present invention. Figure 13 is a top plan view showing the fifth embodiment of the substrate with the metal pillar group and the conductive hole group of the present invention. In the fifth embodiment, the same elements are given the same element numbers as compared with the fourth embodiment. Referring to FIG. 12 to FIG. 13 , the substrate 60 with the metal pillar group and the conductive hole group further includes a plurality of second conductive pads 611 , 612 , 613 , 614 , a plurality of sixth conductive pads 62 , and a plurality of third metal pillars . 63. In this embodiment, the second conductive pads 611, 612, 613, and 614 have no metal pillars, and the first conductive wires 115 are electrically connected to the sixth conductive pads 62, and the sixth conductive pads 62. The second conductive pads are electrically connected to the second conductive pads, that is, the sixth conductive pads 62 are electrically connected to the second conductive pads 611, 612, 613, and 614, but are not electrically connected. Two conductive pads 241, 242, 243, 244. The third metal pillars 63 are respectively formed on the sixth conductive pads 62 such that the positions of the third metal pillars 63 can be elastically adjusted, and are not limited to the second conductive pads 611, 612, 613, and 614. on.

14 is a cross-sectional view showing a package structure of a metal pillar group and a conductive hole group of the present invention. In one embodiment, the package structure 70 having the metal pillar group and the conductive hole group includes a first substrate 10, a second substrate 80, a wafer 71, and a sealant 72. For the first substrate 10, reference may be made to the substrate 10 of the first embodiment of FIGS. 1 to 3, and the same components are given the same component numbers. Referring to FIG. 1 to FIG. 3 and FIG. 14 , the first substrate 10 includes a first substrate body 11 , a plurality of first conductive pads 12 , a plurality of first metal pillars 13 , and at least one conductive pad set . 14. At least one metal pillar group 15 and at least one first conductive hole group 16.

The first substrate body 11 has a first surface 111, a first intermediate layer 112, a first circuit layer 113 and a second circuit layer 114. The first circuit layer 113 includes a plurality of first wires 115 disposed on the first substrate The first surface 111 includes a plurality of second wires 116 disposed on the first intermediate layer 112 of the substrate body 11. The first conductive pads 12 are disposed on the first surface 111 and electrically connected to the first conductive lines 115, respectively. The first metal pillars 13 are formed on the first conductive pads 12, respectively.

The at least one conductive pad set 14 is disposed on the first surface 111, and each of the conductive pad sets includes a plurality of second conductive pads, wherein the conductive pad set 14 includes two second conductive pads 141, 142. Each of the second conductive pads has at least one inner side and at least one outer side, and the inner side 145 of the second conductive pad 141 and the inner side of the adjacent second conductive pad 142 in the conductive pad set 14 The sides 147 are opposite each other with an elongated spacer 149 therebetween. The at least one metal pillar group 15 is formed on the at least one conductive pad group 14, each metal pillar group includes a plurality of second metal pillars, wherein the metal pillar group 15 includes two second metal pillars 151, 152, respectively corresponding to Formed on the second conductive pads 141, 142.

Each of the first conductive via groups includes a first via and a plurality of first conductor segments. The first conductive via 16 includes a first via 161 and two first conductor segments 162, 163. The first through hole 161 passes through the first surface 111 and the first intermediate layer 112. The first conductor segments 162 and 163 are disposed in the first through hole 161, and corresponding to the conductive pad group 14 The second conductive pads 141 and 142 are electrically connected to the second conductive pads 141 and 142 and the second conductive lines 116 respectively.

The second substrate 80 includes a second substrate body 81 and a plurality of conductive terminals 82. The second substrate body 81 has a second surface 811 facing the first surface 111 of the first substrate 10. The conductive terminals 82 of the second substrate 80 are electrically connected to the first metal pillars 13 or the at least one metal pillar group 15 of the first substrate 10 . In this embodiment, the conductive terminal 82 includes a metal bump 821 and a solder 822. The solder 822 and the metal pillar 151 are physically link.

The wafer 71 is disposed on the first substrate 10 and electrically connected to at least one of the first wires 115 or the second wires 116 of the first substrate 10 . The sealant 72 is disposed between the first substrate 10 and the second substrate 80.

The conductive pad set has a plurality of second conductive pads, and a plurality of second metal posts are correspondingly disposed, and the conductive hole group has a plurality of conductor segments electrically connected to the second conductive pads, thereby greatly improving the package structure The number of metal pillars, in turn, increases the number of I/Os, and can reduce the area occupied by the conductive pads, metal pillars, and conductive hole groups of the package structure to increase the interconnect density. In addition, the design of the conductive hole group can improve the flexibility of the wire design and the design of the conductive hole group can reduce the number of wires on one plane, and increase the I/O quantity while reducing the area of the substrate.

However, the above embodiments are merely illustrative of the principles and effects of the invention and are not intended to limit the invention. Therefore, those skilled in the art can make modifications and changes to the above embodiments without departing from the spirit of the invention. The scope of the invention should be as set forth in the appended claims.

10‧‧‧Substrate with metal column group and conductive hole group

11‧‧‧Substrate body

12‧‧‧First conductive pad

13‧‧‧First metal column

16‧‧‧First conductive hole group

111‧‧‧ first surface

112‧‧‧First intermediate layer

115‧‧‧First wire

116‧‧‧second wire

141, 142‧‧‧second conductive pad

151, 152‧‧‧ second metal column

161‧‧‧ first through hole

162, 163‧‧‧ first conductor section

171, 172‧‧‧ third conductive pad

Claims (12)

A substrate having a metal column group and a conductive hole group, comprising: a substrate body having a first surface, a first intermediate layer, a first circuit layer and a second circuit layer, the first circuit layer comprising a plurality of a first wire disposed on the first surface, the second circuit layer includes a plurality of second wires disposed on the first intermediate layer of the substrate body; a plurality of first conductive pads disposed on the first surface, respectively Electrically connecting the first conductive wires; a plurality of first metal pillars respectively formed on the first conductive pads; at least one conductive pad set disposed on the first surface, each of the conductive pad sets including a plurality of second conductive a pad, each of the second conductive pads having at least one inner side and at least one outer side, wherein the inner side of one of the second conductive pads in the conductive pad group and the inner side of the adjacent second conductive pad are in contact with each other Opposite and having a narrow spacer therebetween; at least one metal pillar group is formed on a portion of the at least one conductive pad group, each metal pillar group includes a plurality of second metal pillars, respectively corresponding to the second portion Conductive pad; and to a first conductive hole group, each of the first conductive hole groups includes a first through hole and a plurality of first conductor segments, the first through hole passing through the first surface and the first intermediate layer, the first The second conductive segments are electrically connected to the second conductive pads and the second conductive wires, respectively, in the first conductive vias. The substrate of the metal pillar group and the conductive hole group of claim 1 , wherein each of the conductive pad sets is circular, and each of the conductive pad sets comprises two second conductive pads, wherein the second conductive pads are semicircular . The substrate of the metal column group and the conductive hole group of claim 1 is Each of the conductive pad sets is circular, and each of the conductive pad sets includes four second conductive pads, and the second conductive pads are quarter-circular. The substrate of the metal pillar group and the conductive hole group of claim 1, wherein each of the conductive pad sets is circular, and each of the conductive pad sets comprises six second conductive pads, and the second conductive pads are six-pointed. A round shape. The substrate of the metal pillar group and the conductive hole group of claim 1 further comprising at least one first intermediate layer conductive pad group disposed on the first intermediate layer, each of the first intermediate layer conductive pad groups comprising a plurality of third a conductive pad, each of the third conductive pads having at least one inner side and at least one outer side, corresponding to the second conductive pads, the third conductive pads being electrically connected to the first conductive segments and the The second wire. The substrate of the metal column group and the conductive hole group of claim 1 , wherein the substrate body further comprises a third circuit layer and a second intermediate layer, the third circuit layer comprising a plurality of third wires disposed on the substrate The second intermediate layer of the body; the substrate further includes at least one second conductive hole group, each of the second conductive hole groups includes a second through hole and a plurality of second conductive segments, and the second through hole passes through the first a second conductor segment disposed in the second via hole, and corresponding to the second conductive pads of the conductive pad group, the second conductor segments are respectively electrically connected The second conductive pads and the third wires. The substrate of the metal pillar group and the conductive hole group of claim 1 , wherein the at least one inner side of the second conductive pad has a shortest distance and a farthest distance from an inner side of the adjacent second conductive pad. The distance between the position of the shortest distance of the second conductive pads and the position of the farthest distance is X1, and the difference between the shortest distance and the farthest distance is X2, where 2X1 is greater than X2. The substrate of the metal pillar group and the conductive hole group of claim 1, wherein the at least one inner side of the second conductive pad and the inner side of the adjacent second conductive pad The sides are parallel. The substrate of the metal pillar group and the conductive hole group of claim 1 further includes a plurality of sixth conductive pads and a plurality of third metal pillars, wherein the sixth conductive pads are disposed on the first surface, respectively electrically connecting portions The second conductive pads are formed on the sixth conductive pads. A package structure having a metal pillar group and a conductive hole group, comprising: a first substrate, comprising a first substrate body, a plurality of first conductive pads, a plurality of first metal pillars, at least one conductive pad group, at least one metal a column group and at least one first conductive hole group; the first substrate body has a first surface, a first intermediate layer, a first circuit layer and a second circuit layer, the first circuit layer comprising a plurality of first lines a wire disposed on the first surface, the second circuit layer includes a plurality of second wires disposed on the first intermediate layer of the substrate body; the first conductive pads are disposed on the first surface and electrically connected The first metal wires are respectively formed on the first conductive pads; the at least one conductive pad group is disposed on the first surface, and each of the conductive pad groups includes a plurality of second conductive pads, each a second conductive pad has at least one inner side and at least one outer side, and the inner side of one of the second conductive pads in the conductive pad group and the inner side of the adjacent second conductive pad are opposite to each other and There is a narrow interval between the two; a plurality of metal pillars are formed on a portion of the at least one conductive pad group, each of the metal pillar groups includes a plurality of second metal pillars respectively formed on a portion of the second conductive pads; each of the first conductive via groups includes a a first through hole and a plurality of first conductor segments, the first through hole passing through the first surface and the first intermediate layer, wherein the first conductive segments are disposed in the first through hole and corresponding to the conductive The second conductive pads of the pad set are electrically connected to the second conductive pads and the second conductive wires respectively; and the second substrate comprises a second substrate body and a plurality of conductive ends Pointing, the second substrate body has a second surface facing the first surface of the first substrate The first metal pillars of the first substrate and the at least one metal pillar group are electrically connected to the first substrate; a wafer is disposed on the first substrate and is opposite to the first substrate At least one of the first wires or the second wires is electrically connected; and a sealant is disposed between the first substrate and the second substrate. The package structure of the metal pillar group and the conductive hole group of claim 10, wherein the conductive terminal comprises a metal bump and a solder, and the solder is physically coupled to the metal pillar. The package structure of the metal pillar group and the conductive hole group of claim 10, wherein each of the conductive pad sets is circular, and each of the conductive pad sets includes two second conductive pads, and the second conductive pads are semicircular shape.