TWI550044B - 用於化學機械研磨鎢之方法 - Google Patents

用於化學機械研磨鎢之方法 Download PDF

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Publication number
TWI550044B
TWI550044B TW101128396A TW101128396A TWI550044B TW I550044 B TWI550044 B TW I550044B TW 101128396 A TW101128396 A TW 101128396A TW 101128396 A TW101128396 A TW 101128396A TW I550044 B TWI550044 B TW I550044B
Authority
TW
Taiwan
Prior art keywords
chemical mechanical
mechanical polishing
substrate
tungsten
polishing composition
Prior art date
Application number
TW101128396A
Other languages
English (en)
Chinese (zh)
Other versions
TW201313851A (zh
Inventor
郭毅
李在錫
雷蒙Ｌ 拉夫耶二世
張廣雲
Original Assignee
羅門哈斯電子材料Ｃｍｐ控股公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 羅門哈斯電子材料Ｃｍｐ控股公司 filed Critical 羅門哈斯電子材料Ｃｍｐ控股公司
Publication of TW201313851A publication Critical patent/TW201313851A/zh
Application granted granted Critical
Publication of TWI550044B publication Critical patent/TWI550044B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/062—Manufacture or treatment of conductive parts of the interconnections by smoothing of conductive parts, e.g. by planarisation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW101128396A 2011-08-15 2012-08-07 用於化學機械研磨鎢之方法 TWI550044B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/209,749 US8865013B2 (en) 2011-08-15 2011-08-15 Method for chemical mechanical polishing tungsten

Publications (2)

Publication Number Publication Date
TW201313851A TW201313851A (zh) 2013-04-01
TWI550044B true TWI550044B (zh) 2016-09-21

Family

ID=47625347

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101128396A TWI550044B (zh) 2011-08-15 2012-08-07 用於化學機械研磨鎢之方法

Country Status (7)

Country Link
US (1) US8865013B2 (https=)
JP (1) JP6137793B2 (https=)
KR (1) KR101992132B1 (https=)
CN (1) CN103042464B (https=)
DE (1) DE102012015825A1 (https=)
FR (1) FR2979069B1 (https=)
TW (1) TWI550044B (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101931930B1 (ko) * 2011-12-21 2018-12-24 바스프 에스이 Cmp 조성물의 제조 방법 및 그의 적용
CN103265893B (zh) * 2013-06-04 2015-12-09 复旦大学 一种基于金属Mo的抛光工艺的抛光液、其制备方法及应用
US9303188B2 (en) * 2014-03-11 2016-04-05 Cabot Microelectronics Corporation Composition for tungsten CMP
US9275899B2 (en) * 2014-06-27 2016-03-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition and method for polishing tungsten
US9944828B2 (en) 2014-10-21 2018-04-17 Cabot Microelectronics Corporation Slurry for chemical mechanical polishing of cobalt
US9688885B2 (en) 2014-10-21 2017-06-27 Cabot Microelectronics Corporation Cobalt polishing accelerators
WO2016065057A1 (en) 2014-10-21 2016-04-28 Cabot Microelectronics Corporation Corrosion inhibitors and related compositions and methods
CN107075310B (zh) 2014-10-21 2019-04-02 嘉柏微电子材料股份公司 钴凹陷控制剂
JP6538368B2 (ja) * 2015-02-24 2019-07-03 株式会社フジミインコーポレーテッド 研磨用組成物及び研磨方法
US9803108B1 (en) * 2016-10-19 2017-10-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aqueous compositions of stabilized aminosilane group containing silica particles
US10181408B2 (en) * 2017-01-31 2019-01-15 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method for tungsten using polyglycols and polyglycol derivatives
WO2021210310A1 (ja) * 2020-04-16 2021-10-21 富士フイルムエレクトロニクスマテリアルズ株式会社 処理液、化学的機械的研磨方法、半導体基板の処理方法

Citations (2)

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Publication number Priority date Publication date Assignee Title
TW200706703A (en) * 2005-06-06 2007-02-16 Advanced Tech Materials Integrated chemical mechanical polishing composition and process for single platen processing
US20090311864A1 (en) * 2008-06-12 2009-12-17 Fujifilm Corporation Polishing slurry

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JPH10163142A (ja) * 1996-12-02 1998-06-19 Fujimi Inkooporeetetsudo:Kk タングステンの研磨用組成物
US6083419A (en) 1997-07-28 2000-07-04 Cabot Corporation Polishing composition including an inhibitor of tungsten etching
JP3805588B2 (ja) 1999-12-27 2006-08-02 株式会社日立製作所 半導体装置の製造方法
US6409781B1 (en) 2000-05-01 2002-06-25 Advanced Technology Materials, Inc. Polishing slurries for copper and associated materials
US6569770B2 (en) 2001-06-28 2003-05-27 Chartered Semiconductor Manufacturing Ltd. Method for improving oxide erosion of tungsten CMP operations
FR2835844B1 (fr) * 2002-02-13 2006-12-15 Clariant Procede de polissage mecano-chimique de substrats metalliques
US6641630B1 (en) * 2002-06-06 2003-11-04 Cabot Microelectronics Corp. CMP compositions containing iodine and an iodine vapor-trapping agent
JP2006504270A (ja) 2002-10-22 2006-02-02 サイロクエスト インコーポレーテッド 銅表面の化学的機械研磨用の腐食抑止研磨スラリー
TWI347969B (en) * 2003-09-30 2011-09-01 Fujimi Inc Polishing composition
US8512593B2 (en) * 2005-11-04 2013-08-20 Cheil Industries, Inc. Chemical mechanical polishing slurry compositions, methods of preparing the same and methods of using the same
US20080020680A1 (en) * 2006-07-24 2008-01-24 Cabot Microelectronics Corporation Rate-enhanced CMP compositions for dielectric films
JP5322455B2 (ja) 2007-02-26 2013-10-23 富士フイルム株式会社 研磨液及び研磨方法
JP2009081200A (ja) * 2007-09-25 2009-04-16 Fujifilm Corp 研磨液
US8506831B2 (en) 2008-12-23 2013-08-13 Air Products And Chemicals, Inc. Combination, method, and composition for chemical mechanical planarization of a tungsten-containing substrate
US8119529B2 (en) * 2009-04-29 2012-02-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing a substrate
US8025813B2 (en) * 2009-11-12 2011-09-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition and methods relating thereto
US8232208B2 (en) * 2010-06-15 2012-07-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Stabilized chemical mechanical polishing composition and method of polishing a substrate
US8568610B2 (en) * 2010-09-20 2013-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Stabilized, concentratable chemical mechanical polishing composition and method of polishing a substrate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200706703A (en) * 2005-06-06 2007-02-16 Advanced Tech Materials Integrated chemical mechanical polishing composition and process for single platen processing
US20090311864A1 (en) * 2008-06-12 2009-12-17 Fujifilm Corporation Polishing slurry

Also Published As

Publication number Publication date
KR101992132B1 (ko) 2019-09-30
TW201313851A (zh) 2013-04-01
CN103042464A (zh) 2013-04-17
KR20130020587A (ko) 2013-02-27
CN103042464B (zh) 2015-07-01
DE102012015825A1 (de) 2013-02-21
FR2979069A1 (fr) 2013-02-22
FR2979069B1 (fr) 2014-09-19
JP2013042131A (ja) 2013-02-28
US8865013B2 (en) 2014-10-21
JP6137793B2 (ja) 2017-05-31
US20130045598A1 (en) 2013-02-21

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