TWI549821B - A hardened resin composition, a laminate using the same, and a method for producing the layered product (1) - Google Patents

A hardened resin composition, a laminate using the same, and a method for producing the layered product (1) Download PDF

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TWI549821B
TWI549821B TW100121056A TW100121056A TWI549821B TW I549821 B TWI549821 B TW I549821B TW 100121056 A TW100121056 A TW 100121056A TW 100121056 A TW100121056 A TW 100121056A TW I549821 B TWI549821 B TW I549821B
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resin layer
resin composition
curable
forming
oligomer
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TW201206701A (en
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Satoshi Niiyama
Toyokazu Suzuki
Hitoshi Tsushima
Hiroshige Ito
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Asahi Glass Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/44Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • C08F290/067Polyurethanes; Polyureas
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/06Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)

Description

硬化性樹脂組成物、使用其之層積體以及層積體之製造方法(一)Curing resin composition, laminate using the same, and method for producing laminate (1) 發明領域Field of invention

本發明係關於頗適於面材接合的硬化性樹脂組成物、使用該硬化性樹脂組成物進行面材層積的層積體、以及該層積體之製造方法。The present invention relates to a curable resin composition suitable for surface material joining, a laminate in which a surface material is laminated using the curable resin composition, and a method of producing the laminate.

發明背景Background of the invention

在顯示元件上隔著接合樹脂層進行保護板層積的顯示裝置,當使接合樹脂層硬化時,因該接合樹脂層的收縮所產生應力會有對顯示元件造成影響之可能性。若對顯示元件施加應力,便會發生下述問題。In the display device in which the protective layer is laminated on the display element via the bonding resin layer, when the bonding resin layer is cured, stress generated by shrinkage of the bonding resin layer may affect the display element. If stress is applied to the display element, the following problem occurs.

‧顯示元件中的顯示形成材料(以下稱「顯示材」)會因應力而受影響,會有損及顯示均勻性之虞。例如以液晶顯示元件的情況而言,顯示元件中所封入液晶的排列會因外部應力而凌亂,導致被檢視到顯示斑。‧ The display forming material (hereinafter referred to as "display material") in the display element is affected by stress, which may impair the uniformity of display. For example, in the case of a liquid crystal display element, the arrangement of the liquid crystal enclosed in the display element is disturbed by external stress, and the display spot is observed.

‧當在顯示元件靠顯示面側之基板表面上,形成諸如視野角等為改善顯示品質用的光學膜時,因應力會導致該光學膜的光學特性出現局部性變化,而有損及顯示之均勻性之虞。‧ When an optical film such as a viewing angle is used to improve the display quality on the surface of the substrate on the display surface side of the display element, the optical characteristics of the optical film may be locally changed due to stress, and the display may be damaged. The ambiguity of uniformity.

再者,因為接合樹脂層係設置於顯示元件的檢視側,因而若硬化的接合樹脂層中有存在氣泡,便會發生下述問題。Further, since the bonding resin layer is provided on the inspection side of the display element, if bubbles are present in the cured bonding resin layer, the following problem occurs.

‧來自顯示元件的出射光或反射光會因氣泡而凌亂,會有大幅損及顯示影像之畫質之虞。‧The emitted or reflected light from the display element will be messy due to air bubbles, which will greatly impair the image quality of the displayed image.

‧當顯示元件沒有顯示影像時,因為通過保護板殘存於接合樹脂層中的氣泡較容易被檢視到,因而會有大幅損及製品品質的可能性。‧ When the display element does not display an image, the air bubbles remaining in the bonding resin layer through the protective sheet are more easily viewed, which may greatly deteriorate the quality of the product.

‧樹脂層與顯示元件間之界面接著力、或樹脂層與保護板間之界面接著力會降低。‧ The interfacial adhesion between the resin layer and the display element, or the interface between the resin layer and the protective sheet, is reduced.

製造具有在顯示元件上層積有透明面材之層積構造顯示裝置的方法,已知有如下述方法。A method of fabricating a display device having a laminated structure in which a transparent surface material is laminated on a display element is known, and a method as described below is known.

(1)在樹脂製保護板上注入液態原料使硬化而形成接合樹脂後,或將捲片狀接合樹脂以脫氣狀態貼設於樹脂製保護板上之後,一邊將液晶單元從一端按押一邊使以脫氣狀態進行密接並層積的方法。接合樹脂的原料較佳係使用聚矽氧凝膠(專利文獻1)。(1) After the liquid material is injected into the resin protective plate to be cured to form a bonding resin, or the roll-shaped bonding resin is attached to the resin protective plate in a degassed state, the liquid crystal cell is pushed from one end. A method of adhering and laminating in a degassed state. It is preferable to use a polyphthalocyanine gel as a raw material for the bonding resin (Patent Document 1).

(2)在玻璃製保護板的既定位置處,利用固著構件將顯示面板予以定位而暫時固定後,再對保護板與顯示面板之間所形成的空間中,以減壓狀態注入液態樹脂材料並使硬化,藉此而層積的方法。液態樹脂材料較佳係使用聚矽氧樹脂(專利文獻2)。(2) At a predetermined position of the glass protective plate, the display panel is temporarily fixed by the fixing member, and then the liquid resin material is injected into the space formed between the protective plate and the display panel in a reduced pressure state. And the method of hardening, thereby stratifying. It is preferable to use a polyoxyn resin for the liquid resin material (Patent Document 2).

先行技術文獻Advanced technical literature 專利文獻Patent literature

專利文獻1:日本專利特開平7-209635號公報Patent Document 1: Japanese Patent Laid-Open No. Hei 7-209635

專利文獻2:日本專利特開2006-58753號公報Patent Document 2: Japanese Patent Laid-Open Publication No. 2006-58753

根據本發明者等的發現,藉由降低形成接合樹脂層的樹脂之極性與分子量,便可使接合樹脂層的彈性模數降低。若夾在顯示元件與透明面材間所存在的接合樹脂層之彈性模數降低,則硬化收縮時所產生的應力便會變小,俾可抑制對顯示品質的影響。According to the findings of the inventors of the present invention, the elastic modulus of the bonding resin layer can be lowered by lowering the polarity and molecular weight of the resin forming the bonding resin layer. When the modulus of elasticity of the bonding resin layer existing between the display element and the transparent surface material is lowered, the stress generated during the hardening and contraction is reduced, and the influence on the display quality can be suppressed.

然而,僅依賴降低接合樹脂層的彈性模數,會有將顯示元件與透明面材予以固定的力嫌不足之情況,例如當顯示裝置係呈垂直設置使用時,顯示元件會有經時性從透明面材上偏移脫落、或脫離的可能性。However, depending on merely reducing the modulus of elasticity of the bonding resin layer, there is a case where the force for fixing the display element and the transparent face material is insufficient. For example, when the display device is used in a vertical arrangement, the display element may have a temporal property. The possibility of offset or detachment on the transparent face material.

本發明係有鑒於前述事情而完成,目的在於提供:當隔著由硬化性樹脂組成物的硬化物所構成樹脂層,將面材予以層積一體化時,可將面材彼此間予以充分固定,且可降低因樹脂層硬化時的收縮導致的應力之硬化性樹脂組成物、及使用該硬化性樹脂組成物進行面材之層積的層積體。The present invention has been made in view of the above circumstances, and it is an object of the invention to provide a surface material which can be sufficiently fixed to each other when a surface layer is laminated and integrated by a resin layer composed of a cured product of a curable resin composition. Further, a curable resin composition which can reduce stress due to shrinkage during curing of the resin layer, and a laminate in which the surface material is laminated using the curable resin composition can be used.

再者,本發明目的在於提供:當隔著由硬化性樹脂組成物的硬化物所構成樹脂層,將面材予以層積一體化時,可將面材彼此間予以充分固定,且可降低因樹脂層硬化時的收縮導致的應力,並可充分抑制樹脂層中之氣泡產生的層積體之製造方法。In addition, it is an object of the present invention to provide a surface layer which is formed by laminating a resin layer composed of a cured product of a curable resin composition, and the surface materials can be sufficiently fixed to each other, and the cause can be reduced. A method of producing a laminate of a resin layer in the resin layer by sufficiently suppressing stress caused by shrinkage at the time of curing the resin layer.

本發明的硬化性樹脂組成物,係使用於層積體,該層積體係使未硬化之硬化性樹脂組成物挾持於至少一者為透明的一對面材間並使其硬化而形成者,該硬化性樹脂組成物之特徵在於:於硬化後的動態黏彈性測定時,儲存剪切彈性模數係5×102~1×105Pa,且損失正切係1.4以下。The curable resin composition of the present invention is used in a laminate in which an uncured curable resin composition is held between at least one of a pair of transparent surface materials and cured. The curable resin composition is characterized in that the shear elastic modulus is 5 × 10 2 to 1 × 10 5 Pa and the loss tangent is 1.4 or less at the time of dynamic viscoelasticity measurement after hardening.

較佳為其中含有下述硬化性化合物(II)及下述非硬化性寡聚物(D):硬化性化合物(II):由硬化性樹脂組成物硬化時會進行硬化反應的硬化性化合物之1種以上構成,該硬化性化合物的至少1種具有在前述硬化性樹脂組成物硬化時不會產生反應的羥基;非硬化性寡聚物(D):其係在硬化性樹脂組成物硬化時不會與前述硬化性化合物(II)進行硬化反應,且每1分子具有0.8~3個羥基的寡聚物。It is preferable to contain the following curable compound (II) and the following non-curable oligomer (D): a curable compound (II): a curable compound which undergoes a curing reaction when the curable resin composition is cured. In one or more types, at least one of the curable compounds has a hydroxyl group that does not react when the curable resin composition is cured; and the non-curable oligomer (D): when the curable resin composition is cured An oligomer which does not undergo a curing reaction with the curable compound (II) and has 0.8 to 3 hydroxyl groups per molecule.

較佳為前述硬化性化合物(II)係含有具硬化性基且具羥基的單體。It is preferred that the curable compound (II) contains a monomer having a curable group and having a hydroxyl group.

較佳係前述硬化性化合物(II)含有:寡聚物(A'),其具硬化性基且分子量為1000~100000;及單體(B'),其具硬化性基且分子量為125~600,並且該單體(B')含有具羥基的單體(B3)。Preferably, the curable compound (II) comprises: an oligomer (A') having a curable group and having a molecular weight of from 1,000 to 100,000; and a monomer (B') having a curable group and a molecular weight of 125. 600, and the monomer (B') contains a monomer (B3) having a hydroxyl group.

較佳為前述非硬化性寡聚物(D)係聚氧伸烷基多元醇,且前述寡聚物(A')係使用聚氧伸烷基多元醇及聚異氰酸酯為原料而合成的胺甲酸酯寡聚物。Preferably, the non-curable oligomer (D) is a polyoxyalkylene polyol, and the oligomer (A') is an amine compound synthesized using a polyoxyalkylene polyol and a polyisocyanate as a raw material. Acid ester oligomer.

較佳為前述寡聚物(A')係具有丙烯酸基,而前述單體(B')之至少一部分係具有甲基丙烯酸基。Preferably, the oligomer (A') has an acrylic group, and at least a part of the monomer (B') has a methacryl group.

較佳為前述單體(B3)係含有甲基丙烯酸羥基酯,而該甲基丙烯酸羥基酯具有羥基數1~2且碳數3~8之羥烷基。Preferably, the monomer (B3) contains a hydroxy methacrylate, and the hydroxy methacrylate has a hydroxyalkyl group having 1 to 2 hydroxyl groups and 3 to 8 carbon atoms.

較佳為前述單體(B')係含有選自於由具有碳數8~22之烷基的甲基丙烯酸烷基酯所構成群組中的單體(B4)。It is preferred that the monomer (B') contains a monomer (B4) selected from the group consisting of alkyl methacrylates having an alkyl group having 8 to 22 carbon atoms.

較佳係未含有鏈轉移劑,或者含有鏈轉移劑,但相對於硬化性化合物(II)100質量份,其含量在1質量份以下。It is preferable that the chain transfer agent is not contained or the chain transfer agent is contained, but the content thereof is 1 part by mass or less based on 100 parts by mass of the curable compound (II).

較佳係光硬化性之硬化性樹脂組成物。A photocurable curable resin composition is preferred.

本發明所提供的層積體,係由一對面材隔著樹脂層進行層積而一體化者,且該樹脂層係由本發明的硬化樹脂性組成物之硬化物所構成者,。The laminate provided by the present invention is formed by laminating a pair of face materials through a resin layer, and the resin layer is composed of a cured product of the cured resin composition of the present invention.

較佳為前述一對面材之至少一者係透明面材。Preferably, at least one of the pair of face materials is a transparent face material.

較佳為前述一對面材之一者係透明面材,而另一者係顯示元件。Preferably, one of the pair of face materials is a transparent face material, and the other is a display element.

較佳為前述顯示元件係液晶顯示元件。Preferably, the display element is a liquid crystal display element.

本發明層積體之製造方法,係用以製造層積體,該欲製造之層積體係具備有:第1面材及第2面材、由該第1面材及第2面材所夾持的樹脂層、以及包圍樹脂層周圍的密封部,該製造方法係包括有下述步驟(a)~(d):The method for producing a laminate of the present invention is for producing a laminate, and the laminate system to be produced includes a first face material and a second face material, and the first face material and the second face material are sandwiched between The resin layer and the sealing portion surrounding the resin layer, the manufacturing method includes the following steps (a) to (d):

(a)在第1面材表面周緣部,塗佈含有硬化性化合物(I)及聚合起始劑的液狀密封部形成用硬化性樹脂組成物,而形成未硬化密封部的步驟;(a) a step of applying a curable resin composition for forming a liquid seal portion containing a curable compound (I) and a polymerization initiator to a peripheral portion of the surface of the first face material to form an uncured seal portion;

(b)對由未硬化密封部所包圍的區域,供應由本發明的硬化性樹脂組成物所構成之樹脂層形成用硬化性樹脂組成物的步驟;(b) a step of supplying a curable resin composition for forming a resin layer composed of the curable resin composition of the present invention to a region surrounded by the uncured seal portion;

(c)在100Pa以下的減壓環境下,於樹脂層形成用硬化性樹脂組成物上重疊第2面材,而獲得樹脂層形成用硬化性樹脂組成物已由第1面材、第2面材及未硬化密封部所密封之層積前驅體的步驟;及(c) The second surface material is superposed on the curable resin composition for forming a resin layer in a reduced pressure environment of 100 Pa or less, and the first surface material and the second surface are obtained from the curable resin composition for forming a resin layer. And a step of laminating the precursor sealed by the unhardened seal; and

(d)在將層積前驅體放置於50kPa以上之壓力環境下的狀態下,使未硬化密封部及樹脂層形成用硬化性樹脂組成物進行硬化之步驟。(d) A step of curing the uncured seal portion and the curable resin composition for forming a resin layer in a state where the laminated precursor is placed under a pressure of 50 kPa or more.

較佳為前述第1面材及第2面材之至少一者係透明面材。Preferably, at least one of the first surface material and the second surface material is a transparent surface material.

較佳為前述第1面材及第2面材之一者係透明面材,另一者係顯示元件。Preferably, one of the first surface material and the second surface material is a transparent surface material, and the other is a display element.

較佳為前述硬化性化合物(I)係光硬化性化合物;前述密封部形成用硬化性樹脂組成物係含有光聚合起始劑(C1);前述樹脂層形成用硬化性樹脂組成物係由屬於光硬化性的硬化性樹脂組成物構成;在前述步驟(d)中,係對前述未硬化密封部及前述樹脂層形成用硬化性樹脂組成物施行光照射。The curable compound (I) is a photocurable compound, the curable resin composition for forming a sealing portion contains a photopolymerization initiator (C1), and the curable resin composition for forming a resin layer is In the step (d), the uncured seal portion and the curable resin composition for forming a resin layer are subjected to light irradiation.

根據本發明的硬化性樹脂組成物,藉由使其挾持於面材之間並使硬化,便可將一對面材充分地固定,並可降低因硬化時的收縮所產生之應力。According to the curable resin composition of the present invention, the pair of face materials can be sufficiently fixed by being held between the face materials and hardened, and the stress caused by shrinkage during hardening can be reduced.

根據本發明的層積體,面材與面材可隔著樹脂層充分地被固定,且可降低因該樹脂層硬化時的收縮所產生之應力。According to the laminate of the present invention, the face material and the face material can be sufficiently fixed via the resin layer, and the stress generated by the shrinkage when the resin layer is cured can be reduced.

根據本發明層積體之製造方法,可將一對面材隔著由本發明硬化性樹脂組成物的硬化物所構成樹脂層充分地予以固定,並可降低因該樹脂層硬化時的收縮所產生之應力,且可在充分抑制樹脂層中氣泡發生的情況下製造層積體。According to the method for producing a laminate of the present invention, the pair of face materials can be sufficiently fixed by the resin layer composed of the cured product of the curable resin composition of the present invention, and the shrinkage due to the curing of the resin layer can be reduced. The stress is generated, and the laminate can be produced while sufficiently suppressing the occurrence of bubbles in the resin layer.

本發明的層積體係例如顯示裝置,根據本發明的製造方法,可充分抑制顯示元件與保護板間之樹脂層中氣泡產生,顯示元件與保護板隔著該樹脂層充分地被固定,且硬化收縮時的應力可降低,便可獲得經防止因該應力所造成顯示品質降低的顯示裝置。According to the manufacturing method of the present invention, the laminated system of the present invention can sufficiently suppress the generation of bubbles in the resin layer between the display element and the protective sheet, and the display element and the protective sheet are sufficiently fixed and hardened via the resin layer. The stress at the time of shrinkage can be lowered, and a display device capable of preventing deterioration of display quality due to the stress can be obtained.

圖式簡單說明Simple illustration

第1圖係利用透明面材保護顯示元件的顯示裝置一例之剖視圖。Fig. 1 is a cross-sectional view showing an example of a display device for protecting a display element by a transparent surface material.

第2圖係第1圖之顯示裝置的平面圖。Fig. 2 is a plan view showing the display device of Fig. 1.

第3圖係步驟(a)的態樣一例平面圖。Fig. 3 is a plan view showing an example of the aspect of the step (a).

第4圖係步驟(a)的態樣一例剖視圖。Fig. 4 is a cross-sectional view showing an example of the aspect of the step (a).

第5圖係步驟(b)的態樣一例平面圖。Fig. 5 is a plan view showing an example of the aspect of the step (b).

第6圖係步驟(b)的態樣一例剖視圖。Fig. 6 is a cross-sectional view showing an example of the aspect of the step (b).

第7圖係步驟(c)的態樣一例剖視圖。Fig. 7 is a cross-sectional view showing an example of the aspect of the step (c).

第8圖係步驟(d)的態樣一例剖視圖。Fig. 8 is a cross-sectional view showing an example of the aspect of the step (d).

用以實施發明之形態Form for implementing the invention

本發明中,定義如下述。In the present invention, the definition is as follows.

顯示裝置中,將成為顯示元件之保護板的透明面材稱「表面材」,將顯示元件稱「背面材」。In the display device, the transparent surface material that serves as the protective sheet of the display element is referred to as "surface material", and the display element is referred to as "back surface material".

將表面材與背面材統稱為「面材」。The surface material and the back material are collectively referred to as "face material".

該面材中,於本發明的製造方法中,將周緣部形成有密封部且由密封部所包圍的區域被供應液狀硬化性樹脂組成物的面材稱「第1面材」,將重疊於該硬化性樹脂組成物上的面材稱「第2面材」。In the surface material, in the manufacturing method of the present invention, the surface portion in which the sealing portion is formed in the peripheral portion and the portion surrounded by the sealing portion is called the "first surface material", and the surface material is overlapped. The surface material on the curable resin composition is referred to as "second surface material".

將具有光穿透性的面材稱「透明面材」。The light transmissive surface material is called "transparent surface material".

將由玻璃構成的透明面材稱「玻璃板」。A transparent surface material made of glass is called a "glass plate."

以下,舉本發明較佳實施形態,就本發明的層積體係顯示裝置,一對面材係表面材(成為保護板的透明面材)與背面材(顯示元件),且密封部形成用硬化性樹脂組成物及樹脂層形成用硬化性樹脂組成物係光硬化性樹脂組成物的實施形態進行說明。In the laminated system display device of the present invention, a pair of face material-based surface materials (a transparent surface material serving as a protective sheet) and a back surface material (display element), and a curing portion for forming a sealing portion, are provided. An embodiment in which the resin composition and the curable resin composition for forming a resin layer are photocurable resin compositions will be described.

<顯示裝置><display device>

第1圖係本實施形態的顯示裝置一例之剖視圖,第2圖係平面圖。Fig. 1 is a cross-sectional view showing an example of a display device of the embodiment, and Fig. 2 is a plan view.

顯示裝置1係具有:透明面材10(第2面材(或第1面材))、顯示元件50(第1面材(或第2面材))、樹脂層40、密封部42、可撓性印刷電路板54(FPC)、及遮光印刷部55(遮光部),該透明面材10係屬於表面材,該顯示元件50係屬於背面材,該樹脂層40係由透明面材10與顯示元件50所包夾,該密封部42係包圍著樹脂層40的周圍,該可撓性印刷電路板54係連接於顯示元件50且搭載有使顯示元件50啟動之驅動IC,該遮光印刷部55係形成於透明面材10的周緣部。The display device 1 includes a transparent surface material 10 (second surface material (or first surface material)), a display element 50 (first surface material (or second surface material)), a resin layer 40, a sealing portion 42, and the like. a flexible printed circuit board 54 (FPC) and a light-shielding printing unit 55 (light-shielding portion) belonging to a surface material, the display element 50 belonging to a back surface material, and the resin layer 40 being composed of a transparent surface material 10 and The display element 50 is surrounded by a sealing portion 42 that surrounds the periphery of the resin layer 40. The flexible printed circuit board 54 is connected to the display element 50 and is mounted with a driving IC that activates the display element 50. 55 is formed on the peripheral portion of the transparent surface material 10.

顯示裝置1中,在透明面材10的周緣部設置遮光印刷部55,且由遮光印刷部55所包圍的透光部56之面積小於由密封部42所包圍的樹脂層40之面積,透明面材10的面積係大於顯示元件50的面積,樹脂層40與密封部42的合計面積小於透明面材10與顯示元件50的各面積。In the display device 1, the light-shielding printing portion 55 is provided on the peripheral portion of the transparent surface material 10, and the area of the light-transmitting portion 56 surrounded by the light-shielding printing portion 55 is smaller than the area of the resin layer 40 surrounded by the sealing portion 42, the transparent surface The area of the material 10 is larger than the area of the display element 50, and the total area of the resin layer 40 and the sealing portion 42 is smaller than the respective areas of the transparent surface material 10 and the display element 50.

[表面材][surface material]

表面材係顯示元件之顯示影像能穿透過的透明面材(保護板)。The surface material is a transparent surface material (protective plate) through which the display image of the display element can pass.

透明面材係可舉例如玻璃板、或透明樹脂板,就對來自顯示元件的出射光與反射光呈高透明性的觀點,當然亦就具有耐光性、低雙折射性、高平面精度、耐表面刮傷性、高機械強度等觀點,最佳為玻璃板。就為使光硬化性樹脂組成物進行硬化的光能充分穿透之觀點,亦是以玻璃板為佳。The transparent surface material is, for example, a glass plate or a transparent resin plate, and has high light transmittance, low birefringence, high planar precision, and resistance from the viewpoint of high transparency of emitted light and reflected light from a display element. From the viewpoints of surface scratch resistance and high mechanical strength, the glass plate is most preferable. In view of the fact that the light energy for hardening the photocurable resin composition is sufficiently penetrated, a glass plate is also preferable.

玻璃板的材料係可舉例如鈉鈣玻璃等玻璃材料,較佳係鐵份更低、偏藍較少的高穿透玻璃(冕玻璃)。為提高安全性,表面材亦可使用強化玻璃。The material of the glass plate may be, for example, a glass material such as soda lime glass, and is preferably a high-through glass (glass-lined glass) having a lower iron content and less blue. For safety, tempered glass can also be used for the surface material.

透明樹脂板的材料係可舉例如透明性高的樹脂材料(諸如聚碳酸酯、聚甲基丙烯酸甲酯等)。The material of the transparent resin sheet is, for example, a resin material having high transparency (such as polycarbonate, polymethyl methacrylate, etc.).

在透明面材中,為提升與樹脂層間之界面接著力,亦可施行表面處理。表面處理的方法係有如:對透明面材之表面利用矽烷偶合劑施行處理的方法、或者利用由火焰燃燒器所產生的氧化火燄形成氧化矽薄膜的處理等。在透明面材上,為提高顯示影像的對比,亦可在與樹脂層間的接合面之背面設置抗反射層。抗反射層係可利用諸如在透明面材的表面上直接形成無機薄膜的方法、或將設有抗反射層的透明樹脂薄膜貼合於透明面材上的方法而進行設置。In the transparent surface material, a surface treatment may be performed to enhance the interface adhesion force with the resin layer. The surface treatment method is, for example, a method of treating a surface of a transparent surface material with a decane coupling agent, or a treatment for forming a ruthenium oxide film by an oxidizing flame generated by a flame burner. In order to improve the contrast of the display image on the transparent surface material, an antireflection layer may be provided on the back surface of the joint surface with the resin layer. The antireflection layer can be provided by, for example, a method of directly forming an inorganic thin film on the surface of a transparent face material, or a method of bonding a transparent resin film provided with an antireflection layer to a transparent face material.

再者,配合影像顯示之目的,透明面材之一部分或全體亦可預先施行著色、或呈毛玻璃狀而使光散射、或利用表面的細微凹凸等而使穿透時的光折射或反射。又,亦可將如上述樣態的光學膜、偏光膜等進行光學調變的光學膜等經貼合於透明面材上形成一體物,使用為透明面材。Further, for the purpose of image display, a part or the whole of the transparent surface material may be colored in advance or in a frosted glass shape to scatter light by scattering light or by fine unevenness or the like on the surface. In addition, an optical film or the like which is optically modulated by an optical film or a polarizing film as described above may be bonded to a transparent surface material to form an integrated body, and used as a transparent surface material.

透明面材的厚度,就機械強度、透明性的觀點,當屬玻璃板時通常為0.5~25mm。在室內使用的電視接收器、PC用顯示器等用途上,就顯示裝置的輕量化觀點,較佳為0.7~6mm,而設置於室外的大眾顯示用途時,較佳為3~20mm。透明面材係可使用強化玻璃,當透明面材較薄時便可使用化學強化玻璃。透明樹脂板的情況較佳係2~10mm。The thickness of the transparent face material is usually 0.5 to 25 mm in terms of mechanical strength and transparency. The use of a television receiver for indoor use, a display for a PC, etc., is preferably 0.7 to 6 mm in terms of weight reduction of the display device, and is preferably 3 to 20 mm when used for outdoor display applications. For the transparent surface material, tempered glass can be used, and when the transparent surface material is thin, chemically strengthened glass can be used. The case of the transparent resin sheet is preferably 2 to 10 mm.

[背面材][back material]

背面材係顯示元件。The backing material is a display element.

圖示例的顯示元件50係將設有彩色濾光片的透明面材52、與設有TFT的透明面材53進行貼合,再將其利用一對偏光板51夾持而構成的液晶顯示元件一例,但本實施形態的顯示元件並不侷限於圖示例。The display element 50 of the illustrated example is a liquid crystal display in which a transparent surface material 52 provided with a color filter and a transparent surface material 53 provided with a TFT are bonded together and sandwiched by a pair of polarizing plates 51. Although an element is an example, the display element of this embodiment is not limited to the illustration.

顯示元件係在至少其中一者為透明電極的一對電極中,挾持利用外部之電氣信號而變化光學樣態的顯示材。依照顯示材的種類,有諸如:液晶顯示元件、EL顯示元件、電漿顯示元件、電子墨水型顯示元件等。又,顯示元件係具有貼合一對面材且該一對面材至少一者為透明面材的構造,並配置成透明面材側鄰接於樹脂層。此時,部分的顯示元件係在與樹脂層相鄰側的透明面材最外層側,設置諸如偏光板、相位差板等光學膜。此情況,樹脂層係呈顯示元件上的光學膜與表面材相接合的樣態。The display element holds a display material that changes an optical state by an external electrical signal in a pair of electrodes in which at least one of them is a transparent electrode. Depending on the type of the display material, there are, for example, a liquid crystal display element, an EL display element, a plasma display element, an electronic ink type display element, and the like. Further, the display element has a structure in which a pair of face materials are bonded and at least one of the pair of face materials is a transparent face material, and the transparent face material side is disposed adjacent to the resin layer. At this time, a part of the display elements are on the outermost surface side of the transparent face material on the side adjacent to the resin layer, and an optical film such as a polarizing plate or a phase difference plate is provided. In this case, the resin layer is in a state in which the optical film on the display element is bonded to the surface material.

對顯示元件與樹脂層的接合面,為提升與密封部間之界面接著力,亦可施行表面處理。表面處理係可僅對周緣部施行,亦可對面材的整體表面實施。表面處理的方法有如利用可低溫加工的接著用底漆等施行處理之方法等。The surface of the joint between the display element and the resin layer may be subjected to surface treatment in order to enhance the adhesion between the sealing member and the sealing portion. The surface treatment can be applied only to the peripheral portion or to the entire surface of the face material. The surface treatment method is, for example, a method which can be processed by a low-temperature processing followed by a primer or the like.

顯示元件的厚度係當屬於利用TFT啟動的液晶顯示元件時,通常為0.4~4mm,當屬於EL顯示元件時通常為0.2~3mm。The thickness of the display element is usually 0.4 to 4 mm when it belongs to a liquid crystal display element activated by a TFT, and is usually 0.2 to 3 mm when it belongs to an EL display element.

[樹脂層][resin layer]

樹脂層係由本發明的硬化性樹脂組成物(以下亦稱「樹脂層形成用光硬化性樹脂組成物」)進行硬化而構成的層。The resin layer is a layer formed by curing the curable resin composition of the present invention (hereinafter also referred to as "photocurable resin composition for resin layer formation").

本發明的硬化性樹脂組成物(本實施形態的樹脂層形成用光硬化性樹脂組成物),係可降低硬化後的彈性模數,並可降低進行硬化時所產生的應力。所以,可抑制因該應力對顯示元件的顯示性能造成不良影響。又,該硬化性樹脂組成物在未硬化時的黏度低,所以能在短時間施行對面材表面的硬化性樹脂組成物供應,因而容易防止在表面材與背面材層積後出現氣泡殘留情形。The curable resin composition of the present invention (the photocurable resin composition for forming a resin layer of the present embodiment) can reduce the elastic modulus after curing and can reduce the stress generated during curing. Therefore, it is possible to suppress the adverse effect on the display performance of the display element due to the stress. Moreover, since the curable resin composition has a low viscosity when it is not cured, the supply of the curable resin composition on the surface of the face material can be performed in a short time, and thus it is easy to prevent the occurrence of air bubbles remaining after the surface material and the back surface material are laminated.

樹脂層的厚度較佳係0.03~2mm、更佳係0.1~0.8mm、特佳係0.2~0.6mm。若樹脂層的厚度達0.03mm以上,樹脂層便可有效的緩衝因來自透明面材側的外力所造成衝擊等,俾可保護顯示元件元件。特別係當顯示元件對外力屬於敏銳,較容易影響顯示品質的情況,較佳係設成達0.2mm以上的厚度。又,本實施形態的製造方法中,即便在透明面材與顯示元件之間混入超越樹脂層厚度的異物,樹脂層的厚度仍不會有太大的變化,對光穿透性能的影響較少。若樹脂層的厚度在2mm以下,在樹脂層中不易殘留氣泡,且顯示裝置的整體厚度不會成為多餘的厚。當樹脂層的彈性模數小之情況,為抑制顯示元件經時性接合位置偏移等情形,較佳係設為0.6mm以下的厚度。The thickness of the resin layer is preferably 0.03 to 2 mm, more preferably 0.1 to 0.8 mm, and particularly preferably 0.2 to 0.6 mm. When the thickness of the resin layer is 0.03 mm or more, the resin layer can effectively buffer the impact due to an external force from the side of the transparent surface material, and the display element can be protected. In particular, when the display element is sensitive to external force and is more likely to affect the display quality, it is preferably set to a thickness of 0.2 mm or more. Further, in the production method of the present embodiment, even if a foreign material exceeding the thickness of the resin layer is mixed between the transparent surface material and the display element, the thickness of the resin layer does not change much, and the light penetration property is less affected. . When the thickness of the resin layer is 2 mm or less, bubbles are less likely to remain in the resin layer, and the overall thickness of the display device does not become excessively thick. When the elastic modulus of the resin layer is small, it is preferably set to a thickness of 0.6 mm or less in order to suppress the displacement of the display element over time.

調整樹脂層厚度的方法,係有如調節後述密封部的厚度,且同時調節對第1面材所供應之液狀樹脂層形成用光硬化性樹脂組成物的供應量之方法。The method of adjusting the thickness of the resin layer is a method of adjusting the supply amount of the photocurable resin composition for forming a liquid resin layer supplied to the first face material by adjusting the thickness of the sealing portion to be described later.

[密封部][seal department]

密封部係塗佈後述液狀密封部形成用光硬化性樹脂組成物,經硬化而構成者。因為顯示元件的影像顯示區域之外側區域比較狹窄,因而密封部的寬度以狹窄為宜。密封部的寬度較佳係0.5~2mm、更佳係0.8~1.6mm。The sealing portion is formed by applying a photocurable resin composition for forming a liquid sealing portion, which is described later, and is cured. Since the outer side region of the image display area of the display element is relatively narrow, the width of the sealing portion is preferably narrow. The width of the sealing portion is preferably 0.5 to 2 mm, more preferably 0.8 to 1.6 mm.

[遮光印刷部][Light-shielding printing department]

視需要,可在透明面材的周緣部設置遮光印刷部。遮光印刷部係依顯示元件的影像顯示區域之外均無法從透明面材側看到的方式,隱藏連接於顯示元件的配線構件等。遮光印刷部係可設置於透明面材與樹脂層的接合面、或其背面,就降低遮光印刷部與影像顯示區域的視差之觀點,以設置於透明面材與樹脂層的接合面為佳。當透明面材係玻璃板的情況,若遮光印刷部係使用含黑色顏料的陶瓷印刷,則遮光性高而屬較佳。藉由將表面或背面已設有遮光印刷部的透明薄膜貼合於透明面材上,亦可形成遮光印刷部。亦可使用沒有遮光印刷部的透明面材。A light-shielding printing portion may be provided at a peripheral portion of the transparent surface material as needed. The light-shielding printing unit hides the wiring member or the like connected to the display element so that it cannot be seen from the transparent surface material side except for the image display area of the display element. The light-shielding printing portion can be provided on the joint surface of the transparent surface material and the resin layer or the back surface thereof, and is preferably provided on the joint surface of the transparent surface material and the resin layer from the viewpoint of reducing the parallax between the light-shielding printing portion and the image display region. When the transparent surface material is a glass plate, if the light-shielding printing portion is printed using a ceramic containing a black pigment, the light-shielding property is high, which is preferable. The light-shielding printing portion can also be formed by bonding a transparent film having a light-shielding portion on the front or back surface to the transparent surface material. A transparent face material without a light-shielding printing portion can also be used.

[形狀][shape]

顯示裝置的形狀通常係矩形。The shape of the display device is usually rectangular.

顯示裝置的大小並無特別的限定,因為本實施形態的製造方法特別適用於較大面積之顯示裝置的製造,因而當屬於採用液晶顯示元件之情況,以PC螢幕的情況而言較佳為0.3m×0.18m,以電視接收器的情況而言較佳為0.4m×0.3m以上、更佳為0.7m×0.4m以上。顯示裝置的大小上限大多係依照顯示元件的大小而決定。又,過大的顯示裝置在設置等處理上容易趨於困難。顯示裝置的大小上限係從該等限制觀之,通常為2.5m×1.5m程度。小型顯示器的情況,較佳為0.14m×0.08m以上。The size of the display device is not particularly limited because the manufacturing method of the present embodiment is particularly suitable for the manufacture of a display device having a large area. Therefore, in the case of using a liquid crystal display element, it is preferably 0.3 in the case of a PC screen. m × 0.18 m is preferably 0.4 m × 0.3 m or more, and more preferably 0.7 m × 0.4 m or more in the case of a television receiver. The upper limit of the size of the display device is mostly determined according to the size of the display element. Further, an excessively large display device tends to be difficult in processing such as setting. The upper limit of the size of the display device is from the limit, and is usually about 2.5 m x 1.5 m. In the case of a small display, it is preferably 0.14 m × 0.08 m or more.

成為保護板的透明面材、與顯示元件的尺寸係可為大致相等,但就與收納顯示裝置的其他框體間之關係,多數情況係透明面材較顯示元件大一圈。又,相反的依照其他框體的構造,亦可使透明面材若干小於顯示元件。The transparent surface material to be the protective sheet and the size of the display element may be substantially equal, but in many cases, the transparent surface material is larger than the display element in a relationship with the other housing of the display device. Further, contrary to the configuration of the other housing, the transparent surface material may be made smaller than the display element.

<顯示裝置之製造方法><Method of Manufacturing Display Device>

本實施形態的顯示裝置之製造方法,係包括有下述步驟(a)~(d)的方法。The method of manufacturing the display device of the present embodiment includes the following steps (a) to (d).

(a)在第1面材(背面材(或表面材))的表面周緣部,塗佈含有硬化性化合物(I)及光聚合起始劑(C1)的液狀密封部形成用光硬化性樹脂組成物,而形成未硬化密封部的步驟(但,當第1面材係顯示元件的情況,便在影像顯示側的表面上形成密封部)。(a) The photocuring property for forming a liquid sealing portion containing a curable compound (I) and a photopolymerization initiator (C1) on the surface peripheral portion of the first surface material (back surface material (or surface material)) The resin composition is a step of forming an uncured seal portion (however, when the first face material is a display element, a seal portion is formed on the surface on the image display side).

(b)對未硬化密封部所包圍的區域,供應含有硬化性化合物(II)與光聚合起始劑(C2)的液狀樹脂層形成用光硬化性樹脂組成物之步驟。(b) A step of supplying a photocurable resin composition for forming a liquid resin layer containing a curable compound (II) and a photopolymerization initiator (C2) to a region surrounded by the unhardened seal portion.

(c)在100Pa以下的減壓環境下,於樹脂層形成用光硬化性樹脂組成物上重疊第2面材(表面材(或背面材)),而獲得樹脂層形成用光硬化性樹脂組成物已由第1面材、第2面材及未硬化密封部加以密封之層積前驅體的步驟(但,當在第2面材的表面設有抗反射膜時,便依其背面側的表面鄰接樹脂層形成用光硬化性樹脂組成物的方式重疊。又,當第2面材係顯示元件的情況,便依影像顯示側鄰接於樹脂層形成用光硬化性樹脂組成物的方式重疊)。(c) The second surface material (surface material (or back material)) is superposed on the resin layer-forming photocurable resin composition under a reduced pressure of 100 Pa or less to obtain a photocurable resin for resin layer formation. a step of laminating a precursor having a first surface material, a second surface material, and an unhardened sealing portion (however, when an antireflection film is provided on the surface of the second surface material, the back side is When the surface-adjacent resin layer is formed by the photocurable resin composition, the surface-side resin layer is superposed on the image-display side. .

(d)將層積前驅體放置於50kPa以上之壓力環境下並於此狀態下,對未硬化密封部及樹脂層形成用光硬化性樹脂組成物施行光照射,而使硬化的步驟。(d) A step in which the uncured sealing portion and the resin layer-forming photocurable resin composition are subjected to light irradiation to be cured in a pressure environment of 50 kPa or more.

當透明面材上沒有形成遮光部的情況,便從層積前驅體之透明面材側,透過透光部對密封部及樹脂層形成用光硬化性樹脂組成物照射光。When the light-shielding portion is not formed on the transparent surface material, the sealing portion and the resin layer-forming photocurable resin composition are irradiated with light from the transparent surface material side of the laminated precursor through the light transmitting portion.

當在透明面材的周緣部有形成遮光部的情況,由該遮光部所包圍的透光部面積,係小於由密封部所包圍的樹脂層面積,且上述樹脂層形成用光硬化性樹脂組成物中所含光聚合起始劑(C2)所具有的吸收波長區域(λ2),較上述密封部形成用光硬化性樹脂組成物中所含光聚合起始劑(C1)的吸收波長區域(λ1)更靠長波長側存在,而使在上述步驟(d)中從層積前驅體的側邊所照射的光,涵蓋吸收波長區域(λ1)內的波長光及吸收波長區域(λ2)內的波長光。When the light shielding portion is formed on the peripheral portion of the transparent surface material, the area of the light transmission portion surrounded by the light shielding portion is smaller than the area of the resin layer surrounded by the sealing portion, and the resin layer is formed of a photocurable resin. The absorption wavelength region (λ2) of the photopolymerization initiator (C2) contained in the product is larger than the absorption wavelength region of the photopolymerization initiator (C1) contained in the photocurable resin composition for sealing portion formation ( Λ1) exists on the longer wavelength side, and the light irradiated from the side of the laminated precursor in the above step (d) covers the wavelength light and the absorption wavelength region (λ2) in the absorption wavelength region (λ1). Wavelength of light.

本實施形態的製造方法係在減壓環境下,於第1面材與第2面材之間封入液狀樹脂層形成用光硬化性樹脂組成物,在大氣壓環境下等高壓力環境下,使所封入的樹脂層形成用光硬化性樹脂組成物硬化而形成樹脂層的方法(減壓層積方法)。在減壓下進行樹脂層形成用光硬化性樹脂組成物的封入,並非在第1面材與第2面材的間隙之窄而寬空間中注入樹脂層形成用光硬化性樹脂的方法,而是對第1面材的幾乎整面供應樹脂層形成用光硬化性樹脂組成物,然後重疊上第2面材,而在第1面材與第2面材之間封入樹脂層形成用光硬化性樹脂組成物的方法。In the production method of the present embodiment, the photocurable resin composition for forming a liquid resin layer is sealed between the first surface material and the second surface material in a reduced pressure environment, and is subjected to a high pressure environment under an atmospheric pressure environment. The resin layer to be sealed is formed by a method in which a photocurable resin composition is cured to form a resin layer (decompression lamination method). The method of encapsulating the photocurable resin composition for forming a resin layer under reduced pressure is not a method of injecting a photocurable resin for forming a resin layer in a narrow space between the first surface material and the second surface material. The photocurable resin composition for forming a resin layer is supplied to the entire surface of the first surface material, and then the second surface material is superposed on the surface of the first surface material and the second surface material. A method of resin composition.

在減壓下進行液狀樹脂層形成用光硬化性樹脂組成物的封入、以及在大氣壓下利用樹脂層形成用光硬化性樹脂組成物的硬化而進行透明層積體的製造方法一例,係屬公知。例如國際公開第2008/81838號小冊子、國際公開第2009/16943號小冊子所記載的透明層積體之製造方法、以及該製造方法所使用的光硬化性樹脂組成物,均納入於本說明書中。An example of a method for producing a transparent laminate by encapsulating a photocurable resin composition for forming a liquid resin layer under reduced pressure and curing the photocurable resin composition for forming a resin layer under atmospheric pressure known. For example, the method for producing a transparent laminate described in the pamphlet of International Publication No. WO 2008/81838, the pamphlet of International Publication No. 2009/16943, and the photocurable resin composition used in the production method are incorporated in the present specification.

[步驟(a)][Step (a)]

首先,沿第1面材一表面的周邊部形成未硬化密封部。第1面材係可任意使用背面材、或使用表面材。First, an uncured seal portion is formed along the peripheral portion of the surface of the first face material. The first surface material can be used arbitrarily as a back material or a surface material.

第1面材係當屬於成為顯示元件之保護板的透明面材時,形成未硬化密封部之面係可任意為2個表面中之任一面。當2個表面的性狀不同等情況時便選擇需要的一表面。例如當其中一表面有施行為提升與樹脂層間之界面接著力的表面處理時,便在該表面上形成未硬化密封部。又,當在其中一表面上設有抗反射層的情況,便在其背面形成未硬化密封部。When the first surface material is a transparent surface material which is a protective sheet for a display element, the surface on which the uncured seal portion is formed may be arbitrarily one of two surfaces. When the characteristics of the two surfaces are different, the desired surface is selected. For example, when one of the surfaces has a surface treatment for imparting an adhesion between the resin layer and the resin layer, an uncured seal portion is formed on the surface. Further, when an antireflection layer is provided on one of the surfaces, an uncured seal portion is formed on the back surface thereof.

當第1面材係顯示元件的情況,形成未硬化密封部之一面便為影像顯示側的表面。When the first surface material is a display element, the surface of the uncured seal portion is formed as the surface on the image display side.

未硬化密封部重點在於:在後述步驟(c)中,具有液狀樹脂層形成用光硬化性樹脂組成物不會從未硬化密封部與第1面材間之界面、以及從未硬化密封部與第2面材間之界面處洩漏出程度以上的界面接著力,以及具有能維持形狀之程度的堅固度。所以,未硬化密封部最好係將黏度高的密封部形成用光硬化性樹脂組成物,利用諸如印刷、分配(dispense)等施行塗佈而形成。The uncured seal portion is characterized in that, in the step (c) described later, the photocurable resin composition for forming a liquid resin layer does not have an interface between the unhardened seal portion and the first face material, and the unhardened seal portion. The interface between the second surface material and the second surface material leaks more than the interface adhesion force and has a firmness to maintain the shape. Therefore, it is preferable that the unhardened sealing portion is formed of a photocurable resin composition for forming a sealing portion having a high viscosity, and applied by, for example, printing, dispensing, or the like.

再者,為保持第1面材與第2面材間之間隔,亦可在密封部形成用光硬化性樹脂組成物中摻混既定粒徑的間隔件粒子。In addition, in order to maintain the space between the first surface material and the second surface material, spacer particles having a predetermined particle diameter may be blended in the photocurable resin composition for sealing portion formation.

在密封部形成用光硬化性樹脂組成物剛塗佈後,亦可立即藉由照射用以使密封部硬化的光而使密封部呈局部性半硬化,使密封部的形狀更長時間維持。Immediately after the application of the photocurable resin composition for forming the sealing portion, the sealing portion is partially semi-cured by irradiating light for curing the sealing portion, and the shape of the sealing portion is maintained for a longer period of time.

[密封部形成用光硬化性樹脂組成物][Photocurable resin composition for sealing portion formation]

密封部形成用光硬化性樹脂組成物(以下亦稱「密封材」),係含有光硬化性硬化性化合物(I)與光聚合起始劑(Cl)的液狀組成物。The photocurable resin composition for sealing portion formation (hereinafter also referred to as "sealing material") is a liquid composition containing a photocurable curable compound (I) and a photopolymerization initiator (Cl).

密封部形成用光硬化性樹脂組成物的黏度,較佳係500~3000Pa‧s、更佳係800~2500Pa‧s、特佳係1000~2000 Pa‧s。若黏度達500Pa‧s以上,便可長時間維持未硬化密封部的形狀,可充分維持密封部的高度。若黏度在3000Pa‧s以下,便可利用塗佈法形成密封部。The viscosity of the photocurable resin composition for forming the sealing portion is preferably 500 to 3,000 Pa s, more preferably 800 to 2,500 Pa s, and particularly preferably 1,000 to 2,000 Pa s. When the viscosity is 500 Pa ‧ or more, the shape of the unhardened seal portion can be maintained for a long period of time, and the height of the seal portion can be sufficiently maintained. If the viscosity is 3,000 Pa ‧ or less, the sealing portion can be formed by a coating method.

密封部形成用光硬化性樹脂組成物的黏度,係在25℃下,使用E型黏度計進行測定。The viscosity of the photocurable resin composition for forming a seal portion was measured at 25 ° C using an E-type viscometer.

(硬化性化合物(I))(hardening compound (I))

硬化性化合物(I)係就容易將密封部形成用光硬化性樹脂組成物的黏度調整於前述範圍內的觀點,較佳係含有寡聚物(A)之1種以上、與單體(B)之1種以上,該寡聚物(A)係具有硬化性基且數量平均分子量為30000~100000;該單體(B)係具有硬化性基且分子量為125~600。The curable compound (I) is preferably one or more types of oligomers (A) and monomers (B), in which the viscosity of the photocurable resin composition for sealing a portion is easily adjusted within the above range. In one or more types, the oligomer (A) has a curable group and has a number average molecular weight of 30,000 to 100,000; and the monomer (B) has a curable group and has a molecular weight of from 125 to 600.

寡聚物(A)或單體(B)之硬化性基係可舉例如:加成聚合性的不飽和基(諸如丙烯醯氧基、甲基丙烯醯氧基等)、不飽和基與硫醇基的組合等,就能獲得硬化速度快速與透明性高之密封部的觀點,較佳係選自於由丙烯醯氧基及甲基丙烯醯氧基所構成群組的基。The curable group of the oligomer (A) or the monomer (B) may, for example, be an addition polymerizable unsaturated group (such as a acryloxy group, a methacryloxy group, etc.), an unsaturated group and sulfur. From the viewpoint of a combination of an alcohol group and the like, a sealing portion having a high curing rate and high transparency can be obtained, and is preferably selected from the group consisting of an acryloxy group and a methacryloxy group.

寡聚物(A)中之硬化性基、與單體(B)中之硬化性基係可互為相同、亦可為不同。因為分子量較高的寡聚物(A)中之硬化性基,反應性容易變得低於分子量較低的單體(B)中之硬化性基,因而會有單體(B)的硬化先行進行導致組成物整體的黏性急遽提高,造成硬化反應呈不均質的可能性。為能縮小二者硬化性基的反應性差,俾可獲得均質的密封部,最好將寡聚物(A)中之硬化性基設為反應性較高的丙烯醯氧基,並將單體(B)中之硬化性基設為反應性較低的甲基丙烯醯氧基。The curable group in the oligomer (A) and the curable group in the monomer (B) may be the same or different from each other. Because of the hardening group in the oligomer (A) having a relatively high molecular weight, the reactivity easily becomes lower than the hardening group in the monomer (B) having a lower molecular weight, and thus the hardening of the monomer (B) is advanced. The viscous enthalpy of the composition as a whole is increased, and the hardening reaction is likely to be inhomogeneous. In order to reduce the reactivity of the hardening group, the uniformity of the sealing portion can be obtained, and it is preferable to set the hardening group in the oligomer (A) to a highly reactive propylene oxy group, and to form a monomer. The curable group in (B) is a methacryloxy group having a low reactivity.

寡聚物(A)的數量平均分子量係30000~100000、較佳係40000~80000、更佳係50000~65000。若寡聚物(A)的數量平均分子量在該範圍內,便較容易將密封部形成用光硬化性樹脂組成物的黏度調整於前述範圍內。The number average molecular weight of the oligomer (A) is from 30,000 to 100,000, preferably from 40,000 to 80,000, more preferably from 50,000 to 65,000. When the number average molecular weight of the oligomer (A) is within this range, it is easier to adjust the viscosity of the photocurable resin composition for sealing portion formation within the above range.

寡聚物(A)的數量平均分子量係利用GPC測定而獲得,屬於聚苯乙烯換算的數量平均分子量。另外,GPC測定中,當有出現未反應之低分子量成分(單體等)的尖峰時,便排除該尖峰求取數量平均分子量。The number average molecular weight of the oligomer (A) is obtained by GPC measurement and is a polystyrene-equivalent number average molecular weight. Further, in the GPC measurement, when there is a spike of an unreacted low molecular weight component (monomer or the like), the peak is excluded to obtain a number average molecular weight.

單體(B)的分子量係125~600、較佳係140~400、更佳係150~350。若單體(B)的分子量達125以上,當利用後述減壓層積方法進行顯示裝置製造時,便可抑制單體(B)的揮發。若單體(B)的分子量在600以下,便可提高單體(B)對高分子量寡聚物(A)的溶解性,俾可適當地進行密封部形成用光硬化性樹脂組成物的黏度調整。The molecular weight of the monomer (B) is from 125 to 600, preferably from 140 to 400, more preferably from 150 to 350. When the molecular weight of the monomer (B) is at least 125, the volatilization of the monomer (B) can be suppressed when the display device is produced by the pressure reduction lamination method described later. When the molecular weight of the monomer (B) is 600 or less, the solubility of the monomer (B) to the high molecular weight oligomer (A) can be improved, and the viscosity of the photocurable resin composition for forming a sealing portion can be appropriately performed. Adjustment.

(寡聚物(A))(oligomer (A))

寡聚物(A)係就密封部形成用光硬化性樹脂組成物的硬化性、密封部的機械特性等觀點,較佳為每1分子平均具有1.8~4個硬化性基者。The oligomer (A) is preferably one having an average of 1.8 to 4 curable groups per molecule, from the viewpoints of the curability of the photocurable resin composition for forming a sealing portion, the mechanical properties of the sealing portion, and the like.

寡聚物(A)係可舉:具有胺甲酸酯鍵結的胺甲酸酯寡聚物、聚氧伸烷基多元醇的聚(甲基)丙烯酸酯、聚酯多元醇的聚(甲基)丙烯酸酯等。The oligomer (A) may be a urethane-bonded urethane oligomer, a polyoxyalkylene polyol poly(meth) acrylate, or a polyester polyol. Base) acrylate and the like.

依照胺甲酸酯鏈的分子設計等,就可廣範圍調整諸如硬化後樹脂的機械特性、以及與面材間之密接性等觀點,較佳係將多元醇與聚異氰酸酯使用為原料而合成的胺甲酸酯寡聚物,更佳係後述胺甲酸酯寡聚物(A1)。多元醇較佳係聚氧伸烷基多元醇。According to the molecular design of the urethane chain, etc., it is possible to widely adjust the mechanical properties of the resin after curing, and the adhesion to the surface material, and it is preferred to use a polyol and a polyisocyanate as raw materials. The urethane oligomer is more preferably a urethane oligomer (A1) described later. The polyol is preferably a polyoxyalkylene polyol.

(胺甲酸酯寡聚物(A1))(Amino acid ester oligomer (A1))

數量平均分子量在30000~100000範圍內的胺甲酸酯寡聚物(A1),因為會成為高黏度,因而較難依照普通方法進行合成,即便可合成,但仍較難進行與單體(B)的混合。The urethane acrylate oligomer (A1) having a number average molecular weight in the range of 30,000 to 100,000 is difficult to be synthesized according to an ordinary method because it is highly viscous, and even if it is synthetic, it is difficult to carry out the monomer (B). )the mix of.

因而,較佳係依照使用單體(B)(下述單體(B1)與(B2))的合成方法合成胺甲酸酯寡聚物(A1)後,直接將所獲得生成物使用為密封部形成用光硬化性樹脂組成物,或者將所獲得生成物更進一步利用單體(B)(下述單體(B1)、單體(B3)等)進行稀釋而使用為密封部形成用光硬化性樹脂組成物。Therefore, it is preferred to directly use the obtained product as a seal after synthesizing the urethane oligomer (A1) according to the synthesis method using the monomer (B) (the following monomers (B1) and (B2)). The photocurable resin composition is formed, or the obtained product is further diluted with the monomer (B) (the following monomer (B1), monomer (B3), etc.) to be used as a sealing portion forming light. A curable resin composition.

‧單體(B1):單體(B)中,具有硬化性基且未具有會與異氰酸酯基產生反應之基的單體。‧ Monomer (B1): A monomer having a curable group and a group which does not react with an isocyanate group in the monomer (B).

‧單體(B2):單體(B)中,具有硬化性基且具有會與異氰酸酯基產生反應之基的單體。‧ Monomer (B2): A monomer having a curable group and having a group reactive with an isocyanate group in the monomer (B).

‧單體(B3):單體(B)中,具有硬化性基且具有羥基的單體。‧ Monomer (B3): A monomer having a curable group and having a hydroxyl group in the monomer (B).

胺甲酸酯寡聚物(A1)之合成方法:Synthesis method of urethane oligomer (A1):

在當作稀釋劑用的單體(B1)存在下,使多元醇與聚異氰酸酯進行反應,而獲得具有異氰酸酯基的預聚物後,使單體(B2)對該預聚物的異氰酸酯基進行反應之方法。In the presence of the monomer (B1) as a diluent, the polyol is reacted with the polyisocyanate to obtain a prepolymer having an isocyanate group, and then the monomer (B2) is subjected to the isocyanate group of the prepolymer. The method of reaction.

多元醇、聚異氰酸酯係屬於公知化合物,例如國際公開第2009/016943號小冊子所記載當作胺甲酸酯系寡聚物(a)之原料的多元醇(i)、二異氰酸酯(ii)等,均納入於本說明書中。The polyol and the polyisocyanate are known compounds, and the polyol (i), the diisocyanate (ii), etc. which are the raw materials of the urethane-based oligomer (a) described in the pamphlet of International Publication No. 2009/016943, Both are included in this specification.

多元醇(i)係可舉:聚氧乙二醇、聚氧伸丙基二醇等聚氧伸烷基多元醇;聚酯多元醇、聚碳酸酯多元醇等。該等之中,較佳係聚氧伸烷基多元醇、更佳係聚氧伸丙基多元醇。又,若將聚氧伸丙基多元醇的氧伸丙基其中一部分利用氧伸乙基進行取代,便可提高樹脂層形成用光硬化性樹脂組成物與其他成分的相溶性,因而屬更佳。Examples of the polyhydric alcohol (i) include polyoxyalkylene polyols such as polyoxyethylene glycol and polyoxypropylene propylene glycol; polyester polyols and polycarbonate polyols. Among these, a polyoxyalkylene polyol, more preferably a polyoxypropylene propylene polyol, is preferred. Further, when the oxygen-extended propyl group of the polyoxy-extension propyl polyol is substituted with an oxygen-extended ethyl group, the compatibility of the photocurable resin composition for forming a resin layer with other components can be improved, which is preferable. .

此處,所謂「亦可將氧伸丙基其中一部分利用氧伸乙基進行取代」,係指將構成聚氧伸丙基多元醇分子的氧伸丙基結構其中一部分,取代為氧伸乙基結構的分子結構。相關後述同樣的記載亦係指相同的涵義。氧伸乙基結構係可依無規或嵌段存在於聚氧伸丙基多元醇分子中。又,氧伸乙基結構係可在聚氧伸丙基多元醇分子的內部,亦可剛好位在末端羥基之前。當氧伸乙基結構剛好位於末端羥基之前的情況,藉由在聚氧伸丙基多元醇中加成環氧乙烷便可獲得。Here, "may also replace a part of the oxygen-extended propyl group with an oxygen-extended ethyl group", which means that a part of the oxygen-extended propyl structure constituting the polyoxy-extension propyl polyol molecule is substituted with an oxygen-extended ethyl group. The molecular structure of the structure. The same descriptions as used hereinafter refer to the same meanings. The oxygen-extended ethyl structure can be present in the polyoxy-extension propylene polyol molecule in a random or block form. Further, the oxygen-extended ethyl structure may be internal to the polyoxy-extension propylene polyol molecule or just before the terminal hydroxyl group. When the oxygen-extended ethyl structure is located just before the terminal hydroxyl group, it can be obtained by adding ethylene oxide to the polyoxy-extension propyl polyol.

二異氰酸酯(ii)較佳係選自於脂肪族二異氰酸酯、脂環式二異氰酸酯及無變黃性芳香族二異氰酸酯的二異氰酸酯。其中,脂肪族聚異氰酸酯之例係可舉例如:六亞甲基二異氰酸酯、2,2,4-三甲基-六亞甲基二異氰酸酯、2,4,4-三甲基-六亞甲基二異氰酸酯等。脂環式聚異氰酸酯之例係可舉例如:異佛爾酮二異氰酸酯、亞甲基雙(4-環己基異氰酸酯)等。無變黃性芳香族二異氰酸酯係可例如伸茬基二異氰酸酯等。該等係可單獨使用1種、亦可併用2種以上。The diisocyanate (ii) is preferably selected from the group consisting of aliphatic diisocyanates, alicyclic diisocyanates, and diisocyanates having no yellowing aromatic diisocyanate. Among them, examples of the aliphatic polyisocyanate include hexamethylene diisocyanate, 2,2,4-trimethyl-hexamethylene diisocyanate, and 2,4,4-trimethyl-hexamethylene. Diisocyanate and the like. Examples of the alicyclic polyisocyanate include isophorone diisocyanate and methylene bis(4-cyclohexyl isocyanate). The non-yellowing aromatic diisocyanate may be, for example, a perylene diisocyanate. These may be used alone or in combination of two or more.

單體(B1)係可舉例如:具有碳數8~22之烷基的(甲基)丙烯酸烷基酯[諸如:(甲基)丙烯酸正十二烷基酯、(甲基)丙烯酸正十八烷基酯、(甲基)丙烯酸正廿二烷基酯等]、具有脂環式烴基的(甲基)丙烯酸酯[諸如:(甲基)丙烯酸異酯、(甲基)丙烯酸金剛烷基酯等]。The monomer (B1) may, for example, be an alkyl (meth)acrylate having an alkyl group having 8 to 22 carbon atoms [such as: n-dodecyl (meth)acrylate, or n-methyl (meth)acrylate) Octaalkyl ester, n-decyl (meth) acrylate, etc., (meth) acrylate having an alicyclic hydrocarbon group [such as: (meth) acrylate Ester, adamantyl (meth)acrylate, etc.].

單體(B2)係可舉例如具有活性氫(諸如羥基、胺基等)及硬化性基的單體,具體係可舉例如:具有碳數2~6之羥烷基的(甲基)丙烯酸羥烷基酯[諸如:(甲基)丙烯酸-2-羥甲酯、(甲基)丙烯酸-2-羥丙酯、(甲基)丙烯酸-2-羥丁酯、(甲基)丙烯酸-4-羥丁酯等]等,較佳係具有碳數2~4之羥烷基的丙烯酸羥烷基酯。The monomer (B2) may, for example, be a monomer having an active hydrogen (such as a hydroxyl group, an amine group, or the like) and a curable group, and specific examples thereof include (meth)acrylic acid having a hydroxyalkyl group having 2 to 6 carbon atoms. Hydroxyalkyl esters [such as: 2-hydroxymethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, (meth)acrylic acid-4 - Hydroxybutyl ester or the like], etc., preferably a hydroxyalkyl acrylate having a hydroxyalkyl group having 2 to 4 carbon atoms.

(單體(B))(monomer (B))

單體(B)係就密封部形成用光硬化性樹脂組成物的硬化性、密封部的機械特性等觀點,較佳為每1分子具有1~3個硬化性基者。The monomer (B) is preferably one to three hardening groups per molecule from the viewpoints of the curability of the photocurable resin composition for forming a sealing portion, the mechanical properties of the sealing portion, and the like.

密封部形成用光硬化性樹脂組成物係就單體(B)而言,亦可含有在上述胺甲酸酯寡聚物(A1)的合成方法中作為稀釋劑用的單體(B1)。又,單體(B)亦可含有在上述胺甲酸酯寡聚物(A1)的合成方法中所使用的未反應單體(B2)。The photocurable resin composition for forming a sealing portion may contain a monomer (B1) as a diluent in the method for synthesizing the urethane oligomer (A1) as the monomer (B). Further, the monomer (B) may contain the unreacted monomer (B2) used in the synthesis method of the above urethane oligomer (A1).

單體(B)係就面材與密封部間之密接性、後述各種添加劑的溶解性之觀點,較佳為含有具羥基的單體(B3)。The monomer (B) preferably contains a monomer having a hydroxyl group (B3) from the viewpoint of the adhesion between the face material and the sealing portion and the solubility of various additives to be described later.

具有羥基的單體(B3)較佳係例如:具有羥基數1~2、碳數3~8之羥烷基的甲基丙烯酸羥基酯(諸如:甲基丙烯酸-2-羥丙酯、甲基丙烯酸-2-羥丁酯、甲基丙烯酸-4-羥丁酯、甲基丙烯酸-6-羥己酯、丙三醇單甲基丙烯酸酯等),更佳為甲基丙烯酸-2-羥丁酯。The monomer (B3) having a hydroxyl group is preferably, for example, a hydroxy methacrylate having a hydroxyl group of 1 to 2 and a carbon number of 3 to 8 (such as 2-hydroxypropyl methacrylate or methyl group). 2-hydroxybutyl acrylate, 4-hydroxybutyl methacrylate, -6-hydroxyhexyl methacrylate, glycerol monomethacrylate, etc., more preferably 2-hydroxybutyl methacrylate ester.

密封部形成用光硬化性樹脂組成物中的單體(B)之含有比例,在硬化性化合物(I)整體(100質量%)即寡聚物(A)與單體(B)的合計(100質量%)中,以15~50質量%為佳,較佳為20~45質量%、更佳為25~40質量%。若單體(B)的比例達15質量%以上,密封部形成用光硬化性樹脂組成物的硬化性、面材與密封部間之密接性便呈良好。若單體(B)的比例在50質量%以下,便可輕易地將密封部形成用光硬化性樹脂組成物的黏度調整於500Pa‧s以上。The content ratio of the monomer (B) in the photocurable resin composition for forming a seal portion is the total of the curable compound (I) (100% by mass), that is, the total of the oligomer (A) and the monomer (B) ( 100% by mass) is preferably 15 to 50% by mass, more preferably 20 to 45% by mass, still more preferably 25 to 40% by mass. When the ratio of the monomer (B) is 15% by mass or more, the curability of the photocurable resin composition for forming a seal portion and the adhesion between the face material and the sealing portion are good. When the ratio of the monomer (B) is 50% by mass or less, the viscosity of the photocurable resin composition for sealing portion formation can be easily adjusted to 500 Pa ‧ or more.

另外,在胺甲酸酯寡聚物(A1)的合成中,會與預聚物的異氰酸酯基產生反應之單體(B2),因為係以寡聚物(A)之一部分的形式存在,因而並不包括於密封部形成用光硬化性樹脂組成物中的單體(B)含量中。另一方面,胺甲酸酯寡聚物(A1)的合成中,作為稀釋劑使用的單體(B1)、及在胺甲酸酯寡聚物(A1)合成後才添加的單體(B),係包括於密封部形成用光硬化性樹脂組成物中的單體(B)含量中。Further, in the synthesis of the urethane acrylate oligomer (A1), the monomer (B2) which reacts with the isocyanate group of the prepolymer is present in the form of a part of the oligomer (A), It is not included in the content of the monomer (B) in the photocurable resin composition for sealing portion formation. On the other hand, in the synthesis of the urethane oligomer (A1), the monomer (B1) used as a diluent and the monomer added after the synthesis of the urethane oligomer (A1) (B) The content of the monomer (B) in the photocurable resin composition for forming a seal portion is included.

(光聚合起始劑(C1))(Photopolymerization initiator (C1))

密封部形成用光硬化性樹脂組成物中所含的光聚合起始劑(C1),係可舉例如:苯乙酮系、酮縮醇系、苯偶姻或苯偶姻醚系、氧化膦系、二苯基酮系、噻噸酮系、醌系等光聚合起始劑,較佳係例如:苯乙酮系、酮縮醇系、苯偶姻醚系的光聚合起始劑。當利用短波長的可見光施行硬化時,就吸收波長區域的觀點,較佳係氧化膦系的光聚合起始劑。藉由併用吸收波長區域不同的2種以上光聚合起始劑(C1),便可更加速硬化時間、或提高密封部的表面硬化性。又,當在透明面材上設有遮光印刷部,並利用從面材的側面之光照射,而使由遮光印刷部所挾持的未硬化密封部與樹脂層形成用光硬化性樹脂組成物進行硬化時,亦可在不會阻礙到未硬化密封部所鄰接部分的樹脂層形成用光硬化性樹脂組成物的硬化之範圍內,併用後述光聚合起始劑(C2)。當有併用的情況,聚合起始劑(C1)與聚合起始劑(C2)的含有比例,就效率佳且有效的進行硬化之觀點,依(C1):(C2)的質量比計,較佳為50:1~5:1。為使由遮光印刷部所挾持的樹脂層形成用光硬化性樹脂組成物,能隔著未硬化密封材利用從面材側面所照射的光在短時間內硬化,密封部形成用光硬化性樹脂組成物較佳係不含有光聚合起始劑(C2)。The photopolymerization initiator (C1) contained in the photocurable resin composition for forming a sealing portion may, for example, be an acetophenone type, a ketal type, a benzoin or a benzoin ether type, or a phosphine oxide. A photopolymerization initiator such as a diphenylketone, a thioxanthone or an anthraquinone is preferably a photopolymerization initiator such as an acetophenone-based, ketal-based or benzoin-ether. When curing with a short-wavelength visible light, a phosphine oxide-based photopolymerization initiator is preferred from the viewpoint of absorbing a wavelength region. By using two or more kinds of photopolymerization initiators (C1) having different absorption wavelength regions in combination, the curing time can be further accelerated or the surface hardenability of the sealing portion can be improved. In addition, a light-shielding printing portion is provided on the transparent surface material, and the uncured sealing portion held by the light-shielding printing portion and the photocurable resin composition for forming a resin layer are irradiated with light from the side surface of the surface material. In the case of hardening, it is possible to use a photopolymerization initiator (C2) which will be described later in the range of curing of the resin layer-forming photocurable resin composition which does not inhibit the adjacent portion of the uncured seal portion. When there is a combination, the ratio of the polymerization initiator (C1) to the polymerization initiator (C2) is excellent in efficiency and effective in hardening, and based on the mass ratio of (C1):(C2), Good for 50:1~5:1. In order to form the photocurable resin composition for the resin layer held by the light-shielding printing portion, the light which is irradiated from the side surface of the surface material can be cured in a short time by the uncured sealing material, and the photocurable resin for sealing portion formation can be formed. The composition preferably does not contain a photopolymerization initiator (C2).

密封部形成用光硬化性樹脂組成物中的光聚合起始劑(C1)含量(當含有光聚合起始劑(C2)的情況,便為(C1)與(C2)的合計量),係相對於硬化性化合物(I)整體即寡聚物(A)與單體(B)的合計100質量份,較佳為0.01~10質量份、更佳為0.1~5質量份。The content of the photopolymerization initiator (C1) in the photocurable resin composition for forming a sealing portion (in the case where the photopolymerization initiator (C2) is contained, the total amount of (C1) and (C2)) is The total amount of the oligomer (A) and the monomer (B) is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 5 parts by mass, based on 100 parts by mass of the total of the curable compound (I).

(添加劑)(additive)

密封部形成用光硬化性樹脂組成物係視需要,亦可含有例如:聚合終止劑、光硬化促進劑、鏈轉移劑、光安定劑(諸如:紫外線吸收劑、自由基捕獲劑等)、抗氧化劑、難燃化劑、接著性提升劑(矽烷偶合劑等)、顏料、染料等各種添加劑,較佳係含有聚合終止劑、光安定劑。特別係藉由含有聚合終止劑之量少於聚合起始劑,便可改善密封部形成用光硬化性樹脂組成物的安定性,亦可調整硬化後的樹脂層之分子量。當利用從面材的側面所照射之光使密封材硬化時,具有使硬化反應延遲的效果之諸如聚合終止劑、鏈轉移劑、光安定劑、顏料、染料等,最好盡可能不要使用、或減少含量。The photocurable resin composition for forming a sealing portion may contain, for example, a polymerization terminator, a photocuring accelerator, a chain transfer agent, a light stabilizer (such as an ultraviolet absorber, a radical scavenger, etc.), and an anti-resistance. Various additives such as an oxidizing agent, a flame retardant, an adhesion promoter (such as a decane coupling agent), a pigment, and a dye preferably contain a polymerization terminator and a photostabilizer. In particular, when the amount of the polymerization terminator is less than the polymerization initiator, the stability of the photocurable resin composition for forming a seal portion can be improved, and the molecular weight of the resin layer after curing can be adjusted. When the sealing material is hardened by light irradiated from the side surface of the face material, such as a polymerization terminator, a chain transfer agent, a light stabilizer, a pigment, a dye, etc., which have an effect of delaying the hardening reaction, it is preferable not to use as much as possible. Or reduce the content.

聚合終止劑係可舉例如:氫醌系(諸如2,5-二第三丁基氫醌等)、兒茶酚系(諸如對第三丁基兒茶酚等)、蒽醌系、酚噻系、羥甲苯系等聚合終止劑。The polymerization terminator may, for example, be a hydroquinone (such as 2,5-di-t-butylhydroquinone, etc.), a catechol-based (such as p-tert-butylcatechol), an anthraquinone, or a phenolthiophene. A polymerization terminator such as a hydroxytoluene system.

光安定劑係可舉例如:紫外線吸收劑(諸如:苯并三唑系、二苯基酮系、水楊酸酯系等)、自由基捕獲劑(諸如受阻胺系)等。The photosensitizer may, for example, be a UV absorber (such as a benzotriazole system, a diphenylketone system or a salicylate system), a radical scavenger (such as a hindered amine system), or the like.

抗氧化劑係可舉例如磷系、硫系的化合物。The antioxidant is, for example, a phosphorus-based or sulfur-based compound.

該等添加劑的合計量係相對於硬化性化合物(I)整體即寡聚物(A)與單體(B)的合計100質量份,較佳為10質量份以下、更佳為5質量份以下。The total amount of the additives is 100 parts by mass, preferably 10 parts by mass or less, more preferably 5 parts by mass or less, based on 100 parts by mass of the total of the curable compound (I), that is, the oligomer (A) and the monomer (B). .

[步驟(b)][Step (b)]

經步驟(a)之後,便對由未硬化密封部所包圍的區域中,供應液狀樹脂層形成用光硬化性樹脂組成物。After the step (a), a liquid curable resin composition for forming a liquid resin layer is supplied to a region surrounded by the unhardened sealing portion.

樹脂層形成用光硬化性樹脂組成物的供應量係預先設定為由密封部、第1面材及第2面材所形成空間會被樹脂層形成用光硬化性樹脂組成物所填充,且將第1面材與第2面材之間隔開既定間隔(亦即樹脂層設為既定厚度)的份量。此時,較佳係預先考慮因樹脂層形成用光硬化性樹脂組成物的硬化收縮而造成的體積減少。所以,該份量較佳係樹脂層形成用光硬化性樹脂組成物的厚度,若干較厚於樹脂層既定厚度的量。當硬化收縮較小的情況,亦可將樹脂層的既定厚度、與樹脂層形成用光硬化性樹脂組成物的厚度設為大致相等。The supply amount of the resin layer-forming photocurable resin composition is set so that the space formed by the sealing portion, the first surface material, and the second surface material is filled with the photocurable resin composition for forming a resin layer, and The first surface material and the second surface material are separated by a predetermined interval (that is, the resin layer is set to a predetermined thickness). In this case, it is preferable to consider the volume reduction due to the hardening shrinkage of the photocurable resin composition for forming a resin layer in advance. Therefore, the amount is preferably a thickness of the photocurable resin composition for forming a resin layer, and a certain amount is thicker than a predetermined thickness of the resin layer. When the hardening shrinkage is small, the predetermined thickness of the resin layer and the thickness of the resin layer-forming photocurable resin composition may be made substantially equal.

供應方法係有如平放第1面材,並利用諸如分配機、模具塗佈機等供應手段,呈點狀、線狀或面狀進行供應的方法。The supply method is a method in which the first surface material is laid flat and supplied in a dot shape, a line shape or a surface shape by means of a supply means such as a dispenser or a die coater.

[樹脂層形成用光硬化性樹脂組成物][Photocurable resin composition for resin layer formation]

樹脂層形成用光硬化性樹脂組成物,在硬化後的動態黏彈性測定時,儲存剪切彈性模數為5×102~1×105Pa、且損失正切(tanδ)在1.4以下的液狀光硬化性樹脂組成物。In the photocurable resin composition for forming a resin layer, when the dynamic viscoelasticity after curing is measured, a liquid having a shear elastic modulus of 5 × 10 2 to 1 × 10 5 Pa and a loss tangent (tan δ) of 1.4 or less is stored. A photocurable resin composition.

該儲存剪切彈性模數及損失正切的測定方法,係如後記所詳述,使用動態黏彈性測定裝置,對未硬化的樹脂層形成用光硬化性樹脂組成物一邊施加動態剪切應力、一邊照射光,而使樹脂組成物硬化的方法。The measurement method of the storage shear modulus and the loss tangent is as described in detail later, and the dynamic shear stress is applied to the photocurable resin composition for forming an uncured resin layer by using a dynamic viscoelasticity measuring device. A method of irradiating light to harden a resin composition.

若硬化後的剪切彈性模數在5×105Pa以下,便可充分降低因硬化時的樹脂收縮所產生應力,俾可抑制對顯示面板的顯示品質影響。若該剪切彈性模數達5×102Pa以上,便不易發生樹脂層的彈性變形,俾可輕易地防止顯示元件與透明面材的位置偏移。又,若損失正切在1.4以下,即便顯示裝置係垂直設置使用時,顯示元件仍可充分地固定於透明面材上,可良好地防止因顯示元件的自重而造成樹脂層發生塑性變形等導致經時性出現顯示元件位置偏移的情況。When the shear modulus after hardening is 5 × 10 5 Pa or less, the stress generated by shrinkage of the resin during curing can be sufficiently reduced, and the influence on the display quality of the display panel can be suppressed. If the shear elastic modulus is 5 × 10 2 Pa or more, the elastic deformation of the resin layer is less likely to occur, and the positional displacement of the display element and the transparent face material can be easily prevented. Further, if the loss tangent is 1.4 or less, even if the display device is used vertically, the display element can be sufficiently fixed to the transparent face material, and the resin layer can be prevented from being plastically deformed due to the own weight of the display element. The time when the display component is shifted in position is present.

該儲存剪切彈性模數較佳係8×102~5×104Pa、更佳係1×103~3×104Pa。又,該損失正切較佳係1.0以下、更佳係0.5以下。The storage shear modulus is preferably 8 × 10 2 to 5 × 10 4 Pa, more preferably 1 × 10 3 to 3 × 10 4 Pa. Further, the loss tangent is preferably 1.0 or less, more preferably 0.5 or less.

如後述IPS式液晶顯示元件,在使用因樹脂層硬化時的收縮所產生應力等而容易影響顯示性能的顯示元件之場所,較佳係使用硬化後的儲存剪切彈性模數為5×102~5×103Pa且損失正切(tanδ)小於0.2的液狀光硬化性樹脂組成物。藉由使該剪切彈性模數在5×103Pa以下,便可將硬化時因樹脂收縮所產生的應力充分抑低於較小值,且藉由使損失正切(tanδ)小於0.2,即便是剪切彈性模數較低的樹脂層,仍可抑制因顯示元件的自重而造成的樹脂層經時性塑性變形。此情況,損失正切(tanδ)更佳係0.1以下。In the case of a display element which is likely to affect the display performance due to stress generated by shrinkage during curing of the resin layer, the IPS type liquid crystal display element described later preferably has a storage shear elastic modulus of 5 × 10 2 after hardening. A liquid photocurable resin composition of ~5 × 10 3 Pa and loss tangent (tan δ) of less than 0.2. By setting the shear modulus to 5 × 10 3 Pa or less, the stress due to shrinkage of the resin during hardening can be sufficiently suppressed to be less than a small value, and the loss tangent (tan δ) is less than 0.2, even if It is a resin layer having a low shear modulus, and the plastic deformation of the resin layer due to the self-weight of the display element can be suppressed. In this case, the loss tangent (tan δ) is preferably 0.1 or less.

損失正切的下限值並無特別的限定,可設為製造上能達到的範圍,當屬較柔軟的樹脂層時,通常係0.01以上。The lower limit of the loss tangent is not particularly limited, and can be set in a range that can be achieved in production. When it is a soft resin layer, it is usually 0.01 or more.

樹脂層形成用光硬化性樹脂組成物的黏度,較佳係0.05~50Pa‧s、更佳係1~20Pa‧s。若黏度達0.05Pa‧s以上,便可抑制後述單體(B')的比例,可抑制樹脂層的物性降低。又,因為低沸點成分變少,因而頗適用於後述的減壓層積方法。若黏度在50Pa‧s以下,則樹脂層不易有氣泡殘留。The viscosity of the photocurable resin composition for forming a resin layer is preferably 0.05 to 50 Pa s, more preferably 1 to 20 Pa s. When the viscosity is 0.05 Pa s or more, the ratio of the monomer (B') described later can be suppressed, and the deterioration of the physical properties of the resin layer can be suppressed. Moreover, since the low boiling point component is small, it is suitable for the pressure reduction lamination method mentioned later. If the viscosity is 50 Pa ‧ or less, the resin layer is less likely to have bubbles remaining.

樹脂層形成用光硬化性樹脂組成物的黏度係在25℃下,使用E型黏度計進行測定。The viscosity of the photocurable resin composition for forming a resin layer was measured at 25 ° C using an E-type viscometer.

樹脂層形成用光硬化性樹脂組成物較佳係液狀組成物且係含有:光硬化性硬化性化合物(II)、光聚合起始劑(C2)、以及非硬化性寡聚物(D)。非硬化性寡聚物(D)係在樹脂層形成用光硬化性樹脂組成物進行硬化時,不會與組成物中的硬化性化合物(II)進行硬化反應,且每1分子中含有0.8~3個羥基的寡聚物。The photocurable resin composition for forming a resin layer is preferably a liquid composition and contains a photocurable curable compound (II), a photopolymerization initiator (C2), and a non-curable oligomer (D). . When the non-curable oligomer (D) is cured by the photocurable resin composition for forming a resin layer, it does not undergo a curing reaction with the curable compound (II) in the composition, and contains 0.8~ per molecule. 3 hydroxyl oligomers.

藉由使樹脂層形成用光硬化性樹脂組成物含有非硬化性寡聚物(D),便可在抑制硬化後的樹脂層損失正切(tanδ)上升之同時使儲存剪切彈性模數降低,因而可同時達成動態黏彈性測定中,儲存剪切彈性模數與損失正切(tanδ)的各自較佳範圍。When the photocurable resin composition for forming a resin layer contains the non-curable oligomer (D), the storage shear elastic modulus can be lowered while suppressing an increase in the loss of tangent (tan δ) of the resin layer after curing. Therefore, the respective preferred ranges of the storage shear elastic modulus and the loss tangent (tan δ) in the dynamic viscoelasticity measurement can be simultaneously achieved.

再者,藉由少量含有鏈轉移劑,便可調整硬化後的樹脂層分子量而降低樹脂層的儲存彈性模數,但多數情況會造成硬化速度變慢。Further, by a small amount of a chain transfer agent, the molecular weight of the resin layer after curing can be adjusted to lower the storage elastic modulus of the resin layer, but in many cases, the curing rate is slowed down.

含有較多本發明非硬化性寡聚物(D)的樹脂層形成用光硬化性樹脂組成物中,因為可利用寡聚物(D)的含量調整彈性模數,因而較佳係減少鏈轉移劑的含量、或不要含有。具體而言,相對於硬化性化合物(II)整體即寡聚物(A')與單體(B')的合計100質量份,鏈轉移劑的添加量較佳係在1質量份以下、更佳係低於0.5質量份。鏈轉移劑係可以是例如正十二烷基硫醇。In the photocurable resin composition for forming a resin layer containing a large amount of the non-curable oligomer (D) of the present invention, since the elastic modulus can be adjusted by the content of the oligomer (D), it is preferred to reduce chain transfer. The content of the agent, or not. Specifically, the amount of the chain transfer agent added is preferably 1 part by mass or less, based on 100 parts by mass of the total of the curable compound (II), that is, the total of the oligomer (A') and the monomer (B'). The quality is less than 0.5 parts by mass. The chain transfer agent can be, for example, n-dodecyl mercaptan.

(硬化性化合物(II))(hardening compound (II))

樹脂層形成用光硬化性樹脂組成物中的硬化性化合物(II),係由該樹脂層形成用光硬化性樹脂組成物進行硬化時,會進行硬化反應的硬化性化合物之1種以上構成,較佳係該硬化性化合物之至少1種,具有在前述樹脂層形成用光硬化性樹脂組成物進行硬化時,不會產生反應之羥基的化合物(IIa)。The curable compound (II) in the photocurable resin composition for forming a resin layer is one or more types of curable compounds which undergo a curing reaction when the photocurable resin composition for forming a resin layer is cured. At least one of the curable compounds is preferably a compound (IIa) which does not cause a reaction hydroxyl group when the photocurable resin composition for forming a resin layer is cured.

若硬化性化合物(II)含有該化合物(IIa),由硬化性化合物(II)單獨進行硬化反應的硬化物中便存在羥基。該羥基的存在係對樹脂層形成用光硬化性樹脂組成物中的非硬化性寡聚物安定化具有貢獻。When the curable compound (II) contains the compound (IIa), a hydroxyl group is present in the cured product in which the curable compound (II) is hardened alone. The presence of the hydroxyl group contributes to the stabilization of the non-curable oligomer in the photocurable resin composition for forming a resin layer.

所以,具有前述硬化時不會產生反應之羥基的化合物(IIa),只要是在硬化反應後有存在未反應羥基便可,例如即使化合物(IIa)的羥基一部分進行硬化反應,另一部分未進行硬化反應而以未反應狀態殘留的話便可。Therefore, the compound (IIa) having the hydroxyl group which does not react at the time of hardening may be any unreacted hydroxyl group after the hardening reaction, for example, even if a part of the hydroxyl group of the compound (IIa) is hardened, the other part is not hardened. The reaction can be carried out in an unreacted state.

該具有硬化時不會產生反應之羥基的化合物(IIa),係只要具有對硬化反應具貢獻的硬化性基且具有羥基者便可,可為單體,亦可為具有重複單元的寡聚物。就較容易調整未硬化時的光硬化性組成物黏度之觀點,較佳係使用具有硬化性基且具有羥基的單體作為化合物(IIa)。屬於具羥基之單體的化合物(IIa)具體例,較佳係:具有羥基數1~2、碳數3~8之羥烷基的(甲基)丙烯酸羥基酯[諸如:(甲基)丙烯酸-2-羥丙酯、(甲基)丙烯酸-2-羥丁酯、(甲基)丙烯酸-4-羥丁酯、(甲基)丙烯酸-6-羥己酯、丙三醇單(甲基)丙烯酸酯等],更佳係甲基丙烯酸-2-羥丁酯。The compound (IIa) having a hydroxyl group which does not react during curing may be a monomer or a oligomer having a repeating unit as long as it has a curable group which contributes to the curing reaction and has a hydroxyl group. . From the viewpoint of easily adjusting the viscosity of the photocurable composition at the time of curing, it is preferred to use a monomer having a curable group and having a hydroxyl group as the compound (IIa). Specific examples of the compound (IIa) which is a monomer having a hydroxyl group are preferably a (meth)acrylic acid hydroxyester having a hydroxyl group of 1 to 2 and a carbon number of 3 to 8 [such as (meth)acrylic acid] -2-hydroxypropyl ester, 2-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, glycerol mono (methyl) Acrylate, etc., more preferably 2-hydroxybutyl methacrylate.

硬化性化合物(II)就較容易將黏度調整於前述範圍內的觀點,較佳係含有寡聚物(A')之1種以上與單體(B')之1種以上,該寡聚物(A')係具有硬化性基且數量平均分子量為1000~100000,該單體(B')係具有硬化性基且分子量為125~600。In view of the fact that the curable compound (II) is more preferably adjusted to have a viscosity within the above range, it is preferred to contain one or more kinds of the oligomer (A') and one or more monomers (B'). (A') has a curable group and has a number average molecular weight of 1,000 to 100,000. The monomer (B') has a curable group and has a molecular weight of from 125 to 600.

此情況,較佳為單體(B')至少一部分係使用具有硬化性基並具有羥基且分子量為125~600的單體(B3)。In this case, it is preferred that at least a part of the monomer (B') is a monomer (B3) having a curable group and having a hydroxyl group and having a molecular weight of from 125 to 600.

寡聚物(A')或單體(B')中之硬化性基係可舉例如加成聚合性不飽和基(諸如丙烯醯氧基、甲基丙烯醯氧基等)、或不飽和基與硫醇基的組合等,就能獲得硬化速度快速及透明性高之樹脂層的觀點,較佳係選自於由丙烯醯氧基及甲基丙烯醯氧基所構成群組的基。The curable group in the oligomer (A') or the monomer (B') may, for example, be an addition polymerizable unsaturated group (such as a acryloxy group, a methacryloxy group, etc.), or an unsaturated group. From the viewpoint of a combination of a thiol group and the like, a resin layer having a high curing rate and high transparency can be obtained, and is preferably selected from the group consisting of a propylene oxy group and a methacryloxy group.

寡聚物(A')中之硬化性基、與單體(B')中之硬化性基係可相互為相同、亦可不同。因為分子量較高的寡聚物(A')之硬化性基,反應性較容易變得低於分子量較低的單體(B')中之硬化性基,因而單體(B')的硬化會先進行,導致組成物整體的黏性急遽提高,會有造成硬化反應呈不均質的可能性。為能縮小二者硬化性基的反應性差,俾可獲得均質樹脂層,較佳係將寡聚物(A')中之硬化性基設為反應性較高的丙烯醯氧基,且將單體(B')中之硬化性基設為反應性較低的甲基丙烯醯氧基。The curable group in the oligomer (A') and the curable group in the monomer (B') may be the same or different from each other. Because of the hardening group of the higher molecular weight oligomer (A'), the reactivity is more likely to become lower than the hardening group in the lower molecular weight monomer (B'), and thus the monomer (B') is hardened. It will be carried out first, resulting in an increase in the viscosity of the composition as a whole, which may cause the hardening reaction to be inhomogeneous. In order to reduce the reactivity of the curable groups, the homogeneous resin layer may be obtained, and the sulfomethoxy group in the oligomer (A') is preferably a highly reactive propylene oxime group, and The curable group in the body (B') is a methacryloxy group having a low reactivity.

(寡聚物(A'))(oligomer (A'))

寡聚物(A')的數量平均分子量較佳係1000~100000、更佳係10000~70000。若寡聚物(A')的數量平均分子量在該範圍內,便容易將樹脂層形成用光硬化性樹脂組成物的黏度調整於前述範圍內。The number average molecular weight of the oligomer (A') is preferably from 1,000 to 100,000, more preferably from 10,000 to 70,000. When the number average molecular weight of the oligomer (A') is within this range, the viscosity of the resin layer-forming photocurable resin composition is easily adjusted within the above range.

寡聚物(A')的數量平均分子量係利用GPC測定所獲得聚苯乙烯換算的數量平均分子量。另外,GPC測定中,當有出現未反應低分子量成分(單體等)的尖峰時,便排除該尖峰求取數量平均分子量。The number average molecular weight of the oligomer (A') is a polystyrene-converted number average molecular weight obtained by GPC measurement. Further, in the GPC measurement, when a spike of unreacted low molecular weight component (monomer or the like) occurs, the peak is excluded to obtain a number average molecular weight.

寡聚物(A')就樹脂層形成用光硬化性樹脂組成物的硬化性、樹脂層的機械特性等觀點,較佳為每1分子中平均具有1.8~4個硬化性基者。The oligomer (A') is preferably one having an average of 1.8 to 4 curable groups per molecule, from the viewpoints of the curability of the photocurable resin composition for forming a resin layer, the mechanical properties of the resin layer, and the like.

寡聚物(A')係可舉例如:具有胺甲酸酯鍵結的胺甲酸酯寡聚物、聚氧伸烷基多元醇的聚(甲基)丙烯酸酯、聚酯多元醇的聚(甲基)丙烯酸酯等,就依照胺甲酸酯鏈的分子設計等,可廣泛調整硬化後的樹脂機械特性、以及與面材間之密接性等觀點,較佳為胺甲酸酯寡聚物(A2)。The oligomer (A') may, for example, be a urethane-bonded urethane oligomer, a polyoxyalkylene polyol poly(meth)acrylate, or a polyester polyol. (Meth) acrylate or the like can be broadly adjusted from the viewpoint of molecular design of the urethane chain, etc., and the mechanical properties of the resin after curing and the adhesion to the surface material can be widely adjusted, and urethane oligomerization is preferred. (A2).

胺甲酸酯寡聚物(A2)較佳係依照使多元醇與聚異氰酸酯進行反應而獲得具異氰酸酯基之預聚物後,使該預聚物的異氰酸酯基,與前述單體(B2)進行反應的方法而合成者。The urethane oligomer (A2) is preferably obtained by reacting a polyol with a polyisocyanate to obtain a prepolymer having an isocyanate group, and then reacting the isocyanate group of the prepolymer with the monomer (B2). The method of reaction is synthesized.

多元醇、聚異氰酸酯係屬於公知化合物,例如國際公開第2009/016943號小冊子所記載當作胺甲酸酯系寡聚物(a)之原料的多元醇(i)、二異氰酸酯(ii)等,均納入本說明書中。The polyol and the polyisocyanate are known compounds, and the polyol (i), the diisocyanate (ii), etc. which are the raw materials of the urethane-based oligomer (a) described in the pamphlet of International Publication No. 2009/016943, Both are included in this specification.

胺甲酸酯寡聚物(A2)亦可使用市售物,例如:EB230(DAICEL-CYTEC公司製,認為係官能基數2、聚丙二醇/IPDI/丙烯酸-2-羥乙酯的反應生成物)、U-200A X(新中村化學公司製,認為係官能基數2、脂肪族聚酯多元醇/脂肪族或脂環族聚異氰酸酯/丙烯酸-2-羥乙酯的反應生成物)。A commercially available product may be used as the urethane oligomer (A2), for example, EB230 (manufactured by DAICEL-CYTEC Co., Ltd., which is a reaction product of 2, polypropylene glycol/IPDI/-2-hydroxyethyl acrylate) U-200A X (manufactured by Shin-Nakamura Chemical Co., Ltd., is a reaction product of a functional group number 2, an aliphatic polyester polyol/aliphatic or an alicyclic polyisocyanate/-2-hydroxyethyl acrylate).

寡聚物(A')的含有比例,在硬化性化合物(II)整體(100質量%)即寡聚物(A')與單體(B')的合計(100質量%)中,較佳為20~90質量%、更佳為30~80質量%。若該寡聚物(A')的比例達20質量%以上,樹脂層的耐熱性會呈良好。若該寡聚物(A')的比例在90質量%以下,則樹脂層形成用光硬化性樹脂組成物的硬化性、以及面材與樹脂層間之密接性呈良好。因為該寡聚物(A')係硬化性基每1個的分子量較大,因而為特別抑制硬化時的收縮,更佳係將該寡聚物(A')的比例設為70~90質量%。The content ratio of the oligomer (A') is preferably in the total (100% by mass) of the curable compound (II), that is, the total amount (100% by mass) of the oligomer (A') and the monomer (B'). It is 20 to 90% by mass, more preferably 30 to 80% by mass. When the proportion of the oligomer (A') is 20% by mass or more, the heat resistance of the resin layer is good. When the ratio of the oligomer (A') is 90% by mass or less, the curability of the photocurable resin composition for forming a resin layer and the adhesion between the surface material and the resin layer are good. Since the molecular weight of the oligomer (A')-based curable group is large, the shrinkage at the time of curing is particularly suppressed, and the ratio of the oligomer (A') is preferably 70 to 90. %.

(單體(B'))(monomer (B'))

單體(B')的分子量較佳係125~600、更佳係140~400。若單體(B')的分子量達125以上,當依照後述減壓層積方法進行顯示裝置的製造時,便可抑制單體揮發。若單體(B')的分子量在600以下,則面材與樹脂層間之密接性呈良好。The molecular weight of the monomer (B') is preferably from 125 to 600, more preferably from 140 to 400. When the molecular weight of the monomer (B') is 125 or more, when the display device is produced in accordance with the pressure reduction lamination method described later, the monomer volatilization can be suppressed. When the molecular weight of the monomer (B') is 600 or less, the adhesion between the face material and the resin layer is good.

單體(B')係就樹脂層形成用光硬化性樹脂組成物的硬化性、樹脂層的機械特性等觀點,較佳為每1分子具有1~3個硬化性基者。The monomer (B') is preferably one to three hardening groups per molecule from the viewpoints of the curability of the photocurable resin composition for forming a resin layer, the mechanical properties of the resin layer, and the like.

單體(B')的含有比例在硬化性化合物(II)整體(100質量%)即寡聚物(A')與單體(B')的合計(100質量%)中,較佳為10~80質量%、更佳為20~70質量%。The content ratio of the monomer (B') is preferably 10 in the total (100% by mass) of the curable compound (II), that is, the total amount (100% by mass) of the oligomer (A') and the monomer (B'). ~80% by mass, more preferably 20 to 70% by mass.

單體(B')較佳係含有具硬化性基且具羥基的單體(B3)。單體(B3)係對非硬化性寡聚物(D)的安定化具貢獻。又,若使含有單體(B3),便可輕易地獲得面材與樹脂層間之良好密接性。單體(B3)的1分子中之羥基數,係可任意選擇能使非硬化性寡聚物(D)呈安定化的數目,但就取得容易性的觀點,較佳為1分子中具有1~2個。The monomer (B') preferably contains a monomer (B3) having a sclerosing group and having a hydroxyl group. The monomer (B3) contributes to the stabilization of the non-curable oligomer (D). Further, when the monomer (B3) is contained, good adhesion between the face material and the resin layer can be easily obtained. The number of hydroxyl groups in one molecule of the monomer (B3) can be arbitrarily selected so that the non-curable oligomer (D) can be stabilized. However, from the viewpoint of easiness, it is preferred to have 1 in one molecule. ~2.

具有羥基的單體(B3),係可舉例如與密封部形成用光硬化性樹脂組成物中的單體(B3)為同樣者,較佳為甲基丙烯酸-2-羥丁酯。The monomer (B3) having a hydroxyl group is, for example, the same as the monomer (B3) in the photocurable resin composition for forming a sealing portion, and is preferably 2-hydroxybutyl methacrylate.

單體(B3)的含有比例在硬化性化合物(II)整體(100質量%)即寡聚物(A')與單體(B')的合計(100質量%)中,較佳為10~60質量%、更佳為20~50質量%。若該單體(B3)的含有比例達10質量%以上,便可輕易地充分獲得樹脂層形成用光硬化性樹脂組成物之安定性提升、以及面材與樹脂層間之密接性提升的效果。若單體(B3)的含有比例在60質量%以下,則由樹脂層形成用光硬化性樹脂組成物所構成硬化物的硬度便不會變為過高,因而屬較佳。The content ratio of the monomer (B3) is preferably 10% in the total (100% by mass) of the curable compound (II), that is, the total amount (100% by mass) of the oligomer (A') and the monomer (B'). 60% by mass, more preferably 20 to 50% by mass. When the content ratio of the monomer (B3) is 10% by mass or more, the effect of improving the stability of the photocurable resin composition for forming a resin layer and improving the adhesion between the surface material and the resin layer can be easily obtained. When the content ratio of the monomer (B3) is 60% by mass or less, the hardness of the cured product composed of the photocurable resin composition for forming a resin layer is not excessively high, which is preferable.

單體(B')係就樹脂層的機械特性觀點,較佳係含有下述單體(B4)。因為單體(B4)會使硬化後的樹脂層之玻璃轉移溫度(Tg)降低,因而對硬化後的樹脂層之彈性模數降低具貢獻,可提升該樹脂層的柔軟性。The monomer (B') preferably contains the following monomer (B4) from the viewpoint of mechanical properties of the resin layer. Since the monomer (B4) lowers the glass transition temperature (Tg) of the resin layer after hardening, it contributes to a decrease in the elastic modulus of the resin layer after hardening, and the flexibility of the resin layer can be improved.

但,當提高樹脂層形成用光硬化性樹脂組成物的硬化性,並縮短硬化所需要時間等情況時,亦會有最好減少單體(B4)的含量、或不要含有的情況。However, when the curability of the photocurable resin composition for forming a resin layer is increased and the time required for curing is shortened, the content of the monomer (B4) may be preferably reduced or may not be contained.

單體(B4):選自於具有碳數8~22之烷基的甲基丙烯酸烷基酯所構成群組之1種以上。若碳數達8以上,就可使硬化物的玻璃轉移溫度降低之觀點,係屬較佳,若碳數在22以下,就原料的醇可經由天然物輕易取得的觀點,係屬較佳。Monomer (B4): one or more selected from the group consisting of alkyl methacrylates having an alkyl group having 8 to 22 carbon atoms. When the carbon number is 8 or more, the glass transition temperature of the cured product can be lowered, which is preferable. When the carbon number is 22 or less, it is preferred that the raw material alcohol can be easily obtained through natural materials.

單體(B4)係可舉例如:甲基丙烯酸正十二烷基酯、甲基丙烯酸正十八烷基酯、甲基丙烯酸正廿二烷基酯等,較佳為甲基丙烯酸正十二烷基酯、或甲基丙烯酸正十八烷基酯。Examples of the monomer (B4) include n-dodecyl methacrylate, n-octadecyl methacrylate, n-decyl methacrylate, and the like. An alkyl ester, or n-octadecyl methacrylate.

單體(B4)的含有比例在硬化性化合物(II)整體(100質量%)即寡聚物(A')與單體(B')的合計(100質量%)中,較佳為5~50質量%、更佳為15~40質量%。若該單體(B4)的含有比例達5質量%以上,便可輕易地獲得單體(B4)的充分添加效果。The content ratio of the monomer (B4) is preferably 5% in the total (100% by mass) of the curable compound (II), that is, the total amount (100% by mass) of the oligomer (A') and the monomer (B'). 50% by mass, more preferably 15 to 40% by mass. When the content ratio of the monomer (B4) is 5% by mass or more, the sufficient addition effect of the monomer (B4) can be easily obtained.

(光聚合起始劑(C2))(Photopolymerization initiator (C2))

樹脂層形成用光硬化性樹脂組成物中所含的光聚合起始劑(C2),係可舉例如:苯乙酮系、酮縮醇系、苯偶姻或苯偶姻醚系、氧化膦系、二苯基酮系、噻噸酮系、醌系等光聚合起始劑,較佳為氧化膦系、噻噸酮系的光聚合起始劑,就經光聚合反應後抑制著色的觀點,更佳為氧化膦系。The photopolymerization initiator (C2) contained in the photocurable resin composition for forming a resin layer may, for example, be an acetophenone type, a ketal type, a benzoin or a benzoin ether type, or a phosphine oxide. A photopolymerization initiator such as a diphenyl ketone, a thioxanthone or an anthraquinone, preferably a phosphine oxide-based or thioxanthone-based photopolymerization initiator, which suppresses coloration after photopolymerization More preferably, it is a phosphine oxide system.

樹脂層形成用光硬化性樹脂組成物的光聚合起始劑(C2)之含量,相對於硬化性化合物(II)整體,即寡聚物(A')與單體(B')的合計100質量份,較佳為0.01~10質量份、更佳為0.1~5質量份。The content of the photopolymerization initiator (C2) of the photocurable resin composition for forming a resin layer is 100% of the total of the curable compound (II), that is, the total of the oligomer (A') and the monomer (B'). The mass part is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 5 parts by mass.

當利用從面材側邊所照射的光,使密封材相鄰接的樹脂層形成用光硬化性樹脂組成物一部分硬化時,光聚合起始劑(C2)較佳係具有的吸收波長區域(λ2)較前述光聚合起始劑(C1)的吸收波長區域(λ1)更靠長波長側而存在。光聚合起始劑(C2)係可僅具有吸收波長區域(λ2)者、亦可具有與吸收波長區域(λ1)重複的吸收波長區域(λ1')及吸收波長區域(λ2)者。When a part of the photocurable resin composition for forming a resin layer adjacent to the sealing material is hardened by light irradiated from the side of the surface material, the photopolymerization initiator (C2) preferably has an absorption wavelength region ( Λ2) exists on the longer wavelength side than the absorption wavelength region (λ1) of the photopolymerization initiator (C1). The photopolymerization initiator (C2) may have only an absorption wavelength region (λ2), and may have an absorption wavelength region (λ1') and an absorption wavelength region (λ2) which are repeated with the absorption wavelength region (λ1).

(非硬化性寡聚物(D))(non-hardening oligomer (D))

非硬化性寡聚物(D)係在樹脂層形成用光硬化性樹脂組成物中呈良好相溶且對硬化無具貢獻,因而可在不致損及透明性與均質性的情況下,降低因樹脂層硬化時的收縮所產生應力。The non-curable oligomer (D) is excellent in compatibility with the photocurable resin composition for forming a resin layer and contributes to hardening, so that the effect can be reduced without impairing transparency and homogeneity. Stress generated by shrinkage when the resin layer is hardened.

非硬化性寡聚物(D)係在樹脂層形成用光硬化性樹脂組成物進行硬化時,不會與組成物中的硬化性化合物(II)進行硬化反應,每1分子中具有0.8~3個羥基的寡聚物。較佳係每1分子的羥基為2~3個。若每1分子的羥基達0.8個以上,就非硬化性寡聚物間,或者非硬化性寡聚物、與由硬化性化合物(II)所獲得硬化物之間,可利用羥基間的相互作用而安定地保持非硬化性寡聚物的觀點,係屬較佳,若每1分子的羥基在3個以下,則就非硬化性寡聚物在樹脂層形成用光硬化性樹脂組成物中可呈良好相溶的觀點,係屬較佳。When the non-curable oligomer (D) is cured by the photocurable resin composition for forming a resin layer, it does not undergo a curing reaction with the curable compound (II) in the composition, and has 0.8 to 3 per molecule. Hydroxyl oligomers. Preferably, the number of hydroxyl groups per molecule is 2 to 3. When the number of hydroxyl groups per molecule is 0.8 or more, the interaction between the non-curable oligomers, or between the non-curable oligomers and the hardened material obtained from the curable compound (II), can be utilized. In view of the fact that the non-curable oligomer is stably held, the non-curable oligomer can be used in the photocurable resin composition for forming a resin layer. From the standpoint of good compatibility, it is preferred.

非硬化性寡聚物(D)平均1個羥基的數量平均分子量(Mn)較佳係400~8000。若平均1個羥基的數量平均分子量達400以上,則非硬化性寡聚物(D)的極性不會變為過高,可輕易獲得與樹脂層形成用光硬化性樹脂組成物中的硬化性化合物(II)間之良好相溶性。若平均1個羥基的數量平均分子量在8000以下,則利用源自硬化性化合物(II)的羥基、與非硬化性寡聚物(D)的羥基間之相互作用,可輕易地獲得在硬化後的樹脂層中使非硬化性寡聚物(D)呈安定化的效果。該項相互作用推測係有氫鍵參與。The number average molecular weight (Mn) of the average of one hydroxyl group of the non-curable oligomer (D) is preferably from 400 to 8,000. When the number average molecular weight of the average number of hydroxyl groups is 400 or more, the polarity of the non-curable oligomer (D) does not become too high, and the curability in the photocurable resin composition for forming a resin layer can be easily obtained. Good compatibility between the compounds (II). When the number average molecular weight of one hydroxyl group is 8000 or less, the interaction between the hydroxyl group derived from the curable compound (II) and the hydroxyl group of the non-curable oligomer (D) can be easily obtained after hardening. The non-curable oligomer (D) has an effect of stabilizing the resin layer. The interaction is speculated to involve hydrogen bonding.

非硬化性寡聚物(D)係可單獨使用1種、亦可併用2種以上。The non-curable oligomer (D) may be used alone or in combination of two or more.

含羥基的非硬化性寡聚物(D)之例係可舉例如高分子量的多元醇等,較佳為聚氧伸烷基多元醇、聚酯多元醇、聚碳酸酯多元醇。Examples of the hydroxyl group-containing non-curable oligomer (D) include a high molecular weight polyol, and the like, and a polyoxyalkylene polyol, a polyester polyol, and a polycarbonate polyol are preferable.

聚氧伸烷基多元醇係可舉例如具有碳數2~4個之氧伸烷基重複單元的聚氧伸烷基單醇、聚氧伸烷基二醇或聚氧伸烷基三醇。具體係可舉例如:聚氧乙二醇、聚氧伸丙基二醇(以下亦稱「聚丙二醇」)、聚氧伸丙基三醇、聚氧四亞甲基二醇等。The polyoxyalkylene polyol may, for example, be a polyoxyalkylene monool having a carbon number of 2 to 4 oxygen alkyl repeating units, a polyoxyalkylene glycol or a polyoxyalkylene triol. Specific examples thereof include polyoxyethylene glycol, polyoxypropylene diol (hereinafter also referred to as "polypropylene glycol"), polyoxypropylene propylene glycol, and polyoxytetramethylene glycol.

聚氧伸烷基多元醇平均1個羥基的數量平均分子量(Mn),較佳係400~8000、更佳係600~5000。The number average molecular weight (Mn) of the average hydroxyl group of the polyoxyalkylene polyol is preferably from 400 to 8,000, more preferably from 600 to 5,000.

聚酯多元醇係可舉例如具有諸如:乙二醇、丙二醇、1,4-丁二醇等脂肪族二醇殘基、與諸如:戊二酸、己二酸、癸二酸等脂肪族二羧酸殘基的脂肪族系聚酯二醇。The polyester polyol may, for example, have an aliphatic diol residue such as ethylene glycol, propylene glycol or 1,4-butanediol, and an aliphatic second such as glutaric acid, adipic acid or sebacic acid. An aliphatic polyester diol having a carboxylic acid residue.

聚碳酸酯多元醇係可舉例如:1,6-己二醇等具二醇殘基的脂肪族聚碳酸酯二醇;或者脂肪族環狀碳酸酯的開環聚合物等脂肪族聚碳酸酯二醇。The polycarbonate polyol may, for example, be an aliphatic polycarbonate diol having a diol residue such as 1,6-hexanediol or an aliphatic polycarbonate such as a ring-opening polymer of an aliphatic cyclic carbonate. Glycol.

聚酯多元醇或聚碳酸酯多元醇平均1個羥基的數量平均分子量(Mn),較佳係400~8000、更佳係800~6000。The number average molecular weight (Mn) of the average hydroxyl group of the polyester polyol or the polycarbonate polyol is preferably from 400 to 8,000, more preferably from 800 to 6,000.

本說明書中,非硬化性寡聚物(D)的數量平均分子量係由根據JISK1557-1(2007年版)所測定的羥值A(KOH mg/g)、與非硬化性寡聚物(D)1分子內的羥基數B,依照下式(1)進行計算出的值。In the present specification, the number average molecular weight of the non-curable oligomer (D) is a hydroxyl value A (KOH mg/g) measured according to JIS K1557-1 (2007 edition), and a non-hardening oligomer (D). The number of hydroxyl groups B in one molecule is calculated according to the following formula (1).

非硬化性寡聚物(D)的分子量=56.1×B×1000/A …(1)Molecular weight of non-hardening oligomer (D) = 56.1 × B × 1000 / A ... (1)

就硬化後的樹脂層彈性模數容易變為更低的觀點,非硬化性寡聚物(D)較佳係使用聚氧伸烷基多元醇、更佳係使用聚氧伸丙基多元醇。又,如後述,為調節非硬化性寡聚物(D)的極性,亦可將聚氧伸丙基多元醇的氧伸丙基一部分利用氧伸乙基進行取代。亦可將氧伸丙基一部分利用氧伸乙基進行取代,此部分係與前述多元醇(i)中的說明相同。In view of the fact that the elastic modulus of the resin layer after hardening is likely to be lower, the non-curable oligomer (D) is preferably a polyoxyalkylene polyol, more preferably a polyoxypropylene propylene polyol. Further, as described later, in order to adjust the polarity of the non-curable oligomer (D), a part of the oxygen-extended propyl group of the polyoxy-extension propylene polyol may be substituted with an oxygen-extended ethyl group. A part of the oxygen-extended propyl group may also be substituted with an oxygen-extended ethyl group, which is the same as described in the above polyol (i).

例如就相溶性的觀點,較佳為寡聚物(A')係將聚氧伸烷基多元醇與聚異氰酸酯使用為原料而合成的胺甲酸酯寡聚物,而非硬化性寡聚物(D)係聚氧伸烷基多元醇。For example, from the viewpoint of compatibility, the oligomer (A') is preferably a urethane oligomer synthesized by using a polyoxyalkylene polyol and a polyisocyanate as a raw material, instead of a curable oligomer. (D) is a polyoxyalkylene polyol.

本發明中,為使未硬化時的樹脂層形成用光硬化性樹脂組成物呈安定,俾抑制非硬化性寡聚物(D)從硬化後的樹脂層中分離,較佳係寡聚物(A')與非硬化性寡聚物(D)具有相同結構或類似結構的分子鏈。In the present invention, in order to stabilize the photocurable resin composition for forming a resin layer when it is not cured, the anti-curable oligomer (D) is inhibited from being separated from the cured resin layer, and an oligomer is preferably used. A') A molecular chain having the same structure or a similar structure as the non-hardening oligomer (D).

具體而言,在合成樹脂層形成用光硬化性樹脂組成物中之寡聚物(A')時的原料,較佳係使用例如多元醇等具羥基的化合物(以下亦稱「含羥基化合物」),且將該相同的含羥基化合物使用為非硬化性寡聚物(D)。Specifically, in the case of forming the oligomer (A') in the photocurable resin composition of the synthetic resin layer, it is preferred to use a compound having a hydroxyl group such as a polyhydric alcohol (hereinafter also referred to as "hydroxyl-containing compound"). And the same hydroxyl group-containing compound is used as the non-curable oligomer (D).

例如當寡聚物(A')係將聚氧伸烷基多元醇與聚異氰酸酯使用為原料而合成的胺甲酸酯寡聚物時,較佳係將該聚氧伸烷基多元醇使用作為非硬化性寡聚物(D)。For example, when the oligomer (A') is a urethane oligomer synthesized using a polyoxyalkylene polyol and a polyisocyanate as a raw material, it is preferred to use the polyoxyalkylene polyol as Non-hardening oligomer (D).

或者,當使用為寡聚物(A')原料的含羥基化合物、與使用為非硬化性寡聚物(D)的含羥基化合物,並非屬相同的情況,較佳係二者分子鏈具有共通的重複單元等,部分性具有共通結構,且將二者的極性設為相同程度。極性的調整方法係有如:藉由導入極性基而提高極性的方法、藉由將氧伸丙基一部分利用氧伸乙基進行取代而提高極性的方法、以及藉由降低平均1個羥基的分子量而提高極性的方法等。該等方法亦可組合使用。Alternatively, when the hydroxyl group-containing compound used as the raw material of the oligomer (A') and the hydroxyl group-containing compound used as the non-hardenable oligomer (D) are not the same, it is preferred that the molecular chains of the two have a common The repeating unit or the like has a common structure and has the same polarity as the two. The method of adjusting the polarity is, for example, a method of increasing the polarity by introducing a polar group, a method of increasing the polarity by substituting a part of the oxygen-extended propyl group with an oxygen-extended ethyl group, and reducing the molecular weight of an average of one hydroxyl group. Ways to increase polarity, etc. These methods can also be used in combination.

例如寡聚物(A')係使用了氧伸丙基一部分利用氧伸乙基進行取代的聚氧伸丙基多元醇(a')、及聚異氰酸酯,作為原料而合成的胺甲酸酯寡聚物時,作為非硬化性寡聚物(D)較佳係使用不具有氧伸乙基的聚氧伸丙基多元醇,且平均1個羥基的分子量小於前述多元醇(a')的聚氧伸丙基多元醇者。For example, the oligomer (A') is a polyformate propylene polyol (a') substituted with an oxygen-extended ethyl group and a polyisocyanate, and a urethane oligosaccharide synthesized as a raw material. In the case of a non-curable oligomer (D), a polyoxypropylene propylene polyol having no oxygen-extended ethyl group is preferably used, and an average molecular weight of one hydroxyl group is smaller than that of the aforementioned polyol (a'). Oxygen extended propyl polyol.

最佳的樹脂層形成用光硬化性樹脂組成物一例,係有如下述寡聚物(A')、非硬化性寡聚物(D)、及單體(B')的組成物,該寡聚物(A')係使氧伸丙基一部分已利用氧伸乙基進行取代的聚氧伸丙基二醇、與聚異氰酸酯化合物進行反應而獲得具有異氰酸酯基的預聚物之後,與前述單體(B2)進行反應而獲得之胺甲酸酯寡聚物(A2);該非硬化性寡聚物(D)係與該胺甲酸酯寡聚物(A2)的原料相同,將氧伸丙基一部分已利用氧伸乙基進行取代的聚氧伸丙基二醇;且,該單體(B')係具有羥基的單體(B3)。An example of the photocurable resin composition for forming an optimum resin layer is a composition of the following oligomer (A'), non-curable oligomer (D), and monomer (B'). The polymer (A') is obtained by reacting a polyoxypropyl propylene glycol partially substituted with an oxygen-extended ethyl group with an oxygen-extended ethyl group to obtain a prepolymer having an isocyanate group, and the foregoing The urethane oligomer (A2) obtained by the reaction of the body (B2); the non-hardening oligomer (D) is the same as the raw material of the urethane oligomer (A2), and the oxygen is extended to C A polyoxyalkylene propylene glycol in which a part of the base has been substituted with an oxygen-extended ethyl group; and the monomer (B') is a monomer (B3) having a hydroxyl group.

依此,若寡聚物(A')部分性具有與非硬化性寡聚物(D)相同的分子結構,便可更加提高組成物中的非硬化性寡聚物(D)之相溶性,更藉由單體(B')具有羥基,判斷利用硬化性化合物(II)硬化後的分子結構中之羥基、與非硬化性寡聚物(D)的分子結構中之羥基間的相互作用,便可使非硬化性寡聚物(D)安定地存在於硬化物中。According to this, if the oligomer (A') partially has the same molecular structure as the non-curable oligomer (D), the compatibility of the non-hardening oligomer (D) in the composition can be further improved. Further, by the hydroxyl group of the monomer (B'), the interaction between the hydroxyl group in the molecular structure after curing of the curable compound (II) and the hydroxyl group in the molecular structure of the non-curable oligomer (D) is determined. The non-hardening oligomer (D) can be stably present in the cured product.

再者,其他例方面,含有下述寡聚物(A')、非硬化性寡聚物(D)、及單體(B')的組成物,亦可獲得組成物中的非硬化性寡聚物(D)呈良好相溶性,並可使非硬化性寡聚物(D)安定地存在於硬化物中。該寡聚物(A')係使將氧伸丙基一部分已利用氧伸乙基進行取代的聚氧伸丙基二醇、與聚異氰酸酯化合物進行反應,而獲得具有異氰酸酯基的預聚物之後,與前述單體(B2)進行反應而獲得的胺甲酸酯寡聚物(A2);該非硬化性寡聚物(D)係未利用氧伸乙基進行取代的聚氧伸丙基二醇,且分子量小於胺甲酸酯寡聚物(A2)原料的聚氧伸丙基二醇;且,該單體(B')係具有羥基的單體(B3)。Further, in other examples, the composition of the oligomer (A'), the non-curable oligomer (D), and the monomer (B') may be obtained, and a non-hardening oligo in the composition may be obtained. The polymer (D) is in good compatibility, and the non-hardening oligomer (D) can be stably present in the cured product. The oligomer (A') is obtained by reacting a polyoxypropyl propylene glycol having a part of an oxygen-extended propyl group with an oxygen-extended ethyl group, and reacting with a polyisocyanate compound to obtain a prepolymer having an isocyanate group. a urethane oligomer (A2) obtained by reacting with the aforementioned monomer (B2); the non-curable oligomer (D) is a polyoxypropylene propylene glycol which is not substituted with an oxygen-extended ethyl group And a polyoxypropyl propylene glycol having a molecular weight smaller than a raw material of the urethane acrylate oligomer (A2); and the monomer (B') is a monomer (B3) having a hydroxyl group.

樹脂層形成用光硬化性樹脂組成物中的非硬化性寡聚物(D)的含量,較佳係10~90質量%。若非硬化性寡聚物的含量達10質量%以上,便可輕易地充分獲得降低因硬化時的樹脂收縮所產生應力之效果。若在90質量%以下,便可輕易地使面材彼此間充分地固定,俾可輕易並良好地防止表面材與背面材接合後發生經時性位置偏移情形。非硬化性寡聚物(D)的含量較佳係配合硬化性化合物(II)的組成等,設定為可獲得儲存剪切彈性模數與損失正切之較佳值的狀態。更佳的範圍係30~80質量%。The content of the non-curable oligomer (D) in the photocurable resin composition for forming a resin layer is preferably from 10 to 90% by mass. When the content of the non-curable oligomer is 10% by mass or more, the effect of reducing the stress generated by the shrinkage of the resin during curing can be easily sufficiently obtained. If it is 90% by mass or less, the face materials can be easily fixed to each other sufficiently, and the temporal positional displacement of the surface material and the backing material can be easily and satisfactorily prevented. The content of the non-curable oligomer (D) is preferably a state in which the composition of the curable compound (II) is blended, and the like, and a state in which a storage shear elastic modulus and a loss tangent are preferable. A more preferable range is 30 to 80% by mass.

(添加劑)(additive)

樹脂層形成用光硬化性樹脂組成物係視需要,尚可含有諸如:聚合終止劑、光硬化促進劑、鏈轉移劑、光安定劑(諸如紫外線吸收劑、自由基捕獲劑等)、抗氧化劑、難燃化劑、接著性提升劑(諸如矽烷偶合劑等)、顏料、染料等各種添加劑,較佳係含有聚合終止劑、或光安定劑。特別係藉由含有較聚合起始劑少量的聚合終止劑,便可改善樹脂層形成用光硬化性樹脂組成物的安定性,亦可調整經硬化後的樹脂層分子量。The photocurable resin composition for forming a resin layer may contain, for example, a polymerization terminator, a photohardening accelerator, a chain transfer agent, a light stabilizer (such as an ultraviolet absorber, a radical scavenger, etc.), and an antioxidant. Various additives such as a flame retardant, an adhesion promoter (such as a decane coupling agent), a pigment, and a dye preferably contain a polymerization terminator or a light stabilizer. In particular, by containing a small amount of a polymerization terminator than the polymerization initiator, the stability of the photocurable resin composition for forming a resin layer can be improved, and the molecular weight of the resin layer after curing can be adjusted.

[步驟(c)][Step (c)]

經步驟(b)之後,便將已供應樹脂層形成用光硬化性樹脂組成物的第1面材,放入減壓裝置中,並在減壓裝置內的固定支撐盤上,依硬化性樹脂組成物之面朝上的方式,平放第1面材。After the step (b), the first surface material to which the photocurable resin composition for forming a resin layer is supplied is placed in a decompression device, and is fixed on a fixed support disk in the decompression device. The first face material is placed flat on the face up of the composition.

在減壓裝置內的上部,設有可朝上下方向移動的移動支撐機構,在移動支撐機構上安裝有第2面材。當第2面材係顯示元件的情況,便將顯示影像該側的表面朝下。當在第2面材的表面設有抗反射層之情況,便將沒有形成抗反射層之側的表面朝下。A moving support mechanism that can move in the vertical direction is provided in an upper portion of the pressure reducing device, and a second surface material is attached to the moving support mechanism. When the second face material is the display element, the surface on the side where the image is displayed faces downward. When the antireflection layer is provided on the surface of the second face material, the surface on the side where the antireflection layer is not formed faces downward.

第2面材係放置於第1面材的上方,且不與樹脂層形成用光硬化性樹脂組成物接觸的位置處。即,使第1面材上的樹脂層形成用光硬化性樹脂組成物、與第2面材不會相接觸地呈相對向。The second surface material is placed above the first surface material and is not in contact with the photocurable resin composition for forming a resin layer. In other words, the photocurable resin composition for forming a resin layer on the first surface material is opposed to the second surface material without coming into contact with each other.

另外,亦可將可於上下方向移動的移動支撐機構設置於減壓裝置內的下部,並在移動支撐機構之上放置已被供應硬化性樹脂組成物的第1面材。此情況,第2面材係安裝於在減壓裝置內的上部所設置之固定支撐盤上,並使第1面材與第2面材呈相對向。Further, a movable support mechanism movable in the vertical direction may be provided in a lower portion of the decompression device, and a first face material to which the curable resin composition is supplied may be placed on the movement support mechanism. In this case, the second face material is attached to the fixed support disk provided on the upper portion of the pressure reducing device, and the first face material and the second face material are opposed to each other.

再者,亦可將第1面材與第2面材二者均由設置於減壓裝置內的上下之移動支撐機構所支撐。Further, both the first face material and the second face material may be supported by the upper and lower movement support mechanisms provided in the pressure reducing device.

將第1面材與第2面材配置於既定位置後,便對減壓裝置的內部施行減壓而形成既定的減壓環境。若可能的話,亦可在減壓操作中、或經形成既定減壓環境之後,便在減壓裝置內使第1面材與第2面材位於既定位置處。After the first face material and the second face material are placed at a predetermined position, the inside of the decompression device is depressurized to form a predetermined reduced pressure environment. If possible, the first face material and the second face material may be placed at a predetermined position in the decompression device during the decompression operation or after the predetermined decompression environment is formed.

在減壓裝置的內部成為既定減壓環境之後,便將由移動支撐機構所支撐的第2面材朝下方移動,俾使第2面材重疊於第1面材上的樹脂層形成用光硬化性樹脂組成物之上。After the inside of the decompression device is a predetermined decompression environment, the second surface material supported by the moving support mechanism is moved downward, and the second surface material is superposed on the first surface material to form a photocurable layer for resin layer formation. Above the resin composition.

藉由使進行重疊,便在由第1面材的表面(以顯示元件而言便為影像顯示之側的表面)、第2面材的表面(以顯示元件而言便為影像顯示之側的表面)、及未硬化密封部所包圍空間內,密封著樹脂層形成用光硬化性樹脂組成物。By superimposing, the surface of the first face material (the surface on the side where the display element is displayed on the display side) and the surface of the second face material (in the case of the display element, the side of the image display side) The photocurable resin composition for forming a resin layer is sealed in the space surrounded by the surface and the unhardened sealing portion.

當進行重疊之際,利用第2面材的自重、來自移動支撐機構的按押等,使樹脂層形成用光硬化性樹脂組成物被推擠擴展,便使前述空間內充滿樹脂層形成用光硬化性樹脂組成物,然後當在步驟(d)中暴露於高壓力環境時,便形成氣泡少或沒有氣泡的樹脂層形成用光硬化性樹脂組成物之層。When the overlap is performed, the resin composition forming photocurable resin composition is pushed and expanded by the self-weight of the second face material, the pressing from the moving support mechanism, and the like, and the space is filled with the resin layer forming light. The curable resin composition is then, when exposed to a high pressure environment in the step (d), a layer of a photocurable resin composition for forming a resin layer having little or no bubbles is formed.

進行重疊時的減壓環境係100Pa以下、較佳係10Pa以上。若減壓環境屬於太過低壓,便會有對樹脂層形成用光硬化性樹脂組成物中所含各成分(諸如硬化性化合物、光聚合起始劑、聚合終止劑、光安定劑等)造成不良影響的可能性。例如若減壓環境屬於太過低壓,則各成分便會有氣化的可能性,且為提供減壓環境會耗費時間。減壓環境的壓力較佳係15~40Pa。The pressure reduction environment at the time of superposition is 100 Pa or less, preferably 10 Pa or more. If the reduced pressure environment is too low pressure, the components contained in the photocurable resin composition for forming a resin layer (such as a curable compound, a photopolymerization initiator, a polymerization terminator, a light stabilizer, etc.) may be caused. The possibility of adverse effects. For example, if the decompression environment is too low pressure, each component may be vaporized, and it takes time to provide a reduced pressure environment. The pressure in the reduced pressure environment is preferably 15 to 40 Pa.

從使第1面材與第2面材相重疊的時點起迄解除減壓環境為止的時間並無特別的限定,可在樹脂層形成用光硬化性樹脂組成物密封後,便馬上解除減壓環境,亦可在樹脂層形成用光硬化性樹脂組成物密封後,將減壓狀態維持既定時間。藉由將減壓狀態維持既定時間,樹脂層形成用光硬化性樹脂組成物便在密閉空間內流動,而使第1面材與第2面材間的間隔呈均勻,即便提高環境壓力仍可輕易地維持密封狀態。維持減壓狀態的時間係可為數小時以上的長時間,就生產效率的觀點,較佳係1小時以內、更佳係10分鐘以內。The time from the time when the first surface material and the second surface material are overlapped with each other is not particularly limited, and the resin layer forming photocurable resin composition can be sealed immediately after being sealed. In the environment, after the resin layer forming photocurable resin composition is sealed, the reduced pressure state can be maintained for a predetermined period of time. By maintaining the reduced pressure state for a predetermined period of time, the resin layer forming photocurable resin composition flows in the sealed space, and the interval between the first face material and the second face material is uniform, even if the environmental pressure is raised. It is easy to maintain a sealed state. The time for maintaining the reduced pressure state may be a long time of several hours or more, and from the viewpoint of production efficiency, it is preferably within 1 hour, more preferably within 10 minutes.

本實施形態的製造方法中,當塗佈黏度高的密封部形成用光硬化性樹脂組成物而形成未硬化密封部的情況,可將由步驟(c)所獲得之層積前驅體的樹脂層形成用光硬化性樹脂組成物厚度設為10μm~3mm的較厚狀態。In the production method of the present embodiment, when a photocurable resin composition for forming a sealing portion having a high viscosity is applied to form an uncured sealing portion, the resin layer of the laminated precursor obtained in the step (c) can be formed. The thickness of the photocurable resin composition is set to a relatively thick state of 10 μm to 3 mm.

[步驟(d)][Step (d)]

在步驟(c)中,經解除減壓環境後,便將層積前驅體放置於環境壓力達50kPa以上的壓力環境下。In the step (c), after the decompression environment is released, the laminated precursor is placed in a pressure environment having an ambient pressure of 50 kPa or more.

若將層積前驅體放置於50kPa以上的壓力環境下,第1面材與第2面材便利用上升的壓力朝相密接的方向被按押,因而若在層積前驅體內的密閉空間中有存在氣泡,樹脂層形成用光硬化性樹脂組成物會流動於氣泡中,便使密閉空間整體由樹脂層形成用光硬化性樹脂組成物均勻地填充。When the laminated precursor is placed in a pressure environment of 50 kPa or more, the first face material and the second face material are conveniently pressed in a direction in which they are in close contact with each other, so that there is a closed space in the laminated precursor body. In the presence of the air bubbles, the resin layer-forming photocurable resin composition flows into the cells, and the entire sealed space is uniformly filled with the resin layer-forming photocurable resin composition.

壓力環境通常係80kPa~120kPa。壓力環境係可為大氣壓環境、亦可為高於此的壓力。就樹脂層形成用光硬化性樹脂組成物的硬化等操作可在不需要特別設備情況下實施的觀點,較佳為大氣壓環境。The pressure environment is usually 80 kPa to 120 kPa. The pressure environment can be an atmospheric pressure environment or a pressure higher than this. The operation of hardening or the like of the photocurable resin composition for forming a resin layer can be carried out without requiring special equipment, and is preferably an atmospheric pressure environment.

從將層積前驅體放置於50kPa以上的壓力環境下之時點起、迄樹脂層形成用光硬化性樹脂組成物開始硬化為止的時間(以下稱「高壓保持時間」)並無特別的限定。當將層積前驅體從減壓裝置中取出並移動至硬化裝置,直到開始硬化為止的製程均在大氣壓環境下進行的情況,此項製程所需要的時間便成為高壓保持時間。所以,當在放置於大氣壓環境下的時點,於層積前驅體的密閉空間內已無存在氣泡的情況,或者在該製程期間內氣泡消失的情況,均可馬上使樹脂層形成用光硬化性樹脂組成物硬化。當直到氣泡消失為止須耗時間的情況,便在截至氣泡消失為止前,均將層積前驅體保持於50kPa以上的壓力環境下。又,因為即便高壓保持時間延長,通常仍不會構成阻礙,因而就製程上的其他必要性,亦可延長高壓保持時間。高壓保持時間係可為1日以上的長時間,但就生產效率的觀點,較佳係6小時以內、更佳係1小時以內,就提高生產效率的觀點,特佳在10分鐘以內。The time from when the laminated precursor is placed in a pressure environment of 50 kPa or more, and the time until the resin layer forming photocurable resin composition starts to harden (hereinafter referred to as "high pressure holding time") is not particularly limited. When the laminated precursor is taken out from the decompression device and moved to the hardening device until the process of starting the hardening is performed under an atmospheric pressure environment, the time required for the process becomes the high pressure holding time. Therefore, when it is placed in an atmospheric pressure environment, there is no bubble in the sealed space of the laminated precursor, or the bubble disappears during the process, and the resin layer can be immediately formed with photocurability. The resin composition is hardened. When it takes time until the bubble disappears, the laminated precursor is maintained in a pressure environment of 50 kPa or more until the bubble disappears. Moreover, even if the high-pressure holding time is prolonged, it usually does not constitute an obstacle, so that the high-pressure holding time can be prolonged in view of other necessity in the process. The high-pressure holding time may be a long time of one day or more, but from the viewpoint of production efficiency, it is preferably within 6 hours, more preferably within 1 hour, and it is particularly preferably within 10 minutes from the viewpoint of improving production efficiency.

接著,以將層積前驅體放置於50kPa以上的壓力環境下之狀態,藉由使樹脂層形成用光硬化性樹脂組成物進行硬化,便形成可將顯示元件與保護板予以接合的樹脂層,可製得顯示裝置。Then, by placing the laminated precursor in a pressure environment of 50 kPa or more, the resin layer forming photocurable resin composition is cured to form a resin layer capable of bonding the display element and the protective sheet. A display device can be produced.

樹脂層形成用光硬化性樹脂組成物及密封部形成用光硬化性樹脂組成物,係照射光而使硬化。例如從光源(諸如紫外線燈、高壓水銀燈、黑燈、化學燈、UV-LED等)照射紫外線或短波長可見光,而使光硬化性樹脂組成物硬化。The photocurable resin composition for forming a resin layer and the photocurable resin composition for forming a sealing portion are cured by irradiation with light. For example, a light source (such as an ultraviolet lamp, a high pressure mercury lamp, a black lamp, a chemical lamp, a UV-LED, or the like) is irradiated with ultraviolet rays or short-wavelength visible light to harden the photocurable resin composition.

再者,此時,由密封部形成用光硬化性樹脂組成物所形成的未硬化密封部,係可與樹脂層形成用光硬化性樹脂組成物的硬化同時進行硬化,亦可在樹脂層形成用光硬化性樹脂組成物進行硬化前便使預先硬化。又,當透明面材其中一部分有形成遮光印刷部,並由遮光印刷部挾持而形成密封部的情況,因為在樹脂層形成用光硬化性樹脂組成物的硬化時所採取之利用通過透明面材之透光部的光使密封部硬化係有困難,因而亦可在樹脂層形成用光硬化性樹脂組成物硬化之後才使密封部硬化。In this case, the uncured seal portion formed of the photocurable resin composition for forming the sealing portion can be cured simultaneously with the curing of the photocurable resin composition for forming the resin layer, or can be formed in the resin layer. The hardening resin composition is pre-hardened before being hardened. In addition, when a part of the transparent surface material is formed with a light-shielding printing portion and is held by the light-shielding printing portion to form a sealing portion, the use of the transparent surface material is performed when the resin layer forming photocurable resin composition is cured. Since the light in the light transmitting portion is difficult to harden the sealing portion, the sealing portion can be cured only after the resin layer forming photocurable resin composition is cured.

例如從層積前驅體的第1面材及第2面材中具有光穿透性之側,對樹脂層形成用光硬化性樹脂組成物施行光照射,且從層積前驅體側邊,對由遮光部及顯示元件所包夾的未硬化密封部及樹脂層形成用光硬化性樹脂組成物,施行光照射。For example, from the side of the first surface material and the second surface material of the laminated precursor having light permeability, the photocurable resin composition for forming a resin layer is irradiated with light, and from the side of the laminated precursor, The uncured seal portion and the resin layer-forming photocurable resin composition which are sandwiched between the light-shielding portion and the display element are irradiated with light.

第1面材及第2面材當中,因為顯示元件在未啟動的狀態下並不具有光穿透性,因而從成為保護板的透明面材之側通過透光部施行光照射。In the first surface material and the second surface material, since the display element does not have light transmittance in a state where it is not activated, light irradiation is performed through the light transmitting portion from the side of the transparent surface material serving as the protective plate.

再者,若在透明面材的周邊部設置遮光印刷部,並在由遮光印刷部與顯示元件所挾持的區域中有存在未硬化密封部或樹脂層形成用光硬化性樹脂組成物,則僅依靠來自透明面材之透光部的光並無法充分硬化。所以,從顯示元件的側邊施行光照射。In addition, when the light-shielding printing portion is provided in the peripheral portion of the transparent surface material, and the uncured sealing portion or the photocurable resin composition for forming the resin layer is present in the region where the light-shielding printing portion and the display element are held, only The light from the light transmitting portion of the transparent face material is not sufficiently hardened. Therefore, light irradiation is performed from the side of the display element.

光較佳係紫外線、或450nm以下的可見光。特別係當在透明面材上設有抗反射層,且抗反射層或已形成抗反射層的透明樹脂薄膜、或者在該抗反射薄膜與透明面材間設有黏著層等紫外線無法穿透的情況,便必須利用可見光進行硬化。The light is preferably ultraviolet light or visible light of 450 nm or less. In particular, when an antireflection layer is provided on the transparent surface material, and the antireflection layer or the transparent resin film on which the antireflection layer has been formed, or an ultraviolet ray such as an adhesive layer between the antireflection film and the transparent surface material is not penetrated. In this case, it is necessary to use visible light for hardening.

從側邊進行光照射的光源,係可使用當採取從透明面材側進行光照射時所使用的光源,但就光源的配置空間、與適用於特定地方的有效率光照射之觀點,較佳係使用紫外線、或發出450nm以下之可見光的LED。A light source used for light irradiation from the side may be a light source used when light is irradiated from the side of the transparent surface material, but it is preferable from the viewpoint of the arrangement space of the light source and the efficient light irradiation applied to a specific place. An LED that emits ultraviolet light or emits visible light of 450 nm or less.

光照射的步驟係可在從透明面材一側施行光照射之後再從側邊施行光照射,亦可相反,或同時施行光照射,為能更加促進遮光印刷部的未硬化密封部與樹脂層形成用光硬化性樹脂組成物的光硬化,較佳係先從側邊施行光照射、或與側邊同時從透明面材側施行光照射。又,當經光照射後經時會進行樹脂層形成用光硬化性樹脂組成物的硬化等情況時、或者光硬化性樹脂組成物的硬化需要時間等情況時,亦可在樹脂層形成用光硬化性樹脂組成物的硬化大致完成後,再利用從側邊的光照射而使密封部硬化。The step of irradiating light may be performed by irradiating light from the side of the transparent surface material, and then irradiating light from the side, or vice versa, or simultaneously performing light irradiation, so as to further promote the uncured seal portion and the resin layer of the light-shielding printing portion. In the photocuring of the photocurable resin composition, it is preferred to perform light irradiation from the side or light irradiation from the side of the transparent surface material simultaneously with the side. In addition, when curing with a photocurable resin composition for forming a resin layer, or when curing of the photocurable resin composition is required, the light for forming a resin layer may be used. After the hardening of the curable resin composition is substantially completed, the sealing portion is cured by irradiation with light from the side.

[具體例][Specific example]

本實施形態的製造方法中,第1面材係可任意使用背面材、或使用表面材。所以,顯示裝置係配合第1面材的選擇,可分別依照以下2種方法進行製造。In the production method of the present embodiment, the first surface material can be arbitrarily used as a back material or a surface material. Therefore, the display device can be manufactured in accordance with the following two methods in accordance with the selection of the first face material.

(α-1)第1面材係使用顯示元件(背面材),第2面材係使用成為保護板的透明面材(表面材)之方法。(α-1) The first surface material is a display element (back surface material), and the second surface material is a method of using a transparent surface material (surface material) which is a protective sheet.

(α-2)第1面材係使用成為保護板的透明面材(表面材),第2面材係使用顯示元件(背面材)的方法。(α-2) The first surface material is a transparent surface material (surface material) serving as a protective sheet, and the second surface material is a method using a display element (back surface material).

以下,以方法(α-1)的情況為例,針對第1圖的顯示裝置之製造方法,使用圖式進行具體說明。Hereinafter, a method of manufacturing the display device of Fig. 1 will be specifically described using a pattern (α-1) as an example.

(步驟(a))(Step (a))

如第3圖與第4圖所示,沿顯示元件50(第1面材)的周緣部,利用分配機(未圖示)等塗佈密封部形成用光硬化性樹脂組成物,而形成未硬化密封部12。As shown in FIG. 3 and FIG. 4, the photocurable resin composition for forming a sealing portion is applied to the peripheral edge portion of the display element 50 (first surface material) by a dispenser (not shown) or the like to form an unformed portion. The sealing portion 12 is hardened.

在顯示元件的外周部設置有傳遞用以使顯示元件啟動之電氣信號的FPC等配線構件。本實施形態的製造方法中,當保持各面材時,就使配線構件的配置較為容易之觀點,最好將顯示元件當作第1面材並配置於下側。A wiring member such as an FPC that transmits an electrical signal for activating the display element is provided on the outer peripheral portion of the display element. In the manufacturing method of the present embodiment, when the surface materials are held, the arrangement of the wiring members is facilitated, and it is preferable that the display elements are disposed as the first surface material and disposed on the lower side.

(步驟(b))(Step (b))

接著,如第5圖及第6圖所示,對由顯示元件50的未硬化密封部12所包圍矩形狀區域13供應樹脂層形成用光硬化性樹脂組成物14。樹脂層形成用光硬化性樹脂組成物14的供應量係預先設定為由未硬化密封部12與顯示元件50及透明面材10(參照第7圖)所密閉的空間,剛好能利用樹脂層形成用光硬化性樹脂組成物14填滿的量。Next, as shown in FIG. 5 and FIG. 6, the resin layer-forming photocurable resin composition 14 is supplied to the rectangular region 13 surrounded by the unhardened sealing portion 12 of the display element 50. The supply amount of the resin layer-forming photocurable resin composition 14 is set in advance to a space sealed by the uncured seal portion 12, the display element 50, and the transparent surface material 10 (see Fig. 7), and can be formed by a resin layer. The amount filled with the photocurable resin composition 14.

樹脂層形成用光硬化性樹脂組成物14的供應係如第5圖及第6圖所示,將顯示元件50平放於下定盤18上,利用在水平方向移動的分配機20,呈線狀、帶狀或點狀供應樹脂層形成用光硬化性樹脂組成物14而實施。As shown in Fig. 5 and Fig. 6, the supply layer of the resin layer-forming photocurable resin composition 14 is such that the display element 50 is laid flat on the lower fixed plate 18, and is linear by the dispenser 20 that moves in the horizontal direction. The strip-shaped or dot-shaped supply resin layer forming photocurable resin composition 14 is used.

分配機20係利用由一對導螺22、及與導螺22呈正交的導螺24所構成之公知水平移動機構,可在區域13的全範圍中進行水平移動。另外,亦可取代分配機20,改為使用模具塗佈機。The dispenser 20 is configured to be horizontally movable over the entire range of the region 13 by a known horizontal movement mechanism including a pair of guide screws 22 and a guide screw 24 orthogonal to the guide screw 22. Alternatively, instead of the dispenser 20, a die coater can be used instead.

(步驟(c))(Step (c))

接著,如第7圖所示,將顯示元件50與透明面材10(第2面材)搬入減壓裝置26內。在減壓裝置26內的上部,配置有具備複數吸附墊32的上定盤30,並在下部設置有下定盤31。上定盤30係利用氣缸34可於上下方向移動。Next, as shown in FIG. 7, the display element 50 and the transparent surface material 10 (the second surface material) are carried into the decompression device 26. An upper platen 30 having a plurality of suction pads 32 is disposed on an upper portion of the pressure reducing device 26, and a lower platen 31 is disposed at a lower portion thereof. The upper plate 30 is movable in the vertical direction by the air cylinder 34.

透明面材10係安裝於吸附墊32上。顯示元件50係將被供應樹脂層形成用光硬化性樹脂組成物14之面朝上,固定於下定盤31之上。The transparent face material 10 is attached to the adsorption pad 32. The display element 50 is fixed to the lower fixed plate 31 with the surface of the resin layer-forming photocurable resin composition 14 facing upward.

接著,利用真空泵28抽吸減壓裝置26內的空氣。減壓裝置26內的環境壓力係在到達例如15~40Pa減壓環境之後,便在將透明面材10利用上定盤30的吸附墊32進行吸附保持的狀態下,朝向下方呈待機的顯示元件50,使氣缸34啟動而下降。然後,使顯示元件50與透明面材10隔著未硬化密封部12相重疊,而構成層積前驅體,並在減壓環境下保持層積前驅體既定時間。Next, the air in the decompression device 26 is sucked by the vacuum pump 28. After the ambient pressure in the decompression device 26 reaches the decompression environment of, for example, 15 to 40 Pa, the transparent surface material 10 is sucked and held by the adsorption pad 32 of the upper platen 30, and the display element is placed toward the lower side. 50, causing the cylinder 34 to start and descend. Then, the display element 50 and the transparent surface material 10 are overlapped with each other via the uncured seal portion 12 to form a laminated precursor, and the laminated precursor is held for a predetermined period of time under a reduced pressure atmosphere.

另外,顯示元件50對下定盤31的安裝位置、吸附墊32的個數、以及透明面材10對上定盤30的安裝位置等,係配合顯示元件50及透明面材10的尺寸、形狀等而適當調整。此時,吸附墊係使用靜電吸盤,藉由採用日本特願2008-206124所附說明書(納入本說明書中)所記載的靜電吸盤保持方法,可將玻璃基板安定地保持於減壓環境下。In addition, the mounting position of the display element 50 to the lower fixed plate 31, the number of the adsorption pads 32, and the mounting position of the transparent surface material 10 to the upper fixed plate 30, etc., match the size and shape of the display element 50 and the transparent surface material 10. And adjust it appropriately. In this case, the electrostatic chuck is used in the adsorption pad, and the glass substrate can be stably maintained in a reduced pressure environment by the electrostatic chuck holding method described in the specification attached to Japanese Patent Application No. 2008-206124 (incorporating this specification).

(步驟(d))(Step (d))

接著,將減壓裝置26的內部形成例如大氣壓之後,便從減壓裝置26取出層積前驅體。若將層積前驅體放置於大氣壓環境下,層積前驅體之顯示元件50側的表面與透明面材10側的表面便利用大氣壓而被按押,而密閉空間內的樹脂層形成用光硬化性樹脂組成物14則被顯示元件50與透明面材10加壓。利用該壓力,密閉空間內的樹脂層形成用光硬化性樹脂組成物14會流動,密閉空間整體便由樹脂層形成用光硬化性樹脂組成物14均勻地填充。Next, after the inside of the decompression device 26 is formed, for example, at atmospheric pressure, the laminated precursor is taken out from the decompression device 26. When the laminated precursor is placed in an atmospheric pressure environment, the surface on the display element 50 side of the laminated precursor and the surface on the side of the transparent surface material 10 are conveniently pressed by atmospheric pressure, and the resin layer in the sealed space is formed by photohardening. The resin composition 14 is pressurized by the display element 50 and the transparent face material 10. By this pressure, the resin layer forming photocurable resin composition 14 in the sealed space flows, and the entire sealed space is uniformly filled with the resin layer forming photocurable resin composition 14.

接著,在透明面材上設置遮光印刷部,當使由遮光印刷部所挾持的未硬化密封部與樹脂層形成用光硬化性樹脂組成物先行硬化時,便如第8圖所示,從層積前驅體的側邊,對由遮光印刷部55及顯示元件50所包夾的未硬化密封部12及樹脂層形成用光硬化性樹脂組成物14,涵蓋顯示元件全周施行光(紫外線、或450nm以下的可見光)照射,且從透明面材10之側,透過透光部56對樹脂層形成用光硬化性樹脂組成物14施行光(紫外線、或450nm以下的可見光)照射,而使層積前驅體內部的未硬化密封部12及樹脂層形成用光硬化性樹脂組成物14進行硬化,便製得顯示裝置1。Then, a light-shielding printing portion is provided on the transparent surface material, and when the uncured seal portion held by the light-shielding portion and the photo-curable resin composition for resin layer formation are cured first, as shown in FIG. The uncured seal portion 12 and the resin layer-forming photocurable resin composition 14 which are sandwiched between the light-shielding portion 55 and the display element 50 are disposed on the side of the precursor, and the display element is exposed to light (ultraviolet rays, or Irradiation of visible light of 450 nm or less and irradiation of light (ultraviolet rays or visible light of 450 nm or less) to the resin layer forming photocurable resin composition 14 through the light transmitting portion 56 from the side of the transparent surface material 10 The display device 1 is obtained by curing the uncured seal portion 12 inside the precursor and the photocurable resin composition 14 for forming a resin layer.

當透明面材上無設置遮光印刷部的情況,便從透明面材10之側涵蓋層積前驅體全面施行光照射,藉由使層積前驅體內部的未硬化密封部12及樹脂層形成用光硬化性樹脂組成物14進行硬化,便製得顯示裝置1。When the light-shielding printing portion is not provided on the transparent surface material, the laminated precursor is entirely irradiated with light from the side of the transparent surface material 10, and the uncured sealing portion 12 and the resin layer are formed in the laminated precursor. The photocurable resin composition 14 is cured to obtain a display device 1.

以上,就方法(α-1)的情況為例,針對本實施形態的顯示裝置之製造方法進行具體說明,而其他方法(α-2)的情況亦同樣的可製造顯示裝置。As described above, the method of manufacturing the display device of the present embodiment will be specifically described as an example of the method (α-1), and the display device can be manufactured in the same manner as in the case of the other method (α-2).

[作用效果:顯示裝置之製造方法][Effects: Manufacturing method of display device]

根據以上所說明本實施形態的顯示裝置之製造方法,可在樹脂層中不會產生氣泡的情況下,製造大面積的顯示裝置。假設即便在減壓下已密封的樹脂層形成用光硬化性樹脂組成物中有氣泡殘存,對硬化前在高壓力環境下已密封的樹脂層形成用光硬化性樹脂組成物施加該壓力,便可減少該氣泡的體積,俾使氣泡容易消失。例如在100Pa下已密封的樹脂層形成用光硬化性樹脂組成物中,氣泡中的氣體體積可認為係在100kPa下的1/1000。因為氣體亦會溶解於樹脂層形成用光硬化性樹脂組成物中,因而微小體積氣泡中的氣體會迅速溶解於樹脂層形成用光硬化性樹脂組成物中並消失。According to the method of manufacturing the display device of the present embodiment described above, it is possible to manufacture a display device having a large area without generating bubbles in the resin layer. It is assumed that even if bubbles remain in the photocurable resin composition for forming a resin layer which has been sealed under reduced pressure, the pressure is applied to the photocurable resin composition for forming a resin layer which is sealed under a high pressure environment before curing. The volume of the bubble can be reduced, and the bubble can be easily eliminated. For example, in a photocurable resin composition for forming a resin layer which is sealed at 100 Pa, the volume of gas in the bubble can be considered to be 1/1000 at 100 kPa. Since the gas is dissolved in the photocurable resin composition for forming a resin layer, the gas in the fine volume bubbles is quickly dissolved in the resin layer-forming photocurable resin composition and disappears.

再者,因為即便對密封後的樹脂層形成用光硬化性樹脂組成物施加大氣壓等壓力,液狀樹脂層形成用光硬化性樹脂組成物仍屬於流動性的組成物,因而該壓力係均勻分佈在顯示元件的表面上,不會對接觸到樹脂層形成用光硬化性樹脂組成物的顯示元件表面一部分施加在此以上的應力,對顯示元件造成損傷的威脅低。In addition, even if a pressure such as an atmospheric pressure is applied to the resin layer forming photocurable resin composition after sealing, the liquid resin composition for forming a liquid resin layer is still a fluid composition, and thus the pressure system is uniformly distributed. On the surface of the display element, stress applied to a part of the surface of the display element which is in contact with the photocurable resin composition for forming a resin layer is not applied, and the risk of damage to the display element is low.

再者,由樹脂層形成用光硬化性樹脂組成物的硬化所形成之樹脂層、與顯示元件、透明面材間之界面接著力,高於利用熱熔接所產生的界面接著力。且,對流動性樹脂層形成用光硬化性樹脂組成物加壓而密接於顯示元件、透明面材的表面上,並使在此狀態下硬化,因而可獲得更高的界面接著力,且可獲得對顯示元件、透明面材的表面呈均勻的接著,界面接著力局部性降低的情況很少。In addition, the interfacial adhesion force between the resin layer formed by curing the resin layer-forming photocurable resin composition and the display element and the transparent surface material is higher than the interfacial adhesion force by thermal fusion bonding. In addition, the photocurable resin layer-forming photocurable resin composition is pressed and adhered to the surface of the display element or the transparent surface material, and is cured in this state, whereby a higher interfacial adhesion force can be obtained. It is found that the surface of the display element and the transparent face material is uniform, and the locality of the interface is less likely to decrease.

所以,在樹脂層的表面發生剝離的可能性低,且從界面接著力不足的部分滲入水分、腐蝕性氣體的可能性亦較低。Therefore, there is a low possibility that peeling occurs on the surface of the resin layer, and there is a low possibility that water or corrosive gas is infiltrated from a portion where the interface adhesion is insufficient.

再者,相較於在2片面材間的狹窄且寬廣面積空間中注入流動性樹脂層形成用光硬化性樹脂組成物的方法(注入法),氣泡的產生少,且可在短時間內便填充樹脂層形成用光硬化性樹脂組成物。且,樹脂層形成用光硬化性樹脂組成物的黏度限制少,可輕易地填充高黏度的樹脂層形成用光硬化性樹脂組成物。所以,可使用含有可提高樹脂層強度之較高分子量硬化性化合物的高黏度樹脂層形成用光硬化性樹脂組成物。In addition, a method of injecting a photocurable resin composition for forming a fluid resin layer into a narrow and wide area space between two sheets (injection method) causes less generation of bubbles and can be produced in a short time. A photocurable resin composition for forming a resin layer is filled. In addition, the photocurable resin composition for forming a resin layer has a small viscosity limitation, and can easily fill a high-viscosity photocurable resin composition for forming a resin layer. Therefore, a photocurable resin composition for forming a high-viscosity resin layer containing a higher molecular weight curable compound which can increase the strength of the resin layer can be used.

再者,樹脂層形成用光硬化性樹脂組成物的光聚合起始劑(C2),係使用所具有的吸收波長區域(λ2)較未硬化密封部的光聚合起始劑(C1)之吸收波長區域(λ1)更靠長波長側存在的光聚合起始劑(C2),且從層積前驅體的側邊所照射之光,係使用吸收波長區域(λ1)內的波長光與吸收波長區域(λ2)內的波長光二者,藉此,便可使不會被未硬化密封部的光聚合起始劑(C1)所吸收之吸收波長區域(λ2)內的波長光,充分到達由遮光部中顯示元件所包夾的樹脂層形成用光硬化性樹脂組成物,利用具有吸收波長區域(λ2)的光聚合起始劑(C2),便可充分地執行樹脂層形成用光硬化性樹脂組成物的硬化。In addition, the photopolymerization initiator (C2) of the photocurable resin composition for forming a resin layer is absorbed by the photopolymerization initiator (C1) having an absorption wavelength region (λ2) and an uncured seal portion. The wavelength region (λ1) is further on the long wavelength side of the photopolymerization initiator (C2), and the light irradiated from the side of the layered precursor uses the wavelength light and the absorption wavelength in the absorption wavelength region (λ1). Both of the wavelength light in the region (λ2) can sufficiently achieve the wavelength light in the absorption wavelength region (λ2) which is not absorbed by the photopolymerization initiator (C1) of the uncured seal portion. In the photo-curable resin composition for forming a resin layer which is sandwiched between the display elements, the photo-polymerization initiator (C2) having the absorption wavelength region (λ2) can sufficiently perform the photocurable resin for resin layer formation. Hardening of the composition.

[作用效果:硬化性樹脂組成物][effect: hardening resin composition]

顯示元件與透明面材(保護板)間之接合,藉由降低硬化性樹脂硬化時的收縮率、或降低硬化後的樹脂層彈性模數,便可降低及於顯示元件的應力,而有效地防止顯示斑等會損及顯示品質的情況發生。另一方面,若樹脂層的彈性模數過低,便會有因該樹脂層的彈性變形,而導致發生顯示元件與透明面材出現位置偏移的可能性。且,根據本發明者等的發現,即便樹脂層的彈性模數充分高,當將顯示裝置呈垂直配置使用等情況,若顯示元件的自重長時間施加於樹脂層,樹脂層便會經時的產生塑性變形,有導致顯示元件的接合位置精度降低之可能性。The bonding between the display element and the transparent surface material (protective plate) can reduce the stress on the display element by reducing the shrinkage rate during curing of the curable resin or reducing the elastic modulus of the resin layer after curing. Prevent the display of spots and the like from damaging the display quality. On the other hand, if the elastic modulus of the resin layer is too low, there is a possibility that the display element and the transparent surface material are displaced due to the elastic deformation of the resin layer. Further, according to the findings of the inventors of the present invention, even if the elastic modulus of the resin layer is sufficiently high, when the display device is placed vertically or the like, if the self-weight of the display element is applied to the resin layer for a long time, the resin layer will pass through. Plastic deformation occurs, which may cause a decrease in the accuracy of the joint position of the display element.

相對於此,本發明的硬化性樹脂組成物係將硬化後動態黏彈性測定時的儲存剪切彈性模數設為5×102~1×105Pa,且將損失正切設為1.4以下,藉此便可防止因樹脂層的彈性變形而造成面材彼此間(顯示元件與保護板)的位置偏移,並可降低因樹脂層的硬化收縮而產生的應力,且可有效地防止因樹脂層經時的塑性變形,而造成面材彼此間(顯示元件與保護板)的位置偏移情形。On the other hand, in the curable resin composition of the present invention, the storage shear elastic modulus at the time of dynamic viscoelasticity measurement after hardening is 5×10 2 to 1×10 5 Pa, and the loss tangent is 1.4 or less. Thereby, the positional deviation of the face materials from each other (the display element and the protective plate) due to the elastic deformation of the resin layer can be prevented, the stress generated by the hardening shrinkage of the resin layer can be reduced, and the resin can be effectively prevented. The plastic deformation of the layer is caused by the positional displacement of the face materials between the display elements and the protective plate.

特別係當顯示元件為液晶顯示元件,甚至是IPS(In-plane Switching,平面扭轉)式液晶顯示元件、或於顯示面上經貼合視角改善的光學膜之TN(Twisted Nematic)式液晶顯示元件的情況,因為對顯示元件所施加的應力容易對顯示品質造成不良影響,因而接合樹脂層最好係屬於低彈性模數。In particular, the display element is a liquid crystal display element, or even an IPS (In-plane Switching) liquid crystal display element, or a TN (Twisted Nematic) liquid crystal display element having an optical film whose viewing angle is improved on the display surface. In the case where the stress applied to the display element is liable to adversely affect the display quality, the bonding resin layer is preferably a low modulus of elasticity.

所以,使用本發明硬化性樹脂組成物的顯示裝置,顯示元件較佳係液晶顯示元件,更佳係IPS式液晶顯示元件、或TN式液晶顯示元件。Therefore, in the display device using the curable resin composition of the present invention, the display element is preferably a liquid crystal display element, more preferably an IPS type liquid crystal display element or a TN type liquid crystal display element.

再者,若使樹脂層形成用光硬化性樹脂組成物中所含有的在硬化時不會與硬化性化合物(II)進行硬化反應的非硬化性成分,係每1分子具有0.8~3個羥基的非硬化性寡聚物,且使硬化性化合物(II)中存在有硬化時不會產生反應的羥基,便可抑制硬化後的樹脂層損失正切(tanδ)上升,並可降低儲存剪切彈性模數,且使未硬化時的樹脂層形成用光硬化性樹脂組成物安定性呈良好,能降低黏性,亦可獲得硬化時的硬化反應均勻性。In addition, the non-curable component which does not undergo a curing reaction with the curable compound (II) at the time of curing, which is contained in the photocurable resin composition for forming a resin layer, has 0.8 to 3 hydroxyl groups per molecule. The non-hardening oligomer and the hydroxyl group which does not react when hardened in the curable compound (II) can suppress the loss of the tangent (tan δ) of the resin layer after hardening, and can reduce the storage shear elasticity. The modulus of the photocurable resin composition for forming a resin layer when uncured is good, and the viscosity can be lowered, and the uniformity of the curing reaction at the time of curing can be obtained.

若未硬化時的安定性呈良好,且硬化時的硬化反應均勻性呈良好,便可輕易地獲得透明性良好的樹脂層。若未硬化時的樹脂層形成用光硬化性樹脂組成物黏性低,便可輕易地充分抑制氣泡的發生,俾可輕易地獲得面材與樹脂層間之良好界面接合力。When the stability at the time of hardening is good and the uniformity of the hardening reaction at the time of hardening is good, a resin layer having good transparency can be easily obtained. When the photocurable resin composition for forming a resin layer which is not cured is low in viscosity, the occurrence of bubbles can be easily suppressed, and a good interfacial bonding force between the face material and the resin layer can be easily obtained.

另外,本發明的硬化性樹脂組成物並不僅侷限使用於顯示裝置,亦可適用於一對面材隔著樹脂層進行層積的層積體,可獲得同樣的效果。Further, the curable resin composition of the present invention can be applied not only to a display device but also to a laminate in which a pair of face materials are laminated via a resin layer, and the same effect can be obtained.

再者,本發明的硬化性樹脂組成物係可為熱硬化性的樹脂組成物,此情況,硬化性化合物的硬化性基係使用公知的熱硬化性基。又,視需要使之含有公知的熱聚合起始劑。上述實施形態中,當樹脂層形成用硬化性樹脂組成物係屬於熱硬化性的情況,最好亦使密封部形成用硬化性樹脂組成物為熱硬化性。In addition, the curable resin composition of the present invention may be a thermosetting resin composition. In this case, a known thermosetting group is used as the curable group of the curable compound. Further, it is required to contain a known thermal polymerization initiator. In the above embodiment, when the curable resin composition for forming a resin layer is thermosetting, it is preferable that the curable resin composition for forming a sealing portion is thermosetting.

特別係因為光硬化性的樹脂組成物在硬化時並不需要高溫,因而就因高溫而對面材等造成不良影響的威脅較少之觀點,係屬較佳。In particular, since the photocurable resin composition does not require a high temperature at the time of curing, it is preferable from the viewpoint that the high temperature causes less adverse effects on the face material or the like.

併用光聚合起始劑與熱聚合起始劑等情況,可同時施行光硬化與熱硬化,或者亦可個別進行來提高硬化性。In the case of using a photopolymerization initiator and a thermal polymerization initiator, photocuring and thermal curing may be simultaneously performed, or the curing may be performed individually to improve the curability.

再者,使用本發明硬化性樹脂組成物製造層積體的方法,並不僅侷限於上述實施形態的方法,亦可適當使用公知方法。In addition, the method of producing a laminate using the curable resin composition of the present invention is not limited to the method of the above embodiment, and a known method can be suitably used.

[實施例][Examples]

以下,例示為確認本發明有效性而實施的例子。例1~4、8及9係實施例,例5~7係比較例。Hereinafter, an example which is implemented to confirm the effectiveness of the present invention is exemplified. Examples 1 to 4, 8 and 9 are examples, and examples 5 to 7 are comparative examples.

(儲存剪切彈性模數、及其損失正切的測定方法)(Measurement method for storing shear modulus and its loss tangent)

硬化後的樹脂層之儲存剪切彈性模數及其損失正切(tanδ),係使用流變儀(Anton Paar公司製,Physica MCR301),將未硬化的樹脂層形成用光硬化性樹脂組成物,夾持於鈉鈣玻璃製平台與測定用心軸(Anton Paar公司製,D-PP20/AL/S07)間的0.4mm間隙中,於氮環境下,於35℃下,一邊利用在平台下部所設置的黑燈(日本電氣公司製,FL15BL)照射30分鐘的2mW/cm2光一邊施加1%的動態剪切應力,而使樹脂層形成用光硬化性樹脂組成物硬化並進行測定。樹脂層形成用光硬化性樹脂組成物硬化時,係依心軸的法線方向不會產生應力的方式,令心軸的位置自動追蹤調整。The storage shear elastic modulus and the loss tangent (tan δ) of the resin layer after hardening, using a rheometer (Physica MCR301, manufactured by Anton Paar Co., Ltd.), and a photocurable resin composition for forming an uncured resin layer, It is placed in a 0.4 mm gap between the platform made of soda lime glass and the measuring mandrel (D-PP20/AL/S07, manufactured by Anton Paar Co., Ltd.), and is set at the lower part of the platform at 35 ° C in a nitrogen atmosphere. The black lamp (FL15BL, manufactured by Nippon Electric Co., Ltd.) was subjected to a dynamic shear stress of 1 mW/cm 2 for 30 minutes, and the photocurable resin composition for forming a resin layer was cured and measured. When the resin layer forming photocurable resin composition is cured, the position of the mandrel is automatically tracked and adjusted so that stress does not occur in the normal direction of the mandrel.

照射強度係使用照度計(USHIO電機公司製,紫外線強度計UNI METER UIT-101),在有放置樹脂層形成用光硬化性樹脂組成物的平台上進行測定。The irradiation intensity was measured on a platform on which a photocurable resin composition for forming a resin layer was placed, using an illuminometer (manufactured by USHIO Electric Co., Ltd., UV intensity meter UNI METER UIT-101).

(數量平均分子量)(quantitative average molecular weight)

寡聚物的數量平均分子量係使用GPC裝置(TOSOH公司製,HLC-8020)進行求取。The number average molecular weight of the oligomer was determined by using a GPC apparatus (HLC-8020, manufactured by TOSOH Co., Ltd.).

(黏度)(viscosity)

光硬化性樹脂組成物的黏度係利用E型黏度計(東機產業公司製,RE-85U)進行測定。The viscosity of the photocurable resin composition was measured by an E-type viscometer (manufactured by Toki Sangyo Co., Ltd., RE-85U).

(霧值)(haze value)

霧值係使用東洋精機製作所公司製的Haze-Gard II,根據ASTM D1003進行測定而求得。The haze value was determined by using Haze-Gard II manufactured by Toyo Seiki Seisakusho Co., Ltd., and measuring according to ASTM D1003.

[例1][example 1] (顯示元件)(display component)

從市售17吋液晶監視器(Acer公司製,V137b)中取出液晶顯示元件。液晶顯示元件係顯示模式為TN(Twisted Nematic,扭轉向列)式,顯示部的大小為長338mm、寬270mm。在液晶顯示元件的雙面上貼合偏光板,於長邊的單側接合著6片驅動用FPC且在短邊的單側接合著3片驅動用FPC,在長邊側的FPC端部接合著印刷電路板。將該液晶顯示元件設為「顯示元件A」。The liquid crystal display element was taken out from a commercially available 17-inch liquid crystal monitor (V137b, manufactured by Acer Co., Ltd.). The display mode of the liquid crystal display device is TN (Twisted Nematic), and the size of the display portion is 338 mm long and 270 mm wide. A polarizing plate is bonded to both surfaces of the liquid crystal display element, and six FPCs for driving are bonded to one side of the long side, and three FPCs for driving are joined to one side of the short side, and the FPC end is joined to the long side. Printed circuit board. This liquid crystal display element is referred to as "display element A".

(玻璃板)(glass plate)

在長355mm、寬290mm、厚度2.8mm的鈉鈣玻璃其中一表面之周緣部,依透光部成為長340mm、寬272mm的方式,利用含有黑色顏料的陶瓷印刷形成畫框狀遮光印刷部,便製得成為保護板的玻璃板B。In the peripheral portion of one of the surface of the soda-lime glass having a length of 355 mm, a width of 290 mm, and a thickness of 2.8 mm, the light-transmitting portion is formed into a frame-shaped light-shielding printing portion by ceramic printing containing a black pigment so as to have a length of 340 mm and a width of 272 mm. A glass plate B to be a protective sheet is produced.

(密封部形成用光硬化性樹脂組成物)(Photocurable resin composition for sealing portion formation)

將分子末端經加成環氧乙烷且1分子中具有2個羥基的雙官能基聚丙二醇(由羥值所計算出的數量平均分子量:4000,聚丙二醇分子中的環氧乙烷含量24質量%)、與六亞甲基二異氰酸酯,依成為6比7的莫耳比進行混合,接著利用丙烯酸異酯(大阪有機化學工業公司製,IBXA)進行稀釋後,在錫化合物的觸媒存在下,依70℃進行反應而獲得預聚物,在該預聚物中將丙烯酸-2-羥乙酯依大致成為1比2的莫耳比添加,並添加2,5-二第三丁基氫醌(聚合終止劑)0.03質量份,於70℃下進行反應,藉此便獲得經以30質量%丙烯酸異酯稀釋過的胺甲酸酯丙烯酸酯寡聚物(以下稱「UC-1」)溶液。UC-1的硬化性基數係2,數量平均分子量約55000。UC-1溶液在60℃下的黏度約580Pa‧s。A difunctional polypropylene glycol having a molecular end added to ethylene oxide and having 2 hydroxyl groups in one molecule (number average molecular weight calculated from hydroxyl value: 4000, ethylene oxide content in polypropylene glycol molecule 24 mass) %), mixed with hexamethylene diisocyanate according to a molar ratio of 6 to 7, followed by acrylic acid The ester (IBXA, manufactured by Osaka Organic Chemical Industry Co., Ltd.) is diluted, and a prepolymer is obtained by reacting at 70 ° C in the presence of a catalyst of a tin compound, and 2-hydroxyethyl acrylate is used in the prepolymer. A molar ratio of 1 to 2 was added, and 0.03 parts by mass of 2,5-di-t-butylhydroquinone (polymerization terminator) was added, and the reaction was carried out at 70 ° C, whereby 30% by mass of acrylic acid was obtained. different A solution of an ester-diluted urethane acrylate oligomer (hereinafter referred to as "UC-1"). The hardening base of UC-1 is 2, and the number average molecular weight is about 55,000. The viscosity of the UC-1 solution at 60 ° C is about 580 Pa‧s.

將UC-1溶液90質量份、及甲基丙烯酸-2-羥丁酯(共榮社化學公司製,LIGHT ESTER HOB)10質量份均勻混合而獲得混合物。將該混合物100質量份、1-羥基-環己基-苯基-酮(光聚合起始劑,汽巴超級化學公司製,IRGACURE 184)3質量份均勻混合,便獲得密封部形成用光硬化性樹脂組成物C。90 parts by mass of UC-1 solution and 2-hydroxybutyl methacrylate (LIGHT ESTER, manufactured by Kyoeisha Chemical Co., Ltd.) HOB) 10 parts by mass was uniformly mixed to obtain a mixture. 100 parts by mass of this mixture and 3 parts by mass of 1-hydroxy-cyclohexyl-phenyl-ketone (photopolymerization initiator, manufactured by Ciba Super Chemical Co., Ltd., IRGACURE 184) were uniformly mixed to obtain photocurability for forming a sealing portion. Resin composition C.

在將密封部形成用光硬化性樹脂組成物C放入容器的狀態下,依開放狀態設置於減壓裝置內,將減壓裝置內減壓至約20Pa並保持10分鐘,藉此施行脫泡處理。經測定密封部形成用光硬化性樹脂組成物C在25℃下的黏度,結果約1300Pa‧s。In a state in which the photocurable resin composition C for sealing portion formation is placed in a container, it is placed in a decompression device in an open state, and the pressure in the decompression device is reduced to about 20 Pa for 10 minutes, thereby performing defoaming. deal with. The viscosity of the photocurable resin composition C for sealing portion formation at 25 ° C was measured, and it was about 1300 Pa s.

(樹脂層形成用光硬化性樹脂組成物)(Photocurable resin composition for resin layer formation)

將在分子末端經加成環氧乙烷且1分子中具有2個羥基的雙官能基聚丙二醇(由羥值所計算出的數量平均分子量:4000,聚丙二醇分子中的環氧乙烷含量24質量%)、與異佛爾酮二異氰酸酯,依成為4比5莫耳比進行混合,在錫化合物的觸媒存在下,依70℃進行反應而獲得預聚物,在該預聚物中將丙烯酸-2-羥乙酯依大致成為1比2的莫耳比添加,並添加2,5-二第三丁基氫醌(聚合終止劑)0.03質量份,於70℃下進行反應,藉此便獲得胺甲酸酯丙烯酸酯寡聚物(以下稱「UA-2」)。UA-2的硬化性基數係2,數量平均分子量約24000,25℃下的黏度約830Pa‧s。A difunctional polypropylene glycol having ethylene oxide added to the end of the molecule and having 2 hydroxyl groups in one molecule (number average molecular weight calculated from hydroxyl value: 4000, ethylene oxide content in polypropylene glycol molecule 24) % by mass, mixed with isophorone diisocyanate in a ratio of 4 to 5 molar ratio, and reacted at 70 ° C in the presence of a catalyst of a tin compound to obtain a prepolymer in which the prepolymer is obtained. 2-hydroxyethyl acrylate was added to a molar ratio of 1 to 2, and 0.03 parts by mass of 2,5-di-t-butylhydroquinone (polymerization terminator) was added, and the reaction was carried out at 70 ° C. A urethane acrylate oligomer (hereinafter referred to as "UA-2") was obtained. The hardening base of UA-2 is 2, the number average molecular weight is about 24,000, and the viscosity at 25 ° C is about 830 Pa‧s.

將UA-2計40質量份、甲基丙烯酸-2-羥丁酯(共榮社化學公司製,LIGHT ESTER HOB)30質量份、以及甲基丙烯酸正十二烷基酯30質量份均勻混合,在該混合物100質量份中,均勻溶解雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦(光聚合起始劑,汽巴超級化學公司製,IRGACURE 819) 0.5質量份、及正十二烷基硫醇(鏈轉移劑,花王公司製,THIOKALCHOL 20) 0.5質量份,便獲得光硬化性樹脂組成物PD。40 parts by mass of UA-2, 2-hydroxybutyl methacrylate (made by Kyoeisha Chemical Co., Ltd., LIGHT ESTER) 30 parts by mass of HOB) and 30 parts by mass of n-dodecyl methacrylate are uniformly mixed, and bis(2,4,6-trimethylbenzylidene)-benzene is uniformly dissolved in 100 parts by mass of the mixture. Phosphine oxide (photopolymerization initiator, manufactured by Ciba Super Chemical Co., Ltd., IRGACURE 819) 0.5 parts by mass, and n-dodecyl mercaptan (chain transfer agent, manufactured by Kao Corporation, THIOKALCHOL 20) 0.5 parts by mass, a photocurable resin composition PD was obtained.

其次,使PD計60質量份、與UA-2合成時所使用者相同之分子末端經環氧乙烷改質且1分子中具有2個羥基的雙官能基聚丙二醇(由羥值所計算出的數量平均分子量:4000,聚丙二醇分子中的環氧乙烷含量24質量%) 40質量份均勻溶解,而獲得樹脂層形成用光硬化性樹脂組成物D。Next, 60 parts by mass of the PD meter, which is the same as the user of the UA-2 synthesis, is modified with ethylene oxide and has two hydroxyl groups in one molecule (calculated from the hydroxyl value). The number average molecular weight: 4000, the ethylene oxide content in the polypropylene glycol molecule is 24% by mass) 40 parts by mass is uniformly dissolved, and the photocurable resin composition D for forming a resin layer is obtained.

在將樹脂層形成用光硬化性樹脂組成物D放入容器的狀態下,依開放狀態設置於減壓裝置內,將減壓裝置內減壓至約20Pa並保持10分鐘,藉此施行脫泡處理。經測定樹脂層形成用光硬化性樹脂組成物D在25℃下的黏度,結果為1.7Pa‧s。In the state where the resin layer-forming photocurable resin composition D is placed in a container, it is placed in a decompression device in an open state, and the inside of the decompression device is decompressed to about 20 Pa for 10 minutes, thereby performing defoaming. deal with. The viscosity of the photocurable resin composition D for forming a resin layer at 25 ° C was measured and found to be 1.7 Pa s.

另外,樹脂層形成用光硬化性樹脂組成物D所使用的光聚合起始劑(前述IRGACURE 819),係在較密封部形成用光硬化性樹脂組成物C所使用光聚合起始劑(前述IRGACURE 184)的吸收波長區域(約380nm以下),更靠長波長側亦具有吸收波長區域(約440nm以下)。In addition, the photopolymerization initiator (the IRGACURE 819) used for the resin layer-forming photocurable resin composition D is a photopolymerization initiator which is used for the photocurable resin composition C for sealing portion formation (the aforementioned IRGACURE 184) has an absorption wavelength region (about 380 nm or less) and an absorption wavelength region (about 440 nm or less) on the longer wavelength side.

接著,使用流變儀,測定樹脂層形成用光硬化性樹脂組成物D光硬化後的黏彈性特性,結果儲存剪切彈性模數係1.0×104Pa、其損失正切(tanδ)係0.83。Then, the viscoelastic property of the photocurable resin composition D for resin layer formation after photohardening was measured by a rheometer, and the storage shear modulus was 1.0 × 10 4 Pa, and the loss tangent (tan δ) was 0.83.

(步驟(a))(Step (a))

涵蓋顯示元件A的影像顯示區域外側約4mm位置全周,依成為寬約1mm、塗佈厚度約0.6mm的方式,利用分配機塗佈密封部形成用光硬化性樹脂組成物C,而形成未硬化的密封部。The photocurable resin composition C for sealing portion formation is applied by a dispenser to cover the entire circumference of the image display area of the display element A at a position of about 4 mm, and the coating thickness is about 0.6 mm. Hardened seal.

(步驟(b))(Step (b))

在顯示元件A的影像顯示區域外周所塗佈未硬化密封部的內側區域,使用分配機依總質量成為38g的方式,朝複數地方供應樹脂層形成用光硬化性樹脂組成物D。The resin layer-forming photocurable resin composition D was supplied to a plurality of places in a plurality of places in the inner region of the image display region of the display element A.

在供應樹脂層形成用光硬化性樹脂組成物D的期間中,維持著未硬化密封部的形狀。While the resin layer forming photocurable resin composition D is being supplied, the shape of the unhardened sealing portion is maintained.

(步驟(c))(Step (c))

在設有一對定盤的升降裝置之減壓裝置內,於下定盤的上面,將顯示元件A依樹脂層形成用光硬化性樹脂組成物D之面朝上的方式平放。In the pressure reducing device provided with a pair of fixed lifting devices, the display element A is laid flat on the upper surface of the lower fixed plate in such a manner that the surface of the resin layer forming photocurable resin composition D faces upward.

將玻璃板B依有形成遮光印刷部之一側的表面相對向於顯示元件A的方式,在減壓裝置內的升降裝置之上定盤下面,使用靜電吸盤,依從上面觀看時,玻璃板B沒有設置遮光印刷部的透光部、與顯示元件A的影像顯示區域具有約1mm邊限而位於相同位置且在垂直方向上與顯示元件A間的距離為30mm之方式予以保持。The glass plate B is placed on the lower side of the lifting device in the decompression device so that the surface on one side of the light-shielding printing portion faces the display element A, and the glass plate B is used when viewed from above. The light-transmitting portion where the light-shielding portion is not provided is held in such a manner that the image display region of the display element A has a margin of about 1 mm and is located at the same position and a distance from the display element A in the vertical direction is 30 mm.

將減壓裝置形成密封狀態並施行排氣直到減壓裝置內的壓力成為約10Pa為止。利用減壓裝置內的升降裝置使上下定盤相靠近,再將顯示元件A與玻璃板B隔著樹脂層形成用光硬化性樹脂組成物D,依2kPa壓力施行壓接,並保持1分鐘。將靜電吸盤去電而使玻璃板B離開上定盤,並依約15秒使減壓裝置內返回於大氣壓,便獲得由顯示元件A、玻璃板B及未硬化密封部,將樹脂層形成用光硬化性樹脂組成物D予以密封的層積前驅體E。The decompression device was sealed and evacuated until the pressure in the decompression device became about 10 Pa. The upper and lower fixed plates were brought close to each other by the elevating device in the decompression device, and the display element A and the glass plate B were laminated with the resin layer forming photocurable resin composition D, and pressure-bonded at a pressure of 2 kPa, and held for 1 minute. The electrostatic chuck is deenergized, the glass plate B is separated from the upper plate, and the inside of the decompression device is returned to atmospheric pressure in about 15 seconds, thereby obtaining the resin layer by the display element A, the glass plate B, and the uncured seal portion. The laminated precursor E in which the photocurable resin composition D is sealed.

層積前驅體E中,未硬化密封部的形狀係大致維持初期狀態。In the laminated precursor E, the shape of the uncured seal portion is substantially maintained in an initial state.

(步驟(d))(Step (d))

對在層積前驅體E的顯示元件A周緣部所設置之未硬化密封部(密封部形成用光硬化性樹脂組成物C),從顯示元件A的側邊,使用紫外線LED呈線狀配置的紫外線光源(Spectrum Illumination公司製,LL146-395),涵蓋未硬化密封部的全周施行光照射約10分鐘,而使密封部硬化。照射光的強度經使用照度計(ORC製作所公司製,UV-M02,受光器UV-42)進行測定,結果約1mW/cm2。使密封硬化後,便將層積前驅體E呈水平保持靜置約10分鐘。The uncured seal portion (the photocurable resin composition C for sealing portion formation) provided on the peripheral edge portion of the display element A of the laminated precursor E is arranged linearly from the side of the display element A using the ultraviolet light LED. An ultraviolet light source (manufactured by Spectrum Illumination Co., Ltd., LL146-395), which irradiated the entire portion of the unhardened seal portion with light for about 10 minutes, hardened the seal portion. The intensity of the irradiation light was measured by using an illuminometer (UV-M02, light receiver UV-42, manufactured by ORC Co., Ltd.), and the result was about 1 mW/cm 2 . After the seal was hardened, the laminated precursor E was left to stand horizontally for about 10 minutes.

從層積前驅體E靠玻璃板B側之一面,均勻照射來自黑燈的紫外線及450nm以下的可見光30分鐘,而使樹脂層形成用光硬化性樹脂組成物D硬化,藉此形成樹脂層而獲得顯示裝置F。顯示裝置F係儘管不需要習知利用注入法進行製造時所需要的氣泡去除之步驟,仍未發現到樹脂層中有殘留氣泡等缺陷。又,亦未發現到有從密封部出現樹脂層形成用光硬化性樹脂組成物洩漏等缺陷。又,樹脂層的厚度成為目標厚度(約0.4mm)。From the laminated precursor E to one side of the glass plate B side, the ultraviolet light from the black lamp and the visible light of 450 nm or less are uniformly irradiated for 30 minutes, and the resin layer forming photocurable resin composition D is cured to form a resin layer. The display device F is obtained. The display device F has no defects such as residual bubbles in the resin layer, although it is not necessary to carry out the step of removing the bubbles required for the production by the injection method. Further, there has been no defect such as leakage of the photocurable resin composition for forming a resin layer from the sealing portion. Further, the thickness of the resin layer became a target thickness (about 0.4 mm).

取代顯示元件A,改為使用大致相同尺寸的玻璃板,同樣地製作透明層積體,經測定沒有印刷遮光部之部分處的霧值,結果在1%以下,屬於透明度高的良好物。In place of the display element A, a glass plate having substantially the same size was used instead, and a transparent laminate was produced in the same manner. The haze value at the portion where the light-shielding portion was not printed was measured, and as a result, it was 1% or less, which was a good transparency.

將顯示裝置F送返被取出液晶顯示元件的液晶監視器之框體中,再度連接配線後,以接合於玻璃板B的顯示元件A成為垂直之方式設置液晶監視器。經靜置5日後,切入電源,獲得涵蓋顯示畫面全面均呈均質的良好顯示影像,且顯示對比高於當初狀態。即使手指頭強力按押影像顯示面,影像仍不會凌亂,玻璃板B有效地保護著顯示元件A。The display device F is returned to the casing of the liquid crystal monitor from which the liquid crystal display element is taken out, and after the wiring is connected again, the liquid crystal monitor is placed so that the display element A bonded to the glass plate B is vertical. After standing for 5 days, cut into the power supply to obtain a good display image covering the display screen in a uniform manner, and the display contrast is higher than the original state. Even if the finger is strongly pressed against the image display surface, the image is not disturbed, and the glass plate B effectively protects the display element A.

接著,同樣的設置顯示裝置F,經1個月後確認顯示元件的接合位置,並無發現位置偏移等情形,良好地保持於玻璃板。Next, the display device F was placed in the same manner, and after one month, the bonding position of the display element was confirmed, and no positional deviation was observed, and the glass plate was favorably held.

[例2][Example 2] (樹脂層形成用光硬化性樹脂組成物)(Photocurable resin composition for resin layer formation)

使例1所使用UA-2計40質量份、甲基丙烯酸-2-羥丁酯(共榮社化學公司製,LIGHT ESTER HOB) 30質量份、以及甲基丙烯酸正十二烷基酯30質量份均勻混合,再於該混合物100質量份中均勻溶解雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦(光聚合起始劑,汽巴超級化學公司製,IRGACURE 819) 0.5質量份,便獲得光硬化性樹脂組成物PG。40 parts by mass of UA-2 used in Example 1 and 2-hydroxybutyl methacrylate (LIGHT ESTER, manufactured by Kyoeisha Chemical Co., Ltd.) HOB) 30 parts by mass, and 30 parts by mass of n-dodecyl methacrylate are uniformly mixed, and then uniformly dissolving bis(2,4,6-trimethylbenzylidene)-benzene in 100 parts by mass of the mixture The photo-curable resin composition PG was obtained in 0.5 part by mass of a phosphine oxide (photopolymerization initiator, manufactured by Ciba Super Chemical Co., Ltd., IRGACURE 819).

其次,使PG計40質量份、與UA-2合成時所使用者相同的分子末端經環氧乙烷改質且1分子中具有2個羥基的雙官能基聚丙二醇(由羥值所計算出的數量平均分子量:4000,聚丙二醇分子中的環氧乙烷含量24質量%)60質量份均勻溶解,而獲得樹脂層形成用光硬化性樹脂組成物G。Next, 40 parts by mass of a PG meter, a difunctional polypropylene glycol having a molecular end modified by ethylene oxide and having two hydroxyl groups in one molecule, which is the same as the user of the UA-2 synthesis, was calculated from the hydroxyl value. The number average molecular weight: 4000, the ethylene oxide content in the polypropylene glycol molecule is 24% by mass), 60 parts by mass is uniformly dissolved, and the photocurable resin composition G for forming a resin layer is obtained.

在將樹脂層形成用光硬化性樹脂組成物G放入容器的狀態下,依開放狀態設置於減壓裝置內,將減壓裝置內減壓至約20Pa並保持10分鐘,藉此施行脫泡處理。經測定樹脂層形成用光硬化性樹脂組成物G在25℃下的黏度,結果為1.3Pa‧s。In a state where the resin layer-forming photocurable resin composition G is placed in a container, it is placed in a decompression device in an open state, and the inside of the decompression device is depressurized to about 20 Pa for 10 minutes, thereby performing defoaming. deal with. The viscosity of the photocurable resin composition G for forming a resin layer at 25 ° C was measured and found to be 1.3 Pa ‧ s.

其次,使用流變儀,測定樹脂層形成用光硬化性樹脂組成物G光硬化後的黏彈性特性,結果儲存剪切彈性模數係3.7×103Pa、其損失正切(tanδ)係0.61。Then, the viscoelastic property of the photocurable resin composition G for resin layer formation after photohardening was measured by a rheometer, and the storage shear modulus was 3.7 × 10 3 Pa, and the loss tangent (tan δ) was 0.61.

與例1同樣,除密封部形成用光硬化性樹脂組成物係使用組成物C,且樹脂層形成用光硬化性樹脂組成物係使用組成物G之外,其餘均與例1相同而獲得顯示裝置H。In the same manner as in Example 1, except that the composition C was used for the photocurable resin composition for sealing portion formation, and the composition G was used for the photocurable resin composition for resin layer formation, the same as in Example 1 was used to obtain the display. Device H.

將顯示裝置H送返被取出液晶顯示元件的液晶監視器之框體中,再度連接配線後,以接合於玻璃板B的顯示元件A成為垂直之方式設置液晶監視器。經靜置5日後再切入電源,結果可獲得涵蓋顯示畫面全面呈均質的良好顯示影像,且顯示對比高於當初狀態。即使手指頭強力按押影像顯示面,影像仍不會凌亂,玻璃板B有效地保護著顯示元件A。The display device H is returned to the casing of the liquid crystal monitor from which the liquid crystal display element is taken out, and after the wiring is connected again, the liquid crystal monitor is provided such that the display element A bonded to the glass plate B is vertical. After standing for 5 days, the power is cut in, and a good display image covering the display screen is obtained, and the display contrast is higher than the original state. Even if the finger is strongly pressed against the image display surface, the image is not disturbed, and the glass plate B effectively protects the display element A.

接著,同樣的設置顯示裝置H,經1個月後確認顯示元件的接合位置,並無發現位置偏移等情形,良好地保持於玻璃板。Next, the display device H was set in the same manner, and after one month, the bonding position of the display element was confirmed, and no positional shift or the like was observed, and the glass plate was favorably held.

[例3][Example 3] (樹脂層形成用光硬化性樹脂組成物)(Photocurable resin composition for resin layer formation)

將分子末端經加成環氧乙烷且1分子中具有2個羥基的雙官能基聚丙二醇(由羥值所計算出的數量平均分子量:4000,聚丙二醇分子中的環氧乙烷含量24質量%)、與異佛爾酮二異氰酸酯,依成為3比4的莫耳比進行混合,在錫化合物的觸媒存在下,以70℃進行反應而獲得預聚物,在該預聚物中將丙烯酸-2-羥乙酯依大致成為1比2的莫耳比添加,並添加2,5-二第三丁基氫醌(聚合終止劑) 0.03質量份,藉由以70℃使進行反應,便獲得胺甲酸酯丙烯酸酯寡聚物(以下稱「UA-3」)。UA-3的硬化性基數係2,數量平均分子量約21000,25℃下的黏度約350Pa‧s。A difunctional polypropylene glycol having a molecular end added to ethylene oxide and having 2 hydroxyl groups in one molecule (number average molecular weight calculated from hydroxyl value: 4000, ethylene oxide content in polypropylene glycol molecule 24 mass) %), mixed with isophorone diisocyanate according to a molar ratio of 3 to 4, and reacted at 70 ° C in the presence of a catalyst of a tin compound to obtain a prepolymer in which the prepolymer is obtained. 2-hydroxyethyl acrylate was added in a molar ratio of approximately 1 to 2, and 0.03 parts by mass of 2,5-di-t-butylhydroquinone (polymerization terminator) was added, and the reaction was carried out at 70 ° C. A urethane acrylate oligomer (hereinafter referred to as "UA-3") was obtained. The hardening base of UA-3 is 2, the number average molecular weight is about 21,000, and the viscosity at 25 ° C is about 350 Pa‧s.

將UA-3計80質量份、甲基丙烯酸-2-羥丁酯(共榮社化學公司製,LIGHT ESTER HOB) 20質量份進行混合,再於該混合物100質量份中均勻溶解雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦(光聚合起始劑,汽巴超級化學公司製,IRGACURE 819)0.5質量份,便獲得光硬化性樹脂組成物PI。80 parts by mass of UA-3, 2-hydroxybutyl methacrylate (made by Kyoeisha Chemical Co., Ltd., LIGHT ESTER) HOB) 20 parts by mass is mixed, and then bis(2,4,6-trimethylbenzylidene)-phenylphosphine oxide is uniformly dissolved in 100 parts by mass of the mixture (photopolymerization initiator, Ciba super chemistry The company's product, IRGACURE 819), 0.5 parts by mass, gave a photocurable resin composition PI.

其次,使PI計30質量份、與1分子中具有2個羥基的雙官能基聚丙二醇(由羥值所計算出的數量平均分子量:2000,聚丙二醇中的EO含量0質量%) 70質量份均勻溶解,便獲得樹脂層形成用光硬化性樹脂組成物I。Next, 30 parts by mass of PI, and a bifunctional polypropylene glycol having two hydroxyl groups in one molecule (number average molecular weight calculated from a hydroxyl value: 2000, EO content in polypropylene glycol: 0% by mass) 70 parts by mass After uniformly dissolving, the photocurable resin composition I for forming a resin layer was obtained.

在將樹脂層形成用光硬化性樹脂組成物I放入容器的狀態下,依開放狀態設置於減壓裝置內,將減壓裝置內減壓至約20Pa並保持10分鐘,藉此施行脫泡處理。經測定樹脂層形成用光硬化性樹脂組成物I在25℃下的黏度,結果為2.0Pa‧s。In the state where the resin layer-forming photocurable resin composition I is placed in a container, it is placed in a decompression device in an open state, and the pressure in the decompression device is reduced to about 20 Pa for 10 minutes, thereby performing defoaming. deal with. The viscosity of the photocurable resin composition I for forming a resin layer at 25 ° C was measured and found to be 2.0 Pa s.

其次,使用流變儀,測定樹脂層形成用光硬化性樹脂組成物I光硬化後的黏彈性特性,結果儲存剪切彈性模數係2.5×104Pa、其損失正切(tanδ)係0.06。Then, the viscoelastic property after photocuring of the photocurable resin composition I for forming a resin layer was measured by a rheometer. As a result, the storage shear modulus was 2.5 × 10 4 Pa, and the loss tangent (tan δ) was 0.06.

與例1同樣,除密封部形成用光硬化性樹脂組成物係使用組成物C,且樹脂層形成用光硬化性樹脂組成物係使用組成物I之外,其餘均與例1相同而獲得顯示裝置J。In the same manner as in Example 1, except that the composition C was used for the photocurable resin composition for forming a sealing portion, and the composition I was used for the photocurable resin composition for forming a resin layer, the same results as in Example 1 were obtained. Device J.

將顯示裝置J送返被取出液晶顯示元件的液晶監視器之框體中,再度連接配線後,以接合於玻璃板B的顯示元件A成為垂直之方式設置液晶監視器。經靜置5日後再切入電源,結果可獲得涵蓋顯示畫面全面呈均質的良好顯示影像,且顯示對比高於當初狀態。即使手指頭強力按押影像顯示面,影像仍不會凌亂,玻璃板B有效地保護著顯示元件A。The display device J is returned to the casing of the liquid crystal monitor from which the liquid crystal display element is taken out, and after the wiring is connected again, the liquid crystal monitor is provided such that the display element A bonded to the glass plate B is vertical. After standing for 5 days, the power is cut in, and a good display image covering the display screen is obtained, and the display contrast is higher than the original state. Even if the finger is strongly pressed against the image display surface, the image is not disturbed, and the glass plate B effectively protects the display element A.

接著,同樣的設置顯示裝置J,經1個月後確認顯示元件的接合位置,並無發現位置偏移等情形,良好地保持於玻璃板。Next, the display device J was placed in the same manner, and after one month, the bonding position of the display element was confirmed, and no positional shift or the like was observed, and the glass plate was favorably held.

[例4][Example 4] (樹脂層形成用光硬化性樹脂組成物)(Photocurable resin composition for resin layer formation)

使例3所使用PI計20質量份、與1分子中具有2個羥基的雙官能基聚丙二醇(由羥值所計算出的數量平均分子量:2000,聚丙二醇中的EO含量0質量%) 80質量份均勻溶解,便獲得樹脂層形成用光硬化性樹脂組成物I2。20 parts by mass of the PI used in Example 3 and a bifunctional polypropylene glycol having two hydroxyl groups in one molecule (number average molecular weight calculated from a hydroxyl value: 2000, EO content in polypropylene glycol: 0% by mass) 80 When the mass part is uniformly dissolved, the photocurable resin composition I2 for resin layer formation is obtained.

在將樹脂層形成用光硬化性樹脂組成物I2放入容器的狀態下,依開放狀態設置於減壓裝置內,將減壓裝置內減壓至約20Pa並保持10分鐘,藉此施行脫泡處理。經測定樹脂層形成用光硬化性樹脂組成物I2在25℃下的黏度,結果為1.0Pa‧s。In a state where the resin layer-forming photocurable resin composition I2 is placed in a container, it is placed in a decompression device in an open state, and the inside of the decompression device is depressurized to about 20 Pa for 10 minutes, thereby performing defoaming. deal with. The viscosity of the photocurable resin composition I2 for forming a resin layer at 25 ° C was measured and found to be 1.0 Pa ‧ s.

其次,使用流變儀,測定樹脂層形成用光硬化性樹脂組成物I2光硬化後的黏彈性特性,結果儲存剪切彈性模數係4.0×103Pa、其損失正切(tanδ)係0.07。Then, the viscoelastic property after photocuring of the photocurable resin composition I2 for resin layer formation was measured by a rheometer, and as a result, the storage shear modulus was 4.0 × 10 3 Pa, and the loss tangent (tan δ) was 0.07.

與例1同樣,除密封部形成用光硬化性樹脂組成物係使用組成物C,且樹脂層形成用光硬化性樹脂組成物係使用組成物I2之外,其餘均與例1相同而獲得顯示裝置J2。In the same manner as in Example 1, except that the composition C was used for the photocurable resin composition for forming a sealing portion, and the composition I2 was used for the photocurable resin composition for forming a resin layer, the same results as in Example 1 were obtained. Device J2.

將顯示裝置J2送返被取出液晶顯示元件的液晶監視器之框體中,再度連接配線後,以接合於玻璃板B的顯示元件A成為垂直之方式設置液晶監視器。經靜置5日後再切入電源,結果可獲得涵蓋顯示畫面全面呈均質的良好顯示影像,且顯示對比高於當初狀態。即使手指頭強力按押影像顯示面,影像仍不會凌亂,玻璃板B有效地保護著顯示元件A。The display device J2 is returned to the casing of the liquid crystal monitor from which the liquid crystal display element is taken out, and after the wiring is connected again, the liquid crystal monitor is provided such that the display element A bonded to the glass plate B is vertical. After standing for 5 days, the power is cut in, and a good display image covering the display screen is obtained, and the display contrast is higher than the original state. Even if the finger is strongly pressed against the image display surface, the image is not disturbed, and the glass plate B effectively protects the display element A.

接著,同樣的設置顯示裝置J2,經1個月後確認顯示元件的接合位置,並無發現位置偏移等情形,良好地保持於玻璃板。Next, the display device J2 was set in the same manner, and after one month, the bonding position of the display element was confirmed, and no positional shift or the like was observed, and the glass plate was favorably held.

[例5][Example 5] (樹脂層形成用光硬化性樹脂組成物)(Photocurable resin composition for resin layer formation)

將例1所使用的UA-2計40質量份、甲基丙烯酸-2-羥丁酯(共榮社化學公司製,LIGHT ESTER HOB) 20質量份、以及甲基丙烯酸正十二烷基酯40質量份均勻混合,再於該混合物100質量份中均勻溶解雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦(光聚合起始劑,汽巴超級化學公司製,IRGACURE 819) 0.3質量份、2,5-二第三丁基氫醌(聚合終止劑) 0.04質量份、正十二烷基硫醇(鏈轉移劑,花王公司製,THIOKALCHOL 20) 0.5質量份、以及紫外線吸收劑(汽巴超級化學公司製,TINUVIN 109) 0.3質量份,便獲得樹脂層形成用光硬化性樹脂組成物K。40 parts by mass of UA-2 used in Example 1 and 2-hydroxybutyl methacrylate (LIGHT ESTER, manufactured by Kyoeisha Chemical Co., Ltd.) HOB) 20 parts by mass, and 40 parts by mass of n-dodecyl methacrylate are uniformly mixed, and then uniformly dissolving bis(2,4,6-trimethylbenzylidene)-benzene in 100 parts by mass of the mixture Phosphine oxide (photopolymerization initiator, manufactured by Ciba Super Chemical Co., Ltd., IRGACURE 819) 0.3 parts by mass, 2,5-di-tert-butylhydroquinone (polymerization terminator) 0.04 parts by mass, n-dodecylsulfide Alcohol (chain transfer agent, made by Kao Corporation, THIOKALCHOL 20) 0.5 parts by mass and 0.3 parts by mass of a UV absorber (TINUVIN 109, manufactured by Ciba Super Chemical Co., Ltd.) to obtain a photocurable resin composition K for forming a resin layer.

在將樹脂層形成用光硬化性樹脂組成物K放入容器的狀態下,依開放狀態設置於減壓裝置內,將減壓裝置內減壓至約20Pa並保持10分鐘,藉此施行脫泡處理。經測定樹脂層形成用光硬化性樹脂組成物K在25℃下的黏度,結果為2.0Pa‧s。In the state where the resin layer-forming photocurable resin composition K is placed in a container, it is placed in a decompression device in an open state, and the inside of the decompression device is decompressed to about 20 Pa for 10 minutes, thereby performing defoaming. deal with. The viscosity of the photocurable resin composition K for forming a resin layer at 25 ° C was measured and found to be 2.0 Pa s.

其次,使用流變儀,測定樹脂層形成用光硬化性樹脂組成物K光硬化後的黏彈性特性,結果儲存剪切彈性模數係1.6×105Pa、其損失正切(tanδ)係0.44。Then, the viscoelastic property of the photocurable resin composition for resin layer formation K after light curing was measured using a rheometer. As a result, the storage shear modulus was 1.6 × 10 5 Pa, and the loss tangent (tan δ) was 0.44.

與例1同樣,除密封部形成用光硬化性樹脂組成物係使用組成物C,且樹脂層形成用光硬化性樹脂組成物係使用組成物K之外,其餘均與例1相同而獲得顯示裝置L。In the same manner as in Example 1, except that the composition C was used for the photocurable resin composition for forming a sealing portion, and the composition K was used for the photocurable resin composition for forming a resin layer, the same results as in Example 1 were obtained. Device L.

將顯示裝置L送返被取出液晶顯示元件的液晶監視器之框體中,再度連接配線後,以接合於玻璃板B的顯示元件A成為垂直之方式設置液晶監視器。經靜置5日後再切入電源,結果顯示畫面其中一部分有出現顯示斑,特別係在半色調顯示時的顯示畫面周緣部有被檢視到。在沒有出現顯示斑的部分處,可獲得較初期更高對比的影像。The display device L is returned to the casing of the liquid crystal monitor from which the liquid crystal display element is taken out, and after the wiring is connected again, the liquid crystal monitor is provided such that the display element A bonded to the glass plate B is vertical. After standing for 5 days, the power was cut in, and a part of the display screen showed a display spot, especially in the peripheral portion of the display screen at the time of halftone display. At the portion where the display spot does not appear, an image with a higher contrast than the initial one can be obtained.

接著,同樣的設置顯示裝置L,經1個月後確認顯示元件的接合位置,並無發現位置偏移等情形,良好地保持於玻璃板。Next, the display device L was set in the same manner, and after one month, the bonding position of the display element was confirmed, and the positional shift or the like was not observed, and the glass plate was favorably held.

[例6][Example 6] (樹脂層形成用光硬化性樹脂組成物)(Photocurable resin composition for resin layer formation)

將例2所使用的光硬化性樹脂組成物PG,使用為樹脂層形成用光硬化性樹脂組成物M。The photocurable resin composition PG used in Example 2 is used as a photocurable resin composition M for forming a resin layer.

在將樹脂層形成用光硬化性樹脂組成物M放入容器的狀態下,依開放狀態設置於減壓裝置內,將減壓裝置內減壓至約20Pa並保持10分鐘,藉此施行脫泡處理。經測定樹脂層形成用光硬化性樹脂組成物M在25℃下的黏度,結果為2.2Pa‧s。In a state where the resin layer-forming photocurable resin composition M is placed in a container, it is placed in a decompression device in an open state, and the inside of the decompression device is decompressed to about 20 Pa for 10 minutes, thereby performing defoaming. deal with. The viscosity of the photocurable resin composition M for forming a resin layer at 25 ° C was measured and found to be 2.2 Pa s.

其次,使用流變儀,測定樹脂層形成用光硬化性樹脂組成物M光硬化後的黏彈性特性,結果儲存剪切彈性模數係3.1×105Pa、其損失正切(tanδ)係0.32。Then, the viscoelastic property after photohardening of the photocurable resin composition M for forming a resin layer was measured using a rheometer. As a result, the storage shear modulus was 3.1 × 10 5 Pa, and the loss tangent (tan δ) was 0.32.

與例1同樣,除密封部形成用光硬化性樹脂組成物係使用組成物C,且樹脂層形成用光硬化性樹脂組成物係使用組成物M之外,其餘均與例1相同而獲得顯示裝置N。In the same manner as in Example 1, except that the composition C was used for the photocurable resin composition for forming a sealing portion, and the composition M was used for the photocurable resin composition for forming a resin layer, the same results as in Example 1 were obtained. Device N.

將顯示裝置N送返被取出液晶顯示元件的液晶監視器之框體中,再度連接配線後,以接合於玻璃板B的顯示元件A成為垂直之方式設置液晶監視器。經靜置5日後再切入電源,結果顯示畫面其中一部分有出現顯示斑,特別係在半色調顯示時的顯示畫面周緣部有被檢視到。在沒有出現顯示斑的部分處,可獲得較初期更高對比的影像。The display device N is returned to the casing of the liquid crystal monitor from which the liquid crystal display element is taken out, and after the wiring is connected again, the liquid crystal monitor is provided such that the display element A bonded to the glass plate B is vertical. After standing for 5 days, the power was cut in, and a part of the display screen showed a display spot, especially in the peripheral portion of the display screen at the time of halftone display. At the portion where the display spot does not appear, an image with a higher contrast than the initial one can be obtained.

接著,同樣的設置顯示裝置N,經1個月後確認顯示元件的接合位置,並無發現位置偏移等情形,良好地保持於玻璃板。Next, the display device N was set in the same manner, and after one month, the bonding position of the display element was confirmed, and no positional shift or the like was observed, and the glass plate was favorably held.

[例7][Example 7] (樹脂層形成用光硬化性樹脂組成物)(Photocurable resin composition for resin layer formation)

將例1所使用UA-2計40質量份、甲基丙烯酸-2-羥丁酯(共榮社化學公司製,LIGHT ESTER HOB) 20質量份、以及甲基丙烯酸正十二烷基酯40質量份均勻混合,再於該混合物100質量份中均勻溶解雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦(光聚合起始劑,汽巴超級化學公司製,IRGACURE 819) 0.3質量份、以及正十二烷基硫醇(鏈轉移劑,花王公司製,THIOKALCHOL 20) 1.5質量份,便獲得樹脂層形成用光硬化性樹脂組成物O。40 parts by mass of UA-2 used in Example 1 and 2-hydroxybutyl methacrylate (LIGHT ESTER, manufactured by Kyoeisha Chemical Co., Ltd.) HOB) 20 parts by mass, and 40 parts by mass of n-dodecyl methacrylate are uniformly mixed, and then uniformly dissolving bis(2,4,6-trimethylbenzylidene)-benzene in 100 parts by mass of the mixture Phosphine oxide (photopolymerization initiator, manufactured by Ciba Super Chemical Co., Ltd., IRGACURE 819) 0.3 parts by mass, and n-dodecyl mercaptan (chain transfer agent, manufactured by Kao Corporation, THIOKALCHOL 20) 1.5 parts by mass, a photocurable resin composition O for forming a resin layer was obtained.

在將樹脂層形成用光硬化性樹脂組成物O放入容器的狀態下,依開放狀態設置於減壓裝置內,將減壓裝置內減壓至約20Pa並保持10分鐘,藉此施行脫泡處理。經測定樹脂層形成用光硬化性樹脂組成物O在25℃下的黏度,結果為1.9Pa‧s。In a state where the resin layer-forming photocurable resin composition O is placed in a container, it is placed in a decompression device in an open state, and the inside of the decompression device is depressurized to about 20 Pa for 10 minutes, thereby performing defoaming. deal with. The viscosity of the photocurable resin composition O for resin layer formation at 25 ° C was measured and found to be 1.9 Pa s.

其次,使用流變儀,測定樹脂層形成用光硬化性樹脂組成物O光硬化後的黏彈性特性,結果儲存剪切彈性模數係7.5×103Pa、其損失正切(tanδ)係1.8。Then, the viscoelastic property after photocuring of the photocurable resin composition for forming a resin layer was measured by a rheometer. As a result, the storage shear modulus was 7.5 × 10 3 Pa, and the loss tangent (tan δ) was 1.8.

與例1同樣,除密封部形成用光硬化性樹脂組成物係使用組成物C,且樹脂層形成用光硬化性樹脂組成物係使用組成物O之外,其餘均與例1相同而獲得顯示裝置P。In the same manner as in Example 1, except that the composition C was used for the photocurable resin composition for sealing portion formation, and the composition O was used for the photocurable resin composition for resin layer formation, the same results as in Example 1 were obtained. Device P.

將顯示裝置P送返被取出液晶顯示元件的液晶監視器之框體中,再度連接配線後,以接合於玻璃板B的顯示元件A成為垂直之方式設置液晶監視器。約1小時後確認顯示元件的接合位置,結果從玻璃板偏移脫落數mm程度,無法將顯示元件良好地保持於玻璃板上。The display device P is returned to the casing of the liquid crystal monitor from which the liquid crystal display element is taken out, and after the wiring is connected again, the liquid crystal monitor is provided such that the display element A bonded to the glass plate B is vertical. After about 1 hour, the bonding position of the display element was confirmed, and as a result, the glass plate was offset by a few mm, and the display element could not be satisfactorily held on the glass plate.

此處,以接合於玻璃板B的顯示元件A呈水平之方式設置顯示裝置P,經靜置5日後再切入電源,結果顯示元件的偏移並無變化,在顯示畫面的中央部可獲得均質的良好顯示影像,且顯示對比高於當初狀態。即使手指頭強力按押影像顯示面,影像仍不會凌亂,玻璃板B有效地保護著顯示元件A。Here, the display device P is placed horizontally with the display element A bonded to the glass sheet B, and after the power is left for 5 days, the power supply is cut, and as a result, the offset of the display element does not change, and the center portion of the display screen can be homogenized. Good display image, and the display contrast is higher than the original state. Even if the finger is strongly pressed against the image display surface, the image is not disturbed, and the glass plate B effectively protects the display element A.

[例8][Example 8]

除在例1中,於UA-2的合成時,取代分子末端經加成環氧乙烷的雙官能基聚丙二醇,改為使用將分子末端並未加成環氧乙烷且1分子中具有2個羥基之雙官能基聚丙二醇(由羥值所計算出的數量平均分子量5500)、以及大致同量含有2,2,4-三甲基-六亞甲基二異氰酸酯與2,4,4-三甲基-六亞甲基二異氰酸酯的混合物,依1:2莫耳比進行混合之外,其餘均與例1相同而合成胺甲酸酯丙烯酸酯寡聚物(UA-4)。UA-4的硬化性基數係2,數量平均分子量約16000,25℃下的黏度約39Pa‧s。In addition to the case of the synthesis of UA-2 in the case of the synthesis of UA-2, the substituted terminal of the difunctional polypropylene glycol to which ethylene oxide is added is used instead of adding ethylene oxide to the terminal of the molecule and having one molecule 2 hydroxy bifunctional polypropylene glycol (number average molecular weight calculated from hydroxyl value 5500), and approximately the same amount containing 2,2,4-trimethyl-hexamethylene diisocyanate and 2,4,4 A mixture of trimethyl-hexamethylene diisocyanate was synthesized in the same manner as in Example 1 except that the mixture was mixed at a molar ratio of 1:2 to synthesize a urethane acrylate oligomer (UA-4). The hardening base of UA-4 is 2, the number average molecular weight is about 16,000, and the viscosity at 25 ° C is about 39 Pa‧s.

除在例1中,取代UA-2,改為使用UA-4,其餘均與例1相同而獲得樹脂層形成用光硬化性樹脂組成物PQ。使用PQ計40質量份、與UA-4合成時所使用者相同的分子末端並未加成環氧乙烷且1分子中具有2個羥基之雙官能基聚丙二醇(由羥值所計算出的數量平均分子量5500),獲得樹脂層形成用光硬化性樹脂組成物Q。樹脂層形成用光硬化性樹脂組成物Q在25℃下的黏度係0.8Pa‧s。In the same manner as in Example 1, except that UA-2 was used instead of UA-2, the photocurable resin composition PQ for resin layer formation was obtained. 40 parts by mass of the PQ meter, the same molecular end as the user of the UA-4 synthesis, did not add ethylene oxide and had two hydroxyl groups in one molecule of the difunctional polypropylene glycol (calculated from the hydroxyl value) The number average molecular weight was 5,500), and the photocurable resin composition Q for resin layer formation was obtained. The viscosity of the photocurable resin composition Q for forming a resin layer at 25 ° C is 0.8 Pa ‧ s.

利用流變儀測定樹脂層形成用光硬化性樹脂組成物Q光硬化後的黏彈性特性,結果儲存剪切彈性模數係2.4×104Pa、其損失正切(tanδ)係0.13。The viscoelastic property of the photocurable resin composition for forming a resin layer after Q-light curing was measured by a rheometer. As a result, the storage shear modulus was 2.4 × 10 4 Pa, and the loss tangent (tan δ) was 0.13.

與例1同樣,除密封部形成用光硬化性樹脂組成物係使用組成物C,且樹脂層形成用光硬化性樹脂組成物係使用組成物Q之外,其餘均與例1相同而獲得顯示裝置R。In the same manner as in Example 1, except that the composition C was used for the photocurable resin composition for forming a sealing portion, and the composition Q was used for the photocurable resin composition for forming a resin layer, the same results as in Example 1 were obtained. Device R.

將顯示裝置R送返被取出液晶顯示元件的液晶監視器之框體中,再度連接配線後,以接合於玻璃板B的顯示元件A成為垂直之方式設置液晶監視器。經靜置5日後再切入電源,結果可獲得涵蓋顯示畫面全面呈均質的良好顯示影像,且顯示對比高於當初狀態。即使手指頭強力按押影像顯示面,影像仍不會凌亂,玻璃板B有效地保護著顯示元件A。The display device R is returned to the casing of the liquid crystal monitor from which the liquid crystal display element is taken out, and after the wiring is connected again, the liquid crystal monitor is placed so that the display element A bonded to the glass plate B is vertical. After standing for 5 days, the power is cut in, and a good display image covering the display screen is obtained, and the display contrast is higher than the original state. Even if the finger is strongly pressed against the image display surface, the image is not disturbed, and the glass plate B effectively protects the display element A.

接著,同樣的設置顯示裝置R,經1個月後確認顯示元件的接合位置,並無發現位置偏移等情形,良好地保持於玻璃板。Next, the display device R was placed in the same manner, and after one month, the bonding position of the display element was confirmed, and no positional deviation was observed, and the glass plate was favorably held.

[例9][Example 9]

除將分子末端並未加成環氧乙烷且1分子中具有2個羥基的雙官能基聚丙二醇(由羥值所計算出的數量平均分子量2000)、與異佛爾酮二異氰酸酯,依5:6莫耳比進行混合之外,其餘均與例1相同而合成胺甲酸酯丙烯酸酯寡聚物(UA-5)。UA-5的硬化性基數係2,數量平均分子量約18000,25℃下的黏度約620Pa‧s。In addition to a difunctional polypropylene glycol having a hydroxyl group at the terminal of the molecule and having two hydroxyl groups in one molecule (a number average molecular weight calculated from a hydroxyl value of 2000), and isophorone diisocyanate, The urethane acrylate oligomer (UA-5) was synthesized in the same manner as in Example 1 except that 6 molar ratios were mixed. The hardening base of UA-5 is 2, the number average molecular weight is about 18,000, and the viscosity at 25 ° C is about 620 Pa‧s.

除在例1中,取代UA-2,改為使用UA-5,其餘均與例1相同而獲得樹脂層形成用光硬化性樹脂組成物PS。使用PS計40質量份、UA-5合成時所使用者相同的分子末端並未加成環氧乙烷且1分子中具有2個羥基之雙官能基聚丙二醇(由羥值所計算出的數量平均分子量2000)30質量份、以及分子量大於UA-5合成時所使用者的分子末端並未加成環氧乙烷且1分子中具有2個羥基之雙官能基聚丙二醇(由羥值所計算出的數量平均分子量5500) 30質量份,獲得樹脂層形成用光硬化性樹脂組成物S。樹脂層形成用光硬化性樹脂組成物S在25℃下的黏度係0.9Pa‧s。In the same manner as in Example 1, except that UA-2 was used instead of UA-2, the photocurable resin composition PS for resin layer formation was obtained. Using 40 parts by mass of the PS meter, the same molecular end of the user of the UA-5 was synthesized without the addition of ethylene oxide and the bifunctional polypropylene glycol having 2 hydroxyl groups in one molecule (the amount calculated from the hydroxyl value) An average molecular weight of 2000) 30 parts by mass, and a difunctional polypropylene glycol having a molecular weight greater than that of the user at the time of synthesis of UA-5 without the addition of ethylene oxide and having two hydroxyl groups in one molecule (calculated from the hydroxyl value) The number average molecular weight of 5500) was 30 mass parts, and the photocurable resin composition S for resin layer formation was obtained. The viscosity of the photocurable resin composition S for forming a resin layer at 25 ° C is 0.9 Pa ‧ s.

利用流變儀測定樹脂層形成用光硬化性樹脂組成物S光硬化後的黏彈性特性,結果儲存剪切彈性模數係2.0×104Pa、其損失正切(tanδ)係0.15。The viscoelastic property of the photocurable resin composition S for resin layer formation after photohardening was measured by a rheometer, and as a result, the storage shear modulus was 2.0 × 10 4 Pa, and the loss tangent (tan δ) was 0.15.

與例1同樣,除密封部形成用光硬化性樹脂組成物係使用組成物C,且樹脂層形成用光硬化性樹脂組成物係使用組成物S之外,其餘均與例1相同而獲得顯示裝置T。In the same manner as in Example 1, except that the composition C was used for the photocurable resin composition for sealing portion formation, and the composition S was used for the photocurable resin composition for resin layer formation, the same results as in Example 1 were obtained. Device T.

將顯示裝置T送返被取出液晶顯示元件的液晶監視器之框體中,再度連接配線後,以接合於玻璃板B的顯示元件A成為垂直之方式設置液晶監視器。經靜置5日後再切入電源,結果可獲得涵蓋顯示畫面全面呈均質的良好顯示影像,且顯示對比高於當初狀態。即使手指頭強力按押影像顯示面,影像仍不會凌亂,玻璃板B有效地保護著顯示元件A。The display device T is returned to the casing of the liquid crystal monitor from which the liquid crystal display element is taken out, and after the wiring is connected again, the liquid crystal monitor is provided such that the display element A bonded to the glass plate B is vertical. After standing for 5 days, the power is cut in, and a good display image covering the display screen is obtained, and the display contrast is higher than the original state. Even if the finger is strongly pressed against the image display surface, the image is not disturbed, and the glass plate B effectively protects the display element A.

接著,同樣的設置顯示裝置T,經1個月後確認顯示元件的接合位置,並無發現位置偏移等情形,良好地保持於玻璃板。Next, the display device T was set in the same manner, and after one month, the bonding position of the display element was confirmed, and no positional shift or the like was observed, and the glass plate was favorably held.

含有本發明硬化性化合物(II)、及非硬化性寡聚物(D),且該(D)的含量係佔硬化性樹脂組成物中的10~90質量%之例1~4、8及9,得知可降低因樹脂層硬化時的收縮所產生應力,可獲得涵蓋顯示液晶畫面全面呈均質的良好顯示影像。The curable compound (II) of the present invention and the non-curable oligomer (D) are contained, and the content of the (D) is in the range of 10 to 90% by mass in the curable resin composition, and examples 1 to 4 and 8 and 9. It is known that the stress generated by the shrinkage at the time of hardening of the resin layer can be reduced, and a good display image covering the entire liquid crystal display can be obtained.

雖含有本發明硬化性化合物(II),但未含有非硬化性寡聚物(D)的例5與6,在液晶顯示畫面的周緣部有出現顯示斑,特別係半色調的顯示時會明顯被檢視到。又,特別係相對於硬化性化合物(II)100質量份,鏈轉移劑含有超過1.0質量份的例7,並無法將顯示元件良好地保持於玻璃板上。Examples 5 and 6 which do not contain the non-curable oligomer (D), although the curable compound (II) of the present invention is contained, have display spots on the peripheral portion of the liquid crystal display screen, and are particularly noticeable in halftone display. It was examined. In addition, in particular, the chain transfer agent contained Example 7 in an amount of more than 1.0 part by mass based on 100 parts by mass of the curable compound (II), and the display element could not be satisfactorily held on the glass plate.

產業上之可利用性Industrial availability

本發明的硬化性樹脂組成物係能有效利用於顯示裝置所使用之層積體的製造。The curable resin composition of the present invention can be effectively utilized in the production of a laminate used in a display device.

另外,2010年6月16日所提出申請的日本專利申請案2010-137531號之說明書、申請專利範圍、圖式及摘要等全部內容,均爰引於本案中,並納入為本發明說明書的揭示。In addition, the contents of the specification, the scope of the application, the drawings and the abstract of the Japanese Patent Application No. 2010-137531, filed on Jun. 16, 2010, are hereby incorporated by reference in .

1...顯示裝置1. . . Display device

10...透明面材10. . . Transparent surface material

12...未硬化密封部12. . . Unhardened seal

13...區域13. . . region

14...樹脂層形成用光硬化性樹脂組成物14. . . Photocurable resin composition for resin layer formation

18...下定盤18. . . Lower order

20...分配機20. . . Distribution machine

22...導螺twenty two. . . Guide screw

24...導螺twenty four. . . Guide screw

26...減壓裝置26. . . Pressure reducing device

28...真空泵28. . . Vacuum pump

30...上定盤30. . . Upper plate

31...下定盤31. . . Lower order

32...吸附墊32. . . Adsorption pad

34...氣缸34. . . cylinder

40...樹脂層40. . . Resin layer

42...密封部42. . . Sealing part

50...顯示元件50. . . Display component

51...偏光板51. . . Polarizer

52...透明面材52. . . Transparent surface material

53...透明面材53. . . Transparent surface material

54...可撓性印刷電路板54. . . Flexible printed circuit board

55...遮光印刷部(遮光部)55. . . Shading printing section (shading section)

56...透光部56. . . Translucent part

第1圖係利用透明面材保護顯示元件的顯示裝置一例之剖視圖。Fig. 1 is a cross-sectional view showing an example of a display device for protecting a display element by a transparent surface material.

第2圖係第1圖之顯示裝置的平面圖。Fig. 2 is a plan view showing the display device of Fig. 1.

第3圖係步驟(a)的態樣一例平面圖。Fig. 3 is a plan view showing an example of the aspect of the step (a).

第4圖係步驟(a)的態樣一例剖視圖。Fig. 4 is a cross-sectional view showing an example of the aspect of the step (a).

第5圖係步驟(b)的態樣一例平面圖。Fig. 5 is a plan view showing an example of the aspect of the step (b).

第6圖係步驟(b)的態樣一例剖視圖。Fig. 6 is a cross-sectional view showing an example of the aspect of the step (b).

第7圖係步驟(c)的態樣一例剖視圖。Fig. 7 is a cross-sectional view showing an example of the aspect of the step (c).

第8圖係步驟(d)的態樣一例剖視圖。Fig. 8 is a cross-sectional view showing an example of the aspect of the step (d).

1...顯示裝置1. . . Display device

10...透明面材10. . . Transparent surface material

40...樹脂層40. . . Resin layer

42...密封部42. . . Sealing part

50...顯示元件50. . . Display component

51...偏光板51. . . Polarizer

52...透明面材52. . . Transparent surface material

53...透明面材53. . . Transparent surface material

54...可撓性印刷電路板54. . . Flexible printed circuit board

55...遮光印刷部(遮光部)55. . . Shading printing section (shading section)

56...透光部56. . . Translucent part

Claims (16)

一種樹脂層,係將硬化性樹脂組成物硬化而得之樹脂層,該樹脂層之特徵在於:於動態黏彈性測定時,儲存剪切彈性模數係5×102~2.4×104Pa,且損失正切係0.13~1.4。 A resin layer obtained by curing a curable resin composition, wherein the resin layer is characterized by a storage shear modulus of 5 × 10 2 to 2.4 × 10 4 Pa during dynamic viscoelasticity measurement. And the loss tangent is 0.13~1.4. 如申請專利範圍第1項之樹脂層,其中前述硬化性樹脂組成物含有下述硬化性化合物(II)及下述非硬化性寡聚物(D):硬化性化合物(II):由硬化性樹脂組成物硬化時會進行硬化反應的硬化性化合物之1種以上構成,該硬化性化合物的至少1種具有在前述硬化性樹脂組成物硬化時不進行反應的羥基;非硬化性寡聚物(D):其係在硬化性樹脂組成物硬化時不會與前述硬化性化合物(II)進行硬化反應,且每1分子具有0.8~3個羥基的寡聚物。 The resin layer according to claim 1, wherein the curable resin composition contains the following curable compound (II) and the following non-curable oligomer (D): curable compound (II): curable One or more kinds of curable compounds which undergo a curing reaction when the resin composition is cured, and at least one of the curable compounds has a hydroxyl group which does not react when the curable resin composition is cured; a non-curable oligomer ( D): an oligomer which does not undergo a curing reaction with the curable compound (II) when the curable resin composition is cured, and has 0.8 to 3 hydroxyl groups per molecule. 如申請專利範圍第2項之樹脂層,其中前述硬化性化合物(II)係含有具硬化性基且具羥基的單體。 The resin layer of claim 2, wherein the curable compound (II) contains a monomer having a curable group and having a hydroxyl group. 如申請專利範圍第3項之樹脂層,其中前述硬化性化合物(II)係含有:寡聚物(A'),其具硬化性基且分子量為1000~100000;及單體(B'),其具硬化性基且分子量為125~600,並且該單體(B')含有具羥基的單體(B3)。 The resin layer of claim 3, wherein the curable compound (II) comprises: an oligomer (A') having a curable group and having a molecular weight of 1,000 to 100,000; and a monomer (B'). It has a hardening group and a molecular weight of 125 to 600, and the monomer (B') contains a monomer (B3) having a hydroxyl group. 如申請專利範圍第4項之樹脂層,其中前述非硬化性寡聚物(D)係聚氧伸烷基多元醇,且前述寡聚物(A')係使用聚氧伸烷基多元醇及聚異氰酸酯為原料進行合成的胺 甲酸酯寡聚物。 The resin layer of claim 4, wherein the non-hardening oligomer (D) is a polyoxyalkylene polyol, and the oligomer (A') is a polyoxyalkylene polyol and Amine synthesized by polyisocyanate as raw material Formate oligomer. 如申請專利範圍第4或5項之樹脂層,其中前述寡聚物(A')係具有丙烯酸基,而前述單體(B')之至少一部分係具有甲基丙烯酸基。 The resin layer of claim 4, wherein the oligomer (A') has an acrylic group, and at least a part of the monomer (B') has a methacryl group. 如申請專利範圍第6項之樹脂層,其中前述單體(B3)係含有甲基丙烯酸羥基酯,而該甲基丙烯酸羥基酯具有羥基數1~2且碳數3~8之羥烷基。 The resin layer of claim 6, wherein the monomer (B3) contains a hydroxy methacrylate, and the hydroxy methacrylate has a hydroxyalkyl group having 1 to 2 hydroxyl groups and 3 to 8 carbon atoms. 如申請專利範圍第7項之樹脂層,其中前述單體(B')係含有選自於由具有碳數8~22之烷基的甲基丙烯酸烷基酯所構成群組中的單體(B4)。 The resin layer of claim 7, wherein the monomer (B') contains a monomer selected from the group consisting of alkyl methacrylates having an alkyl group having 8 to 22 carbon atoms ( B4). 如申請專利範圍第8項之樹脂層,其係不含鏈轉移劑,或者含有鏈轉移劑,但其含量係相對於硬化性化合物(II)100質量份計在1質量份以下。 The resin layer of the eighth aspect of the invention is not a chain transfer agent or a chain transfer agent, but the content thereof is 1 part by mass or less based on 100 parts by mass of the curable compound (II). 如申請專利範圍第1或2項之樹脂層,其係光硬化性。 The resin layer of claim 1 or 2 is photocurable. 一種層積體,係將至少一者為透明之一對面材隔著如申請專利範圍第1至10項中任一項之樹脂層進行層積而一體化,。 A laminate in which at least one of the transparent facing materials is laminated by laminating a resin layer as disclosed in any one of claims 1 to 10. 如申請專利範圍第11項之層積體,其中前述一對面材之一者係透明面材,而另一者係顯示元件。 A laminate according to claim 11, wherein one of the pair of face materials is a transparent face material, and the other is a display member. 如申請專利範圍第12項之層積體,其中前述顯示元件係液晶顯示元件。 The laminate of claim 12, wherein the display element is a liquid crystal display element. 一種層積體之製造方法,該欲製造之層積體係具備有:第1面材及第2面材、由該第1面材及第2面材所夾持的樹脂層、以及包圍樹脂層周圍的密封部,該製造方法包含: (a)在第1面材表面周緣部,塗佈液狀密封部形成用硬化性樹脂組成物而形成未硬化密封部之步驟,其中該液狀密封部形成用硬化性樹脂組成物含有硬化性化合物(I)及聚合起始劑;(b)對由未硬化密封部所包圍的區域,供應樹脂層形成用硬化性樹脂組成物的步驟;(c)在100Pa以下的減壓環境下,於前述樹脂層形成用硬化性樹脂組成物上重疊第2面材,而獲得已由第1面材、第2面材及未硬化密封部所密封之前述樹脂層形成用硬化性樹脂組成物之層積前驅體的步驟;及(d)在將層積前驅體放置於50kPa以上之壓力環境下的狀態下,使未硬化密封部及樹脂層形成用硬化性樹脂組成物進行硬化之步驟,其中,前述樹脂層形成用硬化性樹脂組成物經硬化而獲得之樹脂層,在動態黏彈性測定時,儲存剪切彈性模數係5×102~2.4×104Pa,且損失正切係0.13~1.4。 A method for producing a laminate comprising: a first face material and a second face material; a resin layer sandwiched between the first face material and the second face material; and a resin layer surrounding the resin layer In the surrounding sealing portion, the manufacturing method includes the steps of: (a) forming a uncured seal portion by applying a curable resin composition for forming a liquid seal portion on a peripheral edge portion of the first face material surface, wherein the liquid seal portion The curable resin composition for forming contains a curable compound (I) and a polymerization initiator; (b) a step of supplying a curable resin composition for forming a resin layer to a region surrounded by the uncured seal; (c) The second surface material is superposed on the curable resin composition for forming a resin layer in a reduced pressure environment of 100 Pa or less, and the resin which has been sealed by the first surface material, the second surface material, and the uncured seal portion is obtained. a step of laminating a precursor of a curable resin composition for forming a layer; and (d) curing the uncured seal portion and the resin layer in a state where the laminated precursor is placed under a pressure of 50 kPa or more. a step of hardening a resin composition, wherein The resin layer obtained by curing the curable resin composition for forming a resin layer, the shear elastic modulus is 5×10 2 to 2.4×10 4 Pa, and the loss tangent is 0.13 to 1.4 in the measurement of dynamic viscoelasticity. . 如申請專利範圍第14項之層積體之製造方法,其中前述第1面材及第2面材之其中一者係透明面材,另一者係顯示元件。 The method for producing a laminate according to claim 14, wherein one of the first surface material and the second surface material is a transparent surface material, and the other is a display element. 如申請專利範圍第14或15項之層積體之製造方法,其中前述硬化性化合物(I)係光硬化性化合物;前述密封部形成用硬化性樹脂組成物係含有光聚合起始劑(C1);前述樹脂層形成用硬化性樹脂組成物係由如申請專利範圍第10項之硬化性樹脂組成物構成;在前述步驟(d)中,係 對前述未硬化密封部及前述樹脂層形成用硬化性樹脂組成物施行光照射。 The method for producing a laminate according to the invention of claim 14 or 15, wherein the curable compound (I) is a photocurable compound; and the curable resin composition for forming a sealing portion contains a photopolymerization initiator (C1) The curable resin composition for forming a resin layer is composed of a curable resin composition as disclosed in claim 10; in the aforementioned step (d), The uncured seal portion and the curable resin composition for forming a resin layer are subjected to light irradiation.
TW100121056A 2010-06-16 2011-06-16 A hardened resin composition, a laminate using the same, and a method for producing the layered product (1) TWI549821B (en)

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