TWI549256B - 發光二極體模組之製造方法 - Google Patents

發光二極體模組之製造方法 Download PDF

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TWI549256B
TWI549256B TW101149450A TW101149450A TWI549256B TW I549256 B TWI549256 B TW I549256B TW 101149450 A TW101149450 A TW 101149450A TW 101149450 A TW101149450 A TW 101149450A TW I549256 B TWI549256 B TW I549256B
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light
lens
emitting diode
manufacturing
circuit board
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TW201426967A (zh
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賴志成
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鴻海精密工業股份有限公司
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Priority to US13/931,454 priority patent/US8950066B2/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/46—Measurement of colour; Colour measuring devices, e.g. colorimeters
    • G01J3/50—Measurement of colour; Colour measuring devices, e.g. colorimeters using electric radiation detectors
    • G01J3/501—Colorimeters using spectrally-selective light sources, e.g. LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting

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Description

發光二極體模組之製造方法
本發明涉及半導體發光領域，尤其涉及一種發光二極體模組之製造方法。
發光二極體（light emitting diode，LED）作為一種高效之發光源，具有環保、省電、壽命長等諸多特點已經被廣泛之運用於各種領域，目前將發光二極體應用於背光模組中已經成為產業之趨勢。習知之背光模組在製作過程中，會先將一電路板（PCB）上做為承載作為光源之LED之基板，繼而在PCB上用SMT(Surface Mount Technology)貼片機將LED元件貼片上去，藉由融化焊錫等工藝完成LED在電路板上之安裝，同時在LED上方覆蓋一擴散片來均勻光線。為進一步均勻光線，可以先在每個LED上對應加裝一個光學透鏡（Lens），然後固化，再完成擴散片組裝。
然，這種情況下LED與光學透鏡之配合就顯得更加重要，如果出現二者間之組裝偏位就會造成出光不均勻，後續背光模組在工作中將可能出現不均勻之亮暗帶現象。
一種發光二極體模組之製造方法，包括以下步驟：準備步驟，提供貼片機，該貼片機具有CCD圖像感測器，再提供條形電路板裝置於貼片機中，該電路板上間隔設置有複數發光二極體；裝置透鏡步驟，提供複數透鏡，利用貼片機之CCD圖像感測器成像識別透鏡，以檢查透鏡之相對位置，利用該貼片機之貼片工藝將該透鏡對應定位裝置於每一發光二極體上；光學效果量測步驟，提供擴散板罩置於該電路板上之發光二極體及透鏡上方，電連接該發光二極體使其發光，提供平面影像輝度計對該擴散板之出光面進行平面影像量測，並獲取光學效果影像；光學效果調整步驟，藉由電腦軟體分析光學效果影像得到所需光學效果補償資料，再根據補償資料局部微調該透鏡相對於對應發光二極體之位置，從而調整發光二極體模組之整體出光效果；固定透鏡步驟，固定透鏡於該電路板上。
與習知技術相比，本發明之發光二極體模組之製造方法中首先利用貼片機之CCD圖像感測器成像識別透鏡並將該透鏡對應定位裝置於每一發光二極體上，再提供平面影像輝度計對該擴散板之出光面進行平面影像量測，並獲取光學效果影像，然後藉由電腦軟體分析光學效果影像得到所需光學效果補償資料，再根據補償資料局部微調該透鏡相對於對應發光二極體之位置，從而調整發光二極體模組之整體出光效果，使得定位精確、有效，生產效率高，同時確保所製造之發光二極體模組具有較佳之出光效果。
請一併參閱圖1至圖4，本發明一實施例之發光二極體模組之製造方法，其包括以下步驟：
準備步驟S101，提供一貼片機100，該貼片機100具備CCD（Charge-Coupled Device）圖像感測器102，再提供至少一條形電路板10裝置於貼片機100中，該電路板10上間隔設置有複數發光二極體20；
裝置透鏡步驟S102，提供複數透鏡30，利用貼片機100之CCD圖像感測器102成像識別透鏡30，以檢查透鏡30之相對位置，利用該貼片機100之貼片工藝將該透鏡30對應定位裝置於每一發光二極體20上；
光學效果量測步驟S103，提供一擴散板40罩置於該電路板10上之發光二極體20及透鏡30上方，電連接該發光二極體20使其發光，提供一平面影像輝度計50對該擴散板40之出光面進行平面影像量測，並獲取光學效果影像；
光學效果調整步驟S104，藉由電腦軟體分析光學效果影像得到所需光學效果補償資料，再根據補償資料局部微調該透鏡30相對於對應發光二極體20之位置，從而調整發光二極體模組之整體出光效果；
固定透鏡步驟S105，固定透鏡30於該電路板10上。
具體地，該貼片機100之貼片工藝流程包括：首先該電路板10藉由傳送裝置被傳輸到固定位置並被夾板機構固定，貼片機100之吸嘴移至電路板10基準點上方，由CCD圖像感測器102對電路板10上基準點照相，確定電路板10之坐標系，當貼片機100之吸嘴吸取透鏡30後，由CCD圖像感測器102對透鏡30成像識別，確定透鏡30之坐標系，並將結果轉換為數位資訊形式經存儲、編碼、放大、整理和分析，再回饋到控制單元，由控制單元執行將吸嘴吸取透鏡30定位到電路板10上預定位置，最後完成貼片操作。
該透鏡30由光學性能良好之透明材料一體成型，如PMMA或PC塑膠。每一透鏡30對應蓋置於一發光二極體20上。該透鏡30水平貼置於該電路板10上。
該透鏡30包括入光面301、與入光面301相對設置之出光面302和連接該入光面301和出光面302之側壁面303。該透鏡30在其底面之中部區域開設一容置槽304對應容置該發光二極體20。該出光面302設於入光面301上方，該入光面301直接罩設在發光二極體20上。該透鏡30之尺寸大致在3mm左右。該貼片機100可以直接藉由識別整個透鏡30之外廓進行定位，節約工序時長，提高生產效率。
請同時參照圖5，進一步地，每一透鏡30上形成至少一圖案化光學識別部32，以供該貼片機100之CCD圖像感測器102識別。該光學識別部32之圖案尺寸大致在0.1mm左右。該光學識別部32形成於該透鏡30之入光面301、出光面302或側壁面303上。圖5中所示為該光學識別部32形成於該透鏡30之入光面301上。由於該透鏡30之光學識別部32之圖案尺寸大致在0.1mm左右，對貼片機100之CCD圖像感測器102之解析度要求較高，對透鏡30之定位也較精準。
可以理解地，該透鏡30之光學識別部32之數量可以為多個，這樣，可以實現對透鏡30之之位置作出細化調整，進而得到最佳化之定位效果。在本實施例中，該透鏡30之光學識別部32為三個，相互均勻、間隔設置。
與習知技術相比，本發明之發光二極體模組之製造方法中首先利用貼片機100之CCD圖像感測器102成像識別透鏡30並將該透鏡30對應定位裝置於每一發光二極體20上，再提供平面影像輝度計50對該擴散板40之出光面進行平面影像量測，並獲取光學效果影像，然後藉由電腦軟體分析光學效果影像得到所需光學效果補償資料，再根據補償資料局部微調該透鏡30相對於對應發光二極體20之位置，從而調整發光二極體模組之整體出光效果，使得定位精確、有效，生產效率高，同時確保所製造之發光二極體模組具有較佳之出光效果。
綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。
10．．．電路板
20．．．發光二極體
30．．．透鏡
301．．．入光面
302．．．出光面
303．．．側壁面
304．．．容置槽
32．．．光學識別部
40．．．擴散板
50．．．平面影像輝度計
100．．．貼片機
102．．．CCD圖像感測器
圖1是本發明一實施例之發光二極體模組之製造方法之流程圖。
圖2是圖1中所示發光二極體模組之製造方法之步驟S101中元件示意圖。
圖3是圖1中所示發光二極體模組之製造方法之步驟S102中元件示意圖。
圖4是圖1中所示發光二極體模組之製造方法之步驟S103中元件示意圖。
圖5是圖1中所示發光二極體模組之製造方法中透鏡之仰視示意圖。

Claims (10)

  1. 一種發光二極體模組之製造方法，包括以下步驟：
    準備步驟，提供貼片機，該貼片機具有CCD圖像感測器，再提供條形電路板裝置於貼片機中，該電路板上間隔設置有複數發光二極體；
    裝置透鏡步驟，提供複數透鏡，利用貼片機之CCD圖像感測器成像識別透鏡，以檢查透鏡之相對位置，利用該貼片機之貼片工藝將該透鏡對應定位裝置於每一發光二極體上；
    光學效果量測步驟，提供擴散板罩置於該電路板上之發光二極體及透鏡上方，電連接該發光二極體使其發光，提供平面影像輝度計對該擴散板之出光面進行平面影像量測，並獲取光學效果影像；
    光學效果調整步驟，藉由電腦軟體分析光學效果影像得到所需光學效果補償資料，再根據補償資料局部微調該透鏡相對於對應發光二極體之位置，從而調整發光二極體模組之整體出光效果；
    固定透鏡步驟，固定透鏡於該電路板上。
  2. 如申請專利範圍第1項所述的發光二極體模組之製造方法，其中該透鏡包括入光面、與入光面相對設置之出光面和連接該入光面和出光面之側壁面。
  3. 如申請專利範圍第2項所述的發光二極體模組之製造方法，其中該入光面直接罩設在發光二極體上，該出光面位於入光面之上方，該出光面為向上拱起之穹狀曲面。
  4. 如申請專利範圍第2項所述的發光二極體模組之製造方法，其中每一透鏡上形成有圖案化光學識別部，以供該貼片機之CCD圖像感測器識別。
  5. 如申請專利範圍第4項所述的發光二極體模組之製造方法，其中該光學識別部形成於該透鏡之入光面上。
  6. 如申請專利範圍第4項所述的發光二極體模組之製造方法，其中該光學識別部形成於該透鏡之出光面上。
  7. 如申請專利範圍第4項所述的發光二極體模組之製造方法，其中該光學識別部形成於該透鏡之連接面上。
  8. 如申請專利範圍第4項所述的發光二極體模組之製造方法，其中該光學識別部之數量為多個，光學識別部相互均勻、間隔設置。
  9. 如申請專利範圍第1項所述的發光二極體模組之製造方法，其中該貼片機之CCD圖像感測器藉由識別透鏡之外廓進行定位。
  10. 如申請專利範圍第1項至第9項中任一項所述的發光二極體模組之製造方法，其中該貼片機之貼片工藝流程包括：首先該電路板藉由貼片機之傳送裝置被傳輸到固定位置並被夾板機構固定，貼片機之吸嘴移至電路板上方，由CCD圖像感測器對電路板照相，確定電路板之坐標系，然後，貼片機之吸嘴吸取透鏡，由CCD圖像感測器對透鏡成像識別，確定透鏡之坐標系，並將結果轉換為數位資訊形式經存儲、編碼、放大、整理和分析，再回饋到控制單元，由控制單元執行將吸嘴及透鏡定位到電路板上預定位置，最後完成貼片操作。
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