TWI548877B - Connecting mechanism for semiconductor testing device - Google Patents

Description

Semiconductor component test connection mechanism

The invention relates to a semiconductor component test connection mechanism, in particular to a semiconductor component test connection mechanism suitable for connecting a test head and a needle tester.

There are several shortcomings regarding the conventional semiconductor component test connection mechanism. Firstly, the light source supply device blocks the pick-and-place path of the probe card, so that the operator must remove the light source supply device every time before the replacement operation can be performed, and the convenience is facilitated. It needs to be strengthened. Secondly, this kind of connection alignment method lacks buffering and adjustment mechanism, and it is easy to produce deviation during the connection and positioning process, and the accuracy is not high. Moreover, the circuit board must be connected with the test head by using various kinds of wires, and during the maintenance process, the test signal is abnormally transmitted and bent, and the stability of the test is lowered.

Inventors for this reason, in the spirit of active invention, thinking about a semiconductor component test connection mechanism that can solve the above problems, after several research experiments to complete the present invention.

The main object of the present invention is to provide a semiconductor component test connection mechanism. The main structure of the connection mechanism is disposed on the test head, so that the two can be coaxially inverted according to a pivot axis, which is different from the traditional structure body and the needle tester. The design mode is convenient for the user to install, repair and pick up the probe card, and at the same time, the fine adjustment mechanism during the connection enables the structural body to be horizontally overlapped with the needle measuring machine, thereby improving the accuracy of the connection positioning.

To achieve the above object, the semiconductor component test connection mechanism of the present invention is used for connecting a test head and a needle measuring machine, and includes a support portion, a main body portion and a set of ring portions. The support portion is fixed to the test head, and includes a connecting plate and a plurality of sliding columns, and each of the sliding columns is respectively fixed on the connecting plate, thereby being used as a sliding track when the main body portion slides. The main body portion comprises a structural body having a plurality of chutes, a plurality of buffering members and a plurality of latching members, each of the buffering members connecting the connecting plate and the structural body, and can be used as a fine adjustment buffering mechanism when the structural main body is connected and removed from the needle measuring machine. And each of the fastening components is disposed on the structural body to provide a buckle unit component. In the present invention, the latching member can be a latch so that the structural body and the collar portion can be coupled. The fastening component is matched with a collar portion fixed on the needle measuring machine, and has a plurality of locking grooves respectively engageable with each of the fastening members, and a plurality of oblique grooves respectively sliding each guiding column . Thereby, the two are fixedly combined by means of a rotational engagement.

In addition, the main body portion may further include a light source supply device disposed in one of the accommodating spaces of the structural body and electrically connected to the test head. The light source supply device can be an LED light source and is used as a light source supply device for image testing. Thereby, the light source supply device is disposed in the main body portion to enhance replacement or The convenience of detecting the probe card while properly utilizing the accommodation space in the structural device.

The main body portion can be further provided with a plurality of circuit boards which are disposed around the side surface of the structural body and electrically connected to the test head. Among them, the circuit board is used for image testing, and its bareness is fixed on the side surface of the structural body, which can increase the heat dissipation effect and facilitate the inspection of the appearance of the circuit board.

Wherein, the light source supply device may further comprise a plurality of positioning holes corresponding to the plurality of positioning pins connected to the needle measuring machine. Each of the circuit boards further includes a plurality of slots corresponding to the plurality of positioning contacts of the needle measuring machine. Thereby, the components of the structural body can be more accurately engaged on the needle measuring machine, thereby providing the most perfect detection environment, and also avoiding the occurrence of light leakage of the light source supply device.

Furthermore, each of the buffering members may be a spring, and the characteristics of the spring telescopic deformation may improve the uneven force or unevenness of the structural body when the positional engagement of the needle measuring machine is performed. Further, each of the buffering members may be a pneumatic cylinder, and the interaction between the pneumatic piston rod and the air cushion gas provides a buffer adjustment in the longitudinal direction, which can also improve the uneven force applied when the structural body is aligned with the needle measuring machine. Or uneven state.

An elastic member covering the strut can be separately disposed in each of the sliding grooves. Thereby, the buffer displacement in the horizontal direction when the structural body is aligned with the needle measuring machine is provided, and the precision of the joint is improved.

The above summary and the following detailed description are exemplary in order to further illustrate the scope of the invention. Other objects and advantages of the present invention will be described in the following description and drawings.

1‧‧‧Semiconductor component test connection mechanism

10‧‧‧Semiconductor component tester

101‧‧‧Support arm

102‧‧‧ pivot shaft

2‧‧‧Support

20‧‧‧Test head

21‧‧‧Link board

22‧‧‧Sliding column

23‧‧‧Flexible components

3‧‧‧ Main body

31‧‧‧Structural subject

311‧‧ ‧ chute

312‧‧‧ accommodating space

32‧‧‧ cushioning parts

33‧‧‧Card fasteners

4‧‧‧ collar

40‧‧‧needle measuring machine

401‧‧‧Locating pin

402‧‧‧ Positioning contacts

41‧‧‧Snap slot

42‧‧‧ oblique slot

43‧‧‧ Guide column

5‧‧‧Light source supply device

51‧‧‧Positioning holes

52‧‧‧Reminder

6‧‧‧Circuit board

61‧‧‧ slots

7‧‧‧ probe card

9‧‧‧Semiconductor component test connection mechanism

902‧‧‧ pivot bearing

931‧‧‧ Structure subject

94‧‧‧Needle measuring machine

941‧‧‧Locating pin

942‧‧‧Slots

95‧‧‧Light source supply unit

96‧‧‧ boards

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view showing the joined state of a semiconductor component test connection mechanism in accordance with a preferred embodiment of the present invention.

2 is a perspective view showing a separated state of a semiconductor component test connection mechanism according to a preferred embodiment of the present invention.

Fig. 3 is a partially enlarged view showing the separated state of the semiconductor element test connection mechanism of Fig. 2.

4 is a cross-sectional view along line A-A showing the locked state of the semiconductor component test connection mechanism in accordance with a preferred embodiment of the present invention.

Figure 5 is a cross-sectional view along line A-A of the state in which the semiconductor component test connection mechanism of the preferred embodiment of the present invention is removed.

Figure 6 is a partial cross-sectional view, taken along line A-A, of the locked state of the semiconductor component test connection mechanism in accordance with a preferred embodiment of the present invention.

Figure 7 is a partial cross-sectional view, taken along line A-A, of the state in which the semiconductor component test connection mechanism of the preferred embodiment of the present invention is removed.

Figure 8 is a perspective view of a semiconductor component test connection mechanism in accordance with another preferred embodiment of the present invention.

1 to 3 are a perspective view showing a joined state of a semiconductor component test connection mechanism according to a preferred embodiment of the present invention, a perspective view of a separated state, and a partially enlarged view of a separated state. A semiconductor is shown in Figures 1-3. The component test connection mechanism 1 is disposed in a semiconductor component testing device 10, and is mainly used to connect one of the test heads 20 and a needle measuring machine 40. The test head 20 is pivotally mounted on the needle by a support arm 101. One of the measuring machines 40 pivots on the shaft 102. However, since one of the structural members 31 of the semiconductor component test connection mechanism 1 is disposed on the test head 20, the two can be coaxially inverted according to the pivot axis 102, which is different from The design mode in which the traditional structural body is connected to the needle measuring machine can be reversed as shown in FIG. 1 and FIG. 2 .

2 and FIG. 3, the semiconductor component test connection mechanism 1 of the present invention mainly comprises three major parts, including a support portion 2 fixed to the test head 20, and a main body portion on which the circuit board 6 is mounted on the outer surface. 3 and a set of ring portions 4 fixed to the needle measuring machine 40. The foregoing circuit board 6 is disposed on the main body portion 3 in a configuration of a bare structure, which can increase the heat dissipation effect and facilitate inspection of the appearance of the circuit board.

The support portion 2 of the test head 20 supports and fixes the main body portion 3 of the lower connecting mechanism to the test head 20 by a connecting plate 21, and at the same time, four sliding posts 22 are additionally fixed on the connecting plate 21, thereby serving as a main body portion. 3 Sliding track when sliding.

The main body 3 includes a structural body 31 having a plurality of sliding grooves 311 (shown in FIG. 4), a plurality of cushioning members 32, and a plurality of latching members 33. In the embodiment, the buffering member 32 is a spring. However, not limited thereto, any component that can provide a buffering force of the structural body 31, such as a pneumatic cylinder, is within the scope of the patent protection of the present invention. Each of the buffering members 32 is connected to the connecting plate 21 and the structural body 31 by a hook. In addition, each of the fastening members 33 is disposed on the structural body 31 to provide a buckle unit. In the present invention, a latch may be provided so that the structural body 31 and the collar portion 4 can be coupled. The structure main body 31 of the main body portion 3 is a hollow frame body having an accommodating space 312 for storing different test kits. In the embodiment, the accommodating space 312 is provided with a light source supply device 5, which is An LED light source is electrically connected to the test head 20 for supply as a light source for image testing.

The above is the respective members connected to the test head 20, and it is again emphasized that the above-described structure has the pivot axis 102 as a pivot axis, and has the property of being coaxially inverted, and can be turned over at least 90 degrees. Next, referring to FIG. 2 and FIG. 3 again, the collar portion 4 disposed on the needle measuring machine includes a plurality of locking grooves 41 and a plurality of oblique grooves 42. The plurality of locking grooves 41 are in the structural body 31 and the collar. During the process of joining the upper and lower portions of the portion 4, the first fastening member 33 is firstly engaged with the locking member 33, so that the structure of the collar portion 4 and the structural body 31 are integrated, and then the rotation is engaged to make the structure pass through the plurality of guides. The columns 43 are respectively slid down along the trajectory of each of the oblique grooves 42 to complete the integral joining operation.

4 and FIG. 5 are a cross-sectional view along the line A-A and a cross-sectional view of the removed state of the semiconductor device test connection mechanism in a locked state according to a preferred embodiment of the present invention. As described above, in the present invention, after the plurality of snap grooves 41 and the snap members 33 are first engaged, in order to achieve the horizontal joint step, the following two situations are included in the process, one of which is a locked state. The second is the dismounting state.

In the locked state, as shown in FIG. 4, the entire structural body 31 and the collar portion 4 are engaged with the lower guide measuring machine 40, and each oblique groove 42 is relatively slipped corresponding to the guiding post 43 to reach the locked state. At this time in the portrait The buffer member 32 connecting the support portion 2 and the structural body 31 will be elongated as the overall position moves downward, so that the connecting plate 21 and the structural body 31 are separated by a distance D, which is reachable in this embodiment. 30 mm. In the lateral direction, the connecting mechanism of the present invention is slid in the plurality of sliding grooves 311 through the plurality of spools 22, and is filled with elastic members 23 therebetween. In the present embodiment, a spring is coated on the outer periphery of the sliding column 22. , can effectively prevent unnecessary lateral offset and improve the accuracy of alignment.

In the unloading state, as shown in FIG. 5, the entire structural body 31 and the collar portion 4 have been separated from the lower guide measuring machine 40, and each oblique groove 42 is relatively slipped corresponding to the guide post 43 on the side and returned. In the unloading state, the buffer member 32 connecting the support portion 2 and the structural body 31 is restored to the original length as the overall position is moved in the longitudinal direction, so that the distance between the collar portion 4 and the surface of the needle measuring machine 40 is a distance D. In this embodiment, it can be up to 30 mm. Thereby, the fine adjustment buffer mechanism is used to make the structural body horizontally overlap the needle measuring machine in a stable state, thereby improving the accuracy of the connection positioning.

Furthermore, referring to FIG. 6 and FIG. 7 , FIG. 6 is a partial cross-sectional view showing a locked state of a semiconductor component test connection mechanism according to a preferred embodiment of the present invention, and a partial cross-sectional view of the AA portion of the removal state, and may also refer to FIG. 3, which includes Internal structural features. As shown in FIG. 6, the light source supply device 5 is located in one of the accommodation spaces 312 of the structural body 31. In the locked state, in order to avoid the occurrence of light leakage of the light source during the test, it is necessary to ensure that the light source supply device 5 can abut against one of the probe cards 7 in the needle measuring machine 40. Therefore, the present invention is in the structural body 31 except that a plurality of positioning holes 51 are provided on the outer casing of the light source supply device 5 to thereby align the plurality of positioning pins 401 of the alignment measuring machine 40. The light source supply device 5 is further provided with a plurality of abutting members 52. In the present embodiment, the plurality of springs are also used. The two sides are closely adhered to each other by the compression thrust of the spring, so that the light source leakage phenomenon can be effectively avoided. In addition, the probe card 7 includes a plurality of positioning contacts 402. In the locked state, the slots 61 of each circuit board 6 can be correspondingly connected, so that the circuit board 6 is inserted into the horizontally placed probe card 7 in a vertical direction. In the slot 61, the image detecting signal can be supplied into the wafer connected to the probe card, thereby screening for defective products for subsequent packaging work.

Similarly, as shown in FIG. 7, in the unloading state, when the structural body 31 and the collar portion 4 are moved upward by the aforementioned distance D, regardless of the positioning hole 51 of the light source supply device 5 or the insertion on the circuit board 6, The slots 61 are detached from the corresponding positioning pins 401 and the positioning contacts 402. Further, the plurality of pushing members 52 can be restored to the original length to suspend the light source supply device 5. With the above design, the semiconductor component test connection mechanism of the present invention can more accurately snap the components of the structural body to the needle measuring machine, thereby providing the most perfect detection environment, and also avoiding the occurrence of light leakage of the light source supply device. .

As shown in FIG. 8, a perspective view of a semiconductor component test connection mechanism according to another preferred embodiment of the present invention. The semiconductor component test connection mechanism 9 is disposed on a probe 94, and mainly includes a structural body 931, a plurality of circuit boards 96, and corresponding positioning pins 941 and slots 942. The structural body 931 is pivotally mounted on a pivot bearing 902, such that the structural body 931 is a single-sided fixed upper cover body, and a plurality of circuit boards 96 are fixed around the circuit board. Connect the test head to provide image test signal control. In addition, when the structural body 931 is covered back to the needle measuring machine 94, it will be on The structure main body 931 and the circuit board 96 are correspondingly engaged to the positioning pin 941 and the slot 942, and the test operation can be performed after completion; otherwise, when the structure main body 931 is in the upper state and the light source supply device 95 is removed, the operation can be performed. Replace the probe card or repair or update the internal components.

The above-mentioned embodiments are merely examples for convenience of description, and the scope of the claims is intended to be limited to the above embodiments.

1‧‧‧Semiconductor component test connection mechanism

101‧‧‧Support arm

102‧‧‧ pivot shaft

2‧‧‧Support

20‧‧‧Test head

21‧‧‧Link board

22‧‧‧Sliding column

3‧‧‧ Main body

31‧‧‧Structural subject

32‧‧‧ cushioning parts

33‧‧‧Card fasteners

4‧‧‧ collar

40‧‧‧needle measuring machine

41‧‧‧Snap slot

42‧‧‧ oblique slot

43‧‧‧ Guide column

5‧‧‧Light source supply device

6‧‧‧Circuit board

Claims (9)

A semiconductor component test connection mechanism for connecting a test head and a needle tester, comprising: a support portion fixed to the test head, comprising a connecting plate and a plurality of sliding columns, wherein each sliding column is separately fixed The main body portion includes a structural body having a plurality of sliding grooves, a plurality of buffering members and a plurality of fastening members, wherein each of the buffering members is connected to the connecting plate and the structural body, and each of the fastening members The utility model is disposed on the main body of the structure; and a ring portion is fixed on the needle measuring machine, and has a plurality of snap grooves respectively engageable with each of the fastening members, and each of the guiding columns is respectively slid Complex diagonal slots. The semiconductor component test connection mechanism of claim 1, wherein the body portion further comprises a light source supply device disposed in an accommodation space of the structure body and electrically connected to the test head. The semiconductor component test connection mechanism of claim 1, wherein the main body portion is provided with a plurality of circuit boards disposed on a side surface of the structure body and electrically connected to the test head. The semiconductor component test connection mechanism of claim 2, wherein the light source supply device further comprises a plurality of positioning holes, which are corresponding to the plurality of positioning pins of the needle measuring machine. The semiconductor component test connection mechanism of claim 3, wherein each of the circuit boards further comprises a plurality of slots corresponding to the plurality of positioning contacts of the needle measuring machine. The semiconductor component test connection mechanism of claim 1, wherein each of the buffer members is a spring. The semiconductor component test connection mechanism of claim 1, wherein each of the buffer members is a pneumatic cylinder. The semiconductor component test connection mechanism of claim 1, wherein each of the chutes is provided with an elastic member covering the spool. The semiconductor component test connection mechanism of claim 1, wherein the fastening component is a latch.