TWI544983B - Composite diamond cutter and method of manufacturing the same - Google Patents

Description

Composite diamond cutting knife and manufacturing method thereof

The present invention relates to a composite diamond cutting knife, and more particularly to a composite copper and nickel diamond cutting knife. The invention also relates to a method of making the composite diamond cutting knife.

In the manufacturing process of many products, it is necessary to cut raw materials or semi-finished products of various materials. Among them, the physical characteristics of the cutting blade and the service life are critical to mastering the quality and cost of the cutting program. In the manufacturing process of electronic components (for example, semiconductor components), the trend of miniaturization of electronic products today has increasingly strict standards for the accuracy of the cutting process. Therefore, it is necessary to further improve the characteristics of existing cutting knives to meet the needs of today's industry.

In the Chinese Patent Application Publication No. 1245745, a production technique of a composite saw blade is disclosed, which uses an electroplating technique to produce a diamond layer, and uses a hot pressing technique to join the aforementioned diamond layer and the non-diamond layer. The electroplated metal layer of the composite saw blade is exposed to the outside, and is not protected by other plating layers, and is easily oxidized. Moreover, the production technology requires the low-temperature sintering to fix the electroplated diamond layer to the non-diamond layer, which is cumbersome.

In Chinese Patent Application Publication No. 101716803, a copper-based diamond saw blade is disclosed, which is composed of a cutter head and a copper base, wherein the cutter head is made of metal powder, abrasive, diamond and nai. The rice grade diamond is mixed and fired. Among them, the copper-based diamond saw blade is formed by using metal sintered diamond, and the diamond saw blade obtained by the electroplating method is inferior in strength and life.

Japanese Patent Application Laid-Open No. H10177975 discloses a cutting blade comprising a rotary hub composed of an aluminum alloy, a cutting edge composed of nickel or a nickel alloy, and a film on the surface of the cutting edge. Wherein the film is composed of nickel or a nickel alloy containing fullerene (C ₆₀ ). Wherein, the cutting edge of the cutting blade and the film on the surface of the cutting edge are mainly composed of nickel or nickel alloy, and the multi-layer plating structure is not effective for reinforcing the deficiency of the nickel metal in ductility and softness.

The above-mentioned saw blade or cutting blade of the prior art is composed of a plurality of materials, but there is still room for improvement in physical properties and service life, and it is difficult to effectively improve cutting quality and control cost. Therefore, it is necessary to develop a novel composite diamond cutter to meet the needs of today's industry.

In order to improve the cutting quality and control the cost, the present invention provides a composite diamond cutting knife and a composite diamond cutting knife manufacturing method.

To achieve the above and other objects, a composite diamond cutting blade of the present invention comprises: a rigid cutting layer comprising an electroplated nickel metal and a plurality of diamond abrasives; and a soft cutting layer comprising an electroplated copper metal And a plurality of diamond abrasives; wherein the rigid cutting layer and the soft cutting layer are stacked in a staggered manner to form a composite cutting body, wherein the composite cutting body has a multilayer structure of 2-10 layers.

The composite diamond cutting blade may further include an electroplated nickel protective layer respectively disposed on two outer sides of the composite cutting body, so that the composite cutting body is sandwiched between the electroplated nickel protective layers .

In the above composite diamond cutting blade, the composite cutting system is a three-layer structure comprising two layers of the rigid cutting layer and one layer of the soft cutting layer, and the soft cutting layer is sandwiched between the rigid cutting layers. Between the layers.

In the above composite diamond cutting blade, the composite cutting system is a three-layer structure comprising one layer of the rigid cutting layer and two layers of the soft cutting layer, and the rigid cutting layer is sandwiched between the soft cutting layers Between the layers. Preferably, the soft cutting layers have a thickness of 45 microns; the rigid cutting layer has a thickness of 10 microns.

In the above composite diamond cutting blade, the composite cutting system is a 5-layer structure comprising three layers of the rigid cutting layer and two layers of the soft cutting layer, and the two outer layers are the rigid cutting layer.

In the above composite diamond cutting blade, the composite cutting system has a 5-layer structure comprising two layers of the rigid cutting layer and three layers of the soft cutting layer, and the two outer layers are the soft cutting layer. Preferably, the soft cutting layers have a thickness of 30 microns; the rigid cutting layers have a thickness of 5 microns.

The composite diamond cutting blade described above, wherein the thickness of the rigid cutting layer is 1 to 50 micrometers, preferably the thickness of the rigid cutting layer is 2 to 15 micrometers, and more preferably the thickness of the rigid cutting layer is 5 The thickness of the soft cutting layer is 1 to 80 μm, preferably the thickness of the soft cutting layer is 10 to 50 μm, and more preferably the thickness of the soft cutting layer is 30 to 45 μm.

In the above composite diamond cutting blade, the thickness of the composite cutting body is 10 to 200 micrometers, preferably the thickness of the composite cutting body is 50 to 150 micrometers, and more preferably the thickness of the composite cutting body is 80 to 120 microns.

In the above composite diamond cutting blade, the rigid cutting layer and the soft cutting layer have the same thickness; or the rigid cutting layer and the soft cutting layer have different thicknesses.

In the above composite diamond cutting blade, the rigid cutting layer or the soft cutting layer contains 5 to 30% by weight of the diamond abrasives.

In the above composite diamond cutting blade, the rigid cutting layer and the soft cutting layer have the same diamond abrasive content; or the rigid cutting layer and the soft cutting layer have different diamond abrasive contents.

The above composite diamond cutting knives, wherein the diamond abrasives may have a particle diameter of 5 to 75 microns.

In the above composite diamond cutting blade, the rigid cutting layer and the soft cutting layer have the same particle diameter of the diamond abrasive; or the rigid cutting layer and the soft cutting layer have different grains of the diamond abrasive path.

The above composite diamond cutting knife, wherein the composite diamond cutting knife can be annular.

In order to achieve the above and other objects, a method for manufacturing a composite diamond cutting blade according to the present invention comprises: taking a metal substrate, performing pretreatment on the surface thereof, removing oxides and other impurities on the surface thereof, so as to enable The metal substrate meets the requirements of electroplating; an electroplated copper layer containing no diamond abrasive is formed on the surface of the metal substrate by electroplating; Interlacing the following two steps at least once: placing the metal substrate containing the electroplated copper layer into a copper-plated bath containing diamond abrasive for electroplating to form a soft cutting layer containing copper and a plurality of diamond abrasives; The metal substrate of the copper layer is placed in a nickel plating bath containing diamond abrasive for electroplating to form a rigid cutting layer containing nickel and a plurality of diamond abrasives; thereby, the rigid cutting layer and the soft cutting layer are The composite cutting body is formed in a staggered manner to form a composite cutting body having a multilayer structure of 2 to 10 layers; and the metal substrate and the electroplated copper layer on the surface of the metal substrate are removed by an etching process.

The above method is to form an electroplated copper layer containing no diamond abrasive on the surface of the metal substrate, but the invention is not limited thereto, and those skilled in the art may, according to the needs of the user, or cooperate with the rigidity formed subsequently. / Soft cutting layer, the electroplated copper layer can be arbitrarily replaced with other different materials of electroplated metal layer (such as: electroplated nickel layer).

The method for manufacturing the composite diamond cutting blade may further include: after the metal substrate is to be removed, forming an electroplated nickel protective layer made of nickel on both outer sides of the composite cutting body by electroless plating or electroplating. The composite cutting body is sandwiched between the electroplated nickel protective layers.

The composite diamond cutting knife of the invention has the advantages of good rigidity, high strength and long service life compared with the prior art, and the thickness can be controlled between 10 and 200 micrometers, the cutting precision and the accuracy are high, the cost is low, and the application A wide range.

100‧‧‧Composite cutting body

101‧‧‧Metal substrate

110‧‧‧First soft cutting layer

111‧‧‧Diamond Abrasives

120‧‧‧First rigid cutting layer

130‧‧‧Second soft cutting layer

140‧‧‧Second rigid cutting layer

150‧‧‧ third soft cutting layer

210‧‧‧Electroplated nickel protective layer

220‧‧‧Electroplated nickel protective layer

S1‧‧‧Step 1

S2‧‧‧Step 2

S3‧‧‧Step 3

S4‧‧‧Step 4

1A is a schematic perspective view of a composite diamond cutting blade according to Embodiment 1 of the present invention.

1B is a cross-sectional view of the composite diamond cutting blade according to Embodiment 1 of the present invention along the A-A section.

[Fig. 2] is a preparation process of the composite diamond cutting knife of the first embodiment of the present invention.

FIG. 3 is a photograph of a composite diamond cutter according to Embodiment 1 of the present invention.

FIG. 4 is a cross-sectional view showing a composite diamond cutting blade according to Embodiment 3 of the present invention.

FIG. 5 is a photograph of a composite diamond cutting knife according to Embodiment 3 of the present invention.

6 is a cross-sectional view of a composite diamond cutting blade according to a fourth embodiment of the present invention.

In order to fully understand the objects, features and advantages of the present invention, the present invention will be described in detail by the following specific embodiments and the accompanying drawings.

Example 1

The structure of the composite diamond cutting blade of the embodiment 1 is as shown in FIG. 1A and FIG. 1B, which comprises the following structure: a first soft cutting layer 110 comprising a plated copper metal and a plurality of diamond abrasives 111; a first rigid cutting layer 120, which is an electroplated nickel metal and a plurality of diamond abrasives 111; a second soft cutting layer 130 comprising a plated copper metal and a plurality of diamond abrasives 111; wherein the soft cutting layers and the rigid cutting layers are stacked in a staggered manner to form a composite cutting body 100, such that the composite The cutting body 100 is a three-layered multilayer structure.

The composite diamond cutting blade of the first embodiment comprises two layers of the soft cutting layer and one layer of the rigid cutting layer, and the rigid cutting layer is sandwiched between the soft cutting layers, and the composite cutting body The metal materials are respectively copper-nickel-copper, and each of the cutting layers comprises a plurality of diamond abrasives.

The preparation process of the composite diamond cutting knife of Embodiment 1 is as described in the following steps 1 to 5 and shown in FIG. 2:

Step 1 (S1): taking a metal substrate 101 and performing a pretreatment operation on the surface thereof, sufficiently removing oxides and other impurities on the surface thereof, so that the metal substrate 101 meets the needs of electroplating, and is plated. In a manner, an electroplated copper layer containing no diamond abrasive is formed on the surface of the metal substrate 101, and has a thickness of about 1 to 2 μm (not shown). In this embodiment, the metal substrate 101 is an aluminum substrate, but the present invention is not limited thereto, and other metal substrates suitable for electroplating and suitable for removal by etching in the subsequent step 4 (S4) may be selected as the metal substrate. Metal substrate 101. The metal substrate 101 of the pre-treatment work is placed in a copper plating (copper sulfate) tank containing a diamond abrasive (content: 5 to 30%) for electroplating to form copper and a plurality of layers on the surface of the electroplated copper layer. The first soft cut layer 110 of the diamond abrasive 111. The plating time is controlled such that the first soft cutting layer 110 has a thickness of about 20 microns.

Step 2 (S2): After the first soft cutting layer 110 is completed, the first soft cutting layer 110 is subjected to a surface activation treatment. The surface-activated treatment, the metal substrate 101 including the electroplated copper layer and the first soft-cut layer 110 is placed in a nickel-plated (nickel sulfate) tank containing a diamond abrasive (content: 5 to 30%) for electroplating operation. Forming nickel and a plurality of diamond abrasives 111 on the first soft cutting layer 110 The first rigid cutting layer 120. The length of plating is controlled so that the first rigid cutting layer 120 has a thickness of about 20 microns.

Step 3 (S3): After the first rigid cutting layer 120 is completed, the first rigid cutting layer 120 is subjected to a surface activation treatment. The surface-activated treatment, the metal substrate 101 including the electroplated copper layer, the first soft-cut layer 110 and the first rigid-cut layer 120 is placed in a copper-plated (copper sulfate) tank containing a diamond abrasive (content 5 to 30%). The body performs an electroplating operation to form a second soft cut layer 130 containing copper and a plurality of diamond abrasives 111 over the first rigid cut layer 120. The plating time is controlled such that the second soft cutting layer 130 has a thickness of about 20 microns.

Step 4 (S4): After the second soft cutting layer 130 is completed, the metal substrate 101 and the electroplated copper layer on the surface of the metal substrate 101 are removed by an etching process to complete the composite diamond cutting blade of the first embodiment. .

In the preparation process of the first embodiment, the first soft cutting layer 110, the first rigid cutting layer 120 and the second soft cutting layer 130 are all formed by electroplating, and the thickness of the cutting layers can be effectively controlled to meet the thinning of the cutting blade. The need to improve cutting accuracy and accuracy.

In the composite diamond cutting blade of the first embodiment, the metal materials of the layers of the composite cutting body are respectively copper-nickel-copper, which has the ductility and softness of copper, and the copper strength is reinforced by the rigidity and hardness of nickel. Insufficient problems, with good physical properties, can make the cutting blade have good life and cutting efficiency. In the composite diamond cutting blade of the first embodiment, the composite cutting system is a three-layered multilayer structure, but the invention is not limited thereto, and the composite cutting body may be a multilayer structure of 2 to 10 layers, as long as the rigid cutting layer and The soft cutting layer is formed in a staggered manner to form the composite cutting body, so that the composite cutting body has excellent cutting performance and service life. For example, step 3 (S3) in the preparation process of the composite diamond cutting blade of Embodiment 1 can be omitted, and the composite cutting system of the diamond cutting blade is made of 2 layers. Multi-layer structure. Alternatively, step 2 (S2) and step 3 (S3) in the preparation process of the composite diamond cutting blade of the embodiment 1 may be further repeated, so that the composite cutting system of the diamond cutting blade has a multilayer structure of 4 to 10 layers.

In the composite diamond cutting blade of Embodiment 1, each layer of the composite cutting body comprises a plurality of diamond abrasives, so that the composite diamond cutting blade can provide cutting force by the diamond abrasives in the cutting process. The cutting blade has good cutting precision and accuracy as well as cutting efficiency.

A photograph of the composite diamond cutter of Example 1 is shown in FIG. The composite diamond cutting blade is annular, but the present invention is not limited thereto, and those skilled in the art to which the present invention pertains can adjust or modify the shape of the cutting blade according to different cutting requirements.

Example 2

The structure of the composite diamond cutting blade of the second embodiment is substantially the same as that of the first embodiment, but it comprises two rigid cutting layers and one soft cutting layer, and the metal materials of the composite cutting body are respectively nickel-copper. Nickel, and each of the cutting layers comprises a plurality of diamond abrasives.

The preparation process of the composite diamond cutter of the second embodiment is substantially the same as that of the first embodiment, in which a copper-plated copper layer is formed on the surface of the metal substrate, and then the step 1 (S1) is pretreated. The metal substrate of the operation is placed in a nickel-plated (nickel sulfate) tank containing diamond abrasive (5-30%) for electroplating to form a first rigidity containing nickel and a plurality of diamond abrasives on the surface of the electroplated copper layer. Cutting layer; step 2 (S2) is a surface-activated treatment, the metal substrate including the electroplated copper layer and the first rigid cutting layer is placed in a copper-plated (copper sulfate) tank containing diamond abrasive (content 5~30%) Performing an electroplating operation to form a first soft cut layer comprising copper and a plurality of diamond abrasives on the first rigid cut layer; and step 3 (S3) is to be surface activated, comprising an electroplated copper layer, first rigid The metal substrate of the cutting layer and the first soft cutting layer is plated with a nickel-plated (nickel sulfate) tank containing diamond abrasive (content 5 to 30%) for plating Working to form a second rigid cut layer comprising nickel and a plurality of diamond abrasives over the first soft cut layer.

The composite cutting body of the composite diamond cutting blade of the present invention can be a three-layer multi-layer structure, and the metal materials of the cutting layers can be copper-nickel-copper or nickel in sequence. - Copper-nickel. That is, the present invention does not particularly limit the metal material as the outermost layer structure, as long as the rigid cutting layer and the soft cutting layer are stacked in a staggered manner to form a composite cutting body, which can have a copper extension. Sex and softness, and the rigidity and hardness of nickel reinforced the problem of insufficient copper strength. In the preparation process of the composite diamond cutter of the first embodiment and the second embodiment, an electroplated copper layer containing no diamond abrasive is formed on the surface of the metal substrate, but the invention is not limited thereto, and is generally in the technical field. The knowledgeable person can replace the electroplated copper layer with other electroplated metal layers of different materials (for example, electroplated nickel layer) according to the user's needs or with the subsequently formed rigid/soft cutting layer.

Example 3

The structure of the composite diamond cutting blade of the third embodiment is as shown in FIG. 4, which is substantially the same as that of the first embodiment, but further includes an electroplated nickel protective layer 210, 220, and the electroplated nickel protective layers 210 and 220 are respectively disposed. The composite cutting body is sandwiched between the nickel plating protective layers on both outer sides of the composite cutting body.

The preparation process of the composite diamond cutting blade of Embodiment 3 is substantially the same as that of Embodiment 1, but further includes:

Step 5 (S5): After the metal substrate is to be removed, an electroplated nickel protective layer 210 made of nickel is formed on the surfaces of the first soft cutting layer 110 and the second soft cutting layer 130 by electroless plating or electroplating, respectively. 220.

The metal materials of the layers of the composite cutting body of the embodiment 3 are respectively copper-nickel-copper. By the electroplated nickel protective layers 210 and 220, the first soft cutting layer 110 and the second soft cutting layer 130 are directly exposed to the first soft cutting layer 110. In addition, the phenomenon of preventing the copper from coming into contact with the air to generate oxidation enhances the life and storage period of the cutting blade.

In addition, the electroplated nickel protective layers 210, 220 can also beautify the appearance of the cutting blade. A photograph of the composite diamond cutter of Example 3 is shown in FIG. The difference in appearance between the composite diamond cutters of Example 1 and Example 3 can be observed with reference to Figs. 3 and 5.

The composite diamond cutting blade of the embodiment 3 is further based on the cutting blade of the first embodiment, and further includes the electroplated nickel protective layers 210 and 220, but the present invention is not limited thereto. The electroplated nickel protective layers 210, 220 may also be further included in the embodiment 2 or the cutting blade of the fourth embodiment described below.

Example 4

The structure of the composite diamond cutting blade of the fourth embodiment is as shown in FIG. 6 and is substantially the same as that of the first embodiment, but the composite cutting body 100 is a five-layer structure containing three layers of the soft cutting layer and Two layers of the rigid cutting layer, and the two outer layers are the soft cutting layers. The composite diamond cutting blade of the embodiment 4 further includes: a second rigid cutting layer 140 comprising an electroplated nickel metal and a plurality of diamond abrasives 111; and a third soft cutting layer 150, It comprises an electroplated copper metal and a plurality of diamond abrasives 111.

The preparation process of the composite diamond cutting blade of Example 4 is substantially the same as that of Embodiment 1, but before the removal of the metal substrate in Step 4, steps 2 and 3 are sequentially repeated to make the composite cutting book. The body has a 5-layer structure. The metal materials of the layers of the composite cutting body are respectively copper-nickel-copper-nickel-copper, and each of the cutting layers comprises a plurality of diamond abrasives.

The composite diamond cutting blade of Embodiment 4 comprises a second rigid cutting layer and a third soft cutting layer, whereby the physical properties of the cutting blade can be further improved.

The composite diamond cutting blade of Example 4 further raised the number of layers of the multilayer structure of the composite cutting body of the cutting blade of Example 1 from 3 to 5, but the present invention is not limited thereto. Steps 2 and 3 may be repeated a plurality of times in sequence before removing the metal substrate in step 4 to further increase the number of layers of the multilayer structure of the composite cutting body of the cutting blade. The number of layers of the multilayer structure of the composite cutting body of the composite diamond cutting blade of the present invention is preferably 2 to 10 layers, and the number is not limited to the singular number. For example, the number of the cutting layers of the cutting blade may be that the metal materials of the layers of the four-layer composite cutting body are respectively copper-nickel-copper-nickel, and each of the cutting layers comprises a plurality of diamond abrasives.

The composite diamond cutting blade of the embodiment 4 is based on the cutting blade of the first embodiment, and further includes the second rigid cutting layer and the third soft cutting layer, but the invention is not limited thereto. The cutting blade according to the second embodiment further includes a second soft cutting layer and a third rigid cutting layer, wherein the metal materials of the layers of the composite cutting body are respectively nickel-copper-nickel-copper-nickel, and each of the cutting layers All contain multiple diamond abrasives.

According to the above embodiments 1 to 4, the composite diamond cutting blade of the invention has the advantages of good rigidity, high strength, long service life, etc., and its thickness can be controlled between 10 and 200 micrometers by its special composite structure. Cutting accuracy and accuracy, low cost, and a wide range of applications. The composite diamond cutting knife of the invention can meet the cutting requirements of the related industries in the process for semiconductor germanium wafer, C-MOS green glass, optical glass, quartz glass and the like.

Example 5

The structure of the composite diamond cutting blade of the embodiment 5 is substantially the same as that of the first embodiment, and further includes: a first soft cutting layer, a first rigid cutting layer and a second soft cutting layer, wherein the metal materials of the layers of the composite cutting body are respectively Copper-nickel-copper, but Example 5 further adjusts the thickness of the cut layers to further optimize the physical properties of the composite diamond cutter of Example 5. In the composite diamond cutting blade of Embodiment 5, the first soft cutting layer and the second soft cutting layer have a thickness of 45 μm; and the first rigid cutting layer has a thickness of 10 μm.

Example 6

The composite diamond cutting blade of Embodiment 6 has the same structure as Embodiment 4, and also includes: a first soft cutting layer, a first rigid cutting layer, a second soft cutting layer, a second rigid cutting layer, and a third soft cutting. The metal materials of the layers of the composite cutting body are respectively copper-nickel-copper-nickel-copper, but the embodiment 6 further adjusts the thickness of the cutting layers to further optimize the physics of the composite diamond cutting blade of the embodiment 6. characteristic. In the composite diamond cutting blade of Embodiment 6, the thickness of the first soft cutting layer, the second soft cutting layer and the third soft cutting layer is 30 micrometers; the thickness of the first rigid cutting layer and the second rigid cutting layer The system is 5 microns.

The invention has been described above in terms of the preferred embodiments, and it should be understood by those skilled in the art that the present invention is not intended to limit the scope of the invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention. Therefore, the scope of protection of the present invention is defined by the scope of the patent application.

100‧‧‧Composite cutting body

110‧‧‧First soft cutting layer

111‧‧‧Diamond Abrasives

120‧‧‧First rigid cutting layer

130‧‧‧Second soft cutting layer

Claims (15)

A composite diamond cutting blade comprising: a rigid cutting layer comprising an electroplated nickel metal and a plurality of diamond abrasives; and a soft cutting layer comprising an electroplated copper metal and a plurality of diamond abrasives; wherein the rigidity The cutting layer and the soft cutting layer are stacked in a staggered manner to form a composite cutting body, such that the composite cutting body has a multilayer structure of 2 to 10 layers, and the thickness of the composite cutting body is 10 to 200 microns. The composite diamond cutting blade according to claim 1, further comprising an electroplated nickel protective layer respectively disposed on two outer sides of the composite cutting body, wherein the composite cutting body is sandwiched between the plating Between the nickel protective layers. The composite diamond cutting blade according to claim 1, wherein the composite cutting system has a three-layer structure comprising two layers of the rigid cutting layer and one layer of the soft cutting layer, and the soft cutting layer is interposed. Between the rigid cutting layers. The composite diamond cutting blade according to claim 1, wherein the composite cutting system has a three-layer structure comprising one layer of the rigid cutting layer and two layers of the soft cutting layer, and the rigid cutting layer is interposed Between the soft cutting layers. The composite diamond cutting blade according to claim 1, wherein the composite cutting system has a 5-layer structure comprising three layers of the rigid cutting layer and two layers of the soft cutting layer, and the two outer layers are the rigidity. Cutting layer. The composite diamond cutting blade according to claim 1, wherein the composite cutting system has a 5-layer structure comprising 2 layers of the rigid cutting layer and 3 layers of the soft cutting layer, and the two outer layers are the soft layer. Cutting layer. The composite diamond cutting blade according to claim 1, wherein the rigid cutting layer has a thickness of 1 to 50 μm; and the soft cutting layer has a thickness of 1 to 80 μm. The composite diamond cutting blade according to claim 1, wherein the rigid cutting layer and the soft cutting layer have the same thickness; or the rigid cutting layer and the soft cutting layer have different thicknesses. The composite diamond cutting blade according to claim 1, wherein the rigid cutting layer or the soft cutting layer contains 5 to 30% by weight of the diamond abrasives. The composite diamond cutting blade according to claim 1, wherein the rigid cutting layer and the soft cutting layer have the same diamond abrasive content; or the rigid cutting layer and the soft cutting layer have different diamonds Abrasive content. The composite diamond cutting blade of claim 1, wherein the diamond abrasives have a particle size of 5 to 75 microns. The composite diamond cutting blade according to claim 1, wherein the rigid cutting layer and the soft cutting layer have the same particle diameter of the diamond abrasive; or the rigid cutting layer and the soft cutting layer have different The particle size of some diamond abrasives. The composite diamond cutting blade of claim 1, wherein the composite diamond cutting blade is annular. A method for manufacturing a composite diamond cutting knife comprises: taking a metal substrate, performing pretreatment on the surface thereof, removing oxides and other impurities on the surface thereof, so that the metal substrate meets the needs of electroplating; using electroplating The method comprises: forming a copper-plated copper layer without diamond abrasive on the surface of the metal substrate; staggering the following two steps at least once: The metal substrate including the electroplated copper layer is placed in a copper plating tank containing diamond abrasive for electroplating to form a soft cutting layer containing copper and a plurality of diamond abrasives; and the metal substrate containing the electroplated copper layer is placed Electroplating operation is performed on a nickel plating tank containing diamond abrasive to form a rigid cutting layer containing nickel and a plurality of diamond abrasives; thereby, the rigid cutting layer and the soft cutting layer are stacked in a staggered manner to form a composite cutting The main body is such that the composite cutting body has a multilayer structure of 2 to 10 layers; and the metal substrate and the electroplated copper layer on the surface of the metal substrate are removed by an etching process. The method for manufacturing a composite diamond cutting blade according to claim 14, further comprising: after the metal substrate is to be removed, by electroless plating or electroplating, respectively forming nickel on the outer sides of the composite cutting body The electroplated nickel protective layer is disposed between the electroplated nickel protective layer.