TWI534063B - Aligning system and aligning method using the same - Google Patents
Aligning system and aligning method using the same Download PDFInfo
- Publication number
- TWI534063B TWI534063B TW103139928A TW103139928A TWI534063B TW I534063 B TWI534063 B TW I534063B TW 103139928 A TW103139928 A TW 103139928A TW 103139928 A TW103139928 A TW 103139928A TW I534063 B TWI534063 B TW I534063B
- Authority
- TW
- Taiwan
- Prior art keywords
- materials
- platform
- opening
- gate
- thickness
- Prior art date
Links
Landscapes
- Sheets, Magazines, And Separation Thereof (AREA)
Description
本發明是有關於一種整列系統。 The present invention is directed to an array system.
一般之半導體元件中的小型料材於大量成型後,當要應用於半導體元件的製程時,通常需要先經過整列程序,以將原本擺放雜亂之料材整齊化。目前市面上的整列機通常係利用振動或搖擺的方式以整列料材。然而對於質輕的料材而言,振動與搖擺的方式皆無法達到整列的效果。且未整列的料材通常係成堆放置,若直接以吸附方式吸取料材,則容易一次吸附多片料材,反而會增加整列的複雜度。因此,如何有效率的將質輕的料材整列為目前業界需解決的問題之一。 In the case of a large number of semiconductor materials in a general semiconductor component, when it is to be applied to a semiconductor device, it is usually necessary to go through a series of procedures to align the originally disordered material. Currently, the entire array of machines on the market usually uses vibration or rocking to align the materials. However, for light materials, the vibration and rocking methods cannot achieve the effect of the whole column. The un-listed materials are usually placed in piles. If the material is directly absorbed by adsorption, it is easy to adsorb multiple pieces of material at one time, which will increase the complexity of the entire column. Therefore, how to efficiently sort the light materials into one of the problems that the industry needs to solve.
本發明之一態樣提供一種整列系統,用於整列形成一堆之複數個料材。整列系統包含平台、閘門、吸附裝置與撿料裝置。平台具有堆疊區與撿料區。該堆料材置於平台之堆疊區上。閘門置於平台上且具有開口。開口毗鄰平台 且位於堆疊區與撿料區之間。開口具有一高度,每一料材具有一厚度,該高度等於或大於該厚度之1倍且小於該厚度之2倍。平台置於料材與吸附裝置之間。吸附裝置用以透過平台而吸附部分之料材,並將被吸附之料材穿過閘門之開口而到達撿料區,使得穿過開口之料材互不堆疊。撿料裝置用以分別撿取位於撿料區之料材。 One aspect of the present invention provides an array system for forming a stack of a plurality of stocks in a row. The entire system includes platforms, gates, adsorption devices and skimmers. The platform has a stacking area and a picking area. The stack of materials is placed on the stacking area of the platform. The gate is placed on the platform and has an opening. Opening adjacent to the platform It is located between the stacking area and the picking area. The opening has a height, each material having a thickness equal to or greater than one time the thickness and less than two times the thickness. The platform is placed between the material and the adsorption device. The adsorption device is configured to adsorb a portion of the material through the platform, and pass the adsorbed material through the opening of the gate to the dip region so that the materials passing through the opening are not stacked with each other. The picking device is used to respectively pick up the material located in the picking area.
在一或多個實施方式中,吸附裝置為磁力產生裝置。 In one or more embodiments, the adsorption device is a magnetic force generating device.
在一或多個實施方式中,平台具有複數個貫穿孔,且吸附裝置為抽氣裝置。 In one or more embodiments, the platform has a plurality of through holes and the adsorption device is an air extraction device.
在一或多個實施方式中,閘門包含升降裝置,用以控制開口之高度。 In one or more embodiments, the gate includes a lifting device for controlling the height of the opening.
在一或多個實施方式中,整列系統更包含取像裝置,用以擷取位於撿料區之料材的影像。 In one or more embodiments, the array system further includes an image capture device for capturing images of the material located in the feed zone.
在一或多個實施方式中,整列系統更包含檢測系統,用以檢測被撿取之料材之正反面。 In one or more embodiments, the alignment system further includes a detection system for detecting the front and back of the captured material.
在一或多個實施方式中,檢測系統包含光源與成像幕。光源用以照射料材之側面。光源將料材之影像投射至成像幕。 In one or more embodiments, the detection system includes a light source and an imaging screen. The light source is used to illuminate the side of the material. The light source projects an image of the material onto the imaging screen.
本發明之另一態樣提供一種整列方法,用於整列形成一堆之複數個料材。整列方法包含將該堆料材置於平台之堆疊區上。設置一閘門於平台上。閘門具有開口。開口毗鄰平台且位於堆疊區與平台之撿料區之間。透過平台而吸附部分之料材。帶動被吸附之料材,穿過閘門之開口而到達 撿料區,使得穿過開口之料材互不堆疊。分別撿取位於撿料區之料材。 Another aspect of the present invention provides an arranging method for forming a stack of a plurality of stocks in a row. The alignment process involves placing the stack of materials on a stacking area of the platform. Set a gate on the platform. The gate has an opening. The opening is adjacent to the platform and is located between the stacking zone and the picking zone of the platform. A portion of the material is adsorbed through the platform. Drive the adsorbed material and pass through the opening of the gate to reach The material area is such that the materials passing through the openings are not stacked with each other. The materials in the dip area are separately taken.
在一或多個實施方式中,吸附部分之料材包含以磁力吸附料材。 In one or more embodiments, the material of the adsorbing portion comprises magnetically adsorbing the material.
在一或多個實施方式中,吸附部分之料材包含透過平台抽氣而吸附料材。 In one or more embodiments, the material of the adsorption section comprises pumping the material through the platform.
上述之整列系統與整列方法係利用吸附裝置吸附料材並通過開口,使得位於撿料區之料材互不堆疊,再以撿料裝置分別撿取位於撿料區之料材,因此能夠解決質輕或片狀之料材的整列問題,亦有助於簡化整列工序。 The above-mentioned collinear system and the whole column method utilize the adsorption device to adsorb the material and pass through the opening, so that the materials in the mashing area are not stacked with each other, and then the material in the mashing area is separately taken by the mashing device, so that the quality can be solved. The problem of the entire column of light or flake materials also helps to simplify the entire process.
110‧‧‧平台 110‧‧‧ platform
112‧‧‧堆疊區 112‧‧‧Stacking area
114‧‧‧撿料區 114‧‧‧捡料区
142、902‧‧‧影像 142, 902‧‧ images
150‧‧‧取像裝置 150‧‧‧Image capture device
160‧‧‧檢測系統 160‧‧‧Detection system
116‧‧‧貫穿孔 116‧‧‧through holes
120‧‧‧閘門 120‧‧ ‧ gate
122‧‧‧開口 122‧‧‧ openings
124‧‧‧升降裝置 124‧‧‧ Lifting device
126‧‧‧主體 126‧‧‧ Subject
128‧‧‧活動板體 128‧‧‧Active board
130‧‧‧吸附裝置 130‧‧‧Adsorption device
140‧‧‧撿料裝置 140‧‧‧Feeding device
162‧‧‧光源 162‧‧‧Light source
164‧‧‧成像幕 164‧‧‧Image screen
900、900a、900b‧‧‧料材 900, 900a, 900b‧‧‧ materials
900’‧‧‧料材堆 900’‧‧‧Material pile
910‧‧‧帽蓋 910‧‧‧ cap
920‧‧‧帽緣 920‧‧‧Mammal
H‧‧‧高度 H‧‧‧ Height
T‧‧‧厚度 T‧‧‧ thickness
S11、S13、S15、S17、S19‧‧‧步驟 S11, S13, S15, S17, S19‧‧ steps
第1圖與第2圖分別為本發明一實施方式之整列系統於不同操作步驟時的示意圖。 1 and 2 are schematic views of the entire system of the embodiment of the present invention in different operational steps.
第3圖為本發明一實施方式之整列方法的流程圖。 Figure 3 is a flow chart of a method of aligning an embodiment of the present invention.
第4圖為第2圖之撿料區的上視圖。 Figure 4 is a top view of the feed zone of Figure 2.
第5圖為本發明另一實施方式之整列系統的示意圖。 Figure 5 is a schematic illustration of an alignment system in accordance with another embodiment of the present invention.
第6圖為第1圖之閘門與平台的局部放大圖。 Figure 6 is a partial enlarged view of the gate and platform of Figure 1.
第7圖為本發明一實施方式之料材的示意圖。 Figure 7 is a schematic view of a material material according to an embodiment of the present invention.
第8圖為本發明又一實施方式之整列系統的撿料裝置與檢測系統的示意圖。 Figure 8 is a schematic diagram of a dip device and detection system of an array system according to still another embodiment of the present invention.
第9圖為第8圖之成像幕的正視圖。 Figure 9 is a front elevational view of the image forming screen of Figure 8.
以下將以圖示揭露本發明的複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本發明。也就是說,在本發明部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。 The embodiments of the present invention are disclosed in the drawings, and, in the However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.
第1圖與第2圖分別為本發明一實施方式之整列系統於不同操作步驟時的示意圖。整列系統用於整列形成一堆之複數個料材900(於後續內文中該堆料材900係簡稱料材堆900’)。整列系統包含平台110、閘門120、吸附裝置130與撿料裝置140。平台110具有堆疊區112與撿料區114。該堆料材900(即料材堆900’)置於平台110之堆疊區112上。閘門120置於平台110上且具有開口122。開口122毗鄰平台110且位於堆疊區112與撿料區114之間。開口122具有一高度H,每一料材900具有一厚度T,高度H等於或大於厚度T之1倍且小於厚度T之2倍。在一些實施方式中,高度H可為厚度T之1至1.5倍,在另一些實施方式中,高度H可為厚度T之約1.1至1.2倍。平台110置於料材900與吸附裝置130之間。吸附裝置130用以透過平台110而吸附部分之料材900,並將被吸附之料材900穿過閘門120之開口122而到達撿料區114,使得穿過開口122之料材900互不堆疊。撿料裝置140用以分別撿取位於撿料區114之料材900。 1 and 2 are schematic views of the entire system of the embodiment of the present invention in different operational steps. The entire column system is used to form a stack of a plurality of stock materials 900 (in the following text, the stack of materials 900 is referred to as a stock pile 900'). The alignment system includes a platform 110, a gate 120, an adsorption device 130, and a dip device 140. The platform 110 has a stacking area 112 and a dip area 114. The stack of materials 900 (i.e., the stock pile 900') is placed on the stacking area 112 of the platform 110. The gate 120 is placed on the platform 110 and has an opening 122. The opening 122 is adjacent to the platform 110 and is located between the stacking zone 112 and the dip zone 114. The opening 122 has a height H, and each of the materials 900 has a thickness T which is equal to or greater than 1 times the thickness T and less than 2 times the thickness T. In some embodiments, the height H can be from 1 to 1.5 times the thickness T, and in other embodiments, the height H can be from about 1.1 to 1.2 times the thickness T. The platform 110 is placed between the material 900 and the adsorption device 130. The adsorption device 130 is configured to adsorb a portion of the material 900 through the platform 110 and pass the adsorbed material 900 through the opening 122 of the gate 120 to the dip region 114 such that the materials 900 passing through the opening 122 are not stacked with each other. . The picking device 140 is configured to respectively pick up the material 900 located in the picking area 114.
在操作上,請一併參照第3圖,其為本發明一實施方式之整列方法的流程圖。首先如步驟S11所示,將該堆料材900(即料材堆900’)置於平台110之堆疊區112上。料材900例如為用於微積電系統(Micro Electro Mechanical System,MEMS)元件之材料,或者用於發光二極體之疊層結構之間的焊料。本實施方式之整列系統與整列方法有利於整列質輕的料材900,其無法以振動、搖擺或直接以吸取方式進行整列。然而在其他的實施方式中,料材900不以上述特性為限。在本實施方式中,以片狀之料材900作例示。 In operation, please refer to FIG. 3, which is a flowchart of the method of the entire column according to an embodiment of the present invention. First, the stack material 900 (i.e., the material pile 900') is placed on the stacking area 112 of the platform 110 as shown in step S11. The material 900 is, for example, a material for a micro electro mechanical system (MEMS) element, or a solder for a laminated structure of a light emitting diode. The collinear system and the collinear method of the present embodiment facilitate the arranging of the lightweight material 900, which cannot be oscillated by vibration, sway or directly by suction. However, in other embodiments, the material 900 is not limited to the above characteristics. In the present embodiment, the sheet material 900 is exemplified.
接著,如步驟S13所示,設置閘門120於平台110上。閘門120例如可為箱狀,其可倒置立於平台110上,以覆蓋料材堆900’。開口122設置於閘門120的側壁,因此當閘門120倒置於平台110時,開口122成為料材900自堆疊區112進入撿料區114的唯一通道。在其他的實施方式中,閘門120亦可不為箱形,基本上,只要置於堆疊區112之料材900僅能藉由通過開口122而進入撿料區114,皆在本發明之範疇中。 Next, as shown in step S13, the gate 120 is placed on the platform 110. The gate 120 can be, for example, a box shape that can be inverted upright on the platform 110 to cover the stock pile 900'. The opening 122 is disposed in the sidewall of the gate 120 such that when the gate 120 is inverted onto the platform 110, the opening 122 becomes the only passage for the material 900 to enter the dip zone 114 from the stacking zone 112. In other embodiments, the gate 120 may not be box-shaped. Basically, as long as the material 900 placed in the stacking zone 112 can only enter the dip zone 114 through the opening 122, it is within the scope of the present invention.
接著,如步驟S15所示,透過平台110而吸附部分之料材900,在本實施方式中,係以吸附裝置130進行吸附。吸附裝置130主要吸附位於料材堆900’底部的部分料材900。具體而言,大部分接觸平台110之料材900a係平躺於平台110上,因此吸附裝置130與該些平躺之料材900a之間具有較大的吸引力。反之,堆疊於料材900a上的其他料材900b則較不易被吸附裝置130所吸引。 Next, as shown in step S15, a part of the material 900 is adsorbed through the stage 110, and in the present embodiment, the adsorption is performed by the adsorption device 130. The adsorption unit 130 primarily adsorbs a portion of the material 900 located at the bottom of the stock pile 900'. In particular, most of the material 900a of the contact platform 110 lies flat on the platform 110, so that the adsorption device 130 has a greater attractive force with the flat materials 900a. Conversely, other materials 900b stacked on the material 900a are less likely to be attracted by the adsorption device 130.
接著,如步驟S17與第2圖所示,帶動被吸附之料材900,穿過閘門120之開口122而到達撿料區114,使得穿過開口122之料材900互不堆疊,在本實施方式中,係以吸附裝置130帶動被吸附之料材900。具體而言,如上所述,開口122之高度H等於或大於料材900之厚度T之1倍且小於厚度T之2倍,也就是說,僅單層之料材900可通過開口122,而第二層以上之料材900則會被開口122擋住而無法通過開口122。也就是說,位於料材堆900’底部且平躺於平台110之料材900a可藉由被吸附裝置130帶動而直接通過開口122。另一方面,僅管有部分堆疊於料材900a的其他料材900b可能會被吸附裝置130所吸附而被帶動,然而在到達開口122時,料材900b會被開口122擋住而被欄下,因此可確保在撿料區114之料材900皆互不堆疊。 Next, as shown in steps S17 and 2, the adsorbed material 900 is driven through the opening 122 of the gate 120 to reach the dip region 114, so that the materials 900 passing through the opening 122 are not stacked with each other. In the mode, the adsorbed material 900 is driven by the adsorption device 130. Specifically, as described above, the height H of the opening 122 is equal to or greater than 1 times the thickness T of the material 900 and less than 2 times the thickness T, that is, only a single layer of material 900 can pass through the opening 122. The material 900 of the second layer or more is blocked by the opening 122 and cannot pass through the opening 122. That is, the material 900a located at the bottom of the material pile 900' and lying flat on the platform 110 can pass directly through the opening 122 by being carried by the adsorption device 130. On the other hand, only the other material 900b partially stacked on the material 900a may be adsorbed by the adsorption device 130, but when the opening 122 is reached, the material 900b is blocked by the opening 122 and is placed under the column. It is thus ensured that the materials 900 in the dip area 114 are not stacked with each other.
接著,如步驟S19所示,分別撿取位於撿料區114之料材900,在本實施方式中,係以撿料裝置140撿取料材900。具體而言,撿料裝置140可以吸取或夾取的方式撿起每一料材900,並整齊地放置至其他載具或基板(未繪示)上,以完成整列工作。因在撿料區114之料材900互不堆疊,因此即使撿料裝置140以吸取的方式撿起料材900,亦不會同時吸取超過兩片料材900,有助於簡化整列工序。 Next, as shown in step S19, the material 900 located in the dip area 114 is separately extracted. In the present embodiment, the material 900 is picked up by the dip device 140. Specifically, the dip device 140 can pick up each material 900 in a sucking or gripping manner and place it neatly on other carriers or substrates (not shown) to complete the alignment. Since the materials 900 in the dip area 114 are not stacked with each other, even if the dip device 140 picks up the material 900 in a sucking manner, more than two sheets of material 900 are not sucked at the same time, which helps to simplify the entire process.
接著請一併參照第2圖與第4圖,其中第4圖為第2圖之撿料區114的上視圖。在本實施方式中,整列系統可更包含取像裝置150,用以擷取位於撿料區114之料材900的影像。具體而言,當吸附裝置130將料材900吸附至 撿料區114後,料材900之擺放方向是隨機的,如第4圖所示。因此在撿料裝置140進行撿料動作之前,取像裝置150可先擷取撿料區114的影像,以取得各料材900在平台110上的位置與擺放方向。因此撿料裝置140進行撿料動作時,可依據影像而定位至撿取位置,且可一併將被撿取之料材900旋轉至預定方位再放置於載具或基板上。 Next, please refer to FIG. 2 and FIG. 4 together, wherein FIG. 4 is a top view of the dip area 114 of FIG. In the present embodiment, the alignment system may further include an image capture device 150 for capturing images of the material 900 located in the feed zone 114. Specifically, when the adsorption device 130 adsorbs the material 900 to After the dip zone 114, the direction in which the material 900 is placed is random, as shown in FIG. Therefore, before the picking device 140 performs the picking action, the image capturing device 150 can first capture the image of the feeding area 114 to obtain the position and the placing direction of each material 900 on the platform 110. Therefore, when the feeding device 140 performs the feeding operation, the feeding device 140 can be positioned to the capturing position according to the image, and the material 900 to be taken can be rotated to a predetermined orientation and then placed on the carrier or the substrate.
請回到第1圖。在本實施方式中,料材900可為磁性物質,而吸附裝置130為磁力產生裝置。因此即使相隔平台110,吸附裝置130仍可吸附料材900。在一些實施方式中,吸附裝置130可為磁鐵或電磁鐵。當吸附裝置130為磁鐵時,吸附料材900的磁力強度可藉由改變吸附裝置130與料材900之間的距離而改變(例如在平台110與吸附裝置130之間加入厚度不同的墊片),以取得較合適的吸附力。當吸附裝置130為電磁鐵時,則可藉由調整其電流強弱而決定吸附力的強度。 Please return to Figure 1. In the present embodiment, the material 900 may be a magnetic substance, and the adsorption device 130 is a magnetic force generating device. Therefore, even if the platform 110 is separated, the adsorption device 130 can adsorb the material 900. In some embodiments, the adsorption device 130 can be a magnet or an electromagnet. When the adsorption device 130 is a magnet, the magnetic strength of the adsorption material 900 can be changed by changing the distance between the adsorption device 130 and the material 900 (for example, a gasket having a different thickness is added between the platform 110 and the adsorption device 130) In order to obtain a more suitable adsorption force. When the adsorption device 130 is an electromagnet, the intensity of the adsorption force can be determined by adjusting the current intensity.
然而吸附裝置130不以磁力產生裝置為限。請參照第5圖,其為本發明另一實施方式之整列系統的示意圖。在本實施方式中,平台110具有複數個貫穿孔116,且吸附裝置130為抽氣裝置,因此吸附裝置130即藉由對貫穿孔116抽氣而使得置於料材堆900’底部之料材900被吸附於平台110上。因本實施方式之吸附裝置130係以氣壓差而吸附料材900,因此料材900可不必然為磁性物質。至於本實施方式的其他細節因與第1圖相同,因此便不再贅述。 However, the adsorption device 130 is not limited to the magnetic force generating device. Please refer to FIG. 5, which is a schematic diagram of an entire system according to another embodiment of the present invention. In the present embodiment, the platform 110 has a plurality of through holes 116, and the adsorption device 130 is an air suction device. Therefore, the adsorption device 130 is configured to be placed at the bottom of the material pile 900' by pumping the through holes 116. 900 is adsorbed on the platform 110. Since the adsorption device 130 of the present embodiment adsorbs the material 900 by the difference in gas pressure, the material 900 is not necessarily a magnetic substance. Other details of the present embodiment are the same as those of Fig. 1, and therefore will not be described again.
接著請參照第6圖,其為第1圖之閘門120與平台110的局部放大圖。在本實施方式中,閘門120可包含升降裝置124,用以控制開口122之高度H。舉例而言,閘門120可包含主體126與活動板體128,升降裝置124用以控制活動板體128相對於主體126的位置,以在主體126與活動板體128之間形成不同高度H的開口122。因不同種類的料材900(如第1圖所示)具有不同的厚度T,因此只要依據料材900的厚度T(如第1圖所示)而調整開口122的高度H,即可整列不同料材900。其中升降裝置124例如為按鈕、轉軸或其他合適的移動裝置,本發明不以此為限。另外,亦可更換不同閘門120來整列不同種類的料材900。 Next, please refer to FIG. 6, which is a partial enlarged view of the shutter 120 and the platform 110 of FIG. In the present embodiment, the gate 120 may include a lifting device 124 for controlling the height H of the opening 122. For example, the shutter 120 can include a main body 126 and a movable plate body 128 for controlling the position of the movable plate body 128 relative to the main body 126 to form openings of different heights H between the main body 126 and the movable plate body 128. 122. Since different types of materials 900 (as shown in FIG. 1) have different thicknesses T, the height H of the openings 122 can be adjusted according to the thickness T of the material 900 (as shown in FIG. 1). Material 900. The lifting device 124 is, for example, a button, a rotating shaft or other suitable moving device, and the invention is not limited thereto. In addition, different gates 120 can be replaced to align different types of materials 900.
上述的內容皆以不具正反面之料材900作為例子,不過上述之整列裝置亦可用以整列具正反面料材900。舉例而言,請參照第7圖,其為本發明一實施方式之料材900的示意圖。在本實施方式中,料材900例如具有帽蓋910與帽緣920,亦即具有不同的正反面,因此在整列時,亦需一併分辨料材900的正反面。接著請一併參照第8圖與第9圖,其中第8圖為本發明又一實施方式之整列系統的撿料裝置140與檢測系統160的示意圖,第9圖為第8圖之成像幕164的正視圖。檢測系統160用以檢測被撿取之料材900之正反面。舉例而言,檢測系統160包含光源162與成像幕164。光源162用以照射料材900之側面。光源162將料材900之影像902投射至成像幕164。在第3圖之步驟S19後(亦即以撿料裝置140撿取料材900後),光源162便可照射料材900, 並投影料材900至成像幕164以形成影像902,其中第9圖之影像142為撿料裝置140被光源162投影至成像幕164的影像。因料材900之帽蓋910與帽緣920具有不同的寬度,因此投射至成像幕164的影像902亦具有不同的寬度,如此一來即可由影像902判斷出料材900的正反面,而後續再由撿料裝置140調整其正反面後放置於載具或基板上。然而上述之檢測系統160僅為例示,並非用以限制本發明。本發明所屬領域具通常知識者,可視實際情形,彈性選擇檢測料材900正反面之方法。 The above contents are all exemplified by the material 900 having no front and back surfaces, but the above-described arranging device can also be used to arrange the front and back fabric materials 900. For example, please refer to FIG. 7 , which is a schematic diagram of a material 900 according to an embodiment of the present invention. In the present embodiment, the material 900 has, for example, a cap 910 and a cap 920, that is, different front and back surfaces, so that the front and back surfaces of the material 900 need to be resolved together when the column is aligned. Referring to FIG. 8 and FIG. 9 together, FIG. 8 is a schematic diagram of the dip device 140 and the detection system 160 of the alignment system according to still another embodiment of the present invention, and FIG. 9 is an imaging screen 164 of FIG. Front view. The detection system 160 is used to detect the front and back of the captured material 900. For example, detection system 160 includes a light source 162 and an imaging screen 164. Light source 162 is used to illuminate the sides of material 900. Light source 162 projects image 902 of material 900 onto imaging screen 164. After step S19 of FIG. 3 (i.e., after the material 900 is picked up by the picking device 140), the light source 162 can illuminate the material 900. The material 900 is projected to the imaging screen 164 to form an image 902, wherein the image 142 of FIG. 9 is an image projected by the light source 142 onto the imaging screen 164 by the light source 162. Since the cap 910 of the material 900 and the cap 920 have different widths, the image 902 projected onto the imaging screen 164 also has a different width, so that the front and back of the material 900 can be judged by the image 902, and then Then, the feeding device 140 adjusts its front and back surfaces and then places it on the carrier or the substrate. However, the detection system 160 described above is merely illustrative and is not intended to limit the invention. A person skilled in the art to which the present invention pertains can flexibly select a method for detecting the front and back of the material 900, depending on the actual situation.
綜合上述,本發明各實施方式之整列系統與整列方法係利用吸附裝置吸附料材並通過開口,使得位於撿料區之料材互不堆疊,再以撿料裝置分別撿取位於撿料區之料材,因此能夠解決質輕或片狀之料材的整列問題,亦有助於簡化整列工序。 In summary, the collinear system and the collinear method of the embodiments of the present invention utilize the adsorption device to adsorb the material and pass through the opening, so that the materials in the mashing area are not stacked with each other, and then the picking device is separately taken from the mashing area. The material can solve the problem of the whole column of the light or flake material and also help to simplify the whole process.
雖然本發明已以實施方式揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.
110‧‧‧平台 110‧‧‧ platform
112‧‧‧堆疊區 112‧‧‧Stacking area
114‧‧‧撿料區 114‧‧‧捡料区
120‧‧‧閘門 120‧‧ ‧ gate
122‧‧‧開口 122‧‧‧ openings
130‧‧‧吸附裝置 130‧‧‧Adsorption device
140‧‧‧撿料裝置 140‧‧‧Feeding device
150‧‧‧取像裝置 150‧‧‧Image capture device
900‧‧‧料材 900‧‧‧Materials
900’‧‧‧料材堆 900’‧‧‧Material pile
H‧‧‧高度 H‧‧‧ Height
T‧‧‧厚度 T‧‧‧ thickness
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103139928A TWI534063B (en) | 2014-11-18 | 2014-11-18 | Aligning system and aligning method using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103139928A TWI534063B (en) | 2014-11-18 | 2014-11-18 | Aligning system and aligning method using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI534063B true TWI534063B (en) | 2016-05-21 |
TW201619026A TW201619026A (en) | 2016-06-01 |
Family
ID=56509318
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103139928A TWI534063B (en) | 2014-11-18 | 2014-11-18 | Aligning system and aligning method using the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI534063B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI753989B (en) * | 2017-01-16 | 2022-02-01 | 中國大陸商泰科電子(上海)有限公司 | System and method for feeding diaphragm |
-
2014
- 2014-11-18 TW TW103139928A patent/TWI534063B/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI753989B (en) * | 2017-01-16 | 2022-02-01 | 中國大陸商泰科電子(上海)有限公司 | System and method for feeding diaphragm |
Also Published As
Publication number | Publication date |
---|---|
TW201619026A (en) | 2016-06-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI680530B (en) | Apparatus for picking up a semiconductor chip | |
US20180102509A1 (en) | Display apparatus and method of manufacturing the same | |
JP5778054B2 (en) | Substrate processing apparatus and substrate processing method | |
TWI534063B (en) | Aligning system and aligning method using the same | |
JP2017084498A (en) | Transport device for electrode foil, and manufacturing device for lamination type battery | |
CN107444907A (en) | Take film device and take film method | |
KR20130099686A (en) | Apparatus and method of fabricating organic electroluminescence device | |
JP5058347B2 (en) | Electronic component mounting device | |
KR101739714B1 (en) | Detection method and detection device | |
JP2010087062A (en) | Electronic component mounting head and electronic component mounting device using the same | |
JP6019406B2 (en) | Electronic component mounting apparatus and electronic component mounting method | |
JPWO2011081025A1 (en) | Vacuum deposition apparatus and vacuum deposition method | |
KR20230024057A (en) | Semiconductor package sawing and sorting apparatus | |
JP2019086509A (en) | Inspection device | |
KR101951222B1 (en) | Tray and deposition system | |
CN108074848B (en) | Gasket, wafer stacking structure, adsorption type moving device and wafer moving method | |
JP5899574B2 (en) | Substrate correction holding device | |
KR102643579B1 (en) | Micro-lens exterior inspection mounted automatic transfer device | |
JP7355059B2 (en) | Suction device and suction method | |
JP6186940B2 (en) | Method for transporting brittle material substrate | |
TWI773378B (en) | Pick-and-place and pressing module of circuit board inspection device | |
KR20140120641A (en) | Film align device | |
KR101193889B1 (en) | Donor film supply system for oled manufacturing | |
JP2017197234A (en) | Bag supply method and bag supply device | |
KR101850364B1 (en) | Laser processing system and picker apparatus |