TWI532952B - LED bulb - Google Patents
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- TWI532952B TWI532952B TW102108280A TW102108280A TWI532952B TW I532952 B TWI532952 B TW I532952B TW 102108280 A TW102108280 A TW 102108280A TW 102108280 A TW102108280 A TW 102108280A TW I532952 B TWI532952 B TW I532952B
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本發明係關於一種LED燈泡之結構方面的技術領域,尤指一種具有良好散熱效果、組裝方便快速、可延長使用壽命及周面可發出溫和燈光等功效之LED燈泡者。 The invention relates to the technical field of the structure of an LED bulb, in particular to an LED bulb with good heat dissipation effect, convenient and rapid assembly, long service life and mild light on the circumference.
一般習知的LED燈泡,如台灣公告第M402387號專利所示,其主要係將複數LED晶片設在鋁材質之一電路板上,再將該電路板結合在鋁材質之一導熱板上,然後將該導熱板組裝在鋁材質之一散熱座的一端,於該導熱板相反該散熱座的一側係結合有一燈罩供將該電路板及該複數LED晶片罩設,於該散熱座的另一端係結合有一轉接座可供使其能安裝在一燈泡插座上,而且於該散熱座中設有一變壓器供與該轉接座及該電路板電性連接。如此,LED晶片發光時所產生高溫便可經由鋁材質之電路板傳導至鋁材質之導熱板,再藉由鋁材質之導熱板傳導至鋁材質之散熱座,然後由散熱座周面上之複數散熱葉片及其間之散熱槽將熱量散佈到周圍的空氣中以達到降溫效果,同時並利用導熱板上之複數散熱孔將電路板之溫度直接散出至該散熱座內部的通孔中,以使該熱氣可由散熱座之透氣槽道導引並由透氣缺槽向外排出,以進一步提高散熱降溫之功效。 A commonly known LED light bulb, as disclosed in Taiwan Patent No. M402387, mainly comprises a plurality of LED chips on a circuit board of aluminum material, and then bonding the circuit board to a heat conducting plate of aluminum material, and then The heat conducting plate is assembled at one end of one of the heat dissipating blocks of the aluminum material, and a lamp cover is coupled to the side of the heat dissipating plate opposite to the heat dissipating block for covering the circuit board and the plurality of LED chips on the other end of the heat dissipating block An adapter is coupled to enable mounting on a bulb socket, and a transformer is disposed in the heat sink for electrically connecting to the adapter and the circuit board. In this way, the high temperature generated by the LED chip can be transmitted to the aluminum heat conduction plate through the aluminum circuit board, and then transferred to the aluminum heat sink by the aluminum heat conduction plate, and then the plurality of heat sinks on the periphery of the heat sink The heat dissipating blades and the heat dissipating grooves therebetween disperse heat into the surrounding air to achieve a cooling effect, and simultaneously use the plurality of heat dissipating holes on the heat conducting plate to directly dissipate the temperature of the circuit board into the through holes in the heat dissipating seat, so that The hot gas can be guided by the venting channel of the heat sink and discharged outward from the venting slot to further improve the heat dissipation and cooling effect.
然而,該習知的LED燈泡在實際製作及使用時係會產生以下之諸多缺點: However, the conventional LED bulbs have the following disadvantages in actual production and use:
1、由於習知LED燈泡的LED晶片發光時所產生之熱量需經過該電路板、該導熱板及該散熱座才會散發至外部空氣之中,而該電路板、該導熱板及該散熱座係會形成熱阻而使該LED晶片之熱量的傳導效率大幅降低,進而影響其之散熱效果。而且,該散熱座僅利用靠近該轉接座之一端面上的複數透氣缺槽將內部的熱氣排出,不但會因距離熱源較遠而有排熱效果不佳之情形,尤其是該些透氣缺槽係無法與外部的冷空氣形成對流,因此內部的熱氣係不易排出而會有積存之狀況發生。所以,其之整體散熱效果係非常的差。 1. The heat generated by the LED chip of the conventional LED bulb needs to pass through the circuit board, the heat conducting board and the heat sink to be radiated to the outside air, and the circuit board, the heat conducting board and the heat sink The thermal resistance is formed to greatly reduce the heat transfer efficiency of the LED chip, thereby affecting the heat dissipation effect thereof. Moreover, the heat sink only uses a plurality of venting slots close to one end surface of the adapter to discharge the internal hot air, which not only has a poor heat removal effect due to being far away from the heat source, especially the venting slots. Since it is impossible to form convection with the outside cold air, the internal hot gas is not easily discharged and there is a situation in which it accumulates. Therefore, the overall heat dissipation effect is very poor.
2、該習知LED燈泡係需先將複數LED晶片結合在該電路板上,然後再將該電路板螺鎖在該導熱板上,以及將該導熱板螺鎖在該散熱座上,所以其之組裝非常麻煩及不便。尤其是,該電路板與該導熱板及該導熱板與該散熱座之間的貼合狀態如果具有非常多的空隙,則係會使其導熱效果大幅降低,因此更是會進一步增加組裝之困難度及所花費的時間。 2, the conventional LED bulb is required to first combine a plurality of LED chips on the circuit board, and then the board is screwed on the heat conducting board, and the heat conducting board is screwed on the heat sink, so The assembly is very cumbersome and inconvenient. In particular, if the bonding state between the circuit board and the heat conducting plate and the heat conducting plate and the heat sink has a very large gap, the heat conduction effect is greatly reduced, thereby further increasing the difficulty of assembly. Degree and time spent.
3、該習知LED燈泡之電路板係蓋住導熱板上之複數散熱孔,所以該電路板及其上之複數LED晶片係會被該燈罩及該導熱板覆設於密閉的空間之中,因此該複數LED晶片發光時所產生的熱量便會使該燈罩內部的密閉空間充滿熱氣,而該熱氣係無法導出外部,因此一旦時間一久便會對該LED晶片造成 非常大的影響,進而使其之使用壽命大幅的縮短。 3. The circuit board of the conventional LED bulb covers a plurality of heat dissipation holes on the heat conduction plate, so the circuit board and the plurality of LED chips thereon are covered by the lamp cover and the heat conduction plate in a sealed space. Therefore, the heat generated when the plurality of LED chips emit light causes the sealed space inside the lampshade to be filled with hot air, and the hot gas system cannot be exported to the outside, so that the LED wafer is caused once a long time. Very large impact, which in turn greatly shortens its service life.
4、由於該習知LED燈泡係被包覆在該燈罩與該導熱板之中,其中該燈罩係可透光的,該導熱板係為鋁材質而不透光的,所以該複數LED晶片所發出的光線便僅只能投射到導熱板朝向燈罩之方向,而該導熱板至該轉接座的周圍部份則會因光線受到該導熱板的阻擋而無照射到,因此會呈暗黑狀態。 4, because the conventional LED bulb is wrapped in the lampshade and the heat conducting plate, wherein the lampshade is transparent, the heat conducting plate is made of aluminum and is not transparent, so the plurality of LED wafers The emitted light can only be projected to the direction of the heat-conducting plate toward the lamp cover, and the portion of the heat-conducting plate to the periphery of the adapter block is blocked by the light-conducting plate without being irradiated, so that it is dark.
習知的LED燈泡係具有散熱效果差、組裝麻煩不便、使用壽命短及燈光無法照射到自身周圍而使周圍呈暗黑狀態等之問題。 Conventional LED bulbs have problems such as poor heat dissipation, inconvenient assembly, short service life, and incapability of the illumination to illuminate the surroundings and darken the surroundings.
本發明係提供一種LED燈泡,包括一底座、一燈杯、複數LED晶片、一固定蓋、一飾環、一燈罩、一燈頭及一電源轉換模組。其中,該底座係為塑膠材質,其具有頭端大尾端小之一殼壁及位在該殼壁內側之一環壁,該環壁內側圍成朝頭端呈開口狀之一容納空間,該環壁與該殼壁之間形成朝頭端呈開口狀之一對流空間,該殼壁的外周面具有貫通到該對流空間之複數對流孔。該燈杯係為熱導率高、絕緣性佳之複合材料製成,其係結合在該殼壁的頭端供罩住該對流空間的開口,該燈杯包含一基板、佈設於基板一側面之一電路及呈輻射狀一體形成於該基板另一側面之複數散熱鰭片,該複數散熱鰭片之間分別形成有連通該對流空間與外部之複數散熱槽,該基板的中央具有貫穿到底部之一穿孔,於靠近周邊處具有呈環狀排列且分別貫通到該複數散熱 槽之複數通孔。該複數LED晶片係結合在該電路上。該固定蓋係蓋住該容納空間的開口,且具有一凸柱凸伸到該穿孔中,該凸柱的端面具有一導孔貫通到底面與該容納空間相通。該飾環係可分離地結合在該燈杯之基板上。該燈罩係可分離地結合在該飾環上,以供將該複數LED晶片罩設於內側,且可供該複數LED晶片的燈光透過。該燈頭係結合在該殼壁的尾端,可供螺接在一燈泡插座上。該電源轉換模組係設在該容納空間中,且具有兩上導線及兩下導線,該兩上導線係穿過該導孔與該電路導接,該兩下導線係與該燈頭導接。 The invention provides an LED light bulb, comprising a base, a light cup, a plurality of LED chips, a fixed cover, a decorative ring, a lamp cover, a lamp holder and a power conversion module. The base is made of a plastic material, and has a shell wall with a small end and a small end end and a ring wall located inside the shell wall. The inner side of the ring wall encloses an accommodation space which is open toward the head end. A convection space is formed between the ring wall and the shell wall in an open shape toward the head end, and the outer peripheral surface of the shell wall has a plurality of convection holes penetrating into the convection space. The lamp cup is made of a composite material with high thermal conductivity and good insulation, and is coupled to the opening end of the shell wall for covering the opening of the convection space. The lamp cup comprises a substrate and is arranged on one side of the substrate. a plurality of heat dissipating fins integrally formed on the other side of the substrate, wherein the plurality of heat dissipating fins are respectively formed with a plurality of heat dissipating grooves connecting the convection space and the outer portion, and the center of the substrate has a through hole to the bottom a perforation having an annular arrangement near the periphery and respectively penetrating the plurality of heat dissipation A plurality of through holes in the slot. The plurality of LED chips are bonded to the circuit. The fixing cover covers the opening of the receiving space, and has a protruding post protruding into the through hole. The end surface of the protruding post has a guiding hole extending through the bottom surface to communicate with the receiving space. The trim ring is detachably coupled to the base of the lamp cup. The lampshade is detachably coupled to the trim ring for illuminating the plurality of LED chips on the inner side and for transmitting light of the plurality of LED chips. The base is coupled to the rear end of the casing wall for screwing onto a bulb socket. The power conversion module is disposed in the accommodating space and has two upper wires and two lower wires. The two upper wires are connected to the circuit through the guiding holes, and the two lower wires are connected to the lamp cap.
本發明之LED燈泡可藉由直接於該燈杯上佈設電路,然後再將該複數LED晶片直接結合在該電路上的設計,使得該LED晶片發光時所產生的熱量可直接由該燈杯傳導及排至外部,而無需再經過其它熱阻,因此係可使該LED晶片發光時所產生的熱量被迅速的導出,而且利用該殼壁上貫通到該對流空間之複數對流孔及該燈杯之複數散熱鰭片間連通該對流空間與外部之複數散熱槽,係可使對流空間中的熱空氣與外部的冷空氣能產生對流,因此係可將對流空間中熱氣迅速的排出,使該複數散熱鰭片能快速的降溫,因此整體上係具有良好散熱效果。尤其是,該複數LED晶片係直接結合在預先佈設有電路的燈杯上,因此可減少數個組裝步驟,所以係可使組裝較為方便快速。特別是,藉由該燈杯之基板上呈環狀排列的複數通孔,係可使燈罩內側空間中的熱氣藉其流到該複數散熱槽及該對流空間中再排出 外部,因此可使燈罩內側空間保持在適當的溫度,所以係可藉此使該複數LED晶片不致受到高溫環境的影響,故而可大幅延長其之使用壽命。另外,當該複數LED晶片發光時,大部份的燈光係會穿過該燈罩投射出去,而少部份的燈光則會被該燈罩反射,該反射的燈光係可透過該複數通孔投射到該複數散熱槽及該對流空間中,藉此便可使該燈杯及該底座的周面因此透出溫和的燈光。 The LED bulb of the present invention can be directly conducted by the lamp cup by directly arranging a circuit on the lamp cup and then directly bonding the plurality of LED chips to the circuit, so that the heat generated when the LED chip emits light can be directly conducted by the lamp cup. And discharging to the outside without further heat resistance, so that the heat generated when the LED chip emits light can be quickly derived, and the plurality of convection holes and the lamp cup penetrating the convection space on the shell wall are utilized. The plurality of heat dissipation fins connecting the convection space and the external plurality of heat dissipation slots can convect the hot air in the convection space and the external cold air, so that the hot air in the convection space can be quickly discharged, so that the plurality The heat sink fins can quickly cool down, so the overall heat dissipation effect is achieved. In particular, the plurality of LED chips are directly bonded to the lamp cup which is pre-wired, so that several assembly steps can be reduced, so that the assembly is convenient and quick. In particular, the plurality of through holes arranged in a ring shape on the substrate of the lamp cup enable the hot air in the space inside the lamp cover to flow into the plurality of heat dissipation grooves and the convection space and then discharge Externally, the space inside the lampshade can be maintained at an appropriate temperature, so that the plurality of LED chips can be prevented from being affected by a high temperature environment, thereby greatly extending the service life thereof. In addition, when the plurality of LED chips emit light, most of the light is projected through the lamp cover, and a small portion of the light is reflected by the lamp cover, and the reflected light is projected through the plurality of through holes. The plurality of heat dissipating grooves and the convection space can thereby make the lamp cup and the circumferential surface of the base transparently emit light.
10‧‧‧底座 10‧‧‧Base
11‧‧‧殼壁 11‧‧‧ shell wall
12‧‧‧環壁 12‧‧‧Circle
13‧‧‧容納空間 13‧‧‧Accommodation space
14‧‧‧對流空間 14‧‧‧ Convection space
15‧‧‧對流孔 15‧‧‧ convection hole
20‧‧‧燈杯 20‧‧‧light cup
21‧‧‧螺栓 21‧‧‧ bolt
22‧‧‧基板 22‧‧‧Substrate
23‧‧‧電路 23‧‧‧ Circuitry
24‧‧‧散熱鰭片 24‧‧‧ Heat sink fins
240‧‧‧凸部 240‧‧‧ convex
25‧‧‧散熱槽 25‧‧‧heat sink
26‧‧‧穿孔 26‧‧‧Perforation
27‧‧‧通孔 27‧‧‧through hole
28‧‧‧環溝 28‧‧‧Circle
29‧‧‧扣孔 29‧‧‧Cut hole
30‧‧‧LED晶片 30‧‧‧LED chip
40‧‧‧固定蓋 40‧‧‧Fixed cover
41‧‧‧凸柱 41‧‧‧Bump
42‧‧‧導孔 42‧‧‧Guide
43‧‧‧凹槽 43‧‧‧ Groove
50‧‧‧飾環 50‧‧‧rings
51‧‧‧環槽 51‧‧‧ Ring groove
52‧‧‧環嵌片 52‧‧‧ring inserts
53‧‧‧扣勾 53‧‧‧ buckle
54‧‧‧卡孔 54‧‧‧Kakong
60‧‧‧燈罩 60‧‧‧shade
61‧‧‧環凸部 61‧‧‧ ring convex
62‧‧‧卡勾 62‧‧‧ card hook
70‧‧‧燈頭 70‧‧‧ lamp holder
80‧‧‧電源轉換模組 80‧‧‧Power Conversion Module
81‧‧‧上導線 81‧‧‧Upper wire
82‧‧‧下導線 82‧‧‧Down wire
第1圖為本發明之立體分解示意圖。 Figure 1 is a perspective exploded view of the present invention.
第2圖為本發明之立體組合放大示意圖。 Figure 2 is a schematic enlarged view of the three-dimensional combination of the present invention.
第3圖為本發明之組合剖面放大示意圖。 Figure 3 is an enlarged schematic cross-sectional view of the combination of the present invention.
第4圖為本發明之LED晶片與燈杯之立體分解放大示意圖。 Fig. 4 is a perspective exploded view showing the LED chip and the lamp cup of the present invention.
第5圖為本發明之LED晶片與燈杯之立體組合放大示意圖。 Fig. 5 is a schematic enlarged view showing the three-dimensional combination of the LED chip and the lamp cup of the present invention.
第6圖為本發明之LED晶片與燈杯之組合剖面放大示意圖。 Fig. 6 is an enlarged schematic cross-sectional view showing the combination of the LED chip and the lamp cup of the present invention.
第7圖為本發明之燈頭朝下安裝使用時之散熱對流示意圖。 Figure 7 is a schematic diagram of heat dissipation convection when the lamp cap of the present invention is installed downward.
第8圖為本發明之燈頭朝上安裝使用時之散熱對流示意圖。 Fig. 8 is a schematic view showing the heat dissipation convection when the lamp cap of the present invention is mounted upward.
請參閱第1~6圖所示,係顯示本發明所述之LED燈泡包括一底座10、一燈杯20、複數LED晶片30、一固定蓋40、一飾環50、一燈罩60、一燈頭70及一電源轉換模組80。其中: 該底座10係為塑膠材質,且其具有頭端大尾端小之一殼壁11及位在該殼壁11內側之一環壁12。該環壁12的內側係圍成朝頭端呈開口狀之一容納空間13,該環壁12與該殼壁11之間係形成朝頭端呈開口狀呈環形之一對流空間14。該殼壁11的外周面係具有貫通到該對流空間14之複數對流孔15,該尾端的周面係具有外螺紋。 Referring to FIGS. 1 to 6 , the LED light bulb of the present invention includes a base 10 , a light cup 20 , a plurality of LED chips 30 , a fixed cover 40 , a trim ring 50 , a lamp cover 60 , and a lamp cap . 70 and a power conversion module 80. among them: The base 10 is made of a plastic material, and has a shell wall 11 having a small end and a large end, and a ring wall 12 located inside the shell wall 11. The inner side of the annular wall 12 is surrounded by a receiving space 13 which is open toward the head end. The annular wall 12 and the casing wall 11 form an annular convection space 14 which is open toward the head end. The outer peripheral surface of the casing wall 11 has a plurality of convection holes 15 penetrating into the convection space 14, and the peripheral surface of the tail end has an external thread.
該燈杯20係為熱導率高、絕緣性佳之電子陶瓷或導熱塑膠等複合材料製成,例如其可為含有氧化鋁、氮化鋁、碳化矽或氧化鈹……等之複合材料所製成。該燈杯20係利用複數螺栓21將其螺鎖在該底座10之殼壁11的頭端上,使其罩住該對流空間14的開口。該燈杯20包含有一基板22、佈設於基板22頂面之一電路23及呈輻射狀一體形成於該基板22底面之複數散熱鰭片24。該複數散熱鰭片24之間係形成有連通該對流空間14與外部之複數散熱槽25,且該複數散熱鰭片24的底面係分別具有一凸部240可供嵌設於該殼壁11的開口之中。該基板22的頂面中央具有貫穿到底部之一穿孔26,於靠近周邊處具有呈環狀排列且分別貫通到該複數散熱槽25之複數通孔27。另該基板22的頂面於該複數通孔27的外圍係又另設有一環溝28,該環溝28上設有複數扣孔29。 The lamp cup 20 is made of a composite material such as an electronic ceramic or a heat conductive plastic having high thermal conductivity and good insulation, for example, it can be made of a composite material containing aluminum oxide, aluminum nitride, tantalum carbide or yttrium oxide. to make. The lamp cup 20 is screwed to the head end of the casing wall 11 of the base 10 by a plurality of bolts 21 to cover the opening of the convection space 14. The lamp cup 20 includes a substrate 22, a circuit 23 disposed on a top surface of the substrate 22, and a plurality of heat dissipation fins 24 integrally formed on the bottom surface of the substrate 22. A plurality of heat dissipation grooves 25 are formed between the plurality of heat dissipation fins 24 and the outer surface of the plurality of heat dissipation fins 24, and the bottom surfaces of the plurality of heat dissipation fins 24 respectively have a convex portion 240 for being embedded in the shell wall 11. In the opening. The center of the top surface of the substrate 22 has a through hole 26 penetrating to the bottom portion, and has a plurality of through holes 27 which are arranged in a ring shape and penetrate through the plurality of heat dissipation grooves 25, respectively, near the periphery. The top surface of the substrate 22 is further provided with a ring groove 28 on the outer periphery of the plurality of through holes 27, and the ring groove 28 is provided with a plurality of button holes 29.
該複數LED晶片30係結合在該電路23上,可供發出燈光。 The plurality of LED chips 30 are coupled to the circuit 23 for emitting light.
該固定蓋40係蓋住該容納空間13的開口,且具有 一凸柱41凸伸到該穿孔26中,該凸柱41的端面具有一導孔42貫通到底面與該容納空間13相通。該固定蓋40的底部具有一凹槽43可供容納該環壁12的上端緣。 The fixing cover 40 covers the opening of the receiving space 13 and has A protruding post 41 protrudes into the through hole 26, and an end surface of the protruding post 41 has a guiding hole 42 extending through the bottom surface to communicate with the receiving space 13. The bottom of the fixing cover 40 has a recess 43 for receiving the upper end edge of the ring wall 12.
該飾環50係設在該基板22的頂面,且該飾環50的頂面具有一環槽51,底面具有一環嵌片52及複數扣勾53。該環槽51的外側槽壁上係具有貫通到外周面之複數卡孔54,該環嵌片52係嵌設在該基板22的環溝28,該複數扣勾53係可分別彈性勾扣在該基板22的複數扣孔29中,以使該飾環50因此可分離地結合在該燈杯20之基板22上。 The ring 50 is disposed on the top surface of the substrate 22, and the top mask of the ring 50 has a ring groove 51. The bottom surface has a ring insert 52 and a plurality of hooks 53. The outer groove wall of the annular groove 51 has a plurality of holes 54 extending through the outer peripheral surface. The ring insert 52 is embedded in the annular groove 28 of the substrate 22, and the plurality of hooks 53 are elastically hooked respectively. The plurality of button holes 29 of the substrate 22 are such that the ring 50 is detachably coupled to the substrate 22 of the lamp cup 20.
該燈罩60係呈半球形,且開口端面上係具有一環凸部61可供嵌入該飾環50的環槽51中。該環凸部61上係具有複數卡勾62可供分別彈性勾扣在該飾環50的複數卡孔54中,使該燈罩60可分離地結合在該飾環50上,以供將該複數LED晶片30罩設於內側,且可供該複數LED晶片30的燈光透過。 The lamp cover 60 is semi-spherical, and has a ring protrusion 61 for inserting into the ring groove 51 of the ring 50 on the open end face. The ring protrusion 61 has a plurality of hooks 62 for elastically hooking into the plurality of card holes 54 of the ring 50, so that the lamp cover 60 can be detachably coupled to the ring 50 for the plural The LED chip 30 is disposed on the inner side and is transparent to the light of the plurality of LED chips 30.
該燈頭70係具有內螺紋可供螺設在該殼壁11之尾端的外螺紋上,其係可供用於螺接在一燈泡插座(圖中未示)上。 The base 70 has internal threads for threading on the external threads of the rear end of the casing wall 11, which are available for screwing onto a bulb socket (not shown).
該電源轉換模組80係設在該容納空間13中,具有穩壓及將交流電轉換成直流電之作用。該電源轉換模組80係具有兩上導線81及兩下導線82,該兩上導線81係穿過該固定蓋40的導孔42而與該電路23導接,該兩下導線82係與該燈頭70導接。 The power conversion module 80 is disposed in the accommodating space 13 and has a function of voltage regulation and conversion of alternating current into direct current. The power conversion module 80 has two upper wires 81 and two lower wires 82. The two upper wires 81 are connected to the circuit 23 through the guide holes 42 of the fixing cover 40. The two lower wires 82 are connected to the same. The lamp head 70 is guided.
請參閱第7圖所示,係指出當該燈頭70朝下安裝 地使用時,外部的冷空氣係會從該對流孔15流入該對流空間14中,而該對流空間14中的熱空氣及該散熱鰭片24的熱量則係會由該散熱槽25排出外部,如此該對流空間14便可藉由相通之對流孔15及散熱槽25形成散熱對流狀態,以使該對流空間14中的熱空氣及該散熱鰭片24的熱量能被迅速的排出,同時並可藉由外部流入的冷空氣使該散熱鰭片24快速的降溫。 Please refer to Figure 7, which indicates that the lamp head 70 is mounted face down. When the ground is used, external cold air flows into the convection space 14 from the convection hole 15, and the hot air in the convection space 14 and the heat of the heat dissipation fin 24 are discharged from the heat dissipation groove 25 to the outside. Therefore, the convection space 14 can form a heat dissipation convection state through the communicating convection holes 15 and the heat dissipation slots 25, so that the hot air in the convection space 14 and the heat of the heat dissipation fins 24 can be quickly discharged, and The heat sink fins 24 are rapidly cooled by the cold air flowing in from the outside.
請參閱第8圖所示,係指出當該燈頭70朝上安裝地使用時,外部的冷空氣係會從該散熱槽25流入該對流空間14中,而該對流空間14中的熱空氣及該散熱鰭片24的熱量則係會由該對流孔15排出外部,如此該對流空間14便可藉由相通之對流孔15及散熱槽25形成散熱對流狀態,以使該對流空間14中的熱空氣及該散熱鰭片24的熱量能被迅速的排出,同時並可藉由外部流入的冷空氣使該散熱鰭片24快速的降溫。 Referring to FIG. 8, it is pointed out that when the lamp holder 70 is used upwardly, external cold air flows into the convection space 14 from the heat dissipation groove 25, and the hot air in the convection space 14 and the The heat of the heat dissipating fins 24 is discharged from the convection hole 15 so that the convection space 14 can form a heat convection state through the communicating convection holes 15 and the heat dissipating grooves 25, so that the hot air in the convection space 14 The heat of the heat dissipation fins 24 can be quickly discharged, and the heat dissipation fins 24 can be quickly cooled by the cold air flowing in from the outside.
由於本發明之LED燈泡係具有上述之特殊結構設計,因此係具有以下之諸多優點: Since the LED bulb of the present invention has the special structural design described above, it has the following advantages:
1、本發明係可藉由直接於該燈杯20上佈設電路23,然後再將該複數LED晶片30直接結合在該電路23上的設計,使得該LED晶片30發光時所產生的熱量能直接由該燈杯20迅速的傳導及排至外部,而無需再經過其它熱阻,因此係可使該LED晶片30發光時所產生的熱量被迅速的導出,而且利用該殼壁11上貫通到該對流空間14之複數對流孔15及該燈杯20之複數散熱鰭片24間連通該對流空間14與外部之複數散熱槽25, 係可使該對流空間14中的熱空氣與外部的冷空氣能產生對流,因此係可將該對流空間14中熱氣及該散熱鰭片24的熱量迅速的排出,及可使該複數散熱鰭片24能快速的降溫,因此整體上係具有良好散熱效果。 1. The present invention is designed such that the circuit 23 is directly disposed on the lamp cup 20, and then the plurality of LED chips 30 are directly bonded to the circuit 23, so that the heat generated by the LED chip 30 can be directly generated. The lamp cup 20 is quickly conducted and discharged to the outside without any other thermal resistance, so that the heat generated when the LED chip 30 emits light can be quickly derived, and the shell wall 11 is used to penetrate the The plurality of convection holes 15 of the convection space 14 and the plurality of heat dissipation fins 24 of the lamp cup 20 communicate with the convection space 14 and the plurality of external heat dissipation slots 25, The hot air in the convection space 14 can be convected with the external cold air, so that the heat in the convection space 14 and the heat of the heat dissipation fins 24 can be quickly discharged, and the plurality of heat dissipation fins can be 24 can quickly cool down, so the overall heat dissipation effect.
2、本發明之複數LED晶片30係直接結合在預先佈設有電路23的燈杯20上,因此係可減少數個組裝步驟,所以可使組裝較為方便快速。 2. The plurality of LED chips 30 of the present invention are directly coupled to the lamp cup 20 in which the circuit 23 is pre-wired, so that several assembly steps can be reduced, so that assembly can be facilitated and quick.
3、本發明可藉由該燈杯20之基板22上呈環狀排列的複數通孔27,使燈罩60內側空間中的熱氣能藉其流到該複數散熱槽25及該對流空間14中再排出到外部,因此可使燈罩60內側空間保持在適當的溫度,所以係可藉此使該複數LED晶片30不致受到高溫環境的影響,故而可大幅延長其之使用壽命。 3. The present invention can make the hot air in the inner space of the lamp cover 60 flow into the plurality of heat dissipation slots 25 and the convection space 14 by using a plurality of through holes 27 arranged in a ring shape on the substrate 22 of the lamp cup 20. The discharge to the outside allows the space inside the lamp cover 60 to be maintained at an appropriate temperature, so that the plurality of LED chips 30 can be prevented from being affected by a high temperature environment, so that the service life thereof can be greatly extended.
4、本發明之複數LED晶片30發光時,大部份的燈光係會穿過該燈罩60投射出去,而少部份的燈光則係會被該燈罩60反射,該反射的燈光係可透過該複數通孔27而投射到該複數散熱槽25及該對流空間14之中,藉此便可使該燈杯20及該底座10的周面因此透出溫和的燈光,請配合參閱第7、8圖所示。 4. When the plurality of LED chips 30 of the present invention emit light, most of the light is projected through the light cover 60, and a small portion of the light is reflected by the light cover 60, and the reflected light is transmitted through the light. The plurality of through holes 27 are projected into the plurality of heat dissipation grooves 25 and the convection space 14, whereby the circumferential surface of the lamp cup 20 and the base 10 can be made to emit a gentle light. Please refer to Chapters 7 and 8. The figure shows.
10‧‧‧底座 10‧‧‧Base
11‧‧‧殼壁 11‧‧‧ shell wall
12‧‧‧環壁 12‧‧‧Circle
13‧‧‧容納空間 13‧‧‧Accommodation space
14‧‧‧對流空間 14‧‧‧ Convection space
15‧‧‧對流孔 15‧‧‧ convection hole
20‧‧‧燈杯 20‧‧‧light cup
21‧‧‧螺栓 21‧‧‧ bolt
22‧‧‧基板 22‧‧‧Substrate
23‧‧‧電路 23‧‧‧ Circuitry
24‧‧‧散熱鰭片 24‧‧‧ Heat sink fins
240‧‧‧凸部 240‧‧‧ convex
25‧‧‧散熱槽 25‧‧‧heat sink
26‧‧‧穿孔 26‧‧‧Perforation
27‧‧‧通孔 27‧‧‧through hole
28‧‧‧環溝 28‧‧‧Circle
29‧‧‧扣孔 29‧‧‧Cut hole
30‧‧‧LED晶片 30‧‧‧LED chip
40‧‧‧固定蓋 40‧‧‧Fixed cover
41‧‧‧凸柱 41‧‧‧Bump
42‧‧‧導孔 42‧‧‧Guide
50‧‧‧飾環 50‧‧‧rings
51‧‧‧環槽 51‧‧‧ Ring groove
52‧‧‧環嵌片 52‧‧‧ring inserts
53‧‧‧扣勾 53‧‧‧ buckle
54‧‧‧卡孔 54‧‧‧Kakong
60‧‧‧燈罩 60‧‧‧shade
61‧‧‧環凸部 61‧‧‧ ring convex
62‧‧‧卡勾 62‧‧‧ card hook
70‧‧‧燈頭 70‧‧‧ lamp holder
80‧‧‧電源轉換模組 80‧‧‧Power Conversion Module
81‧‧‧上導線 81‧‧‧Upper wire
82‧‧‧下導線 82‧‧‧Down wire
Claims (9)
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