KR20130028195A - Lighting device - Google Patents

Lighting device Download PDF

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Publication number
KR20130028195A
KR20130028195A KR1020110091542A KR20110091542A KR20130028195A KR 20130028195 A KR20130028195 A KR 20130028195A KR 1020110091542 A KR1020110091542 A KR 1020110091542A KR 20110091542 A KR20110091542 A KR 20110091542A KR 20130028195 A KR20130028195 A KR 20130028195A
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South Korea
Prior art keywords
case
lighting
disposed
air inlet
heat
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KR1020110091542A
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Korean (ko)
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KR101890186B1 (en
Inventor
박인수
곽재오
홍승균
김선호
Original Assignee
엘지이노텍 주식회사
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Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020110091542A priority Critical patent/KR101890186B1/en
Priority claimed from US14/240,317 external-priority patent/US9739469B2/en
Publication of KR20130028195A publication Critical patent/KR20130028195A/en
Application granted granted Critical
Publication of KR101890186B1 publication Critical patent/KR101890186B1/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/60Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F21V29/677Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans the fans being used for discharging
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

Embodiments relate to a lighting device, comprising: a light emitting module unit; A heat sink disposed on the light emitting module unit; A heat radiation fan disposed on the heat sink; An upper case covering the radiating fan and the radiator; And a lower case coupled to the upper case and fixing the light emitting module unit, wherein the lower case has an air inlet disposed therein, and the upper case has an air outlet disposed on a surface facing the outer circumferential direction of the upper case. To provide.

Description

LIGHTING DEVICE

An embodiment of the present invention relates to a lighting device.

Light emitting diodes (LEDs) are a type of semiconductor device that converts electrical energy into light. Light emitting diodes have the advantages of low power consumption, semi-permanent life, fast response speed, safety and environmental friendliness compared to conventional light sources such as fluorescent and incandescent lamps. Accordingly, many researches have been conducted to replace the existing light source with light emitting diodes, and light emitting diodes have been increasingly used as light sources for lighting devices such as liquid crystal display devices, electronic displays, and street lights.

However, when the LED is turned on, a lot of heat is generated, and when the heat dissipation is not performed smoothly, the life of the LED is shortened, the illuminance is reduced, and the quality characteristics are significantly reduced. Therefore, the advantages of the LED lighting device presupposes that the heat dissipation of the LED is smooth.

Korean Patent Publication No. 10-2011-0004715 (published: January 14, 2011)

The embodiment is to solve the conventional problems as described above, to provide a lighting device excellent in heat dissipation efficiency.

In addition, the embodiment provides a lighting device that maximizes the illuminance and life of the light source used in the lighting device and significantly improves the quality characteristics.

In addition, the embodiment provides a lighting device that minimizes the dust introduced into the device.

In addition, the embodiment provides a lighting device that is easy to manufacture and assemble the component.

In an embodiment, the lighting apparatus includes a light emitting module unit; A heat sink disposed on the light emitting module unit; A heat radiation fan disposed on the heat sink; An upper case covering the radiating fan and the radiator; And a lower case coupled to the upper case and fixing the light emitting module unit, an air inlet is disposed in the lower case, and an air outlet may be disposed on a surface of the upper case facing the outer circumferential direction of the upper case. .

In another embodiment, the lighting apparatus includes a light emitting module unit; An intermediate body including a heat sink disposed on the light emitting module unit; A heat radiation fan disposed on the heat sink; An upper case covering the heat dissipation fan and coupled to the intermediate body; A lower case coupled to the intermediate body and fixing the light emitting module unit; An air inlet may be disposed in the lower case, and an air outlet may be disposed on a surface of the intermediate body that faces the outer circumferential direction of the intermediate body.

In addition, the air inlet of the lower case may lead to a space between the upper case and the upper portion of the heat dissipation fan, and the air outlet may lead to a space between the lower portion of the heat dissipation fan and the heat sink.

In addition, the air passage leading to the air inlet and the air passage leading to the air outlet may be separated from each other by the partition of the upper case and the heat radiating fan.

In addition, the air inlet may be disposed on the edge portion of the lower case.

In addition, the air inlet may be disposed in the center of the lower case.

According to the embodiment, the heat radiation efficiency of the lighting device is significantly increased.

In addition, according to the embodiment, the illuminance and lifetime of the light source are maximized and the quality characteristics are significantly improved.

In addition, according to the embodiment, in the recessed lighting device embedded in the ceiling or the wall to effect the effective heat exchange with the outside air.

In addition, the embodiment to minimize the dust introduced into the lighting device.

The embodiment also facilitates the manufacture and assembly of the components of the lighting device.

1 is a sectional perspective view of a lighting apparatus according to an embodiment.
2 illustrates a heat radiation fan of a lighting apparatus according to an embodiment.
3 is a bottom plan view of a lighting apparatus according to another embodiment.
4 shows a cross-sectional view of the AA line of FIG. 3.
FIG. 5 shows a cross-sectional view of the BB line of FIG. 3.
FIG. 6 shows a cross-sectional view of the CC line of FIG. 3.
FIG. 7 shows a plan view of the DD line of FIG. 6.
8 is a bottom plan view of a lighting apparatus according to another embodiment.
9 is a side view of a lighting device according to another embodiment.
10 shows various embodiments of the air outlet and air inlet arrangement of the lighting device.
11 is a perspective view of a lighting apparatus according to another embodiment.
12 is a bottom plan view of a lighting apparatus according to another embodiment.
FIG. 13 shows a cross-sectional view of the AA line of FIG. 12.
FIG. 14 shows a cross-sectional view of the BB line of FIG. 12.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. It is to be understood, however, that the appended drawings illustrate the present invention in order to more easily explain the present invention, and the scope of the present invention is not limited thereto. You will know.

In addition, the reference to the top or bottom of each component will be described with reference to the drawings. In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity. In addition, the size of each component does not necessarily reflect the actual size.

In the description of embodiments according to the present invention, it is to be understood that where an element is described as being formed "on or under" another element, On or under includes both the two elements being directly in direct contact with each other or one or more other elements being indirectly formed between the two elements. In addition, when expressed as "on" or "under", it may include the meaning of the downward direction as well as the upward direction based on one element.

1 is a cross-sectional perspective view of a lighting apparatus according to an embodiment.

The lighting apparatus 100 according to an embodiment is disposed on the light emitting module unit 110 and the light emitting module unit 110 and the heat dissipating member 120 having a heat sink formed around the outer surface thereof, and disposed on the heat dissipating member 120. The heat dissipation fan 130, the upper case 150 covering the heat dissipation fan 130, and the inner side of the upper case 150 are electrically connected to the heat dissipation fan 130 and the LED mounting board 112 to supply power. The driving unit 140 and the upper case 150 may be coupled to the lower case 160 to fix the light emitting module unit 110.

Detailed description of each component is as follows.

<Light Emitting Module Part>

The light emitting module unit 110 may include one or more LEDs 111 and an LED mounting substrate 112 on which one or more LEDs 111 are mounted. A plurality of LEDs 111 may be arranged on the LED mounting substrate 112, and the number and arrangement of the LEDs 111 to be arranged may be arbitrarily adjusted according to required illuminance. The light emitting module unit 110 may adopt a form in which a plurality of LEDs are focused to facilitate handling and mass production.

The LED mounting substrate 112 may have a circuit pattern printed on an insulator, and for example, a general printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB Etc., and a Chips On Board (COB) type that can directly bond an LED chip that is not packaged on a printed circuit board. In addition, the substrate may be formed of a material that reflects light efficiently, or the surface may be formed of a color that reflects light efficiently, for example, white, silver, or the like.

The LED 111 mounted on the substrate may be a red, green, blue, or white light emitting diode that emits red, green, blue, or white light, respectively, but is not limited to the type or number thereof.

<Heat radiator>

The heat radiator 120 may be disposed on the light emitting module unit 110 to perform a function of conducting and radiating heat generated from the light emitting module unit 110.

The heat sink 120 may have a plurality of heat radiation fins on the surface. The plurality of heat sink fins may be disposed radially along the surface of the heat sink 120. The shape of the heat sink 120 increases the surface area to improve the heat radiation efficiency of the heat sink 120.

The radiator 120 has air that is injected into the radiator 120 through the radiator fan 130 across the surface of the radiator 120 in a relationship with the radiator fan 130 and the lower case 160 which will be described below. It may include a heat dissipation fin arranged in a predetermined direction to be discharged to the air outlet of the lower case 160. For example, the heat dissipation fins of the heat dissipator 120 may be perpendicular to the direction of the wind sprayed by the heat dissipation fan 130, and may be arranged in a direction toward the air outlet of the lower case 160.

The radiator 120 may be formed of a metal material or a resin material having excellent heat dissipation efficiency, but is not limited thereto. For example, the material of the heat sink 120 may include at least one of aluminum (Al), nickel (Ni), copper (Cu), silver (Ag), and tin (Sn).

Although not shown, a heat sink may be disposed between the light emitting module unit 110 and the heat sink 120. The heat sink may be formed of a thermally conductive silicon pad or a thermal conductive tape having excellent thermal conductivity, and may effectively transfer heat generated by the light emitting module unit 110 to the heat sink 120.

<Heat radiating fan>

2 illustrates a heat radiating fan 130 of a lighting apparatus 100 according to an embodiment.

The heat dissipation fan 130 may be disposed on the heat dissipator 120 to generate a forced convection of external air in the lighting apparatus 100 to perform a function of cooling the heat in the lighting apparatus 100.

Power is applied to the lighting device 100 to illuminate the light in the light emitting module unit 110, and high heat is generated when the light is illuminated. Therefore, power is applied to the heat dissipation fan 130 at the same time that power is applied, and the heat dissipation fan 130 may operate. Alternatively, the heat radiating fan 130 may be configured to operate only when the temperature is greater than or equal to a predetermined temperature according to the heat sensor in the lighting apparatus 100.

When the heat radiating fan 130 operates, the outside air is sucked through the air inlet of the lower case 160 to be described below, and the sucked air passes through the heat radiating fan 130 and passes through the radiator 120. In the heat exchange, the heated air may be discharged to the outside through the air outlet of the lower case 160.

In a specific embodiment, the lighting device 100 may be MR16, the outer diameter of the MR16 is 50mm, the diameter of the heat radiation fan 130 may be 30mm. Since the width becomes wider toward the bottom according to the shape of the hemispherical MR16, the radiator 120 may be configured to have a maximum size for heat dissipation, the radiator 120 is larger diameter than the radiator fan 130 May have

Accordingly, the direct air injection of the heat dissipation fan 130 may be performed only in a partial area of the heat dissipation 120, but the air injected as described in the heat dissipation 120 may cover all surfaces of the heat dissipation 120. The arrangement of the heat sink fins can be specified to pass through.

The heat dissipation fan 130 may have a bolt insertion hole 131 on the outside of the heat dissipation fan 130 to be coupled to the upper case 150 to be described below.

<Upper case and lower case>

The upper case 150 may cover the outside of the heat dissipation fan 130, and may be combined with the lower case 160 to generate an air passage allowing the air introduced into the lighting device 100 to be discharged along a predetermined path. have.

A terminal 141 for supplying power may be disposed outside the upper case 150. In addition, an upper portion of the upper case 150 may be provided with an air inlet (not shown) for air inlet.

The driving unit electrically connected to the heat dissipation fan 130 and the light emitting module unit 110 in the upper case 150 to supply power supplied from the terminal 141 to the heat dissipation fan 130 and the light emitting module unit 110. 140 may be disposed.

The driver 140 may be configured by mounting various electronic devices for driving the LED on the PCB. At this time, a terminal 141 is formed on the upper surface of the PCB, and is installed to partially expose the upper side through the rear cover, and can be coupled to the terminal coupling groove and electrically connected using the exposed portion.

The terminal 141 of the exposed portion may be in the form of a pin (shown by two terminals in the figure) inserted into the rear end of the upper case 150, but this is not limiting, but is not limited to an external power source (assuming DC power, but AC It may serve as an inlet to receive the power supply and to install a rectifier or a condenser therein as the lighting device of the present invention.

The upper case 150, the heat dissipation fan 130, and the lower case 160 include a bolt insertion hole 151, and the lower case 160, the heat dissipation fan 130, the heat dissipation body 120, and the light emitting module unit 110. After the parts such as) are assembled without fastening, the upper case 150 is covered, and the position of each part may be fixed and combined using two bolts.

When the parts are combined, the lower case 160 may hold the outer portion of the light emitting module unit 110 to fix the other parts together. In addition, a space in which the light emitting module unit 110 is accommodated may be disposed in the lower case 160 so that the light emitting module unit 110 may be disposed in the storage space of the lower case 160.

The lower case 160 may have an air inlet and an air outlet in the direction of the illumination area illuminated by the lighting device 100. The air inlet and the air outlet are configured and arranged independently of each other, and the air inlet is used for introducing external air into the lighting device 100, and the air outlet is exhausted from the heat exchanged air in the lighting device 100. Can be used for such purposes.

Looking at the air movement path in the lighting device 100 according to an embodiment, the air outside the lighting device 100 between the upper case 150 and the upper portion of the heat radiating fan 130 through the air inlet of the lower case 160. It is introduced into the space of the, by the operation of the heat radiating fan 130 is sucked into the heat radiating fan 130 is injected into the space between the lower portion of the heat radiating fan 130 and the radiator 120. The injected air may pass through the surface of the heat sink 120 to form a heat exchange to cool the heat sink 120, and then be discharged through the air outlet of the lower case 160.

The upper case 150 or the lower case 160 may have a partition wall to distinguish the air inflow path through the air inlet and the air outflow path through the air outlet.

When the lighting device 100 according to an embodiment is embedded in a wall or a ceiling, since the air inlet and the air outlet are present in the external exposed portion instead of the embedded portion of the lighting device 100, the outside air is effectively introduced. And may be discharged.

A lens 170 may be disposed in the lower case 160, and the lens 170 may be formed on the upper portion of each LED to collect or diverge / focus light emitted from the LEDs at a predetermined angle. The lens 170 may disperse / concentrate the light to obtain a desired shape of light and also protect the LED from impact.

3 illustrates a bottom plan view of a lighting apparatus 300 according to another embodiment. The bottom plan view of the lighting device 300 of FIG. 3 may also be a bottom plan view of the lighting device 100 according to the embodiment of the present invention of FIG. 1.

The lighting apparatus 300 according to another embodiment may include a light emitting module unit 310, a heat radiator 320 disposed on the light emitting module unit 310, and a heat radiating fan 330 disposed on the heat radiator 320. ), A light emitting module unit 310, a heat sink 320, and a heat dissipation fan 330 may include a housing 350.

The light emitting module unit 310, the heat dissipating member 320, and the heat dissipating fan 330 may be the same as one embodiment of the present invention, but in another embodiment of the present invention, the light emitting module unit 310 and the heat dissipating body 320 are provided. And a housing 350 for receiving the heat dissipation fan 330. The housing 350 may be separated into the upper case 150 and the lower case 160 as in one embodiment of the present invention, or may be manufactured in one piece.

The driving unit 340 is disposed inside the housing 350 to supply external power to the heat dissipation fan 330 and the light emitting module unit 310.

An air inlet 361 and an air outlet 362 may be disposed at a lower portion of the housing 350, that is, a portion of the light emitting module that faces in the direction in which light is emitted. An air passage may be disposed in the housing 350 such that air introduced from the air inlet 361 passes through the heat radiating fan 330 and passes through the heat radiator 320 through the air outlet 362. have. Air passages connected to the air inlet 361 and the air outlet 362 may be separated from each other by the partition wall 351 and the heat radiating fan 330 in the housing 350.

An upper air inlet 371 may be disposed on an upper surface of the housing 350, that is, a surface of the housing 350 above the heat radiating fan 330. The upper air inlet 371 may be disposed at a position of the upper surface of the housing 350 corresponding to a position perpendicular to the position of the air inlet 361 disposed on the lower surface of the housing 350.

Accordingly, as shown in FIG. 3, the upper surface air inlet 371 is disposed on the upper surface of the housing 350 through the air inlet 361 disposed on the lower surface of the housing 350 in the lower plan view. Can be seen.

4 illustrates a cross-sectional view of the A-A line of FIG.

In FIG. 4, an air inflow path of the lighting apparatus 300 according to another embodiment may be seen. Air outside the lighting device 300 is moved to the space between the housing 350 and the top of the heat radiation fan 330 through the air inlet 361 and the top air inlet 371 according to the operation of the heat radiation fan 330. .

According to one embodiment illustrated in FIG. 1, when the heat radiating fan 130 operates, the outside air will be moved to the space between the upper case 150 and the top of the heat radiating fan 130.

Looking at the cross section in the direction of the air inlet 361, the heat sink 320 may be configured to be separate from the air inlet path. According to this configuration, the air introduced from the air inlet 361 and the upper air inlet 371 is introduced into the lighting device while maintaining the room temperature without contacting the radiator 320.

When the incoming air comes into contact with the radiator first, heated air flows in between the upper part of the radiating fan and the housing, thereby preventing cooling of the driving unit 340 effectively.

The incoming air is moved to a space between the housing 350 and the upper portion of the heat dissipation fan 330 while maintaining the room temperature, and heat exchanges with the driving unit 340 of the lighting device 300 to cool the driving unit 340. have.

FIG. 5 shows a cross-sectional view of the B-B line of FIG. 3.

In FIG. 5, an air discharge path of the lighting device 300 according to another embodiment may be seen. As shown in FIG. 4, the air introduced into the upper portion of the heat dissipation fan 330 through the air inlet 361 and the upper air inlet 371 is lowered from the heat dissipation fan 330 and the heat sink according to the operation of the heat dissipation fan 330. It is injected into the space between 320. The injected air passes through the surface of the heat dissipator 320 and exchanges heat with the heat dissipator 320 to cool the heat dissipator 320 that has received heat from the light emitting module unit 310.

The inside of the housing 350 of the air outlet 362 portion is blocked by the partition wall 351 as shown in FIG. 5, and the air that absorbs heat from the heat radiator 320 and heats up is illuminated by the operation of the heat radiating fan 330. It is discharged to the outside of the lighting device 300 without entering back to the inside.

FIG. 6 shows a cross-sectional view of the C-C line of FIG. 3.

FIG. 7 shows a plan view of the D-D line of FIG. 6.

6 and 7 are a cross-sectional view and a plan view showing a portion of the partition wall 351 of the lighting device 300 according to another embodiment, the partition wall 351 separating the air inlet 361 and the air outlet 362 and the air path that follows ) Can be seen.

8 shows a bottom plan view of a lighting apparatus 400 according to another embodiment.

The lighting device 400 according to another embodiment has the same components as the lighting device 300 according to another embodiment, but since the arrangement of the air inlet and the air outlet is different, the air inlet and the air outlet are described below. To explain.

A lens 470, an air inlet 461, and an air outlet 462 may be disposed at a lower portion of the housing 450, that is, a portion of the light emitting module that faces in the direction in which light is emitted. In the lighting apparatus 400 according to another embodiment, four air inlets 461 are disposed on the bottom surface of the housing 450, and two air outlets 462 are disposed.

An upper surface air inlet 480 may be disposed on the upper surface of the housing 450, that is, the surface of the housing 450 above the heat radiating fan. The upper air inlet 480 may be disposed at a position of the upper surface of the housing 450 corresponding to a position perpendicular to the position of the air inlet 461 disposed on the lower surface of the housing 450.

Therefore, as shown in FIG. 8, in the lower plan view of the lighting device 400, the upper surface air inlet 480 disposed on the upper surface of the housing 450 through the air inlet 461 disposed on the lower surface of the housing 450. Can be seen.

9 shows a side view of a lighting apparatus 400 according to another embodiment.

As shown in FIG. 9, an upper surface air inlet 480 may be disposed on the upper surface of the housing 450. The upper air inlet 480 is disposed in addition to the air inlet 461 disposed on the lower surface of the housing 450, thereby reducing the inflow rate of air to minimize dust inflow and increasing the amount of air introduced at room temperature. The cooling effect of the internal temperature is increased.

10 illustrates various embodiments of an air inlet and an air outlet arrangement of a lighting device.

The air inlet 261 and the air outlet 262 may be arranged in various forms at various positions of the lower surface of the housing or the lower case as shown in FIG. 10.

As shown in FIGS. 10A and 10B, the air inlet 261 and the air outlet 262 may be disposed in an arc shape at the edge of the lower case. FIG. 10 (a) shows a case where the air inlet 261 and the air outlet 262 arranged in the edge portion are alternately arranged. The edge portion means an edge portion away from the center of the lower case, and how far the air inlet 261 and the air outlet 262 are to be disposed from the center of the lower case may be arbitrarily determined according to the embodiment of the present invention. As illustrated in FIGS. 10A and 10B, the air inlet 261 and the air outlet 262 may be arranged in an arc shape forming a concentric circle with the lower case of a circular shape.

Also, as shown in FIG. 10C, the air inlet 261 of the lower case may be disposed inward of the air outlet 262, and as shown in FIG. 10D, the air inlet 261 may be the center of the lower case. And an air outlet 262 may be configured to be disposed at an edge portion of the lower case. The air inlet 261 and the air outlet 262 may have various shapes such as circular, polygonal, as well as circular arcs.

When the air inlet 261 is disposed inward of the air outlet 262 as shown in FIGS. 10 (c) and 10 (d), it is possible to reduce the probability that the warmed air discharged through the air outlet 262 is re-introduced through the air inlet. Can be.

Table 1 shows the simulation results for the LED temperature and the case temperature in the MR16 lighting device having an ambient temperature of 25? And an applied power of 10W. In the case of using only the heat sink and the heat dissipation fan, the case of Examples (a) to (d) having an air inlet and an air outlet was compared.

Figure pat00001

 Compared with the case of using only the heat sink, the case temperature can be as high as 0.1 ℃ to 28 ℃ when using a heat radiating fan, it can be seen that the LED temperature is lowered by 16 ℃ ~ 32 ℃.

In addition, the results of experimenting at an internal temperature of 25 ° C. with or without the upper air inlet port on the upper surface of the housing or the upper case can be seen in Table 2 below.

[Table 2]

Figure pat00002

As shown in the results in Table 2, the internal temperature of the lighting device is lowered when the upper air inlet is arranged.

Considering that the quality characteristics and lifetime of the LED are affected by the temperature of the LED, the lighting apparatus according to the embodiments of the present invention shows a markedly improved performance in quality characteristics and lifetime compared to the conventional case using only a heat sink.

The present invention includes a heat sink and a heat dissipation fan as described in the above embodiment, and having an air inlet and an air outlet disposed independently of each other, and further having an upper air inlet on the upper surface of the housing, thereby cooling It is possible to provide a lighting device with increased efficiency.

In addition, an additional upper air inlet is disposed on the upper surface of the housing in addition to the lower surface of the housing, thereby reducing the flow rate of the incoming air and minimizing the inflow of dust. have.

Embodiments of the present invention can be used in a lighting lamp that focuses a plurality of LEDs to obtain light, in particular embedded in the ceiling or wall to be installed in the structure facing the lighting area to be mounted using only the LED to be exposed so that only the front surface is mounted. It may be used in a type lighting device.

[Modified example having an air outlet at the side surface]

11 is a perspective view of a lighting apparatus according to another embodiment. 12 is a bottom plan view of a lighting apparatus according to another embodiment. FIG. 13 shows a cross sectional view along line A-A in FIG. FIG. 14 shows a cross-sectional view of the B-B line of FIG. 12.

The lighting apparatus according to another embodiment includes a light emitting module unit 515 and 517, an intermediate body 510 disposed on the light emitting module unit, an upper case 550 coupled to the intermediate body 510, and an intermediate body 510. It may include a lower case 560 coupled to and fixing the light emitting module units 515 and 517.

The light emitting module unit may include a substrate 517 and a light emitting element 515 disposed on the substrate 517.

The intermediate body 510 may include a heat sink 513 disposed on one side of the light emitting module units 515 and 517. The intermediate body 510 is disposed to be in contact with the rear portion of the light emitting module units 515 and 517 so that heat of the light emitting module units 515 and 517 can be efficiently transmitted to the intermediate body 510.

The heat dissipation fan 530 may be disposed on the heat dissipation 513 to allow external air flow to be transmitted to the heat dissipation 513. This air flow may allow heat of the heat sink 513 to be released to the outside. The heat dissipation fan 530 may be spaced apart from the heat dissipation 513 and disposed in a direction toward the heat dissipation 513.

The upper case 550 may be disposed to cover the heat radiating fan 530. The upper case 550 may form a closed space to allow the outside air sucked by the heat radiating fan 530 to exit through the air outlet 515.

The lower case 560 may have an air inlet 561 as shown in FIG. 12. A circular dotted line through which the line A-A indicated on the surface of the lower case 560 shown in FIG. 12 passes is a screw groove for screwing the lower case 560 into the intermediate body 510 or the like.

The position of the air inlet 561 disposed in the lower case 560 is changeable and may be disposed in the edge portion of the lower case 560 as shown in FIG. 12, but may be disposed in the center of the lower case 560.

The air outlet 516 may be disposed in the intermediate body 510 in a direction in which the air inlet 561 is not disposed. As described in the above embodiment, the air introduced through the air inlet 561 enters between the upper case 550 and the heat dissipation fan 530, passes through the heat dissipation fan 530, and exchanges heat with the heat dissipator 513. May be discharged through the outlet 516.

The air inlet 561 of the lower case 560 leads to the space between the upper case 550 and the upper portion of the heat dissipation fan 530, and the air outlet 516 is connected to the lower portion of the heat dissipation fan 530 and the heat sink 513. It can lead to spaces in between.

In addition, the air passage leading to the air inlet 561 and the air passage leading to the air outlet 516 may be separated from each other by the partition wall of the upper case 550 and the heat dissipation fan 530.

The air outlet 516 is disposed on the surface facing the outer circumferential direction of the intermediate body 510 to allow the air introduced therein to escape in the outer circumferential direction of the lighting device. In this case, the air flowing out through the air outlet 516 does not flow back into the air inlet 561. Therefore, since the air heated by heat-exchanging with the radiator 513 is not introduced into the lighting apparatus again, the thermal efficiency of the lighting apparatus may be improved.

In FIGS. 13 and 14, the intermediate body 510 including the heat dissipator 513 and the upper case 550 are separately configured, but the heat dissipation 513 is separately configured, and the upper case radiates the heat dissipation fan 530. The structure which covers all the sieves 513 is also possible. In this case, an air outlet may be disposed on a surface of the upper case that faces the outer circumferential direction of the upper case.

Although the above description has been made with reference to the embodiments, these are merely examples and are not intended to limit the present invention. Those skilled in the art to which the present invention pertains are not illustrated above without departing from the essential characteristics of the present embodiments. It will be appreciated that many variations and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

100, 300, 400: lighting apparatus 110, 310: light emitting module
120, 320: radiator 130, 330: radiator fan
140 and 340: driving unit 150: upper case
160: lower case 350, 450: housing
261, 361: air inlet 262, 362: air outlet
480: upper air inlet

Claims (6)

  1. A light emitting module unit;
    A heat sink disposed on the light emitting module unit;
    A heat radiation fan disposed on the heat sink;
    An upper case covering the radiating fan and the radiator; And
    A lower case coupled to the upper case and fixing the light emitting module unit;
    An air inlet is disposed in the lower case,
    The upper case is provided with an air outlet on the surface facing the outer circumferential direction of the upper case,
    Lighting device.
  2. A light emitting module unit;
    An intermediate body including a heat sink disposed on the light emitting module unit;
    A heat radiation fan disposed on the heat sink;
    An upper case covering the heat dissipation fan and coupled to the intermediate body;
    A lower case coupled to the intermediate body and fixing the light emitting module unit;
    An air inlet is disposed in the lower case,
    The intermediate body is provided with an air outlet on the surface facing the outer peripheral direction of the intermediate body,
    Lighting device.
  3. 3. The method according to claim 1 or 2,
    The air inlet of the lower case leads to the space between the upper case and the top of the heat radiating fan, the air outlet leads to the space between the bottom of the heat radiating fan and the heat sink,
    Lighting device.
  4. 3. The method according to claim 1 or 2,
    The air passage leading to the air inlet and the air passage leading to the air outlet are separated from each other by the partition of the upper case and the heat dissipation fan,
    Lighting device.
  5. 3. The method according to claim 1 or 2,
    The air inlet is disposed on the edge portion of the lower case,
    Lighting device.
  6. 3. The method according to claim 1 or 2,
    The air inlet is disposed in the center of the lower case,
    Lighting device.


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US14/240,317 US9739469B2 (en) 2011-08-30 2012-08-30 Lighting device
EP12829045.9A EP2751473B1 (en) 2011-08-30 2012-08-30 Lighting device
PCT/KR2012/006920 WO2013032239A1 (en) 2011-08-30 2012-08-30 Lighting device
CN201610883790.1A CN107023762A (en) 2011-08-30 2012-08-30 Lighting device
CN201280042436.6A CN103782081B (en) 2011-08-30 2012-08-30 Lighting device
JP2014528280A JP6116567B2 (en) 2011-08-30 2012-08-30 Lighting device

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US20060193139A1 (en) * 2005-02-25 2006-08-31 Edison Opto Corporation Heat dissipating apparatus for lighting utility
US20100246166A1 (en) * 2009-03-24 2010-09-30 Nien-Hui Hsu Illumination apparatus
WO2011005314A2 (en) * 2009-07-06 2011-01-13 Rodriquez Edward T Cooling solid state high-brightness white-light illumination sources
KR20110004715A (en) 2009-07-08 2011-01-14 이상구 The led light with a cooling fan
US20110037368A1 (en) * 2009-08-14 2011-02-17 Risun Expanse Corp. Lamp structure
WO2011036591A1 (en) * 2009-09-23 2011-03-31 Koninklijke Philips Electronics N.V. A lighting device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060193139A1 (en) * 2005-02-25 2006-08-31 Edison Opto Corporation Heat dissipating apparatus for lighting utility
US20100246166A1 (en) * 2009-03-24 2010-09-30 Nien-Hui Hsu Illumination apparatus
WO2011005314A2 (en) * 2009-07-06 2011-01-13 Rodriquez Edward T Cooling solid state high-brightness white-light illumination sources
KR20110004715A (en) 2009-07-08 2011-01-14 이상구 The led light with a cooling fan
US20110037368A1 (en) * 2009-08-14 2011-02-17 Risun Expanse Corp. Lamp structure
WO2011036591A1 (en) * 2009-09-23 2011-03-31 Koninklijke Philips Electronics N.V. A lighting device

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