TWI527508B - Method and apparatus for peeling copper foil - Google Patents

Description

Substrate copper foil stripping method and device

The present invention relates to a peeling method and apparatus, and more particularly to a method and apparatus for peeling off a substrate copper foil which can peel a metal copper foil on a substrate without damaging the copper foil.

According to the general semiconductor chip packaging process, a layer of copper foil is usually adhered on a substrate with a viscous material, and the copper foil is peeled off after the packaging process is completed; such copper foil is difficult to peel off due to the metal material. The method adopts a laser to cut a corner at the corner edge of the substrate, and exposes the copper foil at the edge, and then performs laser height measurement with a laser measuring instrument to determine that the substrate of the corner edge has been cut off, and then the substrate side is removed. The copper foil is clamped by vacuum adsorption, and then the copper foil is clamped and then peeled off to complete the separation of the copper foil from the substrate.

However, the prior art copper foil stripping method has to be subjected to procedures such as laser cutting and laser height measurement, and its operation and timing are too complicated, and the throughput rate UPH (Unit Per Hour) is too low, and the cost is quite high; After the substrate is cut off to form waste, there will be troubles in handling, which is quite inconsistent with economic benefits!

Therefore, the object of the present invention is to provide a method for stripping a copper foil of a substrate which does not require laser cutting during the stripping process of the copper foil from the substrate, and which does not require laser height measurement.

Another object of the present invention is to provide a copper foil peeling device for forming a copper foil which does not need to be laser cut during the stripping process from the substrate, and which does not need to be subjected to laser height measurement.

A further object of the present invention is to provide a method for performing the patent application The apparatus for peeling off a substrate copper foil according to any one of items 1 to 7.

The substrate copper foil stripping method according to the object of the present invention comprises: a substrate adsorption step of adsorbing the surface of the substrate by the first adsorption device; a copper foil adsorption step, adsorbing the surface of the copper foil with the second adsorption device; and a stripping step The second adsorption device adsorbs the copper foil and peels off the substrate.

Another substrate copper foil stripping method according to the object of the present invention comprises: a substrate adsorption step of adsorbing the surface of the substrate by the first adsorption device; a copper foil adsorption step, adsorbing the surface of the copper foil with the second adsorption device; and a stripping step The first adsorption device adsorbs the substrate, and the second adsorption device adsorbs the copper foil, and the two substrates are peeled off between the substrate and the copper foil.

A substrate copper foil stripping device according to another object of the present invention is for peeling a substrate from a copper foil, comprising: a first adsorption device, one side of the substrate, including a first adsorption surface that can be used to contact the substrate a first vacuum suction port corresponding to the surface of the substrate; a second adsorption device located on one side of the copper foil, including a second adsorption surface which can be used to contact the copper foil, and is provided with a surface of the copper foil Corresponding to the second negative pressure suction port; the first adsorption device and the second adsorption device are used to peel the substrate from the copper foil.

A substrate copper foil stripping apparatus according to still another object of the present invention, for peeling a substrate from a copper foil, comprising: a device for performing the substrate copper foil stripping method according to any one of claims 1 to 7.

In the method and device for peeling off the substrate copper foil according to the embodiment of the present invention, the copper foil is peeled off from the substrate by the relative displacement of the adsorption substrate of the first adsorption device and the second adsorption device, so that no laser cutting is required in the process. There is no need for laser height measurement, and there is no waste formed by the cutting of the substrate at the edge of the corner. Therefore, the procedure is streamlined and rapid, and the throughput rate UPH (Unit Per Hour) can be greatly improved, and the cost is relatively low, and there is no waste. The troubles in handling have considerable economic benefits!

1‧‧‧Substrate

2‧‧‧ copper foil

21‧‧‧ edge

3‧‧‧First adsorption device

31‧‧‧First adsorption surface

32‧‧‧First negative pressure chamber

33‧‧‧First negative pressure suction

4‧‧‧Second adsorption device

41‧‧‧Second adsorption surface

42‧‧‧Negative pressure pipeline

43‧‧‧Second negative pressure suction

The first figure is a schematic cross-sectional view of a substrate and a copper foil in the embodiment of the present invention.

The second figure is a schematic cross-sectional view of the substrate and the copper foil of the first adsorption device and the second adsorption device in the embodiment of the present invention.

The third figure is a bottom view of the second adsorption device relative to the copper foil in the embodiment of the present invention.

The fourth figure is a schematic cross-sectional view of the initial peeling stroke in the embodiment of the present invention.

The fifth drawing is a schematic cross-sectional view of the continuous peeling stroke in the embodiment of the present invention.

Referring to FIG. 1 , a method and a device for stripping a substrate copper foil according to an embodiment of the present invention are used to perform stripping between a substrate 1 and a copper foil 2 as shown in the figure. The substrate 1 and the copper foil 2 are usually adhered. The material forms a sticky state.

Please refer to the second figure. The apparatus shown in the figure can be exemplified in the stripping method. The method includes the following: a first adsorption device 3, one side of the substrate 1 includes a surface that can be used to contact the substrate 1. The first adsorption surface 31 has a wide range of mask adsorption on the surface of the substrate 1. The first adsorption device 3 is provided with a first negative pressure chamber 32, and is disposed on the first adsorption surface 31. a plurality of first negative pressure suction ports 33 corresponding to the surface of the substrate 1; a second adsorption device 4 on one side of the copper foil 2, including a second adsorption surface 41 which can be used to contact the copper foil 2, the second The adsorption surface 41 is shielded and adsorbed to the proximal edge 21 of the copper foil 2, and the second adsorption device 4 is provided with a negative conduit 42 and the second adsorption surface 41 is provided with a surface corresponding to the surface of the copper foil 1. Two negative pressure suction ports 43.

Referring to the third figure, the second adsorption device 4 is in the form of a strip, and is placed on the proximal edge 21 of the copper foil 2, and the second negative pressure suction port 43 is also elongated to correspond to the copper foil 2. Most of the width is used as a mask for adsorption.

Referring to the fourth embodiment, the substrate copper foil stripping method of the embodiment of the present invention may include the following steps: a substrate 1 adsorption step, the first adsorption surface 31 of the first adsorption device 3 is attached to the surface of the substrate 1 The negative pressure is adsorbed on the surface of the substrate 1 through the first negative pressure suction port 33; a copper foil 2 adsorption step is applied to the surface of the copper foil 1 by the second adsorption surface 41 of the second adsorption device 4, and the second negative pressure is applied under negative pressure. The suction port 43 adsorbs the surface of the near edge 21 of the copper foil 2; a peeling step includes an initial peeling stroke and a continuous peeling stroke; wherein, the initial peeling stroke is as shown in the fourth figure, mainly for the second adsorption device 4 The second adsorption surface 41 is under the surface of the adsorption copper foil 2, so that the copper foil 2 at the end edge 21 of the adsorption is peeled off from the substrate 1; the continuous peeling stroke is as shown in the fifth figure, mainly after the initial peeling stroke is completed, on the substrate. 1 in a horizontal state, the first adsorption device 3 is caused to adsorb the substrate 1 to the upper right side, and at the same time, the second adsorption device 4 adsorbs the copper foil 2 to the lower left, and the substrate 1 and the copper foil are displaced in opposite directions. 2 is completely stripped; the opposite direction is not necessarily mutually The line of one hundred and eighty degrees is opposite to the direction, but is relatively displaced or far away. For example, when the displacement direction of the second adsorption device 4 adsorbing the copper foil 2 is displaced to the lower left side, the arc direction may be divided by the oblique movement. In the same manner, the arc-shaped moving circuit can also be referred to the displacement of the substrate 1 by the first adsorption device 3, and the first adsorption device 3 is displaced to the upper right by the substrate 1, or can be displaced to the right only in the horizontal direction.

In the method and apparatus for peeling off the substrate copper foil according to the embodiment of the present invention, the copper foil 2 is peeled off from the substrate 1 by the relative adsorption displacement of the copper foil 2 adsorbed by the first adsorption device 3 and the second adsorption device 4, In the process, there is no need for laser cutting, no laser height measurement, and no waste formed by the cutting of the substrate at the edge of the edge. Therefore, the procedure is simple and rapid, and the throughput rate UPH (Unit Per Hour) can be greatly improved. The cost is quite low, and there is no trouble in waste disposal, and it has considerable economic benefits!

However, the above is only a preferred embodiment of the present invention, and when The scope of the present invention is defined by the scope of the invention, and the equivalent equivalents and modifications of the present invention are still within the scope of the invention.

1‧‧‧Substrate

2‧‧‧ copper foil

21‧‧‧ edge

3‧‧‧First adsorption device

31‧‧‧First adsorption surface

33‧‧‧First negative pressure suction

4‧‧‧Second adsorption device

41‧‧‧Second adsorption surface

43‧‧‧Second negative pressure suction

Claims (12)

A substrate copper foil stripping method comprises: a substrate adsorption step of adsorbing the surface of the substrate by the first adsorption device; a copper foil adsorption step, adsorbing the surface of the copper foil by the second adsorption device; and a stripping step to make the second adsorption device The adsorbed copper foil is peeled off from the substrate. A substrate copper foil stripping method comprises: a substrate adsorption step of adsorbing the surface of the substrate by the first adsorption device; a copper foil adsorption step, adsorbing the surface of the copper foil by the second adsorption device; and a stripping step to make the first adsorption device The substrate is adsorbed, and the copper foil is adsorbed by the second adsorption device, and the substrate and the copper foil are peeled off with a relative displacement therebetween. The substrate copper foil peeling method according to any one of claims 1 to 2, wherein, in the horizontal state, the substrate adsorbs the substrate to the upper right by the first adsorption device. The method for peeling off a substrate copper foil according to any one of claims 1 to 2, wherein the second adsorption device displaces the displacement direction of the copper foil toward the lower left. The substrate copper foil stripping method according to the fourth aspect of the invention, wherein the second adsorbing device adsorbs the displacement direction of the copper foil by an arc moving path. The method for peeling off a substrate copper foil according to any one of claims 1 to 2, wherein the second adsorption device adsorbs a proximal edge of one side of the copper foil. The substrate copper foil stripping method according to any one of claims 1 to 2, wherein the stripping step comprises an initial peeling stroke and a continuous peeling stroke; wherein the initial peeling stroke causes the second adsorption device to adsorb copper Under the surface of the foil, the copper foil at the adsorption site is peeled off from the substrate; the peeling stroke is continued to cause the first adsorption device to adsorb the substrate, and the second adsorption device is used to adsorb the copper foil, and the substrate and the copper foil are disposed under the relative displacement of the two. Stripped. A substrate copper foil stripping device for stripping a substrate from a copper foil, comprising: a first adsorption device, one side of the substrate, comprising a first adsorption surface that can be used to contact the substrate, and a first vacuum suction port corresponding to the surface of the substrate; and a second adsorption device located in the copper foil One side comprises a second adsorption surface which can be used to contact the copper foil, and a second vacuum suction port corresponding to the surface of the copper foil is provided; the first adsorption device and the second adsorption device are used to peel the substrate from the copper foil By. The substrate copper foil stripping device of claim 8, wherein the first adsorbing faces the surface of the substrate for a wide range of adsorption. The substrate copper foil stripping device according to claim 8, wherein the second adsorption surface is adsorbed toward a proximal edge of the copper foil. The substrate copper foil peeling device according to claim 8, wherein the second adsorption device is in the form of a strip. A substrate copper foil stripping device for stripping a substrate from a copper foil, comprising: a device for performing the substrate copper foil stripping method according to the first to seventh aspects of the patent application.