TWI527120B - Laser processing apparatus and method of controlling the same - Google Patents

Description

Laser processing device and control method thereof

The present invention relates to a laser processing apparatus and a control method thereof, and more particularly to a laser processing apparatus capable of selectively performing laser processing on a portion of a substrate to be subjected to laser processing, and a control method thereof. And it is possible to prevent gas from remaining between the substrate and the platform until the substrate is placed on the platform.

When manufacturing a semiconductor device, a flat panel display (FPD) device, or a solar cell device or the like, when a thin film is deposited at a high temperature, a thermochemical reaction may cause contamination of the reactor or may generate an undesired compound.

Thus, a thin film is deposited at a low temperature using laser-excited plasma chemical vapor deposition.

Meanwhile, since it is difficult to ensure uniformity in film deposition and annealing as the substrate size is increased, various measures including laser annealing treatment have been proposed.

The reaction chamber is provided with an air inlet/outlet port through which the reaction gas is supplied or discharged from the reaction chamber, and a quartz glass window is disposed at the upper end of the reaction chamber. A laser device is placed over the quartz glass window and a laser beam emitted from the laser device passes through the quartz glass window and reaches the substrate in the reaction chamber.

The laser beam illuminated in the form of a curtain is perpendicular to the substrate or slightly inclined relative to the substrate.

The substrate is horizontally moved in one direction relative to the laser beam such that the laser beam illuminates the entire surface of the substrate.

Korean Patent Application No. 10-2010-0138509 A (published on Dec. 31, 2010) entitled "Surface Processing Apparatus for Adjusting the Length and Strength of Energy Beams" discloses the prior art of the present invention. Surgery.

However, since the general-purpose laser processing apparatus irradiates the laser beam to the entire substrate to perform laser processing, the laser beam may even illuminate a portion of the substrate that does not require processing, so that it is difficult to reduce the time of the laser processing.

Additionally, the universal laser processing apparatus is not provided with a separate device capable of removing gas from the space between the substrate and the platform until the substrate is placed on the platform. Therefore, when a large substrate is placed on the stage, gas may remain between the substrate and the stage.

When the substrate is placed on the platform, the gas remaining between the substrate and the platform causes bubbles to form and the substrate to be uneven. Moreover, during the laser processing, the gas remaining between the substrate and the platform can deflect the laser beam away from the focal range and cause uneven heat treatment over the entire area of the substrate.

Therefore, there is a need for a laser processing apparatus that overcomes such problems in the prior art.

The present invention relates to a laser processing apparatus and a control method thereof, and more particularly to a laser processing apparatus capable of selectively performing laser processing on a portion of a substrate to be subjected to laser processing, and a control method thereof. And it is possible to prevent gas from remaining between the substrate and the platform until the substrate is placed on the platform.

According to one aspect of the invention, a laser processing apparatus includes: a platform placed in a reaction chamber and a substrate placed on the platform; a vacuum unit provided to the platform to occlude oxygen from a space between the substrate and the platform is discharged to the outside of the reaction chamber; and a controller that, when the substrate is placed on the platform, transmits an operation signal to the vacuum unit such that oxygen is sequentially performed from the central portion of the platform to the periphery thereof Emissions operation.

The vacuum unit may include: a plurality of vacuum holes provided to the stage; and a vacuum pump connected to the vacuum holes and used to discharge oxygen to the outside of the reaction chamber.

The platform may include a central portion disposed to divide the platform into two symmetrical portions through a center of the platform; a first side portion adjacent the center portion; a second side portion adjacent to an outer side of the first side portion; and a third side portion Adjacent to the outer side of the second side portion; and a plurality of intersection portions disposed to intersect the second side portion.

The vacuum hole may include: a first vacuum hole formed in the center portion; a second vacuum hole formed in the first side portion; a third vacuum hole formed in the second side portion; and a fourth vacuum hole formed in the third And a fifth vacuum hole formed in the intersection.

According to another aspect of the present invention, a method of controlling a laser processing apparatus includes: discharging oxygen from a center portion of a stage placed in a reaction chamber when a substrate is placed on a stage; and completely discharging oxygen from a center portion of the stage when the substrate is placed on the stage Oxygen is discharged from a first side portion of a central portion of the adjacent platform; when oxygen is completely discharged from the first side portion, oxygen is discharged from a second side portion adjacent to the outer side of the first side portion; when oxygen is from the second side portion When fully discharged, oxygen is discharged from a third side adjacent to the outer side of the second side portion; and when oxygen is completely discharged from the third side portion, oxygen is discharged from the intersection portion intersecting the second side portion.

In the laser processing apparatus and the control method therefor according to the present invention, since the laser beam can illuminate only the portion of the substrate to be subjected to the laser processing, the operation time for irradiating the laser beam can be shortened, thereby reducing the laser processing Time and cost.

Further, in the laser processing apparatus and the control method thereof according to the present invention, in a space between the substrate and the stage, a vacuum is sequentially generated from the center of the stage to the periphery thereof to prevent gas from remaining in the substrate and the platform. Therefore, it is possible to effectively prevent bubbles from being generated between the substrate and the stage during the laser processing of the large substrate.

As a result, the laser processing apparatus according to the present invention can provide uniform flatness in the entire area of the large substrate, allow the laser beam to be irradiated to the substrate within the focus range, and can uniformize the entire area of the large substrate. Heat treatment.

10‧‧‧Reaction room

12‧‧‧ platform

12a‧‧‧ Central Department

12b‧‧‧ first side

12c‧‧‧ second side

12d‧‧‧ third side

12e‧‧‧Intersection

14‧‧‧ drive unit

20‧‧‧Marking unit

22‧‧‧Processing unit

22a‧‧‧Exhaust hole

24‧‧‧Remove unit

24a‧‧‧curved part

24b‧‧‧vacuum hole

26‧‧‧Sensor unit

26a‧‧‧first sensor

26b‧‧‧Second sensor

26c‧‧‧ third sensor

30‧‧‧vacuum unit

32‧‧‧vacuum hole

32a‧‧‧First vacuum hole

32b‧‧‧second vacuum hole

32c‧‧‧ third vacuum hole

32d‧‧‧fourth vacuum hole

32e‧‧‧ fifth vacuum hole

34‧‧‧vacuum pump

34a‧‧‧First vacuum pump

34b‧‧‧second vacuum pump

34c‧‧‧ third vacuum pump

34d‧‧‧fourth vacuum pump

34e‧‧‧ fifth vacuum pump

50‧‧‧Laser generating unit

51‧‧‧Blocking unit

52‧‧‧ housing

52a‧‧‧ Entrance

52b‧‧‧Export

54‧‧‧First barrier

54a‧‧‧First reflector

54b‧‧‧First rotating shaft

54c‧‧‧First motor

56‧‧‧second barrier

56a‧‧‧second reflector

56b‧‧‧second axis of rotation

56c‧‧‧second motor

58‧‧‧Power meter

59‧‧‧beam collector

70‧‧‧ Optical unit

72‧‧‧Support

74‧‧‧ Subject

76‧‧‧ channel

78‧‧‧Supply unit

80‧‧‧Vibration detection unit

82‧‧‧First vibration detection sensor

84‧‧‧Second vibration detection sensor

86‧‧‧ Third vibration detection sensor

88‧‧‧fourth vibration detection sensor

90‧‧‧ Controller

100‧‧‧substrate

102‧‧‧ benchmark

104‧‧‧ gap

106‧‧‧Processing position

S10, S20, S30, S40, S50, S60, S70, S80, S90‧‧ steps

S41, S42, S44, S46, S48‧ ‧ steps

S110, S120, S130, S140, S150, S160‧‧ steps

The above and other objects, features and other advantages of the present invention will become more <RTIgt; 2 is a schematic view of a reaction chamber and a marking unit of a laser processing apparatus according to an embodiment of the present invention; FIG. 3 is a plan view of a substrate on which a laser processing apparatus according to an embodiment of the present invention is FIG. 4 is a perspective view of a marking unit of a laser processing apparatus according to an embodiment of the present invention; FIG. 5 is a perspective view of a removing unit of the laser processing apparatus according to an embodiment of the present invention; Is a perspective view of a blocking unit of a laser processing apparatus in accordance with an embodiment of the present invention; Figure 7 is a perspective view of a laser processing apparatus performing laser inspection in accordance with an embodiment of the present invention; and Figure 8 is an operation of a blocking unit of a laser processing apparatus according to an embodiment of the present invention. 9 is a plan view of a stage of a laser processing apparatus according to an embodiment of the present invention; FIG. 10 is a block diagram of a laser processing apparatus according to an embodiment of the present invention; and FIG. 11 is a block diagram according to an embodiment of the present invention. A flowchart of a method of controlling a laser processing apparatus; FIG. 12 is a flowchart of an oxygen discharging process of a laser processing apparatus according to an embodiment of the present invention; and FIG. 13 is a vibration of a laser processing apparatus according to an embodiment of the present invention. Flow chart of the detection process.

Exemplary embodiments of the present invention will be described below with reference to the accompanying drawings. It is to be understood that the appended drawings are not in the The singular terms such as "a", "an" Moreover, the terms used herein are defined by considering the functions disclosed herein and can be changed according to the habit or will of the user or operator. Therefore, the definition of terms should be based on the full text given here.

1 is a perspective view of a laser processing apparatus according to an embodiment of the present invention; FIG. 2 is a schematic view of a reaction chamber and a marking unit of a laser processing apparatus according to an embodiment of the present invention; and FIG. 3 is a plan view of the substrate A laser processing apparatus according to an embodiment of the present invention generates a reference point on the substrate.

4 is a perspective view of a marking unit of a laser processing apparatus according to an embodiment of the present invention, and FIG. 5 is a perspective view of a removing unit of the laser processing apparatus according to an embodiment of the present invention.

Referring to FIGS. 1 through 5, a laser processing apparatus according to an embodiment of the present invention includes a reaction chamber 10 including a stage 12 on which a substrate 100 is placed, and a marking unit 20 provided to the reaction chamber 10 to be on the substrate 100. Forming a reference point 102; a sensing unit 26 that detects the position of the substrate 100 or the position of the reference point 102; a driving unit 14 that moves the stage 12 on which the substrate 100 is placed; and a laser generating unit 50 that illuminates the laser beam An optical unit 70 that transmits the laser beam irradiated by the laser generating unit 50 into the reaction chamber 10; a blocking unit 51 that blocks the laser light irradiated from the laser generating unit 50 a vacuum unit 30, which is supplied to the platform 12 to discharge oxygen from a space between the substrate 100 and the stage 12 to the outside of the reaction chamber 10; a vibration detecting unit 80 that detects the reaction chamber 10, the laser generating unit 50, Vibration of the optical unit 70 or the platform 12; and a controller 90 that transmits an operational signal to the marking unit 20 or the driving unit 14 in response to a position signal transmitted from the sensing unit 26, also when the substrate 100 is placed on the platform 12. An operation signal is sent to the vacuum unit 30 to sequentially perform an oxygen discharge operation from the center portion 12a of the stage 12 to its periphery, and whether or not to operate the blocking unit 51 based on the vibration signal transmitted from the vibration detecting unit 80.

When the substrate 100 is received within the reaction chamber 10, the position of the substrate 100 is detected by the sensing unit 26, and the position signal is transmitted to the controller 90. Then, the driving unit 14 is driven in response to an operation signal transmitted from the controller 90, and the substrate 100 is moved such that the target position in the substrate 100 faces the marking unit 20.

When the target position in the substrate 100 is moved toward the marking unit 20, the reference point 102 is formed at the target position in the substrate 100 by the marking unit 20.

After the reference point 102 is formed on the substrate 100, it is determined by calculating the distance and direction from the reference point 102 determined based on the position signal transmitted from the sensing unit 26 to the processing position 106 on which the laser processing is to be performed. Processing location 106.

The drive unit 14 is operated to move the substrate 100 such that the processing location 106 of the substrate 100 is directed toward a laser beam that is emitted into the reaction chamber 10.

Then, the laser beam from the laser generating unit 50 is supplied into the reaction chamber 100 while it is reflected along the optical unit 70. Here, the laser beam is supplied into the reaction chamber 10 through a quartz glass window placed on the upper side of the reaction chamber 10.

At this time, since the substrate 100 is placed on the upper surface of the stage 12 in the reaction chamber 10, the laser processing is performed on the processing position 106 of the substrate 100 by the laser beam supplied to the reaction chamber 10.

The marking unit 20 includes a processing unit 22 placed in the reaction chamber 10, and the processing unit 22 irradiates a laser beam to the substrate 100, and a removal unit 24 that is sucked in forming a reference by the processing unit 22. The foreign matter generated from the substrate 100 at the point 102 is discharged to the outside of the reaction chamber 10.

Since the processing unit 22 is placed within the reaction chamber 10, the operation of forming the fiducials 102 on the substrate 100 is not performed separately, and the fiducials 102 may be after the substrate 100 is received within the reaction chamber 10. And formed before performing laser processing.

At the time of forming the reference point 102, the laser beam supplied from the processing unit 22 is irradiated to the substrate 100, and the impurities generated from the substrate 100 are taken in by the removing unit 24 and discharged to the outside of the reaction chamber 10.

The removing unit 24 includes a curved portion 24a having a C shape surrounding the processing unit 22, and a vacuum hole 24b formed in the curved portion 24a to suck impurities.

The curved portion 24a is C-shaped in plan view, which is formed at the lower end of the block forming the removal unit 24, and is disposed to surround the portion of the processing unit 22 that is illuminated by the laser beam.

A plurality of vacuum holes 24b are formed on the inner wall of the curved portion 24a, and are connected to the vacuum pump, whereby the laser beam emitted from the processing unit 22 passes through the curved portion 24a and is irradiated to the substrate 100, thereby forming a reference point. 102.

At this time, impurities generated from the substrate 100 are sucked by the vacuum holes 24b and discharged to the outside of the reaction chamber 10 along the path defined in the removal unit 24.

A person extending from the vacuum hole 24b to the outside of the reaction chamber 10 and the processing unit 22 can be easily realized by those skilled in the art, and thus its detailed illustration and description are omitted.

The sensing unit 26 includes a first sensor 26a for detecting a corner of the substrate 100, a second sensor 26b for detecting the position of the reference point 102, and a third sensor 26c for detecting The position of the laser beam that is incident on the reaction chamber 10 is illuminated.

When the substrate 100 is received in the reaction chamber 10 and the substrate 100 is placed on the upper surface of the stage 12, the plurality of first sensors 26a detect the corners of the substrate 100 and transmit a position signal, thereby Controller 90 determines the location of substrate 100.

When the substrate 100 is deviated from the preset position, the driving unit 14 is driven in accordance with a driving signal transmitted from the controller 90, thereby moving the substrate 100.

Thus, the substrate 100 can be placed at a preset position such that the target position in the substrate 100 can face the marking unit 20, and the laser beam is irradiated from the processing unit 22 to the target position to form the reference point 102.

When the reference point 102 is completely formed, the position of the reference point 102 is detected by the second sensor 26b, and the second sensor 26b sequentially transmits the position signal to the controller 90. Controller 90 then calculates processing location 106 based on reference point 102.

Since the third sensor 26c detects the position of the laser beam irradiated into the reaction chamber 10 by the optical unit 70, the position of the laser beam is controlled such that the position of the laser beam is directed toward The processing location 106 of the substrate 100 in the initial stage of the laser processing.

6 is a perspective view of a barrier unit of a laser processing apparatus according to an embodiment of the present invention, and FIG. 7 is a perspective view of a laser processing apparatus according to an embodiment of the present invention when performing laser inspection, and FIG. 8 is based on A perspective view of the blocking unit of the laser processing apparatus of the embodiment of the present invention in operation.

9 is a plan view of a platform of a laser processing apparatus in accordance with an embodiment of the present invention, and FIG. 10 is a block diagram of a laser processing apparatus in accordance with an embodiment of the present invention.

Referring to FIGS. 1 and 6 to 10, the vacuum unit 30 includes a plurality of vacuum holes 32 provided to the stage 12, and a vacuum pump 34 connected to the vacuum holes 32 to discharge oxygen to the outside of the reaction chamber 10.

After the position of the substrate 100 is detected by the sensing unit 26 and the target position in the substrate 100 is set to face the marking unit 20 by the driving unit 14, the vacuum pump 34 is operated such that it remains between the substrate 100 and the stage 12. Oxygen in the space is drawn in through the vacuum hole 32 and discharged to the outside of the reaction chamber 10.

Thus, oxygen can be prevented from remaining between the substrate 100 and the stage 12, and generation of impurities on the substrate 100 can be prevented during the laser processing.

The platform 12 includes a central portion 12a disposed to pass through the center of the platform 12 to divide the platform 12 into two symmetrical sections; a first side portion 12b adjacent the center portion 12a; and a second side portion 12c adjacent to the first portion The outer side of the side portion 12b; the third side portion 12d adjacent to the outer side of the second side portion 12c; and the plurality of intersection portions 12e are disposed to intersect the second side portion 12c.

When oxygen is discharged from the space between the substrate 100 and the stage 12, in order to prevent oxygen from remaining in the central portion 12a of the substrate 100, the operation of discharging oxygen is sequentially performed from the central portion 12a of the substrate 100 toward the periphery of the substrate 100.

Thus, as described above, the upper surface of the stage 12 is divided into the central portion 12a, the first side portion 12b, the second side portion 12c, the third side portion 12d, and the intersection portion 12e, and is placed to extend from the respective portions to the outside of the reaction chamber 10. Exhaust line.

The vacuum hole 32 includes a first vacuum hole 32a formed in the center portion 12a, a second vacuum hole 32b formed in the first side portion 12b, and a third vacuum hole 32c formed in the second side portion 12c; A vacuum hole 32d is formed in the third side portion 12d; and a fifth vacuum hole 32e is formed in the intersection portion 12e.

When the substrate 100 is accurately placed on the stage 12 such that the target position in the substrate 100 faces the marking unit 20, the first vacuum pump 34a is driven (which is connected to the first vacuum hole 32a formed in the central portion 12a of the stage 12) The oxygen is discharged from the central portion 12a of the substrate 100.

Thereafter, the second vacuum pump 34b, the third vacuum pump 34c, the fourth vacuum pump 34d, and the fifth vacuum pump 34e are sequentially driven, thereby sequentially discharging from the first side portion 12b, the second side portion 12c, the third side portion 12d, and the intersection portion 12e. Oxygen thus prevents oxygen from remaining between the substrate 100 and the platform 12.

The intersection portion 12e refers to a portion that intersects the second side portion 12c, and the plurality of intersection portions 12e are arranged at even intervals.

When the large-sized substrate 100 is placed on the stage 12, even if oxygen is sequentially discharged from the center portion 12a to the outside, oxygen may remain in the space between the center portion 12a and the third side portion 12d.

Therefore, after the oxygen is sequentially discharged from the center portion 12a in the lateral direction, when oxygen is discharged from the intersection portion 12e crossing the second side portion 12c, oxygen can be effectively prevented from remaining in the large-sized substrate 100 and the stage 12 between.

The blocking unit 51 includes a housing 52 placed at the discharge port of the laser generating unit 50 and including an inlet 52a and an outlet 52b; a first blocking portion 54 placed between the inlet 52a and the outlet 52b to reflect the laser beam, Thereby, the laser beam is prevented from being radiated through the outlet 52b; and a power meter 58 for measuring the intensity of the laser beam reflected by the first blocking portion 54.

When the laser beam is irradiated from the laser generating unit 50 to the substrate 100 placed on the stage 12, the laser beam is introduced into the casing 52 through the inlet 52a and is irradiated toward the optical unit 70 through the outlet 52b.

After the laser beam irradiated into the optical unit 70 passes through the plurality of lenses, the laser beam is refracted or reflected toward the reaction chamber 10 and irradiated to the substrate 100 placed on the stage 12.

In the present embodiment, since the laser beam is selectively blocked by the blocking unit 51, the laser beam irradiated into the reaction chamber 10 during the operation of the laser generating unit 50 can be selectively blocked.

Thus, the laser processing can be performed such that intervals are continuously arranged between the processing locations 106 on the substrate 100 where laser processing is to be performed.

When the laser beam is irradiated into the reaction chamber 10 with the substrate 100 placed on the stage 12, laser processing is performed on the substrate 100 using the laser beam, as the stage 12 is moved to one side by the driving unit 14. The laser beam performs laser processing on a wide area while scanning the substrate 100.

In the present embodiment, the laser beam is selectively irradiated into the reaction chamber 10 through the blocking unit 51. Thus, when the laser beam is irradiated into the reaction chamber 10 at uniform time intervals while the stage 12 is moved by the driving unit 14, the substrate 100 is subjected to laser processing, thereby arranging the plurality of processing positions 106 at even intervals.

The first blocking portion 54 includes: a first reflecting plate 54a disposed between the inlet 52a and the outlet 52b; a first rotating shaft 54b for supporting the first reflecting plate 54a and being rotatably disposed in the housing 52; And a first motor 54c for supplying power to the first rotating shaft 54b.

The first rotating shaft 54b is connected to one end of the first reflecting plate 54a. Thus, when the first rotating shaft 54b is rotated by the first motor 54c, the first reflecting plate 54a passes through the space between the inlet 52a and the outlet 52b while rotating about the rotating shaft.

When the first reflecting plate 54a is disposed between the inlet 52a and the outlet 52b, the laser beam introduced into the casing 52 through the inlet 52a is reflected by the first reflecting plate 54a and directed to the power meter 58 instead of along The outlet 52b is discharged to the outside of the housing 52.

Thus, when the laser beam is irradiated into the reaction chamber 10, the laser beams are illuminated at uniform time intervals, and laser processing is performed to form a gap 104 between the processing locations 106 on the substrate 100.

Since the laser beam reflected by the first reflecting plate 54 is irradiated to the power meter 58, the intensity of the laser beam irradiated from the laser generating unit 50 can be measured.

In the present embodiment of the invention, the blocking unit 51 further includes: a second blocking portion 56 that reflects the laser beam through the first blocking portion 54; and a beam dump 59 that is offset by The laser beam reflected by the second blocking portion 56.

Since the laser beam reflected by the first reflecting plate 54a is not directed to the power meter 58 but is reflected by the operation of the second blocking portion 56 toward the beam dump 59, the laser beam is compensated by the beam dump 59.

The operation of measuring the intensity of the laser beam with the power meter 58 is performed periodically, or when the test is performed under certain conditions.

Thus, as in the embodiment of the invention, when the substrate 100 is subjected to a laser process at the intermittent processing location 106, the first barrier 54 and the second barrier 56 are simultaneously operated such that they are emitted through the inlet 52a to the shell. The laser beam in the body 52 is reflected toward the beam dump 59 to be compensated by the first barrier 54 and the second barrier 56.

The second blocking portion 56 includes: a second reflecting plate 56a placed between the first reflecting plate 54a and the power meter 58; and a second rotating shaft 56b for supporting the second reflecting plate 56a and rotatably disposed in the case And a second motor 56c for supplying power to the second rotating shaft 56b.

Since the second reflecting plate 56a is disposed between the first reflecting plate 54a and the power meter 58, when the second motor 56c is applied with electric power to rotate the second rotating shaft 56b, it is reflected by the first reflecting plate 54 to the power. The laser beam of meter 58 is thus reflected by second reflector 56 to beam dump 59.

The first motor 54c is a large-capacity motor having a higher rotational speed than the second motor 56c, so that as the rotational speed of the first reflecting plate 54a increases, the gap between the processing positions 106 on the substrate 100 becomes smaller, and can be in an emergency In case of the situation, the laser beam is blocked immediately.

The vibration detecting unit 80 includes a first vibration detecting sensor 82 that is supplied to the reaction chamber 10, a second vibration detecting sensor 84 that is supplied to the laser generating unit 50, and a third vibration detecting sensor 86 that is Provided to the optical unit 70; and a fourth vibration detecting sensor 88 is provided to the platform 12.

When the laser processing is performed, the vibration occurring in the reaction chamber 10 is measured by the first vibration detecting sensor 82, and the vibration occurring in the laser generating unit 50 is measured by the second vibration detecting sensor 84, by the third The vibration detecting sensor 86 measures the vibration occurring in the optical unit 70, and the vibration occurring in the stage 12 is measured by the fourth vibration detecting sensor 88.

When the amplitude of the vibration measured by the first to third vibration detecting sensors 82 to 86 is greater than or equal to the preset value, the controller 90 determines an abnormal state and transmits a driving signal to the first motor 54c. Then, while the first rotating shaft 54b is rotating, the first reflecting plate 54a reflects the laser beam toward the power meter 58.

As a result, the laser beam irradiated into the reaction chamber 10 along the optical unit 70 can be blocked, and the laser processing can be stopped.

When the amplitude of the vibration measured by the fourth vibration detecting sensor 88 is greater than or equal to the preset value, the controller 90 determines an abnormal state and transmits a control signal to the platform 12 to compensate for the vibration occurring in the platform 12.

In the present embodiment, the platform 12 is an air platform 12 that is filled with gas that supports the platform 12. Such an air platform 12 can be easily implemented by those skilled in the art, and thus its detailed illustration or description is omitted.

In an embodiment of the invention, the optical unit 70 includes a body 74, a barrier unit 51 disposed adjacent to the laser generating unit 50, a support member 72 for supporting the body 74, and a passage 76 extending from the body 74 to the reaction chamber A quartz glass window of 10; and a supply unit 78 configured by placing an optical lens at one end of the channel 76.

The third vibration detecting sensor 86 of the optical unit 70 may be provided to the body 74, may be provided to a plurality of lenses placed in the channel 76, or may be provided to an optical lens placed in the supply unit 78.

Those skilled in the art can easily improve this configuration, and thus the other embodiments are omitted. Body icon or description.

Reference numeral 22a denotes a discharge hole 22a through which a laser beam is irradiated from the processing unit 22.

A control method of the laser processing apparatus according to an embodiment of the present invention will be described below.

11 is a flow chart of a control method of a laser processing apparatus according to an embodiment of the present invention. 12 is a flow chart of an oxygen discharge process of a laser processing apparatus in accordance with an embodiment of the present invention. Figure 13 is a flow chart of a vibration detecting process of a laser processing apparatus in accordance with an embodiment of the present invention.

1 to 13, a control method of a laser processing apparatus according to an embodiment of the present invention includes the steps of detecting a position of a substrate 100 placed in a reaction chamber 10 (S10); moving the substrate 100 such that a marking unit 20 toward a target position in the substrate 100 (S20); driving the marking unit 20 to form a reference point 102 on the substrate 100 (S30); removing oxygen from a space between the substrate 100 and the stage 12 (S40); After starting the process, it is determined whether or not the laser processing is initially performed (S50); the processing position 106 to be subjected to the laser processing with respect to the reference point 102 is calculated and stored (S60); the laser beam is irradiated from the outside of the reaction chamber 10 to The laser processing is performed in the reaction chamber 10 on the portion of the substrate 100 corresponding to the processing position 106 stored in the controller 90 (S70); and it is determined whether the number of the substrate 100 after the laser processing reaches a preset value. (S80).

When the substrate 100 is supplied into the reaction chamber 10 and placed on the stage 12, the first sensor 26a detects the corner of the substrate 100 and passes the controller based on the position signal transmitted from the first sensor 26 The position of 90 pairs of substrates 100 is compared to a preset position.

When the position of the substrate 100 deviates from the preset position, the driving unit 14 is driven with a driving signal transmitted from the controller 90 to rearrange the substrate 100 at a preset position.

The term "preset position" as used herein means that the target position in the substrate 100 is set to a position toward the marking unit 20.

When the laser beam is irradiated from the processing unit 22 after the substrate 100 is set at the preset position to form the reference point 102 on the substrate 100, the reference point 102 may be formed in each of the linings repeatedly supplied to the reaction chamber 10. At the same position of the bottom 100.

After forming the reference point 102, the second sensor 26b detects the position of the reference point 102 and transmits a position signal to the controller 90, while the third sensor 26c detects the laser beam irradiation position and transmits a position signal to the controller 90.

Based on the position signals transmitted from the second sensor 26b and the third sensor 26c, the controller 90 A processing location 106 relative to the reference location 102 where laser processing is to be performed is calculated.

By the operation of the sensing unit 26, even in the case where the laser processing is repeatedly performed while sequentially supplying the plurality of substrates 100 into the reaction chamber 10, the lightning can be performed at the same processing position 106 on the plurality of substrates 100. Shot processing.

In the operation S50 of determining whether or not to perform the laser processing after the start of the process, when it is determined that the laser process is not initialized after the start of the process, the laser beam is irradiated from the outside of the reaction chamber 10 into the reaction chamber 10 to be aligned. The portion of the bottom 100 corresponding to the processing position 106 stored in the controller 90 performs an operation S70 of the laser processing.

In a large-scale production process in which a plurality of substrates 100 are subjected to laser processing, laser processing is continuously performed on the same portion of each substrate 100 in accordance with the processing position 106 stored in the controller 90 at the time of initializing the execution of the laser processing. .

Thus, since the operation S60 of calculating the processing position with respect to the reference point 102 is omitted for performing the laser processing again, the time of the laser processing can be reduced.

In the foregoing laser processing, since the laser beam is selectively supplied to the reaction chamber 10 through the first reflection plate 54a rotated by the first motor 54c, the laser processing can be performed to enable the substrate 100 to be The plurality of processing locations 106 are continuously arranged at even intervals.

Thus, in the processing performed after the laser processing, the processing position 106 is determined based on the reference point 102, and the subsequent processing can be performed only on the processing position 106 after the laser processing.

As described above, since laser processing or subsequent processing is not performed on the substrate 100 which is not used as a product, but these processing is performed only at the processing position 106, product manufacturing time and cost can be reduced.

When the laser processing is repeated and the number of substrates 100 after the laser processing reaches a preset value, the laser processing is ended.

In the operation (S80) of determining whether the number of the substrates 100 after the laser processing reaches the preset value (S80), when it is determined that the number of the substrates 100 after the laser processing has not reached the preset value, the execution in the reaction chamber 10 is performed. The operation of the laser-processed substrate 100 to discharge and supply the new substrate 100 is performed (S90), and then the operation of detecting the position of the substrate 100 is performed (S10).

The operation of removing oxygen remaining between the substrate 100 and the stage 12 (S40) includes: when the substrate 100 is placed on the stage 12 in the reaction chamber 10, discharging oxygen from the central portion 12a of the platform 12 (S41); When the oxygen is completely discharged from the center portion 12a, from the first side portion adjacent to the center portion 12a 12b discharges oxygen (S42); when oxygen is completely discharged from the first side portion 12b, oxygen is discharged from the second side portion 12c adjacent to the outside of the first side portion 12b (S44); when oxygen is completely discharged from the second side portion 12c At the time, oxygen is discharged from the third side portion 12d adjacent to the outer side of the second side portion 12c (S46); and when oxygen is completely discharged from the third side portion 12d, oxygen is discharged from the intersection portion 12e crossing the second side portion 12c (S48).

After moving the substrate 100 such that the target position in the substrate 100 faces the marking unit 20, oxygen is initially discharged from the central portion 12a of the substrate 100, and then from the first side portion 12b, the second side portion 12c, and the third side portion. 12d is discharged in sequence.

Then, since oxygen is again discharged from the intersection portion 12e crossing the second side portion 12c, it is possible to effectively prevent oxygen from remaining between the substrate 100 and the stage 12.

In particular, when the large-sized substrate 100 is placed on the stage 12, oxygen is likely to remain between the central portion 12a and the side end of the substrate 100.

In the present embodiment, since oxygen is sequentially discharged to the outside from the center portion 12a, and then discharged again from the intersection portion 12e crossing the second side portion 12c, it is possible to more effectively prevent oxygen from remaining in the large-sized substrate. 100 is between the platform 12.

In the operation (S70) of performing the laser processing in the control method of the laser processing apparatus, an operation of detecting vibrations occurring in the reaction chamber 10, the laser generating unit 50, the optical unit 70, and the stage 12 is performed.

In the control method of the laser processing apparatus, the process of detecting the vibration in the laser processing apparatus includes: determining whether the vibration amplitude of the reaction chamber 10 including the stage 12 on which the substrate 100 is placed is smaller than a preset value (S110); When the vibration amplitude of the chamber 10 is less than a preset value, it is determined whether the vibration amplitude of the laser generating unit 50 (for generating a laser beam to be irradiated into the reaction chamber 10) is less than a preset value (S120); when a laser occurs When the vibration amplitude of the unit 50 is less than a preset value, it is determined whether the vibration amplitude of the optical unit 70 (for introducing the laser beam irradiated from the laser generating unit 50 into the reaction chamber 10) is smaller than a preset value (S130); When the vibration amplitude of the optical unit 70 is less than the preset value, it is determined whether the vibration amplitude of the stage 12 is smaller than a preset value (S140).

When the operation S70 of the laser processing is performed, the vibration of the reaction chamber 10 is measured by the first vibration measuring sensor 82, the vibration of the laser generating unit 50 is measured by the second vibration detecting sensor 84, and the sense of the third vibration is detected by the third vibration detecting unit The detector 86 measures the vibration of the optical unit 70, and the vibration of the stage 12 is measured by the fourth vibration detecting sensor 88.

In operation S110 of measuring the vibration of the reaction chamber 10, when it is determined that the vibration amplitude of the reaction chamber 10 is greater than or equal to a preset value, the operation S150 of blocking the laser beam by the operation of the blocking unit 51 is performed.

In operation S120 of measuring the vibration of the laser generating unit 50, when it is determined that the vibration amplitude of the laser generating unit 50 is greater than or equal to a preset value, the operation S150 of blocking the laser beam by the operation of the blocking unit 51 is performed.

In operation S130 of measuring the vibration of the optical unit 70, when it is determined that the vibration amplitude of the optical unit 70 is greater than or equal to the preset value, the operation S150 of blocking the laser beam by the operation of the blocking unit 51 is performed.

As described above, when the measured vibration amplitude of any of the reaction chamber 10, the laser generating unit 50, and the optical unit 70 is greater than or equal to a preset value, the controller 90 transmits an operation signal to the first motor 54c.

Thus, since the first motor 54c drives the first rotating shaft 54b and the first reflecting plate 54a to rotate, the laser beam introduced into the casing 52 through the inlet 52a can be blocked without being supplied into the reaction chamber 10 through the outlet 52b.

In operation S140 of measuring the vibration amplitude of the platform 12, when it is determined that the vibration amplitude of the platform 12 is greater than or equal to the preset value, the operation S160 of the control platform 12 compensating for vibration is performed.

In the embodiment of the present invention, since the platform 12 is an air platform 12 supported by air pressure, when the vibration amplitude of the platform 12 is greater than or equal to a preset value, the air pressure is lowered, so that the vibration transmitted to the platform 12 can pass the air pressure. The support unit is compensated.

Accordingly, the present invention can provide a laser processing apparatus capable of selectively performing laser processing only on a portion of a substrate that needs to be subjected to laser processing while simplifying use for laser processing, and a control method thereof Alignment operation of the substrate.

While the invention has been described with respect to the embodiments of the present invention, it is understood that Further, although an example of a laser processing apparatus, that is, a method of controlling the laser processing apparatus, has been given, they are merely illustrative, and the present invention is applicable to other products. Therefore, the scope of the invention should be limited by the scope of the appended claims and their equivalents.

10‧‧‧Reaction room

50‧‧‧Laser generating unit

51‧‧‧Blocking unit

70‧‧‧ Optical unit

72‧‧‧Support

74‧‧‧ Subject

76‧‧‧ channel

78‧‧‧Supply unit

82‧‧‧First vibration detection sensor

84‧‧‧Second vibration detection sensor

Claims (4)

A laser processing apparatus comprising: a platform placed in a reaction chamber and having a substrate placed on the platform; a vacuum unit provided to the platform to transfer oxygen from between the substrate and the platform a space discharged to the outside of the reaction chamber; and a controller that, when the substrate is placed on the platform, transmits an operation signal to the vacuum unit such that the center portion of the platform is sequentially An oxygen discharge operation is performed at a periphery thereof, wherein the platform includes: a center portion configured to divide the platform into two symmetrical portions through a center of the platform; a first side portion adjacent to the center portion; a side portion adjacent to an outer side of the first side portion; a third side portion adjacent to an outer side of the second side portion; and a plurality of intersection portions disposed to intersect the second side portion; After the first side portion, the second side portion, and the third side portion emit oxygen, the controller includes discharging oxygen from the plurality of intersections intersecting the second side portion to Removing oxygen between the substrate and the platform Operation. A laser processing apparatus according to claim 1, wherein the vacuum unit includes: a plurality of vacuum holes provided to the stage; and a vacuum pump connected to the vacuum holes to discharge oxygen to the Outside the reaction chamber. The laser processing apparatus of claim 2, wherein the vacuum hole comprises: a first vacuum hole formed in the central portion; and a second vacuum hole formed in the first side portion; a three vacuum hole formed in the second side portion; a fourth vacuum hole formed in the third side portion; and a fifth vacuum hole formed in the intersection portion. A method of controlling a laser processing apparatus, comprising: discharging oxygen from a central portion of the platform placed in a reaction chamber when a substrate is placed on a platform; when oxygen is completely discharged from the center portion of the platform, Oxygen is discharged from a first side adjacent the central portion of the platform; Oxygen is discharged from a second side adjacent to an outer side of the first side when oxygen is completely discharged from the first side; from adjacent to the second when oxygen is completely discharged from the second side The third side of the outer side of the side discharges oxygen; and when oxygen is completely exhausted from the third side, oxygen is discharged from the intersection intersecting the second side to perform from the substrate and the Oxygen is removed between the platforms.