TWI526312B - Apparatus and process for producing laminated sheet - Google Patents
Apparatus and process for producing laminated sheet Download PDFInfo
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- TWI526312B TWI526312B TW101111298A TW101111298A TWI526312B TW I526312 B TWI526312 B TW I526312B TW 101111298 A TW101111298 A TW 101111298A TW 101111298 A TW101111298 A TW 101111298A TW I526312 B TWI526312 B TW I526312B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
- B32B37/223—One or more of the layers being plastic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/60—In a particular environment
- B32B2309/68—Vacuum
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Fluid Mechanics (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Reinforced Plastic Materials (AREA)
Description
本發明係關於積層片之製造裝置、積層片之製造方法。 The present invention relates to a manufacturing apparatus of a laminated sheet and a method of manufacturing a laminated sheet.
近年來,欲使電子零件/電子機器等小型化/薄膜化,而要求將其所使用之電路基板等小型化/薄膜化。為了回應此要求,係使用多層構造之電路基板,並減薄其之各層。 In recent years, in order to reduce the size and thickness of electronic components and electronic devices, it is required to reduce the size and thickness of circuit boards used. In response to this requirement, a multi-layered circuit substrate is used and the layers thereof are thinned.
多層構造之電路基板,係使用例如在纖維基材之兩面,配置樹脂組成物片材(樹脂層)使其層合接黏的片材(例如參照專利文獻1)。 In the circuit board of the multilayer structure, for example, a sheet in which a resin composition sheet (resin layer) is laminated and adhered on both surfaces of the fiber base material is used (for example, see Patent Document 1).
該片材係藉由於纖維基材之兩面,重疊B階段樹脂組成物片材,對該積層體進行加壓而製造。 This sheet is produced by superposing a B-stage resin composition sheet on both sides of a fibrous base material and pressurizing the laminated body.
(專利文獻1)日本專利特開2003-340952號公報 (Patent Document 1) Japanese Patent Laid-Open Publication No. 2003-340952
然而,此種製造方法中,有對樹脂層之纖維基材之壓黏不足的可能性,其結果有樹脂層由纖維基材發生剝離之虞。 However, in such a production method, there is a possibility that the pressure of the fiber base material of the resin layer is insufficient, and as a result, the resin layer is peeled off from the fiber base material.
尚且,此種課題不僅止於將纖維基材與樹脂層積層的情況,即使在將樹脂層彼此積層的情況、將含有纖維基材之預浸體彼此積層的情況下亦會發生。 Further, such a problem is not limited to the case where the fiber base material and the resin layer are laminated, and even when the resin layers are laminated to each other, and the prepreg containing the fiber base material is laminated to each other.
根據本發明,提供一種積層片之製造裝置,係將於一面側具有樹脂層之薄板狀片材之上述樹脂層,接合於長尺型薄板狀之基材之單面或兩面以製造積層片者;其具備有:依上述 基材與上述樹脂層相對向之對向狀態,將上述片材與上述基材沿著上述基材之長度方向進行搬送的搬送手段;藉由上述搬送手段所搬送之上述片材與上述基材依維持上述相對向狀態之下所通過的腔室;對上述腔室內進行減壓的減壓手段;於上述腔室內,對上述基材及上述片材進行加熱的加熱手段;與於上述腔室內,對相對向狀態之上述基材與上述片材,一括性地於其厚度方向上進行加壓的加壓手段;於上述腔室內,使由上述搬送手段所進行之上述基材與上述片材的搬送暫時停止,於其停止狀態下,一邊藉上述減壓手段對上述腔室內進行減壓,一邊藉上述加壓手段及上述加熱手段對上述相對向狀態之上述基材與上述片材進行加壓及加熱,而將上述樹脂層與上述基材壓黏。 According to the present invention, there is provided a manufacturing apparatus for a laminated sheet which is obtained by bonding the resin layer of a thin plate-shaped sheet having a resin layer on one side to one side or both sides of a long-length thin plate-shaped substrate to produce a laminated sheet. ; it has: according to the above a conveying means for conveying the substrate and the substrate along the longitudinal direction of the substrate, and the sheet and the substrate conveyed by the conveying means a chamber for passing the above-mentioned relative state; a pressure reducing means for decompressing the chamber; a heating means for heating the substrate and the sheet in the chamber; and the chamber a pressing means for pressurizing the substrate and the sheet in a relative state in a thickness direction thereof; and the substrate and the sheet which are carried by the conveying means in the chamber The conveyance is temporarily stopped, and in the stopped state, the substrate and the sheet in the opposing state are added by the pressing means and the heating means while decompressing the chamber by the decompression means. The resin layer is pressure-bonded to the substrate by pressing and heating.
根據本發明,由加壓手段之作動所造成之基材與樹脂層間的壓黏,與藉減壓手段之作動而於腔室內所產生之減壓力所造成之基材與樹脂層間的壓黏合作,使基材與樹脂層間之接合強化。 According to the present invention, the pressure-bonding between the substrate and the resin layer caused by the action of the pressurizing means, and the pressure-bonding between the substrate and the resin layer caused by the pressure reduction generated in the chamber by the action of the decompression means The bonding between the substrate and the resin layer is strengthened.
再者,根據本發明,亦可提供使用上述積層片製造裝置而製造積層片的方法。 Furthermore, according to the present invention, a method of manufacturing a laminated sheet using the above laminated sheet manufacturing apparatus can also be provided.
再者,亦可提供一種積層片之製造方法,係將於一面側具有樹脂層之片材之上述樹脂層,接合於長尺型薄板狀之基材之單面或兩面以製造積層片者;其包括:於腔室內,依使上述基材與上述樹脂層相對向之相對向狀態,搬送上述片材與 上述基材的搬送步驟;依上述片材及與上述片材相對向之上述基材之一部分區域位於上述腔室內,且上述基材之上述一部分的搬送方向上游側及下游側之上述基材之其他一部分位於上述腔室外部的狀態,使上述片材及上述基材之搬送停止的步驟;與對上述腔室內進行減壓,對上述腔室內之上述基材之一部分及片材進行加熱,並對上述基材之一部分及上述片材進行加壓的步驟。 Furthermore, a method for producing a laminated sheet may be provided, wherein the resin layer of a sheet having a resin layer on one side is bonded to one side or both sides of a long-length sheet-shaped substrate to produce a laminated sheet; The method includes: in the chamber, the substrate and the resin layer are opposed to each other, and the sheet is conveyed a step of transporting the substrate; the substrate and a portion of the substrate facing the sheet are located in the chamber, and the substrate on the upstream side and the downstream side in the transport direction of the portion of the substrate a step of stopping the conveyance of the sheet and the substrate in a state in which the other portion is located outside the chamber; and depressurizing the chamber to heat a portion of the substrate and the sheet in the chamber, and A step of pressurizing a portion of the substrate and the sheet.
根據本發明,提供使基材與樹脂層被牢固固定的積層片製造裝置及積層片之製造方法。 According to the invention, there is provided a laminated sheet manufacturing apparatus and a method for producing a laminated sheet in which a base material and a resin layer are firmly fixed.
以下,根據圖式說明本發明之實施形態。又,所有圖式中,對相同之構成要件係註記同一符號,其詳細說明則不重複而適當省略。 Hereinafter, embodiments of the present invention will be described based on the drawings. In the drawings, the same components are denoted by the same reference numerals, and the detailed description is omitted as appropriate.
以下根據添附圖式所示之較佳實施形態,詳細說明本發明之積層片製造裝置、積層片之製造方法及積層片。 Hereinafter, the laminated sheet manufacturing apparatus, the laminated sheet manufacturing method, and the laminated sheet of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.
圖1~圖6分別為依序顯示本發明之積層片製造裝置(第1實施形態)之作動狀態的概略剖面側面圖;圖7為顯示本發明之積層片製造裝置(第2實施形態)的概略剖面側面圖;圖8為顯示本發明之積層片的剖面圖。又,以下說明中,為了說明方便,而以圖1~圖6及圖8中之上側作為「上」或「上方」、以下側作為「下」或「下方」。又,圖8係將厚度方向(圖中之上下方向)誇張擴大表示。圖9係顯示於基材上間歇 性配置複數片材部之狀態的平面圖。 1 to 6 are schematic cross-sectional side views showing an operation state of the laminated sheet manufacturing apparatus (first embodiment) of the present invention, and FIG. 7 is a view showing a laminated sheet manufacturing apparatus (second embodiment) of the present invention. A schematic cross-sectional side view; Fig. 8 is a cross-sectional view showing a laminated sheet of the present invention. In the following description, for convenience of explanation, the upper side in FIGS. 1 to 6 and 8 is referred to as "upper" or "upper", and the lower side is referred to as "lower" or "lower". In addition, FIG. 8 is an exaggerated expansion of the thickness direction (upward and downward directions in the drawing). Figure 9 shows the intermittent on the substrate A plan view of the state in which a plurality of sheets are disposed.
再者,圖10為圖4之X-X方向之剖面圖。圖11為沿著纖維基材2之長度方向的剖面圖,,概略性地顯示相對於纖維基材2使片材部離間配置之狀態的剖面圖。 10 is a cross-sectional view taken along line X-X of FIG. 4. FIG. 11 is a cross-sectional view along the longitudinal direction of the fiber base material 2, and schematically shows a cross-sectional view of a state in which the sheet portion is disposed apart from the fiber base material 2.
圖1~圖7所示之積層片製造裝置30,係製造圖8所示構成之積層片40的裝置。 The laminated sheet manufacturing apparatus 30 shown in Figs. 1 to 7 is an apparatus for manufacturing the laminated sheet 40 having the configuration shown in Fig. 8.
首先,針對積層片40,參照圖8進行說明。又,若將積層片40於其長度方向之途中切斷為既定尺寸,則得到預浸體1。 First, the laminated sheet 40 will be described with reference to Fig. 8 . Moreover, when the laminated sheet 40 is cut into a predetermined size in the longitudinal direction, the prepreg 1 is obtained.
圖8所示之積層片40,係其整體形狀呈帶狀(長尺狀),具有:薄板狀(平板狀)之纖維基材(基材)2;位於纖維基材2之一面(上面)側,由固形或半固形之第1樹脂組成物所構成的第1樹脂層(樹脂層)3;位於纖維基材2之另一面(下面)側,由固形或半固形之第2樹脂組成物所構成的第2樹脂層(樹脂層)4;分別形成於第1樹脂層3及第2樹脂層4上的金屬層12。該積層片40係被切斷為既定尺寸而使用。 The laminated sheet 40 shown in Fig. 8 has a strip shape (long scale) as a whole, and has a thin plate-like (flat-plate) fibrous base material (substrate) 2; one surface (upper surface) of the fibrous base material 2 a first resin layer (resin layer) 3 composed of a solid or semi-solid first resin composition, and a second resin composition which is solid or semi-solid on the other surface (lower surface) side of the fiber substrate 2 The second resin layer (resin layer) 4 to be formed; the metal layer 12 formed on the first resin layer 3 and the second resin layer 4, respectively. The laminated sheet 40 is cut into a predetermined size and used.
該積層片40係如圖9所示般,構成為於長尺狀之纖維基材2的一面上,使由第1樹脂層(樹脂層)3及金屬層12所構成之片材部5a(第1片材部)複數離間配置。 As shown in FIG. 9, the laminated sheet 40 is configured such that the sheet portion 5a composed of the first resin layer (resin layer) 3 and the metal layer 12 is formed on one surface of the long-length fibrous base material 2 ( The first sheet portion is arranged in a plurality of places.
另外,構成為在長尺狀之纖維基材2之另一面上,使第2樹脂層(樹脂層)4及金屬層12所構成之片材部5b(第2片材 部)複數離間配置。 In addition, the sheet portion 5b composed of the second resin layer (resin layer) 4 and the metal layer 12 is formed on the other surface of the long-length fiber base material 2 (the second sheet) Department) Multiple separation configuration.
第1片材部5a及第2片材部5b係挾持纖維基材2而配置於相對向位置。 The first sheet portion 5a and the second sheet portion 5b are placed at the opposing positions by sandwiching the fiber base material 2.
藉由切斷第1片材部5a間之纖維基材2及第2片材部5b間之纖維基材2,則得到預浸體1。又,各樹脂層3、4為B-階段狀態。 The prepreg 1 is obtained by cutting the fiber base material 2 between the fiber base material 2 and the second sheet portion 5b between the first sheet portions 5a. Further, each of the resin layers 3 and 4 is in a B-stage state.
該預浸體1係用於多層印刷佈線板(電路基板),成為核材者。將預浸體1之金屬層12選擇性地去除而形成電路層,接著於該預浸體1之表背面,交替地積層其他之預浸體與電路層,藉此得到多層印刷佈線(電路基板)。 This prepreg 1 is used for a multilayer printed wiring board (circuit board) and becomes a core material. The metal layer 12 of the prepreg 1 is selectively removed to form a circuit layer, and then another prepreg and a circuit layer are alternately laminated on the front and back surfaces of the prepreg 1, thereby obtaining a multilayer printed wiring (circuit substrate) ).
尚且,各樹脂層3、4為B-階段狀態,在使用作為核材時,係將預浸體1加熱硬化,使樹脂層3、4完全硬化(C-階段)。 Further, each of the resin layers 3 and 4 is in a B-stage state, and when used as a core material, the prepreg 1 is heat-cured to completely cure the resin layers 3 and 4 (C-stage).
纖維基材2具有提升積層片40之機械強度的機能。 The fibrous base material 2 has a function of enhancing the mechanical strength of the laminated sheet 40.
作為纖維基材2,可舉例如玻璃織布、玻璃不織布等之玻璃纖維基材,以包括聚醯胺樹脂纖維、芳香族聚醯胺樹脂纖維或全芳香族聚醯胺樹脂纖維等之芳醯胺纖維等之聚醯胺系樹脂纖維,聚酯樹脂纖維、芳香族聚酯樹脂纖維、全芳香族聚酯樹脂纖維等之聚酯系樹脂纖維,聚對伸苯基苯并雙唑、聚醯亞胺樹脂纖維、氟樹脂纖維等作為主成分之織布或不織布所構成的合成纖維基材,以牛皮紙、棉絨紙、棉絨與牛皮紙漿之混抄紙等作為主成分的紙纖維基材等之有機纖維基材等的纖維基材等。 The fiber base material 2 may, for example, be a glass fiber base material such as a glass woven fabric or a glass nonwoven fabric, and may include a polyamide resin fiber, an aromatic polyamide resin fiber, or a wholly aromatic polyamide resin fiber. Polyurethane resin fiber such as amine fiber, polyester resin fiber such as polyester resin fiber, aromatic polyester resin fiber or wholly aromatic polyester resin fiber, polyparaphenylene benzobis a synthetic fiber base material composed of a woven fabric or a non-woven fabric such as a azole, a polyimide resin fiber or a fluororesin fiber, and a paper mainly composed of kraft paper, cotton wool paper, mixed paper of cotton velvet and kraft pulp, and the like A fiber base material such as an organic fiber base material such as a fiber base material.
尚且,纖維基材可使用上述纖維之任一種,亦可使用2種以上。 In addition, any of the above fibers may be used as the fiber base material, and two or more types may be used.
此等之中,纖維基材2較佳為玻璃纖維基材。藉由使用此種玻璃纖維基材,可更加提升切斷積層片40所得預浸體1的機械強度。又,亦有可使預浸體1之熱膨脹係數減小的效果。 Among these, the fibrous base material 2 is preferably a glass fiber base material. By using such a glass fiber base material, the mechanical strength of the prepreg 1 obtained by cutting the laminated sheet 40 can be further enhanced. Further, there is an effect that the coefficient of thermal expansion of the prepreg 1 can be reduced.
作為構成此種玻璃纖維基材之玻璃,可舉例如E玻璃、C玻璃、A玻璃、S玻璃、D玻璃、NE玻璃、T玻璃、H玻璃、Q玻璃、石英玻璃等。此等之中,玻璃較佳為S玻璃、T玻璃、石英玻璃或Q玻璃。藉此,可相較地減小玻璃纖維基材之熱膨脹係數,因此可儘可能地減小積層片40的熱膨脹係數。 Examples of the glass constituting the glass fiber substrate include E glass, C glass, A glass, S glass, D glass, NE glass, T glass, H glass, Q glass, and quartz glass. Among these, the glass is preferably S glass, T glass, quartz glass or Q glass. Thereby, the coefficient of thermal expansion of the glass fiber substrate can be relatively reduced, so that the coefficient of thermal expansion of the laminated sheet 40 can be reduced as much as possible.
纖維基材2之平均厚度T並無特別限定,較佳為150μm以下、更佳100μm以下、再更佳10~50μm左右。藉由使用此種厚度的纖維基材2,則可確保預浸體1(積層片40)之機械強度,達到其薄型化。進而亦可提升預浸體1之加工性、尺寸安定性。 The average thickness T of the fiber base material 2 is not particularly limited, but is preferably 150 μm or less, more preferably 100 μm or less, still more preferably about 10 to 50 μm. By using the fiber base material 2 having such a thickness, the mechanical strength of the prepreg 1 (the laminated sheet 40) can be ensured and the thickness thereof can be reduced. Further, the workability and dimensional stability of the prepreg 1 can be improved.
於該纖維基材2之一面側,設置第1樹脂層3,又,於另一面側設置第2樹脂層4。又,第1樹脂層3係由第1樹脂組成物所構成,另一方面,第2樹脂層4係由第2樹脂組成物所構成。第1樹脂組成物與第2樹脂組成物可為相同組成物,亦可為相異。本實施形態中設為相同組成物。 The first resin layer 3 is provided on one surface side of the fiber base material 2, and the second resin layer 4 is provided on the other surface side. Further, the first resin layer 3 is composed of a first resin composition, and the second resin layer 4 is composed of a second resin composition. The first resin composition and the second resin composition may be the same composition or may be different. In the present embodiment, the same composition is used.
本實施形態中,係於第1樹脂層3及第2樹脂層4上分別形成金屬層12。該金屬層12係藉由施加例如蝕刻或雷射加工,而成為佈線部(導體圖案)。因此,第1樹脂組成物、第2樹脂組成物係設定為與金屬間之密黏性優越的組成。 In the present embodiment, the metal layer 12 is formed on each of the first resin layer 3 and the second resin layer 4. The metal layer 12 is formed as a wiring portion (conductor pattern) by applying, for example, etching or laser processing. Therefore, the first resin composition and the second resin composition are set to have a superior adhesion to the metal.
如圖8所示般,本實施形態中係於纖維基材2之厚度方向之一部分含浸第1樹脂組成物(第1樹脂層3)(以下將此部分稱為「第1含浸部31」),於纖維基材2之未含浸第1樹脂組成物的殘餘部分,含浸第2樹脂組成物(第2樹脂層4)(以下將此部分稱為「第2含浸部41」)。藉此,使第1樹脂層3之一部分的第1含浸部31與第2樹脂層4之一部分的第2含浸部41位於纖維基材2內。而且,於纖維基材2內,使第1含浸部31(第1樹脂層3之下面)與第2含浸部41(第2樹脂層4之上面)接觸。換言之,第1樹脂組成物係由纖維基材2之上面側含浸至纖維基材2,第2樹脂組成物係由纖維基材2之下面側含浸至纖維基材2,藉此等樹脂組成物填充纖維基材2內的空隙。 As shown in Fig. 8, in the present embodiment, the first resin composition (first resin layer 3) is impregnated in one of the thickness directions of the fiber base material 2 (hereinafter, this portion is referred to as "first impregnation portion 31"). The second resin composition (second resin layer 4) is impregnated into the remaining portion of the fibrous base material 2 which is not impregnated with the first resin composition (hereinafter referred to as "second impregnation portion 41"). Thereby, the first impregnation portion 31 of one of the first resin layers 3 and the second impregnation portion 41 of one of the second resin layers 4 are placed in the fiber base material 2. In the fiber base material 2, the first impregnation portion 31 (the lower surface of the first resin layer 3) is brought into contact with the second impregnation portion 41 (the upper surface of the second resin layer 4). In other words, the first resin composition is impregnated into the fiber base material 2 from the upper surface side of the fiber base material 2, and the second resin composition is impregnated into the fiber base material 2 from the lower surface side of the fiber base material 2, whereby the resin composition is obtained. The voids in the fibrous substrate 2 are filled.
本實施形態中,第1含浸部31之厚度與第2含浸部41之厚度相等。 In the present embodiment, the thickness of the first impregnation portion 31 is equal to the thickness of the second impregnation portion 41.
再者,第1樹脂層3之第1含浸部31除外的部分(第1非含浸部32)的厚度、與第2樹脂層4之第2含浸部41除外的部分(第2非含浸部42)的厚度相等。第1非含浸部32之厚度、第2非含浸部42之厚度為例如2~20μm。又,第1 含浸部31之厚度與第2含浸部41的厚度亦可為相異,又,第1非含浸部32之厚度與第2非含浸部42之厚度亦可為相異。又,圖8中符號20係概略地顯示含浸部31、含浸部32間之邊界。 In addition, the thickness of the portion (the first non-impregnated portion 32) excluding the first impregnation portion 31 of the first resin layer 3 and the portion excluding the second impregnation portion 41 of the second resin layer 4 (the second non-impregnation portion 42) ) the thickness is equal. The thickness of the first non-impregnated portion 32 and the thickness of the second non-impregnated portion 42 are, for example, 2 to 20 μm. Again, the first The thickness of the impregnation portion 31 and the thickness of the second impregnation portion 41 may be different, and the thickness of the first non-impregnated portion 32 and the thickness of the second non-impregnation portion 42 may be different. Further, reference numeral 20 in Fig. 8 schematically shows the boundary between the impregnation portion 31 and the impregnation portion 32.
如圖1所示,第1樹脂層3係依積層了金屬片12的狀態,作為薄板狀之第1片材部(片材部)5a,供給至積層片製造裝置30。第2樹脂層4亦依積層了金屬片12的狀態,作為薄板狀之第2片材部(片材部)5b,供給至積層片製造裝置30。 As shown in FIG. 1, the first resin layer 3 is supplied to the laminated sheet manufacturing apparatus 30 as a sheet-shaped first sheet portion (sheet portion) 5a in a state in which the metal sheet 12 is laminated. The second resin layer 4 is also supplied to the laminated sheet manufacturing apparatus 30 as a second sheet portion (sheet portion) 5b in a thin plate shape in a state in which the metal sheet 12 is laminated.
金屬層12係如上述般被加工為佈線部的部分,由具有導電性的金屬材料所構成,例如將銅箔、鋁箔等之金屬箔,接合至對應之樹脂層,或將銅、鋁等之金屬箔藉鍍覆形成於對應之樹脂層表面上。又,本實施形態中,由於第1樹脂層3或第2樹脂層4具有上述特性,故可依高密黏性保持金屬層12,並可依高加工精度將金屬層12形成為佈線部。 The metal layer 12 is processed into a portion of the wiring portion as described above, and is made of a conductive metal material. For example, a metal foil such as a copper foil or an aluminum foil is bonded to a corresponding resin layer, or copper or aluminum is used. The metal foil is formed by plating on the surface of the corresponding resin layer. Further, in the present embodiment, since the first resin layer 3 or the second resin layer 4 has the above characteristics, the metal layer 12 can be held with high adhesion, and the metal layer 12 can be formed as a wiring portion with high processing precision.
金屬層12與第1樹脂層3或第2樹脂層4間之剝離強度較佳為0.3kN/m以上、更佳0.6kN/m以上。藉此,將金屬層12加工為佈線部,可更加提升與例如半導體裝置間之電氣性之連接可靠性。 The peeling strength between the metal layer 12 and the first resin layer 3 or the second resin layer 4 is preferably 0.3 kN/m or more, more preferably 0.6 kN/m or more. Thereby, the metal layer 12 is processed into a wiring portion, and the electrical connection reliability with, for example, a semiconductor device can be further improved.
尚且,積層片40中亦可省略金屬層12。 Further, the metal layer 12 may be omitted in the laminated sheet 40.
再者,第1樹脂組成物及第2樹脂組成物較佳係設為下述組成。 Further, the first resin composition and the second resin composition are preferably made into the following compositions.
各樹脂組成物係例如含有硬化性樹脂,視需要含有硬化助 劑(例如硬化劑、硬化促進劑等)及無機填充材中之至少1種而構成。 Each resin composition contains, for example, a curable resin, and if necessary, contains a hardening aid. It is composed of at least one of a solvent (for example, a curing agent, a curing accelerator, and the like) and an inorganic filler.
作為硬化性樹脂,可舉例如脲(尿素)樹脂、三聚氰胺樹脂、馬來醯亞胺化合物、聚胺基甲酸酯樹脂、不飽和聚酯樹脂、具有苯并環之樹脂、雙烯丙基納特醯亞胺化合物、乙烯基苄基樹脂、乙烯基苄基醚樹脂、苯并環丁烯樹脂、氰酸酯樹脂、環氧樹脂等之熱硬化性樹脂、紫外線硬化性樹脂、厭氣硬化性樹脂等。此等之中,硬化性樹脂較佳係玻璃轉移溫度為200℃以上的組合。例如,較佳係使用含有螺環、雜環式、三羥甲基型、聯苯型、萘基、蒽型、酚醛清漆型之2或3官能以上的環氧樹脂、氰酸酯樹脂(包括氰酸酯樹脂之預聚物)、馬來醯亞胺化合物、苯并環丁烯樹脂、具有苯并環之樹脂。 Examples of the curable resin include urea (urea) resin, melamine resin, maleic imine compound, polyurethane resin, unsaturated polyester resin, and benzoic acid. a thermosetting resin such as a ring resin, a bisallyl nalenimine compound, a vinyl benzyl resin, a vinyl benzyl ether resin, a benzocyclobutene resin, a cyanate resin, or an epoxy resin; An ultraviolet curable resin, an anaerobic resin, or the like. Among these, the curable resin is preferably a combination in which the glass transition temperature is 200 ° C or higher. For example, it is preferred to use an epoxy resin or a cyanate resin containing a spiro ring, a heterocyclic formula, a trimethylol type, a biphenyl type, a naphthyl group, a fluorene type, a novolac type, or a cyanate resin (including Prepolymer of cyanate resin), maleic imine compound, benzocyclobutene resin, with benzoic acid Ring resin.
上述硬化性樹脂中,藉由使用熱硬化性樹脂,進而在製作了後述基板後,於硬化後之樹脂層3、4中增加交聯密度,則可達到硬化後之樹脂層3、4(所得基板)的耐熱性之提升。 In the curable resin, by using a thermosetting resin, after the substrate to be described later is produced, and the crosslinking density is increased in the resin layers 3 and 4 after curing, the cured resin layers 3 and 4 can be obtained. The heat resistance of the substrate) is improved.
藉由併用上述熱硬化性樹脂與填充材,可減小預浸體1之熱膨脹係數(以下亦稱為「低熱膨脹化」)。再者,亦可達到預浸體1之電氣特性(低介電係數、低介電損耗正切)等之提升。 By using the thermosetting resin and the filler in combination, the thermal expansion coefficient of the prepreg 1 (hereinafter also referred to as "low thermal expansion") can be reduced. Furthermore, the electrical characteristics (low dielectric constant, low dielectric loss tangent) of the prepreg 1 can be improved.
作為上述環氧樹脂,可舉例如酚酚醛清漆型環氧樹脂、雙酚型環氧樹脂、萘型環氧樹脂、蒽型環氧樹脂、芳基伸烷基 型環氧樹脂等。 Examples of the epoxy resin include a phenol novolak type epoxy resin, a bisphenol type epoxy resin, a naphthalene type epoxy resin, a fluorene type epoxy resin, and an aryl alkylene group. Type epoxy resin, etc.
此等之中,環氧樹脂較佳為萘型、芳基伸烷基型環氧樹脂。藉由使用萘基、芳基伸烷基型環氧樹脂,於硬化後之樹脂層3、4(所得基板)中,可提升吸濕焊錫耐熱性(吸濕後之焊錫耐熱性)及難燃性。作為萘型環氧樹脂,可舉例如DIC(股)製之HP-4700、HP-4770、HP-4032D、HP-5000、HP-6000、日本化藥(股)製之NC-7300L、新日鐵化學(股)製之ESN-375等,作為芳基伸烷基型環氧樹脂,可舉例如日本化藥(股)製之NC-3000、NC-3000L、NC-3000-FH、日本化藥(股)製NC-7300L、新日鐵化學(股)製之ESN-375等。所謂芳基伸烷基型環氧樹脂,係指於重複單體中含有一個以上之芳香族基與亞甲基等之伸烷基之組合的環氧樹脂,其耐熱性、難燃性及機械強度優越。又,在對應於無鹵素之佈線板方面,較佳係使用實質上不含鹵素的環氧樹脂。 Among these, the epoxy resin is preferably a naphthalene type or arylalkylene type epoxy resin. By using a naphthyl group or an arylalkylene type epoxy resin, the heat-resistant solder heat resistance (solder heat resistance after moisture absorption) and flame retardancy can be improved in the cured resin layers 3 and 4 (the obtained substrate). . Examples of the naphthalene type epoxy resin include HP-4700, HP-4770, HP-4032D, HP-5000, HP-6000, and Nippon Chemical Co., Ltd., NC-7300L, manufactured by DIC Co., Ltd. ESN-375, etc., which is an aryl alkylene-based epoxy resin, such as NC-3000, NC-3000L, NC-3000-FH, and Nippon Chemical Co., Ltd., manufactured by Nippon Kayaku Co., Ltd. (Stock) system NC-7300L, Nippon Steel Chemical Co., Ltd. ESN-375. The term "aryl extended alkyl type epoxy resin" refers to an epoxy resin which contains a combination of one or more aromatic groups and an alkylene group such as a methylene group in a repeating monomer, and has heat resistance, flame retardancy and mechanical strength. superior. Further, in terms of a halogen-free wiring board, it is preferred to use an epoxy resin which does not substantially contain a halogen.
上述氰酸酯樹脂例如可藉由使鹵化氰化合物與酚類或萘酚類反應,視需要依加熱等方法進行預聚物化而獲得。又,亦可使用如此調製之市售物。 The cyanate resin can be obtained, for example, by reacting a halogenated cyanide compound with a phenol or a naphthol, and if necessary, prepolymerizing by a method such as heating. Further, a commercially available product thus prepared can also be used.
上述氰酸酯樹脂可舉例如酚醛清漆型氰酸酯樹脂、雙酚A型氰酸酯樹脂、雙酚E型氰酸酯樹脂、四甲基雙酚F型氰酸酯樹脂等之雙酚型氰酸酯樹脂及萘酚芳烷基型氰酸酯樹脂等。 The cyanate resin may, for example, be a bisphenol type such as a novolak type cyanate resin, a bisphenol A type cyanate resin, a bisphenol E type cyanate resin, or a tetramethyl bisphenol F type cyanate resin. Cyanate resin, naphthol aralkyl type cyanate resin, and the like.
另外,上述氰酸酯樹脂較佳係於分子內具有2個以上氰酸 酯基(-O-CN)。可舉例如2,2-雙(4-氰氧基苯基)亞異丙基、1,1-雙(4-氰氧基苯基)乙烷、雙(4-氰氧基-3,5-二甲基苯基)甲烷、1,3-雙(4-氰氧基苯基-1-(1-甲基亞乙基))苯、雙(4-氰氧基苯基)硫醚、雙(4-氰氧基苯基)醚、1,1,1-參(4-氰氧基苯基)乙烷、參(4-氰氧基苯基)亞磷酸、雙(4-氰氧基苯基)碸、2,2-雙(4-氰氧基苯基)丙烷、1,3-、1,4-、1,6-、1,8-、2,6-或2,7-二氰氧基萘、1,3,6-三氰氧基萘、4,4-二氰氧基聯苯,及酚酚醛清漆型、甲酚酚醛清漆型、二環戊二烯型等之多元酚類與鹵化氰間之反應所得的氰酸酯樹脂,萘酚芳烷基型之多元萘酚類與鹵化氰間之反應所得的氰酸酯樹脂等。此等之中,酚酚醛清漆型氰酸酯樹脂係難燃性及低熱膨脹性優越,2,2-雙(4-氰氧基苯基)亞異丙基及二環戊二烯型氰酸酯樹脂係交聯密度之控制及耐濕可靠性優越。尤其是酚酚醛清漆型氰酸酯樹脂係由低熱膨脹性的觀點而言為較佳。又,亦可進一步併用1種或2種以上之其他氰酸酯樹脂,並無特別限定。 Further, the cyanate resin preferably has two or more cyanic acids in the molecule. Ester group (-O-CN). For example, 2,2-bis(4-cyanooxyphenyl)isopropylidene, 1,1-bis(4-cyanooxyphenyl)ethane, bis(4-cyanooxy-3,5) -Dimethylphenyl)methane, 1,3-bis(4-cyanooxyphenyl-1-(1-methylethylidene))benzene, bis(4-cyanooxyphenyl) sulfide, Bis(4-cyanooxyphenyl)ether, 1,1,1-gin(4-cyanooxyphenyl)ethane, ginseng (4-cyanooxyphenyl)phosphoric acid, bis(4-cyanate) Phenyl, hydrazine, 2,2-bis(4-cyanooxyphenyl)propane, 1,3-, 1,4-, 1,6-, 1,8-, 2,6- or 2,7 - dicyanoxynaphthalene, 1,3,6-tricyanooxynaphthalene, 4,4-dicyanooxybiphenyl, and phenol novolac type, cresol novolac type, dicyclopentadiene type, etc. A cyanate resin obtained by a reaction between a polyhydric phenol and a cyanogen halide, a cyanate resin obtained by a reaction between a naphthol aralkyl type polyheptanol and a cyanogen halide. Among these, the phenol novolac type cyanate resin is excellent in flame retardancy and low thermal expansion property, and 2,2-bis(4-cyanooxyphenyl)isopropylidene and dicyclopentadiene type cyanic acid. The ester resin is excellent in control of crosslinking density and moisture resistance reliability. In particular, the phenol novolac type cyanate resin is preferred from the viewpoint of low thermal expansion. Further, one or two or more kinds of other cyanate resins may be further used in combination, and are not particularly limited.
上述氰酸酯樹脂可單獨使用,亦可併用重量平均分子量不同之氰酸酯樹脂,或可併用上述氰酸酯樹脂與其預聚物。 The cyanate resin may be used singly or as a cyanate resin having a different weight average molecular weight, or the above cyanate resin and its prepolymer may be used in combination.
藉由使用此等氰酸酯樹脂,可有效表現耐熱性及難燃性。 By using such cyanate resins, heat resistance and flame retardancy can be effectively exhibited.
另外,上述硬化性樹脂亦可合併使用2種以上。例如,於使用上述環氧樹脂作為硬化性樹脂時,在更加提升難燃性方面,可併用上述氰酸酯樹脂,又,在更加提升耐熱性方面,可併用上述馬來醯亞胺化合物。再者,於使用上述氰酸酯樹 脂作為硬化性樹脂時,在更加提升耐熱性或難燃性等方面,可併用上述環氧樹脂。 Further, the curable resin may be used in combination of two or more kinds. For example, when the epoxy resin is used as the curable resin, the cyanate resin can be used in combination for further improving the flame retardancy, and the maleidene compound can be used in combination for further improving the heat resistance. Furthermore, the use of the above cyanate tree When the grease is used as a curable resin, the above epoxy resin can be used in combination for further improving heat resistance, flame retardancy, and the like.
硬化性樹脂之含量並無特別限定,較佳係樹脂組成物整體之5~70質量%、更佳10~50質量%。若硬化性樹脂之含量未滿上述下限值,則視硬化性樹脂之種類等,有第1樹脂組成物之清漆黏度過低、難以形成預浸體1的情形。另一方面,若硬化性樹脂之含量超過上述上限值,則因其他成分之量過少,視硬化性樹脂之種類等而有預浸體1之機械強度降低的情形。 The content of the curable resin is not particularly limited, but is preferably 5 to 70% by mass, more preferably 10 to 50% by mass based on the entire resin composition. When the content of the curable resin is less than the above-described lower limit, the varnish viscosity of the first resin composition is too low, and it is difficult to form the prepreg 1 depending on the type of the curable resin. On the other hand, when the content of the curable resin is more than the above-described upper limit, the amount of the other components is too small, and the mechanical strength of the prepreg 1 may be lowered depending on the type of the curable resin or the like.
另外,樹脂組成物較佳係含有無機填充材。藉此,即使使預浸體薄型化(例如厚度35μm以下),仍可得到機械強度優越的基板。再者,亦可提升基板之低熱膨脹化。 Further, the resin composition preferably contains an inorganic filler. Thereby, even if the prepreg is made thin (for example, the thickness is 35 μm or less), a substrate excellent in mechanical strength can be obtained. Furthermore, the low thermal expansion of the substrate can also be improved.
作為無機填充材,可舉例如滑石、氧化鋁、玻璃、熔融二氧化矽等之二氧化矽、雲母、氫氧化鋁、氫氧化鎂等。又,配合無機填充材之使用目的,適當選擇破碎狀、球狀者。此等之中,由低熱膨脹性優越的觀點而言,無機填充材較佳為二氧化矽,更佳為熔融二氧化矽(尤其是球狀熔融二氧化矽)。 Examples of the inorganic filler include cerium oxide such as talc, alumina, glass, and molten cerium oxide, mica, aluminum hydroxide, and magnesium hydroxide. Further, in accordance with the purpose of use of the inorganic filler, a crushed or spherical shape is appropriately selected. Among these, the inorganic filler is preferably cerium oxide, and more preferably molten cerium oxide (especially spherical molten cerium oxide) from the viewpoint of superior low thermal expansion property.
另外,樹脂組成物係除了上述說明之成分以外,在不阻礙本發明效果的範圍內,視需要可調配其他成分。作為其他成分,可舉例如ORBEN、BENTONE等之增黏劑,聚矽氧系、氟系、高分子系之消泡劑或均平劑,偶合劑等之密黏性賦予 劑,難燃劑,酞菁/藍、酞菁/綠、碘/綠、二偶氮黃(Disazo Yellow)、碳黑、蒽醌類等之著色劑等。 Further, in addition to the components described above, the resin composition may be blended with other components as needed within the range not inhibiting the effects of the present invention. The other component may, for example, be a tackifier such as ORBEN or BENTONE, a polyoxymethylene-based, a fluorine-based or a polymer-based antifoaming agent or a leveling agent, or a coupling agent. Agent, flame retardant, phthalocyanine/blue, phthalocyanine/green, iodine/green, disazo yellow, carbon black, enamel, etc.
接著,針對積層片40之製造中所使用之積層片製造裝置30、亦即本發明之積層片製造方法之實施形態中所使用的積層片製造裝置30,參照圖1~圖6、圖10、圖11進行說明。 Next, the laminated sheet manufacturing apparatus 30 used in the production of the laminated sheet 40, that is, the laminated sheet manufacturing apparatus 30 used in the embodiment of the laminated sheet manufacturing method of the present invention, will be described with reference to FIGS. 1 to 6 and 10 . Figure 11 is explained.
積層片製造裝置30係將配置於纖維基材2之一面(上面側)的第1片材5A、與纖維基材2壓黏,並將配置於纖維基材2之另一面(下面側)的第2片材5B、與纖維基材2壓黏的裝置。 In the laminated sheet manufacturing apparatus 30, the first sheet material 5A disposed on one surface (upper surface side) of the fiber base material 2 is adhered to the fiber base material 2, and is placed on the other surface (lower side) of the fiber base material 2. The second sheet 5B is a device that is pressed against the fiber base material 2.
本實施形態中,第1片材5A係由離間配置之複數之第1片材部5a所構成,複數之第2片材5B係由離間配置之複數之第2片材部5b所構成。 In the present embodiment, the first sheet 5A is composed of a plurality of first sheet portions 5a disposed apart from each other, and the plurality of second sheets 5B are composed of a plurality of second sheet portions 5b disposed apart from each other.
於此,將纖維基材2之上面側部分與第1片材部(支撐部)5a的第1樹脂層3接合,將纖維基材2之下面側部分與第2片材部(支撐體)5b之第2樹脂層4接合,製造積層片40。 Here, the upper side portion of the fiber base material 2 is joined to the first resin layer 3 of the first sheet portion (support portion) 5a, and the lower surface portion of the fiber base material 2 and the second sheet portion (support) are bonded. The second resin layer 4 of 5b is joined to produce a laminated sheet 40.
尚且,圖1~圖6中,為了使完成品、亦即使纖維基材2與第1片材部5a與第2片材部5b經接合者,與未完成品、亦即纖維基材2與第1片材部5a與第2片材部5b尚未接合者容易區別,而使未完成品呈現纖維基材2與第1片材部5a與第2片材部5b彼此離間的狀態。實際上係如圖11之 概略圖所示,未完成品中,纖維基材2與第1片材部5a接觸著,第2片材部5b與纖維基材2接觸著。又,於腔室7中,搬送纖維基材2與第1片材部5a與第2片材部5b,此時,沿著纖維基材2之搬送方向的端面(TD方向之端部的端面)並未被第1片材部5a或第2片材部5b所被覆,呈露出的狀態(參照圖10)。第1片材部5a及第2片材部5b之寬度(與搬送方向呈正交之方向的長度)較佳係與纖維基材2相等、或較纖維基材2之寬度短。 In addition, in the case of the finished product, even if the fiber base material 2 and the first sheet portion 5a and the second sheet portion 5b are joined, the unfinished product, that is, the fiber base material 2 and The first sheet portion 5a and the second sheet portion 5b are not easily joined, and the unfinished product is in a state in which the fibrous base material 2 and the first sheet portion 5a and the second sheet portion 5b are separated from each other. In fact, as shown in Figure 11 As shown in the schematic view, in the unfinished product, the fiber base material 2 is in contact with the first sheet portion 5a, and the second sheet portion 5b is in contact with the fiber base material 2. Further, in the chamber 7, the fiber base material 2 and the first sheet portion 5a and the second sheet portion 5b are conveyed, and at this time, the end surface in the conveying direction of the fiber base material 2 (the end surface of the end portion in the TD direction) It is not covered by the first sheet portion 5a or the second sheet portion 5b, and is exposed (see Fig. 10). The width of the first sheet portion 5a and the second sheet portion 5b (the length in the direction orthogonal to the conveying direction) is preferably equal to or shorter than the width of the fibrous base material 2.
積層片製造裝置30係具備搬送手段6、腔室7、減壓手段8、加壓手段9與加熱手段95。以下說明各部構成。 The laminated sheet manufacturing apparatus 30 includes a conveying means 6, a chamber 7, a pressure reducing means 8, a pressurizing means 9, and a heating means 95. The configuration of each unit will be described below.
搬送手段6係由經由例如腔室7而分別配置於其兩側的帶輸送器所構成。該搬送手段6可將纖維基材2與第1片材部5a與第2片材部5b一括性地由圖中之左側搬送至右側(沿著長度方向)、亦即於水平方向上進行搬送。亦即,搬送手段6係將纖維基材2與第1片材部5a與第2片材部5b供給至腔室7內,並由腔室7送出纖維基材2與第1片材部5a與第2片材部5b。 The conveying means 6 is constituted by a belt conveyor which is disposed on each of the two sides via, for example, the chamber 7. The conveying means 6 can convey the fiber base material 2, the first sheet portion 5a and the second sheet portion 5b in a horizontal direction from the left side in the drawing to the right side (in the longitudinal direction), that is, in the horizontal direction. . In other words, the conveying means 6 supplies the fiber base material 2, the first sheet portion 5a and the second sheet portion 5b into the chamber 7, and the fiber substrate 2 and the first sheet portion 5a are sent out from the chamber 7. And the second sheet portion 5b.
尚且,搬送手段6亦可由其他之壓輪或捲取輥進行搬送。 Further, the conveying means 6 may be conveyed by another pressure roller or a take-up roller.
另外,纖維基材2與第1片材部5a與第2片材部5b,係在藉搬送手段6進行搬送時,係使第1片材部5a之第1樹脂層3與纖維基材2上面相對向,使第2片材部5b之第2樹脂層4與纖維基材2下面相對向的狀態。以下將此狀態稱 為「相對向狀態」。 In addition, when the fiber base material 2, the first sheet portion 5a, and the second sheet portion 5b are transported by the transport means 6, the first resin layer 3 of the first sheet portion 5a and the fibrous base material 2 are obtained. The second resin layer 4 of the second sheet portion 5b is opposed to the lower surface of the fiber base material 2 in the opposing direction. This state is called below It is a "relative state".
於腔室7中,使藉搬送手段6所搬送之纖維基材2與第1片材部5a與第2片材部5b於維持相對向狀態下通過,此時其等被接合。 In the chamber 7, the fiber base material 2 conveyed by the transport means 6 and the first sheet portion 5a and the second sheet portion 5b are kept in a state of being opposed to each other, and at this time, they are joined.
腔室7係由於上下方向上彼此接近/離間之上側構造體(第1構造體)71與下側構造體(第2構造體)72所構成。 The chamber 7 is formed by the upper side structure (first structure) 71 and the lower structure (second structure) 72 which are close to each other in the vertical direction.
上側構造體71係具有頂板711、於頂板711緣部涵括其全周而形成的側壁712。側壁712係由頂板711之緣部朝下方突出。下側構造體72係具有底板721、於底板721緣部涵括其全周而形成的側壁722。側壁722係由底板721之緣部朝上方突出。 The upper structure 71 has a top plate 711 and a side wall 712 formed on the edge of the top plate 711 including the entire circumference thereof. The side wall 712 protrudes downward from the edge of the top plate 711. The lower structure 72 has a bottom plate 721 and a side wall 722 formed on the edge of the bottom plate 721 including the entire circumference thereof. The side wall 722 protrudes upward from the edge of the bottom plate 721.
於使上側構造體71與下側構造體72離間既定距離以上的狀態(以下稱為「開狀態」)下,可將纖維基材2與第1片材部5a與第2片材部5b送入至此等之構造體71、72內側,又,亦可朝此等構造體71、72之外側送出(參照圖6)。腔室7中,上側構造體71與下側構造體72間之圖中左側的部分成為入口73,右側的部分成為出口74。更詳細說明之,藉由在與纖維基材2等之搬送方向呈正交之上側構造體71之一對側壁712中,被配置於搬送方向上游側的側壁712A,以及在與纖維基材2等之搬送方向呈正交之下側構造體72之一對側壁722中,被配置於搬送方向上游側的側壁722A,區隔上述入口。又,藉由在與纖維基材2等之搬送 方向呈正交之上側構造體71之一對側壁712中,被配置於搬送方向下游側的側壁712B,以及在與纖維基材2等之搬送方向呈正交之下側構造體72之一對側壁722中,被配置於搬送方向下游側的側壁722B,區隔上述出口。側壁712A、722A之相對向的端面間成為入口,側壁712B、722B之相對向的端面間成為出口。 When the upper structure 71 and the lower structure 72 are separated by a predetermined distance or more (hereinafter referred to as "open state"), the fiber base material 2 and the first sheet portion 5a and the second sheet portion 5b can be sent. The inside of the structures 71 and 72 can be fed to the outside of the structures 71 and 72 (see Fig. 6). In the chamber 7, a portion on the left side in the drawing between the upper structure 71 and the lower structure 72 serves as an inlet 73, and a portion on the right side serves as an outlet 74. More specifically, the side wall 712 is disposed on the side wall 712 on the upstream side in the transport direction, and on the fiber substrate 2, in the side wall 712, which is perpendicular to the transport direction of the fiber base material 2 or the like. The conveyance direction is such that the side wall 722 of one of the orthogonal lower side structures 72 is disposed on the side wall 722A on the upstream side in the conveyance direction, and the entrance is partitioned. Moreover, by transporting with the fiber substrate 2 or the like The direction is one of the pair of side walls 712 of the pair of orthogonal upper side structures 71, and is disposed on the side wall 712B on the downstream side in the transport direction and on the side opposite to the transport direction of the fiber base material 2 and the like. The side wall 722 is disposed on the side wall 722B on the downstream side in the conveying direction to partition the outlet. The opposing end faces of the side walls 712A and 722A serve as an inlet, and the opposing end faces of the side walls 712B and 722B serve as an outlet.
作為上側構造體71及下側構造體72的構成材料,並無特別限定,可舉例如鐵、不銹鋼、鋁等之各種金屬,或含有此等的合金。 The constituent material of the upper structure 71 and the lower structure 72 is not particularly limited, and examples thereof include various metals such as iron, stainless steel, and aluminum, or alloys containing the same.
於上側構造體71之區隔入口73的部分(亦即側壁712A之端面)、區隔出口74之部分(亦即側壁712B之端面),分別設置由彈性材料所構成的密封構件75。又,於上側構造體72之區隔入口73的部分(亦即側壁722A之端面)、區隔出口74之部分(亦即側壁722B之端面),亦分別設置由彈性材料所構成的密封構件76。密封構件75及76分別係其橫剖面形狀為圓形的構件。密封構件75係固定於上側構造體71之側壁712A、712B下部,密封構件76係固定於下側構造體72之側壁722A、722B上部。 A portion of the upper structure 71 that partitions the inlet 73 (i.e., the end surface of the side wall 712A) and a portion that partitions the outlet 74 (i.e., the end surface of the side wall 712B) are respectively provided with a sealing member 75 made of an elastic material. Further, a portion of the upper structure 72 which partitions the inlet 73 (i.e., the end surface of the side wall 722A) and a portion of the partition outlet 74 (i.e., the end surface of the side wall 722B) are also provided with sealing members 76 each made of an elastic material. . The sealing members 75 and 76 are members each having a circular cross-sectional shape. The sealing member 75 is fixed to the lower portion of the side walls 712A and 712B of the upper structure 71, and the sealing member 76 is fixed to the upper portions of the side walls 722A and 722B of the lower structure 72.
而且,如圖2~圖4所示般,依使上側構造體71與下側構造體72接近之狀態(以下稱為「閉狀態」),使密封構件75與密封構件76一括地挾持纖維基材2與第1片材部5a與第2片材部5b,亦即,使密封構件75密黏於第1片材部5a 之金屬層12,使密封構件76密黏於第2片材部5b之金屬層12。藉此密黏,維持由上側構造體71與下側構造體72所區隔的空間77、亦即腔室7內的氣密性。此時,藉由減壓手段8之作動,可使空間77內減壓。 In addition, as shown in FIG. 2 to FIG. 4, the sealing member 75 and the sealing member 76 sandwich the fiber base in a state in which the upper structure 71 and the lower structure 72 are close to each other (hereinafter referred to as "closed state"). The material 2 and the first sheet portion 5a and the second sheet portion 5b, that is, the sealing member 75 is adhered to the first sheet portion 5a The metal layer 12 adheres the sealing member 76 to the metal layer 12 of the second sheet portion 5b. Thereby, the airtightness in the space 77 which is partitioned by the upper side structure 71 and the lower side structure body 72, that is, the inside of the chamber 7 is maintained. At this time, the inside of the space 77 can be decompressed by the operation of the decompression means 8.
尚且,於此雖未圖示,但在上側構造體71之四片側壁中,於側壁712A、712B以外之側壁的下端部,亦配置密封構件。同樣地,在下側構造體72之四片側壁中,於側壁722A、722B以外之側壁的上端部,亦配置密封構件。藉此,可保持腔室7內的氣密性。 Further, although not shown here, in the four side walls of the upper structure 71, a sealing member is also disposed at the lower end portions of the side walls other than the side walls 712A and 712B. Similarly, in the four side walls of the lower structure 72, a sealing member is also disposed at the upper end portions of the side walls other than the side walls 722A and 722B. Thereby, the airtightness in the chamber 7 can be maintained.
尚且,密封構件75及76分別於圖2~圖4所示之構成中,密黏於第1片材部5a之金屬層12,並密黏於第2片材部5b之金屬層12,但並不限定於此,亦可例如密黏於纖維基材2之上面及下面。 Further, in the configuration shown in FIGS. 2 to 4, the sealing members 75 and 76 are adhered to the metal layer 12 of the first sheet portion 5a, and are adhered to the metal layer 12 of the second sheet portion 5b, but The present invention is not limited thereto, and may be adhered to the upper surface and the lower surface of the fibrous base material 2, for example.
作為密封構件75及76之構成材料,並無特別限定,可舉例如天然橡膠、異戊二烯橡膠、丁二烯橡膠、苯乙烯-丁二烯橡膠、腈橡膠、氯平橡膠、丁基橡膠、丙烯酸系橡膠、乙烯-丙烯橡膠、表氯醇橡膠、胺基甲酸酯橡膠、聚矽氧橡膠、氟橡膠般之各種橡膠材料(尤其是經加硫處理者),或苯乙烯系、聚烯烴系、聚氯乙烯系、聚胺基甲酸酯系、聚酯系、聚醯胺系、聚丁二烯系、反式聚異戊二烯系、氟橡膠系、氯化聚乙烯系等之各種熱可塑性彈性體,此等之中可使用1種或混合2種以上使用。 The constituent materials of the sealing members 75 and 76 are not particularly limited, and examples thereof include natural rubber, isoprene rubber, butadiene rubber, styrene-butadiene rubber, nitrile rubber, chloroprene rubber, and butyl rubber. Acrylic rubber, ethylene-propylene rubber, epichlorohydrin rubber, urethane rubber, polyoxyethylene rubber, fluororubber-like rubber materials (especially those treated with sulfur), or styrene, poly Olefin, polyvinyl chloride, polyurethane, polyester, polyamine, polybutadiene, trans-polyisoprene, fluororubber, chlorinated polyethylene, etc. Each of the thermoplastic elastomers may be used alone or in combination of two or more.
另外,於密封構件75及密封構件76中,分別內藏著例如由電熱線所構成的加熱器78。藉此,於圖2~圖4所示之狀態下,可對第1片材部5a或第2片材部5b進行加熱。藉此,由於可進行各片材部之樹脂層的壓黏,故可維持纖維基材2的減壓狀態。亦即,藉由密封構件75及密封構件76,對第1片材部5a或第2片材部5b之搬送方向下游側之端部及上游側之端部進行加熱時,則各片材部5a、5b之樹脂層熔融,含浸至纖維基材2內部。藉此,位於構造體7內之纖維基材2之搬送方向下游側的區域及上游側的區域,被樹脂層所密封。在驅動了後述之減壓手段時,藉後述之減壓手段吸引纖維基材2內部的氣體,可維持纖維基材2之減壓狀態。 Further, a heater 78 composed of, for example, a heating wire is housed in each of the sealing member 75 and the sealing member 76. Thereby, the first sheet portion 5a or the second sheet portion 5b can be heated in the state shown in FIGS. 2 to 4. Thereby, since the resin layer of each sheet part can be pressure-bonded, the decompression state of the fiber base material 2 can be maintained. In other words, when the end portion on the downstream side in the conveying direction of the first sheet portion 5a or the second sheet portion 5b and the upstream end portion are heated by the sealing member 75 and the sealing member 76, each sheet portion is heated. The resin layers of 5a and 5b are melted and impregnated into the inside of the fibrous base material 2. Thereby, the region on the downstream side in the conveying direction of the fiber base material 2 in the structure 7 and the region on the upstream side are sealed by the resin layer. When the pressure reducing means to be described later is driven, the gas inside the fiber base material 2 is sucked by the pressure reducing means described later, and the reduced pressure state of the fiber base material 2 can be maintained.
尚且,積層片製造裝置30中,密封構件75及76亦具有作為加壓手段或加熱手段之一部分的機能。 Further, in the laminated sheet manufacturing apparatus 30, the sealing members 75 and 76 also have a function as a part of a pressurizing means or a heating means.
另外,在僅將片材部5a、5b之任一者設於纖維基材2的情況,亦可於纖維基材2之與片材部相反側的面上,抵接密封構件。此時亦經由纖維基材2使片材部間接地抵接於密封構件,使樹脂層加熱。然後,經加熱之樹脂層被含浸至纖維基材內部。 In addition, when only one of the sheet portions 5a and 5b is provided on the fiber base material 2, the sealing member may be abutted on the surface of the fiber base material 2 opposite to the sheet portion. At this time, the sheet portion is indirectly abutted against the sealing member via the fiber base material 2, and the resin layer is heated. Then, the heated resin layer is impregnated into the interior of the fibrous substrate.
減壓手段8係使腔室7內減壓為負壓者,具有2組之泵81與連接管(管)82。 The decompression means 8 has a pressure reduction of the inside of the chamber 7 to a negative pressure, and has two sets of pumps 81 and connecting pipes (tubes) 82.
一組(圖中上側)之連接管82係連接至上側構造體71之頂板711,於711開口。藉此,該連接管82連通至腔室7內。 經由該連接管82,一組之泵81與上側構造體71連接。 A set (the upper side in the figure) of the connecting pipe 82 is connected to the top plate 711 of the upper side structure 71, and is opened at 711. Thereby, the connecting pipe 82 is connected to the inside of the chamber 7. A group of pumps 81 is connected to the upper side structure 71 via the connecting pipe 82.
另一組(圖中下側)之連接管82係連接至下側構造體72之底板721,於721開口。藉此,該連接管82連通至腔室7內。經由該連接管82,另一組之泵81與下側構造體72連接。 The other set (the lower side in the figure) of the connecting pipe 82 is connected to the bottom plate 721 of the lower side structure 72, and is opened at 721. Thereby, the connecting pipe 82 is connected to the inside of the chamber 7. The pump 81 of the other group is connected to the lower structure 72 via the connecting pipe 82.
各泵81分別設置於腔室7外側,可應用例如真空泵。各連接管82係分別由例如不銹鋼等之金屬材料所構成的硬質管。 Each of the pumps 81 is disposed outside the chamber 7, and for example, a vacuum pump can be applied. Each of the connecting pipes 82 is a rigid pipe made of a metal material such as stainless steel.
然後,如圖3、圖4所示,於腔室7為閉狀態下使各泵81分別作動,而可經由各連接管82吸引空間77內的空氣G,藉此,可確實使空間77減壓。 Then, as shown in FIGS. 3 and 4, the respective pumps 81 are actuated in the closed state of the chamber 7, and the air G in the space 77 can be sucked through the respective connecting pipes 82, whereby the space 77 can be surely reduced. Pressure.
加壓手段9係於閉狀態之腔室7內,將相對向狀態之纖維基材2與第1片材部5a與第2片材部5b一括地於其厚度方向上進行加壓者(參照圖4)。 The pressurizing means 9 is placed in the chamber 7 in the closed state, and the fiber base material 2 and the first sheet portion 5a and the second sheet portion 5b in the opposing state are pressed in the thickness direction (see Figure 4).
加壓手段9係具有:上側按壓構件(第1按壓構件)91、連結至上側按壓構件的汽缸92、下側按壓構件(第2按壓構件)93、與連接至下側按壓構件93的汽缸94。 The pressurizing means 9 includes an upper pressing member (first pressing member) 91, a cylinder 92 coupled to the upper pressing member, a lower pressing member (second pressing member) 93, and a cylinder 94 connected to the lower pressing member 93. .
本實施形態中,係驅動上側按壓構件91及下側按壓構件93之雙方,但亦可構成為僅驅動其中一者,使上側按壓構件91及下側按壓構件93相對地進行接近、離間。 In the present embodiment, both the upper pressing member 91 and the lower pressing member 93 are driven, but only one of them may be driven, and the upper pressing member 91 and the lower pressing member 93 may be relatively approached and separated from each other.
上側按壓構件91係位於腔室7內,將第1片材部5a由其上側進行按壓的構件。上側按壓構件91係呈平面矩形的板 狀,其總長(纖維基材2等之沿著搬送方向的長度)係與切斷積層片40而成之預浸體1(或第1片材部5a)之總長幾乎相同,或較其稍短。又,上側按壓構件91之寬度(圖1~圖6之朝紙面內部方向的長度)係較預浸體1之寬度寬。 The upper pressing member 91 is a member that is placed in the chamber 7 and that presses the first sheet portion 5a from the upper side thereof. The upper pressing member 91 is a flat rectangular plate The total length (the length of the fiber base material 2 or the like along the conveying direction) is almost the same as or shorter than the total length of the prepreg 1 (or the first sheet portion 5a) obtained by cutting the laminated sheet 40. short. Further, the width of the upper pressing member 91 (the length in the inner direction of the paper surface of FIGS. 1 to 6) is wider than the width of the prepreg 1.
上側按壓構件91之上面係連接著汽缸92。汽缸92係使上側按壓構件91對於下側按壓構件93進行接近、離間的驅動手段。汽缸92係具有自由出沒的桿921,藉由該桿921之出沒可使上側按壓構件91於上下方向進行移動。而且,在上側按壓構件91朝下方移動時,可由其上側按壓第1片材部5a。又,汽缸92之桿921貫通上側構造體71之頂板711,大部分位於腔室7之外側。 The upper surface of the upper pressing member 91 is connected to the cylinder 92. The cylinder 92 is a driving means for causing the upper pressing member 91 to approach and disengage the lower pressing member 93. The cylinder 92 has a rod 921 that is freely detached, and the upper pressing member 91 can be moved in the vertical direction by the presence or absence of the rod 921. Further, when the upper pressing member 91 moves downward, the first sheet portion 5a can be pressed by the upper side. Further, the rod 921 of the cylinder 92 penetrates the top plate 711 of the upper structure 71, and most of it is located outside the chamber 7.
下側按壓構件93係位於腔室7內,將第2片材部5b由其下側進行按壓的構件。下側按壓構件93係與上側按壓構件91同樣地為平面矩形的板狀,其總長係與切斷積層片40而成之預浸體1(或第2片材部5b)之總長幾乎相同,或較其稍短。又,下側按壓構件93之寬度係較預浸體1之寬度寬。 The lower pressing member 93 is a member that is located in the chamber 7 and that presses the second sheet portion 5b from the lower side thereof. Similarly to the upper pressing member 91, the lower pressing member 93 has a flat rectangular plate shape, and the total length thereof is almost the same as the total length of the prepreg 1 (or the second sheet portion 5b) obtained by cutting the laminated sheet 40. Or a little shorter. Further, the width of the lower pressing member 93 is wider than the width of the prepreg 1.
下側按壓構件93之下面係連接著汽缸94。汽缸94係使下側按壓構件93對於上側按壓構件91進行接近、離間的驅動手段。汽缸94係具有自由出沒的桿941,藉由該桿941之出沒可使下側按壓構件93於上下方向進行移動。而且,在下側按壓構件93朝下方移動時,可由其下側按壓第2片材部5b。又,汽缸94之桿941貫通下側構造體72之底板 721,大部分位於腔室7之外側。 The lower surface of the lower pressing member 93 is connected to the cylinder 94. The cylinder 94 is a driving means for causing the lower pressing member 93 to approach and disengage the upper pressing member 91. The cylinder 94 has a rod 941 that is freely detached, and the lower pressing member 93 is moved in the vertical direction by the presence of the rod 941. Further, when the lower pressing member 93 moves downward, the second sheet portion 5b can be pressed by the lower side. Further, the rod 941 of the cylinder 94 penetrates the bottom plate of the lower structure 72 721, mostly located outside the chamber 7.
尚且,如圖12所示,於下側按壓構件93之入口73側、具體而言於下側按壓構件93之入口73側之側面,亦可設置朝上側按壓構件91突出的凸部90。同樣地,於下側按壓構件93之出口74側、具體而言於下側按壓構件93之出口74側之側面,亦可設置朝上側按壓構件91側突出的凸部90。該凸部90係經由下側按壓構件93而被後述之加熱器95所加熱。 Further, as shown in FIG. 12, a convex portion 90 that protrudes toward the upper pressing member 91 may be provided on the side of the inlet 73 of the lower pressing member 93, specifically, the side surface on the side of the inlet 73 of the lower pressing member 93. Similarly, a convex portion 90 that protrudes toward the upper side pressing member 91 side may be provided on the side of the outlet 74 of the lower pressing member 93, specifically, the side surface on the outlet 74 side of the lower pressing member 93. The convex portion 90 is heated by a heater 95 to be described later via the lower pressing member 93.
凸部90係形成於與上側按壓構件91相對向的位置。於凸部90之與上側按壓構件91相反側,設有彈性構件E。將第1片材部5a、纖維基材2、第2片材部5b以下側按壓構件93及上側按壓構件91挾壓時,凸部90係經由第1片材部5a、纖維基材2、第2片材部5b而抵接至上側按壓構件91。其中,由於設有彈性構件E,故凸部90不致較下側按壓構件93之上面更突出至上側按壓構件91側。藉由使凸部90接觸至第2片材部5b,則第2片材部5b被按壓於纖維基材2側。亦即,彈性構件E成為調整凸部90對第2片材部5b之按壓力的壓力調整機構。然後,藉凸部90,第2片材部5b被加熱,可使樹脂層4含浸至纖維基材2中,可將纖維基材2之一部分密封。 The convex portion 90 is formed at a position facing the upper pressing member 91. An elastic member E is provided on the opposite side of the convex portion 90 from the upper pressing member 91. When the first sheet portion 5a, the fiber base material 2, and the second sheet portion 5b are pressed against the lower side pressing member 93 and the upper side pressing member 91, the convex portion 90 passes through the first sheet portion 5a and the fiber base material 2. The second sheet portion 5b is in contact with the upper pressing member 91. Among these, since the elastic member E is provided, the convex portion 90 does not protrude further toward the upper side pressing member 91 than the upper surface of the lower pressing member 93. When the convex portion 90 is brought into contact with the second sheet portion 5b, the second sheet portion 5b is pressed against the fiber base material 2 side. That is, the elastic member E serves as a pressure adjusting mechanism that adjusts the pressing force of the convex portion 90 against the second sheet portion 5b. Then, the second sheet portion 5b is heated by the convex portion 90, and the resin layer 4 can be impregnated into the fibrous base material 2, and one portion of the fibrous base material 2 can be sealed.
汽缸92係構成為可調整該桿921之突出量、亦即壓力大小,汽缸94亦構成為可調整該桿941之突出量、亦即壓力 大小。藉此,可將第1片材部5a之第1樹脂層3對纖維基材2的含浸程度(第1含浸部31之平均厚度ta1)、與第2片材部5b之第2樹脂層4對纖維基材2的含浸程度(第2含浸部41之平均厚度ta2)調整為所需大小。 The cylinder 92 is configured to adjust the amount of protrusion of the rod 921, that is, the magnitude of the pressure, and the cylinder 94 is also configured to adjust the amount of protrusion of the rod 941, that is, the pressure. size. Thereby, the degree of impregnation of the first resin layer 3 of the first sheet portion 5a with respect to the fiber base material 2 (the average thickness ta1 of the first impregnation portion 31) and the second resin layer 4 of the second sheet portion 5b can be obtained. The degree of impregnation of the fibrous base material 2 (the average thickness ta2 of the second impregnation portion 41) is adjusted to a desired size.
作為上側按壓構件91及下側按壓構件93的構成材料,並無特別限定,可使用例如不銹鋼等之金屬材料。又,於金屬材料,亦可將橡膠、玻璃板、尤其是表面平滑度高之構件貼附於相對向之面上。藉此,可得到平滑性更加優越的積層片40。 The constituent material of the upper pressing member 91 and the lower pressing member 93 is not particularly limited, and a metal material such as stainless steel can be used. Further, in the metal material, a rubber, a glass plate, and particularly a member having a high surface smoothness may be attached to the opposite surface. Thereby, the laminated sheet 40 which is more excellent in smoothness can be obtained.
作為汽缸92、94並無特別限定,可使用例如油壓汽缸、氣缸。 The cylinders 92 and 94 are not particularly limited, and for example, a hydraulic cylinder or an air cylinder can be used.
另外,於上側按壓構件91及下側按壓構件93,分別內藏有例如由電熱線所構成的加熱器95(加熱手段)。藉此,可經由上側按壓構件91確實地加熱第1片材部5a,並可經由下側按壓構件93確實地加熱第2片材部5b。 Further, a heater 95 (heating means) composed of, for example, a heating wire is housed in the upper pressing member 91 and the lower pressing member 93, respectively. Thereby, the first sheet portion 5a can be surely heated by the upper pressing member 91, and the second sheet portion 5b can be surely heated via the lower pressing member 93.
加熱器95係於本實施形態中雖內藏於上側按壓構件91及下側按壓構件93之雙方,但並不限定於此,例如亦可僅內藏於上側按壓構件91及側按壓構件93之其中一者中。 In the present embodiment, the heater 95 is incorporated in both the upper pressing member 91 and the lower pressing member 93. However, the present invention is not limited thereto. For example, the heater 95 may be incorporated only in the upper pressing member 91 and the side pressing member 93. One of them.
再者,如圖1所示,積層片製造裝置30係具備檢測手段96、判別手段97與控制手段98。 Further, as shown in FIG. 1, the laminated sheet manufacturing apparatus 30 includes a detecting means 96, a determining means 97, and a control means 98.
檢測手段96係檢測相鄰接之第1片材部5a間之間隙(纖維基材2之露出部21)或相鄰接之第2片材部5b間之間隙 (纖維基材2之露出部21)。 The detecting means 96 detects the gap between the adjacent first sheet portions 5a (the exposed portion 21 of the fiber base material 2) or the gap between the adjacent second sheet portions 5b. (The exposed portion 21 of the fibrous base material 2).
本實施形態中,係檢測腔室7之入口側之露出部21的位置。作為檢測手段96,可舉例如CCD相機等。 In the present embodiment, the position of the exposed portion 21 on the inlet side of the chamber 7 is detected. As the detecting means 96, for example, a CCD camera or the like can be mentioned.
判別手段97係判別纖維基材2之一部分、與各片材部5a、5b是否有被搬送至腔室7內之既定位置。具體而言,判別手段97係判別由檢測手段所檢測出之第1片材部5a間的間隙、或第2片材部5b間之間隙是否位於既定位置。於此所謂既定位置,係指露出部21不進入腔室7,且片材部5a、5b未由腔室7擠出的位置。 The discrimination means 97 determines whether or not one of the fiber base materials 2 and the respective sheet portions 5a and 5b are conveyed to a predetermined position in the chamber 7. Specifically, the determination means 97 determines whether or not the gap between the first sheet portions 5a detected by the detecting means or the gap between the second sheet portions 5b is located at a predetermined position. Here, the predetermined position means a position at which the exposed portion 21 does not enter the chamber 7, and the sheet portions 5a, 5b are not extruded by the chamber 7.
控制手段98係在由判別手段97判別出纖維基材2之一部分與片材部5a、5b被搬送至腔室7內之既定位置時,亦即判別出露出部21位於上述既定位置時,停止搬送手段6的驅動。另一方面,控制手段98係在判別手段97未判別出纖維基材2之一部分與片材部5a、5b被搬送至上述腔室7內之既定位置時,亦即判別出露出部21並未位於上述既定位置時,控制成不停止搬送手段6之驅動。 The control means 98 determines when one of the fibrous base material 2 and the sheet portions 5a, 5b are transported to a predetermined position in the chamber 7 by the determining means 97, that is, when the exposed portion 21 is positioned at the predetermined position, it is stopped. The drive of the transport means 6. On the other hand, when the determination means 97 does not determine that one of the fibrous base material 2 and the sheet portions 5a, 5b are conveyed to a predetermined position in the chamber 7, the control means 98 determines that the exposed portion 21 is not When it is located at the predetermined position described above, it is controlled so as not to stop the driving of the conveying means 6.
尚且,本實施形態中,雖藉由檢測手段96檢測腔室7入口側之露出部21的位置,但並不限定於此,亦可檢測腔室7出口側之露出部21的位置。此時,判別手段97係判別露出部21是否位於既定位置。 Further, in the present embodiment, the position of the exposed portion 21 on the inlet side of the chamber 7 is detected by the detecting means 96. However, the present invention is not limited thereto, and the position of the exposed portion 21 on the outlet side of the chamber 7 may be detected. At this time, the determination means 97 determines whether or not the exposed portion 21 is located at a predetermined position.
再者,藉由檢測手段96,亦可檢測腔室7入口側之露出部21之位置、腔室7出口側之露出部21之位置雙方。 Further, by the detecting means 96, both the position of the exposed portion 21 on the inlet side of the chamber 7 and the position of the exposed portion 21 on the outlet side of the chamber 7 can be detected.
接著,針對積層片製造裝置30之作動狀態、亦即藉積層片製造裝置30製造積層片40之狀態(過程),參照圖1~圖6進行說明。 Next, a state (process) in which the laminated sheet manufacturing apparatus 30 is operated, that is, a state in which the laminated sheet manufacturing apparatus 30 manufactures the laminated sheet 40, will be described with reference to FIGS. 1 to 6 .
於積層片製造裝置30中,纖維基材2係被連續地供給至腔室7內。然後,於此被連續供給的纖維基材2,如圖11所示般,於其上面側沿著長度方向使複數之第1片材部5a經由間隙51鄰接配置,於下面側亦使複數之第2片材部5b經由間隙52鄰接配置。藉由此種配置,第1片材部5a、第2片材部5b分別被斷續地供給至腔室7內。 In the laminated sheet manufacturing apparatus 30, the fiber base material 2 is continuously supplied into the chamber 7. Then, as shown in FIG. 11, the fiber base material 2 which is continuously supplied here has a plurality of first sheet portions 5a disposed adjacent to each other via the gap 51 along the longitudinal direction on the upper surface side thereof, and plural numbers on the lower surface side. The second sheet portion 5b is disposed adjacent to each other via the gap 52. With this arrangement, the first sheet portion 5a and the second sheet portion 5b are intermittently supplied into the chamber 7.
於此,第1片材部5a係包括第1樹脂層3、與支撐第1樹脂層3之支撐體的金屬層12。第2片材部5b係包括第2樹脂層4、與支撐第2樹脂層4之支撐體的金屬層12。第1樹脂層3、第2樹脂層4係由固形或半固形之樹脂組成物所構成,為B-階段狀態。 Here, the first sheet portion 5a includes the first resin layer 3 and the metal layer 12 that supports the support of the first resin layer 3. The second sheet portion 5b includes a second resin layer 4 and a metal layer 12 that supports the support of the second resin layer 4. The first resin layer 3 and the second resin layer 4 are composed of a solid or semi-solid resin composition and are in a B-stage state.
尚且,第1樹脂層3、第2樹脂層4亦可為液狀之樹脂組成物。 Further, the first resin layer 3 and the second resin layer 4 may be a liquid resin composition.
纖維基材2係捲繞於未圖示之供給輥,由該供給輥,使纖維基材2朝腔室7搬送。在使纖維基材2朝腔室7搬送的途中,對纖維基材2配置複數之片材部5a、複數之片材部5b。 The fiber base material 2 is wound around a supply roller (not shown), and the fiber base material 2 is conveyed to the chamber 7 by the supply roller. In the middle of transporting the fiber base material 2 toward the chamber 7, a plurality of sheet portions 5a and a plurality of sheet portions 5b are disposed on the fiber base material 2.
於此,搬送時,較佳係依片材部5a對纖維基材2不發生位置偏移的方式,對纖維基材2,事先作成固定各片材部5a之一部分且其他一部分不固定的狀態。具體而言,較佳係例 如將各片材部5a之搬送方向下游側之端部壓黏固定於纖維基材2。 In the case of the conveyance, it is preferable that the fiber base material 2 is fixed in a state in which one portion of each of the sheet portions 5a is fixed and the other portion is not fixed, so that the fiber base material 2 is not displaced in position. . Specifically, preferred examples The end portion on the downstream side in the conveying direction of each sheet portion 5a is pressure-fixed to the fiber base material 2.
同樣地,較佳係對纖維基材2,事先作成固定片材5b之一部分且其他一部分不固定的狀態。具體而言,較佳係例如將片材部5b之搬送方向下游側之端部壓黏固定於纖維基材2。 Similarly, it is preferable that the fiber base material 2 is previously formed in a state in which one portion of the sheet 5b is fixed and the other portion is not fixed. Specifically, for example, it is preferable to press-fix and fix the end portion of the sheet portion 5 b on the downstream side in the conveying direction to the fiber base material 2 .
作為將各片材部5a、5b之一部分壓黏固定於纖維基材2的方法,可舉例如藉由密封棒等之加熱手段,將各片材部5a、5b之一部分加熱,使樹脂層3、4熔融,而含浸於纖維基材2的方法。 As a method of partially pressing and fixing one of the sheet portions 5a and 5b to the fiber base material 2, for example, a part of each of the sheet portions 5a and 5b is heated by a heating means such as a sealing rod to form the resin layer 3. 4, a method of melting and impregnating the fibrous substrate 2.
尚且,纖維基材2係其上面一部分經由間隙51而露出,下面一部分亦經由間隙52而露出。積層片40中,係將纖維基材2之露出部21、亦即對應於纖維基材2之間隙51、52之部分,使用作為切斷積層片40而得到預浸體1時的切斷部。 Further, in the fibrous base material 2, a part of the upper surface thereof is exposed through the gap 51, and a part of the lower surface is also exposed through the gap 52. In the laminated sheet 40, the exposed portion 21 of the fiber base material 2, that is, the portion corresponding to the gaps 51 and 52 of the fiber base material 2, is used as the cut portion when the prepreg 1 is obtained by cutting the laminated sheet 40. .
另外,如上述般,纖維基材2之沿著搬送方向的端面(TD方向之端部的端面),並未被第1片材部5a或第2片材部5b所被覆,而呈露出狀態。 In addition, as described above, the end surface (the end surface of the end portion in the TD direction) of the fiber base material 2 in the transport direction is not covered by the first sheet portion 5a or the second sheet portion 5b, but is exposed. .
藉由搬送手段6,於腔室7內搬送纖維基材2、第1片材部5a及第2片材部5b。此時,腔室7呈開狀態。於檢測手段96中,檢測相鄰接之第1片材部5a間之間隙(纖維基材2之露出部21)或相鄰接之第2片材部5b間之間隙(纖維基材 2之露出部21)的位置。然後,藉判別手段97,判別由檢測手段所檢測出之第1片材部5a間之間隙、或第2片材部5b間之間隙是否位於既定位置。於判別手段97中,在判別出纖維基材2之一部分與片材部5a、5b被搬送至腔室7內之既定位置時,停止搬送手段6之驅動。該停止狀態係維持至腔室7內之纖維基材2與第1片材部5a與第2片材部5b接合為止。 The fiber base material 2, the first sheet portion 5a, and the second sheet portion 5b are conveyed in the chamber 7 by the conveying means 6. At this time, the chamber 7 is in an open state. In the detecting means 96, the gap between the adjacent first sheet portions 5a (the exposed portion 21 of the fibrous base material 2) or the gap between the adjacent second sheet portions 5b (fiber substrate) is detected. The position of the exposed portion 21) of 2. Then, the discriminating means 97 determines whether or not the gap between the first sheet portions 5a detected by the detecting means or the gap between the second sheet portions 5b is located at a predetermined position. In the discriminating means 97, when it is determined that one of the fibrous base material 2 and the sheet portions 5a, 5b are conveyed to a predetermined position in the chamber 7, the driving of the conveying means 6 is stopped. This stopped state is maintained until the fiber base material 2 in the chamber 7 is joined to the first sheet portion 5a and the second sheet portion 5b.
如圖1所示,腔室7呈開狀態,經由入口73,插入相對向狀態之纖維基材2與第1片材部5a與第2片材部5b。又,纖維基材2之一部分雖位於腔室7內,但纖維基材2之其他一部分係位於腔室之搬送方向下游側及上游側,由腔室7露出。 As shown in Fig. 1, the chamber 7 is opened, and the fiber base material 2 and the first sheet portion 5a and the second sheet portion 5b in the opposing state are inserted through the inlet 73. Further, although one portion of the fibrous base material 2 is located in the chamber 7, the other portion of the fibrous base material 2 is located on the downstream side and the upstream side in the transport direction of the chamber, and is exposed by the chamber 7.
另外,位於腔室7之片材部5a、5b以外之其他片材部5a、5b係位於腔室7外部。 Further, the other sheet portions 5a, 5b located outside the sheet portions 5a, 5b of the chamber 7 are located outside the chamber 7.
此時,使分別內藏於上側按壓構件91及下側按壓構件93之各加熱器95預先作動。藉此,上側按壓構件91及下側按壓構件93分別呈帶熱狀態。 At this time, the heaters 95 respectively housed in the upper pressing member 91 and the lower pressing member 93 are operated in advance. Thereby, the upper side pressing member 91 and the lower side pressing member 93 are each in a heated state.
此外,設於腔室7之上側構造體71的密封構件75、與設於下側構造體72之密封構件76中所分別內藏的各加熱器78亦預先作動。藉此,密封構件75、76分別呈帶熱狀態。 Further, the sealing member 75 provided in the upper side structure 71 of the chamber 7 and the heaters 78 respectively provided in the sealing member 76 provided in the lower structure 72 are also actuated in advance. Thereby, the sealing members 75 and 76 are respectively in a heated state.
接著,如圖2所示,使上側構造體71與下側構造體72接近,腔室作為閉狀態。此時,如上述般,藉由腔室7之上 側構造體71之密封構件75、與下側構造體72之密封構件76,一括地挾持纖維基材2與第1片材部5a與第2片材部5b。藉此,保持腔室7之氣密性。 Next, as shown in FIG. 2, the upper side structure 71 and the lower side structure body 72 are brought close, and the chamber is in a closed state. At this time, as described above, by the chamber 7 The sealing member 75 of the side structure 71 and the sealing member 76 of the lower structure 72 collectively hold the fiber base material 2, the first sheet portion 5a, and the second sheet portion 5b. Thereby, the airtightness of the chamber 7 is maintained.
另外,密封構件75、76分別呈帶熱狀態。藉此,於第1片材部5a,經由金屬層12使第1樹脂層3之兩端部(搬送方向下游側及上游側的端部)分別被加熱。藉此加熱,使第1樹脂層3之兩端部分別熔融,並壓黏(熔著)於纖維基材2。又,於第2片材部5b,經由金屬層12使第2樹脂層4之兩端部分別被加熱。藉此加熱,使第2樹脂層4之兩端部分別熔融,並壓黏於纖維基材2。經熔融之樹脂層3、4係含浸至纖維基材2內部,位於腔室7內之纖維基材2之搬送方向下游側及上游側的區域被密封。如此,可抑制腔室7內部之氣體通過纖維基材2而洩漏至腔室7外部。因此,可使腔室7內部容易減壓,可作成高真空。 Further, the sealing members 75 and 76 are respectively in a heated state. In the first sheet portion 5a, both end portions (end portions on the downstream side and the upstream side in the transport direction) of the first resin layer 3 are heated via the metal layer 12. By heating, both end portions of the first resin layer 3 are melted and pressed (fused) to the fiber base material 2. Further, in the second sheet portion 5b, both end portions of the second resin layer 4 are heated via the metal layer 12. By heating, both end portions of the second resin layer 4 are melted and pressed against the fiber base material 2. The molten resin layers 3 and 4 are impregnated into the inside of the fiber base material 2, and the region on the downstream side and the upstream side in the conveying direction of the fiber base material 2 in the chamber 7 is sealed. In this way, it is possible to suppress the gas inside the chamber 7 from leaking to the outside of the chamber 7 through the fibrous base material 2. Therefore, the inside of the chamber 7 can be easily decompressed, and a high vacuum can be created.
接著,如圖3所示,使減壓手段8作動,開始對腔室7的減壓。減壓係在藉汽缸92之作動使上側按壓構件91移動至下方,藉汽缸94之作動使下側按壓構件93移動至上方,一括性地對纖維基材2與第1片材部5a與第2片材部5b加壓前所進行。 Next, as shown in FIG. 3, the decompression means 8 is actuated, and the pressure reduction of the chamber 7 is started. In the decompression, the upper pressing member 91 is moved downward by the operation of the cylinder 92, and the lower pressing member 93 is moved upward by the operation of the cylinder 94, and the fiber base material 2 and the first sheet portion 5a and the first portion are integrally formed. The 2 sheet portion 5b is carried out before pressurization.
藉此,空間77成為減壓狀態,藉由於該空間77所產生之減壓力(負壓),輔助纖維基材2與第1樹脂層3間之壓黏、與纖維基材2與第2樹脂層4間之壓黏。 Thereby, the space 77 is in a reduced pressure state, and the pressure between the auxiliary fiber base material 2 and the first resin layer 3 and the fiber base material 2 and the second resin are caused by the pressure (negative pressure) generated by the space 77. The pressure between layers 4 is sticky.
本實施形態中,係如上述般,為使片材部5a之一部分固定於纖維基材2,並使其他一部分未固定於纖維基材2的狀態。同樣地,為使片材部5b之一部分固定於纖維基材2,並使其他一部分未固定於纖維基材2的狀態。 In the present embodiment, as described above, one of the sheet portions 5a is partially fixed to the fiber base material 2, and the other portion is not fixed to the fiber base material 2. Similarly, in order to fix one part of the sheet portion 5b to the fiber base material 2, the other portion is not fixed to the fiber base material 2.
因此,藉由對腔室7進行減壓,而使片材部5a、5b之未固定於纖維基材2的區域接觸至纖維基材2。 Therefore, by depressurizing the chamber 7, the regions of the sheet portions 5a, 5b which are not fixed to the fibrous base material 2 are brought into contact with the fibrous base material 2.
再者,藉由使減壓手段8作動,使纖維基材2內部之氣體(空氣)被吸引,纖維基材2內部亦被減壓。如圖10所示,位於腔室內之纖維基材2之沿搬送方向的端面並未被片材部5a、5b所被覆,而呈露出,故由纖維基材2之沿著搬送方向的端面,使纖維基材2內部之氣體被減壓手段8所吸引。 Further, by operating the decompression means 8, the gas (air) inside the fiber base material 2 is sucked, and the inside of the fiber base material 2 is also depressurized. As shown in FIG. 10, the end surface of the fiber base material 2 located in the chamber in the transport direction is not covered by the sheet portions 5a and 5b, and is exposed. Therefore, the end surface of the fibrous base material 2 along the transport direction is The gas inside the fiber base material 2 is sucked by the decompression means 8.
尚且,纖維基材2內之氣體亦由纖維基材2與片材部5a間之間隙、纖維基材2與片材部5b間之間隙被減壓手段8所吸引。 Further, the gas in the fiber base material 2 is also sucked by the pressure reducing means 8 from the gap between the fiber base material 2 and the sheet portion 5a and the gap between the fiber base material 2 and the sheet portion 5b.
此外,如上述般,在位於腔室7內之纖維基材2之搬送方向下游側及上游側的區域,含浸至樹脂層3、4,成為被樹脂層3、4所密封的狀態,故可使位於腔室7內之纖維基材2內部的氣體確實地被吸引,使纖維基材2內部減壓。 In addition, as described above, the regions on the downstream side and the upstream side in the transport direction of the fiber base material 2 located in the chamber 7 are impregnated into the resin layers 3 and 4, and are sealed by the resin layers 3 and 4, so that they can be sealed. The gas inside the fiber base material 2 located in the chamber 7 is surely attracted, and the inside of the fiber base material 2 is decompressed.
尚且,纖維基材2之沿著搬送方向的端部,係位於腔室7內部,並未由腔室7露出。 Further, the end portion of the fibrous base material 2 along the conveying direction is located inside the chamber 7, and is not exposed by the chamber 7.
接著,如圖4所示,於維持減壓手段8之作動所進行之減壓狀態之下,使下側按壓構件93移動至上方後,使上側按 壓構件91移動至下方。藉此,一括地對纖維基材2與第1片材部5a與第2片材部5b加壓。 Next, as shown in FIG. 4, under the reduced pressure state in which the operation of the decompression means 8 is maintained, the lower pressing member 93 is moved upward, and the upper side is pressed. The pressing member 91 is moved to the lower side. Thereby, the fiber base material 2 and the first sheet portion 5a and the second sheet portion 5b are pressurized.
另外,如上述般,上側按壓構件91及下側按壓構件93係分別呈帶熱狀態。藉此,於第1片材部5a,經由金屬層12使第1樹脂層3之中間部被加熱。藉此加熱,使第1樹脂層3之中間部熔融,並壓黏(熔著)於纖維基材2,進而使樹脂層3含浸於纖維基材2內部。又,於第2片材部5b,亦經由金屬層12使第2樹脂層4之中間部被加熱。藉此加熱,使第2樹脂層4之中間部熔融,並壓黏於纖維基材2,進而使樹脂層4含浸於纖維基材2內部。 Further, as described above, the upper pressing member 91 and the lower pressing member 93 are each in a heated state. Thereby, the intermediate portion of the first resin layer 3 is heated in the first sheet portion 5a via the metal layer 12. By this heating, the intermediate portion of the first resin layer 3 is melted, pressure-bonded (fused) to the fiber base material 2, and the resin layer 3 is further impregnated into the fiber base material 2. Further, in the second sheet portion 5b, the intermediate portion of the second resin layer 4 is also heated via the metal layer 12. By heating, the intermediate portion of the second resin layer 4 is melted, and the fiber substrate 2 is pressure-bonded, and the resin layer 4 is further impregnated into the fiber base material 2.
積層片製造裝置30中,係此種加壓手段9之作動所造成之壓黏、與上述減壓手段8之作動所造成之壓黏合作,而強化纖維基材2與第1樹脂層3之接合及纖維基材2與第2樹脂層4之接合。藉此,例如不論第1樹脂層3或第2樹脂層4之厚度或組成,均可製造使該各樹脂層確實且牢固地接合至纖維基材2的積層片40。又,所製造之積層片40係於纖維基材2中分別含浸了各樹脂層之一部分的圖8所示者。 In the laminated sheet manufacturing apparatus 30, the pressure bonding by the action of the pressing means 9 and the pressure bonding by the operation of the decompressing means 8 are performed, and the reinforcing fiber substrate 2 and the first resin layer 3 are bonded. Bonding and joining of the fibrous base material 2 and the second resin layer 4. Thereby, for example, regardless of the thickness or composition of the first resin layer 3 or the second resin layer 4, the laminated sheet 40 in which the respective resin layers are reliably and firmly bonded to the fiber base material 2 can be produced. Further, the laminated sheet 40 to be produced is one in which the fiber base material 2 is impregnated with one of the resin layers, as shown in Fig. 8 .
另外,本實施形態中,係於藉減壓手段8使腔室7經減壓的狀態下,使樹脂層3、4含浸於纖維基材2中。藉此,於含浸時,成為纖維基材2內部之氣體被減壓手段8所吸引的狀態。因此,可抑制殘存於纖維基材2中之氣體成為氣泡的情形。藉此,可製造減低了空隙的預浸體。 In the present embodiment, the resin layers 3 and 4 are impregnated into the fibrous base material 2 in a state where the chamber 7 is depressurized by the decompression means 8. Thereby, when the impregnation is performed, the gas inside the fiber base material 2 is sucked by the decompression means 8. Therefore, it is possible to suppress the gas remaining in the fiber base material 2 from becoming a bubble. Thereby, a prepreg with reduced voids can be produced.
再者,於藉減壓手段8使腔室7經減壓的狀態下,使樹脂層3、4含浸於纖維基材2中。換言之,由於在藉減壓手段吸引纖維基材2內部之氣體的狀態下,使樹脂層含浸,故可提高樹脂層對纖維基材2的含浸性。 Further, the resin layers 3 and 4 are impregnated into the fibrous base material 2 by decompressing the chamber 7 by the decompression means 8. In other words, since the resin layer is impregnated in a state where the gas inside the fiber base material 2 is sucked by the decompression means, the impregnation property of the resin layer to the fiber base material 2 can be improved.
尚且,加壓手段9、加熱手段95之作動條件、亦即加壓時間、加熱時間、加熱溫度,係分別視纖維基材2、第1樹脂層3、第2樹脂層4之各構成材料或厚度等而異,作為加壓時間,較佳為例如5~180秒、更佳10~120秒。又,作為加熱時間,較佳為例如5~180秒、更佳10~120秒。又,作為加熱溫度,較佳為例如60~150度、更佳80~130度。 In addition, the operating conditions of the pressurizing means 9 and the heating means 95, that is, the pressurizing time, the heating time, and the heating temperature are respectively considered as constituent materials of the fiber base material 2, the first resin layer 3, and the second resin layer 4, or The thickness is different, and as the pressurizing time, it is preferably, for example, 5 to 180 seconds, more preferably 10 to 120 seconds. Further, the heating time is preferably, for example, 5 to 180 seconds, more preferably 10 to 120 seconds. Further, the heating temperature is preferably, for example, 60 to 150 degrees, more preferably 80 to 130 degrees.
另外,作為壓力,較佳為例如0.1~3.0MPa、更佳0.5~1.5MPa。 Further, the pressure is preferably, for example, 0.1 to 3.0 MPa, more preferably 0.5 to 1.5 MPa.
接著,如圖5所示,停止減壓手段8之作動並解放大氣後,使上側按壓構件91移動至上方,並使下側按壓構件93移動至下方。使上側構造體71與下側構造體72離間,腔室7成為開狀態。 Next, as shown in FIG. 5, after the operation of the decompression means 8 is stopped and the atmosphere is released, the upper pressing member 91 is moved upward, and the lower pressing member 93 is moved downward. The upper side structure 71 and the lower side structure body 72 are separated, and the chamber 7 is opened.
其次,如圖6所示,使搬送手段6作動,將積層片40由腔室7之出口74送出。與此連動,而於腔室7中插入尚未被接合的纖維基材2與第1片材部5a與第2片材部5b。 Next, as shown in FIG. 6, the conveying means 6 is actuated, and the laminated sheet 40 is sent out from the outlet 74 of the chamber 7. In conjunction with this, the fiber base material 2 which has not been joined, and the first sheet portion 5a and the second sheet portion 5b are inserted into the chamber 7.
於此,由腔室7之出口74,係於大氣壓下依序送出纖維基材2與第1片材部5a與第2片材部5b的積層體。此時,使露出部21屈曲,折疊積層片40,並予以回收。 Here, the fiber substrate 2 and the laminate of the first sheet portion 5a and the second sheet portion 5b are sequentially fed from the outlet 74 of the chamber 7 under atmospheric pressure. At this time, the exposed portion 21 is flexed, and the laminated sheet 40 is folded and recovered.
然後,由腔室7之出口74被送出之積層片40,係藉未圖示之步驟,於纖維基材2之露出部21被切斷。藉此,得到預浸體1。 Then, the laminated sheet 40 sent out from the outlet 74 of the chamber 7 is cut at the exposed portion 21 of the fibrous base material 2 by a step (not shown). Thereby, the prepreg 1 was obtained.
尚且,不將由腔室7之出口74所送出的積層片40折疊,可立即切斷露出部21。 Further, the laminated sheet 40 sent out from the outlet 74 of the chamber 7 is not folded, and the exposed portion 21 can be immediately cut.
另外,於積層片製造裝置30中,在檢測露出部21之位置,露出部21位於既定位置時,停止搬送手段6之驅動。 Further, in the laminated sheet manufacturing apparatus 30, when the exposed portion 21 is positioned at the position where the exposed portion 21 is detected, the driving of the transporting means 6 is stopped.
可將露出部21用於纖維基材2與第1片材部5a與第2片材部5b相對於腔室7的定位。藉此,可如圖1所示般使構成1個預浸體1的纖維基材2、第1片材部5a、第2片材部5b確實位於腔室7內,若進行其後之壓黏,則可確實得到預浸體1。 The exposed portion 21 can be used for positioning the fiber base material 2 and the first sheet portion 5a and the second sheet portion 5b with respect to the chamber 7. As a result, as shown in FIG. 1, the fiber base material 2, the first sheet portion 5a, and the second sheet portion 5b constituting one prepreg 1 can be surely positioned in the chamber 7, and if the pressure is thereafter pressed If it is sticky, the prepreg 1 can be obtained.
再者,本實施形態中,係將長尺狀之纖維基材2送入腔室7內。藉由如此先將纖維基材2作成長尺狀,則可抑制纖維基材2之切斷屑等的產生。 Further, in the present embodiment, the long-sized fibrous base material 2 is fed into the chamber 7. By first making the fiber base material 2 into a long shape, the generation of cutting chips and the like of the fiber base material 2 can be suppressed.
另外,本實施形態中,片材5A(5B)係事先被裁斷而成為複數之片材部5a。而且,將該片材部5a(5b)離間配置於纖維基材2上。如此,在得到預浸體1時,則不需裁斷片材部5a(5b)。 Further, in the present embodiment, the sheet 5A (5B) is cut in advance to form a plurality of sheet portions 5a. Further, the sheet portion 5a (5b) is disposed on the fiber base material 2 with a detachment therebetween. Thus, when the prepreg 1 is obtained, it is not necessary to cut the sheet portion 5a (5b).
以下,參照圖7說明本發明之積層片製造裝置、積層片之製造方法及積層片的第2實施形態,但以與上述實施形態間 之相異點為中心進行說明,同樣事項則省略其說明。 Hereinafter, a second embodiment of a laminated sheet manufacturing apparatus, a laminated sheet manufacturing method, and a laminated sheet according to the present invention will be described with reference to Fig. 7, but with the above embodiment The difference is described centering, and the description of the same matters is omitted.
本實施形態係除了上述第1實施形態中各密封構件中分別內藏之加熱器的配置位置不同之外,其餘與上述第1實施形態相同。 This embodiment is the same as the above-described first embodiment except that the arrangement positions of the heaters included in the respective sealing members in the first embodiment are different.
如圖7所示,於上側構造體71之內側,係被2個加熱器78所支撐著。與此同樣地,於下側構造體72內側,亦被2個加熱器78所支撐著。以下,以上側構造體71側之加熱器78為代表進行說明。 As shown in FIG. 7, the inside of the upper structure 71 is supported by two heaters 78. Similarly to this, the inside of the lower structure 72 is also supported by the two heaters 78. Hereinafter, the heater 78 on the side of the side structure 71 will be described as a representative.
2個加熱器78中其中一加熱器78,係於上側構造體71內,配置於第1片材部5a之搬送方向前方(圖7中之右側),另一加熱器78被配置於第1片材部5a之搬送方向後方(圖7中之左側)。藉此,可確實使第1片材部5a被加熱。 One of the two heaters 78 is disposed in the upper structure 71, and is disposed in front of the transport direction of the first sheet portion 5a (on the right side in FIG. 7), and the other heater 78 is disposed in the first The sheet portion 5a is disposed behind the conveyance direction (the left side in Fig. 7). Thereby, the first sheet portion 5a can be surely heated.
以上,針對圖示之實施形態說明了本發明之積層片製造裝置、積層片之製造方法及積層片,但本發明並不限定於此,積層片製造裝置及構成積層片之各部可與能發揮相同機能的任意構成者置換。又,亦可附加任意之構成物。 Hereinabove, the laminated sheet manufacturing apparatus, the laminated sheet manufacturing method, and the laminated sheet of the present invention have been described with reference to the embodiments shown in the drawings. However, the present invention is not limited thereto, and the laminated sheet manufacturing apparatus and the components constituting the laminated sheet can be utilized. Any component of the same function is replaced. Further, any constituent may be added.
另外,本發明之積層片製造裝置、積層片之製造方法及積層片,亦可為將上述各實施形態中之任意2個以上構成(特徵)組合者。 In addition, the laminated sheet manufacturing apparatus, the laminated sheet manufacturing method, and the laminated sheet of the present invention may be a combination of any two or more of the above-described respective embodiments.
另外,積層片雖於圖8所示之構成中,在纖維基材之兩面分別接合了樹脂層者,但並不限定於此,亦可僅於纖維基材之單面上接合樹脂層。此種構成之積層片亦可藉由積層片製 造裝置進行製造。 Further, in the configuration shown in FIG. 8, the laminated sheet is bonded to each other on both surfaces of the fibrous base material. However, the laminated layer is not limited thereto, and the resin layer may be bonded only to one surface of the fibrous base material. The laminated sheet of such a configuration can also be formed by laminating sheets Manufacturing equipment for manufacturing.
另外,積層片雖於圖8所示之構成中,於纖維基材分別含浸了第1樹脂組成物及第2樹脂組成物,但並不限定於此,亦可例如為下述者。第1個例子係涵括纖維基材之厚度方向整體含浸第1樹脂組成物,並未含浸第2樹脂組成物的積層片。第2個例子係涵括纖維基材之厚度方向整體含浸第2樹脂組成物,未含浸第1樹脂組成物的積層片。第3個例子係於纖維基材之厚度方向的一部份含浸第1樹脂組成物,未含浸第2樹脂組成物的積層片。第4個例子係於纖維基材之厚度方向之一部分含浸第2樹脂組成物,未含浸第1樹脂組成物的積層片。以上4個例子之積層片中,第1樹脂組成物與第2樹脂組成物係組成可彼此相異,或組成可彼此相同。而且,此種構成之積層片亦可藉由積層片製造裝置進行製造。 In the configuration shown in FIG. 8, the laminated sheet is impregnated with the first resin composition and the second resin composition in the fiber base material, but the present invention is not limited thereto, and may be, for example, the following. The first example is a laminated sheet in which the first resin composition is impregnated as a whole in the thickness direction of the fiber base material, and the second resin composition is not impregnated. The second example is a laminated sheet in which the second resin composition is impregnated as a whole in the thickness direction of the fiber base material, and the first resin composition is not impregnated. The third example is a laminated sheet in which a part of the thickness direction of the fiber substrate is impregnated with the first resin composition and the second resin composition is not impregnated. In the fourth example, the second resin composition is impregnated in one of the thickness directions of the fibrous base material, and the laminated sheet of the first resin composition is not impregnated. In the laminated sheets of the above four examples, the composition of the first resin composition and the second resin composition may be different from each other, or the compositions may be identical to each other. Further, the laminated sheet of such a configuration can also be produced by a laminated sheet manufacturing apparatus.
再者,上述各實施形態中,雖製造了纖維基材2與樹脂層的積層片,但並不限定於此,例如亦可於樹脂層之至少一面上積層其他樹脂層而製造積層片。再者,亦可於預浸體之至少一面上,積層樹脂層或其他預浸體而製造積層片。此時,可得到使用作為電路基板中所使用之增建材的積層片。 In the above-described embodiments, the laminated sheet of the fiber base material 2 and the resin layer is produced. However, the laminated sheet is not limited thereto. For example, another resin layer may be laminated on at least one surface of the resin layer to produce a laminated sheet. Further, a laminate sheet may be formed by laminating a resin layer or other prepreg on at least one side of the prepreg. At this time, a laminated sheet using the building material used as a circuit board can be obtained.
另外,於上述實施形態中,雖於纖維基材2之一面側上積層第1片材5A、並於另一面側上積層了第2片材5B,但亦可僅於纖維基材2之一面側積層片材。 Further, in the above-described embodiment, the first sheet 5A is laminated on one surface side of the fiber base material 2, and the second sheet 5B is laminated on the other surface side, but only one side of the fiber base material 2 may be used. Side laminate sheet.
另外,上述實施形態中,雖使用纖維基材作為基材,但亦可使用纖維基材以外之其他多孔質基材。多孔質基材較佳係於內部形成有在與搬送方向呈正交之方向上連通、且在沿著搬送方向之端面上連通的孔。於此種多孔質基材中,可於腔室7內吸引基材內部的氣體。 Further, in the above embodiment, a fibrous base material is used as the base material, and other porous base materials other than the fibrous base material may be used. It is preferable that the porous base material has a hole that communicates in a direction orthogonal to the conveyance direction and communicates with the end surface along the conveyance direction. In such a porous substrate, gas inside the substrate can be attracted in the chamber 7.
本發明係根據以下構成者。 The present invention is based on the following constituents.
(1)一種積層片之製造裝置,係將於一面側具有由固形或半固形之樹脂組成物所構成之樹脂層的長尺型薄板狀支撐體的上述樹脂層,接合於長尺型薄板狀之基材之單面或兩面以製造積層片者;其具備有:依上述基材與上述樹脂層相對向之對向狀態,將上述支撐體與上述基材沿著其長度方向進行搬送的搬送手段;藉由上述搬送手段所搬送之上述支撐體與上述基材依維持上述相對向狀態之下所通過的腔室;對上述腔室內進行減壓的減壓手段;與於上述腔室內,對上述相對向狀態之上述支撐體與上述基材一括性地於其厚度方向上進行加壓與加熱的加壓/加熱手段;於上述腔室內,使由上述搬送手段所進行之上述支撐體與上述基材的搬送暫時停止,於其停止狀態下,一邊藉上述減壓手段對上述腔室內進行減壓,一邊藉上述加壓/加熱手段對上述相對向狀態之上述支撐體與上述基材進行加壓/加 熱,而將上述樹脂層與上述基材壓黏。 (1) A manufacturing apparatus for a laminated sheet, which is a resin sheet having a long-length thin plate-shaped support body having a resin layer composed of a solid or semi-solid resin composition on one side, and joined to a long-length thin plate A laminated sheet is produced on one or both sides of the substrate; and the substrate and the substrate are opposed to each other, and the support and the substrate are transported along the longitudinal direction thereof. a means for maintaining the chamber through which the support body and the base material are conveyed by the transport means while maintaining the relative state; and a pressure reducing means for decompressing the chamber; and in the chamber a pressing/heating means for pressurizing and heating the support body in the opposing state and the base material in the thickness direction thereof; and the support body by the transport means in the chamber and the above The transfer of the substrate is temporarily stopped, and in the stopped state, the chamber is depressurized by the decompression means, and the above-mentioned relative state is applied by the pressurization/heating means. Pressurizing the support and the substrate / plus Heat, and the above resin layer is pressure-bonded to the above substrate.
(2)如(1)之積層片之製造裝置,其中,在上述加壓/加熱手段所進行之加壓前,開始上述減壓手段所進行的減壓。 (2) The apparatus for manufacturing a laminated sheet according to (1), wherein the pressure reduction by the pressure reducing means is started before the pressurization by the pressurizing/heating means.
(3)如(1)或(2)之積層片之製造裝置,其中,上述支撐體係斷續地供給至上述腔室內,上述基材係連續地供給至上述腔室內。 (3) The apparatus for manufacturing a laminated sheet according to (1) or (2), wherein the support system is intermittently supplied into the chamber, and the substrate is continuously supplied into the chamber.
(4)如(3)之積層片之製造裝置,其中,於上述基材上,沿著其長度方向使複數之上述支撐體隔著間隙相鄰接配置,將上述基材之對應於上述間隙的部分,使用作為於上述腔室內使上述支撐體與上述基材之搬送暫時停止時的對上述腔室的定位部。 (4) The apparatus for manufacturing a laminated sheet according to (3), wherein the plurality of support members are adjacently arranged along the longitudinal direction of the substrate, and the substrate corresponds to the gap. The portion to be used as the positioning portion when the transfer of the support body and the substrate is temporarily stopped in the chamber is used.
(5)如(1)至(4)中任一項之積層片之製造裝置,其中,上述加壓/加熱手段係具有:對上述相對向狀態之上述支撐體與上述基材由其一面側進行按壓的上側按壓構件;與由另一面側進行按壓的下側按壓構件。 (5) The apparatus for manufacturing a laminated sheet according to any one of (1) to (4), wherein the pressurizing/heating means includes: the support body and the substrate on the one side of the opposing state The upper pressing member that performs pressing; and the lower pressing member that is pressed by the other surface side.
(6)如(5)之積層片之製造裝置,其中,上述加壓/加熱手段係內藏於上述上側按壓構件及上述下側按壓構件中之至少一按壓構件中,具有經由該一方之按壓構件對上述支撐體進行加熱的加熱器。 (6) The apparatus for manufacturing a laminated sheet according to (5), wherein the pressurizing/heating means is incorporated in at least one of the upper pressing member and the lower pressing member, and has a pressing force via the one of the pressing members A heater that heats the support body by the member.
(7)如(1)至(6)中任一項之積層片之製造裝置,其中,上述加壓/加熱手段係構成為可調整其壓力大小。 (7) The manufacturing apparatus of the laminated sheet according to any one of (1) to (6) wherein the pressure/heating means is configured to adjust the pressure.
(8)如(1)至(7)中任一項之積層片之製造裝置,其中,上述腔 室係具有:送入上述支撐體與上述基材的入口;與將由該入口被送入之上述支撐體與上述基材送出的出口;上述入口及上述出口係分別配置有密黏於上述支撐體或上述基材而維持上述腔室內之氣密性的密封構件。 (8) The apparatus for manufacturing a laminated sheet according to any one of (1) to (7), wherein the cavity The chamber has an inlet for feeding the support and the substrate, an outlet for feeding the support fed from the inlet to the substrate, and the inlet and the outlet are respectively adhered to the support Or a sealing member that maintains the airtightness in the chamber in the above substrate.
(9)如(8)之積層片之製造裝置,其中,上述各密封構件係分別構成為可對上述支撐體或上述基材進行加熱,具有作為上述加壓/加熱手段之一部分的機能。 (9) The apparatus for manufacturing a laminated sheet according to (8), wherein each of the sealing members is configured to be capable of heating the support or the substrate, and has a function as a part of the pressurizing/heating means.
(10)如(1)至(9)中任一項之積層片之製造裝置,其中,上述腔室係由彼此接近/離間之2個構造體所構成。 (10) The manufacturing apparatus of the laminated sheet according to any one of (1) to (9) wherein the chamber is composed of two structures close to each other.
(11)如(1)至(10)中任一項之積層片之製造裝置,其中,上述減壓手段係具有:連通至上述腔室內的管;與經由該管而與上述腔室連接的泵。 (11) The apparatus for manufacturing a laminated sheet according to any one of (1) to (10), wherein the pressure reducing means has a tube that communicates with the chamber; and is connected to the chamber via the tube. Pump.
(12)一種積層片之製造方法,係使用上述(1)至(11)中任一項之積層片之製造裝置製造上述積層片。 (12) A method for producing a laminated sheet, which is produced by using the apparatus for producing a laminated sheet according to any one of the above (1) to (11).
本申請案係主張以2011年3月31日所申請之日本專利申請案2011-080363及2012年3月22日所申請之日本專利申請案2012-065031為基礎的優先權,將其揭示內容全部取用於此。 The present application claims priority based on Japanese Patent Application No. 2011-080363, filed on March 31, 2011, and Japanese Patent Application No. 2012-065031, filed on March 22, 2012. Take this for this.
1‧‧‧預浸體 1‧‧‧Prepreg
2‧‧‧纖維基材 2‧‧‧Fiber substrate
3‧‧‧第1樹脂層 3‧‧‧1st resin layer
4‧‧‧第2樹脂層 4‧‧‧2nd resin layer
5a‧‧‧第1片材部 5a‧‧‧1st sheet
5b‧‧‧第2片材部 5b‧‧‧2nd Sheet
5A‧‧‧第1片材 5A‧‧‧1st sheet
5B‧‧‧第2片材 5B‧‧‧2nd sheet
6‧‧‧搬送手段 6‧‧‧Transportation means
7‧‧‧腔室 7‧‧‧ chamber
8‧‧‧減壓手段 8‧‧‧Decompression
9‧‧‧加壓手段 9‧‧‧pressure means
12‧‧‧金屬層 12‧‧‧metal layer
20‧‧‧邊界 20‧‧‧ border
21‧‧‧露出部 21‧‧‧Exposed Department
30‧‧‧積層片製造裝置 30‧‧‧Laminated sheet manufacturing equipment
31‧‧‧第1含浸部 31‧‧‧1st impregnation
32‧‧‧第1非含浸部 32‧‧‧1st Non-Immersion Department
40‧‧‧積層片 40‧‧‧Layered film
41‧‧‧第2含浸部 41‧‧‧2nd Impregnation Department
42‧‧‧第2非含浸部 42‧‧‧2nd Non-Immersion Department
51、52‧‧‧間隙 51, 52‧ ‧ gap
71‧‧‧上側構造體 71‧‧‧Upside structure
72‧‧‧下側構造體 72‧‧‧lower structure
73‧‧‧入口 73‧‧‧ Entrance
74‧‧‧出口 74‧‧‧Export
75、76‧‧‧密封構件 75, 76‧‧‧ Sealing members
77‧‧‧空間 77‧‧‧ Space
78‧‧‧加熱器 78‧‧‧heater
81‧‧‧泵 81‧‧‧ pump
82‧‧‧連接管 82‧‧‧Connecting tube
90‧‧‧凸部 90‧‧‧ convex
91‧‧‧上側按壓構件 91‧‧‧Upper pressing member
92、94‧‧‧汽缸 92, 94‧‧ ‧ cylinder
93‧‧‧下側按壓構件 93‧‧‧Bottom pressing member
95‧‧‧加熱手段 95‧‧‧heating means
96‧‧‧檢測手段 96‧‧‧Detection means
97‧‧‧判別手段 97‧‧‧Discrimination means
98‧‧‧控制手段 98‧‧‧Control means
711‧‧‧頂板 711‧‧‧ top board
712、712A、712B、722、722A、722B‧‧‧側壁 712, 712A, 712B, 722, 722A, 722B‧‧‧ side walls
721‧‧‧底板 721‧‧‧floor
921、941‧‧‧桿 921, 941‧‧‧ pole
E‧‧‧彈性構件 E‧‧‧elastic components
G‧‧‧空氣 G‧‧‧Air
圖1為依序顯示本發明之積層片製造裝置(第1實施形態)之作動狀態的概略剖面側面圖。 Fig. 1 is a schematic cross-sectional side view showing an operation state of the laminated sheet manufacturing apparatus (first embodiment) of the present invention in order.
圖2為依序顯示本發明之積層片製造裝置(第1實施形態) 之作動狀態的概略剖面側面圖。 Fig. 2 is a view showing the apparatus for manufacturing a laminated sheet of the present invention in order (first embodiment) A schematic cross-sectional side view of the actuation state.
圖3為依序顯示本發明之積層片製造裝置(第1實施形態)之作動狀態的概略剖面側面圖。 Fig. 3 is a schematic cross-sectional side view showing an operation state of the laminated sheet manufacturing apparatus (first embodiment) of the present invention in order.
圖4為依序顯示本發明之積層片製造裝置(第1實施形態)之作動狀態的概略剖面側面圖。 Fig. 4 is a schematic cross-sectional side view showing an operation state of the laminated sheet manufacturing apparatus (first embodiment) of the present invention in order.
圖5為依序顯示本發明之積層片製造裝置(第1實施形態)之作動狀態的概略剖面側面圖。 Fig. 5 is a schematic cross-sectional side view showing an operation state of the laminated sheet manufacturing apparatus (first embodiment) of the present invention in order.
圖6為依序顯示本發明之積層片製造裝置(第1實施形態)之作動狀態的概略剖面側面圖。 Fig. 6 is a schematic cross-sectional side view showing an operation state of the laminated sheet manufacturing apparatus (first embodiment) of the present invention in order.
圖7為顯示本發明之積層片製造裝置(第2實施形態)的概略剖面側面圖。 Fig. 7 is a schematic cross-sectional side view showing a laminated sheet manufacturing apparatus (second embodiment) of the present invention.
圖8為顯示積層片的剖面圖。 Figure 8 is a cross-sectional view showing a laminated sheet.
圖9為顯示於基材上間歇性配置複數之片材部的狀態的平面圖。 Fig. 9 is a plan view showing a state in which a plurality of sheet portions are intermittently arranged on a substrate.
圖10為圖4之X-X方向的剖面圖。 Figure 10 is a cross-sectional view taken along line X-X of Figure 4;
圖11為沿著纖維基材之長度方向的剖面圖;顯示相對於纖維基材,使片材部離間配置之狀態的剖面圖。 Fig. 11 is a cross-sectional view along the longitudinal direction of the fiber base material; and a cross-sectional view showing a state in which the sheet portions are disposed apart from each other with respect to the fiber base material.
圖12為顯示本發明之積層片製造裝置之變形例的概略剖面側面圖。 Fig. 12 is a schematic cross-sectional side view showing a modification of the laminated sheet manufacturing apparatus of the present invention.
2‧‧‧纖維基材 2‧‧‧Fiber substrate
3‧‧‧第1樹脂層 3‧‧‧1st resin layer
4‧‧‧第2樹脂層 4‧‧‧2nd resin layer
5a‧‧‧第1片材部 5a‧‧‧1st sheet
5b‧‧‧第2片材部 5b‧‧‧2nd Sheet
5A‧‧‧第1片材 5A‧‧‧1st sheet
5B‧‧‧第2片材 5B‧‧‧2nd sheet
6‧‧‧搬送手段 6‧‧‧Transportation means
7‧‧‧腔室 7‧‧‧ chamber
8‧‧‧減壓手段 8‧‧‧Decompression
9‧‧‧加壓手段 9‧‧‧pressure means
12‧‧‧金屬層 12‧‧‧metal layer
21‧‧‧露出部 21‧‧‧Exposed Department
30‧‧‧積層片製造裝置 30‧‧‧Laminated sheet manufacturing equipment
51‧‧‧間隙 51‧‧‧ gap
52‧‧‧間隙 52‧‧‧ gap
71‧‧‧上側構造體 71‧‧‧Upside structure
72‧‧‧下側構造體 72‧‧‧lower structure
73‧‧‧入口 73‧‧‧ Entrance
74‧‧‧出口 74‧‧‧Export
75‧‧‧密封構件 75‧‧‧ Sealing members
76‧‧‧密封構件 76‧‧‧ Sealing members
77‧‧‧空間 77‧‧‧ Space
78‧‧‧加熱器 78‧‧‧heater
81‧‧‧泵 81‧‧‧ pump
82‧‧‧連接管 82‧‧‧Connecting tube
91‧‧‧上側按壓構件 91‧‧‧Upper pressing member
92‧‧‧汽缸 92‧‧‧ cylinder
93‧‧‧下側按壓構件 93‧‧‧Bottom pressing member
94‧‧‧汽缸 94‧‧‧ cylinder
95‧‧‧加熱手段 95‧‧‧heating means
711‧‧‧頂板 711‧‧‧ top board
712‧‧‧側壁 712‧‧‧ side wall
712A‧‧‧側壁 712A‧‧‧ sidewall
712B‧‧‧側壁 712B‧‧‧ Sidewall
722‧‧‧側壁 722‧‧‧ side wall
722A‧‧‧側壁 722A‧‧‧ sidewall
722B‧‧‧側壁 722B‧‧‧ side wall
921‧‧‧桿 921‧‧‧ rod
941‧‧‧桿 941‧‧‧ rod
G‧‧‧空氣 G‧‧‧Air
Claims (13)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011080363 | 2011-03-31 | ||
JP2012065031A JP5821733B2 (en) | 2011-03-31 | 2012-03-22 | Laminated sheet manufacturing apparatus, laminated sheet manufacturing method |
Publications (2)
Publication Number | Publication Date |
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TW201302474A TW201302474A (en) | 2013-01-16 |
TWI526312B true TWI526312B (en) | 2016-03-21 |
Family
ID=46930159
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101111298A TWI526312B (en) | 2011-03-31 | 2012-03-30 | Apparatus and process for producing laminated sheet |
Country Status (4)
Country | Link |
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JP (1) | JP5821733B2 (en) |
KR (1) | KR20140022041A (en) |
TW (1) | TWI526312B (en) |
WO (1) | WO2012132383A1 (en) |
Families Citing this family (4)
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WO2016187884A1 (en) * | 2015-05-28 | 2016-12-01 | 华为技术有限公司 | Stamping device of electronic element |
CN107310203B (en) * | 2017-06-30 | 2018-05-01 | 南京恒丰包装材料有限公司 | A kind of board machine |
DE102018101470A1 (en) * | 2018-01-23 | 2019-07-25 | Robert Bürkle GmbH | Laminating apparatus and method for laminating at least one layer stack |
CN112428656A (en) * | 2020-11-30 | 2021-03-02 | 枣庄佳莱堡新材料科技有限公司 | Wear-resisting type melamine impregnated paper presses and pastes apparatus for producing |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0698679B2 (en) * | 1987-03-26 | 1994-12-07 | 積水化成品工業株式会社 | Molding method of container |
JP2003181697A (en) * | 2001-12-17 | 2003-07-02 | Sanee Giken Kk | Vacuum press apparatus |
JP4390056B2 (en) * | 2004-03-31 | 2009-12-24 | 三菱瓦斯化学株式会社 | B-stage resin composition sheet and method for producing copper-clad laminate using the same |
JP2006248118A (en) * | 2005-03-11 | 2006-09-21 | Fuji Xerox Co Ltd | Manufacturing apparatus of plastic sheet and its manufacturing method |
JP5470725B2 (en) * | 2007-04-10 | 2014-04-16 | 日立化成株式会社 | Metal foil-clad laminate and printed wiring board |
-
2012
- 2012-03-22 JP JP2012065031A patent/JP5821733B2/en not_active Expired - Fee Related
- 2012-03-26 WO PCT/JP2012/002070 patent/WO2012132383A1/en active Application Filing
- 2012-03-26 KR KR1020137028609A patent/KR20140022041A/en not_active Application Discontinuation
- 2012-03-30 TW TW101111298A patent/TWI526312B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
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JP5821733B2 (en) | 2015-11-24 |
KR20140022041A (en) | 2014-02-21 |
JP2012214033A (en) | 2012-11-08 |
WO2012132383A1 (en) | 2012-10-04 |
TW201302474A (en) | 2013-01-16 |
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