TWI523262B - 具多單元陣列之半導體發光裝置及製造其之方法 - Google Patents

具多單元陣列之半導體發光裝置及製造其之方法 Download PDF

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Publication number
TWI523262B
TWI523262B TW100103015A TW100103015A TWI523262B TW I523262 B TWI523262 B TW I523262B TW 100103015 A TW100103015 A TW 100103015A TW 100103015 A TW100103015 A TW 100103015A TW I523262 B TWI523262 B TW I523262B
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TW
Taiwan
Prior art keywords
light
semiconductor layer
light emitting
emitting device
conductive
Prior art date
Application number
TW100103015A
Other languages
English (en)
Chinese (zh)
Other versions
TW201242079A (en
Inventor
金制遠
張泰盛
禹鍾均
李鍾昊
Original Assignee
三星電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三星電子股份有限公司 filed Critical 三星電子股份有限公司
Publication of TW201242079A publication Critical patent/TW201242079A/zh
Application granted granted Critical
Publication of TWI523262B publication Critical patent/TWI523262B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/24137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73267—Layer and HDI connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92244—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Computer Hardware Design (AREA)
  • Led Devices (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
TW100103015A 2010-02-26 2011-01-27 具多單元陣列之半導體發光裝置及製造其之方法 TWI523262B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20100018259 2010-02-26
KR1020100085707A KR20110098600A (ko) 2010-02-26 2010-09-01 멀티셀 어레이를 갖는 반도체 발광장치 및 이의 제조방법

Publications (2)

Publication Number Publication Date
TW201242079A TW201242079A (en) 2012-10-16
TWI523262B true TWI523262B (zh) 2016-02-21

Family

ID=44952123

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100103015A TWI523262B (zh) 2010-02-26 2011-01-27 具多單元陣列之半導體發光裝置及製造其之方法

Country Status (2)

Country Link
KR (1) KR20110098600A (ko)
TW (1) TWI523262B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102098135B1 (ko) * 2013-07-12 2020-04-08 엘지이노텍 주식회사 발광소자
WO2017073759A1 (ja) * 2015-10-29 2017-05-04 京セラ株式会社 発光素子、受発光素子モジュールおよび光学式センサ
WO2017202331A1 (en) * 2016-05-25 2017-11-30 Chen-Fu Chu Methods of filling organic or inorganic liquid in assembly module
JP7222993B2 (ja) 2017-11-08 2023-02-24 ソウル バイオシス カンパニー リミテッド 複数のピクセルを含むディスプレイ用発光ダイオードユニット及びそれを有する表示装置
KR102628803B1 (ko) * 2018-09-03 2024-01-24 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지
KR102600236B1 (ko) * 2018-03-15 2023-11-09 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 반도체 소자 패키지 및 이를 포함하는 광원장치
US11881542B2 (en) 2020-12-07 2024-01-23 Lumileds Llc Pixelated wavelength-conversion layer

Also Published As

Publication number Publication date
TW201242079A (en) 2012-10-16
KR20110098600A (ko) 2011-09-01

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