TWI518822B - Mounting device - Google Patents
Mounting device Download PDFInfo
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- TWI518822B TWI518822B TW101106136A TW101106136A TWI518822B TW I518822 B TWI518822 B TW I518822B TW 101106136 A TW101106136 A TW 101106136A TW 101106136 A TW101106136 A TW 101106136A TW I518822 B TWI518822 B TW I518822B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Description
本發明關於一種具備有在低溫下處理半導體晶圓等被處理體時，能夠將被處理體冷卻至特定溫度的冷卻機構之載置裝置，更詳細而言，係關於一種可簡化冷卻機構來謀求低成本化之載置裝置。 The present invention relates to a mounting device including a cooling mechanism capable of cooling a target object to a specific temperature when a processed object such as a semiconductor wafer is processed at a low temperature, and more specifically, a cooling mechanism can be simplified. Low cost mounting device.
習知的載置裝置在半導體製造領域中被使用於各種處理裝置。以下，將舉進行半導體晶圓的電氣特性檢測之檢測裝置所使用的載置裝置為例來加以說明。 Conventional mounting devices are used in various processing devices in the field of semiconductor manufacturing. Hereinafter, a mounting device used in a detecting device for detecting electrical characteristics of a semiconductor wafer will be described as an example.
習知的檢測裝置E例如圖4所示，係具備有搬送半導體晶圓W之裝載室L、對從裝載室L搬送而來的半導體晶圓W進行電氣特性檢測之探針室P、以及控制裝置(未圖示)，而構成為在控制裝置的控制下，將半導體晶圓W從裝載室L搬送至探針室P，並於探針室P內進行半導體晶圓W的電氣特性檢測後，再將半導體晶圓W返回原處。 As shown in FIG. 4, the conventional detecting device E includes a loading chamber L that transports the semiconductor wafer W, a probe chamber P that detects electrical characteristics of the semiconductor wafer W that is transported from the loading chamber L, and control. The device (not shown) is configured to transfer the semiconductor wafer W from the loading chamber L to the probe chamber P under the control of the control device, and to perform electrical characteristic detection of the semiconductor wafer W in the probe chamber P. Then return the semiconductor wafer W to its original location.
探針室P如圖4所示，係具備有載置半導體晶圓W且可調節溫度的晶圓夾具1、使晶圓夾具1往X、Y方向移動之XY台座2、配置在透過該XY台座2而移動之晶圓夾具1的上方之探針卡3、以及使探針卡3的複數探針3A與晶圓夾具1上之半導體晶圓W的複數電極焊墊正確地對位之對位機構4。 As shown in FIG. 4, the probe chamber P includes a wafer holder 1 on which a semiconductor wafer W is placed and a temperature-adjustable wafer holder 1, and an XY stage 2 for moving the wafer holder 1 in the X and Y directions. The probe card 3 above the moving wafer holder 1 and the complex probe 3A of the probe card 3 and the plurality of electrode pads of the semiconductor wafer W on the wafer holder 1 are correctly aligned with each other. Position mechanism 4.
又，如圖4所示，探針室P的頭板(head plate)5係可旋轉地配設有測試器的測試頭T，測試頭T與探針卡3係透過效能板(performance-board)(未圖示)而電連接。然後，在例如低溫區域至高溫區域之間將晶圓夾具1上的半導體晶圓W設定為半導體晶圓W的檢測溫度，並透過測試頭T將來自測試器的訊號傳送至探針3A，而進行半導體晶圓W的電氣特性檢測。 Moreover, as shown in FIG. 4, the head plate 5 of the probe chamber P is rotatably provided with the test head T of the tester, and the test head T and the probe card 3 are transmitted through the performance board (performance-board). ) (not shown) and electrically connected. Then, the semiconductor wafer W on the wafer holder 1 is set to the detection temperature of the semiconductor wafer W between, for example, the low temperature region to the high temperature region, and the signal from the tester is transmitted to the probe 3A through the test head T, and Electrical characteristic detection of the semiconductor wafer W is performed.
進行半導體晶圓W的低溫檢測時，一般來說係如圖5所示般地藉由連結至晶圓夾具1之冷卻裝置6來冷卻冷卻液，並透過晶圓夾具1內的冷媒通道來使該冷卻液循環，而將半導體晶圓W冷卻至例如-數10℃的低溫區域。冷卻裝置6有一種例如本案申請人在專利文獻1中所提出的冷卻加熱裝置。該冷卻加熱裝置6例如圖5所示，係具備有供冷卻液儲存之冷卻液槽61、在晶圓夾具1與冷卻液槽61之間冷卻液會透過第1幫浦62A而循環之第1冷卻液循環路徑62、冷卻液槽61的冷卻液會透過第2幫浦63A而循環之第2冷卻液循環路徑63、用以檢測冷卻液槽61內的冷卻液溫度之溫度感測器61A、依據溫度感測器61A的檢測值而作動之溫度調節器64、依據來自溫度調節器64的訊號而作動之熱機關驅動用逆變器(以下簡稱為「逆變器」)65、以及依據來自逆變器65的訊號而驅動之史特林熱機關66(參照圖2)，而構成為藉由史特林熱機關66來加熱或冷卻通過第2冷卻液循環路徑63之冷卻液。 When the low temperature detection of the semiconductor wafer W is performed, generally, as shown in FIG. 5, the cooling liquid is cooled by the cooling device 6 connected to the wafer jig 1, and is passed through the refrigerant passage in the wafer holder 1. The coolant circulates to cool the semiconductor wafer W to a low temperature region of, for example, a few 10 °C. The cooling device 6 has, for example, a cooling and heating device proposed by the applicant of the present application in Patent Document 1. For example, as shown in FIG. 5, the cooling and heating device 6 includes a coolant tank 61 for storing a coolant, and a coolant that passes through the first pump 62A between the wafer holder 1 and the coolant tank 61. The coolant circulation path 62, the coolant liquid of the coolant tank 61, the second coolant circulation path 63 that circulates through the second pump 63A, and the temperature sensor 61A for detecting the temperature of the coolant in the coolant tank 61, The temperature regulator 64 that operates based on the detected value of the temperature sensor 61A, the inverter for driving the thermal mechanism (hereinafter simply referred to as "inverter") 65 that operates based on the signal from the temperature regulator 64, and The Stirling heat engine 66 (see FIG. 2) driven by the signal of the inverter 65 is configured to heat or cool the coolant passing through the second coolant circulation path 63 by the Stirling heat unit 66.
使用冷卻加熱裝置6來冷卻冷卻液時，冷卻液槽61內的冷卻液會因第1幫浦62A的作用而在第1冷卻液循環路徑62與晶圓夾具1之間循環來冷卻晶圓夾具1。在此期間，回到冷卻液槽61的冷卻液溫度會上升。溫度感測器61A會檢測冷卻液槽61內的冷卻液溫度，並將檢測訊號傳送至溫度調節器64。溫度調節器64中會比較預先設定的設定溫度與檢測溫度，並根據其溫度差來驅動逆變器65。逆變器65會根據來自溫度調節器64的指令訊號而以特定頻率驅動史特林熱機關66。史特林熱機關66會使因第2幫浦63A的作用而在第2冷卻液循環路徑63循環之冷卻液在熱交換器67中冷卻。如此地，圖5所示冷卻加熱裝置6由於未使用閥類而可簡化配管構造，故具有故障較少且可減少消耗電力等優點。 When the cooling liquid is cooled by the cooling and heating device 6, the coolant in the coolant tank 61 is circulated between the first coolant circulation path 62 and the wafer holder 1 by the action of the first pump 62A to cool the wafer holder. 1. During this time, the temperature of the coolant returning to the coolant tank 61 rises. The temperature sensor 61A detects the temperature of the coolant in the coolant tank 61 and transmits the detection signal to the temperature regulator 64. The temperature regulator 64 compares the preset set temperature and the detected temperature, and drives the inverter 65 based on the temperature difference. The inverter 65 drives the Stirling thermal mechanism 66 at a specific frequency in accordance with the command signal from the temperature regulator 64. The Sterling heat engine 66 cools the coolant circulating in the second coolant circulation path 63 by the action of the second pump 63A in the heat exchanger 67. As described above, since the cooling and heating device 6 shown in FIG. 5 can simplify the piping structure without using a valve, there is an advantage that the number of failures is small and power consumption can be reduced.
專利文獻1：日本特開2006-060361 Patent Document 1: Japanese Special Open 2006-060361
然而，若載置裝置使用了圖5所示晶圓夾具1的冷卻加熱裝置6之情況，便必須要有冷卻液槽61、第1，第2冷卻液循環路徑62,63、第1，第2幫浦62A,63A及史特林熱機關66等的設置空間，而使得作為載置裝置所使用的冷卻裝置有省空間化之問題。 However, if the mounting device uses the cooling and heating device 6 of the wafer jig 1 shown in Fig. 5, it is necessary to have the coolant tank 61, the first and second coolant circulation paths 62, 63, and the first, 2 The installation space of the pump 62A, 63A, and the Stirling heat 66, etc., makes the cooling device used as the mounting device have a problem of space saving.
本發明為了解決上述課題，其目的在於提供一種能夠實現用以冷卻載置體上所載置的半導體晶圓等被處理體之冷卻機構的省空間化及低成本化之載置裝置。 In order to solve the above problems, an object of the present invention is to provide a mounting apparatus capable of realizing space saving and cost reduction of a cooling mechanism for cooling a target object such as a semiconductor wafer mounted on a carrier.
本發明之申請專利範圍第1項的載置裝置係具備有為了對被處理體施予特定處理而載置該被處理體之載置體，與透過該載置體來冷卻該被處理體之冷卻機構；其中該冷卻機構係具備有設置在該載置體的下面之熱交換器，與具有從該熱交換器的熱媒介來吸熱的吸熱部之冷卻裝置；該冷卻裝置係透過該吸熱部而固定在該熱交換器。 The mounting device according to the first aspect of the invention is provided with a carrier on which the object to be processed is placed in order to apply a specific treatment to the object to be processed, and to cool the object to be processed by transmitting the carrier. a cooling mechanism, wherein the cooling mechanism is provided with a heat exchanger provided on a lower surface of the carrier, and a cooling device having a heat absorbing portion that absorbs heat from the heat medium of the heat exchanger; the cooling device transmits the heat absorbing portion It is fixed in the heat exchanger.
又，本發明之申請專利範圍第2項的載置裝置係如申請專利範圍第1項之發明，其中該冷卻裝置係構成為史特林冷凍機(Stirling cooler)。 Further, the mounting device of the second aspect of the present invention is the invention of claim 1, wherein the cooling device is configured as a Stirling cooler.
又，本發明之申請專利範圍第3項的載置裝置係如申請專利範圍第1或2項之發明，其中該熱媒介係由金屬所形成。 Further, the mounting device of the third aspect of the present invention is the invention of claim 1 or 2, wherein the heat medium is formed of a metal.
又，本發明之申請專利範圍第4項的載置裝置係如申請專利範圍第1至3項中任一項之發明，其具備有以外周緣部來支撐該載置體之支撐體，與使該支撐體在複數部位處升降之升降機構。 Further, the mounting device of the fourth aspect of the present invention is the invention of any one of claims 1 to 3, which is provided with a support having an outer peripheral portion for supporting the carrier, and The lifting body of the support body is raised and lowered at a plurality of parts.
又，本發明之申請專利範圍第5項的載置裝置係如申請專利範圍第4項之發明，其中該升降機構係構成為壓缸機構。 Further, the mounting device of the fifth aspect of the present invention is the invention of claim 4, wherein the lifting mechanism is configured as a cylinder mechanism.
又，本發明之申請專利範圍第6項的載置裝置係如申請專利範圍第1至5項中任一項之發明，其中被處理體係進行電氣特性檢測之被檢測體。 Further, the mounting device according to the sixth aspect of the invention is the object of any one of the first to fifth aspects of the invention, wherein the object to be processed is subjected to electrical property detection.
依據本發明，便可提供一種能夠實現用以冷卻載置體上所載置的被處理體之冷卻機構的省空間化及低成本化之載置裝置。 According to the present invention, it is possible to provide a mounting apparatus capable of realizing space saving and cost reduction of a cooling mechanism for cooling a target object placed on a carrier.
以下，根據圖1~圖3所示實施型態來加以說明本發明。 Hereinafter, the present invention will be described based on the embodiment shown in Figs. 1 to 3 .
本實施型態之載置裝置10例如圖1所示，係具備有載置半導體晶圓W之載置體(晶圓夾具)11、透過該晶圓夾具11來冷卻半導體晶圓W之冷卻機構12、以外周緣支撐晶圓夾具11之支撐體13、以及在基台14上可升降地支撐支撐體13之升降機構15，而構成為可適用於例如進行半導體晶圓W的電氣特性檢測之檢測裝置。 As shown in FIG. 1, the mounting device 10 of the present embodiment includes a mounting body (wafer jig) 11 on which the semiconductor wafer W is placed, and a cooling mechanism that cools the semiconductor wafer W through the wafer jig 11 12. The support body 13 supporting the wafer holder 11 and the elevating mechanism 15 for supporting the support body 13 on the base 14 at a peripheral periphery are configured to be applicable to, for example, detecting the electrical characteristic of the semiconductor wafer W. Device.
晶圓夾具11的上方係設置有探針卡20。該探針卡20係透過卡片保持部20A而安裝在形成檢測裝置之探針室的上面之頭板30。探針室內係設置有對位機構(未圖示)，而藉由對位機構來進行晶圓夾具11上之半導體晶圓W與探針卡20的探針21之對位。 A probe card 20 is provided above the wafer holder 11. The probe card 20 is attached to the head plate 30 forming the upper surface of the probe chamber of the detecting device through the card holding portion 20A. The probe chamber is provided with a registration mechanism (not shown), and the alignment of the semiconductor wafer W on the wafer holder 11 with the probe 21 of the probe card 20 is performed by the alignment mechanism.
進行半導體晶圓W的低溫檢測時係藉由冷卻機構12來將晶圓夾具11上的半導體晶圓W冷卻至例如-數10℃低溫區域的特定溫度。半導體晶圓W被冷卻的期間，晶圓夾具11上的半導體晶圓W係透過對位機構來進行電極焊墊與探針卡20的探針21之對位，之後，藉由升降機構15來使晶圓夾具11上升，而與半導體晶圓 W的複數電極焊墊及探針卡20的所有探針21一次性地電性接觸，以在特定低溫下進行形成於半導體晶圓W之複數元件的電氣特性檢測。 When the low temperature detection of the semiconductor wafer W is performed, the semiconductor wafer W on the wafer holder 11 is cooled by the cooling mechanism 12 to a specific temperature of, for example, a low temperature region of 10 ° C. While the semiconductor wafer W is being cooled, the semiconductor wafer W on the wafer holder 11 passes through the alignment mechanism to align the electrode pads with the probes 21 of the probe card 20, and then the lifting mechanism 15 Raising the wafer fixture 11 to the semiconductor wafer The plurality of electrode pads of W and all of the probes 21 of the probe card 20 are electrically contacted at one time to perform electrical characteristic detection of a plurality of elements formed on the semiconductor wafer W at a specific low temperature.
然後，冷卻機構12如圖1所示，係具備有設置於晶圓夾具11的下面中央部之熱交換器121，與具有從熱交換器121的側面插入至內部的吸熱部122A之冷卻裝置122，冷卻裝置122係透過吸熱部122A而橫向地固定在熱交換器121的側面。熱交換器121係具有熱媒介121A，與收容熱媒介121A之框體121B。熱媒介121A係由熱傳導性優異的金屬等所形成，框體121B則由絕熱材料所形成。冷卻裝置122如圖1所示，係具有吸熱部122A與連設於吸熱部122A的橫向之驅動部122B，且透過殼體來使吸熱部122A與驅動部122B一體成型。 As shown in FIG. 1, the cooling mechanism 12 includes a heat exchanger 121 provided at a central portion of the lower surface of the wafer holder 11, and a cooling device 122 having a heat absorbing portion 122A inserted from the side surface of the heat exchanger 121 to the inside. The cooling device 122 is laterally fixed to the side surface of the heat exchanger 121 through the heat absorbing portion 122A. The heat exchanger 121 has a heat medium 121A and a frame body 121B that houses the heat medium 121A. The heat medium 121A is formed of a metal having excellent thermal conductivity, and the frame 121B is formed of a heat insulating material. As shown in FIG. 1, the cooling device 122 has a heat absorbing portion 122A and a driving portion 122B that is connected to the lateral direction of the heat absorbing portion 122A, and transmits the heat absorbing portion 122A and the driving portion 122B integrally through the casing.
參照圖2來更進一步詳加說明冷卻裝置122。吸熱部122A如圖2所示，係具有第1壓缸122C、可往復移動地配置在第1壓缸122C內之置換器(displacer)122D、配置在第1壓缸122C的外周面之再生器122E、以及收容該等之第1殼體部122F，第1殼體部122F內係封入有作動氣體。驅動部122B如圖2所示，係具有配置在第1壓缸122C正下方之第2壓缸122G、可往復移動地配置在第2壓缸122G內之活塞122H、使活塞122H往復移動之驅動機構122I、以及收容該等之第2殼體部122J，而構成為在第2殼體部122J內活塞122H會透過驅動機構122I而在第2壓缸122G 內往復移動。第1殼體部122F與第2殼體部122J係作為殼體而一體成型。然後，第1殼體部122F與第2殼體部122J係在第2壓缸122G的外側處被加以區劃。該冷卻裝置12中，第1壓缸122C與第2壓缸122G係形成為相同外徑及相同內徑。此外，由於第1壓缸122C與第2壓缸122G為一體成型，故亦可為於吸熱部122A的下端部形成有連通孔者。 The cooling device 122 will be described in further detail with reference to FIG. As shown in FIG. 2, the heat absorbing portion 122A includes a first cylinder 122C, a displacer 122D that is reciprocally disposed in the first cylinder 122C, and a regenerator disposed on the outer circumferential surface of the first cylinder 122C. 122E and the first case portion 122F that accommodates the first case portion 122F, and the operating gas is sealed in the first case portion 122F. As shown in FIG. 2, the drive unit 122B includes a second cylinder 122G disposed directly below the first cylinder 122C, a piston 122H reciprocally disposed in the second cylinder 122G, and a drive for reciprocating the piston 122H. The mechanism 122I and the second case portion 122J are accommodated, and the piston 122H passes through the drive mechanism 122I and is in the second pressure cylinder 122G in the second case portion 122J. Reciprocating inside. The first case portion 122F and the second case portion 122J are integrally molded as a case. Then, the first case portion 122F and the second case portion 122J are partitioned outside the second pressure cylinder 122G. In the cooling device 12, the first cylinder 122C and the second cylinder 122G are formed to have the same outer diameter and the same inner diameter. Further, since the first cylinder 122C and the second cylinder 122G are integrally formed, a communication hole may be formed in the lower end portion of the heat absorbing portion 122A.
如圖2所示，在殼體內，驅動機構122I會驅動來使活塞122H沿著第2壓缸122G往復移動，並且當其上方的置換器122D在第1壓缸122C內與活塞122H以一定的相位差往復移動的期間，作動氣體會透過再生器122E而往復於箭頭所示方向，則置換器122D的上下便會分別形成膨脹空間及壓縮空間。在膨脹空間處，作動氣體的溫度會降低而從外部吸熱，在壓縮空間處，作動氣體的溫度則會上升而散熱至外部。膨脹空間處係透過吸熱鰭片而吸熱，在壓縮空間處則會透過散熱鰭片而散熱。 As shown in FIG. 2, in the housing, the drive mechanism 122I is driven to reciprocate the piston 122H along the second cylinder 122G, and the displacer 122D above it is fixed in the first cylinder 122C and the piston 122H. While the phase difference reciprocates, the operating gas reciprocates in the direction indicated by the arrow through the regenerator 122E, and the expansion space and the compression space are formed in the upper and lower sides of the displacer 122D, respectively. In the expansion space, the temperature of the operating gas is lowered to absorb heat from the outside, and in the compression space, the temperature of the operating gas rises and dissipates heat to the outside. The expansion space absorbs heat through the heat-absorbing fins, and heat is dissipated through the heat-dissipating fins in the compression space.
於是，當置換器與活塞在第1，第2壓缸內以一定的相位差往復移動的期間，作動氣體便會進行重複壓縮與膨脹之史特林循環，在吸熱部122A的前端部處會進行吸熱，而在置換器122D與活塞122H之間則會散熱。由於吸熱部122A係如圖1所示般地插入至熱交換器121內，因此吸熱部122A便可從熱媒介121A吸熱，且透過熱媒介12A來冷卻晶圓夾具11，進而冷卻晶圓夾具11上的半導體晶圓W。 Then, while the displacer and the piston reciprocate in a certain phase difference in the first and second cylinders, the operating gas undergoes a Sterling cycle in which compression and expansion are repeated, and the front end portion of the heat absorbing portion 122A is Heat absorption is performed, and heat is dissipated between the displacer 122D and the piston 122H. Since the heat absorbing portion 122A is inserted into the heat exchanger 121 as shown in FIG. 1, the heat absorbing portion 122A can absorb heat from the heat medium 121A, and cool the wafer holder 11 through the heat medium 12A, thereby cooling the wafer holder 11 On the semiconductor wafer W.
如此地，由於本實施型態中所使用之冷卻機構12係直接安裝在晶圓夾具11的下面，因此相較於以往般使用冷卻液來冷卻晶圓夾具的情況，便可省略冷卻液槽、冷卻液的循環配管、循環幫浦等，且分別所固有的設置空間變得不需要，而大為簡化作為冷卻機構12之構造，從而可實現成本的大幅削減。 As described above, since the cooling mechanism 12 used in the present embodiment is directly mounted on the lower surface of the wafer jig 11, the coolant tank can be omitted by using the coolant to cool the wafer holder as in the related art. The circulating piping of the cooling liquid, the circulation pump, and the like are not required, and the structure as the cooling mechanism 12 is greatly simplified, so that the cost can be greatly reduced.
圖1中，雖係針對將冷卻裝置122橫向地安裝在熱交換器121的側面之情況加以說明，但亦可如圖3所示般地，從熱交換器121的下面來縱向地安裝冷卻裝置122。此情況下，由於冷卻裝置122與晶圓夾具11的軸心為一致，故當載置裝置10往水平方向移動時便可平衡性良好地移動。又，驅動部122B係藉由升降引導部16而可升降地支撐在冷卻裝置122。 In FIG. 1, the case where the cooling device 122 is laterally attached to the side surface of the heat exchanger 121 will be described. However, as shown in FIG. 3, the cooling device may be longitudinally mounted from the lower surface of the heat exchanger 121. 122. In this case, since the axial direction of the cooling device 122 and the wafer jig 11 coincides, when the mounting device 10 moves in the horizontal direction, it can be moved in a well-balanced manner. Further, the drive unit 122B is supported by the cooling device 122 so as to be movable up and down by the elevation guide portion 16.
接下來，針對動作加以說明。首先，當進行半導體晶圓W的電氣特性檢測時，係預先藉由冷卻機構12來冷卻載置裝置10的晶圓夾具11。此時，冷卻機構12中係如圖2所示般地，在冷卻裝置122的驅動部122B中驅動機構122I會驅動來使活塞122H隨著第2壓缸122G往復移動。當活塞122H往復移動時，在吸熱部122A中置換器122D會與活塞122H以一定的相位差隨著第1壓缸122C往復移動。此時，於置換器122D上側處，作動氣體會膨脹且透過吸熱鰭片而從熱交換器121的熱媒介121A吸熱。另一方面，在置換器122D與活塞122H之間，作動氣體則會壓縮而溫度上升並過散 熱鰭片而散熱至殼體外。藉由以一定的週期重複該史特林循環，則在吸熱部122A處便會從熱交換器121的熱媒介121A慢慢地吸熱來冷卻晶圓夾具11。吸熱部122A所吸收之熱會從置換器122D與活塞122H之間的壓縮空間透過散熱鰭片而散熱至殼體外。 Next, the action will be explained. First, when the electrical characteristics of the semiconductor wafer W are detected, the wafer jig 11 of the mounting device 10 is cooled by the cooling mechanism 12 in advance. At this time, in the cooling mechanism 12, as shown in FIG. 2, the drive mechanism 122I is driven in the drive unit 122B of the cooling device 122 to reciprocate the piston 122H along with the second cylinder 122G. When the piston 122H reciprocates, the displacer 122D reciprocates with the piston 122H in a certain phase difference with the piston 122C in the heat absorbing portion 122A. At this time, at the upper side of the displacer 122D, the operating gas expands and absorbs heat from the heat medium 121A of the heat exchanger 121 through the heat absorbing fins. On the other hand, between the displacer 122D and the piston 122H, the actuating gas is compressed and the temperature rises and is excessively dispersed. Heat fins to dissipate heat outside the casing. By repeating the Stirling cycle at a certain cycle, the heat sink portion 122A slowly absorbs heat from the heat medium 121A of the heat exchanger 121 to cool the wafer jig 11. The heat absorbed by the heat absorbing portion 122A is radiated from the compressed space between the displacer 122D and the piston 122H through the heat radiating fins to the outside of the casing.
如此地透過冷卻機構12來冷卻的期間，將經預對位後的半導體晶圓W載置於晶圓夾具11上。半導體晶圓W係透過對位機構而相對於探針卡20進行對位。之後，升降機構15會驅動來使被冷卻至特定低溫(例如-50℃)的晶圓夾具11上升，來使半導體晶圓W的電極焊墊與探針卡20的所有探針21電性接觸，而進行特定的低溫檢測。在半導體晶圓W的低溫檢測後，半導體晶圓W會從晶圓夾具11被返回原先的地方，而進行後續半導體晶圓W的低溫檢測。 The pre-aligned semiconductor wafer W is placed on the wafer chuck 11 while being cooled by the cooling mechanism 12 as described above. The semiconductor wafer W is aligned with respect to the probe card 20 through the alignment mechanism. Thereafter, the lifting mechanism 15 is driven to raise the wafer holder 11 cooled to a specific low temperature (for example, -50 ° C) to electrically contact the electrode pads of the semiconductor wafer W with all the probes 21 of the probe card 20. And perform specific low temperature detection. After the low temperature detection of the semiconductor wafer W, the semiconductor wafer W is returned from the wafer holder 11 to the original place, and the low temperature detection of the subsequent semiconductor wafer W is performed.
如以上的說明，依據本實施型態，載置裝置10所附設之冷卻機構12係具備有設置在晶圓夾具11的下面之熱交換器121，與具有從熱交換器121的熱媒介121A來吸熱的吸熱部122A之冷卻裝置122，由於冷卻裝置122係透過吸熱部122A而固定在熱交換器121，因此不需要以往般用以冷卻晶圓夾具11之冷卻液、冷卻液槽或冷卻液的循環配管等，而可極為簡化冷卻機構12的構造，來實現作為冷卻機構12之省空間化，進而可實現降低成本。 As described above, according to the present embodiment, the cooling mechanism 12 attached to the mounting device 10 is provided with the heat exchanger 121 provided on the lower surface of the wafer holder 11 and the heat medium 121A having the heat exchanger 121. Since the cooling device 122 of the endothermic heat absorbing portion 122A is fixed to the heat exchanger 121 through the heat absorbing portion 122A, the cooling liquid, the cooling liquid tank or the cooling liquid for cooling the wafer jig 11 is not required. By circulating the piping or the like, the structure of the cooling mechanism 12 can be extremely simplified, and space saving as the cooling mechanism 12 can be realized, and the cost can be reduced.
此外，本發明不限於上述實施型態，可依需要而適當地變更設計。上述實施型態中，雖係針對使用於檢測 裝置之載置裝置加以說明，但亦可廣泛地適用於具有冷卻被處理體功能之載置裝置。又，雖係使用金屬來作為熱交換器121的熱媒介121A，但亦可使用金屬以外的物質。又，作為冷卻裝置122使用的史特林冷凍機不限於上述實施型態，可依需要而適當地變更其構成要素之設計。 Further, the present invention is not limited to the above embodiment, and the design can be appropriately changed as needed. In the above embodiment, although it is used for detection Although the mounting device of the device has been described, it can be widely applied to a mounting device having a function of cooling the object to be processed. Further, although a metal is used as the heat medium 121A of the heat exchanger 121, a substance other than metal may be used. Moreover, the Stirling refrigerator used as the cooling device 122 is not limited to the above-described embodiment, and the design of the constituent elements can be appropriately changed as needed.
W‧‧‧半導體晶圓(被處理體或被檢測體) W‧‧‧Semiconductor wafer (subject or object to be processed)
10‧‧‧載置裝置 10‧‧‧Loading device
11‧‧‧晶圓夾具(載置體) 11‧‧‧ Wafer fixture (mounting body)
12‧‧‧冷卻機構 12‧‧‧Cooling mechanism
13‧‧‧支撐體 13‧‧‧Support
14‧‧‧基台 14‧‧‧Abutment
15‧‧‧升降機構 15‧‧‧ Lifting mechanism
20‧‧‧探針卡 20‧‧‧ Probe Card
20A‧‧‧卡片保持部 20A‧‧‧Card Holder
21‧‧‧探針 21‧‧‧ probe
30‧‧‧頭板 30‧‧‧ head board
121‧‧‧熱交換器 121‧‧‧ heat exchanger
121A‧‧‧熱媒介 121A‧‧‧Hot media
121B‧‧‧框體 121B‧‧‧ frame
122‧‧‧冷卻裝置 122‧‧‧Cooling device
122A‧‧‧吸熱部 122A‧‧‧Heat Absorption Department
122B‧‧‧驅動部 122B‧‧‧Drive Department
122C‧‧‧第1壓缸 122C‧‧‧1st cylinder
122D‧‧‧置換器 122D‧‧‧Displacer
122E‧‧‧再生器 122E‧‧‧ Regenerator
122F‧‧‧第1殼體部 122F‧‧‧1st housing part
122G‧‧‧第2壓缸 122G‧‧‧2nd cylinder
122H‧‧‧活塞 122H‧‧‧Piston
122I‧‧‧驅動機構 122I‧‧‧ drive mechanism
122J‧‧‧第2殼體部 122J‧‧‧2nd housing part
圖1係顯示本發明載置裝置的一實施型態之剖視圖。 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing an embodiment of a mounting apparatus of the present invention.
圖2係顯示圖1所示載置裝置所使用的冷卻裝置之示意圖。 Fig. 2 is a schematic view showing a cooling device used in the mounting device shown in Fig. 1.
圖3係顯示本發明載置裝置的其他實施型態之剖視圖。 Fig. 3 is a cross-sectional view showing another embodiment of the mounting device of the present invention.
圖4係顯示具有習知載置裝置之檢測裝置的內部構造之圖式。 Fig. 4 is a view showing the internal configuration of a detecting device having a conventional mounting device.
圖5係顯示圖4所示檢測裝置所使用的載置裝置一例之結構圖。 Fig. 5 is a structural view showing an example of a mounting device used in the detecting device shown in Fig. 4.
W‧‧‧半導體晶圓(被處理體或被檢測體) W‧‧‧Semiconductor wafer (subject or object to be processed)
10‧‧‧載置裝置 10‧‧‧Loading device
11‧‧‧晶圓夾具(載置體) 11‧‧‧ Wafer fixture (mounting body)
12‧‧‧冷卻機構 12‧‧‧Cooling mechanism
13‧‧‧支撐體 13‧‧‧Support
14‧‧‧基台 14‧‧‧Abutment
15‧‧‧升降機構 15‧‧‧ Lifting mechanism
20‧‧‧探針卡 20‧‧‧ Probe Card
20A‧‧‧卡片保持部 20A‧‧‧Card Holder
21‧‧‧探針 21‧‧‧ probe
30‧‧‧頭板 30‧‧‧ head board
121‧‧‧熱交換器 121‧‧‧ heat exchanger
121A‧‧‧熱媒介 121A‧‧‧Hot media
121B‧‧‧框體 121B‧‧‧ frame
122‧‧‧冷卻裝置 122‧‧‧Cooling device
122A‧‧‧吸熱部 122A‧‧‧Heat Absorption Department
122B‧‧‧驅動部 122B‧‧‧Drive Department
Claims (6)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011041934A JP5715444B2 (en) | 2011-02-28 | 2011-02-28 | Mounting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201308465A TW201308465A (en) | 2013-02-16 |
| TWI518822B true TWI518822B (en) | 2016-01-21 |
Family
ID=46718078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101106136A TWI518822B (en) | 2011-02-28 | 2012-02-24 | Mounting device |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20120216559A1 (en) |
| JP (1) | JP5715444B2 (en) |
| KR (1) | KR101370235B1 (en) |
| CN (1) | CN102683241A (en) |
| TW (1) | TWI518822B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014001528A1 (en) * | 2014-02-07 | 2015-08-13 | Festo Ag & Co. Kg | Axle |
| TWI629490B (en) * | 2017-07-07 | 2018-07-11 | 鴻勁精密股份有限公司 | Electronic component testing equipment with lower-type cold source conveying device |
| US10781771B1 (en) * | 2019-09-22 | 2020-09-22 | Ghasem Kahe | Automatic cooling system for combustion engine |
| CN113808928A (en) * | 2021-08-04 | 2021-12-17 | 北京华卓精科科技股份有限公司 | Laser annealing method and porous sucker with automatic cooling function |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3247715B2 (en) * | 1992-02-29 | 2002-01-21 | アイシン精機株式会社 | Element cooling test equipment |
| JP2606602B2 (en) * | 1993-11-30 | 1997-05-07 | 日本電気株式会社 | Cooling test equipment |
| US5740016A (en) * | 1996-03-29 | 1998-04-14 | Lam Research Corporation | Solid state temperature controlled substrate holder |
| US6070414A (en) * | 1998-04-03 | 2000-06-06 | Raytheon Company | Cryogenic cooler with mechanically-flexible thermal interface |
| ATE251340T1 (en) * | 1999-04-27 | 2003-10-15 | Decker Gmbh & Co Kg Geb | TREATMENT DEVICE FOR SILICON DISCS |
| JP2001284417A (en) * | 2000-03-30 | 2001-10-12 | Nagase & Co Ltd | Low temperature test device provided with probe and prober |
| CN1232791C (en) * | 2000-08-22 | 2005-12-21 | 夏普公司 | Stirling refrigerator |
| CN1208545C (en) * | 2001-07-24 | 2005-06-29 | 三洋电机株式会社 | Starling refrigerator |
| JP3619965B1 (en) * | 2003-07-22 | 2005-02-16 | シャープ株式会社 | Stirling agency |
| JP3773522B1 (en) * | 2005-01-18 | 2006-05-10 | シャープ株式会社 | Stirling agency |
| JP2007240035A (en) * | 2006-03-06 | 2007-09-20 | Tokyo Electron Ltd | Cooling/heating device and mounting device |
| US20070268944A1 (en) * | 2006-05-22 | 2007-11-22 | Frank Voss | Gas purification in an excimer laser using a stirling cycle cooler |
| DE102007055712A1 (en) * | 2007-12-05 | 2009-06-18 | Bruker Biospin Ag | Measuring module for rapid measurement of electrical, electronic and mechanical components at cryogenic temperatures and measuring device with such a measuring module |
| JP5222038B2 (en) * | 2008-06-20 | 2013-06-26 | 東京エレクトロン株式会社 | Probe device |
| JP2011134992A (en) * | 2009-12-25 | 2011-07-07 | Canon Anelva Corp | Temperature control device, and vacuum processing device including the same |
-
2011
- 2011-02-28 JP JP2011041934A patent/JP5715444B2/en not_active Expired - Fee Related
-
2012
- 2012-02-15 CN CN2012100347361A patent/CN102683241A/en active Pending
- 2012-02-23 US US13/403,430 patent/US20120216559A1/en not_active Abandoned
- 2012-02-24 TW TW101106136A patent/TWI518822B/en not_active IP Right Cessation
- 2012-02-27 KR KR1020120019601A patent/KR101370235B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| US20120216559A1 (en) | 2012-08-30 |
| JP2012178527A (en) | 2012-09-13 |
| JP5715444B2 (en) | 2015-05-07 |
| KR20120098503A (en) | 2012-09-05 |
| KR101370235B1 (en) | 2014-03-05 |
| CN102683241A (en) | 2012-09-19 |
| TW201308465A (en) | 2013-02-16 |
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