TWI515424B - Mask cleaning apparatus and the method thereof - Google Patents

Mask cleaning apparatus and the method thereof Download PDF

Info

Publication number
TWI515424B
TWI515424B TW102100583A TW102100583A TWI515424B TW I515424 B TWI515424 B TW I515424B TW 102100583 A TW102100583 A TW 102100583A TW 102100583 A TW102100583 A TW 102100583A TW I515424 B TWI515424 B TW I515424B
Authority
TW
Taiwan
Prior art keywords
laser
metal mask
laser device
stage
disposed
Prior art date
Application number
TW102100583A
Other languages
Chinese (zh)
Other versions
TW201428275A (en
Inventor
李松賢
王永豪
Original Assignee
旭東機械工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 旭東機械工業股份有限公司 filed Critical 旭東機械工業股份有限公司
Priority to TW102100583A priority Critical patent/TWI515424B/en
Publication of TW201428275A publication Critical patent/TW201428275A/en
Application granted granted Critical
Publication of TWI515424B publication Critical patent/TWI515424B/en

Links

Landscapes

  • Cleaning In General (AREA)

Description

一種遮罩潔淨裝置及其方法 Mask cleaning device and method thereof

本發明係關於一種遮罩潔淨裝置,尤其涉及一種可對金屬遮罩之上下表面進行雷射照射的遮罩潔淨裝置及其方法。 The present invention relates to a mask cleaning apparatus, and more particularly to a mask cleaning apparatus and a method thereof for performing laser irradiation on a lower surface of a metal mask.

有機發光二極體或有機電致發光顯示技術,具有低操作電壓、厚度薄、主動發光、全彩且無需背光源及製作容易等優點。隨著消費者對電子產品之高顯示畫面的需求,有機發光二極體顯示器的解析度也逐漸朝向高畫素發展,因此,用來製作有機發光二極體顯示面板之蒸鍍用的金屬遮罩,不可避免地亦須滿足高精度尺寸公差的要求。 Organic light-emitting diode or organic electroluminescence display technology has the advantages of low operating voltage, thin thickness, active illumination, full color, no need for backlight and easy fabrication. With the demand for high display screens of electronic products, the resolution of organic light-emitting diode displays is gradually moving toward high-resolution pixels. Therefore, the metal used for vapor deposition of organic light-emitting diode display panels is used. The cover is inevitably also required to meet the requirements of high-precision dimensional tolerances.

一般來說,金屬遮罩主要是用來製備不同顏色的發光層,其方式是係使用具有特定圖案之多個微細開孔的金屬遮罩來進行蒸鍍,使得有機蒸鍍材料得以穿透過此等微細開孔,而蒸鍍形成於基板上。因此,倘若金屬遮罩的尺寸或定位精度不佳,將造成顯示器不同顏色之發光層錯亂現象,嚴重影響各發光層發光效率不均勻,進而致使顯示面板的解析度降低。由此可知,金屬遮罩的精度對於顯示面板的高解析度具有決定性的影響。 In general, metal masks are mainly used to prepare light-emitting layers of different colors by vapor deposition using a plurality of fine-opened metal masks having a specific pattern, so that the organic vapor-deposited material can penetrate through this. The holes are finely opened, and vapor deposition is formed on the substrate. Therefore, if the size or positioning accuracy of the metal mask is not good, the luminescent layer of different colors of the display will be disordered, which will seriously affect the uneven luminous efficiency of each luminescent layer, thereby causing the resolution of the display panel to be lowered. From this, it can be seen that the accuracy of the metal mask has a decisive influence on the high resolution of the display panel.

然而,在進行蒸鍍過程中,有機材料可能會附著於金屬遮罩上,例如附著於金屬遮罩的表面上,更或者是部份的或全面的堵塞在開孔中。先不用提及開孔全面地被堵塞的情況,單單是只有部份的開孔被堵塞,也會造成開孔面積產生變化,致使原本預定的特定圖案被改變了,如此便造成後續蒸鍍製程之蒸鍍精度會明顯降低。再者,又由於金屬遮罩的製備不易且成本高,因此金屬遮罩不單只使用在一個蒸鍍製程,而是在多 個蒸鍍製程中不斷地被重覆使用,而且在每個蒸鍍製程之間,金屬遮罩必須往返被搬運到欲進行蒸鍍製程的設備腔室中,因此金屬遮罩難免會受到汙染,例如沾附了前次蒸鍍製程的有機材料或者是因搬運過程而附著於金屬遮罩上的纖維、泥土、粉塵等雜質。綜上所述,為了維持蒸鍍精度,在完成一個蒸鍍製程之後,勢必得清洗金屬遮罩,以去除掉附著於其上的有機材料或雜質顆粒。 However, during the evaporation process, the organic material may adhere to the metal mask, for example, to the surface of the metal mask, or may be partially or completely blocked in the opening. It is not necessary to mention that the opening is completely blocked. Only a part of the opening is blocked, which will cause a change in the opening area, so that the original predetermined pattern is changed, thus causing the subsequent evaporation process. The evaporation accuracy will be significantly reduced. Moreover, because the metal mask is not easy to prepare and costly, the metal mask is not only used in one evaporation process, but in many The evaporation process is continuously repeated, and between each evaporation process, the metal mask must be transported back and forth to the equipment chamber where the evaporation process is to be performed, so the metal mask is inevitably contaminated. For example, an organic material that has been adhered to the previous vapor deposition process or an impurity such as fibers, dirt, or dust that adheres to the metal mask due to the conveyance process. In summary, in order to maintain the vapor deposition precision, after completing an evaporation process, it is necessary to clean the metal mask to remove the organic material or impurity particles attached thereto.

傳統的金屬遮罩清洗製程,主要包含了超音波振動以及以非接觸式之雷射照射等方法來清洗金屬遮罩。一般來說,會先將金屬遮罩放置在特定溶劑中,以超音波振動讓有機蒸鍍材料溶解掉,其後晾乾金屬遮罩,接著再以雷射照射金屬遮罩,去除掉殘留的雜質。然而,雖然習知清洗製程包含了多種去除雜質的步驟,但實際應用上還是有些微雜質依舊殘留在金屬遮罩上,無法完全去除乾淨。舉例來說,習知的金屬遮罩之開孔,其剖面結構形狀通常為由上蒸鍍面自相反的下表面漸擴,一旦利用雷射照射開孔中的雜質時,因受限於金屬遮罩開孔的形狀以及雷射機台照射的角度之故,僅能去除部份的雜質,而無法完全將開孔內的雜質去除掉。再者,又因為金屬遮罩是極薄的金屬薄板,即使是極微小的力量作用,也會產生扭曲或變形等而導致損傷金屬薄板,因此該如何在不損害金屬遮罩的情況下,又能完全去除掉金屬遮罩上的有機材料等雜質,為本領域人士亟欲解決的問題。 The traditional metal mask cleaning process mainly includes ultrasonic vibration and cleaning of the metal mask by non-contact laser irradiation. Generally, the metal mask is first placed in a specific solvent, the organic vapor deposition material is dissolved by ultrasonic vibration, and then the metal mask is dried, and then the metal mask is irradiated with a laser to remove the residual Impurities. However, although the conventional cleaning process includes a plurality of steps for removing impurities, in practice, some micro-impurities remain on the metal mask and cannot be completely removed. For example, a conventional metal mask opening has a cross-sectional structure generally formed by the upper vapor-deposited surface diverging from the opposite lower surface. Once the impurity in the opening is irradiated by laser, it is limited by the metal. The shape of the opening of the mask and the angle of the laser irradiation can only remove some of the impurities, and the impurities in the opening cannot be completely removed. Moreover, because the metal mask is a very thin metal sheet, even a very small force can cause distortion or deformation, which can damage the metal sheet, so how to prevent the metal mask from being damaged It can completely remove impurities such as organic materials on the metal mask, which is a problem that people in the field would like to solve.

本發明提供一種能對金屬遮罩之上、下表面進行雷射照射之遮罩潔淨裝置及其方法,其能在不損壞金屬遮罩的情況下,從而解決先前技術中所述的各項問題。 The invention provides a mask cleaning device capable of performing laser irradiation on the upper and lower surfaces of a metal mask and a method thereof, which can solve various problems described in the prior art without damaging the metal mask. .

在本發明之一實施例中,遮罩潔淨裝置包含第一載台、第二載台、雷射支架、第一雷射裝置以及第二雷射裝置。第一載台與一第二載台係以一距離平行設置於一機台且可沿著一第一方向相對該機台移動,以供承載一金屬遮罩 In an embodiment of the invention, the mask cleaning device includes a first stage, a second stage, a laser mount, a first laser device, and a second laser device. The first stage and the second stage are disposed in parallel with the machine at a distance and are movable relative to the machine along a first direction for carrying a metal mask

雷射支架係位於該第一與第二載台之間。第一雷射裝置與第二雷射裝置皆係沿著第二方向且移動設置於雷射支架上。更詳言之,第 一雷射裝置移動設置於雷射支架上,使第一雷射裝置得以沿著第二方向位移。相同地,第二雷射裝置也是移動設置於雷射支架上,而且第二雷射裝置也會沿著第二方向位移。第一雷射裝置可對承載於第一載台的金屬遮罩之上表面照射一雷射光,以去除金屬遮罩上表面的複數個雜質顆粒。而第二雷射裝置可對承載於第二載台上的該金屬遮罩之下表面照射一雷射光,以對殘留在金屬遮罩上的雜質顆粒進行二次清除,例如附著在金屬遮罩下表面的雜質顆粒,或者是在金屬遮罩開孔內尚未完全被清除掉的雜質顆粒。 A laser mount is located between the first and second stages. The first laser device and the second laser device are both disposed in the second direction and are disposed on the laser bracket. More specifically, the first A laser device is moved to the laser mount to displace the first laser device in the second direction. Similarly, the second laser device is also moved to the laser mount and the second laser device is also displaced in the second direction. The first laser device can illuminate a surface of the metal mask carried on the first stage with a laser beam to remove a plurality of impurity particles on the upper surface of the metal mask. The second laser device can irradiate a laser beam on the lower surface of the metal mask carried on the second stage to remove the impurity particles remaining on the metal mask, for example, attached to the metal mask. Impurity particles on the lower surface, or impurity particles that have not been completely removed in the openings of the metal mask.

在本發明之另一實施例中,遮罩潔淨裝置可以僅包含一個雷射裝置以及一旋轉機構。旋轉機構沿著垂直於該第一方向的一第二方向移動設置於該雷射支架上,且該旋轉機構可相對該雷射支架轉動。而雷射裝置固設於該旋轉機構上,使得雷射裝置可相對該雷射支架於一第一雷射照射位置與一第二雷射照射位置之間轉動。如此,當該雷射裝置於該第一雷射照射位置時,可對承載於該第一載台的該金屬遮罩之上表面照射雷射光,當該雷射裝置於該第二雷射照射位置時,可對承載於該第二載台的該金屬遮罩之下表面照射雷射光,以完全去除金屬遮罩上的雜質顆粒。 In another embodiment of the invention, the mask cleaning device may comprise only one laser device and a rotating mechanism. The rotating mechanism is disposed on the laser bracket in a second direction perpendicular to the first direction, and the rotating mechanism is rotatable relative to the laser bracket. The laser device is fixed on the rotating mechanism, so that the laser device can rotate relative to the laser bracket between a first laser irradiation position and a second laser irradiation position. In this manner, when the laser device is in the first laser irradiation position, the surface of the metal mask carried on the first stage may be irradiated with laser light, and when the laser device is irradiated to the second laser In the position, the lower surface of the metal mask carried on the second stage may be irradiated with laser light to completely remove the impurity particles on the metal mask.

或者,在本發明之更一實施例中,遮罩潔淨裝置也可以僅包含一個載台及兩個雷射裝置,利用設置於基座相對兩側面上的第一雷射裝置與第二雷射裝置,來對承載於載台上的金屬遮罩之上下表面進行雷射照射。詳言之,載台沿著第一方向移動設置於基座上,其中載台具有一開口,開口連通基座的缺口,使得承載於其上的金屬遮罩暴露出其上下表面。 Alternatively, in a further embodiment of the present invention, the mask cleaning device may also include only one stage and two laser devices, using the first laser device and the second laser disposed on opposite sides of the base. The device is configured to perform laser irradiation on the upper surface of the metal mask carried on the stage. In detail, the stage is disposed on the base in a first direction, wherein the stage has an opening that communicates with the notch of the base such that the metal mask carried thereon exposes the upper and lower surfaces thereof.

第一雷射裝置係位於該基座之一側,且可相對該基座沿著垂直於該第一方向之一第二方向移動,該第一雷射裝置之雷射光源係面對該基座中的該缺口,使該第一雷射裝置可對承載於該遮罩載台上的該金屬遮罩之該上表面照射雷射光。第二雷射裝置係位於該基座相對該第一雷射裝置之另一側,且可相對該基座沿著該第二方向移動,該第二雷射裝置之雷射光源面對該基座中的該缺口,使該第二雷射裝置可對承載於該載台上的該金屬遮罩的該下表面照射雷射光。 a first laser device is located on one side of the base and movable relative to the base in a second direction perpendicular to the first direction, the laser light source of the first laser device facing the base The gap in the seat allows the first laser device to illuminate the upper surface of the metal mask carried on the mask stage with laser light. a second laser device is located on the other side of the base opposite the first laser device and movable relative to the base in the second direction, the laser light source of the second laser device facing the base The gap in the seat allows the second laser device to illuminate the lower surface of the metal mask carried on the stage with laser light.

本發明更提供一種潔淨金屬遮罩之方法,至少包括以下步驟。放置一金屬遮罩於一第一位置,並使該金屬遮罩的上表面朝向一第一方向。接著,藉由一雷射裝置對該金屬遮罩的上表面照射雷射光。移動該 金屬遮罩至一第二位置,並使該金屬遮罩的下表面朝向一第二方向,其中該第二方向係不同於該第一方向。最後,藉由前述雷射裝置對該金屬遮罩的下表面照射雷射光。 The invention further provides a method of cleaning a metal mask comprising at least the following steps. A metal mask is placed in a first position and the upper surface of the metal mask faces a first direction. Next, the upper surface of the metal mask is irradiated with laser light by a laser device. Move this The metal mask is brought to a second position and the lower surface of the metal mask faces a second direction, wherein the second direction is different from the first direction. Finally, the lower surface of the metal mask is irradiated with laser light by the aforementioned laser device.

本發明更提供一種潔淨金屬遮罩之方法,至少包括以下步驟。放置一金屬遮罩於一載台上,且令該載台上的該金屬遮罩相對之上表面與下表面暴露出來。最後,藉由二雷射裝置分別對該金屬遮罩的上表面及下表面照射雷射光。 The invention further provides a method of cleaning a metal mask comprising at least the following steps. A metal mask is placed on a stage, and the metal mask on the stage is exposed to the upper surface and the lower surface. Finally, the upper surface and the lower surface of the metal mask are respectively irradiated with laser light by means of two laser devices.

本發明更提供一種潔淨金屬遮罩之方法,至少包括以下步驟。放置一金屬遮罩於一第一位置,並使該金屬遮罩的上表面朝向一第一方向。接著,藉由一雷射裝置對該金屬遮罩的上表面照射雷射光。移動該金屬遮罩至一第二位置,並使該金屬遮罩的下表面朝向一第二方向,其中該第二方向係不同於該第一方向。最後,藉由另一雷射裝置對該金屬遮罩的下表面照射雷射光。 The invention further provides a method of cleaning a metal mask comprising at least the following steps. A metal mask is placed in a first position and the upper surface of the metal mask faces a first direction. Next, the upper surface of the metal mask is irradiated with laser light by a laser device. Moving the metal mask to a second position and directing a lower surface of the metal mask toward a second direction, wherein the second direction is different from the first direction. Finally, the lower surface of the metal mask is irradiated with laser light by another laser device.

因此,本發明之遮罩潔淨裝置不僅不會造成金屬遮罩的扭曲或變形等損傷,而且還能同時對金屬遮罩的上表面與下表面分別進行潔淨作業,進而確保金屬遮罩的開孔內、更甚至是上下表面中所附著的雜質都能完全地被去除掉,如此一來,便可大幅提升金屬遮罩的潔淨度。 Therefore, the mask cleaning device of the present invention not only does not cause damage such as distortion or deformation of the metal mask, but also simultaneously cleans the upper surface and the lower surface of the metal mask, thereby ensuring the opening of the metal mask. The impurities attached to the inner and even the upper and lower surfaces can be completely removed, so that the cleanliness of the metal mask can be greatly improved.

至於本發明的其它發明內容與更詳細的技術及功能說明,將揭露於隨後的說明。 Other inventive aspects and more detailed technical and functional descriptions of the present invention are disclosed in the following description.

100‧‧‧基座 100‧‧‧Base

100a‧‧‧上表面 100a‧‧‧ upper surface

101‧‧‧軌道 101‧‧‧ Track

103‧‧‧缺口 103‧‧‧ gap

105‧‧‧載台 105‧‧‧stage

105a‧‧‧開口 105a‧‧‧ openings

200‧‧‧架體 200‧‧‧ frame

202‧‧‧上載台 202‧‧‧ Uploading station

202a‧‧‧開口 202a‧‧‧ openings

204‧‧‧下載台 204‧‧‧Download

206‧‧‧雷射空間 206‧‧‧Laser space

300‧‧‧雷射支架 300‧‧‧Road bracket

301‧‧‧橫桿 301‧‧‧cross bar

301a‧‧‧側面 301a‧‧‧ side

301b‧‧‧側面 301b‧‧‧ side

401‧‧‧雷射裝置、第一雷射裝置 401‧‧ ‧ laser device, first laser device

403‧‧‧第二雷射裝置 403‧‧‧second laser device

405‧‧‧檢查裝置、第一檢查裝置 405‧‧‧Inspection device, first inspection device

407‧‧‧第二檢查裝置 407‧‧‧Second inspection device

500‧‧‧金屬遮罩 500‧‧‧Metal mask

501a‧‧‧上表面 501a‧‧‧ upper surface

501b‧‧‧下表面 501b‧‧‧ lower surface

503‧‧‧開孔 503‧‧‧Opening

507‧‧‧雜質顆粒 507‧‧‧ impurity particles

507a‧‧‧雜質顆粒 507a‧‧‧ impurity particles

601‧‧‧第一雷射裝置 601‧‧‧First laser device

603‧‧‧第一支架 603‧‧‧First bracket

605‧‧‧第一檢查裝置 605‧‧‧First inspection device

701‧‧‧第二雷射裝置 701‧‧‧second laser device

703‧‧‧第二支架 703‧‧‧second bracket

705‧‧‧第二檢查裝置 705‧‧‧Second inspection device

800‧‧‧旋轉機構 800‧‧‧Rotating mechanism

第一圖,為本發明之第一實施例的遮罩潔淨裝置的立體結構示意圖。 The first figure is a schematic perspective view of a mask cleaning device according to a first embodiment of the present invention.

第二圖,為本發明之第一實施例中金屬遮罩的部份放大的剖面結構示意圖。 The second figure is a partially enlarged cross-sectional structural view of a metal mask in the first embodiment of the present invention.

第三圖,為本發明之第一實施例的遮罩潔淨裝置中,將金屬遮罩放置在上載台的立體結構示意圖。 Fig. 3 is a perspective view showing the three-dimensional structure in which a metal mask is placed on an loading table in the mask cleaning device of the first embodiment of the present invention.

第四圖,為本發明之第一實施例中金屬遮罩的部份放大的剖面結構示意圖。 The fourth figure is a partially enlarged cross-sectional structural view of a metal mask in the first embodiment of the present invention.

第五圖,為本發明之第二實施例的遮罩潔淨裝置的立體結構示意圖。 Fig. 5 is a perspective view showing the structure of a mask cleaning device according to a second embodiment of the present invention.

第六圖,為本發明之第二實施例的遮罩潔淨裝置中,轉動雷射裝置並進行第二雷射照射的立體結構示意圖。 Fig. 6 is a perspective view showing a three-dimensional structure in which a laser device is rotated and a second laser is irradiated in the mask cleaning device of the second embodiment of the present invention.

第七圖,為本發明之第三實施例的遮罩潔淨裝置的立體結構示意圖。 Fig. 7 is a perspective view showing the structure of a mask cleaning device according to a third embodiment of the present invention.

第八圖,為本發明之第三實施例中金屬遮罩的部份放大的剖面結構示意圖。 Figure 8 is a partially enlarged cross-sectional structural view showing a metal mask in a third embodiment of the present invention.

以下,參照附圖對用於實施本發明的最佳形態進行說明,但是本發明不限於以下形態。 Hereinafter, the best mode for carrying out the invention will be described with reference to the drawings, but the invention is not limited to the following aspects.

第一實施例 First embodiment

第一圖,為本發明之第一實施例的遮罩潔淨裝置的立體結構示意圖。如第一圖所示,遮罩潔淨裝置包含基座100、架體200與雷射支架300。基座100為一腔室機台的一工作平台。基座100上設置有一組軌道101,且軌道101係沿著第一方向延伸設置於基座100上。在此實施例中第一方向係指X軸方向,但並不用以限定本發明。 The first figure is a schematic perspective view of a mask cleaning device according to a first embodiment of the present invention. As shown in the first figure, the mask cleaning device includes a base 100, a frame 200, and a laser mount 300. The base 100 is a working platform of a chamber machine. A set of rails 101 is disposed on the base 100, and the rails 101 are extended on the base 100 along the first direction. The first direction in this embodiment refers to the X-axis direction, but is not intended to limit the invention.

架體200係跨設於基座100上且可於軌道101上移動,使得架體200可於軌道101上相對基座100移動。遮罩潔淨裝置更包含有一上載台202與下載台204,且上載台202與下載台204係以一距離平行設置,其係分別用以供承載一金屬遮罩。也就是說,如第一圖所示,上載台202與下載台204是與架體200連接固定在一起,且上載台202係設置高於下載台204,使得上載台202與下載台204之間定義出一雷射空間206,用以供後續進行雷射照射。在此實施例中,上載台202係設置於下載台204的正上方,但此並非以限定本發明。再者,上載台202大致上為一矩形的框架台,且具有一開口202a,使得承載於其上的金屬遮罩的下表面能暴露出來。下載台204大致上為一矩形的平台,也可以為一矩形的框架台,並不用以限定本發明。 The frame body 200 is spanned on the base 100 and movable on the track 101 such that the frame body 200 can move relative to the base 100 on the track 101. The mask cleaning device further includes an uploading station 202 and a downloading station 204, and the loading station 202 and the downloading station 204 are disposed in parallel at a distance for respectively carrying a metal mask. That is, as shown in the first figure, the uploading station 202 and the downloading station 204 are fixedly coupled to the frame 200, and the uploading station 202 is disposed higher than the downloading station 204, so that the loading station 202 and the downloading station 204 are disposed. A laser space 206 is defined for subsequent laser illumination. In this embodiment, the uploading station 202 is disposed directly above the download station 204, but this is not intended to limit the invention. Further, the loading table 202 is substantially a rectangular frame stage and has an opening 202a such that the lower surface of the metal mask carried thereon can be exposed. The download station 204 is generally a rectangular platform, and may also be a rectangular frame table, and is not intended to limit the present invention.

請繼續參照第一圖,雷射支架300跨設置於基座100上,且其係沿著垂直於第一方向的第二方向延伸穿過雷射空間206。更具體來說,雷射支架300大致上為ㄇ字形的結構,且雷射支架300具有一橫桿301,橫桿301之長度方向係與Y軸方向平行,並且令橫桿301穿越過上載台202 與下載台204之間的雷射空間206,使部份的橫桿301位於雷射空間206中。。 Referring to the first figure, the laser mount 300 is disposed across the base 100 and extends through the laser space 206 in a second direction perpendicular to the first direction. More specifically, the laser mount 300 is substantially U-shaped, and the laser mount 300 has a crossbar 301 whose longitudinal direction is parallel to the Y-axis direction and allows the crossbar 301 to pass through the loading platform. 202 The laser space 206 between the download station 204 and the portion of the crossbar 301 is located in the laser space 206. .

再者,遮罩潔淨裝置更包含第一雷射裝置401以及第二雷射裝置403,用以分別對金屬遮罩的上下表面照射雷射光。如第一圖所示,第一雷射裝置401係移動設置於雷射支架300的橫桿301之一側面301a上,且可沿著Y軸方向移動。更具體來說,第一雷射裝置401可以設置於橫桿301之一側面301a上的一軌道(未繪示),並且沿著軌道移動,使得第一雷射裝置401可以沿著Y軸方向且於雷射支架300上移動。 Furthermore, the mask cleaning device further includes a first laser device 401 and a second laser device 403 for respectively irradiating the upper and lower surfaces of the metal mask with the laser light. As shown in the first figure, the first laser device 401 is moved and disposed on one side 301a of the cross bar 301 of the laser mount 300, and is movable in the Y-axis direction. More specifically, the first laser device 401 can be disposed on a track (not shown) on one side 301a of the crossbar 301 and moved along the track such that the first laser device 401 can follow the Y-axis direction. And moving on the laser mount 300.

相似於第一雷射裝置401,第二雷射裝置403亦移動設置於雷射支架300的橫桿301之側面301a上且可沿著Y軸方向移動,換句話說,第二雷射裝置403與第一雷射裝置401皆移動設置於雷射支架300的相同側面301a上。其中,第二雷射裝置403可以與第一雷射裝置401共用相同的軌道,也可以設置於相異軌道(未繪示)上。或者,在更一實施例中,第二雷射裝置403與第一雷射裝置401可以設置於雷射支架300相對兩側面上。詳言之,第一雷射裝置401設置於橫桿301之一側面301a上,第二雷射裝置403設置於橫桿與側面301a相反面之另一側面301b上。值得注意的是,前述關於第一與第二雷射裝置401、403設置於雷射支架300的方式以及兩雷射裝置的相對位置之描述說明,只是一種便於實施例說明解釋的態樣,並非以限定本發明,熟悉此技藝者當可依需求自行變化。 Similar to the first laser device 401, the second laser device 403 is also moved on the side surface 301a of the crossbar 301 of the laser mount 300 and is movable along the Y-axis direction, in other words, the second laser device 403 Both the first laser device 401 and the first laser device 401 are disposed on the same side surface 301a of the laser holder 300. The second laser device 403 may share the same track as the first laser device 401, or may be disposed on a different track (not shown). Alternatively, in a further embodiment, the second laser device 403 and the first laser device 401 may be disposed on opposite sides of the laser bracket 300. In detail, the first laser device 401 is disposed on one side 301a of the crossbar 301, and the second laser device 403 is disposed on the other side 301b of the opposite side of the crossbar from the side surface 301a. It should be noted that the foregoing description of the manner in which the first and second laser devices 401, 403 are disposed on the laser mount 300 and the relative positions of the two laser devices is merely an explanation for facilitating the explanation of the embodiment, and is not In order to limit the invention, those skilled in the art can change themselves as needed.

值得一提的是,上述的架體的移動、第一與第二雷射裝置401、403之移動以及雷射照射作業,通常是藉由至少一電腦控制裝置(未繪示)加以控制。也就是說,電腦控制裝置為一精密量測裝置,其係用以控制架體的位移、第一與第二雷射裝置401、403之位移、雷射光照射等等運作,使得承載有金屬遮罩的載台以及第一與第二雷射裝置401、403能準確移動到目標位置,進而進行雷射照射的修補作業。而電腦控制裝置控制架體、雷射裝置等運作,為所屬技術領域中具有通常知識者所熟知且可自行變化的技術,故不在此加以贅述。 It is worth mentioning that the movement of the above-mentioned frame, the movement of the first and second laser devices 401, 403, and the laser irradiation operation are usually controlled by at least one computer control device (not shown). That is to say, the computer control device is a precision measuring device for controlling the displacement of the frame body, the displacement of the first and second laser devices 401, 403, the laser irradiation, etc., so that the metal cover is carried. The stage of the cover and the first and second laser devices 401, 403 can be accurately moved to the target position, thereby performing a laser irradiation repair operation. The computer control device controls the frame body, the laser device, and the like, and is a technology that is well known and can be changed by those skilled in the art, and therefore will not be described herein.

在本發明之另一實施例中,遮罩潔淨裝置更包含與第一雷射裝置401搭配的第一檢查裝置405,用以判斷金屬遮罩500的上表面501a是否有待去除的雜質顆粒。如第一圖所示,第一檢查裝置405係與第一雷射裝置401固設在一起。也就是說,第一檢查裝置405亦移動設置於雷射支 架300之側面301a上的軌道上(未繪示),且可沿著軌道移動。其中,第一檢查裝置405可以為一影像擷取裝置,例如為電荷耦合元件(Charge Coupled Device,CCD)。第一檢查裝置405是用來判斷金屬遮罩500的上表面501a是否有待去除的雜質顆粒,待檢查出待去除的雜質顆粒並加以定位後,再利用第一雷射裝置401進行照射雷射光。 In another embodiment of the present invention, the mask cleaning device further includes a first inspection device 405 coupled with the first laser device 401 for determining whether the upper surface 501a of the metal mask 500 has foreign particles to be removed. As shown in the first figure, the first inspection device 405 is fixed to the first laser device 401. That is, the first inspection device 405 is also moved to the laser branch. A track (not shown) on the side 301a of the frame 300 is movable along the track. The first inspection device 405 can be an image capture device, such as a Charge Coupled Device (CCD). The first inspection device 405 is for determining whether the upper surface 501a of the metal mask 500 has impurity particles to be removed. After the impurity particles to be removed are to be inspected and positioned, the first laser device 401 is used to illuminate the laser light.

在本發明之一實施例中,除了第一檢查裝置405之外,第一雷射裝置401中更可以包含有另一檢查裝置(未繪示)。這兩個檢查裝置大致上係分別進行檢查、定位等作業,而此兩檢查裝置的檢查與定位等作業,應為對於所屬技術領域中具有通常知識者所熟知的技術,故不在此加以贅述。值得注意的是,此兩檢查裝置只是便於實施例的描述說明,並不用以限定本發明,熟悉此技藝者當可依需求自行變化檢查裝置之數量多寡。 In an embodiment of the present invention, in addition to the first inspection device 405, the first laser device 401 may further include another inspection device (not shown). The two inspection devices are generally subjected to inspection, positioning, and the like, and the inspection and positioning operations of the two inspection devices should be well-known to those skilled in the art, and therefore will not be described herein. It should be noted that the two inspection devices are merely illustrative of the embodiments and are not intended to limit the present invention. Those skilled in the art can change the number of inspection devices as needed.

相同地,遮罩潔淨裝置更可包含與第二雷射裝置403搭配的第二檢查裝置407。如第一圖所示,第二檢查裝置407係與第二雷射裝置403固定在一起,係移動設置於雷射支架300上且可沿著第二方向移動,以判斷金屬遮罩500的下表面501b是否有待去除的雜質顆粒。第二檢查裝置407的位置設置與作業,係與上述第一檢查裝置405相似,故不在此加以贅述。 Similarly, the mask cleaning device may further include a second inspection device 407 that is coupled to the second laser device 403. As shown in the first figure, the second inspection device 407 is fixed to the second laser device 403, and is disposed on the laser holder 300 and movable in the second direction to determine the lower portion of the metal mask 500. Whether the surface 501b has foreign particles to be removed. The position setting and operation of the second inspection device 407 are similar to those of the first inspection device 405 described above, and therefore will not be described herein.

請同時參照第一圖與第二圖,首先,將金屬遮罩500承載於下載台204上,並讓金屬遮罩500的上表面501a面對第一雷射裝置401(在此實施例中,金屬遮罩500的上表面501a係朝向上方,但並非用以限定本發明,只要金屬遮罩500的上表面501a面向雷射裝置即可)。其中,金屬遮罩500為安裝在金屬框架上的一金屬薄板,且此金屬薄板上形成有多個圖案化的開孔503。接著,先進行第一雷射光照射。調整架體200以及第一雷射裝置401之相對位置,令第一雷射裝置401於雷射空間206中移動至目標位置,其後再利用第一雷射裝置401,對金屬遮罩500的上表面501a照射第一雷射光。此時,第一雷射光會照射附著在金屬遮罩500上的雜質顆粒507,例如包含附著在金屬遮罩500上表面501a的雜質顆粒507以及在開孔503中的雜質顆粒507,使得雜質顆粒507自金屬遮罩500上脫落。 Referring to both the first and second figures, first, the metal mask 500 is carried on the download station 204, and the upper surface 501a of the metal mask 500 faces the first laser device 401 (in this embodiment, The upper surface 501a of the metal mask 500 is upwardly directed, but is not intended to limit the invention as long as the upper surface 501a of the metal mask 500 faces the laser device. The metal mask 500 is a metal thin plate mounted on the metal frame, and the metal thin plate is formed with a plurality of patterned openings 503. Next, the first laser light is irradiated first. Adjusting the relative positions of the frame body 200 and the first laser device 401 to move the first laser device 401 to the target position in the laser space 206, and then using the first laser device 401 to the metal mask 500 The upper surface 501a illuminates the first laser light. At this time, the first laser light illuminates the impurity particles 507 attached to the metal mask 500, for example, the impurity particles 507 attached to the upper surface 501a of the metal mask 500 and the impurity particles 507 in the opening 503, so that the impurity particles 507 is detached from the metal mask 500.

請同時參照第三圖與第四圖,進行第二雷射光照射。先從下載台204取出該金屬遮罩500,再將金屬遮罩500放置於上載台202上, 並且藉由上載台202之開口202a,讓承載於上載台202上的金屬遮罩500之下表面501b得以暴露出來。此時,置放於上載台202上的金屬遮罩500之下表面501b係面對第二雷射裝置403(在此實施例中,金屬遮罩500之下表面501b係朝向下方,但並非用以限定本發明,只要金屬遮罩500的下表面501b面向雷射裝置即可)。接著,調整架體200與第二雷射裝置403之位置並使其移動至目標位置。其後,利用第二雷射裝置403,對金屬遮罩500的下表面501b照射第二雷射光。此時,在金屬遮罩500下表面501b上可能還存留有雜質顆粒507a,例如包含附著在下表面501b的雜質顆粒507a以及在開孔503中未完全被雷射光照射去除掉的雜質顆粒507a。因此,第二雷射光的照射可以進一步去除掉殘留的雜質顆粒507a,以確保金屬遮罩的潔淨,進而獲得更高的金屬遮罩洗淨效果。 Please refer to the third and fourth figures at the same time for the second laser light irradiation. The metal mask 500 is first taken out from the download station 204, and the metal mask 500 is placed on the loading platform 202. And the lower surface 501b of the metal mask 500 carried on the loading table 202 is exposed by the opening 202a of the loading table 202. At this time, the lower surface 501b of the metal mask 500 placed on the loading table 202 faces the second laser device 403 (in this embodiment, the lower surface 501b of the metal mask 500 faces downward, but is not used To limit the invention, as long as the lower surface 501b of the metal mask 500 faces the laser device). Next, the position of the frame body 200 and the second laser device 403 is adjusted and moved to the target position. Thereafter, the second laser light 403 is used to illuminate the lower surface 501b of the metal mask 500 with the second laser light. At this time, impurity particles 507a may remain on the lower surface 501b of the metal mask 500, for example, containing the impurity particles 507a attached to the lower surface 501b and the impurity particles 507a which are not completely removed by the laser irradiation in the opening 503. Therefore, the irradiation of the second laser light can further remove the residual impurity particles 507a to ensure the cleanness of the metal mask, thereby obtaining a higher metal mask cleaning effect.

遮罩潔淨裝置更可依需求包含一第一超音波振動裝置(未繪示)且/或一第一氣流裝置(未繪示),第一超音波振動裝置與第一氣流裝置係與第一雷射裝置401固定在一起且相鄰於第一雷射裝置401,也就是其亦移動設置於雷射支架300的橫桿301之側面301a上且可沿著Y軸方向移動。第一超音波振動裝置會產生超音波振動,利用超音波振動來清除金屬遮罩500表面上的落塵等雜質。第一氣流裝置會產生一空氣氣流(例如吸氣氣流且/或吹氣氣流),以清除金屬遮罩500表面上的落塵等雜質,例如該第一氣流裝置更可以包含有一吹氣件及一吸氣件,該吹氣件可以為一吹嘴,該吸氣件可以為一吸嘴,該吹氣件會先吹起金屬遮罩500表面上的雜質,吸氣件則將被吹起的雜質吸走。 The mask cleaning device may further include a first ultrasonic vibration device (not shown) and/or a first air flow device (not shown), the first ultrasonic vibration device and the first air flow device and the first The laser device 401 is fixed together and adjacent to the first laser device 401, that is, it is also moved on the side surface 301a of the cross bar 301 of the laser mount 300 and is movable in the Y-axis direction. The first ultrasonic vibration device generates ultrasonic vibration, and ultrasonic vibration is used to remove impurities such as dust on the surface of the metal mask 500. The first air flow device generates an air flow (for example, an intake air flow and/or a blow air flow) to remove dust and the like on the surface of the metal cover 500. For example, the first air flow device may further include a blower and a blower. The air suction member may be a blowing nozzle, and the air suction member may be a suction nozzle, the air blowing member first blowing impurities on the surface of the metal mask 500, and the air suction member is to be blown up. Impurities are sucked away.

此外,遮罩潔淨裝置亦可依需求包含一第二超音波振動裝置(未繪示)且/或一第二氣流裝置(未繪示),第二超音波振動裝置與第二氣流裝置係與第二雷射裝置403固定在一起且相鄰於第二雷射裝置403。關於第二超音波振動裝置與第二氣流裝置的位置、移動方向等特徵之說明,係與上述相似,故不在此加以贅述。 In addition, the mask cleaning device may also include a second ultrasonic vibration device (not shown) and/or a second air flow device (not shown), and the second ultrasonic vibration device and the second air flow device. The second laser device 403 is fixed together and adjacent to the second laser device 403. The descriptions of the features such as the position and the moving direction of the second ultrasonic vibration device and the second air flow device are similar to those described above, and thus are not described herein.

第二實施例 Second embodiment

請參照第五圖與第六圖,其係為本發明之第二實施例的遮罩潔淨裝置的立體結構示意圖。相似於上述第一實施例,在第二實施例中,遮罩潔淨裝置包含基座100、架體200與雷射支架300。架體200係藉由基 座100的軌道101移動設置於基座100上且沿著第一方向移動,其中,架體200具有一上載台202與下載台204,係分別用以供承載一金屬遮罩。雷射支架300跨設於基座100上,且其係沿著垂直於第一方向的第二方向延伸穿過上載台202與下載台204所定義出來的雷射空間206。關於基座100、架體200與雷射支架300的位置、形狀、移動方向、結構特徵等說明,係與前述第一實施例相似,故不在此加以贅述。 Please refer to FIG. 5 and FIG. 6 , which are schematic perspective views of a mask cleaning device according to a second embodiment of the present invention. Similar to the first embodiment described above, in the second embodiment, the mask cleaning device includes the base 100, the frame 200, and the laser mount 300. Frame 200 is based on The track 101 of the base 100 is disposed on the base 100 and moves along the first direction. The frame 200 has an loading platform 202 and a downloading station 204 for respectively carrying a metal mask. The laser mount 300 spans the base 100 and extends through the laser space 206 defined by the loading station 202 and the download station 204 in a second direction perpendicular to the first direction. The descriptions of the position, shape, moving direction, structural features, and the like of the susceptor 100, the frame 200, and the laser holder 300 are similar to those of the first embodiment described above, and thus are not described herein.

與第一實施例不同處為,本實施例中的遮罩潔淨裝置只包含了一個雷射裝置401以及一旋轉機構800。如第五圖所示,旋轉機構800係移動設置於雷射支架300上且沿著第二方向移動。更具體來說,旋轉機構800可以設置於橫桿301之一側面301a上的一軌道(未繪示),並且沿著軌道移動,使得旋轉機構800得以沿著Y軸方向且於雷射支架300上移動。雷射裝置401係固定於旋轉機構800上,使雷射裝置401藉由旋轉機構800可相對雷射支架300轉動,例如旋轉180度,用以讓雷射裝置401可轉動到第一雷射照射位置或第二雷射照射位置,使其分別對承載於該下載台的該金屬遮罩之上表面照射一第一雷射光以及對承載於該上載台的該金屬遮罩之下表面照射一第二雷射光,進而去除該金屬遮罩上的複數個雜質顆粒。舉例來說,旋轉機構800可以包含一驅動件,例如步進馬達,驅動件會帶動雷射裝置401旋轉,但並不僅限於此,所屬技術領域中具有通常知識者當可自行變化調整旋轉機構800的設計。 The difference from the first embodiment is that the mask cleaning device in this embodiment includes only one laser device 401 and one rotating mechanism 800. As shown in the fifth figure, the rotating mechanism 800 is movably disposed on the laser mount 300 and moves in the second direction. More specifically, the rotating mechanism 800 can be disposed on a track (not shown) on one side 301a of the crossbar 301 and moved along the track so that the rotating mechanism 800 can be along the Y-axis direction and on the laser mount 300. Move on. The laser device 401 is fixed to the rotating mechanism 800, so that the laser device 401 can be rotated relative to the laser bracket 300 by the rotating mechanism 800, for example, rotated by 180 degrees, so that the laser device 401 can be rotated to the first laser irradiation. a position or a second laser irradiation position, respectively illuminating a surface of the metal mask carried on the downloading station with a first laser light and a surface of the lower surface of the metal mask carried on the loading table Two lasers, which in turn remove a plurality of impurity particles on the metal mask. For example, the rotating mechanism 800 can include a driving member, such as a stepping motor. The driving member can drive the laser device 401 to rotate, but is not limited thereto. Those skilled in the art can adjust the rotating mechanism 800 when the self-change is self-changeable. the design of.

在本發明之再一實施例中,遮罩潔淨裝置更包含與雷射裝置401搭配的一檢查裝置405。如第五圖所示,相似於雷射裝置401之設置,檢查裝置405亦固定於旋轉機構800上。值得一提的是,此等檢查裝置的位置設置與作業,係與第一實施例的檢查裝置相似,故不在此加以贅述。 In still another embodiment of the present invention, the mask cleaning device further includes an inspection device 405 that is coupled to the laser device 401. As shown in the fifth figure, similar to the arrangement of the laser device 401, the inspection device 405 is also fixed to the rotating mechanism 800. It is worth mentioning that the position setting and operation of these inspection devices are similar to those of the first embodiment, and therefore will not be described herein.

請同時參照第五圖與第六圖。如第五圖所示,金屬遮罩500係承載於下載台204上,並讓金屬遮罩500的上表面501a面對雷射裝置401。首先,進行第一雷射光照射。將雷射裝置401轉動到第一雷射照射位置,也就是將雷射裝置401的雷射頭轉動到面對下載台204。接著,調整架體200以及雷射裝置401之位置,令雷射裝置401於雷射空間206中移動,並使其移動至目標位置。其後,再利用雷射裝置401,對金屬遮罩500的上表面501a照射第一雷射光。此時,第一雷射光會照射附著在金屬遮罩500 上的雜質顆粒507,例如第二圖中包含附著在金屬遮罩500上表面501a的雜質顆粒507以及在開孔503中的雜質顆粒507,使得雜質顆粒507自金屬遮罩500上脫落。 Please refer to the fifth and sixth figures at the same time. As shown in the fifth figure, the metal mask 500 is carried on the download stage 204, and the upper surface 501a of the metal mask 500 faces the laser device 401. First, the first laser light is irradiated. The laser device 401 is rotated to the first laser irradiation position, that is, the laser head of the laser device 401 is rotated to face the download station 204. Next, the position of the frame body 200 and the laser device 401 is adjusted, and the laser device 401 is moved in the laser space 206 and moved to the target position. Thereafter, the first surface 501a of the metal mask 500 is irradiated with the first laser light by the laser device 401. At this time, the first laser light is irradiated and attached to the metal mask 500. The impurity particles 507 on the upper side include, for example, the impurity particles 507 attached to the upper surface 501a of the metal mask 500 and the impurity particles 507 in the opening 503, so that the impurity particles 507 are detached from the metal mask 500.

進行第二雷射光照射。如第六圖所示,先從下載台204取出該金屬遮罩500,再將金屬遮罩500放置於上載台202上,並且藉由上載台202之開口202a,讓承載於上載台202上的金屬遮罩500之下表面501b得以暴露出來。接著,約180度轉動雷射裝置401,使雷射裝置401轉動到第二雷射照射位置,也就是使雷射裝置401的雷射頭轉動到面對放置於上載台202上的金屬遮罩500之下表面501b的位置。調整架體200與雷射裝置401之位置並使其移動至目標位置。其後,利用雷射裝置401,對金屬遮罩500的下表面501b照射第二雷射光。此時,在金屬遮罩500下表面501b上可能還存留有雜質顆粒507a,例如第四圖中包含附著在下表面501b的雜質顆粒507a以及在開孔503中未完全被雷射光照射去除掉的雜質顆粒507a。因此,第二雷射光的照射可以進一步去除掉殘留的雜質顆粒507a,以確保金屬遮罩的潔淨,進而獲得更高的金屬遮罩洗淨效果。 A second laser light irradiation is performed. As shown in the sixth figure, the metal mask 500 is first taken out from the download station 204, and then the metal mask 500 is placed on the loading platform 202, and is carried on the loading platform 202 by the opening 202a of the loading station 202. The lower surface 501b of the metal mask 500 is exposed. Next, the laser device 401 is rotated about 180 degrees to rotate the laser device 401 to the second laser irradiation position, that is, the laser head of the laser device 401 is rotated to face the metal mask placed on the loading table 202. The position of the surface 501b below 500. The position of the frame 200 and the laser device 401 is adjusted and moved to the target position. Thereafter, the second surface 501b of the metal mask 500 is irradiated with the second laser light by the laser device 401. At this time, impurity particles 507a may remain on the lower surface 501b of the metal mask 500, for example, the impurity particles 507a attached to the lower surface 501b and the impurities not completely removed by the laser irradiation in the opening 503 are included in the fourth figure. Particle 507a. Therefore, the irradiation of the second laser light can further remove the residual impurity particles 507a to ensure the cleanness of the metal mask, thereby obtaining a higher metal mask cleaning effect.

遮罩潔淨裝置更可依需求包含一超音波振動裝置(未繪示)且/或一氣流裝置(未繪示),超音波振動裝置與氣流裝置係固定於旋轉機構800上,也就是超音波振動裝置與氣流裝置係與雷射裝置401可相對基座100沿著第二方向移動,且亦可同時藉由旋轉機構800而於轉動。至於超音波振動裝置與氣流裝置的特徵說明,係與前述第一實施例相似,故不在此加以贅述。 The mask cleaning device may further include an ultrasonic vibration device (not shown) and/or an air flow device (not shown), and the ultrasonic vibration device and the air flow device are fixed on the rotating mechanism 800, that is, the ultrasonic wave. The vibrating device and the airflow device and the laser device 401 are movable in the second direction relative to the base 100, and can also be rotated by the rotating mechanism 800 at the same time. The description of the characteristics of the ultrasonic vibration device and the air flow device is similar to that of the first embodiment described above, and therefore will not be described herein.

第三實施例 Third embodiment

請參照第七圖,其係為本發明之第三實施例的遮罩潔淨裝置的立體結構示意圖。如第七圖所示,遮罩潔淨裝置包含基座100以及沿著第一方向移動設置於基座100上的一載台105。具體來說,基座100上開設有一缺口103且於缺口103相對兩側設置有一對軌道101,其中,軌道101係沿著第一方向延伸設置於基座100上。在此實施例中,第一方向係指X軸方向,但此並不用以限定本發明。 Please refer to the seventh figure, which is a schematic perspective view of a mask cleaning device according to a third embodiment of the present invention. As shown in the seventh figure, the mask cleaning device includes a base 100 and a stage 105 disposed on the base 100 in a first direction. Specifically, a recess 103 is defined in the base 100, and a pair of rails 101 are disposed on opposite sides of the notch 103. The rail 101 is extended on the base 100 along the first direction. In this embodiment, the first direction refers to the X-axis direction, but this is not intended to limit the invention.

在第三實施例中,載台105係設置於基座100上的軌道101上,並於軌道101上移動,使得載台105可於軌道101上相對基座100移動。 如第七圖所示,載台105大致上為一矩形框架結構,且載台105具有一開口105a,因此當載台105設置於基座100上時,載台105的開口105a會連通基座100的缺口103,使得後續將承載於其上的金屬遮罩的上下表面皆能暴露出來。 In the third embodiment, the stage 105 is disposed on the track 101 on the base 100 and moves on the track 101 such that the stage 105 can be moved relative to the base 100 on the track 101. As shown in the seventh figure, the stage 105 is substantially a rectangular frame structure, and the stage 105 has an opening 105a. Therefore, when the stage 105 is disposed on the base 100, the opening 105a of the stage 105 communicates with the base. The notch 103 of 100 allows the upper and lower surfaces of the metal mask to be subsequently carried thereon to be exposed.

請繼續參照第七圖,基座100的上表面100a上跨設有第一支架603,且其係沿著垂直於第一方向的第二方向,也就是Y軸方向,設置於基座100上。在此實施例中,第一支架603大致上為ㄇ字形的結構,但並不限定於此。第一雷射裝置601係移動設置於第一支架603,更具體來說,第一雷射裝置601可藉由第一支架603上的一軌道(未繪示),移動設置於雷射支架300上,使得第一雷射裝置601可於Y軸方向相對基座100位移。需注意,第一雷射裝置601安裝於第一支架603之技術,為對於所屬技術領域中具有通常知識者可任意變換的技術,並不僅限於實施例中所提及技術。 Referring to the seventh figure, the first bracket 603 is disposed across the upper surface 100a of the base 100, and is disposed on the base 100 along a second direction perpendicular to the first direction, that is, the Y-axis direction. . In this embodiment, the first bracket 603 is substantially U-shaped, but is not limited thereto. The first laser device 601 is disposed on the first bracket 603. More specifically, the first laser device 601 can be moved to the laser bracket 300 by a track (not shown) on the first bracket 603. The first laser device 601 is displaceable relative to the susceptor 100 in the Y-axis direction. It should be noted that the technology of the first laser device 601 mounted on the first bracket 603 is a technology that can be arbitrarily changed by those skilled in the art, and is not limited to the technology mentioned in the embodiment.

相似於第一支架603,相對於基座100上表面100a的下表面上(未繪示),設有第二支架703,且第二支架703也是沿著垂直於第一方向的第二方向,也就是Y軸方向,設置於基座100的下表面。第二雷射裝置701係移動設置於第二支架703上,且可沿著Y軸方向相對基座100位移。其中,第二雷射裝置701安裝於第二支架703如同第一雷射裝置601,應為對於所屬技術領域中具有通常知識者所熟知的技術,故不在此加以贅述。 Similar to the first bracket 603, with respect to the lower surface (not shown) of the upper surface 100a of the base 100, a second bracket 703 is provided, and the second bracket 703 is also in a second direction perpendicular to the first direction, That is, the Y-axis direction is provided on the lower surface of the susceptor 100. The second laser device 701 is disposed on the second bracket 703 and is displaceable relative to the base 100 along the Y-axis direction. The second laser device 701 is mounted on the second bracket 703, like the first laser device 601, and should be well known to those skilled in the art, and therefore will not be described herein.

值得注意的是,如同第一實施例所述,上述載台105的移動、第一與第二雷射裝置601、701之移動以及雷射照射作業,通常是藉由至少一電腦裝置(未繪示)加以控制,且此等運作應為對於所屬技術領域中具有通常知識者所熟知的技術,故不在此加以贅述。 It should be noted that, as described in the first embodiment, the movement of the stage 105, the movement of the first and second laser devices 601, 701, and the laser irradiation operation are usually performed by at least one computer device (not drawn It is to be controlled, and such operations should be well known to those of ordinary skill in the art and are not described herein.

請同時參照第七圖與第八圖,分別進行第一雷射光照射與第二雷射光照射。將金屬遮罩500承載於載台105上,並且透過載台105的開口105a與基座100的缺口103,讓承載於載台105上的金屬遮罩500之上下表面501a、501b皆暴露出來。此時,金屬遮罩500之上表面501a係面向第一雷射裝置601,金屬遮罩500之下表面501b係面向第二雷射裝置701。接著,依序調整載台105以及第一、第二雷射裝置601、701之位置並使其移動至目標位置。其後,利用第一雷射裝置601與第二雷射裝置701,分別 對金屬遮罩500的上表面501a與下表面501b照射第一雷射光與第二雷射光。此時,第一雷射光會照射附著在金屬遮罩500上的雜質顆粒507,例如包含附著在金屬遮罩500上表面501a以及在開孔503中的雜質顆粒507,而第二雷射光會照射附著在金屬遮罩500下表面501b的雜質顆粒507,例如包含附著在下表面501b以及在開孔503中的雜質顆粒507。如此一來,便能全面的地將金屬遮罩500上所有的雜質顆粒507完全去除掉,進而獲得更高的金屬遮罩洗淨效果。 Please refer to the seventh and eighth figures simultaneously, and perform the first laser light irradiation and the second laser light irradiation, respectively. The metal mask 500 is carried on the stage 105, and the upper surface 501a, 501b of the metal mask 500 carried on the stage 105 is exposed through the opening 105a of the stage 105 and the notch 103 of the base 100. At this time, the upper surface 501a of the metal mask 500 faces the first laser device 601, and the lower surface 501b of the metal mask 500 faces the second laser device 701. Next, the positions of the stage 105 and the first and second laser devices 601 and 701 are sequentially adjusted and moved to the target position. Thereafter, using the first laser device 601 and the second laser device 701, respectively The upper surface 501a and the lower surface 501b of the metal mask 500 are irradiated with the first laser light and the second laser light. At this time, the first laser light illuminates the impurity particles 507 adhering to the metal mask 500, for example, containing the impurity particles 507 attached to the upper surface 501a of the metal mask 500 and the opening 503, and the second laser light is irradiated. The impurity particles 507 attached to the lower surface 501b of the metal mask 500 include, for example, impurity particles 507 adhered to the lower surface 501b and in the opening 503. In this way, all the impurity particles 507 on the metal mask 500 can be completely removed, thereby obtaining a higher metal mask cleaning effect.

在本發明之另一實施例中,遮罩潔淨裝置更包含與第一雷射裝置601搭配的第一檢查裝置605。如第七圖所示,第一檢查裝置605係移動設置於第一支架603上。其中,第一檢查裝置605可以為一影像擷取裝置,例如為電荷耦合元件(Charge Coupled Device,CCD)。第一檢查裝置605是用來判斷金屬遮罩500的上表面501a是否有待去除的雜質顆粒,待檢查出待去除的雜質顆粒並加以定位後,再利用第一雷射裝置601進行照射雷射光。在本發明之再一實施例中,除了第一檢查裝置605之外,第一雷射裝置601中更包含有另一檢查裝置(未繪示)。值得一提的是,此等檢查裝置的位置設置與作業,係與第一實施例的第一檢查裝置相似,故不在此加以贅述。 In another embodiment of the invention, the mask cleaning device further includes a first inspection device 605 that is coupled to the first laser device 601. As shown in the seventh figure, the first inspection device 605 is moved and disposed on the first bracket 603. The first inspection device 605 can be an image capture device, such as a Charge Coupled Device (CCD). The first inspection device 605 is for determining whether the upper surface 501a of the metal mask 500 has impurity particles to be removed. After the impurity particles to be removed are detected and positioned, the first laser device 601 is used to illuminate the laser light. In still another embodiment of the present invention, in addition to the first inspection device 605, the first laser device 601 further includes another inspection device (not shown). It is worth mentioning that the position setting and operation of these inspection devices are similar to those of the first inspection device of the first embodiment, and therefore will not be further described herein.

在本發明之更一實施例中,遮罩潔淨裝置更可以包含與第二雷射裝置701搭配的第二檢查裝置705。如第七圖所示,第二檢查裝置705係移動設置於第二支架703上且沿著第二方向移動,以判斷金屬遮罩500的下表面501b是否有待去除的雜質顆粒。第二檢查裝置705的位置設置與作業,係與上述第一檢查裝置相似,故不在此加以贅述。 In a further embodiment of the invention, the mask cleaning device may further comprise a second inspection device 705 in combination with the second laser device 701. As shown in the seventh figure, the second inspection device 705 is moved on the second bracket 703 and moved in the second direction to determine whether the lower surface 501b of the metal mask 500 has foreign particles to be removed. The position setting and operation of the second inspection device 705 are similar to those of the first inspection device described above, and thus are not described herein.

或者,遮罩潔淨裝置更可依需求包含一第一超音波振動裝置(未繪示)且/或一第一氣流裝置(未繪示),第一超音波振動裝置與第一氣流裝置係移動設置於第一支架603上且可沿著Y軸方向移動。至於第一超音波振動裝置與第一氣流裝置的特徵說明,係與前述第一實施例相似,故不在此加以贅述。 Alternatively, the mask cleaning device may further include a first ultrasonic vibration device (not shown) and/or a first air flow device (not shown), and the first ultrasonic vibration device moves with the first air flow device. It is disposed on the first bracket 603 and is movable along the Y-axis direction. The feature description of the first ultrasonic vibration device and the first air flow device is similar to that of the first embodiment described above, and therefore will not be described herein.

此外,遮罩潔淨裝置更可依需求包含一第二超音波振動裝置(未繪示)且/或一第二氣流裝置(未繪示),第二超音波振動裝置與第二氣流裝置係移動設置於第二支架703上且可沿著Y軸方向移動。至於第二超音 波振動裝置與第二氣流裝置的特徵說明,係與前述第一實施例相似,故不在此加以贅述。 In addition, the mask cleaning device may further include a second ultrasonic vibration device (not shown) and/or a second air flow device (not shown), and the second ultrasonic vibration device and the second air flow device are moved as required. It is disposed on the second bracket 703 and is movable along the Y-axis direction. As for the second supersonic The features of the wave vibrating device and the second airflow device are similar to those of the first embodiment described above, and thus are not described herein.

因此,本發明不僅不會造成金屬遮罩的扭曲或變形等損傷,而且還能同時對金屬遮罩的上表面與下表面分別進行潔淨作業,進而確保金屬遮罩的開孔內、更甚至是上下表面中所附著的雜質都能完全地被去除掉,如此一來,便可大幅提升金屬遮罩的潔淨度。 Therefore, the present invention not only does not cause damage such as distortion or deformation of the metal mask, but also simultaneously cleans the upper surface and the lower surface of the metal mask, thereby ensuring the inside of the opening of the metal mask, and even even The impurities attached to the upper and lower surfaces can be completely removed, so that the cleanliness of the metal mask can be greatly improved.

另外,前述實施例中所描述的上、下、第一、第二僅是便於各實施態樣之說明解釋,其並非用以限定本發明之範圍,例如本發明之遮罩潔淨裝置除了上述各實施例中所及,係將金屬遮罩水平放置於載台上進行修補清洗的作業,也可以依需求將金屬遮罩直立架設於機台內,此時則須同時調整雷射裝置、檢測裝置等裝置的方位設計,以對直立式的金屬遮罩進行清洗作業。 In addition, the above, the first, the second, and the second described in the foregoing embodiments are merely illustrative of the various embodiments, and are not intended to limit the scope of the present invention. For example, the mask cleaning device of the present invention is not limited to the above. In the embodiment, the metal mask is placed horizontally on the stage for repairing and cleaning, and the metal mask can be erected in the machine table according to requirements. At this time, the laser device and the detecting device must be simultaneously adjusted. The orientation of the device is designed to clean the upright metal mask.

無論如何,任何人都可以從上述例子的說明獲得足夠教導,並據而了解本發明內容確實不同於先前技術,且具有產業上之利用性,及足具進步性。是本發明確已符合專利要件,爰依法提出申請。 In any event, anyone can obtain sufficient teaching from the description of the above examples, and it is understood that the present invention is indeed different from the prior art, and is industrially usable and progressive. It is the invention that has indeed met the patent requirements and has filed an application in accordance with the law.

100‧‧‧基座 100‧‧‧Base

101‧‧‧軌道 101‧‧‧ Track

200‧‧‧架體 200‧‧‧ frame

202‧‧‧上載台 202‧‧‧ Uploading station

202a‧‧‧開口 202a‧‧‧ openings

204‧‧‧下載台 204‧‧‧Download

206‧‧‧雷射空間 206‧‧‧Laser space

300‧‧‧雷射支架 300‧‧‧Road bracket

301‧‧‧橫桿 301‧‧‧cross bar

301a‧‧‧側面 301a‧‧‧ side

301b‧‧‧側面 301b‧‧‧ side

401‧‧‧雷射裝置 401‧‧‧ Laser device

405‧‧‧檢查裝置 405‧‧‧Checking device

500‧‧‧金屬遮罩 500‧‧‧Metal mask

503‧‧‧開孔 503‧‧‧Opening

800‧‧‧旋轉機構 800‧‧‧Rotating mechanism

Claims (17)

一種遮罩潔淨裝置,包括:一第一載台與一第二載台,以一距離平行設置於一機台且可沿著一第一方向相對該機台移動,以供承載一金屬遮罩;一雷射支架,位於該第一與第二載台之間;一旋轉機構,沿著垂直於該第一方向的一第二方向移動設置於該雷射支架上,且該旋轉機構可相對該雷射支架轉動;以及一雷射裝置,固設於該旋轉機構上,使該雷射裝置可相對該雷射支架於一第一雷射照射位置與一第二雷射照射位置之間轉動,其中當該雷射裝置於該第一雷射照射位置時,可對承載於該第一載台的該金屬遮罩之上表面照射雷射光,當該雷射裝置於該第二雷射照射位置時,可對承載於該第二載台的該金屬遮罩之下表面照射雷射光。 A mask cleaning device includes: a first stage and a second stage disposed at a distance parallel to a machine and movable relative to the machine along a first direction for carrying a metal mask a laser bracket disposed between the first and second stages; a rotating mechanism disposed on the laser bracket in a second direction perpendicular to the first direction, and the rotating mechanism is opposite Rotating the laser mount; and a laser device fixed to the rotating mechanism to rotate the laser device relative to the laser mount between a first laser irradiation position and a second laser irradiation position And when the laser device is in the first laser irradiation position, the surface of the metal mask carried on the first stage may be irradiated with laser light, and when the laser device is irradiated to the second laser In the position, the lower surface of the metal mask carried on the second stage may be irradiated with laser light. 如申請專利範圍第1項所述之裝置,更包含與該雷射裝置搭配的一檢查裝置,該檢查裝置固設於該旋轉機構上。 The device of claim 1, further comprising an inspection device coupled to the laser device, the inspection device being fixed to the rotation mechanism. 如申請專利範圍第2項所述之裝置,更包含一超音波振動裝置,該超音波振動裝置固設於該旋轉機構上。 The device of claim 2, further comprising an ultrasonic vibration device, the ultrasonic vibration device being fixed to the rotation mechanism. 如申請專利範圍第3項所述之裝置,更包含一與該雷射裝置搭配之氣流裝置,該氣流裝置係固設於該旋轉機構上。 The device of claim 3, further comprising an air flow device matched with the laser device, the air flow device being fixed to the rotating mechanism. 一種遮罩潔淨裝置,包括: 一第一載台與一第二載台,以一距離平行設置於一機台且可沿著一第一方向相對該機台移動,以供承載一金屬遮罩;一雷射支架,位於該第一與第二載台之間;一第一雷射裝置,沿著垂直於該第一方向的一第二方向移動設置於該雷射支架上,該第一雷射裝置可對承載於該第一載台上的該金屬遮罩之上表面照射雷射光;以及一第二雷射裝置,沿著該第二方向移動設置於該雷射支架上,該第二雷射裝置可對承載於該第二載台上的該金屬遮罩之下表面照射雷射光。 A mask cleaning device comprising: a first stage and a second stage are disposed at a distance parallel to a machine and are movable relative to the machine along a first direction for carrying a metal cover; a laser mount is located at the same Between the first and second stages; a first laser device disposed on the laser mount in a second direction perpendicular to the first direction, the first laser device being The upper surface of the metal mask on the first stage illuminates the laser light; and a second laser device is disposed on the laser holder along the second direction, and the second laser device can be carried on the The underside of the metal mask on the second stage illuminates the laser light. 如申請專利範圍第5項所述之裝置,其中該第一與該第二雷射裝置係分別移動設置於該雷射支架的相同側面上。 The device of claim 5, wherein the first and the second laser device are respectively disposed on the same side of the laser mount. 如申請專利範圍第5項所述之裝置,更包含與該第一雷射裝置搭配的一第一檢查裝置以及與該第二雷射裝置搭配的一第二檢查裝置,該第一與該第二檢查裝置係分別沿著該第二方向移動設置於該雷射支架上。 The device of claim 5, further comprising a first inspection device coupled with the first laser device and a second inspection device coupled with the second laser device, the first and the first The two inspection devices are respectively disposed on the laser bracket along the second direction. 如申請專利範圍第7項所述之裝置,更包含一第一超音波振動裝置以及一與該第一雷射裝置搭配之第一氣流裝置,該第一超音波振動裝置與氣流裝置分別沿著該第二方向移動設置於該雷射支架上。 The device of claim 7, further comprising a first ultrasonic vibration device and a first air flow device coupled with the first laser device, the first ultrasonic vibration device and the air flow device respectively The second direction of movement is disposed on the laser mount. 如申請專利範圍第8項所述之裝置,更包含一第二超音波振動裝置以及與該第二雷射裝置搭配之一第二氣流裝置,該第二超音波振動裝置與氣流裝置係分別沿著該第二方向移動設置於該雷射支架上。 The device of claim 8, further comprising a second ultrasonic vibration device and a second air flow device coupled with the second laser device, wherein the second ultrasonic vibration device and the air flow device are respectively The second direction of movement is disposed on the laser mount. 一種遮罩潔淨裝置,包括:一基座,開設有一缺口;一載台,沿著一第一方向移動設置於該基座上,以承載一金屬遮罩,該載台具有一開口,該開口連通該基座的該缺口,且令承載於其上的該金屬遮罩之一上表面與一下表面暴露出來;一第一雷射裝置,位於該基座之一側,且可相對該基座沿著垂直於該第一方向之一第二方向移動,該第一雷射裝置之雷射光源係面對該基座中的該缺口,使該第一雷射裝置可對承載於該載台上的該金屬遮罩之該上表面照射雷射光;一第二雷射裝置,位於該基座相對該第一雷射裝置之另一側,且可相對該基座沿著該第二方向移動,該第二雷射裝置之雷射光源面對該基座中的該缺口,使該第二雷射裝置可對承載於該載台上的該金屬遮罩的該下表面照射雷射光。 A mask cleaning device includes: a base having a notch; a stage disposed on the base along a first direction to carry a metal cover, the stage having an opening, the opening Connecting the notch of the pedestal and exposing an upper surface and a lower surface of the metal mask carried thereon; a first laser device located on one side of the pedestal and opposite to the pedestal Moving along a second direction perpendicular to the first direction, the laser light source of the first laser device faces the gap in the base, so that the first laser device can be carried on the stage The upper surface of the metal mask is irradiated with laser light; a second laser device is located on the other side of the base opposite the first laser device and movable relative to the base along the second direction The laser light source of the second laser device faces the gap in the base, so that the second laser device can irradiate the lower surface of the metal mask carried on the stage with laser light. 如申請專利範圍第10項所述之裝置,更包含一第一支架與一第二支架,該第一支架跨設於該基座上之該側,該第二支架跨設於該基座上之該另一側,該第一雷射裝置係移動設置於該第一支架上,該第二雷射裝置係移動設置於該第二支架上。 The device of claim 10, further comprising a first bracket and a second bracket, the first bracket spanning the side of the base, the second bracket spanning the base On the other side, the first laser device is disposed on the first bracket, and the second laser device is disposed on the second bracket. 如申請專利範圍第10項所述之裝置,更包含與該第一雷射裝置搭配之一第一檢查裝置以及與該第二雷射裝置搭配 之一第二檢查裝置,該第一與該第二檢查裝置係分別沿著該第二方向移動設置於該雷射支架上。 The device of claim 10, further comprising: a first inspection device matched with the first laser device and a matching with the second laser device And a second inspection device, wherein the first inspection device and the second inspection device are respectively disposed on the laser bracket along the second direction. 如申請專利範圍第12項所述之裝置,更包含一第一超音波振動裝置以及一與該第一雷射裝置搭配之第一氣流裝置,該第一超音波振動裝置與該第一氣流裝置位於該基座之該側,且該第一超音波振動裝置與該第一氣流裝置可相對該基座沿著該第二方向移動。 The device of claim 12, further comprising a first ultrasonic vibration device and a first air flow device matched with the first laser device, the first ultrasonic vibration device and the first air flow device Located on the side of the base, the first ultrasonic vibration device and the first air flow device are movable relative to the base in the second direction. 如申請專利範圍第13項所述之裝置,更包含一第二超音波振動裝置以及與該第二雷射裝置搭配之一第二氣流裝置,該第二超音波振動裝置與該第二氣流裝置係位於該基座之該另一側,且該第二超音波振動裝置與該第二氣流裝置可相對該基座沿著該第二方向移動。 The device of claim 13, further comprising a second ultrasonic vibration device and a second air flow device in combination with the second laser device, the second ultrasonic vibration device and the second air flow device Located on the other side of the base, and the second ultrasonic vibration device and the second air flow device are movable relative to the base in the second direction. 一種潔淨金屬遮罩之方法,包括:放置一金屬遮罩於一第一位置,並使該金屬遮罩的上表面朝向一第一方向;當該金屬遮罩於該第一位置時,藉由一雷射裝置對該金屬遮罩的上表面照射雷射光;移動該金屬遮罩至一第二位置,並使該金屬遮罩的下表面朝向一第二方向,其中該第二方向係不同於該第一方向;及當該金屬遮罩於該第二位置時,藉由該雷射裝置對該金屬遮罩的下表面照射雷射光。 A method of cleaning a metal mask, comprising: placing a metal mask in a first position and directing an upper surface of the metal mask toward a first direction; when the metal is masked in the first position, a laser device irradiates the upper surface of the metal mask with laser light; moving the metal mask to a second position, and directing a lower surface of the metal mask toward a second direction, wherein the second direction is different from The first direction; and when the metal is masked in the second position, the lower surface of the metal mask is irradiated with laser light by the laser device. 一種潔淨金屬遮罩之方法,包括: 放置一金屬遮罩於一載台上,且令該載台上的該金屬遮罩相對之上表面與下表面暴露出來;及藉由二雷射裝置分別對該金屬遮罩的上表面及下表面照射雷射光。 A method of cleaning a metal mask comprising: Placing a metal mask on a stage, and exposing the metal mask on the upper surface to the upper surface and the lower surface; and respectively covering the upper surface and the lower surface of the metal mask by two laser devices The surface is illuminated with laser light. 一種潔淨金屬遮罩之方法,包括:放置一金屬遮罩於一第一位置,並使該金屬遮罩的上表面朝向一第一方向;當該金屬遮罩於該第一位置時,藉由一雷射裝置對該金屬遮罩的上表面照射雷射光;移動該金屬遮罩至一第二位置,並使該金屬遮罩的下表面朝向一第二方向,其中該第二方向係不同於該第一方向;及當該金屬遮罩於該第二位置時,藉由另一雷射裝置對該金屬遮罩的下表面照射雷射光。 A method of cleaning a metal mask, comprising: placing a metal mask in a first position and directing an upper surface of the metal mask toward a first direction; when the metal is masked in the first position, a laser device irradiates the upper surface of the metal mask with laser light; moving the metal mask to a second position, and directing a lower surface of the metal mask toward a second direction, wherein the second direction is different from The first direction; and when the metal is masked in the second position, the lower surface of the metal mask is irradiated with laser light by another laser device.
TW102100583A 2013-01-08 2013-01-08 Mask cleaning apparatus and the method thereof TWI515424B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW102100583A TWI515424B (en) 2013-01-08 2013-01-08 Mask cleaning apparatus and the method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102100583A TWI515424B (en) 2013-01-08 2013-01-08 Mask cleaning apparatus and the method thereof

Publications (2)

Publication Number Publication Date
TW201428275A TW201428275A (en) 2014-07-16
TWI515424B true TWI515424B (en) 2016-01-01

Family

ID=51726034

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102100583A TWI515424B (en) 2013-01-08 2013-01-08 Mask cleaning apparatus and the method thereof

Country Status (1)

Country Link
TW (1) TWI515424B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102488145B1 (en) 2017-05-30 2023-01-17 삼성디스플레이 주식회사 Apparatus for cleaning mask and method of mask cleaning
CN110672634B (en) * 2019-10-25 2021-12-14 昆山佑泽欣智控设备有限公司 LED radiator visual detection equipment

Also Published As

Publication number Publication date
TW201428275A (en) 2014-07-16

Similar Documents

Publication Publication Date Title
KR101362329B1 (en) Inspecting apparatus of pannel for display
JP2007107945A (en) Inspection device of substrate
JP4809032B2 (en) Mounting board inspection device and printing device
JP4085538B2 (en) Inspection device
TWI353894B (en) A spreading device and a method for spreading liqu
TWI515424B (en) Mask cleaning apparatus and the method thereof
TW201213931A (en) Repair apparatus
KR101236286B1 (en) Apparatus for inspecting defect of panel
KR20130098838A (en) Laser processing apparatus, laser processing method and computer-readable recording medium storing laser processing program
JP2006344705A (en) Stage device of substrate, inspecting device, and correcting device
TWI503631B (en) Coating apparatus
JP2005017386A (en) Device for inspecting and correcting flat plate work
JP5004530B2 (en) Board inspection equipment
KR101167079B1 (en) Thin layers deposition apparatus for manufacturing oled
JP4135283B2 (en) Inspection device
JP2008268055A (en) Foreign material inspecting device, and foreign material inspection method
JP2004333198A (en) Substrate inspection apparatus
JP4154816B2 (en) Inspection device
JP5325406B2 (en) Board inspection equipment
JP2006066747A (en) Positioning apparatus and method of substrate
KR20190079199A (en) Apparatus for supporting mask and method of aligning mask using the same
JP2006038825A (en) Micropattern observation device and micropattern correction device using it
KR102025704B1 (en) Apparatus for inspecting film
JP2020095223A (en) Element array manufacturing apparatus and specific element removal device
JPH11242007A (en) Inspection device of o-ring