TWI514117B - Electronic device and hard disk drive blank thereof - Google Patents
Electronic device and hard disk drive blank thereof Download PDFInfo
- Publication number
- TWI514117B TWI514117B TW102135051A TW102135051A TWI514117B TW I514117 B TWI514117 B TW I514117B TW 102135051 A TW102135051 A TW 102135051A TW 102135051 A TW102135051 A TW 102135051A TW I514117 B TWI514117 B TW I514117B
- Authority
- TW
- Taiwan
- Prior art keywords
- hard disk
- frame
- engaging
- flow
- block
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
本發明係關於一種電子裝置,特別是一種裝設有硬碟偽框之電子裝置。The present invention relates to an electronic device, and more particularly to an electronic device equipped with a hard disk dummy frame.
電子裝置通常包括多種電子元件。散熱的設計通常會針對電子裝置滿載電子元件時的狀態進行設計。但在電子裝置使用之初,電子裝置會留下許多空間,以供日後能夠擴充其他電子元件。但在尚未擴充電子元件時,會在預定裝設擴充電子元件的位置上,裝設實際上不具功能但具有類似形狀的偽框。Electronic devices typically include a variety of electronic components. The design of the heat dissipation is usually designed for the state in which the electronic device is fully loaded with electronic components. However, at the beginning of the use of electronic devices, electronic devices leave a lot of space for future expansion of other electronic components. However, when the electronic component has not been expanded, a pseudo frame which is not functional but has a similar shape is installed at a position where the expansion electronic component is to be installed.
此些偽框中,有些能夠設置在電子裝置之殼體的容置孔內,以避免外界物質在容置孔尚未裝設電子元件時,從殼體的容置孔掉入殼體內,而導致殼體內之電子元件的損壞。舉例而言,電子裝置能夠在其殼體之多個容置孔內分別擴充多個硬碟。但在尚未裝設硬碟的容置孔內,會裝設有硬碟偽框。為了逸散電子裝置所產生的熱,習知硬碟偽框通常會具有十分接近容置孔大小之極大的開口率,以增大散熱氣流的量。然而,如此之設置,通常會導致散熱氣流僅從裝設 有硬碟偽框的容置孔通過,裝設有硬碟的容置孔則幾乎沒有散熱氣流通過。因此,硬碟本身的熱無法藉由散熱氣流逸散,而常導致過熱而損毀。Some of the dummy frames can be disposed in the receiving holes of the housing of the electronic device to prevent foreign matter from falling into the housing from the receiving hole of the housing when the receiving hole is not provided with the electronic component. Damage to electronic components within the housing. For example, the electronic device can respectively expand a plurality of hard disks in a plurality of receiving holes of the housing. However, a hard disk dummy frame is installed in the receiving hole of the hard disk. In order to dissipate the heat generated by the electronic device, conventional hard disk dummy frames generally have an aperture ratio that is very close to the size of the aperture to increase the amount of heat dissipation. However, such a setting usually causes the cooling airflow to be installed only from The accommodating hole having the hard disk dummy frame passes through, and the accommodating hole in which the hard disk is mounted has almost no heat-dissipating airflow. Therefore, the heat of the hard disk itself cannot be dissipated by the heat dissipation airflow, which often causes overheating and damage.
有鑑於以上的問題,本發明提出一種電子裝置及其硬碟偽框,藉以使散熱氣流能夠均勻流經容置孔及硬碟,以逸散硬碟所產生之熱。In view of the above problems, the present invention provides an electronic device and a hard disk dummy frame thereof, so that the heat dissipation airflow can uniformly flow through the receiving hole and the hard disk to dissipate the heat generated by the hard disk.
本發明揭露一種電子裝置,包括一殼體、一硬碟、一硬碟偽框及一風流產生器。殼體具有多個容置孔。硬碟裝設於多個容置孔之其中一者。硬碟偽框裝設於多個容置孔之其中另一者。硬碟偽框包括一框體、一擋流件及一卡合組件。框體具有相對之一第一側及一第二側。擋流件設置於框體,且具有一擋流部及一流通口。流通口接近於第一側。卡合組件設置於框體且位於第二側。擋流件遮擋部分卡合組件。卡合組件卡合於殼體。風流產生器設置於殼體之內,係用以產生散熱氣流。一部分散熱氣流經過硬碟,一部分散熱氣流經過硬碟偽框之流通口。The invention discloses an electronic device comprising a casing, a hard disk, a hard disk dummy frame and a wind flow generator. The housing has a plurality of receiving holes. The hard disk is mounted on one of the plurality of receiving holes. The hard disk dummy frame is mounted on the other of the plurality of receiving holes. The hard disk dummy frame includes a frame body, a flow blocking member and a snap component. The frame has a first side and a second side opposite to each other. The flow stop is disposed on the frame and has a flow blocking portion and a flow opening. The flow port is close to the first side. The snap component is disposed on the frame and on the second side. The baffle blocks part of the snap-fit assembly. The snap component is engaged with the housing. The airflow generator is disposed within the housing for generating a heat sinking airflow. A part of the cooling airflow passes through the hard disk, and a part of the cooling airflow passes through the flow port of the hard disk dummy frame.
本發明還揭露一種硬碟偽框,包括一框體、一擋流件及一卡合組件。框體具有相對之一第一側及一第二側。擋流件設置於框體,且具有一擋流部及一流通口。流通口接近於第一側。卡合組件設置於框體且位於第二側。卡合組件卡合於殼體。擋流件遮擋部分卡合組件。The invention also discloses a hard disk dummy frame, comprising a frame body, a flow blocking member and a snap assembly. The frame has a first side and a second side opposite to each other. The flow stop is disposed on the frame and has a flow blocking portion and a flow opening. The flow port is close to the first side. The snap component is disposed on the frame and on the second side. The snap component is engaged with the housing. The baffle blocks part of the snap-fit assembly.
根據本發明之電子裝置及其硬碟偽框,藉由擋流件之擋流部遮擋部分散熱氣流,且散熱氣流能夠流經擋流部之流通口,以使電子裝置中之散熱氣流能夠均勻地流經硬碟偽框之流通口以及電子裝置之殼體之其他開口,以利逸散位於其他開口之電子元件所產生之熱。According to the electronic device and the hard disk dummy frame of the present invention, a portion of the heat-dissipating airflow is blocked by the flow blocking portion of the flow blocking member, and the heat-dissipating airflow can flow through the flow opening of the blocking portion, so that the heat-dissipating airflow in the electronic device can be evenly distributed. The ground flows through the flow opening of the hard disk dummy frame and other openings of the housing of the electronic device to facilitate the heat generated by the electronic components located in other openings.
以上之關於本發明內容之說明及以下之實施方式之說明係用以示範與解釋本發明之精神與原理,並且提供本發明之專利申請範圍更進一步之解釋。The above description of the present invention and the following description of the embodiments of the present invention are intended to illustrate and explain the spirit and principles of the invention.
1‧‧‧電子裝置1‧‧‧Electronic device
11‧‧‧殼體11‧‧‧Shell
11a‧‧‧容置孔11a‧‧‧ accommodating holes
12‧‧‧硬碟偽框12‧‧‧ hard disk pseudo frame
121‧‧‧框體121‧‧‧ frame
1211‧‧‧第一側1211‧‧‧ first side
1212‧‧‧第二側1212‧‧‧ second side
122‧‧‧擋流件122‧‧‧Baffle
122a‧‧‧內側面122a‧‧‧ inside
122b‧‧‧外側面122b‧‧‧Outside
1221‧‧‧擋流部1221‧‧‧Block
1222‧‧‧流通口1222‧‧‧ circulation
123‧‧‧卡合組件123‧‧‧Clamping components
1231‧‧‧卡合塊1231‧‧‧卡合块
1231a‧‧‧傾斜面1231a‧‧‧ sloped surface
1232‧‧‧彈性件1232‧‧‧Flexible parts
1233‧‧‧把手1233‧‧‧Handle
124‧‧‧彈性推抵件124‧‧‧Flexible push-offs
1240‧‧‧連接件1240‧‧‧Connecting parts
13‧‧‧風流產生器13‧‧‧Airflow Generator
14‧‧‧硬碟14‧‧‧ Hard disk
第1圖繪示依照本發明之實施例之電子裝置之立體圖。1 is a perspective view of an electronic device in accordance with an embodiment of the present invention.
第2圖繪示第1圖之硬碟偽框之立體圖。FIG. 2 is a perspective view of the hard disk dummy frame of FIG. 1.
第3A及3B圖繪示第2圖之硬碟偽框之另一視角之立體爆炸圖。3A and 3B are perspective exploded views of another perspective view of the hard disk dummy frame of Fig. 2.
以下在實施方式中詳細敘述本發明之詳細特徵以及優點,其內容足以使任何本領域中具通常知識者了解本發明之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖式,任何本領域中具通常知識者可輕易地理解本發明相關之目的及優點。以下之實施例係進一步詳細說明本發明之觀點,但非以任何觀點限制本發明之範疇。The detailed features and advantages of the present invention are set forth in the Detailed Description of the Detailed Description of the Detailed Description of the <RTIgt; The related objects and advantages of the present invention are readily understood by those of ordinary skill in the art. The following examples are intended to describe the present invention in further detail, but are not intended to limit the scope of the invention.
請參照第1及2圖,第1圖繪示依照本發明之實 施例之電子裝置1之立體圖,第2圖繪示第1圖之硬碟偽框12之立體圖。於本實施例中,電子裝置1包括一殼體11、至少一硬碟偽框12、一風流產生器13及至少一硬碟14。於本實施例中,電子裝置1包括四個硬碟偽框12及一個硬碟14,但不限於此。硬碟偽框12及硬碟14之數量能依使用需求而不限制數量。殼體11具有多個容置孔11a。硬碟偽框12及硬碟14裝設於容置孔11a。硬碟偽框12及硬碟14之總數與容置孔11a之數量相同。當硬碟14之數量等於容置孔11a之數量時,則所有硬碟14皆裝設於所有容置孔11a內。當硬碟14之數量小於容置孔11a之數量時,除了將所有硬碟14裝設於部分數量的容置孔11a內。未裝設硬碟14之容置孔11a則全數裝設有硬碟偽框12。風流產生器13設置於殼體11之內,且用以產生散熱氣流。Please refer to Figures 1 and 2, and Figure 1 illustrates the implementation according to the present invention. A perspective view of the electronic device 1 of the embodiment, and a second perspective view of the hard disk dummy frame 12 of the first embodiment. In this embodiment, the electronic device 1 includes a housing 11 , at least one hard disk dummy frame 12 , a wind flow generator 13 , and at least one hard disk 14 . In the embodiment, the electronic device 1 includes four hard disk dummy frames 12 and one hard disk 14, but is not limited thereto. The number of hard disk pseudo-frames 12 and hard disks 14 can be limited according to the needs of use. The housing 11 has a plurality of receiving holes 11a. The hard disk dummy frame 12 and the hard disk 14 are mounted in the receiving hole 11a. The total number of hard disk dummy frames 12 and hard disks 14 is the same as the number of receiving holes 11a. When the number of the hard disks 14 is equal to the number of the receiving holes 11a, all the hard disks 14 are installed in all the receiving holes 11a. When the number of the hard disks 14 is smaller than the number of the accommodating holes 11a, all the hard disks 14 are mounted in a part of the accommodating holes 11a. The hard disk dummy frame 12 is mounted on all of the receiving holes 11a of the hard disk 14 . The airflow generator 13 is disposed within the housing 11 and is configured to generate a heat dissipation airflow.
硬碟偽框12包括一框體121、一擋流件122、一卡合組件123及多個彈性推抵件124。框體121具有相對之一第一側1211及一第二側1212。擋流件122設置於框體121,且具有一擋流部1221及一流通口1222。流通口1222接近於第一側1211。流通口1222能夠具有多個子開口,但不限於此。於其他實施例中,流通口1222亦能夠為單一開口。擋流部1221之面積大於流通口1222之面積。擋流件122之內側面122a朝向殼體11之內,擋流件122之外側面122b朝向殼體11之外。The hard disk dummy frame 12 includes a frame body 121, a flow stop member 122, an engaging component 123 and a plurality of elastic pushing members 124. The frame 121 has a first side 1211 and a second side 1212 opposite to each other. The flow stop 122 is disposed on the frame 121 and has a flow blocking portion 1221 and a flow opening 1222. The flow port 1222 is adjacent to the first side 1211. The circulation port 1222 can have a plurality of sub-openings, but is not limited thereto. In other embodiments, the flow port 1222 can also be a single opening. The area of the flow blocking portion 1221 is larger than the area of the flow opening 1222. The inner side surface 122a of the flow stop 122 faces the inside of the housing 11, and the outer side surface 122b of the flow stop 122 faces the outside of the housing 11.
卡合組件123設置於框體121且位於第二側 1212。擋流件122遮擋住部分卡合組件123。卡合組件123能卡合於殼體11,以使硬碟偽框12裝設於殼體11之容置孔11a。卡合組件123包括一卡合塊1231、一彈性件1232及一把手1233。卡合塊1231可移動地設置於框體121。卡合塊1231相對於框體121具有一卡合位置及一解除位置。彈性件1232設置於卡合塊1231及框體121之間。把手1233與卡合塊1231相連。使用者能夠藉由拉動把手1233而使卡合塊1231從卡合位置移動至解除位置。於本實施例中,把手1233外露於擋流件122之外側面122b,以令使用者能從殼體11外拉動把手1233。The engaging component 123 is disposed on the frame 121 and located on the second side 1212. The baffle 122 blocks a portion of the snap-fit assembly 123. The engaging component 123 can be engaged with the housing 11 such that the hard disk dummy frame 12 is mounted on the receiving hole 11a of the housing 11. The engaging component 123 includes an engaging block 1231, an elastic member 1232 and a handle 1233. The engaging block 1231 is movably disposed in the frame 121. The engaging block 1231 has an engaging position and a releasing position with respect to the frame 121. The elastic member 1232 is disposed between the engaging block 1231 and the frame 121. The handle 1233 is connected to the engaging block 1231. The user can move the engaging block 1231 from the engaged position to the released position by pulling the handle 1233. In the present embodiment, the handle 1233 is exposed on the outer side 122b of the flow stop 122 to allow the user to pull the handle 1233 from the outside of the housing 11.
彈性推抵件124設置於框體121之周圍,且抵靠於容置孔11a周圍之殼體11。於硬碟偽框12裝設於殼體11之容置孔11a時,若電子裝置1受到震動,框體121能夠藉由彈性推抵件124而避免撞擊置殼體11。The elastic pushing member 124 is disposed around the frame 121 and abuts against the housing 11 around the receiving hole 11a. When the hard disk dummy frame 12 is mounted on the receiving hole 11a of the casing 11, if the electronic device 1 is subjected to vibration, the frame 121 can be prevented from striking the casing 11 by the elastic pushing member 124.
請參照第3A及3B圖,繪示第2圖之硬碟偽框12之另一視角之立體爆炸圖。其中,第3A圖表示卡合塊位於卡合位置時之硬碟偽框12之立體爆炸圖,第3B圖表示卡合塊位於解除位置時之硬碟偽框12之立體爆炸圖。彈性件1232於卡合塊1231位於卡合位置時之變形量小於彈性件1232於卡合塊1231位於解除位置時之變形量。因此,於常態下,卡合塊1231會位於第3A圖所示之卡合位置。此外,多個彈性推抵件124能夠由一連接件1240相連。連接件1240設置於擋流 件122之內側面122a。連接件1240能夠具有多個開孔,亦能夠為網狀結構。Referring to FIGS. 3A and 3B, a perspective exploded view of another perspective view of the hard disk dummy frame 12 of FIG. 2 is illustrated. 3A shows a three-dimensional exploded view of the hard disk dummy frame 12 when the engaging block is in the engaged position, and FIG. 3B shows a three-dimensional exploded view of the hard disk dummy frame 12 when the engaging block is in the released position. The amount of deformation of the elastic member 1232 when the engaging block 1231 is at the engaging position is smaller than the amount of deformation of the elastic member 1232 when the engaging block 1231 is at the releasing position. Therefore, in the normal state, the engaging block 1231 will be located at the engaging position shown in FIG. 3A. Further, a plurality of elastic pushers 124 can be connected by a connector 1240. The connecting member 1240 is disposed at the blocking flow Inner side 122a of member 122. The connector 1240 can have a plurality of openings and can also be a mesh structure.
當要將硬碟偽框12安裝於殼體11時,使用者能夠拉動把手1233而使卡合塊1231從卡合位置移動至解除位置,同時增加彈性件1232之變形量,以增加內蓄於彈性件1232之彈性恢復力。並將硬碟偽框12從殼體11之外推入殼體11之內,再放開把手1233,使卡合塊1231藉由彈性件1232之彈性恢復力從解除位置移動至卡合位置,以使卡合組件123與殼體11卡合。When the hard disk dummy frame 12 is to be mounted on the casing 11, the user can pull the handle 1233 to move the engaging block 1231 from the engaging position to the releasing position, and increase the deformation amount of the elastic member 1232 to increase the internal storage. The elastic restoring force of the elastic member 1232. The hard disk dummy frame 12 is pushed into the casing 11 from the outside of the casing 11, and the handle 1233 is released, so that the engaging block 1231 is moved from the releasing position to the engaging position by the elastic restoring force of the elastic member 1232. The snap-fit assembly 123 is engaged with the housing 11.
或者,直接將硬碟偽框12從殼體11之外推入殼體11之內。藉由卡合塊1231之傾斜面1231a經過殼體11時,殼體11沿著傾斜面1231a推壓卡合塊1231而使其從卡合位置移動至解除位置。當硬碟偽框12移動至殼體11不與卡合塊1231接觸時,卡合塊1231能藉由彈性件1232之彈性恢復力從解除位置移動至卡合位置,以使卡合組件123與殼體11卡合。Alternatively, the hard disk dummy frame 12 is directly pushed into the casing 11 from outside the casing 11. When the inclined surface 1231a of the engaging block 1231 passes through the casing 11, the casing 11 pushes the engaging block 1231 along the inclined surface 1231a to move from the engaged position to the released position. When the hard disk dummy frame 12 is moved until the housing 11 is not in contact with the engaging block 1231, the engaging block 1231 can be moved from the releasing position to the engaging position by the elastic restoring force of the elastic member 1232 so that the engaging member 123 and the engaging member 123 The housing 11 is engaged.
當要從殼體11之外拆卸硬碟偽框12時,使用者能夠拉動把手1233而使卡合塊1231從卡合位置移動至解除位置,以解除卡合組件123與殼體11之間的卡合。接著,再將硬碟偽框12從殼體11拉出殼體11之外。When the hard disk dummy frame 12 is to be detached from the outside of the casing 11, the user can pull the handle 1233 to move the engaging block 1231 from the engaging position to the releasing position to release the between the engaging component 123 and the casing 11. Engage. Next, the hard disk dummy frame 12 is pulled out of the casing 11 from the casing 11.
如第1圖所示,於本實施例中,使用者將硬碟14裝設於第一個容置孔11a,且將硬碟偽框12裝設於第二至 第四個容置孔11a。當電子裝置1啟動,且風流產生器13產生散熱氣流時,殼體11外之氣體能從殼體11外經由容置孔11a進入殼體11內。由於裝設於各個容置孔11a中之硬碟偽框12具有擋流件122以遮蔽部分散熱氣流,使一部分散熱氣流會流經硬碟偽框12之流通口1222,一部分散熱氣流會被擋流件122限制,轉而流經硬碟14附近以對硬碟14散熱。因此,流經硬碟14之散熱氣流能夠逸散硬碟14之熱。於本實施例中,擋流部1221相對於容置孔11a之面積能夠與硬碟14相對於容置孔11a之面積類似,故使得散熱氣流能夠均勻流經各個容置孔11a,而達到不論是裝設硬碟14還是裝設硬碟偽框12,對於流場的影響具有較小差異之效果。As shown in FIG. 1 , in the embodiment, the user installs the hard disk 14 in the first receiving hole 11 a and the hard disk dummy frame 12 in the second to The fourth receiving hole 11a. When the electronic device 1 is activated and the airflow generator 13 generates a heat-dissipating airflow, the gas outside the casing 11 can enter the casing 11 from the outside of the casing 11 via the accommodating hole 11a. Since the hard disk dummy frame 12 installed in each of the accommodating holes 11a has the flow blocking member 122 to shield part of the heat dissipation airflow, a part of the heat dissipation airflow flows through the flow port 1222 of the hard disk dummy frame 12, and a part of the heat dissipation airflow is blocked. The flow member 122 is restricted and flows through the vicinity of the hard disk 14 to dissipate heat to the hard disk 14. Therefore, the heat dissipation air flowing through the hard disk 14 can dissipate the heat of the hard disk 14. In this embodiment, the area of the blocking portion 1221 relative to the receiving hole 11a can be similar to the area of the hard disk 14 with respect to the receiving hole 11a, so that the heat-dissipating airflow can uniformly flow through the respective receiving holes 11a, regardless of Whether the hard disk 14 is mounted or the hard disk dummy frame 12 is installed has a small difference effect on the flow field.
綜上所述,本發明之電子裝置及其硬碟偽框,藉由擋流件之擋流部遮擋部分散熱氣流,且散熱氣流能夠流經擋流部之流通口,以使電子裝置中之散熱氣流能夠均勻地流經硬碟偽框之流通口以及設有硬碟之容置孔,以利逸散硬碟所產生之熱。此外,使用者能夠藉由拉動把手帶動卡合塊以使卡合塊卡合或解除卡合於殼體,而能從殼體之外拆裝硬碟偽框。因此能夠避免欲拆裝硬碟及硬碟偽框時,還必須將殼體拆開的步驟。In summary, the electronic device and the hard disk pseudo frame of the present invention block a part of the heat dissipation airflow by the blocking portion of the flow blocking member, and the heat dissipation airflow can flow through the flow opening of the blocking portion to make the electronic device The heat-dissipating airflow can uniformly flow through the flow opening of the hard disk dummy frame and the receiving hole provided with the hard disk to facilitate the heat generated by the hard disk. In addition, the user can remove the hard disk dummy frame from the outside of the casing by pulling the handle to drive the engaging block to engage or disengage the engaging block. Therefore, it is possible to avoid the step of disassembling the casing when the hard disk and the hard disk dummy frame are to be removed.
雖然本發明以前述之實施例揭露如上,然其並非用以限定本發明。在不脫離本發明之精神和範圍內,所為之更動與潤飾,均屬本發明之專利保護範圍。關於本發明所界 定之保護範圍請參考所附之申請專利範圍。Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the invention. It is within the scope of the invention to be modified and modified without departing from the spirit and scope of the invention. About the boundaries of the present invention Please refer to the attached patent application scope for the scope of protection.
1‧‧‧電子裝置1‧‧‧Electronic device
11‧‧‧殼體11‧‧‧Shell
11a‧‧‧容置孔11a‧‧‧ accommodating holes
12‧‧‧硬碟偽框12‧‧‧ hard disk pseudo frame
13‧‧‧風流產生器13‧‧‧Airflow Generator
14‧‧‧硬碟14‧‧‧ Hard disk
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW102135051A TWI514117B (en) | 2013-09-27 | 2013-09-27 | Electronic device and hard disk drive blank thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW102135051A TWI514117B (en) | 2013-09-27 | 2013-09-27 | Electronic device and hard disk drive blank thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201512817A TW201512817A (en) | 2015-04-01 |
TWI514117B true TWI514117B (en) | 2015-12-21 |
Family
ID=53437125
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW102135051A TWI514117B (en) | 2013-09-27 | 2013-09-27 | Electronic device and hard disk drive blank thereof |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI514117B (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201005489A (en) * | 2008-07-18 | 2010-02-01 | Hon Hai Prec Ind Co Ltd | Dissipating-heat device and bracket thereof |
TWM400735U (en) * | 2010-11-05 | 2011-03-21 | Inventec Corp | Bearing framework |
-
2013
- 2013-09-27 TW TW102135051A patent/TWI514117B/en not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201005489A (en) * | 2008-07-18 | 2010-02-01 | Hon Hai Prec Ind Co Ltd | Dissipating-heat device and bracket thereof |
TWM400735U (en) * | 2010-11-05 | 2011-03-21 | Inventec Corp | Bearing framework |
Also Published As
Publication number | Publication date |
---|---|
TW201512817A (en) | 2015-04-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6400568B1 (en) | Method and apparatus for cooling electronic components | |
US20090147477A1 (en) | Electronic device | |
KR20120129885A (en) | Set-top box having microperforations | |
KR101197251B1 (en) | Freezing case for smart phone | |
US7661462B2 (en) | Heat dissipation assembly | |
JP5295043B2 (en) | Heat dissipation structure of electronic control unit | |
JP2017005975A (en) | Inverter | |
TWI647997B (en) | Backflow prevention device and server system using same | |
TWI514117B (en) | Electronic device and hard disk drive blank thereof | |
TWI605646B (en) | Holder to constrain elastic members of a receptacle | |
US8300411B2 (en) | Fan mounting apparatus | |
US10238006B2 (en) | Heat dissipating module | |
CN107023517B (en) | Blower module and electronic device | |
US20120293957A1 (en) | Heat dissipating system for computer | |
JP6829748B2 (en) | Mechanism to prevent reflow due to fan flap failure | |
US20130309074A1 (en) | Swivelling shield providing protection to fan | |
US20020163789A1 (en) | Dust filtering apparatus for a computer system | |
US7569088B2 (en) | Method and apparatus for circulating air through a hard disk drive | |
JP3209292U (en) | Heat sink structure | |
TWI593345B (en) | Server | |
JP4566901B2 (en) | Communication terminal device | |
TWI489934B (en) | Electronic device | |
TWI660265B (en) | Heat dissipation and shockproof structure | |
TW201315355A (en) | Fixing device for fan | |
TWI400031B (en) | Air duct |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |