JP4566901B2 - Communication terminal device - Google Patents

Description

  The present invention relates to a communication terminal device such as an optical subscriber line terminating device.

  As a conventional communication terminal device, for example, there is an optical subscriber line terminating device disclosed in Patent Document 1. The optical subscriber line terminator performs optical communication connection between the optical communication station side and the subscriber side optical communication device, and stores the extra length of the optical fiber for performing the optical communication connection. . In the optical subscriber line terminating device disclosed in Patent Document 1, an optical fiber storage portion that stores the extra length of the optical fiber is detachably installed on the upper surface of the device main body. The apparatus main body incorporates a substrate on which a circuit for an optical subscriber terminal is mounted. Further, in the optical subscriber line terminating device disclosed in Patent Document 2, an optical fiber storage portion is detachably installed on the outer surface of the device main body that becomes the wall side when hanging on the wall.

JP 2004-333835 A JP 2002-258062 A

  For example, in the case of Patent Document 1, a conventional optical subscriber line termination device is provided with an optical fiber storage portion and a device main body cover for blocking this from the outside in order to install an optical fiber storage portion on the outer surface of the device main body. The external dimensions of the main body are increased. Moreover, it is necessary to provide a connector for connecting to the optical fiber and a special engagement structure for detachably supporting and fixing the optical fiber storage portion on the outer surface of the apparatus main body.

  Further, Patent Documents 1 and 2 do not disclose the heat dissipation structure inside the apparatus main body. A substrate on which a circuit for executing various processes is mounted is provided in the housing of the apparatus main body. During the operation of the communication terminal device, a heat pool is formed in the upper portion of the device main body along the direction of gravity due to the convection of the heat generated from the circuit on the substrate, and a high temperature state is obtained. The components mounted on the board are designed to operate appropriately at temperatures below various rated temperatures. For this reason, when the circuit components on the substrate are exposed to high-temperature air, there is a possibility that sufficient performance may not be achieved beyond the rated temperature, or malfunction may occur.

  In order to avoid such a problem, for example, there is a method of dissipating and dissipating heat using a heat radiating fin or the like, or a method of forcibly air cooling using a fan. However, any of these methods may increase the outer dimensions of the communication terminal device, increase the product weight, increase the number of assembly steps during manufacturing, and increase the cost.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to obtain a communication terminal device that can avoid the influence of heat generated from a circuit on a substrate and can be downsized. To do.

A communication terminal device according to the present invention includes a casing that dissipates heat by natural air cooling, an optical fiber storage section that is installed along the direction of gravity in the casing, and stores an optical fiber, and an optical fiber along the direction of gravity in the casing. disposed parallel to the housing part, at least the direction of gravity in the height along the have a smaller outside dimension than the optical fiber storage section, and a substrate circuit as a heat source is mounted, the optical fiber accommodating portion and the substrate the difference in external dimensions, the top along the gravity direction in the housing of the substrate, forming a heat reservoir and comprising the space of the heat generated from the circuit mounted on the said board, corresponding to the position of the space is at least heat reservoir A hole for releasing heat generated from the circuit to the outside of the casing is formed on the outer surface of the casing .

  According to the present invention, since a space is formed in the upper part of the substrate having a small outer dimension in the case that dissipates heat by natural air cooling, even if a heat pool due to heat generated from the circuit on the substrate is formed in the space. There is an effect that the circuit components on the substrate are not exposed to high-temperature air and can be effectively dissipated. In addition, since the optical fiber storage portion is provided in parallel with the substrate in the housing of the device main body without providing the optical fiber storage portion and the device main body separately, there is an effect that the communication terminal device can be downsized. .

Embodiment 1 FIG.
1A and 1B are diagrams showing a communication terminal apparatus according to Embodiment 1 of the present invention, in which FIG. 1A is a front view, FIG. 1B is a side view, and FIG. 1C is a rear view. As shown in the figure, the communication terminal apparatus according to the first embodiment is installed on a table with the installation adapter 1 attached to the bottom surface of the apparatus body (housing) 2. Further, the installation adapter 1 attached to the wall is engaged with the back surface of the terminal device main body 2 to be supported and fixed to be installed on the wall.

  FIG. 2 is a perspective view of the communication terminal device according to Embodiment 1 when installed on a table. As shown in the figure, the installation adapter 1 is engaged and supported and fixed to the bottom surface of the apparatus main body 2, and the apparatus main body 2 is installed on the table using the installation adapter 1 as a stand. FIG. 3 is a perspective view of the communication terminal device according to the first embodiment when it is wall-mounted, as seen from the wall side through the wall. As shown in the figure, the installation adapter 1 is engaged and fixed on the back surface of the apparatus main body 2, and is installed on the wall via the installation adapter 1. The installation adapter 1 has three screw holes as shown, and is fixed to the wall by screwing through these screw holes.

  FIG. 4 is a perspective view showing a schematic configuration of the communication terminal device according to the first embodiment, and shows an internal configuration of the apparatus main body installed on the table with a broken line. In addition, the same code | symbol is attached | subjected to the structure which is the same as that of the structure shown to FIGS. 1-3, or corresponds to this, and description is abbreviate | omitted. As shown in FIG. 4, in the present invention, a substrate 3 on which various circuits are mounted and an optical fiber storage portion 4 for storing an optical fiber are provided in parallel in the apparatus main body 2. By comprising in this way, compared with the structure which provides a connector etc. in the outer surface of an apparatus main body like patent document 1, an apparatus can be reduced in size.

  Further, the substrate 3 is formed to be smaller than the outer dimensions of the optical fiber storage portion 4. As a result, a space is formed in the upper part of the apparatus main body 2 along the direction of gravity, that is, in the upper part of the substrate 3 when installed on a table as shown in FIG. By forming this space, the present invention can avoid the above-mentioned adverse effects due to the heat generated from the circuit on the substrate 3 without providing a special cooling structure, and can reduce the size of the apparatus. it can.

Next, the heat radiation principle of the communication terminal device according to the first embodiment will be described.
First, a description will be given in comparison with a configuration without the heat dissipation structure.
FIG. 5 is a diagram for explaining the heat dissipation structure of the communication terminal device according to the first embodiment, and is a line drawn at the same position as the AA line in FIG. 4 for the communication terminal device not having the heat dissipation structure. It is sectional drawing cut along. In addition, the same code | symbol is attached | subjected to the structure which is the same as that of the structure shown to FIGS. 1-4, or corresponds to this, and description is abbreviate | omitted. In the example shown in FIG. 5, the outer dimensions of the substrate 3 and the optical fiber storage portion 4 are substantially the same. For this reason, a part of the substrate 3 on which a circuit serving as a heat source during operation reaches the region 5 in the apparatus main body 2.

  In this case, the heat generated from the circuit on the substrate 3 convects in the apparatus main body 2 and reaches the region 5, and the portion indicated by the symbol B in FIG. Therefore, the circuit components on the board 3 in the part that has reached the region 5 are exposed to high-temperature air and operate, and may not exhibit sufficient performance beyond the rated temperature or may malfunction. is there.

  FIG. 6 is a diagram for explaining the heat dissipation structure of the communication terminal device according to the first embodiment, and shows a communication terminal device having another heat dissipation structure that does not have the heat dissipation structure. It is sectional drawing cut along the line pulled in the same position. In the example of FIG. 6, the external dimensions of the substrate 3 and the optical fiber storage unit 4 are substantially the same as in FIG. 5, but a heat reservoir by convection of heat generated from the circuit on the substrate 3 is provided in the upper part of the substrate 3. For this reason, the external dimensions of the apparatus main body 2a are extended upward along the direction of gravity by the amount indicated by symbol C. If comprised in this way, the circuit components on the board | substrate 3 will not be exposed to the air of a high temperature state, and the malfunctions mentioned above will not generate | occur | produce. However, this configuration limits the downsizing of the device.

Next, the heat dissipation structure according to Embodiment 1 will be described.
7 is a diagram showing a heat dissipation structure of the communication terminal device according to the first embodiment, and is a cross-sectional view taken along the line AA in FIG. As shown in FIG. 7, the substrate 3 according to the first embodiment is formed to be smaller than the outer dimensions of the optical fiber storage portion 4. Thereby, when the board | substrate 3 and the optical fiber accommodating part 4 are provided in the apparatus main body 2, and the apparatus is installed on a table, the space 5a is formed in the upper part along the direction of gravity in the apparatus main body 2.

  Heat generated from the circuit on the substrate 3 is convected in the housing of the apparatus body 2 and accumulated in the space 5a. However, as shown in FIG. 7, the height of the substrate 3 along the direction of gravity is smaller than that of the optical fiber housing 4, and the circuit components of the substrate 3 are not exposed to the high-temperature air in the space 5a.

  The optical fiber storage unit 4 has a limit in miniaturization due to the restriction of the minimum R of the optical fiber, and cannot be smaller than a certain size. In the present invention, the housing of the apparatus main body 2 has a minimum external dimension that can cover the optical fiber storage part 4 on the basis of the external dimension of the optical fiber storage part 4. In addition, in order to store the substrate 3 and the optical fiber storage unit 4 in the apparatus main body 2 in a compact manner, there is a portion in which the substrate surface of the substrate 3 and the optical fiber of the optical fiber storage unit 4 are wound and stored in the housing of the apparatus main body 2. The board | substrate 3 and the optical fiber accommodating part 4 are installed in parallel so that the formed surface may become parallel. For this reason, there is almost no gap in the housing of the apparatus main body 2, and it is necessary to take measures against heat generated from the circuit on the substrate 3.

  Therefore, in the present invention, as shown in FIG. 7, at least the height of the substrate 3 along the direction of gravity is configured to be smaller than the optical fiber housing 4. As a result, the space 5a serving as a heat reservoir as described above is formed in the upper portion of the substrate 3, and the circuit components on the substrate 3 are not exposed to high-temperature air. In this way, it is possible to avoid problems due to heat generated from the circuit on the substrate 3 due to natural air cooling without adopting a forced cooling system equipped with a fan or the like in the apparatus main body 2.

  FIG. 8 is a diagram illustrating a specific configuration example of the communication terminal device according to the first embodiment, which is shown expanded in each configuration. In the example of FIG. 8, the apparatus main body 2 is composed of two covers. The two covers constituting the apparatus main body 2 have engaging portions formed at the connecting portions thereof, and are fitted together via the engaging portions. Further, as described above, the substrate 3 and the optical fiber storage unit 4 are arranged in parallel so that the substrate surface of the substrate 3 and the surface of the optical fiber storage unit 4 where the optical fiber is wound and stored are parallel to each other. Installed. Furthermore, since the height of the substrate 3 along the direction of gravity is smaller than the optical fiber housing 4, a space 5 a is formed in which heat is accumulated by convection of heat within the apparatus body 2.

  As shown in FIG. 8, the two covers constituting the apparatus main body 2 are formed with a plurality of holes for releasing the heat to the outside when at least the space 5a becomes a heat reservoir. In the example of FIG. 8, a plurality of holes are formed on the outer surface (upper surface, front surface, side surface) corresponding to the upper portion of the cover of the apparatus main body 2 along the direction of gravity. A plurality of holes are also formed in the outer surface corresponding to the lower part of the cover of the apparatus main body 2 along the direction of gravity. By doing in this way, heat can be efficiently discharged outside from the space 5a that has become a heat reservoir, and problems due to temperature rise in the apparatus main body 2 can be avoided even by natural air cooling.

  As described above, according to the first embodiment, the casing of the apparatus main body 2 that dissipates heat by natural air cooling, the optical fiber storage portion 4 that is installed in the casing and stores the optical fiber, and the optical fiber in the casing. The substrate 3 is provided in parallel with the storage unit 4 and has an outer dimension smaller than that of the optical fiber storage unit 4, and the optical fiber storage unit 4 and the substrate 3 are arranged along the direction of gravity in the casing due to the difference in the external dimensions. A space 5a was formed in the upper part. As a result, even if a heat pool due to heat generated from the board 3 on which the circuit is mounted is formed in the space 5a, the circuit components on the board 3 are not exposed to high-temperature air and can be radiated effectively. In addition, since the optical fiber housing 4 is provided in parallel with the substrate 3 in the housing of the apparatus main body 2 without providing the optical fiber housing 4 and the apparatus main body 2 separately, the communication terminal device can be downsized. it can.

It is a figure which shows the communication terminal device by Embodiment 1 of this invention. FIG. 3 is a perspective view of the communication terminal device according to Embodiment 1 when installed on a desktop. It is a perspective view at the time of wall hanging of the communication terminal device by Embodiment 1. FIG. 1 is a perspective view showing a schematic configuration of a communication terminal device according to Embodiment 1. FIG. It is a figure for demonstrating the thermal radiation structure of the communication terminal device by Embodiment 1. FIG. It is a figure for demonstrating the thermal radiation structure of the communication terminal device by Embodiment 1. FIG. It is a figure which shows the thermal radiation structure of the communication terminal device by Embodiment 1. FIG. It is a figure which shows the specific structural example of the communication terminal device by Embodiment 1. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Installation adapter, 2 apparatus main body (housing | casing), 3 board | substrate, 4 optical fiber accommodating part, 5 area | region, 5a space.

Claims (1)

A case that dissipates heat by natural air cooling,
An optical fiber storage unit that is installed along the direction of gravity in the housing and stores an optical fiber;
Said housing along a direction of gravity in the body disposed parallel to the said optical fiber storage section, at least the direction of gravity in the height along the have a smaller outside dimension than said optical fiber storage section, the circuit as a heat source is mounted With a substrate,
The difference in the outer dimensions of the substrate and the optical fiber accommodating portion, the upper portion along the gravity direction of the substrate in the housing, a heat reservoir and comprising the space of the heat generated from the circuit mounted on the said substrate Forming ,
A communication terminal device in which a hole for releasing heat generated from the circuit to the outside of the housing is formed on an outer surface of the housing corresponding to a position of a space serving as the heat reservoir .

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