201005489 , 九、發明說明： .【發明所屬之技術領域】 . 本發明係關於一種散熱裝置及其支架。 【先前技術】 隨著電腦資訊產業之迅速發展，各類電子元件 瞀 速度愈來愈快，其所產生之熱量亦愈來愈多，而過 : 量如果無法及時排除，將嚴重影響電子元件運行時 二 ❹ 性。為此’業界通常在電子元件周圍裝設一散熱元件= 出熱量。通常散熱元件係透過螺絲固定在電子元件周 准如疋對於散熱元件之拆卸不便，從而浪費時間: 【發明内容】 裝置雲於以上内容，本發明提供—種可拆裝方便之散熱 還有必要提供一種拆裝方便之支架。 ❹ -種散熱裝置，包括一支架及一固定於該支架之散 二^，該支架包括-支撐部及—導風罩，該支樓部包 括-第一側壁、一第二側壁、一與該第―、第二側壁之 ^應端連接之端壁及—與該端壁之底部相連之底壁，該 夕第一侧壁、端壁及底壁圍成-可容納該散熱元件 =納該導風罩卡固於該支標部上，將支樓於該支 芽。之'壁上之散熱兀件罩人其内，該端壁上開設有通 孔，使該導風罩與該支撐部之外部連通。 :種支架’用於固定一散熱元件，其包括一支撐部 二^罩’該支撐部包括—第—側壁、-第二側壁、 一，、该第一、第二側壁之對應端連接之端壁及一與該端 201005489 壁之底部相連之之底帶，兮结 咕 辟^、逆之之履2③第-、第二側壁、端壁及底 成-可容納該散熱元件之容納腔，該導風罩卡固於 μ撐郤上，该端壁上開設有通孔，使該導風罩盘該支 撐部之外部連通。 守l皁〃及爻 本發明月欠熱裝置透過該{架中t導風罩卡固於支撐 :=亥Γ熱ί件限位在該支撐部之底壁上，該散熱裝置 拆裝方便，從而節約了拆裝時間。 【實施方式】201005489, IX. Description of the invention: . [Technical field to which the invention pertains] The present invention relates to a heat dissipating device and a bracket therefor. [Prior Art] With the rapid development of the computer information industry, all kinds of electronic components are getting faster and faster, and the heat generated by them is increasing. However, if the amount cannot be eliminated in time, it will seriously affect the operation of electronic components. Time is two. To this end, the industry usually installs a heat dissipating component around the electronic components = heat output. Generally, the heat dissipating component is fixed to the electronic component by screws, and the disassembly of the heat dissipating component is inconvenient, thereby wasting time: [Summary of the Invention] The device provides the above-mentioned contents, and the present invention provides a convenient disassembly and heat dissipation. A convenient disassembly and assembly bracket. ❹ - a heat dissipating device comprising a bracket and a splicing fixed to the bracket, the bracket comprising a support portion and an air hood, the branch portion comprising - a first side wall, a second side wall, a The end wall of the first and second side walls is connected to the bottom wall connected to the bottom of the end wall, and the first side wall, the end wall and the bottom wall are encircled to accommodate the heat dissipating component. The air hood is fastened to the branch portion, and the branch is attached to the branch. The heat-dissipating cover member on the wall is provided with a through hole in the end wall, so that the air guiding cover communicates with the outside of the support portion. The support bracket is configured to fix a heat dissipating component, and includes a support portion and a cover portion. The support portion includes a first side wall, a second side wall, a second end portion, and a corresponding end end of the first and second side walls. a wall and a bottom strap connected to the bottom of the end of the wall of the 201005489, the shackle, the second, the second side wall, the end wall and the bottom of the base - the receiving cavity of the heat dissipating component The air guiding hood is fastened to the yoke, and the end wall is provided with a through hole, so that the outside of the supporting portion of the air guiding hood is in communication. The saponin and the sputum of the present invention are fastened to the support through the {window t-wind hood of the present invention: = Γ Γ ί ί 限 限 限 限 限 限 限 限 限 限 限 限 限 限 限 限 = = = = = = = = = = = = This saves assembly and disassembly time. [Embodiment]
一晴參考圖ί，本發明散熱裝置第一較佳實施方式包括 一支架、-散熱元件20 (如—鼓風機）及一電路板％。 該支架包括-支撐部4〇及—導風罩％。該支樓部4〇 夂呈U 1其包括兩相對之第一側壁44及第二側壁46 及垂直連接第-側壁44及第二侧壁46對應端之端壁42。 該，一側壁44、第二侧壁46及端壁42共同圍成一端開口 之谷納腔，該端壁42之底部朝向該容納腔延伸出一用於承 載散熱元件20之底壁48。該第一、第二側壁料、^之内 側下部遠離端壁42之一端分別設有兩卡槽442。該端壁42 之内部中空，其外側面設有複數與其内部連通之長條狀平 行排列之進風口 424，其位於容納腔中之内側面則開設一 較大之與其内部連通之長方形通風口 422，該進風口 424 f該通風口 422貫通形成通孔，或者該端壁42亦可以直接 疋個開没有通孔之板體，該通孔使容納腔及外部連通。 該底壁48兩側分別向上凸設兩具卡槽之卡固件482。 戎導風罩50包括一頂板52、自頂板52相對兩侧垂直 向下延伸之一第一側板54、一第二側板56及自頂板Μ之 6 201005489 • 一端垂直向下延伸之一第三侧板％，第三側板58垂直連 •接於該第一側板54及該第二側板56之相應端，該第一、 •第二側板54、56之外側面下部均設有兩楔形卡塊522，用 於與該支撐部40之底壁48上之兩卡固件482進行卡固。 該第二側板58上設有與該端壁42之進風口相對之一出風 口 582,其靠近第一側板54 一端之底部開設有一供散埶元 件20之電源線穿過之通孔584。 該電路板30上設有一朝向一侧之第一連接器32及一 ❹朝向另一侧之第二連接器34,該電路板3〇之兩端分別設 有與該支撐部40之兩側壁44、46上之兩卡槽442對應之 兩凸塊36。 請繼續參考圖2,組裝該散熱裝置時，將該散熱元件 20放置在該支撐部4〇之底壁48上，將該導風罩5〇罩在 該散熱元件20上並使其上之卡塊522卡入該底板48之卡 固件482之卡槽中，該導風罩5〇遠離第三側板弨之一端 與該端壁42之内侧面緊密配合，該散熱元件2〇之電源線 ❹透過該導風罩50之通孔584伸出並與該電路板3〇上之第 二連接器34相連。該電路板3〇之凸塊36卡入該支撐部 40之第一、第二側壁44、46之卡槽442内，該電路板π 上之第一連接器32連接一電源之連接器（未示出），以透 過該第二連接器34給該散熱元件2〇提供電源。該支撐部 仞，端壁42及該導風罩50之第一側板54、第二侧板56、 第三侧板58及頂板52共同將該散熱元件2〇限於該支撐部 4〇之底壁48上。 請參考圖3’在第二較佳實施方式中，在支撐部4〇之 201005489 .第一、第二侧壁44及46之内侧底部分別開設兩與導風罩 ,50之卡固件522相對應之凹槽462,該導風罩5〇之尺寸血 .该支撐部40對應，則該導風罩50可卡固在該第一、第Γ 側壁44、46上。 組裝完成之散熱裝置可以插入一伺服器機箱内之 硬碟機容置區内對該飼服器機箱内之電子元件散熱 放入其他裝置内對電子元件散熱。 以該散熱裝置插入該伺服器機箱内之閒置硬碟機容 ❹區内對機箱内之電子元件散熱為例對該散熱裝置 明，伺服器工作時，該散熱裝置内之散熱元# 20透過該端 壁C之通孔將外界空氣吸入並導入到該導風罩％内，"該 導風罩50内之空氣又在該散熱元件2〇之作用下由該導^ 罩50上之出風口 582導出以進一步對該伺服器機箱内之 子元件散熱。 4 J一、第二實施方式中，該導風罩5〇之材質可以為密 封材質且與支撐部4〇密封配合，使從該支擇部扣之 ❹42吸進之風全部進入該導風罩5〇。 土 本發明散熱裝置透過該導風罩5〇將該散熱元件2〇 f在該支撐部40之底壁48上來對電子元件進行散熱，該 散熱裝置組裝拆卸方便，從而節約了組裝拆卸時間" &綜上所述，本發明符合發明專利要件，爰依法提出專利 申凊。惟，以上所述者僅為本發明之較佳實施例，舉凡熟悉 本案技藝之人士，在爰依本發明精神所作之等效修飾或= 化，皆應涵蓋於以下之申請專利範圍内。 8 201005489 【圖式簡單說明】 圖1係本發明散熱裝置之第一較佳實施方式之分解 圖。 圖2係圖1之組裝圖。 圖3係本發明散熱裝置之第二較佳實施方式之分解A first preferred embodiment of the heat sink of the present invention includes a bracket, a heat dissipating component 20 (e.g., a blower), and a circuit board %. The bracket includes a support portion 4 and an air hood %. The branch portion 4〇 is U1 and includes two opposite first side walls 44 and a second side wall 46 and an end wall 42 perpendicularly connecting the corresponding ends of the first side wall 44 and the second side wall 46. The sidewalls 44, the second sidewalls 46, and the end walls 42 collectively define a valley opening having an opening at one end. The bottom of the end wall 42 extends toward the receiving cavity to extend a bottom wall 48 for supporting the heat dissipating component 20. The inner side of the first and second side wall materials and the inner side of the end wall 42 are respectively provided with two card slots 442. The inner wall of the end wall 42 is hollow, and the outer side surface is provided with a plurality of air inlets 424 arranged in parallel with the inner portion thereof. The inner side surface of the receiving cavity defines a rectangular vent 422 which is connected to the inner portion thereof. The air inlet 424 f penetrates the through hole, or the end wall 42 can directly open the plate body without the through hole, and the through hole communicates the receiving cavity and the outside. Two card slot fasteners 482 are respectively protruded from two sides of the bottom wall 48. The hood 50 includes a top plate 52, a first side plate 54 extending perpendicularly from opposite sides of the top plate 52, a second side plate 56, and a top plate 20106 201005489 • one end vertically extending downwardly from the third side The second side plate 58 is vertically connected to the corresponding ends of the first side plate 54 and the second side plate 56. The first and second side plates 54 and 56 are provided with two wedge-shaped blocks 522 at the lower portion of the outer side. For fastening with the two fasteners 482 on the bottom wall 48 of the support portion 40. The second side plate 58 is provided with an air outlet 582 opposite to the air inlet of the end wall 42. The bottom of one end of the first side plate 54 defines a through hole 584 through which the power line of the heat dissipation element 20 passes. The circuit board 30 is provided with a first connector 32 facing one side and a second connector 34 facing the other side. The two ends of the circuit board 3 are respectively provided with two side walls 44 of the support portion 40. The two latches 442 corresponding to the two latching slots 442 on the 46. Referring to FIG. 2, when the heat dissipating device is assembled, the heat dissipating component 20 is placed on the bottom wall 48 of the supporting portion 4, and the air guiding cover 5 is placed on the heat dissipating component 20 and the card is placed thereon. The block 522 is inserted into the card slot of the card 482 of the bottom plate 48. One end of the air guiding cover 5 away from the third side plate is closely matched with the inner side surface of the end wall 42. The through hole 584 of the air hood 50 extends and is connected to the second connector 34 on the circuit board 3. The bumps 36 of the circuit board 3 are inserted into the slots 442 of the first and second side walls 44, 46 of the support portion 40, and the first connector 32 of the circuit board π is connected to a connector of a power source (not Shown to supply power to the heat dissipating component 2 through the second connector 34. The support portion 仞, the end wall 42 and the first side plate 54, the second side plate 56, the third side plate 58 and the top plate 52 of the air hood 50 collectively limit the heat dissipating component 2 to the bottom wall of the support portion 4 48 on. Please refer to FIG. 3'. In the second preferred embodiment, at the inner bottom of the first and second side walls 44 and 46 of the support portion 4, respectively, the inner and bottom portions of the first and second side walls 44 and 46 are respectively provided with two air-conditioning covers, 50 corresponding to the fastener 522. The groove 462, the size of the air hood 5 is corresponding to the support portion 40, the air hood 50 can be locked on the first and second side walls 44, 46. The assembled heat sink can be inserted into a hard disk drive accommodating area in a server chassis to dissipate heat from the electronic components in the feeder chassis into other devices to dissipate heat from the electronic components. The heat dissipating device is inserted into the spare hard disk drive in the server chassis to dissipate heat from the electronic components in the chassis. For example, when the server is in operation, the heat dissipating component 20 in the heat dissipating device passes through the heat dissipating device. The through hole of the end wall C sucks in the outside air and is introduced into the air hood %, and the air in the air hood 50 is again driven by the air vent of the heat sink 2 The 582 is derived to further dissipate heat to the sub-components within the server chassis. In the second embodiment, the material of the air guiding hood 5 可以 can be a sealing material and is sealingly matched with the supporting portion 4 , so that all the wind sucked from the dam 42 of the supporting portion enters the air hood. 5〇. The heat dissipating device of the present invention transmits the heat dissipating component 2 to the bottom wall 48 of the supporting portion 40 through the air guiding cover 5 to dissipate the electronic component, and the heat dissipating device is convenient to assemble and disassemble, thereby saving assembly and disassembly time. & In summary, the present invention complies with the requirements of the invention patent, and proposes a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and those skilled in the art will be able to devise equivalent modifications or modifications in the spirit of the present invention. 8 201005489 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded view of a first preferred embodiment of a heat sink according to the present invention. Figure 2 is an assembled view of Figure 1. Figure 3 is an exploded view of a second preferred embodiment of the heat sink of the present invention
【主要元件符號說明】 鼓風機 20 第一連接器 32 凸塊 36 端壁 42 第二側壁 46 通風口 422 卡槽 442 導風罩 50 第一側板 54 第三側板 58 出風口 582 凹槽 462 電路板 30 第二連接器 34 支撐部 40 第一側壁 44 底壁 48 進風口 424 卡固件 482 頂板 52 第二側板 56 卡固件 522 通孔 584 9[Main component symbol description] Blower 20 First connector 32 Bump 36 End wall 42 Second side wall 46 Vent 422 Card slot 442 Air duct 50 First side plate 54 Third side plate 58 Air outlet 582 Groove 462 Circuit board 30 Second connector 34 support portion 40 first side wall 44 bottom wall 48 air inlet 424 fastener 482 top plate 52 second side plate 56 fastener 522 through hole 584 9