TWI513966B - Method for measuring quality of lens - Google Patents

Description

Lens quality detection method

The invention relates to a lens quality detecting method, and in particular to a detecting method for reducing damage occurrence and flange distance (FFL).

1A is a top plan view of a conventional lens testing machine, and FIG. 1B is a partial cross-sectional view of the lens testing machine taken along line AA' of FIG. 1A, wherein FIG. 1A only shows the lens for convenience of explanation. The first metal plate, the second metal plate and the lens module of the machine are tested, and other possible devices, such as a pattern generating device, are omitted.

Referring to FIG. 1A and FIG. 1B simultaneously, the lens testing machine 100 of the present embodiment includes a first metal plate 112, a second metal plate 114, and a pattern generating device 120. The first metal plate 112 has a plurality of first through holes H1, respectively, and the second metal plate has a plurality of second through holes H2, wherein the width W1 of the first through holes H1 is greater than the width W2 of the second through holes H2, The lens module 101 to be tested by the lens testing machine 100 can bear against the second metal plate 114 when it is disposed on the first through hole H1. In addition, since the second metal plate 114 has the second through hole H2, the pattern light beam L1 generated by the pattern generating device 120 can be transmitted to the lens module 101 through the second through hole H2 for the lens quality test.

However, as the size of the lens module 101 is shrinking, the conventional mirror The head test machine will encounter a detection bottleneck when it is tested. For example, the back focus of a wafer-level lens module is shorter than that of a conventional lens module, and the size is much smaller than that of a conventional lens module. Therefore, the conventional lens test machine performs the wafer level lens module. During the optical test, the pattern generating device 120 needs to enter the second through hole H2 to project the pattern light beam L1, so that the pattern generating device 120 can easily collide with the second metal plate 114 on the left and right sides, thereby causing the pattern generating device. Damaged.

In addition, the bottom of the wafer level lens module is not a flat surface. Therefore, when the flange distance is measured, the wafer level lens module of the non-flat surface may have a problem that the flange distance is not accurate.

The invention provides a method for detecting lens quality, which can avoid damage of the pattern generating device during use, and can effectively measure the flange distance value of each lens module and reduce the cost of the machine.

An embodiment of the present invention provides a lens quality detecting method suitable for optically detecting at least one wafer level lens module, which includes at least the following steps. First, at least a consistent hole is formed in a sheet. Then, a light-transmissive flat plate is disposed on the bearing plate, and the light-transmitting flat plate covers the through-hole to correspondingly form the accommodating space. Then, the wafer level lens module is placed in the space. Next, a pattern beam is provided to the light transmissive plate, wherein the pattern beam is adapted to pass through the light transmissive plate into the through hole for transmission to the wafer level lens module.

In an embodiment of the invention, a method of providing a patterned beam includes A pattern generating device is used, and the pattern generating device is located on one side of the light transmitting plate. In an embodiment of the invention, the pattern generating device includes a body and a protrusion on the body, and the protrusion is adapted to provide a pattern beam.

In an embodiment of the invention, the method for detecting the quality of the lens further comprises: receiving a pattern light beam passing through the wafer level lens module by using a photosensitive device, wherein the photosensitive device is located on the other side of the light transmissive plate, and bears the plate and The light transmissive plate is located between the pattern generating device and the photosensitive device.

In an embodiment of the invention, the method for detecting the quality of the lens further comprises moving the bearing plate so that the pattern beam is adapted to be transmitted to any position of the light transmitting plate. In one embodiment of the invention, a method of moving a photosensitive device includes utilizing a mobile device and the mobile device is physically coupled to a bearing plate.

In an embodiment of the invention, the method of arranging the light transmissive plate on the bearing plate comprises attaching or locking.

In one embodiment of the invention, the wafer level lens module bears against a light transmissive plate.

Another embodiment of the present invention provides a lens testing machine adapted to perform optical quality testing on at least one wafer level lens module. The lens testing machine includes a bearing plate, a light transmitting plate and a pattern generating device. The backing plate has at least a consistent aperture. The light-transmissive plate is disposed on the bearing plate and covers at least the consistent hole to correspondingly form at least one receiving space. The accommodating space is suitable for accommodating the wafer level lens module. The pattern generating device is located on one side of the light transmissive plate and provides a pattern beam to the light transmissive plate. The pattern beam is adapted to pass through the light transmissive plate into the through hole for transmission to the wafer level lens module.

In an embodiment of the invention, the lens testing machine further comprises a photosensitive The device is located on the other side of the light transmissive plate for receiving a pattern beam passing through at least one wafer level lens module.

In an embodiment of the invention, the lens testing machine further includes a moving device that is physically coupled to the plate and adapted to move against the plate such that the pattern beam is adapted to be transferred to any position of the light transmissive plate.

In an embodiment of the invention, the bearing plate comprises a metal plate, a plastic plate, a semiconductor plate or a glass plate.

In an embodiment of the invention, the light transmissive plate comprises a plastic plate or a glass plate.

In an embodiment of the invention, the pattern generating device comprises a body and a protrusion on the body, and the protrusion is adapted to provide a pattern beam.

In an embodiment of the invention, the pattern generating device further includes a cover glass disposed on the convex portion.

Based on the above, in the above embodiment of the present invention, the lens detecting machine covers the through hole on the plate by the light-transmitting plate to form a receiving space for accommodating the wafer-level lens module, so that when the lens is tested When the machine performs the MTF test to move the bearing plate in the horizontal direction, the problem that the pattern generating device collides with the bearing plate can be avoided. Furthermore, since the lens testing machine of the embodiment only needs to process the through hole of one piece of the sheet material, the lens testing machine of the embodiment is processed separately from the traditional two metal sheets. In addition to being more cost-effective, Taiwan's process reliability and test reliability are also high. Furthermore, an embodiment of the present invention also proposes a detection method suitable for the above-described machine, and similarly has the aforementioned advantages.

The above described features and advantages of the present invention will be more apparent from the following description.

2A is a top plan view of a lens testing machine according to an embodiment of the present invention, and FIG. 2B is a partial cross-sectional view of the lens testing machine shown along line BB' of FIG. 2A, wherein FIG. 2A is only for convenience of description. The bearing plate and wafer level lens module of the lens testing machine are depicted, and other possible devices such as a light transmitting plate, a pattern generating device, a photosensitive device and a moving device are omitted. Referring to FIG. 2A and FIG. 2B , the lens testing machine 200 of the embodiment is adapted to perform optical quality testing on at least one wafer level lens module 201 . The lens testing machine 200 includes at least one bearing plate 210 and one The light transmissive plate 220, a pattern generating device 230, and a photosensitive device 240. The bearing plate 210 has at least a consistent hole H1. In this embodiment, the number of the through holes H1 is determined according to the number of the wafer level lens modules 201 to be detected by the user. The lens module 201 of the present embodiment is formed by a wafer level process. Therefore, the size of the wafer level lens module 201 itself is relatively small compared to the conventional lens module, and thus the width W1 of the through hole H1 is also determined. In addition, the number of the through holes H1 in this embodiment is exemplified by a plurality of, but is not limited thereto, and this part depends on the needs of the user.

In this embodiment, the material of the plate 210 is exemplified by a metal plate. In other embodiments, the material of the plate 210 may also be a plastic plate, a semiconductor plate, a glass plate or other suitable. Plate. It should be noted that the material selected for the plate 210 will determine the manner in which the through hole H1 is formed. For example, if the sheet metal 210 is selected from the sheet metal, the through hole H1 can be formed by a metal processing method such as lathe technology, laser processing or stamping technology; If a semiconductor plate is used for the plate 210, the formation of the through hole H1 can be formed by a semiconductor process technology, such as etching.

In addition, the light-transmissive plate 220 is disposed on the bearing plate 210 and covers the through-hole H1, so that the accommodating space S1 can be correspondingly configured. The accommodating space S1 is adapted to receive the wafer-level lens module 201, such as 2A and 2B are shown. Specifically, since the transparent plate 220 directly contacts the bearing plate 210 and covers the through hole H1 at the same time, the wafer level lens module 201 can be supported and supported by the transparent plate 220 when disposed in the through hole H1. , as shown in Figure 2A and Figure 2B. In the present embodiment, the light-transmissive plate 220 is exemplified by a glass plate, but is not limited thereto. Other materials having a flat surface and good light transmittance may also be selected for the light-transmitting plate 220 of the embodiment. In other words, the material of the transparent plate 220 of the embodiment may also be a plastic plate or other suitable material.

In this embodiment, the method of arranging the light-transmitting plate 220 on the plate 210 depends on the material of the light-transmitting plate 220 and the plate 210. For example, if the material of the plate 210 is selected from a metal plate, and the transparent plate 220 is a glass plate, the connection between the transparent plate 220 and the plate 210 may be through the use of an adhesive (not labeled). Adhesively attaching the bearing plate 210 to the light-transmitting plate 220, or alternatively, The bearing plate 210 and the light transmissive plate 220 are locked by a locking component (not shown), wherein the locking component can be a screw or a clamp.

In the lens testing machine 200, the pattern generating device 230 is located at one side of the light transmitting plate 220 and is adapted to provide a pattern light beam L1 to the light transmitting plate 220, and the photosensitive device 240 is located at the other side of the light transmitting plate 220 for The pattern beam L1 passing through at least one wafer level lens module 201 is received, as shown in FIGS. 2A and 2B. Specifically, the pattern light beam L1 is adapted to be transmitted into the through-hole H1 through the light-transmitting plate 220 and transmitted to the wafer-level lens module 201. Then, the pattern light beam L1 is transmitted to the photosensitive device through the wafer-level lens module 201. 240, at this time, the image quality of the wafer level lens module 201 can be judged by analyzing the pattern light beam L1 transmitted to the photosensitive device 240. It can be seen from the above that the lens testing machine 200 of the embodiment can perform a modulation transfer function (MTF) test of the lens for the wafer level lens module 201, wherein the MTF test is a test lens contrast contrast and sharpness. evaluation method.

In this embodiment, the pattern generating device 230 can include a body 232 and a protrusion 234 on the body 232, wherein the protrusion 234 is adapted to provide the pattern beam L1 to the wafer level lens module 201. In detail, since the back focal length of the wafer level lens module 201 is shorter than that of the conventional lens module and the size is smaller than that of the conventional lens module, the conventional lens testing machine 100 shown in FIG. 1B is used. When the MTF test is performed on the wafer level lens module 201 of the present embodiment, the pattern generating device 120 is likely to collide with the second metal plate 114 on the left and right sides. On the contrary, since the lens testing machine 200 of the embodiment uses the transparent plate 220 to bear the bearing plate The through hole H1 of the material 210 is covered to form the accommodating space S1 for accommodating the wafer level lens module 201. Thus, when the lens testing machine 200 performs the MTF test, the pattern generating device 230 can be prevented from colliding. By the plate 210. It should be noted that the transparent plate 220 can be appropriately adjusted according to the thickness of the Cover Glass of the CCD used by the client.

In addition, the lens testing machine 200 of the embodiment can also perform MTF detection on the plurality of wafer level lens modules 201 in sequence. Specifically, the lens testing machine 200 can include a mobile device 250, wherein the mobile device 250 is physically connected to the bearing plate 210 and adapted to move against the plate 210, so that the transfer of the pattern light beam L1 to the transparent plate 220 can be controlled. One position. In detail, the lens testing machine 200 of the embodiment can control the movement of the bearing plate 210 to the first axial direction P1 and the second axial direction P2 by the moving device 250 (in this way, the bearing plate 210 can be controlled to the horizontal axis) The pattern beam L1 generated by the pattern generating device 230 can be transferred to the wafer level lens module 201 to be detected. In particular, the lens testing machine 200 of the present embodiment may also include another mobile device (not shown) to control the pattern generating device 230 to approach or away from the wafer level lens module 201, that is, the lens testing machine. The 200 controllable pattern generating device 230 is moved to the third axial direction P3, wherein the third axial direction is perpendicular to the first axial direction P1 and the second axial direction P2.

Based on the above, the lens testing machine 200 of the present embodiment covers the receiving space S1 of the wafer level lens module 201 by using the transparent plate 220 to cover the receiving space S1 of the wafer level lens module 201. When the lens testing machine 200 performs the MTF test and moves the bearing plate 210 to move between the first axial direction P1 and the second axial direction P2, the pattern generating device can be avoided. The problem of the 230 collision bearing the plate 210 is set. In addition, since the lens testing machine 200 of the embodiment can perform MTF testing on the wafer level lens module 201, wherein the size of the wafer level lens module 201 is smaller than that of the conventional lens module, therefore, the same test On the area of the bearing plate, the lens testing machine 200 of the present embodiment can detect a larger number of wafer level lens modules 201. Furthermore, since the lens testing machine 200 of the embodiment only needs to process the through hole of a piece of the plate, the lens processing of the embodiment is performed by separately processing the two holes of the metal plate. In addition to being more cost effective, the machine 200 has higher process reliability and test reliability.

3 is a partial cross-sectional view of the lens testing machine of another embodiment taken along line BB' of FIG. 2A. Referring to FIG. 2A and FIG. 2B, the lens testing machine 300 of the present embodiment adopts the same concept as the lens testing machine 200 described above, but the difference is that the pattern generating device 230a of the embodiment may further include The cover glass 236 is disposed on the convex portion 234 to protect the convex portion 234 from being stained, collided or damp, and affects the pattern light beam L1 provided by the convex portion 234.

Based on the above, the present embodiment can also provide a lens quality detection method, which is suitable for optical detection of the singular or plural wafer level lens module 201 described above, and the detection step thereof is as shown in FIG. 4 .

First, a plurality of or a plurality of through holes H1 may be formed on the aforementioned bearing plate 210, as shown in step S101 of FIG. 2B and FIG. In this embodiment, the through hole H1 may be formed by lathe technology, laser processing, stamping technology, semiconductor etching technology or other suitable processing technology. The amount depends on which material is used to support the sheet. The above is only an example.

Then, a light-transmitting plate 220 is disposed on the bearing plate 210, wherein the light-transmitting plate 220 covers the through-hole H1 to correspondingly form the accommodating space S1, as shown in step S103 of FIG. 2B and FIG. In this embodiment, the transparent plate and the supporting plate may be connected by using an adhesive (not labeled) to adhere the supporting plate 210 and the transparent plate 220, or alternatively, the locking may be selectively utilized. The solid component (not labeled) locks the bearing plate 210 and the light transmissive plate 220, wherein the locking component can be a screw or a clamp.

Then, the wafer level lens module 201 described above is placed in the accommodating space S1, as shown in step S105 of FIG. 2B and FIG. In this embodiment, each wafer level lens module 201 is correspondingly disposed in each of the accommodating spaces S1, that is, the number of wafer level lens modules 201 that can be tested depends on the through holes H1. Quantity.

Next, a pattern light beam L1 is provided to the light-transmitting plate 220, wherein the pattern light beam L1 is adapted to pass through the light-transmissive flat plate into the through-hole H1 and transmitted to the wafer-level lens module 201, as shown in FIG. 2B and FIG. Step S107 is shown. In the present embodiment, the method of providing the pattern light beam L1 may be to use the aforementioned pattern generating device 230, wherein the pattern generating device 230 is located on one side of the light transmitting plate 220, as shown in FIG. 2B.

Then, the pattern light beam L1 passing through the wafer level lens module 201 is received by the photosensitive device 240, wherein the photosensitive device 240 is located on the other side of the light transmitting plate 220, and the bearing plate 210 is located on the light transmitting plate 220. Between the pattern generating device 230 and the photosensitive device 240, as shown in step S109 of FIGS. 2B and 4. So far, a method of detecting the quality of the lens has been substantially completed.

It is worth mentioning that the method for detecting the quality of the lens may further include moving the bearing plate 210 so that the pattern beam L1 is adapted to be transmitted to any position of the transparent plate 220 to sequentially apply the plurality of wafer level lens modes. The group performs an MTF test as shown in FIGS. 2A and 2B. In the present embodiment, the method of moving the photosensitive device 220 includes utilizing the aforementioned mobile device 250, and the mobile device is physically coupled to the bearing plate 210.

In summary, the lens testing machine and the detecting method according to an embodiment of the present invention have at least the following advantages. Firstly, the lens detecting machine covers the receiving space of the wafer level lens module by using a transparent plate to form a receiving space for accommodating the wafer level lens module. Thus, when the lens testing machine performs the MTF test, the bearing plate is supported. When moving in the horizontal direction, the problem that the pattern generating device collides with the bearing plate can be avoided. In addition, since the size of the wafer level lens module is smaller than that of the conventional lens module, the lens testing machine of the embodiment can perform the same test area when performing MTF test on the wafer level lens module. A larger number of wafer level lens modules are detected on the sheet. Furthermore, since the lens testing machine of the embodiment only needs to process the through hole of one piece of the sheet material, the lens testing machine of the embodiment is processed separately from the traditional two metal sheets. In addition to being more cost-effective, Taiwan's process reliability and test reliability are also high. Furthermore, an embodiment of the present invention also proposes a detection method suitable for the above-described machine, and similarly has the aforementioned advantages.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

100, 200, 300‧‧‧ lens test machine

101‧‧‧ lens module

112‧‧‧First metal sheet

114‧‧‧Second sheet metal

130, 230‧‧‧ pattern generating device

201‧‧‧ Wafer-level lens module

210‧‧‧Received plates

220‧‧‧Lighting plate

230a‧‧‧ pattern generating device

232‧‧‧ Ontology

234‧‧‧ convex

240‧‧‧Photosensitive device

250‧‧‧Mobile devices

H1‧‧‧ first through hole

H1‧‧‧through hole

H2‧‧‧Second hole

W1, W2‧‧‧ width

L1‧‧‧ pattern beam

P1‧‧‧first axial direction

P2‧‧‧second axial

P3‧‧‧ third axial

S1‧‧‧ accommodating space

S101, S103, S105, S107, S109‧‧‧ steps

1A is a top plan view of a conventional lens testing machine.

Figure 1B is a partial cross-sectional view of the lens testing machine shown along line AA' of Figure 1A.

2A is a top plan view of a lens testing machine according to an embodiment of the invention.

2B is a partial cross-sectional view of the lens testing machine shown along line BB' of FIG. 2A.

3 is a partial cross-sectional view of the lens testing machine of another embodiment taken along line BB' of FIG. 2A.

FIG. 4 is a schematic flow chart of a method for detecting lens quality according to an embodiment of the present invention.

200‧‧‧Lens test machine

230‧‧‧ pattern generating device

201‧‧‧ Wafer-level lens module

210‧‧‧Received plates

220‧‧‧Lighting plate

232‧‧‧ Ontology

234‧‧‧ convex

240‧‧‧Photosensitive device

250‧‧‧Mobile devices

H1‧‧‧through hole

L1‧‧‧ pattern beam

P1‧‧‧first axial direction

P2‧‧‧second axial

P3‧‧‧ third axial

S1‧‧‧ accommodating space

Claims (5)

A lens quality detecting method, which is suitable for optically detecting at least one wafer level lens module, comprising: forming at least a consistent hole on a bearing plate; and arranging a light transmitting plate on the bearing plate; The light plate covers the at least one hole to form at least one accommodating space; the at least one wafer level lens module is respectively accommodated in the at least one accommodating space; and a pattern generating device is used to provide a pattern beam to the through hole a light plate; moving the bearing plate to transmit the pattern beam to any position of the light transmissive plate, wherein the pattern beam is adapted to pass through the light transmissive plate into the at least consistent hole to be transferred to the at least one a wafer level lens module; and providing a photosensitive device, the pattern beam being transmitted to the photosensitive device through the at least one wafer level lens module. The method for detecting the quality of a lens according to claim 1, wherein the method of disposing the transparent plate on the bearing plate comprises attaching or locking. The lens quality detecting method according to claim 1, wherein the at least one wafer level lens module bears against the light transmissive plate. The lens quality detecting method according to claim 1, wherein the bearing plate comprises a metal plate, a plastic plate, a semiconductor plate or a glass plate. The method for detecting the quality of a lens according to the first aspect of the invention, wherein the transparent plate comprises a plastic plate or a glass plate.