TWI513966B - Method for measuring quality of lens - Google Patents
Method for measuring quality of lens Download PDFInfo
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- TWI513966B TWI513966B TW100120424A TW100120424A TWI513966B TW I513966 B TWI513966 B TW I513966B TW 100120424 A TW100120424 A TW 100120424A TW 100120424 A TW100120424 A TW 100120424A TW I513966 B TWI513966 B TW I513966B
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Description
本發明是有關於一種鏡頭品質檢測方法,且特別是有關於一種減少損壞發生與法蘭距(Flange Focal Length,FFL)的檢測方法。 The invention relates to a lens quality detecting method, and in particular to a detecting method for reducing damage occurrence and flange distance (FFL).
圖1A為傳統之鏡頭測試機台的俯視示意圖,而圖1B為沿圖1A之AA’線所繪示之鏡頭測試機台的局部剖示圖,其中為了方便說明,圖1A僅繪示出鏡頭測試機台之第一金屬板材、第二金屬板材與鏡頭模組,而省略其他可能的裝置,如:圖樣產生裝置。 1A is a top plan view of a conventional lens testing machine, and FIG. 1B is a partial cross-sectional view of the lens testing machine taken along line AA' of FIG. 1A, wherein FIG. 1A only shows the lens for convenience of explanation. The first metal plate, the second metal plate and the lens module of the machine are tested, and other possible devices, such as a pattern generating device, are omitted.
請同時參考圖1A與圖1B,本實施例之鏡頭測試機台100包括一第一金屬板材112、第二金屬板材114以及一圖樣產生裝置120。第一金屬板材112分別具有複數個第一貫孔H1,而第二金屬板材分別具有複數個第二貫孔H2,其中第一貫孔H1之寬度W1大於第二貫孔H2的寬度W2,如此一來,欲被鏡頭測試機台100所測試的鏡頭模組101在被設置於第一貫孔H1時便可承靠於第二金屬板材114上。此外,由於第二金屬板材114具有第二貫孔H2,因此圖樣產生裝置120所產生的圖樣光束L1便可通過第二貫孔H2而傳遞至鏡頭模組101,以進行鏡頭品質的測試。 Referring to FIG. 1A and FIG. 1B simultaneously, the lens testing machine 100 of the present embodiment includes a first metal plate 112, a second metal plate 114, and a pattern generating device 120. The first metal plate 112 has a plurality of first through holes H1, respectively, and the second metal plate has a plurality of second through holes H2, wherein the width W1 of the first through holes H1 is greater than the width W2 of the second through holes H2, The lens module 101 to be tested by the lens testing machine 100 can bear against the second metal plate 114 when it is disposed on the first through hole H1. In addition, since the second metal plate 114 has the second through hole H2, the pattern light beam L1 generated by the pattern generating device 120 can be transmitted to the lens module 101 through the second through hole H2 for the lens quality test.
然而,隨著鏡頭模組101之尺寸日益縮小,傳統的鏡 頭測試機台在進行測試便會遇到檢測瓶頸。舉例來說,晶圓級透鏡模組的背焦距相較於傳統的鏡頭模組短,且尺寸亦遠小於傳統的鏡頭模組,因此傳統的鏡頭測試機台在對晶圓級透鏡模組進行光學測試時,圖樣產生裝置120需進入第二貫孔H2以進行圖樣光束L1之投射,如此便容易發生圖樣產生裝置120去碰撞到左右兩側的第二金屬板材114,而造成圖樣產生裝置的損毀。 However, as the size of the lens module 101 is shrinking, the conventional mirror The head test machine will encounter a detection bottleneck when it is tested. For example, the back focus of a wafer-level lens module is shorter than that of a conventional lens module, and the size is much smaller than that of a conventional lens module. Therefore, the conventional lens test machine performs the wafer level lens module. During the optical test, the pattern generating device 120 needs to enter the second through hole H2 to project the pattern light beam L1, so that the pattern generating device 120 can easily collide with the second metal plate 114 on the left and right sides, thereby causing the pattern generating device. Damaged.
另外,晶圓級透鏡模組底部並非均為平整面,因此在於測量法蘭距時,非平整面的晶圓級透鏡模組,會有法蘭距測不準的問題產生。 In addition, the bottom of the wafer level lens module is not a flat surface. Therefore, when the flange distance is measured, the wafer level lens module of the non-flat surface may have a problem that the flange distance is not accurate.
本發明提供一種鏡頭品質的檢測方法,可避免圖樣產生裝置於使用時的損壞,並可有效測量各式透鏡模組的法蘭距值、降低機台的成本。 The invention provides a method for detecting lens quality, which can avoid damage of the pattern generating device during use, and can effectively measure the flange distance value of each lens module and reduce the cost of the machine.
本發明的一實施例提出一種鏡頭品質的檢測方法,適於對至少一晶圓級透鏡模組進行光學檢測,其至少包括下列步驟。首先,於一承靠板材上形成至少一貫孔。之後,於承靠板材上配置一透光平板,且透光平板覆蓋貫孔,以對應地形成容置空間。然後,於容置空間內容置晶圓級透鏡模組。接著,提供一圖樣光束至透光平板,其中圖樣光束適於通過透光平板進入貫孔內而傳遞至晶圓級透鏡模組。 An embodiment of the present invention provides a lens quality detecting method suitable for optically detecting at least one wafer level lens module, which includes at least the following steps. First, at least a consistent hole is formed in a sheet. Then, a light-transmissive flat plate is disposed on the bearing plate, and the light-transmitting flat plate covers the through-hole to correspondingly form the accommodating space. Then, the wafer level lens module is placed in the space. Next, a pattern beam is provided to the light transmissive plate, wherein the pattern beam is adapted to pass through the light transmissive plate into the through hole for transmission to the wafer level lens module.
在本發明之一實施例中,提供圖樣光束的方法包括利 用一圖樣產生裝置,且圖樣產生裝置位於透光平板的一側。在本發明之一實施例中,圖樣產生裝置包括一本體與位於本體上的一凸部,且凸部適於提供圖樣光束。 In an embodiment of the invention, a method of providing a patterned beam includes A pattern generating device is used, and the pattern generating device is located on one side of the light transmitting plate. In an embodiment of the invention, the pattern generating device includes a body and a protrusion on the body, and the protrusion is adapted to provide a pattern beam.
在本發明之一實施例中,鏡頭品質的檢測方法更包括利用一感光裝置,接收通過晶圓級透鏡模組的圖樣光束,其中感光裝置位於透光平板的另一側,且承靠板材與透光平板位於圖樣產生裝置與感光裝置之間。 In an embodiment of the invention, the method for detecting the quality of the lens further comprises: receiving a pattern light beam passing through the wafer level lens module by using a photosensitive device, wherein the photosensitive device is located on the other side of the light transmissive plate, and bears the plate and The light transmissive plate is located between the pattern generating device and the photosensitive device.
在本發明之一實施例中,鏡頭品質的檢測方法更包括移動承靠板材,使圖樣光束適於傳遞至透光平板之任一位置上。在本發明之一實施例中,移動感光裝置的方法包括利用一移動裝置,且移動裝置與承靠板材實體連接。 In an embodiment of the invention, the method for detecting the quality of the lens further comprises moving the bearing plate so that the pattern beam is adapted to be transmitted to any position of the light transmitting plate. In one embodiment of the invention, a method of moving a photosensitive device includes utilizing a mobile device and the mobile device is physically coupled to a bearing plate.
在本發明之一實施例中,透光平板配置於承靠板材上的方法包括貼附或鎖固之方式。 In an embodiment of the invention, the method of arranging the light transmissive plate on the bearing plate comprises attaching or locking.
在本發明之一實施例中,晶圓級透鏡模組承靠透光平板。 In one embodiment of the invention, the wafer level lens module bears against a light transmissive plate.
本發明的另一實施例提出一種鏡頭測試機台,適於對至少一晶圓級透鏡模組進行光學品質測試。鏡頭測試機台包括一承靠板材、一透光平板以及一圖樣產生裝置。承靠板材具有至少一貫孔。透光平板配置於承靠板材上並覆蓋至少一貫孔,以對應構成至少一容置空間。容置空間適於容置晶圓級透鏡模組。圖樣產生裝置位於透光平板的一側並提供一圖樣光束至透光平板。圖樣光束適於通過透光平板進入貫孔內而傳遞至晶圓級透鏡模組。 Another embodiment of the present invention provides a lens testing machine adapted to perform optical quality testing on at least one wafer level lens module. The lens testing machine includes a bearing plate, a light transmitting plate and a pattern generating device. The backing plate has at least a consistent aperture. The light-transmissive plate is disposed on the bearing plate and covers at least the consistent hole to correspondingly form at least one receiving space. The accommodating space is suitable for accommodating the wafer level lens module. The pattern generating device is located on one side of the light transmissive plate and provides a pattern beam to the light transmissive plate. The pattern beam is adapted to pass through the light transmissive plate into the through hole for transmission to the wafer level lens module.
在本發明之一實施例中,鏡頭測試機台更包括一感光 裝置,位於透光平板的另一側,用以接收通過至少一晶圓級透鏡模組的圖樣光束。 In an embodiment of the invention, the lens testing machine further comprises a photosensitive The device is located on the other side of the light transmissive plate for receiving a pattern beam passing through at least one wafer level lens module.
在本發明之一實施例中,鏡頭測試機台更包括一移動裝置,實體連接承靠板材並適於移動承靠板材,使圖樣光束適於傳遞至透光平板之任一位置上。 In an embodiment of the invention, the lens testing machine further includes a moving device that is physically coupled to the plate and adapted to move against the plate such that the pattern beam is adapted to be transferred to any position of the light transmissive plate.
在本發明之一實施例中,上述承靠板材包括一金屬平板、一塑膠平板、一半導體平板或一玻璃平板。 In an embodiment of the invention, the bearing plate comprises a metal plate, a plastic plate, a semiconductor plate or a glass plate.
在本發明之一實施例中,上述透光平板包括一塑膠平板或一玻璃平板。 In an embodiment of the invention, the light transmissive plate comprises a plastic plate or a glass plate.
在本發明之一實施例中,上述圖樣產生裝置包括一本體與位於本體上的一凸部,且凸部適於提供圖樣光束。 In an embodiment of the invention, the pattern generating device comprises a body and a protrusion on the body, and the protrusion is adapted to provide a pattern beam.
在本發明之一實施例中,上述圖樣產生裝置更包括一蓋玻璃,配置於凸部上。 In an embodiment of the invention, the pattern generating device further includes a cover glass disposed on the convex portion.
基於上述,在本發明的上述實施例中,鏡頭檢測機台利用透光平板將承靠板材上的貫孔覆蓋,以構成容置晶圓級透鏡模組的容置空間,如此,當鏡頭測試機台進行MTF測試而使承靠板材在水平方向上移動時,便可避免發生圖樣產生裝置碰撞承靠板材的問題。再者,由於本實施例之鏡頭測試機台僅需對一片承靠板材進行貫孔之加工處理,相對於傳統需分別對兩片金屬板材進行貫孔之加工處理,本實施例之鏡頭測試機台除了可較為節省成本外,其製程可靠度與測試可靠度亦較高。此外,本發明一實施例亦提出一種適於上述機台的檢測方法,而同樣地具有前述所提及之優點。 Based on the above, in the above embodiment of the present invention, the lens detecting machine covers the through hole on the plate by the light-transmitting plate to form a receiving space for accommodating the wafer-level lens module, so that when the lens is tested When the machine performs the MTF test to move the bearing plate in the horizontal direction, the problem that the pattern generating device collides with the bearing plate can be avoided. Furthermore, since the lens testing machine of the embodiment only needs to process the through hole of one piece of the sheet material, the lens testing machine of the embodiment is processed separately from the traditional two metal sheets. In addition to being more cost-effective, Taiwan's process reliability and test reliability are also high. Furthermore, an embodiment of the present invention also proposes a detection method suitable for the above-described machine, and similarly has the aforementioned advantages.
為讓本發明之上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 The above described features and advantages of the present invention will be more apparent from the following description.
圖2A為本發明一實施例之鏡頭測試機台的俯視示意圖,而圖2B為沿圖2A之BB’線所繪示之鏡頭測試機台的局部剖示圖,其中為了方便說明,圖2A僅繪示出鏡頭測試機台之承靠板材與晶圓級透鏡模組,而省略其他可能的裝置,如:透光平板、圖樣產生裝置、感光裝置與移動裝置。請同時參考圖2A與圖2B,本實施例之鏡頭測試機台200適於對至少一晶圓級透鏡模組201進行光學品質測試,其中鏡頭測試機台200至少包括一承靠板材210、一透光平板220、一圖樣產生裝置230以及一感光裝置240。承靠板材210具有至少一貫孔H1。在本實施例中,貫孔H1的數量是依據使用者所欲檢測之晶圓級透鏡模組201的數量而定,其中由於本實施例之透鏡模組201係透過晶圓級製程所形成,因此晶圓級透鏡模組201本身尺寸的大小相對於傳統的透鏡模組來說,便會相對地較小,因此貫孔H1的寬度W1亦會隨之而定。另外,本實施例之貫孔H1的數量是以複數個進行舉例說明,但不限此,此部份視乎使用者的需求而定。 2A is a top plan view of a lens testing machine according to an embodiment of the present invention, and FIG. 2B is a partial cross-sectional view of the lens testing machine shown along line BB' of FIG. 2A, wherein FIG. 2A is only for convenience of description. The bearing plate and wafer level lens module of the lens testing machine are depicted, and other possible devices such as a light transmitting plate, a pattern generating device, a photosensitive device and a moving device are omitted. Referring to FIG. 2A and FIG. 2B , the lens testing machine 200 of the embodiment is adapted to perform optical quality testing on at least one wafer level lens module 201 . The lens testing machine 200 includes at least one bearing plate 210 and one The light transmissive plate 220, a pattern generating device 230, and a photosensitive device 240. The bearing plate 210 has at least a consistent hole H1. In this embodiment, the number of the through holes H1 is determined according to the number of the wafer level lens modules 201 to be detected by the user. The lens module 201 of the present embodiment is formed by a wafer level process. Therefore, the size of the wafer level lens module 201 itself is relatively small compared to the conventional lens module, and thus the width W1 of the through hole H1 is also determined. In addition, the number of the through holes H1 in this embodiment is exemplified by a plurality of, but is not limited thereto, and this part depends on the needs of the user.
在本實施例中,承靠板材210的材質係以金屬平板作為舉例說明,於其他實施例中,承靠板材210的材質亦可選用一塑膠平板、一半導體平板、一玻璃平板或其他適當 的板材。需要說明的是,承靠板材210所選用的材質將會決定形成貫孔H1的方式。舉例來說,若承靠板材210選用金屬板材時,則貫孔H1的形成方式便可透過金屬加工的方式,如:車床技術、雷射加工或是沖壓技術來形成之;相對地,承靠板材210若選用半導體平板時,則貫孔H1的形成方式便可透過半導體製程技術來形成之,如:蝕刻技術。 In this embodiment, the material of the plate 210 is exemplified by a metal plate. In other embodiments, the material of the plate 210 may also be a plastic plate, a semiconductor plate, a glass plate or other suitable. Plate. It should be noted that the material selected for the plate 210 will determine the manner in which the through hole H1 is formed. For example, if the sheet metal 210 is selected from the sheet metal, the through hole H1 can be formed by a metal processing method such as lathe technology, laser processing or stamping technology; If a semiconductor plate is used for the plate 210, the formation of the through hole H1 can be formed by a semiconductor process technology, such as etching.
另外,透光平板220配置於承靠板材210上並覆蓋貫孔H1,如此便可對應地構成容置空間S1,其中容置空間S1適於容置上述的晶圓級透鏡模組201,如圖2A與圖2B所示。具體來說,由於透光平板220直接地接觸承靠板材210並同時覆蓋貫孔H1,因此晶圓級透鏡模組201配置於貫孔H1內時便可被透光平板220所支撐與承靠,如圖2A與圖2B所示。在本實施例中,透光平板220係以玻璃平板作為舉例說明,但不限於此,其他具有平整表面與良好透光性的材質亦可為本實施例之透光平板220所選用之材質。換言之,本實施例之透光平板220的材質亦可為一塑膠平板,或其他適當的材料。 In addition, the light-transmissive plate 220 is disposed on the bearing plate 210 and covers the through-hole H1, so that the accommodating space S1 can be correspondingly configured. The accommodating space S1 is adapted to receive the wafer-level lens module 201, such as 2A and 2B are shown. Specifically, since the transparent plate 220 directly contacts the bearing plate 210 and covers the through hole H1 at the same time, the wafer level lens module 201 can be supported and supported by the transparent plate 220 when disposed in the through hole H1. , as shown in Figure 2A and Figure 2B. In the present embodiment, the light-transmissive plate 220 is exemplified by a glass plate, but is not limited thereto. Other materials having a flat surface and good light transmittance may also be selected for the light-transmitting plate 220 of the embodiment. In other words, the material of the transparent plate 220 of the embodiment may also be a plastic plate or other suitable material.
在本實施例中,透光平板220配置於承靠板材210上的方法需視乎透光平板220與承靠板材210的材質而定。舉例來說,承靠板材210的材質若選用金屬平板,而透光平板220選用玻璃平板時,則透光平板220與承靠板材210的連接方式則可以是透過使用黏著劑(未標示)來將承靠板材210與透光平板220進行黏著貼附,或者是,可選擇性 地利用鎖固元件(未標示)將承靠板材210與透光平板220進行鎖固,其中鎖固元件可以是螺絲或是夾具。 In this embodiment, the method of arranging the light-transmitting plate 220 on the plate 210 depends on the material of the light-transmitting plate 220 and the plate 210. For example, if the material of the plate 210 is selected from a metal plate, and the transparent plate 220 is a glass plate, the connection between the transparent plate 220 and the plate 210 may be through the use of an adhesive (not labeled). Adhesively attaching the bearing plate 210 to the light-transmitting plate 220, or alternatively, The bearing plate 210 and the light transmissive plate 220 are locked by a locking component (not shown), wherein the locking component can be a screw or a clamp.
在鏡頭測試機台200中,圖樣產生裝置230位於透光平板220的一側並適於提供一圖樣光束L1至透光平板220,而感光裝置240位於透光平板220的另一側,用以接收通過至少一晶圓級透鏡模組201的圖樣光束L1,如圖2A與圖2B所示。具體而言,圖樣光束L1適於通過透光平板220進入貫孔H1內而傳遞至晶圓級透鏡模組201,之後,圖樣光束L1便會通過晶圓級透鏡模組201而傳遞至感光裝置240,此時便可藉由分析傳遞至感光裝置240的圖樣光束L1,而可判斷晶圓級透鏡模組201的成像品質。由上述可知,本實施例之鏡頭測試機台200可針對晶圓級透鏡模組201進行鏡頭的調制轉換函數(Modulation Transfer Function,MTF)測試,其中MTF測試是一種測試鏡頭反差對比度及銳利度的評估方法。 In the lens testing machine 200, the pattern generating device 230 is located at one side of the light transmitting plate 220 and is adapted to provide a pattern light beam L1 to the light transmitting plate 220, and the photosensitive device 240 is located at the other side of the light transmitting plate 220 for The pattern beam L1 passing through at least one wafer level lens module 201 is received, as shown in FIGS. 2A and 2B. Specifically, the pattern light beam L1 is adapted to be transmitted into the through-hole H1 through the light-transmitting plate 220 and transmitted to the wafer-level lens module 201. Then, the pattern light beam L1 is transmitted to the photosensitive device through the wafer-level lens module 201. 240, at this time, the image quality of the wafer level lens module 201 can be judged by analyzing the pattern light beam L1 transmitted to the photosensitive device 240. It can be seen from the above that the lens testing machine 200 of the embodiment can perform a modulation transfer function (MTF) test of the lens for the wafer level lens module 201, wherein the MTF test is a test lens contrast contrast and sharpness. evaluation method.
在本實施例中,圖樣產生裝置230可包括一本體232與位於本體232上的一凸部234,其中凸部234適於提供上述圖樣光束L1至晶圓級透鏡模組201上。詳細來說,由於晶圓級透鏡模組201的背焦距相較於傳統的鏡頭模組短,且尺寸亦小於傳統的鏡頭模組,因此若使用圖1B所繪示的傳統鏡頭測試機台100對本實施例之晶圓級透鏡模組201進行MTF測試時,便容易發生圖樣產生裝置120去碰撞到左右兩側的第二金屬板材114。相反地,由於本實施例之鏡頭測試機台200是利用透光平板220將承靠板 材210上的貫孔H1覆蓋,以構成容置晶圓級透鏡模組201的容置空間S1,如此一來,當鏡頭測試機台200進行MTF測試,便可避免圖樣產生裝置230去碰撞承靠板材210。需要說明的是,透光平板220可依據客戶端使用CCD的Cover Glass厚度作適當地調整。 In this embodiment, the pattern generating device 230 can include a body 232 and a protrusion 234 on the body 232, wherein the protrusion 234 is adapted to provide the pattern beam L1 to the wafer level lens module 201. In detail, since the back focal length of the wafer level lens module 201 is shorter than that of the conventional lens module and the size is smaller than that of the conventional lens module, the conventional lens testing machine 100 shown in FIG. 1B is used. When the MTF test is performed on the wafer level lens module 201 of the present embodiment, the pattern generating device 120 is likely to collide with the second metal plate 114 on the left and right sides. On the contrary, since the lens testing machine 200 of the embodiment uses the transparent plate 220 to bear the bearing plate The through hole H1 of the material 210 is covered to form the accommodating space S1 for accommodating the wafer level lens module 201. Thus, when the lens testing machine 200 performs the MTF test, the pattern generating device 230 can be prevented from colliding. By the plate 210. It should be noted that the transparent plate 220 can be appropriately adjusted according to the thickness of the Cover Glass of the CCD used by the client.
另外,本實施例之鏡頭測試機台200亦可依序地對多個晶圓級透鏡模組201進行MTF檢測。具體來說,鏡頭測試機台200可包括一移動裝置250,其中移動裝置250實體連接承靠板材210並適於移動承靠板材210,如此便可控制圖樣光束L1傳遞至透光平板220之任一位置上。詳細而言,本實施例之鏡頭測試機台200可藉由移動裝置250來控制承靠板材210往第一軸向P1與第二軸向P2移動(意即可控制承靠板材210往水平軸向移動),而使圖樣產生裝置230所產生的圖樣光束L1可傳遞至所欲檢測的晶圓級透鏡模組201上。特別要說明是,本實施例之鏡頭測試機台200亦可包括另一移動裝置(未繪示),以控制圖樣產生裝置230靠近或遠離晶圓級鏡頭模組201,意即鏡頭測試機台200可控制圖樣產生裝置230往第三軸向P3移動,其中第三軸向垂直於第一軸向P1與第二軸向P2。 In addition, the lens testing machine 200 of the embodiment can also perform MTF detection on the plurality of wafer level lens modules 201 in sequence. Specifically, the lens testing machine 200 can include a mobile device 250, wherein the mobile device 250 is physically connected to the bearing plate 210 and adapted to move against the plate 210, so that the transfer of the pattern light beam L1 to the transparent plate 220 can be controlled. One position. In detail, the lens testing machine 200 of the embodiment can control the movement of the bearing plate 210 to the first axial direction P1 and the second axial direction P2 by the moving device 250 (in this way, the bearing plate 210 can be controlled to the horizontal axis) The pattern beam L1 generated by the pattern generating device 230 can be transferred to the wafer level lens module 201 to be detected. In particular, the lens testing machine 200 of the present embodiment may also include another mobile device (not shown) to control the pattern generating device 230 to approach or away from the wafer level lens module 201, that is, the lens testing machine. The 200 controllable pattern generating device 230 is moved to the third axial direction P3, wherein the third axial direction is perpendicular to the first axial direction P1 and the second axial direction P2.
基於上述可知,由於本實施例之鏡頭測試機台200利用透光平板220將承靠板材210上的貫孔H1覆蓋,以構成容置晶圓級透鏡模組201的容置空間S1,如此,當鏡頭測試機台200進行MTF測試而移動承靠板材210往第一軸向P1與第二軸向P2移動時,便可避免發生圖樣產生裝 置230碰撞承靠板材210的問題。另外,由於本實施例之鏡頭測試機台200係可對晶圓級透鏡模組201進行MTF測試,其中晶圓級透鏡模組201的尺寸小於相對傳統鏡頭模組的尺寸,因此,在相同測試面積的承靠板材上,本實施例之鏡頭測試機台200可檢測數量更多的晶圓級透鏡模組201。再者,由於本實施例之鏡頭測試機台200僅需對一片承靠板材進行貫孔之加工處理,相對於傳統需分別對兩片金屬板材進行貫孔之加工處理,本實施例之鏡頭測試機台200除了可較為節省成本外,其製程可靠度與測試可靠度亦較高。 Based on the above, the lens testing machine 200 of the present embodiment covers the receiving space S1 of the wafer level lens module 201 by using the transparent plate 220 to cover the receiving space S1 of the wafer level lens module 201. When the lens testing machine 200 performs the MTF test and moves the bearing plate 210 to move between the first axial direction P1 and the second axial direction P2, the pattern generating device can be avoided. The problem of the 230 collision bearing the plate 210 is set. In addition, since the lens testing machine 200 of the embodiment can perform MTF testing on the wafer level lens module 201, wherein the size of the wafer level lens module 201 is smaller than that of the conventional lens module, therefore, the same test On the area of the bearing plate, the lens testing machine 200 of the present embodiment can detect a larger number of wafer level lens modules 201. Furthermore, since the lens testing machine 200 of the embodiment only needs to process the through hole of a piece of the plate, the lens processing of the embodiment is performed by separately processing the two holes of the metal plate. In addition to being more cost effective, the machine 200 has higher process reliability and test reliability.
圖3為沿圖2A之BB’線所繪示另一實施例之鏡頭測試機台的局部剖示圖。請同時參考圖2A與圖2B,本實施例之鏡頭測試機台300與前述的鏡頭測試機台200採用相同的概念,惟二者不同處在於,本實施例之圖樣產生裝置230a還可包括有一蓋玻璃236,其中蓋玻璃236配置於凸部234上,用以保護凸部234受到污損、碰撞或受潮,而影響凸部234所提供的圖樣光束L1。 3 is a partial cross-sectional view of the lens testing machine of another embodiment taken along line BB' of FIG. 2A. Referring to FIG. 2A and FIG. 2B, the lens testing machine 300 of the present embodiment adopts the same concept as the lens testing machine 200 described above, but the difference is that the pattern generating device 230a of the embodiment may further include The cover glass 236 is disposed on the convex portion 234 to protect the convex portion 234 from being stained, collided or damp, and affects the pattern light beam L1 provided by the convex portion 234.
基於上述,本實施例亦可提出一種鏡頭品質的檢測方法,其適於對上述的單數或複數個晶圓級透鏡模組201進行光學檢測,其檢測步驟如圖4所示。 Based on the above, the present embodiment can also provide a lens quality detection method, which is suitable for optical detection of the singular or plural wafer level lens module 201 described above, and the detection step thereof is as shown in FIG. 4 .
首先,可於前述的承靠板材210上形成單數個或複數個貫孔H1,如圖2B與圖4之步驟S101所示。在本實施例中,形成貫孔H1的方式可以是車床技術、雷射加工、沖壓技術、半導體蝕刻技術或或其他適當加工技術,此部 份需視乎承靠板材選用何種材質而定,上述僅為舉例說明。 First, a plurality of or a plurality of through holes H1 may be formed on the aforementioned bearing plate 210, as shown in step S101 of FIG. 2B and FIG. In this embodiment, the through hole H1 may be formed by lathe technology, laser processing, stamping technology, semiconductor etching technology or other suitable processing technology. The amount depends on which material is used to support the sheet. The above is only an example.
之後,於承靠板材210上配置一前述的透光平板220,其中透光平板220覆蓋貫孔H1,以對應地形成容置空間S1,如圖2B與圖4之步驟S103所示。在本實施例中,透光平板與承靠板材的連接方式可以是使用黏著劑(未標示)來將承靠板材210與透光平板220進行黏著貼附,或者是,可選擇性地利用鎖固元件(未標示)將承靠板材210與透光平板220進行鎖固,其中鎖固元件可以是螺絲或是夾具。 Then, a light-transmitting plate 220 is disposed on the bearing plate 210, wherein the light-transmitting plate 220 covers the through-hole H1 to correspondingly form the accommodating space S1, as shown in step S103 of FIG. 2B and FIG. In this embodiment, the transparent plate and the supporting plate may be connected by using an adhesive (not labeled) to adhere the supporting plate 210 and the transparent plate 220, or alternatively, the locking may be selectively utilized. The solid component (not labeled) locks the bearing plate 210 and the light transmissive plate 220, wherein the locking component can be a screw or a clamp.
然後,於容置空間S1內容置前述的晶圓級透鏡模組201,如圖2B與圖4之步驟S105所示。在本實施例中,每一晶圓級透鏡模組201分別對應地被設置於每一容置空間S1中,意即,可被測試的晶圓級透鏡模組201的數量取決貫孔H1的數量。 Then, the wafer level lens module 201 described above is placed in the accommodating space S1, as shown in step S105 of FIG. 2B and FIG. In this embodiment, each wafer level lens module 201 is correspondingly disposed in each of the accommodating spaces S1, that is, the number of wafer level lens modules 201 that can be tested depends on the through holes H1. Quantity.
接著,提供一前述的圖樣光束L1至透光平板220,其中圖樣光束L1適於通過透光平220板進入貫孔H1內而傳遞至晶圓級透鏡模組201,如圖2B與圖4之步驟S107所示。在本實施例中,提供圖樣光束L1的方法可以是使用前述的圖樣產生裝置230,其中圖樣產生裝置230位於透光平板220的一側,如圖2B所示。 Next, a pattern light beam L1 is provided to the light-transmitting plate 220, wherein the pattern light beam L1 is adapted to pass through the light-transmissive flat plate into the through-hole H1 and transmitted to the wafer-level lens module 201, as shown in FIG. 2B and FIG. Step S107 is shown. In the present embodiment, the method of providing the pattern light beam L1 may be to use the aforementioned pattern generating device 230, wherein the pattern generating device 230 is located on one side of the light transmitting plate 220, as shown in FIG. 2B.
之後,利用一前述的感光裝置240,接收通過晶圓級透鏡模組201的圖樣光束L1,其中感光裝置240位於透光平板220的另一側,且承靠板材210與透光平板220位於 圖樣產生裝置230與感光裝置240之間,如圖2B與圖4之步驟S109所示。至此,大致完成一種鏡頭品質的檢測方法。 Then, the pattern light beam L1 passing through the wafer level lens module 201 is received by the photosensitive device 240, wherein the photosensitive device 240 is located on the other side of the light transmitting plate 220, and the bearing plate 210 is located on the light transmitting plate 220. Between the pattern generating device 230 and the photosensitive device 240, as shown in step S109 of FIGS. 2B and 4. So far, a method of detecting the quality of the lens has been substantially completed.
值得一提的是,鏡頭品質的檢測方法更可包括移動承靠板材210,使圖樣光束L1適於傳遞至透光平板220之任一位置上,以依序地對複數個晶圓級透鏡模組進行MTF測試,如圖2A與圖2B所示。在本實施例中,移動感光裝置220的方法包括利用前述的移動裝置250,且移動裝置會與承靠板材210實體連接。 It is worth mentioning that the method for detecting the quality of the lens may further include moving the bearing plate 210 so that the pattern beam L1 is adapted to be transmitted to any position of the transparent plate 220 to sequentially apply the plurality of wafer level lens modes. The group performs an MTF test as shown in FIGS. 2A and 2B. In the present embodiment, the method of moving the photosensitive device 220 includes utilizing the aforementioned mobile device 250, and the mobile device is physically coupled to the bearing plate 210.
綜上所述,本發明一實施例之鏡頭測試機台及檢測方法至少具有下列優點。首先,鏡頭檢測機台利用透光平板將承靠板材上的貫孔覆蓋,以構成容置晶圓級透鏡模組的容置空間,如此,當鏡頭測試機台進行MTF測試而使承靠板材在水平方向上移動時,便可避免發生圖樣產生裝置碰撞承靠板材的問題。另外,由於晶圓級透鏡模組的尺寸小於相對傳統鏡頭模組的尺寸,因此本實施例之鏡頭測試機台在對晶圓級透鏡模組進行MTF測試時,便可在相同測試面積的承靠板材上檢測數量更多的晶圓級透鏡模組。再者,由於本實施例之鏡頭測試機台僅需對一片承靠板材進行貫孔之加工處理,相對於傳統需分別對兩片金屬板材進行貫孔之加工處理,本實施例之鏡頭測試機台除了可較為節省成本外,其製程可靠度與測試可靠度亦較高。此外,本發明一實施例亦提出一種適於上述機台的檢測方法,而同樣地具有前述所提及之優點。 In summary, the lens testing machine and the detecting method according to an embodiment of the present invention have at least the following advantages. Firstly, the lens detecting machine covers the receiving space of the wafer level lens module by using a transparent plate to form a receiving space for accommodating the wafer level lens module. Thus, when the lens testing machine performs the MTF test, the bearing plate is supported. When moving in the horizontal direction, the problem that the pattern generating device collides with the bearing plate can be avoided. In addition, since the size of the wafer level lens module is smaller than that of the conventional lens module, the lens testing machine of the embodiment can perform the same test area when performing MTF test on the wafer level lens module. A larger number of wafer level lens modules are detected on the sheet. Furthermore, since the lens testing machine of the embodiment only needs to process the through hole of one piece of the sheet material, the lens testing machine of the embodiment is processed separately from the traditional two metal sheets. In addition to being more cost-effective, Taiwan's process reliability and test reliability are also high. Furthermore, an embodiment of the present invention also proposes a detection method suitable for the above-described machine, and similarly has the aforementioned advantages.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,故本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
100、200、300‧‧‧鏡頭測試機台 100, 200, 300‧‧‧ lens test machine
101‧‧‧鏡頭模組 101‧‧‧ lens module
112‧‧‧第一金屬板材 112‧‧‧First metal sheet
114‧‧‧第二金屬板材 114‧‧‧Second sheet metal
130、230‧‧‧圖樣產生裝置 130, 230‧‧‧ pattern generating device
201‧‧‧晶圓級透鏡模組 201‧‧‧ Wafer-level lens module
210‧‧‧承靠板材 210‧‧‧Received plates
220‧‧‧透光平板 220‧‧‧Lighting plate
230a‧‧‧圖樣產生裝置 230a‧‧‧ pattern generating device
232‧‧‧本體 232‧‧‧ Ontology
234‧‧‧凸部 234‧‧‧ convex
240‧‧‧感光裝置 240‧‧‧Photosensitive device
250‧‧‧移動裝置 250‧‧‧Mobile devices
H1‧‧‧第一貫孔 H1‧‧‧ first through hole
H1‧‧‧貫孔 H1‧‧‧through hole
H2‧‧‧第二貫孔 H2‧‧‧Second hole
W1、W2‧‧‧寬度 W1, W2‧‧‧ width
L1‧‧‧圖樣光束 L1‧‧‧ pattern beam
P1‧‧‧第一軸向 P1‧‧‧first axial direction
P2‧‧‧第二軸向 P2‧‧‧second axial
P3‧‧‧第三軸向 P3‧‧‧ third axial
S1‧‧‧容置空間 S1‧‧‧ accommodating space
S101、S103、S105、S107、S109‧‧‧步驟 S101, S103, S105, S107, S109‧‧‧ steps
圖1A為傳統之鏡頭測試機台的俯視示意圖。 1A is a top plan view of a conventional lens testing machine.
圖1B為沿圖1A之AA’線所繪示之鏡頭測試機台的局部剖示圖。 Figure 1B is a partial cross-sectional view of the lens testing machine shown along line AA' of Figure 1A.
圖2A為本發明一實施例之鏡頭測試機台的俯視示意圖。 2A is a top plan view of a lens testing machine according to an embodiment of the invention.
圖2B為沿圖2A之BB’線所繪示之鏡頭測試機台的局部剖示圖。 2B is a partial cross-sectional view of the lens testing machine shown along line BB' of FIG. 2A.
圖3為沿圖2A之BB’線所繪示另一實施例之鏡頭測試機台的局部剖示圖。 3 is a partial cross-sectional view of the lens testing machine of another embodiment taken along line BB' of FIG. 2A.
圖4為本發明一實施例之鏡頭品質之檢測方法的流程示意圖。 FIG. 4 is a schematic flow chart of a method for detecting lens quality according to an embodiment of the present invention.
200‧‧‧鏡頭測試機台 200‧‧‧Lens test machine
230‧‧‧圖樣產生裝置 230‧‧‧ pattern generating device
201‧‧‧晶圓級透鏡模組 201‧‧‧ Wafer-level lens module
210‧‧‧承靠板材 210‧‧‧Received plates
220‧‧‧透光平板 220‧‧‧Lighting plate
232‧‧‧本體 232‧‧‧ Ontology
234‧‧‧凸部 234‧‧‧ convex
240‧‧‧感光裝置 240‧‧‧Photosensitive device
250‧‧‧移動裝置 250‧‧‧Mobile devices
H1‧‧‧貫孔 H1‧‧‧through hole
L1‧‧‧圖樣光束 L1‧‧‧ pattern beam
P1‧‧‧第一軸向 P1‧‧‧first axial direction
P2‧‧‧第二軸向 P2‧‧‧second axial
P3‧‧‧第三軸向 P3‧‧‧ third axial
S1‧‧‧容置空間 S1‧‧‧ accommodating space
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TW100120424A TWI513966B (en) | 2011-06-10 | 2011-06-10 | Method for measuring quality of lens |
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TW100120424A TWI513966B (en) | 2011-06-10 | 2011-06-10 | Method for measuring quality of lens |
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TW201250220A TW201250220A (en) | 2012-12-16 |
TWI513966B true TWI513966B (en) | 2015-12-21 |
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Citations (1)
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US20080285968A1 (en) * | 2007-05-14 | 2008-11-20 | Powergate Optical Inc. | Compact camera module package structure |
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Patent Citations (1)
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US20080285968A1 (en) * | 2007-05-14 | 2008-11-20 | Powergate Optical Inc. | Compact camera module package structure |
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