TWI513794B - 膠帶 - Google Patents

膠帶 Download PDF

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Publication number
TWI513794B
TWI513794B TW102121639A TW102121639A TWI513794B TW I513794 B TWI513794 B TW I513794B TW 102121639 A TW102121639 A TW 102121639A TW 102121639 A TW102121639 A TW 102121639A TW I513794 B TWI513794 B TW I513794B
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Taiwan
Prior art keywords
tape
adhesive
casing
carrier particles
adhesive layer
Prior art date
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TW102121639A
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English (en)
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TW201500516A (zh
Inventor
Pei Rong Shieh
Chang Chin Wu
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Hon Hai Prec Ind Co Ltd
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Publication date
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Priority to TW102121639A priority Critical patent/TWI513794B/zh
Priority to US14/058,447 priority patent/US20140377536A1/en
Publication of TW201500516A publication Critical patent/TW201500516A/zh
Application granted granted Critical
Publication of TWI513794B publication Critical patent/TWI513794B/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof

Description

膠帶
本發明涉及一種膠帶，尤其涉及一種雙面膠帶。
目前一般之雙面膠帶包括基材層及分別形成於基材層相對二側面之膠黏層。基材層一般由泡棉製成。使用時，可藉由膠黏層將待黏結物黏結於一起。目前形成基材層之泡棉之方法(如採用化學方法控制膨脹樹脂微球之膨脹體積或採用物理方法將氣泡導入泡棉之主體材質內)均較難控制其中氣泡之大小，甚至部分氣泡會破裂，導致膠帶使用時受力不均，較難承受預設之荷重。
鑒於上述狀況，有必要提供一種使用時受力均勻之膠帶。
一種膠帶，其包括剝離保護層、形成於該剝離保護層上之膠黏層、及分散於該膠黏層之複數承載粒子。每一該承載粒子包括具有彈性之殼體及收容於該殼體內之填充體，該填充體為膠黏劑，該殼體上還間隔開設有複數通孔。
本發明之膠帶採用承載粒子用作基材層，由於承載粒子包括具有彈性之殼體，受力時殼體彈性形變，不易破裂，可有效分散作用力，使膠帶受力均勻，均勻分散膠黏層所承受之應力，從而提高黏結效果。另，承載粒子之玻璃態轉化溫度較高，可提高膠帶之整體耐溫性能，從而改善其高溫時之剪切強度。同時，受力時， 填充體經由通孔流入膠黏層，從而進一步提高黏結效果。再者，膠帶之結構更簡單，製造步驟更簡單，僅需將承載粒子分散於膠黏劑中，然後，塗覆於剝離保護層上，即可製成。
10，20‧‧‧膠帶
11，21‧‧‧剝離保護層
13，23‧‧‧膠黏層
15，25‧‧‧承載粒子
150，250‧‧‧連通孔
151，251‧‧‧殼體
153，253‧‧‧填充體
圖1係本發明第一實施方式之膠帶之部分剖面示意圖。
圖2係本發明第一實施方式之承載粒子之剖面示意圖。
圖3係本發明第一實施方式之膠帶之使用狀態之部分剖面示意圖。
圖4係本發明第二實施方式之膠帶之部分剖面示意圖。
圖5係本發明第二實施方式之膠帶之使用狀態之部分剖面示意圖。
請參閱圖1及圖2，本發明第一實施方式之膠帶10包括剝離保護層11、設置於剝離保護層11上之膠黏層13、及分散於膠黏層13之複數承載粒子15。剝離保護層11為離型紙。膠黏層13由膠黏劑製成，用於黏結物件(圖未示)。承載粒子15為圓球狀，其包括具有彈性之空心之殼體151及收容於殼體151內之填充體153。殼體151上還開設有複數通孔150。填充體153為膠黏劑。
殼體151之材質可採用有機高分子材質、金屬或陶瓷材質，其中，有機高分子材質可採用偏二氯乙烯-丙烯腈共聚物、聚乙烯醇、聚乙烯醇縮丁醛、聚甲基丙烯酸甲酯、聚丙烯腈共聚物、聚偏二氯乙烯或聚碸至少其中之一；金屬可為不銹鋼、鈦、銅等；陶瓷可為改性之具有彈性之陶瓷，如二氧化硅-有機高分混合材質 或中空之玻璃陶瓷。在本發明第一實施方式中，殼體151由偏二氯乙烯-丙烯腈共聚物製成。
本發明第一實施方式中，填充體153為亞克力膠。可理解，填充體153不局限為亞克力膠，亦可為其它膠黏劑，如橡膠，只要具有膠黏作用即可。
本發明第一實施方式中，承載粒子15之粒徑大致為膠黏層13之厚度之一半，膠黏層13與複數承載粒子15之整體密度大致為0.6千克/立方米。可理解，承載粒子15之粒徑並不限於第一實施方式之大小，亦可大於膠黏層13之厚度之一半；膠黏層13與複數承載粒子15之整體密度並不限於第一實施方式之大小，只要其於0.3至0.9千克/立方米之間即可。本發明第一實施方式中，複數承載粒子15均勻分散於膠黏層13中。
請參圖3，本發明第一實施方式之膠帶10採用承載粒子15用作基材層，由於承載粒子15為具有彈性之殼體151，受力時殼體151彈性形變，不易破裂，可有效分散作用力，提高膠帶10之耐沖擊性，使膠帶10受力均勻，均勻分散膠黏層13所承受之應力，從而提高黏結效果。另外，承載粒子15之玻璃態轉化溫度較高，可提高膠帶10之整體耐溫性能，從而改善其高溫時之剪切強度。同時，受力時，填充體153經由通孔150流入膠黏層13，從而進一步提高黏結效果。再者，膠帶10之結構更簡單，製造步驟更簡單，僅需將承載粒子15分散於膠黏劑中，然後，塗覆於剝離保護層11上，即可製成。
請參閱圖4及圖5，本發明第二實施方式之膠帶20與第一實施方式之膠帶10結構類似，膠帶20包括剝離保護層21、設置於剝離保護 層21之膠黏層23、及分散於膠黏層23之複數承載粒子25。承載粒子25具有彈性之空心之殼體251及收容於殼體251內之填充體253。殼體251上還開設有複數通孔250。惟，承載粒子25之殼體251為橢圓球，其粒徑大於膠黏層23厚度之一半。請參圖5，使用時，如膠帶20受力，承載粒子25則發生形變。
可理解，承載粒子15，25並不限於上述形狀，其亦可為其它規則形狀或不規則形狀，如立方體形、多邊形等。
綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾或變化，皆應涵蓋於以下之如申請專利範圍內。
10‧‧‧膠帶
11‧‧‧剝離保護層
13‧‧‧膠黏層
15‧‧‧承載粒子
150‧‧‧通孔
151‧‧‧殼體
153‧‧‧填充體

Claims (10)

  1. 一種膠帶，其包括剝離保護層及形成於該剝離保護層上之膠黏層，其改良在於：該膠帶還包括分散於該膠黏層之複數承載粒子，每一該承載粒子包括具有彈性之殼體及收容於該殼體內之填充體，該填充體為膠黏劑，該殼體上還間隔開設有複數通孔。
  2. 如申請專利範圍第1項之膠帶，其中該殼體之材質採用有機高分子材質、金屬或陶瓷材質。
  3. 如申請專利範圍第2項之膠帶，其中該殼體之材質採用偏二氯乙烯-丙烯腈共聚物、聚乙烯醇、聚乙烯醇縮丁醛、聚甲基丙烯酸甲酯、聚丙烯腈共聚物、聚偏二氯乙烯或聚碸至少其中之一。
  4. 如申請專利範圍第2項之膠帶，其中該殼體之材質採用不銹鋼、鈦或銅。
  5. 如申請專利範圍第2項之膠帶，其中該殼體之材質採用二氧化硅-有機高分混合材質或中空之玻璃陶瓷材質。
  6. 如申請專利範圍第1項之膠帶，其中該承載粒子為圓球或橢圓球狀。
  7. 如申請專利範圍第1項所述之膠帶，其中該複數承載粒子均勻分散於該膠黏層中。
  8. 如申請專利範圍第1項所述之膠帶，其中該承載粒子之粒徑大於或等於該膠黏層厚度之一半。
  9. 如申請專利範圍第1項所述之膠帶，其中該膠黏層與該複數承載粒子之整體密度為0.3至0.9千克/立方米。
  10. 如申請專利範圍第1項所述之膠帶，其中該填充體為橡膠或亞克力樹脂。
TW102121639A 2013-06-19 2013-06-19 膠帶 TWI513794B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW102121639A TWI513794B (zh) 2013-06-19 2013-06-19 膠帶
US14/058,447 US20140377536A1 (en) 2013-06-19 2013-10-21 Adhesive tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102121639A TWI513794B (zh) 2013-06-19 2013-06-19 膠帶

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Publication Number Publication Date
TW201500516A TW201500516A (zh) 2015-01-01
TWI513794B true TWI513794B (zh) 2015-12-21

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TW (1) TWI513794B (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1844285A (zh) * 2006-04-07 2006-10-11 上海永冠胶粘制品有限公司 热熔压敏胶型布基胶带的制造工艺

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5348740A (en) * 1976-10-15 1978-05-02 Ricoh Co Ltd Pressure sensitive adhesive electrostatic photographic toner
US4988567A (en) * 1990-02-27 1991-01-29 Minnesota Mining And Manufacturing Company Hollow acid-free acrylate polymeric microspheres having multiple small voids
EP1033347B2 (en) * 1997-09-02 2012-06-20 Ishihara Sangyo Kaisha, Ltd. Hollow fine powder, flaky fine titanium oxide powder prepared by pulverizing said hollow fine powder, and process for preparing the both
US20040131846A1 (en) * 2002-12-19 2004-07-08 Epple Thomas C. Microsphere containing electron beam cured pressure-sensitive adhesive tapes and methods of making and using same
JP2012122027A (ja) * 2010-12-10 2012-06-28 Nitto Denko Corp 粘着テープ又はシート

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1844285A (zh) * 2006-04-07 2006-10-11 上海永冠胶粘制品有限公司 热熔压敏胶型布基胶带的制造工艺

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US20140377536A1 (en) 2014-12-25

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