TWI513546B - Laminated polishing pad and manufacturing method thereof - Google Patents
Laminated polishing pad and manufacturing method thereof Download PDFInfo
- Publication number
- TWI513546B TWI513546B TW102118437A TW102118437A TWI513546B TW I513546 B TWI513546 B TW I513546B TW 102118437 A TW102118437 A TW 102118437A TW 102118437 A TW102118437 A TW 102118437A TW I513546 B TWI513546 B TW I513546B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- laminated
- polishing
- polishing pad
- support layer
- Prior art date
Links
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- 238000004519 manufacturing process Methods 0.000 title claims description 45
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
本發明之積層研磨墊係有關於一種可以穩定且高研磨效率進行透鏡、反射鏡等光學材料或矽晶圓、硬碟用玻璃基板、鋁基板、及一般金屬研磨加工等要求高度表面平坦性之材料之平坦化加工之積層研磨墊及其製造方法。本發明之積層研磨墊,特別適合使用於在進一步積層、形成氧化物層或金屬層之前,平坦化矽晶圓及其上形成有該等氧化物層、金屬層等之裝置的步驟中。
製造半導體裝置時,進行於晶圓表面形成導電性膜,且藉微影成像術、蝕刻等形成佈線層之形成步驟、或於佈線層上形成層間絕緣膜之步驟等,且藉該等步驟於晶圓表面產生由金屬等導電體或絕緣體所形成之凹凸。近年,以半導體積體電路之高密度化為目的,不斷發展佈線之微細化或多層佈線化,但使晶圓表面之凹凸平坦化之技術亦隨之益形重要。
在CMP中一般使用之研磨裝置具有,例如,如第1圖所示,用以支持研磨墊1之研磨平台2、用以支持被研磨
材(晶圓等)4之支持台(拋光頭)5與用以對晶圓均勻加壓之背襯材、及研磨劑3之供給機構。例如,研磨墊1係藉由雙面膠帶之黏貼裝設於研磨平台2上。研磨平台2與支持台5係配置成使各自支持之研磨墊1與被研磨材4對向之狀態,並分別具有旋轉軸6、7。又,支持台5側設有用以將被研磨材4緊壓於研磨墊1上之加壓機構。
以往,高精度研磨所使用之研磨墊,一般係使用聚胺酯樹脂發泡體片。然而,聚胺酯樹脂發泡體片雖具有優異之局部平坦化能力,但是緩衝性不足,故難以在晶圓全面施加均勻之壓力。因此,通常於聚胺酯樹脂發泡體片之背面另設有柔軟之緩衝層,作為積層研磨墊且用於研磨加工。
但是,習知之積層研磨墊一般係藉雙面膠帶黏合研磨層與緩衝層,但是有研磨中漿液侵入研磨層與緩衝層之間而使雙面膠帶之耐久性降低,且研磨層與緩衝層變成容易產生剝離之問題。
例如,乃提出以下之技術,作為解決上述問題之方法。
在專利文獻1中,揭示使用反應性熱熔接著劑接著塑膠薄膜及研磨墊。
在專利文獻2中,揭示底層及研磨層藉由熱熔接著劑層接著之研磨墊。
在專利文獻3中,揭示一種多層研磨墊之製造方法,該製造方法係加熱在基材之一面形成用以積層硬質墊
本體之熱熔型接著劑層,且在另一面形成用以積層緩衝性副墊之壓感黏著劑層之多層研磨墊用雙面膠帶之前述熱熔型接著劑層,且透過前述熱熔型接著劑層積層硬質墊本體於基材之一面後,加壓緩衝性副墊於前述壓感黏著劑層上,且透過前述壓感黏著劑層積層緩衝性副墊於基材之另一面。
在專利文獻4中,揭示一種研磨層及基底層藉由雙面膠帶接著之研磨墊,且在研磨層之背面與雙面膠帶之間設有由熱熔接著劑形成且遮斷研磨漿液之止水層的技術。
在專利文獻5中,揭示一種研磨層與下層藉由含有EVA之熱熔接著劑接合之研磨墊。
在專利文獻6中,揭示一種製造多數層化學機械研磨墊之方法,該方法包含:提供研磨墊;提供具有上面及底面之副墊層;提供未硬化之反應性熱熔接著劑;以平行線圖案將未硬化之反應性熱熔接著劑施加在副墊層之上面;將研磨層配置在未硬化之反應性熱熔接著劑之平行線圖案上,形成研磨墊積層物;施力於研磨墊積層物上以緊壓研磨層與副墊層;及使未硬化之反應性熱熔接著劑硬化,且在研磨層與副墊層之間形成反應性熱熔接著劑結合。
如果使用熱熔接著劑,則可防止層間剝離。但是,在連續線上使用積層輥且透過熱熔接著劑黏合研磨層與緩衝層時,有在緩衝層容易產生皺摺之問題。
專利文獻1:特開2002-224944號公報
專利文獻2:特開2005-167200號公報
專利文獻3:特開2006-265410號公報
專利文獻4:特開2009-95945號公報
專利文獻5:特表2010-525956號公報
專利文獻6:特開2010-28113號公報
本發明之目的在於提供一種即使因長時間研磨而變成高溫時研磨層與支持層之間亦不易剝離,且在支持層不易產生皺摺之積層研磨墊之製造方法。
本發明人等為解決前述課題再三鑽研後,發現藉以下所示之積層研磨墊之製造方法可達成上述目的,並完成本發明。
即,本發明係有關於一種積層研磨墊之製造方法,其包含使透過熱熔型接著構件積層研磨層與支持層之積層體通過一對積層輥之間,且藉熱熔型接著構件黏合研
磨層與支持層而製作積層研磨片之步驟,其特徵在於前述積層體之研磨層之TD方向之長度(TD1)及支持層之TD方向之長度(TD2)之比(TD1/TD2)恆定地調整至0.3以上。
在連續線上使用積層輥藉熱熔型接著劑黏合研磨層與支持層(例如,緩衝層)時,以往,如圖2所示,在支持層8上設置熔融之熱熔型接著劑(未圖示),然後,在熱熔型接著劑上積層圓形之研磨層9,且使得到之積層體通過一對積層輥10之間並且藉熱熔型接著劑黏合研磨層9與支持層8。
在前述習知製造方法中,積層體搬入積層輥10時,只在積層研磨層9之支持層部份(圖2之斜線部份)上施加線壓,且在未積層研磨層9之支持層部份上不施加線壓。又,由於在支持層8上設有熔融之熱熔型接著劑,故支持層8呈容易柔軟變形之狀態。又,在連續線上以搬送方向拉伸支持層8,但是支持層8之施加線壓之部份(圖2之斜線部份),與未施加線壓之部份比較,對拉伸之抵抗力大,因此在施加線壓之部份與未施加線壓之部份,移動速度產生些許差。結果,可考慮在黏合後之支持層8上容易產生皺摺。
本發明人發現,如圖3及圖4所示,恆定地調整研磨層9之TD方向之長度(TD1)與支持層之TD方向之長度(TD2)之比(TD1/TD2)至0.3以上,且均勻地施加線壓至積層研磨層9之支持層部份(圖3及圖4之斜線部份),藉此在黏合後之支持層8上不易產生皺摺。如圖2所示地使用圓形研磨層9時,或TD1/TD2未達0.3時,防止皺摺產生是困難的。
本發明之積層研磨墊之製造方法亦可包含將前述積層研磨片切斷成圓形之步驟。製造圓形積層研磨片時,必須在製作積層研磨片後切斷成圓形。
又,本發明之積層研磨墊之製造方法亦可包含在前述積層研磨片之表面實施凹槽加工之步驟。製造在研磨表面具有凹槽之積層研磨墊時,宜在製作積層研磨片後在研磨層之表面進行凹槽加工。使用預先實施凹槽加工之研磨層製作積層研磨片時,如上所述,在積層時在有凹槽之部份及無凹槽之部份不產生線壓差異,且在黏合後之支持層上不易產生皺摺。又,由於壓力難以施加於有凹槽之部份,故在該部份之接著不足,且容易產生空氣滲入。
較佳地,前述熱熔型接著構件係含有聚酯類熱熔接著劑之接著劑層,或在基材兩面具有前述接著劑層之雙面膠帶,且前述聚酯類熱熔接著劑係相對於100重量份之基底聚合物之聚酯樹脂,含有2至10重量份之在1分子中具有2以上環氧丙基之環氧樹脂。
相對於100重量份之基底聚合物之聚酯樹脂,添加2至10重量份之在1分子中具有2以上環氧丙基之環氧樹脂,且使聚酯樹脂交聯,藉此可得到即使因長時間研磨而變成高溫時,接著構件對研磨時產生之「位移」之耐久性亦提高,且研磨層與支持層之間亦不易剝離的積層研磨墊。
聚酯樹脂之添加量未達2重量份時,因長時間研磨而變成高溫時,接著構件對研磨時產生之「位移」之耐久性不足,故研磨層與支持層之間容易剝離。另一方面,
超過10重量份時,接著劑層之硬度變成過高而使接著性降低,因此研磨層與支持層或中間層之間變成容易剝離。
又,較佳地,基底聚合物之聚酯樹脂係結晶性聚酯樹脂。藉使用結晶性聚酯樹脂,可提高對漿液之耐藥品性,且接著劑層之接著力不易降低。
此外,本發明係有關於一種藉前述製造方法得到之積層研磨墊,及包含使用前述積層研磨墊研磨半導體晶圓表面之步驟之半導體裝置之製造方法。
依據本發明之製造方法,可得到即使在連續線上使用積層輥且透過熱熔接著構件黏合研磨層與支持層時,在支持層上亦無皺摺之積層研磨墊。又,本發明之積層研磨墊係透過含有特定聚酯類熱熔接著劑之接著構件積層研磨層與支持層,因此即使因長時間研磨而變成高溫時,在研磨層與支持層之間亦不易剝離。
1‧‧‧研磨墊、積層研磨墊
2‧‧‧研磨平台
3‧‧‧研磨劑
4‧‧‧被研磨材
5‧‧‧支持台
6、7‧‧‧旋轉軸
8‧‧‧支持層
9‧‧‧研磨層
10‧‧‧積層輥
TD1‧‧‧研磨層之TD方向之長度
TD2‧‧‧支持層之TD方向之長度
圖1係顯示CMP研磨所使用之研磨裝置之一例之概略構成圖。
圖2係顯示習知積層研磨墊之製造方法之一例之概略圖。
圖3係顯示本發明之積層研磨墊之製造方法之一例之概略圖。
圖4係顯示本發明之積層研磨墊之製造方法之一例之概略圖。
本發明之積層研磨墊之製造方法包含使透過熱熔型接著構件積層研磨層與支持層之積層體通過一對積層輥之間,且藉熱熔型接著構件黏合研磨層與支持層而製作積層研磨片之步驟。
前述研磨層只要是具有微細氣泡之發泡體即可,沒有特殊限制。可舉例如:聚胺酯樹脂、聚酯樹脂、聚醯胺樹脂、丙烯酸樹脂、聚碳酸酯樹脂、鹵素類樹脂(聚氯乙烯、聚四氟乙烯、聚偏二氟乙烯等)、聚苯乙烯、烯烴類樹脂(聚乙烯、聚丙烯等)、環氧樹脂、感光性樹脂等1種或2種以上之混合物。聚胺酯樹脂因耐磨性佳,且藉原料組成之各種變化可容易地得到具有所希望物性之聚合物,故為特別適於作為研磨層之形成材料的材料。以下,就聚胺酯樹脂代表前述發泡體進行說明。
聚胺酯樹脂係由異氰酸酯成分、多元醇成分(高分子量多元醇、低分子量多元醇)、及鏈伸長劑構成者。
異氰酸酯成分可無特殊限制地使用聚胺酯領域中公知之化合物。異氰酸酯成分可舉例如:2,4-二異氰酸甲苯酯、2,6-二異氰酸甲苯酯、2,2’-二苯甲烷二異氰酸酯、2,4’-二苯甲烷二異氰酸酯、4,4’-二苯甲烷二異氰酸酯、1,5-萘二異氰酸酯、對苯二異氰酸酯、間苯二異氰酸酯、對伸茬二異氰酸酯、間伸茬二異氰酸酯等芳香族二異氰酸酯;乙烯二異氰酸酯、2,2,4-三甲基六亞甲基二異氰酸酯、1,6-六亞
甲基二異氰酸酯等脂肪族二異氰酸酯;1,4-環己烷二異氰酸酯、4,4’-二環己基甲烷二異氰酸酯、二異氰酸異佛爾酮、降冰片烷二異氰酸酯等脂環族二異氰酸酯。可由以上諸等中選1種使用,或取2種以上混合亦可。
高分子量多元醇可舉在聚胺酯之領域中一般用者為例。可舉例如:以聚四亞甲基醚二醇、聚乙二醇等為代表之聚醚多元醇,以聚丁烯己二酸酯為代表之聚酯多元醇,聚己內酯多元醇,以聚己內酯之類聚酯二醇與碳酸伸烷酯之反應物等為例之聚酯聚碳酸酯多元醇,使碳酸伸乙酯與多元醇反應後所產生之反應混合物與有機二羧酸反應形成之聚酯聚碳酸酯多元醇,及聚羥基化合物與碳酸烯丙酯經轉酯作用而得之聚碳酸酯多元醇等。上述諸等可單獨使用,亦可合併2種以上使用。
多元醇成分除上述高分子量多元醇外,可並用乙二醇、1,2-丙二醇、1,3-丙二醇、1,2-丁二醇、1,3-丁二醇、1,4-丁二醇、2,3-丁二醇、1,6-己二醇、新戊二醇、1,4-環己烷二甲醇、3-甲基-1,5-戊二醇、二乙二醇、三乙二醇、1,4-雙(2-羥乙氧)苯、三羥甲基丙烷、甘油、1,2,6-己烷三醇、新戊四醇、四羥甲基環己烷、甲基葡萄糖苷、山梨糖醇、甘露糖醇、半乳糖醇、蔗糖、2,2,6,6-四(羥甲基)環己醇、二乙醇胺、N-甲基乙醇胺、及三乙醇胺等低分子量多元醇。又,亦可與伸乙二胺、甲苯二胺、二苯甲烷二胺、及二伸乙三胺等低分子量多胺並用。又,亦可與一乙醇胺、2-(2-胺乙胺)乙醇、及一丙醇胺等醇胺並用。低分子量多元醇、分
子量多胺等可單獨使用1種,亦可合併2種以上使用。低分子量多元醇或低分子量多胺等之混合量並無特殊限制,可依由製成之研磨墊(研磨層)所要求之特性來適當決定。
以預聚合物法製造聚胺酯發泡體時,將鏈伸長劑用於預聚合物之硬化上。鏈伸長劑係具有至少2個以上活性氫基之有機化合物,活性氫基可舉羥基、1級或2級胺基、硫醇基(SH)等為例。具體言之,可舉例如:以4,4’-亞甲雙(鄰氯苯胺)(MOCA)、2,6-二氯對苯二胺、4,4’-亞甲雙(2,3-二氯苯胺)、3,5-雙(甲硫基)-2,4-甲苯二胺、3,5-雙(甲硫基)-2,6-甲苯二胺、3,5-二乙基甲苯-2,4-二胺、3,5-二乙基甲苯-2,6-二胺、1,3-丙二醇-二對胺苯甲酸酯、聚四亞甲基二醇-二對胺苯甲酸酯、4,4’-二胺-3,3’,5,5’-四乙基二苯甲烷、4,4’-二胺-3,3’-二異丙基-5,5’-二甲二苯甲烷、4,4’-二胺-3,3’,5,5’-四異丙基二苯甲烷、1,2-雙(2-胺基苯硫基)乙烷、4,4’-二胺-3,3’-二乙-5,5’-二甲二苯甲烷、N-N’-二(二級丁基)-4,4’-二胺二苯甲烷、3,3’-二乙-4,4’-二胺二苯甲烷、間伸茬二胺、N,N’-二(二級丁基)對苯二胺、間苯二胺、及對伸茬二胺等為例之多胺類,抑或上述低分子量多元醇或低分子量多胺。上述諸等可僅用1種,亦可取2種以上混合使用。
聚胺酯發泡體可運用預聚合熔融法、溶液法等公知之聚胺酯化技術製造,但考慮到成本、作業環境等因素,則宜以熔融法進行製造。
聚胺酯發泡體可由預聚合物法、直接聚合法中採任一方法製造,但事先由異氰酸酯成分與多元醇成分合成
端基為異氰酸酯之預聚合物,再使鏈伸長劑與該預聚合物反應之預聚合物法因製得之聚胺酯樹脂之物理性特性佳,故是合適的。
聚胺酯發泡體之製造方法,可舉添加中空珠粒之方法、機械性發泡法、化學性發泡法等為例。
其中又以使用了矽型界面活性劑之機械性發泡法尤佳,該矽型界面活性劑乃聚烷基矽氧與聚醚之共聚物,且不具活性氫基。
另,視必要亦可加入抗氧化劑等穩定劑、潤滑劑、顏料、填充劑、抗靜電劑及其他添加劑。
聚胺酯發泡體可為獨立氣泡式,亦可為連續氣泡式。
聚胺酯發泡體之平均氣泡直徑宜為30至80μm,若為30至60μm更佳。若脫離此範圍,則有研磨速度下降,或研磨後之被研磨材(晶圓)之平面性(平坦性)降低之趨向。
聚胺酯發泡體之比重宜為0.5至1.3。比重未達0.5時,研磨層之表面強度趨於下降,且被研磨材之平面性降低。又,大於1.3時,雖然研磨層表面之氣泡數減少,且平面性良好,但是研磨速度趨於下降。
聚胺酯發泡體之硬度,宜經ASKER D型硬度計測為40至75度。ASKER D型硬度計測得之硬度未達40度時,被研磨材之平面性降低,又,大於75度時,平面性雖良好,但被研磨材之均勻度(均一性)趨於下降。
研磨區域8之厚度並無特殊限制,但通常約為0.8
至4mm,且宜為1.2至2.5mm。
支持層係用以補足研磨層之特性者。支持層可使用彈性模數比研磨層低之層(緩衝層),亦可使用彈性模數比研磨層高之層(高彈性層)。緩衝層係CMP中,為使折衷關係中平面性與均勻度兩者並立之所必須。所謂平面性係指研磨圖案形成時產生有微小凹凸之被研磨材後的圖案部之平坦性,均勻度係指被研磨材全體之均一性。藉由研磨層之特性,改善平面性,並藉由緩衝層之特性改善均勻度。當CMP中,為抑制裂縫產生而使用柔軟研磨層時,為提高研磨墊之平坦化特性使用高彈性層。又,藉由使用高彈性層,可抑制過度切削被研磨材之邊緣部。
緩衝層可舉例如:聚酯不織布、尼龍不織布、及丙烯酸不織布等纖維不織布;浸漬聚胺酯之聚酯不織布之類之浸樹脂不織布;聚胺酯泡棉及聚乙烯泡棉等高分子樹脂發泡體;丁二烯橡膠及異戊二烯橡膠等橡膠性樹脂;感光性樹脂等。
緩衝層之厚度並無特殊限制,但宜為300至1800μm,若為700至1400μm更佳。
高彈性層可舉金屬片,樹脂薄膜等為例。樹脂薄膜可舉例如:聚對苯二甲酸乙二酯薄膜及聚萘二甲酸乙二酯薄膜等聚酯薄膜;聚乙烯薄膜及聚丙烯薄膜等聚烯烴薄膜;尼龍薄膜;聚醯亞胺薄膜等。
高彈性層之厚度並無特殊限制,但由剛性、及加熱時之尺寸安定性等觀點來看宜為10至200μm,若為15至
55μm更佳。
前述積層體係透過熱熔型接著構件積層研磨層與支持層製作。
熱熔型接著構件可使用含有一般熱熔接著構件之接著劑層,但是特佳的是使用含有聚酯類熱熔接著劑之接著劑層。
前述聚酯類熱熔接著劑宜至少含有基底聚合物之聚酯樹脂,及作為交聯成分之在1分子中具有2以上環氧丙基之環氧樹脂。
前述聚酯樹脂可使用藉由酸成分及多元醇之縮聚合得到之公知者,但特佳的是使用結晶性聚酯樹脂。
酸成分可舉芳香族二羧酸,脂肪族二羧酸及脂環族二羧酸等為例。可只使用該等酸成分中之1種,亦可合併2種以上使用。
芳香族二羧酸之具體例可舉例如:對苯二甲酸,間苯二甲酸,鄰苯二甲酸酐,α-萘二甲酸,β-萘二甲酸,及其酯形成體等。
脂肪族二羧酸之具體例可舉例如:琥珀酸,戊二酸,己二酸,庚二酸,壬二酸,癸二酸,十一碳烯酸,十二烷二酸,及其酯形成體等。
脂環族二羧酸之具體例可舉1,4-環己二甲酸,四氫化鄰苯二甲酸酐,六氫化鄰苯二甲酸酐等為例。
又,酸成分亦可並用順丁烯二酸、反丁烯二酸、二聚物酸等之不飽和酸,偏苯三酸、焦蜜石酸等多元羧酸等。
多元醇成分可舉脂肪族二醇,脂環族二醇等二元醇及多元醇為例。可只使用該等多元醇成分中之1種,亦可合併2種以上使用。
脂肪族二醇之具體例可舉例如:乙二醇,1,2-丙二醇,1,3-丙二醇,1,3-丁二醇,1,4-丁二醇,1,5-戊二醇,1,6-己二醇,1,8-辛二醇,1,9-壬二醇,新戊二醇,3-甲基戊二醇,2,2,3-三甲基戊二醇,二乙二醇,三乙二醇,二丙二醇等。
脂環族二醇之具體例可舉1,4-環己烷二甲醇,氫化雙酚A等為例。
多元醇可舉甘油,三羥甲基乙烷,三羥甲基丙烷,新戊四醇等為例。
結晶性聚酯樹脂可藉由公知之方法合成。例如,包括準備原料及觸媒,且在生成物熔點以上之溫度加熱之熔融聚合法、在生成物熔點以下聚合之固相聚合法、使用溶劑之溶液聚合法等,亦可採用任一種方法。
結晶性聚酯樹脂之熔點宜為100至200℃。熔點未達100℃時,熱熔接著劑之接著力會因研磨時發熱而下降,且超過200℃時,由於使熱熔接著劑熔融時之溫度升高,所以有在積層研磨墊產生翹曲而對研磨特性造成不良影響之傾向。
又,結晶性聚酯樹脂之數目平均分子量宜為5000至50000。數目平均分子量未達5000時,熱熔接著劑之機械特性降低,故無法得到充分之接著性及耐久性,且超過
50000時,有合成結晶性聚酯樹脂時產生造成凝膠化等製造上之缺點,或作為熱熔接著劑之性能降低的傾向。
前述環氧樹脂可舉例如:雙酚A型環氧樹脂,溴化雙酚A型環氧樹脂,雙酚F型環氧樹脂,雙酚AD型環氧樹脂,二苯乙烯型環氧樹脂,聯苯型環氧樹脂,雙酚A酚醛清漆型環氧樹脂,甲酚酚醛清漆型環氧樹脂,二胺聯苯甲烷型環氧樹脂,及六(羥苯)乙烷系等之聚苯系環氧樹脂;含茀環氧樹脂,三環氧丙基異氰酸酯,含有雜芳香環(例如,三氮雜苯環等)之環氧樹脂等之芳香族環氧樹脂;脂肪族環氧丙基醚型環氧樹脂,脂肪族環氧丙基酯型環氧樹脂,脂環族環氧丙基醚型環氧樹脂,脂環族環氧丙基酯型環氧樹脂等之非芳香族環氧樹脂。可使用該等環氧樹脂之單獨1種,亦可合併2種以上使用。
該等環氧樹脂中,由研磨時與研磨層之接著性觀點來看,宜使用甲酚酚醛清漆型環氧樹脂。
前述環氧樹脂,相對於100重量份之基底聚合物之聚酯樹脂,必須添加2至10重量份,且較佳的是3至7重量份。
聚酯類熱熔接著劑亦可含有烯烴類樹脂等軟化劑,黏著賦予劑,填充劑,安定劑,及耦合劑等公知之添加劑。又,亦可含有滑石等公知之無機填料。
聚酯類熱熔接著劑係藉由任意之方法混合至少前述聚酯樹脂、及前述環氧樹脂等來調製。例如,藉由單軸擠壓機、嚙合型同向平行軸雙軸擠壓機、嚙合型異向平
行軸雙軸擠壓機、嚙合型異向斜軸雙軸擠壓機、非嚙合型雙軸擠壓機、不完全嚙合型雙軸擠壓機、共揉和形擠壓機、行星齒輪型擠壓機、轉移混合擠壓機、輥擠壓機等之擠壓成形機或揉合機等混合各原料來調製。
聚酯類熱熔接著劑之熔點宜為100至200℃。
又,聚酯類熱熔接著劑之比重宜為1.1至1.3。
又,聚酯類熱熔接著劑之熔融流動指數(MI)在150℃、負載2.16公斤之條件下,宜為16至26克/10分鐘。
前述接著劑層之厚度宜為10至200μm,更佳的是25至125μm。
透過熱熔型接著構件積層研磨層與支持層之方法並無特殊限制,可舉例如:(1)一面搬送晶圓狀支持層,一面在該支持層上積層由熱熔接著劑構成之接著劑層,且藉由加熱器加熱熔融接著劑層,然後,在熔融之接著劑層上積層研磨層之方法;(2)一面搬送晶圓狀支持層,一面在該支持層上塗布熔融之熱熔接著劑,然後,在熔融之接著劑層上積層研磨層之方法。又,積層之研磨層可呈晶圓狀,亦可呈個別單件,但是藉由使用晶圓狀之研磨層,可進一步確實防止支持層之皺摺產生。
製作積層體時,研磨層之TD方向之長度(TD1)與支持層之TD方向之長度(TD2)之比(TD1/TD2)必須恆定地調整至0.3以上。TD1/TD2宜為0.3至1.2,且更佳的是0.8至1。TD1/TD2超過1.2時會在製造成本方面不利,或容易產生空氣滲入。
亦可使用在基材之兩面具有前述接著劑層之雙面膠帶,取代前述接著劑層。藉由基材可防止漿液浸透至支持層側,且防止在支持層與接著構件之間的剝離。
基材可舉樹脂薄膜為例,且樹脂薄膜可舉例如:聚對苯二甲酸乙二酯薄膜及聚萘二甲酸乙二酯薄膜等聚酯薄膜;聚乙烯薄膜及聚丙烯薄膜等聚烯烴薄膜;尼龍薄膜;聚醯亞胺薄膜等。其等之中,宜使用防透水性質佳之聚酯薄膜。
基材之表面亦可實施電暈處理、電漿處理等易接著處理。
基材之厚度並無特殊限制,但由透明性、柔軟性、剛性及加熱時之尺寸安定性等觀點來看宜為10至200μm,且更佳的是15至55μm。
使用雙面膠帶時,前述接著劑層之厚度宜為10至200μm,且更佳的是30至100μm。
然後,使前述積層體通過一對積層輥之間,且藉熱熔型接著構件黏合研磨層與支持層並製作積層研磨片。使前述積層體通過一對積層輥之間時,宜以研磨層之始端相對積層輥之旋轉軸平行之方式搬送積層體。藉由線壓均勻地施加在積層有研磨層之支持層部份上,在黏合後之支持層上不易產生皺摺。
製造圓形積層研磨墊時,在製作積層研磨片後切斷成圓形。
又,當製作在研磨表面具有用以保持、更換漿液
之凹槽之積層研磨墊時,宜在製作積層研磨片後在研磨表面實施凹槽加工。凹槽並無特殊限制,只要呈可保持、更換漿液之形狀即可,例如,舉例言之,如XY細長凹槽、同心圓狀凹槽、未貫通孔、多角柱、圓柱、螺旋狀凹槽、偏心圓形凹槽、放射狀凹槽及該等凹槽之組合。又,該等凹槽一般具有規則性,但為提高研磨液之保持、更換性,亦可每某一範圍改變凹槽節距、凹槽寬度、凹槽深度等。
本發明之積層研磨墊亦可在與平台(研磨平台)接著之面上設有雙面膠帶。
半導體裝置係經利用前述積層研磨墊研磨半導體晶圓表面之步驟製造。所謂半導體晶圓一般而言係於矽晶圓上積層有佈線金屬及氧化膜者。半導體晶圓之研磨方法、研磨裝置並無特殊限制,舉例言之,係使用圖1所示具有用以支持積層研磨墊1之研磨平台2、用以支持半導體晶圓4之支持台(拋光頭)5與用以對晶圓均勻加壓之背襯材、研磨劑3之供給機構之研磨裝置等進行。舉例言之,積層研磨墊1係藉由雙面膠帶之黏貼裝設於研磨平台2上。研磨平台2與支持台5係配置成使各自支持之積層研磨墊1與半導體晶圓4相對向之狀態,並分別具有旋轉軸6、7。又,支持台5側設有用以將半導體晶圓4緊壓於積層研磨墊1上之加壓機構。研磨時,使研磨平台2與支持台5旋轉同時將半導體晶圓4緊壓在積層研磨墊1上,且一面供給漿液一面進行研磨。漿液之流量、研磨負載、研磨平台旋轉數及晶圓旋轉數並無特殊限制,適當調整即可進行。
藉此即可去除半導體晶圓4表面突出之部分,研磨成平坦狀。然後,藉由切割、接合、封裝等製造半導體裝置。半導體裝置係用於運算處理裝置或記憶體等。
以下,舉實施例說明本發明,但本發明並非以該等實施例為限。
聚酯類熱熔接著劑之熔點係使用TOLEDO DSC822(METTLER公司製),以20℃/分之升溫速度測量。
依據JIS Z8807-1976進行。將由聚酯類熱熔接著劑形成之接著劑層切出4cm×8.5cm之長條狀(厚度:任意),做成測量比重用試樣,並於溫度23℃±2℃、濕度50%±5%之環境下靜置16小時。測量時使用比重計(sartorius公司製)測量比重。
依據ASTM-D-1238在150℃、2.16公斤之條件下,測量聚酯類熱熔接著劑之熔融流動指數。
由製成之積層研磨墊切出25mm×200mm之樣本,且以拉伸角度180°、拉伸速度300mm/分拉伸樣本之研磨層及支持層,觀察此時之樣本之剝離狀態。
將1229重量份之甲苯異氰酸酯(2,4-體/2,6-體=80/20之混合物),272重量份之4,4'-二環己基甲烷二異氰酸酯,1901重量份之數目平均分子量1018之聚四亞甲基醚二醇,198重量份之二乙二醇放入容器中,且在70℃反應4小時而得到端基為異氰酸酯之預聚合物。
於聚合容器內加入100重量份之該預聚合物及3重量份之矽型界面活性劑(Dow Corning Toray‧silicone公司製,SH-192)加以混合,並調整為80℃後予以真空除氣。繼之,利用攪拌葉片,以旋轉數900rpm激烈攪拌大約4分鐘,將氣泡帶入反應系內。再添加26重量份之預先調整溫度為120℃之MOCA(IHARA CHEMICAL公司製,IHARACUAMINE-MT)。將該混合液攪拌約1分鐘後,注入四角形之盤式敞模(鑄模容器)中。於該混合液喪失流動性時放入烘箱內,進行100℃且16小時之後硬化,製得聚胺酯發泡體塊體。
將加熱達80℃之前述聚胺酯發泡體塊體使用切片機(Amitec公司製,VGW-125)切片,製得聚胺酯發泡體片(平均氣泡直徑:50μm,比重:0.86,硬度:52度)。其次,使用擦光機(Amitec公司製),以#120號、#240號、及#400號砂紙依序進行研磨加工且調整厚度精度,製成研磨層(厚度2mm、寬度550mm、長度1200mm)。
除了使用八角形之盤式敞模取代四角形之盤式敞模以外,以與製造例1同樣之方法製成研磨層(厚度2mm、最小
寬度200mm、最大寬度550mm、長度1200mm)。
除了使用八角形之盤式敞模取代四角形之盤式敞模以外,以與製造例1同樣之方法製成研磨層(厚度2mm、最小寬度150mm、最大寬度550mm、長度1200mm)。
搬送由發泡聚胺酯形成之支持層(NHK SPRING公司製,NIPPALAY EXT,寬度550mm),且在該支持層上,積層100重量份之由含有結晶性聚酯樹脂(TOYOBO公司製,VYLON GM420),及5重量份之在1分子中具有2個以上環氧丙基之鄰甲酚酚醛清漆型環氧樹脂(NIPPON KAYAKU(股)公司製,EOCN4400)之聚酯類熱熔接著劑(熔點:142℃,比重:1.22,熔融流動指數:21克/10分鐘)形成的接著劑層(厚度50μm),且使用紅外線加熱器加熱接著劑層表面至150℃使接著劑層熔融。然後,在熔融之接著劑層上使用積層機積層藉製造例1製成之研磨層,得到積層體。TD1/TD2=550mm/550mm=1。然後,以聚酯類熱熔接著劑之始端相對於積層輥之旋轉轉平行之方式,使積層體通過一對積層輥之間,且藉接著劑層黏合研磨層與支持層而製成積層研磨片。在製成之積層研磨片上未產生皺摺及空氣滲入。然後,在積層研磨片之支持層上使用積層機黏合壓感式雙面膠帶(3M公司製,442JA),且將積層研磨片切斷成直徑508mm之大小。然後,使用凹槽加工機(Tohokoki公司製)在
研磨層之表面上形成凹槽寬度0.25mm、凹槽節距1.5mm、凹槽深度0.6mm之同心圓形狀凹槽而製成積層研磨墊。
使用製成之積層研磨片研磨半導體晶圓,但是可無斑地研磨層半導體晶圓。又,藉此述方法進行剝離試驗後,樣本之剝離狀態係材料破壞。
藉與實施例1同樣之方法製作積層研磨片。然後,使用凹槽加工機(Tohokoki公司製)在研磨層之表面上形成凹槽寬度0.25mm、凹槽節距1.5mm、凹槽深度0.6mm之同心圓形狀凹槽,再將積層研磨片切斷成直徑508mm之大小。在製成之積層研磨片上未產生皺摺及空氣滲入。然後,在積層研磨片之支持層上使用積層機黏合壓感式雙面膠帶(3M公司製,442JA)而製成積層研磨墊。
使用製成之積層研磨片研磨半導體晶圓,但是可無斑地研磨層半導體晶圓。又,藉此述方法進行剝離試驗後,樣本之剝離狀態係材料破壞。
除了使用藉製造例2製成之研磨層取代藉製造例1製成之研磨層以外,藉與實施例2同樣之方法製成積層研磨片(參照圖4)。又,TD1/TD2之最小值係0.36(200mm/550mm)。又,在製成之積層研磨片上未產生皺摺及空氣滲入。
使用製成之積層研磨片研磨半導體晶圓,但是可無斑地研磨層半導體晶圓。又,藉此述方法進行剝離試驗後,樣本之剝離狀態係材料破壞。
搬送由發泡聚胺酯形成之支持層(NHK SPRING公司製,NIPPALAY EXT,寬度550mm),且在該支持層上,積層100重量份之由含有結晶性聚酯樹脂(TOYOBO公司製,VYLON GM420),及2重量份之在1分子中具有2個以上環氧丙基之鄰甲酚酚醛清漆型環氧樹脂(NIPPON KAYAKU(股)公司製,EOCN4400)之聚酯類熱熔接著劑(熔點:140℃,比重:1.24,熔融流動指數:26克/10分鐘)形成的接著劑層(厚度50μm),且使用紅外線加熱器加熱接著劑層表面至150℃使接著劑層熔融。然後,藉與實施例1同樣之方法製成積層研磨墊。
使用製成之積層研磨片研磨半導體晶圓,但是可無斑地研磨層半導體晶圓。又,藉此述方法進行剝離試驗後,樣本之剝離狀態係材料破壞。
搬送由發泡聚胺酯形成之支持層(NHK SPRING公司製,NIPPALAY EXT,寬度550mm),且在該支持層上,積層100重量份之由含有結晶性聚酯樹脂(TOYOBO公司製,VYLON GM420),及10重量份之在1分子中具有2個以上環氧丙基之鄰甲酚酚醛清漆型環氧樹脂(NIPPON KAYAKU(股)公司製,EOCN4400)之聚酯類熱熔接著劑(熔點:145℃,比重:1.19,熔融流動指數:16克/10分鐘)形成的接著劑層(厚度50μm),且使用紅外線加熱器加熱接著劑層表面至150℃使接著劑層熔融。然後,藉與實施例1同
樣之方法製成積層研磨墊。
使用製成之積層研磨片研磨半導體晶圓,但是可無斑地研磨層半導體晶圓。又,藉此述方法進行剝離試驗後,樣本之剝離狀態係材料破壞。
將藉製造例1製成之研磨層切斷成直徑508nm之大小。
搬送由發泡聚胺酯形成之支持層(NHK SPRING公司製,NIPPALAY EXT,寬度550mm),且在該支持層上,積層在實施例1中使用之接著劑層(厚度50μm),且使用紅外線加熱器加熱接著劑層表面至150℃使接著劑層熔融。然後,在熔融之接著劑層上使用積層機積層直徑508mm之研磨層而得到積層體。然後,使積層體通過一對積層輥之間,且藉接著劑層黏合研磨層與支持層而製成積層研磨片。在製成之積層研磨片上產生皺摺及空氣滲入。然後,在積層研磨片之支持層上使用積層機黏合壓感式雙面膠帶(3M公司製,442JA),且將積層研磨片切斷成直徑508mm之大小。然後,使用凹槽加工機(Tohokoki公司製)在研磨層之表面上形成凹槽寬度0.25mm、凹槽節距1.5mm、凹槽深度0.6mm之同心圓形狀凹槽而製成積層研磨墊。
使用製成之積層研磨片研磨半導體晶圓,但是在半導體晶圓上產生研磨斑。又,藉此述方法進行剝離試驗後,樣本之剝離狀態係界面剝離。皺摺及空氣滲入可考慮為研磨斑及界面剝離之原因。
除了使用藉製造例3製成之研磨層取代藉製造1製成之研磨層以外,藉與實施例1同樣之方法製成積層研磨片(參照圖4)。又,TD1/TD2之最小值係0.27(150mm/550mm)。又,在製成之積層研磨片上產生皺摺及空氣滲入。
使用製成之積層研磨片研磨半導體晶圓,但是在半導體晶圓上產生研磨斑。又,藉此述方法進行剝離試驗後,樣本之剝離狀態係界面剝離。皺摺及空氣滲入可考慮為研磨斑及界面剝離之原因。
本發明之積層研磨墊可以穩定且高研磨效率進行透鏡、反射鏡等光學材料或矽晶圓、硬碟用玻璃基板、鋁基板、及一般金屬研磨加工等要求高度表面平坦性之材料之平坦化加工之積層研磨墊及其製造方法。本發明之積層研磨墊,特別適合使用於在進一步積層、形成氧化物層或金屬層之前,平坦化矽晶圓及其上形成有該等氧化物層、金屬層等之裝置的步驟中。
8‧‧‧支持層
9‧‧‧研磨層
10‧‧‧積層輥
TD1‧‧‧研磨層之TD方向之長度
TD2‧‧‧支持層之TD方向之長度
Claims (6)
- 一種積層研磨墊之製造方法,其特徵在於:包含使透過熱熔型接著構件積層研磨層與支持層之積層體通過一對積層輥之間,且藉熱熔型接著構件黏合研磨層與支持層而製作積層研磨片之步驟,以及將前述積層研磨片切斷成圓形之步驟,其中,前述積層體之研磨層之TD方向(Transverse Direction,寬方向)之長度(TD1)及支持層之TD方向(Transverse Direction,寬方向)之長度(TD2)之比(TD1/TD2),在使該積層體通過積層輥間時,恆定地調整至0.3以上。
- 如申請專利範圍第1項之積層研磨墊之製造方法,包含在前述積層研磨片之表面實施凹槽加工之步驟。
- 如申請專利範圍第1項之積層研磨墊之製造方法,其中前述熱熔型接著構件係含有聚酯類熱熔接著劑之接著劑層,或在基材兩面具有前述接著劑層之雙面膠帶,且前述聚酯類熱熔接著劑係相對於100重量份之基底聚合物之聚酯樹脂,含有2至10重量份之在1分子中具有2以上環氧丙基之環氧樹脂。
- 如申請專利範圍第3項之積層研磨墊之製造方法,其中前述聚酯樹脂係結晶性聚酯樹脂。
- 一種積層研磨墊,係藉如申請專利範圍第1至4項中任一項之製造方法得到。
- 一種半導體裝置之製造方法,包含使用如申請專利範圍第5項之積層研磨墊研磨半導體晶圓之表面之步驟。
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EP3272457B1 (en) * | 2016-07-21 | 2019-03-27 | Delamare Sovra | A method for manufacturing in series optical grade polishing tools |
EP3272456B1 (en) * | 2016-07-21 | 2019-03-13 | Delamare Sovra | A method for manufacturing in series optical grade polishing tools |
EP3272458B1 (en) * | 2016-07-21 | 2019-03-27 | Delamare Sovra | A method for manufacturing in series optical grade polishing tools |
CN112238670B (zh) * | 2020-10-16 | 2022-11-15 | 上海江丰平芯电子科技有限公司 | 一种研磨垫的制备方法 |
CN112428165B (zh) * | 2020-10-22 | 2021-10-22 | 德阳展源新材料科技有限公司 | 一种阻尼布抛光垫的制备方法 |
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