TWI513041B - Light emitting diode package and light emitting diode module - Google Patents

Description

Light-emitting diode package structure and light-emitting diode module

The present invention relates to a semiconductor light emitting device, and more particularly to a light emitting diode package structure and a light emitting diode module having the light emitting diode package structure.

As an emerging light source, the light-emitting diode has been widely used in various fields due to its high luminous efficiency, small size, light weight, environmental protection, etc., and has a tendency to replace the traditional light source.

Currently, the surface mount technology (SMT) is generally used in the industry to place the packaged light-emitting diodes on boards such as circuit boards, and then applied to various fields. When the surface is pasted, the solder paste is placed between the light-emitting diode and the plate, and the light-emitting diode is soldered to the plate by solder paste. However, due to the setting of the solder paste, the light-emitting diode is prone to floating height, skew or creeping on the board, which not only affects the operation of the surface pasting process, but also affects the appearance and performance of the finished product. At the same time, when the solder paste is heated, the flux in the solder paste may also generate holes or voids in the solder paste due to heat, so that the thermal resistance of the solder paste is increased, which affects the heat dissipation of the light-emitting diode.

In view of the above, it is necessary to provide a light emitting diode package structure and a light emitting diode module, which can be more conveniently fixed and have better thermal conductivity.

A light emitting diode package structure includes a substrate, a light emitting diode chip disposed on the first surface of the substrate, two electrodes electrically connected to the light emitting diode chip, and a package for sealing the light emitting diode chip And a second surface of the substrate is provided with at least one trench for receiving the solder paste when the LED package structure is fixed.

An LED module includes a plate and at least one LED package structure disposed on the plate, the at least one LED package structure comprising a substrate, and a light emitting on the first surface of the substrate a diode chip, a second electrode electrically connected to the light emitting diode chip, and a package for sealing the LED chip, wherein a second surface of the substrate is provided with at least one trench, and the substrate is The two surfaces are attached to the plate, and the LED package structure is fixed on the plate by solder paste, and the groove of the substrate is filled with solder paste.

Compared with the prior art, the light-emitting diode package structure of the present invention has a groove on the substrate, which can increase the surface area of the substrate to accommodate more solder paste, so that the light-emitting diode can be closely adhered to the plate to avoid illuminating. The phenomenon of floating height, skew or creeping of the diode occurs. The trench can also discharge the gas generated by the flux in the solder paste to prevent the gas from remaining in the solder paste to generate voids or holes, thereby reducing the thermal resistance and allowing the light-emitting diode to be better dissipated.

10,11,12,13,14,15‧‧‧Light emitting diode package structure

20‧‧‧Substrate

201‧‧‧ Non-conductive substances

21‧‧‧Reflection Cup

22‧‧‧ trench

24‧‧‧Electrical hole

241‧‧‧ conductive materials

25‧‧‧thermal hole

251‧‧‧ Thermal Conductive Materials

30‧‧‧Light Emitter Wafer

32‧‧‧Fluorescent powder layer

40‧‧‧Electrode

42‧‧‧ Gold wire

43‧‧‧metal layer

50‧‧‧Package

60‧‧‧Base

70‧‧‧ board

71‧‧‧ solder paste

1 is a side elevational view showing a light emitting diode package structure according to a first embodiment of the present invention.

2 is a cross-sectional view showing a light emitting diode package structure according to a second embodiment of the present invention.

3 is a cross-sectional view showing a light emitting diode package structure according to a third embodiment of the present invention.

4 is a cross-sectional view showing a light emitting diode package structure according to a fourth embodiment of the present invention.

FIG. 5 is a schematic top plan view of a light emitting diode package structure according to a fifth embodiment of the present invention.

Figure 6 is a cross-sectional view taken along line VI-VI of Figure 5.

FIG. 7 is a schematic top plan view of a light emitting diode package structure according to a sixth embodiment of the present invention.

Figure 8 is a schematic cross-sectional view taken along line VIII-VIII of Figure 7.

9 is a cross-sectional view showing a light emitting diode package structure according to a seventh embodiment of the present invention.

10 and FIG. 11 are schematic bottom views of a substrate in a light emitting diode package structure according to various embodiments of the present invention.

FIG. 12 is a schematic cross-sectional view showing a light emitting diode module according to an embodiment of the present invention.

1 is a side elevational view of a light emitting diode package structure 10 according to a first embodiment of the present invention. The LED package structure 10 includes a substrate 20, a light emitting diode chip 30 disposed on a surface of the substrate 20, two electrodes 40 electrically connected to the LED chip 30, and a sealed LED. The package 50 of the wafer 30 is provided with at least one trench 22 on the other surface of the substrate 20.

The substrate 20 may be made of a non-conductive material such as plastic or ceramic. The substrate 20 can be rectangular or round The shape such as a shape or a polygon is a rectangular block shape in this embodiment. The LED wafer 30 is disposed on a first surface of the substrate 20, and may be, for example, a top surface.

The LED chip 30 is electrically connected to the two electrodes 40 through the two gold wires 42. The LED wafer 30 can be in the form of a dress, a flip, or the like, and can also be a vertical LED chip. The light-emitting diode wafer 30 in the present embodiment is a formal wear.

The grooves 22 in the present embodiment are plural and linear, and are formed on a second surface of the substrate 20, for example, a bottom surface. Of course, other surfaces may be excluded. The cross section of the groove 22 may be any geometric shape such as a rectangle, a circular arc, or a polygon. Due to the arrangement of the trenches 22, the surface area of the substrate 20 can be increased to accommodate more solder paste. When the light-emitting diode package structure 10 is fixed, phenomena such as floating height, skew or creeping can be avoided. Further, the trench 22 can also discharge the gas generated when the flux in the solder paste is heated, thereby preventing the gas from remaining in the solder paste to generate voids or holes, thereby reducing the thermal resistance, so that the light emitting diode package structure 10 has Better heat dissipation. Preferably, the trench 22 is in communication with the edge of the substrate 20 such that the trench 22 has a better exhaust gas effect and reduces the thermal resistance of the solder paste. Preferably, the depth of the trench 22 is 1/5-1/2 of the thickness of the substrate 20, and the depth of the trench 22 is set so as not to make the strength of the substrate 20 too poor, and the space for the tin can not be too large. small. In addition, the surface of the trench 22 may be fully plated or partially plated with metal to make the solder paste easy to adhere to the purpose of eating tin.

The package 50 may be a transparent material such as various resins or glass. The shape of the package 50 may be a spherical shape, an ellipsoidal shape, a square block shape or the like.

Referring to FIG. 2, the substrate 20 of the LED package 11 of the second embodiment of the present invention is further provided with a plurality of conductive holes 24 and heat conducting holes 25, and the conductive holes 24 and the heat conducting holes 25 respectively penetrate the top surface of the substrate 20 and a bottom surface, and the conductive hole 24 and the heat conductive hole 25 are divided A conductive material 241 and a heat conductive material 251 are provided, and may be, for example, a metal. The conductive materials 241 in the conductive holes 24 are electrically connected to the two electrodes 40, respectively, thereby providing more conductive paths for the LEDs 30. The heat conductive material 251 in the heat conduction hole 25 is better than the heat conductivity of the substrate 20. The heat conductive material 251 is thermally connected to the metal layer 43 on the substrate 20, and the heat generated by the light emitting diode chip 30 can be conducted to the bottom of the substrate 20. Dissipated to improve heat dissipation. Preferably, the heat conducting hole 25 corresponding to the position of the light emitting diode chip 30 is larger, thereby facilitating heat dissipation of the light emitting diode chip 30. The conductive hole 24 and the heat conducting hole 25 may be a circular hole, a square hole, a long hole or a square hole. The conductive hole 24 and the heat conductive hole 25 may have a plurality of shapes such as a rectangle or a trapezoid.

The grooves 22 in the above embodiment are all processed on the substrate 20. Of course, the grooves 22 in the present invention are not limited to such an embodiment. Referring to FIG. 3 , the substrate 20 in the third embodiment of the present invention comprises a conductive material 241 having a sheet shape and a different height, a heat conductive material 251 (for example, metal), and a non-conductive material 201 (for example, ceramics, plastic, etc.). Alternately sandwiched. The height of the conductive material 241 and the heat conductive material 251 is larger than the height of the non-conductive material 201. When the conductive material 241 and the heat conductive material 251 are aligned with the top end of the non-conductive material 201, the bottom end is adjacent to the height difference. A groove 22 is formed between the conductive material 241 and the heat conductive material 251.

FIG. 4 shows a light emitting diode package structure 12 according to a fourth embodiment of the present invention. A reflective cup 21 is further disposed on the top surface of the substrate 20 of the LED package 12, the package 50 is received in the reflective cup 21, and the LED wafer 30 is placed at the bottom of the reflective cup 21. . The reflective cup 21 can be integrally formed with the substrate 20. The angle between the inner reflecting surface of the reflecting cup 21 and the top surface of the substrate 20 is between 90 and 130 degrees.

Referring to FIG. 5 and FIG. 6, the LED array 30 in the LED package structure 13 of the fifth embodiment of the present invention is a vertical LED chip, and the bottom portion thereof is transparent. The electrode 40 is electrically connected to the outside, and the top thereof is connected to the other electrode 40 through the gold wire 42 and then electrically connected to the outside. A plurality of conductive holes 24 and a plurality of heat conduction holes 25 are formed in the substrate 20. The conductive holes 24 and the heat conductive holes 25 are filled with a conductive substance and a heat conductive substance, respectively. Wherein, the heat conducting holes 25 distributed around the light emitting diode chip 30 are more, that is, the heat conducting holes 25 in the region close to the light emitting diode chip 30 are denser than the heat conducting holes in the region away from the light emitting diode chip 30. The density of 25 is large, and the design is intended to dissipate heat concentrated in an area close to the light-emitting diode wafer 30 more quickly.

Referring to FIG. 7 and FIG. 8 , the LED array 30 in the LED package structure 14 of the sixth embodiment of the present invention is in a flip-chip form, that is, a flip-chip LED chip, which transmits the two electrodes. 40 forms an electrical connection with the outside. A heat conducting hole 25 in the substrate 20 is a square hole having a trapezoidal cross section.

FIG. 9 shows a light emitting diode package structure 15 according to a seventh embodiment of the present invention. The light emitting diode package structure 15 includes a substantially cylindrical substrate 20, and a light emitting diode disposed on the top surface of the substrate 20. The polar body wafer 30, the two electrodes 40 electrically connected to the light emitting diode chip 30, and the package body 50 for sealing the light emitting diode chip 30 are provided with at least one trench 22 on the bottom surface of the substrate 20. The substrate 20 is made of a material having high thermal conductivity, and heat generated by the LED chip 30 can be transmitted through the substrate 20. A phosphor layer 32 is further coated around the LED array 30 in the package 50. The phosphor powder in the phosphor layer 32 may be, for example, garnet-based phosphor powder or citrate-based phosphor. Powder, orthosilicate-based phosphor powder, sulfide-based phosphor powder, thiogallate-based phosphor powder, and nitride-based phosphor powder. In addition, a susceptor 60 is also disposed around the substrate 20, and the electrode 40 extends outside the susceptor 60 and is flush with the bottom surface of the substrate 20.

10 and 11 show different shapes of trenches 22 formed in the substrate 20 in different embodiments. Wherein, the trench 22 shown in FIG. 10 is curved, and the trench shown in FIG. 22 is a mesh.

Referring to FIG. 12, a light emitting diode module of the present invention includes a board body 70 and a light emitting diode package structure disposed on the board body 70. The light emitting diode package structure in the embodiment is the above In the light-emitting diode package structure 15 of the seventh embodiment, one surface on which the trench 22 is opened is attached to the board body 70. Of course, it can be understood that the LED package structure can be one of the above embodiments, and different features in different embodiments can be combined and matched reasonably. For example, in the same embodiment, the trench 22 may be formed in different forms in the first and third embodiments described above. In addition, the light emitting diode package structures in the different embodiments described above may be collectively placed on the same board body 70. The board body 70 may be a board such as a circuit board. When the light emitting diode package structure is fixed on the board body 70 by the solder paste 71, the substrate 20 of the light emitting diode package structure is provided with a trench 22. The excess solder paste 71 is accommodated, so that the light-emitting diode package structure is closely adhered to the board body 70, and the phenomenon that the light-emitting diode package structure generates floating height, skew or creeping is prevented. Preferably, at least one of the trenches 22 is in communication with the edge of the substrate 20, so that the trench 22 has a better effect of exhausting gas, so that the gas generated when the flux in the solder paste 71 is heated is discharged, thereby preventing gas from remaining in the gas. A void or a hole is formed in the solder paste 71, thereby reducing the thermal resistance of the solder paste 71.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

11‧‧‧Light emitting diode package structure

20‧‧‧Substrate

22‧‧‧ trench

24‧‧‧Electrical hole

241‧‧‧ conductive materials

25‧‧‧thermal hole

251‧‧‧ Thermal Conductive Materials

30‧‧‧Light Emitter Wafer

40‧‧‧Electrode

43‧‧‧metal layer

50‧‧‧Package

Claims (10)

A light emitting diode package structure includes a substrate, a light emitting diode chip disposed on the first surface of the substrate, two electrodes electrically connected to the light emitting diode chip, and a package for sealing the light emitting diode chip The improvement is that: a second surface of the substrate is provided with at least one groove, the groove increases a surface area of the second surface of the substrate, the groove does not penetrate the first surface and the second surface of the substrate The trench is used to accommodate the solder paste when the light emitting diode package structure is fixed. The light emitting diode package structure of claim 1, wherein the at least one trench communicates with an edge of the substrate. The light emitting diode package structure according to claim 1, wherein the at least one trench has a curved shape, a linear shape or a mesh shape. The light emitting diode package structure of claim 1, wherein at least part of the surface of the at least one trench is plated with a metal. The light emitting diode package structure of claim 1, wherein the substrate is provided with a conductive hole and a heat conducting hole penetrating the first surface and the second surface, and the conductive hole and the heat conducting hole are respectively filled with a conductive substance and Thermally conductive material. The light-emitting diode package structure of claim 5, wherein a density of the heat-conducting holes in the region of the substrate near the light-emitting diode wafer is higher than that of the heat-radiating hole in the region away from the light-emitting diode chip. High density. The light emitting diode package structure of claim 1, wherein the at least one trench has a depth of 1/5 to 1/2 of a thickness of the substrate. The illuminating diode package structure of claim 1, further comprising a pedestal surrounding the substrate, the electrode extending outside the pedestal and flush with the second surface of the substrate . The light emitting diode package structure according to claim 1, wherein the substrate comprises alternating non-conductive materials, conductive materials and heat conductive materials, and non-conductive materials, conductive materials and heat conductive materials. The height difference forms the at least one trench. A light-emitting diode module comprising: a plate material and at least one light-emitting diode package structure disposed on the plate material, wherein the at least one light-emitting diode package structure is any one of the claims 1-9 The light emitting diode package structure, wherein a second surface of the substrate is attached to the board, the LED package structure is fixed on the board by solder paste, and The trench of the substrate contains a solder paste.