TWI511184B - Control device for material gas, control method, control program and control system thereof - Google Patents

Control device for material gas, control method, control program and control system thereof Download PDF

Info

Publication number
TWI511184B
TWI511184B TW100149169A TW100149169A TWI511184B TW I511184 B TWI511184 B TW I511184B TW 100149169 A TW100149169 A TW 100149169A TW 100149169 A TW100149169 A TW 100149169A TW I511184 B TWI511184 B TW I511184B
Authority
TW
Taiwan
Prior art keywords
opening degree
valve
gas
material gas
flow rate
Prior art date
Application number
TW100149169A
Other languages
Chinese (zh)
Other versions
TW201246294A (en
Inventor
Daisuke Hayashi
Original Assignee
Horiba Stec Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Horiba Stec Co filed Critical Horiba Stec Co
Publication of TW201246294A publication Critical patent/TW201246294A/en
Application granted granted Critical
Publication of TWI511184B publication Critical patent/TWI511184B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563Gas nozzles
    • C23C16/45574Nozzles for more than one gas
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D11/00Control of flow ratio
    • G05D11/02Controlling ratio of two or more flows of fluid or fluent material
    • G05D11/13Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means
    • G05D11/131Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by measuring the values related to the quantity of the individual components
    • G05D11/132Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by measuring the values related to the quantity of the individual components by controlling the flow of the individual components
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/12Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Description

材料氣體控制裝置、控制方法、控制程式及控制系統Material gas control device, control method, control program and control system

本發明涉及一種材料氣體控制裝置,在向收容在收容體內的材料導入載氣並使材料氣化的材料氣化裝置中,所述材料氣體控制裝置控制所述材料氣化後的材料氣體。The present invention relates to a material gas control device that controls a material gas that is vaporized by the material gas in a material vaporization device that introduces a carrier gas into a material contained in a housing and vaporizes the material.

例如,在半導體的成膜過程中,要求以規定的濃度或流量向進行成膜的室(chamber)內,輸送通過材料氣化裝置氣化後的材料氣體。For example, in the film formation process of a semiconductor, it is required to transport a material gas vaporized by a material vaporization device into a chamber where a film is formed at a predetermined concentration or flow rate.

例如,作為用於將材料氣體的流量控制為一定的材料氣體控制裝置,如專利文獻1(日本專利公開公報 特開平08-153685號)和圖9所示,公開有一種材料氣體控制裝置,該材料氣體控制裝置包括:品質流量控制器(以下也記載為MFC),設置在導入管上,該導入管用於將載氣導入收容有材料的收容體內;以及氣體濃度監測器,設置在導出管上,該導出管用於從所述收容體導出氣化後的材料氣體和載氣的混合氣體,該材料氣體控制裝置基於由所述氣體濃度監測器測量出的測量濃度,來控制所述載氣的流量。For example, as a material gas control device for controlling a flow rate of a material gas to be constant, as disclosed in Patent Document 1 (Japanese Patent Laid-Open Publication No. Hei 08-153685) and FIG. 9, a material gas control device is disclosed. The material gas control device includes a quality flow controller (hereinafter also referred to as MFC), which is disposed on the introduction pipe for introducing the carrier gas into the housing containing the material, and a gas concentration monitor disposed on the outlet pipe The lead-out tube is configured to derive a mixed gas of the vaporized material gas and the carrier gas from the container, the material gas control device controlling the carrier gas based on the measured concentration measured by the gas concentration monitor flow.

更具體地說,如果設混合氣體中的材料氣體的濃度為C、材料氣體的流量為Qv 、載氣的流量為Qc ,則根據材料氣體的濃度C=Qv /(Qv +Qc )這種關係,材料氣體的流量可以表示為Qv =C×Qc /(1-C),從而可以根據測量濃度計算材料氣體的實際流量。利用這種關係,所述材料氣體控制裝置監測氣化後的材料氣體的濃度,將根據該測量濃度計算出的材料氣體的實際流量回饋給所述MFC,並且通過MFC進行載氣的流量控制,以使材料氣體的流量Qv 大體固定為預先設定的設定流量。More specifically, if the concentration of the material gas in the mixed gas is C, the flow rate of the material gas is Q v , and the flow rate of the carrier gas is Q c , then according to the concentration of the material gas C=Q v /(Q v +Q c ) In this relationship, the flow rate of the material gas can be expressed as Q v = C × Q c / (1-C), so that the actual flow rate of the material gas can be calculated from the measured concentration. With this relationship, the material gas control device monitors the concentration of the material gas after vaporization, feeds back the actual flow rate of the material gas calculated according to the measured concentration to the MFC, and performs flow control of the carrier gas through the MFC. The flow rate Q v of the material gas is substantially fixed to a predetermined set flow rate.

在此,所述材料氣體的流量Qv 取決於材料氣化的量,並且材料氣化的量基於載氣的流量Qc 而變化。通常,為了使材料氣體的流量Qv 增加,可以通過使所述載氣的流量Qc 增加,從而在材料為液體時使鼓泡量增加、在材料為固體時使與材料表面接觸的載氣量增加,來使材料氣化的量增加。因此,當材料氣體的流量減少時,MFC進行將更多的載氣導入到收容體內的動作,從而可以始終保持一定的材料氣體的流量QvHere, the flow rate Q v of the material gas depends on the amount of material vaporization, and the amount of material vaporization varies based on the flow rate Q c of the carrier gas. Typically, in order to make the material gas flow rate Q v increases, the carrier gas flow rate may be increased by the Q c, thereby increasing the amount of bubbling liquid in the material, the carrier gas in contact with the surface of the material is a solid material Increase to increase the amount of material vaporized. Thus, while reducing the flow rate of the material gas, the MFC will be more carrier gas is introduced into the housing body movements, which can always maintain a certain flow rate of material gas Q v.

然而,在以上述方式通超載氣的流量Qc 來控制材料氣體的流量Qv 的材料氣體控制裝置中,如下所述,存在當材料減少時材料氣體的氣化效率降低的問題。However, in the above-described manner through the gas flow rate Q c overload controls the flow rate of the material gas Q v material gas control apparatus, as described below, when the presence of the reducing material reduces the efficiency of the material gas vaporized problem.

具體地說,由於如果液體材料變少,則收容體內的液位變低,在鼓泡過程中載氣與材料液接觸的時間變短,所以每單位流量的載氣使材料氣化的量變少。即,如果材料減少,則材料的氣化效率降低。即使是固體材料,由於如果材料被氣化而變少,則與載氣接觸的面積變小,所以也會導致氣化效率降低。Specifically, if the amount of the liquid material is reduced, the liquid level in the container body becomes low, and the time during which the carrier gas comes into contact with the material liquid during the bubbling process becomes short, so that the carrier gas per unit flow rate reduces the amount of material vaporization. . That is, if the material is reduced, the gasification efficiency of the material is lowered. Even in the case of a solid material, if the material is vaporized and becomes small, the area in contact with the carrier gas becomes small, so that the gasification efficiency is lowered.

如果即使在這種氣化效率降低的狀態下,還想要將材料氣體的流量Qv 保持為設定流量,則需要向收容體內導入更多的載氣。這樣,材料與載氣的接觸時間越來越短,氣化效率進一步降低。其結果,如果在材料減少的狀態下想要保持材料氣體的流量Qv ,則導致載氣的流量Qc 加速增加,最終MFC內的閥完全打開,從而不能在此基礎上再增載入氣的流量Qc 。當MFC內的閥完全打開時,由於即使材料殘留在收容體內,也不能在此基礎上再增加材料氣化的量,所以不能將材料氣體的流量Qv 保持為設定流量,導致成為不能控制材料氣體流量的狀態。換句話說,即使按照設定流量在收容體內剩餘有限多材料,也不能以規定的流量向室內等中輸送材料氣體,為了防止發生這種狀況,必須頻繁地追加材料。Even if such a reduction in the efficiency of gasification state, the material gas flow would also want to maintain the set flow rate Q v, you need to import more carrier gas accommodating body. Thus, the contact time of the material with the carrier gas is shorter and shorter, and the gasification efficiency is further lowered. As a result, if the flow rate Q v of the material gas is to be maintained in a state where the material is reduced, the flow rate Q c of the carrier gas is accelerated to increase, and finally the valve in the MFC is completely opened, so that the gas cannot be further added on this basis. The flow rate Q c . When the valve in the MFC is completely opened, since the amount of material vaporization cannot be increased even if the material remains in the housing, the flow rate Q v of the material gas cannot be maintained at the set flow rate, resulting in an uncontrollable material. The state of the gas flow. In other words, even if a limited amount of material remains in the housing in accordance with the set flow rate, the material gas cannot be transported to the room or the like at a predetermined flow rate, and in order to prevent such a situation, it is necessary to frequently add materials.

此外,當成為不能控制的狀態時,雖然可以考慮降低材料氣體的流量Qv 的設定值來再次進行濃度控制,但是在這種情況下,由於需要進行將半導體的成膜工序中的處理時間設定得較長等大幅度的處理方法變更,所以造成使用困難。此外,即使改變了設定值,也會產生與上述相同的現象,很快就導致不能將材料氣體的流量保持為一定。Further, when it is in an uncontrollable state, the concentration control may be performed again by reducing the set value of the flow rate Q v of the material gas. However, in this case, it is necessary to set the processing time in the film forming process of the semiconductor. It is difficult to use because of the long and large processing method changes. Further, even if the set value is changed, the same phenomenon as described above occurs, and the flow rate of the material gas cannot be kept constant.

此外,不僅在將材料氣體的流量保持為一定的情況下產生如上所述的問題,在如專利文獻2(日本專利公開公報特開2010-109304號)所述的材料氣體濃度控制裝置中,在進行控制以將材料氣體的在混合氣體中的濃度或流量保持為一定的情況下,也會產生如上所述的問題。In addition, in the material gas concentration control device described in the patent document 2 (Japanese Patent Laid-Open Publication No. 2010-109304), in the case where the flow rate of the material gas is kept constant, When the control is performed to keep the concentration or flow rate of the material gas in the mixed gas constant, the above problem also occurs.

鑒於所述問題,本發明的目的是提供一種材料氣體控制裝置,該材料氣體控制裝置可以防止成為不能控制的狀態,當材料減少時,隨氣化效率的降低而使載氣的流量加速增加,造成即使剩餘大量材料,閥也會過早地成為完全打開的狀態,從而導致成為所述的不能控制的狀態。In view of the above problems, an object of the present invention is to provide a material gas control device which can prevent an uncontrollable state, and when the material is reduced, the flow rate of the carrier gas is accelerated as the gasification efficiency is lowered. This causes the valve to become fully open state prematurely even if a large amount of material remains, resulting in an uncontrollable state as described.

即,本發明提供一種材料氣體控制裝置,該材料氣體控制裝置用於材料氣化裝置,所述材料氣化裝置至少包括:收容體,收容材料;導入管,將用於使所述材料氣化的載氣導入所述收容體內;以及導出管,用於將所述載氣和所述材料氣化後的材料氣體的混合氣體從所述收容體導出,其中,所述材料氣體控制裝置包括:濃度測量機構,測量所述混合氣體中的所述材料氣體的濃度;第一閥控制部,控制設置在所述導出管上的第一閥的開度,並且對所述第一閥的開度進行控制,使得由所述濃度測量機構測量出的材料氣體的測量濃度成為設定濃度;以及第二閥控制部,控制設置在所述導入管上的第二閥的開度,並且對所述第二閥的開度進行控制,使得當所述第一閥的開度成為臨界值開度時,在規定時間內使所述第二閥的開度成為變更後開度,所述臨界值開度是比完全打開的開度小第一規定值的開度,所述變更後開度比所述第一閥的開度成為所述臨界值開度時的變更前開度大第二規定值。That is, the present invention provides a material gas control device for a material gasification device, the material gasification device comprising at least: a receiving body, a receiving material; and an introduction tube for vaporizing the material a carrier gas is introduced into the housing; and a delivery tube for discharging a mixed gas of the carrier gas and the material gas vaporized by the material from the housing, wherein the material gas control device comprises: a concentration measuring mechanism that measures a concentration of the material gas in the mixed gas; a first valve control portion that controls an opening degree of a first valve provided on the outlet pipe, and an opening degree of the first valve Controlling such that the measured concentration of the material gas measured by the concentration measuring mechanism becomes the set concentration; and the second valve control portion controls the opening degree of the second valve provided on the introduction pipe, and for the The opening degree of the two valves is controlled such that when the opening degree of the first valve becomes a critical value opening degree, the opening degree of the second valve is changed to a later opening degree within a predetermined time, and the threshold value is opened. Smaller than the opening degree is fully opened opening degree of a first predetermined value, the opening ratio of the change of the opening degree of the first valve opening degree becomes a second predetermined value before the change when the opening degree threshold value.

此外,本發明還提供一種材料氣體控制系統,其包括:收容體,收容材料;導入管,將用於使所述材料氣化的載氣導入所述收容體內;導出管,用於將所述載氣和所述材料氣化後的材料氣體的混合氣體從所述收容體導出;第一閥,設置在所述導出管上;濃度測量機構,測量所述混合氣體中的所述材料氣體的濃度;第一閥控制部,控制所述第一閥的開度,使得由所述濃度測量機構測量出的所述材料氣體的測量濃度成為預先設定的設定濃度;第二閥,設置在所述導入管上;以及第二閥控制部,對所述第二閥的開度進行控制,使得當所述第一閥的開度成為臨界值開度時,在規定時間內使所述第二閥的開度成為變更後開度,所述臨界值開度是比完全打開的開度小第一規定值的開度,所述變更後開度比所述第一閥的開度成為所述臨界值開度時的變更前開度大第二規定值。In addition, the present invention also provides a material gas control system, comprising: a receiving body, a receiving material; an introduction tube, a carrier gas for vaporizing the material is introduced into the receiving body; and a lead-out tube for a mixed gas of a carrier gas and a material gas after vaporization of the material is led out from the housing; a first valve is disposed on the outlet tube; and a concentration measuring mechanism measures the material gas in the mixed gas a first valve control unit that controls an opening degree of the first valve such that a measured concentration of the material gas measured by the concentration measuring mechanism becomes a preset set concentration; a second valve is disposed in the And a second valve control unit that controls an opening degree of the second valve such that when the opening degree of the first valve becomes a critical value opening degree, the second valve is made within a predetermined time The opening degree is a changed opening degree, and the threshold opening degree is an opening degree that is smaller than a fully opened opening degree by a first predetermined value, and the changed opening degree is higher than the opening degree of the first valve Large opening before change in value opening Bis provides value.

此外,本發明還提供一種材料氣體控制方法,該材料氣體控制方法使用材料氣體控制裝置,所述材料氣體控制裝置用於材料氣化裝置,所述材料氣化裝置至少包括:收容體,收容材料;導入管,將用於使所述材料氣化的載氣導入所述收容體內;以及導出管,用於將所述載氣和所述材料氣化後的材料氣體的混合氣體從所述收容體導出,其中,所述材料氣體控制裝置至少包括濃度測量機構,所所濃度測量機構測量所述混合氣體中的所述材料氣體的濃度,所述材料氣體控制方法包括:第一閥控制步驟,控制設置在所述導出管上的第一閥的開度,並且對所述第一閥的開度進行控制,使得由所述濃度測量機構測量出的所述材料氣體的測量濃度成為設定濃度;以及第二閥控制步驟,控制設置在所述導入管上的第二閥的開度,並且對所述第二閥的開度進行控制,使得當所述第一閥的開度成為臨界值開度時,在規定時間內使所述第二閥的開度成為變更後開度,所述臨界值開度是比完全打開的開度小第一規定值的開度,所述變更後開度比所述第一閥的開度成為所述臨界值開度時的變更前開度大第二規定值。In addition, the present invention also provides a material gas control method using a material gas control device for a material gasification device, the material gasification device comprising at least: a container, a receiving material a introducing tube for introducing a carrier gas for vaporizing the material into the housing; and a delivery tube for discharging a mixed gas of the carrier gas and the material gas vaporized by the material from the housing Deriving, wherein the material gas control device comprises at least a concentration measuring mechanism, the concentration measuring mechanism measures a concentration of the material gas in the mixed gas, and the material gas control method comprises: a first valve control step, Controlling an opening degree of the first valve disposed on the outlet pipe, and controlling an opening degree of the first valve such that a measured concentration of the material gas measured by the concentration measuring mechanism becomes a set concentration; And a second valve control step of controlling an opening degree of the second valve provided on the introduction pipe and controlling an opening degree of the second valve, When the opening degree of the first valve is the critical value opening degree, the opening degree of the second valve is changed to the opening degree after the predetermined time, and the threshold opening degree is smaller than the opening degree of the full opening. The opening degree of the predetermined value is greater than a second predetermined value of the change opening degree when the opening degree of the first valve is the threshold opening degree.

此外,本發明還提供一種材料氣體控制程式,用於控制材料氣體控制裝置,所述材料氣體控制裝置用於材料氣化裝置,所述材料氣化裝置至少包括:收容體,收容材料;導入管,將用於使所述材料氣化的載氣導入所述收容體內;以及導出管,用於將所述載氣和所述材料氣化後的材料氣體的混合氣體從所述收容體導出,其中,所述材料氣體控制裝置至少包括濃度測量機構,所述濃度測量機構測量所述混合氣體中的所述材料氣體的濃度,所述材料氣體控制程式作為控制部起作用,所述控制部包括:第一閥控制部,控制設置在所述導出管上的第一閥的開度,並且對所述第一閥的開度進行控制,使得由所述濃度測量機構測量出的所述材料氣體的測量濃度成為設定濃度;以及第二閥控制部,控制設置在所述導入管上的第二閥的開度,並且對所述第二閥的開度進行控制,使得當所述第一閥的開度成為臨界值開度時,在規定時間內使所述第二閥的開度成為變更後開度,所述臨界值開度是比完全打開的開度小第一規定值的開度,所述變更後開度比所述第一閥的開度成為所述臨界值開度時的變更前開度大第二規定值。In addition, the present invention also provides a material gas control program for controlling a material gas control device for a material gasification device, the material gasification device comprising at least: a receiving body, a receiving material, and an introduction tube a carrier gas for vaporizing the material is introduced into the housing; and a delivery tube for discharging a mixed gas of the carrier gas and the material gas vaporized by the material from the container; Wherein the material gas control device includes at least a concentration measuring mechanism that measures a concentration of the material gas in the mixed gas, the material gas control program functions as a control portion, and the control portion includes a first valve control portion that controls an opening degree of the first valve provided on the outlet pipe, and controls an opening degree of the first valve such that the material gas measured by the concentration measuring mechanism The measured concentration becomes the set concentration; and the second valve control portion controls the opening degree of the second valve provided on the introduction pipe, and the opening degree of the second valve The line control is such that when the opening degree of the first valve becomes the critical value opening degree, the opening degree of the second valve is changed to the later opening degree within a predetermined time, and the threshold opening degree is more than the fully opened The degree of opening of the first predetermined value is smaller, and the degree of opening after the change is greater than a second predetermined value of the degree of opening before the opening of the first valve becomes the threshold opening.

按照所述的控制裝置、控制系統、控制方法及控制程式,通過設置在所述導出管上的第一閥來持續控制混合氣體中的材料氣體的濃度,並且進行控制,使得當由於所述收容體內的材料減少、材料的氣化效率下降而使所述第一閥成為完全打開或接近完全打開時,使設置在所述導入管上的第二閥的開度變大。因此,當第一閥接近控制極限時,由於載氣的流量增加,材料氣化的量也增加,所以第一閥的開度從完全打開或接近完全打開返回到可動範圍的中間側。這樣,由於每當所述第一閥成為作為完全打開或接近完全打開的開度的臨界值開度時,都使載氣的流量階段性地增加,所以可以防止伴隨材料的氣化效率下降,載氣的流量加速增加,即使材料大量剩餘,也成為不能控制的狀態。即,直到收容體內的材料被充分使用為止,能夠將測量濃度固定保持為設定濃度。According to the control device, the control system, the control method, and the control program, the concentration of the material gas in the mixed gas is continuously controlled by the first valve disposed on the outlet pipe, and is controlled such that When the material in the body is reduced and the gasification efficiency of the material is lowered to cause the first valve to be fully opened or nearly fully opened, the opening degree of the second valve provided on the introduction pipe is made large. Therefore, when the first valve approaches the control limit, since the flow rate of the carrier gas increases, the amount of material vaporization also increases, so the opening degree of the first valve returns from the fully open or near full opening to the intermediate side of the movable range. In this way, since the flow rate of the carrier gas is increased stepwise each time the first valve becomes the threshold opening degree of the opening degree which is fully opened or nearly fully opened, the vaporization efficiency of the accompanying material can be prevented from being lowered. The flow rate of the carrier gas is accelerated, and even if the material remains in a large amount, it becomes an uncontrollable state. That is, the measured concentration can be fixed to the set concentration until the material in the container is sufficiently used.

為了利用現有的材料氣化裝置的設備,例如把預先設置在所述導入管上的閥作為第二閥,並且僅追加最低限度的新結構就可以實現所述效果,本發明還提供一種材料氣體控制裝置,用於材料氣化裝置,所述材料氣化裝置至少包括:收容體,收容材料;導入管,將用於使所述材料氣化的載氣導入所述收容體內;以及導岀管,用於將所述載氣和所述材料氣化後的材料氣體的混合氣體從所述收容體導出,其中,所述材料氣體控制裝置包括:濃度測量機構,測量所述混合氣體中的所述材料氣體的濃度;第一閥,設置在所述導出管上;第一閥控制部,控制所述第一閥的開度,使得由所述濃度測量機構測量出的所述材料氣體的測量濃度成為設定濃度;以及第二閥控制部,控制設置在所述導入管上的第二閥的開度,並且對所述第二閥的開度進行控制,使得當所述第一閥的開度成為臨界值開度時,在規定時間內使所述第二閥的開度成為變更後開度,所述臨界值開度是比完全打開的開度小第一規定值的開度,所述變更後開度比所述第一閥的開度成為所述臨界值開度時的變更前開度大第二規定值。In order to utilize the apparatus of the existing material gasification apparatus, for example, a valve previously provided on the introduction pipe is used as the second valve, and only a minimum new structure is added, the effect can be achieved, and the present invention also provides a material gas. a control device for a material gasification device, the material gasification device comprising at least: a receiving body, a receiving material; an introduction tube for introducing a carrier gas for vaporizing the material into the receiving body; and a guiding tube a mixed gas for discharging the carrier gas and the material gas vaporized by the material, wherein the material gas control device includes: a concentration measuring mechanism that measures a portion of the mixed gas a concentration of the material gas; a first valve disposed on the outlet pipe; a first valve control portion that controls an opening of the first valve such that the measurement of the material gas measured by the concentration measuring mechanism The concentration becomes the set concentration; and the second valve control portion controls the opening degree of the second valve provided on the introduction pipe, and controls the opening degree of the second valve such that when When the opening degree of the one valve is the critical value opening degree, the opening degree of the second valve is changed to the opening degree after the predetermined time, and the threshold opening degree is smaller than the opening degree of the full opening by the first predetermined value. In the opening degree, the change opening degree is greater than a second predetermined value when the opening degree of the first valve becomes the threshold opening degree.

為了即使改變所述第二閥的開度,也不會使載氣的流量急劇變化,並且在變化期間內也將測量濃度固定為設定濃度,優選的是,所述第二閥控制部控制所述第二閥,使得從所述變更前開度到成為所述變更後開度為止,使所述第二閥的開度與時間基本成比例地變大。In order to change the opening of the second valve abruptly, the flow rate of the carrier gas is not changed abruptly, and the measured concentration is also fixed to the set concentration during the change period. Preferably, the second valve control unit controls the The second valve is configured to increase the opening degree of the second valve substantially in proportion to the time from the pre-change opening degree to the change-opening degree.

為了與伴隨材料的減少而產生的氣化效率的下降量相配合,通過增加導入收容體內的載氣的量,使所述第一閥從臨界值開度返回到能夠充分可動的開度,並且在較長期間內不追加材料就可以將濃度保持為一定,優選的是,所述第二規定值根據所述第一閥成為所述臨界值開度的次數而改變。In order to match the amount of decrease in gasification efficiency caused by the decrease in the accompanying material, the first valve is returned from the threshold opening degree to the fully movable opening degree by increasing the amount of the carrier gas introduced into the housing, and The concentration may be kept constant without adding material for a long period of time. Preferably, the second predetermined value is changed according to the number of times the first valve becomes the threshold opening degree.

作為用於根據載氣的流量來設定所述第二閥的開度,更嚴密地進行與氣化效率下降相配合的濃度控制的具體結構,可以舉出的是:還包括流量測量感測器,該流量測量感測器用於測量在所述導入管中流動的載氣的流量,所述第二閥控制部包括:開度控制部,控制所述第二閥的開度,使得基於所述流量測量感測器測量出的所述載氣的測量流量成為設定流量;以及流量設定部,將所述設定流量設定在所述開度控制部中,當所述第一閥的開度成為所述臨界值開度時,所述流量設定部將變更後設定流量作為所述設定流量設定在所述開度控制部中,所述變更後設定流量是所述第一閥的開度成為所述臨界值開度時的變更前設定流量的α倍,其中,α>1。As a specific configuration for setting the opening degree of the second valve in accordance with the flow rate of the carrier gas, and more strictly performing the concentration control in accordance with the decrease in the gasification efficiency, it is also possible to include a flow rate measuring sensor. a flow measuring sensor for measuring a flow rate of a carrier gas flowing in the introduction pipe, the second valve control portion including: an opening degree control portion that controls an opening degree of the second valve such that a measured flow rate of the carrier gas measured by the flow rate measuring sensor becomes a set flow rate; and a flow rate setting unit that sets the set flow rate to the opening degree control unit, and when the opening degree of the first valve becomes In the threshold opening degree, the flow rate setting unit sets the changed set flow rate as the set flow rate in the opening degree control unit, and the changed set flow rate is that the opening degree of the first valve is the The value of the flow rate is set to α times before the change at the critical value opening degree, where α>1.

當通過逐步控制載氣的流量來控制混合氣體中的材料氣體的濃度時,為了即使收容體內的材料減少、氣化效率下降,也可以防止載氣的流量加速變大而導致在短期間內就變成不能控制,本發明還提供一種材料氣體控制裝置,該材料氣體控制裝置用於材料氣化裝置,所述材料氣化裝置至少包括:收容體,收容材料;導入管,將用於使所述材料氣化的載氣導入所述收容體內;以及導出管,用於將所述載氣和所述材料氣化後的材料氣體的混合氣體從所述收容體導出,其中,所述材料氣體控制裝置包括:流量測量機構,測量所述混合氣體中的所述材料氣體的流量;第二閥控制部,控制設置在所述導入管上的第二閥的開度,並且對所述第二閥的開度進行控制,使得由所述流童測量機構測量出的所述材料氣體的測量流量成為預先設定的設定流量;以及第一閥控制部,控制設置在所述導出管上的第一閥的開度,並且對所述第一閥的開度進行控制,使得當所述第二閥的開度成為臨界值開度時,在規定時間內使所述第一閥的開度成為變更後開度,所述臨界值開度是比完全打開的開度小第一規定值的開度,所述變更後開度比所述第二閥的開度成為所述臨界值開度時的變更前開度大第二規定值。按照所述的材料氣體控制裝置,由於即使收容體內的材料減少、氣化效率下降,也可以與之配合,通過第二閥將收容體內的全壓設定為較低,從而再次使第一閥返回到可動範圍內,所以可以防止即使材料大量剩餘也不能進行濃度控制的狀態。When the concentration of the material gas in the mixed gas is controlled by gradually controlling the flow rate of the carrier gas, in order to reduce the flow rate of the carrier gas even if the material in the housing is reduced and the gasification efficiency is lowered, the flow rate of the carrier gas is prevented from being increased, resulting in a short period of time. The invention also provides a material gas control device for a material gasification device, the material gasification device comprising at least: a receiving body, a receiving material; and an introduction tube for a carrier gas vaporized by the material is introduced into the housing; and a delivery tube for discharging a mixed gas of the carrier gas and the material gas vaporized by the material from the housing, wherein the material gas is controlled The apparatus includes: a flow measuring mechanism that measures a flow rate of the material gas in the mixed gas; a second valve control unit that controls an opening degree of a second valve provided on the introduction pipe, and the second valve The opening degree is controlled such that the measured flow rate of the material gas measured by the flow sensor measuring mechanism becomes a preset set flow rate; and the first valve control Controlling an opening degree of the first valve provided on the outlet pipe, and controlling an opening degree of the first valve such that when the opening degree of the second valve becomes a critical value opening degree, The opening degree of the first valve is changed to a degree of opening after a change, the threshold opening degree is an opening degree that is smaller than a fully opened opening degree by a first predetermined value, and the changed opening degree is longer than the second opening When the opening degree of the valve is the critical value opening degree, the opening degree before the change is larger than the second predetermined value. According to the material gas control device described above, even if the material in the housing is reduced and the gasification efficiency is lowered, the total pressure in the housing can be set to be low by the second valve, thereby returning the first valve again. It is within the movable range, so it is possible to prevent a state in which concentration control cannot be performed even if a large amount of material remains.

此外,作為所述材料氣體控制裝置的其他方式,本發明還提供一種材料氣體控制裝置,該材料氣體控制裝置用於材料氣化裝置,所述材料氣化裝置至少包括:收容體,收容材料;導入管,將用於使所述材料氣化的載氣導入所述收容體內;以及導出管,用於將所述載氣和所述材料氣化後的材料氣體的混合氣體從所述收容體導出;流量測量機構,測量所述混合氣體中的所述材料氣體的流量;以及第二閥控制部,控制設置在所述導入管上的第二閥的開度,並且對所述第二閥的開度進行控制,使得由所述流量測量機構測量出的所述材料氣體的測量流量成為預先設定的設定流量,其中,所述材料氣體控制裝置包括第一閥控制部,所述第一閥控制部控制設置在所述導出管上的第一閥的開度,並且對所述第一閥的開度進行控制,使得當所述第二閥的開度成為臨界值開度時,在規定時間內使所述第一閥的開度成為變更後開度,所述臨界值開度是比完全打開的開度小第一規定值的開度,所述變更後開度比所述第二閥的開度成為所述臨界值開度時的變更前開度大第二規定值。In addition, as another manner of the material gas control device, the present invention further provides a material gas control device for a material gasification device, the material gasification device comprising at least: a receiving body, a receiving material; Introducing a tube into which a carrier gas for vaporizing the material is introduced; and a discharge tube for mixing a gas of the carrier gas and the material gas vaporized from the material from the container Deriving; a flow measuring mechanism that measures a flow rate of the material gas in the mixed gas; and a second valve control portion that controls an opening degree of the second valve provided on the introduction pipe, and the second valve The opening degree is controlled such that the measured flow rate of the material gas measured by the flow measuring mechanism becomes a preset set flow rate, wherein the material gas control device includes a first valve control portion, the first valve The control unit controls an opening degree of the first valve provided on the outlet pipe, and controls opening degree of the first valve such that when the opening degree of the second valve becomes critical At the opening degree, the opening degree of the first valve is changed to a degree of opening after a predetermined time period, and the threshold opening degree is an opening degree that is smaller than a first opening value of the fully opened opening degree, and the change is opened. The degree of change is greater than a second predetermined value when the opening degree of the second valve becomes the threshold opening degree.

按照本發明的材料氣體控制裝置,即使由於收容體內的材料減少而導致氣化效率下降,也可以通過使第二閥的開度階段性地變大,從而使進行濃度控制的第一閥的開度在較長期間內保持在可動範圍內。因此,可以防止氣化效率加速下降、即使材料大量剩餘也變成不能進行濃度控制的狀態。According to the material gas control device of the present invention, even if the gasification efficiency is lowered due to a decrease in the material in the housing, the opening of the second valve can be made stepwise, thereby opening the first valve for performing the concentration control. The degree remains within the movable range for a longer period of time. Therefore, it is possible to prevent the vaporization efficiency from being accelerated to fall, and even if a large amount of material remains, it becomes a state in which concentration control cannot be performed.

下面參照附圖,對本發明的第一實施方式進行說明。A first embodiment of the present invention will now be described with reference to the accompanying drawings.

本實施方式的材料氣體控制裝置100例如用於以一定的濃度和流量向作為半導體製造裝置一種的MOCVD(金屬有機化合物化學氣相沉積)成膜裝置提供TMIn(三甲基銦)。更具體地說,材料氣體控制裝置100用於材料氣化裝置200,該材料氣化裝置200使TMIn的固體材料氣化並提供到作為成膜室的室內。另外,TMIn與材料對應。此外,通過組合所述材料氣體控制裝置100和所述材料氣化裝置200,來形成材料氣體控制系統300。The material gas control device 100 of the present embodiment is used, for example, to supply TMIn (trimethyl indium) to an MOCVD (Metal Organic Compound Chemical Vapor Deposition) film forming apparatus which is a semiconductor manufacturing apparatus at a constant concentration and flow rate. More specifically, the material gas control device 100 is used for the material gasification device 200 that vaporizes and supplies the solid material of TMIn to the chamber as a film forming chamber. In addition, TMIn corresponds to the material. Further, the material gas control system 300 is formed by combining the material gas control device 100 and the material gasification device 200.

如圖1的簡要圖所示,所述材料氣化裝置200包括:瓶T,在其內部收容用於氣化的材料,並且其周圍被恒溫槽包圍;導入管L1,用於向所述瓶T內導入載氣;以及導出管L2,用於將氣化後的材料氣體和載氣的混合氣體從所述瓶T導出。通過對該材料氣化裝置200設置各種結構部件和控制機構,來構成所述材料氣體控制裝置100。As shown in the schematic view of Fig. 1, the material gasification apparatus 200 includes a bottle T in which a material for gasification is housed and surrounded by a thermostatic bath; an introduction tube L1 for the bottle A carrier gas is introduced into the T; and a discharge tube L2 for discharging the mixed gas of the vaporized material gas and the carrier gas from the bottle T. The material gas control device 100 is constructed by providing various structural components and control mechanisms to the material vaporization apparatus 200.

更具體地說,如圖1所示,所述材料氣體控制裝置100包括:品質流量控制器3,設置在所述導入管L1上;壓電閥1,設置在所述導出管L2上;以及氣體濃度監測器2,通過測量從所述瓶T導出的混合氣體中的材料氣體的濃度,並且以將材料氣體的濃度保持為一定的方式控制所述品質流量控制器3和所述壓電閥1,從而作為結果將所述材料氣體的流量保持為一定。More specifically, as shown in FIG. 1, the material gas control device 100 includes a quality flow controller 3 disposed on the introduction tube L1, and a piezoelectric valve 1 disposed on the outlet tube L2; The gas concentration monitor 2 controls the mass flow controller 3 and the piezoelectric valve by measuring the concentration of the material gas in the mixed gas derived from the bottle T and maintaining the concentration of the material gas constant 1, as a result, the flow rate of the material gas is kept constant.

對各部分進行說明,如圖2的詳細圖所示,所述品質流量控制器3例如在塊狀的基礎件中形成有作為所述導入管L1的一部分的內部流道,在該內部流道上設置有:流量測量感測器31,用於測量在所述導入管L1中流動的載氣的流量:以及流量控制閥32(相當於第二閥),用於控制通過內部流道的流體的流量,並且所述品質流量控制器3還包括流量控制閥開度控制部33,該流量控制閥開度控制部33控制所述流量控制閥32的開度,以使由所述流量測量感測器31測量出的載氣的測量流量成為設定流量。另外,所述流量控制閥開度控制部33的功能是通過設置在品質流量控制器3內的微型電腦等來實現的。Each part will be described. As shown in the detailed view of FIG. 2, the mass flow controller 3 is formed with an internal flow path as a part of the introduction pipe L1, for example, in a block-shaped base member, on the internal flow path. Provided is a flow measuring sensor 31 for measuring the flow rate of the carrier gas flowing in the introduction pipe L1: and a flow control valve 32 (corresponding to the second valve) for controlling the fluid passing through the internal flow path Flow rate, and the quality flow controller 3 further includes a flow rate control valve opening degree control unit 33 that controls the opening degree of the flow rate control valve 32 so that the flow rate measurement is sensed The measured flow rate of the carrier gas measured by the device 31 becomes the set flow rate. Further, the function of the flow rate control valve opening degree control unit 33 is realized by a microcomputer or the like provided in the quality flow controller 3.

所述壓電閥1通過壓電元件能夠進行微小的開度調整,並且其開度通過後述的壓電閥控制部24來控制。The piezoelectric valve 1 can be finely adjusted by the piezoelectric element, and its opening degree is controlled by the piezoelectric valve control unit 24 which will be described later.

所述氣體濃度監測器2包括:濃度測量機構CS,用於測量所述導出管L2中的混合氣體中的材料氣體的濃度;以及流量控制部CC,通過控制所述品質流量控制器3和所述壓電閥1,來控制所述材料氣體的流量。The gas concentration monitor 2 includes: a concentration measuring mechanism CS for measuring a concentration of a material gas in the mixed gas in the outlet pipe L2; and a flow control unit CC by controlling the quality flow controller 3 and the The piezoelectric valve 1 is described to control the flow rate of the material gas.

所述濃度測量機構CS包括:分壓感測器21,設置在所述導出管L2上,測量混合氣體中的材料氣體的分壓;壓力計22,測量作為所述瓶T內的混合氣體壓力的全壓;以及濃度計算部23,基於材料氣體的分壓Pv 和混合氣體的全壓Pt 計算材料氣體的濃度。作為所述分壓感測器21可以採用NDIR(非分散型紅外分析方式)、FTIR(傅立葉變換紅外光譜方式)或鐳射吸收光譜方式等。此外,所述濃度計算部23基於濃度C為C=Pv /Pt 的算式,來計算材料氣體的測量濃度。另外,所述濃度測量機構CS也可以通過超聲波式氣體濃度感測器等,單獨測量材料氣體的濃度。The concentration measuring mechanism CS includes a partial pressure sensor 21 disposed on the discharge tube L2 to measure a partial pressure of a material gas in the mixed gas, and a pressure gauge 22 that measures the pressure of the mixed gas in the bottle T The total pressure; and the concentration calculating unit 23 calculates the concentration of the material gas based on the partial pressure P v of the material gas and the total pressure P t of the mixed gas. As the voltage dividing sensor 21, NDIR (non-dispersive infrared analysis method), FTIR (Fourier transform infrared spectroscopy), or laser absorption spectroscopy may be employed. Further, the concentration calculating unit 23 calculates the measured concentration of the material gas based on the formula in which the concentration C is C=P v /P t . Further, the concentration measuring mechanism CS may measure the concentration of the material gas alone by an ultrasonic gas concentration sensor or the like.

所述流量控制部CC包括:壓電閥控制部24(相當於第一閥控制部),控制所述壓電閥1的開度,以使由所述濃度測量機構CS測量出的材料氣體的測量濃度成為設定濃度;以及載氣流量設定部25,將載氣設定流量設定在所述品質流量控制器3內的流量控制閥開度控制部33中。另外,所述流量控制部CC的功能也是通過例如氣體濃度監測器2內的微型電腦等來實現的。此外,所述品質流量控制器3內的流量控制閥開度控制部33和流量控制部CC內的所述載氣流量設定部25相當於第二閥控制部。The flow rate control unit CC includes a piezoelectric valve control unit 24 (corresponding to a first valve control unit) that controls the opening degree of the piezoelectric valve 1 so that the material gas measured by the concentration measuring unit CS The measured concentration becomes the set concentration; and the carrier gas flow rate setting unit 25 sets the carrier gas set flow rate in the flow rate control valve opening degree control unit 33 in the quality flow controller 3. Further, the function of the flow rate control unit CC is also realized by, for example, a microcomputer or the like in the gas concentration monitor 2. Further, the flow rate control valve opening degree control unit 33 in the mass flow controller 3 and the carrier gas flow rate setting unit 25 in the flow rate control unit CC correspond to the second valve control unit.

所述壓電閥控制部24控制所述壓電閥1的開度,以使材料氣體的測量濃度和設定濃度之間的偏差趨於變小。更具體地說,從C=Pv /Pt 的算式可以明確:如果將設定濃度設定為一定,則當材料氣體的產生量下降、分壓Pv 的值變小時,需要與之配合使全壓Pt 的值也變小。即,當測量濃度低於設定濃度(分壓Pv 低)時,所述壓電閥控制部24進行使壓電閥1的開度變大的控制,以使瓶T內的全壓Pt 下降,反之,當測量濃度高於設定濃度時,所述壓電閥控制部24使壓電閥1的開度變小。此外,雖然可以通過直接進行濃度設定來設定所述設定濃度,但是在本實施方式中採用下述方式,即:如果使用者輸入想要在導出管L2內流動的材料氣體的流量,則根據該材料氣體設定流量來換算出設定濃度。具體地說,當使設定濃度為C0 、材料氣體設定流量為Qv0 、載氣設定流量為Qc0 時,根據C0 =Qv0 /(Qc0 +Qv0 )來進行換算。另外,在後述的載氣流量設定部25中,每次改變載氣設定流量時,也與之配合對設定在所述壓電閥控制部24中的設定濃度C0 進行重新設定。The piezoelectric valve control portion 24 controls the opening degree of the piezoelectric valve 1 so that the deviation between the measured concentration of the material gas and the set concentration tends to become small. More specifically, from the formula of C=P v /P t , it is clear that if the set concentration is set to be constant, when the amount of material gas is decreased and the value of the partial pressure P v becomes small, it is necessary to cooperate with it. The value of the pressure P t also becomes small. That is, when the measured concentration is lower than the set concentration (the partial pressure P v is low), the piezoelectric valve control unit 24 performs control for increasing the opening degree of the piezoelectric valve 1 so that the total pressure P t in the bottle T When the measured concentration is higher than the set concentration, the piezoelectric valve control unit 24 makes the opening degree of the piezoelectric valve 1 small. Further, although the set concentration can be set by directly performing the concentration setting, in the present embodiment, when the user inputs the flow rate of the material gas that is intended to flow in the outlet pipe L2, according to the The material gas sets the flow rate to convert the set concentration. Specifically, when the set concentration is C 0 , the material gas set flow rate is Q v0 , and the carrier gas set flow rate is Q c0 , the conversion is performed based on C 0 = Q v0 / (Q c0 + Q v0 ). In addition, the carrier gas flow rate setting unit 25, which will be described later, resets the set concentration C 0 set in the piezoelectric valve control unit 24 in accordance with the change in the carrier gas set flow rate.

當所述壓電閥1的開度成為臨界值開度時,所述載氣流量設定部25將所述流量控制閥開度控制部33的設定流量設定為變更後設定流量,該變更後設定流量是所述壓電閥1的開度成為臨界值開度時的變更前設定流量的α倍(α>1),所述臨界值開度是比完全打開的開度小第一規定值的開度。另外,第一規定值包含零,在第一實施方式中,所述臨界值開度是完全打開的開度。此外,所述載氣流量設定部25可以通過檢測開度本身來檢測所述壓電閥1開度,也可以基於輸入到壓電閥1的指令值或電流值等來檢測所述壓電閥1的開度。When the opening degree of the piezoelectric valve 1 is the threshold opening degree, the carrier gas flow rate setting unit 25 sets the set flow rate of the flow rate control valve opening degree control unit 33 to the set flow rate after the change, and sets the change after the change. The flow rate is α times (α>1) of the set flow rate before the change when the opening degree of the piezoelectric valve 1 becomes the critical value opening degree, and the threshold opening degree is smaller than the fully opened opening degree by the first predetermined value. Opening degree. Further, the first predetermined value includes zero, and in the first embodiment, the critical value opening degree is a fully open opening degree. Further, the carrier gas flow rate setting unit 25 may detect the opening degree of the piezoelectric valve 1 by detecting the opening degree itself, or may detect the piezoelectric valve based on a command value or a current value or the like input to the piezoelectric valve 1. The opening of 1 .

參照圖3的流程圖,對所述結構的材料氣體控制裝置100的材料氣體的流量控制動作進行說明。The flow rate control operation of the material gas of the material gas control device 100 of the above configuration will be described with reference to the flowchart of Fig. 3 .

首先,在將規定的載氣設定流量Qc0 設定在所述品質流量控制器3中之後,開始載氣的流量控制,來使載氣的測量流量固定為設定流量。而且,通過所述氣體濃度監測器2控制所述壓電閥1的開度,以使測量濃度成為所述一定值的設定濃度C0 (步驟S1)。由於載氣的流量一定,並且控制所述壓電閥1以使混合氣體中的材料氣體的濃度一定,所以其結果,根據濃度的關係式Qv =C×Qc /(1-C)可以確定,材料氣體流量Qv 被控制為一定。在此,以使所述流量控制閥32的開度成為與所述流量控制閥32完全打開的開度相距很大的較小開度的方式來設定初始設定時的載氣設定流量Qc0First, after the predetermined carrier gas set flow rate Qc0 is set in the quality flow controller 3, the flow rate control of the carrier gas is started to fix the measured flow rate of the carrier gas to the set flow rate. Further, the opening degree of the piezoelectric valve 1 is controlled by the gas concentration monitor 2 so that the measured concentration becomes the set concentration C 0 of the predetermined value (step S1). Since the flow rate of the carrier gas is constant, and the piezoelectric valve 1 is controlled so that the concentration of the material gas in the mixed gas is constant, the result is based on the relationship of the concentration formula Q v = C × Q c / (1-C) It is determined that the material gas flow rate Q v is controlled to be constant. Here, the carrier gas set flow rate Q c0 at the initial setting is set such that the opening degree of the flow rate control valve 32 is a small opening degree which is greatly different from the opening degree at which the flow rate control valve 32 is fully opened.

接著,伴隨瓶T內的材料的減少,並隨著氣化效率下降,所述壓電閥1的開度逐漸變大(步驟S2)。當所述壓電閥1的開度成為作為臨界值開度的完全打開的開度時(步驟S3),所述載氣流量設定部25在所述流量控制閥開度控制部33中將載氣設定流量重新設定為當前值的α倍(步驟S4)。在此,如果將載氣設定流量重新設定為當前值的α倍,則同時也更新設定在所述壓電閥控制部24中的設定濃度C0 。具體地說,由於使材料氣體設定流量Qv0 保持為一定,所以如果設新的設定濃度為C0 ’,則C0 ’=Qv0 /(Qv0 +αQc0 )成為在重新設定載氣設定流量Qc0 之後在所述壓電閥控制部24中使用的設定濃度。Then, as the material in the bottle T decreases, and as the gasification efficiency decreases, the opening degree of the piezoelectric valve 1 gradually increases (step S2). When the opening degree of the piezoelectric valve 1 is the fully open opening degree as the threshold opening degree (step S3), the carrier gas flow rate setting unit 25 is loaded in the flow rate control valve opening degree control unit 33. The gas set flow rate is reset to α times the current value (step S4). Here, if the carrier gas setting flow rate is reset to α times the current value, the set concentration C 0 set in the piezoelectric valve control unit 24 is also updated. Specifically, since the material gas set flow rate Q v0 is kept constant, if a new set concentration is set to C 0 ', C 0 '=Q v0 /(Q v0 +αQ c0 ) becomes the reset gas carrier setting. The set concentration used in the piezoelectric valve control unit 24 after the flow rate Q c0 .

此外,所述載氣流量設定部,當在規定時間內測量流量與變更後的設定流量一致了的情況下(步驟S5),所述流量控制閥32的開度作為結果成為比變更前開度大第二規定值的變更後開度並保持該狀態,返回到步驟S2。當即使經過了規定時間,測量流量也沒有與變更後的設定流量一致的情況下(步驟S5),判斷所述流量控制閥32完全打開且為控制極限,因此結束由所述氣體濃度監測器2進行的濃度控制(步驟S6)。Further, when the measured flow rate is equal to the set flow rate after the change in the predetermined time period (step S5), the opening degree of the flow rate control valve 32 is larger than the opening degree before the change. After the second predetermined value is changed, the opening degree is maintained and the state is maintained, and the process returns to step S2. When the measured flow rate does not coincide with the set flow rate after the lapse of the predetermined time (step S5), it is judged that the flow rate control valve 32 is fully opened and is the control limit, so that the gas concentration monitor 2 is ended. Concentration control performed (step S6).

因此,如果關注一個迴圈的濃度控制,則如圖4表示流量控制閥32和壓電閥1的開度的圖所示,控制混合氣體中材料氣體的濃度的壓電閥1的開度從最初的完全打開狀態變成大體完全關閉,使所述瓶T內的全壓上升,此後,由於與氣化效率下降相配合,使全壓下降,所以壓電閥1的開度逐漸變大並成為完全打開。另一方面,由於載氣的流量被保持為一定,所以所述流量控制閥32的開度也保持為大體一定的開度。而且,當所述壓電閥1的開度成為完全打開時,所述流量控制閥32的開度成為變大第二規定值的開度。Therefore, if attention is paid to the concentration control of one loop, as shown in FIG. 4, the opening degree of the flow rate control valve 32 and the piezoelectric valve 1 is shown, and the opening degree of the piezoelectric valve 1 for controlling the concentration of the material gas in the mixed gas is changed from The first fully open state is substantially completely closed, and the total pressure in the bottle T is increased. Thereafter, the total pressure is lowered due to the decrease in the gasification efficiency, so that the opening degree of the piezoelectric valve 1 is gradually increased. Open completely. On the other hand, since the flow rate of the carrier gas is kept constant, the opening degree of the flow rate control valve 32 is also maintained at a substantially constant opening degree. Further, when the opening degree of the piezoelectric valve 1 is completely opened, the opening degree of the flow rate control valve 32 becomes an opening degree which becomes a second predetermined value.

把上述動作作為一個週期來重複多次,因此如圖4所示,所述壓電閥1的開度以大體正弦波形變化,所述流量控制閥32的開度呈臺階函數形地進行變化。另外,由於材料的殘留量越少材料的氣化效率的下降量越大,所以越後續的週期越短。Since the above operation is repeated as a single cycle, as shown in FIG. 4, the opening degree of the piezoelectric valve 1 changes in a substantially sinusoidal waveform, and the opening degree of the flow rate control valve 32 changes in a step function. In addition, the smaller the amount of residual material, the larger the amount of decrease in the gasification efficiency of the material, so the subsequent cycle is shorter.

這樣,由於每當所述壓電閥1完全打開時,都對流量控制閥32進行控制,以使流入到所述瓶T內的載氣的流量階段性地變大,所以即使材料減少、氣化效率下降,也可以防止載氣的流量加速地增加。因此,可以防止很快地陷入不能控制的狀態,從而能夠長期向後續工序提供設定濃度的材料氣體,所述不能控制的狀態為即使材料大量剩餘,也不能使材料氣體的濃度或流量成為所希望的濃度或流量。Thus, since the flow rate control valve 32 is controlled every time the piezoelectric valve 1 is fully opened, the flow rate of the carrier gas flowing into the bottle T is gradually increased, so that even if the material is reduced, gas The reduction in efficiency can also prevent the flow rate of the carrier gas from increasing rapidly. Therefore, it is possible to prevent the state from being uncontrollable quickly, so that the material gas of the set concentration can be supplied to the subsequent process for a long period of time, and the uncontrollable state is that the concentration or the flow rate of the material gas cannot be made desirable even if the material remains in a large amount. Concentration or flow rate.

接著,對第二實施方式的材料氣體控制裝置100進行說明。另外,與第一實施方式的材料氣體控制裝置100對應的部件採用相同的附圖標記。Next, the material gas control device 100 of the second embodiment will be described. In addition, components corresponding to the material gas control device 100 of the first embodiment are denoted by the same reference numerals.

如圖5的簡要圖所示,第二實施方式的材料氣體控制裝置100與所述第一實施方式的不同點是:所述品質流量控制器3和壓電閥1的動作不是由氣體濃度監測器2控制,而是通過另外的控制機構統一進行控制。即,雖然所述第一實施方式的氣體濃度監測器2至少具有濃度測量機構CS和流量控制部CC兩個結構要素,但是氣體濃度監測器2在第二實施方式中僅具有濃度測量機構CS的功能,在控制裝置4內實現所述流量控制部CC的功能。As shown in the schematic view of Fig. 5, the material gas control device 100 of the second embodiment is different from the first embodiment in that the operation of the mass flow controller 3 and the piezoelectric valve 1 is not monitored by gas concentration. The device 2 controls, but is controlled uniformly by another control mechanism. That is, although the gas concentration monitor 2 of the first embodiment has at least two components of the concentration measuring mechanism CS and the flow rate control unit CC, the gas concentration monitor 2 has only the concentration measuring mechanism CS in the second embodiment. The function of the flow control unit CC is implemented in the control device 4.

所述控制裝置4是所謂的電腦,該電腦例如由I/O設備、CPU、記憶體和輸入介面等構成,並且所述控制裝置4至少作為流量控制部CC發揮功能。The control device 4 is a so-called computer composed of, for example, an I/O device, a CPU, a memory, an input interface, and the like, and the control device 4 functions as at least a flow rate control unit CC.

對各部分的協作更具體地進行說明,如圖6的詳細圖所示,所述控制裝置4對所述品質流量控制器3發出指令,以使載氣以一定的流量流動,並且所述控制裝置4從所述氣體濃度監測器2取得作為混合氣體中的材料氣體濃度的測量濃度,並控制所述壓電閥1的開度,以使所述測量濃度成為設定濃度。然後,當所述壓電閥1的開度成為完全打開時,所述控制裝置4對所述品質流量控制器3發出指令,以使載氣的流量僅增加規定量。於是,由於材料氣化的量增加,所以可以使所述壓電閥1的開度返回到可動範圍內,再次成為能夠進行濃度控制的狀態。直到所述品質流量控制器3內的流量控制閥32的開度成為完全打開、且不能使測量濃度與設定濃度一致為止,重複進行所述動作。The cooperation of the respective parts is more specifically explained. As shown in the detailed diagram of FIG. 6, the control device 4 issues an instruction to the quality flow controller 3 to cause the carrier gas to flow at a certain flow rate, and the control The device 4 takes the measured concentration of the material gas concentration in the mixed gas from the gas concentration monitor 2, and controls the opening degree of the piezoelectric valve 1 so that the measured concentration becomes the set concentration. Then, when the opening degree of the piezoelectric valve 1 is fully opened, the control device 4 issues an instruction to the quality flow controller 3 to increase the flow rate of the carrier gas by only a predetermined amount. Then, since the amount of material vaporization increases, the opening degree of the piezoelectric valve 1 can be returned to the movable range, and the concentration control can be performed again. The operation is repeated until the opening degree of the flow rate control valve 32 in the mass flow controller 3 is completely opened and the measured concentration cannot be made to match the set concentration.

這樣,可以像所述第一實施方式那樣,在各部分上設置控制部。也可以像第二實施方式那樣,通過電腦等統一進行濃度和流量控制。Thus, the control unit can be provided in each part as in the first embodiment. The concentration and flow rate control can be uniformly performed by a computer or the like as in the second embodiment.

接著,對第三實施方式的材料氣體控制裝置100進行說明。在第三實施方式中,與第一實施方式的材料氣體控制裝置100對應的部件採用相同的附圖標記。Next, the material gas control device 100 of the third embodiment will be described. In the third embodiment, the components corresponding to the material gas control device 100 of the first embodiment are given the same reference numerals.

第三實施方式與所述第一實施方式和所述第二實施方式的不同點是:在第三實施方式中,為了保持材料氣體濃度而使其開度逐漸變化的閥及在到一個閥成為臨界值開度為止的期間其開度為大體固定的閥,與所述第一實施方式和所述第二實施方式的材料氣體控制裝置100中的相反。除了上述不同點以外,品質流量控制器3、氣體濃度監測器2和壓電閥1的配置相同。The third embodiment is different from the first embodiment and the second embodiment in that, in the third embodiment, the valve whose gradation change is gradually changed in order to maintain the material gas concentration is The opening degree is a substantially fixed valve during the period from the threshold opening degree, which is opposite to that of the material gas control device 100 of the first embodiment and the second embodiment. The configuration of the mass flow controller 3, the gas concentration monitor 2, and the piezoelectric valve 1 is the same except for the above differences.

對各部分進行說明,如圖7的詳細圖所示,所述品質流量控制器3從設置在所述導出管L2上的氣體濃度監測器2取得材料氣體濃度的測量濃度,並且根據當前流動的載氣的流量和測量濃度,計算材料氣體的流量,來控制載氣的流量,以使材料氣體的測量流量成為預先設定的設定流量。更具體地說,如果材料氣體的測量流量下降,則品質流量控制器3使其內部的流量控制閥32(相當於第二閥)的開度變大,以便增載入氣的流量用於使更多的材料氣化。所述氣體濃度監測器2取得與所述流量控制閥32的開度相關的資訊,並且當該流量控制閥32成為完全打開時,使所述壓電閥1(相當於第一閥)的開度改變為變大第二規定量。即,每當所述流量控制閥32的開度成為完全打開時,所述壓電閥1都以使所述瓶T內的全壓下降的方式動作。由於如果使混合氣體的全壓下降,則即使材料氣體的產生量變少、材料氣體的分壓下降,也可以將材料氣體的濃度保持為設定濃度,所以所述流量控制閥32的開度從完全打開返回到可動範圍內。因此,可以一邊再次將材料氣體的濃度保持為設定濃度,一邊繼續進行濃度控制,從而可以防止過早地發生即使剩餘有材料也成為不能控制的狀態。此外,本實施方式可以利用設置在現有的材料氣化裝置上的閥及氣體濃度監測器等來實施。具體地說,當在材料氣化裝置的導入管上設置有第二閥、且已經具有測量材料氣體流量的流量測量機構和基於測量出的流量來控制所述第二閥的第二閥控制部時,只要在導出管上新設置第一閥並新設置第一閥控制部即可,所述第一閥控制部取得所述第二閥的開度資訊,並且當所述第二閥的開度成為臨界值開度時,每次以規定量逐步改變所述第一閥的開度。The respective portions will be described. As shown in the detailed diagram of FIG. 7, the quality flow controller 3 obtains the measured concentration of the material gas concentration from the gas concentration monitor 2 provided on the outlet pipe L2, and according to the current flow. The flow rate of the carrier gas and the measured concentration are used to calculate the flow rate of the material gas to control the flow rate of the carrier gas so that the measured flow rate of the material gas becomes a preset set flow rate. More specifically, if the measured flow rate of the material gas is decreased, the mass flow controller 3 increases the opening degree of the internal flow control valve 32 (corresponding to the second valve) so that the flow rate of the added gas is used to make More materials are vaporized. The gas concentration monitor 2 obtains information relating to the opening degree of the flow control valve 32, and when the flow control valve 32 is fully opened, opens the piezoelectric valve 1 (corresponding to the first valve) The degree is changed to become the second predetermined amount. That is, each time the opening degree of the flow rate control valve 32 is fully opened, the piezoelectric valve 1 operates to lower the total pressure in the bottle T. When the total pressure of the mixed gas is lowered, the concentration of the material gas can be maintained at the set concentration even if the amount of the material gas is reduced and the partial pressure of the material gas is lowered, so that the opening degree of the flow rate control valve 32 is completely Open to return to the movable range. Therefore, it is possible to continue the concentration control while maintaining the concentration of the material gas at the set concentration again, thereby preventing the premature occurrence of a state in which the material remains uncontrollable even if the material remains. Further, the present embodiment can be implemented by a valve, a gas concentration monitor, or the like provided on a conventional material vaporization device. Specifically, when a second valve is provided on the introduction pipe of the material gasification device, and the flow rate measuring mechanism that has measured the flow rate of the material gas and the second valve control portion that controls the second valve based on the measured flow rate When the first valve is newly provided on the outlet pipe and the first valve control portion is newly provided, the first valve control portion acquires the opening degree information of the second valve, and when the second valve is opened When the degree becomes the critical value opening degree, the opening degree of the first valve is gradually changed each time by a predetermined amount.

對其他實施方式進行說明。在除了將所述品質流量控制器內的流量控制閥的開度控制成以完全的臺階函數形的方式進行變化以外,也可以將所述品質流量控制器內的流量控制閥的開度控制成:在規定時間內使變更前開度和變更後開度之間僅產生第二規定值的差。即,也可以在變更前開度和變更後開度之間進行適當的完善(補完)。例如,如圖8的(a)所示,所述第二閥控制部可以對第二閥進行控制:使得從所述變更前開度到成為所述變更後開度為止,使所述第二閥的開度與時間基本成比例地變大。此外,為了使開度的變化率平緩,並且迅速地在所希望的設定濃度穩定,也可以如圖8的(b)所示,在各開度之間進行S形完善(S字補完)。Other embodiments will be described. In addition to controlling the opening of the flow control valve in the mass flow controller to be changed in a complete step function, the opening of the flow control valve in the mass flow controller may be controlled to : Only the difference between the second predetermined value is generated between the pre-change opening degree and the post-change opening degree within the predetermined time. In other words, it is also possible to perform appropriate improvement (filling) between the change opening degree and the change opening degree. For example, as shown in FIG. 8( a ), the second valve control unit may control the second valve such that the second valve is opened from the pre-change opening degree to the changed opening degree. The opening is substantially proportional to the time. Further, in order to make the rate of change of the opening degree gentle and to quickly stabilize at a desired set concentration, as shown in FIG. 8(b), S-shape perfecting (S-fill completion) may be performed between the opening degrees.

此外,在所述實施方式中,對於設置在導出管上的壓電閥的開度,把壓電閥的臨界值開度設定為完全打開的開度,並且把壓電閥成為完全打開作為觸發,來階段性地改變流量控制閥的開度,但是臨界值開度並不限定于完全打開的開度。例如,也可以把比完全打開的開度小第一規定值的開度作為臨界值開度,從而保持裕度。例如只要以如下方式確定第一規定值即可,即:使臨界值開度是從壓電閥的可動範圍的中間開度到完全打開的開度之間的某一開度。按照這種方式,由於可以在足夠長的時間內一邊使材料氣體保持某個氣化效率的狀態,一邊進行濃度控制,所以可以防止氣化效率的加速惡化。Further, in the embodiment, for the opening degree of the piezoelectric valve provided on the outlet pipe, the critical value opening degree of the piezoelectric valve is set to the fully open opening degree, and the piezoelectric valve is fully opened as a trigger. To change the opening of the flow control valve stepwise, but the threshold opening is not limited to the fully open opening. For example, it is also possible to set the opening degree which is smaller than the opening degree of the fully open by the first predetermined value as the threshold opening degree, thereby maintaining the margin. For example, the first predetermined value may be determined in such a manner that the threshold opening degree is a certain degree of opening from an intermediate opening degree of the movable range of the piezoelectric valve to a fully opened opening degree. According to this aspect, since the concentration control can be performed while maintaining the material gas in a certain gasification efficiency state for a sufficiently long period of time, it is possible to prevent the deterioration of the vaporization efficiency from being deteriorated.

此外,在所述實施方式中,設定成使流量控制閥的開度每次僅以大體相同的量階段性地變大,但是例如也可以使作為變更前開度和變更後開度的差的所述第二規定值根據所述第一閥成為臨界值開度的次數而改變。更具體地說,也可以如圖8的(c)所示,第一閥成為臨界值開度的次數越多使第二規定值越大,從而與氣化效率下降相配合,得到足夠的量的材料氣體。Further, in the above-described embodiment, the opening degree of the flow rate control valve is set to be gradually increased by a substantially equal amount each time. For example, the difference between the opening degree before the change and the degree of opening after the change may be set. The second predetermined value is changed according to the number of times the first valve becomes the critical value opening degree. More specifically, as shown in (c) of FIG. 8, as the number of times the first valve becomes the critical value opening degree increases, the second predetermined value increases, and the gasification efficiency decreases, so that a sufficient amount is obtained. Material gas.

此外,作為所述第一閥的具體的實施方式,並不僅限定於壓電閥。例如也可以採用電磁閥等其他閥。Further, as a specific embodiment of the first valve, it is not limited to the piezoelectric valve. For example, other valves such as solenoid valves may be used.

對於各實施方式的材料氣體控制裝置,在所述導入管上沒有設置所述品質流量控制器而僅設置有流量控制閥(第二閥),只要將第二閥控制部設置在所述氣體濃度監測器或控制裝置內即可,所述第二閥控制部進行如下控制,即:當設置在導出管上的第一閥的開度成為作為比完全打開的開度小第一規定值的開度的臨界值開度時,在規定時間內使所述第二閥的開度成為變更後開度,該變更後開度比所述第一閥的開度成為臨界值開度時的變更前開度大第二規定值。In the material gas control device according to each embodiment, the mass flow controller is not provided on the introduction pipe, and only the flow rate control valve (second valve) is provided, as long as the second valve control portion is set at the gas concentration The second valve control unit may be controlled such that the opening degree of the first valve provided on the outlet pipe becomes the first predetermined value smaller than the opening degree of the full opening. When the threshold value is opened, the opening degree of the second valve is changed to a degree of opening after a predetermined time period, and the degree of opening after the change is higher than the opening degree of the first valve. The second specified value.

即使材料為液體材料,各實施方式的材料氣體控制裝置也可以得到同樣的效果。此外,本發明的材料氣體控制裝置並不限定於TMIn的固體氣化後的材料氣體的濃度控制。例如,也可以用於CVD(化學氣相沉積)成膜裝置等、或用於向在半導體製造過程中使用的晶片清洗裝置的乾燥處理槽內以穩定的濃度提供IPA(異丙醇)。此外,本發明的材料氣體控制裝置並不限定於用在半導體、FPD(平板顯示器)、光學裝置、MEMS(微機電系統)等的製造過程中,也可以用於使用了材料氣化裝置的氣體供給裝置。Even if the material is a liquid material, the material gas control device of each embodiment can obtain the same effect. Further, the material gas control device of the present invention is not limited to the concentration control of the material gas after solidification of TMIn. For example, it can also be used for a CVD (Chemical Vapor Deposition) film forming apparatus or the like, or for providing IPA (isopropyl alcohol) in a stable concentration in a drying treatment tank of a wafer cleaning apparatus used in a semiconductor manufacturing process. Further, the material gas control device of the present invention is not limited to use in a manufacturing process of a semiconductor, an FPD (Flat Panel Display), an optical device, a MEMS (Micro Electro Mechanical System), or the like, and may be used for a gas using a material vaporization device. Supply device.

此外,也可以利用現有的材料氣化裝置及在該材料氣化裝置中使用的閥等來實施本發明。例如,當在材料氣化裝置中預先設置有第二閥時,可以在所述材料氣化裝置上追加材料氣體控制裝置來構成材料氣體控制系統,所述材料氣體控制裝置包括所述第一閥、所述濃度測量機構、所述第一閥控制部和所述第二閥控制部。此外,也可以在氣體濃度監測器或控制裝置中安裝材料氣體控制程式,來進行如上所述的濃度或流量控制,所述材料氣體控制程式發揮作為所述第一閥控制部和所述第二閥控制部的功能。此外,這種程式既可以通過網路來安裝,也可以通過例如存儲有材料氣體控制程式的CD等記錄介質來安裝。Further, the present invention can be carried out by using a conventional material vaporization apparatus, a valve used in the material vaporization apparatus, or the like. For example, when a second valve is previously provided in the material gasification device, a material gas control device may be added to the material gasification device to constitute a material gas control system, and the material gas control device includes the first valve The concentration measuring mechanism, the first valve control unit, and the second valve control unit. In addition, a material gas control program may be installed in the gas concentration monitor or the control device to perform concentration or flow rate control as described above, and the material gas control program functions as the first valve control portion and the second The function of the valve control unit. Further, such a program can be installed either through a network or by a recording medium such as a CD storing a material gas control program.

在所述各實施方式中,基於濃度進行材料氣體的流量控制,但是也可以不採用測量混合氣體中的材料氣體濃度的濃度測量機構,而採用直接測量材料氣體流量的流量測量機構來構成材料氣體控制裝置和材料氣體控制系統。例如,也可以測量所述導入管中的載氣流量和所述導出管中的混合氣體流量,根據它們之間的差來測量材料氣體流量。In each of the above embodiments, the flow rate control of the material gas is performed based on the concentration, but the flow rate measuring mechanism that directly measures the material gas flow rate may be used instead of the concentration measuring mechanism that measures the material gas concentration in the mixed gas. Control device and material gas control system. For example, it is also possible to measure the flow rate of the carrier gas in the introduction pipe and the flow rate of the mixed gas in the outlet pipe, and measure the material gas flow rate based on the difference therebetween.

另外,只要不違反本發明的宗旨,可以進行各種變形及對實施方式進行組合。Further, various modifications and combinations of the embodiments may be made without departing from the spirit and scope of the invention.

1...壓電閥1. . . Piezoelectric valve

100...材料氣體控制裝置100. . . Material gas control device

2...氣體濃度監測器2. . . Gas concentration monitor

21...分壓感測器twenty one. . . Partial pressure sensor

22...壓力計twenty two. . . pressure gauge

23...濃度計算部twenty three. . . Concentration calculation department

24...壓電閥控制部twenty four. . . Piezoelectric valve control unit

25...載氣流量設定部25. . . Carrier gas flow setting unit

200...材料氣化裝置200. . . Material gasification unit

3...品質流量控制器3. . . Quality flow controller

31...流量測量感測器31. . . Flow measurement sensor

32...流量控制閥32. . . Flow control valve

33...流量控制閥開度控制部33. . . Flow control valve opening control unit

300...材料氣體控制系統300. . . Material gas control system

C...濃度C. . . concentration

CC...流量控制部CC. . . Flow control department

CS...濃度測量機構CS. . . Concentration measuring mechanism

L1...導入管L1. . . Inlet tube

L2...導出管L2. . . Export tube

S...材料S. . . material

T...瓶T. . . bottle

S1~S6...流程圖步驟說明S1 ~ S6. . . Flow chart step description

圖1是簡要表示本發明第一實施方式的材料氣體控制系統的示意圖。Fig. 1 is a schematic view schematically showing a material gas control system according to a first embodiment of the present invention.

圖2是示意性表示第一實施方式的材料氣體控制系統的流體回路圖和功能框圖。Fig. 2 is a fluid circuit diagram and a functional block diagram schematically showing a material gas control system of the first embodiment.

圖3是表示第一實施方式的材料氣體控制系統的動作的流程圖。3 is a flow chart showing the operation of the material gas control system of the first embodiment.

圖4是表示第一實施方式的材料氣體控制系統的各閥的開度變化的圖。4 is a view showing changes in opening degree of each valve of the material gas control system according to the first embodiment.

圖5是簡要表示本發明第二實施方式的材料氣體控制系統的示意圖。Fig. 5 is a schematic view schematically showing a material gas control system according to a second embodiment of the present invention.

圖6是示意性表示第二實施方式的材料氣體控制系統的流體回路圖和功能框圖。Fig. 6 is a fluid circuit diagram and a functional block diagram schematically showing a material gas control system of a second embodiment.

圖7是示意性表示第三實施方式的材料氣體控制系統的流體回路圖和功能框圖。Fig. 7 is a fluid circuit diagram and a functional block diagram schematically showing a material gas control system of a third embodiment.

圖8是表示本發明其他實施方式的第二閥的動作的圖。Fig. 8 is a view showing the operation of a second valve according to another embodiment of the present invention.

圖9是簡要表示以往的材料氣體控制系統的示意圖。Fig. 9 is a schematic view schematically showing a conventional material gas control system.

1...壓電閥1. . . Piezoelectric valve

100...材料氣體控制裝置100. . . Material gas control device

2...氣體濃度監測器2. . . Gas concentration monitor

200...材料氣化裝置200. . . Material gasification unit

3...品質流量控制器3. . . Quality flow controller

300...材料氣體控制系統300. . . Material gas control system

L1...導入管L1. . . Inlet tube

L2...導出管L2. . . Export tube

S...材料S. . . material

T...瓶T. . . bottle

Claims (10)

一種材料氣體控制裝置,用於材料氣化裝置,所述材料氣化裝置至少包括:收容體,收容材料;導入管,將用於使所述材料氣化的載氣導入所述收容體內;以及導出管,用於將所述載氣和所述材料氣化後的材料氣體的混合氣體從所述收容體導出,其中,所述材料氣體控制裝置包括:濃度測量機構,測量所述混合氣體中的所述材料氣體的濃度;第一閥控制部,控制設置在所述導出管上的第一閥的開度,並且對所述第一閥的開度進行控制,使得由所述濃度測量機構測量出的材料氣體的測量濃度成為設定濃度;以及第二閥控制部,控制設置在所述導入管上的第二閥的開度,並且對所述第二閥的開度進行控制,使得當所述第一閥的開度成為臨界值開度時,在規定時間內使所述第二閥的開度成為變更後開度,所述臨界值開度是比完全打開的開度小第一規定值的開度,所述變更後開度比所述第一閥的開度成為所述臨界值開度時的變更前開度大第二規定值。A material gas control device for a material gasification device, the material gasification device comprising at least: a receiving body, a receiving material; and an introduction pipe for introducing a carrier gas for vaporizing the material into the receiving body; a lead-out tube for extracting a mixed gas of the carrier gas and a material gas vaporized by the material from the container, wherein the material gas control device includes: a concentration measuring mechanism that measures the mixed gas a concentration of the material gas; a first valve control portion that controls an opening degree of the first valve provided on the outlet pipe, and controls an opening degree of the first valve such that the concentration measuring mechanism The measured concentration of the measured material gas becomes the set concentration; and the second valve control portion controls the opening degree of the second valve provided on the introduction pipe, and controls the opening degree of the second valve so that When the opening degree of the first valve is a critical value opening degree, the opening degree of the second valve is changed to a later opening degree within a predetermined time, and the threshold opening degree is smaller than a fully open opening degree. Specified value Opening, after the opening ratio of the change of the opening degree of the first valve opening degree becomes a second predetermined value before the change when the opening degree threshold value. 如申請專利範圍第1項所述之材料氣體控制裝置,其中,所述第二閥控制部控制所述第二閥,使得從所述變更前開度到成為所述變更後開度為止,使所述第二閥的開度與時間基本成比例地變大。The material gas control device according to claim 1, wherein the second valve control unit controls the second valve so as to be from the pre-change opening degree to the change-opening degree The opening degree of the second valve becomes substantially proportional to the time. 如申請專利範圍第1項所述之材料氣體控制裝置,其中,所述第二規定值根據所述第一閥成為所述臨界值開度的次數而改變。The material gas control device according to claim 1, wherein the second predetermined value is changed according to the number of times the first valve becomes the threshold opening degree. 如申請專利範圍第1、2或3項所述之材料氣體控制裝置,其中,所述第二閥控制部包括:開度控制部,控制所述第二閥的開度,使得由流量測量感測器測量出的所述載氣的測量流量成為設定流量,所述流量測量感測器用於測量在所述導入管中流動的所述載氣的流量;以及流量設定部,將所述設定流量設定在所述開度控制部中,當所述第一閥的開度成為所述臨界值開度時,所述流量設定部將變更後設定流量作為所述設定流量設定在所述開度控制部中,所述變更後設定流量是所述第一閥的開度成為所述臨界值開度時的變更前設定流量的α倍,其中,α>1。The material gas control device according to claim 1, wherein the second valve control unit includes: an opening degree control unit that controls an opening degree of the second valve so that a flow measurement feeling is obtained The measured flow rate of the carrier gas measured by the detector becomes a set flow rate, the flow rate measuring sensor is for measuring a flow rate of the carrier gas flowing in the introduction pipe; and a flow rate setting unit is configured to set the flow rate In the opening degree control unit, when the opening degree of the first valve is the threshold opening degree, the flow rate setting unit sets the changed set flow rate as the set flow rate at the opening degree control. In the portion, the set flow rate after the change is α times the set flow rate before the change when the opening degree of the first valve is the threshold opening degree, wherein α>1. 一種材料氣體控制裝置,用於材料氣化裝置,所述材料氣化裝置至少包括:收容體,收容材料;導入管,將用於使所述材料氣化的載氣導入所述收容體內;以及導出管,用於將所述載氣和所述材料氣化後的材料氣體的混合氣體從所述收容體導出,其中,所述材料氣體控制裝置包括:濃度測量機構,測量所述混合氣體中的所述材料氣體的濃度;第一閥,設置在所述導出管上;第一閥控制部,控制所述第一閥的開度,使得由所述濃度測量機構測量出的所述材料氣體的測量濃度成為設定濃度;以及第二閥控制部,控制設置在所述導入管上的第二閥的開度,並且對所述第二閥的開度進行控制,使得當所述第一閥的開度成為臨界值開度時,在規定時間內使所述第二閥的開度成為變更後開度,所述臨界值開度是比完全打開的開度小第一規定值的開度,所述變更後開度比所述第一閥的開度成為所述臨界值開度時的變更前開度大第二規定值。A material gas control device for a material gasification device, the material gasification device comprising at least: a receiving body, a receiving material; and an introduction pipe for introducing a carrier gas for vaporizing the material into the receiving body; a lead-out tube for extracting a mixed gas of the carrier gas and a material gas vaporized by the material from the container, wherein the material gas control device includes: a concentration measuring mechanism that measures the mixed gas a concentration of the material gas; a first valve disposed on the outlet pipe; a first valve control portion that controls an opening degree of the first valve such that the material gas measured by the concentration measuring mechanism The measured concentration becomes the set concentration; and the second valve control portion controls the opening degree of the second valve provided on the introduction pipe, and controls the opening degree of the second valve such that when the first valve When the opening degree is the critical value opening degree, the opening degree of the second valve is changed to the opening degree after the predetermined time, and the threshold opening degree is an opening degree smaller than the opening degree of the full opening by the first predetermined value. , the change The opening degree of the second predetermined value than the front opening degree of the first valve opening degree becomes changed when the opening degree threshold value. 一種材料氣體控制方法,該材料氣體控制方法使用材料氣體控制裝置,所述材料氣體控制裝置用於材料氣化裝置,所述材料氣化裝置至少包括:收容體,收容材料;導入管,將用於使所述材料氣化的載氣導入所述收容體內;以及導出管,用於將所述載氣和所述材料氣化後的材料氣體的混合氣體從所述收容體導出,其中,所述材料氣體控制裝置至少包括濃度測量機構,所述濃度測量機構測量所述混合氣體中的所述材料氣體的濃度,所述材料氣體控制方法包括:第一閥控制步驟,控制設置在所述導出管上的第一閥的開度,並且對所述第一閥的開度進行控制,使得由所述濃度測量機構測量出的所述材料氣體的測量濃度成為設定濃度;以及第二閥控制步驟,控制設置在所述導入管上的第二閥的開度,並且對所述第二閥的開度進行控制,使得當所述第一閥的開度成為臨界值開度時,在規定時間內使所述第二閥的開度成為變更後開度,所述臨界值開度是比完全打開的開度小第一規定值的開度,所述變更後開度比所述第一閥的開度成為所述臨界值開度時的變更前開度大第二規定值。A material gas control method using a material gas control device for a material gasification device, the material gasification device comprising at least: a receiving body, a receiving material; and an introduction tube for use Introducing a carrier gas for vaporizing the material into the housing; and a delivery tube for discharging a mixed gas of the carrier gas and the material gas vaporized by the material from the container; The material gas control device includes at least a concentration measuring mechanism that measures a concentration of the material gas in the mixed gas, the material gas control method including: a first valve control step in which control is set in the export An opening degree of the first valve on the tube, and controlling an opening degree of the first valve such that a measured concentration of the material gas measured by the concentration measuring mechanism becomes a set concentration; and a second valve control step Controlling an opening degree of the second valve provided on the introduction pipe, and controlling an opening degree of the second valve such that when the first valve is When the degree becomes the critical value opening degree, the opening degree of the second valve is changed to the opening degree after the predetermined time, and the threshold opening degree is an opening degree that is smaller than the opening degree of the full opening by the first predetermined value. The change after opening is greater than a second predetermined value when the opening degree of the first valve becomes the threshold opening degree. 一種材料氣體控制程式,用於控制材料氣體控制裝置,所述材料氣體控制裝置用於材料氣化裝置,所述材料氣化裝置至少包括:收容體,收容材料;導入管,將用於使所述材料氣化的載氣導入所述收容體內;以及導出管,用於將所述載氣和所述材料氣化後的材料氣體的混合氣體從所述收容體導出,其中,所述材料氣體控制裝置至少包括濃度測量機構,所述濃度測量機構測量所述混合氣體中的所述材料氣體的濃度,所述材料氣體控制程式作為控制部起作用,其中,所述控制部包括:第一閥控制部,控制設置在所述導出管上的第一閥的開度,並且對所述第一閥的開度進行控制,使得由所述濃度測量機構測量出的所述材料氣體的測量濃度成為設定濃度;以及第二閥控制部,控制設置在所述導入管上的第二閥的開度,並且對所述第二閥的開度進行控制,使得當所述第一閥的開度成為臨界值開度時,在規定時間內使所述第二閥的開度成為變更後開度,所述臨界值開度是比完全打開的開度小第一規定值的開度,所述變更後開度比所述第一閥的開度成為所述臨界值開度時的變更前開度大第二規定值。A material gas control program for controlling a material gas control device for a material gasification device, the material gasification device comprising at least: a receiving body, a receiving material; and an introduction tube for use in a carrier gas vaporized by the material is introduced into the housing; and a delivery tube for discharging a mixed gas of the carrier gas and the material gas vaporized by the material from the housing, wherein the material gas The control device includes at least a concentration measuring mechanism that measures a concentration of the material gas in the mixed gas, the material gas control program functions as a control portion, wherein the control portion includes: a first valve a control unit that controls an opening degree of the first valve provided on the outlet pipe, and controls an opening degree of the first valve such that a measured concentration of the material gas measured by the concentration measuring mechanism becomes Setting a concentration; and a second valve control unit that controls an opening degree of the second valve provided on the introduction pipe, and controls an opening degree of the second valve to When the opening degree of the first valve is the critical value opening degree, the opening degree of the second valve is changed to the opening degree after the predetermined time, and the threshold opening degree is smaller than the opening degree of the full opening. The opening degree of the predetermined value is greater than a second predetermined value of the change opening degree when the opening degree of the first valve is the threshold opening degree. 一種材料氣體控制系統,其包括:收容體,收容材料;導入管,將用於使所述材料氣化的載氣導入所述收容體內;導出管,用於將所述載氣和所述材料氣化後的材料氣體的混合氣體從所述收容體導出;第一閥,設置在所述導出管上;濃度測量機構,測量所述混合氣體中的所述材料氣體的濃度;第一閥控制部,控制所述第一閥的開度,使得由所述濃度測量機構測量出的所述材料氣體的測量濃度成為預先設定的設定濃度;第二閥,設置在所述導入管上;以及第二閥控制部,對所述第二閥的開度進行控制,使得當所述第一閥的開度成為臨界值開度時,在規定時間內使所述第二閥的開度成為變更後開度,所述臨界值開度是比完全打開的開度小第一規定值的開度,所述變更後開度比所述第一閥的開度成為所述臨界值開度時的變更前開度大第二規定值。A material gas control system comprising: a receiving body, a receiving material; an introduction tube for introducing a carrier gas for vaporizing the material into the receiving body; and a discharge tube for the carrier gas and the material a gas mixture of the vaporized material gas is led out from the container; a first valve is disposed on the outlet tube; a concentration measuring mechanism measures a concentration of the material gas in the mixed gas; and the first valve is controlled Controlling the opening degree of the first valve such that the measured concentration of the material gas measured by the concentration measuring mechanism becomes a preset set concentration; a second valve is disposed on the introduction tube; The two-valve control unit controls the opening degree of the second valve such that when the opening degree of the first valve becomes a critical value opening degree, the opening degree of the second valve is changed after a predetermined time In the opening degree, the threshold opening degree is an opening degree that is smaller than a first opening value that is smaller than a fully opened opening degree, and the change opening degree is changed when the opening degree of the first valve becomes the threshold value opening degree. The front opening is greater than the second specified value. 一種材料氣體控制裝置,用於材料氣化裝置,所述材料氣化裝置至少包括:收容體,收容材料;導入管,將用於使所述材料氣化的載氣導入所述收容體內;以及導出管,用於將所述載氣和所述材料氣化後的材料氣體的混合氣體從所述收容體導出,其中,所述材料氣體控制裝置包括:流量測量機構,測量所述混合氣體中的所述材料氣體的流量;第二閥控制部,控制設置在所述導入管上的第二閥的開度,並且對所述第二閥的開度進行控制,使得由所述流量測量機構測量出的所述材料氣體的測量流量成為預先設定的設定流量;以及第一閥控制部,控制設置在所述導出管上的第一閥的開度,並且對所述第一閥的開度進行控制,使得當所述第二閥的開度成為臨界值開度時,在規定時間內使所述第一閥的開度成為變更後開度,所述臨界值開度是比完全打開的開度小第一規定值的開度,所述變更後開度比所述第二閥的開度成為所述臨界值開度時的變更前開度大第二規定值。A material gas control device for a material gasification device, the material gasification device comprising at least: a receiving body, a receiving material; and an introduction pipe for introducing a carrier gas for vaporizing the material into the receiving body; a discharge tube for extracting a mixed gas of the carrier gas and a material gas vaporized by the material from the container, wherein the material gas control device includes: a flow measuring mechanism that measures the mixed gas a flow rate of the material gas; a second valve control portion that controls an opening degree of the second valve provided on the introduction pipe, and controls an opening degree of the second valve such that the flow rate measuring mechanism The measured flow rate of the material gas is measured to be a preset set flow rate; and a first valve control portion controls an opening degree of the first valve provided on the outlet pipe, and an opening degree of the first valve Controlling such that when the opening degree of the second valve becomes the critical value opening degree, the opening degree of the first valve is changed to the later opening degree within a predetermined time, and the threshold opening degree is more than the fully opened open Small opening degree of a first predetermined value after the opening degree change ratio of the opening degree of the second valve opening degree becomes a second predetermined value before the change when the opening degree threshold value. 一種材料氣體控制裝置,用於材料氣化裝置,所述材料氣化裝置至少包括:收容體,收容材料;導入管,將用於使所述材料氣化的載氣導入所述收容體內;導出管,用於將所述載氣和所述材料氣化後的材料氣體的混合氣體從所述收容體導出;流量測量機構,測量所述混合氣體中的所述材料氣體的流量;以及第二閥控制部,控制設置在所述導入管上的第二閥的開度,並且對所述第二閥的開度進行控制,使得由所述流量測量機構測量出的所述材料氣體的測量流量成為預先設定的設定流量,其中,所述材料氣體控制裝置包括第一閥控制部,所述第一閥控制部控制設置在所述導出管上的第一閥的開度,並且對所述第一閥的開度進行控制,使得當所述第二閥的開度成為臨界值開度時,在規定時間內使所述第一閥的開度成為變更後開度,所述臨界值開度是比完全打開的開度小第一規定值的開度,所述變更後開度比所述第二閥的開度成為所述臨界值開度時的變更前開度大第二規定值。A material gas control device for a material gasification device, the material gasification device comprising at least: a receiving body, a receiving material; and an introduction pipe for introducing a carrier gas for vaporizing the material into the receiving body; a tube for extracting a mixed gas of the carrier gas and a material gas vaporized by the material from the container; a flow measuring mechanism that measures a flow rate of the material gas in the mixed gas; and a second a valve control portion that controls an opening degree of the second valve provided on the introduction pipe, and controls an opening degree of the second valve such that a measured flow rate of the material gas measured by the flow rate measuring mechanism a predetermined set flow rate, wherein the material gas control device includes a first valve control portion, the first valve control portion controls an opening degree of the first valve disposed on the outlet pipe, and The opening degree of the valve is controlled such that when the opening degree of the second valve becomes the critical value opening degree, the opening degree of the first valve is changed to the opening degree after the predetermined time, the threshold opening degree Is more than finished Open to open a small opening degree of the first predetermined value after the opening degree change ratio of the opening degree of the second valve opening degree becomes a second predetermined value before the change when the opening degree threshold value.
TW100149169A 2010-12-28 2011-12-28 Control device for material gas, control method, control program and control system thereof TWI511184B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010292537A JP5506655B2 (en) 2010-12-28 2010-12-28 Material gas control device, material gas control method, material gas control program, and material gas control system

Publications (2)

Publication Number Publication Date
TW201246294A TW201246294A (en) 2012-11-16
TWI511184B true TWI511184B (en) 2015-12-01

Family

ID=46348188

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100149169A TWI511184B (en) 2010-12-28 2011-12-28 Control device for material gas, control method, control program and control system thereof

Country Status (4)

Country Link
JP (1) JP5506655B2 (en)
KR (1) KR101814210B1 (en)
CN (1) CN102541101B (en)
TW (1) TWI511184B (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AR093417A1 (en) * 2012-11-14 2015-06-03 Krohne Ag NUCLEAR MAGNETIC RESONANCE FLOW MEASUREMENT DEVICE AND PROCEDURE FOR OPERATING A NUCLEAR MAGNETIC RESONANCE FLOW MEASUREMENT DEVICE
JP6026875B2 (en) * 2012-12-03 2016-11-16 日本エア・リキード株式会社 Vaporization monitoring system and monitoring method for solid materials
JP5973969B2 (en) * 2013-07-31 2016-08-23 国立大学法人徳島大学 Inline densitometer and concentration detection method
JP6435175B2 (en) * 2014-12-02 2018-12-05 株式会社堀場エステック Decomposition detection device, decomposition detection method, program for decomposition detection device, concentration measurement device, and concentration control device
JP2017090351A (en) * 2015-11-13 2017-05-25 株式会社堀場製作所 Radiation thermometer
JP6959921B2 (en) * 2016-08-05 2021-11-05 株式会社堀場エステック A gas control system and a film forming apparatus equipped with the gas control system
JP6914063B2 (en) * 2017-03-10 2021-08-04 株式会社堀場エステック A gas control system, a film forming apparatus provided with the gas control system, a program used for the gas control system, and a gas control method.
CN109423622B (en) * 2017-08-29 2020-10-13 胜高股份有限公司 Gas supply device and gas supply method
JP7027151B2 (en) 2017-12-13 2022-03-01 株式会社堀場エステック Concentration control device, gas control system, film formation device, concentration control method, and program for concentration control device
JP2021164492A (en) * 2018-04-24 2021-10-14 オリンパス株式会社 Pneumoperitoneum device
WO2020021712A1 (en) * 2018-07-27 2020-01-30 株式会社島津製作所 Analysis device
CN111270209B (en) * 2018-12-05 2023-12-12 东君新能源有限公司 Steam sputtering device, control system and control method
JP7281285B2 (en) 2019-01-28 2023-05-25 株式会社堀場エステック DENSITY CONTROLLER, ZERO POINT ADJUSTMENT METHOD, AND PROGRAM FOR DENSITY CONTROLLER
CN114263902B (en) * 2021-12-03 2023-08-25 苏州智程半导体科技股份有限公司 Mixed steam generation system

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007535617A (en) * 2004-04-12 2007-12-06 エム ケー エス インストルメンツ インコーポレーテッド Pulsed mass flow delivery system and method
TW200815703A (en) * 2006-06-27 2008-04-01 Fujikin Kk Vaporizer/supplier of material and automatic pressure regulator for use therein
CN101724828A (en) * 2008-10-31 2010-06-09 株式会社堀场制作所 Material gas concentration control system
US20100178423A1 (en) * 2009-01-13 2010-07-15 Asm Japan K.K. Method for controlling flow and concentration of liquid precursor
US20100285206A1 (en) * 2009-03-27 2010-11-11 Rohm And Haas Electronic Materials Llc Method and apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002179404A (en) * 2000-12-08 2002-06-26 Toho Gas Co Ltd Operation control system for fuel reformer
JP2002289531A (en) * 2001-03-23 2002-10-04 Ricoh Co Ltd System and method for supplying material gas, system for forming thin film and epitaxial growth system
JP4314425B2 (en) * 2002-12-02 2009-08-19 株式会社フジキン Fluid control device
JP4454964B2 (en) * 2003-06-09 2010-04-21 東京エレクトロン株式会社 Partial pressure control system and flow rate control system

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007535617A (en) * 2004-04-12 2007-12-06 エム ケー エス インストルメンツ インコーポレーテッド Pulsed mass flow delivery system and method
TW200815703A (en) * 2006-06-27 2008-04-01 Fujikin Kk Vaporizer/supplier of material and automatic pressure regulator for use therein
CN101724828A (en) * 2008-10-31 2010-06-09 株式会社堀场制作所 Material gas concentration control system
US20100178423A1 (en) * 2009-01-13 2010-07-15 Asm Japan K.K. Method for controlling flow and concentration of liquid precursor
US20100285206A1 (en) * 2009-03-27 2010-11-11 Rohm And Haas Electronic Materials Llc Method and apparatus

Also Published As

Publication number Publication date
CN102541101A (en) 2012-07-04
KR20120075378A (en) 2012-07-06
TW201246294A (en) 2012-11-16
JP2012142355A (en) 2012-07-26
KR101814210B1 (en) 2018-01-02
CN102541101B (en) 2016-02-03
JP5506655B2 (en) 2014-05-28

Similar Documents

Publication Publication Date Title
TWI511184B (en) Control device for material gas, control method, control program and control system thereof
TWI484310B (en) Material gas concertration control system
JP6916964B2 (en) Pulse gas supply method and equipment using a shutoff valve
KR101626619B1 (en) Material gas concentration control system
US8459291B2 (en) Source gas concentration control system
US20200294820A1 (en) Concentration control apparatus, source consumption quantity estimation method, and program recording medium on which a program for a concentration control apparatus is recorded
TW201714207A (en) Gas control system and program for gas control system
US10385457B2 (en) Raw material gas supply apparatus, raw material gas supply method and storage medium
JP7027151B2 (en) Concentration control device, gas control system, film formation device, concentration control method, and program for concentration control device
JP2013055303A (en) Raw material vaporization supply device with raw material concentration detection mechanism
TW201835981A (en) Gas control system, deposition apparatus including gas control system, and program and gas control method used for gas control system
TW201816170A (en) Gas control system and film formation device provided with gas control system
JPWO2018062270A1 (en) Concentration detection method and pressure type flow control device
US11365480B2 (en) Concentration control apparatus, zero point adjustment method, and program recording medium recorded with concentration control apparatus program
JP2007155447A (en) Liquid volume measuring instrument, liquid volume measuring method, and volumetric supply method for liquid material
US11698649B2 (en) Vaporization system and concentration control module used in the same
JP5615162B2 (en) Material gas concentration control system
JP7273596B2 (en) Flow rate calculation device, flow rate calculation system, and flow rate calculation device program
JP5511108B2 (en) Material gas concentration controller
JPH0799175A (en) Method and apparatus for supplying treatment liquid
TWI830862B (en) Concentration control apparatus, zero point adjustment method, and concentration control apparatus program
JP2008007826A (en) Method for determining abnormality in injection valve of film deposition apparatus and vaporizer, and film deposition apparatus and vaporizer
JP5302642B2 (en) Method for measuring the amount of source material in a chemical vapor deposition process
KR20100097823A (en) Canister for processing semiconductor
JP2000124186A (en) Liquid feeding device