TWI510810B - Lens unit and laser processing apparatus - Google Patents

Description

Lens unit and laser processing device

The present invention relates to a lens unit that vertically condenses a laser beam onto a workpiece, and a laser processing apparatus using the lens unit.

A laser processing apparatus using a galvano scanner has been conventionally used as a laser engraving machine or a laser marking machine, and is also generally called a laser marker.

Recently, this laser processing apparatus has been used in the manufacturing process of the opening of a multilayer printed circuit board or a precision electronic component, and has been used as a fine, high-speed and elastic processing method in place of the conventional drilling method.

In recent years, with the miniaturization of semiconductors and the increase in the degree of integration, the high definition of electronic circuits and electronic components has become increasingly prominent. For a laser processing apparatus used for processing such a high-definition electronic circuit or electronic component, a processing position accuracy of μm units which cannot be achieved by a conventional laser reticle or the like has been required.

As a laser processing apparatus corresponding to the requirements of such ultra-high precision processing accuracy, a temperature detecting means having a galvano mirror, a lens temperature detecting means, and according to the isothermal temperature have been proposed. A laser processing apparatus for controlling a position of a current mirror that is biased to a displacement position by a temperature signal of a detection means.

Such a laser processing apparatus is capable of changing a temperature caused by a temperature change around a setting environment, a heat generation caused by absorption of a high-energy laser beam, or a unit or a component level constituting a laser processing apparatus ( Correction of the machining position shift is performed by changing the temperature of the laser processing apparatus such as the temperature change under the level (see, for example, Patent Document 1).

[Previous Technical Literature] [Patent Literature]

Patent Document 1: Japanese Patent No. 4320524 (page 4-5, first figure)

In the conventional laser processing apparatus described in Patent Document 1, the temperature of the f θ lens belonging to the lens unit is detected by a temperature detector attached to the lateral surface of the lens unit.

In general, since the f θ lens system includes an optical lens and a lens barrel that holds the optical lens, in the conventional laser processing apparatus, a temperature detector is provided on the lateral surface of the f θ lens, that is, in the side portion of the lens barrel. A temperature detector is provided.

In the conventional laser processing apparatus, the temperature is measured by a temperature detector provided on the side of the lens barrel of the f θ lens belonging to the lens unit. Therefore, in the case where the optical lens instantaneously absorbs a high-energy laser (for example, msec unit precision) beam, and instantaneously generates a temperature rise, since the temperature measurement point is far from the laser beam irradiation area, and the heat capacity of the lens barrel Larger, so there will be no good Accuracy measures temperature changes without the problem of offsetting the machining position.

The present invention has been made in order to solve the above problems, and the first object thereof is to obtain a laser beam which absorbs high energy instantaneously in an optical lens and instantaneously generates a temperature rise, and can also be good by a temperature detector. Accuracy to measure the lens unit of the temperature change of the optical lens.

A second object of the present invention is to obtain a laser processing apparatus which uses the lens unit as an f θ lens and can process a processing position caused by a laser beam which forms an optical lens of an f θ lens instantaneously absorbing high energy. The offset is corrected with good accuracy.

The present invention provides a lens unit for concentrating a laser beam onto an object, the lens unit having: an optical lens; a lens barrel for holding the optical lens; and a plurality of temperature detectors: a plurality of temperatures The detector is disposed in a non-irradiated portion of the laser beam between the laser beam irradiation region of the optical lens and the outer periphery of the optical lens for measuring the average temperature of the optical lens or the average temperature of the optical lens. And the temperature signal of the temperature distribution in the plane.

The present invention provides a laser processing apparatus comprising: a laser oscillator; a current mirror that deflects a laser beam output from a laser oscillator; a current scanner for driving a current mirror; and a lens unit, Having: an optical lens; a lens barrel holding the optical lens; and a non-irradiated portion of the laser beam disposed between the laser beam irradiation area of the optical lens and the outer circumference of the optical lens for measuring the optical lens The temperature of the average temperature, or the average temperature of the optical lens and the temperature distribution of the in-plane temperature signal And the lens unit condenses the laser beam that is incident on the current mirror toward the object; the XY platform is used to mount the object and move in the horizontal plane; the galvano driver For driving a current scanner; a control device for controlling the laser oscillator, the current driver, and the XY stage; and a signal line for connecting the temperature detector to the control device; the control device is based on detecting from a plurality of temperatures The temperature signal measured by the device determines the average value of the rising temperature of the optical lens, the average value of the rising temperature of the optical lens, and the temperature distribution in the plane, and corrects the concentration of the laser beam according to the obtained result. Point location.

Since the lens unit of the present invention is constructed in the above manner, the average temperature of the optical lens due to the instantaneous absorption of the high-energy laser beam can be accurately measured.

Since the laser processing apparatus of the present invention is constructed in the above manner, even in the processing under high-energy laser output, the positional deviation of the laser beam condensing point can be corrected, and a high-precision ray can be achieved. Shot processing.

1‧‧‧Laser oscillator

2‧‧‧Laser beam

3a‧‧‧1st current mirror

3b‧‧‧2nd current mirror

4a‧‧‧1st current scanner

4b‧‧‧2nd current scanner

5‧‧‧f θ lens

6‧‧‧Workpiece

7‧‧‧XY platform

8‧‧‧ Current driver

9‧‧‧Control device

10‧‧‧ signal line

11a, 11b‧‧‧ optical lens

12‧‧‧Protection window

13‧‧‧Mirror tube

14‧‧‧ Temperature detector

14a‧‧‧1st temperature detector

14b‧‧‧2nd temperature detector

14c‧‧‧3rd temperature detector

14d‧‧‧4th temperature detector

15‧‧‧Laser beam irradiation area

16‧‧‧Laser beam non-illuminated part

20‧‧‧ lens unit

25‧‧‧Laser beam irradiation area

26‧‧‧ Laser beam non-illuminated part

30, 40, 50‧ ‧ lens unit

100‧‧‧ Laser processing equipment

Fig. 1 is a view showing the overall configuration of a laser processing apparatus according to a first embodiment of the present invention.

Fig. 2(a) and Fig. 2(b) are schematic side sectional views showing a lens unit of an f θ lens used in a laser processing apparatus according to Embodiment 1 of the present invention, and a top view showing a side on which a laser beam is incident.

Fig. 3 (a) and (b) are schematic side sectional views showing a lens unit of an f θ lens used in a laser processing apparatus according to a second embodiment of the present invention; And the upper schematic view of the side on which the laser beam is incident.

Fig. 4 (a) and (b) are a schematic side sectional view showing a lens unit of an f θ lens used in a laser processing apparatus according to a third embodiment of the present invention, and a schematic view showing an A-A cross section in the side sectional view.

Fig. 5 (a) and (b) are schematic side sectional views showing a lens unit of an f θ lens used in a laser processing apparatus according to a third embodiment of the present invention, and a schematic view showing an A-A cross section in the side sectional view.

(Embodiment 1)

Fig. 1 is a view showing the overall configuration of a laser processing apparatus according to a first embodiment of the present invention.

As shown in Fig. 1, the laser processing apparatus 100 of the present embodiment includes a laser oscillator 1, a first current mirror 3a, a second current mirror 3b, a first current scanner 4a, and a second current scanner 4b. An f θ lens 5 composed of a lens unit; an XY stage 7; a current driver 8; and a control device 9.

The first current mirror 3a is for biasing the laser beam 2 output from the laser oscillator 1 in the horizontal direction in the horizontal plane.

The second current mirror 3b is for biasing the laser beam 2 deflected by the first current mirror 3a further in the vertical plane.

The first current scanner 4a is for driving the first current mirror 3a, and the second current scanner 4b is for driving the second current mirror 3b.

The f θ lens 5 is configured to receive the laser beam 2 deflected by the second current mirror 3b and to direct the incident laser beam 2 toward the object to be processed (abbreviated as workpiece) 6 substantially vertically. Spotlights.

The XY stage 7 is used to mount the workpiece 6 and move the actor in a horizontal plane.

The current driver 8 is for driving the first and second current scanners 4a and 4b.

The control device 9 is for controlling the laser oscillator 1 and the current driver 8 and the XY stage 7.

In Fig. 1, the arrow X shows the direction of movement in one of the horizontal planes of the XY stage 7, and the arrow Y shows the direction of movement of the other side in the horizontal plane with respect to the X direction in the horizontal plane of the XY stage 7. Furthermore, the directions of X and Y are also the processing directions of the workpiece 6.

Further, in the laser processing apparatus 100 of the present embodiment, the temperature detector 14 is provided in the f θ lens 5 (see FIG. 2), and the temperature detector 14 and the control device 9 are connected by the signal line 10. Further, the control device 9 controls the first driver and the second current scanners 4a and 4b based on the temperature signal input from the temperature detector 14 to control the current driver 8.

Hereinafter, the first and second current mirrors 3a and 3b, the first and second current scanners 4a and 4b, and the current driver 8 are collectively referred to as a current mechanism.

Fig. 2(a) is a side cross-sectional view showing a lens unit of the f θ lens 5 used in the laser processing apparatus according to the first embodiment of the present invention, and Fig. 2(b) is a view of receiving the incident of the laser beam 2. The upper schematic view of the side lens unit.

As shown in Fig. 2(a), the lens unit 20 used in the f θ lens of the present embodiment includes the first optical lens 11a and the second optical lens 11b, the window 12, the lens barrel 13, and the second lens. Temperature detectors 14.

The first optical lens 11a and the second optical lens 11b are arranged in two stages at predetermined intervals.

The protective window 12 has a configuration in which the laser beam 2 is permeable. Further, the second optical lenses 11b are disposed at predetermined intervals to protect the optical lenses 11a and 11b.

The lens barrel 13 is for holding the optical lenses 11a, 11b and the protective window 12.

The two temperature detectors 14 are provided on the surface of the first optical lens 11a on the side where the laser beam 2 is incident.

Further, as shown in Fig. 2(b), the temperature detector 14 is provided at each of both end portions of the chord passing through the center point (the center of the circle of the surface) of the first optical lens 11a.

The "chord" used in the following description is a string that passes through the center point of the optical lens unless otherwise specified, and "the both ends of the string" refers to the non-irradiated portion 16 of the laser beam, which is located in the string. The area near the ends.

Hereinafter, the entire first optical lens 11a, the second optical lens 11b, and the protective window 12 will be referred to as an optical system component group.

Further, the first optical lens 11a and the second optical lens 11b are collectively referred to as an optical lens.

Further, in the lens unit 20 of the present embodiment, the laser beam 2 that is incident from the side on which the laser beam 2 on the upper side of the second drawing (a) is incident is directed toward the lower side of the second figure (a). On the side of the emission, the first optical lens 11a, the second optical lens 11b, and the protective window 12 are arranged in this order.

That is, the first optical lens 11a is disposed at the laser beam incident portion, and the protective window 12 is disposed at the laser beam exit portion.

Generally, in the laser processing apparatus, since the range in which the two current mirrors are biased toward the workpiece is square, the area of the optical lens of the f θ lens 5 that receives the laser beam irradiation is square or rectangular. .

Therefore, when the lens unit 20 of the present embodiment is used as the f θ lens, as shown in Fig. 2(b), the two temperature detectors 14 are arranged in a square or rectangular laser beam located in the first optical lens 11a. The beam irradiation region 15 and the laser beam non-irradiation portion 16 between the outer circumferences of the circular shape of the first optical lens 11a.

Specifically, in the first optical lens 11a, each of the laser beam non-irradiation portions 16 located at both end portions of the chord orthogonal to the two sides of the one of the laser beam irradiation regions 15 is A temperature detector 14 is provided.

Alternatively, in the first optical lens 11a, each of the laser beam non-irradiation portions 16 located at both end portions of the chord orthogonal to the other two sides of the laser beam irradiation region 15 is provided. A temperature detector 14 is provided.

Further, the direction orthogonal to the two sides of the laser beam irradiation region 15 is aligned with the direction in which the second current mirror 3b is deflected, and is opposite to the other of the laser beam irradiation regions 15. The direction orthogonal to the two sides coincides with the direction in which the first current mirror 3a is deflected.

The first and second optical lenses 11a and 11b in the lens unit 20 of the present embodiment are single-sided aspherical and single-sided planar lenses, but may be double-sided aspherical lenses or double-sided spherical surfaces. The lens may be any of a convex lens or a concave lens.

Further, in the lens unit 20 of the present embodiment, two optical lenses are used, but one optical lens may be used, or three may be used. The above optical lenses are arranged in a plurality of stages at predetermined intervals.

Further, the double sides of the protective window 12 are flat.

Although the lens barrel 13 is formed of one member, it may be formed by combining a plurality of members.

In the lens unit 20 of the present embodiment, when the f θ lens is used as the laser processing device, the laser beam non-irradiation portion 16 in the first optical lens 11a having a smaller heat capacity than the lens barrel 13 is disposed. Temperature detector 14. Therefore, the laser beam non-irradiation portion 16 approaches the laser beam irradiation region 15, and thus the temperature of the first optical lens 11a is instantaneous even if the laser beam 2 absorbs instantaneously (for example, msec unit accuracy) such as high energy. In the case of ascending, the temperature of the first optical lens 11a can also be accurately measured as a temperature signal.

Further, since the two temperature detectors 14 are used, it is possible to measure a temperature signal for determining the average temperature of the first optical lens 11a whose temperature rises.

In the present embodiment, in order to measure the temperature signal for obtaining the average temperature of the first optical lens 11a, two temperature detectors 14 are used, but two or more temperature detectors 14 may be provided in the first optical lens. The laser beam of 11a is non-irradiated portion 16.

Further, in the laser processing apparatus 100 of the present embodiment, the lens unit 20 is used for the f θ lens 5, and the first optical lens 11a of the f θ lens 5 is absorbed by the instantaneous (for example, msec unit accuracy) high-energy laser beam. The temperature of the first optical lens 11a when the temperature is increased by the beam 2 is measured by the two temperature detectors 14 provided in the first optical lens 11a. Furthermore, the temperature measured by the two laser detectors 14 is used as the temperature signal. The number is input to the control device 9.

Furthermore, the control device 9 obtains the average value of the temperature difference (hereinafter referred to as the rising temperature) before and after the temperature rise of the first optical lens 11a based on the temperature signals input from the two temperature detectors 14.

Further, the control device 9 controls the current driver 8 based on the average value of the rising temperatures of the optical lenses 11a, thereby controlling the first and second current scanners 4a and 4b.

That is, in the laser processing apparatus 100 of the present embodiment, the workpiece of the laser beam 2 caused by the change in the refractive index caused by the temperature rise of the optical component group from the laser beam 2 is obtained. The offset of the processing position (referred to as the condensed spot position) of 6 is representatively measured for the average temperature of the first optical lens 11a, and the first and second current scanners 4a, 4b are controlled by the temperature signal. Corrected.

It is to be noted that the laser processing apparatus 100 according to the present embodiment corrects a method of shifting the position of the condensed spot of the laser beam 2 caused by the temperature rise of the optical system component group in the f θ lens 5.

First, the correction amount data ΔX (X, Y, Δta) in the X direction of each processing point of the workpiece 6 and the correction amount data ΔY (X, Y, Δta) in the Y direction are held in the control device 9 as In the initial data, the correction amount data is obtained by shifting the position of the condensed spot of the laser beam 2 generated when the average value of the rising temperature of the first optical lens 11a is Δta.

Next, the temperature of the first optical lens 11a when the laser processing device 100 performs laser processing on the workpiece 6 is measured as temperature data by the two temperature detectors 14, and the temperature data is input as a temperature signal. The device 9 calculates the average value ΔTa of the rising temperature.

Next, using the correction amount data of the machining point of the workpiece 6 held in advance by the control device 9, the correction amount data ΔX (X, Y, ΔTa) and the correction of the Y direction in the X direction when Δta = ΔTa are calculated. The quantity data △ Y (X, Y, ΔTa).

Next, the X-direction position Xs of the condensed spot of the laser beam 2 before the correction is corrected by the correction amount data ΔX (X, Y, ΔTa) in the X direction, so that the laser beam 2 is made. The position in the X direction of the light collecting point is Xr shown by the following formula (1).

At the same time, the position Ys in the Y direction of the condensed spot of the laser beam 2 before the correction is corrected by the correction amount data ΔY (X, Y, ΔTa) in the Y direction to make the laser beam The position in the Y direction of the light collecting point of 2 is Yr shown by the following formula (2).

In other words, the first and second current scanners 4a and 4b are controlled such that the position of the condensed spot of the laser beam 2 in the X direction is Yr and the position in the Y direction is Yr, and the laser beam 2 is corrected. The offset of the spot position.

Xr=Xs+△X(X,Y,△Ta) (1)

Yr=Ys+△Y(X,Y,△Ta) (2)

That is, the correction of the offset of the position of the focused spot of the laser beam 2 is performed by controlling and correcting the operation of the current mechanism.

Actually, the positional deviation predicted from the temperature data is added, and in order to illuminate to the desired position, the target position corrected by the correction amount data is output from the control device 9 to the current driver 8, and the current is supplied. The driver 8 instructs the first and second current scanners 4a and 4b to perform the operation.

Since the laser processing apparatus 100 of the present embodiment can correct the shift of the position of the condensed spot of the laser beam 2 even under the processing of the high-energy laser output, the laser of the workpiece 6 with high precision can be performed. machining.

In the present embodiment, the control device 9 can also control the XY stage 7 based on the temperature signal input from the temperature detector 14.

Further, in the present embodiment, the temperature detectors 14 provided in the laser beam non-irradiation portion 16 of the first optical lens 11a may be two or more, and the control device 9 may be based on the plurality of temperatures. The temperature signal of the detector 14 is input to the average value of the rising temperatures obtained by the control device 9, and the first and second current scanners 4a and 4b are controlled to perform correction.

In the present embodiment, the first and second current mirrors 3a and 3b are used as the mechanism for deflecting the laser beam 2. However, the mechanism is not limited thereto as long as it is a mechanism for deflecting the laser beam 2.

(Embodiment 2)

Fig. 3(a) is a side cross-sectional view showing a lens unit of an f θ lens used in a laser processing apparatus according to a second embodiment of the present invention, and Fig. 3(b) is a lens of a side on which a laser beam is incident. Figure (b) above the unit.

As shown in Fig. 3, the lens unit 30 used in the f θ lens of the present embodiment is provided with four temperature detectors on the surface on the side where the laser beam 2 of the first optical lens 11a is incident. The same as the lens unit 20 of the first embodiment.

Further, as shown in FIG. 3(b), the first, second, third, and fourth temperature detectors 14a, 14b, 14c, and 14d are two orthogonal to each other disposed in the first optical lens 11a. Each of the two ends of the string.

When the lens unit 30 of the present embodiment is used as the f θ lens, as shown in FIG. 3( b ), four temperature detectors are disposed in a laser beam irradiation region belonging to a square or a rectangle which is located in the first optical lens 11 a. 15. A laser beam non-irradiation portion 16 between the outer circumference of the circular shape of the first optical lens 11a.

For example, in the first optical lens 11a, the first temperature detector 14a is provided in a laser beam non-irradiation portion 16 at a position corresponding to 12 o'clock in the dial pad.

The second temperature detector 14b is provided in a laser beam non-irradiation portion 16 at a position corresponding to 6 o'clock in the dial pad.

The third temperature detector 14c is provided in a laser beam non-irradiation portion 16 at a position corresponding to 9 o'clock in the dial pad.

The fourth temperature detector 14d is provided in a laser beam non-irradiation portion 16 at a position corresponding to 3 o'clock in the dial pad.

That is, the lens unit 30 of the present embodiment is connected to the string passing through the first temperature detector 14a and the second temperature detector 14b (hereinafter referred to as D1), and the third temperature detector 14c and the fourth temperature detector. Each of the temperature detectors is disposed in the first optical lens 11a such that the 14d string (hereinafter referred to as D2) is orthogonal.

Further, the direction parallel to D1 coincides with the direction in which the first current mirror 3a is deflected, and the direction parallel to D2 coincides with the direction in which the second current mirror 3b is deflected.

In the case where the lens unit 30 of the present embodiment is used as an f θ lens of a laser processing apparatus, the first optical transmission is smaller than the lens barrel 13 in the heat capacity. The laser beam non-irradiation portion 16 in the mirror 11a is provided with first, second, third, and fourth temperature detectors 14a, 14b, 14c, and 14d. Thereby, the laser beam non-irradiation portion 16 is close to the laser beam irradiation region 15, so that even if the temperature of the first optical lens 11a is absorbed by the moment of the high-energy laser beam 2 (for example, msec unit accuracy), it is instantaneous. At the time of ascent, the temperature of the first optical lens 11a can also be accurately measured as a temperature signal.

In particular, since four temperature detectors are provided in the laser beam non-irradiation portion 16 of the first optical lens 11a, the average value of the rising temperatures of the first optical lenses 11a obtained by the control device 9 is uneven. Small, can further improve the measurement accuracy of the rising temperature.

Further, in the lens unit 30 of the present embodiment, the first temperature detector 14a and the second temperature detector 14b are disposed at both ends of the chord D1 of one of the two orthogonal strings of the first optical lens 11a, and The third temperature detector 14c and the fourth temperature detector 14d are disposed at both ends of the other string D2.

Therefore, the temperature distribution in the D1 direction can be obtained from the temperature signal of the first temperature detector 14a and the temperature signal of the second temperature detector 14b which are formed by the temperature rise of the first optical lens 11a. Further, the temperature distribution in the D2 direction can be obtained from the temperature signal of the third temperature detector 14c and the temperature signal of the fourth temperature detector 14d.

The laser processing apparatus of the present embodiment is the same as the laser processing apparatus of the first embodiment except that the lens unit 30 is used for the f θ lens 5.

In the laser processing apparatus of the present embodiment, the lens unit 30 is used in the f θ lens 5, and the high-energy laser beam 2 is instantaneously absorbed (for example, msec unit accuracy) by the first optical lens 11a of the f θ lens 5, and Will be on temperature The temperature of the first optical lens 11a at the time of rising is measured by the first, second, third, and fourth temperature detectors 14a, 14b, 14c, and 14d. Furthermore, these temperatures are input to the control device 9 as temperature signals.

Further, in the laser processing apparatus of the present embodiment, the control device 9 seeks based on the input temperature signals from the first, second, third, and fourth temperature detectors 14a, 14b, 14c, and 14d. The average value of the rising temperature of the first optical lens 11a is obtained.

Further, the control device 9 obtains the temperature distribution in the D1 direction of the first optical lens 11a from the temperature signal of the first temperature detector 14a and the temperature signal of the second temperature detector 14b. Further, the temperature distribution in the D2 direction of the first optical lens 11a is obtained from the temperature signal of the third temperature detector 14c that is input and the temperature signal of the fourth temperature detector 14d.

In the laser processing apparatus of the present embodiment, the position of the focused spot of the laser beam 2 caused by the change in the refractive index caused by the temperature rise of the optical component group is derived from the laser beam 2 The offset is typically obtained as an average value of the rise temperature of the first optical lens 11a. Further, the first and second current scanners 4a and 4b are controlled to perform correction based on the data.

Further, in the laser processing apparatus of the present embodiment, the direction of D1 in the first optical lens 11a of the f θ lens 5 coincides with the X direction of the workpiece 6, and the direction of D2 coincides with the Y direction of the workpiece 6. .

Thereby, the refractive index change from the laser beam 2 due to the temperature distribution in the same direction as the X direction of the workpiece 6 and the temperature distribution in the same direction as the Y direction of the workpiece can be obtained from the laser beam 2 The offset of the position of the condensed spot of the laser beam 2 caused by the representative first The temperature distribution data in the D1 direction of the optical lens 11a and the temperature distribution data in the D2 direction are used to control the first and second current scanners 4a and 4b to perform correction based on the data.

A specific method for correcting the shift of the position of the condensed spot of the laser beam 2 caused by the temperature rise of the optical system component group of the f θ lens 5 will be described in the laser processing apparatus according to the present embodiment.

First, the correction amount data ΔX (X, Y, Δta) in the X direction and the correction amount data ΔY (X, Y, Δta) in the Y direction are held in the control device 9 as initial data. The correction amount data is obtained by shifting the position of the condensed spot of the laser beam 2 generated when the average value of the rising temperature of the first optical lens 11a is Δta.

Further, the correction amount data ΔXx (X, Y, Δtx) in the X direction of each machining point of the workpiece 6 and the correction amount data ΔYx (X, Y, Δtx) in the Y direction are held in the control device 9, The correction amount data is obtained from the offset of the position of the laser beam condensing point due to the temperature distribution Δtx in the X direction of the first optical lens 11a.

Further, the correction amount data ΔXy (X, Y, Δty) in the X direction and the correction amount data ΔYy (X, Y, Δty) in the Y direction are held in the control device 9, and the like The correction amount data is obtained from the offset of the position of the laser beam condensing point due to the temperature distribution Δty in the D2 direction, that is, the Y direction.

Next, in the laser processing apparatus, the temperature is measured by the first, second, third, and fourth temperature detectors 14a, 14b, 14c, and 14d in the first optical lens 11a when the workpiece 6 is subjected to laser processing. And the temperature data is lost The control device 9 is used to obtain the average value ΔTa of the rising temperature.

Further, the temperature distribution ΔTx in the X direction of the first optical lens 11a is obtained from the temperature measured by the first temperature detector 14a and the second temperature detector 14b, and the third temperature detector 14c and the The temperature distribution ΔTy in the Y direction of the first optical lens 11a is obtained by the temperature measured by the temperature detector 14d.

Then, using the correction amount data held in advance at the processing point of the control device 9, the correction amount data ΔX (X, Y, ΔTa) in the X direction and the correction amount data ΔY in the Y direction when Δta = ΔTa are calculated ( X, Y, ΔTa).

Further, the correction amount data ΔXx (X, Y, ΔTx) in the X direction and the correction amount data ΔYx (X, Y, ΔTx) in the Y direction when Δtx = ΔTx are calculated.

Further, the correction amount data ΔXy (X, Y, ΔTy) in the X direction and the correction amount data ΔYy (X, Y, ΔTy) in the Y direction when Δty = ΔTy are calculated.

Next, the X-direction position Xs of the laser beam condensing point before the correction is corrected by the X-direction correction amount data, ΔX (X, Y, ΔTa) and ΔXx (X, Y, ΔTx) and ΔXy (X, Y, ΔTy) are corrected, and the position of the laser beam condensing point in the X direction is Xr as shown in the following formula (3).

At the same time, the Y-direction position Ys of the laser beam condensing point before the correction is corrected, and the correction amount data in the Y direction, ΔY (X, Y, ΔTa) and ΔYx (X, Y, ΔTx) and ΔYy (X, Y, ΔTy) are corrected, and the position of the laser beam condensing point in the Y direction is as follows (4) Yr shown.

In other words, the first and second current scanners 4a and 4b are controlled such that the position in the X direction of the laser beam condensing point is Yr and the position in the Y direction is Yr, thereby correcting the position of the laser beam condensing point. Offset.

Xr=Xs+△X(X,Y,△Ta)+△Xx(X,Y,△Tx)+△Xy(X,Y,△Ty) (3)

Yr=Ys+△Y(X,Y,△Ta)+△Yx(X,Y,△Tx)+△Yy(X,Y,△Ty) (4)

In other words, the correction of the offset of the position of the laser beam condensing point is performed by the control device 9 controlling the operation of the correction current mechanism.

Actually, the positional deviation predicted from the temperature data is added, and in order to illuminate to the desired position, the target position corrected by the correction amount data is output from the control device 9 to the current driver 8, and the current is supplied. The driver 8 instructs the first and second current scanners 4a and 4b to perform the operation.

Since the laser processing apparatus of the present embodiment can correct the offset of the position of the laser beam condensing point more accurately even under the processing of the high-energy laser output, a laser with higher precision can be performed. machining.

In the present embodiment, the control device 9 can also control the XY stage 7 based on the temperature signals input from the first, second, third, and fourth temperature detectors 14a, 14b, 14c, and 14d.

In the present embodiment, the first, second, third, and fourth temperature detectors 14a, 14b, 14c, and 14d of the four temperature detectors are provided in the first optical lens 11a of the lens unit 30. Both ends of the chord in the first optical lens 11a, that is, bits symmetrical with the center of the first optical lens 11a Set, only one is set, that is, a total of two temperature detectors.

Further, as long as the temperature distribution in the direction parallel to the D1 direction of the first optical lens 11a and the temperature distribution in the direction parallel to the D2 direction can be measured, four or more temperature detectors may be provided.

Further, although the first and second current mirrors 3a and 3b are used as the mechanism for deflecting the laser beam 2, the mechanism is not limited as long as it is a mechanism for deflecting the laser beam 2.

(Embodiment 3)

Fig. 4(a) is a side cross-sectional view showing a lens unit of an f θ lens used in a laser processing apparatus according to a third embodiment of the present invention, and Fig. 4(b) is a lens unit in the side sectional view. Schematic diagram of the AA profile.

As shown in Fig. 4, the lens unit 40 used in the f θ lens of the present embodiment is provided with two temperature detectors 14 on the surface on the side where the laser beam 2 of the second optical lens 11b is incident. Both are the same as the lens unit 20 of the first embodiment.

Further, as shown in Fig. 4(b), the temperature detector 14 is provided at each of both end portions of the chord passing through the center point of the second optical lens 11b.

When the lens unit 40 of the present embodiment is used as the f θ lens, as shown in FIG. 4( b ), the region irradiated by the laser beam 2 on the surface of the second optical lens 11 b is a square or a rectangle.

Therefore, the two temperature detectors 14 are provided in the laser beam non-irradiation portion between the laser beam irradiation region 25 located on the surface of the second optical lens 11b and the circular outer circumference of the second optical lens 11b. 26.

Specifically, each of the laser beam non-irradiation portions 26 located at both ends of the chord orthogonal to the two sides of the laser beam irradiation region 25 is located in the second optical lens 11b. A temperature detector 14 is provided.

Alternatively, each of the laser beam non-irradiation portions 26 of the second optical lens 11b located at both ends of the chord orthogonal to the other of the two sides of the laser beam irradiation region 25 is provided. A temperature detector 14 is provided.

Further, the direction orthogonal to the two sides of the laser beam irradiation region 25 is the same as the direction in which the second current mirror 3b is deflected, and the other side is orthogonal to the two sides. It is aligned with the direction in which the first current mirror 3a is deflected.

In the case where the lens unit 40 of the present embodiment is used as the f θ lens of the laser processing apparatus, the laser beam non-irradiation portion 16 in the second optical lens 11b having a smaller heat capacity than the lens barrel 13 is disposed. There is a temperature detector 14, since the laser beam non-irradiation portion 26 is close to the laser beam irradiation region 25, even if the temperature of the second optical lens 11b is absorbed by the moment of the high-energy laser beam 2 (for example, msec unit accuracy) When the temperature rises instantaneously, the temperature of the second optical lens 11b can be accurately measured as a temperature signal.

Further, since the installation surface of the temperature detector 14 of the second optical lens 11b is not a surface that is in contact with the outside atmosphere, it is not affected by the dust generated when the workpiece 6 is processed.

Further, since the two temperature detectors 14 are used, it is possible to measure a temperature signal for determining the average temperature of the second optical lens 11b whose temperature rises.

In the present embodiment, in order to measure the temperature signal for obtaining the average temperature of the second optical lens 11b, two temperature detectors 14 are used, but Two or more temperature detectors 14 may be provided in the laser beam non-irradiation portion 26 of the second optical lens 11b.

The laser processing apparatus of the present embodiment is the same as the laser processing apparatus of the first embodiment except that the lens unit 40 is used for the f θ lens 5.

In the laser processing apparatus of the present embodiment, even if the temperature of the second optical lens 11b is absorbed by the high-energy laser beam 2 of the second optical lens 11b in the f θ lens 5 (for example, msec unit accuracy) On the other hand, when the temperature rises instantaneously, the temperature of the second optical lens 11b can be measured by the two temperature detectors 14 provided in the second optical lens 11b, and the temperature measured by the two temperature detectors 14 can be used as the temperature. The temperature signal is input to the control device 9.

Furthermore, the control device 9 obtains the average value of the rising temperatures of the second optical lenses 11b based on the temperature signals input from the two temperature detectors 14.

Further, the control device 9 controls the current driver 8 based on the average value of the rising temperatures of the second optical lenses 11b, thereby controlling the first and second current scanners 4a and 4b.

In the laser processing apparatus of the present embodiment, the position of the focused spot of the laser beam 2 caused by the change in the refractive index caused by the temperature rise of the optical component group is derived from the laser beam 2 The average temperature of the second optical lens 11b is representatively measured by the offset. Further, the first and second current scanners 4a and 4b are controlled to perform correction based on the temperature signal.

That is, the same machine as the laser processing apparatus 100 of the first embodiment is based on the data of the average value of the rising temperatures of the second optical lens 11b. The first and second current scanners 4a and 4b are controlled to correct the offset of the position of the laser beam condensing point.

Actually, the positional deviation predicted from the temperature data is added, and in order to illuminate to the desired position, the target position corrected by the correction amount data is output from the control device 9 to the current driver 8, and the current is supplied. The driver 8 instructs the first and second current scanners 4a and 4b to perform the operation.

Since the laser processing apparatus of the present embodiment can accurately correct the shift of the position of the laser beam condensing point even if it is processed under high-energy laser output, high-precision laser processing can be performed.

In the present embodiment, the control device 9 can also control the XY stage 7 based on the temperature signal input from the temperature detector.

Further, in the present embodiment, the temperature detectors 14 provided in the laser beam non-irradiation portion 26 of the second optical lens 11b may be two or more, and the control device 9 may be based on the plurality of temperatures. The temperature signal of the detector 14 is input to the average value of the rising temperatures obtained by the control device 9, and the first and second current scanners 4a and 4b are controlled to perform correction.

In the present embodiment, the first and second current mirrors 3a and 3b are used as the mechanism for deflecting the laser beam 2. However, the mechanism is not limited thereto as long as it is a mechanism for deflecting the laser beam 2.

In the lens unit 40 used in the f θ lens 5 of the present embodiment, the temperature detector 14 is provided on the second optical lens 11b, but if it is provided on the surface of the optical lens that is not in contact with the outside atmosphere, Can be placed on any optical lens.

Further, the temperature detector 14 may be provided on the non-irradiated portion of the laser beam on the opposite side of the laser beam exit surface of the protection window 12.

(Embodiment 4)

Fig. 5(a) is a side cross-sectional view showing a lens unit of an f θ lens used in a laser processing apparatus according to a fourth embodiment of the present invention, and a schematic view b) of an A-A cross section of the lens unit in the side sectional view.

As shown in Fig. 5, the lens unit 50 used in the f θ lens of the present embodiment is provided with four temperature detectors 14a and 14b on the surface on the side where the laser beam 2 of the second optical lens 11b is incident. The 14c and 14d detectors 14 are the same as the lens unit 30 of the second embodiment.

Further, as shown in Fig. 5(b), the first, second, third, and fourth temperature detectors 14a, 14b, 14c, and 14d are provided in the second optical lens 11b and are orthogonal to each other. Each of the two ends of the string.

When the lens unit 50 of the present embodiment is used as the f θ lens, as shown in Fig. 5(b), the region irradiated by the laser beam 2 in the surface of the second optical lens 11b is square or rectangular.

Therefore, the temperature detectors 14a, 14b, 14c, and 14d in the second optical lens 11b are disposed between the laser beam irradiation region 25 and the circular outer circumference of the second optical lens 11b. The position of the laser beam is non-irradiated portion 26.

As shown in Fig. 5(b), for example, in the second optical lens 11b, the first temperature detector 14a is provided in a laser beam non-irradiation portion 26 corresponding to 12 o'clock in the clock dial.

The second temperature detector 14b is provided in a laser beam non-irradiation portion 26 at a position corresponding to 6 o'clock in the dial pad.

The third temperature detector 14c is disposed in a clock equivalent The laser beam at the 9 o'clock position is not illuminated by the portion 26.

The fourth temperature detector 14d is provided in a laser beam non-irradiation portion 26 at a position corresponding to 3 o'clock in the clock dial.

That is, the lens unit 50 of the present embodiment is D1 passing through the chord of the first temperature detector 14a and the second temperature detector 14b, and D2 passing through the chord of the third temperature detector 14c and the fourth temperature detector 14d. In the orthogonal manner, each temperature detector is disposed in the second optical lens 11B.

Further, the direction parallel to D1 coincides with the direction in which the first current mirror 3a is deflected, and the direction parallel to D2 coincides with the direction in which the second current mirror 3b is deflected.

In the case where the lens unit 50 of the present embodiment is used as the f θ lens of the laser processing apparatus, the laser beam non-irradiation portion 26 in the second optical lens 11b having a smaller heat capacity than the lens barrel 13 is provided. The first, second, third, and fourth temperature detectors 14a, 14b, 14c, and 14d are provided, and the laser beam non-irradiation portion 26 is close to the laser beam irradiation region 25.

Thereby, even if the temperature of the second optical lens 11b rises instantaneously due to the instantaneous absorption (for example, msec unit accuracy) of the high-energy laser beam 2, the temperature of the second optical lens 11b can be accurately measured as the temperature. signal.

In particular, since the four temperature detectors are provided in the laser beam non-irradiation portion 26 of the second optical lens 11b, the average value of the rising temperatures of the second optical lens 11b is small, and the rise can be further increased. Temperature measurement accuracy.

In addition, since the temperature detector of the second optical lens 11b is provided with a surface It is not a surface that comes into contact with the outside atmosphere, so it is not affected by the dust generated when the workpiece 6 is processed.

The laser processing apparatus of the present embodiment is the same as the laser processing apparatus of the second embodiment except that the lens unit 50 is used for the f θ lens 5.

Further, the direction of D1 in the lens unit 50 is made to coincide with the X direction of the workpiece 6, and the direction of D2 is made to coincide with the Y direction of the workpiece 6.

In the laser processing apparatus of the present embodiment, the instantaneous absorption of the second optical lens 11b of the f θ lens 5 due to the high-energy laser beam 2 (for example, msec unit accuracy) is measured by four temperature detectors. The temperature of the second optical lens 11b at the time of temperature rise is input to the control device 9 as a temperature signal.

Furthermore, the control device 9 determines the average value of the rising temperatures of the second optical lenses 11b from the temperature signals of the four temperature detectors.

Further, from the temperature signals of the first temperature detector 14a and the second temperature detector 14b, the temperature distribution in the D1 direction of the second optical lens 11b is obtained, and the third temperature detector 14c and the fourth temperature detector 14d are obtained. The temperature signal is used to find the temperature distribution in the D2 direction.

Further, in the laser processing apparatus of the present embodiment, the laser beam 2 is collected by the laser beam 2 due to the change in the refractive index caused by the temperature rise of the optical component group. The offset of the dot position is controlled by the first and second current scanners 4a and 4b based on the average value of the rising temperature of the second optical lens 11b.

At the same time, it will be from the laser beam 2 because of the temperature distribution in the same direction as the X direction of the workpiece 6 of the optical component group and the Y side of the workpiece 6. The deviation of the position of the condensed spot of the laser beam 2 caused by the change in the refractive index generated by the temperature distribution in the same direction, by the temperature distribution data in the D1 direction of the second optical lens 11b and the temperature distribution in the D2 direction The data is controlled to control the first and second current scanners 4a and 4b.

In the laser processing apparatus of the present embodiment, the data of the average value of the rising temperature of the second optical lens 11b and the temperature distribution of the second optical lens 11b in the same direction as the X direction of the workpiece 6 are included. And the temperature distribution of the second optical lens 11b in the same direction as the Y direction of the workpiece 6 is controlled by the same mechanism as the laser processing apparatus of the second embodiment, and the first and second current scanners 4a are controlled. 4b. Thereby, the offset of the position of the focused spot of the laser beam 2 is corrected.

In other words, the correction of the offset of the position of the focused spot of the laser beam 2 is performed by the control device 9 controlling the operation of the correcting current mechanism.

Actually, the positional deviation predicted from the temperature data is added, and in order to illuminate to the desired position, the target position corrected by the correction amount data is output from the control device 9 to the current driver 8, and the current is supplied. The driver 8 instructs the first and second current scanners 4a and 4b to perform the operation.

Since the laser processing apparatus 100 of the present embodiment can correct the shift of the spot position of the laser beam 2 more accurately even in the processing of the high-energy laser output, higher precision can be performed. Laser processing.

In the present embodiment, the control device 9 can also control the XY stage 7 based on the temperature signal input from the temperature detector.

In the lens unit 50 used in the f θ lens of the present embodiment, four temperature detectors 14a, 14b, 14c, and 14d are provided in the second optical lens 11b. However, any optical lens can be provided as long as it is provided on the surface of the optical lens that is not in contact with the outside atmosphere.

Further, four temperature detectors 14a, 14b, 14c, and 14d may be provided on the non-irradiated portion of the laser beam on the opposite side of the laser beam incident surface of the protection window 12.

Further, in each of the embodiments, the temperature detector is provided on the surface of the optical lens on the side where the laser beam 2 is incident, but the radiation beam 2 may be incident on the receiving laser beam 2 as an example. The face of the optical lens (the back side of the optical lens) on the opposite side of the side.

In the present embodiment, four temperature detectors 14a, 14b, 14c, and 14d are provided in the second optical lens 11b of the lens unit 50, but they may be at both ends of the chord in the second optical lens 11b. That is, one symmetrical position is set, that is, a total of two temperature detectors.

Further, as long as the temperature distribution in the direction parallel to the direction D1 and the temperature distribution in the direction parallel to the direction D2 of the second optical lens 11b can be measured, four or more temperature detectors may be provided.

Further, although the first and second current mirrors 3a and 3b are used as the mechanism for deflecting the laser beam 2, it is not limited as long as it is a mechanism for deflecting the laser beam 2.

The laser beam 2 in the present invention may also be any one of a single pulse, a complex pulse or a continuous oscillation.

The processing content in the laser processing apparatus of the present invention is not limited to the opening, and may be any one as long as it can be processed by laser cutting such as cutting, deformation, welding, heat treatment, or marking. Processing content. In addition, In the workpiece, any change can be made as long as it is a change which can be caused by a laser such as burning, melting, sublimation or discoloration.

Further, the present invention can be freely combined with each embodiment within the scope of the invention, or each embodiment can be appropriately changed or omitted.

[Industrial availability]

Since the laser processing apparatus of the present invention can correct the offset of the position of the condensed spot with high precision and can perform laser processing with high precision, it can be used for processing of high-definition electronic circuits or electronic parts.

1‧‧‧Laser oscillator

2‧‧‧Laser beam

3a‧‧‧1st current mirror

3b‧‧‧2nd current mirror

4a‧‧‧1st current scanner

4b‧‧‧2nd current scanner

5‧‧‧f θ lens

6‧‧‧Workpiece

7‧‧‧XY platform

8‧‧‧ Current driver

9‧‧‧Control device

10‧‧‧ signal line

Claims (9)

A lens unit for concentrating a laser beam onto an object, the lens unit comprising: an optical lens; a lens barrel for holding the optical lens; and a plurality of temperature detectors: the plurality of temperature detectors And a surface of the optical lens on the side opposite to the side on which the laser beam is incident or on the side opposite to the side on which the laser beam is incident, and is disposed on the laser beam irradiation region of the optical lens and the optical The non-irradiated portion of the laser beam between the outer circumferences of the lens is used to measure a temperature signal for determining the average temperature of the optical lens or the average temperature of the optical lens and the temperature distribution in the plane. The lens unit according to claim 1, wherein at least one of the temperature detectors is disposed at each of both end portions of the chord passing through the center point of the optical lens. The lens unit according to claim 1, wherein each of the two ends of the two strings of the two orthogonal strings passing through the center point of the optical lens, and the other two of the strings Each of the ends is provided with at least one of the above temperature detectors. The lens unit according to any one of claims 1 to 3, wherein the temperature detector is disposed in the optical lens in which a laser beam incident portion is disposed. Lens sheet as described in any one of claims 1 to 3. And wherein the temperature detector is disposed on a surface of the optical lens other than a surface in contact with an atmosphere outside the lens barrel. A laser processing apparatus includes: a laser oscillator; a current mirror that deflects a laser beam output from the laser oscillator; a current scanner for driving the current mirror; and a lens unit having: An optical lens; a lens barrel holding the optical lens; and a surface on a side opposite to a side on which the laser beam is incident on the optical lens or on a side opposite to a side on which the laser beam is incident, and is disposed on the optical a laser beam non-irradiation portion between the laser beam irradiation region of the lens and the outer periphery of the optical lens for measuring an average temperature of the optical lens or an average temperature and in-plane of the optical lens a plurality of temperature detectors for temperature signal temperature distribution; and concentrating the laser beam incident on the current mirror toward the object; the XY stage is configured to mount the object and move in a horizontal plane a current driver for driving the current scanner; a control device for controlling the laser oscillator, the current driver, and the XY platform; a line for connecting the temperature detector to the control device; the control device determining a level of rise temperature of the optical lens based on a temperature signal measured from the plurality of temperature detectors The position of the condensed spot of the above-mentioned laser beam is corrected by the average value or the average value of the rising temperature of the optical lens and the temperature distribution in the plane. The laser processing apparatus according to claim 6, wherein at least one of the temperature detectors is disposed at each of both end portions of the chord passing through the center point of the optical lens. The laser processing apparatus according to claim 6, wherein the plurality of temperature detectors are a first temperature detector, a second temperature detector, a third temperature detector, and a fourth temperature detector. Four of the two chords of one of the two chords that are orthogonal to each other at the center point of the optical lens, and the first temperature detector and the second temperature detector are disposed, and the other is The third temperature detector and the fourth temperature detector are disposed at both ends of the string, and the control device obtains an average of the rising temperatures of the optical lenses from all the temperature signals measured by the plurality of temperature detectors. And obtaining, from the temperature signal of the first temperature detector and the second temperature detector, a temperature distribution in the X direction of the optical lens, and the third temperature detector and the fourth temperature detector The temperature signal is obtained from the temperature signal in the Y direction, and the position of the condensed spot of the laser beam is corrected based on the obtained results. Laser processing as described in any one of claims 6 to 8 The device controls the current scanner through the current driver by the control device, and corrects the position of the condensed spot of the laser beam.