TWI509386B - Main board and methods for disposing memory slots on the main board - Google Patents

Description

Motherboard and method for setting a memory slot on a motherboard

The invention belongs to the technical field of personal computers or servers.

The present invention relates to a motherboard for a server, and more particularly to a hybrid memory slot provided in a server motherboard.

1 is a top plan view of a motherboard 1A of a half-width server of the prior art.

As shown in FIG. 1, the motherboard 1A of the half-width server includes a plurality of (for example, two) central processors 2-1 and 2-2, and a plurality of peripheral chips (for example, the south bridge chipset 3-1 and the network communication control). Chip set 3-2) and a plurality (for example, two sets) of memories 4-1, 4-2 and 5-1, 5-2. The peripheral wafers 3-1 and 3-2 are disposed on the rear end 1b of the motherboard.

In Fig. 1, the airflow A supplied from the cooling fan flows from the front end 1a of the main board to the rear end 1b of the main board. Since the distance W between the plurality of (for example, four) memory modules included in each of the memories 4-1, 4-2 and 5-1, 5-2 is small, the flow of the airflow A is blocked. Further, the efficiency of heat dissipation is reduced, and the temperature of the central processing unit 2-2 and the memories 4-1, 4-2, 5-1, and 5-2 is easily excessively high. Therefore, in the design of the half-width server, the levels and specifications of the central processing units 2-1 and 2-2 and the memories 4-1, 4-2 and 5-1, 5-2 that can be supported are limited. . Further, the peripheral wafers 3-1 and 3-2 provided on the rear end 1b of the motherboard also face the same problem that the temperature is too high.

On the other hand, the slots of the memories 4-1, 4-2 and 5-1, 5-2 use a through-hole design, so if the signal line of the rear end 1b of the motherboard (for example, the peripheral wafer 3-1 and 3-2 signal line S) If you want to cross to the front end 1a of the motherboard, you must increase the number of layers of the motherboard 1A, or reduce each memory of the memory 4-1, 4-2 and 5-1, 5-2. The spacing W between the body modules to vacate one adjacent to the motherboard The space of the side 1c allows the signal line S to traverse to the front end 1a of the motherboard. However, the electromagnetic field M generated by the high-speed signal transmitted on the signal line S may radiate from the motherboard side 1c to the outside of the motherboard 1A. In addition, reducing the spacing W between each of the memory modules 4-1, 4-2 and 5-1, 5-2 will result in memory 4-1, 4-2 and 5-1, 5- The problem of excessive temperature 2 is more serious.

In order to solve the above problems of the high temperature of the central processing unit and the memory module and the electromagnetic radiation of the signal line in the prior art half-width server motherboard, the present invention provides a hybrid memory slot including surface-attached Slots and through-hole slots.

In an embodiment of the invention, a motherboard is provided, including a first set of memory slots, the first set of memory slots including a first channel and a second channel disposed in parallel, the first channel And the second channel includes a first type slot and a second type slot, wherein the first type slot and the second type slot of the first channel are respectively disposed on one of the first channels One side and a second side, and the first type slot and the second type slot of the second channel are respectively disposed on a first side and a second side of the second channel, the first channel The first side is adjacent to the first side of the second channel.

In another embodiment of the present invention, a method for setting a memory slot on a motherboard includes: providing a central processing unit on the motherboard; and providing a first memory channel adjacent to one side of the central processing unit Providing a second memory channel adjacent to the first memory channel opposite to the other side of the central processing unit; and providing a first type of slot on the first side and the second side of the first memory channel And a second type slot; and a first type slot and a second type slot respectively disposed on the first side and the second side of the second memory channel, wherein the first memory channel is parallel to the a second memory channel, the first side of the first memory channel is adjacent to the first side of the second memory channel, and the second side of the first memory channel is adjacent to the center Processor.

The above and further objects, advantages and features of the present invention will be described in detail in the description of the preferred embodiments illustrated herein

2 is a top plan view of a portion of a motherboard 1B including a hybrid memory slot 6 in accordance with an embodiment of the present invention.

As shown in FIG. 2, the hybrid memory slot 6 is disposed between the central processing unit 2-1 and the motherboard side 1c. A memory (such as the memory 4-1 in FIG. 1) can be disposed on the motherboard 1B via the hybrid memory slot 6.

The hybrid memory slot 6 includes two channels 61 and 62, the channel 61 includes two memory slots 601 and 602, and the channel 62 includes two memory slots 603 and 604. In the memory slots 601, 602, 603, and 604, the adjacent two memory slots 602 and 603 are surface-engaging slots, and the memory slots 601 and 604 are through-hole slots.

In other words, the through-hole memory slot 601 is disposed adjacent to one side 1c of the motherboard, and the through-hole memory slot 604 is disposed adjacent to the central processing unit 2-1; and the surface-attached memory slot 602 is 603 is disposed between the through-hole memory slots 601 and 604.

Figure 3 is a cross-sectional view of the hybrid memory slot 6 taken along line A-A' in the embodiment of Figure 2.

As shown in FIG. 3, the through-hole memory slots 601 and 604 are connected to the motherboard 1B via the through holes 601a and the through holes 604a, respectively. In addition, through-hole memory slots 601 and 604 are coupled to surface-attached memory slots 602 and 603, respectively.

Wherein, the pads 602a and 603a of the surface-attached memory sockets 602 and 603 are suspended above the motherboard 1B; therefore, in the through-hole memory slot A space is formed between 601 and 604 and below the surface-attached memory slots 602 and 603, and a line (such as the signal line S shown in FIG. 1) is allowed to pass therethrough. With this embodiment, the wiring pattern of the motherboard 1B is more flexible.

Further, the wind flow A shown in FIG. 1 can also pass through the space, and the temperature of the memory 4-1 provided in the hybrid memory slot 6 can be effectively reduced.

4 is another top plan view of the motherboard 1B including the hybrid memory slot 6 in the embodiment shown in FIG. 2.

As shown in FIG. 4, the signal line S from the back end 1b of the motherboard can pass through the space between the through-hole memory slots 601 and 604 and the surface-side memory slots 602 and 603, and traverse to the motherboard. Front end 1a. Therefore, it is not necessary to reduce the pitch W of each of the memory modules of the memory (memory 4-1) provided on the hybrid memory slot 6, and thus it is possible to meet the requirements of the memory module pitch of the original specification.

Figure 5 is a top plan view of a motherboard 1B' including a hybrid memory slot in accordance with another embodiment of the present invention.

The memory slots 7, 8 and 9 shown in Fig. 5 have the same or similar structure as the hybrid memory slot 6 shown in Figs. 2, 3 and 4.

Specifically, the memory slot 7 includes through-hole memory slots 701 and 704 and surface-attached memory slots 702 and 703. The through-hole memory slot 701 is disposed adjacent to the central processing unit 2-1, the through-hole memory storage slot 704 is disposed adjacent to the motherboard side 1d; and the surface-attached memory slots 702 and 703 are disposed in the through hole Between memory banks 701 and 704.

On the other hand, the memory slot 8 includes through-hole memory slots 801 and 804 and surface-attached memory slots 802 and 803. The through-hole memory slot 804 is disposed adjacent to the central processing unit 2-2, and the through-hole memory slot 801 is disposed adjacent to the motherboard side 1c; and the surface-attached memory slot 802 And 803 are disposed between the through-hole memory slots 801 and 804.

Similar to the manner in which the memory slot 7 is disposed, the memory slot 9 includes through-hole memory slots 901 and 904 and surface-attached memory slots 902 and 903. The through-hole memory slot 901 is disposed adjacent to the central processing unit 2-2, the through-hole memory slot 904 is disposed adjacent to the motherboard side 1d; and the surface-attached memory slots 902 and 903 are disposed in the through hole Between the memory slots 901 and 904.

With the above arrangement, the signal lines from the rear end 1b of the motherboard can pass through the space in the hybrid memory slots 6, 7, 8, and 9, respectively, to the front end 1a of the motherboard. For example, the signal line S1 of the peripheral wafer 3-1 (for example, a south bridge chip group) can pass through the space in the hybrid memory slots 6 and 8 to the front end 1a of the motherboard; and the peripheral chip 3-2 (for example, a net) The signal line S2 of the road communication control chip set can pass through the space in the hybrid memory slots 7 and 9 to the front end 1a of the motherboard.

FIG. 6 shows a manner of mounting the memory 4-1 corresponding to the hybrid memory slot 6 in accordance with an embodiment of the present invention.

In FIG. 6, the through-hole memory slot 601 is disposed adjacent to the motherboard side 1c, and the through-hole memory slot 604 is disposed adjacent to the central processing unit 2-1, and the surface-attached memory slot 602 and 603 are disposed between the through-hole memory slots 601 and 604.

In this embodiment, the memory 4-1 corresponding to the hybrid memory slot 6 may include at least one memory module.

If the memory 4-1 includes only one memory module 41, the memory module 41 can be mounted on the surface-attached memory slot 603.

If the memory 4-1 includes two memory modules 41 and 42, the memory modules 41 and 42 can be sequentially mounted on the surface-mounted memory slot 603 and the through-hole memory slot 604.

If the memory 4-1 includes three memory modules 41, 42 and 43, the memory modules 41, 42 and 43 can be sequentially mounted on the surface-mounted memory slot 603, and the through-hole memory is inserted. Slot 604 and surface-attach memory slot 602.

If the memory 4-1 includes four memory modules 41, 42, 43, and 44, the memory modules 41, 42, 43 and 44 can be sequentially mounted on the surface-attached memory slot 603, through-hole Memory slot 604, surface-attached memory slot 602 and through-hole memory slot 601.

FIG. 7 is a flow chart of a method for setting a hybrid memory slot on a motherboard according to an embodiment of the present invention.

In step 701, a central processing unit 2-1 is disposed on the motherboard 1B shown in FIG.

Next, in step 702, the first memory channel 62 is disposed adjacent to one side 2a of the central processing unit 2-1, and is disposed adjacent to the first memory channel 62 with respect to the other side of the central processing unit 2-1. The second memory channel 61, wherein the second memory channel 61 is parallel to the first memory channel 62.

Next, in step 703, a surface-engaging slot 603 is disposed on the first side 62a of the first memory channel 62, and a surface-engaging slot 602 is disposed on the first side 61a of the second memory channel 61, wherein The first side 62a of the first memory channel 62 is adjacent to the first side 61a of the second memory channel 61.

Next, in step 704, a through-hole slot 604 is disposed on the second side 62b of the first memory channel 62, and a consistent hole slot 601 is disposed on the second side 61b of the second memory channel 61, wherein The second side 62b of the first memory channel 62 is adjacent to the central processor 2-1.

Next, in step 705, the surface of the first memory channel 62 is followed by the slot 603, the through hole slot 604 of the first memory channel 62, and the surface of the second memory channel 61. The slot 602 and the through slot 601 of the second memory channel 61 are respectively provided with a memory module.

Specifically, as shown in FIG. 6, the memory 4-1 includes four memory modules 41 to 44. The memory modules 41 to 44 are sequentially disposed in the surface-engaging slot 603, the through-hole slot 604, the surface-engaging slot 602, and the through-hole slot 601.

Next, in step 706, as shown in FIG. 4, a set of signals is disposed on the surface of the first memory channel 62 followed by the slot 603 and/or below the surface of the second memory channel 61. Line S.

The invention will be best understood from the following detailed description read in conjunction with the drawings. It is emphasized that the various features of the figures are not to scale. On the contrary, the size of each feature is arbitrarily enlarged or reduced for the sake of clarity. The drawings include the following illustrations: FIG. 1 is a top plan view of a motherboard of a half-width server of the prior art; FIG. 2 is a diagram of a portion of a motherboard including a hybrid memory slot in accordance with an embodiment of the present invention; FIG. 3 is a cross-sectional view of the hybrid memory slot along the tangential line A-A' in the embodiment shown in FIG. 2; FIG. 4 is a hybrid memory plug in the embodiment shown in FIG. FIG. 5 is a top view of a motherboard including a hybrid memory slot according to another embodiment of the present invention; FIG. 6 is a schematic view of an embodiment of the present invention; Corresponding to the installation manner of the memory of the hybrid memory slot; and FIG. 7 is a flowchart of a method for setting the hybrid memory slot on the motherboard in an embodiment of the present invention

1B‧‧‧ motherboard

1a‧‧‧ motherboard front end

1b‧‧‧ motherboard backend

1c‧‧‧ motherboard side

2-1‧‧‧Central Processing Unit

6‧‧‧Mixed memory slot

601‧‧‧through hole slot

604‧‧‧through hole slot

602‧‧‧ Surface-mounted slots

603‧‧‧ Surface-mounted slots

S‧‧‧ signal line

W‧‧‧ memory module spacing

Claims (12)

A motherboard includes: a first set of memory slots, the first set of memory slots including a first channel and a second channel disposed in parallel, the first channel and the second channel respectively including a first a first type slot and a second type slot, wherein the first type slot and the second type slot of the first channel are respectively disposed on a first side and a second side of the first channel, and The first type slot and the second type slot of the second channel are respectively disposed on a first side and a second side of the second channel, and the first side of the first channel is adjacent to the first side The first side of the second channel, wherein the two first type slots are surface-mounted slots, and the two second type slots are through-hole slots, wherein the two first type slots respectively have a solder The pad is suspended above the motherboard, so that a space is formed between the two second type slots and below the two first type slots. The motherboard of claim 1 further includes a first set of signal lines disposed in the first type of the first channel of the first set of memory slots and/or the second Below the first type slot of the channel. The motherboard of claim 2, further comprising a central processor disposed on the second side of the second channel adjacent to the first set of memory slots. The motherboard of claim 3, further comprising a second set of memory slots disposed on the other side of the central processor relative to the first set of memory slots. The motherboard of claim 4, wherein the second set of memory slots comprises one of the first channel and the second channel disposed in parallel. Such as the motherboard of claim 5, wherein the second group of memory slots The first channel and the second channel respectively comprise a consistent aperture slot and a surface mount slot. The motherboard of claim 6, wherein the surface-engaging slot of the first channel of the second set of memory slots is disposed adjacent to the surface-engaging slot of the second channel. The motherboard of claim 7 further includes a second set of signal lines disposed on the surface-engaging slot of the first channel of the second set of memory slots and/or the second The surface of the channel is next to the slot. A method for setting a memory slot on a motherboard includes the steps of: setting a central processing unit on the motherboard; and providing a first memory channel adjacent to one side of the central processing unit; adjacent to the first memory channel a second memory channel is disposed on the other side of the central processing unit; a first type slot and a second type slot are respectively disposed on the first side and the second side of the first memory channel; A first type slot and a second type slot are respectively disposed on the first side and the second side of the second memory channel, wherein the first memory channel is parallel to the second memory channel, the first The first side of the memory channel is adjacent to the first side of the second memory channel, and the second side of the first memory channel is adjacent to the central processor. The method of claim 9, wherein the first type of slot is a surface-mounted slot, and the second type of slot is a through-hole slot. The method of claim 10, further comprising the steps of: sequentially following the first type of slot of the first memory channel, the first The memory module is disposed in the second type slot of the memory channel, the first type slot of the second memory channel, and the second type slot of the second memory channel. The method of claim 11, further comprising the steps of: setting a group under the first type slot of the first memory channel and/or the first type slot of the second memory channel; Signal line.